Battery signal acquisition assembly, battery module and battery system

Abstract

The invention relates to the technical field of new energy, in particular to a battery signal acquisition assembly, a battery module and a battery system. For the battery signal acquisition assembly, a conductive path from a conductive sheet to a first bonding pad of the battery signal acquisition assembly is wound back to a first side through a conductive layer on a second side, so that the first bonding pad used for welding a voltage acquisition line can be ingeniously arranged between a second bonding pad and a third bonding pad used for welding a temperature acquisition line in an electric insulation manner; on one hand, the distance between the second bonding pad and the third bonding pad can be increased, so that the electrical insulating property between the second bonding pad and the third bonding pad is improved, the acquisition precision of the temperature sensor is enhanced, on the other hand, the conductive area from the conductive sheet to the first bonding pad can be easily increased, the conductive resistance from the conductive sheet to the first bonding pad is reduced, and the cost is reduced. And the current-carrying capability of the signal acquisition assembly is enhanced.

Description

Technical Field

[0001] The present application relates to the field of new energy technology, and in particular to a battery signal acquisition component, a battery module and a battery system. Background Art

[0002] In order to monitor the operating voltage and operating temperature of the battery cells in the battery PACK module, it is necessary to install a voltage acquisition component and a temperature acquisition component on the battery module.

[0003] The related art proposes a battery temperature and voltage acquisition structure, wherein the temperature acquisition component includes a water drop-shaped temperature sensor wrapped by a temperature sampling nickel sheet, and the voltage acquisition component includes a voltage sampling nickel sheet independent of the temperature sampling nickel sheet. The temperature sampling nickel sheet and the voltage sampling nickel sheet are respectively welded to the conductive bar of the battery module, and the temperature acquisition and voltage acquisition are independent of each other. In this way, two sampling nickel sheets are required to monitor only one battery cell.

[0004] And this method has at least the following disadvantages:

[0005] 1. The cost of collecting the temperatures of all battery cells is high.

[0006] 2. The temperature of the battery needs to be transferred to the temperature sensor through secondary conduction of the sampling nickel sheet. Heat loss is prone to occur during the transfer process, the conduction speed is slow, and the measurement deviation is large.

[0007] 3. The double-sampling nickel sheet occupies a large space in the aluminum row, and has certain requirements on the surface area of ​​the battery aluminum row.

[0008] 4. There is no suitable location on the voltage collection component to configure the overload fuse, which poses a safety hazard when performing voltage balancing on the battery module. Summary of the invention

[0009] In order to solve the problems of low integration in the traditional temperature and voltage acquisition structure, the inventor previously thought of solving the problem by welding a conductive sheet and a PCB board to each other, wherein a temperature sensor is mounted on the PCB board. However, the previous method has the following problems: when the PCB board area is small, it is difficult to set the conductive area between the conductive sheet and the pad for the external voltage acquisition line to be large enough, resulting in a small current carrying capacity from the pad to the conductive sheet when the sampling and acquisition circuit is used to perform voltage balancing on the battery. In addition, it is difficult to set the distance between the two pads for the external temperature acquisition line led from the temperature sensor to be large enough, and there is an insulation risk between the two pads, which causes a large error in the temperature acquisition information of the battery.

[0010] In view of this, the present application proposes a battery signal acquisition component, a battery module and a battery system.

[0011] In a first aspect, the present application proposes a signal acquisition component for acquiring the voltage and temperature of a battery cell in a battery module, the signal acquisition component comprising:

[0012] A PCB board, the PCB board comprising: a substrate layer, having a first side and a second side opposite to each other along a thickness direction of the substrate layer, and a first conductive via and a second conductive via extending from the first side to the second side and separated from each other; a conductive layer, stacked and arranged on the second side of the substrate layer, and electrically connecting the first conductive via and the second conductive via; a second pad, a first pad, and a third pad, which are arranged in sequence and separated from each other, and are all arranged on the first side, wherein the first pad is used for welding a voltage acquisition line, the second pad and the third pad are used for welding a temperature acquisition line, and the first pad is electrically connected to the second conductive via;

[0013] A conductive sheet, comprising a first portion and a second portion, wherein the first portion is fixed to the first side and electrically connected to the first conductive via, and the second portion is used to be electrically connected to an electrode terminal of the battery cell;

[0014] a temperature sensor, disposed on the first side and electrically connected in series between the second pad and the third pad;

[0015] When observing toward the PCB board, the first conductive path from the first conductive via to the first pad at least partially overlaps with the second conductive path from the second pad to the third pad, and any two of the following three do not overlap with each other: the first conductive via, the second conductive hole, and the second conductive path.

[0016] In some possible implementations, the PCB board includes:

[0017] a fourth pad, electrically connected to the first conductive via in a state of covering the first conductive via, the first portion being welded to the fourth pad;

[0018] a fifth pad, electrically connected to the second conductive via in a state of covering the second conductive via, and located on the first side of the substrate layer;

[0019] a sixth pad, electrically connected to the first pad via a first printed circuit and located on the first side;

[0020] Among them, the fifth pad and the sixth pad are electrically connected in series with a fuse located on the first side, and when observing facing the PCB board, the fifth pad, the fuse, the sixth pad, the first printed circuit and the first pad are located in an open space defined by the second conductive path.

[0021] In some possible implementations, the PCB board includes:

[0022] a seventh pad, electrically connected to the second pad via a second printed circuit and located on the first side;

[0023] an eighth pad, electrically connected to the third pad via a third printed circuit and located on the first side;

[0024] Wherein, when observing toward the PCB board, the fifth solder pad, the fuse, the sixth solder pad, the first printed circuit and the first solder pad are located in the open space surrounded by the second solder pad, the second printed circuit, the seventh solder pad, the temperature sensor, the eighth solder pad, the third printed circuit and the third solder pad.

