An automatic testing machine for an IC chip and its testing method

Abstract

The present invention belongs to the technical field of chip testing, and particularly relates to an IC chip automatic testing machine and its testing method, including a testing machine body. At the left and right positions on the top of the testing machine body, two Y-axis rails are symmetrically installed. Along the front-back direction, an X-axis rail is slidably installed on the top of the two Y-axis rails. A fixing plate is installed on the front side of the X-axis rail. Through the provision of a support spring, after the suction cup on the rubber suction head completes the operation of sucking the chip, the conveyor belt can drive the chip to move upward out of the chip tray. As the chip is removed from the chip tray, the support spring can gradually extend, thereby pushing the metal sheet at the bottom downward and resetting through the support rod. As the metal sheet at the bottom is reset, the rubber suction head also completes the reset together, thus avoiding the deformation of the rubber suction head due to long-term extrusion operation and ensuring the suction effect of the rubber suction head on the chip.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip testing, and particularly relates to an IC chip automatic testing machine and a testing method thereof. Background Art

[0002] An automatic chip testing machine, also known as automatic test equipment (ATE), is an automated machine used to verify the functions, performances, and qualities of semiconductor chips.

[0003] When the existing automatic chip testing machine tests a chip, generally a suction head is used to suck the chip placed in a chip tray, and then the sucked chip is placed in a designated testing station of the automatic chip testing machine for testing operations. During the process of the suction head sucking the chip, the suction head generally needs to be pressed tightly on the top of the chip, and then the chip is sucked by the suction generated by the suction pipe. However, since the suction head is generally made of rubber material, during the long-term pressing process, the suction head will deform, resulting in the suction head being unable to fit completely with the chip surface, thereby affecting the suction effect of the suction head on the chip. In addition, due to the differences between chips themselves, the surfaces of the chips may also be uneven, which will also affect the suction effect of the suction head on the chips.

[0004] Therefore, it is very necessary to invent an IC chip automatic testing machine and a testing method thereof to solve the above problems. Summary of the Invention

[0005] In view of the above problems, the present invention provides an IC chip automatic testing machine and a testing method thereof to solve the problems raised in the above background art.

[0006] To achieve the above object, the present invention provides the following technical solution: An automatic IC chip tester, comprising a tester body. On the left and right positions at the top of the tester body, two Y-axis rails are symmetrically installed. Along the front-rear direction, an X-axis rail is slidably installed on the top of the two Y-axis rails. A fixed plate is installed on the front side of the X-axis rail. On the front side of the fixed plate, two vertically arranged conveyor belts are symmetrically installed. An air pump is installed inside the conveyor belts. The bottom of the air pump is vertically and fixedly connected with a suction pipe. A vision positioning module is arranged on the front side of the two suction pipes. The vision positioning module is installed on the fixed plate. The bottom end of the suction pipe is connected with a telescopic rubber suction head. Metal sheets are fixedly connected to both the top and bottom inner walls of the rubber suction head. A plurality of support rods are fixedly connected to the bottom metal sheet. The top end of the support rod is slidably inserted with a connecting rod. The connecting rod is fixedly connected to the top metal sheet. A support spring is connected between the bottom end of the connecting rod and the inside of the support rod. The top of the rubber suction head is fixedly connected with a threaded head. The bottom opening of the rubber suction head is rotatably connected with a spherical tube. The bottom end of the spherical tube is fixedly connected with a suction cup. The top end of the spherical tube is fixedly connected with a fixing ring. A plurality of threading rings are fixedly connected to the top of the fixing ring. A pull rope is threaded between two threading rings in the facing position. The ends of the plurality of pull ropes are fixedly connected to the same pull rod. The top end of the pull rod is fixedly connected with a circular plate. A fixing sleeve is slidably sleeved on the pull rod. A return spring is connected between the fixing sleeve and the circular plate. A plurality of fixing rods are fixedly connected between the side of the fixing sleeve and the inner wall of the threaded head.

[0007] Further, the metal sheets are annular, and the sizes of the two metal sheets respectively match the sizes of the top and bottom inner walls of the rubber suction head.

[0008] Further, a rubber sealing ring concentric with the suction cup is fixedly connected to the bottom of the suction cup. A plurality of rubber U-shaped protrusions are annularly distributed inside the sealing ring. The opening of the U-shaped protrusion is communicated with the bottom opening of the suction cup, and the height of the U-shaped protrusion matches the height of the sealing ring.

