Photovoltaic optimizer

Abstract

The invention provides a photovoltaic optimizer, the photovoltaic optimizer comprises a cover body, a heat dissipation plate, a mainboard and an insulation support member, the cover body is fixedly connected with the heat dissipation plate, and an accommodating cavity is formed between the cover body and the heat dissipation plate; the main board is located in the containing cavity, the insulation supporting piece is installed between the main board and the heat dissipation board and used for supporting the main board, the side face, in the first direction, of the insulation supporting piece is provided with at least one annular boss or at least one annular groove, and the first direction is perpendicular to the plane where the main board is located. According to the photovoltaic optimizer, the annular boss or the annular groove is arranged on the side face of the insulation supporting piece on the creepage path, the creepage distance is increased, the size of the whole photovoltaic optimizer or parts is reduced under the condition that the creepage distance limit value is met, and therefore the use amount of pouring sealant in the photovoltaic optimizer is reduced, and cost is reduced.

Description

Photovoltaic optimizer

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on August 25, 2023, with application number 202322308881.0 and application name “Photovoltaic Optimizer”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of photovoltaic technology, and more specifically, to a photovoltaic optimizer. Background Art

[0003] The outer casing of a photovoltaic optimizer is accessible and typically ungrounded, requiring reinforced insulation from the internal circuitry. Furthermore, the power supply contains high-voltage areas, requiring reinforced insulation from the metal casing to ensure personal safety.

[0004] PV optimizers are typically filled with potting compound to enhance insulation, preventing discharges between the mainboard and heat sink, as well as between the cable terminals and the PV optimizer's metal casing. Consequently, the clearance and creepage distances between the mainboard and heat sink, as well as between the cable terminals and the PV optimizer's metal casing, must meet certain limits. This means sacrificing internal space within the PV optimizer to meet these requirements, which increases potting compound usage and costs.

[0005] Summary of the Invention

[0006] The present application provides a photovoltaic optimizer that can reduce the overall size of the photovoltaic optimizer, reduce the amount of potting glue used inside the photovoltaic optimizer, and reduce costs while meeting the creepage distance limit.

[0007] In a first aspect, a photovoltaic optimizer is provided, which includes: a cover, a heat sink, a main board and an insulating support, wherein: the cover is fixedly connected to the heat sink, and a receiving cavity is formed between the cover and the heat sink; the main board is located in the receiving cavity, the insulating support is installed between the main board and the heat sink, the insulating support is used to support the main board, and the insulating support has at least one annular boss or at least one annular groove on the side along a first direction, and the first direction is perpendicular to the plane where the main board is located.

[0008] The photovoltaic optimizer provided in the present application increases the creepage distance by providing at least one annular boss or at least one annular groove on the insulating support member on the creepage path, thereby avoiding the risk of discharge between the main board and the heat sink. While meeting the creepage distance limit, the size of the photovoltaic optimizer or its components can be reduced, thereby reducing the amount of potting glue used inside the photovoltaic optimizer and reducing costs.

[0009] It should be understood that creepage distance is the shortest path between two conductive components, or between a conductive component and the protective interface of the equipment, measured along the insulating surface. In this embodiment, the accommodating cavity is filled with insulating potting compound, and the creepage distance between the mainboard and the heat sink can be measured along the surface of the insulating support. Therefore, the creepage distance can be increased by adjusting the size of the bosses or grooves on the insulating support.

[0010] In one possible implementation, when there is at least one annular groove on the side of the insulating support along the first direction, the distance of the annular groove along the first direction is greater than a certain limit value, so that the potting glue can flow into the annular groove of the insulating support.

[0011] In combination with the first aspect, in certain implementations of the first aspect, the photovoltaic optimizer also includes a cable, the cable includes a cable terminal and a cable insulation, the cable terminal is connected to the mainboard, and the cable insulation has at least one annular boss along the second direction, and the at least one annular boss on the cable insulation is located in the accommodating cavity formed by the cover body and the heat sink, and the second direction points to the direction in which the cable extends.

[0012] The photovoltaic optimizer provided in the present application increases the creepage distance by providing an annular boss on the outer surface of the cable insulation on the creepage path, thereby avoiding the risk of discharge between the cable terminal and the metal casing of the photovoltaic optimizer (such as a heat sink). While meeting the creepage distance limit, the size of the photovoltaic optimizer or its components can be reduced, thereby reducing the amount of potting glue used inside the photovoltaic optimizer and reducing costs.

[0013] In one possible implementation, the projection of the main portion of the insulating support member on the main board is within the projection of the annular boss on the insulating support member on the main board; alternatively, the projection of the annular groove on the insulating support member on the main board is within the projection of the main portion of the insulating support member on the main board. In other words, the insulating support member may include a main portion and a raised portion protruding outward along a side surface of the main portion, with the projection of the main portion on the main board within the projection of the raised portion on the main board; alternatively, the insulating support member may include a main portion and a recessed portion recessed inward along a side surface of the main portion, with the projection of the recessed portion on the main board within the projection of the main portion on the main board.

[0014] In one possible implementation, the insulating support member has at least one latch on one end near the mainboard, and a latch hole is provided on the mainboard at a position corresponding to the latch. The latch passes through the latch hole to secure the insulating support member to the mainboard. Accordingly, the insulating support member can be fixedly connected to the mainboard via the latch, thereby securing the mainboard in place.

[0015] In combination with the first aspect, in certain implementations of the first aspect, the insulating support member is an insulating support column, which includes a main body and a protruding portion protruding outward along the side wall of the main body, and the projection of the main body along the first direction is located within the projection range of the protruding portion along the first direction; or, the insulating support column includes a main body and a recessed portion recessed inward along the side wall of the main body, and the projection of the recessed portion along the first direction is located within the projection range of the main body along the first direction.

[0016] In the photovoltaic optimizer provided in the present application, the insulating support member may be an insulating support column, which serves to support the mainboard, thereby making the overall structure of the photovoltaic optimizer more stable and preventing the photovoltaic optimizer from shaking during transportation.

[0017] In one possible implementation, a latch is provided on one end of the insulating support column proximate to the mainboard. The projection of the latch along a first direction is located within the projection of the main body along the first direction. A latch hole is provided on the mainboard at a position corresponding to the latch, and the latch passes through the latch hole to secure the insulating support column to the mainboard. Accordingly, the insulating support column can be fixedly connected to the mainboard via the latch, thereby securing the mainboard. For example, the latch can be connected to the end surface of the main body of the insulating support column proximate to the mainboard. The mainboard has a latch hole, and the latch can pass through the latch hole to secure the insulating support column to the mainboard.

