High-precision one-time corrosion method for yin-yang double-sided copper

Abstract

The invention relates to the technical field of inductor manufacturing, and discloses a cathode and anode double-sided copper high-precision one-time corrosion method, which comprises the following steps of: 1, monitoring the thickness of copper in real time by adopting a high-precision sensor, adjusting the spraying pressure and the flow of etching liquid, ensuring the cathode and anode double-sided corrosion to be uniform, and improving the product precision and the qualified rate; meanwhile, various parameters are automatically recorded by the system, data support is provided for subsequent production, and the production process is optimized; and step 2, dynamically adjusting the line width of the copper plates on the positive and negative sides through an accurate line width compensation algorithm, ensuring that the accuracy of the line width of the copper plates is controlled within a reasonable range in the corrosion process, further reducing the line width deviation, and improving the flatness and straightness of the circuit. According to the method, the corrosion time and temperature are accurately controlled, and an accurate line width compensation algorithm is adopted, so that the thickness and the line width of the cathode and anode copper layers are accurately regulated and controlled, and the problems of high etching difficulty and inconsistent line width in the prior art are effectively solved.

Description

Technical Field

[0001] The invention relates to the technical field of inductor manufacturing, in particular to a high-precision one-time etching method for positive and negative double-sided copper. Background Art

[0002] The DCR of inductor products made by existing processes is too large. In order to reduce the DCR, we optimize the existing combination structure and use the combination of yin and yang copper layers to achieve a solution with a small DCR. To achieve the combination of yin and yang copper layers and ensure the same line width on both sides, it is necessary to master the yin and yang copper etching technology.

[0003] There are currently existing problems with the above introduction:

[0004] 1. The nature of yin and yang copper is that the thickness of the two sides is inconsistent, and there will be inconsistent line widths on the two sides. The line width center value of the T / B surface is required to be consistent, so it is more difficult to etch;

[0005] 2. To achieve the problem of consistent line width, the line width compensation on both sides must be consistent. However, due to the different line structures on the two sides, the compensation is large, and the existing design cannot achieve consistent compensation on the T / B side;

[0006] 3. The T / B surfaces can be etched separately, that is, the T surface is etched first and then the B surface, but the aperture of the alignment hole will increase, and there will be changes in expansion and contraction, which will cause a large misalignment of the circuits on both sides of the product, exceeding the customer's standard requirements;

[0007] 4. Thickness / thinness can be compensated according to the standard compensation value, but it is necessary to put in the etching section at the same time and control the switch of the upper and lower etching nozzles. For example, the upper spray is opened for 5 sections on the thick copper side, and the lower spray is opened for 2 sections on the thin copper side. The etching speed is controlled according to the etching amount.

[0008] To this end, we provide a high-precision one-time etching method for positive and negative double-sided copper. This method adopts a unique chemical etching formula, and by accurately controlling the etching time and temperature, it realizes the precise regulation of the thickness and line width of the positive and negative double-sided copper layer, and effectively solves the problems of high etching difficulty and inconsistent line width in the prior art. Through the method of the present invention, the DCR direct current resistance of the inductor product can be significantly reduced, the product performance can be improved, and the customer's requirements for high-precision lines can be met. At the same time, the method simplifies the process flow, improves production efficiency, and provides important technical support for the inductor manufacturing industry. Summary of the invention

[0009] The purpose of the present invention is to provide a high-precision one-time etching method for positive and negative double-sided copper to solve the problems raised in the above background technology.

[0010] To achieve the above object, the present invention provides the following technical solution: a high-precision one-time etching method for positive and negative double-sided copper, comprising the following steps:

[0011] Step 1: Use high-precision sensors to monitor the thickness of copper in real time, adjust the spray pressure and etching liquid flow rate, ensure uniform corrosion on both sides, and improve product accuracy and pass rate; at the same time, the system will automatically record various parameters to provide data support for subsequent production and optimize the production process;

[0012] Step 2: Dynamically adjust the line width of the positive and negative copper plates through precise line width compensation algorithm to ensure that the accuracy of the copper plate line width is controlled within a reasonable range during the corrosion process, further reduce the line width deviation, and improve the flatness and straightness of the line;

