An accurate polishing device for a circuit board

Abstract

The present invention discloses an accurate grinding device for a circuit board, which relates to the field of side grinding of circuit boards. It includes a grinding workbench, and a positioning and grinding mechanism is arranged above the grinding workbench. The positioning and grinding mechanism includes a positioning frame, a rotating crossbeam, a positioning component and a grinding component. The rotating crossbeam is rotatably installed on the positioning frame, and the positioning component and the grinding component are respectively installed at both ends of the rotating crossbeam. The positioning component and the grinding component are symmetrically arranged about the axis of the main shaft. The positioning component includes a positioning turntable and a positioning slider. The positioning turntable is rotatably installed at the bottom of the rotating crossbeam, and the positioning slider is slidably arranged on the bottom surface of the positioning turntable. The positioning shaft is vertically installed at the bottom of the positioning slider. The grinding component includes a grinding turntable and a grinding slider. The grinding turntable is rotatably installed at the bottom of the rotating crossbeam, and the grinding slider is slidably arranged at the bottom of the grinding turntable. The grinding shaft is rotatably installed at the bottom of the grinding slider, which can accurately plan the grinding path and improve the grinding accuracy and efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of side grinding of circuit boards, and particularly to an accurate grinding device for circuit boards. Background Art

[0002] Electronic component assemblies include single-sided circuit boards, double-sided circuit boards, PCB boards, multi-layer printed circuit boards, printed circuit boards, etc. These electronic component assemblies are the core components of a controller and play an important role, that is, they can control the automatic operation of numerical control machine tools, cutting equipment, etc. Among them, the PCB board is usually called a circuit board. After the circuit board is initially cut and formed, due to the cutting process, burrs will be formed on the side of the circuit board. Therefore, after the circuit board is cut and formed, it needs to be edge-ground. By inputting the size path of the circuit board into the edge-grinder, the edge-grinder can move along the preset trajectory path to complete the edge-grinding operation of the circuit board. However, with the rapid development of integrated circuits, circuit boards show diversity and complexity to meet different environmental needs, resulting in circuit boards being cut into special-shaped shapes, that is, the shape of the circuit board is not a conventional rectangular parallelepiped shape, but is cut into a special-shaped shape according to the actual environment, making it difficult to detect the outer dimensions of the special-shaped circuit board to preset the grinding path of the edge-grinder. At the same time, the special-shaped circuit board requires more coordinates to be input for the trajectory path, and the operation is complex, resulting in the edge-grinder being difficult to follow the side of the special-shaped circuit board with high precision to complete the grinding operation, with poor grinding accuracy and low grinding efficiency. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide an accurate grinding device for circuit boards to solve the deficiencies of the prior art.

[0004] The object of the present invention is achieved by the following technical solutions: An accurate grinding device for a circuit board, comprising a grinding workbench, on which a tooling mechanism is arranged. The tooling mechanism includes a chassis and a pressing plate. A support shaft is coaxially fixed to the bottom of the chassis, and the support shaft is vertically fixed on the grinding workbench. The pressing plate is arranged above the chassis, and the circuit board is tooled between the chassis and the pressing plate. A positioning and grinding mechanism is arranged above the grinding workbench. The positioning and grinding mechanism includes a positioning frame, a rotating crossbeam, a positioning component, and a grinding component. A main shaft is fixed to the middle of the bottom surface of the rotating crossbeam, and the main shaft is rotatably installed on the positioning frame. Both the positioning frame and the pressing plate have the freedom to move axially along the support shaft. The two ends of the rotating crossbeam are respectively installed with the positioning component and the grinding component. The positioning component and the grinding component are symmetrically arranged about the axis of the main shaft. The positioning component includes a positioning turntable, a positioning slider, a positioning shaft, and a first distance measuring sensor. The positioning turntable is rotatably installed at the bottom of the rotating crossbeam. A positioning slider is arranged on the end face of the positioning turntable away from the rotating crossbeam. The positioning slider has the freedom to move radially along the positioning turntable. The positioning shaft is vertically installed at the bottom of the positioning slider. The first distance measuring sensor is used to measure the moving distance of the positioning slider. The grinding component includes a grinding turntable, a grinding slider, and a grinding shaft. The grinding turntable is rotatably installed at the bottom of the rotating crossbeam. A grinding slider is arranged on the end face of the grinding turntable away from the rotating crossbeam. The grinding slider has the freedom to move radially along the grinding turntable. The grinding shaft is rotatably installed at the bottom of the grinding slider. A positioning motor is installed at the top of the rotating crossbeam. A positioning main shaft is coaxially fixed to the top of the positioning turntable. The positioning main shaft is rotationally connected to the rotating crossbeam. The output shaft of the positioning motor is drivingly connected to the positioning main shaft. A positioning chute is axially opened along its own radial direction on the bottom surface of the positioning turntable. The positioning slider is slidably fitted in the positioning chute. A positioning spring is arranged in the positioning chute. The two ends of the positioning spring are respectively connected to the grinding slider and the positioning turntable. The positioning spring is located between the center of the positioning turntable and the grinding slider. The first distance measuring sensor is installed in the positioning chute. A horizontal cylinder is installed on the side wall of the positioning turntable. The telescopic shaft of the horizontal cylinder penetrates into the positioning chute movably.

