An automatic design method and auxiliary files for rigid-flexible composite plates

Abstract

This invention discloses an automatic design method and auxiliary files for rigid-flex PCBs. First, the shapes of flexible and rigid PCBs are distinguished, corresponding shape areas are selected and converted into copper foil attributes. Then, by increasing or decreasing the size of the copper foil and using negative stacking of copper foil, the required spacing between different shapes is created. This allows for the rapid creation of auxiliary files for rigid-flex PCBs that meet process requirements. The invention can quickly and automatically generate auxiliary files, improving the efficiency of auxiliary file processing, reducing errors caused by missing requirements, increasing the yield of rigid-flex PCBs, reducing production scrap rates, and improving the quality of rigid-flex PCBs.

Description

Technical Field

[0001] This invention relates to the technical field of rigid-flexible composite plate manufacturing, specifically to an automatic design method and auxiliary files for rigid-flexible composite plate auxiliary files. Background Technology

[0002] Rigid-flex PCBs, as a material capable of meeting complex circuit layouts and bending requirements, are increasingly used in high-end electronic products. Particularly in automotive electronics, medical devices, aerospace, and smart wearables, the application of rigid-flex PCBs is expanding, driving market demand growth.

[0003] Due to the complexity of rigid-flex PCB manufacturing, the PP sheet on the flexible board needs to be milled during production, and the flexible board area also needs to be separately covered with a protective film. These two processes require additional auxiliary files for production processing. However, the design of auxiliary files varies significantly between different rigid-flex PCBs. When creating auxiliary files, the shapes of different flexible and rigid board areas need to be manually processed, resulting in low efficiency in processing auxiliary files. Furthermore, optimizing auxiliary files may overlook some process requirements, leading to production defects. This poses a serious quality risk and problem for both customers and the factory. Summary of the Invention

[0004] Therefore, it is necessary to provide an automatic design method for rigid-flex PCB auxiliary files. This application, by converting drill layer files into copper foil and enabling the mutual conversion between copper foil and rigid-flex PCB shapes, can achieve automatic design of rigid-flex PCB auxiliary files, improving the efficiency of auxiliary file creation and effectively ensuring that the auxiliary files meet the corresponding process requirements.

[0005] An automatic design method for auxiliary files of rigid-flexible composite plates, including

[0006] Distinguish between flexible board areas and rigid board areas. Based on the outline file of the rigid-flex board to be processed, distinguish between flexible board areas and rigid board areas, and mark them as the first flexible board layer and the first rigid board layer.

[0007] The outline file is converted into a copper sheet. The outline files of the first flexible board layer and the first rigid board layer are converted into a first copper sheet. The first copper sheet is then reduced to a preset ratio and located in the center area of ​​the outline lines of the first flexible board layer and the first rigid board layer, and marked as the second flexible board layer and the second rigid board layer.

[0008] The process parameters for milling PP auxiliary files are set to increase the first copper foil of the reduced second flexible board layer by a first preset size along the edge of the copper foil, and mark it as the third flexible board layer. The first copper foil of the reduced second rigid board layer is reduced by a second preset size along the edge of the copper foil to form the third rigid board layer.

[0009] To create a milling PP auxiliary file, the third rigid board layer is superimposed on the third flexible board layer with a negative attribute to form a milling PP auxiliary file layer;

[0010] The process parameters for milling the cover film auxiliary file are set so that the first copper sheet of the reduced second flexible board layer is enlarged by a third preset size along the edge of the copper sheet and marked as the fourth flexible board layer. The first copper sheet of the reduced second rigid board layer is also enlarged by a fourth preset size along the edge of the copper sheet to form the fourth rigid board layer.

[0011] Copper sheets are stacked together, and the fourth flexible board layer is superimposed with the fourth rigid board layer with negative properties to form the fifth rigid board layer;

[0012] The drilling layer file is created by uniformly enlarging one side of the drilling layer file by a fifth preset size and copying it to the fifth rigid plate layer to form the sixth rigid plate layer.

[0013] The auxiliary file for milling the cover film is created by integrating the sixth rigid board layer into a second copper foil and converting the second copper foil into an outline attribute file.

[0014] Auxiliary file output: The auxiliary files for milling PP and the auxiliary files for milling the cover film are output in corresponding formats to complete the automatic design of the auxiliary files for rigid-flexible composite plates.

