Device and method for simulating heating condition of heat exchange equipment

By designing a heating condition simulation device for heat exchange equipment including shell, runner plate, working fluid runner and heating plate, the problem of poor accuracy of existing simulation devices is solved, and more accurate heat transfer simulation and a more stable structure are achieved to meet the simulation needs of high temperature and high pressure.

CN119880489AActive Publication Date: 2025-04-25NUCLEAR POWER INSTITUTE OF CHINA

Patent Information

Application Number
CN202510352246.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-25
Publication Date
2025-04-25
Estimated Expiration
2045-03-25

AI Technical Summary

Technical Problem

The simulation accuracy of existing heat exchange equipment simulation devices is poor, which affects the accuracy of design and research and development.

Method used

A heat-generating condition simulation device for heat exchange equipment including shell, runner plate, working fluid flow channel and heating plate is designed. Through heat exchange between the heating plate and the runner plate, the heating of the working fluid in the working fluid flow channel is realized, and the heat exchange function of the heat exchange device is simulated.

Benefits of technology

It improves the accuracy of the heat transfer simulation results, enhances the structural stability of the device, meets the experimental needs of high temperature and high pressure, and extends the service life of the device.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119880489A_ABST
    Figure CN119880489A_ABST
Patent Text Reader

Abstract

The invention provides a heat exchange equipment heating condition simulation device and method, and belongs to the technical field of heat exchange equipment research, the device is characterized in that a heating plate is adjacent to a runner plate, the heating plate is embedded in the runner plate, a cuboid working medium runner is arranged in the runner plate to allow a working medium to circulate, after the heating plate emits heat, the heating plate transmits heat to the runner plate, furthermore, heat is transferred to a working medium in the working medium runner through the runner plate; the working medium exchanges heat with the heating plate when flowing in the working medium flow channel, heat transfer is achieved, and the heat exchange function of heat exchange equipment is simulated. The runner plate is arranged in the shell, and the shell wraps the runner plate to limit the runner plate, so that the runner plate is prevented from deforming under the pressure action of a high-pressure working medium, the structural reliability of the runner plate is ensured, the working medium runner is ensured not to deform under the pressure action of the working medium, and the accuracy of a heat transfer simulation result is improved; the overall structural stability of the device is improved, the high-temperature and high-pressure experiment requirements are met, and the service life of the device is prolonged.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application belongs to the technical field of heat exchange equipment research, and specifically relates to a device and method for simulating heating conditions of heat exchange equipment. Background Art

[0002] In industrial fields such as refrigeration, power generation, and high-performance computing, heat exchange equipment has always been a research focus. At present, heat exchange equipment is generally simulated through electric heating simulation devices to support the design and development of heat exchange equipment. However, the existing simulation structure has poor simulation accuracy, which affects the final design and development of heat exchange equipment. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0004] To this end, a first aspect of the present invention provides a device for simulating heating conditions of a heat exchange device.

[0005] A second aspect of the present invention provides a heat loss simulation method.

[0006] In view of this, according to a first aspect of an embodiment of the present application, a device for simulating heating conditions of a heat exchange device is proposed, comprising: The outer shell is a hollow cavity with openings at both ends; A flow channel plate, which is arranged inside the shell along the length direction of the shell; A working fluid flow channel, the working fluid flow channel penetrates the flow channel plate along the length direction of the flow channel plate, and the cross section of the working fluid flow channel is rectangular; A heating plate is arranged between two adjacent flow channel plates along the length direction of the flow channel plates, and the heating plate is embedded in the flow channel plates.

[0007] In a feasible implementation manner, the heat exchange equipment heating condition simulation device further includes: The fastener is arranged perpendicular to the flow channel plate, and the flow channel plate is fixed in the shell through the fastener.

[0008] In a feasible implementation manner, the heat exchange equipment heating condition simulation device further includes: An external copper plate, a first end of which is connected to the heating plate, and a second end of which passes through the shell and extends to the outside of the shell.