[0025] In some possible implementations, the number of the first conductive vias is set to be multiple, and the multiple first conductive vias are arranged into two columns separated from each other, namely a first column and a second column;

[0026] The fourth pad includes a first extension portion and a second extension portion separated from each other, the first extension portion is electrically connected to the first column in a state of covering the first column, and the second extension portion is electrically connected to the second column in a state of covering the second column;

[0027] When viewed facing the PCB board, the seventh pad, the temperature sensor, and the eighth pad are located between the first extension portion and the second extension portion.

[0028] In some possible implementations, the PCB board is a rectangle having two width sides and two length sides;

[0029] The second pad, the first pad and the third pad are arranged in a position adjacent to one of the width sides along the width direction of the rectangle, and the second pad and the third pad are arranged adjacent to the two length sides respectively;

[0030] The first column and the second column are arranged adjacent to the other width side and spaced apart from each other in the width direction of the rectangle, and the first column and the second column are respectively arranged adjacent to the two length sides.

[0031] In some possible implementations, the length of the rectangle is no greater than 3 cm, and the width is no greater than 2 cm.

[0032] In some possible implementations, the conductive layer is copper foil, and the PCB board further includes an insulating layer, which is stacked on a side of the conductive layer away from the substrate layer and completely covers the conductive layer.

[0033] In a second aspect, the present application proposes a battery module, comprising:

[0034] A battery cell having electrode terminals;

[0035] A conductive bar, electrically connected to the terminals and in thermal contact with the battery cells;

[0036] It is characterized in that the battery module further comprises the signal acquisition component as described in the first aspect, and the second part is electrically connected to the electrode terminal of the battery cell by being welded to the conductive bar.

[0037] In some possible implementations, the PCB board is thermally conductively attached to the conductive bar in a manner that the second side faces the conductive bar.

[0038] In a third aspect, the present application proposes a battery system, characterized in that it includes:

[0039] The battery module as described in the second aspect;

[0040] A battery box, accommodating the battery module;

[0041] Battery management system BMS;

[0042] A voltage collection line, one end of which is welded to the first welding pad, and the other end of which is connected to the battery management system BMS;

[0043] Two temperature collection lines, one end of each of the two temperature collection lines is welded to the second welding pad and the third welding pad respectively, and the other end of each of the two temperature collection lines is connected to the battery management system BMS.

[0044] The signal acquisition component provided in the present application is used to collect target signals of battery cells in a battery module, such as voltage and temperature signals, and includes: a PCB board, the PCB board including: a substrate layer, having a first side and a second side opposite to each other along the thickness direction of the substrate layer, and a first conductive via and a second conductive via extending from the first side to the second side and separated from each other; a conductive layer, stacked and arranged on the second side of the substrate layer, and electrically connecting the first conductive via and the second conductive via; a second pad, a first pad and a third pad, which are arranged in sequence and are all arranged on the first side, wherein the first pad is used for welding a voltage acquisition line, and the second pad and the third pad are used for welding a temperature acquisition line. A collection line, and the first pad is electrically connected to the second conductive via; a conductive sheet, including a first part and a second part, the first part is fixed to the first side and electrically connected to the first conductive via, and the second part is used to electrically connect to the electrode terminal of the battery cell; a temperature sensor is arranged on the first side and is electrically connected in series between the second pad and the third pad; wherein, when observing facing the PCB board, the first conductive path from the first conductive via to the first pad and the second conductive path from the second pad to the third pad at least partially overlap, and any two of the following three do not overlap with each other: the first conductive via, the second conductive hole, and the second conductive path. With this construction, the conductive path from the conductive sheet to the first pad is routed back to the first side via the conductive layer on the second side, so that the first pad for welding the voltage acquisition line can be cleverly and electrically insulatedly arranged between the second pad and the third pad for welding the temperature acquisition line. Therefore, on the one hand, it helps to increase the distance between the second pad and the third pad, thereby improving the electrical insulation between the second pad and the third pad, thereby enhancing the acquisition accuracy of the temperature sensor. On the other hand, it can easily increase the conductive area from the conductive sheet to the first pad, thereby reducing the conductive resistance from the conductive sheet to the first pad and enhancing the current carrying capacity of the signal acquisition component (for example, when performing voltage balancing on the battery module). BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present application, rather than limiting the present application.

[0046] Figure 1 It is a front view schematic diagram of a signal acquisition component provided in one embodiment of the present application.

[0047] Figure 2 yes Figure 1 Schematic side view of .

[0048] Figure 3 yes Figure 1An exploded schematic diagram of the signal acquisition components shown.

[0049] Figure 4 yes Figure 1 The structure diagram of the signal acquisition component after being installed in the battery module is shown.

[0050] Figure 5 It is a side cross-sectional schematic diagram of a signal acquisition component provided in an embodiment of the present application before being installed in a battery module.

[0051] Figure 6 It is a structural schematic diagram of a signal acquisition component provided in an embodiment of the present application after being installed in a battery module.

[0052] Figure 7 yes Figure 6 Figure 2 is a side cross-sectional diagram of the signal acquisition assembly before installation in the battery module.