[0015] In one embodiment, the outline file is converted into a copper foil. The outline files of the first flexible board layer and the first rigid board layer are respectively converted into first copper foils, and the first copper foils are scaled down according to a preset ratio and located in the center area of ​​the outline lines of the first flexible board layer and the first rigid board layer, and marked as the second flexible board layer and the second rigid board layer.

[0016] Convert the outline files of the first flexible board layer and the first rigid board layer into the first copper foil, respectively;

[0017] The first copper foil fills the area enclosed by the outlines of the first flexible board layer and the first rigid board layer respectively;

[0018] The first copper foil of the first flexible board layer is reduced to a preset ratio and located in the center area of ​​the outline of the first flexible board layer to form the second flexible board layer.

[0019] The first copper foil of the first rigid plate layer is reduced to a preset ratio and located in the center area of ​​the outline of the first rigid plate layer to form the second rigid plate layer.

[0020] In one embodiment, the outline files of the first flexible board layer and the first rigid board layer are respectively converted into a first copper sheet, and the first copper sheet is reduced by a preset ratio and located in the central region of the outline lines of the first flexible board layer and the first rigid board layer. Reducing the first copper sheet by a preset ratio means reducing the outline lines of the first copper sheet by a preset ratio.

[0021] In one embodiment, the process parameter settings for milling the PP auxiliary file involve increasing the first copper layer of the reduced second flexible board layer by a first preset size along the edge of the copper layer, marking it as the third flexible board layer, and reducing the first copper layer of the reduced second rigid board layer by a second preset size along the edge of the copper layer to form the third rigid board layer.

[0022] The second flexible circuit layer is copied to form a duplicated second flexible circuit layer;

[0023] The first copper layer of the replicated second flexible circuit board layer is enlarged along the edge of the copper layer by a first preset size to form a third flexible circuit board layer;

[0024] The second rigid layer is copied to form a duplicated second rigid layer;

[0025] The first copper foil of the replicated second rigid layer is reduced to a second preset size along the edge of the copper foil to form a third rigid layer.

[0026] In one embodiment, the method for creating the milling PP auxiliary file by superimposing the third rigid board layer with the third flexible board layer with a negative attribute to form the milling PP auxiliary file layer is as follows:

[0027] The third rigid layer is superimposed on the third flexible layer with a negative property;

[0028] Remove negative attributes;

[0029] Convert the first copper sheet into a linear property file.

[0030] Create a milling PP auxiliary file layer.

[0031] In one embodiment, copper foil with a width smaller than a preset width needs to be overlaid before the negative attributes are removed.

[0032] In one embodiment, the process parameter settings for the milling cover film auxiliary file are as follows: The first copper layer of the reduced-down second flexible board layer is enlarged by a third preset dimension along the edge of the copper layer, and marked as the fourth flexible board layer; the first copper layer of the reduced-down second rigid board layer is enlarged by a fourth preset dimension along the edge of the copper layer to form the fourth rigid board layer.

[0033] The second flexible circuit layer is copied to form a duplicated second flexible circuit layer;

[0034] The first copper layer of the replicated second flexible circuit board layer is enlarged by a third preset size along the edge of the copper layer to form a fourth flexible circuit board layer;

[0035] The second rigid layer is copied to form a duplicated second rigid layer;

[0036] The first copper foil of the replicated second rigid layer is enlarged to a fourth preset size along the edge of the copper foil to form a fourth rigid layer.

[0037] In one embodiment, the copper sheets are stacked, and the fourth flexible board layer is superimposed with the fourth rigid board layer with negative properties to form a fifth rigid board layer, in which the fourth flexible board layer is covered by the fourth rigid board layer to achieve a sixth preset size.

[0038] In one embodiment, the drilling layer file is created by uniformly enlarging one side of the drilling layer file by a fifth preset size and copying it to the fifth rigid board layer to form the sixth rigid board layer, wherein the fifth preset size is ≥0.5mm.

[0039] In one embodiment, the first preset size is 1mm-3mm, the second preset size is 0.3mm-1mm, the third preset size is 0.5mm-1.5mm, the fourth preset size is 1mm-3mm, and the fifth preset size is 0.5mm-1mm.

[0040] A rigid-flexible plate auxiliary file, which is generated according to the automatic design method of rigid-flexible plate auxiliary file.

