Method for manufacturing solar cell module, and solar cell module

Abstract

Provided is a method for manufacturing a solar cell module in which damage caused by heat during sealing is suppressed. This method for manufacturing a solar cell module is provided with: a first sealing step in which a back-side protective member (51), a back-side sealing material (41), a crystalline silicon solar cell (10), and a first inter-cell sealing material (31) are stacked in this order, and the crystalline silicon solar cell (10) is sealed to obtain a crystalline silicon solar cell sealed body; a second sealing step in which a light-receiving-side protective member (52), a light-receiving-side sealing material (42), a perovskite solar cell (20), and a second inter-cell sealing material (32) are stacked in this order, and the perovskite solar cell (20) is sealed to obtain a sealed perovskite solar cell; and a third sealing step in which the crystalline silicon solar cell sealing body and the perovskite solar cell sealing body are stacked and sealed. The sealing temperatures of the second sealing step and the third sealing step are lower than the sealing temperature of the first sealing step.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a solar cell module and a solar cell module. Background Art

[0002] A solar cell module is known in which a solar cell unit is sealed by a protective member such as glass or a transparent resin and a sealant. As a solar cell unit, a crystalline silicon solar cell unit using a crystalline silicon substrate as a photoelectric conversion layer and a thin film solar cell unit using an inorganic thin film such as an amorphous silicon thin film as a photoelectric conversion layer are known. In addition, as a thin film solar cell, a perovskite thin film solar cell unit using a perovskite thin film as an organic thin film (specifically, an organic / inorganic hybrid thin film) as a photoelectric conversion layer is known.

[0003] In recent years, a multi-junction (tandem) solar cell module has been known in which photoelectric conversion layers having different band gaps are stacked for the purpose of effectively utilizing light in a wide wavelength range to improve the conversion efficiency of solar cell cells.

[0004] For example, a multi-junction solar cell unit in which two photoelectric conversion units including different photoelectric conversion layers are stacked in a single solar cell unit is disclosed in Patent Document 1. In this solar cell unit, for example, a bottom unit including a crystalline silicon substrate as a photoelectric conversion layer and a top unit including a perovskite thin film as a photoelectric conversion layer are stacked in a single solar cell unit.

[0005] On the other hand, a multi-junction solar cell module in which two types of solar cell units each including a different photoelectric conversion layer are stacked is disclosed in Patent Document 2. In this solar cell module, for example, a crystalline silicon solar cell string composed of a bottom unit including a crystalline silicon substrate as a photoelectric conversion layer and a perovskite solar cell string composed of a top unit including a perovskite thin film as a photoelectric conversion layer are stacked as two types of solar cell strings.

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-11058

[0007] Patent Document 2: Japanese Patent Application Publication No. 2018-157176

[0008] As described in Patent Document 2, in a multi-junction solar cell module formed by stacking two types of solar cell units including different photoelectric conversion layers, the heat resistance characteristics of the two types of solar cell units are sometimes different. For example, in a crystalline silicon solar cell unit and a perovskite solar cell unit, the heat resistance characteristics are different. Therefore, when the crystalline silicon solar cell unit and the perovskite solar cell unit are sealed, the perovskite solar cell unit is sometimes damaged by heat, resulting in reduced output. Summary of the invention

[0009] An object of the present invention is to provide a method for manufacturing a solar cell module and a solar cell module that suppress damage caused by heat during sealing.

[0010] The manufacturing method of the solar cell module involved in the present invention is a manufacturing method of a solar cell module comprising a back side protection component, a back side seal, a crystalline silicon solar cell unit, a first inter-unit seal, a second inter-unit seal, a perovskite solar cell unit, a light-receiving side seal and a light-receiving side protection component, wherein the method comprises: (i) a first sealing step of stacking the back side protection component, the back side seal, the crystalline silicon solar cell unit and the first inter-unit seal in sequence, and sealing the crystalline silicon solar cell unit to obtain a crystalline silicon solar cell unit sealed body, (ii) a second sealing step of stacking the light-receiving side protection component, the light-receiving side seal, the perovskite solar cell unit and the second inter-unit seal in sequence, and sealing the perovskite solar cell unit to obtain a perovskite solar cell unit sealed body, and (iii) a third sealing step of stacking and sealing the crystalline silicon solar cell unit sealed body and the perovskite solar cell unit sealed body in a manner that the first inter-unit seal is in contact with the second inter-unit seal. The sealing temperature in the second sealing step and the third sealing step is lower than the sealing temperature in the first sealing step.