[0009] In a feasible implementation manner, the heat exchange equipment heating condition simulation device further includes: A first thermocouple, the first thermocouple is arranged on the heating plate; The second thermocouple is arranged on the flow channel plate and is located between the heating plate and the working medium flow channel.

[0010] In a feasible implementation manner, the first thermocouple is disposed on the end surface of the heating plate, and the first thermocouple is located at the center of the end surface of the heating plate; The second thermocouple is arranged on the end surface of the flow channel plate, the second thermocouple is located on the center line of the flow channel plate, and the second thermocouple and the first thermocouple are located at the same horizontal position.

[0011] In a possible embodiment, the heating plate comprises: Plate, plate stacking settings; The insulating layer is disposed on the outer surface of the plate to electrically isolate the plate.

[0012] In a possible embodiment, the plates have different resistivities and the plates are connected by welding.

[0013] In a feasible implementation manner, the first thermocouple is arranged on the end surface of the plate, and the first thermocouple is located between two adjacent plates.

[0014] According to a second aspect of an embodiment of the present application, a heat loss simulation method is proposed, wherein a heat exchange equipment heating condition simulation device according to any of the above technical solutions is used to perform heat simulation, including: Customize the heating power of the working fluid channel and the heating power of the heating plate; Heating the hotplate; Monitor the temperature of the flow plate and heating plate; Get heat loss.

[0015] In a feasible implementation manner, the steps of customizing the heating power of the working fluid flow channel and the heating power of the heating plate include: Select the type and flow rate of the working fluid in the working fluid flow channel; Select the material of the plate.

[0016] Compared with the prior art, the device and method for simulating heating conditions of a heat exchange device of the present application have the following beneficial effects: The heat exchange equipment heating condition simulation device provided in the embodiment of the present application includes a shell, a flow channel plate, a working fluid flow channel and a heating plate; the heating plate is adjacent to the flow channel plate and the heating plate is embedded in the flow channel plate, and a rectangular working fluid flow channel is arranged in the flow channel plate for the working fluid to flow, and when the heating plate is heated, the heating plate transfers heat to the flow channel plate, and then transfers heat to the working fluid in the working fluid flow channel through the flow channel plate; when the working fluid flows in the working fluid flow channel, it exchanges heat with the heating plate to achieve heat transfer, simulating the heat exchange function of the heat exchange equipment. By arranging the flow channel plate in the shell, the shell wraps the flow channel plate to restrict the flow channel plate, so as to prevent the flow channel plate from deforming under the pressure of the high-pressure working fluid, ensure the structural reliability of the flow channel plate, and then ensure that the working fluid flow channel does not deform under the pressure of the working fluid, which is conducive to improving the accuracy of the heat transfer simulation results, and improving the overall structural stability of the device, meeting the simulation experiment requirements of high temperature and high pressure, and extending the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings: Figure 1 A schematic structural diagram of a heat exchange equipment heating condition simulation device from a first angle according to an embodiment of the present application; Figure 2 A schematic structural diagram of a heat exchange equipment heating condition simulation device from a second angle according to an embodiment of the present application; Figure 3 A schematic structural diagram of a heating plate of a device for simulating heating conditions of a heat exchange device according to an embodiment of the present application; Figure 4 A schematic structural diagram of the installation position of a thermocouple of a heat exchange equipment heating condition simulation device according to an embodiment of the present application; Figure 5 A schematic flowchart of steps of a method for simulating heating conditions of a heat exchange device according to an embodiment of the present application; Figure 6 A schematic diagram of the arrangement of temperature monitoring points of a second heating plate of a device for simulating heating conditions of a heat exchange device according to an embodiment of the present application; Figure 7 A heat transfer temperature trend diagram of a second heating plate of a heat exchange equipment heating condition simulation device according to an embodiment of the present application; in, Figures 1 to 7 The corresponding relationship between the reference numerals and component names in the figure is: 11. Shell; 12. Flow channel plate; 13. Working fluid flow channel; 14. Heating plate; 15. Fastener; 16. External copper plate; 17. First thermocouple; 18. Second thermocouple; 141, first section; 142, second section. DETAILED DESCRIPTION

[0018] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0019] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0020] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0021] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present application and are not used to limit the present application.