[0013] Step 3: During the etching process, the upper and lower nozzles are controlled by program settings so that the upper and lower sprays are separated and controlled separately, which is convenient for yin and yang copper etching. The principle defines that the thick side faces upward, the upper spray can open multiple sections, the thin side faces downward, and the lower spray can open fewer sections. The number of sections of the upper and lower sprays is realized according to the etching amount and compensation;

[0014] Step 4: A multi-parameter adaptive adjustment mechanism is introduced to realize real-time feedback and adjustment based on the changes in ambient temperature, humidity and etching solution composition to ensure the stability of the corrosion process;

[0015] Step 5: Use advanced optical inspection system to conduct online inspection on the corroded copper plate to ensure the accuracy of key dimensions such as line width and line spacing, adjust process parameters in time and reduce scrap rate;

[0016] Step 6. Further optimize the optical inspection system and introduce deep learning algorithms to improve its ability to identify defects, thereby achieving more detailed monitoring of the surface quality of the copper plate; at the same time, combine big data analysis to track various indicators in the production process in real time to predict and prevent potential quality problems.

[0017] Preferably, in step three, an intelligent visual inspection system is introduced during the etching process to perform real-time scanning of the positive and negative coppers. Through image analysis technology, the corrosion depth is accurately controlled to avoid excessive or insufficient corrosion. This system can also automatically adjust the position and angle of the spray head to ensure that the solution evenly covers the surface of the copper sheet, further improving the uniformity and consistency of the product.

[0018] Preferably, in step 4, an appropriate amount of inhibitor is added to the etching solution to slow down the corrosion rate of the copper surface and ensure the uniformity of the corrosion; at the same time, the temperature of the etching solution is controlled at 25°C ± 2°C to ensure the stability of the corrosion process. In the selection of inhibitors, environmentally friendly compounds with moderate solubility are preferred to take into account both environmental protection and corrosion efficiency. In addition, by accurately controlling the corrosion time, the flatness and roughness of the copper surface are further optimized to meet the requirements of high-precision processing.

[0019] Preferably, in step four, a database is established by simulating corrosion effects under different process conditions.

[0020] Preferably, in step four, the copper material is subjected to secondary fine corrosion using positive and negative double-sided corrosion technology. During the secondary fine corrosion process, special attention is paid to monitoring the positive and negative copper materials to ensure that the corrosion degree of the copper materials on both sides is consistent, thereby avoiding surface defects caused by uneven corrosion.

[0021] Preferably, the copper material after positive and negative double-sided etching is thoroughly cleaned to remove the residual etching solution and contaminants, and then dried to maintain the cleanliness and surface integrity of the copper material. During the cleaning process, a mild and effective cleaning agent is used to ensure that the surface of the copper material is not damaged.

[0022] Preferably, the cleaned copper material is subjected to subsequent surface treatment, including electroplating, polishing and other processes, to improve the corrosion resistance and finish of the copper material, and ensure that it can show better performance and appearance in subsequent applications. In the surface treatment process, according to the final use of the copper material, the composition of the electroplating solution and the parameters of the polishing process are adjusted to ensure the accuracy and efficiency of each process, so that the positive and negative double-sided copper material not only achieves high-precision unity in microstructure, but also presents perfect symmetry and gloss in appearance.

[0023] The present invention provides a high-precision one-time etching method for positive and negative double-sided copper. It has the following beneficial effects:

[0024] (1) The present invention effectively improves the surface quality of copper materials, reduces the defective product rate, and improves production efficiency through high-precision corrosion control technology. At the same time, due to the use of environmentally friendly inhibitors and intelligent control systems, the production process is green and intelligent, and resource waste is greatly reduced.

[0025] (2) The present invention achieves precise control of the thickness and line width of the positive and negative copper layers by precisely controlling the etching time and temperature and using an accurate line width compensation algorithm, effectively solving the problems of difficult etching and inconsistent line width in the prior art.

