Cyclic control method and system for alkaline etching waste liquid

Abstract

The invention discloses a circulation control method and system for an alkaline etching waste liquid, and the method comprises the steps: stirring the alkaline etching waste liquid and a sodium hydroxide solution based on a stirring motor in the filling process of the sodium hydroxide solution, and collecting a real-time PH value; and when the PH value reaches 12.5 for the first time, filling of the sodium hydroxide solution is stopped, and stirring of the stirring motor is maintained until the PH value is lower than 12.5, so that multi-stage control of the PH value is realized, and multi-dimensional control of the alkaline etching waste liquid and the sodium hydroxide solution is ensured. Furthermore, a corresponding filling balance system is constructed according to the change quantity of the PH value, the filling speed of the sodium hydroxide solution and the filling speed of the alkaline etching waste liquid; according to the filling balance system, the filling amount of the sodium hydroxide solution, the filling amount of the alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid, circulation control is carried out continuously until the copper hydroxide product is output, and the output of the copper hydroxide product and the circulation control effect of the alkaline etching waste liquid are guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of alkaline etching waste liquid, and in particular to a circulation control method and system for alkaline etching waste liquid. Background Art

[0002] With the development of science and technology, circuit board factories often produce a large amount of acidic etching wastewater and alkaline etching wastewater during etching. However, different circuit board factories use different processes, and the ratio of acidic etching wastewater to alkaline etching wastewater varies greatly. The ratio of acidic etching waste liquid to alkaline etching waste liquid in common circuit board factories is 3:1. In the prior art, the traditional solution uses acid-base waste liquid neutralization precipitation method to recover the same resources. In this process, additional ammonia water is required to make up for the problem of insufficient alkaline etching waste liquid, and sodium hydroxide is introduced for control. However, the filling amount of sodium hydroxide solution and the filling amount of alkaline etching waste liquid are controlled along a single dimension, and it is impossible to achieve the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the multiple interactions of alkaline etching waste liquid, which affects the circulation control effect of alkaline etching waste liquid. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art. The present invention provides a circulation control method and system for alkaline etching waste liquid, which collects alkaline etching waste liquid in a reactor; based on the detection of the alkaline etching waste liquid, a switch level change signal is collected, and the filling of a sodium hydroxide solution is triggered according to the switch level change signal; in the filling process of the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred based on a stirring motor, and a real-time pH value is collected; when the pH value reaches 12.5 for the first time, the filling of the sodium hydroxide solution is stopped, and the stirring of the stirring motor is maintained until the pH value is lower than 12.5, thereby realizing multi-level control of the pH value, and dynamically controlling the pH value and 12.5, so as to control the filling of the sodium hydroxide solution and the dynamic stirring of the alkaline etching waste liquid and the sodium hydroxide solution, thereby ensuring multi-dimensional control of the alkaline etching waste liquid and the sodium hydroxide solution.

[0004] Furthermore, when the pH value is lower than 12.5, continue to add sodium hydroxide solution, and determine the stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determine the corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold; collect the change in the pH value, and construct a corresponding filling balance system according to the change in the pH value, the filling speed of the sodium hydroxide solution and the filling speed of the alkaline etching waste liquid, and construct a filling balance system according to the filling balance system, the filling amount of the sodium hydroxide solution, The filling amount of alkaline etching waste liquid, temperature control system, sodium hydroxide solution and alkaline etching waste liquid are continuously controlled in circulation until the copper hydroxide product is output. The filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, sodium hydroxide solution and alkaline etching waste liquid are introduced, and the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, sodium hydroxide solution and alkaline etching waste liquid are multiple interacted to ensure the output of copper hydroxide products and the circulation control effect of alkaline etching waste liquid.

[0005] The embodiment of the present invention provides a circulation control method for alkaline etching waste liquid, which is applied to the circulation control scenario of alkaline etching waste liquid; The circulation control method of the alkaline etching waste liquid comprises: Collecting the alkaline etching waste liquid in the reaction kettle; Based on the detection of alkaline etching waste liquid, a switch level change signal is collected, and the filling of sodium hydroxide solution is triggered according to the switch level change signal; During the filling process of the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred based on the stirring motor, and the real-time pH value is collected; When the pH value reaches 12.5 for the first time, stop adding the sodium hydroxide solution and keep stirring the stirring motor until the pH value is lower than 12.5; When the pH value is lower than 12.5, continue to add sodium hydroxide solution, and determine the stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determine the corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold; The change in pH value is collected, and a corresponding filling balance system is constructed according to the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid. According to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are continuously circulated and controlled until the copper hydroxide product is output.

[0006] Optionally, collecting the alkaline etching waste liquid in the reactor includes: Collect the internal space of the reactor; Determine the area where the ammonium carbonate solution is located based on real-time detection of the internal space of the reactor; Determine the location of the alkaline etching waste liquid in the reactor according to the area where the ammonium carbonate solution is located and the scale line of the reactor; The alkaline etching waste liquid in the reactor is determined according to the detection of the portion where the alkaline etching waste liquid in the reactor is located, and the alkaline etching waste liquid in the reactor is collected.

