Heat dissipation device for computer

Abstract

The invention discloses a heat dissipation device for a computer, and relates to the technical field of computer case heat dissipation, the heat dissipation device comprises a case, a mainboard element is assembled in the case, a side plate convenient to disassemble is further installed on one side of the case, the vertex angle position of the front side of the case is arranged to be an inclined plane for replacement, a dust removal net is embedded in the inclined plane, and the dust removal net is arranged in the case. The dust removal device comprises a machine box, the machine box is provided with an inclined face, a blocking cover is further connected to the inclined face in a sliding and inserted mode, an air inlet mesh enclosure is installed on the blocking cover, a dust scraping mechanism is arranged in the blocking cover, and a circulating airflow mechanism, a flow blocking mechanism and an exhaust mechanism are further arranged in the machine box. When the case is opened, dust, batting and the like can be filtered and blocked by the dust removal net, the dust can be effectively prevented from entering the case and adhering to main board elements, after the blocking cover is opened, the frame plate can be pushed to clean the dust on the dust removal net, the case does not need to be disassembled, and convenience is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of computer chassis, and more particularly to a heat dissipation device for a computer. Background Art

[0002] Computers emit a lot of heat during operation, especially computer chips and other computing components. The stronger the computing power of the chip and the greater the load, the greater the heat it generates. The accumulation of heat will produce high temperatures. Excessive temperatures will affect the normal operation of the computer, causing slow operation, blue screens, freezes and other faults. In severe cases, the chip or its supporting circuits will be burned. Therefore, the heat dissipation settings for the computer are particularly important.

[0003] A cooling fan is usually installed inside the computer to push air to the computer motherboard components to help dissipate heat. However, the direction of the internal airflow is relatively disordered, and external air will enter the chassis through the heat dissipation holes set on the outer shell, carrying dust and lint. When dust and lint adhere to the motherboard components, they will accelerate the aging of the components, which is troublesome to clean. In addition, there are some sensitive devices in the motherboard components, which are also easily damaged during the wiping process. Based on the above problems, we provide a heat dissipation device for a computer. Summary of the invention

[0004] In order to solve the problems raised in the above background technology, the present invention provides a heat dissipation device for a computer.

[0005] The present invention provides a computer heat dissipation device that adopts the following technical solution:

[0006] A heat dissipation device for a computer comprises: a chassis, a motherboard component is installed inside the chassis, and a side panel for easy removal is installed on one side of the chassis; the top corner position of the front side of the chassis is set as an inclined plane as a replacement, a dust removal net is embedded in the inclined plane, a baffle cover is also slidably plugged on the inclined plane, an air intake mesh cover is installed on the baffle cover, a dust scraping mechanism is arranged inside the baffle cover, and a circulating airflow mechanism, a baffle mechanism and an exhaust mechanism are also arranged inside the chassis:

[0007] The scraping mechanism includes two positioning rods and a frame plate slidably mounted on the positioning rods. A scraping head is also installed at the bottom of the frame plate to facilitate cleaning of the dust removal net.

[0008] The circulating airflow mechanism includes three circulating fans arranged below the top corner of the chassis, the length of the circulating fan blades is adapted to the width of the chassis, and the three circulating fans keep rotating synchronously in the same direction;

[0009] The baffle mechanism includes two sets of baffle fans arranged at the top and the side of the chassis. The upper set of baffle fans is arranged closely below the circulation fan and is composed of fixed blades, movable blades and a hinge shaft. The hinge shaft is installed at the bottom of the fixed blades, and the movable blades are rotatably installed on the hinge shaft, and the inclination direction of the movable blades points to the mainboard component setting.

[0010] The exhaust mechanism includes an intake fan group arranged inside the chassis and an exhaust fan group close to the inner wall of the chassis. The intake fan group is equipped with multiple first-level cooling fans, and the exhaust fan group is equipped with at least two second-level cooling fans. Multiple heat absorption tubes are also connected to the back of the intake fan group.