[0011] The solar cell module involved in the present invention is a solar cell module manufactured by the above-mentioned solar cell module manufacturing method, wherein a back side protection component, a back side seal, a crystalline silicon solar cell unit, a first inter-unit seal, a second inter-unit seal, a perovskite solar cell unit, a light-receiving side seal and a light-receiving side protection component are stacked in sequence, and the materials of the above-mentioned second inter-unit seal and the above-mentioned light-receiving side seal are different from the materials of the above-mentioned first inter-unit seal and the above-mentioned back side seal.

[0012] Another solar cell module involved in the present invention is a solar cell module manufactured by the above-mentioned solar cell module manufacturing method, wherein a back side protection component, a back side sealant, a crystalline silicon solar cell unit, a first inter-unit sealant, a second inter-unit sealant, a perovskite solar cell unit, a light-receiving side sealant and a light-receiving side protection component are stacked in sequence, the material of the above-mentioned second inter-unit sealant and the above-mentioned light-receiving side sealant is the same as the material of the above-mentioned first inter-unit sealant and the above-mentioned back side sealant, and the cross-linking state of the above-mentioned second inter-unit sealant and the above-mentioned light-receiving side sealant is lower than the cross-linking state of the above-mentioned first inter-unit sealant and the above-mentioned back side sealant.

[0013] According to the present invention, in the manufacture of a solar cell module, damage due to heat during sealing can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic cross-sectional view of a solar cell module according to this embodiment.

[0015] Figure 2 It is a diagram showing a first sealing step in the method for manufacturing the solar cell module according to the present embodiment.

[0016] Figure 3 It is a diagram showing a first sealing step in the method for manufacturing the solar cell module according to the present embodiment.

[0017] Figure 4 It is a diagram showing a second sealing step in the method for manufacturing the solar cell module according to the present embodiment.

[0018] Figure 5 It is a diagram showing a second sealing step in the method for manufacturing the solar cell module according to the present embodiment.

[0019] Figure 6 It is a diagram showing a third sealing step in the method for manufacturing the solar cell module according to the present embodiment. DETAILED DESCRIPTION

[0020] Hereinafter, an example of an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, the same reference numerals are used for the same or corresponding parts in each of the drawings. In addition, for convenience, hatching, component reference numerals, etc. may be omitted, but in this case, reference will be made to other drawings.

[0021] (Solar cell module)

[0022] Figure 1 It is a schematic cross-sectional view of a solar cell module according to this embodiment. Figure 1 The solar cell module 100 shown is a multi-junction (tandem) solar cell module in which a crystalline silicon solar cell unit 10 and a perovskite solar cell unit 20 are stacked via a first inter-cell sealant 31 and a second inter-cell sealant 32. The solar cell module 100 includes a back side protection member 51, a back side sealant 41, a crystalline silicon solar cell unit 10, a first inter-cell sealant 31, a second inter-cell sealant 32, a perovskite solar cell unit 20, a light-receiving side sealant 42, and a light-receiving side protection member 52.

[0023] The light-receiving side protection member 52 protects the perovskite solar cell unit 20 by covering the surface (light-receiving surface) of the perovskite solar cell unit 20 via the light-receiving side sealing member 42. The shape of the light-receiving side protection member 52 is not particularly limited, but is preferably in the form of a plate or sheet from the point of indirectly covering the planar light-receiving surface.

[0024] The material of the light-receiving side protection member 52 is not particularly limited, but a material having light transparency and resistance to ultraviolet light is preferred, and examples thereof include glass, acrylic, PET, PC, and ETFE.

[0025] The back protection member 51 protects the crystalline silicon solar cell 10 by covering the back surface of the crystalline silicon solar cell 10 via the back seal 41. The shape of the back protection member 51 is not particularly limited, but is preferably in the form of a plate or sheet in order to indirectly cover the planar back surface.

[0026] The material of the back protection member 51 is not particularly limited, but a material that prevents the intrusion of water or the like (high water-insulating property) is preferable. Examples thereof include glass and a back sheet.

[0027] The light-receiving side seal 42 seals and protects the perovskite solar cell 20, and is interposed between the light-receiving side surface of the perovskite solar cell 20 and the light-receiving side protection member 52. The shape of the light-receiving side seal 42 is not particularly limited, but a sheet shape can be cited, for example. This is because: if it is a sheet shape, it is easy to cover the surface of the planar perovskite solar cell 20.