[0041] The beneficial effects of the above-mentioned automatic design method for auxiliary files of rigid-flexible composite plates and the auxiliary files themselves are as follows:

[0042] This application first distinguishes the shapes of flexible and rigid boards, filters out the corresponding shape areas and converts them into copper foil attributes. Then, by increasing or decreasing the size of the copper foil and using negative stacking of copper foil, the required spacing between different shapes is created. This allows for the rapid creation of auxiliary files for rigid-flex boards, resulting in auxiliary files that meet process requirements. The system can quickly and automatically generate auxiliary files for rigid-flex boards, improving the efficiency of auxiliary file processing, reducing errors caused by missing some requirements in the files, increasing the yield of rigid-flex boards, reducing the scrap rate of rigid-flex boards, and improving the quality of rigid-flex boards. Attached Figure Description

[0043] Figure 1 This is a flowchart illustrating the automatic design method for auxiliary files of rigid-flexible composite plates according to the present invention.

[0044] Figure 2 for Figure 1 A flowchart illustrating the method for converting the outline file of the automatic design method for the rigid-flex plate auxiliary file of the present invention into a copper sheet fabrication method;

[0045] Figure 3 for Figure 1 A schematic diagram of the process parameter setting method for milling PP auxiliary files in the automatic design method of rigid-flex plate auxiliary files of the present invention;

[0046] Figure 4 for Figure 1 A schematic diagram of the process for creating milling PP auxiliary files in the automatic design method for rigid-flexible plate auxiliary files of the present invention;

[0047] Figure 5 for Figure 1 A schematic diagram of the process parameter setting method for milling cover film auxiliary files in the automatic design method of rigid-flex plate auxiliary files of the present invention;

[0048] Figure 6 This is a schematic diagram of the PP auxiliary file structure for the rigid-flexible bonding plate auxiliary file of the present invention;

[0049] Figure 7 This is a schematic diagram of the cover film auxiliary file structure of the rigid-flexible bonded plate auxiliary file of the present invention. Detailed Implementation

[0050] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0051] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediary component present. Conversely, when a component is said to be "directly" connected to another component, there is no intermediary component.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0053] like Figure 1 As shown, an automatic design method for auxiliary files of rigid-flexible plates includes...

[0054] S1. Distinguish between flexible board areas and rigid board areas. Based on the outline file of the rigid-flex board to be processed, distinguish between flexible board areas and rigid board areas, and mark them as the first flexible board layer and the first rigid board layer; differentiate the flexible board areas and rigid board areas into different layers, and mark them as the first flexible board layer and the first rigid board layer; the flexible board areas and rigid board areas may be regular shapes or irregular drawings.

[0055] like Figure 2 As shown, S2, the outline file is converted into a copper sheet. The outline files of the first flexible board layer and the first rigid board layer are converted into a first copper sheet. The first copper sheet is then shrunk according to a preset ratio and located in the center area of ​​the outline lines of the first flexible board layer and the first rigid board layer, and marked as the second flexible board layer and the second rigid board layer.

[0056] S21. Convert the outline files of the first flexible board layer and the first rigid board layer into the first copper sheet respectively;

[0057] S22. Fill the area enclosed by the outlines of the first flexible board layer and the first rigid board layer with the first copper foil respectively;

[0058] S23. The first copper foil of the first flexible circuit board layer is reduced in size according to a preset ratio and located in the center area of ​​the outline of the first flexible circuit board layer to form the second flexible circuit board layer. Reducing the first copper foil in size according to a preset ratio means reducing the outline of the first copper foil in size according to a preset ratio. The outline of the first copper foil is a closed area formed by splicing multiple line segments. Reducing the outline in size according to a preset ratio usually involves shortening the outline segments. For example, if the length of the outline segment is 0.6mm, then it is shortened by half to 0.3mm. After reducing all the outline segments by half, the position of the reduced first copper foil is the center area of ​​the outline of the first flexible circuit board layer. The first copper foil of the first flexible circuit board layer is reduced in size according to a preset ratio to form the second flexible circuit board layer.

[0059] S24. The first copper foil of the first rigid board layer is reduced by a preset ratio and located in the center area of ​​the outline of the first rigid board layer to form a second rigid board layer. The reduction method of the first copper foil of the first rigid board layer is the same as that of the first flexible board layer, so that the position of the reduced first copper foil is the center area of ​​the outline of the first rigid board layer. The first copper foil of the first rigid board layer is reduced by a preset ratio to form a second rigid board layer.

