Method, device and equipment for processing laser deep blind hole of printed circuit board

Abstract

The invention provides a laser deep blind hole processing method, device and equipment for a printed circuit board. The method comprises the following steps: drilling an insulating layer based on preset drilling parameters; assembling the drilled insulating layer and the substrate to obtain a combined layer, and arranging a copper foil on the top layer of the combined layer; the combined layer comprises a plurality of insulating layers and a plurality of substrates from bottom to top, and the insulating layers and the substrates are alternately arranged; carrying out brownification treatment on the combined layer after high-temperature pressing; and performing laser processing on the combined layer after browning processing to obtain the printed circuit board with the blind hole. According to the method, the insulating layer is drilled in advance, then the insulating layer is combined and pressed, and finally, the printed circuit board is subjected to final processing by adopting the laser to generate the blind hole, so that no glass fiber exists around the blind hole, the situation that the glass fiber protrudes is avoided, and the risk of hole bottom breakdown is also avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production technology, and in particular to a method, device and equipment for laser deep blind hole processing of a printed circuit board. Background Art

[0002] For high-density interconnect (HDI) boards, for traditional boards, blind holes are used to achieve conduction between layers. Blind holes are generally processed using lasers, that is, high-energy laser beams are used to ablate the copper surface and substrate of printed circuit boards (PCBs). Deep blind holes are those with an insulation layer of more than 6 mil. During normal laser processing, there should be no hole bottom breakdown, residual glue at the bottom of the hole, or protruding glass fibers. However, for deep blind holes, since the beam will be concentrated at one point, using traditional processing methods, since the absorption rate of glass fiber to energy is lower than that of resin, it is easy to cause glass fiber protrusion and residual glue at the bottom of the hole, which affects heat resistance. Increasing the laser energy is prone to hole bottom breakdown.

[0003] In the related technology, the copper sheet above the blind hole is etched away by a conformal method, and then a laser hole expansion material design is used to solve the problem of residual glue at the bottom of the hole through methods such as low energy and multiple rescues. However, the conformal method requires laser window opening in advance, which takes a long time, and there will be overlaps during processing, and the beam focus remains unchanged, which cannot fundamentally solve the problem of residual glue in the hole and protruding glass fiber. Summary of the invention

[0004] The present disclosure provides a method, device and equipment for laser deep blind hole processing of a printed circuit board, so as to at least solve the above technical problems existing in the prior art.

[0005] According to a first aspect of the present disclosure, a method for laser deep blind hole processing of a printed circuit board is provided, the method comprising:

[0006] Drilling the insulation layer based on preset drilling parameters;

[0007] Assembling the drilled insulating layer and the substrate to obtain a combined layer, wherein the top layer of the combined layer is provided with a copper foil; the combined layer comprises a plurality of insulating layers and a plurality of substrates from bottom to top, wherein the insulating layers and the substrates are alternately arranged;

[0008] After the combined layer is pressed at high temperature, browning treatment is performed;

[0009] The combined layer after the browning treatment is laser processed to obtain a printed circuit board with blind holes.

[0010] In one possible implementation manner, the drilling includes a positioning hole and a blind hole, and the drilling of the insulating layer based on preset drilling parameters includes:

[0011] Based on the positioning holes on the substrate, a drilling machine is used to drill the insulating layer for the first time to obtain positioning holes; the positions of the positioning holes correspond to the positions of the positioning holes on the substrate;

[0012] The insulating layer with the positioning hole is drilled for a second time based on preset drilling parameters to obtain a target hole; wherein the second drilling has a different drilling diameter from the first drilling.

[0013] In one embodiment, the drilling parameters include:

[0014] Rotation speed, feed rate and target hole diameter;

[0015] Wherein, the rotation speed is 250 rpm, the feed speed is 0.003 mm / rev, and the target hole diameter is 0.2 mm.

[0016] In one embodiment, the high temperature pressing of the combined layer comprises:

[0017] Performing high temperature pressing on the combined layer based on high temperature pressing parameters;

[0018] The high temperature pressing parameters include: a temperature rise rate of 3-5 degrees Celsius / minute, a temperature higher than 180 degrees Celsius, a pressing time greater than 90 minutes, and a pressure of 175 pounds per square inch.

