Vacuum high-low temperature semiconductor device probe test bench with buffer protection

Abstract

The invention relates to the technical field of semiconductor testing, and particularly discloses a vacuum high-low temperature semiconductor device probe test bench with buffer protection, which comprises a test platform, the top of the test platform is fixedly connected with a mounting plate, the top of the mounting plate is fixedly connected with a test frame, and the surface of the test frame is fixedly connected with a connecting frame. An electric guide rail is fixedly connected to the inner bottom wall of the connecting frame, a sliding block is slidably connected to the inner wall of the electric guide rail, a connecting block is fixedly connected to the top of the sliding block, a socketed pipe is fixedly connected to the back of the connecting block, and a transmitter is fixedly connected to the inner wall of the socketed pipe; through the arrangement of the test frame, the universal ball, the conduction rod and the probe, in the use process, a semiconductor is conveniently placed in the test frame, the semiconductor in the test frame is monitored through the probe, the length of the electric telescopic rod is adjusted, and different positions of the semiconductor are conveniently monitored through the conduction rod and the probe through adjustment of the connecting rod; therefore, the effect of conveniently monitoring multiple positions of the semiconductor is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor testing, and in particular relates to a vacuum high-low temperature semiconductor device probe testing platform with buffer protection. Background Art

[0002] In the field of semiconductor testing technology, with the vigorous development of the semiconductor industry and technological iteration, the testing demand and precision requirements for semiconductor devices continue to increase, especially in vacuum and high and low temperature environments. The performance stability and reliability testing of semiconductor devices have become crucial links, which is of great significance for ensuring the normal operation of semiconductor devices under various extreme conditions.

[0003] At present, although a series of semiconductor testing equipment has emerged in the market, these devices have promoted the progress and development of the semiconductor industry to a certain extent. However, it cannot be ignored that traditional semiconductor testing equipment generally adopts a fixed probe structure in design, which has significant limitations. Specifically, the fixed probe structure can only test semiconductor devices at a single point or a limited position, and it is difficult to achieve comprehensive monitoring of semiconductor devices at multiple positions and angles. The one-sidedness of this testing method may lead to inaccurate performance evaluation of semiconductor devices, thereby affecting subsequent product development and quality control. Therefore, staff need to improve it. Summary of the invention

[0004] The object of the present invention is to provide a vacuum high and low temperature semiconductor device probe test bench with buffer protection to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A vacuum high and low temperature semiconductor device probe test bench with buffer protection, comprising:

[0007] Test platform;

[0008] A mounting plate is fixedly connected to the top of the test platform, and a test frame is fixedly connected to the top of the mounting plate;

[0009] The surface of the test frame is fixedly connected to a connecting frame, the inner bottom wall of the connecting frame is fixedly connected to an electric guide rail, the inner wall of the electric guide rail is slidably connected to a sliding block, the top of the sliding block is fixedly connected to a connecting block, the back of the connecting block is fixedly connected to a sleeve tube, the inner wall of the sleeve tube is fixedly connected to a transmitter, the front end of the transmitter is fixedly connected to a mounting ring, the inner wall of the mounting ring is rotatably connected to a universal ball, the surface of the universal ball is fixedly connected to a conduction rod, the front end of the conduction rod is fixedly connected to a probe, the surface of the conduction rod is electrically connected to a wire, and the wire and the transmitter are electrically connected to each other.

[0010] Preferably, the inner wall of the sleeve is fixedly connected with a circular electric guide rail, the inner wall of the circular electric guide rail is slidably connected with a moving block, the bottom end of the moving block is fixedly connected with an electric telescopic rod, the bottom end of the electric telescopic rod is fixedly connected with a mounting clamp, the inner wall of the mounting clamp is rotatably connected with a connecting rod, and the bottom end of the connecting rod is rotatably connected with a limiting slider.

[0011] Preferably, a fixing ring is fixedly connected to the surface of the conduction rod, a limiting sliding groove is provided on the surface of the fixing ring, and an inner wall of the limiting sliding groove is sleeved on the surface of the limiting sliding block.