[0026] (3) The present invention controls the upper and lower nozzles through program setting, so that the upper and lower sprays are separated and controlled separately, which is convenient for positive and negative copper etching. The principle defines that the thick side faces upward, and the upper spray can be opened in multiple sections, and the thin side faces downward, and the lower spray can be opened in a small number of sections. The number of sections of the upper and lower sprays is determined according to the etching amount and compensation, thereby realizing precise control of the upper and lower sprays, thereby achieving the effect of uniform corrosion on both sides of the copper material. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Set up a recipe view for the inventive program. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0030] A preferred embodiment of the high-precision one-time etching method for positive and negative double-sided copper provided by the present invention is as follows: Figure 1 As shown: A high-precision one-time etching method for positive and negative double-sided copper, comprising the following steps:

[0031] Step 1: Use high-precision sensors to monitor the thickness of copper in real time, adjust the spray pressure and etching liquid flow rate, ensure uniform corrosion on both sides, and improve product accuracy and pass rate; at the same time, the system will automatically record various parameters to provide data support for subsequent production and optimize the production process;

[0032] Step 2: Dynamically adjust the line width of the positive and negative copper plates through precise line width compensation algorithm to ensure that the accuracy of the copper plate line width is controlled within a reasonable range during the corrosion process, further reduce the line width deviation, and improve the flatness and straightness of the line;

[0033] Step 3: Control the upper and lower nozzles through program settings so that the upper and lower sprays are separated and controlled separately, which is convenient for etching of positive and negative copper. The principle defines that the thick side faces upward, and the upper spray can be opened in multiple sections, the thin side faces downward, and the lower spray can be opened in a few sections. The number of sections of the upper and lower sprays is realized according to the etching amount and compensation, and the parameters are added to the formula function and can be named. The next time, the formula parameters can be adjusted directly for convenient production; in step 3, an intelligent visual inspection system is introduced during the etching process to perform real-time scanning of positive and negative copper. Through image analysis technology, the corrosion depth is accurately controlled to avoid excessive or insufficient corrosion. This system can also automatically adjust the position and angle of the spray head to ensure that the solution evenly covers the surface of the copper sheet, further improving the uniformity and consistency of the product;

[0034] Step 4: A multi-parameter adaptive adjustment mechanism is introduced to achieve real-time feedback and adjustment in combination with changes in ambient temperature, humidity and etching solution composition to ensure the stability of the corrosion process. In addition, by simulating the corrosion effects under different process conditions and establishing a database, a strong technical guarantee is provided for the processing of complex products, which greatly improves the success rate of one-time corrosion. In step 4, an appropriate amount of inhibitor is added to the etching solution to slow down the corrosion rate of the copper surface and ensure the uniformity of corrosion; at the same time, the temperature of the etching solution is controlled at 25℃±2℃ to ensure the stability of the corrosion process. In the selection of inhibitors, environmentally friendly compounds with moderate solubility are preferred to take into account both environmental protection and corrosion efficiency. In addition, by precisely controlling the corrosion time, the flatness and roughness of the copper surface are further optimized to meet the requirements of high-precision processing. Then, the copper material is subjected to secondary fine corrosion by using the positive and negative double-sided corrosion technology. During the secondary fine corrosion process, the monitoring of the copper material on both sides is particularly strengthened to ensure that the corrosion degree of the copper material on both sides is consistent and to avoid surface defects caused by uneven corrosion. The copper material that has been corroded on both sides is thoroughly cleaned to remove the residual corrosive liquid and contaminants, and then dried to maintain the cleanliness and surface integrity of the copper material. During the cleaning process, a mild and effective cleaning agent is used to ensure that the copper surface is not damaged. The cleaned copper material is subjected to subsequent surface treatment, including electroplating, polishing and other processes, to improve the corrosion resistance and finish of the copper material, and to ensure that it can show better performance and appearance in subsequent applications. In the surface treatment stage, the composition of the electroplating solution and the parameters of the polishing process are adjusted according to the final use of the copper material to ensure the accuracy and efficiency of each process. This ensures that the positive and negative-sided copper material not only achieves high-precision uniformity in microstructure, but also presents perfect symmetry and gloss in appearance.

[0035] Step 5: Use an advanced optical inspection system to conduct online inspection of the etched copper plate to ensure the accuracy of key dimensions such as line width and line spacing, adjust process parameters in time, and reduce the scrap rate. This method not only improves production efficiency, but also significantly enhances the market competitiveness of products, laying a solid foundation for achieving high-quality primary etching processes.

[0036] Step 6: Further optimize the optical inspection system and introduce deep learning algorithms to improve its ability to identify defects, thereby achieving more detailed monitoring of the copper plate surface quality. At the same time, combined with big data analysis, various indicators in the production process are tracked in real time to predict and prevent potential quality problems.