[0019] In one embodiment, the browning treatment comprises:

[0020] The copper surface of the copper foil is subjected to browning treatment.

[0021] In one possible implementation manner, assembling the drilled insulating layer with the substrate comprises:

[0022] The positioning holes of the insulating layer and the positioning holes of the substrate are riveted together by using rivets.

[0023] In one possible implementation manner, the number of positioning holes or substantially the number of positioning holes in the insulating layer are four.

[0024] In one possible implementation manner, a drill is used to drill the insulating layer based on preset drilling parameters.

[0025] According to a second aspect of the present disclosure, a laser deep blind hole processing device for a printed circuit board is provided, the device comprising:

[0026] A drilling module, used for drilling holes in the insulation layer based on preset drilling parameters;

[0027] A combination module is used to assemble the drilled insulating layer and the substrate to obtain a combination layer, wherein the top layer of the combination layer is provided with a copper foil; the combination layer comprises a plurality of insulating layers and a plurality of substrates from bottom to top, wherein the insulating layers and the substrates are alternately arranged;

[0028] A processing module, used for performing browning treatment on the combined layer after high-temperature pressing;

[0029] The processing module is used to perform laser processing on the combined layer after the browning treatment to obtain a printed circuit board with blind holes.

[0030] According to a third aspect of the present disclosure, there is provided an electronic device, including:

[0031] at least one processor; and

[0032] a memory communicatively connected to the at least one processor; wherein,

[0033] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method described in the present disclosure.

[0034] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause the computer to execute the method described in the present disclosure.

[0035] The laser deep blind hole processing method, device and equipment of the printed circuit board disclosed in the present invention utilizes pre-drilling of the insulating layer and then assembling and pressing them together before finally using laser to perform final processing on the printed circuit board to produce blind holes, which can eliminate glass fibers around the blind holes, avoid protrusion of glass fibers, and avoid the risk of breakdown at the bottom of the hole.

[0036] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0038] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0039] Figure 1 A schematic diagram showing the process of a laser deep blind hole processing method for a printed circuit board according to an embodiment of the present disclosure is shown;

[0040] Figure 2 A schematic diagram of the structure of the combined layer of an embodiment of the present disclosure is shown;

[0041] Figure 3 A schematic diagram of the insulating layer positioning hole according to the embodiment of the present disclosure is shown.

[0042] Figure 4 A schematic diagram of a target hole in an insulating layer according to an embodiment of the present disclosure is shown;

[0043] Figure 5 A comparison diagram of blind holes obtained by the laser deep blind hole processing method of the printed circuit board according to the embodiment of the present disclosure and blind holes in the prior art is shown;

[0044] Figure 6 An example diagram of a blind hole obtained by a laser deep blind hole processing method for a printed circuit board according to an embodiment of the present disclosure is shown;

[0045] Figure 7 A schematic diagram showing the structure of a laser deep blind hole processing device for a printed circuit board according to an embodiment of the present disclosure is shown;

[0046] Figure 8 A schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0047] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0048] At present, the insulating layer materials used in the products are all made of resin materials containing glass fiber. There is consideration of not using glass fiber, but the board will bend and warp, resulting in empty welding during the assembly process. So glass fiber exists, but this material absorbs light very poorly. Therefore, a large amount of energy is required for cutting. The window of laser processing parameters is very narrow. If the energy is too low, the glass fiber will protrude, and if the energy is too high, the bottom of the hole will be punctured. The current hole defect scrap rate is about 0.5%. By adopting the new processing flow of this application, there is no network skip via breakdown or glass fiber residue, and at the same time, the ability to resist glass fiber bundle leakage (Conductive Anodic Filament, CAF) is improved, which is increased by about 1500 hours from 1000 hours.

[0049] The present application provides a method, device and equipment for laser deep blind hole processing of a printed circuit board, which will be described below in conjunction with the accompanying drawings.

[0050] like Figure 1 As shown, the present application provides a method for laser deep blind hole processing of a printed circuit board, the method comprising:

[0051] S101, drilling the insulation layer based on preset drilling parameters;

[0052] The drilling parameters in this application can be pre-set, and then the insulating layer is drilled using the set drilling parameters. In other words, the insulating layer is pre-drilled in this application, and then combined with the substrate, thereby achieving skip via holes without glass fiber.