[0011] Preferably, a shallow groove and a deep groove are provided on the side of the frame plate, the bottom of the deep groove is through and a support shaft is installed inside, the scraper head is rotatably mounted on the support shaft, a baffle is also installed on the top of the scraper head, and the baffle is connected to the side wall of the shallow groove by a spring.

[0012] Preferably, docking slots are provided at both edges of the inclined surface, plug plates matching the docking slots are installed on both ends of the blocking cover, and a permanent magnet is embedded at the innermost end of the docking slot, and a magnetic suction block is provided at the position corresponding to the plug plate.

[0013] Preferably, a synchronous sprocket is also installed on the central axis of the circulating fan, and the transmission sleeves on the three synchronous sprockets are equipped with the same chain, and a supporting sprocket is also provided below the synchronous sprocket in the middle, and the supporting sprocket pushes the chain to maintain transmission engagement with the synchronous sprocket, and a passive gear is also installed on the synchronous sprocket at the bottom, and a transmission motor is also installed in the chassis, and a driving gear is installed on the output shaft of the transmission motor, and the driving gear maintains engagement with the passive gear.

[0014] Preferably, a guide rod is further provided near the same group of baffle fans, the guide rod is arranged close to the movable blades, and a hinge ring is installed with a hole at the bottom of the movable blades, the hinge ring is connected with a shaft sleeve through a connecting rod, and the shaft sleeve is mounted on the guide rod.

[0015] Preferably, tooth grooves are provided on the adjacent ends of the two guide rods, and synchronous gears are rotatably mounted on the tooth grooves, and the two synchronous gears are meshed with each other, and an adjusting motor is also mounted on the central axis of one of the synchronous gears.

[0016] Preferably, the number of heat absorption tubes corresponds to the number of primary cooling fans, and a plurality of air intake holes are provided on the surface of the heat absorption tubes. The ends of the heat absorption tubes penetrate and extend to the outside of the chassis, and a barrier net is installed at the end openings of the heat absorption tubes.

[0017] Preferably, an open slot is further provided on the side of the chassis, an exhaust net is installed in the open slot, and an exhaust fan group is installed in the open slot.

[0018] In summary, the present invention includes the following beneficial technical effects:

[0019] 1. In the present application, a dust removal net is installed in the inclined surface, and a baffle cover is plugged into the inclined surface. During ventilation, external air can enter the chassis through the air intake mesh cover and the dust removal net on the baffle cover, and dust and lint will be filtered and blocked by the dust removal net, which can effectively prevent dust from entering the chassis and adhering to the mainboard components. After opening the baffle cover, the frame plate can be pushed to clean the dust on the dust removal net without disassembling the chassis, which is more convenient.

[0020] 2. The circulating airflow mechanism provided in the present application can promote the airflow to flow in a spiral shape in the chassis, thereby accelerating the exchange of cold and hot air. Moreover, after cooperating with the flow blocking mechanism, a small spiral airflow rotating in the opposite direction can be formed in the center of the chassis, further accelerating the exchange of airflow and facilitating the discharge of hot air.

[0021] 3. The drainage fan group provided in the present application can conveniently cooperate to discharge the outer spiral airflow outward, and the exhaust fan group provided can conveniently cooperate to discharge the inner spiral airflow outward, thereby speeding up the airflow discharge efficiency and thus speeding up the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the chassis main body of the present invention;

[0023] Figure 2 It is a cross-sectional schematic diagram of the chassis body of the present invention;

[0024] Figure 3 It is a schematic diagram of the internal structure of the chassis of the present invention;

[0025] Figure 4 It is a structural schematic diagram of the flow blocking mechanism of the present invention;

[0026] Figure 5 It is a schematic cross-sectional structure diagram of the scraping mechanism of the present invention;

[0027] Figure 6 It is a structural schematic diagram of the exhaust mechanism of the present invention;

[0028] Figure 7 The present invention Figure 3 Schematic diagram of the structure of part A;

[0029] Figure 8 The present invention Figure 4 Schematic diagram of the structure of part B;

[0030] Fig. 9 It is a schematic diagram of air flow circulation inside the chassis of the present invention.