[0007] Optionally, the collecting of the switch level change signal based on the detection of the alkaline etching waste liquid, and triggering the filling of the sodium hydroxide solution according to the switch level change signal, includes: Freeze alkaline etching waste liquid; Testing of alkaline etching waste liquid; Collecting switch level change signals based on the detection of alkaline etching waste liquid; Determining a filling signal based on the analysis of the switch level change signal; The filling of sodium hydroxide solution is triggered according to the filling signal.

[0008] Optionally, during the filling process of the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred by a stirring motor, and a real-time pH value is collected, including: Real-time monitoring of the filling of sodium hydroxide solution; During the filling process of the sodium hydroxide solution, the sodium hydroxide solution is mixed with the sodium hydroxide solution; The stirring signal of the stirring motor is collected, and the stirring motor is triggered to stir the alkaline etching waste liquid and the sodium hydroxide solution according to the stirring signal of the stirring motor, and the real-time pH value is collected.

[0009] Optionally, when the pH value reaches 12.5 for the first time, the addition of the sodium hydroxide solution is stopped, and the stirring of the stirring motor is maintained until the pH value is lower than 12.5, comprising: Real-time monitoring of pH value; Compare the pH value with 12.5 in real time; When the pH value reaches 12.5 for the first time, the addition of the sodium hydroxide solution is stopped, and a stirring signal of the stirring motor is further output; maintaining the stirring of the stirring motor according to the stirring signal of the stirring motor; Monitor the pH value again in real time until the pH value is below 12.5.

[0010] Optionally, when the pH value is lower than 12.5, the sodium hydroxide solution is continuously added, and a stability coefficient of the pH value is determined based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and a corresponding stabilization time is determined according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds a preset stabilization time threshold, including: When the pH value is lower than 12.5, the filling signal of sodium hydroxide solution is collected; triggering the continued filling of the sodium hydroxide solution according to the filling signal of the sodium hydroxide solution; Further mixing of sodium hydroxide based solution and alkaline etching waste; The pH stability factor is determined based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid.

[0011] Optionally, when the pH value is lower than 12.5, the sodium hydroxide solution is continuously added, and a stability coefficient of the pH value is determined based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and a corresponding stabilization time is determined according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds a preset stabilization time threshold, further comprising: Stability coefficients of associated pH values, sodium hydroxide solutions, and alkaline etching waste liquids; The corresponding stabilization time is determined according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold.

[0012] Optionally, the change in pH value is collected, and a corresponding filling balance system is constructed according to the change in pH value, the filling speed of sodium hydroxide solution, and the filling speed of alkaline etching waste liquid. According to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution, and the alkaline etching waste liquid are continuously circulated and controlled until the copper hydroxide product is output, including: Monitor the changes of pH value in real time and collect the changes of pH value; Correlate the change in pH value, the rate of addition of sodium hydroxide solution, and the rate of addition of alkaline etching waste liquid; A corresponding filling balance system is constructed according to the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid.

[0013] Optionally, the change in pH value is collected, and a corresponding filling balance system is constructed according to the change in pH value, the filling speed of sodium hydroxide solution, and the filling speed of alkaline etching waste liquid. According to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are continuously circulated and controlled until the copper hydroxide product is output, which also includes: Fixed frame filling balance system; According to the filling balance system, the filling amount of the sodium hydroxide solution and the filling amount of the alkaline etching waste liquid are matched to the corresponding pH value; Based on the pH value, temperature control system, sodium hydroxide solution and alkaline etching waste liquid are continuously circulated and controlled until the copper hydroxide product is output.

[0014] In addition, an embodiment of the present invention further provides a circulation control system for alkaline etching waste liquid, the circulation control system for alkaline etching waste liquid comprising: The first collection module is used to collect the alkaline etching waste liquid in the reaction kettle; A filling module, used for collecting a switch level change signal based on the detection of the alkaline etching waste liquid, and triggering the filling of the sodium hydroxide solution according to the switch level change signal; A real-time pH value module is used to stir the alkaline etching waste liquid and the sodium hydroxide solution based on a stirring motor during the filling process of the sodium hydroxide solution, and collect the real-time pH value; A stirring module is used to stop the addition of sodium hydroxide solution when the pH value reaches 12.5 for the first time, and to maintain the stirring of the stirring motor until the pH value is lower than 12.5; A time module, used for continuing to add sodium hydroxide solution when the pH value is lower than 12.5, and determining a stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determining a corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds a preset stabilization time threshold; The circulation control module is used to collect the change in pH value, and build a corresponding filling balance system according to the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid. According to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are continuously circulated and controlled until the copper hydroxide product is output.

[0015] In an embodiment of the present invention, the method in the embodiment of the present invention is used to collect alkaline etching waste liquid in the reactor; a switch level change signal is collected based on the detection of the alkaline etching waste liquid, and the filling of the sodium hydroxide solution is triggered according to the switch level change signal; in the filling process of the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred based on the stirring motor, and the real-time pH value is collected; when the pH value reaches 12.5 for the first time, the filling of the sodium hydroxide solution is stopped, and the stirring of the stirring motor is maintained until the pH value is lower than 12.5, thereby realizing multi-level control of the pH value, and dynamically controlling the pH value and 12.5, so as to control the filling of the sodium hydroxide solution and the dynamic stirring of the alkaline etching waste liquid and the sodium hydroxide solution, thereby ensuring multi-dimensional control of the alkaline etching waste liquid and the sodium hydroxide solution.

