Display panel, manufacturing method of display panel and display equipment

Abstract

The invention provides a display panel, a display device and a manufacturing method of the display panel, the display panel comprises a display area and a non-display area which are connected, the non-display area surrounds the display area, the non-display area comprises a jaw partition, and the display panel comprises a substrate, a driving circuit layer, a first packaging layer and a first touch line; the driving circuit layer is arranged on one side of the substrate, and the driving circuit layer comprises a first wire corresponding to the chin partition; the first packaging layer is arranged on one side, deviating from the substrate, of the driving circuit layer; the first touch line is arranged on one side, deviating from the substrate, of the first packaging layer and corresponds to the jaw partition; wherein the orthographic projection of the first touch line located in the jaw zone on the plane where the substrate is located and the orthographic projection of the first wire located in the jaw zone on the plane where the substrate is located are out of the orthographic projection of the first touch line located in the jaw zone. Therefore, the first touch line and the first wire are not overlapped in the chin partition, the condition that the first touch line is easy to break at the side etching position of the first wire is avoided, smooth signal transmission can be ensured, and the risk that the display panel breaks down is reduced.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] As electronic display devices are widely used, people have higher requirements for the performance of electronic display devices. Display panels based on technologies such as organic light emitting diodes (OLED) and light emitting diodes (LED) are widely used in various electronic display devices such as mobile phones, televisions, laptops, and desktop computers due to their advantages of high image quality, power saving, and thin body.

[0003] In the related art, the display panel includes overlapping metal traces, and some metal traces are easily broken at the overlapping parts. The broken metal traces may cause interruption of signal transmission and cause the display panel to have a malfunction in use. Summary of the invention

[0004] In order to solve the above problems, embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel, so as to at least partially solve the above problems.

[0005] In a first aspect, the present application provides a display panel, the display panel comprising a display area and a non-display area connected to each other, the non-display area surrounds the display area, the non-display area includes a chin partition, and the display panel further comprises:

[0006] substrate;

[0007] A driving circuit layer, the driving circuit layer is arranged on one side of the substrate, and the driving circuit layer includes a first wiring corresponding to the chin partition;

[0008] a first encapsulation layer, the first encapsulation layer being arranged on a side of the driving circuit layer away from the substrate;

[0009] a first touch line, which is disposed on a side of the first encapsulation layer away from the substrate and corresponds to the chin partition;

[0010] The orthographic projection of the first touch line located in the chin partition on the surface where the substrate is located is outside the orthographic projection of the first routing line located in the chin partition on the surface where the substrate is located.

[0011] In one embodiment, the display panel also includes a second packaging layer and a second touch line, the second packaging layer is arranged on a side of the first touch line and the first packaging layer away from the substrate, the second touch line is arranged on a side of the second packaging layer away from the substrate, and corresponds to the chin partition; the second packaging layer includes a first via hole, and the second touch line is electrically connected to the first touch line via the first via hole; the orthographic projection of the second touch line on the substrate is located within the orthographic projection range of the first touch line on the substrate; or, the orthographic projection of the second touch line on the substrate coincides with the orthographic projection of the first touch line on the substrate.

[0012] In one embodiment, the driving circuit layer also includes an insulating filling structure and a second routing line, the insulating filling structure is arranged between the first routing line and the second routing line, and covers the side of the first routing line and the second routing line facing away from the substrate; the first touch line is arranged on the side of the insulating filling structure facing away from the substrate; the orthographic projection of the first touch line located in the chin partition on the surface where the substrate is located overlaps with the orthographic projection of the second routing located in the chin partition on the surface where the substrate is located, and the display panel also includes a second via hole, the second via hole passes through the insulating filling structure and the first packaging layer, and the first touch line is conductively contacted with the second routing line via the second via hole.

[0013] In one embodiment, the first touch control line and the second touch control line are both touch control metal wirings.

[0014] In one embodiment, an edge of the first routing line located in the chin partition has an inner groove, and a portion of the first packaging layer is filled in the inner groove.

[0015] In one embodiment, the first wiring includes a first layer, a second layer and a third layer stacked in sequence along a direction away from the substrate, the first layer and the third layer are made of the same material, and the second layer and the third layer are made of different materials; preferably, the first layer and the third layer are made of metal titanium, and the second layer is made of metal aluminum.