[0009] Further, there is a gap between the bottom of the fixing ring and the bottom metal sheet, and an elastic rubber ring is arranged in this gap. The rubber ring is fixedly connected to the top of the bottom metal sheet, and the height of the rubber ring is equal to the distance between the fixing ring and the bottom metal sheet.

[0010] Further, a fixing ball is slidably sleeved on the pull rod. The fixing ball is rotatably installed inside the fixing sleeve, and the bottom end of the return spring is fixedly connected to the top of the fixing ball.

[0011] Further, a chip tray is arranged on the top of the tester body. A tray support is arranged at the bottom of the chip tray. The tray support is fixedly connected to the top of the tester body.

[0012] Further, a test tray is provided on one side of the chip tray. The test tray is installed on the top of the test machine body, and a plurality of test stations are evenly distributed on the top of the test tray.

[0013] Further, the plurality of support rods are evenly distributed in a ring shape, and the support rods are vertically and fixedly connected to the metal sheet at the bottom.

[0014] The present invention also provides a test method for an IC chip automatic test machine using any one of the above, and this process includes the following steps:

[0015] Step 1: Uniformly stack the chips to be tested on the chip tray, and then place the chip tray with the stacked chips on the tray bracket.

[0016] Step 2: Start the test machine body, so that the two suction pipes move to the top of the chip tray under the cooperation of the X and Y tracks and the vision positioning module. Then, as the conveyor belt drives the air pump and the suction pipes to move downward, the rubber suction heads at the bottom of the suction pipes can suck the chips in the chip tray.

[0017] Step 3: After the rubber suction heads complete the suction operation on the chips, the conveyor belt can drive the chips to move upward out of the chip tray. Then, the X and Y tracks and the vision positioning module can cooperate with each other to move the chips to the designated position on the top of the test tray.

[0018] Step 4: As the conveyor belt drives the air pump to move upward, the suction pipes can drive the rubber suction heads and the chips to move upward and finally place them in the test stations on the test tray. Then, the test machine body can automatically perform a test operation on the chips.

[0019] Step 5: After the test is completed, the suction pipes can suck out the tested chips from the test tray and put them back into the chip tray. Thus, the chip test is completed.

[0020] The technical effects and advantages of the present invention:

[0021] 1. By providing a support spring in the present invention, after the suction cups on the rubber suction heads complete the suction operation on the chips, the conveyor belt can drive the chips to move upward out of the chip tray. As the chips are removed from the chip tray, the support spring can gradually elongate, thereby pushing the metal sheet at the bottom downward and resetting through the support rods. As the bottom metal sheet resets, the rubber suction heads also reset together, thus avoiding the deformation of the rubber suction heads due to long-term extrusion operations and ensuring the suction effect of the rubber suction heads on the chips.

[0022] 2. The present invention is provided with a spherical tube. When the surface of the chip is uneven or the chip is placed unevenly, as the suction cup contacts the top of the chip, the suction cup can drive the spherical tube to rotate adaptively, so that the suction cup can better fit the top of the chip, ensuring the suction effect of the suction cup on the chip.

[0023] 3. The present invention is provided with a U-shaped protrusion and a sealing ring. When the straw generates suction, the air inside the U-shaped protrusion can also be sucked away together, so that the multiple U-shaped protrusions can also generate suction on the top of the chip, thereby cooperating with the sealing ring to improve the suction effect on the chip. And since each U-shaped protrusion is independent, each U-shaped protrusion can generate suction on different positions of the top of the chip, thus improving the stability of the suction cup to suck the chip and avoiding the loosening of the chip due to poor sealing of the sealing ring or insecure adsorption of a certain U-shaped protrusion to the chip. Description of the Drawings

[0024] Figure 1 is the overall structural schematic diagram of the present invention;

[0025] Figure 2 is the three-dimensional schematic diagram of the structures such as the fixing plate, conveyor belt, straw, and vision positioning module in the present invention;

[0026] Figure 3 is the three-dimensional schematic diagram of the rubber suction head and the threaded head in the present invention;

[0027] Figure 4 is the three-dimensional schematic diagram of the rubber suction head, threaded head, suction cup, sealing ring, and U-shaped protrusion in the present invention;

[0028] Figure 5 is the three-dimensional sectional view of the rubber suction head in the present invention;

[0029] Figure 6 is the three-dimensional schematic diagram of the rubber suction head and its internal partial structure in the present invention;

[0030] Figure 7 is the three-dimensional schematic diagram of the structures such as the suction cup, spherical tube, pull rope, pull rod, fixed sleeve, and circular plate in the present invention.