[0005] Further, a driving shaft is coaxially fixed to the top of the grinding turntable. The driving shaft is rotationally connected to the rotating crossbeam. A grinding chute is axially opened along its own radial direction on the grinding turntable. The grinding chute penetrates axially through the grinding turntable. The grinding slider is slidably fitted in the grinding chute. A pushing cylinder is horizontally installed on the side wall of the grinding turntable. The telescopic shaft of the pushing cylinder penetrates into the grinding chute movably to connect the grinding slider. The initial position of the grinding shaft corresponds to the detection base point of the first distance measuring sensor.

[0006] Further, a first motor is arranged above the rotating crossbeam, an output shaft of the first motor is in transmission connection with the driving shaft, a second motor is installed on the grinding slider, and an output shaft of the second motor is in transmission connection with the grinding shaft.

[0007] Further, the positioning and grinding mechanism further includes a jacking cylinder, the jacking cylinder is vertically installed, a telescopic shaft of the jacking cylinder is connected to the positioning frame, a third motor is installed on the positioning frame, an output shaft of the third motor is connected with a driving gear, a driven gear is sleeved on the main shaft, and the driven gear meshes with the driving gear.

[0008] Further, a plurality of radial limiting mechanisms are arranged on the grinding workbench, the plurality of radial limiting mechanisms are evenly distributed along the circumferential direction of the support shaft, the radial limiting mechanism includes a radial limiting shaft which has a degree of freedom of moving along the radial direction of the support shaft, the radial limiting shaft is used for contacting the side wall of the circuit board for limiting, and the radial limiting shaft sequentially moves away from the side wall of the circuit board along the grinding path of the grinding shaft.

[0009] Further, the radial limiting mechanism further includes a radial cylinder and a radial sliding block, a limiting inner cavity is arranged in the grinding workbench, the radial sliding block is arranged in the limiting inner cavity, a cylinder body of the radial cylinder is horizontally installed on the side wall of the grinding workbench, a telescopic shaft of the radial cylinder penetrates into the limiting inner cavity and is connected to the radial sliding block, a radial groove communicating with the limiting inner cavity is formed in the top surface of the grinding workbench, each radial limiting mechanism is provided with one such radial groove, and the radial limiting shaft passes through the radial groove and is connected to the radial sliding block.

[0010] Further, the tooling mechanism further includes a pressing crossbeam and a rotating column, the rotating column is rotatably arranged on the grinding workbench, a rotation axis of the rotating column is coaxially arranged with an axis of the support shaft, one end of the pressing crossbeam is connected to the top of the rotating column through a lifting cylinder, a tooling pressing shaft is fixed to the bottom of the other end of the pressing crossbeam, a bearing is sleeved on the tooling pressing shaft, and a bearing groove is formed in the top of the pressing disc, and the bearing is assembled in the bearing groove.

[0011] Further, an annular groove is formed in the top surface of the grinding workbench, an axis of the annular groove is coaxially arranged with an axis of the support shaft, an external gear ring is rotatably assembled in the annular groove, the external gear ring meshes with a tooling driving gear, a fourth motor is arranged in the limiting inner cavity, and an output shaft of the fourth motor is in transmission connection with the tooling driving gear.

[0012] Further, a through hole is formed in the radial sliding block, the radial limiting shaft slidably passes through the through hole, a driving cylinder is vertically installed in the limiting inner cavity, a telescopic shaft of the driving cylinder is connected with a jacking support plate, the radial limiting shaft is supported by the jacking support plate, and an avoidance groove for the fourth motor to pass through is formed in the jacking support plate in a penetrating manner.