[0053] S102, assembling the drilled insulating layer and the substrate to obtain a composite layer, wherein a copper foil is provided on the top of the composite layer; the composite layer comprises a plurality of insulating layers and a plurality of substrates from bottom to top, wherein the insulating layers and the substrates are alternately arranged;

[0054] like Figure 2 As shown, in the present application, the insulating layer and the substrate are alternately assembled to obtain a combined layer, and finally a copper foil layer is arranged on the top of the combined layer. In the present application, both the insulating layer and the substrate are multiple.

[0055] S103, performing browning treatment on the combined layer after high-temperature pressing;

[0056] The combined layers are laminated at high temperature, and then the top copper foil is browned to increase the roughness.

[0057] S104, laser processing is performed on the combined layer after the browning treatment to obtain a printed circuit board with blind holes.

[0058] Finally, the required aperture can be processed using a 3.3 mm mask to obtain a printed circuit board with blind holes.

[0059] In the present application, blind holes are produced by drilling holes in the insulating layer using pre-set drilling parameters, then combining and pressing them together, and finally using laser to perform final processing on the printed circuit board. By pre-drilling holes in the insulating layer, then combining and pressing them together, and finally using laser to perform final processing on the printed circuit board, there is no glass fiber around the blind hole, thus avoiding the protrusion of glass fiber and the risk of breakdown at the bottom of the hole.

[0060] In some embodiments, the drilling includes a positioning hole and a blind hole, and the drilling of the insulating layer based on preset drilling parameters includes:

[0061] Based on the positioning holes on the substrate, a drilling machine is used to drill the insulating layer for the first time to obtain positioning holes; the positions of the positioning holes correspond to the positions of the positioning holes on the substrate;

[0062] The insulating layer with the positioning hole is drilled for a second time based on preset drilling parameters to obtain a target hole; wherein the second drilling has a different drilling diameter from the first drilling.

[0063] It should be noted that if Figure 3 As shown, the substrate is provided with positioning holes, therefore, a drilling machine can be used to drill the insulating layer for the first time, and the position of the drilling hole is the same as the position of the positioning hole on the substrate, and then the insulating layer with the positioning hole is drilled for the second time according to the preset drilling parameters, such as Figure 4 As shown, a target hole is obtained, wherein the aperture of the target hole is different from the aperture of the positioning hole, and the aperture of the target hole is smaller than the aperture of the positioning hole.

[0064] In some embodiments, the drilling parameters include:

[0065] Rotation speed, feed rate and target hole diameter;

[0066] Wherein, the rotation speed is 250 revolutions per minute (r / min), the feed speed is 0.003 millimeters per revolution (mm / r), and the target hole diameter is 0.2 millimeters (mm).

[0067] In some embodiments, a UC needle is used to drill the insulating layer based on preset drilling parameters.

[0068] Specifically, based on the positioning hole, the drilling machine in this application uses an Under Cut Drill (UC) needle to drill holes in the insulation layer based on preset drilling parameters. When drilling, the rotation speed of the UC needle is 250r / min, and the feed speed is 0.003mm / r. This application uses a UC (under cut drill) needle, where the drilling hole diameter is the blind hole size + 0.2mm, the glue flow in the insulation layer is 0.4mm, the network skip via hole is directly about 0.2mm, the drilling alignment offset is 0.15mm, and a 0.05mm edge is reserved.

[0069] In some embodiments, the step of assembling the drilled insulating layer with the substrate includes:

[0070] The positioning holes of the insulating layer and the positioning holes of the substrate are riveted together by using rivets.

[0071] The insulating layer has four positioning holes or substantially four positioning holes.

[0072] After drilling holes in the insulation layer, use rivets to rivet the insulation layer and the positioning holes of the substrate to prevent the insulation layer from sliding during the pressing process. Figure 3 and Figure 4As shown, the positioning holes on the insulating layer and the substrate are all set at the four corners. After the positioning holes of the insulating layer and the substrate are riveted with rivets, the insulating layer and the substrate are fixed, so that the insulating layer is fixed during the pressing process and will not slide.

