Inverter and photovoltaic system
By adopting a separate cavity management structure and optimized heat dissipation design in the inverter, the problems of high failure risk, large volume and poor heat dissipation of the existing inverter are solved, and higher stability and reliability are achieved.
Patent Information
- Application Number
- CN202411813910.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-04-25
AI Technical Summary
The design of existing inverters leads to a high risk of failure of circuit board components, large size and poor heat dissipation capabilities, affecting stability and reliability.
By designing a cavity management structure in the inverter, the connecting structure and circuit board components are arranged in different cavity bodies respectively, and the heat dissipation fins and thermal pads are used to improve the heat dissipation efficiency.
It realizes the reduction of the risk of circuit board components failure, reduces the inverter volume, improves heat dissipation capacity and power density, thereby improving the stability and reliability of the inverter.
Smart Images

Figure CN119891794A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of photovoltaic technology, and specifically to an inverter and a photovoltaic system. Background Art
[0002] The inverter includes a housing, a circuit board assembly and a connection structure. The housing is surrounded by a receiving cavity. The circuit board assembly is located in the receiving cavity. The circuit board assembly includes a circuit board and a power device. The power device is arranged on the circuit board. One end of the connection structure is connected to the circuit board, and the other end of the connection structure is used to connect to the photovoltaic module or the power grid or the load. The connection structure and the circuit board assembly are both arranged in the receiving cavity. When the user operates the connection structure, the risk of failure of the circuit board assembly will increase. In addition, since the connection structure and most of the devices on the circuit board are arranged on the side of the circuit board away from the bottom plate, the inverter is large in size and has poor heat dissipation capacity. Summary of the invention
[0003] The embodiments of the present application provide an inverter and a photovoltaic system, which can implement compartment management, reduce the risk of failure of circuit board components, and improve the heat dissipation capacity of the inverter.
[0004] In a first aspect, the present application provides an inverter, including a housing, a connection structure and a first circuit board assembly. The housing includes a shell and a cover body arranged opposite to each other, the shell and the cover body are arranged to form a receiving cavity, the receiving cavity includes a first cavity and a second cavity, and the arrangement direction of the first cavity and the second cavity is perpendicular to the thickness direction of the housing. Part of the connection structure is located in the first cavity, and is used to connect a photovoltaic module, a power grid or a load.
[0005] The first circuit board assembly is located in the second cavity and is electrically connected to another part of the connection structure. The first circuit board assembly includes a first circuit board and a power device, and the power device is arranged on the first circuit board. The housing includes a bottom plate, and a heat dissipation fin is arranged on the side of the bottom plate away from the power device. The power device is located between the first circuit board and the bottom plate. The bottom plate also includes a groove that is recessed toward part of the power device. The power device includes a power tube, a busbar capacitor, and a magnetic element.
[0006] The inverter includes a connecting structure and a first circuit board assembly. Part of the connecting structure is located in the first cavity and is used to connect a photovoltaic module or a power grid or a load. The connecting structure located in the first cavity can realize the input of direct current and the output of alternating current. The first circuit board assembly is located in the second cavity and is electrically connected to another part of the connecting structure. The first circuit board assembly includes a first circuit board and a power device. The first circuit board assembly can realize power conversion and convert the input direct current into alternating current. The first circuit board assembly and parts of the connecting structure are located in different cavities, which can realize sub-cavity management, reduce the risk of failure of the first circuit board assembly, reduce mutual interference between the two, and improve the stability and reliability of the inverter.
[0007] At the same time, the shell includes a base plate, the power device is located between the first circuit board and the base plate, and the base plate also includes a groove sunken toward part of the power device, which can reduce the volume of the inverter, enhance the heat dissipation capacity of the inverter, and improve the power density of the inverter.
[0008] In some embodiments that may include the above embodiments, the inverter further includes a DC switch, one end of the DC switch is connected to another part of the first connection structure, and the other end of the DC switch is connected to the first circuit board.
[0009] One end of the DC switch is used to connect to the photovoltaic component, and the other end of the DC switch is connected to the first circuit board. The DC switch can control whether the DC power from the photovoltaic component can be transmitted to the first circuit board.
[0010] In some embodiments that may include the above-mentioned embodiments, the shell includes a partition plate, which is used to separate the shell into a first shell and a second shell, the cover body includes a first cover body and a second cover body, the first shell, the partition plate and the first cover body are arranged to form a first cavity, and the second shell, the partition plate and the second cover body are arranged to form a second cavity.
[0011] The partition plate separates the housing into a first housing and a second housing, so that the first housing, the partition plate and the first cover body are arranged to form a first cavity, and the second housing, the partition plate and the second cover body are arranged to form a second cavity. In other words, the partition plate separates the accommodating cavity into the first cavity and the second cavity, so that the first circuit board assembly and the connection structure are located in different cavities, and when the user operates the connection structure located in the first cavity, the normal operation of the first circuit board assembly will not be affected.
[0012] In some embodiments that may include the above-mentioned embodiments, the connection structure includes a first connection structure, the first connection structure is arranged to pass through the partition plate, a portion of the first connection structure is located in the first cavity and is electrically connected to the first circuit board, and another portion of the first connection structure is located in the second cavity and is connected to the photovoltaic component.
