Wind-liquid integrated heat dissipation device for signal processing equipment

Abstract

The utility model discloses a wind-liquid integrated heat dissipation device for signal processing equipment. The wind-liquid integrated heat dissipation device comprises a liquid cooling module and a fan module which are arranged in a case of the signal processing equipment, the liquid cooling module comprises a liquid cooling pipeline and a liquid storage tank, a liquid cooling pump, a second heat exchanger, a first heat exchanger, a first water segregator, a module liquid cooling plate and a second water segregator which are sequentially connected through the liquid cooling pipeline, the second water segregator is connected with the liquid storage tank, and the module liquid cooling plate is tightly attached to a functional module of the signal processing equipment. The liquid cooling pipeline is further provided with a temperature sensor, the first heat exchanger is arranged behind the air inlet, the second heat exchanger is arranged in front of the air outlet, and the fan modules are arranged at the air inlet and the air outlet of the case panel. The function module comprises a wind-liquid control module, and the wind-liquid control module is connected with the liquid cooling pump, the fan module and the temperature sensor. According to the utility model, the problem that balance among high heat dissipation efficiency, low noise and small size is difficult is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a wind-liquid integrated heat dissipation device for signal processing equipment. Background Art

[0002] In the field of underwater acoustic signal information processing, in order to meet the requirements of electromagnetic shielding and environmental adaptability, general electronic systems tend to be designed as enclosed chassis, and most electronic products try to be isolated from the cooling system as much as possible. Therefore, the circuits on the plug-in modules installed in the chassis also need to be isolated from the cooling system. The main heat dissipation methods include conduction + natural heat dissipation, conduction + air cooling, and conduction + liquid cooling. For 6U modules with a power consumption lower than 80W, conduction + natural heat dissipation is generally considered; for those with a power consumption greater than 80W and less than 200W, conduction + air cooling is generally considered; however, for modules with a power consumption greater than 200W, conduction + liquid cooling is preferably considered. Currently, the power of underwater acoustic signal information processing equipment is large. If natural heat dissipation or air cooling is adopted, the heat dissipation efficiency is limited and cannot meet the heat dissipation requirements of the equipment. If a fan with a higher rotation speed is used to meet the heat dissipation requirements, it will cause a relatively high noise level of the equipment (usually above 75dB); while the current processing equipment supporting liquid cooling generally adopts an external centralized liquid supply method, but there is a problem of limited usage scenarios of the equipment. Liquid cooling cannot be used without an external cold source. Even if the equipment can supply liquid by itself, there is also a problem of a relatively large volume. Therefore, it is difficult to balance high heat dissipation efficiency, low noise, and small volume in existing signal processing equipment.

[0003] In addition, the external communication interfaces of current underwater acoustic information processing equipment generally adopt electrical interfaces. In a complex electromagnetic compatibility environment, problems such as information error codes, loss, and transmission bandwidth reduction will occur during equipment communication. Summary of the Utility Model

[0004] (1) Technical Problems to be Solved

[0005] Based on the above problems, the utility model provides a wind-liquid integrated heat dissipation device for signal processing equipment, which solves the problem of difficulty in balancing high heat dissipation efficiency, low noise, and small volume.

[0006] (2) Technical Solutions

[0007] Based on the above technical problems, the present utility model provides a wind-liquid integrated heat dissipation device for a signal processing device, which includes a liquid cooling module and a fan module arranged in the chassis of the signal processing device; the liquid cooling module includes a liquid cooling pipeline and a liquid storage tank, a liquid cooling pump, a second heat exchanger, a first heat exchanger, a first water distributor, a module liquid cooling plate, and a second water distributor that are sequentially connected through the liquid cooling pipeline. The second water distributor is connected to the liquid storage tank. The module liquid cooling plate is closely attached to the functional modules of the signal processing device. A temperature sensor is also provided on the liquid cooling pipeline. The first heat exchanger is arranged behind the air inlet, and the second heat exchanger is arranged in front of the air outlet. The fan module is arranged at the air inlet and the air outlet of the chassis panel; the functional modules include a plurality of signal processing modules and a wind-liquid control module. The wind-liquid control module is respectively connected to the liquid cooling pump, the fan module, and the temperature sensor. The wind-liquid control module is used to control the rotation speeds of the fan module and the liquid cooling pump according to the detected temperature.