[0012] Preferably, both sides of the test frame are fixedly connected with a configuration box, the inner wall of the mounting plate located at the bottom of the configuration box is fixedly connected with a servo motor, a drive rod is installed at the output end of the servo motor, and the front end of the drive rod is fixedly connected with a forward and reverse screw rod.

[0013] Preferably, both sides of the surface of the forward and reverse screw rod are threadedly connected with threaded rings, the top of the threaded ring is fixedly connected to a support frame, one side of the support frame is fixedly connected to a clamping plate, and the surface of the clamping plate is fixedly connected to a buffer pad.

[0014] Preferably, one side of the clamping plate is fixedly connected to a mounting block, the upper and lower sides of the surface of the mounting block are fixedly connected to fixed clamping blocks, the inner wall of the fixed clamping block is rotatably connected to a connecting block, the surface of the connecting block is fixedly connected to a telescopic sleeve rod, and the surface of the telescopic sleeve rod is fixedly connected to an additional plate.

[0015] Preferably, the surface of the mounting plate is fixedly connected to an assembly frame, both sides of the inner wall of the assembly frame are fixedly connected to a first hydraulic rod, the front end of the first hydraulic rod is fixedly connected to a positioning plate, the surface of the positioning plate is fixedly connected to multiple groups of mounting tubes, the front end of the mounting tube is plugged with a connecting rod, the front end of the connecting rod is fixedly connected with a buffer plate, the tail end of the connecting rod is connected to a buffer spring, and the surface of the buffer spring is plugged into the inner wall of the mounting tube.

[0016] Preferably, a second hydraulic rod is fixedly connected to the top of the mounting plate, an extension rod is fixedly connected to the top of the second hydraulic rod, a monitor is fixedly connected to the front end of the extension rod, a mounting groove is opened on the top of the mounting plate, and a protective frame is inserted into the top of the mounting groove.

[0017] Preferably, a control panel is fixedly connected to the top of the test platform, a display screen is fixedly connected to one side of the top of the test platform located at the control panel, and a sealed door is rotatably connected to the surface of the test platform via a hinge.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] (1) Through the setting of the test frame, electric guide rail, sleeve tube, transmitter, universal ball, conduction rod, probe, circular electric guide rail, electric telescopic rod, connecting rod and fixed ring, when in use, the semiconductor is conveniently placed inside the test frame, the semiconductor in the test frame is monitored by the probe, and the data tested by the probe is transmitted to the transmitter by means of a wire through the conduction rod, thereby facilitating the data transmission to the display device through the transmitter for easy viewing by the staff, the circular electric guide rail drives the sliding block connected to the inner wall to move, the sliding block drives the electric telescopic rod at the bottom end to rotate, the electric telescopic rod drives the installation clamp at the bottom end to adjust synchronously, the installation clamp drives the connecting rod set to rotate the inner wall to adjust, the connecting rod drives the limit slider set to rotate at the bottom end to adjust, the limit slider slides inside the limit slide groove inside the fixed ring on the surface of the conduction rod, the electric telescopic rod adjusts its length, and through the adjustment of the connecting rod, the conduction rod and the probe are convenient for detecting different positions of the semiconductor, thereby achieving the effect of convenient monitoring of multiple positions of the semiconductor and facilitating the operation of the staff.

[0020] (2) By configuring the box, forward and reverse screw rods, threaded collars, clamping plates, telescopic sleeve rods, assembly frames, first hydraulic rods, positioning plates, buffer plates and buffer springs, when in use, the forward and reverse screw rods drive the threaded collars on both sides of the surface to move toward each other, the threaded collars drive the top support frame to move, the support frame drives the clamping plates on one side to move, and the semiconductor is clamped by the buffer pads on the surfaces of the two clamping plates. The first hydraulic rod drives the positioning plate at the front end to move, so that the second hydraulic rod presses the buffer plate against the back of the semiconductor. When the semiconductor is impacted, the buffer mechanism composed of the mounting tube, the plug-in rod and the buffer spring buffers the semiconductor, thereby protecting the semiconductor, thereby achieving the effect of clamping and buffering the semiconductor, and facilitating the operation of the staff.