[0037] In summary, the upper and lower nozzles can be controlled by program setting so that the upper and lower sprays are separated and controlled separately, which is convenient for etching of positive and negative copper. The principle defines that the thick side faces upward, and the upper spray can open multiple sections, the thin side faces downward, and the lower spray can open fewer sections. The number of upper and lower spray sections is realized according to the etching amount and compensation, and the etching amount of each spray section is grasped. The design value needs a reasonable compensation value to accurately control the etching speed of positive and negative copper and achieve the target line width and quality requirements.

[0038] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0039] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-precision one-time etching method for positive and negative double-sided copper, characterized in that: The steps include: Step 1: Use high-precision sensors to monitor the thickness of copper in real time, adjust the spray pressure and etching liquid flow rate, ensure uniform corrosion on both sides, and improve product accuracy and pass rate; at the same time, the system will automatically record various parameters to provide data support for subsequent production and optimize the production process; Step 2: Dynamically adjust the line width of the positive and negative copper plates through precise line width compensation algorithm to ensure that the accuracy of the copper plate line width is controlled within a reasonable range during the corrosion process, further reduce the line width deviation, and improve the flatness and straightness of the line; Step 3: During the etching process, the upper and lower nozzles are controlled by program settings so that the upper and lower sprays are separated and controlled separately, which is convenient for yin and yang copper etching. The principle defines that the thick side faces upward, the upper spray can open multiple sections, the thin side faces downward, and the lower spray can open fewer sections. The number of sections of the upper and lower sprays is realized according to the etching amount and compensation; Step 4: A multi-parameter adaptive adjustment mechanism is introduced to realize real-time feedback and adjustment based on the changes in ambient temperature, humidity and etching solution composition to ensure the stability of the corrosion process; Step 5: Use advanced optical inspection system to conduct online inspection on the corroded copper plate to ensure the accuracy of key dimensions such as line width and line spacing, adjust process parameters in time and reduce scrap rate; Step 6. Further optimize the optical inspection system and introduce deep learning algorithms to improve its ability to identify defects, thereby achieving more detailed monitoring of the surface quality of the copper plate; at the same time, combine big data analysis to track various indicators in the production process in real time to predict and prevent potential quality problems.

2. The high-precision one-time etching method for positive and negative double-sided copper according to claim 1 is characterized in that: In step three, an intelligent visual inspection system is introduced during the etching process to perform real-time scanning of the positive and negative copper. Through image analysis technology, the corrosion depth is accurately controlled to avoid excessive or insufficient corrosion. This system can also automatically adjust the position and angle of the spray head to ensure that the solution evenly covers the surface of the copper sheet, further improving the uniformity and consistency of the product.

3. The high-precision one-time etching method for positive and negative double-sided copper according to claim 1 is characterized in that: In step 4, a proper amount of inhibitor is added to the etching solution to slow down the corrosion rate of the copper surface and ensure the uniformity of the corrosion; at the same time, the temperature of the etching solution is controlled at 25°C ± 2°C to ensure the stability of the corrosion process.

4. The high-precision one-time etching method for positive and negative double-sided copper according to claim 1 is characterized in that: In step four, a database is established by simulating the corrosion effects under different process conditions.

5. The high-precision one-time etching method for positive and negative double-sided copper according to claim 1 is characterized in that: In step four, the copper material is subjected to secondary fine etching using the positive and negative double-sided etching technology. During the secondary fine etching process, special attention is paid to monitoring the positive and negative copper materials to ensure that the corrosion degree of the copper materials on both sides is consistent, thereby avoiding surface defects caused by uneven corrosion.

6. The high-precision one-time etching method for positive and negative double-sided copper according to claim 5, characterized in that: The copper material that has been corroded on both the positive and negative sides is thoroughly cleaned to remove the residual corrosive liquid and contaminants, and then dried to maintain the cleanliness and surface integrity of the copper material.

7. A high-precision one-time etching method for positive and negative double-sided copper according to claim 6, characterized in that: The cleaned copper material is subjected to subsequent surface treatment, including electroplating, polishing and other processes, to improve the corrosion resistance and smoothness of the copper material, ensuring that it can show better performance and appearance in subsequent applications.

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