[0022] like Figure 1 and Figure 2As shown, according to the first aspect of the embodiment of the present application, a device for simulating heating conditions of a heat exchanger is proposed, comprising: a shell 11, a flow channel plate 12, a working fluid flow channel 13 and a heating plate 14; the shell 11 is a hollow cavity with openings at both ends; the flow channel plate 12 is arranged in the shell 11 along the length direction of the shell 11; the working fluid flow channel 13 penetrates the flow channel plate 12 along the length direction of the flow channel plate 12, and the cross-section of the working fluid flow channel 13 is rectangular; the heating plate 14 is arranged between two adjacent flow channel plates 12 along the length direction of the flow channel plate 12, and the heating plate 14 is embedded in the flow channel plate 12.

[0023] The heating condition simulation device of the heat exchange equipment provided in the embodiment of the present application includes a shell 11, a flow channel plate 12, a working fluid flow channel 13 and a heating plate 14; the heating plate 14 is adjacent to the flow channel plate 12 and the heating plate 14 is embedded in the flow channel plate 12, and a rectangular working fluid flow channel 13 is arranged in the flow channel plate 12 for the working fluid to flow. When the heating plate 14 is heated, the heating plate 14 transfers heat to the flow channel plate 12, and then transfers heat to the working fluid in the working fluid flow channel 13 through the flow channel plate 12; when the working fluid flows in the working fluid flow channel 13, heat exchange is performed with the heating plate 14 to realize heat transfer, thereby simulating the heat exchange function of the heat exchange equipment. By arranging the flow plate 12 in the shell 11, the shell 11 wraps the flow plate 12 to restrict the flow plate 12, so as to prevent the flow plate 12 from deforming under the action of the high-pressure working fluid pressure, thereby ensuring the structural reliability of the flow plate 12, and then ensuring that the working fluid flow channel 13 does not deform under the action of the working fluid pressure, which is beneficial to improve the accuracy of the heat transfer simulation results, and improve the overall structural stability of the device, meet the simulation experiment requirements of high temperature and high pressure, and extend the service life of the device.

[0024] Furthermore, the heating plate 14 is symmetrically arranged on the flow channel plate 12 so as to uniformly heat the flow channel plate 12 through the heating plate 14, and the working fluid flow channel 13 is symmetrically arranged on the flow channel plate 12 so as to uniformly conduct heat to the working fluid in the working fluid flow channel 13 through the flow channel plate 12. The heating plate 14 does not directly contact the working fluid, but indirectly transfers heat through the flow channel plate 12, thereby improving the uniformity of the working fluid temperature, so as to reduce the temperature difference inside the flow channel plate 12 and the temperature difference of the working fluid, which is conducive to improving the accuracy of the subsequent calculation device for transferring heat loss. The boundary geometry of the working fluid flow channel 13 of the flow channel plate 12 is a rectangle, and the rectangular working fluid flow channel 13 is simple to process and has strong symmetry. The coupled heat transfer between the rectangular working fluid flow channels 13 and the flow distribution calculation between different working fluid flow channels 13 are simple, which can effectively reduce the difficulty of subsequent heat loss calculation, so as to quickly obtain simulation result data and improve the efficiency of simulation experiments.

[0025] Furthermore, a plurality of flow channel plates 12 are provided, and the size and number of the flow channel plates 12 can be adjusted according to the simulation design, so as to simulate the internal heat source of different heat exchange equipment, thereby facilitating experimental verification and design and development of the heat exchange equipment. An independent working fluid flow channel 13 is provided in each flow channel plate 12, and a heating plate 14 is provided between the two flow channel plates 12, so that the heating plate 14 is used to heat the flow channel plate 12, and then the flow channel plate 12 heats the working fluid, thereby improving the uniformity of the working fluid temperature rise.