[0021] (3) Through the arrangement of the second hydraulic rod, the extension rod, the monitor, the mounting groove and the protective frame, when in use, the output end of the second hydraulic rod drives the extension rod to adjust the height, and the extension rod drives the monitor at the front end to adjust the height. The monitor is used to monitor the semiconductor in the test frame. The protective frame is inserted into the interior of the mounting groove, and the protective frame is used to seal the semiconductor detection area as a whole, thereby making it easy to create a vacuum environment, thereby achieving the effect of convenient monitoring and sealing testing of semiconductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A perspective view of the present invention;

[0023] Figure 2 A three-dimensional diagram of the mounting plate of the present invention;

[0024] Figure 3 A three-dimensional diagram of a buffer plate of the present invention;

[0025] Figure 4It is a stereoscopic diagram of the forward and reverse screw rod of the present invention;

[0026] Figure 5 A three-dimensional diagram of the electric guide rail of the present invention;

[0027] Figure 6 is a stereogram of the probe of the present invention;

[0028] In the figure: 1. test platform; 2. mounting plate; 3. test frame; 4. connection frame; 5. electric guide rail; 6. sliding block; 7. connection block; 8. sleeve pipe; 9. transmitter; 10. mounting ring; 11. universal ball; 12. conduction rod; 13. probe; 14. wire; 15. circular electric guide rail; 16. moving block; 17. electric telescopic rod; 18. mounting clamp block; 19. connecting rod; 20. limit slider; 21. fixing ring; 22. limit slide groove; 23. configuration box; 24. servo motor; 25. drive rod; 26. Forward and reverse screw rod; 27. Threaded collar; 28. Support frame; 29. ​​Clamping plate; 30. Mounting block; 31. Fixed clamp block; 32. Connecting block; 33. Telescopic sleeve rod; 34. Additional plate; 35. Assembly frame; 36. First hydraulic rod; 37. Positioning plate; 38. Mounting pipe; 39. Plug-in rod; 40. Buffer plate; 41. Buffer spring; 42. Second hydraulic rod; 43. Extension rod; 44. Monitor; 45. Mounting slot; 46. Protective frame; 47. Control panel; 48. Display screen; 49. Sealed door. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Embodiment 1:

[0031] See also Figures 1 to 6 As shown, a vacuum high and low temperature semiconductor device probe test bench with buffer protection comprises:

[0032] Test platform 1;

[0033] The top of the test platform 1 is fixedly connected with a mounting plate 2, and the top of the mounting plate 2 is fixedly connected with a test frame 3;

[0034] The surface of the test frame 3 is fixedly connected to a connection frame 4, the inner bottom wall of the connection frame 4 is fixedly connected to an electric guide rail 5, the inner wall of the electric guide rail 5 is slidably connected to a sliding block 6, the top of the sliding block 6 is fixedly connected to a connection block 7, the back of the connection block 7 is fixedly connected to a sleeve tube 8, the inner wall of the sleeve tube 8 is fixedly connected to a transmitter 9, the front end of the transmitter 9 is fixedly connected to a mounting ring 10, the inner wall of the mounting ring 10 is rotatably connected to a universal ball 11, the surface of the universal ball 11 is fixedly connected to a conduction rod 12, the front end of the conduction rod 12 is fixedly connected to a probe 13, the surface of the conduction rod 12 is electrically connected to a wire 14, and the wire 1 4 and the transmitter 9 are electrically connected to each other, the inner wall of the sleeve tube 8 is fixedly connected with a circular electric guide rail 15, the inner wall of the circular electric guide rail 15 is slidably connected with a moving block 16, the bottom end of the moving block 16 is fixedly connected with an electric telescopic rod 17, the bottom end of the electric telescopic rod 17 is fixedly connected with a mounting clamp 18, the inner wall of the mounting clamp 18 is rotatably connected with a connecting rod 19, the bottom end of the connecting rod 19 is rotatably connected with a limiting slider 20, the surface of the conducting rod 12 is fixedly connected with a fixing ring 21, the surface of the fixing ring 21 is provided with a limiting slide groove 22, and the inner wall of the limiting slide groove 22 is sleeved on the surface of the limiting slider 20.