[0016] In one embodiment, the display panel further includes a display area, the display panel includes a light-emitting unit, the display area is connected to the chin partition, the light-emitting unit is arranged in the display area, and the light-emitting unit is electrically connected to the driving circuit layer.

[0017] In a second aspect, the present application provides a method for manufacturing a display panel, the manufacturing method comprising:

[0018] A backplane is provided, the backplane comprising a substrate, a driving circuit layer and a first packaging layer stacked in sequence, the driving circuit layer comprising a first trace corresponding to the chin partition;

[0019] Disposing a first metal film layer on a side of the first packaging layer away from the substrate;

[0020] The first metal film layer is etched to obtain a first touch line corresponding to the chin partition, wherein the orthographic projection of the first touch line located in the chin partition on the surface where the substrate is located is outside the orthographic projection of the first line located in the chin partition on the surface where the substrate is located.

[0021] In one embodiment, the manufacturing method further comprises:

[0022] forming a second packaging layer on a side of the first metal film layer and the first packaging layer away from the substrate;

[0023] Etching the second packaging layer to obtain a first via hole, wherein a portion of the first touch line is exposed in the first via hole;

[0024] A second metal film layer is disposed on a side of the second packaging layer away from the substrate, wherein the second metal film layer fills the first via hole;

[0025] The second metal film layer is etched to obtain a second touch line, wherein the second touch line is electrically connected to the first touch line via the first via hole; and the orthographic projection of the second touch line on the surface of the substrate is within the orthographic projection range of the first touch line on the surface of the substrate.

[0026] In a third aspect, the present application provides a display device, wherein the display device comprises the above-mentioned display panel.

[0027] Based on the above-mentioned display panel provided by the present application, since the orthographic projection of the first touch line in the chin partition of the substrate is located outside the orthographic projection of the first routing line in the chin partition of the substrate, the first touch line and the first routing line do not overlap in the chin partition, thereby preventing the first touch line from overlapping with the side etching position of the first routing line, thereby preventing the first touch line from being easily broken at the side etching position of the first routing line, ensuring smooth signal transmission and reducing the risk of display panel failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The following drawings are intended only to illustrate and explain the present application, and do not limit the scope of the present application.

[0029] Figure 1a It is a planar schematic diagram of a display panel in the related art;

[0030] Figure 1b is a schematic diagram of an orthographic projection of a part of the structure of the chin partition on a substrate in the related art;

[0031] Figure 1c The display panel is Figure 1b A schematic cross-sectional view of the position A of FIG.

[0032] Figure 2 is a schematic diagram of an orthographic projection of a partial structure of a chin partition on a substrate in a display panel provided according to some embodiments of the present application;

[0033] Figure 3 is Figure 2 At BB in the middle, a cross-sectional schematic diagram of a display panel provided by the present application;

[0034] Figure 4 is Figure 2 At BB in the middle, a cross-sectional schematic diagram of another display panel provided by the present application;

[0035] Figure 5 It is a partial structural schematic diagram of a display panel provided by the present application;

[0036] Figure 6 is a partial structural schematic diagram of another display panel provided by the present application;

[0037] Figure 7 It is a flow chart of a method for manufacturing a display panel provided in the present application.

[0038] Description of reference numerals:

[0039] 11-substrate, 12-first control wiring, 13-packaging layer, 14-second control wiring;

[0040] B1-display area, B2-chin partition;

[0041] 20-substrate, 30-driving circuit layer,

[0042] 31-first routing, 311-first layer, 312-second layer, 313-third layer, 310-inner groove;

[0043] 32-second routing, 33-insulation filling structure;

[0044] 41-first encapsulation layer, 42-second encapsulation layer,

[0045] 51 - first touch line, 52 - second touch line, 61 - first via hole, 62 - second via hole, 70 - light emitting unit;

[0046] S81, providing a backplane, the backplane comprising a substrate, a driving circuit layer, and a first packaging layer stacked in sequence, the driving circuit layer comprising a first trace corresponding to the chin partition;

[0047] S82, disposing a first metal film layer on a side of the first packaging layer away from the substrate;

[0048] S83, etching the first metal film layer to obtain a first touch line corresponding to the chin partition, wherein the orthographic projection of the first touch line in the chin partition on the surface where the substrate is located is outside the orthographic projection of the first trace in the chin partition on the surface where the substrate is located. DETAILED DESCRIPTION

[0049] In order to have a clearer understanding of the technical features, purposes and effects of the embodiments of the present application, the specific implementation methods of the embodiments of the present application are now described with reference to the accompanying drawings.