[0013] The first connection structure is connected to the first circuit board and the photovoltaic assembly respectively, so that the direct current generated by the photovoltaic assembly can be transmitted to the first circuit board and converted into alternating current on the first circuit board.
[0014] In some embodiments that may include the above embodiments, the first shell and the first cover are detachably connected.
[0015] The first cover body and the first shell body are detachably connected, indicating that the first shell body can be used alone, and the opening and closing of the first cover body will not affect the state of the second cover body. The first shell body and the first cover body are detachably connected, which is convenient for opening the first cover body and checking the connection structure in the first cavity.
[0016] In some embodiments that may include the above embodiments, the connection structure also includes a second connection structure, which is arranged through the partition plate, part of the second connection structure is located in the first cavity and is electrically connected to the first circuit board, and another part of the second connection structure is located in the second cavity and is respectively connected to the load and the power grid.
[0017] The second connection structure is connected to the first circuit board, the load and the power grid respectively, that is, the alternating current generated by the first circuit board assembly can be used in the grid-connected photovoltaic system to supply power to the power grid and the load.
[0018] In some embodiments that may include the above embodiments, the inverter further includes a second circuit board assembly, the second circuit board assembly is located in the second cavity. The second circuit board assembly includes a second circuit board, a capacitor and an inductor, the second circuit board is electrically connected to the first circuit board, and the capacitor and the inductor are both arranged on the second circuit board.
[0019] The inverter also includes a third connection structure, which is arranged to penetrate the partition plate, a portion of the third connection structure is located in the first cavity and is electrically connected to the second circuit board, and a portion of the third connection structure is located in the second cavity and is connected to the load.
[0020] The second circuit board is electrically connected to the first circuit board, and the third connection structure is connected to the second circuit board and the load respectively, that is, the alternating current generated by the first circuit board can be transmitted to the second circuit board, and then transmitted to the load by the second circuit board through the third connection structure. The capacitor and the inductor can form a filter circuit. Since the alternating current will generate a changing electric field and magnetic field during the transmission process, thereby generating electromagnetic interference, the filter circuit can suppress the electromagnetic interference and ensure the quality of the alternating current.
[0021] At the same time, the second circuit board assembly is located in the second cavity. Compared with the embodiment in which the second circuit board assembly is located in the first cavity, the risk of electric shock caused by possible contact with the second circuit board assembly when the user operates the connection structure in the first cavity can be reduced, corrosion of the second circuit board assembly caused by frequent exposure can be avoided, and the reliability of the inverter operation can be improved.
[0022] In addition, capacitors can filter high-frequency interference signals, and inductors can filter low-frequency interference signals, reducing electromagnetic interference, thereby ensuring the stability and reliability of the circuit.
[0023] In some embodiments that may include the above embodiments, the plurality of heat dissipation fins are arranged flush at one end facing away from the housing.
[0024] The multiple heat sink fins are flushly arranged at one end away from the housing, which helps to optimize the airflow distribution and ensure that the air can evenly contact each fin when passing through the heat sink fins, avoiding excessive or insufficient airflow in some areas.
[0025] In some embodiments that may include the above embodiments, a thermal pad is provided on a side of the power device close to the housing, and the power device is in contact with the housing through the thermal pad.
[0026] The thermal pad can fill the air gap between the power device and the housing, so that the power device and the housing can be fully in contact, increasing the heat dissipation area and improving the heat dissipation rate. At the same time, the thermal pad has a high thermal conductivity, which can further improve the heat dissipation rate.
[0027] In some embodiments that may include the above embodiments, the inverter further includes a third circuit board, the third circuit board is located in the first cavity, the third circuit board is electrically connected to the first circuit board, and the third circuit board is used to connect to the communication device.
[0028] The third circuit board can realize data transmission between the communication equipment and the inverter. The communication equipment can obtain the parameter settings of the inverter through the third circuit board and monitor the output voltage, output current, output power and other parameters of the inverter in real time to ensure the stability of the inverter operation status.
[0029] In a second aspect, an embodiment of the present application further provides an inverter, comprising a housing, a connection structure, and a first circuit assembly. The housing comprises a shell and a cover body arranged opposite to each other, the shell comprises a first shell and a second shell, the cover body comprises a first cover body and a second cover body, the first shell and the first cover body are arranged opposite to each other and connected to each other, and the second shell and the second cover body are arranged opposite to each other and are detachably connected. The first shell and the first cavity enclose a first cavity, the second shell and the second cover body enclose a second cavity, and the arrangement direction of the first cavity and the second cavity is perpendicular to the thickness direction of the housing.
[0030] Part of the connection structure is located in the first cavity and is used to connect the photovoltaic module or the power grid or the load. The first circuit component is located in the second cavity and is connected to the other part of the connection structure. The first circuit component includes a first circuit board and a power device, and the power device is arranged on the first circuit board. The second housing includes a bottom plate, and a heat dissipation fin is arranged on the side of the bottom plate away from the power device. The power device is located between the first circuit board and the bottom plate, and the bottom plate also includes a groove that is recessed toward part of the power device.
[0031] The inverter includes a connection structure and a first circuit board assembly. Part of the connection structure is located in the first cavity and is used to connect the photovoltaic module or the power grid or the load. The connection structure located in the first cavity can realize the input of direct current and the output of alternating current. The first circuit board assembly is located in the second cavity and is electrically connected to another part of the connection structure. The first circuit board assembly includes a first circuit board and a power device. The first circuit board assembly can realize power conversion and convert the input direct current into alternating current.