[0073] In some embodiments, the high temperature pressing of the combined layer comprises:

[0074] Performing high temperature pressing on the combined layer based on high temperature pressing parameters;

[0075] The high temperature pressing parameters include: a temperature rise rate of 3-5 degrees Celsius per minute (°C / min), a temperature higher than 180 degrees Celsius, a pressing time greater than 90 minutes (min), and a pressure of 175 pounds per square inch (PSI).

[0076] The copper surface of the copper foil is subjected to browning treatment.

[0077] It can be understood that in this application, the temperature rise rate is 3-5℃ / min, the temperature is >180 degrees Celsius for 90min, and the pressure is 175PSI. The composite layer is pressed at high temperature, and then the copper surface of the copper foil is surface treated using a browning process to increase the roughness.

[0078] Finally, the required aperture can be processed using a 3.3mm mask. Since there is no glass fiber, there is no risk of glass fiber protrusion, and the number of laser parameter shots can be adjusted from 36 to 6.

[0079] It should be noted that the present application pre-drills holes in the insulating layer, and then combines, presses, browns and lasers to form skip via holes. In a specific embodiment, Figure 5 As shown, compared with the skip via holes in the prior art, the skip via holes formed by the technical solution of the present application have no glass fibers around them, which reduces the risk of CAF and the risk of glass fiber and hole bottom breakdown after laser irradiation. Figure 6 As shown, in actual tests, the skip via obtained by the technical solution of the present application does not have glass fiber cloth, and the laser light does not need to cut the glass fiber. The number of rounds is reduced from the original 30 to the current 6. The skip via obtained by the technical solution of the present application is reliable, and the difficulty of laser processing is reduced.

[0080] like Figure 7 As shown, the present application provides a laser deep blind hole processing device for a printed circuit board, the device comprising:

[0081] A drilling module 701, used for drilling holes in the insulating layer based on preset drilling parameters;

[0082] A combination module 702 is used to assemble the drilled insulating layer and the substrate to obtain a combination layer, wherein the top layer of the combination layer is provided with a copper foil; the combination layer comprises a plurality of insulating layers and a plurality of substrates from bottom to top, wherein the insulating layers and the substrates are alternately arranged;

[0083] A processing module 703 is used to perform a browning treatment on the combined layer after high-temperature pressing;

[0084] The processing module 704 is used to perform laser processing on the combined layer after the browning treatment to obtain a printed circuit board with blind holes.

[0085] The laser deep blind hole processing device for a printed circuit board provided in the present application comprises a drilling module 601 which drills a hole in the insulating layer based on preset drilling parameters; a combination module 602 assembles the drilled insulating layer with a substrate to obtain a combination layer, wherein a copper foil is provided on the top layer of the combination layer; the combination layer comprises a plurality of insulating layers and a plurality of substrates from bottom to top, wherein the insulating layers and the substrates are alternately arranged; a processing module 603 performs browning treatment on the combination layer after high-temperature pressing; and a processing module 604 performs laser processing on the browned combination layer to obtain a printed circuit board with blind holes.

[0086] It should be noted that the laser deep blind hole processing device for the printed circuit board of the embodiment of the present application, since the principle of solving the problem by the laser deep blind hole processing device for the printed circuit board is similar to the aforementioned laser deep blind hole processing method for the printed circuit board, the implementation process, implementation principle, and beneficial effects of the laser deep blind hole processing device for the printed circuit board can all be referred to the description of the implementation process, implementation principle, and beneficial effects of the aforementioned method, and the repeated parts will not be repeated.

[0087] An embodiment of the present application provides an electronic device, including:

[0088] at least one processor; and

[0089] a memory communicatively connected to the at least one processor; wherein,

[0090] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method described in any one of the above embodiments.

[0091] An embodiment of the present application provides a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a computer to execute the method described in any of the above embodiments.

[0092] According to an embodiment of the present application, the present application also provides an electronic device and a readable storage medium.

[0093] Figure 8A schematic block diagram of an example electronic device 800 that can be used to implement an embodiment of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or required herein.