[0050] In this document, “exemplary” means “serving as an example, instance or illustration”, and any diagram or implementation described in this document as “exemplary” should not be interpreted as a more preferred or more advantageous technical solution.

[0051] In order to simplify the drawings, only the parts related to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one or more of the parts with the same structure or function are schematically drawn or only one or more of them are marked.

[0052] In the related art, reference Figure 1a , Figure 1b and 1c The display panel includes a display area 101 and a chin partition 102. The display panel includes a substrate 11, a packaging layer 13, a first control line 12, and a second control line 14. The first control line 12, the packaging layer 13, and the second control line 14 are sequentially stacked on the same side of the substrate 11. The first control line 12, the second control line 14, and the packaging layer 13 are continuously distributed in the display area 101 and the chin partition 102. The orthographic projection of the second control line 14 in the chin partition 102 on the substrate 11 overlaps with the orthographic projection of the first control line 12 in the chin partition 102 on the substrate 11.

[0053] In the related art, the manufacturing process of the display panel is as follows: first, a plurality of spaced first control lines 12 are formed in the chin partition 102 by deposition and etching processes, then the entire surface is deposited to obtain the encapsulation layer 12, and then a plurality of spaced second control lines 14 are obtained on the encapsulation layer 12 by deposition and etching processes.

[0054] Since the side etching position of the first control line 12 is prone to concave, the encapsulation layer 13 is deposited abnormally there, which causes the film layer of the second control line 14 to be poorly formed at the concave position when depositing the film layer, and there are abnormalities such as microcracks, which makes the second control line 14 easy to break. Figure 1c As shown, the signal transmission is interrupted.

[0055] In order to solve the above technical problems, the present application provides a display panel, referring to Figure 2 and Figure 3 The display panel includes a display area B1 and a non-display area connected to each other, the non-display area surrounds the display area, and the non-display area includes a chin sub-area B2. The display panel includes a substrate 20, a driving circuit layer 30, a first packaging layer 41, and a first touch line 51; the driving circuit layer 30 is arranged on one side of the substrate 20, and the driving circuit layer 30 includes a first routing line 31 corresponding to the chin sub-area B2; the first packaging layer 41 is arranged on the side of the driving circuit layer 30 away from the substrate 20; the first touch line 51 is arranged on the side of the first packaging layer 41 away from the substrate 20, and corresponds to the chin sub-area B2; wherein, the orthographic projection of the first touch line 51 located in the chin sub-area B2 on the surface where the substrate 20 is located is outside the orthographic projection of the first routing line 31 located in the chin sub-area B2 on the surface where the substrate 20 is located.

[0056] Based on the above technical solution, since the orthographic projection of the first touch line 51 in the chin partition B2 toward the surface where the substrate 20 is located is outside the orthographic projection of the first routing line 31 in the chin partition B2 toward the surface where the substrate 20 is located, it can be known that the first touch line 51 and the first routing line 31 do not overlap in the chin partition B2, thereby preventing the first touch line 51 from overlapping with the first routing line 31, thereby preventing the first touch line 51 from being easily broken at the side etching position of the first routing line 31, ensuring smooth signal transmission of the first touch line 51 and reducing the risk of display panel failure. In addition, the first routing line 31 and the first touch line 51 do not overlap in the chin partition B2, which can also reduce electromagnetic interference between each other, so that the display panel has a good display effect and improves the user experience.

[0057] Among them, the first touch line 51 can be used to transmit touch signals. The display panel can emit light and display in the display area B1. The chin partition B2 can be used to set structures such as a driver chip, and various wirings can extend from the display area B1 to the chin partition B2, so as to be electrically connected to the driver chip in the chin partition. For example, the first touch line 51 extends from the display area B1 to the chin partition B2, and is electrically connected to the driver chip in the chin partition B2.