[0060] like Figure 3 As shown, in S3, the process parameters for milling the PP auxiliary file are set such that the first copper sheet of the reduced second flexible board layer is enlarged by a first preset size along the edge of the copper sheet, and marked as the third flexible board layer. The first copper sheet of the reduced second rigid board layer is reduced by a second preset size along the edge of the copper sheet to form the third rigid board layer. The enlarged or reduced size of the first copper sheet of the second flexible board layer and the first copper sheet of the second rigid board layer are set according to specific requirements.

[0061] S31. Copy the second flexible board layer to form a copied second flexible board layer;

[0062] S32. Enlarge the first copper layer of the scaled-down replica second flexible circuit board layer by a first preset size along the edge of the copper layer to form the third flexible circuit board layer; for example, according to the specific manufacturing requirements, increase the first copper layer of the second flexible circuit board layer by 2mm along the edge of the copper layer.

[0063] S33. Copy the second rigid layer to form a copied second rigid layer;

[0064] S34. Reduce the first copper layer of the scaled-down replica of the second rigid layer by a second preset size along the edge of the copper layer to form the third rigid layer; reduce the first copper layer of the second flexible layer by 0.5mm along the edge of the copper layer according to the specific manufacturing requirements.

[0065] like Figure 4 As shown, S4, milling PP auxiliary file creation, superimposes the third rigid board layer with the third flexible board layer with negative attributes to form the milling PP auxiliary file layer;

[0066] S41. Overlay the third rigid layer with the third flexible layer with a negative attribute. After the third rigid layer is overlaid with the third flexible layer with a negative attribute, some small connection positions will be generated. For example, if the connection position is less than 1mm, the copper foil with a width of less than 1mm needs to be removed before removing the negative attribute.

[0067] In circuit board design, negative properties are used to handle the junction between rigid and flexible circuit boards. By overlaying the copper pattern of one area with a negative property (i.e., after flipping) onto the copper pattern of another area, the small connections that are generated after the rigid and flexible boards are overlaid can be eliminated, ensuring that the rigid and flexible parts of the circuit board can be properly separated, while maintaining the connection where the rigid and flexible boards of the circuit board need to be connected.

[0068] S42. Remove negative attributes;

[0069] S43. Convert the first copper sheet into a linear property file.

[0070] S44. Create the milling PP auxiliary file layer;

[0071] like Figure 5 As shown, S5, the process parameter settings for the milling cover film auxiliary file, increase the first copper sheet of the reduced second flexible board layer by a third preset size along the edge of the copper sheet, and mark it as the fourth flexible board layer, and increase the first copper sheet of the reduced second rigid board layer by a fourth preset size along the edge of the copper sheet to form the fourth rigid board layer;

[0072] S51. Copy the second flexible board layer to form a copied second flexible board layer;

[0073] S52. The first copper foil of the scaled-down replica of the second flexible board layer is enlarged by a third preset size along the edge of the copper foil to form the fourth flexible board layer. In this embodiment, the flexible board edge needs to be pressed by 1mm, so the first copper foil of the second flexible board layer is enlarged by 1mm along the edge of the copper foil.

[0074] S53. Copy the second rigid layer to form a copied second rigid layer;

[0075] S54. The first copper foil of the scaled-down replica of the second rigid board layer is enlarged by a fourth preset size along the edge of the copper foil to form the fourth rigid board layer; In this embodiment, the cover film of the rigid board area needs to be milled by 2mm, so the first copper foil of the second rigid board layer is enlarged by 2mm along the edge of the copper foil.

[0076] S6. Copper sheets are stacked together, and the fourth flexible board layer is stacked with the fourth rigid board layer with negative properties to form the fifth rigid board layer; In the process of stacking copper sheets together, the fourth flexible board layer is stacked with the fourth rigid board layer with negative properties to form the fifth rigid board layer, and the fourth flexible board layer is covered into the fourth rigid board layer to reach the sixth preset size, that is, the fourth flexible board layer is covered into the fourth rigid board layer by 1 mm to ensure that the cover film extends into the board;

[0077] S7. Drill layer file creation: Enlarge the drill layer file by the fifth preset size on one side and copy it to the fifth rigid board layer to form the sixth rigid board layer. Since the metallized holes need to be at least 0.5mm away from the flexible board cover film area, the drill layer file should be enlarged by at least 0.5mm on one side and copied to the fifth rigid board layer to form the sixth rigid board layer.

[0078] S8. Milling cover film auxiliary file creation: integrate the sixth rigid board layer into the second copper foil and convert the second copper foil into an outline attribute file to form the milling cover film auxiliary file;

[0079] S9. Auxiliary file output: Output the milling PP auxiliary file and the milling cover film auxiliary file into the corresponding format to complete the automatic design of the rigid-flexible plate auxiliary file.