[0035] When in use, a mounting plate 2 is arranged on the top of the test platform 1, and a test frame 3 is arranged on the top of the mounting plate 2. The inside of the test frame 3 is convenient for placing semiconductors, and an electric guide rail 5 is arranged on one side of the test frame 3 through a connecting frame 4. The staff connects the electric guide rail 5 to a power source, and the electric guide rail 5 drives the sliding block 6 connected to the inner wall to move, and the sliding block 6 drives the connecting block 7 on the top to move, and the connecting block 7 drives the sleeve tube 8 on the back to move. A transmitter 9 is arranged on the inner wall of the sleeve tube 8, and a universal ball 11 is arranged at the front end of the transmitter 9 through a mounting ring 10 for rotation, and a conduction rod 12 is arranged on the surface of the universal ball 11, and a probe 13 is arranged at the front end of the conduction rod 12, so as to monitor the semiconductor in the test frame 3 through the probe 13, and the data tested by the probe 13 is transmitted to the transmitter 9 through the conduction rod 12 using a wire 14, thereby facilitating the transmission of data through the transmitter 9. Input into the display equipment for the convenience of staff to view, and on the inner wall circular electric guide rail 15 of the sleeve tube 8, the staff will connect the circular electric guide rail 15 to the power supply, the circular electric guide rail 15 drives the moving block 16 connected to the inner wall sliding to move, the moving block 16 drives the electric telescopic rod 17 at the bottom to rotate, the electric telescopic rod 17 drives the installation clamp 18 at the bottom to adjust synchronously, the installation clamp 18 drives the connecting rod 19 set to rotate on the inner wall to adjust, the connecting rod 19 drives the limit slider 20 set to rotate at the bottom to adjust, the limit slider 20 slides in the limit slide groove 22 inside the fixed ring 21 on the surface of the conduction rod 12, and the electric telescopic rod 17 is connected to the power supply, the electric telescopic rod 17 adjusts the length, and is adjusted through the connecting rod 19. The universal ball 11 drives the conduction rod 12 to adjust the angle, so that the conduction rod 12 and the probe 13 are convenient for detecting different positions of the semiconductor.

[0036] Embodiment 2:

[0037] See also Figures 1 to 6 As shown, both sides of the test frame 3 are fixedly connected with a configuration box 23, the inner wall of the mounting plate 2 is located at the bottom of the configuration box 23 and is fixedly connected with a servo motor 24, the output end of the servo motor 24 is installed with a driving rod 25, the front end of the driving rod 25 is fixedly connected with a forward and reverse screw rod 26, both sides of the surface of the forward and reverse screw rod 26 are threadedly connected with a threaded collar 27, the top of the threaded collar 27 is fixedly connected with a support frame 28, one side of the support frame 28 is fixedly connected with a clamping plate 29, the surface of the clamping plate 29 is fixedly connected with a buffer pad, one side of the clamping plate 29 is fixedly connected with a mounting block 30, the upper and lower sides of the surface of the mounting block 30 are fixedly connected with a fixed clamping block 31, and the fixed clamping block 31 is fixedly connected with the fixing clamping block 31. The inner wall of the block 31 is rotatably connected with a connecting block 32, the surface of the connecting block 32 is fixedly connected with a telescopic sleeve rod 33, the surface of the telescopic sleeve rod 33 is fixedly connected with an additional plate 34, the surface of the additional plate 34 is fixedly connected with an assembly frame 35, both sides of the inner wall of the assembly frame 35 are fixedly connected with a first hydraulic rod 36, the front end of the first hydraulic rod 36 is fixedly connected with a positioning plate 37, the surface of the positioning plate 37 is fixedly connected with multiple groups of mounting tubes 38, the front end of the mounting tube 38 is plugged with a plug rod 39, the front end of the plug rod 39 is fixedly connected with a buffer plate 40, the tail end of the plug rod 39 is connected with a buffer spring 41, and the surface of the buffer spring 41 is plugged into the inner wall of the mounting tube 38.