[0013] The beneficial effects of the present invention are as follows:

[0014] The rotating cross beam rotates to make the positioning assembly in the working position. The positioning slider drives the positioning shaft to move, so that the positioning shaft always contacts the side of the circuit board. The position of the positioning shaft is measured by the first distance measuring sensor, and then the positioning turntable drives the positioning shaft to rotate, so that the positioning shaft rotates around the side of the circuit board for one circle. During this process, the positioning shaft always contacts the side of the circuit board, and the distance of the positioning shaft is detected by the first distance measuring sensor in real time, so as to plan the contour dimension path of the circuit board. The rotating cross beam rotates to make the grinding assembly in the working position, and the grinding shaft moves along the contour dimension path of the circuit board to complete the grinding operation, so that the grinding path can be accurately planned, and the grinding accuracy and grinding efficiency are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of an accurate grinding device for a circuit board according to the present invention Figure 1 ;

[0016] Figure 2 is a schematic structural diagram of an accurate grinding device for a circuit board according to the present invention Figure 2 ;

[0017] Figure 3 is Figure 2 the enlarged view at A in

[0018] Figure 4 is a schematic structural diagram of an accurate grinding device for a circuit board according to the present invention Figure 3 ;

[0019] Figure 5 is a schematic internal structure diagram of a grinding workbench in an accurate grinding device for a circuit board according to the present invention;

[0020] In the figure, 1 - grinding workbench, 2 - chassis, 3 - lower pressing plate, 4 - support shaft, 5 - positioning frame, 6 - rotating crossbeam, 7 - main shaft, 8 - positioning turntable, 9 - positioning slider, 10 - positioning shaft, 11 - first distance measuring sensor, 12 - grinding turntable, 13 - grinding slider, 14 - grinding shaft, 15 - positioning motor, 16 - positioning main shaft, 17 - positioning chute, 18 - positioning spring, 19 - horizontal cylinder, 20 - drive shaft, 21 - grinding chute, 22 - pushing cylinder, 24 - first motor, 25 - lifting cylinder, 28 - second motor, 31 - jacking cylinder, 32 - third motor, 33 - driving gear, 34 - driven gear, 35 - radial limiting shaft, 36 - radial cylinder, 37 - radial sliding block, 38 - limiting inner cavity, 39 - radial groove, 40 - lower pressing crossbeam, 41 - rotating column, 42 - tooling lower pressing shaft, 43 - bearing, 44 - bearing groove, 45 - annular groove, 46 - external gear ring, 47 - tooling driving gear, 48 - through hole, 49 - driving cylinder, 50 - jacking support plate. Detailed implementation mode

[0021] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0022] Embodiment 1:

[0023] As Figures 1 to 5As shown in the figure, an accurate grinding device for a circuit board includes a grinding workbench 1. A tooling mechanism is arranged on the grinding workbench 1. The tooling mechanism includes a chassis 2 and a pressing plate 3. A support shaft 4 is coaxially fixed at the bottom of the chassis 2. The support shaft 4 is vertically fixed on the grinding workbench 1. The pressing plate 3 is arranged above the chassis 2. The circuit board is tooled between the chassis 2 and the pressing plate 3. A positioning and grinding mechanism is arranged above the grinding workbench 1. The positioning and grinding mechanism includes a positioning frame 5, a rotating crossbeam 6, a positioning component and a grinding component. A main shaft 7 is fixed in the middle of the bottom surface of the rotating crossbeam 6. The main shaft 7 is rotatably installed on the positioning frame 5. Both the positioning frame 5 and the pressing plate 3 have the freedom to move axially along the support shaft 4. Positioning components and grinding components are respectively installed at both ends of the rotating crossbeam 6. The positioning component and the grinding component are symmetrically arranged about the axis of the main shaft 7. The positioning component includes a positioning turntable 8, a positioning slider 9, a positioning shaft 10 and a first distance measuring sensor 11. The positioning turntable 8 is rotatably installed at the bottom of the rotating crossbeam 6. A positioning slider 9 is arranged on the end face of the positioning turntable 8 away from the rotating crossbeam 6. The positioning slider 9 has the freedom to move radially along the positioning turntable 8. The positioning shaft 10 is vertically installed at the bottom of the positioning slider 9. The first distance measuring sensor 11 is used to measure the moving distance of the positioning slider 9. The grinding component includes a grinding turntable 12, a grinding slider 13 and a grinding shaft 14. The grinding turntable 12 is rotatably installed at the bottom of the rotating crossbeam 6. A grinding slider 13 is arranged on the end face of the grinding turntable 12 away from the rotating crossbeam 6. The grinding slider 13 has the freedom to move radially along the grinding turntable 12. The grinding shaft 14 is rotatably installed at the bottom of the grinding slider 13. The circuit board is clamped and placed between the chassis 2 and the pressing plate 3 by a robotic arm. The pressing plate 3 has the freedom to move axially along the support shaft 4. After the circuit board is loaded between the chassis 2 and the pressing plate 3, the pressing plate 3 moves downward to contact the circuit board. The tooling of the circuit board is completed through the interaction between the chassis 2 and the pressing plate 3. The tooling position of the circuit board is located in the middle of the circuit board, making the side of the circuit board completely exposed. Then, the external dimensions of the special-shaped circuit board are detected first. The rotating crossbeam 6 deflects so that the positioning component is in the working position to measure the side position of the circuit board. The positioning frame 5 drives the positioning component to move downward so that the bottom surface height of the positioning shaft 10 is located below the circuit board. The positioning turntable 8 drives the positioning shaft 10 to rotate around the circuit board for one circle. During the rotation, the positioning slider 9 drives the positioning shaft 10 to move closer to the circuit board so that the positioning shaft 10 always contacts the side of the circuit board. The position information of the positioning slider 9 is measured in real time by the first distance measuring sensor 11. When the positioning turntable 8 rotates one circle, the side path coordinates of the circuit board can be measured. This path information is transmitted to the grinding component. Then, the rotating crossbeam 6 deflects so that the grinding component is in the working position. The initial position of the grinding shaft 14 is the same as the initial position of the positioning shaft 10. Then, the grinding slider 13 drives the grinding shaft 14 to move. The movement of the grinding slider 13 moves according to the feedback side path coordinates. The rotation speed of the grinding turntable 12 is the same as the rotation speed of the positioning turntable 8.Move the grinding shaft 14 around the side of the circuit board at the same speed for one circle. During this process, the grinding shaft 14 moves in real time, and the moving coordinates of the grinding shaft 14 are the same as the side path coordinates, so that the positioning component measures the side path coordinates of the circuit board, which is the grinding moving path of the grinding component. Furthermore, the grinding shaft 14 can continuously contact the side of the circuit board to complete the grinding operation. In the batch grinding of the same circuit board, only the side path coordinates of this type of circuit board need to be planned for the first time. For subsequent identical circuit boards, they can be directly ground by the grinding component moving according to the side path coordinates, completing the side grinding operation of the special-shaped circuit board, which has the advantages of high grinding accuracy and high grinding efficiency.

[0024] Furthermore, as Figure 1 , Figure 2 and Figure 4 shown, the positioning and grinding mechanism further includes a lifting cylinder 31. The lifting cylinder 31 is vertically installed, and the telescopic shaft of the lifting cylinder 31 is connected to the positioning frame 5. A third motor 32 is installed on the positioning frame 5. The output shaft of the third motor 32 is connected with a driving gear 33. A driven gear 34 is sleeved on the main shaft 7, and the driven gear 34 meshes with the driving gear 33. By the telescopic movement of the lifting cylinder 31, the positioning frame 5 moves up and down, and the positioning frame 5 drives the rotating crossbeam 6 to move up and down, so that it moves downward to the working position to measure the side path of the circuit board and perform the side grinding operation, and moves upward to facilitate the loading and unloading of the circuit board; the third motor 32 drives the main shaft 7 to rotate through the meshing of the driving gear 33 and the driven gear 34, and the main shaft 7 drives the rotating crossbeam 6 to rotate, completing the working position switching of the grinding component and the positioning component.

[0025] Embodiment 2:

[0026] On the basis of Embodiment 1, as Figures 1 to 4As shown in the figure, a positioning motor 15 is installed at the top of the rotating cross beam 6. A positioning main shaft 16 is coaxially fixed to the top of the positioning turntable 8. The positioning main shaft 16 is rotationally connected to the rotating cross beam 6. The output shaft of the positioning motor 15 is drivingly connected to the positioning main shaft 16. A positioning chute 17 is formed in the bottom surface of the positioning turntable 8 along its radial direction. A positioning slider 9 is slidably fitted in the positioning chute 17. A positioning spring 18 is arranged in the positioning chute 17. The two ends of the positioning spring 18 are respectively connected to the grinding slider 13 and the positioning turntable 8. The positioning spring 18 is located between the center of the positioning turntable 8 and the grinding slider 13. The first distance measuring sensor 11 is installed in the positioning chute 17. A horizontal air cylinder 19 is installed on the side wall of the positioning turntable 8. The telescopic shaft of the horizontal air cylinder 19 movably penetrates into the positioning chute 17. The telescopic shaft of the horizontal air cylinder 19 is not connected to the positioning slider 9. Initially, the horizontal air cylinder 19 extends to push the positioning slider 9 to move away from the first distance measuring sensor 11, that is, the positioning slider 9 stretches the positioning spring 18 to move away from the center of the circuit board, so that the positioning shaft 10 is located outside the side of the circuit board. Then, the positioning frame 5 moves downward so that the height of the circuit board is between the top surface and the bottom surface of the positioning shaft 10. The horizontal air cylinder 19 contracts, and the positioning slider 9 moves back under the reaction force of the positioning spring 18 following the contraction of the horizontal air cylinder 19, so that the positioning shaft 10 contacts the side of the circuit board. At this time, the positioning spring 18 is still in a stretched state. Then, the positioning motor 15 drives the positioning turntable 8 to move slowly through the positioning main shaft 16, so that the positioning shaft 10 rotates around the side of the circuit board for one circle. Under the reaction force of the positioning spring 18, the positioning shaft 10 can adaptively move following the shape of the side of the circuit board, and keep the state that the positioning shaft 10 always contacts the side of the circuit board. The position of the positioning slider 9 is measured in real time by the first distance measuring sensor 11, so as to reflect the position coordinates of the positioning shaft 10. According to this position coordinate, the side path coordinates of the circuit board can be planned, and the side path coordinates are used as the grinding movement path of the grinding shaft 14, so that the grinding shaft 14 can perform side grinding operation on the special-shaped circuit board.

[0027] Embodiment 3:

[0028] On the basis of Embodiment 2, as Figures 1 to 4As shown in the figure, a drive shaft 20 is coaxially fixed to the top of the grinding turntable 12. The drive shaft 20 is rotatably connected to the rotating cross beam 6. A grinding chute 21 is radially formed in the grinding turntable 12 along its own radial direction. The grinding chute 21 runs through the grinding turntable 12 axially. A grinding slider 13 is slidably fitted in the grinding chute 21. A pushing cylinder 22 is horizontally installed on the side wall of the grinding turntable 12. The telescopic shaft of the pushing cylinder 22 movably penetrates into the grinding chute 21 and is connected to the grinding slider 13. The initial position of the grinding shaft 14 corresponds to the detection base point of the first distance measuring sensor 11. The telescopic shaft of the pushing cylinder 22 is directly connected to the grinding slider 13. According to the side path coordinates of the circuit board, the pushing cylinder 22 drives the grinding slider 13 to move according to the side path coordinates, so that the grinding shaft 14 can always contact the side of the circuit board to complete the grinding operation, making the grinding accuracy of the special-shaped edge higher and enabling full-coverage grinding of the side of the circuit board; a first motor 24 is arranged above the rotating cross beam 6. The output shaft of the first motor 24 is drivingly connected to the drive shaft 20. A second motor 28 is installed on the grinding slider 13. The output shaft of the second motor 28 is drivingly connected to the grinding shaft 14. The first motor 24 drives the grinding turntable 12 to rotate through the drive shaft 20, so that the grinding shaft 14 can complete full-coverage grinding around the circuit board. The second motor 28 drives the grinding shaft 14 to rotate to achieve the grinding operation.

[0029] Embodiment 4:

[0030] The cooperation between the chassis 2 and the lower pressing plate 3 has a strong limiting effect in the vertical direction of the circuit board, but the limiting strength in the horizontal direction is not high. Since the circuit board is subjected to grinding operations, the grinding will generate large vibrations, which will cause the circuit board to shift horizontally, resulting in uneven grinding of the side of the circuit board and affecting the grinding accuracy. Therefore, on the basis of Embodiment 3, as Figures 1 to 5As shown in the figure, a plurality of radial limiting mechanisms are arranged on the grinding workbench 1. The plurality of radial limiting mechanisms are evenly distributed along the circumferential direction of the support shaft 4. The radial limiting mechanism includes a radial limiting shaft 35. The radial limiting shaft 35 has a degree of freedom to move radially along the support shaft 4. The radial limiting shaft 35 is used to contact the side wall of the circuit board for limiting. The radial limiting shaft 35 sequentially moves away from the side wall of the circuit board along the grinding path of the grinding shaft 14. The radial limiting mechanism further includes a radial cylinder 36 and a radial sliding block 37. A limiting inner cavity 38 is arranged inside the grinding workbench 1. The radial sliding block 37 is arranged inside the limiting inner cavity 38. The cylinder body of the radial cylinder 36 is horizontally installed on the side wall of the grinding workbench 1. The telescopic shaft of the radial cylinder 36 penetrates into the limiting inner cavity 38 and is connected to the radial sliding block 37. A radial groove 39 communicating with the limiting inner cavity 38 is opened on the top surface of the grinding workbench 1. Each radial limiting mechanism is provided with a radial groove 39. The radial limiting shaft 35 passes through the radial groove 39 and is connected to the radial sliding block 37. At least four radial limiting mechanisms are provided. The radial cylinder 36 is used to move the radial sliding block 37 close to the circuit board, so that the radial limiting shaft 35 contacts the side edge of the circuit board. The horizontal movement degree of freedom of the circuit board is restricted by a plurality of radial limiting shafts 35. When the grinding shaft 14 is performing a grinding operation, when the grinding shaft 14 approaches the radial limiting shaft 35, the radial limiting shaft 35 moves away from the circuit board, so that the radial limiting shaft 35 avoids the grinding shaft 14. The circuit board is limited by other radial limiting shafts 35. Since the grinding shaft 14 also contacts the circuit board for grinding, the grinding shaft 14 replaces the radial limiting shaft 35 that has been avoided to limit the circuit board. When the circuit board passes through the radial limiting shaft 35, the radial limiting shaft 35 moves to re-contact the side wall of the circuit board. In this way, while not affecting the limiting effect of the circuit board, it will not interfere with the grinding assembly.