[0032] The first shell and the first cover body form a first cavity, and the second shell and the second cover body form a second cavity, so that the first circuit board assembly and parts of the connecting structure are arranged in different cavities, thereby realizing chamber management, reducing the failure risk of the first circuit board assembly, reducing mutual interference between the two, and improving the stability and reliability of the inverter.
[0033] At the same time, the second shell includes a bottom plate, the power device is located between the first circuit board and the bottom plate, and the bottom plate also includes a groove sunken toward part of the power device, which can reduce the volume of the inverter and improve the power density of the inverter.
[0034] In a third aspect, an embodiment of the present application provides a photovoltaic system, including an energy storage device and an inverter, wherein the inverter is connected to the energy storage device, and the inverter is used to connect the photovoltaic module and the load.
[0035] The inverter provided in the embodiment of the present application includes the sampling circuit in any of the above embodiments, so the two can solve the same technical problem and achieve the same technical effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0036] Figure 1 is a structural schematic diagram of an inverter in the related art;
[0037] Figure 2 A schematic diagram of the structure of a photovoltaic system provided in an embodiment of the present application;
[0038] Figure 3 The structure of the inverter provided in the embodiment of the present application is shown in FIG. Figure 1 ;
[0039] Figure 4 for Figure 3 AA section view;
[0040] Figure 5 A schematic diagram of the structure of an inverter with a cover removed provided in an embodiment of the present application Figure 1 ;
[0041] Figure 6 A schematic diagram of the structure of an inverter with a cover removed provided in an embodiment of the present application Figure 2 ;
[0042] Figure 7 for Figure 3 BB section view;
[0043] Figure 8 A schematic diagram of the structure in the second cavity provided in an embodiment of the present application;
[0044] Fig. 9 The structure of the inverter provided in the embodiment of the present application is shown in FIG. Figure 2 ;
[0045] Fig.10 for Fig. 9 CC section view.
[0046] Description of reference numerals:
[0047] 10: photovoltaic system; 11: photovoltaic module; 12: load; 13: power grid; 14: energy storage device; 20: inverter; 21: housing; 22: first circuit board assembly; 23: accommodating cavity; 23a: first cavity; 23b: second cavity; 24: second circuit board assembly; 30: connection structure; 31: first connection structure; 32: second connection structure; 33: third connection structure; 34: terminal; 41: first circuit board; 42: power device; 43: second circuit board; 44: electronic device; 45: 5: inductor; 46: capacitor; 47: third circuit board; 51: shell; 51a: first shell; 51b: second shell; 511: bottom plate; 52: cover; 52a: first cover; 52b: second cover; 53: heat sink; 54: groove; 55: partition plate; 61: first through hole; 62: second through hole; 63: thermal pad; 71: DC switch; 72: power tube; 73: bus capacitor; 74: magnetic element; 75: DC-DC conversion circuit; 76: DC-AC conversion circuit. DETAILED DESCRIPTION
[0048] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0049] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.
[0050] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left", "right", "horizontal" and "vertical" are defined relative to the orientation of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to changes in the orientation of the components placed in the drawings.
[0051] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.
[0052] Please refer to Figure 1 , Figure 1 The inverter (Inventor) 20 in the related art includes a housing 21 and a first circuit board assembly 22. The housing 21 includes a shell 51 and a cover 52 that are arranged opposite to each other. The first circuit board assembly 22 includes a first circuit board 41 and a power device 42. The first circuit board 41 is arranged in a cavity surrounded by the housing 21. In the thickness direction of the housing 21, part of the power device 42 has a larger height and is arranged between the first circuit board 41 and the cover 52, and part of the power device 42 has a smaller height and is arranged between the first circuit board 41 and the housing 51.
[0053] It is understandable that the power devices 42 are dispersedly arranged on both sides of the first circuit board 41 , and the gaps between the power devices 42 are relatively large, resulting in the inverter 20 occupying a large space and the inverter 20 having a low power density.
[0054] In an embodiment where the inverter 20 includes a second circuit board assembly 24 , the second circuit board assembly 24 includes a second circuit board 43 and an electronic device 44 . The second circuit board 43 is disposed between the first circuit board 41 and the cover 52 . The electronic device 44 is disposed between the second circuit board 43 and the cover 52 .
[0055] It is understandable that the power device 42 is located between the first circuit board 41 and the second circuit board 43. The distance between the first circuit board 41 and the second circuit board 43 is relatively far, resulting in a relatively long transmission line connecting the first circuit board 41 and the second circuit board 43, which is likely to cause signal attenuation during transmission. At the same time, a higher bracket needs to be provided when the second circuit board 43 is provided, which increases the cost.
[0056] Please refer to Figure 2 The present application provides a photovoltaic system 10, including an inverter 20, a part of the connection structure of the inverter 20 is connected to the photovoltaic module 11, one end of the inverter 20 is connected to the photovoltaic module 11, and the other end of the inverter 20 is connected to the load 12. The inverter 20 can receive direct current from the photovoltaic module 11, convert the direct current into alternating current inside the inverter 20, and transmit the alternating current to the load 12 to supply power to the load 12.
