Shielding assembly and vapor deposition equipment

Abstract

The invention provides a shielding assembly and vapor deposition equipment. The shielding assembly comprises a top supporting ring and a shielding ring, a plurality of bosses horizontally extending inwards are arranged on the inner circumferential face of the top supporting ring at intervals, and sliding grooves are formed in only part of the bosses and provided with circumferential inner conical faces. The circumferential surface of the shielding ring is provided with first lugs which are used for vertically corresponding to notches on a wafer and second lugs which are matched with the bosses of the top supporting ring in a one-to-one correspondence mode, the first lugs extend horizontally inwards, and the second lugs extend horizontally outwards. The first convex lug and one of the second convex lugs are located in the same radial direction, and the boss corresponding to the second convex lug is not provided with a sliding groove; and a plurality of clamping jaws which extend downwards and are matched with the outer peripheral surface of the wafer carrying disc are arranged on the shielding ring at intervals. According to the invention, the shielding ring and the top support ring are ensured to be circumferentially centered and radially aligned during installation, so that the notch position is ensured to be at the same position when the wafer carrying disc jacks up the shielding ring each time, and the process yield is improved.

Description

Technical Field

[0001] The invention relates to the technical field of integrated circuit manufacturing, and in particular to a shielding component and a vapor deposition device having the shielding component. Background Art

[0002] APF (Aligned Pocket Formation) is a process technology used to manufacture semiconductor devices. It forms doped regions by hollowing pockets, thereby forming a conductive layer or an insulating layer.

[0003] In the APF process of CVD, a shielding ring is required to shield the edge of the wafer and the positioning groove point (Notch) of the wafer. Before coating, the robotic arm (fork) holds the wafer and places it in the cavity entry position, and the wafer carrier rises to hold the wafer; during coating, the wafer carrier rises with the wafer close to the spray plate, and during the rising process, the shielding ring is lifted from the top support ring by the wafer carrier. The shielding ring shields the edge and Notch of the wafer and rotates with the rotation of the wafer carrier; after coating, the wafer carrier descends, and the shielding ring falls on the top support ring during the descent of the wafer carrier. The wafer is in the cavity exit position, and the robotic arm holds the wafer and moves it out of the cavity.

[0004] During the installation of the chamber of the CVD equipment, the wafer carrier needs to be aligned and centered with the inner wall of the chamber as the reference, and the leveling is initially adjusted. After the wafer carrier is aligned, centered and leveled, the chamber cover is covered, and the wafer carrier is blindly adjusted to be equidistant from the spray plate on the chamber cover. The robotic arm holds the wafer in and out of the chamber, and the robotic arm and the wafer are indirectly centered with the inner wall of the chamber as the reference, with the wafer notch facing the chamber. When the wafer carrier holds up the wafer, the wafer slides from the positioning surface of the wafer carrier to the bottom plane of the wafer carrier, and slides to the center of the wafer carrier, but the notch still faces the chamber and does not rotate circumferentially. Because different references are used in the two leveling processes, there may be a slight offset between the plane of the wafer carrier and the cylindrical surface of the inner wall of the chamber after the wafer carrier is blindly adjusted to be equidistant from the spray plate. During the rising process of the wafer carrier, if the shielding ring and the wafer carrier are not aligned, there will be a slight offset between the shielding ring and the center of the wafer carrier, resulting in a slight offset between the center of the wafer and the notch relative to the center of the shielding ring, and the coating quality will be affected. In existing vapor deposition equipment, the shielding ring is placed on the horizontal surface of the support platform on the inner circumference of the top support ring. The calibration and correction of the shielding ring relies on manual judgment. The shielding ring may shift during the rise and fall of the wafer carrier, which will cause the center of the shielding ring to be unable to align with the center of the wafer, and the shielding ring cannot effectively shield the edge of the wafer and the notch, thereby affecting the coating quality.

[0005] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present invention and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology section of the present invention. Summary of the invention

[0006] In view of the shortcomings of the prior art mentioned above, the object of the present invention is to provide a shielding assembly and a vapor deposition device having the shielding assembly, so as to solve the problems in the existing vapor deposition device, that a shielding ring is placed on the horizontal surface of a support platform on the inner periphery of a top support ring, that the calibration and guidance of the shielding ring relies on manual judgment, that the shielding ring may shift during the lifting and lowering of the wafer carrier and cannot accurately shield the wafer edge and notch position, thereby affecting the coating quality, and the like.