[0026] Furthermore, the working fluid inlets of the plurality of flow channel plates 12 are connected to the same working fluid input port, and the working fluid outlets of the plurality of flow channel plates 12 are connected to the same working fluid output port, so that the medium can evenly enter the plurality of working fluid flow channels 13 .

[0027] It should be noted that the working fluid is a medium material that realizes the mutual conversion of thermal energy and mechanical energy. The working fluid obtains work by changing its state (such as expansion) in the heat engine, and transfers heat energy by the flow of the working fluid. The working fluid is in a high-pressure environment. When the working fluid flows in the working fluid flow channel 13 of the flow channel plate 12, the flow channel plate 12 bears the pressure of the working fluid, and the boundary of the working fluid flow channel 13 is prone to deformation. By arranging a shell 11 outside the flow channel plate 12 to improve the pressure bearing capacity of the flow channel plate 12 and prevent the deformation of the flow channel plate 12 and the working fluid flow channel 13, the heat loss of each working fluid flow channel 13 can be calculated more accurately to achieve accurate measurement of the rectangular multi-channel structure.

[0028] Furthermore, the flow channel plate 12 is made into an integrated structure by a casting process so that there is no connection point inside the flow channel plate 12 to ensure the strength of the flow channel plate 12, and then a rectangular working medium flow channel 13 is processed in the flow channel plate 12 by a wire cutting process.

[0029] like Figure 1 and Figure 2 As shown, in a feasible implementation manner, the heat exchange equipment heating condition simulation device further includes: a fastener 15 , the fastener 15 is arranged perpendicular to the flow channel plate 12 , and the flow channel plate 12 is fixed in the housing 11 through the fastener 15 .

[0030] In this technical solution, the flow plate 12 is arranged in the shell 11, and the shell 11 is limited to the first-level pressure-bearing structure of the flow plate 12; the fastener 15 is arranged perpendicular to the stacking direction of the flow plate 12, and the fastening force of the fastener 15 on the flow plate 12 is the second-level pressure-bearing structure of the flow plate 12. The setting of the two-level pressure-bearing structure further reduces the probability of deformation of the flow plate 12 and the working fluid flow channel 13, which is beneficial to improve the accuracy and effectiveness of the heat loss calculation results of the working fluid flow channel 13.

[0031] In this technical solution, the heating plate 14 is placed between two adjacent flow channel plates 12 , and the fastening force of the housing 11 and the fasteners 15 can achieve fastening and positioning of the heating plate 14 , thereby improving the stability of the heating plate 14 .

[0032] like Figure 1 and Figure 3 As shown, in a feasible embodiment, the heat exchange equipment heating condition simulation device also includes: an external copper plate 16, a first end of the external copper plate 16 is connected to the heating plate 14, and a second end of the external copper plate 16 passes through the outer shell 11 and extends to the outside of the outer shell 11.

[0033] In this technical solution, an external copper plate 16 is provided on the heating plate 14 so that the connection point between the heating plate 14 and the power supply is led out to the outside of the outer shell 11 by means of the external copper plate 16. This ensures that the power supply is located outside the shell while simulating the internal heat source of the heat exchange device. The external power supply does not affect the structure of the flow channel plate 12 and the working fluid flow channel 13. The electric energy is then converted into thermal energy by the heating plate 14, and the working fluid is heated by heat conduction of the flow channel plate 12. An effective simulation of the internal heat source of the heat exchange device is achieved through a simple structural arrangement.

[0034] Furthermore, the heating plate 14 is heated by direct current, and the heat generated by the heating plate 14 follows Joule's law, that is, , where Q is heat, I is current, R is resistance, and t is the power-on time.

[0035] It is understandable that the external copper plate 16 is made of metal copper, which has a relatively small resistance. Compared with the resistance of the heating plate 14, the heating power of the external copper plate 16 can be ignored to reduce the difficulty of calculating heat loss.

[0036] like Figure 4 As shown, in a feasible embodiment, the heat exchange equipment heating condition simulation device also includes: a first thermocouple 17 and a second thermocouple 18; the first thermocouple 17 is arranged on the heating plate 14; the second thermocouple 18 is arranged on the flow channel plate 12, and the second thermocouple 18 is located between the heating plate 14 and the working fluid flow channel 13.