[0028] The material of the light-receiving side seal 42 is not particularly limited, but preferably has a property of allowing light to pass through (translucency). In addition, it is preferred that the material of the light-receiving side seal 42 has adhesion that allows the perovskite solar cell unit 20 to adhere to the light-receiving side protection component 52. As such a material, for example, translucent resins such as polyolefins, ethylene / vinyl acetate copolymers (EVA), acrylic resins, epoxy resins, and silicone resins can be cited. In addition, the light-receiving side seal 42 may contain a cross-linking agent.

[0029] The back seal 41 seals and protects the crystalline silicon solar cell 10, and is disposed between the back surface of the crystalline silicon solar cell 10 and the back protection member 51. The shape of the back seal 41 is not particularly limited, but a sheet shape can be cited, for example. This is because: if it is a sheet shape, it is easy to cover the back surface of the planar crystalline silicon solar cell 10.

[0030] The material of the back seal 41 is not particularly limited, but preferably has a property of allowing light to pass through (translucency). In addition, it is preferred that the material of the back seal 41 has adhesion that allows the crystalline silicon solar cell unit 10 to be bonded to the back protection component 51. As such a material, for example, translucent resins such as polyolefins, ethylene / vinyl acetate copolymers (EVA), acrylic resins, epoxy resins, and silicone resins can be cited. In addition, the back seal 41 may contain a crosslinking agent.

[0031] The first inter-cell sealant 31 seals and protects the crystalline silicon solar cell 10, and is located between the light-receiving surface of the crystalline silicon solar cell 10 and the second inter-cell sealant 32. The shape of the first inter-cell sealant 31 is not particularly limited, but a sheet shape can be cited, for example. This is because: if it is in a sheet shape, it is easy to cover the light-receiving surface of the planar crystalline silicon solar cell 10.

[0032] The material of the first inter-unit sealant 31 is not particularly limited, but preferably has a property of allowing light to pass through (translucency). In addition, the material of the first inter-unit sealant 31 preferably has adhesion that allows the crystalline silicon solar cell unit 10 to be bonded to the second inter-unit sealant 32. As such a material, for example, translucent resins such as polyolefins and ethylene / vinyl acetate copolymers (EVA) can be cited. In addition, the back sealant 41 may contain a cross-linking agent.

[0033] The second inter-cell sealant 32 seals and protects the perovskite solar cell 20, and is disposed between the back surface of the perovskite solar cell 20 and the first inter-cell sealant 31. The shape of the second inter-cell sealant 32 is not particularly limited, but a sheet shape can be cited, for example. This is because: if it is in a sheet shape, it is easy to cover the back surface of the planar perovskite solar cell 20.

[0034] The material of the second inter-cell seal 32 is not particularly limited, but preferably has a property of allowing light to pass through (translucency). In addition, it is preferred that the material of the second inter-cell seal 32 has adhesion that allows the perovskite solar cell unit 20 to be bonded to the first inter-cell seal 31. As such a material, for example, translucent resins such as polyolefins, ethylene / vinyl acetate copolymers (EVA), acrylic resins, epoxy resins, and silicone resins can be cited. In addition, the light-receiving side seal 42 may contain a crosslinking agent.

[0035] The materials of the second inter-cell seal 32 and the light-receiving side seal 42 may be different from the materials of the first inter-cell seal 31 and the back-side seal 41. That is, the melting points of the second inter-cell seal 32 and the light-receiving side seal 42 may be lower than the melting points of the first inter-cell seal 31 and the back-side seal 41. Thus, the sealing temperatures of the second sealing step and the third sealing step described later can be lower than the sealing temperature of the first sealing step.

[0036] Alternatively, the material of the second inter-cell seal 32 and the light-receiving side seal 42 may be the same as the material of the first inter-cell seal 31 and the back-side seal 41. In this case, if the sealing temperature of the second sealing step and the third sealing step described later is lower than the sealing temperature of the first sealing step, the cross-linked state of the second inter-cell seal 32 and the light-receiving side seal 42 becomes lower than the cross-linked state of the first inter-cell seal 31 and the back-side seal 41.

[0037] <<Crystalline Silicon Solar Cell>>

[0038] The crystalline silicon solar cell 10 includes a semiconductor substrate as a photoelectric conversion layer. The semiconductor substrate absorbs light to generate photocarriers. The semiconductor substrate is a crystalline silicon substrate such as single crystal silicon or polycrystalline silicon.

[0039] The semiconductor substrate may have a pyramid-shaped microscopic concavo-convex structure called a texture structure on the light-receiving surface side, thereby reducing reflection of incident light on the light-receiving surface and improving the light confinement effect of the semiconductor substrate.