[0038] When in use, configuration boxes 23 are provided on both sides of the test frame 3, and servo motors 24 are provided at the bottom of the configuration box 23 and the inner wall of the mounting plate 2. The staff connects the servo motor 24 to the power supply, and the output end of the servo motor 24 drives the driving rod 25 to rotate, and the driving rod 25 drives the forward and reverse screw rods 26 at the front end to rotate, and the forward and reverse screw rods 26 drive the threaded collars 27 on both sides of the surface to move in opposite directions, and the threaded collars 27 drive the top support frame 28 to move, and the support frame 28 drives the clamping plate 29 on one side to move, and the semiconductor is clamped by the buffer pads on the surfaces of the two clamping plates 29, and a mounting block 30 is provided on one side of the clamping plate 29, and the upper and lower sides of the two mounting blocks 30 are both provided with connecting blocks 32 through the fixed clamping blocks 31 for rotation, and the two connecting blocks 32 are connected by a telescopic sleeve rod 33 The telescopic sleeve 33 is connected, and an additional plate 34 is provided on the outermost sleeve rod surface of the telescopic sleeve 33, and an assembly frame 35 is provided on the surface of the additional plate 34. Both sides of the inner wall of the assembly frame 35 are provided with first hydraulic rods 36. The staff connects the two first hydraulic rods 36 to the power supply, and the first hydraulic rods 36 drive the front end positioning plate 37 to move. A plurality of mounting tubes 38 are provided on the surface of the positioning plate 37. A plug-in rod 39 is plugged into the front end of the mounting tube 38. The plug-in rod 39 is connected to the mounting tube 38 through a buffer spring 41, and a buffer plate 40 is provided at the front end of the plug-in rod 39, so that the second hydraulic rod 42 presses the buffer plate 40 against the back of the semiconductor, and when the semiconductor is collided, the buffer mechanism composed of the mounting tube 38, the plug-in rod 39 and the buffer spring 41 buffers the semiconductor, thereby protecting the semiconductor.

[0039] Embodiment three:

[0040] See also Figures 1 to 6 As shown, a second hydraulic rod 42 is fixedly connected to the top of the mounting plate 2, an extension rod 43 is fixedly connected to the top of the second hydraulic rod 42, a monitor 44 is fixedly connected to the front end of the extension rod 43, a mounting groove 45 is provided on the top of the mounting plate 2, a protective frame 46 is inserted into the top of the mounting groove 45, a control panel 47 is fixedly connected to the top of the test platform 1, a display screen 48 is fixedly connected to the top of the test platform 1 on one side of the control panel 47, and a sealing door 49 is rotatably connected to the surface of the test platform 1 through a hinge.

[0041] When in use, a second hydraulic rod 42 is provided on the top of the mounting plate 2. The staff drives the second hydraulic rod 42. The output end of the second hydraulic rod 42 drives the extension rod 43 to adjust the height. The extension rod 43 drives the monitor 44 at the front end to adjust the height. The monitor 44 is used to monitor the semiconductors in the test frame 3. A mounting groove 45 is provided on the top of the mounting plate 2. A protective frame 46 is inserted into the interior of the mounting groove 45. The protective frame 46 is used to seal the semiconductor detection area as a whole, thereby making it easy to create a vacuum environment.

[0042] Embodiment 4:

[0043] See also Figures 1 to 6 As shown, the test bench can accurately test semiconductor devices in vacuum high and low temperature environments. It can realize multi-position and multi-angle monitoring of semiconductor devices, and provide buffer protection to ensure safety and accuracy during the test.

[0044] Working principle:

[0045] Test platform and installation structure:

[0046] The test platform 1 serves as the basis of the entire test system, on which a mounting plate 2 is fixed, and a test frame 3 is further fixed on the top of the mounting plate 2 for placing semiconductor devices to be tested.

[0047] Probe test system:

[0048] The probe 13 is used to directly contact the semiconductor device for testing.

[0049] The wire 14 and the transmitter 9 are electrically connected to each other to ensure that the test data can be accurately transmitted.

[0050] Multi-position monitoring and adjustment:

[0051] Through the coordinated work of the circular electric guide rail 15 and the electric telescopic rod 17 , the probe 13 can be adjusted at multiple angles and positions to meet the testing requirements of different semiconductor devices.

[0052] Clamping and buffer protection:

[0053] The buffer pad is used to clamp the semiconductor device and provide a certain buffer protection.

[0054] When the semiconductor device is impacted, the buffer mechanism composed of the mounting tube 38, the plug rod 39 and the buffer spring 41 can absorb the impact energy, thereby further protecting the semiconductor device from damage.