[0016] Furthermore, when the pH value is lower than 12.5, continue to add sodium hydroxide solution, and determine the stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determine the corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold; collect the change in the pH value, and construct a corresponding filling balance system according to the change in the pH value, the filling speed of the sodium hydroxide solution and the filling speed of the alkaline etching waste liquid, and construct a filling balance system according to the filling balance system, the filling amount of the sodium hydroxide solution, The filling amount of alkaline etching waste liquid, temperature control system, sodium hydroxide solution and alkaline etching waste liquid are continuously controlled in circulation until the copper hydroxide product is output. The filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, sodium hydroxide solution and alkaline etching waste liquid are introduced, and the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, sodium hydroxide solution and alkaline etching waste liquid are multiple interacted to ensure the output of copper hydroxide products and the circulation control effect of alkaline etching waste liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 is a schematic flow chart of a circulation control method for alkaline etching waste liquid in an embodiment of the present invention; Figure 2 is a schematic flow chart of S11 in the circulation control method of the alkaline etching waste liquid in an embodiment of the present invention; Figure 3is a schematic flow chart of S12 in the circulation control method of the alkaline etching waste liquid in an embodiment of the present invention; Figure 4 is a schematic flow chart of S13 in the circulation control method of the alkaline etching waste liquid in an embodiment of the present invention; Figure 5 is a schematic flow chart of S14 in the circulation control method of the alkaline etching waste liquid in an embodiment of the present invention; Figure 6 is a schematic flow chart of S15 in the circulation control method of the alkaline etching waste liquid in an embodiment of the present invention; Figure 7 is a schematic flow chart of S16 in the circulation control method of the alkaline etching waste liquid in an embodiment of the present invention; Figure 8 Schematic diagram of the structure of the circulation control system of the alkaline etching waste liquid in the embodiment of the present invention; Fig. 9 The figure is a hardware diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] See also Figures 1 to 9 , a circulation control method for alkaline etching waste liquid, applied to the circulation control scenario of alkaline etching waste liquid; the circulation control method for alkaline etching waste liquid includes: Step S11: collecting the alkaline etching waste liquid in the reaction kettle; Step S12: collecting a switch level change signal based on the detection of the alkaline etching waste liquid, and triggering the filling of the sodium hydroxide solution according to the switch level change signal; Step S13: During the filling process of the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred by a stirring motor, and a real-time pH value is collected; Step S14: When the pH value reaches 12.5 for the first time, stop adding the sodium hydroxide solution and maintain stirring of the stirring motor until the pH value is lower than 12.5; Step S15: when the pH value is lower than 12.5, continue to add sodium hydroxide solution, and determine the stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determine the corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold; Step S16: Collect the change in pH value, and construct a corresponding filling balance system according to the change in pH value, the filling speed of sodium hydroxide solution, and the filling speed of alkaline etching waste liquid. According to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are continuously circulated and controlled until the copper hydroxide product is output.

[0021] In an embodiment of the present invention, the method in the embodiment of the present invention is used to collect alkaline etching waste liquid in the reactor; a switch level change signal is collected based on the detection of the alkaline etching waste liquid, and the filling of the sodium hydroxide solution is triggered according to the switch level change signal; in the filling process of the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred based on the stirring motor, and the real-time pH value is collected; when the pH value reaches 12.5 for the first time, the filling of the sodium hydroxide solution is stopped, and the stirring of the stirring motor is maintained until the pH value is lower than 12.5, thereby realizing multi-level control of the pH value, and dynamically controlling the pH value and 12.5, so as to control the filling of the sodium hydroxide solution and the dynamic stirring of the alkaline etching waste liquid and the sodium hydroxide solution, thereby ensuring multi-dimensional control of the alkaline etching waste liquid and the sodium hydroxide solution.

[0022] Furthermore, when the pH value is lower than 12.5, continue to add sodium hydroxide solution, and determine the stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determine the corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold; collect the change in the pH value, and construct a corresponding filling balance system according to the change in the pH value, the filling speed of the sodium hydroxide solution and the filling speed of the alkaline etching waste liquid, and construct a filling balance system according to the filling balance system, the filling amount of the sodium hydroxide solution, The filling amount of alkaline etching waste liquid, temperature control system, sodium hydroxide solution and alkaline etching waste liquid are continuously controlled in circulation until the copper hydroxide product is output. The filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, sodium hydroxide solution and alkaline etching waste liquid are introduced, and the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, sodium hydroxide solution and alkaline etching waste liquid are multiple interacted to ensure the output of copper hydroxide products and the circulation control effect of alkaline etching waste liquid.

[0023] refer to Figure 2In step S11, the alkaline etching waste liquid in the reaction kettle is collected; In the specific implementation process of the present invention, the specific steps may be: S111: collecting the internal space of the reactor; S112: determining the area where the ammonium carbonate solution is located based on real-time detection of the internal space of the reactor; S113: determining the portion of the alkaline etching waste liquid in the reactor according to the area where the ammonium carbonate solution is located and the scale line of the reactor; S114: determining the alkaline etching waste liquid in the reactor according to the detection of the portion where the alkaline etching waste liquid is located in the reactor, and completing the collection of the alkaline etching waste liquid in the reactor.