[0037] In this technical solution, the first thermocouple 17 monitors the temperature of the heating plate 14, and the second thermocouple 18 monitors the temperature of the flow channel plate 12. The temperature of the heating plate 14 is used as the initial temperature. The temperature of the flow channel plates 12 on both sides of the heating plate 14 is monitored to monitor the temperature change after heat transfer, and then the heat flux density is calculated through the temperature difference between the flow channel plate 12 and the heating plate 14. The real heat entering the working fluid is further calculated based on the heat flux density, and then the heat loss is calculated.

[0038] like Figure 4As shown, in a feasible embodiment, the first thermocouple 17 is arranged on the end surface of the heating plate 14, and the first thermocouple 17 is located at the center of the end surface of the heating plate 14; the second thermocouple 18 is arranged on the end surface of the flow channel plate 12, the second thermocouple 18 is located on the center line of the flow channel plate 12, and the second thermocouple 18 and the first thermocouple 17 are located at the same horizontal position.

[0039] In this technical solution, the first thermocouple 17 is arranged on the end surface of the heating plate 14 and detects the temperature of the center point of the end surface of the detection plate. By setting the second thermocouple 18 on the end surface of the flow channel plate 12, the second thermocouple 18 is located on the center line of the flow channel plate 12, and the second thermocouple 18 and the first thermocouple 17 are located at the same horizontal position, so as to calculate the distance between the second thermocouple 18 and the first thermocouple 17, or calculate the distance between two second thermocouples 18.

[0040] It can be understood that the second thermocouple 18 and the first thermocouple 17 are arranged on a vertical line in the center of the superheating plate 14, the distance between the second thermocouple 18 and the first thermocouple 17 is the absolute value of the height difference between the second thermocouple 18 and the first thermocouple 17, and the distance between the second thermocouple 18 and the second thermocouple 18 is the absolute value of the height difference between the two second thermocouples 18.

[0041] Furthermore, two second thermocouples 18 are provided between the heating plate 14 and the flow channel plate 12 on one side, so as to calculate the heat flux density transferred from the heating plate 14 to the flow channel plate 12 on the corresponding side through the distance between the two second thermocouples 18 and the temperature difference between the two thermocouples.

[0042] In a feasible implementation, the heating plate 14 includes: a plate and an insulating layer; the plates are stacked; and the insulating layer is disposed on the outer surface of the plate to electrically isolate the plate.

[0043] In this technical solution, at least two plates are provided. Different plates are selected to simulate different power distributions and realize bidirectional heat transfer of heat sources with different powers, thereby increasing the adjustable range of the simulation device and improving practicality. An insulating layer is provided on the surface of the plate to electrically isolate two adjacent plates and prevent conductive contact between the two plates, thereby ensuring that each plate works independently, ensuring the heating efficiency of the plate, preventing heat concentration, and thus ensuring uniform heating of the heating plate 14. At the same time, electrical isolation is also formed between the plate and the flow channel plate 12 to prevent conductive contact between the plate and the flow channel plate 12, preventing current from flowing from the heating plate 14 to the flow channel plate 12, avoiding short circuits, and improving the electrical safety and reliability of the device.

[0044] Furthermore, the plates are stacked and fixedly connected to ensure the structural stability of the heating plate 14 .

[0045] In some examples, such as Figure 3 and Figure 4 The heating plate 14 includes a first plate 141 and a second plate 142 , and the first plate 141 is arranged above the second plate 142 .

[0046] As a preferred solution, the insulating layer is a sprayed layer, and the outer surface of the plate needs to be made into a ceramic insulating layer by a ceramic spraying method.

[0047] In a possible embodiment, the plates have different resistivities and the plates are connected by welding.

[0048] In this technical solution, under the same current intensity, plates with different resistivities have different heating powers. Plates with different resistivities are combined to form a heating plate 14 to simulate different power distributions, thereby achieving two-way heat transfer of heat sources with different powers, so that the heating power of the heating plate 14 to the flow channel plates 12 on both sides is different, thereby simulating different heating devices.