[0055] Monitoring and sealing test:

[0056] By adjusting the second hydraulic rod 42 , the height of the monitor 44 can be adjusted to meet different testing requirements.

[0057] The protection frame 46 is used to seal the semiconductor testing area as a whole to create a vacuum testing environment.

[0058] The control panel 47 is used to control the operation of the entire test system, and the display screen 48 is used to display test data and results.

[0059] Working principle: When in use, semiconductors are conveniently placed inside the test frame 3. The staff turns on the power of the electric guide rail 5, which drives the sliding block 6 connected to the inner wall to move, and the sliding block 6 drives the connecting block 7 on the top to move, and the connecting block 7 drives the sleeve 8 on the back to move. The semiconductor in the test frame 3 is monitored by the probe 13, and the data tested by the probe 13 is transmitted to the transmitter 9 through the conductive rod 12 using the wire 14, thereby facilitating the data transmission to the display device through the transmitter 9 for the staff to view. The staff turns on the power of the circular electric guide rail 15, and the circular electric The guide rail 15 drives the moving block 16 connected to the inner wall for sliding movement, and the moving block 16 drives the electric telescopic rod 17 at the bottom to rotate. The electric telescopic rod 17 drives the installation clamp 18 at the bottom to adjust synchronously. The installation clamp 18 drives the connecting rod 19 set for rotating the inner wall to adjust. The connecting rod 19 drives the limit slider 20 set for rotating the bottom to adjust. The limit slider 20 slides inside the limit slide groove 22 inside the fixed ring 21 on the surface of the conduction rod 12, and the electric telescopic rod 17 is powered on. The electric telescopic rod 17 adjusts its length through the connecting rod 19, and the universal ball 11 drives the conduction rod 12 to adjust The angle makes it easy for the conducting rod 12 and the probe 13 to monitor different positions of the semiconductor. The staff connects the servo motor 24 to the power supply, and the output end of the servo motor 24 drives the driving rod 25 to rotate. The driving rod 25 drives the forward and reverse screw rod 26 at the front end to rotate. The forward and reverse screw rod 26 drives the threaded collars 27 on both sides of the surface to move in opposite directions. The threaded collar 27 drives the top support frame 28 to move, and the support frame 28 drives the clamping plate 29 on one side to move. The semiconductor is clamped by the buffer pads on the surfaces of the two clamping plates 29. The staff connects the two first hydraulic rods 36 to the power supply so that the second hydraulic rods 36 can rotate. The rod 42 presses the buffer plate 40 against the back of the semiconductor, and when the semiconductor is impacted, the buffer mechanism composed of the mounting tube 38, the plug-in rod 39 and the buffer spring 41 buffers the semiconductor, thereby protecting the semiconductor. The staff drives the second hydraulic rod 42, and the output end of the second hydraulic rod 42 drives the extension rod 43 to adjust the height, and the extension rod 43 drives the monitor 44 at the front end to adjust the height. The monitor 44 is used to facilitate monitoring of the semiconductor in the test frame 3. A protective frame 46 is inserted into the interior of the mounting groove 45, and the protective frame 46 is used to seal the semiconductor detection area as a whole, thereby facilitating the creation of a vacuum environment.

[0060] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A vacuum high and low temperature semiconductor device probe test bench with buffer protection, characterized in that: include: Test platform (1); The top of the test platform (1) is fixedly connected to a mounting plate (2), and the top of the mounting plate (2) is fixedly connected to a test frame (3); The surface of the test frame (3) is fixedly connected to a connection frame (4); the inner bottom wall of the connection frame (4) is fixedly connected to an electric guide rail (5); the inner wall of the electric guide rail (5) is slidably connected to a sliding block (6); the top of the sliding block (6) is fixedly connected to a connection block (7); the back of the connection block (7) is fixedly connected to a sleeve pipe (8); the inner wall of the sleeve pipe (8) is fixedly connected to a transmitter (9); the front end of the transmitter (9) is fixedly connected to a mounting ring (10); the inner wall of the mounting ring (10) is rotatably connected to a universal ball (11); the surface of the universal ball (11) is fixedly connected to a conduction rod (12); the front end of the conduction rod (12) is fixedly connected to a probe (13); the surface of the conduction rod (12) is electrically connected to a wire (14); and the wire (14) and the transmitter (9) are electrically connected to each other.