[0058] In one example, the chin partition B2 is a part of the non-display area. For example, the chin partition B2 is located at the lower side of the display area B1, and non-display areas are distributed on the upper side, left side, and right side of the display area B1.

[0059] In one example, the chin partition B2 can be bent, thereby reducing the border size of the display panel.

[0060] In one embodiment, reference Figure 2 The display panel further includes a driving chip, which is disposed at one end of the chin partition B2 away from the display area B1 and is electrically connected to the driving circuit layer 30. In this way, the first wiring 31 and the first touch line 51 can be electrically connected to the driving chip, and can transmit signals to the driving chip, or the driving signal generated by the driving chip can be transmitted to the first wiring 31 or the first touch line 51 via the driving circuit layer.

[0061] In an example, the first touch control line 51 is a metal wiring. Thus, the first touch control line 51 can make the display panel have a good touch function and a low failure rate.

[0062] In one possible implementation, reference Figure 4 The display panel further includes a second encapsulation layer 42 and a second touch line 52. The second encapsulation layer 42 is arranged on a side of the first touch line 51 and the first encapsulation layer 41 away from the substrate 20. The second touch line 52 is arranged on a side of the second encapsulation layer 42 away from the substrate 20 and corresponds to the chin area B2. The second encapsulation layer 42 includes a first via hole 61. The second touch line 52 is electrically connected to the first touch line 51 via the first via hole 61. The orthographic projection of the second touch line 52 on the surface where the substrate 20 is located is located within the range of the orthographic projection of the first touch line 51 on the surface where the substrate 20 is located. Alternatively, the orthographic projection of the second touch line 52 on the substrate 20 coincides with the orthographic projection of the first touch line 51 on the substrate 20.

[0063] Based on the above technical solution, the first touch line 51 and the second touch line 52 are in parallel and can be used to transmit the same signal. When the first touch line 51 is manufactured, if the first touch line 51 is broken due to the particle debris in the manufacturing process causing the first touch line 51 to be poorly formed, the signal can still be transmitted through the second touch line 52, ensuring smooth signal transmission and reducing the risk of display panel failure.

[0064] In one example, the display panel may include a touch circuit arranged in the display area B1, and the first touch line 52 and the second touch line 52 may both extend from the display area B1 to the chin partition B2, and the first touch line 52 and the second touch line 52 may both be electrically connected to the touch circuit in the display area B1 and electrically connected to the driving chip in the chin partition B2.

[0065] In one possible embodiment, reference Figure 5 or Figure 6 The driving circuit layer 30 also includes an insulating filling structure 33 and a second wiring 32. The insulating filling structure 33 is arranged between the first wiring 31 and the second wiring 32, and covers the side of the first wiring 31 and the second wiring 32 away from the substrate 20. The first touch line 51 is arranged on the side of the insulating filling structure 33 away from the substrate 20; the orthographic projection of the first touch line 51 located in the chin partition B2 on the surface where the substrate 20 is located overlaps with the orthographic projection of the second wiring 32 located in the chin partition B2 on the surface where the substrate 20 is located. The display panel also includes a second via hole 62. The second via hole 62 passes through the insulating filling structure and the first packaging layer 41. The first touch line 51 is conductively contacted with the second wiring 32 via the second via hole 62. It can be seen from the above technical solution that by setting the second via 62, the first touch line 51 and the second wiring 32 of the driving circuit layer 30 can be electrically connected, so that the touch signal on the first touch line 51 can be transmitted, and then the second touch line 52 is electrically connected to the driving circuit layer 30 through the second via 62, the first via 61 and the driving circuit layer 30.

[0066] In one embodiment, the first touch line 51 and the second touch line 52 are both touch metal wirings. In this way, the first touch line 51 and / or the second touch line 52 can make the display panel have good touch function and low failure rate.