[0008] Further, a pressure sensor is also provided on the liquid cooling pipeline. The pressure sensor is used to test whether the pressure usage requirements of each device in the liquid cooling module are met. The pressure sensor and the temperature sensor are installed between the first heat exchanger and the first water separator.

[0009] Further, the first heat exchanger is a microchannel heat exchanger, and the second heat exchanger is a finned heat exchanger.

[0010] Further, the functional modules further include a switching module and a power supply module.

[0011] Further, the switching module includes at least two switching modules, and the power supply module includes at least two power supply modules.

[0012] Further, the signal processing modules and the switching module are interconnected through a first connector on the backplane. The first connector is connected to a second connector through the backplane. The second connector is provided with a communication interface for external connection. The BMC unit is connected to the fan module and the liquid cooling pump through a third connector. The power supply module is connected to an external power supply through a fourth connector.

[0013] Further, the second connector is provided with a communication interface for external connection, including a 40G Ethernet optical port, a 10G Ethernet optical port, a Gigabit Ethernet optical port, a management network optical port, an optical serial port, and a GPIO optical port.

[0014] Further, the liquid cooling pump is also provided with a soundproof cotton.

[0015] Further, the signal processing module includes a CPU module, a GPGPU module, an FPGA module, a DSP module, or an AI module.

[0016] Further, the air-liquid control module is controlled by the BMC unit.

[0017] (III) Advantageous Effects

[0018] The above technical solution of the present utility model has the following advantages:

[0019] (1) The present utility model improves the heat dissipation efficiency, reduces the noise, and has a relatively small overall structure by integrating the liquid cooling module and the fan module. While meeting the heat dissipation requirements of high heat flux density, the liquid cooling module is miniaturized and integrated into the whole signal processing device, thus solving the contradiction between high heat dissipation requirements and the requirements of device miniaturization and low noise.

[0020] (2) The present utility model adopts a dual radiator to improve the heat dissipation efficiency. By setting the direction of cold air flow opposite to the direction of coolant flow, the heat dissipation efficiency is improved; the microchannel radiator with a high heat transfer coefficient but large resistance is arranged behind the air inlet, and the finned radiator with small resistance is arranged in front of the air outlet to avoid the accumulation of hot air inside the device, further improving the heat dissipation efficiency; and the air flow rate and velocity of heat exchange are increased through the fan module, further improving the heat dissipation efficiency.

[0021] (3) By setting the direction of cold air flow opposite to the direction of coolant flow, the present utility model reduces the requirement for the air volume of the device, greatly reduces the fan speed, which is beneficial to reducing the fan noise; and the noise of the liquid cooling pump is reduced by the sound-absorbing cotton, so that the total noise of the device is greatly reduced.

[0022] (4) The present utility model also designs a full-optical communication interface to solve the electromagnetic compatibility problem of the device in a complex electromagnetic environment, reduce the electromagnetic radiation phenomenon, reduce interference, and improve the security of signal transmission. Description of the Drawings

[0023] The features and advantages of the present utility model will be more clearly understood by referring to the accompanying drawings. The drawings are schematic and should not be construed as imposing any limitation on the present utility model. In the drawings:

[0024] Figure 1 is the overall schematic diagram of the signal processing device according to the embodiment of the present utility model;

[0025] Figure 2 is the top view exploded schematic diagram of the signal processing device according to the embodiment of the present utility model;

[0026] Figure 3 is the bottom view exploded schematic diagram of the signal processing device according to the embodiment of the present utility model;

[0027] Figure 4 is the structural diagram of the internal air-liquid integrated heat dissipation device of the signal processing device according to the embodiment of the present utility model;

[0028] Figure 5 Schematic diagram of liquid flow of the internal air-liquid integrated heat dissipation device of the signal processing device according to an embodiment of the present invention;

