W-band phased array module with frequency conversion based on AIP packaging

Abstract

The invention provides a W-band phased array module with frequency conversion based on AIP packaging, and relates to the technical field of W-band phased array modules. An AIP packaging antenna of the module can convert a received W-band radio frequency signal into a C-band intermediate frequency signal and transmit the C-band intermediate frequency signal to a PCB mother board, or convert the C-band intermediate frequency signal received from the PCB mother board into a W-band radio frequency signal and transmit the W-band radio frequency signal; the sum and difference device is connected with the PCB mother board, the sum and difference device can process a C-band intermediate frequency signal from the PCB mother board and then output the signal to the post-stage circuit, and the sum and difference device can process a transmitting signal input by the post-stage circuit and then transmit the signal to the PCB mother board; and the frequency source is connected with the PCB mother board, and can provide a local oscillator signal which is fed into the AIP packaging antenna through a power division network on the PCB mother board. The problems that a traditional phased array is large in signal transmission loss, large in PCB technology difficulty, high in cost and poor in usability can be effectively solved, and the problems that a W-band sum-difference device is high in design difficulty and poor in performance can also be effectively solved.

Description

Technical Field

[0001] The present specification relates to the technical field of W-band phased array modules, and in particular to a W-band phased array module with frequency conversion based on AIP packaging. Background Art

[0002] The phased array system can integrate circuits such as amplification, phase shifting, amplitude shifting, filtering, mixing, and power modulation with the antenna, achieving a high degree of integration and miniaturization. Compared with other bands, the W-band phased array has the advantages of high resolution, broadband, small size, and strong anti-interference ability. Therefore, the W-band phased array has huge application potential in military defense, aerospace, and certain civilian fields.

[0003] At present, the main form of W-band two-dimensional phased array is AOB (Antenna On Board), which integrates antenna, TR circuit, power management circuit, etc. on PCB board, usually setting antenna array on one side of PCB board, and setting RF amplification, amplitude and phase control chips and other circuits on the other side. The working process is usually that the antenna array set on one side of PCB board sends and receives W-band RF signal, and the signal passes through the coaxial and stripline structure inside the PCB board to reach the RF chip set on the other side of PCB board, and enters the subsequent circuit after amplification, amplitude shifting and phase shifting. It can be seen that when the W-band two-dimensional phased array in the form of AOB is working, the transmission link of W-band RF signal is located in PCB board, and it is affected by the high-frequency performance, board making process, board thickness, etc. of PCB board, and it will be difficult to achieve good matching of W-band signal, and it has the defect of large loss. In addition, AOB array has no frequency conversion function, and the subsequent circuit needs to directly process the high-frequency signal of W-band, which will further increase the transmission loss and greatly increase the difficulty of designing and manufacturing the subsequent circuit.

[0004] Moreover, the two-dimensional phased array in the form of AOB has a low degree of integration. A large number of RF chips and other chips are often required to be installed on one side of the PCB board on which it is installed. The layout space is tight and a large number of necessary decoupling, energy storage capacitors, inductors and other devices cannot be placed, which is not conducive to the miniaturization and high integration of the system. Summary of the invention

[0005] The purpose of this specification is to provide a W-band phased array module with frequency conversion based on AIP packaging, which can overcome the above-mentioned defects of the traditional W-band two-dimensional phased array structure.

[0006] The embodiments of this specification are implemented as follows:

[0007] A W-band phased array module with frequency conversion based on AlP package, including several AIP package antennas, a PCB motherboard, a heat dissipation structure, a summator and a frequency source;

[0008] The AIP packaged antenna and the heat dissipation structure are respectively arranged on opposite sides of the PCB motherboard along the thickness direction thereof, wherein the heat dissipation structure can dissipate the heat generated by the AIP packaged antenna, and the AIP packaged antenna can convert the received W-band radio frequency signal into a C-band intermediate frequency signal and transmit it to the PCB motherboard, or convert the C-band intermediate frequency signal received from the PCB motherboard into a W-band radio frequency signal for transmission;

[0009] The summator is arranged on a side of the heat dissipation structure away from the PCB motherboard, the summator is connected to the PCB motherboard, the summator can process the C-band intermediate frequency signal from the PCB motherboard and output it to the subsequent circuit, and the summator can process the transmission signal input by the subsequent circuit and transmit it to the PCB motherboard;

[0010] The frequency source is arranged on a side of the heat dissipation structure away from the PCB motherboard. The frequency source is connected to the PCB motherboard. The frequency source can provide a local oscillation signal and feed it into the AIP packaged antenna through the PCB motherboard.