[0018] In one possible implementation, the insulating support column has at least one clip on one end near the mainboard, and a clip hole is provided on the mainboard at a position corresponding to the clip. The clip passes through the clip hole to secure the insulating support column to the mainboard. Accordingly, the insulating support column can be fixedly connected to the mainboard via the clip, thereby securing the mainboard. For example, the clip can be connected to the end surface of the main body of the insulating support column near the mainboard, and the mainboard has a clip hole. The clip can pass through the clip hole to secure the insulating support column to the mainboard.

[0019] In a possible implementation, adhesive is applied to one end of the insulating support column close to the mainboard, that is, the insulating support column can be bonded to the mainboard by bonding to achieve a fixed connection between the insulating support column and the mainboard.

[0020] In conjunction with the first aspect, in certain implementations of the first aspect, the photovoltaic optimizer further comprises a screw, a first through-hole is formed on the mainboard, a second through-hole is formed on the insulating support member along a first direction, a threaded hole corresponding to the screw is formed on the heat sink, and the projections of the threaded hole, the first through-hole, and the second through-hole along the first direction overlap, and the screw passes through the first through-hole and the second through-hole and is fixedly connected to the threaded hole. In other words, the insulating support member can be a hollow structure, through which the screw can pass, and the screw can serve to secure the mainboard to the heat sink, while the insulating support member can serve to support the mainboard. Therefore, by providing this structure, the mainboard and the heat sink can be rigidly connected while also serving as a support, thereby making the overall structure more stable and preventing the photovoltaic optimizer from shaking during transportation.

[0021] In one possible implementation, the photovoltaic optimizer further includes an insulating screw sleeve. The screw includes a head and a shank. The insulating screw sleeve is positioned between the mainboard and the screw head. The insulating screw sleeve extends through the first through-hole and into the second through-hole. The shank extends through the insulating screw sleeve, extends through the second through-hole, and is fixedly connected to the threaded hole. In other words, the insulating screw sleeve is positioned between the screw and the mainboard to isolate the screw from the mainboard. Providing an insulating screw sleeve (e.g., a plastic screw sleeve) can effectively isolate the screw from the mainboard.

[0022] In a possible implementation, the insulating support members are located at the midpoints of the four sides of the main board.

[0023] It should be noted that the location of the insulating support member can be determined based on the actual layout of components on the motherboard. In one example, the insulating support member can be located in the middle of the side of the motherboard closest to the cable. In another example, the insulating support member can be located in the middle of the side of the motherboard away from the cable.

[0024] In a possible implementation, the photovoltaic optimizer further includes an aluminum substrate, which is located between the main board and the heat sink and fixedly connected to the main board, and on which power devices are mounted.

[0025] In this implementation, an aluminum substrate is set between the mainboard and the heat sink, and power devices with higher heat generation (such as MOS tubes, diodes, etc.) can be installed on the aluminum substrate, thereby reducing the number of power devices on the mainboard. At the same time, the heat transfer path of the power devices can be increased, thereby accelerating heat dissipation.

[0026] In a second aspect, a photovoltaic optimizer is provided, which includes a cover, a heat sink, a main board, screws and an insulating screw sleeve, wherein: the cover is fixedly connected to the heat sink, and an accommodating cavity is formed between the cover and the heat sink; the main board is located in the accommodating cavity, the main board has a first through hole, the heat sink has a threaded hole corresponding to the screw, the threaded hole and the first through hole overlap in a projection surface along a first direction, and the first direction is perpendicular to the plane where the main board is located; the screw includes a nail head and a nail rod, part of the insulating screw sleeve is located between the main board and the nail head, part of the insulating screw sleeve passes through the first through hole and extends toward the heat sink, the nail rod passes through part of the insulating screw sleeve and is fixedly connected to the threaded hole, and the part of the insulating screw sleeve passing through the first through hole has at least one annular boss or at least one annular groove along the first direction.

[0027] The photovoltaic optimizer provided in the present application increases the creepage distance by providing at least one annular boss or at least one annular groove on the insulating screw sleeve on the creepage path, thereby avoiding the risk of discharge between the main board and the heat sink. While meeting the creepage distance limit, the size of the photovoltaic optimizer or its components can be reduced, thereby reducing the amount of potting glue used inside the photovoltaic optimizer and reducing costs.

[0028] In one possible implementation, when there is at least one annular groove on the side of the insulating screw sleeve along the first direction, the distance of the annular groove along the first direction is greater than a certain limit value, so that the potting glue can flow into the annular groove of the insulating screw sleeve.

[0029] In combination with the second aspect, in certain implementations of the second aspect, the photovoltaic optimizer also includes a cable, the cable includes a cable terminal and a cable insulation, the cable terminal is connected to the mainboard, and the cable insulation has at least one annular boss along the second direction, and the at least one annular boss on the cable insulation is located in the accommodating cavity formed by the cover body and the heat sink, and the second direction points to the direction in which the cable extends.

[0030] The photovoltaic optimizer provided in the present application increases the creepage distance by providing an annular boss on the outer surface of the cable insulation on the creepage path, thereby avoiding the risk of discharge between the cable terminal and the metal casing of the photovoltaic optimizer (such as a heat sink). While meeting the creepage distance limit, the size of the photovoltaic optimizer or its components can be reduced, thereby reducing the amount of potting glue used inside the photovoltaic optimizer and reducing costs.

[0031] In combination with the second aspect, in certain implementations of the second aspect, the photovoltaic optimizer further includes an aluminum substrate, which is located between the main board and the heat sink and fixedly connected to the main board, and power devices are mounted on the aluminum substrate.

[0032] In this implementation, an aluminum substrate is set between the mainboard and the heat sink, and power devices with higher heat generation (such as MOS tubes, diodes, etc.) can be installed on the aluminum substrate, thereby reducing the number of power devices on the mainboard. At the same time, the heat transfer path of the power devices can be increased, thereby accelerating heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG1 is a three-dimensional structural diagram of a photovoltaic optimizer.

[0034] FIG2 is a diagram showing the split structure of the photovoltaic optimizer shown in FIG1 .

[0035] FIG3 is a schematic cross-sectional view showing the connection portion between the mainboard and the heat dissipation plate in FIG1 .

[0036] FIG. 4 is a schematic cross-sectional view showing the connection portion between the cable and the mainboard in FIG. 1 .

[0037] FIG5 is a partial structural diagram of a photovoltaic optimizer provided in an embodiment of the present application.

[0038] FIG6 is a side view of the structure of a photovoltaic optimizer provided in an embodiment of the present application.

[0039] FIG7 is a three-dimensional structural diagram of an insulating support member provided in an embodiment of the present application.