[0057] It is understood that the photovoltaic system 10 includes two main types, a grid-connected photovoltaic system and an off-grid photovoltaic system. In the embodiment where the photovoltaic system 10 includes a grid-connected photovoltaic system, the other end of the inverter 20 is also connected to the power grid 13. When the power generated by the inverter 20 is greater than the power consumption of the load 12, the excess AC power can be transmitted to the power grid 13 for use by the power grid 13. When the power consumption of the load 12 is greater than the power generated by the inverter 20, power can be purchased from the power grid 13.
[0058] In an embodiment where the photovoltaic system 10 includes an off-grid photovoltaic system, the inverter 20 is not connected to the power grid 13, and the photovoltaic system 10 further includes an energy storage device 14, and the inverter 20 is connected to the energy storage device 14. When the electric energy generated by the inverter 20 is greater than the power consumption of the load 12, the excess AC power can be transmitted to the energy storage device 14, and when the electric energy generated by the inverter 20 is less than the power consumption of the load 12, the electric energy in the energy storage device 14 can be transmitted to the load 12 through the inverter 20.
[0059] It can be understood that there are two types of connections between the inverter 20 and the load 12, namely, a grid-connected line and an off-grid line. A splitter is provided between the inverter 20 and the load 12. The inverter 20 is connected to the splitter through the grid-connected line and the off-grid line, respectively, and the splitter is connected to the load 12. The splitter can convert the AC power received by the load 12 so that the AC power generated by the off-grid photovoltaic system or the AC power generated by the grid-connected photovoltaic system is transmitted to the load 12.
[0060] It is understandable that the inverter 20 can also be connected to a management system, and the inverter 20 can transmit parameter information, input voltage, output voltage and other data to the management system, and the management system can control the input and output of the inverter 20 in real time based on the data.
[0061] The inverter 20 can also be connected to a detection device, one end of the detection device is connected to the inverter 20, and the other end of the detection device is connected to the power grid 13. The voltage detection device can detect the amount of electricity transmitted from the inverter 20 to the power grid 13 to prevent the amount of electricity transmitted from the inverter 20 to the power grid 13 from exceeding a preset value and affecting the normal operation of the power grid 13.
[0062] Please refer to Figure 3 and Figure 4 The inverter 20 provided in the present application includes a shell 21, the shell 21 includes a shell 51 and a cover 52 that are relatively arranged, the shell 51 and the cover 52 are arranged to form a receiving cavity 23, the receiving cavity 23 includes a first cavity 23a and a second cavity 23b, and the arrangement direction of the first cavity 23a and the second cavity 23b is perpendicular to the thickness direction of the shell 21.
[0063] The inverter 20 further includes a connection structure 30 and a first circuit board assembly 22. Part of the connection structure 30 is located in the first cavity 23a and is used to connect the photovoltaic assembly 11, the power grid 13, or the load 12. The first circuit board assembly 22 is located in the second cavity 23b and is electrically connected to another part of the connection structure 30. The first circuit board assembly 22 includes a first circuit board 41 and a power device 42. The power device 42 is disposed on the first circuit board 41.
[0064] The connection structure 30 can realize the connection between the first circuit board assembly 22 and the photovoltaic assembly 11 ( Figure 2 The connection structure 30 can also realize the electrical connection between the first circuit board assembly 22 and the power grid 13 ( Figure 2 shown) or load 12 ( Figure 2 The electrical connection between the first circuit board assembly 22 and the power grid 13 is used to transmit the direct current generated by the first circuit board assembly 22 to the load 12 or the power grid 13.
[0065] The housing 51 includes a bottom plate 511, and a heat dissipation fin 53 is provided on a side of the bottom plate 511 away from the power device 42. The power device 42 is located between the first circuit board 41 and the bottom plate 511, and the bottom plate 511 also includes a groove 54 that is recessed toward a portion of the power device 42. It can be understood that the power device 42 generates a large amount of heat when working, and the heat dissipation fin 53 can increase the heat dissipation area of the housing 51 and transfer the heat generated by the power device 42 to the outside air.
[0066] The power device 42 is located between the first circuit board 41 and the bottom plate 511, which reduces the distance between the power device 42 and the heat dissipation fins 53, increases the contact area between the power device 42 and the housing 51, and improves the heat dissipation rate of the power device 42. The power device 42 includes at least one of a DC switch, a power tube, a bus capacitor, a magnetic element, and a capacitor.
[0067] The bottom plate 511 also includes a groove 54 that is recessed toward part of the power device 42. It can be understood that the power device 42 includes a power tube, a capacitor, an inductor, etc. The thickness of the power tube is less than the thickness of the capacitor. The part of the bottom plate 511 corresponding to the power tube is recessed toward the power tube, thereby forming a corresponding groove 54 on the side of the bottom plate 511 that is away from the first circuit board 41.
[0068] The inverter 20 includes a connection structure 30 and a first circuit board assembly 22. Part of the connection structure 30 is located in the first cavity 23a and is used to connect the photovoltaic component 11 or the power grid 13 or the load 12. The connection structure 30 located in the first cavity 23a can realize the input of direct current and the output of alternating current.
[0069] The first circuit board assembly 22 is located in the second cavity 23b and is electrically connected to another part of the connection structure 30. The first circuit board assembly 22 includes a first circuit board 41 and a power device 42. The first circuit board assembly 22 can realize power conversion and convert the input direct current into alternating current. The first circuit board assembly 22 and the connection structure 30 are located in different cavities, which can realize separate cavity management, reduce the failure risk of the first circuit board assembly 22, reduce the mutual interference between the two, and improve the stability and reliability of the inverter 20.