[0049] Furthermore, the sizes of the plates are kept consistent, and the resistivity of the heating plate 14 is adjusted by making the materials of the plates different.

[0050] Furthermore, the power of the heating plates 14 is different. By assembling heating plates 14 with different powers at different positions, a specific power distribution of the simulation device can be achieved.

[0051] like Figure 4 As shown, in a feasible implementation manner, the first thermocouple 17 is disposed on the end surface of the plate, and the first thermocouple 17 is located between two adjacent plates.

[0052] In this technical solution, the first thermocouple 17 is located between two adjacent plates to ensure that the heating power of the flow channel plate 12 on the corresponding side of the plate can be accurately calculated.

[0053] like Figure 5 As shown, according to the second aspect of the present application, a heat loss simulation method is proposed, using a heat exchange equipment heating condition simulation device as in any one of the above technical solutions to perform heat simulation, including: Step 100: Customizing the heating power of the working fluid channel 13 and the heating power of the heating plate 14; by customizing the heating power of the working fluid channel 13 and the heating plate 14, different heat exchange equipment can be simulated; Step 200: heating the heating plate 14 to generate heat; Step 300: monitoring the temperatures of the flow channel plate 12 and the heating plate 14 to calculate the heat flux density transferred from the heating plate 14 to the flow channel plate 12 through the temperature difference; Step 400: Obtain heat loss, calculate real heat through heat flux density, and obtain heat loss percentage using the ratio of real heat to heating power.

[0054] The heat loss simulation method provided in the embodiment of the present application is applied to the heating condition simulation device of the heat exchange equipment such as any of the above-mentioned technical solutions. Therefore, the heat loss simulation method has all the beneficial effects of the heating condition simulation device of the heat exchange equipment of the above-mentioned technical solutions, which will not be elaborated here.

[0055] By means of the heat loss simulation method provided in the embodiment of the present application, the heating power of the working fluid flow channel 13 and the heating plate 14 are customized to simulate the heating and heat exchange conditions of different heat exchange equipment, and then the heat flux density is calculated according to the detected temperatures of the flow channel plate 12 and the heating plate 14, and then the actual heat entering the working fluid is calculated according to the heat flux density, and finally the heat loss percentage is obtained by the ratio of the actual heat to the heating power; the heating plate 14 is adjacent to the flow channel plate 12 and the heating plate 14 is embedded in the flow channel plate 12, and a rectangular working fluid flow channel 13 is arranged in the flow channel plate 12 for the working fluid to flow, and when the heating plate 14 is heated, the heating plate 14 transfers heat to the flow channel plate 12, and then transfers heat to the working fluid in the working fluid flow channel 13 through the flow channel plate 12; when the working fluid flows in the working fluid flow channel 13, heat exchange is performed with the heating plate 14 to realize heat transfer, thereby simulating the heat exchange function of the heat exchange equipment. By arranging the flow plate 12 in the shell 11, the shell 11 wraps the flow plate 12 to restrict the flow plate 12, so as to prevent the flow plate 12 from deforming under the action of the high-pressure working fluid pressure, thereby ensuring the structural reliability of the flow plate 12, and then ensuring that the working fluid flow channel 13 does not deform under the action of the working fluid pressure, which is beneficial to improve the accuracy of the heat transfer simulation results, and improve the overall structural stability of the device, meet the simulation experiment requirements of high temperature and high pressure, and extend the service life of the device.

[0056] In a feasible implementation manner, the steps of customizing the heating power of the working medium flow channel 13 and the heating power of the heating plate 14 include: Selecting the type and flow rate of the working fluid in the working fluid flow channel 13; The material of the heating plate 14 is selected.

[0057] In this technical solution, the type and flow rate of the working fluid in the working fluid flow channel 13 are selected to simulate different heat exchange equipment media and their flow rates; the plate material of the heating plate 14 is selected to simulate the heating conditions of the heat exchange equipment, and then the heat exchange effect of the heating equipment is simulated through the operation of the device.

