A mass transfer device and method of transfer

Abstract

The application belongs to the technical field of semiconductor manufacturing, and particularly relates to a mass transfer device and a mass transfer method. An operation table is provided with a material taking station and a material placing station. The material taking station is used for placing a wafer disc, and the material placing station is used for placing a circuit substrate. A rotary transfer mechanism is arranged above the operation table. A rotary part is movably arranged on the side wall of a mounting seat. A driving part is used for driving the rotary part to move around the mounting seat. A plurality of groups of transfer assemblies are arranged on the rotary part in a spaced manner. When one group of transfer assemblies is located above the material taking station, another group of transfer assemblies is located above the material placing station. The two groups of transfer assemblies simultaneously implement material taking and material placing. Through the design of the rotary transfer mechanism, material taking and material placing can be simultaneously completed in one rotation process. The parallel operation mode significantly reduces the time required for the adsorption device to repeatedly move between the wafer and the circuit substrate in the conventional technology, thereby improving the overall efficiency of mass transfer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more particularly to a mass transfer apparatus and transfer method. Background Technology

[0002] Mass transfer is another challenge brought about by pixelation, especially in Mini / MicroLED applications. The chips are extremely small and numerous, and it takes a lot of time to transfer LED chips to the circuit board in batches, and the yield is not easy to control. This has become a major obstacle to commercial production and application.

[0003] Currently, mass transfer technology typically uses an adsorption device to pick up chips from above the wafer, then the adsorption device transfers the chips to the circuit board to release them, and finally the adsorption device returns to above the wafer for a second chip adsorption. This process is time-consuming and has low transfer efficiency. Summary of the Invention

[0004] In view of the problems raised in the background art, the purpose of this invention is to provide a mass transfer device and transfer method, which solves the problem of low transfer efficiency in the prior art.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A mass transfer device includes an operating table and a rotary transfer mechanism;

[0007] The operating table is provided with a material picking station and a material placing station. The material picking station is used to place the wafer disk, and the material placing station is used to place the circuit board.

[0008] The rotary transfer mechanism is located above the operating table. The rotary transfer mechanism includes a mounting base, a rotating component, a driving component, and several sets of transfer components. The driving component is mounted on the mounting base. The rotating component is movably disposed on the side wall of the mounting base. The driving component is used to drive the rotating component to move around the mounting base. Several sets of transfer components are installed on the rotating component at intervals.

[0009] When one set of the transfer components is located above the material picking station, another set of the transfer components is located above the material discharging station, and the two sets of the transfer components simultaneously perform material picking and discharging.

[0010] Preferably, the rotating component comprises a first part, a second part, a third part, and a fourth part connected in sequence;

[0011] The four regions of the rotary transfer mechanism in the left, right, front, and back directions are respectively designated as the material picking area, the material dispensing area, the material waiting to be dispensed area, and the material waiting to be picked up area. When the rotating component moves, the first part, the second part, the third part, and the fourth part can be located in the material picking area, the material dispensing area, the material waiting to be dispensed area, and the material waiting to be picked up area, respectively.

[0012] The transfer components are in four groups, and the four groups of transfer components are respectively disposed in the first part, the second part, the third part and the fourth part. The driving component drives the rotating component to drive the four groups of transfer components to sequentially circulate through the material picking area, the material waiting area, the material feeding area and the material waiting picking area.

[0013] When one set of the transfer components is located in the material picking area, the other three sets of the transfer components are located in the material waiting area, the material feeding area, and the material picking area, respectively; when the transfer component located in the material picking area picks up material, the transfer component located in the material feeding area feeds material.

[0014] Preferably, the rotating component is a transmission belt, the driving component includes two transmission rollers and a driver, the transmission rollers are mounted on the mounting base, the central axes of the two transmission rollers are parallel to each other, the transmission belt is sleeved on the outside of the two transmission rollers, and the driver drives the transmission rollers to rotate, thereby driving the transmission belt to rotate.

[0015] The four sets of transfer components are installed at intervals on the outside of the drive belt.

[0016] Preferably, the transfer assembly includes a limiting member, a first elastic member, and a plurality of transfer heads;

[0017] Two limiting members are installed on the transmission belt in a front-to-back manner, and the two ends of the first elastic member are respectively connected to the two limiting members. A plurality of transfer heads are installed on the first elastic member at intervals.

[0018] Preferably, the rotary transfer mechanism further includes two sets of limiting components, which are mounted on the mounting base via a mounting bracket;

[0019] One of the limiting components is located above the material picking area, and the limiting component is used to limit the transfer component to the material picking area; the other limiting component is located above the material discharging area, and the limiting component is used to limit the transfer component to the material discharging area.

[0020] Preferably, the limiting component includes two electromagnetic adsorption sub-components, which are arranged opposite each other, and the distance between the two electromagnetic adsorption sub-components is equal to the length of the transfer component;

[0021] The electromagnetic adsorption sub-assembly includes an electromagnet, a second elastic element, and a limiting iron block. The electromagnet is mounted on the mounting frame, and the limiting iron block is disposed below the electromagnet via the second elastic element.