[0040] FIG8 is a three-dimensional structural diagram of another insulating support member provided in an embodiment of the present application.

[0041] FIG9 is a schematic cross-sectional view of another insulating support member provided in an embodiment of the present application.

[0042] FIG10 is a schematic cross-sectional view of another insulating support member provided in an embodiment of the present application.

[0043] FIG11 is a schematic cross-sectional view of an insulating screw sleeve provided in an embodiment of the present application.

[0044] FIG12 is a schematic cross-sectional view of a cable insulation provided in an embodiment of the present application. DETAILED DESCRIPTION

[0045] The technical solution in this application will be described below with reference to the accompanying drawings.

[0046] In order to facilitate understanding of the embodiments of the present application, the following explanations are made before introducing the embodiments of the present application.

[0047] In the description of the embodiments of the present application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; “and / or” in this article is merely a way to describe the association relationship of associated objects, indicating that three relationships can exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0048] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first" and "second" can sensibly or implicitly include one or more features. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two, and "at least one" and "one or more" mean one, two or more. The singular expressions "one", "a", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise. The size of the sequence numbers of the processes below does not mean the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. For example, in the embodiments of the present application, words such as "110", "120", and "130" are merely identifiers made for the convenience of description and do not limit the order of execution of the steps.

[0049] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0050] Figure 1 shows a three-dimensional structural diagram of a photovoltaic optimizer. Figure 2 is a split structural diagram of the photovoltaic optimizer shown in Figure 1.

[0051] As shown in Figures 1 and 2 , the photovoltaic optimizer 100 includes a housing 110, a mainboard 120, a cover 130, and a cable 140. The cover 130 is used to cover the housing 110 to form a housing cavity for accommodating the mainboard 120. The housing 110, formed by the cover 130 covering the housing 110, includes at least one through-hole. Electronic components can be mounted on the mainboard 120, and the input end of the cable 140 can pass through the at least one through-hole to connect to the mainboard 120.

[0052] It should be understood that the four through holes formed by the cover 130 covering the shell 110 in FIG1 and the positions of the through holes are only examples, and the number and positions of the through holes can be set according to actual use requirements.

[0053] As shown in Figure 2, housing 110 includes a heat sink 111, mounting ears 112, and a connecting plate 113. Heat sink 111, mounting ears 112, and connecting plate 113 form a Z-shaped structure, with connecting plate 113 connected between heat sink 111 and mounting ears 112. Mounting ears 112 and heat sink 111 are located at opposite ends of connecting plate 113, respectively, so that heat sink 111 and mounting ears 112 are not located in the same plane. Heat sink 111 is fixedly connected to motherboard 120 and can dissipate heat from at least one electronic component on motherboard 120.

[0054] It should be understood that the heat sink 111 and the main board 120 can be fixedly connected by screws or snap connections, thereby improving the stability and safety of the photovoltaic optimizer.

[0055] The surface of the heat sink 111 facing away from the mainboard 120 is provided with a fin-type heat dissipation structure, such as heat dissipation teeth. As shown in Figure 2, the heat sink 111 has a flat surface on one side for securing the mainboard 120, and a fin-shaped surface on the other side. The use of a fin-type heat dissipation structure can increase the heat dissipation area and improve heat dissipation efficiency. The heat sink 111 can be made of a metal or alloy with high thermal conductivity, such as copper or aluminum.

[0056] The hanging ear 112 is used to install the photovoltaic optimizer 100 on the photovoltaic module. The hanging ear 112 includes a mounting hole. During installation, the photovoltaic optimizer 100 is fixed to the profile frame of the photovoltaic module through the mounting hole using a buckle or screw.

[0057] The cover 130 is used to cover the housing 110 to form a receiving cavity. Specifically, the cover 130 is fixedly connected to the heat sink 111, and a receiving cavity is formed between the cover 130 and the heat sink 111. The mainboard 120 can be located within this receiving cavity. In one example, the cover 130 includes an injection hole 131, which can be used to inject potting material into the receiving cavity. In other words, the interior of the photovoltaic optimizer 100 can be filled with potting compound, which can provide insulation and heat dissipation.

[0058] The cable 140 can pass through at least one through hole formed by the cover body 130 covering the heat sink 111 and be connected to the main board 120. Specifically, as shown in Figure 2, the first part of the cable 140 is located in the accommodating cavity, and the first part of the cable 140 includes a cable terminal 141 and a cable insulation skin 142, and the cable terminal 141 is connected to the main board 120. The second part of the cable 140 can be located outside the accommodating cavity and connected to the photovoltaic panel. It should be understood that the connection method between the cable 140 and the main board 120 is not limited. In one example, the cable 140 is electrically connected to the main board 120 by welding. In another example, a socket is provided on the main board 120, and the cable 140 can be directly inserted into the socket to be electrically connected to the main board 120.

[0059] In some embodiments, as shown in FIG2 , the photovoltaic optimizer 100 may further include an aluminum substrate 121, which is located between the mainboard 120 and the heat sink 111 and is fixedly connected to the mainboard 120. Power devices are mounted on the aluminum substrate 121. The power devices may be high-heat-generating power devices, such as metal-oxide-semiconductor field-effect transistors (MOSFETs), also known as MOS tubes, and power devices such as diodes. It should be understood that by placing some high-heat-generating power devices on the aluminum substrate 121, the number of power devices on the mainboard 120 can be reduced, and the heat transfer path of the power devices can also be reduced, thereby accelerating heat dissipation.

[0060] As mentioned in the Background section, the metal casing of the PV optimizer 100 (including housing 110 and cover 130) is accessible to human hands and is typically not grounded, requiring reinforced insulation from the internal circuitry. Furthermore, the power supply contains high-voltage areas, requiring safety regulations to provide reinforced insulation between it and the metal casing / heat sink to ensure personal safety.

[0061] Currently, potting compound is typically filled inside the photovoltaic optimizer 100 to enhance insulation, thereby preventing discharge between the mainboard 120 and the heat sink 111, as well as discharge between the cable terminal 141 and the metal housing of the photovoltaic optimizer 100 (e.g., the heat sink 111 or the cover 130). Therefore, the electrical clearance and creepage distance between the mainboard 120 and the heat sink 111 must meet certain limits, as must the electrical clearance and creepage distance between the cable terminal 141 and the heat sink 111. This means that the internal space of the photovoltaic optimizer 100 must be sacrificed to meet these requirements, which results in increased potting compound usage and increased costs.