[0053] Description of reference numerals:

[0054] 1-conductive sheet, 1A-second surface, 11-first portion, 12-second portion, 13-third portion;

[0055] 111-first extension leg, 111A-first blocking portion;

[0056] 112-second extension leg, 112A-second blocking portion;

[0057] 121- convex, 121A- first folding arm, 121B- second folding arm, 121C- third folding arm, 121D- concave;

[0058] 131-arc-shaped bending portion;

[0059] 2-PCB board, 2A-third surface, 201-first conductive via, 202-second conductive via, 203-first pad, 204-second pad, 205-third pad, 206-fourth pad, 207-fifth pad, 208-sixth pad, 209-seventh pad, 210-eighth pad, 211-substrate layer, 212-conductive layer, 213-insulating layer, 214, 215, 216-printed circuit;

[0060] 206A-main body, 206B-first extension portion, 206C-second extension portion;

[0061] 3- Fuse;

[0062] 4- Temperature sensor;

[0063] 5-conductive row, 5A-first surface, 51-card slot;

[0064] 6-battery cell, 61-electrode terminal. DETAILED DESCRIPTION

[0065] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the embodiment of the present application will be clearly and completely described below in conjunction with the drawings of the embodiment of the present application. Obviously, the described embodiment is a part of the embodiment of the present application, rather than all the embodiments. Based on the described embodiment of the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of this application. It can be understood that, in the absence of conflict, some technical means of the various embodiments described herein can be replaced or combined with each other.

[0066] In the description of this application, if there are terms such as "first", "second", etc., they are only used to distinguish the objects described and do not have any order or technical meaning. Therefore, an object defined as "first", "second", etc. may explicitly or implicitly include one or more of the objects. In addition, "one" or "a" and similar words do not indicate a quantity limitation, but rather indicate the presence of at least one, and "multiple" means no less than two.

[0067] In the description of this specification, reference to "one embodiment" or "some embodiments" etc. means that one or more embodiments of the present application include a specific feature, structure or characteristic described in conjunction with the embodiment. Therefore, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. appearing in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways.

[0068] Figures 1 to 3 A specific embodiment of a signal acquisition component is shown. The signal acquisition component is used to collect temperature signals and voltage signals of battery cells 6 in a battery module. The signal acquisition component includes a PCB board 2 (Printed Circuit Board), a temperature sensor 4, a conductive sheet 1 and a fuse 3.

[0069] The PCB board 2 includes a substrate layer 211, a conductive layer 212 and an insulating layer 213 stacked in sequence, and a first pad 203, a second pad 204 and a third pad 205 separated from each other. The PCB board 2 is rectangular, having a width and a length greater than the width, and the width does not exceed 1.5 cm, and the length does not exceed 2.0 cm.

[0070] The material forming the substrate layer 211 may include glass fiber reinforced thermosetting resin FR4 or FP5, and the substrate layer 211 has a first side and a second side opposite to each other along its thickness direction (i.e., a direction perpendicular to the aforementioned width and length), and a first conductive via 201 and a second conductive via 202 extending from the first side to the second side and separated from each other.

[0071] The conductive layer 212 is stacked on the aforementioned second side of the substrate layer 211, and electrically connects the first conductive via 201 and the second conductive via 202. In this embodiment, the conductive layer 212 is a copper foil with high electrical conductivity and high thermal conductivity, and the copper foil substantially covers the entire substrate layer 211. The first conductive via 201 and the second conductive via 202 are metallized holes with high thermal conductivity.

[0072] The insulating layer 213 is stacked on the side of the conductive layer 212 away from the substrate layer 211 and completely covers the conductive layer 212, thereby protecting the conductive layer 212 and preventing the conductive layer 212 from contacting an external conductor. The insulating layer 213 may be a resin.

[0073] The first pad 203, the second pad 204 and the third pad 205 are arranged separately from each other on the aforementioned first side of the substrate layer 211. Among them, the first pad 203 is used for welding the voltage acquisition line connected to the battery management system BMS to transmit the voltage signal collected by the acquisition component to the battery management system BMS. The second pad 204 and the third pad 205 are used for welding the temperature acquisition line connected to the battery management system BMS to transmit the temperature signal collected by the acquisition component to the battery management system BMS.

[0074] The temperature sensor 4 is thermally conductively mounted on the PCB board 2. Specifically, the temperature sensor 4 is thermally conductively connected to the PCB board 2 in a manner of being arranged against the first side of the substrate layer 211. And the temperature sensor 4 is electrically connected in series between the second pad 204 and the third pad 205. The temperature sensor 4 can be an NTC thermistor. When working, the NTC thermistor has a corresponding resistance value based on the temperature of the environment in which it is located. The battery management system BMS can obtain the current resistance value of the NTC thermistor via the temperature acquisition line welded to the second pad 204 and the third pad 205, and determine the NTC thermistor based on the current resistance value and thereby determine the current temperature of the battery cell 6.

[0075] The conductive sheet 1 includes a first portion 11 and a second portion 12, wherein the first portion 11 is fixedly disposed on a first side of the substrate layer 211 and electrically connected to the first conductive via 201, and the second portion 12 extends to the outside of the PCB board 2 to be electrically connected to the electrode terminal 61 of the battery cell 6. Specifically, the PCB board 2 includes a fourth pad 206 electrically connected to the first conductive via 201 and located on the first side, and the first portion 11 of the conductive sheet 1 is electrically connected to the first conductive via 201 by being welded to the fourth pad 206.