[0011] The embodiments of this specification have at least the following advantages or beneficial effects:

[0012] Compared with the prior art, the W-band RF signal of the W-band phased array module with frequency conversion based on AIP packaging is processed inside the AIP package antenna, and the above-mentioned PCB motherboard only needs to process the C-band intermediate frequency signal. This method can effectively solve the problems of large signal transmission loss, high difficulty and high cost of PCB board process and poor usability that the traditional AOB phased array needs to directly transmit the W-band RF signal on the PCB board. Moreover, the above-mentioned summator also processes the C-band intermediate frequency signal, which can also effectively solve the problems of high difficulty in designing the W-band summator and poor performance. In addition, the above-mentioned AIP packaged antenna integrates some functional devices originally set on the PCB motherboard. At this time, the reserved space of the PCB motherboard is larger, which is convenient for integrating the distribution network, power supply network and energy storage network, and further solves the problems of low integration and small layout space of the traditional A0B phased array. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of this specification, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present specification and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying any creative work.

[0014] Figure 1 This is a schematic diagram of the structure of the W-band phased array module with frequency conversion based on AIP packaging provided in this manual;

[0015] Figure 2 A schematic diagram of the power module provided for this manual;

[0016] Figure 3 This is a schematic diagram of the location of the 1.2V power partition power supply of the PCB motherboard provided for this manual.

[0017] Icons: 1. Package substrate; 2. Antenna array; 3. Amplitude and phase multifunctional chip; 4. Solder ball; 5. PCB motherboard; 6. Heat dissipation structure; 7. Heat dissipation protrusion; 8. Power module; 9. Heat dissipation slot; 10. Power protrusion; 11. Summing and differential device; 12. Frequency source. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of this specification more clear, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are part of the embodiments of this specification, not all of the embodiments. Generally, the components of the embodiments of this specification described and shown in the drawings here can be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the present specification provided in the accompanying drawings is not intended to limit the scope of the present specification claimed for protection, but merely represents selected embodiments of the present specification. Based on the embodiments in the present specification, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present specification.

[0020] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0021] In the description of the embodiments of this specification, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of this specification is usually placed when used. It is only for the convenience of describing this specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on this specification. In addition, if the terms "first", "second", "third", etc. appear, they are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0022] In addition, the use of terms such as "horizontal", "vertical", and "overhanging" does not mean that the components must be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0023] In the description of the embodiments of this specification, it is also necessary to explain that, unless otherwise clearly specified and limited, the words "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in this specification can be understood according to specific circumstances.

[0024] Please refer to Figures 1 to 3 , a W-band phased array module with frequency conversion based on AIP package provided in one embodiment of the present specification mainly includes a plurality of AIP package antennas, a PCB motherboard 5, a heat dissipation structure 6, a summator 11 and a frequency source 12;

[0025] The AIP packaged antenna and the heat dissipation structure 6 are respectively arranged on opposite sides of the PCB motherboard 5 along the thickness direction thereof. The heat dissipation structure 6 can dissipate the heat generated by the AIP packaged antenna. The AIP packaged antenna can convert the received W-band RF signal into a C-band intermediate frequency signal and transmit it to the PCB motherboard 5, or convert the C-band intermediate frequency signal received from the PCB motherboard 5 into a W-band RF signal for transmission;

[0026] The summator 11 is arranged on a side of the heat dissipation structure 6 away from the PCB motherboard 5. The summator 11 is connected to the PCB motherboard 5. The summator 11 can process the C-band intermediate frequency signal from the PCB motherboard 5 and output it to the subsequent circuit. The summator 11 can process the transmission signal input by the subsequent circuit and transmit it to the PCB motherboard 5.

[0027] The frequency source 12 is arranged on a side of the heat dissipation structure 6 away from the PCB motherboard 5 . The frequency source 12 is connected to the PCB motherboard 5 . The frequency source 12 can provide a local oscillation signal and feed it into the AIP package antenna through the PCB motherboard 5 .

[0028] Specifically, during operation, the local oscillator signal provided by the frequency source 12 can be fed into the AIP packaged antenna through the above-mentioned PCB motherboard 5, and the AIP packaged antenna can perform harmonic mixing according to the fed local oscillator signal, that is, it can down-convert the W-band RF signal it receives into a C-band intermediate frequency signal and transmit it to the PCB motherboard 5 for subsequent processing, or up-convert the C-band intermediate frequency signal input from the PCB motherboard 5 into a W-band RF signal for transmission.