[0062] Specifically, if the photovoltaic optimizer 100 is not potted with glue, and the safety regulations require that the pollution level be considered as 2, then the electrical clearance and creepage distance limits are greater than or equal to 20mm. Excessive electrical clearance and creepage distances will cause the size of the photovoltaic optimizer 100 or its components to become larger, the amount of potting glue used will increase, and the cost will increase. If the photovoltaic optimizer 100 is potted with glue, the pollution level can be upgraded from 2 to 1, and the electrical clearance and creepage distance limits (8.3mm) will be reduced. Among them, electrical clearance refers to the shortest spatial distance measured between two conductive components or between a conductive component and the equipment protection interface, that is, the shortest distance that can be achieved through air insulation while ensuring stable and safe electrical performance; creepage distance is the shortest path between two conductive components or between a conductive component and the equipment protection interface measured along the insulation surface.

[0063] Therefore, compared with the case where there is no potting glue inside the photovoltaic optimizer 100, the potting glue inside the photovoltaic optimizer 100 can reduce the size of the entire photovoltaic optimizer 100 or its components, reduce the amount of potting glue used, and reduce the cost accordingly.

[0064] However, even if the interior of the photovoltaic optimizer 100 is filled with potting glue, the photovoltaic optimizer 100 may still have the following risks: Risk 1 - discharge occurs between the main board 120 and the heat sink 111; Risk 2 - discharge occurs between the cable terminal 141 and the metal shell of the photovoltaic optimizer 100 (such as the heat sink 111 or the cover 130).

[0065] Figure 3 shows a cross-sectional view of the connection between mainboard 120 and heat sink 111 in Figure 2 . As can be seen from Figure 3 , an insulating support member 200 is installed between mainboard 120 and heat sink 111. This insulating support member 200 supports mainboard 120 and has flat sides. Potting compound 160 is filled between mainboard 120 and heat sink 111, providing both insulation and heat dissipation. Therefore, the creepage path between live network 170 and heat sink 111 can be creepage path 180, as shown in Figure 3 .

[0066] For example, if the vertical distance between the mainboard 120 and the heat sink 111 is 4.4 mm, the creepage distance between the live network 170 and the heat sink 111 is 4.4 mm. This vertical distance is the distance between the mainboard 120 and the heat sink 111 along a first direction perpendicular to the plane of the mainboard 120. In other words, this creepage distance is less than the creepage distance limit of 8.3 mm. To meet the creepage distance limit of 8.3 mm, the vertical distance between the live network 170 and the heat sink 111 must be 8.3 mm, or the setback distance on the mainboard 120 must be increased by 4 mm.

[0067] Therefore, to avoid risk 1, that is, to prevent discharge between the mainboard 120 and the heat sink 111, it is necessary to increase the distance between the mainboard 120 and the heat sink 111, or to widen the mainboard 120. Furthermore, the thickness of the photovoltaic optimizer 100 will increase or the width of the photovoltaic optimizer 100 will increase, which will lead to an increase in the amount of potting compound used and a corresponding increase in cost.

[0068] Figure 4 shows a cross-sectional schematic diagram of the connection between cable 140 and mainboard 120 in Figure 2 . As shown in Figure 4 , cable 140 may include a cable terminal 141 and a cable insulation 142. Cable terminal 141 may be connected to mainboard 120, and cable insulation 142 may extend through a through-hole in the PV optimizer housing into the accommodating cavity formed by cover 130 and housing 110. The accommodating cavity may be filled with a potting compound 160. The sides of cable insulation 142 are flat. It should be understood that discharge may occur between cable terminal 141 and the metal housing of the PV optimizer (e.g., heat sink 111 or cover 130).

[0069] For example, if the distance between the end of the cable terminal 141 closest to the cable insulation 142 and the metal housing of the PV optimizer 100 (e.g., the heat sink 111) is 4.5 mm, then the creepage path between the live network 170 on the mainboard 120 and the heat sink 111 is 4.5 mm. In other words, this creepage distance is less than the creepage distance limit of 8.3 mm. To meet the creepage distance limit of 8.3 mm, the horizontal distance between the live network 170 on the mainboard 120 and the heat sink 111 must be 8.3 mm.

[0070] Therefore, in order to avoid risk 2, that is, to avoid discharge between the cable terminal 141 and the metal casing of the photovoltaic optimizer 100 (such as the heat sink 111), it is necessary to increase the size of the mainboard 120 so that the distance between the live network 170 on the mainboard 120 and the heat sink 111 meets the creepage distance limit, that is, the length of the entire photovoltaic optimizer needs to be lengthened, which will lead to an increase in the amount of potting glue used and the cost will also increase accordingly.

[0071] To address the above risks, the embodiments of the present application implement safety design for components such as the insulating support 200 and the cable insulation 142 on the creepage path, thereby reducing the size of the photovoltaic optimizer or its components and the amount of potting compound used while meeting the electrical clearance and creepage distance restrictions, thereby reducing costs.

[0072] FIG5 is a partial structural diagram of a photovoltaic optimizer provided in an embodiment of the present application, and FIG6 is a structural side view of a photovoltaic optimizer provided in an embodiment of the present application.

[0073] As can be seen from Figures 5 and 6 , to address the aforementioned risk 1, namely, to prevent discharge between the mainboard 120 and the heat sink 111, the present embodiment provides an insulating support member 2000 as shown in area ① of Figure 6 or an insulating support member 2000 as shown in area ② of Figure 6 . The structure of the insulating support member 2000 shown in area ① will be described in detail in conjunction with Figures 7 and 8 , and the insulating support member 2000 shown in area ② will be described in detail in conjunction with Figures 9 and 10 . The specific location of the insulating support member 2000 can be found in Figure 5 .

[0074] In addition, in response to the above-mentioned risk 1, the embodiment of the present application also provides an insulating screw sleeve 190 as shown in Figure 11.

[0075] In response to the above-mentioned risk 2, that is, in order to avoid discharge between the cable terminal 141 and the metal shell of the photovoltaic optimizer (such as the heat sink 111), the embodiment of the present application provides a cable insulation skin 1420 as shown in area ③ in Figure 6. The structure of the cable insulation skin 1420 will be specifically explained in conjunction with Figure 12.

[0076] In one possible implementation, the photovoltaic optimizer provided in the present application includes: a cover body 130, a heat sink 111, a main board 120 and an insulating support member 2000, wherein: the cover body 130 is fixedly connected to the heat sink 111, and a receiving cavity is formed between the cover body 130 and the heat sink 111; the main board 120 is located in the receiving cavity, the insulating support member 2000 is installed between the main board 120 and the heat sink 111, the insulating support member 2000 is used to support the main board 120, and the insulating support member 2000 has at least one annular boss or at least one annular groove on the side along the first direction, and the first direction is perpendicular to the plane where the main board 120 is located.