[0070] At the same time, Figure 1 Compared with the related art, the shell 51 of the present application includes a base plate 511, the power device 42 is located between the first circuit board 41 and the base plate 511, and the base plate 511 also includes a groove 54 recessed toward part of the power device 42, which can reduce the volume of the inverter 20, enhance the heat dissipation capacity of the inverter 20, and improve the power density of the inverter 20.
[0071] In the above embodiment, the shell 51 includes a partition plate 55, which is used to separate the shell 51 into a first shell 51a and a second shell 51b, and the cover body 52 includes a first cover body 52a and a second cover body 52b. The first shell 51a, the partition plate 55 and the first cover body 52a are arranged to form a first cavity 23a, and the second shell 51b, the partition plate 55 and the second cover body 52b are arranged to form a second cavity 23b.
[0072] The partition plate 55 divides the housing 51 into a first housing 51a and a second housing 51b, so that the first housing 51a, the partition plate 55 and the first cover 52a are arranged to form a first cavity 23a, and the second housing 51b, the partition plate 55 and the second cover 52b are arranged to form a second cavity 23b. In other words, the partition plate 55 divides the accommodating cavity 23 into a first cavity 23a and a second cavity 23b, so that the first circuit board assembly 22 and parts of the connecting structure 30 are located in different cavities, and when the user operates the connecting structure 30 located in the first cavity 23a, the normal operation of the first circuit board assembly 22 will not be affected.
[0073] Please refer to Figure 5 and Figure 6 In the above embodiment, the connection structure 30 includes a first connection structure 31, which is arranged to penetrate the partition plate 55, a portion of the first connection structure 31 is located in the first cavity 23a and is electrically connected to the first circuit board 41, and another portion of the first connection structure 31 is located in the second cavity 23b and is connected to the photovoltaic component 11.
[0074] It is understandable that the partition plate 55 may be provided with a first through hole 61, and the first connecting structure 31 may pass through the first through hole 61 to connect with the first circuit board 41 and the photovoltaic module 11 ( Figure 2 as shown) connection.
[0075] The first connection structure 31 is connected to the first circuit board 41 and the photovoltaic assembly 11 respectively, so that the direct current generated by the photovoltaic assembly 11 can be transmitted to the first circuit board 41 and converted into alternating current on the first circuit board 41 .
[0076] In some embodiments, a rubber pad may be provided between the partition plate 55 and the first connection structure 31. The material of the rubber pad is soft and can be deformed. There may be a gap between the partition plate 55 and the first connection structure 31. The rubber pad can fill the gap to improve the airtightness of the first cavity 23a and the second cavity 23b.
[0077] In the above embodiment, the first shell 51a and the first cover 52a are detachably connected. The embodiment of the present application does not limit the connection method of the first shell 51a and the first cover 52a. For example, the first shell 51a and the first cover 52a can be connected by a bolt structure, or the first shell 51a and the first cover 52a can also be connected by a buckle structure.
[0078] The first cover 52a and the first shell 51a are detachably connected, so that the first shell 51a can be used alone, and the opening and closing of the first cover 52a will not affect the state of the second cover 52b. The first shell 51a and the first cover 52a are detachably connected, which is convenient for opening the first cover 52a and checking the connection structure 30 in the first cavity 23a.
[0079] In the above embodiment, the first connection structure 31 includes a through-wall terminal 34. It is understandable that the first connection structure 31 is used to transmit the direct current generated by the photovoltaic assembly 11, that is, the first connection structure 31 can be a photovoltaic (PV) through-wall terminal.
[0080] Continue to refer to Figure 5 and Figure 6 In the above embodiment, the connection structure 30 further includes a second connection structure 32, which is arranged through the partition plate 55, a portion of the second connection structure 32 is located in the first cavity 23a and is electrically connected to the first circuit board 41, and another portion of the second connection structure 32 is located in the second cavity 23b and is respectively connected to the load 12 ( Figure 2 shown) and power grid 13 ( Figure 2 as shown) connection.
[0081] It can be understood that the partition plate 55 may be provided with a second through hole 62 , and the second connection structure 32 may pass through the second through hole 62 to be connected to the first circuit board 41 , the load 12 , and the power grid 13 , respectively.
[0082] The second connection structure 32 is connected to the first circuit board 41 , the load 12 and the grid 13 respectively, that is, the alternating current generated by the first circuit board assembly 22 can be used in the grid-connected photovoltaic system to supply power to the grid 13 and the load 12 .
[0083] Since the second connection structure 32 is used to transmit the alternating current generated by the inverter 20 , in the embodiment where the connection structure 30 is a through-wall terminal, the second connection structure 32 may be an alternating current (AC) through-wall terminal.
[0084] In some embodiments, a rubber pad is also provided between the partition plate 55 and the second connection structure 32 to improve the airtightness of the first cavity 23a and the second cavity 23b. Similar to the rubber pad in the above embodiment, it will not be described again.
[0085] Please refer to Figure 5 , Figure 6 and Figure 7 In the above embodiment, the inverter 20 further includes a second circuit board assembly 24, which is located in the second cavity 23b. The second circuit board assembly 24 includes a second circuit board 43, a capacitor 46 and an inductor 45, the second circuit board 43 is electrically connected to the first circuit board 41, and the capacitor 46 and the inductor 45 are both arranged on the second circuit board 43.