[0040] In addition, the semiconductor substrate may have a pyramid-shaped microscopic concavo-convex structure called a texture structure on the back side. This improves the efficiency of recovering light that has passed through the semiconductor substrate without being absorbed.

[0041] Examples of the crystalline silicon solar cell unit 10 include a diffusion type unit in which a second conductivity type diffusion layer is provided on the light receiving surface side of a first conductivity type single crystal silicon substrate, and a heterojunction unit in which silicon thin films are provided on both surfaces of a first conductivity type single crystal silicon substrate.

[0042] In the case of a heterojunction unit having silicon-based thin films on the front and back of a single crystal silicon substrate, the crystalline silicon solar cell 10 has a conductive silicon-based thin film formed on the light-receiving side of the photoelectric conversion layer and a conductive silicon-based thin film formed on the back side of the photoelectric conversion layer.

[0043] The single crystal silicon substrate can be either p-type or n-type. When comparing holes with electrons, electrons have a greater mobility, so when an n-type single crystal silicon substrate is used, the conversion characteristics are particularly excellent. The conductive silicon-based thin film is a p-type silicon-based thin film or an n-type silicon-based thin film.

[0044] Preferably, an intrinsic silicon-based thin film is provided between the single crystal silicon substrate as the photoelectric conversion layer and the conductive silicon-based thin film. By providing the intrinsic silicon-based thin film on the surface of the single crystal silicon substrate, it is possible to effectively perform surface passivation while suppressing the diffusion of impurities into the single crystal silicon substrate. By providing an intrinsic amorphous silicon thin film on the surface of the single crystal silicon substrate as the intrinsic silicon-based thin film, a high passivation effect can be obtained relative to the surface of the single crystal silicon substrate.

[0045] The crystalline silicon solar cell unit 10 may be a double-sided electrode type (also called double-sided junction type) unit, or a back electrode type (also called back junction type, back contact type) unit. In addition, in the case of a back electrode type unit, compared with a double-sided electrode type unit, the output of the solar cell module can be increased, and the appearance design of the solar cell module can be improved.

[0046] The crystalline silicon solar cell unit 10 may be a large semiconductor substrate (wafer) of a predetermined size (for example, a 6-inch semi-square shape), or may be a half-cut unit obtained by cutting the large semiconductor substrate (wafer) into two.

[0047] As described above, the semiconductor substrate may have a pyramid-shaped minute concavo-convex structure called a texture structure on the light-receiving surface side. Thus, the crystalline silicon-based solar cell 10 may have a concavo-convex structure on the light-receiving surface side.

[0048] <<Perovskite Solar Cell>>

[0049] The perovskite solar cell unit 20 includes a thin film semiconductor layer as a photoelectric conversion layer. The semiconductor layer absorbs light to generate photocarriers. The semiconductor layer has a band gap different from that of the semiconductor substrate of the above-mentioned crystalline silicon solar cell unit 10. Therefore, the above-mentioned semiconductor substrate and semiconductor layer have spectral sensitivity characteristics in different wavelength ranges. Therefore, in the solar cell module 100 stacked with the above-mentioned crystalline silicon solar cell unit 10 and the perovskite solar cell unit 20, light with a wider wavelength can be contributed to photoelectric conversion.

[0050] Specifically, the thin film constituting the semiconductor layer may be an organic semiconductor thin film, more specifically, an organic-inorganic hybrid semiconductor thin film. The organic-inorganic hybrid semiconductor thin film may be a perovskite thin film containing a photosensitive material having a perovskite crystal structure.

[0051] The compound constituting the perovskite type crystalline material is represented by the general formula R 1 NH3M 1 X3 or HC(NH2)2M 1 X3 represents. In the formula, R 1 M is an alkyl group, preferably an alkyl group having 1 to 5 carbon atoms, and particularly preferably a methyl group.1 It is a divalent metal ion, preferably Pb or Sn. X is a halogen, and examples thereof include F, Cl, Br, and I. In addition, all three Xs may be the same halogen element, or a plurality of halogens may be mixed.

[0052] As a preferred example of a compound constituting a perovskite type crystalline material, there can be mentioned a compound having the formula CH3NH3Pb(I 1- x Br x )3 (wherein 0≤x≤1). The spectral sensitivity characteristics of the perovskite material can be changed by changing the type and ratio of the halogen. The perovskite semiconductor thin film can be formed by various drying processes, spin coating and other solution film formation.