[0080] The first preset size is 1mm-3mm, the second preset size is 0.3mm-1mm, the third preset size is 0.5mm-1.5mm, the fourth preset size is 1mm-3mm, and the fifth preset size is 0.5mm-1mm. When the milling clearance of the PP groove needs to be enlarged by 1mm-3mm, the first copper foil of the second flexible board layer is enlarged by the first preset size along the edge of the copper foil, that is, the first copper foil of the second flexible board layer is enlarged by 1mm-3mm.

[0081] When the junction between the second rigid layer and the second flexible layer needs to be increased by 0.3 mm to 1.0 mm, the first copper foil of the second rigid layer is reduced by a second preset size along the edge of the copper foil, and the first copper foil of the second rigid layer is reduced by 0.3 mm to 1.0 mm.

[0082] When the cover film flexible board is pressed at an edge of 0.5 mm-1.5 mm, the first copper sheet of the reduced second flexible board layer is enlarged by a third preset size along the edge of the copper sheet, and the first copper sheet of the second flexible board layer is enlarged by 0.5 mm-1.5 mm.

[0083] When the milled groove is 1.0 mm - 3.0 mm larger than the hard board area, the first copper sheet of the reduced second hard board layer is enlarged by a fourth preset size along the edge of the copper sheet, and the first copper sheet of the reduced second hard board layer is enlarged by 1.0 mm - 3.0 mm.

[0084] When the metallized hole is 0.5mm-1.0mm away from the flexible board cover film area, the drilling layer file will be uniformly enlarged by the fifth preset size on one side, and the drilling layer file will be uniformly enlarged by 0.5mm-1.0mm on one side.

[0085] like Figure 6 and Figure 7 As shown, a rigid-flexible plate auxiliary file is generated according to the automatic design method for rigid-flexible plate auxiliary files.

[0086] In this way, this application first distinguishes the shapes of flexible and rigid boards, selects the corresponding shape areas and converts them into copper foil attributes, and then creates the required spacing between different shapes by increasing or decreasing the size of the copper foil and using negative stacking of copper foil. This allows for the rapid creation of rigid-flex board auxiliary files, resulting in rigid-flex board auxiliary files that meet process requirements. The process can quickly and automatically generate rigid-flex board auxiliary files, improving the efficiency of rigid-flex board auxiliary file processing, reducing errors caused by missing some requirements in the files, increasing the yield of rigid-flex board production, reducing the scrap rate of rigid-flex board production, and improving the quality of rigid-flex board.

[0087] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An automatic design method for auxiliary files of rigid-flexible composite plates, characterized in that: include Distinguish between flexible board areas and rigid board areas. Based on the outline file of the rigid-flex board to be processed, distinguish between flexible board areas and rigid board areas, and mark them as the first flexible board layer and the first rigid board layer. The outline file is converted into a copper sheet. The outline files of the first flexible board layer and the first rigid board layer are converted into a first copper sheet. The first copper sheet is then reduced to a preset ratio and located in the center area of ​​the outline lines of the first flexible board layer and the first rigid board layer, and marked as the second flexible board layer and the second rigid board layer. The process parameters for milling PP auxiliary files are set to increase the first copper foil of the reduced second flexible board layer by a first preset size along the edge of the copper foil, and mark it as the third flexible board layer. The first copper foil of the reduced second rigid board layer is reduced by a second preset size along the edge of the copper foil to form the third rigid board layer. To create a milling PP auxiliary file, the third rigid board layer is superimposed on the third flexible board layer with a negative attribute to form a milling PP auxiliary file layer; The process parameters for milling the cover film auxiliary file are set so that the first copper sheet of the reduced second flexible board layer is enlarged by a third preset size along the edge of the copper sheet and marked as the fourth flexible board layer. The first copper sheet of the reduced second rigid board layer is also enlarged by a fourth preset size along the edge of the copper sheet to form the fourth rigid board layer. Copper sheets are stacked together, and the fourth flexible board layer is superimposed with the fourth rigid board layer with negative properties to form the fifth rigid board layer; The drilling layer file is created by uniformly enlarging one side of the drilling layer file by a fifth preset size and copying it to the fifth rigid plate layer to form the sixth rigid plate layer. The auxiliary file for milling the cover film is created by integrating the sixth rigid board layer into a second copper foil and converting the second copper foil into an outline attribute file. Auxiliary file output: Output the milling PP auxiliary file and the milling cover film auxiliary file into the corresponding format to complete the automatic design of the rigid-flex plate auxiliary file; The method for converting the outline files into copper foil, converting the outline files of the first flexible board layer and the first rigid board layer into first copper foil respectively, and then scaling down the first copper foil according to a preset ratio and placing it in the center area of ​​the outline lines of the first flexible board layer and the first rigid board layer, and marking it as the second flexible board layer and the second rigid board layer, is as follows: Convert the outline files of the first flexible board layer and the first rigid board layer into the first copper foil, respectively; The first copper foil fills the area enclosed by the outlines of the first flexible board layer and the first rigid board layer respectively; The first copper foil of the first flexible board layer is reduced to a preset ratio and located in the center area of ​​the outline of the first flexible board layer to form the second flexible board layer. The first copper foil of the first rigid plate layer is reduced to a preset ratio and located in the center area of ​​the outline of the first rigid plate layer to form the second rigid plate layer.