[0029] Figure 6 Schematic diagram of the air duct of the internal air-liquid integrated heat dissipation device of the signal processing device according to an embodiment of the present invention;

[0030] Figure 7 Schematic diagram of the coolant circulation of the air-liquid integrated heat dissipation device according to an embodiment of the present invention;

[0031] Figure 8 Electrical principle block diagram of the signal processing device according to an embodiment of the present invention;

[0032] Figure 9 Principle block diagram of the air-liquid control module according to an embodiment of the present invention;

[0033] Figure 10 Control principle block diagram of the fan module according to an embodiment of the present invention;

[0034] In the figure: 1: front panel; 2: second heat exchanger; 3: functional module; 4: first heat exchanger; 5: liquid storage tank; 6: water distributor; 7: back panel; 8: liquid cooling pump; 9: liquid cooling pipeline; 10: air inlet; 11: air outlet; 12: temperature sensor; 13: pressure sensor; 14: module liquid cooling plate. Detailed implementation manners

[0035] The following combines the accompanying drawings and embodiments to further describe in detail the specific implementation manners of the present invention. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0036] Among the common heat dissipation methods, the heat transfer path of the heat conduction + natural heat dissipation form is: device - the local area where the cold plate is in close contact with the device - the edge area where the cold plate is lapped with the chassis - the chassis - the peripheral heat sink. The typical heat conduction cooling module has a large thermal resistance and can no longer meet the heat dissipation requirements of the mainstream signal processing module. Although means such as heat pipes or copper inserts can be used to transfer the heat on the module to the edge of the cold plate and reduce the conduction thermal resistance between the device and the chassis, the heat dissipation problem of the whole machine with high power density cannot be solved. The best solution for the heat conduction + air cooling form is to design with reference to the ANSI / VITA 48.5 specification and use the AFT heat dissipation method to dissipate heat from each board in the chassis. Its advantages are that the peripheral heat sink can directly cool the radiator on the module, removing the thermal resistance from the cold plate to the chassis, and the efficiency is very high. It can meet the normal operation of a module with a power consumption of 200W at an ambient temperature of +55°C. However, its limitations are: a) A sealing design needs to be made between the module and the chassis to ensure that the internal circuit is in a closed environment; b) Since an air duct needs to be designed on each module, the size of the air duct space, that is, the thickness dimension, needs to be increased for each module, which limits the number of modules in the same volume. In the heat conduction + liquid cooling form, the cold plate liquid cooling technology is the most mature and widely used liquid cooling heat dissipation method at present. The cold plate liquid cooling technology refers to a cooling form in which the heat of the heat-generating device is indirectly transferred to the cooling liquid in the closed circulation pipeline through a cold plate (usually a closed cavity composed of heat-conducting metals such as copper and aluminum), and the heat is taken away by the cooling liquid. The cold plate liquid cooling technology uses process refrigerant as an intermediate heat transfer medium to transfer the heat from the hot area to a remote location and then cool it. The cold plate liquid cooling solution generally has the following advantages: a) High-efficiency heat dissipation: The volumetric specific heat capacity of the liquid is 1000 - 3500 times that of air, which means that the cooling liquid can absorb a large amount of heat without a significant increase in temperature; the convective heat transfer coefficient of the liquid is 10 - 40 times that of air, and the cooling capacity of liquid cooling is much higher than that of air in the same space; through the forced convection of the process refrigerant in the cold plate, the heat is effectively and quickly taken away from the device, and the heat dissipation efficiency is greatly improved; b) Suitable for high-TDP heat power consumption solutions: When the TDP of the power chip exceeds 350W, the cold plate liquid cooling becomes one of the few solutions; c) Precise refrigeration: It realizes more efficient module-level precise refrigeration, enables the components to work at a more stable and appropriate temperature, and has higher reliability; d) Supports high-power deployment: The cold plate liquid cooling technology has higher heat dissipation efficiency, and at the same time, the liquid cooling pipes of the module occupy less space, supporting more signal processing modules to be inserted into the whole machine; however, liquid cooling heat dissipation cannot be adopted without an external cold source, and the self-supplied cooling liquid has a large volume.