[0022] When the electromagnet is energized, it attracts the limiting iron block, and the limiting iron block does not interfere with the transfer component; when the electromagnet is de-energized, it does not attract the limiting iron block, and the two limiting iron blocks are located on the front and rear sides of the two limiting components respectively.

[0023] Preferably, the limiting block includes a fixing sleeve and a slider;

[0024] The fixed sleeve is fixedly disposed at the bottom of the electromagnet, and the upper part of the slider is slidably disposed inside the fixed sleeve;

[0025] The second elastic element is located inside the fixed sleeve, with its upper end connected to the electromagnet and its lower end connected to the slider.

[0026] The lower part of the slider is inverted cone-shaped.

[0027] Preferably, the transfer assembly further includes an elastic top plate;

[0028] The two ends of the elastic top plate are respectively connected to the two limiting members, and the elastic top plate is located above the first elastic member;

[0029] The top of the elastic top plate is flat, and when the transfer component moves relative to the limiting component, the bottom of the slider abuts against the top of the elastic top plate.

[0030] Preferably, the picking station and the unloading station are each provided with a three-way movable carrier. The three-way movable carrier located at the picking station is used to install the wafer disk, and the three-way movable carrier located at the unloading station is used to install the circuit board.

[0031] The feeding station is equipped with a physical field component, which is used to generate a physical field to cause the first elastic element to deform.

[0032] A transfer method using the aforementioned mass transfer device includes the following steps:

[0033] S100. Start the rotary transfer mechanism and calibrate the four sets of transfer components, which are respectively located in the material pick-up area, the material waiting area, the material feeding area, and the material waiting pick-up area.

[0034] S200: Place the wafer disk at the pick-up station and place the circuit board to be mounted at the unloading station; perform alignment between the wafer disk and the transfer components on the pick-up area, and perform alignment between the circuit board and the transfer components on the unloading area.

[0035] S300: The transfer component located in the material picking area picks up materials, the transfer component located in the material discharging area discharges materials, and the transfer components located in the material waiting area and the material waiting picking area wait.

[0036] S400: When the rotating component is energized, the four sets of transfer components begin to rotate synchronously; after the transfer components have transferred to the next area, the rotating component is de-energized and stops rotating.

[0037] S500, repeating S300 and S400, achieves massive transfer.

[0038] Compared with the prior art, one of the above technical solutions has the following beneficial effects:

[0039] 1. By designing a rotary transfer mechanism, the pick-up and drop-off operations can be completed simultaneously in a single rotation. While one set of transfer components is positioned above the pick-up station to pick up chips, another set of transfer components can simultaneously be positioned above the drop-off station to drop and mount chips. This parallel operation significantly reduces the time required for the pick-up device to make multiple round trips between the wafer and the circuit board in traditional technologies, thereby improving the overall efficiency of mass transfer.

[0040] 2. By using rotating components and limiting components to simultaneously control the stop position of the transfer component, that is, by using electrical systems and mechanical components for synchronous control, the precise position of the transfer component in the material picking and discharging areas is ensured, thus guaranteeing the accuracy of material picking and discharging. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of a structure according to an embodiment of the present invention;

[0042] Figure 2 This is a top view of the rotary transfer mechanism of the present invention;

[0043] Figure 3 This is a side view of the rotary transfer mechanism of the present invention;

[0044] Figure 4 This is a schematic diagram of the electromagnetic adsorption sub-component of the present invention.

[0045] The components include: material picking area 01, material discharging area 02, material waiting area 03, material waiting picking area 04, material picking station 11, three-way movable carrier 110, material discharging station 12, rotary transfer mechanism 20, rotating component 22, transmission belt 221, transfer assembly 23, limiting component 231, first elastic component 232, transfer head 233, elastic top plate 234, limiting assembly 24, electromagnet 241, second elastic component 242, limiting iron block 243, fixed sleeve 2431, slider 2432, driving component 25, and transmission roller 251. Detailed Implementation

[0046] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0047] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0048] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," and "third" may explicitly or implicitly include one or more of that feature.

[0049] It should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0050] The following is in conjunction with the appendix Figures 1 to 4 The technical solution of the present invention will be further illustrated through specific embodiments.

[0051] A mass transfer device includes an operating table and a rotary transfer mechanism 20;

[0052] The operating table is provided with a material picking station 11 and a material placing station 12. The material picking station 11 is used to place the wafer disk, and the material placing station 12 is used to place the circuit board.

[0053] The rotary transfer mechanism 20 is located above the operating table. The rotary transfer mechanism 20 includes a mounting base, a rotating component 22, a driving component 25, and several sets of transfer components 23. The driving component 25 is mounted on the mounting base, and the rotating component 22 is movably disposed on the side wall of the mounting base. The driving component 25 is used to drive the rotating component 22 to move around the mounting base. Several sets of transfer components 23 are spaced apart from the rotating component 22.