[0007] To achieve the above-mentioned purpose and other related purposes, the present invention provides a shielding component, which includes a top support ring and a shielding ring, wherein a plurality of bosses extending horizontally inward are arranged at intervals on the inner circumferential surface of the top support ring, and only some of the bosses are provided with slide grooves, which have a circumferential inner conical surface; a first lug corresponding to the notch on the wafer and a second lug corresponding to the boss of the top support ring are arranged on the circumferential surface of the shielding ring, wherein the first lug extends horizontally inward, and the second lug extends horizontally outward, the first lug and one of the second lugs are located in the same radial direction, and the boss corresponding to the second lug is not provided with a slide groove; a plurality of claws extending downward for adapting to the outer circumferential surface of the wafer carrier are also arranged at intervals on the shielding ring.

[0008] Optionally, the slide groove is a V-shaped groove.

[0009] Optionally, a plurality of spherical protrusions are arranged at intervals on the circumferential bottom surface of the shielding ring, and spherical grooves that match the spherical protrusions one by one are arranged on the wafer carrier, and the height of the spherical protrusions is greater than the depth of the spherical grooves, so that when the shielding ring is erected on the wafer carrier through the spherical protrusions, other surfaces except the spherical protrusions do not directly contact the wafer carrier.

[0010] Optionally, the top support ring and the shielding ring are both ceramic rings that are integrally machined and formed.

[0011] Optionally, a plurality of exhaust holes are arranged at intervals on the annular side surface of the top support ring.

[0012] Optionally, the bosses provided with the slide grooves and the bosses not provided with the slide grooves are alternately and evenly spaced on the same circumferential surface of the top support ring.

[0013] Optionally, the inner circumferences of the plurality of claws form a conical inner circumference with an upper opening size smaller than a lower opening size, and the upper opening size of the conical inner circumference matches the outer circumference size of the wafer carrier.

[0014] Optionally, the claws are arranged in one-to-one correspondence with the second lugs.

[0015] The present invention also provides a vapor deposition device, which includes a deposition chamber, a wafer carrier and a shielding component as described in any of the above schemes, wherein the wafer carrier and the shielding component are both located in the deposition chamber, and the shielding component is correspondingly located directly above the wafer carrier.

[0016] Optionally, the vapor deposition equipment includes APF chemical vapor deposition equipment.

[0017] As described above, the shielding assembly and vapor deposition equipment of the present invention have the following beneficial effects: the shielding assembly provided by the present invention provides a slide groove and a circumferential inner cone on part of the boss of the top support ring, and the lug of the shielding ring is adapted accordingly, so as to ensure that the shielding ring and the top support ring are circumferentially centered and radially aligned during installation, thereby ensuring that the notch position is at the same position each time the wafer carrier lifts the shielding ring. At the same time, the shielding ring is designed with claws to ensure that the wafer carrier is centered and aligned with the shielding ring during the process of lifting the shielding ring, to ensure that the shielding ring is aligned with the wafer on the wafer carrier, and to ensure that the lug position of the shielding ring is aligned with the wafer notch. These optimized structural designs help to improve the process yield. The use of vapor deposition equipment including the shielding assembly helps to improve the quality of thin film deposition. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A top view of the shielding assembly provided by the present invention is shown when the shielding ring is erected on the top support ring.

[0019] Figure 2 Display as Figure 1 Schematic diagram of the cross-sectional structure along line AA.

[0020] Figure 3 Shown is a schematic diagram of the exploded structure of the shielding assembly provided by the present invention.

[0021] Figure 4 Shown is a top view of a top support ring in a shield assembly of the present invention in one example.

[0022] Figure 5 Display as Figure 4 Schematic diagram of the cross-sectional structure along line BB.

[0023] Figure 6 Display as Figure 4 Schematic diagram of the cross-sectional structure along line EE.

[0024] Figure 7 Shown is a front view of a shielding ring in a shielding assembly provided by the present invention in an example.

[0025] Figure 8 It is a schematic diagram showing the positional relationship between the claws of the shielding ring and the wafer carrier of the present invention.

[0026] Fig. 9 and Fig.10 The diagram shows the position relationship of the shielding assembly provided by the present invention in different process steps when applied to a chemical vapor deposition device. DETAILED DESCRIPTION

[0027] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional view showing the device structure will not be partially enlarged according to the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0028] For ease of description, spatially relative terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

[0029] In the context of the present invention, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0030] It should be noted that the diagrams provided in this embodiment are only schematic illustrations of the basic concept of the present invention, and the diagrams only show the components related to the present invention rather than the number, shape and size of the components in actual implementation. The type, quantity and proportion of each component in actual implementation may be changed at will, and the layout of the components may also be more complicated. In order to make the diagrams as concise as possible, not all structures are marked in the drawings.