[0076] exist Figure 1 In the embodiment, the second pad 204, the first pad 203 and the third pad 205 are arranged in sequence at equal intervals along the width direction of the PCB board 2, and are all arranged close to a width edge (first width edge) of the PCB board 2. In addition, the first pad 203, the second pad 204 and the third pad 205 are formed into a substantially rectangular shape, and the outermost two pads, namely the second pad 204 and the third pad 205, are arranged close to the two length edges of the PCB board 2, respectively. The number of the first conductive vias 201 is multiple ( Figure 1 The plurality of first conductive vias 201 are arranged in two parallel rows, and the 10 first conductive vias 201 in each row are arranged at intervals along the length direction of the PCB board 2, and the 10 first conductive vias 201 in each row are arranged to a position close to the other width side (the second width side) of the PCB board 2, and the two rows of first conductive vias 201 are respectively arranged close to the two length sides of the PCB board 2. The fourth solder pad 206 includes a main body portion extending in a straight line along the width direction of the PCB board 2, and a first extension portion and a second extension portion extending in the same direction from both ends of the main body portion along the length direction of the PCB board 2, the first extension portion covers and electrically connects one of the two rows, and the second extension portion covers and electrically connects the other of the two rows. Correspondingly, the first portion 11 of the conductive sheet 1 includes a first extension leg 111 and a second extension leg 112 separated from each other, the first extension leg 111 is welded to the first extension leg in a manner of completely covering the first extension leg, and the second extension leg 112 is welded to the second extension leg in a manner of completely covering the second extension leg. In addition, the temperature sensor 4 is arranged in the space between the first extension part and the second extension part. In this way, the limited area of ​​the PCB board 2 can be fully utilized to reasonably arrange various components, and the connection strength between the conductive sheet 1 and the PCB board 2 and the conductive area of ​​the conductive sheet 1 and the PCB board 2 can be ensured, and the welding of the signal acquisition line with the first pad 203, the second pad 204 and the third pad 205 can be facilitated.

[0077] The conductive sheet 1 may be a nickel sheet.

[0078] The fuse 3 is arranged on the first side of the substrate layer 211 and is electrically connected in series between the second conductive via 202 and the first pad 203. Specifically, the number of the second conductive vias 202 is also set to be multiple, and the multiple second conductive vias 202 are arranged in a matrix at a substantially middle position in the length direction of the PCB board 2, and the fifth pad 207 arranged on the first side of the substrate layer 211 is electrically connected to the second conductive vias 202 in a state of covering each second conductive via 202. The sixth pad 208 arranged on the first side of the substrate layer 211 is electrically connected to the aforementioned first pad 203 via a printed circuit 214, and the sixth pad 208 is aligned with the fifth pad 207 in a manner of being separated from each other in the width direction of the PCB board 2, and the fuse 3 is welded and electrically connected in series between the fifth pad 207 and the sixth pad 208. In addition, the fuse 3 can be a resettable fuse. In implementation, the voltage acquisition circuit including the fuse 3 can also be used to perform voltage balancing on the battery (for example, the desired battery voltage can be obtained by charging or discharging the target battery cell 6). At this time, a current will flow through the fuse 3 (as well as the conductive sheet 1 and the first welding pad). When the current is too large, the resettable fuse becomes a high-resistance state to protect the circuit.

[0079] The first extension leg 111 has a first blocking portion 111A extending in the thickness direction of the PCB board 2, and the second extension leg 112 has a second blocking portion 112A extending in the thickness direction of the PCB board 2. The temperature sensor 4 is located between the first blocking portion 111A and the second blocking portion 112A, and the first blocking portion 111A and the second blocking portion 112A are both higher than the temperature sensor 4 in the thickness direction of the PCB board 2. Therefore, based on the blocking and retaining effect of the first blocking portion 111A and the second blocking portion 112A on the fluid material, a relatively thick insulating thermally conductive resin can be conveniently applied between the first blocking portion 111A and the second blocking portion 112A to wrap the temperature sensor 4 as a whole and solidify it, thereby avoiding: the NTC thermistor as the temperature sensor 4 accidentally contacts with an external conductor (for example, causing the NTC thermistor to short-circuit) to cause its working resistance to deviate, and thus cause errors in the measured temperature information. In addition, the insulating thermally conductive resin thus provided not only improves the thermal conductivity of the PCB board 2 and the temperature sensor 4, but also enables the heat absorbed by the conductive sheet 1 from the conductive bar 5 to be transferred to the temperature sensor 4 more quickly. The insulating thermally conductive resin may be a transparent thermally conductive UV glue.

[0080] More specifically, a seventh soldering pad 209 and an eighth soldering pad 210 are also provided on the first side of the PCB board 2, wherein the seventh soldering pad 209 is electrically connected to the second soldering pad 204 via a printed circuit 215, and the eighth soldering pad 210 is electrically connected to the third soldering pad 205 via a printed circuit 216, and the positive pin and the negative pin of the temperature sensor 4 are respectively welded to the aforementioned seventh soldering pad 209 and the eighth soldering pad 210, thereby realizing the electrical series connection of the temperature sensor 4 between the second soldering pad 204 and the third soldering pad 205.

[0081] The PCB board 2 may further include another insulating protective layer stacked on the first side of the substrate layer 211, the insulating protective layer buries the aforementioned printed circuits 214, 215, 216 inside thereof, and the first pad 203, the second pad 204 and the third pad 205 are exposed from the insulating protective layer.

[0082] See also Figure 1 , when viewed from the PCB board 2, the conductive path from the first conductive via 201 to the first pad 203, i.e., the first conductive path, partially overlaps with the conductive path from the second pad 204 to the third pad 205, i.e., the second conductive path, and any two of the first conductive via 201, the second conductive via 202, and the second conductive path do not overlap with each other. In this way, the conductive area from the conductive sheet 1 to the first pad 203 can be set as large as possible, thereby reducing the conductive resistance from the conductive sheet 1 to the first pad 203, enhancing the current carrying capacity of the signal acquisition component, for example, when performing voltage balancing processing on the battery module, and better ensuring the insulation isolation between the voltage acquisition circuit and the temperature acquisition circuit.

[0083] It can be understood that the aforementioned first conductive path is a conductive path that passes through the first conductive via 201, the conductive layer 212, the second conductive via 202, the seventh pad 209, the fuse 3, the eighth pad 210, the printed circuit 214 and the first pad 203 in sequence, and the aforementioned second conductive path is a conductive path that passes through the second pad 204, the printed circuit 215, the seventh pad 209, the temperature sensor 4, the eighth pad 210, the printed circuit 216 and the third pad 205 in sequence.