[0029] At the same time, during the operation of the AIP packaged antenna, the heat dissipation structure 6 can provide a good heat dissipation path for the AIP packaged antenna, thereby preventing the generated heat from affecting the operation of the AIP packaged antenna.

[0030] The W-band phased array module converts the received W-band RF signal into an intermediate frequency signal through the AIP packaged antenna and then processes it on the PCB motherboard 5, or converts the C-band intermediate frequency signal received from the PCB motherboard 5 into a W-band RF signal and then transmits it. It can be seen that the W-band RF signal is processed inside the AIP packaged antenna, and the PCB motherboard 5 only needs to process the C-band intermediate frequency signal. This method can effectively solve the problems of large signal transmission loss, high difficulty and high cost of PCB board process and poor usability in the traditional AOB phased array that needs to directly transmit the W-band RF signal on the PCB board. Moreover, the above-mentioned summator 11 also processes the C-band intermediate frequency signal, which can also effectively solve the problems of high design difficulty and poor performance of the W-band summator 11. In addition, the AIP packaged antenna integrates some functional components originally set on the PCB motherboard 5. At this time, the reserved space of the PCB motherboard 5 is larger, which is convenient for integrating the power distribution network, power supply network and energy storage network, and further solves the problems of low integration and small layout space of the traditional A0B phased array.

[0031] In this embodiment, the local oscillator signal is an X-band signal.

[0032] In this embodiment, the AIP packaged antenna includes a package substrate 1, a plurality of antenna arrays 2, a plurality of amplitude and phase multifunctional chips 3 and a plurality of power division chips;

[0033] The packaging substrate 1 is connected to the PCB motherboard 5 through a plurality of solder balls 4, the antenna array 2 is arranged on a side of the packaging substrate 1 away from the PCB motherboard 5, and the amplitude-phase multifunctional chip 3 and the power division chip are arranged on a side of the packaging substrate 1 close to the PCB motherboard 5;

[0034] The amplitude and phase multifunctional chip 3 can convert the W-band RF signal received by the antenna array 2 into a C-band intermediate frequency signal according to the fed local oscillator signal and transmit it to the power division chip, or convert the C-band intermediate frequency signal received from the power division chip into a W-band RF signal and transmit it through the antenna array 2.

[0035] The power division chip can combine the C-band intermediate frequency signals output by the plurality of amplitude and phase multifunctional chips 3 into one C-band intermediate frequency signal and transmit it to the PCB motherboard 5 .

[0036] In this embodiment, the number of the AIP package antennas is four, and the four AIP package antennas are arranged in a square array on the PCB motherboard 5. That is, the AIP package antennas are arranged on the PCB motherboard 5 in a 2×2 square array.

[0037] In this embodiment, the number of the amplitude and phase multifunctional chips 3 is four, that is, four 16-channel amplitude and phase multifunctional chips 3, the number of power division chips is three, and the 8×8 antenna array 2 is integrated on the packaging substrate 1 to form a 64-channel antenna array 2, so that each of the above-mentioned AIP packaged antennas has 64 shared channels for transmission and reception, and the above-mentioned W-band phased array module has 256 channels.

[0038] In this embodiment, the amplitude and phase multifunctional chip 3 adopts silicon-based CMOS technology and has a frequency conversion function, so that the AIP packaged antenna can perform 8th harmonic mixing.

[0039] It can be seen that in this embodiment, the above-mentioned AIP packaged antenna has integrated functions such as frequency conversion and amplitude and phase control, and integrated 64 antennas. It has a high degree of integration and a large number of channels. At this time, the PCB motherboard 5 no longer needs to integrate the RF chip and the amplitude and phase control chip, and the layout space is reserved for the above-mentioned PCB motherboard 5, so that the above-mentioned PCB motherboard 5 can place a large number of decoupling, energy storage capacitors, inductors and other devices, which is beneficial to the miniaturization of the above-mentioned phased array module and has the advantage of high integration.

[0040] In this embodiment, the PCB motherboard 5 is provided with a plurality of through slots corresponding to the position of the amplitude-phase multifunctional chip 3 , and the heat dissipation structure 6 has a heat dissipation protrusion 7 , which can pass through the through slots and abut against the amplitude-phase multifunctional chip 3 .

[0041] In this embodiment, the number of through slots is consistent with the number of the amplitude-phase multifunctional chips 3, which is 16.

[0042] In this embodiment, the above-mentioned method can enable the amplitude-phase multifunctional chip 3, which is the main heat-generating device, to dissipate heat directly through the heat dissipation protrusion 7, with a short heat dissipation path and high heat dissipation efficiency.