[0031] The present embodiment provides a shielding component, which can be used in semiconductor equipment such as vapor deposition equipment or dry etching equipment that needs to shield the edge of the wafer, especially the notch position of the edge of the wafer, during the process. In this embodiment, the application of the shielding component in chemical vapor deposition equipment will be mainly taken as an example, especially the application in APF chemical vapor deposition equipment. Because the APF process has particularly high requirements on the alignment accuracy of each process component inside the equipment, it is very suitable to adopt the shielding component of the present application.

[0032] The structure of the shielding assembly in this embodiment can be referred to Figures 1 to 8 As shown, it includes a top support ring 11 and a shielding ring 12. The top support ring 11 and the shielding ring 12 are, as the name implies, generally annular structures. The top support ring 11 has an annular side wall, and a plurality of horizontally inwardly extending bosses 111 are arranged at intervals on its inner circumference. The plurality of bosses 111 are evenly spaced, for example, on the inner circumference of the top support ring 11. Among them, only some of the bosses 111 are provided with a slide groove 112, and the slide groove 112 has a circumferential inner cone 113. That is, at least some of the bosses 111 are not provided with a slide groove 112, or the morphology of the bosses 111 is not exactly the same. In some examples, a step for facilitating the erection of the shielding ring may be provided on the boss without a slide groove.

[0033] The circumferential surface of the shielding ring 12 is provided with a first lug 121 for corresponding to the notch on the wafer 13 up and down, and a second lug 122 that is adapted to the boss 111 of the top support ring 11 in a one-to-one correspondence. The first lug 121 extends horizontally inward, for example, the first lug 121 is connected to the inner circumferential surface of the shielding ring 12 and extends toward the center of the shielding ring 12, and its extension length and morphology match the morphology of the notch of the wafer 13. The notch on the wafer 13 is used for alignment during the process, and it is necessary to ensure that it is not blocked during the chip manufacturing process. In some examples, the notch of the wafer 13 is a V-shaped notch, and the first lug 121 is V-shaped. In other examples, the notch is fan-shaped, and the first lug 121 is correspondingly fan-shaped. The first lug 121 is used to shield the notch of the wafer 13 to prevent the deposition of a thin film at the notch position during, for example, vapor deposition. The second lug 122 extends outward horizontally. When the shielding ring 12 is placed on the top support ring 11, the second lugs 122 of the shielding ring 12 are arranged one by one on the boss 111 of the top support ring 11, wherein part of the second lug 122 or a part of the second lug 122 is correspondingly embedded in the slide groove 112 of the boss 111, and the outer peripheral surface of the part of the lug fits with the circumferential inner conical surface 113 of the corresponding slide groove 112. Therefore, in this embodiment, the morphology of the second lug 122 is not completely the same, but at least includes a morphology that is compatible with the boss 111 with the slide groove 112 and a morphology that is compatible with the boss 111 without the slide groove 112. In addition, the boss 111 with the slide groove 112 can be completely the same or not completely the same, or the morphology of the slide groove 112 can be completely the same or different. What is important is that the second lug 122 of the shielding ring 12 is compatible with it. From a processing perspective, it is preferred that all the slide grooves 112 have the same structure, for example, all are V-shaped grooves, which facilitates the clamping of the second lug 122 in the corresponding boss 111 .

[0034] In addition, in this embodiment, the first lug 121 and one of the second lugs 122 are located in the same radial direction (but located on opposite sides of the shielding ring 12), and the boss 111 corresponding to the second lug 122 is not provided with a slide groove 112. Since there is only one notch on the wafer 13, there is only one first lug 121, so it can be quickly and accurately positioned when assembling the shielding component. At the same time, the shielding ring 12 in this embodiment is also provided with a plurality of claws 123 extending downward at intervals for matching with the outer peripheral surface of the wafer carrier 14. For example, the claw 123 extends downward from the outer edge of the bottom surface of the shielding ring 12, and its extension length is, for example, controlled within 2 cm. When the shielding ring 12 is clamped on the wafer carrier 14 and moves up and down with the wafer carrier 14, these claws 123 fit tightly against the outer peripheral surface of the wafer carrier 14, which can effectively prevent the shielding ring 12 and the wafer carrier 14 from offsetting each other, ensuring accurate shielding of the wafer 13, especially ensuring that the first lug 121 shields the notch position of the wafer 13, which helps to improve the process yield.