[0084] Please see again Figure 1When observing facing the PCB board 2, the fifth pad 207, the fuse 3, the sixth pad 208, the printed circuit 214 and the first pad 203 are located in the open space defined by the aforementioned second conductive path, that is, in the aforementioned open space surrounded by the second pad 204, the printed circuit 215, the seventh pad 209, the temperature sensor 4, the eighth pad 210, the printed circuit 216 and the third pad 205. In this way, while increasing the distance between the second soldering pad 204 and the third soldering pad 205, thereby improving the electrical insulation between the second soldering pad 204 and the third soldering pad 205, especially improving the electrical insulation between the solder joints of the two temperature acquisition lines respectively soldered to the two soldering pads, thereby enhancing the acquisition accuracy of the temperature sensor 4, the limited installation area of ​​the PCB board 2 is fully utilized (in particular, the opening space theoretically defined by the second conductive path is fully utilized, and the large distance between the second soldering pad 204 and the third soldering pad 205 brings about the aforementioned large-sized opening space) to arrange components such as the fuse 3 and the first soldering pad 203, so that the conductive area from the second conductive via 202 to the first soldering pad 203 can be easily increased.

[0085] According to the signal acquisition component provided in the embodiment of the present application, the conductive path from the conductive sheet 1 to the first pad 203 is bypassed back to the first side of the substrate layer 211 via the conductive layer on the second side of the substrate layer 211, so that the first pad 203 for welding the voltage acquisition line can be cleverly and electrically insulated and arranged between the second pad 204 and the third pad 205 for welding the temperature acquisition line. In this way, on the one hand, it helps to increase the distance between the second pad 204 and the third pad 205, thereby improving the electrical insulation between the second pad 204 and the third pad 205, and further enhancing the acquisition accuracy of the temperature sensor 4. On the other hand, it can easily increase the conductive area from the conductive sheet 1 to the first pad 203, thereby reducing the conductive resistance from the conductive sheet 1 to the first pad 203 and enhancing the current carrying capacity of the signal acquisition component.

[0086] In addition, an embodiment of the present application further provides a battery module configured with the aforementioned signal acquisition component, the battery module includes a plurality of battery cells 6 and a plurality of conductive bars 5, the conductive bars 5 electrically connecting the electrode terminals 61 of two adjacent battery cells 6, for example, one conductive bar 5 electrically connects the positive terminal of the first battery cell and the negative terminal of the second battery cell, and another conductive bar 5 electrically connects the positive terminal of the second battery cell and the negative terminal of the third battery cell, thereby connecting the first battery cell in series with the second battery cell, and connecting the second battery cell in series with the third battery cell. It can be known that the voltage between the aforementioned two conductive bars 5 is equal to the terminal voltage of the aforementioned second battery cell, therefore, the voltage between the two voltage acquisition lines respectively drawn from the two conductive bars 5 (to be more specific, the two signal acquisition components installed on the two conductive bars 5) reflects the terminal voltage of the second battery cell. For the convenience of explanation, Figure 4Only the assembly structure of one battery cell 6, one conductive bar 5 and one signal acquisition component in the battery module is illustrated.

[0087] See also Figure 4 , the second portion 12 of the conductive sheet 1 is electrically connected to the electrode terminal 61 of the battery cell 6 via a conductive bar 5. Specifically, the conductive bar 5 is directly welded to the electrode terminal 61 of the battery cell 6, and the conductive bar 5 is in thermal contact with the battery cell 6. The second portion 12 of the conductive sheet 1 is directly welded to the conductive bar 5, thereby achieving electrical connection between the second portion 12 of the conductive sheet 1 and the electrode terminal 61 of the battery cell 6. In some embodiments, the conductive bar 5 is only in thermal contact (and welded) with the electrode terminal 61 of the battery cell 6, while in other embodiments, the conductive bar 5 is not only in thermal contact (and welded) with the electrode terminal 61 of the battery cell 6, but also in thermal contact with the housing of the battery cell 6.

[0088] The conductive bar 5 can be an aluminum bar or a copper bar, and has a flat first surface 5A. The second portion 12 of the conductive sheet 1 has a flat second surface 1A, and the second surface 1A is attached to the first surface 5A and the two are fixed by welding. In this way, the conductive sheet 1 and the conductive bar 5 have a large conductive area, high connection strength and low connection resistance.

[0089] In addition, the PCB board 2 has a third surface 2A that is suitable for being attached to the aforementioned first surface 5A and is straight. When the signal acquisition component is assembled to the battery module, the third surface 2A is coplanar with the aforementioned second surface 1A, and both are attached to the first surface 5A of the conductive bar 5. The third surface 2A is defined by the aforementioned insulating layer 213, that is, the third surface 2A is specifically the surface of the aforementioned insulating layer 213 that is away from the conductive layer 212, and the third surface 2A is also a side surface of the PCB board 2 along its thickness direction. The third surface 2A coplanar with the aforementioned second surface 1A can be in contact with the first surface 5A of the conductive bar 5 over a large area, so that the heat of the conductive bar 5 can be quickly transferred to the PCB board 2, thereby enabling the temperature sensor 4 to accurately detect the conductive bar 5 in real time and thereby obtain the current temperature of the battery cell 6. In some embodiments, a thermal conductive adhesive can also be applied to further strengthen the combination of the PCB board 2 and the conductive bar 5.

[0090] exist Figure 4When the conductive sheet 1 and the conductive bar 5 are mounted to each other, the conductive sheet 1 can be in an elastic deformation state with elastic restoring force (or elastic force), so that the conductive sheet 1, more specifically the first portion 11 of the conductive sheet 1, exerts an elastic pressing force toward the first surface 5A on the PCB board 2. In this way, the contact and heat conduction rate between the PCB board 2 and the conductive bar 5, more specifically the third surface 2A and the second surface 1A, can be enhanced, thereby helping the temperature sensor 4 to accurately detect the current temperature of the battery cell 6.