[0094] like Figure 8 As shown, the device 800 includes a computing unit 801, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 802 or a computer program loaded from a storage unit 808 into a random access memory (RAM) 803. In the RAM 803, various programs and data required for the operation of the device 800 can also be stored. The computing unit 801, the ROM 802, and the RAM 803 are connected to each other via a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0095] A number of components in the device 800 are connected to the I / O interface 805, including: an input unit 806, such as a keyboard, a mouse, etc.; an output unit 807, such as various types of displays, speakers, etc.; a storage unit 808, such as a disk, an optical disk, etc.; and a communication unit 809, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 809 allows the device 800 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0096] The computing unit 801 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 801 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 801 performs the various methods and processes described above, such as a laser deep blind hole processing method for a printed circuit board. For example, in some embodiments, the laser deep blind hole processing method for a printed circuit board may be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 808. In some embodiments, part or all of the computer program may be loaded and / or installed on the device 800 via the ROM 802 and / or the communication unit 809. When the computer program is loaded into the RAM 803 and executed by the computing unit 801, one or more steps of the laser deep blind hole processing method for a printed circuit board described above may be performed. Alternatively, in other embodiments, the computing unit 801 may be configured to execute the laser deep blind hole processing method for a printed circuit board in any other appropriate manner (for example, by means of firmware).

[0097] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0098] The program code for implementing the method of the present disclosure may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0099] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0100] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0101] The systems and techniques described herein may be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0102] A computer system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship of client and server is generated by computer programs running on respective computers and having a client-server relationship with each other. The server may be a cloud server, a server of a distributed system, or a server combined with a blockchain.

[0103] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0104] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0105] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A method for laser deep blind hole processing of a printed circuit board, characterized in that: The method comprises: Drilling the insulation layer based on preset drilling parameters; Assembling the drilled insulating layer and the substrate to obtain a combined layer, wherein the top layer of the combined layer is provided with a copper foil; the combined layer comprises a plurality of insulating layers and a plurality of substrates from bottom to top, wherein the insulating layers and the substrates are alternately arranged; After the combined layer is pressed at high temperature, browning treatment is performed; The combined layer after the browning treatment is laser processed to obtain a printed circuit board with blind holes.

2. The method according to claim 1, characterized in that The drilling includes positioning holes and blind holes, and the drilling of the insulating layer based on preset drilling parameters includes: Based on the positioning holes on the substrate, a drilling machine is used to drill the insulating layer for the first time to obtain positioning holes; the positions of the positioning holes correspond to the positions of the positioning holes on the substrate; The insulating layer with the positioning hole is drilled for a second time based on preset drilling parameters to obtain a target hole; wherein the second drilling has a different drilling diameter from the first drilling.

3. The method according to claim 2, characterized in that The drilling parameters include: Rotation speed, feed rate and target hole diameter; Wherein, the rotation speed is 250 rpm, the feed speed is 0.003 mm / rev, and the target hole diameter is 0.2 mm.

4. The method according to claim 1, characterized in that The high temperature pressing of the combined layer comprises: Performing high temperature pressing on the combined layer based on high temperature pressing parameters; The high temperature pressing parameters include: a temperature rise rate of 3-5 degrees Celsius / minute, a temperature higher than 180 degrees Celsius, a pressing time greater than 90 minutes, and a pressure of 175 pounds per square inch.

5. The method according to claim 1, characterized in that The browning treatment comprises: The copper surface of the copper foil is subjected to browning treatment.

6. The method according to claim 1, characterized in that The step of assembling the drilled insulating layer and the substrate comprises: The positioning holes of the insulating layer and the positioning holes of the substrate are riveted together by using rivets.

7. The method according to claim 6, characterized in that The insulating layer has four positioning holes or substantially four positioning holes.

8. The method according to claim 3, characterized in that The insulating layer is drilled using a drill needle based on preset drilling parameters.

9. A laser deep blind hole processing device for a printed circuit board, characterized in that: The device comprises: A drilling module, used for drilling holes in the insulation layer based on preset drilling parameters; A combination module is used to assemble the drilled insulating layer and the substrate to obtain a combination layer, wherein the top layer of the combination layer is provided with a copper foil; the combination layer comprises a plurality of insulating layers and a plurality of substrates from bottom to top, wherein the insulating layers and the substrates are alternately arranged; A processing module, used for performing browning treatment on the combined layer after high-temperature pressing; The processing module is used to perform laser processing on the combined layer after the browning treatment to obtain a printed circuit board with blind holes.

10. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 8.

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