[0054] When one set of the transfer components 23 is located above the material picking station 11, another set of the transfer components 23 is located above the material discharging station 12, and the two sets of transfer components 23 simultaneously perform material picking and discharging.

[0055] By designing the rotary transfer mechanism 20, the device can simultaneously complete the pick-up and drop-off operations in a single rotation. Specifically, while one set of transfer components 23 is positioned above the pick-up station 11 to pick up chips, another set of transfer components 23 can simultaneously be positioned above the drop-off station 12 to drop and mount chips. This parallel operation significantly reduces the time required for the pick-up device to make multiple round trips between the wafer and the circuit board in conventional technologies, thereby improving the overall efficiency of mass transfer.

[0056] Due to the design of the rotary transfer mechanism 20, the movement path of the transfer assembly 23 during material handling and unloading is relatively fixed, reducing the cumulative errors that may be caused by multiple round trips and positioning adjustments. By precisely controlling the movement and rotation of the rotating component 22, the precise alignment of each transfer assembly 23 during material handling and unloading can be further ensured, thereby improving the accuracy and yield of mass transfer.

[0057] The transfer device of this invention, through an integrated rotary transfer mechanism 20, achieves automated and continuous operation of material picking and unloading, simplifying the cumbersome operation steps in traditional mass transfer technology. This not only reduces operational difficulty and labor costs but also helps improve the stability and reliability of the production line. This transfer device is suitable for applications such as Mini / MicroLED where chip sizes are extremely small and quantities are large, meeting the demands of commercial production and applications for efficient and high-precision mass transfer technology. By adjusting the number and layout of the transfer components 23, multiple sets of transfer components 23 can be configured to either have chips attached and be waiting to be transferred to the unloading station 12 for unloading, or be in an unloaded state and waiting to be transferred to the picking station 11 for picking.

[0058] Furthermore, the rotating component 22 includes a first part, a second part, a third part, and a fourth part connected in sequence;

[0059] The four regions of the rotary transfer mechanism 20 in the left, right, front, and back directions are respectively designated as the material picking area 01, the material dispensing area 02, the material waiting area 03, and the material waiting area 04. When the rotating component 22 moves, the first part, the second part, the third part, and the fourth part can be located in the material picking area 01, the material dispensing area 02, the material waiting area 03, and the material waiting area 04, respectively.

[0060] The transfer components 23 are in four groups, and the four groups of transfer components 23 are respectively disposed in the first part, the second part, the third part and the fourth part. The driving member 25 drives the rotating member 22 to drive the four groups of transfer components 23 to sequentially circulate through the material picking area 01, the material waiting area 03, the material feeding area 02 and the material waiting area 04.

[0061] When one set of the transfer components 23 is located in the material picking area 01, the other three sets of the transfer components 23 are located in the material waiting area 03, the material feeding area 02 and the material picking area 04, respectively; when the transfer component 23 located in the material picking area 01 picks up the material, the transfer component 23 located in the material feeding area 02 feeds the material.

[0062] The pick-up station 11 and the unload station 12 on the operating table are used to place wafer disks and circuit boards, respectively, while the rotary transfer mechanism 20 is located above the operating table. This layout helps to optimize space utilization, making the whole device more compact and easier to operate.

[0063] By designing the rotating component 22 with an elliptical rotation path (including a first part, a second part, a third part, and a fourth part), the path is divided into four areas (picking area 01, unloading area 03, unloading area 02, and picking area 04). Four sets of transfer components 23 are then alternately and cyclically transferred between these four areas. When one set of transfer components 23 moves to the picking area 01, another set of transfer components 23 is located in the unloading area 02, and both sets of transfer components 23 perform picking and unloading in their respective operating areas. Simultaneously, the other two sets of transfer components 23 are located in the unloading area 03 and the picking area 04, respectively, in a waiting state. Of the two sets of transfer components 23 in the waiting area, one set has chips attached to it in the unloading area 03, awaiting the next transfer to the unloading area 02 for unloading; the other set of transfer components 23 is empty and in the unloading area 04. This set of transfer components 23 will be transferred to the unloading area 04 after unloading and await the next transfer to the unloading area 01 for unloading. This design makes the entire transfer process more compact and efficient.