[0043] In this embodiment, thermal conductive silicone grease is filled between the heat dissipation protrusion 7 and the amplitude-phase multifunctional chip 3. The heat dissipation efficiency of the amplitude-phase multifunctional chip 3 can be further improved by providing the thermal conductive silicone grease.

[0044] In this embodiment, there is a narrow bridge between two adjacent through slots, and the power division network is located on the narrow bridge. The power division network is arranged on the PCB motherboard 5 .

[0045] In this embodiment, the power division network includes three X-band Wilkinson power dividers, preferably improved ultra-narrow Wilkinson power dividers, the width of the two arms of the power divider is 1.3 mm, which is compatible with the width of the narrow bridge between two adjacent through slots, and can further achieve miniaturization and high integration.

[0046] In this embodiment, a power module 8 is also included. The power module 8 is arranged on a side of the PCB motherboard 5 close to the heat dissipation structure 6, and the power module 8 can provide the required power for the AIP package antenna. Considering that the power supply voltage required by the PCB motherboard 5 is different from the power supply voltage required by the AIP package antenna, the power module 8 is set to meet the above-mentioned usage requirements. It can be seen that the power module 8 can be directly integrated on the PCB motherboard 5 through the above method, thereby meeting the power supply requirements of the AIP package antenna without the need to set up additional components such as power connection cables.

[0047] In this embodiment, the power supply module 8 includes a carrier board and a linear regulator chip (i.e., an LDO chip) and a plurality of switching power supply chips (i.e., DCDC chips) arranged on the carrier board. The plurality of switching power supply chips can convert the power input from the PCB motherboard 5 into the required power of the amplitude-phase multifunctional chip 3, and the linear regulator chip can convert the power input from the PCB motherboard 5 into the required power of the parallel ends of the plurality of amplitude-phase multifunctional chips 3.

[0048] In this embodiment, the 28V power supply input from the PCB motherboard 5 is converted into two 12V power supplies and one 3.6V power supply through the three DCDC chips arranged on the above-mentioned carrier board. Each 12V power supply has two DCDC chips to convert it into a 1.2V power supply, which provides independent power for the AIP packaged antennas respectively. One 3.6V power supply is converted into a 3.3V power supply by an LDO chip, which provides power for the parallel ends of the four AIP packaged antennas mentioned above.

[0049] In this embodiment, the heat dissipation structure 6 is provided with a heat dissipation groove 9 corresponding to the position of the power module 8, and the heat dissipation groove 9 is provided with a power protrusion 10 from the PCB motherboard 5 toward the AIP package antenna, and the power protrusion 10 is close to the side of the PCB motherboard 5 and abuts against the power module 8.

[0050] In this embodiment, the heat generated by the power module 8 which is the main heat generating source can be further dissipated through the above-mentioned configuration, thereby preventing heat accumulation from affecting the normal operation and work of the above-mentioned PCB motherboard 5.

[0051] In this embodiment, the heat dissipation structure 6 is provided with heat dissipation teeth and a fan on one side away from the PCB motherboard 5, and the fan can dissipate the heat generated by the AIP packaged antenna in the direction toward the summator 11. Through the above arrangement, the heat dissipation efficiency of the heat dissipation structure 6 can be further improved.

[0052] In this embodiment, the four input and output ports of the above-mentioned summator 11 are respectively connected to the PCB motherboard through radio frequency cables. The above-mentioned summator 11 also has a receiving summation path port, an azimuth difference path port, a pitch difference path port and a transmitting summation path port. Specifically, when the above-mentioned W-band phased array module is in a transmitting state, the summator 11 divides the transmission signal input from the transmitting summation path into four paths, and feeds them into four AIP packaged antennas respectively. When the above-mentioned W-band phased array module is in a receiving state, the above-mentioned summator 11 converts the four C-band intermediate frequency signals fed by the four AIP packaged antennas into sum and difference signals, and outputs them from the above-mentioned receiving summation path port, pitch difference path port and azimuth difference path port respectively.

[0053] In this embodiment, the frequency source 12 can transmit an input local oscillator signal to the PCB motherboard 5, and divide the local oscillator signal into four local oscillator signals through a power division network provided on the PCB motherboard 5 to feed the four AIP packaged antennas respectively.

[0054] In addition, the W-band phased array module effectively reduces the volume of the entire phased array system by integrating the summator 11 and the frequency source 12, improves the portability and flexibility of the system, reduces external connections, and further reduces signal loss and noise interference.

[0055] The above are only preferred embodiments of this specification and are not intended to limit this specification. For those skilled in the art, this specification may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification shall be included in the protection scope of this specification.