[0053] The perovskite solar cell 20 may be formed on a highly transparent film-shaped substrate. Examples of the material of the substrate include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), and glass.

[0054] The perovskite solar cell 20 includes a perovskite layer as a photoelectric conversion layer and a charge transport layer. One of the charge transport layers is a hole transport layer, and the other is an electron transport layer.

[0055] Examples of materials for the hole transport layer include polythiophene derivatives such as poly-3-hexylthiophene (P3HT) and poly(3,4-ethylenedioxythiophene) (PEDOT), fluorene derivatives such as 2,2',7,7'-tetrakis[N,N-di(4-methoxyphenyl)amino]-9,9'-spirobifluorene (Spiro-OMeTAD), carbazole derivatives such as polyvinylcarbazole, triphenylamine derivatives, diphenylamine derivatives, polysilane derivatives, and polyaniline derivatives.

[0056] Examples of the material for the electron transport layer include metal oxides such as titanium oxide, zinc oxide, niobium oxide, zirconium oxide, and aluminum oxide.

[0057] An electrode for extracting photogenerated carriers is formed in the perovskite solar cell unit 20. The electrode may include a transparent electrode and a metal electrode, or may include only a transparent electrode, or may include only a metal electrode. As the material of the transparent electrode, metal oxides such as ITO, zinc oxide, and tin oxide are preferably used. As the material of the metal electrode, silver, copper, aluminum, etc. are preferably used.

[0058] (Method for manufacturing solar cell module)

[0059] Next, refer to Figure 2 to Figure 6 A method for manufacturing the solar cell module according to the present embodiment will be described. Figure 2 and Figure 31 is a diagram showing a first sealing step in the method for manufacturing a solar cell module according to the present embodiment. Figure 4 and Figure 5 It is a diagram showing a second sealing step in the method for manufacturing the solar cell module according to the present embodiment. Figure 6 It is a diagram showing a third sealing step in the method for manufacturing the solar cell module according to the present embodiment.

[0060] First, if Figure 2 As shown, the back protection member 51, the back sealing member 41, the crystalline silicon solar cell 10, the first inter-cell sealing member 31, the peeling sheet 62, and the glass plate 61 are stacked in sequence. Next, the stacked components are heated and pressed under vacuum by using a laminating device, for example, to seal the crystalline silicon solar cell 10. Next, the glass plate 61 is peeled off by peeling off the peeling sheet 62 to obtain Figure 3 The crystalline silicon solar cell sealed body 110 is shown (first sealing step).

[0061] The sealing temperature of the first sealing process is, for example, 100° C. or more and 180° C. or less. That is, the sealing temperature of the first sealing process is higher than the sealing temperatures of the second sealing process and the third sealing process described later. Thus, the sealing temperature of the first sealing process can be made higher than the melting point of the back seal 41 and the first inter-unit seal 31, and the cross-linking state of the back seal 41 and the first inter-unit seal 31 can be improved. Therefore, the crystalline silicon solar cell unit 10 can be fully sealed.

[0062] In addition, the release sheet 62 and the glass plate 61 may not be used. However, by using the glass plate 61, the first inter-cell seal 31 side can be made flat, and the generation of bubbles on the first inter-cell seal 31 side in the third sealing step described later can be suppressed. In addition, by using the release sheet 62, the glass plate 61 can be easily peeled off.

[0063] Next, if Figure 4 As shown, the light-receiving side protection member 52, the light-receiving side sealing member 42, the perovskite solar cell 20, and the second inter-cell sealing member 32 are stacked in sequence. Next, the stacked components are heated and pressed under vacuum by using a laminating device, for example, to seal the perovskite solar cell 20. Thus, Figure 5 The perovskite solar cell sealed body 120 is shown (second sealing step).

[0064] The sealing temperature of the second sealing process is, for example, above room temperature and below 100°C. That is, the sealing temperature of the second sealing process is lower than the sealing temperature of the first sealing process. Thus, it is possible to suppress damage to the perovskite solar cell 20. In addition, the cross-linking state of the second inter-cell seal 32 and the light-receiving side seal 42 may also be low. Thus, in the third sealing process described later, the adhesion between the second inter-cell seal 32 and the first inter-cell seal 31 can be improved.

[0065] In the second sealing step, a release sheet and a glass plate may be used on the second inter-cell sealing material 32 side, similarly to the first sealing step.