[0037] Therefore, the present utility model innovatively designs in the form of heat conduction + liquid cooling, miniaturizes the cooling system of the process refrigerant and integrates it into the whole machine, retaining the heat dissipation advantages of liquid cooling while reducing the volume and noise.

[0038] An embodiment of the present utility model is an air-liquid integrated heat dissipation device for a signal processing device. The signal processing device is as follows Figure 1-2 shown, and the air-liquid integrated heat dissipation device is as follows Figure 3-4 shown, including a liquid cooling module and a fan module disposed in the chassis of the signal processing device; the liquid cooling module includes a liquid cooling pipeline 9 and a liquid storage tank 5, a liquid cooling pump 8, a second heat exchanger 2, a first heat exchanger 4, and a module liquid cooling plate 14 connected in sequence through the liquid cooling pipeline 9. The module liquid cooling plate 14 is connected to the liquid storage tank 5, and the module liquid cooling plate 14 is closely attached to the functional module 3 of the signal processing device. A temperature sensor 12 is further provided on the liquid cooling pipeline 9. The first heat exchanger 4 is disposed behind the air inlet 10, and the second heat exchanger 2 is disposed in front of the air outlet 11. The fan module is arranged at the air inlet 10 and the air outlet 11 of the chassis panel; the functional module 3 includes a plurality of signal processing modules and an air-liquid control module. The air-liquid control module is respectively connected to the liquid cooling pump 8, the fan module, and the temperature sensor 12, and the air-liquid control module is used to control the rotation speeds of the fan module and the liquid cooling pump 8 according to the detected temperature.

[0039] A temperature sensor 12 and a pressure sensor 13 are provided on the liquid cooling pipeline 9. The temperature sensor 12 is used to obtain the fluid temperature in the liquid cooling pipeline 9, and the pressure sensor 13 is used to test whether the pressure usage requirements of each device in the liquid cooling module are met. In this embodiment, the pressure sensor 13 and the temperature sensor 12 are installed between the first heat exchanger 4 and the first water separator on the liquid cooling pipeline 9 to detect the hydraulic pressure and temperature information of the liquid cooling pipeline 9.

[0040] The liquid cooling module is as follows Figure 3-5 shown, including a liquid cooling pipeline 9 and a liquid storage tank 5, a liquid cooling pump 8, a second heat exchanger 2, a first heat exchanger 4, a first water separator, a module liquid cooling plate 14, and a second water separator connected in sequence through the liquid cooling pipeline 9. The second water separator is connected to the liquid storage tank 5. The module liquid cooling plate 14 is closely attached to the functional module 3 of the signal processing device for heat exchange. The first heat exchanger 4 is disposed behind the air inlet 10, and the second heat exchanger 2 is disposed in front of the air outlet 11. The fan module is arranged at the air inlet 10 and the air outlet 11 of the chassis panel. The first water separator and the second water separator are integrated into a water separator 6; thus, the fan module at the front air inlet 10 blows the external primary cold air into the chassis interior and directly exchanges heat with the coolant in the first heat exchanger 4 disposed behind the front air inlet 10. The primary cold air becomes secondary cold air through the first heat exchanger 4. The upper part of the secondary cold air directly flows out of the chassis side to the surrounding heat sink, and the remaining secondary cold air flows through the chassis bottom and simultaneously dissipates heat from the coolant in the second heat exchanger 2 and the liquid cooling pump 8. Finally, the hot air is extracted from the chassis by the fan module at the rear air outlet, as follows Figure 6 shown, Figure 6The arrow in it indicates the air duct direction; under the action of the liquid cooling pump 8, the coolant first enters the second heat exchanger 2 to conduct convective heat exchange with the secondary cold air and becomes the secondary low-temperature coolant. The secondary low-temperature coolant then flows into the first heat exchanger 4 to conduct convective heat exchange with the primary cold air and becomes the primary low-temperature coolant. The primary low-temperature coolant then flows into the module liquid cooling plate 14 to cool the devices on the functional module, quickly taking away the heat generated by the devices on the functional module through convective heat exchange and becoming the high-temperature coolant, and then returning to the liquid storage tank 5, as Figure 4-5 shown in Figures 7 Figure 4-5 and 7, the arrow in it indicates the coolant flow direction. The fan module increases the air flow rate and velocity of the heat exchange, improving the heat dissipation efficiency.