Claims

1. A W-band phased array module with frequency conversion based on AIP packaging, characterized in that: Including several AIP package antennas, PCB motherboard, heat dissipation structure, summator and frequency source; The AIP packaged antenna and the heat dissipation structure are respectively arranged on opposite sides of the PCB motherboard along the thickness direction thereof, wherein the heat dissipation structure can dissipate the heat generated by the AIP packaged antenna, and the AIP packaged antenna can convert the received W-band radio frequency signal into a C-band intermediate frequency signal and transmit it to the PCB motherboard, or convert the C-band intermediate frequency signal received from the PCB motherboard into a W-band radio frequency signal for transmission; The summator is arranged on a side of the heat dissipation structure away from the PCB motherboard, the summator is connected to the PCB motherboard, the summator can process the C-band intermediate frequency signal from the PCB motherboard and output it to the subsequent circuit, and the summator can process the transmission signal input by the subsequent circuit and transmit it to the PCB motherboard; The frequency source is arranged on a side of the heat dissipation structure away from the PCB motherboard. The frequency source is connected to the PCB motherboard. The frequency source can provide a local oscillation signal and feed it into the AIP packaged antenna through a power division network on the PCB motherboard.

2. The W-band phased array module with frequency conversion based on AIP packaging according to claim 1 is characterized in that: The AIP packaged antenna includes a packaging substrate, a plurality of antenna arrays, a plurality of amplitude and phase multifunctional chips and a plurality of power division chips; The packaging substrate is connected to the PCB motherboard through a plurality of solder balls, the antenna array is arranged on a side of the packaging substrate away from the PCB motherboard, and the amplitude-phase multifunctional chip and the power division chip are arranged on a side of the packaging substrate close to the PCB motherboard; The amplitude and phase multifunctional chip can convert the W-band radio frequency signal received by the antenna array into a C-band intermediate frequency signal according to the fed local oscillator signal and transmit it to the power division chip, or convert the C-band intermediate frequency signal received from the power division chip into a W-band radio frequency signal and transmit it through the antenna array. The power division chip can combine the C-band intermediate frequency signals output by the plurality of amplitude and phase multifunctional chips into one C-band intermediate frequency signal and transmit it to the PCB motherboard.

3. The W-band phased array module with frequency conversion based on AIP packaging according to claim 2 is characterized in that: The PCB motherboard is provided with a plurality of through slots corresponding to the positions of the amplitude-phase multifunctional chip, and the heat dissipation structure has a heat dissipation protrusion, which can pass through the through slots and abut against the amplitude-phase multifunctional chip.

4. The W-band phased array module with frequency conversion based on AIP packaging according to claim 3 is characterized in that: There is a narrow bridge between two adjacent through slots, and the power division network is located on the narrow bridge between the through slots of the PCB motherboard.

5. The W-band phased array module with frequency conversion based on AlP packaging according to claim 3, characterized in that: Thermal conductive silicone grease is filled between the heat dissipation protrusion and the amplitude-phase multifunctional chip.

6. The W-band phased array module with frequency conversion based on AIP packaging according to claim 2 is characterized in that: It also includes a power module, which is arranged on a side of the PCB motherboard close to the heat dissipation structure, and the power module can provide the required power for the AIP packaged antenna.

7. The W-band phased array module with frequency conversion based on AIP packaging according to claim 6 is characterized in that: The power supply module includes a carrier board and a linear regulator chip and a plurality of DC switching power supply chips arranged on the carrier board. The plurality of DC switching power supply chips can convert the power input from the PCB motherboard into the required power of the amplitude-phase multifunctional chip, and the linear regulator chip can convert the power input from the PCB motherboard into the required power of the parallel ends of the plurality of amplitude-phase multifunctional chips.

8. The W-band phased array module with frequency conversion based on AIP packaging according to claim 6 or 7, characterized in that: The heat dissipation structure is provided with a heat dissipation slot corresponding to the position of the power module, and the heat dissipation slot is provided with a power protrusion in the direction from the PCB motherboard toward the AIP package antenna, and the power protrusion is in contact with the power module on one side close to the PCB motherboard.

9. The W-band phased array module with frequency conversion based on AIP packaging according to claim 1, characterized in that: The number of the AIP packaged antennas is four, and the four AIP packaged antennas are arranged in a square array on the PCB motherboard.

10. The W-band phased array module with frequency conversion based on AIP packaging according to claim 1, characterized in that: The heat dissipation structure is provided with heat dissipation teeth and a fan on one side away from the PCB motherboard, and the fan can dissipate the heat generated by the AIP packaged antenna in the direction toward the summator.

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