[0031] In the figure: 1. Test machine body; 2. Y-axis track; 3. X-axis track; 4. Fixed plate; 5. Conveyor belt; 6. Air pump; 7. Straw; 8. Vision positioning module; 9. Rubber suction head; 10. Metal sheet; 11. Support rod; 12. Connecting rod; 13. Support spring; 14. Threaded head; 15. Spherical tube; 16. Suction cup; 17. Fixed ring; 18. Thread-passing ring; 19. Pulling rope; 20. Pulling rod; 21. Circular plate; 22. Fixed sleeve; 23. Return spring; 24. Fixed rod; 25. Sealing ring; 26. U-shaped protrusion; 27. Rubber ring; 28. Fixed ball; 29. Chip tray; 30. Tray support; 31. Test plate; 32. Test station. Detailed implementation mode

[0032] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0033] The present invention provides as Figures 1 to 7An automatic IC chip testing machine shown in the figure includes a testing machine body 1. On the left and right positions at the top of the testing machine body 1, two Y-axis rails 2 are symmetrically installed. Along the front and back directions, an X-axis rail 3 is slidably installed on the top of the two Y-axis rails 2. A fixing plate 4 is installed on the front side of the X-axis rail 3. On the front side of the fixing plate 4, two vertical conveyor belts 5 are symmetrically installed. An air pump 6 is installed inside the conveyor belt 5. The bottom of the air pump 6 is vertically and fixedly connected with a suction pipe 7. A vision positioning module 8 is arranged on the front side of the two suction pipes 7. The vision positioning module 8 is installed on the fixing plate 4. The bottom end of the suction pipe 7 is connected with a telescopic rubber suction head 9. Metal sheets 10 are fixedly connected to both the top and bottom inner walls of the rubber suction head 9. The metal sheets 10 are annular, and the sizes of the two metal sheets 10 respectively match the sizes of the top and bottom inner walls of the rubber suction head 9. A plurality of support rods 11 are fixedly connected to the bottom metal sheet 10. The top end of the support rod 11 is slidably inserted with a connecting rod 12. The connecting rod 12 is fixedly connected to the top metal sheet 10. A support spring 13 is connected between the bottom end of the connecting rod 12 and the inside of the support rod 11. A threaded head 14 is fixedly connected to the top of the rubber suction head 9. The bottom opening of the rubber suction head 9 is rotatably connected with a spherical tube 15. The bottom end of the spherical tube 15 is fixedly connected with a suction cup 16. The top end of the spherical tube 15 is fixedly connected with a fixing ring 17. A plurality of threading rings 18 are fixedly connected to the top of the fixing ring 17. A pull rope 19 is threaded between two threading rings 18 at the opposite positions. The ends of the plurality of pull ropes 19 are fixedly connected to the same pull rod 20. The top end of the pull rod 20 is fixedly connected with a circular plate 21. A fixing sleeve 22 is slidably sleeved on the pull rod 20. A return spring 23 is connected between the fixing sleeve 22 and the circular plate 21. A plurality of fixing rods 24 are fixedly connected between the side of the fixing sleeve 22 and the inner wall of the threaded head 14;

[0034] A chip tray 29 is arranged on the top of the testing machine body 1. A tray support 30 is arranged at the bottom of the chip tray 29. The tray support 30 is fixedly connected to the top of the testing machine body 1. A test tray 31 is arranged on one side of the chip tray 29. The test tray 31 is installed on the top of the testing machine body 1, and a plurality of test stations 32 are evenly distributed on the top of the test tray 31. The plurality of support rods 11 are evenly distributed in a ring shape, and the support rods 11 are vertically and fixedly connected to the bottom metal sheet 10;