[0024] In an embodiment of the present application, the internal space of the reactor is collected and introduced, and the area where the ammonium carbonate solution is located is determined based on the real-time detection of the internal space of the reactor, thereby realizing the real-time detection of the internal space of the reactor and ensuring the accuracy of the area where the ammonium carbonate solution is located.

[0025] Therefore, the portion of the alkaline etching waste liquid in the reactor is determined according to the region where the ammonium carbonate solution is located and the scale line of the reactor, and the region where the ammonium carbonate solution is located and the scale line of the reactor are introduced, so as to realize the overall consideration of the region where the ammonium carbonate solution is located and the scale line of the reactor, thereby ensuring the multi-dimensional control of the region where the ammonium carbonate solution is located and the scale line of the reactor, and ensuring the accuracy of the portion of the alkaline etching waste liquid in the reactor.

[0026] Therefore, the alkaline etching waste liquid in the reactor is determined based on the detection of the portion where the alkaline etching waste liquid is located in the reactor, and the collection of the alkaline etching waste liquid in the reactor is completed, thereby realizing the detection of the portion where the alkaline etching waste liquid in the reactor is located and ensuring the accuracy of the alkaline etching waste liquid in the reactor.

[0027] refer to Figure 3 In step S12, a switch level change signal is collected based on the detection of the alkaline etching waste liquid, and the filling of the sodium hydroxide solution is triggered according to the switch level change signal; In the specific implementation process of the present invention, the specific steps may be: S121: freeze alkaline etching waste liquid; S122: Testing the alkaline etching waste liquid; S123: collecting a switch level change signal based on the detection of the alkaline etching waste liquid; S124: Determining a filling signal based on the analysis of the switch level change signal; S125: Triggering the filling of sodium hydroxide solution according to the filling signal.

[0028] In an embodiment of the present application, the alkaline etching waste liquid is frozen to further control the alkaline etching waste liquid, and at the same time, the detection of the alkaline etching waste liquid is detected; based on the detection of the alkaline etching waste liquid, the switch level change signal is collected to realize the detection of the alkaline etching waste liquid and ensure the timely response of the switch level change signal.

[0029] Therefore, the filling signal is determined based on the analysis of the switch level change signal; the filling of the sodium hydroxide solution is triggered according to the filling signal, the filling signal is introduced, the analysis of the filling signal is realized, and the filling of the sodium hydroxide solution is further triggered, thereby ensuring the automatic filling of the sodium hydroxide solution.

[0030] refer to Figure 4 In step S13, during the filling process of the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred based on the stirring motor, and the real-time pH value is collected; In the specific implementation process of the present invention, the specific steps may be: S131: real-time monitoring of the filling of sodium hydroxide solution; S132: During the filling process of the sodium hydroxide solution, the sodium hydroxide solution is mixed with the sodium hydroxide solution; S133: collecting a stirring signal of the stirring motor, and triggering the stirring motor to stir the alkaline etching waste liquid and the sodium hydroxide solution according to the stirring signal of the stirring motor, and collecting a real-time pH value.

[0031] In an embodiment of the present application, the filling of the sodium hydroxide solution is monitored in real time. During the filling process of the sodium hydroxide solution, the sodium hydroxide solution is mixed with the sodium hydroxide solution, and the mixing of the sodium hydroxide solution with the sodium hydroxide solution is controlled.

[0032] Therefore, the stirring signal of the stirring motor is collected, and the stirring motor is triggered to stir the alkaline etching waste liquid and the sodium hydroxide solution according to the stirring signal of the stirring motor, and the real-time pH value is collected. The stirring motor stirs the alkaline etching waste liquid and the sodium hydroxide solution, and the real-time pH value is controlled to facilitate the control of the real-time pH value.

[0033] refer to Figure 5 , S14: When the pH value reaches 12.5 for the first time, stop adding the sodium hydroxide solution and maintain stirring of the stirring motor until the pH value is lower than 12.5; In the specific implementation process of the present invention, the specific steps may be: S141: Real-time monitoring of pH value; S142: comparing the pH value with 12.5 in real time; S143: When the pH value reaches 12.5 for the first time, the addition of the sodium hydroxide solution is stopped, and a stirring signal of the stirring motor is further output; S144: maintaining stirring of the stirring motor according to the stirring signal of the stirring motor; S145: Monitor the pH value again in real time until the pH value is lower than 12.5.

[0034] In an embodiment of the present application, alkaline etching waste liquid in a reactor is collected; a switch level change signal is collected based on the detection of the alkaline etching waste liquid, and the filling of the sodium hydroxide solution is triggered according to the switch level change signal; in the filling process of the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred based on a stirring motor, and the real-time pH value is collected; when the pH value reaches 12.5 for the first time, the filling of the sodium hydroxide solution is stopped, and the stirring of the stirring motor is maintained until the pH value is lower than 12.5, thereby realizing multi-level control of the pH value, and dynamically controlling the pH value and 12.5, so as to control the filling of the sodium hydroxide solution and the dynamic stirring of the alkaline etching waste liquid and the sodium hydroxide solution, thereby ensuring multi-dimensional control of the alkaline etching waste liquid and the sodium hydroxide solution.

[0035] At this time, the pH value is monitored in real time, the pH value is introduced, and the pH value is compared with 12.5 in real time, realizing the real-time comparison of the pH value with 12.5.