[0031] Description of the accompanying drawings: 1. chassis; 101. main board component; 102. side panel; 103. dust removal net; 104. cover; 105. air intake net; 106. docking slot; 107. permanent magnet; 108. plug board; 109. exhaust net; 2. scraper mechanism; 201. positioning rod; 202. frame plate; 203. shallow groove; 204. deep groove; 205. scraper head; 206. support shaft; 207. stop bar; 208. spring; 3. circulating airflow mechanism; 301. circulating fan; 302. synchronous sprocket; 303. chain; 304. 4. Passive gear; 305. Driving gear; 306. Transmission motor; 4. Flow blocking mechanism; 401. Fixed blade; 402. Articulated shaft; 403. Movable blade; 404. Guide rod; 405. Bushing; 406. Connecting rod; 407. Articulated ring; 408. Tooth groove; 409. Synchronous gear; 410. Adjusting motor; 5. Exhaust mechanism; 501. Drainage fan group; 502. Primary cooling fan; 503. Heat absorbing pipe; 504. Intake hole; 505. Barrier net; 506. Exhaust fan group; 507. Secondary cooling fan. DETAILED DESCRIPTION

[0032] The following is combined with Figures 1 to 9 The present invention is described in further detail.

[0033] It should be noted that the drawings are schematic and not to scale. For the sake of clarity and convenience, the relative sizes and proportions of the parts shown in the drawings are exaggerated or reduced in size, and any size is only illustrative and not restrictive. In addition, the same reference symbol is used for the same structure, element or accessory appearing in more than two figures to reflect similar features.

[0034] Embodiment 1

[0035] The present invention discloses a heat dissipation device for a computer. Figures 1 to 8As shown, a heat dissipation device for a computer comprises a case 1, wherein a mainboard component 101 is assembled inside the case 1, and a side panel 102 for easy disassembly is also installed on one side of the case 1; the top angle position of the front side of the case 1 is set as an inclined plane as a substitute, a dust removal net 103 is embedded in the inclined plane, a blocking cover 104 is also slidably plugged on the inclined plane, docking slots 106 are arranged at both edges of the inclined plane, plugging plates 108 adapted to the docking slots 106 are installed on both ends of the blocking cover 104, and a permanent magnet 107 is also embedded at the innermost end of the docking slot 106, a magnetic suction block is arranged at the position corresponding to the plugging plate 108, an air intake mesh cover 105 is installed on the blocking cover 104, a dust scraping mechanism 2 is arranged inside the blocking cover 104, the dust scraping mechanism 2 comprises two positioning rods 201 and a frame plate 202 slidably installed on the positioning rods 201, and a scraping head 205 is also installed at the bottom of the frame plate 202 for convenient The dust collecting net 103 is cleaned, and a shallow groove 203 and a deep groove 204 are provided on the side of the frame plate 202. The bottom of the deep groove 204 is connected and a support shaft 206 is installed inside. The scraper head 205 is rotatably mounted on the support shaft 206. A baffle 207 is also installed on the top of the scraper head 205. The baffle 207 is connected to the side wall of the shallow groove 203 by a spring 208. When in use, external air can pass through the air intake mesh cover 105 and the dust collecting net 103 to enter the inside of the chassis 1. The dust and fluff in the air will be filtered by the dust collecting net 103 and adhere to the dust collecting net 103. When cleaning is needed, the baffle cover 104 can be pushed to push the plug plate 108 out of the docking slot 106, and then the frame plate 202 is held and slided downward. The scraper head 205 installed at the bottom of the frame plate 202 can contact and slide with the dust collecting net 103 to clean the dust on the dust collecting net 103 without disassembling the entire chassis 1, which is more convenient.