[0086] The inverter 20 also includes a third connection structure 33, which is arranged to penetrate the partition plate 55, a portion of the third connection structure 33 is located in the first cavity 23a and is electrically connected to the second circuit board 43, and a portion of the third connection structure 33 is located in the second cavity 23b and is connected to the load 12.
[0087] The second circuit board 43 is electrically connected to the first circuit board 41 , and the third connection structure 33 is respectively connected to the second circuit board 43 and the load 12 , that is, the alternating current generated by the first circuit board 41 can be transmitted to the second circuit board 43 , and then transmitted to the load 12 by the second circuit board 43 through the third connection structure 33 .
[0088] It is understandable that the third connection structure 33 is only connected to the load 12 and can be used in an off-grid photovoltaic system. The second circuit board 43 is used to transmit alternating current, so that the alternating current generated by the first circuit board 41 can be transmitted to the load 12. The second circuit board 43 can also be called an output board.
[0089] The capacitor 46 and the inductor 45 can form a filter circuit. Since the alternating current will generate a changing electric field and magnetic field during the transmission process, thereby generating electromagnetic interference, the filter circuit can suppress the electromagnetic interference and ensure the quality of the output alternating current.
[0090] At the same time, the second circuit board assembly 24 is located in the second cavity 23b. Compared with the embodiment in which the second circuit board assembly 24 is located in the first cavity 23a, the risk of electric shock caused by possible contact with the second circuit board assembly 24 when the user operates the connecting structure 30 in the first cavity 23a can be reduced, corrosion of the second circuit board assembly 24 caused by frequent exposure can be avoided, and the reliability of the operation of the inverter 20 can be improved.
[0091] In addition, the capacitor 46 can filter high-frequency interference signals, and the inductor 45 can filter low-frequency interference signals, thereby reducing electromagnetic interference and ensuring the stability and reliability of the circuit.
[0092] In some embodiments, a third through hole is provided on the partition plate 55 , and the third connection structure 33 can pass through the third through hole to be connected to the second circuit board 43 and the load 12 respectively.
[0093] In some embodiments, the second connection structure 32 and the third connection structure 33 are an integrated structure. The second connection structure 32 located in the second cavity 23b can be connected to the first circuit board 41 through the first copper busbar, and the third connection structure 33 can be connected to the second circuit board 43 through the second copper busbar.
[0094] The second connection structure 32 and the third connection structure 33 are an integrated structure, which can reduce the manufacturing cost and processing steps. In addition, the second connection structure 32 and the third connection structure 33 need to penetrate the partition plate 55. The second connection structure 32 and the third connection structure 33 are an integrated structure, which can reduce the number of openings on the partition plate 55 and ensure the airtightness of the first cavity 23a and the second cavity 23b.
[0095] In some embodiments, a rubber pad is also provided between the partition plate 55 and the third connection structure 33 to improve the airtightness of the first cavity 23a and the second cavity 23b. Similar to the rubber pad in the above embodiment, it will not be described again.
[0096] Please refer to Figure 7 In the above embodiment, the end of the plurality of heat dissipating fins 53 facing away from the housing 51 is flushly arranged. It can be understood that the bottom plate 511 includes a groove 54 recessed toward a portion of the power device 42, that is, the length of the heat dissipating fin 53 in the groove 54 is greater than the length of the remaining heat dissipating fins 53 on the housing 51, so that the end of the plurality of heat dissipating fins 53 facing away from the housing 51 can be flushly arranged.
[0097] The multiple heat dissipation fins 53 are arranged flush with one end of the housing 51, which helps to optimize the airflow distribution and ensure that the air can evenly contact each fin when passing through the heat dissipation fins 53, avoiding excessive or insufficient airflow in some areas.
[0098] In the above embodiment, a thermal pad 63 is provided on one side of the power device 42 close to the housing 51 , and the power device 42 is in contact with the housing 51 through the thermal pad 63 .
[0099] The thermal pad 63 can fill the air gap between the power device 42 and the housing 51, so that the power device 42 can fully contact the housing 51, increase the heat dissipation area, and improve the heat dissipation rate. At the same time, the thermal pad 63 has a high thermal conductivity, which can further improve the heat dissipation rate.
[0100] Continue to refer to Figure 6 and Figure 7 In the above embodiment, the inverter 20 further includes a DC switch 71 , one end of the DC switch 71 is connected to another part of the first connection structure 31 , and the other end of the DC switch 71 is connected to the first circuit board 41 .
[0101] One end of the DC switch 71 is used to connect to the photovoltaic module 11 ( Figure 2 As shown), the other end of the DC switch 71 is connected to the first circuit board 41, and the DC switch 71 can control whether the DC power from the photovoltaic component 11 can be transmitted to the first circuit board 41.
[0102] Please refer to Figure 7 and Figure 8 In the above embodiment, the power device 42 includes a power tube 72 , a bus capacitor 73 , and a magnetic element 74 .
[0103] It is understandable that the power tube 72 and the magnetic element 74 can form a DC-DC (Direct Current to Direct Current) conversion circuit 75 and a DC-AC (Direct Current to Alternating Current) conversion circuit 76 to achieve conversion from DC to DC and from DC to AC.