[0035] Before testing the chip, the chips to be tested are evenly stacked on the chip tray 29, and then the chip tray 29 with the stacked chips is placed on the tray bracket 30, and then the test machine body 1 is started, so that the two suction pipes 7 move to the top of the chip tray 29 under the cooperation of the X and Y tracks and the visual positioning module 8, and then as the conveyor belt 5 drives the air pump 6 and the suction pipe 7 to move downward, the rubber suction head 9 at the bottom of the suction pipe 7 can suck the chip in the chip tray 29, and the rubber suction head 9 moves downward and passes through the suction cup 1 When the rubber suction head 9 is pressed tightly against the top of the chip, the rubber suction head 9 can gradually shrink and deform due to the squeezing force. As the rubber suction head 9 is gradually squeezed, the bottom of the rubber suction head 9 can drive the metal sheet 10 at the bottom to move upward. As the metal sheet 10 moves upward, the support rod 11 can gradually move upward and cooperate with the connecting rod 12 to squeeze the support spring 13. At the same time, as the metal sheet 10 at the bottom moves upward, the return spring 23 can generate an upward pulling force on the pull rod 20 through the circular plate 21, so that the pull rod 20 can always pass through the pull rope 1 9 pairs of fixing rings 17 generate an upward pulling force. After the suction cup 16 completes the suction operation on the chip, the conveyor belt 5 can drive the chip to move upward out of the chip tray 29. As the chip moves out of the chip tray 29, the support spring 13 can gradually extend, thereby pushing the metal sheet 10 at the bottom to move downward and reset through the support rod 11. As the bottom metal sheet 10 is reset, the rubber suction head 9 is also reset together, thereby avoiding the deformation of the rubber suction head 9 due to long-term extrusion operation, ensuring the suction effect of the rubber suction head 9 on the chip. After the chip is removed from the chip tray 29, the X and Y tracks and the visual positioning module 8 can cooperate with each other to move the chip to the designated position on the top of the test tray 31. As the conveyor belt 5 drives the air pump 6 to move upward, the suction pipe 7 can drive the rubber suction head 9 and the chip to move upward and finally place them in the test station 32 on the test tray 31. Then the test machine body 1 can automatically test the chip. After the test is completed, the suction pipe 7 can suck the tested chip out of the test tray 31 and put it back into the chip tray 29. At this point, the chip test is completed;

[0036] When the suction cup 16 sucks the chip, since the chip surface may be uneven or the chip is not placed straight, as the rubber suction head 9 drives the suction cup 16 to move downward and contact the top of the chip, the bottom surface of the suction cup 16 cannot keep perfect fit with the top of the chip, which will affect the suction effect of the suction cup 16 on the chip. At this time, by providing the spherical tube 15, when the chip surface is uneven or the chip is placed unevenly, as the suction cup 16 contacts the top of the chip, the suction cup 16 can drive the spherical tube 15 to rotate adaptively, so that the suction cup 16 can better keep fit with the top of the chip, and in the process of the deflection of the suction cup 16, the pull rope 19 can adaptively move in the threading ring 18, so as to meet the deflection requirement of the suction cup 16;

[0037] After the suction cup 16 picks up the chip and moves it out of the chip tray 29, as the support spring 13 presses the support rod 11 to drive the rubber suction head 9 to reset, the reset spring 23 can be compressed again by the circular plate 21, and the pulling force of the reset spring 23 on the pull rope 19 through the pull rod 20 can enable the fixing ring 17 to return to the horizontal state again.

[0038] Such as Figure 4 As shown, a rubber sealing ring 25 concentric with it is fixedly connected to the bottom of the suction cup 16. A plurality of rubber U-shaped protrusions 26 are annularly distributed on the inner side of the sealing ring 25. The openings of the U-shaped protrusions 26 communicate with the bottom opening of the suction cup 16, and the height of the U-shaped protrusions 26 matches the height of the sealing ring 25;

[0039] By providing the sealing ring 25, during the process of the suction cup 16 sucking the chip, when the suction cup 16 fits together with the top of the chip, the sealing ring 25 can keep in close contact with the chip. And as the air pump 6 generates suction through the suction pipe 7, the air inside the sealing ring 25 can be gradually sucked away, so that the chip can be firmly adsorbed on the bottom of the suction cup 16 under the action of the atmospheric pressure;

[0040] In addition, by providing a plurality of rubber U-shaped protrusions 26, during the process of the sealing ring 25 fitting together with the top of the chip, the plurality of U-shaped protrusions 26 can also keep in close contact with the top of the chip. Thus, when the suction pipe 7 generates suction, the air inside the U-shaped protrusions 26 can also be sucked away together, so that the plurality of U-shaped protrusions 26 can also generate suction on the top of the chip, thereby cooperating with the sealing ring 25 to improve the suction effect on the chip. And since each U-shaped protrusion 26 is independent, each U-shaped protrusion 26 can generate suction on different positions of the top of the chip, so as to improve the stability of the suction cup 16 sucking the chip and avoid the chip from loosening due to the poor sealing of the sealing ring 25 or the insecure adsorption of a certain U-shaped protrusion 26 to the chip.