[0058] Example: like Figure 4 Taking the simulation device consisting of 4 flow plates and 3 heating plates as an example, the rectangular multi-channel power customization steps and heat loss evaluation steps are as follows: Customized power distribution Each flow channel plate is provided with a fluid flow channel, that is, the simulation device has a total of 4 fluid flow channels, of which the 4 fluid flow channels can be designed into 4 different power distribution forms, namely the first fluid flow channel, the second fluid flow channel, the third fluid flow channel and the fourth fluid flow channel from top to bottom. Each heating plate is composed of a first plate and a second plate. The three heating plates have three power forms of A1+B1, A2+B2 and A3+B3. A first heating plate A1+B1 is provided between the first fluid flow channel and the second fluid flow channel, a second heating plate A2+B2 is provided between the second fluid flow channel and the third fluid flow channel, and a third heating plate A3+B3 is provided between the third fluid flow channel and the fourth fluid flow channel. Among them, the first heating plate A1+B1 affects the first fluid flow channel and the second fluid flow channel, the second heating plate A2+B2 affects the second fluid flow channel and the third fluid flow channel, and the third heating plate A3+B3 affects the third fluid flow channel and the fourth fluid flow channel.

[0059] When direct current is used to heat the electric heating plate, the resistivity of the external copper plate is smaller than that of the heating plate material (10% or less), and the resistance of the external copper plate can be ignored. The electric potential of the welding point between the external copper plate and the first plate and the welding point between the external copper plate and the second plate are equal. Therefore, for the heating plate composed of the first plate and the second plate, the voltage U before and after the heating plate is equal, and the electric heating power of the first plate and the second plate of the heating plate are respectively: , , where R a is the resistance of the first plate, R b is the resistance of the second plate.

[0060] When realizing customized power arrangement, by using plates made of different metal materials (the resistivity of the metal material should be much greater than the resistivity of the external copper plate), when DC power is applied for heating, the electric power of the three heating plates is , , , where R a1 is the resistance of the first plate in the first heating plate, R b1 is the resistance of the second plate in the first heating plate; R a2 is the resistance of the first plate in the second heating plate, R b2 is the resistance of the second plate in the second heating plate; R a3 is the resistance of the first plate in the third heating plate, R b3 is the resistance of the second plate in the third heating plate.

[0061] Heat loss assessment: like Figure 6 , taking the second heating plate with power form A2+B2 as an example, the heat loss evaluation method is as follows: A first thermocouple is installed between the first plate and the second plate of the second heating plate, two second thermocouples are installed after drilling a hole on the second flow channel plate, and two second thermocouples are installed after drilling a hole on the third flow channel plate to obtain the second heating plate T a1 , T a2 , T0, T b1 , T b2 The temperature at five locations. Based on the thermal conductivity σ of the metal material of the flow channel plate, The calculation formula of the heat flux density transferred from the second heating plate to the second working fluid flow channel is as follows:

[0062] Where x1 is T a1 Dot and T a2 The distance between points.

[0063] The calculation formula of the heat flux density transferred from the second heating plate to the third working fluid flow channel is as follows:

[0064] Where x2 is T b1 Dot and T b2 The distance between points.

[0065] Although the second heating plate A2+B2 is located between the second working fluid flow channel and the third working fluid flow channel, the first plate and the second plate of the second heating plate have different resistances under the same voltage conditions, so the heat generation is different, resulting in , Inconsistency, that is, the bidirectional heat transfer of the second heating plate is uneven, and its temperature trend is as follows Figure 7 shown.

[0066] The heat generated by the second heating plate is , and the heat flux entering the working fluid flow channel is , Assuming that the contact area between the second heating plate and the second and third working fluid channels is S, the actual heat entering the working fluid is calculated as follows: + S Therefore, the calculation formula for the heat loss percentage of the second heating plate is as follows:

[0067] The heat loss of each heating plate is calculated according to the heat loss calculation method of the second heating plate and then summed up. The heat loss of the entire simulation device during heat exchange is obtained, which is the heat loss of the simulated heat exchange equipment. The heat loss of the designed heat exchange equipment is accurately customized in power and evaluated in heat loss through the simulation device to quickly and effectively determine whether the heat exchange equipment meets the requirements.