[0041] In this embodiment, to achieve the integration of liquid cooling and air cooling of the product, it is mainly achieved through the liquid cooling pump 8 and the first heat exchanger 4. The liquid cooling pump 8 is a micro centrifugal pump, using the TA60E series of micro DC brushless water pumps, with a maximum flow rate of 35 L / min and a maximum head of 8 m. The first heat exchanger 4 is a microchannel heat exchanger, with characteristics such as a high convective heat transfer coefficient, a high limit heat dissipation density, a low cold plate thermal resistance, and a compact structure, and its volume heat transfer coefficient can reach 7000 W / (m3*k).

[0042] In this embodiment, the module liquid cooling plate 14 can guide the coolant to directly flow above the chip of the functional module 3, with a short heat dissipation path, a low heat dissipation thermal resistance, and a higher heat dissipation efficiency. The above design can be used for the application of chips or modules with a heat flux density of up to 100 W / cm 2 . At the front air inlet 10 of the device, due to the large air volume and high wind speed, a microchannel radiator with a high heat transfer coefficient but a large resistance is used here; at the rear air outlet 11 of the device, a finned radiator with a small resistance is used to prevent hot air from accumulating inside the device. The first heat exchanger 4 is a microchannel heat exchanger, and the second heat exchanger 2 is a finned heat exchanger. The microchannel radiator and the finned radiator are connected in series through the liquid cooling pipeline 9. The cold air flow direction is opposite to the fluid flow direction, improving the efficiency of the cooling air and reducing the requirement for the air volume of the device, that is, greatly reducing the requirement for the fan speed.

[0043] The noise of this device comes from the liquid cooling pump 8 and the fan module. In this embodiment, the fan module adopts the 120×120 series of DC fans. One set of fans is designed at each of the front and rear air inlets and outlets to improve the heat exchange efficiency between the hot air inside the product and the cold air outside. In this embodiment, at the front air inlet 10, 6 axial fans are installed on the front panel 1, and at the rear air outlet 11, 4 axial fans are installed on the rear panel. The total noise is not greater than 50 dB(A), and the total air volume is not greater than 1000 CFM. The liquid cooling pump 8 adopts the TA60E series of micro DC brushless water pumps, with a noise not greater than 50 dB(A), an IP rating of IP68, capable of continuous operation, and a service life of not less than 20,000 hours. Moreover, the micro liquid cooling pump 8 can be further noise-reduced by using sound-absorbing cotton inside the device, making the main noise of the device depend on the fan module. It is expected that the total noise of the device is less than 55 dB(A) (noise affecting the human body is above 60 dB(A)), less than the noise of the classical forced air-cooled device above 75 dB(A), avoiding the impact of noise on the human body.

[0044] In this embodiment, the liquid cooling module and the fan module are integrated, and the volume of the device is not greater than 482.6 mm × 311 mm × 430 mm (width × height × depth), as Figure 8 shown, which is comparable to the volume of the classical forced air-cooled signal information device and much smaller than the volume of the separated device (482.6 mm × 1000 mm × 550 mm).

[0045] The functional module 3 of the signal processing device includes multiple signal processing modules, a switching module, a power module, and a wind-liquid control module. The wind-liquid control module is respectively connected to the liquid cooling pump 8, the fan module, and the temperature sensor 12, and is used to control the rotation speeds of the fan module and the liquid cooling pump 8 according to the detected temperature. The wind-liquid control module is controlled through the BMC unit, with the BMC unit set on the switching module and the IPMC unit set on other modules. The signal processing module, the switching module, and the power module achieve the interconnection of internal modules through the first connector on the backplane. The first connector is connected to the second connector through the backplane 7. The second connector is provided with a communication interface for external connection to achieve communication between the device and external devices. The fourth connector is provided with a power interface for external connection. The power module is connected to the external power supply through the fourth connector to provide power for the device. The BMC unit is connected to the fan module and the liquid cooling pump 8 through the third connector.