[0077] In one example, as shown in Figures 5 and 6, the photovoltaic optimizer provided in this application may further include an aluminum substrate 121, which is located between the mainboard 120 and the heat sink 111 and fixedly connected to the mainboard 120, and has power devices mounted on the aluminum substrate 121. In this example, by disposing the aluminum substrate 121 between the mainboard 120 and the heat sink 111, and by mounting power devices with high heat generation (such as MOS tubes, diodes, etc.) on the aluminum substrate 121, the number of power devices on the mainboard 120 can be reduced, while also increasing the heat transfer path of the power devices and accelerating heat dissipation.

[0078] In some embodiments, the structure of the insulating support member 2000 may refer to FIG. 7 . The insulating support member 2000 may be an insulating support column, and the insulating support column may be a solid insulating support column having a boss structure.

[0079] Specifically, as shown in Figure 7, the insulating support member 2000 has at least one annular boss 220 along the side surface along the first direction, which is perpendicular to the plane of the main board 120. It will be understood that the projection of the main portion of the insulating support member 2000 on the main board 120 is located within the projection of the annular boss 220 on the insulating support member 2000 on the main board 120. In other words, the insulating support member 2000 may include a main portion and a raised portion protruding outward along the side surface of the main portion, and the projection of the main portion on the main board 120 is located within the projection of the raised portion on the main board 120.

[0080] For example, as shown in FIG7 , the insulating support member 2000 includes a main body 210 and an annular boss 220. The main body 210 may be cylindrical, and the annular boss 220 may be sleeved on the main body 210, with the inner sidewall of the annular boss 220 connected to the outer sidewall of the main body 210. Overall, the insulating support member 2000 includes the main body 210 and a protrusion protruding outward along the sidewall of the main body 210. The outward protrusion forms the annular boss 220. In other words, the insulating support member 2000 includes the main body 210 and the protrusion protruding outward along the sidewall of the main body 210. The projection of the main body 210 along the first direction is located within the projection range of the protrusion along the first direction.

[0081] By providing the annular boss 220, the creepage distance between the main board 120 and the heat sink 111 can be increased. This creepage distance is shown by the black arrow in Figure 7. It can avoid the risk of discharge between the main board 120 and the heat sink 111, so that the size of the photovoltaic optimizer or its components can be reduced while meeting the creepage distance limit, thereby reducing the amount of potting glue used inside the photovoltaic optimizer and reducing costs.

[0082] It should be understood that the more annular bosses 220 are mounted on the main body 210, the longer the creepage distance between the main board 120 and the heat sink 111, the smaller the distance between the main board 120 and the heat sink 111 along the first direction (i.e., the vertical distance), the smaller the thickness of the entire photovoltaic optimizer can be, the less potting glue is used, and the cost is reduced accordingly.

[0083] In other embodiments, the insulating support member 2000 may refer to FIG. 8 . The insulating support member 2000 may be an insulating support column, and the insulating support column may be a solid insulating support column having a groove structure.

[0084] Specifically, as shown in FIG8 , the insulating support member 2000 has at least one annular groove 260 formed along a first direction perpendicular to the plane of the main board 120. It will be appreciated that the projection of the annular groove 260 on the insulating support member 2000 onto the main board 120 is within the projection of the main body of the insulating support member 2000 onto the main board 120. In other words, the insulating support member 2000 may include a main body and a recessed portion recessed inwardly along a side surface of the main body, with the projection of the recessed portion onto the main board 120 being within the projection of the main body onto the main board 120.

[0085] For example, as shown in FIG8 , the insulating support member 2000 includes a main body 210 and an annular groove 260. The main body 210 may be a cylindrical structure, and the main body 210 has an inwardly recessed annular groove 220. In other words, the insulating support member 2000 includes the main body 210 and an inwardly recessed recess along the sidewall of the main body 210. The projection of the recess along the first direction is located within the projection range of the main body 210 along the first direction.

[0086] By providing the annular groove 260, the creepage distance between the main board 120 and the heat sink 111 can be increased. The creepage distance is shown by the black arrow in Figure 8, which can avoid the risk of discharge between the main board 120 and the heat sink 111. Under the condition of meeting the creepage distance limit, the size of the photovoltaic optimizer or its components can be reduced, thereby reducing the amount of potting glue used inside the photovoltaic optimizer and reducing costs.

[0087] It should be understood that when there is at least one annular groove 220 on the insulating support 2000 along the first direction, the distance of the annular groove 220 in the first direction is greater than a certain limit, so that the potting glue can flow into the annular groove 220 of the insulating support 2000.

[0088] It should also be understood that the more annular grooves 220 there are on the main body 210, the longer the creepage distance between the main board 120 and the heat sink 111, the smaller the distance between the main board 120 and the heat sink 111 along the first direction (i.e., the vertical distance), the smaller the thickness of the entire photovoltaic optimizer can be, the less potting glue is used, and the cost is reduced accordingly.

[0089] In one example, as shown in FIG. 7( a ) or FIG. 8( a ), the insulating support member 2000 further includes a post 230 , which is connected to the end face of the main body 210 near the main board 120 . The post 230 is used to clamp the main board 120 and the insulating support member 2000 . The projection of the post 230 on a first plane is within the projection of the main body 210 on the first plane, where the first plane is the plane where the main board 120 is located. Exemplarily, a post hole may be provided on the main board 120 at a position corresponding to the post 230 . The post 230 can pass through the post hole and be clamped to the main board 120 , thereby fixing the insulating support member 2000 to the main board 120 and securing the main board 120 in place.

[0090] In another example, as shown in FIG7( b) or FIG8( b), the insulating support member 2000 further includes at least one buckle (e.g., buckle 240), which is connected to the end surface of the main body 210 near the main board 120. The buckle 240 is used to clamp the main board 120 and the insulating support member 2000, that is, the insulating support member 2000 can be fixedly connected to the main board 120 through the buckle 240. Exemplarily, there can be a buckle hole on the main board 120 at a position corresponding to the buckle 240, and the position of the buckle hole corresponds to the position of the buckle. The buckle 240 can pass through the buckle hole to fix the insulating support member 2000 to the main board 120. In other words, the insulating support member 2000 can be fixedly connected to the main board 120 through the buckle 240, thereby achieving the locking position of the main board 120.

[0091] In another example, the end face of the insulating support member 2000 close to the main board 120 can be coated with glue, that is, the insulating support member 2000 can be bonded to the main board 120 by bonding and fixing, so as to achieve a fixed connection between the insulating support member 2000 and the main board 120, thereby achieving the positioning of the main board 120.