[0036] Therefore, when the pH value reaches 12.5 for the first time, the addition of sodium hydroxide solution is stopped, and the stirring signal of the stirring motor is further output; the stirring of the stirring motor is maintained according to the stirring signal of the stirring motor; the pH value is monitored in real time again until the pH value is lower than 12.5, thereby realizing multi-level control of the pH value, and dynamically controlling the pH value and 12.5, so as to control the addition of sodium hydroxide solution and the dynamic stirring of the alkaline etching waste liquid and the sodium hydroxide solution, thereby ensuring multi-dimensional control of the alkaline etching waste liquid and the sodium hydroxide solution.

[0037] refer to Figure 6 , S15: when the pH value is lower than 12.5, continue to add sodium hydroxide solution, and determine the stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determine the corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold; In the specific implementation process of the present invention, the specific steps may be: S151: When the pH value is lower than 12.5, a signal for adding sodium hydroxide solution is collected; S152: triggering the continued filling of the sodium hydroxide solution according to the filling signal of the sodium hydroxide solution; S153: further mixing the sodium hydroxide solution and the alkaline etching waste liquid; S154: Determining a stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid; S155: stability coefficient of correlation pH value, sodium hydroxide solution and alkaline etching waste liquid; S156: Determine a corresponding stabilization time according to a stability coefficient of the pH value, the sodium hydroxide solution, and the alkaline etching waste liquid, and the stabilization time exceeds a preset stabilization time threshold.

[0038] In an embodiment of the present application, when the pH value is lower than 12.5, a filling signal of the sodium hydroxide solution is collected; the continued filling of the sodium hydroxide solution is triggered according to the filling signal of the sodium hydroxide solution, thereby realizing the continued filling of the sodium hydroxide solution and ensuring the control of the sodium hydroxide solution.

[0039] Therefore, based on the further mixing of sodium hydroxide solution and alkaline etching waste liquid; based on the further mixing of sodium hydroxide solution and alkaline etching waste liquid to determine the stability coefficient of pH value, the further mixing of sodium hydroxide solution and alkaline etching waste liquid is introduced to ensure the accuracy of the stability coefficient of pH value.

[0040] Furthermore, the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid are correlated; the corresponding stabilization time is determined according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold, and is compatible with the overall consideration of the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, thereby realizing multi-dimensional control of the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and ensuring the accuracy of the stabilization time.

[0041] refer to Figure 7 S16: Collect the change in pH value, and build a corresponding filling balance system according to the change in pH value, the filling speed of sodium hydroxide solution, and the filling speed of alkaline etching waste liquid. According to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution, and the alkaline etching waste liquid, the circulation control is continued until the copper hydroxide product is output; In the specific implementation process of the present invention, the specific steps may be: S161: monitor the change of pH value in real time and collect the change amount of pH value; S162: Correlate the change in pH value, the filling rate of the sodium hydroxide solution, and the filling rate of the alkaline etching waste liquid; S163: constructing a corresponding filling balance system according to the change in pH value, the filling speed of the sodium hydroxide solution, and the filling speed of the alkaline etching waste liquid; S164: Fixed-frame filling balance system; S165: matching a corresponding pH value according to the filling balance system, the filling amount of the sodium hydroxide solution, and the filling amount of the alkaline etching waste liquid; S166: Based on the pH value, temperature control system, sodium hydroxide solution and alkaline etching waste liquid, circulation control is continued until the copper hydroxide product is output.

[0042] In the specific implementation process of the present invention, when the pH value is lower than 12.5, the sodium hydroxide solution is continuously added, and the stability coefficient of the pH value is determined based on the further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and the corresponding stabilization time is determined according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold; the change in the pH value is collected, and a corresponding filling balance system is constructed according to the change in the pH value, the filling speed of the sodium hydroxide solution and the filling speed of the alkaline etching waste liquid, and the filling balance system is constructed according to the filling balance system, the filling speed of the sodium hydroxide solution and the filling speed of the alkaline etching waste liquid. The filling amount, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are continuously controlled in a circulation manner until the copper hydroxide product is output. The filling balance system, the filling amount of the sodium hydroxide solution, the filling amount of the alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are introduced, and the filling balance system, the filling amount of the sodium hydroxide solution, the filling amount of the alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are multiple interacted to ensure the output of the copper hydroxide product and the circulation control effect of the alkaline etching waste liquid.

[0043] At this time, the change of pH value is monitored in real time, and the change of pH value is collected; the change of pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid are correlated, and the change of pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid are introduced to control the change of pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid as a whole.

[0044] Furthermore, a corresponding filling balance system is constructed according to the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid, thereby achieving multi-dimensional control of the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid, and ensuring the accuracy of the filling balance system.

[0045] Therefore, a filling balance system is fixed; the corresponding pH value is matched according to the filling balance system, the filling amount of the sodium hydroxide solution and the filling amount of the alkaline etching waste liquid; based on the pH value, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid, a circulation control is continued until the copper hydroxide product is output, and the filling balance system, the filling amount of the sodium hydroxide solution, the filling amount of the alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are introduced, and multiple interactions are performed on the filling balance system, the filling amount of the sodium hydroxide solution, the filling amount of the alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid, thereby ensuring the output of the copper hydroxide product and the circulation control effect of the alkaline etching waste liquid.

[0046] Specifically, in the circulation control method of alkaline etching waste liquid, step one: place non-contact liquid level sensing switches at 20% and 95% of the reactor, and fix the pH acquisition module in the reactor and connect it to the control chip.