[0091] like Figure 5 As shown, when the signal acquisition component has not been assembled to the conductive bar 5, the conductive sheet 1 is not in the aforementioned elastic deformation state, but in a natural state. At this time, there is an obtuse angle between the second surface 1A of the conductive sheet 1 and the third surface 2A of the PCB board 2, for example, an angle of 170°. When the conductive sheet 1 of the signal acquisition component is welded to the first surface 5A of the conductive bar 5, the conductive bar 5 presses the PCB board 2, more specifically, the first surface 5A presses the third surface 2A in reverse, causing the conductive sheet 1 to produce elastic deformation, and thereby making the second surface 1A of the conductive sheet 1 and the third surface 2A of the PCB board 2 coplanar (the two are arranged at 180°). At this time, under the action of the elastic restoring force of the conductive sheet 1, the PCB board 2 and the conductive bar 5, more specifically, the third surface 2A and the first surface 5A press each other to reliably conduct heat. Furthermore, when the conductive sheet 1 is in the aforementioned natural state where it has not yet been assembled to the conductive bar 5, all parts of the third surface 2A of the PCB board 2 are only on the same side (at the same side) of the plane where the second surface 1A is located. Figure 5 In this way, it can be easily ensured that after the assembly is completed (in more detail, after the second portion 12 of the conductive sheet 1 and the conductive bar 5 are welded), the third surface 2A is substantially completely attached to the first surface 5A. A better approach is that when the conductive sheet 1 is in the aforementioned natural state before being assembled to the conductive bar 5, the third surface 2A of the PCB board 2 extends from the plane where the second surface 1A is located to the one side, for example, Figure 5 In the figure, the third surface 2A extends from the plane where the second surface 1A is located to the lower right side.

[0092] Specifically, the conductive sheet 1 further includes a third portion 13 connecting the first portion 11 and the second portion 12. Since the third portion 13 has a bending design (such as Figure 4 and Figure 5 The third portion 13 has two arc-shaped bending portions 131, and the first portion 11 and the second portion 12 are respectively attached to and fixed to the relevant components (PCB board 2 and conductive bar 5). Therefore, when the first surface 5A presses the third surface 2A in the reverse direction, the third portion 13 is more likely to produce elastic deformation than the first portion 11 and the second portion 12. Figure 4 In the embodiment, the third portion 13 is in an elastic deformation state and has an elastic restoring force, so that the first portion 11 of the conductive sheet 1 presses the PCB board 2 toward the conductive bar 5. It can be understood that during the assembly process, the first surface 5A presses the third surface 2A in reverse, so that the third surface 2A finally completely rests on the first surface 5A of the conductive bar 5 in a manner of rotating around the third portion 13.

[0093] In other embodiments, the third part 13 may be thinned or perforated so that the thickness of the third part 13 is thinner than that of each of the first part 11 and the second part 12, or the third part 13 has a hole that allows it to be easily elastically deformed (it can be understood that the opening on the third part 13 can reduce the deformation resistance of the third part 13), so that when the first surface 5A presses the third surface 2A in the opposite direction, the third part 13 is more likely to be elastically deformed (bent) than the first part 11 and the second part 12. In this way, because the deformation path of the third surface 5A during the assembly process is known (i.e., rotation around the third part 13), it is easy to configure the relative position of the third surface 2A and the second surface 1A when the conductive sheet 2 is in the natural state, that is, it is easier to configure the configuration of the conductive sheet 2 in the natural state.

[0094] In other embodiments, the PCB board 2 may not be in close contact with the conductive bar 5 (i.e., the third surface 2A is not in close contact with the first surface 5A). In this case, after the heat of the battery cell 6 is transferred to the conductive bar 5, it needs to be transferred to the PCB board 2 through the conductive sheet 1, and then transferred from the PCB board 2 to the temperature sensor 3, that is, the heat transfer path directly from the conductive bar 5 and the PCB board 2 to the temperature sensor 3 is eliminated. In this case, the heat transfer rate from the battery cell 6 to the temperature sensor 3 is much lower than that of the conductive bar 5. Figure 4 The structure shown is reduced, however, since the heat obtained by the conductive sheet 1 from the battery cell 6 can still be quickly transferred to the PCB board 2, especially through the metallized conductive vias (the first conductive vias and the second conductive vias are metallized holes) to the large area of ​​the copper foil conductive layer, the high sensitivity of the temperature sensor 3 to the temperature detection of the battery cell 6 can still be guaranteed.

[0095] Please see again Figure 2In this embodiment, the second portion 12 of the conductive sheet 1 includes an elastically deformable protrusion 121, and the conductive bar 5 has a slot 51 that is recessed 121D inward from its first surface 5A for the aforementioned protrusion 121 to be elastically inserted. In this way, in the process of assembling the signal acquisition component to the conductive bar 5, the elastic protrusion 121 of the conductive sheet 1 can be first inserted into the slot 51 of the conductive bar 5, and then the conductive sheet 1 and the conductive bar 5 are welded. In this way, on the one hand, the pre-welding position of the conductive sheet 1 on the conductive bar 5 can be quickly found and fixed by means of the elastic engagement of the protrusion 121 and the slot 51, and the conductive sheet 1 can be prevented from accidentally detaching from the conductive bar 5 when the conductive sheet 1 and the conductive bar 5 are welded in the subsequent sequence. On the other hand, the elastic engagement of the protrusion 121 and the slot 51 also helps to increase the conductive area of ​​the conductive sheet 1 and the conductive bar 5, thereby reducing the connection resistance of the conductive sheet 1 and the conductive bar 5, especially when the surface of the protrusion 121 and the slot wall of the slot 51 elastically abut each other over a large area.