[0104] The bus capacitor 73 can be connected to the output end of the DC-DC conversion circuit 75 and the input end of the DC-AC conversion circuit 76 respectively. The bus capacitor 73 can store energy and reduce the fluctuation of direct current to ensure the stability of the output alternating current. When the output alternating current voltage changes, the bus capacitor 73 can stabilize the output of alternating current by storing and releasing charges. The bus capacitor 73 can also prevent the voltage and current in the circuit from being too large and protect other power devices 42.
[0105] Continue to refer to Figure 5 In the above embodiment, the inverter 20 further includes a third circuit board 47, which is located in the first cavity 23a, and is electrically connected to the first circuit board 41, and is used to connect to the communication device.
[0106] The third circuit board 47 can realize data transmission between the communication device and the inverter 20. The communication device can obtain the parameter settings of the inverter 20 through the third circuit board 47, and monitor the output voltage, output current, output power and other parameters of the inverter 20 in real time to ensure the stability of the operating state of the inverter 20.
[0107] It is understandable that the voltage on the third circuit board 47 is a safety extra-low voltage (SELV). When the user opens the first cover 52 a to operate the connection structure 30 , there is no risk of electric shock even if the user touches the third circuit board 47 .
[0108] In some embodiments, a fourth through hole is disposed on the partition plate 55 , and the terminal 34 can pass through the fourth through hole to be connected to the third circuit board 47 and the first circuit board 41 respectively.
[0109] In some embodiments, a rubber pad is also provided between the partition plate 55 and the terminal 34 to improve the airtightness of the first cavity 23a and the second cavity 23b. Similar to the rubber pad in the above embodiment, it will not be described again.
[0110] Please refer to Fig. 9 and Fig.10 The embodiment of the present application also provides an inverter 20, including a housing 21, a connection structure 30 and a first circuit assembly. The housing 21 includes a shell 51 and a cover 52 arranged opposite to each other, the shell 51 includes a first shell 51a and a second shell 51b, the cover 52 includes a first cover 52a and a second cover 52b, the first shell 51a and the first cover 52a are arranged opposite to each other and connected to each other, and the second shell 51b and the second cover 52b are arranged opposite to each other and are detachably connected. The first shell 51a and the first cavity 23a enclose a first cavity 23a, the second shell 51b and the second cover 52b enclose a second cavity 23b, and the arrangement direction of the first cavity 23a and the second cavity 23b is perpendicular to the thickness direction of the housing 21.
[0111] The connection structure 30 is located in the first cavity 23a and is used to connect the photovoltaic module 11 ( Figure 2 as shown) or power grid 13 ( Figure 2 shown) or load 12 ( Figure 2 The first circuit assembly is located in the second cavity 23 b and connected to another part of the connection structure 30 . The first circuit assembly includes a first circuit board 41 and a power device 42 . The power device 42 is disposed on the first circuit board 41 .
[0112] The connection structure 30 can realize the electrical connection between the first circuit board assembly 22 and the photovoltaic assembly 11, and transmit the direct current to the first circuit board assembly 22. The first circuit board assembly 22 includes a power device 42, and the power device 42 can realize the conversion from alternating current to direct current. The connection structure 30 can also realize the electrical connection between the first circuit board assembly 22 and the power grid 13 or the load 12, and transmit the direct current generated by the first circuit board assembly 22 to the load 12 or the power grid 13.
[0113] The second housing 51b includes a bottom plate 511, a heat dissipation fin 53 is provided on a side of the bottom plate 511 away from the power device 42, the power device 42 is located between the first circuit board 41 and the bottom plate 511, and the bottom plate 511 also includes a groove 54 that is recessed toward a portion of the power device 42. It can be understood that the power device 42 generates a large amount of heat when working, and the heat dissipation fin 53 can increase the heat dissipation area of the housing 51 and transfer the heat generated by the power device 42 to the outside air.
[0114] The power device 42 is located between the first circuit board 41 and the bottom plate 511 , which reduces the distance between the power device 42 and the heat dissipation fins 53 , increases the contact area between the power device 42 and the second housing 51 b , and improves the heat dissipation rate of the power device 42 .
[0115] The bottom plate 511 also includes a groove 54 that is recessed toward a portion of the power device 42. It can be understood that the power device 42 includes a power tube 72, a capacitor 46, an inductor 45, etc. The thickness of the power tube 72 is less than the thickness of the capacitor 46. The portion of the bottom plate 511 corresponding to the power tube 72 is recessed toward the power tube 72, thereby forming a corresponding groove 54 on the side of the bottom plate 511 that is away from the first circuit board 41.
[0116] The inverter 20 includes a connection structure 30 and a first circuit board assembly 22. Part of the connection structure 30 is located in the first cavity 23a and is used to connect the photovoltaic component 11 or the power grid 13 or the load 12. The connection structure 30 located in the first cavity 23a can realize the input of direct current and the output of alternating current.
[0117] The first circuit board assembly 22 is located in the second cavity 23b and is electrically connected to another part of the connection structure 30. The first circuit board assembly 22 includes a first circuit board 41 and a power device 42. The first circuit board assembly 22 can realize power conversion and convert the input direct current into alternating current.