[0046] The signal processing module includes a CPU module, a GPGPU module, an FPGA module, a DSP module or an AI module. Multiple signal processing modules together constitute a computing power resource pool for providing the computing power required for device signals and information. The number of signal processing modules is configured as needed. In this embodiment, there are 2 CPU modules and 8 GPGPU modules in the signal processing module. The CPU module and the GPGPU module are interconnected via a PCIE bus through the backplane 7. The CPU module outputs GPIO optical interfaces and optical serial ports externally;

[0047] The switching module adopts a redundant design with at least two switching modules. In this embodiment, it is a dual-switching module, that is, when one switching module has a problem, it does not affect the network communication function of the device. At the same time, the switching module provides 40G Ethernet interconnection for domestic high-performance CPU modules and the external Ethernet interface of the device.

[0048] The power supply module adopts a redundant design with at least two power supply modules. In this embodiment, it is a dual-power supply module, that is, when one power supply has a problem, it does not affect the normal operation of the device. The power supply module supports AC200V input and DC12V output.

[0049] The air-liquid control module is controlled through the BMC unit on the switching module and the IPMC unit on other modules. The BMC unit and the IPMC unit are interconnected via the IPMB bus of the backplane 7. The air-liquid control module is also responsible for collecting the overall machine health status information, such as the voltage, temperature, fan speed, micro liquid cooling pump 8, etc. of each module. It can adjust the fan speed and the speed of the micro liquid cooling pump 8 according to the detected temperature, and can report the overall machine health status information through the overall machine management network port.

[0050] The wind and liquid control module is respectively connected to the liquid cooling pump 8, the fan module, the temperature sensor 12, and the management network port; the liquid cooling control module uses an HC32F4A0 single-chip microcomputer to detect and control the liquid cooling pump 8 and the fan module through PWM and TACH signals. The HC32F4A0 collects the rotation speed of the liquid cooling pump 8 through the TACH signal, controls the pump rotation speed through the PWM signal, collects the rotation speed of the fan module through the TACH signal, controls the fan module through the PWM signal, and realizes the fan rotation speed collection and control function through GPIO; the liquid cooling control module is connected to the RS485 chip and the JL connector through the UART signal to connect the pressure sensor 13 and the temperature sensor 12, and obtains the information reported by the pressure sensor 13 and the temperature sensor 12. The RS485 chip is SIT 3485E; the liquid cooling control module is connected to the management network port through the PHY chip and the network transformer, and leads out the management network port to detect and control the single-chip microcomputer; the liquid cooling control module reserves an I2C connection to the JL connector for data interaction with the main BMC; the liquid cooling control module is also connected to a power chip, and the power chip is BPD60306. As Figure 9 shown. The fan module includes multiple fans, which are respectively connected to the liquid cooling control module, as Figure 10 shown.

[0051] The second connector is provided with communication interfaces for external connection, including 40G Ethernet optical port, 10G Ethernet optical port, Gigabit Ethernet optical port, management network optical port, optical serial port, and GPIO optical port, to realize the communication between the device and external devices. The fourth connector is provided with a power interface for external connection, that is, an AC 220V / 50Hz power interface, to provide power for the device. The buses or interfaces used by the first connector and the third connector include Ethernet, PCIE bus, IPMB bus, and 40G optical interface.

[0052] In this embodiment, the key software and hardware of the CPU module, GPGPU module, and switch module are all domestic.

[0053] In this embodiment, the processing chip of the CPU module is the FT2000+ series, and the floating-point operation ability of a single module is ≥1.12 TFlops; the chipset of the CPU module is the X-100 series chip; the 10G Ethernet controller of the CPU module is the 18XX series chip; the IPMC controller of the CPU module is the HC32XX series chip; the operating system of the CPU module adopts the Galaxy Kylin operating system.