[0064] To further explain, since the material picking area 01, the material waiting area 03, the material feeding area 02, and the material waiting area 04 are respectively located at four consecutive positions (first part, second part, third part, and fourth part) of the elliptical ring-shaped rotating component 22, assuming that at a certain moment the four sets of transfer components 23 located in the material picking area 01, the material waiting area 03, the material feeding area 02, and the material waiting area 04 are the first transfer component, the second transfer component, the third transfer component, and the fourth transfer component, respectively, then while the first transfer component is picking up the material in the material picking area 01, the third transfer component is feeding and mounting the material in the material feeding area 02; and the second transfer component has a chip adsorbed and is waiting in the material waiting area 03, while the fourth transfer component is in an unloaded state and is waiting in the material waiting area 04. After the rotating component 22 rotates, the second transfer component with the chip adsorbed is transferred to the feeding area 02 and feeding and mounting are performed. The first transfer component with the chip adsorbed is transferred to the feeding area 03 to wait. The empty third transfer component, which has completed feeding and mounting in the previous operation, is transferred to the picking area 04 to wait. The empty fourth transfer component is transferred to the picking area 01 to pick up the material, thereby realizing the cyclic picking and feeding.

[0065] Compared to traditional adsorption devices that require multiple back-and-forth movements between the wafer disk and the circuit board, the transfer device of this invention uses an elliptical ring-shaped transmission path and four sets of transfer components 23 arranged on the rotating component 22 to cyclically pass through the picking area 01, the unloading area 03, the unloading area 02, and the unpicking area 04. The transfer components 23 in the picking area 01 and the unloading area 02 simultaneously pick up and unload materials, and the addition of the unloading area 03 and the unpicking area 04 solves the problems of long waiting and transfer times and low efficiency in the prior art when the transfer components switch between the picking area and the unloading area and carry out picking and unloading. The transfer device of this invention achieves synchronous and uninterrupted picking and unloading, improves transfer efficiency, and realizes continuous, cyclical, and efficient mass transfer operations.

[0066] Furthermore, the rotating component 22 is a transmission belt 221, and the driving component 25 includes two transmission rollers 251 and a driver. The transmission rollers 251 are mounted on the mounting base, and the central axes of the two transmission rollers 251 are parallel to each other. The transmission belt 221 is sleeved on the outside of the two transmission rollers 251. The driver drives the transmission rollers 251 to rotate, thereby driving the transmission belt 221 to rotate.

[0067] The four sets of transfer components 23 are installed at intervals on the outside of the transmission belt 221.

[0068] The smooth operation of the rotating component 22 is ensured by the cyclic rotation of the drive belt 221 on two parallel drive rollers 251. The driver drives either drive roller 251 to rotate, thereby rotating the drive belt 221. Therefore, the speed of the drive belt can be controlled by adjusting the output speed of the driver, which in turn adjusts the moving speed of the transfer assembly 23. This makes the device more flexible and allows for rapid adjustments based on production needs.

[0069] Furthermore, the transfer assembly 23 includes a limiting member 231, a first elastic member 232, and a plurality of transfer heads 233;

[0070] Two limiting members 231 are mounted on the transmission belt 221 in a front-to-back manner, and the two ends of the first elastic member 232 are respectively connected to the two limiting members 231. A plurality of transfer heads 233 are installed on the first elastic member 232 at intervals.

[0071] The transfer assembly 23 has a relatively simple structure, mainly consisting of a limiting member 231, a first elastic member 232, and a transfer head 233, making it easy to disassemble and replace. This design helps reduce maintenance costs and improves the maintainability and service life of the equipment. By installing several transfer heads 233 at intervals, the same set of transfer assemblies 23 can transfer multiple chips simultaneously in a single transfer process, thereby improving transfer efficiency. At the same time, the design of the limiting member 231 and the first elastic member 232 also helps ensure that each transfer head 233 can be accurately aligned with the chip position, reducing repetitive operations and wasted time due to inaccurate alignment.

[0072] To further explain, multiple transfer heads 233 are spaced apart and mounted on the first elastic member 232. The introduction of the first elastic member 232 can absorb and buffer the impact force caused by mechanical vibration or improper operation to a certain extent, protect the transfer head 233 and the micro chip being picked up, and improve the transfer accuracy. On the other hand, under the action of the physical field (including magnetic field, thermal field, electric field, etc.) of the unloading area 02, the first elastic member 232 can be adjusted to stretch and extend to adapt to the distance between each transfer head 233, so as to meet the mounting requirements of the circuit board at the unloading station 12.

[0073] Furthermore, the rotary transfer mechanism 20 also includes two sets of limiting components 24, which are mounted on the mounting base via a mounting bracket;

[0074] One of the limiting components 24 is located above the material picking area 01, and the limiting component 24 is used to limit the transfer component 23 to the material picking area 01. The other limiting component 24 is located above the material discharging area 02, and the limiting component 24 is used to limit the transfer component 23 to the material discharging area 02.

[0075] The limiting component 24 can precisely position the transfer component 23 in the pick-up area 01 and the unload area 02, ensuring that the transfer component 23 is accurately aligned with the target position on the chip on the wafer disk and the circuit board. This helps reduce pick-up or unload failures caused by inaccurate positioning, and improves the success rate and efficiency of transfer.