[0031] Embodiment Five:

[0032] On the basis of Embodiment Four, as Figure 1 and Figure 5As shown in the figure, the tooling mechanism further includes a downward pressing cross beam 40 and a rotating column 41. The rotating column 41 is rotatably arranged on the grinding workbench 1. The rotation axis of the rotating column 41 is coaxially arranged with the axis of the support shaft 4. One end of the downward pressing cross beam 40 is connected to the top of the rotating column 41 through a lifting cylinder 25. A tooling downward pressing shaft 42 is fixed to the bottom of the other end of the downward pressing cross beam 40. A bearing 43 is sleeved on the tooling downward pressing shaft 42. A bearing groove 44 is formed in the top of the downward pressing plate 3. The bearing 43 is assembled in the bearing groove 44. An annular groove 45 is formed in the top surface of the grinding workbench 1. The axis of the annular groove 45 is coaxially arranged with the axis of the support shaft 4. An external gear ring 46 is rotatably assembled in the annular groove 45. The external gear ring 46 meshes with a tooling driving gear 47. A fourth motor is arranged in the limit inner cavity 38. The output shaft of the fourth motor is drivingly connected to the tooling driving gear 47. By driving the downward pressing cross beam 40 to move along the axial direction of the support shaft 4 through the lifting cylinder 25, when the circuit board is loaded, the downward pressing cross beam 40 drives the downward pressing plate 3 to move upward, so as to leave a space required for the robot to load the circuit board between the downward pressing plate 3 and the chassis 2. After the circuit board is placed on the chassis 2, the lifting cylinder 25 drives the downward pressing plate 3 to move close to the chassis 2, and the tooling of the circuit board is completed through the cooperation of the chassis 2 and the downward pressing plate 3. Since the side wall of the circuit board needs to be completely exposed, the tooling mechanism of the downward pressing plate 3 is provided. However, since the downward pressing plate 3 needs to be driven by the downward pressing cross beam 40, interference will occur between the positioning assembly and the downward pressing cross beam 40 when measuring the side path coordinates of the circuit board and when the grinding shaft 14 performs grinding operations along the grinding path. Therefore, a rotational degree of freedom is provided for the downward pressing cross beam 40. The fourth motor drives the tooling driving gear 47 to rotate. The tooling driving gear 47 drives the rotating column 41 to rotate through the external gear ring 46. The rotating column 41 drives the downward pressing cross beam 40 to rotate. The rotation directions of the positioning turntable 8 and the grinding turntable 12 are the same as the rotation direction of the downward pressing cross beam 40, so that the downward pressing cross beam 40 can avoid the grinding shaft 14 and the positioning shaft 10. Since the downward pressing plate 3 cannot rotate together with the downward pressing cross beam 40, otherwise the circuit board will be worn. Therefore, the downward pressing cross beam 40 and the downward pressing plate 3 are connected through the bearing 43, so that there is a rotational degree of freedom between the downward pressing plate 3 and the downward pressing cross beam 40, and the downward pressing plate 3 does not rotate together with the downward pressing cross beam 40, thus not damaging the circuit board.