[0047] The chip is connected to the acid etching waste liquid feeding pump and the sodium hydroxide feeding pump through a relay. The alkaline etching waste liquid feeding pump controls the feeding of the alkaline etching waste liquid, and the sodium hydroxide feeding pump is connected to the pre-configured 30%wt sodium hydroxide solution. The control chip controls the alkaline etching waste liquid feeding pump to feed, and the alkaline etching waste liquid of about 20% of the reactor volume is added to the reactor, triggering the low liquid level switch. The control chip receives the switch level change signal and stops the alkaline etching waste liquid feeding pump from feeding.

[0048] Step 2: The control chip controls the stirring motor to run at 400 rpm, controls the sodium hydroxide feeding pump to add sodium hydroxide solution at a rate of 0.5% / sec of the volume of the alkaline etching solution added in step 1, and continuously reads the pH value data collected by the pH acquisition module. When the pH value reaches 12.5 for the first time, the operation of the sodium hydroxide feeding pump is stopped.

[0049] Step 3: After the sodium hydroxide feeding pump stops, the control chip keeps the stirring motor running and counts for about 20 minutes. The pH value will tend to stabilize, and the pH value will be lower than 12.5 at this time. The control chip controls the sodium hydroxide feeding pump to add sodium hydroxide solution at a rate of 0.1% / second of the volume of the alkaline etching solution added in step 1, and continuously reads the pH value. Repeat this process until the pH stabilizes at 12.5±0.1 for 20 minutes.

[0050] Step 4: The control chip controls the alkaline etching waste liquid feeding pump to add alkaline etching liquid at a rate of 0%-0.05% / s of the total volume of the reactor, and adds sodium hydroxide solution at 0%-50% of the alkaline etching waste liquid feeding rate. The pH value of the reaction solution is continuously recorded, and the feeding speed of the two feeding pumps is controlled by the control chip to maintain the reaction pH value between 12-13. When the feeding reaches the high liquid level switch level change, the operation of the two feeding pumps is stopped.

[0051] Step 5: After 20 minutes of stopping the addition of materials in step 4, read the pH value of the reaction solution. If the pH value is higher than 12.5, add alkaline etching waste liquid at a rate of 0.1% / second of the volume of the alkaline etching solution added in step 1. If the pH value is lower than 12.5, add sodium hydroxide solution at a rate of 0.1% / second of the volume of the alkaline etching solution added in step 1. Repeat this process until the pH stabilizes at 12.5±0.1 for 20 minutes.

[0052] Step 6: The control chip stops the stirring pump motor, waits for 30 minutes, controls the discharge pump to extract the supernatant to another reactor, and stops the discharge pump when the low liquid level switch changes. The control chip sends a first step reaction completion signal to another control chip.

[0053] Step 7: The second control chip receives the completion signal from the first chip, controls the stirring motor and the heating wire through the relay to start running, and reads the temperature sensor chip.

[0054] Step 8: The second control chip maintains the reaction temperature at 80-90°C for 45-60 minutes through the temperature sensor, and stops the operation of the heating wire and the stirring motor after the time is reached.

[0055] Step 9: The product obtained in the first reactor is a copper hydroxide product with uniform particle size, and the product obtained in the second reactor is an industrial-grade copper oxide product with a purity greater than or equal to 98%.

[0056] In an embodiment of the present invention, the method in the embodiment of the present invention is used to collect alkaline etching waste liquid in the reactor; a switch level change signal is collected based on the detection of the alkaline etching waste liquid, and the filling of the sodium hydroxide solution is triggered according to the switch level change signal; in the filling process of the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred based on the stirring motor, and the real-time pH value is collected; when the pH value reaches 12.5 for the first time, the filling of the sodium hydroxide solution is stopped, and the stirring of the stirring motor is maintained until the pH value is lower than 12.5, thereby realizing multi-level control of the pH value, and dynamically controlling the pH value and 12.5, so as to control the filling of the sodium hydroxide solution and the dynamic stirring of the alkaline etching waste liquid and the sodium hydroxide solution, thereby ensuring multi-dimensional control of the alkaline etching waste liquid and the sodium hydroxide solution.

[0057] Furthermore, when the pH value is lower than 12.5, continue to add sodium hydroxide solution, and determine the stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determine the corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold; collect the change in the pH value, and construct a corresponding filling balance system according to the change in the pH value, the filling speed of the sodium hydroxide solution and the filling speed of the alkaline etching waste liquid, and construct a filling balance system according to the filling balance system, the filling amount of the sodium hydroxide solution, The filling amount of alkaline etching waste liquid, temperature control system, sodium hydroxide solution and alkaline etching waste liquid are continuously controlled in circulation until the copper hydroxide product is output. The filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, sodium hydroxide solution and alkaline etching waste liquid are introduced, and the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, sodium hydroxide solution and alkaline etching waste liquid are multiple interacted to ensure the output of copper hydroxide products and the circulation control effect of alkaline etching waste liquid.

[0058] See also Figure 8 , Figure 8 It is a schematic diagram of the structural composition of the circulation control system of the alkaline etching waste liquid in an embodiment of the present invention.