[0076] Specifically, when the rotating component 22 drives the transfer component 23 to switch between the four areas, if the transfer component 23 deviates from the specific operation area (material picking area or material unloading area) due to error or inertia, the limiting component 24 can promptly stop it from continuing to move, prevent the existence of error, and further avoid the multiple accumulation of error, which would lead to a decrease in the yield of the transfer operation.

[0077] Furthermore, the limiting component 24 includes two electromagnetic adsorption sub-components, which are arranged opposite each other, and the distance between the two electromagnetic adsorption sub-components is equal to the length of the transfer component 23.

[0078] The electromagnetic adsorption sub-assembly includes an electromagnet 241, a second elastic element 242, and a limiting iron block 243. The electromagnet 241 is mounted on the mounting frame, and the limiting iron block 243 is disposed below the electromagnet 241 via the second elastic element 242.

[0079] When the electromagnet 241 is energized, it attracts the limiting iron block 243, and the limiting iron block 243 does not interfere with the transfer component 23; when the electromagnet 241 is de-energized, it does not attract the limiting iron block 243, and the two limiting iron blocks 243 are located on the front and rear sides of the two limiting members 231 respectively.

[0080] By controlling the energization and de-energization of the electromagnet 241, the adsorption and release of the limiting iron block 243 can be precisely controlled, thereby achieving precise positioning of the transfer component 23. When the electromagnet 241 is energized, the limiting iron block 243 is adsorbed without interfering with the transfer component 23, allowing it to move freely. Since the second elastic element 242 is used to connect the electromagnet 241 and the limiting iron block 243, when the electromagnet 241 adsorbs the limiting iron block 243, the second elastic element 242 is in a compressed state. When the electromagnet 241 is de-energized, the limiting iron block 243 pops out downward under the action of the second elastic element 242. Thus, the limiting iron blocks 243 of the electromagnetic adsorption sub-components arranged in opposite directions are all in the popped-out state, acting on the front and rear sides of the transfer component 23 entering the material picking area 01 (discharging area 02) respectively, realizing the positioning function.

[0081] The design of the electromagnetic adsorption sub-assembly allows the limiting function of the limiting assembly 24 to be turned on or off as needed, improving the flexibility of the equipment. Specifically, when the rotating component 22 rotates, if the four sets of transfer assemblies 23 need to change their working areas, and the limiting assembly 24 needs to make way, the electromagnet 241 is energized. The electromagnet 241 attracts the limiting block 243 upwards, causing the limiting block 243 to leave the moving path of the transfer assembly 23, allowing the transfer assembly 23 to move freely. When the transfer assembly 23 completes the area transfer, the electromagnet 241 is de-energized, the electromagnet 241 no longer attracts the limiting block 243, and the limiting block 243 pops down.

[0082] To further explain, the energization / de-energization state of the electromagnet in the limiting component can be correlated with the energization / de-energization state of the rotating component 22. When the rotating component 22 is energized and drives the transmission belt 221 to rotate the four sets of transfer components 23, the electromagnet is also energized. Before the rotating component 22 stops rotating, the electromagnet is de-energized before the rotating component 22, so that the energization time of the electromagnet is shorter than the energization time of the rotating component 22, thus ensuring that the limiting component effectively limits the transfer components 23. By setting the rotating component 22 and the limiting component 24 to synchronously control the precise position of the transfer components 23, that is, by using the electrical system and mechanical components for synchronous control, only the wafer disk of the picking station 11 and the circuit board of the unloading station 12 need to be aligned, which can ensure the accurate position of the transfer components 23 in the picking area 01 and the unloading area 02. At the same time, each transfer of the transfer components 23 in the operating area has a limiting operation, and there is no error superposition, which improves the accuracy of mass transfer.

[0083] Furthermore, the limiting block 243 includes a fixing sleeve 2431 and a slider 2432;

[0084] The fixed sleeve 2431 is fixedly disposed at the bottom of the electromagnet 241, and the upper part of the slider 2432 is slidably disposed inside the fixed sleeve 2431;

[0085] The second elastic element 242 is located inside the fixed sleeve 2431. The upper end of the second elastic element 242 is connected to the electromagnet 241, and the lower end of the second elastic element 242 is connected to the slider 2432.

[0086] The lower part of the slider 2432 is inverted cone-shaped.

[0087] By designing the limiting block 243 as a two-part structure comprising a fixed sleeve 2431 and a slider 2432, the entire device can move more flexibly under the action of the electromagnet 241. The upper part of the slider 2432 slides inside the fixed sleeve 2431, which provides guidance and stable support for the slider 2432's up-and-down movement. This effectively prevents the transfer component 23 from impacting the limiting component 24 due to inertia during rapid rotational transfer.

[0088] The two ends of the second elastic element 242 are connected to the electromagnet 241 and the slider 2432 respectively, and the second elastic element 242 is always inside the fixed sleeve 2431. This allows for more efficient use of space and avoids interference from the external environment if the second elastic element 242 is exposed. At the same time, this arrangement also allows the elastic element to better perform its function, providing a stable restoring force for the slider 2432 and ensuring that the device can quickly return to its initial position when power is lost or demagnetized.