[0118] The first shell 51a and the first cover 52a form a first cavity 23a, and the second shell 51b and the second cover 52b form a second cavity 23b, so that parts of the first circuit board assembly 22 and the connecting structure 30 are arranged in different cavities, thereby realizing chamber management, reducing the failure risk of the first circuit board assembly 22, reducing mutual interference between the two, and improving the stability and reliability of the inverter 20.
[0119] At the same time, the second shell 51b includes a base plate 511, and the power device 42 is located between the first circuit board 41 and the base plate 511. The base plate 511 also includes a groove 54 that is recessed toward part of the power device 42, which can reduce the volume of the inverter 20 and improve the power density of the inverter 20.
[0120] In addition to being applied to inverters, the present application can also be applied to vehicle chargers, uninterruptible power supplies (UPS), etc.
[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. An inverter, characterized in that: include: The housing comprises a shell and a cover body which are arranged opposite to each other, wherein the shell and the cover body are arranged to form a receiving cavity, wherein the receiving cavity comprises a first cavity and a second cavity, and an arrangement direction of the first cavity and the second cavity is perpendicular to a thickness direction of the housing; A connection structure, part of which is located in the first cavity and is used to connect a photovoltaic module or a power grid or a load; a first circuit board assembly, located in the second cavity and electrically connected to another part of the connection structure, wherein the first circuit board assembly comprises a first circuit board and a power device, and the power device is arranged on the first circuit board; The housing comprises a bottom plate, a heat dissipation fin is arranged on a side of the bottom plate away from the power device, the power device is located between the first circuit board and the bottom plate, and the bottom plate further comprises a groove sunken toward a portion of the power device; The power devices include power tubes, bus capacitors, and magnetic elements.
2. The inverter according to claim 1, characterized in that: The shell includes a partition plate, which is used to separate the shell into a first shell and a second shell; the cover body includes a first cover body and a second cover body, the first cover body, the partition plate and the first shell are arranged to form the first cavity, and the second cover body, the partition plate and the second shell are arranged to form the second cavity.
3. The inverter according to claim 2, characterized in that: The first shell and the first cover are detachably connected.
4. The inverter according to any one of claims 1 to 3, characterized in that: The connection structure includes a first connection structure, which is arranged to penetrate the partition plate, a portion of the first connection structure is located in the first cavity and is electrically connected to the first circuit board, and another portion of the first connection structure is located in the second cavity and is connected to the photovoltaic component.
5. The inverter according to claim 4, characterized in that: The first connection structure includes a through-wall terminal.
6. The inverter according to claim 4 or 5, characterized in that: The inverter further includes a DC switch, one end of which is connected to another part of the first connection structure, and the other end of which is connected to the first circuit board.
7. The inverter according to any one of claims 1 to 6, characterized in that: The connection structure also includes a second connection structure, which is arranged to pass through the partition plate, a portion of the second connection structure is located in the first cavity and is electrically connected to the first circuit board, and another portion of the second connection structure is located in the second cavity and is respectively connected to the load and the power grid.
8. The inverter according to any one of claims 1 to 7, characterized in that: The inverter further includes a second circuit board assembly, wherein the second circuit board assembly is located in the second cavity; The second circuit board assembly includes a second circuit board, a capacitor and an inductor, the second circuit board is electrically connected to the first circuit board, the capacitor and the inductor are both arranged on the second circuit board, the second circuit board is located between the first circuit board and the top plate of the cover body, and the capacitor and the inductor are both located between the second circuit board and the top plate of the cover body; The inverter also includes a third connection structure, which is arranged to pass through the partition plate, a portion of the third connection structure is located in the first cavity and is electrically connected to the second circuit board, and a portion of the third connection structure is located in the second cavity and is connected to the load.
9. The inverter according to any one of claims 1 to 8, characterized in that: The plurality of heat dissipation fins are arranged flush with one end facing away from the housing.
10. The inverter according to any one of claims 1 to 9, characterized in that: A heat-conducting pad is arranged on one side of the power device close to the housing, and the power device is in contact with the housing through the heat-conducting pad.
11. The inverter according to any one of claims 1 to 10, characterized in that: The inverter further includes a third circuit board, which is located in the first cavity, electrically connected to the first circuit board, and is used to connect to a communication device.
12. An inverter, characterized in that: include: The housing comprises a shell and a cover body which are arranged opposite to each other, the shell comprises a first shell and a second shell, the cover body comprises a first cover body and a second cover body, the first shell and the first cover body are arranged opposite to each other and connected to each other, and the second shell and the second cover body are arranged opposite to each other and are detachably connected; The first shell and the first cover body enclose a first cavity, the second shell and the second cover body enclose a second cavity, and the arrangement direction of the first cavity and the second cavity is perpendicular to the thickness direction of the shell; A connection structure, part of which is located in the first cavity and is used to connect a photovoltaic module or a power grid or a load; A first circuit component is located in the second cavity and connected to another part of the connecting structure. The first circuit component includes a first circuit board and a power device. The power device is arranged on the first circuit board. The second shell includes a bottom plate. A heat dissipation fin is arranged on the side of the bottom plate away from the power device. The power device is located between the first circuit board and the bottom plate. The bottom plate also includes a groove recessed toward part of the power device.
13. A photovoltaic system, characterized in that: It comprises an energy storage device and the inverter according to any one of claims 1 to 12, wherein the inverter is connected to the energy storage device, and the inverter is used to connect a photovoltaic module and a load.