[0036] Embodiment 2

[0037] Reference Figure 2 , 3As shown in Figures 4, 7 and 9, a circulating airflow mechanism 3 is further provided inside the chassis 1, and the circulating airflow mechanism 3 includes three circulating fans 301 provided below the top corner position of the chassis 1, the fan blade length of the circulating fan 301 is adapted to the width of the chassis 1, and the three circulating fans 301 keep synchronous rotation in the same direction, a synchronous sprocket 302 is further installed on the central axis of the circulating fan 301, a same chain 303 is provided on the transmission sleeves of the three synchronous sprockets 302, and a supporting sprocket is further provided below the synchronous sprocket 302 in the middle, the supporting sprocket pushes the chain 303 to keep transmission meshing with the synchronous sprocket 302, a passive gear 304 is further installed on the synchronous sprocket 302 at the bottom, and a transmission gear 306 is further installed inside the chassis 1 The driving motor 306 is provided with a driving gear 305 on its output shaft, and the driving gear 305 is meshed with the driven gear 304. When the driving motor 306 is working, the driving gear 305 can be driven to rotate, and the synchronous sprocket 302 can be driven to rotate through the cooperation of the driving gear 305 and the driven gear 304. Under the cooperation of the synchronous sprocket 302 and the chain 303, the three circulation fans 301 can be driven to rotate together synchronously. The three circulation fans 301 rotate in the same direction, so as to drive the airflow to flow along the position where the circulation fan 301 is located, and form a spiral airflow along the inner outer ring in the chassis 1, which can accelerate the mixing of the cold and hot airflows and help to quickly discharge the hot air, thereby achieving the effect of heat dissipation.

[0038] A baffle mechanism 4 is also provided inside the chassis 1. The baffle mechanism 4 includes two groups of baffle fans provided at the top and the side of the chassis 1. The upper group of baffle fans is provided closely below the circulation fan 301 and is composed of a fixed blade 401, a movable blade 403 and a hinge shaft 402. The hinge shaft 402 is installed at the bottom of the fixed blade 401. The movable blade 403 is rotatably installed on the hinge shaft 402, and the inclination direction of the movable blade 403 points to the main board component 101. A guide rod 404 is also provided near the same group of baffle fans. The guide rod 404 is provided close to the movable blade 403, and a hinge ring 407 is installed at the bottom of the movable blade 403. A shaft sleeve 405 is connected to the hinge ring 407 through a connecting rod 406. The shaft sleeve 405 is sleeved on the guide rod 4 04, in order to facilitate the control of the angle of the movable fan blades 403 and adjust the air volume blown to the main board component 101, tooth grooves 408 are provided on the adjacent ends of the two guide rods 404, and synchronous gears 409 are rotatably mounted on the tooth grooves 408, and the two synchronous gears 409 are meshed with each other, and an adjusting motor 410 is also installed on the central axis of one of the synchronous gears 409. Furthermore, the baffle fan is arranged, and since the movable fan blades 403 at the bottom are arranged tilted, when the airflow flows, it can be blown toward the main board component 101 along the movable fan blades 403, and through the cooperation of the two sets of baffle fans on the top and the side, a small spiral airflow can be formed inside the chassis 1, and the flow direction of the small spiral airflow is opposite to that of the outer spiral airflow, which further accelerates the mixing of the airflow and helps to quickly dissipate heat.

[0039] Embodiment 3

[0040] Reference Figure 2 , 3As shown in Figures 6 and 9, an exhaust mechanism 5 is further provided inside the chassis 1, and the exhaust mechanism 5 includes a draught fan group 501 provided inside the chassis 1 and an exhaust fan group 506 closely attached to the inner wall of the chassis 1. An open slot is further provided on the side of the chassis 1, and an exhaust net 109 is installed in the open slot. The exhaust fan group 506 is installed in the open slot. A plurality of primary cooling fans 502 are installed in the draught fan group 501. The number of heat absorbing pipes 503 corresponds to the number of primary cooling fans 502, and a plurality of air intake holes 504 are provided on the surface of the heat absorbing pipe 503. The end of the heat absorbing pipe 503 passes through and extends to the outside of the chassis 1, and a barrier is installed at the end opening of the heat absorbing pipe 503. The partition net 505 and the exhaust fan group 506 are equipped with at least two secondary cooling fans 507. A plurality of heat absorbing tubes 503 are connected to the back of the drainage fan group 501. When in use, the drainage fan group 501 can blow the airflow out from the heat absorbing tube 503, and a plurality of air intake holes 504 are provided on the surface of the heat absorbing tube 503. The air intake holes 504 can further absorb the hot air dissipated from the surface of the mainboard component 101 and discharge it quickly. The exhaust fan group 506 can accelerate the discharge of the small circulation airflow in the inner circle of the chassis 1 to help dissipate heat quickly. The exhaust net 109 and the barrier net 505 can also prevent insects from entering the inside of the chassis 1.