[0054] In this embodiment, the GPGPU module is a Zhikai 100 series chip. The Zhikai 100 series is the latest domestic high-performance GPGPU chip. Its single-chip single-precision floating-point operation ability is not less than 16 TFlops, and can reach up to 24 TFlops. Moreover, it has good usability (compatible with CUDA) and versatility (high model and operator coverage).

[0055] In this embodiment, the switching module uses CTC7132 series chips, with a maximum supported I / O bandwidth of 440G. The chips adopt a low-power process, and the typical power consumption is 25W. The BMC controller of the switching module is an HC32 series chip;

[0056] In this embodiment, there are 2 CPU modules and 8 GPGPU modules. The total computing power of the device is not less than 190 TFlops at most. While the computing power of a single existing classic underwater acoustic processing device is 5 TFlops. That is, this device can provide computing power equivalent to about 40 original classic devices. Therefore, this embodiment can meet the heat dissipation requirements of the device up to 3100W (typical 2000W), and can support a heat flux density of up to 100W / cm 2 The application of chips or modules can provide a peak floating-point operation ability of not less than 190 TFlops (equivalent to the computing power that a traditional workstation can provide).

[0057] In this embodiment, the first connector adopts a VPX optical and electrical hybrid series connector. The interfaces or buses include an Ethernet bus, a PCIE bus, and an IPMB bus. The Ethernet bus adopts protocol standards of 1000BASE-X and 10GBASE-KR; the PCIE bus adopts a protocol standard of PCIE GEN3.0, and the IPMB bus adopts a protocol standard of IPMI2.0; the second connector adopts YMF15XX and J599XX series connectors. The interfaces or buses include 40G Ethernet optical ports, 10G Ethernet optical ports, Gigabit Ethernet optical ports, management network optical ports, optical serial ports, and GPIO optical ports; the third and fourth connectors adopt J30J series connectors. The interface signals include fan power and control signals, micro-pump power and control signals, device power, etc.

[0058] In addition, due to the skin effect of high-speed signals in circuit transmission, the higher the signal rate, the more likely electromagnetic radiation phenomena occur. Secondly, high-speed electrical signals are easily interfered during transmission. The present utility model also adopts an optical interface design scheme to solve the electromagnetic compatibility problem of the device in a complex electromagnetic environment.

[0059] In this embodiment, the network chips of the CPU module and the switching module also adopt HTS8502 series optical and electrical conversion modules to realize the optical and electrical conversion function of high-speed network signals; the CPU module also adopts optocoupler devices to realize the optical and electrical conversion function of low-speed serial ports and GPIO.

[0060] The first connector of the backplane 7 uses a VPX optical and electrical hybrid connector, and the CPU modules are interconnected by 40G ultra-high-speed Ethernet optical fibers to solve the electromagnetic radiation problem of high-speed signals in the PCB board. The second connector of the device uses YMF15XX and J599XX series optical connectors to transmit high-speed signals such as 40G and 10G, as well as low-speed signals such as optical serial ports and GPIO optical interfaces, respectively, to solve the problems of electromagnetic radiation and electromagnetic sensitivity during signal transmission.

[0061] In summary, through the above-mentioned liquid-air integrated cooling device for signal processing equipment, the following beneficial effects are achieved:

[0062] (1) The present utility model improves the heat dissipation efficiency, reduces noise, and has a relatively small overall structure by integrating the liquid cooling module and the fan module, so that while meeting the heat dissipation requirements of high heat flux density, the liquid cooling module is miniaturized and integrated into the entire signal processing equipment to solve the contradiction between high heat dissipation requirements and the requirements of equipment miniaturization and low noise.