[0067] Among them, the touch metal wiring needs to have a conductive function during use and also have high transparency to reduce the impact on the display state, so the touch metal wiring can be formed of at least one material such as indium tin oxide, indium gallium zinc oxide, nano silver, conductive polymer and graphene. For the first wiring 31 and the second wiring 32, in order to ensure that the display panel has good display color and display brightness, metal conductive materials such as copper, aluminum, chromium, molybdenum, gold and silver can be used, and transparent conductive materials such as indium tin oxide or indium gallium zinc oxide can also be used to ensure good conductivity and durability, which will not be repeated here.

[0068] In one example, the insulating filling structure 33 is an organic insulating material, which may be a common polymer (PMMA, PS), a polymer derivative with a phenolic group, an acrylic polymer, an imide polymer, an aromatic ether-based polymer, an amide-based polymer, a fluorine-based polymer, a paraxylene-based polymer, a vinyl alcohol-based polymer, and a mixture thereof.

[0069] In one example, the material of the first encapsulation layer 41 is the same as the material of the second encapsulation layer 42. In one example, the first encapsulation layer 41 and the second encapsulation layer 42 are both inorganic materials.

[0070] In one possible implementation, reference Figure 3, the edge of the first wiring 31 located at the chin partition B2 has an inner groove 310, and part of the first encapsulation layer 41 is filled in the inner groove 310. The inner groove 310 at the edge of the first wiring 31 is formed because in the process of forming the first wiring 31 by etching, since the first wiring 31 includes multiple film layers, and the etching rates of different film layers are different, after the etching is completed, the inner groove 310 is formed at the edge of the first wiring 31. Filling part of the first encapsulation layer 41 in the inner groove 310 can protect the first wiring 31 and play a role in isolating water and oxygen.

[0071] In one embodiment, reference Figure 3 The first trace 31 includes a first layer 311, a second layer 312 and a third layer 313 stacked in sequence in a direction away from the substrate 20, the first layer 311 and the third layer 313 are made of the same material, and the second layer 312 and the third layer 313 are made of different materials.

[0072] In one example, the materials of the first layer 311 and the third layer 313 are both metal titanium, and the material of the second layer 312 is metal aluminum. The first trace 31 can be obtained by an etching process. Since the etching resistance of metal aluminum is poor and the etching resistance of metal titanium is good, the etching of the second layer 312 will be faster, so that the first layer 311 protrudes from the side wall of the second layer 312 along the extension direction of the substrate 20, and the third layer 313 protrudes from the side wall of the second layer 312 along the extension direction of the substrate 20.

[0073] In one embodiment, reference Figure 2 The display panel further includes a light emitting unit 70, which is disposed in the display area B1 and is electrically connected to the driving circuit layer 30. The driving circuit layer 30 transmits a driving signal to the light emitting unit 70 to control the light emission of the light emitting unit 70.

[0074] In one example, the first routing line 31 and the second routing line 32 can both extend from the display area B1 to the chin partition B2, and the first routing line 31 and the second routing line 32 can both be electrically connected to the light-emitting unit 70 in the display area B1 and electrically connected to the driving chip in the chin partition B2, and the first routing line 31 and the second routing line 32 can be used to transmit different driving signals.

[0075] Specifically, the substrate can be a glass substrate, CPI (transparent polyimide), PI (polyimide), PET (polyethylene terephthalate) and PEN (polyethylene naphthalate), etc. This embodiment does not specifically limit the material of the substrate, and different materials can be selected to make the substrate according to actual needs.

[0076] The present application also provides a method for manufacturing a display panel, referring to Figure 7 , Figure 2 and Figure 3 , the preparation method comprises:

[0077] S81, providing a backplane, the backplane comprising a substrate 20, a driving circuit layer 30 and a first packaging layer 41 stacked in sequence, the driving circuit layer 30 comprising a first trace 31 corresponding to the chin partition;

[0078] S82, disposing a first metal film layer on a side of the first packaging layer 41 facing away from the substrate 20;

[0079] S83, etching the first metal film layer to obtain a first touch line 51 corresponding to the chin partition B2, wherein the orthographic projection of the first touch line 51 located in the chin partition B2 on the surface where the substrate 20 is located is outside the orthographic projection of the first trace 31 located in the chin partition on the surface where the substrate 20 is located.