[0041] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the instructions and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. Machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0042] The implementation principle of a heat dissipation device for a computer according to an embodiment of the present invention is as follows: the mainboard component 101 will continuously generate heat during operation. When the primary heat dissipation fan 502 and the secondary heat dissipation fan 507 are working, they can push the airflow in the chassis 1 to be discharged outwards, thereby facilitating the release of heat. At this time, the external airflow can only pass through the air intake mesh cover 105 and the dust removal net 103 to enter the interior of the chassis 1. The dust and fluff in the air will be filtered by the dust removal net 103 and adhere to the dust removal net 103. When cleaning is required, the blocking cover 104 can be pushed to push the plug-in board 108 out of the docking slot 106. Then, the frame plate 202 can be held and slid downward. The scraper head 205 installed at the bottom of the frame plate 202 can be in contact with the dust removal net 103. The dust on the dust removal net 103 can be cleaned by sliding the dust removal net 103 without disassembling the entire chassis 1, which is more convenient. When the transmission motor 306 is working, the driving gear 305 can be driven to rotate. The meshing cooperation between the driving gear 305 and the passive gear 304 can drive the synchronous sprocket 302 at the corresponding position to rotate, and the synchronous sprocket 302 and the chain 303 can cooperate to drive the three circulation fans 301 to rotate. The three circulation fans 301 rotate in the same direction, so as to promote the airflow to flow along the position where the circulation fan 301 is located, and form a spiral airflow along the inner outer ring in the chassis 1, which can accelerate the mixing of cold and hot airflows and help to quickly discharge hot air, thereby achieving a heat dissipation effect.

[0043] Moreover, two groups of baffle fans are arranged inside the chassis 1. Since the movable blades 403 at the bottom of the baffle fans are arranged at an angle, when the airflow flows, it can be blown toward the mainboard component 101 along the movable blades 403, and through the cooperation of the two groups of baffle fans on the top and the side, a small spiral airflow can be formed inside the chassis 1, and the flow direction of the small spiral airflow is opposite to the flow direction of the outer circle spiral airflow, further accelerating the mixing of the airflow and helping to quickly dissipate heat. The set drainage fan group 501 is closer to the flow direction of the outer circle spiral airflow, and the exhaust fan group 506 is closer to the direction of the small spiral airflow of the inner circle, which can discharge the two spiral airflows outward respectively, and the drainage fan group 501 can blow the airflow outward from the heat absorption pipe 503, and the surface of the heat absorption pipe 503 is also provided with a plurality of suction holes 504, through which the hot air dissipated from the surface of the mainboard component 101 can be further absorbed and discharged quickly, thereby achieving the effect of rapid heat dissipation.