[0033] Embodiment Six:

[0034] Due to the setting of the external gear ring 46, the radial limiting shaft 35 will be affected by the external gear ring 46 when moving. Therefore, on the basis of Embodiment Five, as Figure 1 and Figure 5As shown, a through hole 48 is formed through the radial sliding block 37, and the radial limiting shaft 35 slides through the through hole 48. A driving cylinder 49 is vertically installed in the limiting inner cavity 38. The telescopic shaft of the driving cylinder 49 is connected with a jacking support plate 50. The radial limiting shaft 35 is supported by the jacking support plate 50. An avoidance groove for the fourth motor to pass through is formed through the jacking support plate 50. When the radial limiting shaft 35 approaches the external gear ring 46, the driving cylinder 49 drives the jacking support plate 50 to move downward, so that the radial limiting shaft 35 moves downward under its own gravity, and the radial limiting shaft 35 moves into the limiting inner cavity 38, that is, the radial limiting shaft 35 is located below the external gear ring 46, so that the radial limiting shaft 35 can smoothly pass through the external gear ring 46. After the radial limiting shaft 35 passes through the external gear ring 46, the driving cylinder 49 drives the jacking support plate 50 to move upward, so that the jacking support plate 50 jacks up the radial limiting shaft 35, and the radial limiting shaft 35 penetrates out of the radial groove 39, so that the radial limiting shaft 35 contacts the side of the circuit board to complete the limiting, so that the radial limiting shaft 35 can move avoiding the external gear ring 46, avoiding interference.

Claims

1. An accurate polishing device for a circuit board, characterized in that, It includes a grinding workbench (1), on which a tooling mechanism is arranged. The tooling mechanism includes a chassis (2) and a lower pressing plate (3). A support shaft (4) is coaxially fixed to the bottom of the chassis (2), and the support shaft (4) is vertically fixed on the grinding workbench (1). The lower pressing plate (3) is arranged above the chassis (2). The circuit board is tooled between the chassis (2) and the lower pressing plate (3). A positioning and grinding mechanism is arranged above the grinding workbench (1). The positioning and grinding mechanism includes a positioning frame (5), a rotating crossbeam (6), a positioning component, and a grinding component. A main shaft (7) is fixed to the middle of the bottom surface of the rotating crossbeam (6), and the main shaft (7) is rotatably installed on the positioning frame (5). Both the positioning frame (5) and the lower pressing plate (3) have the freedom of moving axially along the support shaft (4). The positioning component and the grinding component are respectively installed at both ends of the rotating crossbeam (6). The positioning component and the grinding component are symmetrically arranged about the axis of the main shaft (7). The positioning component includes a positioning turntable (8), a positioning slider (9), a positioning shaft (10), and a first distance measuring sensor (11). The positioning turntable (8) is rotatably installed at the bottom of the rotating crossbeam (6). The positioning slider (9) is arranged on the end face of the positioning turntable (8) away from the rotating crossbeam (6). The positioning slider (9) has the freedom of moving radially along the positioning turntable (8). The positioning shaft (10) is vertically installed at the bottom of the positioning slider (9). The first distance measuring sensor (11) is used to measure the moving distance of the positioning slider (9). The grinding component includes a grinding turntable (12), a grinding slider (13), and a grinding shaft (14). The grinding turntable (12) is rotatably installed at the bottom of the rotating crossbeam (6). The grinding slider (13) is arranged on the end face of the grinding turntable (12) away from the rotating crossbeam (6). The grinding slider (13) has the freedom of moving radially along the grinding turntable (12). The grinding shaft (14) is rotatably installed at the bottom of the grinding slider (13); A positioning motor (15) is installed at the top of the rotating crossbeam (6). A positioning main shaft (16) is coaxially fixed to the top of the positioning turntable (8). The positioning main shaft (16) is rotatably connected to the rotating crossbeam (6). The output shaft of the positioning motor (15) is drivingly connected to the positioning main shaft (16). A positioning chute (17) is formed in the bottom surface of the positioning turntable (8) along its radial direction. The positioning slider (9) is slidably fitted in the positioning chute (17). A positioning spring (18) is arranged in the positioning chute (17). Two ends of the positioning spring (18) are respectively connected to the grinding slider (13) and the positioning turntable (8). The positioning spring (18) is located between the center of the positioning turntable (8) and the grinding slider (13). The first distance measuring sensor (11) is installed in the positioning chute (17). A horizontal cylinder (19) is installed on the side wall of the positioning turntable (8). The telescopic shaft of the horizontal cylinder (19) movably penetrates into the positioning chute (17).