[0066] Next, if Figure 6 As shown, the crystalline silicon solar cell sealing body 110 and the perovskite solar cell sealing body 120 are stacked in such a manner that the first inter-cell sealing member 31 and the second inter-cell sealing member 32 are in contact with each other. Next, the stacked components are sealed by heating and pressing them under vacuum, for example, using a laminating device. Thus, Figure 1 The solar cell module 100 shown (third sealing step).

[0067] The sealing temperature of the third sealing step is, for example, room temperature or higher and 100° C. or lower. That is, the sealing temperature of the third sealing step is lower than the sealing temperature of the first sealing step. This can prevent the perovskite solar cell 20 from being damaged.

[0068] In addition, when the materials of the second inter-cell sealant 32 and the light-receiving side sealant 42 are the same as those of the first inter-cell sealant 31 and the back-side sealant 41, in the solar cell module 100, the cross-linked state of the second inter-cell sealant 32 and the light-receiving side sealant 42 is lower than the cross-linked state of the first inter-cell sealant 31 and the back-side sealant 41.

[0069] As an index of the crosslinking state of the sealant, for example, the crosslinking rate (gel fraction) can be cited. For example, it is preferred that the crosslinking rate of the first inter-cell sealant 31 and the back-side sealant 41 is 60% or more and 90% or less, and the crosslinking rate of the second inter-cell sealant 32 and the light-receiving side sealant 42 is 0% or more and 50% or less.

[0070] Here, as described above, when the perovskite solar cell is formed on a film-like substrate, in the sealing process, stress may be generated from the sealant to the film-like substrate due to the curing shrinkage of the sealant caused by crosslinking, causing the film-like substrate to fluctuate. If the film-like substrate fluctuates, the wiring may peel off.

[0071] In this regard, if the cross-linking rate of the sealants 32 and 42 on the perovskite solar cell unit 20 side is lowered to 0% or more and 50% or less, the curing shrinkage of the sealants 32 and 42 caused by cross-linking is suppressed, the generation of stress from the sealants 32 and 42 to the film-like substrate is suppressed, and the generation of undulations of the film-like substrate is suppressed. Therefore, it is possible to suppress the peeling of the wiring caused by the undulations of the film-like substrate, and also to obtain a good appearance.

[0072] If the cross-linking rate of the first inter-cell sealant 31 and the back-side sealant 41 is 60% or more, the sealants 31 and 41 are not easy to flow after the first sealing process, so that the peeling and sealant falling off between the crystalline silicon solar cell unit 10 and the first inter-cell sealant 31 or between the crystalline silicon solar cell unit 10 and the back-side sealant 41 caused by the flow of the sealants 31 and 41 in the third sealing process can be suppressed. In addition, if the cross-linking rate of the first inter-cell sealant 31 and the back-side sealant 41 exceeds 90%, the bonding strength between the first inter-cell sealant 31 and the second inter-cell sealant 32 is reduced in the third sealing process.

[0073] On the other hand, even when the materials of the second inter-cell sealant 32 and the light-receiving side sealant 42 are different from those of the first inter-cell sealant 31 and the back-side sealant 41 and the melting points of the second inter-cell sealant 32 and the light-receiving side sealant 42 are lower than the melting points of the first inter-cell sealant 31 and the back-side sealant 41, in the solar cell module 100, it is preferred that the cross-linked state of the second inter-cell sealant 32 and the light-receiving side sealant 42 is lower than the cross-linked state of the first inter-cell sealant 31 and the back-side sealant 41. In this case, for example, the melting points of the second inter-cell sealant 32 and the light-receiving side sealant 42 may be higher than the sealing temperature of the second sealing step and the third sealing step.

[0074] Furthermore, the second sealing step and the third sealing step described above may be performed simultaneously.

[0075] In addition, the crystalline silicon solar cell unit 10 may be a unit of a back electrode type (also called a back junction type or a back contact type). Thus, all wiring members can be arranged on the back side, and the flatness of the first inter-unit sealant 31 side is improved (because there is no unevenness from the wiring members), and the generation of bubbles on the first inter-unit sealant 31 side in the third sealing step can be suppressed.

[0076] As described above, according to the manufacturing method of the solar cell module 100 of the present embodiment, the sealing temperature of the second sealing process of sealing the perovskite solar cell and the sealing temperature of the third sealing process of sealing the perovskite solar cell and the crystalline silicon solar cell are lower than the sealing temperature of the first sealing process of sealing the crystalline silicon solar cell. Thus, when sealing the crystalline silicon solar cell and the perovskite solar cell, it is possible to suppress the damage of the perovskite solar cell due to heat, and to suppress the reduction in the output of the solar cell module.