[0059] like Figure 8 As shown, a circulation control system for alkaline etching waste liquid, the circulation control system for alkaline etching waste liquid comprises: The first collection module 21 is used to collect the alkaline etching waste liquid in the reaction kettle; A filling module 22, used for collecting a switch level change signal based on the detection of the alkaline etching waste liquid, and triggering the filling of the sodium hydroxide solution according to the switch level change signal; A real-time pH value module 23 is used to stir the alkaline etching waste liquid and the sodium hydroxide solution based on a stirring motor during the filling process of the sodium hydroxide solution, and collect the real-time pH value; The stirring module 24 is used to stop the addition of sodium hydroxide solution when the pH value reaches 12.5 for the first time, and maintain the stirring of the stirring motor until the pH value is lower than 12.5; The time module 25 is used to continue to add the sodium hydroxide solution when the pH value is lower than 12.5, and determine the stability coefficient of the pH value based on the further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determine the corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold; The circulation control module 26 is used to collect the change in pH value, and build a corresponding filling balance system according to the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid. According to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are continuously circulated and controlled until the copper hydroxide product is output.

[0060] See also Fig. 9 , refer to the following Fig. 9 The electronic device 40 according to this embodiment of the present invention will be described. Fig. 9 The electronic device 40 shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0061] like Fig. 9 As shown, the electronic device 40 is in the form of a general computing device. The components of the electronic device 40 may include but are not limited to: at least one processing unit 41, at least one storage unit 42, and a bus 43 connecting different system components (including the storage unit 42 and the processing unit 41).

[0062] The storage unit stores program codes, which can be executed by the processing unit 41, so that the processing unit 41 executes the steps according to various exemplary embodiments of the present invention described in the above “Embodiment Method” section of this specification.

[0063] The storage unit 42 may include a readable medium in the form of a volatile storage unit, such as a random access memory unit (RAM) 421 and / or a cache memory unit 422 , and may further include a read-only memory unit (ROM) 423 .

[0064] The storage unit 42 may also include a program / utility 424 having a set (at least one) of program modules 425, such program modules 425 including but not limited to: an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment.

[0065] Bus 43 may represent one or more of several types of bus structures, including a memory unit bus or memory unit controller, a peripheral bus, an accelerated graphics port, a processing unit, or a local bus using any of a variety of bus architectures.

[0066] The electronic device 40 may also communicate with one or more external devices (e.g., keyboards, pointing devices, Bluetooth devices, etc.), one or more devices that enable a user to interact with the electronic device 40, and / or any device that enables the electronic device 40 to communicate with one or more other computing devices (e.g., routers, modems, etc.). Such communication may be performed via an input / output (I / O) interface 44. Furthermore, the electronic device 40 may also communicate with one or more networks (e.g., a local area network (LAN), a wide area network (WAN), and / or a public network, such as the Internet) via a network adapter 45. Fig. 9 As shown, the network adapter 45 communicates with other modules of the electronic device 40 via the bus 43. It should be understood that although Fig. 9 Not shown, other hardware and / or software modules may be used in conjunction with the electronic device 40, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup planning systems.

[0067] Through the description of the above implementation, it is easy for those skilled in the art to understand that the example implementation described here can be implemented by software, or by software combined with necessary hardware. Therefore, the technical solution according to the implementation of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, and includes a number of instructions to enable a computing device (which can be a personal computer, a server, a terminal device, or a network device, etc.) to execute the method according to the implementation of the present disclosure.

[0068] Those skilled in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, and the storage medium can include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc. In addition, it stores computer program instructions, and when the computer program instructions are executed by a computer, the computer executes the above method.

[0069] In addition, the above is a detailed introduction to the circulation control method and system for the alkaline etching waste liquid provided in the embodiments of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A circulation control method for alkaline etching waste liquid, characterized in that: Applied to the circulation control scenario of alkaline etching waste liquid; The circulation control method of the alkaline etching waste liquid comprises: Collecting the alkaline etching waste liquid in the reaction kettle; Based on the detection of alkaline etching waste liquid, a switch level change signal is collected, and the filling of sodium hydroxide solution is triggered according to the switch level change signal; During the filling process of the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred based on the stirring motor, and the real-time pH value is collected; When the pH value reaches 12.5 for the first time, stop adding the sodium hydroxide solution and keep stirring the stirring motor until the pH value is lower than 12.5; When the pH value is lower than 12.5, continue to add sodium hydroxide solution, and determine the stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determine the corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold; The change in pH value is collected, and a corresponding filling balance system is constructed according to the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid. According to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are continuously circulated and controlled until the copper hydroxide product is output.

2. The circulation control method for alkaline etching waste liquid according to claim 1, characterized in that: The collecting of the alkaline etching waste liquid in the reaction kettle comprises: Collect the internal space of the reactor; Determine the area where the ammonium carbonate solution is located based on real-time detection of the internal space of the reactor; Determine the location of the alkaline etching waste liquid in the reactor according to the area where the ammonium carbonate solution is located and the scale line of the reactor; The alkaline etching waste liquid in the reactor is determined according to the detection of the portion where the alkaline etching waste liquid in the reactor is located, and the alkaline etching waste liquid in the reactor is collected.