[0092] In one example, as shown in FIG. 7 or FIG. 8 , the insulating support member 2000 further includes a positioning column 250 , which is connected to the end surface of the main body 210 close to the heat dissipation plate 111 . The positioning column 250 can be used for rough positioning during assembly of the entire machine.

[0093] It should be noted that the present application does not limit the location of the insulating support member 2000 shown in Figures 7 or 8, and the location can be determined based on the actual layout of the power devices on the mainboard 120 and the aluminum substrate 121. In some examples, the insulating support member 2000 can be located at the midpoint of the four sides of the mainboard 120. For example, as shown in Figures 5 and 6, the insulating support member 2000 can be located at the midpoint of the side of the heat sink 111 close to the connecting plate 113, or the insulating support member 2000 can be located at the midpoint of the side of the heat sink 111 close to the cable 1400.

[0094] It should be noted that if the vertical distance between the mainboard 120 and the heat sink 111 is small, but the length or width of the mainboard 120 is large, the number and size of the annular bosses 220 or annular grooves 260 can be reduced by setting a clearance distance on the mainboard 120. If the vertical distance between the mainboard 120 and the heat sink 111 is large, the number of annular bosses 220 or annular grooves 260 can be increased, or the size of the annular bosses 220 or annular grooves 260 can be increased, thereby reducing the clearance distance set on the mainboard 120 and reducing the size of the mainboard 120.

[0095] In other embodiments, the structure of the insulating support member 2000 can be referred to Figure 9, which shows two cross-sectional views of the insulating support member 2000, the cross-sections being perpendicular to the plane of the mainboard 120. The insulating support member 2000 can be hollow and have a boss structure.

[0096] Specifically, as shown in Figure 9, the insulating support member 2000 has at least one annular boss 220 along a first direction perpendicular to the plane of the mainboard 120. The insulating support member 2000 may be a hollow structure, through which screws 150 may pass to secure the mainboard 120 to the heat sink 111.

[0097] In one example, the insulating support member 2000 includes a main body and an annular boss 220 . The main body can be a hollow cylindrical structure, and the annular boss 220 can be sleeved on the main body. The hollow insulating support member 2000 can be used in conjunction with the screw 150 .

[0098] By providing the annular boss 220, the creepage distance between the main board 120 and the heat sink 111 can be increased. The creepage distance is shown by the black arrow in Figure 9. This can avoid the risk of discharge between the main board 120 and the heat sink 111, so that the size of the photovoltaic optimizer or its components can be reduced while meeting the creepage distance limit, thereby reducing the amount of potting glue used inside the photovoltaic optimizer and reducing costs.

[0099] It should be understood that the more annular bosses 220 are mounted on the main body of the insulating support 2000, the longer the creepage distance between the main board 120 and the heat sink 111, the smaller the distance between the main board 120 and the heat sink 111 along the first direction (i.e., the vertical distance), the smaller the thickness of the entire photovoltaic optimizer can be, the less potting glue is used, and the cost is reduced accordingly.

[0100] In other embodiments, the structure of the insulating support member 2000 can be referred to Figure 10, which shows two cross-sectional schematic diagrams of the insulating support member 2000, the cross-section being perpendicular to the plane of the mainboard 120. The insulating support member 2000 can be a hollow insulating support member having a groove structure.

[0101] Specifically, as shown in Figure 10, the insulating support member 2000 has at least one annular groove 260 on its side along a first direction perpendicular to the plane of the mainboard 120. The insulating support member 2000 may be a hollow structure, and the screws 150 may pass through the insulating support member 2000 to secure the mainboard 120 to the heat sink 111.

[0102] In one example, the insulating support 2000 includes a main body and an annular groove 260. The main body can be a hollow cylindrical structure, and the main body has an inwardly recessed annular groove 260. The hollow insulating support 2000 can be used in conjunction with the screw 150.

[0103] By providing the annular groove 260, the creepage distance between the main board 120 and the heat sink 111 can be increased. The creepage distance is shown by the black arrow in Figure 10, which can avoid the risk of discharge between the main board 120 and the heat sink 111. Under the condition of meeting the creepage distance limit, the size of the photovoltaic optimizer or its components can be reduced, thereby reducing the amount of potting glue used inside the photovoltaic optimizer and reducing costs.

[0104] It should be understood that the more annular grooves 260 there are, the longer the creepage distance between the main board 120 and the heat sink 111, the smaller the distance between the main board 120 and the heat sink 111 along the first direction (i.e., the vertical distance), the smaller the thickness of the entire photovoltaic optimizer can be, the less potting glue is used, and the cost is reduced accordingly.

[0105] As shown in Figure 9 or 10, there is a first through hole on the main board 120, the insulating support 2000 has a second through hole along the first direction, and the heat dissipation plate 111 has a threaded hole corresponding to the screw 150. The threaded hole, the first through hole and the second through hole overlap in the projection surface along the first direction, and the screw 150 passes through the first through hole and the second through hole and is fixedly connected to the threaded hole on the heat dissipation plate 111.

[0106] In one example, an insulating material is filled between the screw 150 and the mainboard 120 to isolate the mainboard 120 from the screw 150 .

[0107] In another example, as shown in FIG9 or FIG10 , the outer surface of the screw 150 can be covered with an insulating screw sleeve 190. That is, the screw sleeve is made of an insulating material, and the insulating screw sleeve 190 can isolate the mainboard 120 from the screw 150. Exemplarily, the screw 150 includes a head and a shank. A portion of the insulating screw sleeve 190 is positioned between the mainboard 120 and the head. A portion of the insulating screw sleeve 190 passes through the first through-hole and extends into the second through-hole. The shank passes through the portion of the insulating screw sleeve 190 that extends through the second through-hole and is fixedly connected to the threaded hole. In other words, the insulating screw sleeve 190 is provided between the screw 150 and the mainboard 120 to isolate the screw 150 from the mainboard 120. The provision of the insulating screw sleeve 190 (e.g., a plastic screw sleeve) can serve to isolate the screw 150 from the mainboard 120. It should be understood that the projection of the screw head onto the plane of the mainboard 120 can cover the first through-hole on the mainboard 120.

[0108] In one example, as shown in FIG9(a) or FIG10(a), the end surface of the insulating support member 2000 close to the mainboard 120 may be coated with adhesive, and the end of the insulating support member 2000 away from the mainboard 120 may abut against the heat sink 111. In other words, the insulating support member 2000 may be adhered to the mainboard 120 by adhesive fixation, thereby achieving a fixed connection between the insulating support member 2000 and the mainboard 120.