[0044] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A heat dissipation device for a computer, characterized in that: The invention comprises a chassis (1), wherein a mainboard component (101) is installed inside the chassis (1), and a side panel (102) which is easy to disassemble is also installed on one side of the chassis (1); the top corner position of the front side of the chassis (1) is arranged as an inclined plane as a replacement, a dust removal net (103) is embedded in the inclined plane, a blocking cover (104) is also slidably plugged on the inclined plane, an air intake mesh cover (105) is installed on the blocking cover (104), a dust scraping mechanism (2) is arranged inside the blocking cover (104), and a circulating airflow mechanism (3), a flow blocking mechanism (4) and an exhaust mechanism (5) are also arranged inside the chassis (1): The dust scraping mechanism (2) comprises two positioning rods (201) and a frame plate (202) slidably mounted on the positioning rods (201), and a scraping head (205) is also mounted at the bottom of the frame plate (202) to facilitate cleaning of the dust removal net (103); The circulating airflow mechanism (3) comprises three circulating fans (301) arranged below the top corner position of the chassis (1); the length of the blades of the circulating fans (301) is adapted to the width of the chassis (1), and the three circulating fans (301) rotate synchronously in the same direction; The baffle mechanism (4) comprises two groups of baffle fans arranged at the top and the side of the chassis (1); the upper group of baffle fans is arranged closely below the circulation fan (301) and is composed of fixed blades (401), movable blades (403) and a hinge shaft (402); the hinge shaft (402) is installed at the bottom of the fixed blades (401); the movable blades (403) are rotatably installed on the hinge shaft (402); and the tilt direction of the movable blades (403) points to the mainboard component (101); The exhaust mechanism (5) comprises an airflow fan group (501) arranged inside the chassis (1) and an exhaust fan group (506) closely attached to the inner wall of the chassis (1); a plurality of primary cooling fans (502) are installed in the airflow fan group (501); at least two secondary cooling fans (507) are installed in the exhaust fan group (506); and a plurality of heat absorbing pipes (503) are also connected to the back of the airflow fan group (501).

2. A heat dissipation device for a computer according to claim 1, characterized in that: A shallow groove (203) and a deep groove (204) are provided on the side of the frame plate (202); the bottom of the deep groove (204) is through-connected and a support shaft (206) is installed inside; the scraper head (205) is rotatably mounted on the support shaft (206); a baffle (207) is also installed on the top of the scraper head (205); the baffle (207) is connected to the side wall of the shallow groove (203) via a spring (208).

3. A heat dissipation device for a computer according to claim 1, characterized in that: A docking slot (106) is provided at both edges of the inclined surface, and plugging plates (108) adapted to the docking slot (106) are installed on both ends of the blocking cover (104), and a permanent magnet (107) is embedded at the innermost end of the docking slot (106), and a magnetic attraction block is provided at a position corresponding to the plugging plate (108).

4. A heat dissipation device for a computer according to claim 1, characterized in that: A synchronous sprocket (302) is also installed on the central axis of the circulation fan (301), and the transmission sleeves on the three synchronous sprockets (302) are equipped with the same chain (303), and a supporting sprocket is also arranged below the synchronous sprocket (302) in the middle, and the supporting sprocket pushes the chain (303) to maintain transmission meshing with the synchronous sprocket (302), and a passive gear (304) is also installed on the synchronous sprocket (302) at the bottom, and a transmission motor (306) is also installed in the chassis (1), and a driving gear (305) is installed on the output shaft of the transmission motor (306), and the driving gear (305) maintains meshing with the passive gear (304).

5. A heat dissipation device for a computer according to claim 1, characterized in that: A guide rod (404) is also provided near the same group of baffle fans. The guide rod (404) is provided close to the movable blades (403). A hinge ring (407) is installed through a hole at the bottom of the movable blades (403). A shaft sleeve (405) is connected to the hinge ring (407) via a connecting rod (406). The shaft sleeve (405) is sleeved on the guide rod (404).

6. A heat dissipation device for a computer according to claim 5, characterized in that: The two guide rods (404) are both provided with tooth grooves (408) at the adjacent ends thereof, and synchronous gears (409) are rotatably mounted on the tooth grooves (408), and the two synchronous gears (409) are meshed with each other, and an adjusting motor (410) is also mounted on the central axis of one of the synchronous gears (409).

7. A heat dissipation device for a computer according to claim 1, characterized in that: The number of the heat absorption tubes (503) corresponds to the number of the primary heat dissipation fans (502), and a plurality of air intake holes (504) are provided on the surface of the heat absorption tubes (503). The ends of the heat absorption tubes (503) penetrate and extend to the outside of the chassis (1), and a barrier net (505) is installed at the end opening of the heat absorption tubes (503).

8. A heat dissipation device for a computer according to claim 1, characterized in that: The side of the chassis (1) is also provided with an open slot, an exhaust net (109) is installed in the open slot, and an exhaust fan group (506) is installed in the open slot.

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