[0096] The protrusion 121 is a U-shaped bending portion formed by bending the conductive sheet 1, and the conductive sheet 1 with the protrusion 121 is an integrated structure. The U-shaped bending portion, i.e., the protrusion 121, includes a first folding arm 121A and a second folding arm 121B separated from each other, and a third folding arm 121C connecting the first folding arm 121A and the second folding arm 121B, and the first folding arm 121A, the third folding arm 121C and the second folding arm 121B are terminated in sequence. The first folding arm 121A and the second folding arm 121B extend substantially perpendicular to the second surface 1A, and the third folding arm 121C extends substantially parallel to the second surface 1A. When the latching protrusion 121 is inserted into the latching slot 51 of the conductive bar 5, the first folded arm 121A and the second folded arm 121B are elastically deformed to move closer to each other due to being squeezed by the inner wall of the latching slot 51, and thereby the first folded arm 121A and the second folded arm 121B are pressed against the inner wall of the latching slot 51 away from each other under the action of the elastic restoring force, that is, the latching protrusion 121 maintains contact with the latching slot 51 with the help of the elastic restoring force of the latching protrusion 121.

[0097] exist Figure 4 In the embodiment, the slot 51 is a non-through slot having a bottom wall, and the bottom wall is spaced a certain distance from the electrode terminal 61 and is located above the electrode terminal 61. The height of the protrusion 121 and the depth of the slot 51 can be constructed to be equal, so that when the protrusion 121 is inserted into the slot 51 of the conductive bar 5, the third folded arm 121C is in conductive contact with the bottom wall of the slot 51.

[0098] The aforementioned bending portion, i.e., the second folded arm 121B of the protrusion 121, is located at the end of the conductive sheet 1. In addition, in order to prevent the end of the second folded arm 121B from protruding out of the slot 51 after the protrusion 121 is inserted into the slot 51 and thus generating a "protrusion" on the first surface 5A, in some embodiments, the second folded arm 121B at the end of the conductive sheet 1 is constructed to be only on the same side of the plane where the second surface 1A is located (e.g. Figure 2 The second surface 1A extends to the right side of the plane where the second surface 1A is located.

[0099] The aforementioned protrusion 121 (U-shaped bending portion) formed by bending the conductive sheet 1 has a recess 121D, and the recess 121D is defined by a first folding arm 121A, a second folding arm 121B, and a third folding arm 121C. Based on the recess 121D, in some embodiments, after the protrusion 121 is inserted into the slot 51, solder connecting the conductive sheet 1 and the conductive bar 5 can be filled in the recess 121D and the slot 51 to significantly improve the connection strength between the conductive sheet 1 and the conductive bar 5.

[0100] See also Figure 4 When observed along the thickness direction of the PCB board 2, the temperature sensor 4, the PCB board 2, the conductive bar 5 and the electrode terminal 61 overlap each other, and in the overlapping area, the temperature sensor 4, the PCB board 2, the conductive bar 5 and the electrode terminal 61 are in close contact with each other in sequence. With this structure, the heat transfer path from the battery cell 6, more specifically the electrode terminal 61 to the temperature sensor 4, can be shortened, and the heat transfer rate between the battery cell 6 and the temperature sensor 4 can be increased.

[0101] In other embodiments, Figure 6 and Figure 7 As shown, the card slot 51 is a through slot that penetrates the conductive bar 5 in the thickness direction of the conductive bar 5. The through slot is opposite to the electrode terminal 61 of the battery cell 6. The card protrusion 121 of the conductive sheet 1 abuts against the electrode terminal 61 via the through slot. Specifically, the third folded arm 121C of the card protrusion 121 abuts against the electrode terminal 61 at the through slot. In this way, the card protrusion 121 of the conductive sheet 6 is in direct electrical and thermal contact with the electrode terminal 61, which helps to further reduce the connection resistance and thermal resistance from the electrode terminal 61 to the conductive sheet 6. In this embodiment, the third folded arm 121C can be directly welded to the electrode terminal 61.

[0102] In other embodiments, when the signal acquisition component has not been assembled to the conductive bar 5, the protruding direction of the protrusion 121 is inclined to the second surface 1A. More specifically, there is an acute angle between the protruding direction of the protrusion 121 and the second surface 1A, and the slot 51 of the conductive bar 5 is perpendicular to the first surface 5A and is recessed inward 121D. In this way, when the protrusion 121 is inserted into the slot 51, it is squeezed by the first surface 5A, and the second part 12 of the conductive sheet 1 is elastically deformed - the second surface 1A is elastically bent relative to the protrusion 121, so that under the action of the elastic restoring force of the conductive sheet 1, the second surface 1A of the conductive sheet 1 and the first surface 5A of the conductive bar 5 are pressed against each other and reliably contacted.

[0103] See also Figure 4 In the battery module provided in the embodiment of the present application, the entire area of ​​the PCB board 2 and the conductive sheet 1 is covered on the conductive bar 5 .

[0104] In addition, the embodiment of the present application also provides a battery system, which includes a battery module of the above structure, a battery box for accommodating the battery module, a battery management system BMS, a temperature acquisition line and a voltage acquisition line. Two temperature acquisition lines are provided, one end of the two temperature acquisition lines is respectively welded to the first welding pad 203 and the second welding pad 204, and the other end is connected to the battery management system BMS. One end of the voltage acquisition line is welded to the third welding pad 205, and the other end is connected to the battery management system BMS.

[0105] During operation, the terminal voltage of the battery cell 6 is transmitted to the battery management system BMS in sequence via the conductive bus 5, the conductive sheet 1, the first conductive via 201, the conductive layer 212, the second conductive via 202, the fuse 3, the first pad and the voltage collection line. The battery management system BMS determines the current temperature of the battery cell 6 by obtaining the resistance value of the NTC thermistor.