[0041] Such as Figure 5 And Figure 6 As shown, there is a gap between the bottom of the fixing ring 17 and the metal sheet 10 at the bottom, and an elastic rubber ring 27 is arranged in this gap. The rubber ring 27 is fixedly connected to the top of the metal sheet 10 at the bottom, and the height of the rubber ring 27 is equal to the distance between the fixing ring 17 and the metal sheet 10 at the bottom;

[0042] By providing a rubber ring 27, when the suction cup 16 tilts during chip suction, the fixing ring 17 can tilt together with the suction cup 16. At this time, the downward-tilting side of the fixing ring 17 can squeeze the rubber ring 27. As the rubber ring 27 is squeezed, the rubber ring 27 can push the fixing ring 17 upward. After the chip is picked up by the suction cup 16 from the suction cup tray, the rubber ring 27 can cooperate with the pulling force of the pulling rope 19 on the fixing ring 17 to make the fixing ring 17 drive the suction cup 16 and the chip to quickly return to the horizontal state.

[0043] As Figure 7 shown, a fixing ball 28 is slidably sleeved on the pull rod 20. The fixing ball 28 is rotatably installed inside the fixing sleeve 22, and the bottom end of the return spring 23 is fixedly connected to the top of the fixing ball 28.

[0044] By providing the fixing ball 28, during the up and down movement of the pull rod 20, when the suction cup 16 tilts, the pull rod 20 can drive the fixing ball 28 and the return spring 23 to deflect synchronously under the pulling of the pulling rope 19, so as to ensure that the pulling force generated by the return spring 23 on the pulling rope 19 through the pull rod 20 is always coaxial with the suction cup 16, thereby ensuring the pulling effect of the pulling rope 19 on the suction cup 16.

[0045] The present invention also provides a test method for an IC chip automatic tester using any one of the above. The process includes the following steps:

[0046] Step 1: Uniformly stack the chips to be tested on the chip tray 29, and then place the chip tray 29 with the stacked chips on the tray support 30.

[0047] Step 2: Start the tester body 1, so that the two suction pipes 7 move to the top of the chip tray 29 under the combined action of the X and Y tracks and the vision positioning module 8. Then, as the conveyor belt 5 drives the air pump 6 and the suction pipes 7 to move downward, the rubber suction heads 9 at the bottom of the suction pipes 7 can suck the chips in the chip tray 29.

[0048] Step 3: After the rubber suction heads 9 complete the chip suction operation, the conveyor belt 5 can drive the chips to move upward out of the chip tray 29. Then, the X and Y tracks and the vision positioning module 8 can cooperate with each other to move the chips to the designated position at the top of the test tray 31.

[0049] Step 4: As the conveyor belt 5 drives the air pump 6 to move upward, the suction pipes 7 can drive the rubber suction heads 9 and the chips to move upward and finally place them in the test station 32 on the test tray 31. Then, the tester body 1 can automatically test the chips.

[0050] Step 5: After the test is completed, the pipette 7 can suck the tested chip out of the test plate 31 and put it back into the chip tray 29, and the chip test is now completed.

[0051] The above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them.

Claims

1. An IC chip automatic tester, comprising a tester body (1), characterized in that: Two Y-axis rails (2) are symmetrically installed at the left and right positions of the top of the testing machine body (1); an X-axis rail (3) is slidably installed on the top of the two Y-axis rails (2) in the front-to-back direction; a fixing plate (4) is installed on the front side of the X-axis rail (3); two vertical conveyor belts (5) are symmetrically installed on the front side of the fixing plate (4); an air pump (6) is installed on the inner side of the conveyor belt (5); a suction pipe (7) is vertically fixedly connected to the bottom of the air pump (6); and a visual positioning module is arranged on the front side of the two suction pipes (7). The visual positioning module (8) is mounted on a fixed plate (4), the bottom end of the suction tube (7) is connected to a retractable rubber suction head (9), the top and bottom inner walls of the rubber suction head (9) are fixedly connected to an annular metal sheet (10), and the middle opening of the metal sheet (10) is directly opposite to the openings at the top and bottom of the rubber suction head (9), and the metal sheet (10) at the bottom is fixedly connected to a plurality of support rods (11), and the top ends of the support rods (11) are slidably plugged with connecting rods (12), and the connecting rods (12) are connected to the top ends of the support rods (11). The rod (12) is fixedly connected to the metal sheet (10) at the top, a support spring (13) is connected between the bottom end of the connecting rod (12) and the inside of the support rod (11), a threaded head (14) is fixedly connected to the top of the rubber suction head (9), a spherical tube (15) is rotatably connected to the bottom opening of the rubber suction head (9), a suction cup (16) is fixedly connected to the bottom end of the spherical tube (15), a fixing ring (17) is fixedly connected to the top of the spherical tube (15), and a plurality of threaded holes are fixedly connected to the top of the fixing ring (17). A wire loop (18), a pull rope (19) is threaded between two wire loops (18) located at opposite positions, a pull rod (20) is fixedly connected between the ends of the plurality of pull ropes (19), a round plate (21) is fixedly connected to the top of the pull rod (20), a fixed sleeve (22) is slidably sleeved on the pull rod (20), a return spring (23) is connected between the fixed sleeve (22) and the round plate (21), and a plurality of fixed rods (24) are fixedly connected between the side surface of the fixed sleeve (22) and the inner wall of the threaded head (14).