[0080] Obviously, in the display panel manufactured by the above method, since the orthographic projection of the first touch line 51 in the chin partition of the substrate 20 is located outside the orthographic projection of the first routing line 31 in the chin partition of the substrate 20, the first touch line 51 and the first routing line 31 do not overlap in the chin partition, thereby preventing the first touch line 51 from overlapping with the side etching position of the first routing line 31, thereby preventing the first touch line 51 from being easily broken at the side etching position of the first routing line 31, ensuring smooth signal transmission and reducing the risk of display panel failure.

[0081] In one embodiment, the manufacturing method further comprises:

[0082] A second encapsulation layer 42 is formed on a side of the first metal film layer and the first encapsulation layer 41 away from the substrate 20;

[0083] The second encapsulation layer 42 is etched to obtain a first via hole 61, wherein a portion of the first touch line 51 is exposed in the first via hole 61;

[0084] A second metal film layer is disposed on a side of the second packaging layer 42 facing away from the substrate 20 , and the second metal film layer fills the first via hole 61 ;

[0085] The second metal film layer is etched to obtain a second touch line 52, and the second touch line 52 corresponds to the chin area B2. The second touch line 52 is electrically connected to the first touch line 51 via the first via hole 61. The orthographic projection of the second touch line 52 located in the chin area B2 on the surface where the substrate 20 is located is within the orthographic projection range of the first touch line 51 on the surface where the substrate 20 is located or overlaps. For details, please refer to Figure 4 or Figure 6 .

[0086] Obviously, in the display panel manufactured by the above method, the first touch line 51 and the second touch line 52 are in parallel and can be used to transmit the same signal. When the first touch line 51 is manufactured, if the first touch line 51 is broken due to the poor film formation of the first touch line 51 caused by particles and impurities in the manufacturing process, the signal can still be transmitted through the second touch line 52, ensuring smooth signal transmission and reducing the risk of display panel failure.

[0087] In one embodiment, before the first metal film layer is provided on the side of the first packaging layer 41 facing away from the substrate 20, the manufacturing method further includes: etching the first packaging layer 41 to obtain a second via hole 62, and a portion of the second wiring 32 of the driving circuit layer 30 is exposed in the second via hole 62. In this way, after the first metal film layer is formed, the first metal film layer is filled in the second via hole 62, and the first touch line 51 obtained by the first metal film layer can be electrically connected to the second wiring 32 through the second via hole 62, thereby achieving electrical connection with the driving circuit layer 30.

[0088] In addition, in the manufacturing method provided in the present application, the backplane further includes a light emitting unit 70 located in the display area of ​​the display panel, wherein the first touch control line 51 and the second touch control line 52 can be transparent and conductive touch control metal wirings.

[0089] The present application also provides a display device, the display device comprising the above display panel. Based on the beneficial effects of the above display panel, the display device has the advantage of a low probability of dark spots appearing.

[0090] The display device can be applied to smart wearable devices (such as smart bracelets and smart watches), and can also be applied to smart phones, tablet computers, monitors and other devices. Other essential components of the display device should be understood by ordinary technicians in the field, and will not be repeated here, nor should they be used as limitations of the present invention.

[0091] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0092] It should be understood that although the specific embodiments of the present application are described in detail in conjunction with the accompanying drawings, it should not be understood as limiting the scope of protection of the present application. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still fall within the scope of protection of the present application. Although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises a display area (B1) and a non-display area connected to each other, the non-display area surrounds the display area, the non-display area comprises a chin area (B2), and the display panel comprises: substrate(20); A driving circuit layer (30), the driving circuit layer (30) being arranged on one side of the substrate (20), the driving circuit layer (30) comprising a first wiring (31) corresponding to the chin partition (B2); a first encapsulation layer (41), the first encapsulation layer (41) being arranged on a side of the driving circuit layer (30) facing away from the substrate (20); A first touch line (51), the first touch line (51) being arranged on a side of the first encapsulation layer (41) away from the substrate (20) and corresponding to the chin partition (B2); The orthographic projection of the first touch line (51) located in the chin partition (B2) on the surface where the substrate (20) is located is outside the orthographic projection of the first routing line (31) located in the chin partition (B2) on the surface where the substrate (20) is located.