[0106] The embodiment of the present application also provides a method for installing the above-mentioned signal acquisition component on a battery module, the method comprising:

[0107] Step 1: Insert the protrusion 121 into the slot 51 in a state of elastic deformation;

[0108] Step 2: The second part 12 is welded and fixed to the conductive bar 5 when the second surface 1A of the second part 12 and the first surface 5A of the conductive bar 5 are in contact with each other. Under the reverse pressure of the conductive bar 5, the conductive sheet 1 generates elastic deformation so that the first part 11 moves away from the first surface 5A, and thereby the conductive sheet 1 has an elastic restoring force that presses the third surface 2A toward the first surface 5A.

[0109] In some embodiments, step three may be further included: applying thermal conductive adhesive on the PCB board 2 to further strengthen the connection between the PCB board 2 and the conductive bar 5 .

Claims

1. A battery signal acquisition component for collecting the voltage and temperature of a battery cell in a battery module, characterized in that: The signal acquisition component comprises: A PCB board, the PCB board comprising: a substrate layer, having a first side and a second side opposite to each other along a thickness direction of the substrate layer, and a first conductive via and a second conductive via extending from the first side to the second side and separated from each other; a conductive layer, stacked and arranged on the second side of the substrate layer, and electrically connecting the first conductive via and the second conductive via; a second pad, a first pad, and a third pad, which are arranged in sequence and separated from each other, and are all arranged on the first side, wherein the first pad is used for welding a voltage acquisition line, the second pad and the third pad are used for welding a temperature acquisition line, and the first pad is electrically connected to the second conductive via; A conductive sheet, comprising a first portion and a second portion, wherein the first portion is fixed to the first side and electrically connected to the first conductive via, and the second portion is used to be electrically connected to an electrode terminal of the battery cell; a temperature sensor, disposed on the first side and electrically connected in series between the second pad and the third pad; When observing toward the PCB board, the first conductive path from the first conductive via to the first pad at least partially overlaps with the second conductive path from the second pad to the third pad, and any two of the following three do not overlap with each other: the first conductive via, the second conductive hole, and the second conductive path.

2. The battery signal acquisition component according to claim 1, characterized in that: The PCB board comprises: a fourth pad, electrically connected to the first conductive via in a state of covering the first conductive via, the first portion being welded to the fourth pad; a fifth pad, electrically connected to the second conductive via in a state of covering the second conductive via, and located on the first side of the substrate layer; a sixth pad, electrically connected to the first pad via a first printed circuit and located on the first side; Among them, the fifth pad and the sixth pad are electrically connected in series with a fuse located on the first side, and when observing facing the PCB board, the fifth pad, the fuse, the sixth pad, the first printed circuit and the first pad are located in an open space defined by the second conductive path.

3. The battery signal acquisition component according to claim 2, characterized in that: The PCB board comprises: a seventh pad, electrically connected to the second pad via a second printed circuit and located on the first side; an eighth pad, electrically connected to the third pad via a third printed circuit and located on the first side; Wherein, the temperature sensor is welded between the seventh soldering pad and the eighth soldering pad, and when observing facing the PCB board, the fifth soldering pad, the fuse, the sixth soldering pad, the first printed circuit and the first soldering pad are located in the open space surrounded by the second soldering pad, the second printed circuit, the seventh soldering pad, the temperature sensor, the eighth soldering pad, the third printed circuit and the third soldering pad.

4. The battery signal acquisition component according to claim 3, characterized in that: The number of the first conductive vias is set to be multiple, and the multiple first conductive vias are arranged into two columns separated from each other, namely a first column and a second column; The fourth pad includes a first extension portion and a second extension portion separated from each other, the first extension portion is electrically connected to the first column in a state of covering the first column, and the second extension portion is electrically connected to the second column in a state of covering the second column; When viewed facing the PCB board, the seventh pad, the temperature sensor, and the eighth pad are located between the first extension portion and the second extension portion.

5. The battery signal acquisition component according to claim 4, characterized in that: The PCB board is a rectangle having two width sides and two length sides; The second pad, the first pad and the third pad are arranged in a position adjacent to one of the width sides along the width direction of the rectangle, and the second pad and the third pad are arranged adjacent to the two length sides respectively; The first column and the second column are arranged adjacent to the other width side and spaced apart from each other in the width direction of the rectangle, and the first column and the second column are respectively arranged adjacent to the two length sides.

6. The battery signal acquisition component according to claim 5, characterized in that: The length of the rectangle is no greater than 3 cm, and the width is no greater than 2 cm.

7. The battery signal acquisition component according to claim 1, characterized in that: The conductive layer is copper foil, and the PCB board further comprises an insulating layer, which is stacked on a side of the conductive layer away from the substrate layer and completely covers the conductive layer.

8. A battery module, comprising: A battery cell having electrode terminals; A conductive bar, electrically connected to the terminals and in thermal contact with the battery cells; It is characterized in that the battery module further comprises a signal acquisition component as described in any one of claims 1 to 7, and the second part is electrically connected to the electrode terminal of the battery cell by being welded to the conductive bar.

9. The battery module according to claim 8, characterized in that: The PCB board is thermally conductively attached to the conductive bar in a manner that the second side faces the conductive bar.

10. A battery system, characterized in that: include: The battery module according to claim 8 or 9; A battery box, accommodating the battery module; Battery management system BMS; A voltage collection line, one end of which is welded to the first welding pad, and the other end of which is connected to the battery management system BMS; Two temperature collection lines, one end of each of the two temperature collection lines is welded to the second welding pad and the third welding pad respectively, and the other end of each of the two temperature collection lines is connected to the battery management system BMS.

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