[0077] As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, Various changes and deformation|transformation are possible.

[0078] Example

[0079] Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to the following examples.

[0080] (Example 1)

[0081] The solar cell module of the present embodiment was produced using the method for producing the solar cell module of the present embodiment as Example 1. Details of the solar cell module of Example 1 and the method for producing the same are as follows.

[0082] Material of back side protection member 51 and light receiving side protection member 52: Glass

[0083] Material of the first inter-cell seal 31 and the back-side seal 41: polyolefin resin, cross-linking rate 82%

[0084] Materials of the second inter-cell seal 32 and the light-receiving side seal 42: polyolefin resin, cross-linking rate 0%

[0085] Perovskite solar cell 20: formed on a film-like substrate

[0086] The temperature of the first sealing process: 160 degrees

[0087] Temperature of the second and third sealing steps: 100 degrees

[0088] (Example 2)

[0089] In the second embodiment, the solar cell module and the method for manufacturing the same according to the first embodiment are different in the following points.

[0090] Materials of the first inter-cell seal 31 and the back-side seal 41: polyolefin resin, cross-linking rate 70%

[0091] Materials of the second inter-cell seal 32 and the light-receiving side seal 42: polyolefin resin, cross-linking rate 9%

[0092] The temperature of the first sealing process: 150 degrees

[0093] Temperature of the second and third sealing steps: 120 degrees

[0094] (Comparative Example 1)

[0095] In Comparative Example 1, the solar cell module and the method for manufacturing the same of Example 1 are different in the following points.

[0096] Materials of the first inter-cell seal 31 and the back-side seal 41: polyolefin resin, cross-linking rate 86%

[0097] Materials of the second inter-cell seal 32 and the light-receiving side seal 42: polyolefin resin, cross-linking rate 74%

[0098] Temperature of the second and third sealing steps: 160 degrees

[0099] (Comparative Example 2)

[0100] In Comparative Example 2, the solar cell module and the method for manufacturing the same of Example 1 are different in the following points.

[0101] Materials of the first inter-cell seal 31 and the back-side seal 41: polyolefin resin, cross-linking rate 0%

[0102] Materials of the second inter-cell seal 32 and the light-receiving side seal 42: polyolefin resin, cross-linking rate 0%

[0103] Temperature of the first sealing process: 100 degrees

[0104] (evaluate)

[0105] In the solar cell modules of the embodiment and the comparative example, the presence or absence of undulation of the perovskite after sealing was confirmed by visual observation. In addition, in the solar cell modules of the embodiment and the comparative example, the presence or absence of poor appearance (sealant detachment) after sealing was confirmed by visual observation. The evaluation results are shown in Table 1.

[0106] [Table 1]

[0107]

[0108] As shown in Table 1, in Comparative Example 1, the second sealing temperature is high, and the cross-linking rate of the sealants 32 and 42 on the side of the perovskite solar cell unit is as high as 74%. Therefore, due to the curing shrinkage of the sealant caused by cross-linking, stress is generated from the sealant to the film-like substrate of the perovskite solar cell unit, resulting in undulation of the film-like substrate of the perovskite solar cell unit. In contrast, in Examples 1 and 2, the second sealing temperature is low, and the cross-linking rate of the sealants 32 and 42 on the side of the perovskite solar cell unit is as low as 0% or more and 50% or less. Therefore, the curing shrinkage of the sealants 32 and 42 caused by cross-linking is suppressed, the generation of stress from the sealants 32 and 42 to the film-like substrate of the perovskite solar cell unit is suppressed, and the generation of undulation of the film-like substrate of the perovskite solar cell unit is suppressed.

[0109] In Comparative Example 2, the first sealing temperature is low, so in the first sealing process, the sealant does not flow to the relatively large step portion at the wiring of the crystalline silicon solar cell, and the sealant falls off at the step portion, resulting in poor appearance after sealing. In contrast, in Examples 1 and 2, the first sealing temperature is high, so in the first sealing process, the sealant flows to the relatively large step portion at the wiring of the crystalline silicon solar cell, and the occurrence of sealant falling off is suppressed at the step portion, and the occurrence of poor appearance after sealing is suppressed.

[0110] In addition, in Examples 1 and 2, the crosslinking rates of the first inter-cell sealant 31 and the back-side sealant 41 are high, so it is considered that the sealants 31 and 41 do not flow after the first sealing step, and the peeling and sealant shedding between the crystalline silicon solar cell unit 10 and the first inter-cell sealant 31, or between the crystalline silicon solar cell unit 10 and the back-side sealant 41 are suppressed. In addition, in Examples 1 and 2, the crosslinking rates of the first inter-cell sealant 31 and the back-side sealant 41 are 90% or less, so it is considered that the bonding strength between the first inter-cell sealant 31 and the second inter-cell sealant 32 can be obtained in the third sealing step.