[0068] It is easy to be understood by those skilled in the art that the above embodiments can be freely combined and superimposed without conflict.

[0069] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application. The above are only preferred implementations of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present application, and these improvements and variations should also be regarded as the protection scope of the present application.

Claims

1. A device for simulating heating conditions of a heat exchanger, characterized in that: The heat exchange equipment heating condition simulation device comprises: A shell, wherein the shell is a hollow cavity with openings at both ends; A flow channel plate, the flow channel plate is arranged in the shell along the length direction of the shell; A working fluid flow channel, wherein the working fluid flow channel penetrates the flow channel plate along the length direction of the flow channel plate, and the cross section of the working fluid flow channel is rectangular; A heating plate is disposed between two adjacent flow channel plates along the length direction of the flow channel plates, and the heating plate is embedded in the flow channel plates.

2. A heat exchange equipment heating condition simulation device according to claim 1, characterized in that: The heat exchange equipment heating condition simulation device also includes: A fastener is arranged perpendicular to the flow channel plate, and the flow channel plate is fixed in the shell through the fastener.

3. The device for simulating heating conditions of heat exchange equipment according to claim 1, characterized in that: The heat exchange equipment heating condition simulation device also includes: An external copper plate, a first end of which is connected to the heating plate, and a second end of which passes through the shell and extends to the outside of the shell.

4. The device for simulating heating conditions of heat exchange equipment according to claim 1, characterized in that: The heat exchange equipment heating condition simulation device also includes: a first thermocouple, wherein the first thermocouple is disposed on the heating plate; A second thermocouple is provided on the flow channel plate, and the second thermocouple is located between the heating plate and the working medium flow channel.

5. The device for simulating heating conditions of heat exchange equipment according to claim 4, characterized in that: The first thermocouple is arranged on the end surface of the heating plate, and the first thermocouple is located at the center of the end surface of the heating plate; The second thermocouple is arranged on the end surface of the flow channel plate, the second thermocouple is located on the center line of the flow channel plate, and the second thermocouple and the first thermocouple are located at the same horizontal position.

6. The device for simulating heating conditions of heat exchange equipment according to claim 4, characterized in that: The heating plate comprises: Plates, the plates are stacked; An insulating layer is disposed on the outer surface of the plate to electrically isolate the plate.

7. A heat exchange equipment heating condition simulation device according to claim 6, characterized in that: The plates have different resistivities and are connected by welding.

8. The device for simulating heating conditions of heat exchange equipment according to claim 6, characterized in that: The first thermocouple is arranged on the end surface of the plate, and the first thermocouple is located between two adjacent plates.

9. A heat loss simulation method, characterized in that: The heat simulation is performed using the heat exchange equipment heating condition simulation device as claimed in any one of claims 1 to 8, comprising: Customize the heating power of the working fluid channel and the heating power of the heating plate; heating the heating plate; Monitoring the temperature of the flow channel plate and the heating plate; Get heat loss.

10. A heat loss simulation method according to claim 9, characterized in that: The steps of customizing the heating power of the working fluid flow channel and the heating power of the heating plate include: Selecting the type and flow rate of the working fluid in the working fluid flow channel; Select the material of the plate.

Citation Information

Patent Citations

  • Device and method for simulated measurement of heating rod cluster channel wall temperatures under movement conditions

    CN106710647A

  • Method for determining the state of a heat exchanger device

    CN107690563A

  • Multi-channel flow instability experimental device capable of accurately simulating flow resistance

    CN112556983A

  • Simulation test device for uniform heat release of multiple rectangular flow channels of plate type fuel element

    CN113345611A

  • Real-time simulation method of heat pipe cooling solid reactor heat transfer and neutron physical module

    CN115684247A

Cited By

  • Heat source device and nuclear power generation test system applicable to same

    CN121545803A