2. The IC chip automatic tester according to claim 1, characterized in that: The metal sheets (10) are ring-shaped, and the sizes of the two metal sheets (10) match the sizes of the top and bottom inner walls of the rubber suction head (9) respectively.

3. The IC chip automatic testing machine according to claim 2, characterized in that: The bottom of the suction cup (16) is fixedly connected to a concentric rubber sealing ring (25), and a plurality of rubber U-shaped protrusions (26) are distributed in an annular manner inside the sealing ring (25), the opening of the U-shaped protrusion (26) is connected to the bottom opening of the suction cup (16), and the height of the U-shaped protrusion (26) matches the height of the sealing ring (25).

4. The IC chip automatic testing machine according to claim 3, characterized in that: There is a gap between the bottom of the fixing ring (17) and the metal sheet (10) at the bottom, and an elastic rubber ring (27) is arranged in the gap. The rubber ring (27) is fixedly connected to the top of the metal sheet (10) at the bottom, and the height of the rubber ring (27) is equal to the distance between the fixing ring (17) and the metal sheet (10) at the bottom.

5. The IC chip automatic testing machine according to claim 4, characterized in that: A fixed ball (28) is slidably sleeved on the pull rod (20), the fixed ball (28) is rotatably mounted on the inner side of the fixed sleeve (22), and the bottom end of the return spring (23) is fixedly connected to the top of the fixed ball (28).

6. The IC chip automatic tester according to claim 5, characterized in that: A chip tray (29) is arranged on the top of the test machine body (1), a tray support (30) is arranged on the bottom of the chip tray (29), and the tray support (30) is fixedly connected to the top of the test machine body (1).

7. The IC chip automatic tester according to claim 6, characterized in that: A test tray (31) is provided on one side of the chip tray (29); the test tray (31) is installed on the top of the test machine body (1); and a plurality of test stations (32) are evenly distributed on the top of the test tray (31).

8. The IC chip automatic tester according to claim 7, characterized in that: The plurality of support rods (11) are evenly distributed in a ring shape, and the support rods (11) are vertically fixedly connected to the metal sheet (10) located at the bottom.

9. A testing method using an IC chip automatic testing machine according to any one of claims 1 to 8, characterized in that: The method comprises the following steps: Step 1: evenly stack the chips to be tested on a chip tray (29), and then place the chip tray (29) with the stacked chips on a tray support (30); Step 2: Start the testing machine body (1), so that the two suction pipes (7) move to the top of the chip tray (29) under the cooperation of the X and Y tracks and the visual positioning module (8), and then as the conveyor belt (5) drives the air pump (6) and the suction pipes (7) to move downward, the rubber suction head (9) at the bottom of the suction pipes (7) can suck the chip in the chip tray (29); Step 3: After the rubber suction head (9) completes the suction operation on the chip, the conveyor belt (5) can drive the chip to move upward out of the chip tray (29), and then the X and Y tracks and the visual positioning module (8) can cooperate with each other to move the chip to a designated position on the top of the test tray (31); Step 4: As the conveyor belt (5) drives the air pump (6) to move upward, the suction tube (7) can drive the rubber suction head (9) and the chip to move upward and finally be placed in the test station (32) on the test plate (31), and then the test machine body (1) can automatically perform a test operation on the chip; Step 5: After the test is completed, the pipette (7) can suck the tested chip out of the test plate (31) and put it back into the chip tray (29), and the chip test is now completed.

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