[0063] (2) The present utility model uses a dual radiator to improve the heat dissipation efficiency. By making the cold air flow direction opposite to the coolant flow direction, the heat dissipation efficiency is improved; the microchannel radiator with a high heat transfer coefficient but large resistance is arranged behind the air inlet, and the finned radiator with small resistance is arranged in front of the air outlet to avoid the accumulation of hot air inside the equipment and further improve the heat dissipation efficiency; and the air flow rate and velocity of heat exchange are increased through the fan module to further improve the heat dissipation efficiency.

[0064] (3) The present utility model reduces the requirement for the air volume of the equipment and greatly reduces the fan speed by making the cold air flow direction opposite to the coolant flow direction, which is beneficial to reducing the fan noise; and the noise of the liquid cooling pump is reduced by using sound-absorbing cotton, so that the total noise of the equipment is greatly reduced.

[0065] (4) The present utility model also solves the electromagnetic compatibility problem of the equipment in a complex electromagnetic environment, reduces the electromagnetic radiation phenomenon, reduces interference, and improves the security of signal transmission through the all-optical communication interface design.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model and are not intended to limit them; although the embodiments of the present utility model are described in conjunction with the drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present utility model, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. An air-liquid integrated heat dissipation device for signal processing equipment, characterized in that: It includes a liquid cooling module and a fan module arranged in the chassis of the signal processing equipment; the liquid cooling module includes a liquid cooling pipeline and a liquid storage tank, a liquid cooling pump, a second heat exchanger, a first heat exchanger, a first water distributor, a module liquid cooling plate, and a second water distributor which are connected in sequence through the liquid cooling pipeline, the second water distributor is connected to the liquid storage tank, the module liquid cooling plate is close to the functional module of the signal processing equipment, and a temperature sensor is also provided on the liquid cooling pipeline, the first heat exchanger is arranged behind the air inlet, the second heat exchanger is arranged in front of the air outlet, and the fan module is arranged at the air inlet and the air outlet of the chassis panel; the functional module includes multiple signal processing modules and an air-liquid control module, and the air-liquid control module is respectively connected to the liquid cooling pump, the fan module and the temperature sensor.

2. The air-liquid integrated heat dissipation device for signal processing equipment according to claim 1, characterized in that: A pressure sensor is also provided on the liquid cooling pipeline, and the pressure sensor is used to test whether the pressure use requirements of each component in the liquid cooling module are met. The pressure sensor and the temperature sensor are installed between the first heat exchanger and the first water separator.

3. The air-liquid integrated heat dissipation device for signal processing equipment according to claim 1, characterized in that: The first heat exchanger is a microchannel heat exchanger, and the second heat exchanger is a fin heat exchanger.

4. The air-liquid integrated heat dissipation device for signal processing equipment according to claim 1, characterized in that: The functional module also includes a switching module and a power supply module.

5. The air-liquid integrated heat dissipation device for signal processing equipment according to claim 4, characterized in that: The switching module includes at least two switching modules, and the power supply module includes at least two power supply modules.

6. The air-liquid integrated heat dissipation device for signal processing equipment according to claim 4, characterized in that: The signal processing module and the switching module are interconnected through a first connector on the backplane, the first connector is connected to a second connector through the backplane, the second connector is provided with a communication interface for external connection, the BMC unit is connected to a fan module and a liquid cooling pump through a third connector, and the power supply module is connected to an external power supply through a fourth connector.

7. The air-liquid integrated heat dissipation device for signal processing equipment according to claim 6, characterized in that: The second connector is provided with communication interfaces for external connection, including a 40G Ethernet optical port, a 10 Gigabit Ethernet optical port, a Gigabit Ethernet optical port, a management network optical port, an optical serial port and a GPIO optical port.

8. The air-liquid integrated heat dissipation device for signal processing equipment according to claim 1, characterized in that: The liquid cooling pump is also provided with silent cotton.

9. The air-liquid integrated heat dissipation device for signal processing equipment according to claim 1, characterized in that: The signal processing module includes a CPU module, a GPGPU module, a FPGA module, a DSP module or an AI module.

10. The air-liquid integrated heat dissipation device for signal processing equipment according to claim 1, characterized in that: The air-hydraulic control module is controlled by a BMC unit.

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