2. A vacuum high and low temperature semiconductor device probe test bench with buffer protection according to claim 1, characterized in that: The inner wall of the sleeve tube (8) is fixedly connected to a circular electric guide rail (15), the inner wall of the circular electric guide rail (15) is slidably connected to a moving block (16), the bottom end of the moving block (16) is fixedly connected to an electric telescopic rod (17), the bottom end of the electric telescopic rod (17) is fixedly connected to a mounting clamp (18), the inner wall of the mounting clamp (18) is rotatably connected to a connecting rod (19), and the bottom end of the connecting rod (19) is rotatably connected to a limiting slider (20).

3. A vacuum high and low temperature semiconductor device probe test bench with buffer protection according to claim 1, characterized in that: A fixing ring (21) is fixedly connected to the surface of the conduction rod (12), a limiting sliding groove (22) is provided on the surface of the fixing ring (21), and the inner wall of the limiting sliding groove (22) is sleeved on the surface of the limiting sliding block (20).

4. A vacuum high and low temperature semiconductor device probe test bench with buffer protection according to claim 1, characterized in that: Both sides of the test frame (3) are fixedly connected to a configuration box (23); the inner wall of the mounting plate (2) is located at the bottom of the configuration box (23) and is fixedly connected to a servo motor (24); a driving rod (25) is installed at the output end of the servo motor (24); and a forward and reverse screw rod (26) is fixedly connected to the front end of the driving rod (25).

5. A vacuum high and low temperature semiconductor device probe test bench with buffer protection according to claim 4, characterized in that: Both sides of the surface of the forward and reverse screw rod (26) are threadedly connected with threaded collars (27), the top of the threaded collar (27) is fixedly connected with a support frame (28), one side of the support frame (28) is fixedly connected with a clamping plate (29), and the surface of the clamping plate (29) is fixedly connected with a buffer pad.

6. A vacuum high and low temperature semiconductor device probe test bench with buffer protection according to claim 5, characterized in that: A mounting block (30) is fixedly connected to one side of the clamping plate (29); fixed clamping blocks (31) are fixedly connected to the upper and lower sides of the surface of the mounting block (30); a connecting block (32) is rotatably connected to the inner wall of the fixing clamping block (31); a telescopic sleeve rod (33) is fixedly connected to the surface of the connecting block (32); and a mounting plate (34) is fixedly connected to the surface of the telescopic sleeve rod (33).

7. A vacuum high and low temperature semiconductor device probe test bench with buffer protection according to claim 6, characterized in that: The surface of the mounting plate (34) is fixedly connected to an assembly frame (35), and both sides of the inner wall of the assembly frame (35) are fixedly connected to a first hydraulic rod (36), the front end of the first hydraulic rod (36) is fixedly connected to a positioning plate (37), and the surface of the positioning plate (37) is fixedly connected to a plurality of mounting tubes (38), the front end of the mounting tube (38) is plugged with a plug-in rod (39), the front end of the plug-in rod (39) is fixedly connected to a buffer plate (40), the rear end of the plug-in rod (39) is connected to a buffer spring (41), and the surface of the buffer spring (41) is plugged into the inner wall of the mounting tube (38).

8. The vacuum high and low temperature semiconductor device probe test bench with buffer protection according to claim 1, characterized in that: A second hydraulic rod (42) is fixedly connected to the top of the mounting plate (2), an extension rod (43) is fixedly connected to the top of the second hydraulic rod (42), a monitoring instrument (44) is fixedly connected to the front end of the extension rod (43), a mounting groove (45) is provided on the top of the mounting plate (2), and a protective frame (46) is inserted into the top of the mounting groove (45).

9. The vacuum high and low temperature semiconductor device probe test bench with buffer protection according to claim 1, characterized in that: A control panel (47) is fixedly connected to the top of the test platform (1), a display screen (48) is fixedly connected to the top of the test platform (1) on one side of the control panel (47), and a sealed door (49) is rotatably connected to the surface of the test platform (1) via a hinge.

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