2. The display panel according to claim 1, characterized in that: The display panel further comprises a second encapsulation layer (42) and a second touch line (52), wherein the second encapsulation layer (42) is arranged on a side of the first touch line (51) and the first encapsulation layer (41) away from the substrate (20), and the second touch line (52) is arranged on a side of the second encapsulation layer (42) away from the substrate (20) and corresponds to the chin partition (B2); The second encapsulation layer (42) comprises a first via hole (61), and the second touch line (52) is electrically connected to the first touch line (51) via the first via hole (61); the orthographic projection of the second touch line (52) on the substrate (20) is located within the orthographic projection range of the first touch line (51) on the substrate (20); or, the orthographic projection of the second touch line (52) on the substrate (20) coincides with the orthographic projection of the first touch line (51) on the substrate (20).

3. The display panel according to claim 1 or 2, characterized in that: The driving circuit layer (30) further comprises an insulating filling structure (33) and a second wiring (32), wherein the insulating filling structure (33) is arranged between the first wiring (31) and the second wiring (32), and covers a side of the first wiring (31) and the second wiring (32) that is away from the substrate (20); The first touch control line (51) is arranged on a side of the insulating filling structure (33) away from the substrate (20); The orthographic projection of the first touch line (51) located in the chin partition (B2) on the surface where the substrate (20) is located overlaps with the orthographic projection of the second routing line (32) located in the chin partition (B2) on the surface where the substrate (20) is located, and the display panel also includes a second via hole (62), the second via hole (62) passes through the insulating filling structure (33) and the first packaging layer (41), and the first touch line (51) is in conductive contact with the second routing line (32) via the second via hole (62).

4. The display panel according to claim 3, characterized in that: The first touch control line (51) and the second touch control line (52) are both touch control metal wirings.

5. The display panel according to claim 1, characterized in that: An edge of the first routing line (31) located in the chin partition has an inner groove (310), and a portion of the first packaging layer (41) is filled in the inner groove (310).

6. The display panel according to claim 1, characterized in that: The first wiring (31) comprises a first layer, a second layer and a third layer stacked in sequence in a direction away from the substrate (20), the first layer and the third layer are made of the same material, and the second layer and the third layer are made of different materials; Preferably, the materials of the first layer and the third layer are both metal titanium, and the material of the second layer is metal aluminum.

7. The display panel according to claim 1, characterized in that: The display panel further comprises a display area (B1), the display panel comprises a light-emitting unit (70), the display area (B1) is connected to the chin partition (B2), the light-emitting unit (70) is arranged in the display area (B1), and the light-emitting unit (70) is electrically connected to the driving circuit layer (30).

8. A method for manufacturing a display panel, characterized in that: The production method comprises: A backplane is provided, the backplane comprising a substrate (20), a driving circuit layer (30) and a first packaging layer (41) which are stacked in sequence, the driving circuit layer (30) comprising a first trace (31) corresponding to the chin partition; A first metal film layer is provided on a side of the first packaging layer (41) facing away from the substrate (20); The first metal film layer is etched to obtain a first touch line (51) corresponding to the chin partition, wherein the orthographic projection of the first touch line (51) located in the chin partition on the surface where the substrate (20) is located is outside the orthographic projection of the first routing line (31) located in the chin partition on the surface where the substrate (20) is located.

9. The method for manufacturing a display panel according to claim 8, characterized in that: The production method further comprises: forming a second packaging layer (42) on a side of the first metal film layer and the first packaging layer (41) facing away from the substrate (20); Etching the second packaging layer (42) to obtain a first via hole (61), wherein a portion of the first touch line (51) is exposed in the first via hole (61); A second metal film layer is provided on a side of the second packaging layer (42) facing away from the substrate (20), wherein the second metal film layer fills the first via hole (61); The second metal film layer is etched to obtain a second touch line (52), wherein the second touch line (52) is electrically connected to the first touch line (51) via the first via hole (61); and the orthographic projection of the second touch line (52) on the surface where the substrate (20) is located is located within the range of the orthographic projection of the first touch line (51) on the surface where the substrate (20) is located.

10. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 7.

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