3. The circulation control method for alkaline etching waste liquid according to claim 1, characterized in that: The method of collecting a switch level change signal based on the detection of the alkaline etching waste liquid and triggering the filling of the sodium hydroxide solution according to the switch level change signal includes: Freeze alkaline etching waste liquid; Testing of alkaline etching waste liquid; Collecting switch level change signals based on the detection of alkaline etching waste liquid; Determining a filling signal based on the analysis of the switch level change signal; The filling of sodium hydroxide solution is triggered according to the filling signal.

4. The circulation control method for alkaline etching waste liquid according to claim 3, characterized in that: In the process of adding the sodium hydroxide solution, the alkaline etching waste liquid and the sodium hydroxide solution are stirred by a stirring motor, and the real-time pH value is collected, including: Real-time monitoring of the filling of sodium hydroxide solution; During the filling process of the sodium hydroxide solution, the sodium hydroxide solution is mixed with the sodium hydroxide solution; The stirring signal of the stirring motor is collected, and the stirring motor is triggered to stir the alkaline etching waste liquid and the sodium hydroxide solution according to the stirring signal of the stirring motor, and the real-time pH value is collected.

5. The circulation control method for alkaline etching waste liquid according to claim 4, characterized in that: When the pH value reaches 12.5 for the first time, the addition of the sodium hydroxide solution is stopped, and the stirring of the stirring motor is maintained until the pH value is lower than 12.5, comprising: Real-time monitoring of pH value; Compare this pH value with 12.5 in real time; When the pH value reaches 12.5 for the first time, the addition of the sodium hydroxide solution is stopped, and a stirring signal of the stirring motor is further output; maintaining the stirring of the stirring motor according to the stirring signal of the stirring motor; Monitor the pH value again in real time until the pH value is below 12.

5.

6. The circulation control method for alkaline etching waste liquid according to claim 5, characterized in that: When the pH value is lower than 12.5, the sodium hydroxide solution is continuously added, and the stability coefficient of the pH value is determined based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and the corresponding stabilization time is determined according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold, including: When the pH value is lower than 12.5, the filling signal of sodium hydroxide solution is collected; triggering the continued filling of the sodium hydroxide solution according to the filling signal of the sodium hydroxide solution; Further mixing of sodium hydroxide based solution and alkaline etching waste; The pH stability factor is determined based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid.

7. The circulation control method for alkaline etching waste liquid according to claim 6, characterized in that: When the pH value is lower than 12.5, the sodium hydroxide solution is continuously added, and the stability coefficient of the pH value is determined based on the further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and the corresponding stabilization time is determined according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold, and further includes: Stability coefficients of associated pH values, sodium hydroxide solutions, and alkaline etching waste liquids; The corresponding stabilization time is determined according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds the preset stabilization time threshold.

8. The circulation control method for alkaline etching waste liquid according to claim 7, characterized in that: The method comprises collecting the change in pH value, constructing a corresponding filling balance system according to the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid, and performing circulation control according to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid until the copper hydroxide product is output, including: Monitor the changes of pH value in real time and collect the changes of pH value; Correlate the change in pH value, the rate of addition of sodium hydroxide solution, and the rate of addition of alkaline etching waste liquid; A corresponding filling balance system is constructed according to the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid.

9. The circulation control method for alkaline etching waste liquid according to claim 8, characterized in that: The method further comprises collecting the change in pH value, constructing a corresponding filling balance system according to the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid, and performing circulation control according to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid until the copper hydroxide product is output, and further comprising: Fixed-frame filling balance system; According to the filling balance system, the filling amount of the sodium hydroxide solution and the filling amount of the alkaline etching waste liquid are matched to the corresponding pH value; Based on the pH value, temperature control system, sodium hydroxide solution and alkaline etching waste liquid are continuously circulated and controlled until the copper hydroxide product is output.

10. A circulation control system for alkaline etching waste liquid, characterized in that: The circulation control system of the alkaline etching waste liquid is applied to the circulation control method of the alkaline etching waste liquid as described in any one of claims 1 to 9, and the circulation control system of the alkaline etching waste liquid comprises: The first collection module is used to collect the alkaline etching waste liquid in the reaction kettle; A filling module, used for collecting a switch level change signal based on the detection of the alkaline etching waste liquid, and triggering the filling of the sodium hydroxide solution according to the switch level change signal; A real-time pH value module is used to stir the alkaline etching waste liquid and the sodium hydroxide solution based on a stirring motor during the filling process of the sodium hydroxide solution, and collect the real-time pH value; A stirring module is used to stop the addition of sodium hydroxide solution when the pH value reaches 12.5 for the first time, and to maintain the stirring of the stirring motor until the pH value is lower than 12.5; A time module, used for continuing to add sodium hydroxide solution when the pH value is lower than 12.5, and determining a stability coefficient of the pH value based on further mixing of the sodium hydroxide solution and the alkaline etching waste liquid, and determining a corresponding stabilization time according to the stability coefficient of the pH value, the sodium hydroxide solution and the alkaline etching waste liquid, and the stabilization time exceeds a preset stabilization time threshold; The circulation control module is used to collect the change in pH value, and build a corresponding filling balance system according to the change in pH value, the filling speed of sodium hydroxide solution and the filling speed of alkaline etching waste liquid. According to the filling balance system, the filling amount of sodium hydroxide solution, the filling amount of alkaline etching waste liquid, the temperature control system, the sodium hydroxide solution and the alkaline etching waste liquid are continuously circulated and controlled until the copper hydroxide product is output.

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