[0109] In another example, as shown in FIG9( b) or FIG10( b), the insulating support member 2000 further includes at least one buckle 240, which is connected to the end surface of the main body portion near the main board 120. The buckle 240 is used to clamp the main board 120 and the insulating support member 2000, that is, the insulating support member 2000 can be fixedly connected to the main board 120 through the buckle 240. Exemplarily, a buckle hole can be provided at a position on the main board 120 corresponding to the buckle 240, and the position of the buckle hole corresponds to the position of the buckle. The buckle 240 can pass through the buckle hole to fix the insulating support member 2000 to the main board 120. In other words, the insulating support member 2000 can be fixedly connected to the main board 120 through the buckle 240.

[0110] It should be noted that, whether by adhesive fixing or snap fixing, the projections of the first through hole on the main board 120, the second through hole on the insulating support 2000 and the threaded hole on the heat dissipation plate 111 in the first direction overlap, so that the screw 150 can pass through the first through hole and the second through hole and be installed in the threaded hole to fix the main board 120 and the heat dissipation plate 111.

[0111] It should be noted that the present application does not limit the location of the insulating support member 2000 shown in Figures 9 or 10, and can be determined based on the actual layout of the power devices on the mainboard 120 and the aluminum substrate 121. In some examples, the insulating support member 2000 can be located at the midpoint of the four sides of the mainboard 120. In other examples, as shown in Figures 5 and 6, the insulating support member 2000 can be located between the mainboard 120 and the aluminum substrate 121, and the screws 150 can pass through the insulating support member 2000 and the heat sink 111 and be locked and fixed to the heat sink 111.

[0112] In another possible implementation, the photovoltaic optimizer provided in the present application includes a cover 130, a heat sink 111, a main board 120, a screw 150 and an insulating screw sleeve 190, wherein: the cover 130 is fixedly connected to the heat sink 111, and an accommodating cavity is formed between the cover 130 and the heat sink 111; the main board 120 is located in the accommodating cavity, the main board 120 has a first through hole, and the heat sink 111 has a threaded hole corresponding to the screw 150, the threaded hole and the first through hole overlap in a projection surface along a first direction, and the first direction is perpendicular to the plane where the main board 120 is located; the screw 150 includes a nail head and a nail rod, a portion of the insulating screw sleeve 190 is located between the main board 120 and the nail head, a portion of the insulating screw sleeve 190 passes through the first through hole and extends toward the heat sink 111, the nail rod passes through a portion of the insulating screw sleeve 190 and is fixedly connected to the threaded hole, and the portion of the insulating screw sleeve 190 passing through the first through hole has at least one annular boss or at least one annular groove along the first direction.

[0113] Illustratively, the cross-sectional structure of the insulating screw sleeve 190 may be as shown in FIG. 11 .

[0114] As shown in FIG11( a ), at least one annular boss 191 is formed along the first direction on the portion of the insulating screw sleeve 190 that passes through the first through-hole in the mainboard 120. The provision of the annular boss 191 increases the creepage distance between the mainboard 120 and the heat sink 111, as indicated by the black arrow in FIG11( a ).

[0115] As shown in FIG11( b ), at least one annular groove 192 is formed along the first direction on the portion of the insulating screw sleeve 190 that passes through the first through-hole in the mainboard 120. The provision of annular groove 192 increases the creepage distance between the mainboard 120 and the heat sink 111, as indicated by the black arrow in FIG11( b ).

[0116] It should be understood that the greater the number of annular bosses 191 or annular grooves 192, the longer the creepage distance between the main board 120 and the heat sink 111, the smaller the distance between the main board 120 and the heat sink 111 along the first direction (i.e., the vertical distance), the smaller the thickness of the entire photovoltaic optimizer can be, the less potting glue is used, and the cost is reduced accordingly.

[0117] It should be understood that when the insulating screw sleeve 190 has at least one annular groove 191 along the first direction, the distance of the annular groove 191 in the first direction is greater than a certain limit, so that the potting glue can flow into the groove of the insulating screw sleeve 190.

[0118] It should be noted that the insulating screw sleeve 190 shown in Figure 11 can be used in combination with the screw 150. By providing the insulating screw sleeve 190 with an annular boss 191 or an annular groove 192, the distance between the bottom wiring layer of the mainboard 120 and the heat sink 111 can be shortened, the thickness of the photovoltaic optimizer can be reduced, and the amount of potting glue used can be reduced, thereby reducing costs.

[0119] That is to say, the photovoltaic optimizer provided in the present application can also increase the creepage distance by providing at least one annular boss 191 or at least one annular groove 192 on the insulating screw sleeve 190 on the creepage path, thereby avoiding the risk of discharge between the main board 120 and the heat sink 111, so that the size of the photovoltaic optimizer or its components can be reduced while meeting the creepage distance limit, thereby reducing the amount of potting glue used inside the photovoltaic optimizer and reducing costs.

[0120] From the above, combined with Figures 5 to 11, it can be seen that in order to address risk 1, the embodiments of the present application can use an insulating support member 2000 with a boss or groove design, or an insulating screw sleeve 190 with a boss or groove design to shorten the distance from the bottom wiring layer of the mainboard 120 to the heat sink 111, reduce the thickness of the entire optimizer, and thereby reduce the amount of potting glue used and reduce costs.

[0121] The following will describe the improvements made by the embodiment of the present application to address risk 2 with reference to Figure 12. Figure 12 is a cross-sectional view of the connection between the cable 1400 and the mainboard 120 provided in the embodiment of the present application.

[0122] As shown in Figure 12, the cable 1400 includes a cable terminal 141 and a cable insulation skin 1420. The cable 1400 can be connected to the mainboard 120 through the cable terminal 141. There is at least one annular boss on the cable insulation skin 1420 along the second direction, and the at least one annular boss on the cable insulation skin 1400 is located in the accommodating cavity formed by the cover body and the heat dissipation plate 111. The second direction points to the direction in which the cable 1400 extends.

[0123] By providing an annular boss on the outer surface of the cable insulation 1420 on the creepage path, the creepage distance is increased, thereby avoiding the risk of discharge between the cable terminal 141 and the metal casing of the photovoltaic optimizer (such as the heat sink 111). This allows the size of the entire photovoltaic optimizer or its components to be reduced while meeting the creepage distance limit, thereby reducing the amount of potting glue used inside the photovoltaic optimizer and reducing costs.

[0124] In some embodiments, to ensure good potting compound flow in confined spaces, the cable insulation 1420 includes an annular boss along the second direction. The height and thickness of this boss can be 1 mm. In this case, a 2 mm clearance should be maintained from the edge of the mainboard 120. The height of the boss is the dimension in the first direction, and the thickness is the dimension in the second direction. The first direction is perpendicular to the plane of the mainboard 120, and the second direction points in the direction in which the cable 1400 extends.