2. The precise grinding device for a circuit board according to claim 1, characterized in that, A driving shaft (20) is coaxially fixed to the top of the grinding turntable (12). The driving shaft (20) is rotatably connected to the rotating crossbeam (6). A grinding chute (21) is formed in the grinding turntable (12) along its radial direction. The grinding chute (21) penetrates through the grinding turntable (12) along its axial direction. The grinding slider (13) is slidably fitted in the grinding chute (21). A pushing cylinder (22) is horizontally installed on the side wall of the grinding turntable (12). The telescopic shaft of the pushing cylinder (22) movably penetrates into the grinding chute (21) and is connected to the grinding slider (13). The initial position of the grinding shaft (14) corresponds to the detection base point of the first distance measuring sensor (11).

3. The precise grinding device for a circuit board according to claim 2, characterized in that, A first motor (24) is arranged above the rotating crossbeam (6). The output shaft of the first motor (24) is drivingly connected to the driving shaft (20). A second motor (28) is installed on the grinding slider (13). The output shaft of the second motor (28) is drivingly connected to the grinding shaft (14).

4. The precise grinding device for a circuit board according to claim 1, wherein, The positioning and grinding mechanism further includes a jacking cylinder (31). The jacking cylinder (31) is vertically installed. The telescopic shaft of the jacking cylinder (31) is connected to the positioning frame (5). A third motor (32) is installed on the positioning frame (5). The output shaft of the third motor (32) is connected to a driving gear (33). A driven gear (34) is sleeved on the main shaft (7). The driven gear (34) meshes with the driving gear (33).

5. The precise grinding device for a circuit board according to claim 1, characterized in that, A plurality of radial limiting mechanisms are arranged on the grinding workbench (1). The plurality of radial limiting mechanisms are evenly distributed along the circumferential direction of the support shaft (4). The radial limiting mechanism includes a radial limiting shaft (35). The radial limiting shaft (35) has a degree of freedom to move radially along the support shaft (4). The radial limiting shaft (35) is used to contact the side wall of the circuit board for limiting. The radial limiting shaft (35) sequentially moves away from the side wall of the circuit board along the grinding path of the grinding shaft (14).

6. The precise grinding device for a circuit board according to claim 5, characterized in that, The radial limiting mechanism further includes a radial cylinder (36) and a radial sliding block (37). A limiting inner cavity (38) is provided in the grinding workbench (1). The radial sliding block (37) is arranged in the limiting inner cavity (38). The cylinder body of the radial cylinder (36) is horizontally installed on the side wall of the grinding workbench (1). The telescopic shaft of the radial cylinder (36) penetrates into the limiting inner cavity (38) to connect the radial sliding block (37). A radial groove (39) communicating with the limiting inner cavity (38) is opened on the top surface of the grinding workbench (1). Each radial limiting mechanism is provided with one such radial groove (39). The radial limiting shaft (35) passes through the radial groove (39) to connect the radial sliding block (37).

7. The precise grinding device for a circuit board according to claim 6, characterized in that, The tooling mechanism further includes a downward pressing cross beam (40) and a rotating column (41). The rotating column (41) is rotatably arranged on the grinding workbench (1). The rotation axis of the rotating column (41) is coaxially arranged with the axis of the support shaft (4). One end of the downward pressing cross beam (40) is connected to the top of the rotating column (41) through a lifting cylinder (25). A tooling downward pressing shaft (42) is fixed to the bottom of the other end of the downward pressing cross beam (40). A bearing (43) is sleeved on the tooling downward pressing shaft (42). A bearing groove (44) is opened on the top of the downward pressing plate (3). The bearing (43) is assembled in the bearing groove (44).

8. The precise grinding device for a circuit board according to claim 7, characterized in that, A circular groove (45) is opened on the top surface of the grinding workbench (1). The axis of the circular groove (45) is coaxially arranged with the axis of the support shaft (4). An external gear ring (46) is rotatably assembled in the circular groove (45). The external gear ring (46) meshes with a tooling driving gear (47). A fourth motor is arranged in the limiting inner cavity (38). The output shaft of the fourth motor is drivingly connected to the tooling driving gear (47).

9. The precise grinding device for a circuit board according to claim 8, characterized in that, The radial sliding block (37) is provided with a through hole (48) penetrating therethrough. The radial limiting shaft (35) slidably passes through the through hole (48). A driving cylinder (49) is vertically installed in the limiting inner cavity (38). The telescopic shaft of the driving cylinder (49) is connected to a jacking support plate (50). The radial limiting shaft (35) is supported by the jacking support plate (50). An avoidance groove for the fourth motor to pass through is penetrated through the jacking support plate (50).

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