[0089] The lower part of slider 2432 is designed in an inverted cone shape. This shape allows the slider to more easily adapt and adjust to the limiting member 231 of the transfer assembly 23, thus achieving the limiting function. The inverted cone design increases the contact area between slider 2432 and limiting member 231, thereby improving the stability and reliability of the limiting. In addition, the inclined transition design of the inverted cone also helps to reduce rigid collisions and wear between slider 2432 and limiting member 231, extending the service life of the device.

[0090] Furthermore, the transfer assembly 23 also includes an elastic top plate 234;

[0091] The two ends of the elastic top plate 234 are respectively connected to the two limiting members 231, and the elastic top plate 234 is located above the first elastic member 232;

[0092] The top of the elastic top plate is flat, and when the transfer component moves relative to the limiting component, the bottom of the slider abuts against the top of the elastic top plate.

[0093] When the electromagnet 241 attracts the limiting block 243, the bottom of the slider 2432 is at a height higher than the top of the elastic top plate 234.

[0094] By adding an elastic top plate 234 to the transfer assembly 23 and connecting it to the two limiting members 231, a more stable structure can be formed. The elastic top plate 234 needs to have deformation characteristics to accommodate the transfer assembly 23 to the material feeding area 03 and the material picking area 04 located in the second and fourth parts.

[0095] When the electromagnet 241 attracts the limiting block 243, the bottom of the slider 2432 is at a height higher than the top of the elastic top plate 234. Specifically, as the transfer assembly 23 rotates with the rotating component 22, the top of the elastic top plate 234 of the transfer assembly 23 abuts against the bottom of the slider 2432, or the bottom of the slider 2432 is higher than the top of the elastic top plate 234. This arrangement allows the transfer assembly 23 to pass smoothly during the transfer process without being blocked by the limiting component. Furthermore, since the electromagnet of the limiting component responds quickly to power on and off, during the transfer process, the top of the transfer component 23 (elastic top plate 234) with a flat top abuts against the bottom of the slider 2432. When the electromagnet is de-energized before the rotating part 22, the slider 2432 pops down. The inclined surface of the inverted conical bottom of the slider 2432 acts on the transfer component 23, which stops rotating after being de-energized, and limits and adjusts the position of the transfer component 23, so that the transfer component 23 stops accurately in the material picking area 01 / material discharging area 02.

[0096] Furthermore, the picking station and the unloading station are each equipped with a three-way movable carrier. The three-way movable carrier located at the picking station is used to install the wafer disk, and the three-way movable carrier located at the unloading station is used to install the circuit board.

[0097] The feeding station 12 is equipped with a physical field component, which is used to generate a physical field to cause the first elastic member 232 to deform.

[0098] The three-way movable carrier 110 can move freely in three directions (such as the X, Y, and Z axes), making the installation process of wafer disks or circuit boards more flexible and convenient. By precisely controlling the movement of the three-way movable carrier 110, it can be ensured that wafer disks or circuit boards are accurately placed in predetermined positions at the pick-up station 11 or the unload station 12, thereby improving the accuracy and efficiency of mass transfer. Figure 1 Only the three-way movable vehicle at the material picking station is shown; the three-way movable vehicle at the material unloading station is not shown.

[0099] By setting a physical field component at the unloading station 12 to generate a physical field (such as an electromagnetic field or an electrostatic field), the physical field is indirectly applied to the transfer component located in the unloading area 02, thereby achieving precise control over the deformation of the first elastic element 232. This adjusts the distance between each transfer head 233 of the transfer component located in the unloading area 02 to meet the chip mounting requirements of different circuit boards.

[0100] A transfer method using the aforementioned mass transfer device includes the following steps:

[0101] S100, Start the rotary transfer mechanism 20, and calibrate the four sets of transfer components 23, which are respectively located in the material pick-up area 01, the material waiting area 03, the material feeding area 02 and the material waiting pick-up area 04.

[0102] S200. Before transfer, an alignment operation is performed. A wafer disk is installed at the three-way movable carrier 110 of the pick-up station 11, and the chip on the wafer disk is aligned with the transfer component 23 located in the pick-up area of ​​the rotary transfer mechanism 20 by adjusting the three-way movable carrier 110. The circuit board to be mounted is placed at the unloading station 12, and the unloading space on the circuit board to be mounted is aligned with the transfer component 23 located in the unloading area 02 by adjusting the three-way movable carrier.

[0103] S300: The transfer component 23 located in the pick-up area 01 picks up the chip from the wafer disk at the pick-up station 11; the transfer component 23 located in the unloading area 03 unloads and mounts the circuit board to be mounted at the unloading station 12; and the transfer components 23 located in the unloading area 03 and the pick-up area 04 wait. Specifically, during the initial power-on operation, since all four sets of transfer components 23 are in an unloaded state, when the two sets of transfer components 23 located in the pick-up area 01 and the unloading area 02 simultaneously pick up and unload, the transfer component 23 in the unloading area 02 does not actually mount the circuit board, which does not affect subsequent operations.