[0035] The shielding assembly provided in this embodiment can be used in a semiconductor device, for example, in a chemical vapor deposition device. Fig. 9 and Fig.10 As shown. Since the top support ring 11 is provided with a slide groove 112 on the part of the boss 111 for setting up the shielding ring 12, the slide groove 112 is, for example, a radial V-shaped groove, and the V-shaped groove has a circumferential inner conical surface 113, so that when the shielding ring 12 slides from the wafer carrier 14 to the top support ring 11, the shielding ring 12 is circumferentially positioned due to the action of the V-shaped groove; when the shielding ring 12 slides from the wafer carrier 14 to the top support ring 11, the shielding ring 12 is centered on the top support ring 11 due to the action of the circumferential inner conical surface 113; when the wafer carrier 14 rises and passes through the top support ring 11, the shielding ring 12 is lifted from the top support ring 11, and the inner circumferential surface of the claw 123 of the shielding ring 12 slides relative to the outer edge of the wafer carrier 14, so that the shielding ring 12 is centered with the outer edge of the wafer carrier 14. Because the wafer 13 is aligned with the wafer carrier 14, the shielding ring 12 is aligned with the wafer 13, and the first lug 121 of the shielding ring 12 is aligned with the notch of the wafer 13; when the wafer carrier 14 rises to the process coating position, the shielding ring 12 has completely fallen on the wafer carrier 14, and during the coating process, the shielding ring 12 rotates a full circle with the wafer carrier 14; at the end of coating, the wafer carrier 14 stops rotating and descends, and the shielding ring 12 descends with the wafer carrier 14, and when passing through the top support ring 11, the shielding ring 12 falls on the top support ring 11, and slides along the V-groove and the circumferential inner cone 113 of the top support ring 11 and falls on the shielding ring 12, at this time, the shielding ring 12 is circumferentially positioned and radially aligned with the top support ring 11.

[0036] The shielding assembly provided in this embodiment provides a slide groove and a circumferential inner cone on part of the boss of the top support ring, and adapts the lug of the shielding ring to correspond thereto, to ensure that the shielding ring and the top support ring are circumferentially centered and radially aligned during installation, thereby ensuring that the notch is in the same position each time the wafer carrier lifts up the shielding ring. At the same time, the shielding ring is designed with claws to ensure that the wafer carrier is centered and aligned with the shielding ring during the process of lifting the shielding ring, to ensure that the shielding ring is aligned with the wafer on the wafer carrier, and to ensure that the lug position of the shielding ring is aligned with the wafer notch. These optimized structural designs can help to improve process yields, such as improving coating quality.

[0037] In some examples, such as Figure 7 As shown, the circumferential bottom surface of the shielding ring 12 is provided with a plurality of spherical protrusions 124 at intervals, and the wafer carrier 14 is provided with spherical grooves that match the spherical protrusions 124 one by one, and the height of the spherical protrusions 124 is greater than the depth of the spherical grooves, so that when the shielding ring 12 is erected on the wafer carrier 14 through the spherical protrusions 124, other surfaces except the spherical protrusions 124 do not directly contact the wafer carrier 14. That is, when the shielding ring 12 is lifted up by the wafer carrier 14, these spherical protrusions 124 on the bottom surface of the shielding ring 12 are embedded in the spherical grooves of the wafer carrier 14 one by one to achieve fixation between the two. This not only helps to prevent the shielding ring 12 from shifting during the process of rising and falling and rotating with the wafer carrier 14, but also can minimize the tiny particles generated by the contact and friction between the shielding ring 12 and the wafer carrier 14, which helps to reduce particle contamination and improve the process yield. The number of spherical protrusions 124 is 3 or more, for example 4, which are evenly spaced and distributed on the bottom surface of the shielding ring 12, and the number of corresponding spherical grooves is 4. In some examples, the inner surface of the spherical groove and / or the surface of the spherical protrusion may be provided with a wear-resistant shock-absorbing material layer, which can reduce the friction between the two and reduce the adverse effects of shaking on the wafer during the lifting process. The shock-absorbing material layer may preferably be made of a porous graphene material with a certain elasticity.