2. The automatic design method for auxiliary files of rigid-flexible plates according to claim 1, characterized in that: The outline files of the first flexible board layer and the first rigid board layer are respectively converted into the first copper sheet. The first copper sheet is then reduced by a preset ratio and located in the center area of ​​the outline lines of the first flexible board layer and the first rigid board layer. Reducing the first copper sheet by a preset ratio means reducing the outline lines of the first copper sheet by a preset ratio.

3. The automatic design method for auxiliary files of rigid-flexible plates according to claim 1, characterized in that: The process parameter settings in the milling PP auxiliary file are as follows: The first copper layer of the reduced second flexible board layer is enlarged by a first preset size along the edge of the copper layer, and marked as the third flexible board layer. The first copper layer of the reduced second rigid board layer is then reduced by a second preset size along the edge of the copper layer to form the third rigid board layer. The second flexible circuit layer is copied to form a duplicated second flexible circuit layer; The first copper layer of the replicated second flexible circuit board layer is enlarged along the edge of the copper layer by a first preset size to form a third flexible circuit board layer; The second rigid layer is copied to form a duplicated second rigid layer; The first copper foil of the replicated second rigid layer is reduced to a second preset size along the edge of the copper foil to form a third rigid layer.

4. The automatic design method for auxiliary files of rigid-flexible plates according to claim 3, characterized in that: The method for creating the milling PP auxiliary file by superimposing the third rigid board layer with the third flexible board layer with a negative attribute to form the milling PP auxiliary file layer is as follows: The third rigid layer is superimposed on the third flexible layer with a negative property; Remove negative attributes; Convert the first copper sheet into a linear property file. Create a milling PP auxiliary file layer.

5. The automatic design method for auxiliary files of rigid-flexible plates according to claim 4, characterized in that: Before removing negative attributes, copper areas smaller than the preset width need to be overlaid.

6. The automatic design method for auxiliary files of rigid-flexible plates according to claim 5, characterized in that: The process parameter settings in the milling cover film auxiliary document are as follows: The first copper layer of the reduced second flexible board layer is enlarged by a third preset dimension along the edge of the copper layer, and marked as the fourth flexible board layer. The method for forming the fourth rigid board layer by enlarging the first copper layer of the reduced second rigid board layer by a fourth preset dimension along the edge of the copper layer is as follows: The second flexible circuit layer is copied to form a duplicated second flexible circuit layer; The first copper layer of the replicated second flexible circuit board layer is enlarged by a third preset size along the edge of the copper layer to form a fourth flexible circuit board layer; The second rigid layer is copied to form a duplicated second rigid layer; The first copper foil of the replicated second rigid layer is enlarged to a fourth preset size along the edge of the copper foil to form a fourth rigid layer.

7. The automatic design method for auxiliary files of rigid-flexible plates according to claim 1, characterized in that: The copper sheets are stacked, and the fourth flexible board layer is superimposed with the fourth rigid board layer with negative properties to form the fifth rigid board layer. The fourth flexible board layer is then covered by the fourth rigid board layer to achieve a sixth preset size.

8. The automatic design method for auxiliary files of rigid-flexible plates according to claim 1, characterized in that: The drilling layer file is created by uniformly enlarging one side of the drilling layer file by a fifth preset size and copying it to the fifth rigid board layer to form the sixth rigid board layer. The fifth preset size is ≥0.5mm.

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