[0104] S400 After completing one round of material picking and unloading simultaneously, the rotating component 22 is energized, and the four sets of transfer components 23 located on the transmission belt 221 are synchronously and in the same direction transferred to the next area; at the same time, the wafer disk and the circuit board move under the action of the three-way movable carrier 110 respectively. The wafer disk moves to the next picking position, waiting for the next set of transfer components 23 to pick it up, and the circuit board moves to the next unloading position, waiting for the next set of transfer components 23 to unload it;

[0105] After the four sets of transfer components 23 are in place, the rotating component 22 is de-energized and stops rotating. This is equivalent to the transfer component 23 that completed the material picking in step S300 being transferred to the material waiting area 03; similarly, the transfer component 23 in the material waiting area 03 is transferred to the material feeding area 02 to feed the material; the transfer component 23 in the material feeding area 02 is transferred to the material waiting area 04 to wait; and the transfer component 23 in the material waiting area 04 is transferred to the material picking area 01 to pick the material.

[0106] After the rotating component 22 drives the four sets of transfer components 23 to change positions in step S500, step S300 is repeated so that the transfer components 23 located in the material picking area 01 and the material discharging area 02 can simultaneously pick up and discharge materials. After the synchronous picking up and discharging is completed, step S400 is repeated so that the rotating component 22 drives the transfer components 23 to transfer.

[0107] By simultaneously controlling the start and stop positions of the transfer components 23 using the rotating component 22 and the limiting component 24—that is, by using synchronous control of the electrical system and mechanical components—the positions of the transfer components 23 within the pick-up area 01 and the unloading area 02 remain unchanged. Only one alignment operation is required between the wafer disk and the circuit board at the bottom of the pick-up area 01 and the unloading area 02, ensuring that each transfer component 23 does not require further alignment after reaching its position, and eliminating the accumulation of alignment errors, thus improving alignment accuracy. By activating the rotating component 22, each group of transfer components 23 can sequentially cyclically move between the four areas: the pick-up area 01, the unloading area 03, the unloading area 02, and the pick-up area 04. This cyclical movement mechanism ensures that the transfer components can continuously and efficiently perform pick-up and placement operations, thereby improving overall transfer efficiency.

[0108] Furthermore, in step S400, S410 is also included, where the limiting component 24 performs a limiting operation. The energizing time of the electromagnet 241 of the limiting component 24 is shorter than the energizing time of the rotating component 22. After the electromagnet 241 is de-energized, the limiting iron block 243 pops out, and the two limiting iron blocks 243 limit the transfer component 23 to the material picking area 01 or the material discharging area 02.

[0109] By introducing the limiting component 24, during the process of the rotating component 22 driving the transfer component 23 to move to a new position, the electromagnet 241 is energized, attracting the limiting iron block 243 to prevent interference between the limiting component 24 and the transfer component 23. When the electromagnet 241 is de-energized, it no longer attracts the limiting iron block 243, and the limiting iron block 243 pops downwards into the transfer path of the transfer component 23, thereby physically restricting the movement of the transfer component 23. This ensures that the transfer component 23 can accurately stop at a predetermined position (such as the picking area 01 or the discharging area 02) after each movement, avoiding picking or discharging errors caused by positional deviations.

[0110] The energizing time of the electromagnet 241 is shorter than that of the rotating component 22, so as to ensure that the de-energizing of the limiting component precedes the stopping action of the transmission belt 221, so that the limiting component can effectively mechanically limit the transfer component 23.

[0111] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the invention and should not be construed as limiting the scope of protection of the invention in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of the invention without inventive effort, and these embodiments will all fall within the scope of protection of the present invention.