[0038] The material of the shielding component depends on its application. For example, if it is applied to vapor deposition equipment, the top support ring 11 and the shielding ring 12 are preferably ceramic rings that are integrally processed. More specifically, for example, one or more ceramics such as aluminum oxide, zirconium oxide, and yttrium oxide. If applied to dry etching process, the top support ring 11 and the shielding ring 12 are each silicon rings that are integrally processed. In addition, they can also be quartz rings, silicon carbide rings or other materials.

[0039] In some examples, a plurality of exhaust holes 114 are arranged at intervals on the annular side surface of the top support ring 11. The exhaust holes 114 are used to discharge residual gas in a timely manner during the process.

[0040] The number of bosses 111 of the top support ring 11 is 3 or more, preferably 4, and correspondingly, the number of second lugs on the shielding ring 12 is 4. In some examples, bosses 111 provided with slide grooves 112 and bosses 111 not provided with slide grooves 112 are alternately and evenly spaced on the same circumferential surface of the top support ring 11, so as to facilitate quick alignment during installation.

[0041] In some examples, the inner circumference of the plurality of claws 123 constitutes a conical inner circumference with an upper opening size smaller than a lower opening size, and the upper opening size of the conical inner circumference matches the outer circumference size of the wafer carrier 14. Figure 8 As shown, when the shielding ring 12 is clamped on the wafer carrier 14, the claws 123 extending downward from the outer wall are in contact with the wafer carrier 14 and then gradually move away from each other, so that the end of the claws 123 away from the shielding ring 12 has a gap with the outer peripheral surface of the wafer carrier 14. Therefore, when the shielding ring 12 is lifted up by the wafer carrier 14, the inner conical surface of the claws 123 slides and fits with the outer peripheral surface of the wafer carrier 14 and finally fixes the two; when the wafer carrier 14 descends, the shielding ring 12 is easily detached from the surface of the wafer carrier 14 when passing through the top support ring 11 and falls onto the top support ring 11. At the same time, such a setting is also more conducive to the loading and unloading of the equipment, avoiding adhesion between the two components.

[0042] The number and arrangement positions of the claws 123 and the second lugs 122 may be the same or different, but in a preferred example, the claws 123 are arranged one-to-one with the second lugs 122. That is, a claw 123 is arranged correspondingly on the bottom surface of each second lug 122 of the shielding ring 12, so that the overall design of the shielding ring 12 looks simpler and is more conducive to installation and alignment.

[0043] The shielding assembly provided in this embodiment can be used in various semiconductor devices that have high requirements for alignment accuracy, especially to protect the wafer notch position from being affected. The semiconductor device provided in this embodiment is used to reduce the difficulty of device assembly and improve alignment accuracy.

[0044] The present invention further provides a vapor deposition device, which includes a deposition chamber 15, a wafer carrier 14, and a shielding assembly as described in any of the above solutions. Therefore, the above description of the shielding assembly can be quoted in full here, and will not be repeated for the purpose of brevity.

[0045] The structure of the vapor deposition device provided by the present invention can refer to Fig. 9 and Fig.10As shown. The deposition chamber 15 is, for example, a metal chamber such as stainless steel or aluminum alloy, and the wafer carrier 14 and the shielding assembly are both located in the deposition chamber 15, and the shielding assembly is correspondingly located directly above the wafer carrier 14. A support shaft extending to the outside of the deposition chamber 15 may be provided at the bottom of the wafer carrier 14, and the support shaft is connected to a power mechanism such as a motor to drive the wafer carrier 14 to rotate and rise and fall. The wafer carrier 14 can fix the wafer 13 based on electrostatic adsorption and / or vacuum adsorption, and a heating and / or cooling pipeline may be provided inside the wafer carrier 14. In other examples, the wafer carrier 14 may also be rotated and / or raised and lowered by electromagnetic drive, without specific limitation.

[0046] In a preferred example, the vapor deposition device is an APF chemical vapor deposition device, so a shower head 16 is provided on the top of the deposition chamber 15 for delivering the deposition source into the deposition chamber 15, and a cover plate 17 is also provided on the top of the device. The internal state of the APF chemical vapor deposition device during the non-deposition process is as follows: Fig. 9 As shown, at this time, the shielding ring 12 falls on the top support ring 11. During the thin film deposition process, the wafer carrier 14 carries the wafer 13 to rise, and the shielding ring 12 is lifted from the top support ring 11 and placed on the wafer 13, and is clamped on the wafer carrier 14, and rotates with the rotation of the wafer carrier 14. When the process is completed, the wafer carrier 14 descends, and when passing the top support ring 11, the shielding ring 12 detaches from the wafer carrier 14 and falls on the top support ring 11. Due to the use of the shielding assembly provided by the present invention, the alignment and centering between the shielding ring 12, the top support ring 11 and the wafer carrier 14 can be ensured during the installation of the equipment, and the positional offset between the components can be avoided during the coating process, which helps to improve the coating quality.