[0125] In other embodiments, as shown in FIG12 , two annular bosses may be provided on the cable insulation 1420 , and the height and thickness of each annular boss are both 1 mm. In this way, the edge routing of the mainboard 120 does not need to avoid a distance of 2 mm, and a creepage distance of 8.5 mm can be achieved, thereby further reducing the size of the mainboard 120.

[0126] For example, as shown in FIG12 , if the distance between the end of the cable terminal 141 close to the cable insulation 1420 and the metal housing of the photovoltaic optimizer (such as the heat sink 111) is 4.5 mm, then the creepage distance (denoted as d sum ) is 8.5mm, the creepage distance 8.5mm is greater than the creepage distance limit of 8.3mm, that is, d sum =2mm+4.5mm+2mm=8.5mm>8.3mm. Therefore, by providing an annular boss on the cable insulation 1420, the vertical distance between the mainboard 120 and the heat sink 111 can be reduced while meeting the electrical clearance and creepage distance limits. This reduces the thickness of the photovoltaic optimizer and the amount of potting compound used, thereby reducing costs.

[0127] In yet other embodiments, the thickness of the annular boss on the cable insulation 1420 can be set to 2 mm, so that the PCB edge routing does not need to avoid a 2 mm gap. This can further reduce the length of the mainboard 120, reduce the size of the photovoltaic optimizer, and reduce the amount of potting compound used, thereby reducing costs.

[0128] It should be understood that the number and size of the annular bosses on the cable insulation 1420 can be specifically set according to the actual layout, and this application does not limit this.

[0129] It should be noted that the insulating support 2000, insulating screw sleeve 190 and cable insulation 1420 provided in the embodiment of the present application can be applied to power products with safety shielding requirements, such as photovoltaic optimizers, photovoltaic inverters or other power products.

[0130] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A photovoltaic optimizer, characterized in that: include: Cover, heat sink, main board and insulating support, wherein: The cover body is fixedly connected to the heat sink, and a receiving cavity is formed between the cover body and the heat sink; The main board is located in the accommodating cavity, the insulating support is installed between the main board and the heat sink, the insulating support is used to support the main board, and the insulating support has at least one annular boss or at least one annular groove on the side along a first direction, and the first direction is perpendicular to the plane where the main board is located.

2. The photovoltaic optimizer according to claim 1, characterized in that: The photovoltaic optimizer also includes a cable, which includes a cable terminal and a cable insulation skin. The cable terminal is connected to the mainboard. The cable insulation skin has at least one annular boss along a second direction. The at least one annular boss on the cable insulation skin is located in the accommodating cavity. The second direction points to the direction in which the cable extends.

3. The photovoltaic optimizer according to claim 1, characterized in that: The photovoltaic optimizer also includes a screw, a first through hole is provided on the main board, a second through hole is provided on the insulating support along the first direction, a threaded hole corresponding to the screw is provided on the heat dissipation plate, the projection surface of the threaded hole, the first through hole and the second through hole along the first direction overlap, and the screw passes through the first through hole and the second through hole and is fixedly connected to the threaded hole.

4. The photovoltaic optimizer according to claim 3, characterized in that: The photovoltaic optimizer also includes an insulating screw sleeve, and the screw includes a screw head and a screw rod. Part of the insulating screw sleeve is located between the main board and the nail head, part of the insulating screw sleeve passes through the first through hole and extends into the second through hole, and the nail rod passes through the part of the insulating screw sleeve that passes through the second through hole and is fixedly connected to the threaded hole.

5. The photovoltaic optimizer according to any one of claims 1 to 4, characterized in that: At least one buckle is disposed on one end of the insulating support member close to the main board, and a buckle hole is disposed at a position on the main board corresponding to the buckle, and the buckle passes through the buckle hole to fix the insulating support member and the main board.

6. The photovoltaic optimizer according to claim 1 or 2, characterized in that: The insulating support member is an insulating support column, The insulating support column comprises a main body and a protruding portion protruding outward along a side wall of the main body, and a projection of the main body along the first direction is located within a projection range of the protruding portion along the first direction; or The insulating support column includes a main body and a recessed portion recessed inwardly along a side wall of the main body, and a projection of the recessed portion along the first direction is located within a projection range of the main body along the first direction.

7. The photovoltaic optimizer according to claim 6, characterized in that: A clamping column is provided on one end of the insulating support column close to the main board, the projection of the clamping column along the first direction is located within the projection range of the main body along the first direction, a clamping column hole is provided at a position on the main board corresponding to the clamping column, and the clamping column passes through the clamping column hole to fix the insulating support column and the main board.

8. The photovoltaic optimizer according to any one of claims 1 to 4, characterized in that: The insulating support members are located at the midpoints of the four sides of the main board.

9. The photovoltaic optimizer according to any one of claims 1 to 4, characterized in that: The photovoltaic optimizer also includes an aluminum substrate, which is located between the main board and the heat sink and fixedly connected to the main board, and a power device is mounted on the aluminum substrate.

10. A photovoltaic optimizer, characterized in that: include: Cover, heat sink, main board, screws and insulating screw sleeves, including: The cover body is fixedly connected to the heat dissipation plate, and a receiving cavity is formed between the cover body and the heat dissipation plate; The mainboard is located in the accommodating cavity, the mainboard has a first through hole, the heat sink has a threaded hole corresponding to the screw, the threaded hole and the first through hole overlap in a projection plane along a first direction, and the first direction is perpendicular to the plane where the mainboard is located; The screw includes a nail head and a nail rod, a portion of the insulating screw sleeve is located between the main board and the nail head, a portion of the insulating screw sleeve passes through the first through hole and extends toward the heat sink, the nail rod passes through a portion of the insulating screw sleeve and is fixedly connected to the threaded hole, and a portion of the insulating screw sleeve passing through the first through hole has at least one annular boss or at least one annular groove along the first direction.

11. The photovoltaic optimizer according to claim 10, characterized in that: The photovoltaic optimizer also includes a cable, which is located in the accommodating cavity. The cable includes a cable terminal and a cable insulation skin, the cable terminal is connected to the mainboard, and the cable insulation skin has at least one annular boss along a second direction. The at least one annular boss on the cable insulation skin is located in the accommodating cavity, and the second direction points to the direction in which the cable extends.

12. The photovoltaic optimizer according to claim 10 or 11, characterized in that: The photovoltaic optimizer also includes an aluminum substrate, which is located between the main board and the heat sink and fixedly connected to the main board, and a power device is mounted on the aluminum substrate.

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