Claims

1. A mass transfer device, characterized by: The operation table and the rotary transfer mechanism are included; The operation table is provided with a material taking station and a material placing station, the material taking station is used for placing a wafer disc, and the material placing station is used for placing a circuit substrate; The rotary transfer mechanism is arranged above the operation table, the rotary transfer mechanism includes a mounting seat, a rotating part, a driving part and four groups of transfer assemblies, the driving part is mounted on the mounting seat, the rotating part is movably arranged on the side wall of the mounting seat, the driving part is used for driving the rotating part to move around the mounting seat, and four groups of the transfer assemblies are spacedly mounted on the rotating part; When one group of the transfer assemblies is located above the material taking station, another group of the transfer assemblies is located above the material placing station, and two groups of the transfer assemblies simultaneously implement material taking and material placing; The rotating part includes a first part, a second part, a third part and a fourth part which are sequentially connected; four directions of the rotary transfer mechanism, i.e. left, right, front and back, are respectively used as a material taking area, a material placing area, a material placing standby area and a material taking standby area, when the rotating part moves, the first part, the second part, the third part and the fourth part can be respectively located in the material taking area, the material placing area, the material placing standby area and the material taking standby area; the transfer assemblies are four groups, four groups of the transfer assemblies are respectively arranged on the first part, the second part, the third part and the fourth part, the driving part drives four groups of the transfer assemblies to sequentially and circularly pass through the material taking area, the material placing standby area, the material placing area and the material taking standby area by driving the rotating part; when one group of the transfer assemblies is located in the material taking area, the other three groups of the transfer assemblies are respectively located in the material placing standby area, the material placing area and the material taking standby area; when the transfer assembly located in the material taking area implements material taking, the transfer assembly located in the material placing area implements material placing; The rotary transfer mechanism includes two groups of limiting assemblies, two groups of the limiting assemblies are mounted on the mounting seat through a mounting frame; one group of the limiting assemblies is located above the material taking area, and the one group of the limiting assemblies is used for limiting the transfer assemblies in the material taking area, and the other group of the limiting assemblies is located above the material placing area, and the other group of the limiting assemblies is used for limiting the transfer assemblies in the material placing area; The transfer assembly includes a limiting part, a first elastic part and a plurality of transfer heads; two limiting parts are mounted on the rotating part in front of and behind each other, two ends of the first elastic part are respectively connected with the two limiting parts, and a plurality of transfer heads are spacedly mounted on the first elastic part; Each of the limiting assemblies comprises two electromagnetic adsorption sub-assemblies, the two electromagnetic adsorption sub-assemblies are arranged opposite to each other, and the distance between the two electromagnetic adsorption sub-assemblies is equal to the length of the transfer assembly; the electromagnetic adsorption sub-assembly comprises an electromagnet, a second elastic member and a limiting iron block, the electromagnet is mounted on the mounting frame, and the limiting iron block is arranged below the electromagnet through the second elastic member; when the electromagnet is powered on, the electromagnet adsorbs the limiting iron block, and the limiting iron block does not interfere with the transfer assembly; when the electromagnet is powered off, the electromagnet does not adsorb the limiting iron block, and the two limiting iron blocks are respectively located on the front and back sides of the two limiting members.

2. A mass transfer device according to claim 1, wherein: The rotating member is a transmission belt, the driving member comprises two transmission rollers and a driver, the transmission rollers are mounted on the mounting seat, the central axes of the two transmission rollers are parallel to each other, the transmission belt is sleeved on the outside of the two transmission rollers, and the driver drives the transmission belt to rotate by driving the transmission rollers to rotate; Four groups of the transfer assemblies are arranged at intervals on the outside of the transmission belt.

3. A mass transfer device according to claim 2, wherein: The limiting iron block comprises a fixed sleeve and a sliding block; The fixed sleeve is fixedly arranged at the bottom of the electromagnet, and the upper portion of the sliding block is slidably arranged in the inside of the fixed sleeve; The second elastic member is located in the inside of the fixed sleeve, the upper end of the second elastic member is connected with the electromagnet, and the lower end of the second elastic member is connected with the sliding block; The lower portion of the sliding block is in an inverted conical shape.

4. A mass transfer device according to claim 3, wherein: The transfer assembly further comprises an elastic top plate; The two ends of the elastic top plate are respectively connected with the two limiting members, and the elastic top plate is located above the first elastic member; The top portion of the elastic top plate is flat, and when the transfer assembly moves relative to the limiting assembly, the bottom portion of the sliding block abuts against the top portion of the elastic top plate.

5. A mass transfer device according to claim 4, wherein: The material taking station and the material placing station are respectively provided with three-directional movable carriers, the three-directional movable carrier located at the material taking station is used for mounting the wafer disc, and the three-directional movable carrier located at the material placing station is used for mounting the circuit substrate; The material placing station is provided with a physical field assembly, and the physical field assembly is used for generating a physical field to deform the first elastic member.

6. A transfer method using the mass transfer apparatus according to any one of claims 1 to 5, characterized by, The method comprises the following steps: S100, starting the rotating transfer mechanism, and calibrating four groups of transfer assemblies to be respectively located at a material taking area, a material placing area, a material placing area and a material taking area; S200, placing the wafer disc at the material taking station and placing the circuit substrate to be mounted at the material placing station; aligning the wafer disc with the transfer assembly on the material taking area, and aligning the circuit substrate with the transfer assembly on the material placing area; S300, the transfer assembly located at the material taking area takes material, the transfer assembly located at the material placing area places material, and the transfer assemblies located at the material placing area and the material taking area wait; S400, the rotating member is powered on, and the four groups of transfer assemblies start to rotate synchronously; after the transfer assemblies are transferred to the next area respectively, the rotating member is powered off to stop rotating; S500, repeating S300 and S400 to realize mass transfer.

Images