[0047] In summary, the present invention provides a shielding component and a vapor deposition device. The shielding component includes a top support ring and a shielding ring, wherein a plurality of bosses extending horizontally inward are arranged at intervals on the inner circumference of the top support ring, and only some of the bosses are provided with a slide groove, and the slide groove has a circumferential inner conical surface; a first lug corresponding to the notch on the wafer and a second lug corresponding to the boss of the top support ring are arranged on the circumference of the shielding ring, wherein the first lug extends horizontally inward, and the second lug extends horizontally outward, and the first lug and one of the second lugs are located in the same radial direction, and the boss corresponding to the second lug is not provided with a slide groove; a plurality of claws extending downward for adapting to the outer circumference of the wafer carrier are also arranged at intervals on the shielding ring. The shielding assembly provided by the present invention provides a slide groove and a circumferential inner cone on part of the boss of the top support ring, and the lug of the shielding ring is adapted accordingly to ensure that the shielding ring and the top support ring are circumferentially centered and radially aligned during installation, thereby ensuring that the notch is in the same position each time the wafer carrier lifts up the shielding ring. At the same time, the shielding ring is designed with claws to ensure that the wafer carrier is centered and aligned with the shielding ring during the process of lifting the shielding ring, to ensure that the shielding ring is aligned with the wafer on the wafer carrier, and to ensure that the lug position of the shielding ring is aligned with the wafer notch. These optimized structural designs help to improve the process yield. The use of vapor deposition equipment including the shielding assembly helps to improve the quality of thin film deposition. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0048] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A shielding assembly, characterized in that: The shielding assembly includes a top support ring and a shielding ring, wherein a plurality of bosses extending horizontally inward are arranged at intervals on the inner circumference of the top support ring, and only some of the bosses are provided with slide grooves, which have a circumferential inner conical surface; a first boss corresponding to the notch on the wafer and a second boss corresponding one-to-one with the boss of the top support ring are arranged on the circumference of the shielding ring, the first boss extends horizontally inward, and the second boss extends horizontally outward, the first boss and one of the second bosses are located in the same radial direction, and the boss corresponding to the second boss is not provided with a slide groove; a plurality of claws extending downward for adapting to the outer circumference of the wafer carrier are also arranged at intervals on the shielding ring.

2. The shielding assembly according to claim 1, characterized in that: The slide groove is a V-shaped groove.

3. The shielding assembly according to claim 1, characterized in that: The circumferential bottom surface of the shielding ring is provided with a plurality of spherical protrusions at intervals, and the wafer carrier is provided with spherical grooves that match the spherical protrusions one by one. The height of the spherical protrusions is greater than the depth of the spherical grooves, so that when the shielding ring is erected on the wafer carrier through the spherical protrusions, other surfaces except the spherical protrusions do not directly contact the wafer carrier.

4. The shielding assembly according to claim 1, characterized in that: The top support ring and the shielding ring are both ceramic rings formed in one piece.

5. The shielding assembly according to claim 1, characterized in that: A plurality of exhaust holes are arranged at intervals on the annular side surface of the top support ring.

6. The shielding assembly according to claim 1, characterized in that: The bosses provided with the slide grooves and the bosses not provided with the slide grooves are alternately and evenly spaced on the same circumferential surface of the top support ring.

7. The shielding assembly according to claim 1, characterized in that: The inner circumferences of the plurality of claws form a conical inner circumference with an upper opening size smaller than a lower opening size, and the upper opening size of the conical inner circumference matches the outer circumference size of the wafer carrier.

8. The shielding assembly according to any one of claims 1 to 7, characterized in that: The claws are arranged in one-to-one correspondence with the second lugs.

9. A vapor deposition device, characterized in that: The vapor deposition equipment comprises a deposition chamber, a wafer carrier and a shielding assembly as described in any one of claims 1 to 8, wherein the wafer carrier and the shielding assembly are both located in the deposition chamber, and the shielding assembly is correspondingly located directly above the wafer carrier.

10. The vapor deposition apparatus according to claim 9, characterized in that: The vapor deposition equipment includes APF chemical vapor deposition equipment.

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