[0111] Description of Reference Numerals

[0112] 10…crystalline silicon solar cell unit; 20…perovskite solar cell unit; 31…first inter-unit seal; 32…second inter-unit seal; 41…back side seal; 42…light-receiving side seal; 51…back side protection component; 52…light-receiving side protection component; 61…glass plate; 62…peeling sheet; 100…solar cell module; 110…crystalline silicon solar cell unit seal; 120…perovskite solar cell unit seal.

Claims

1. A method for manufacturing a solar cell module, the solar cell module comprising a back side protection member, a back side sealant, a crystalline silicon solar cell, a first inter-cell sealant, a second inter-cell sealant, a perovskite solar cell, a light-receiving side sealant, and a light-receiving side protection member, The method for manufacturing the solar cell module is characterized by comprising: a first sealing step of stacking the back protection member, the back sealing member, the crystalline silicon solar cell unit, and the first inter-cell sealing member in sequence, and sealing the crystalline silicon solar cell unit to obtain a crystalline silicon solar cell unit sealed body; A second sealing step of stacking the light-receiving side protection member, the light-receiving side sealing member, the perovskite solar cell unit, and the second inter-unit sealing member in sequence, and sealing the perovskite solar cell unit to obtain a perovskite solar cell unit sealed body; as well as A third sealing step is to stack and seal the crystalline silicon solar cell sealed body and the perovskite solar cell sealed body in such a manner that the first inter-cell sealant is in contact with the second inter-cell sealant. The sealing temperature in the second sealing step and the third sealing step is lower than the sealing temperature in the first sealing step.

2. The method for manufacturing a solar cell module according to claim 1, wherein: The materials of the second inter-cell sealant and the light-receiving side sealant are different from the materials of the first inter-cell sealant and the back side sealant. The second inter-cell sealant and the light-receiving-side sealant have melting points lower than those of the first inter-cell sealant and the back-side sealant.

3. The method for manufacturing a solar cell module according to claim 1, wherein: The second inter-cell sealant and the light-receiving side sealant are made of the same material as the first inter-cell sealant and the back side sealant. The cross-linking state of the second inter-cell sealant and the light-receiving-side sealant is lower than the cross-linking state of the first inter-cell sealant and the back-side sealant.

4. The method for manufacturing a solar cell module according to claim 3, wherein: The crosslinking rate of the first inter-unit sealing material and the back-side sealing material is 60% or more and 90% or less, The cross-linking rate of the second inter-cell sealing material and the light-receiving-side sealing material is 0% or more and 50% or less.

5. The method for manufacturing a solar cell module according to claim 1, wherein: In the first sealing step, stacking the back protection member, the back sealant, the crystalline silicon solar cell, the first inter-cell sealant, a release sheet, and a glass plate in sequence, and sealing the crystalline silicon solar cell, The glass flat plate is peeled off by peeling off the release sheet, thereby obtaining the crystalline silicon-based solar cell sealed body.

6. The method for manufacturing a solar cell module according to claim 1, wherein: The crystalline silicon solar cell unit is a back electrode type solar cell unit.

7. A solar cell module manufactured by the method for manufacturing a solar cell module according to any one of claims 1, 2, 5, and 6, characterized in that: A back side protection member, a back side sealant, a crystalline silicon solar cell unit, a first inter-cell sealant, a second inter-cell sealant, a perovskite solar cell unit, a light-receiving side sealant, and a light-receiving side protection member are sequentially stacked. The second inter-cell sealant and the light-receiving-side sealant are made of materials different from those of the first inter-cell sealant and the back-side sealant.

8. A solar cell module manufactured by the method for manufacturing a solar cell module according to any one of claims 1 and 3 to 6, characterized in that: A back side protection member, a back side sealant, a crystalline silicon solar cell unit, a first inter-cell sealant, a second inter-cell sealant, a perovskite solar cell unit, a light-receiving side sealant, and a light-receiving side protection member are sequentially stacked. The second inter-cell sealant and the light-receiving side sealant are made of the same material as the first inter-cell sealant and the back side sealant. The cross-linking state of the second inter-cell sealant and the light-receiving-side sealant is lower than the cross-linking state of the first inter-cell sealant and the back-side sealant.

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