Preparation method of composite abrasive polishing disc for diamond laser processing

Abstract

The invention discloses a preparation method of a composite abrasive polishing disk for diamond laser processing, which is characterized by comprising the following steps: mixing diamond micro-powder, aluminum oxide and silicon carbide, and adding a binding agent; carrying out ball milling and stirring on the mixed raw materials; carrying out drying treatment and compression molding on the mixed raw materials subjected to ball milling and stirring; and sintering and post-processing the formed blank. The method has the beneficial effects that the removal rate of the diamond material is remarkably increased, meanwhile, the surface roughness is reduced, and the machining quality is improved; high cutting force and wear resistance are achieved, the service life is effectively prolonged, the replacement frequency is reduced, and the machining stability is improved; the mechanical strength and the stability are excellent, and the use reliability is improved; the grinding material is ensured to be uniformly distributed, local excessive wear is avoided, the processing consistency is improved, and the processing defects caused by non-uniform polishing are reduced; and the manufacturing cost is reduced while the product quality is guaranteed, so that the method has remarkable economic advantages in large-scale production, and the market competitiveness is improved.

Description

Technical Field

[0001] The invention relates to a polishing disc and a preparation method thereof, in particular to a preparation method of a composite abrasive polishing disc for diamond laser processing. Background Art

[0002] Diamond materials are widely used in optics, semiconductors, precision manufacturing and other fields due to their extremely high hardness, wear resistance and thermal stability. However, the processing of diamond materials is difficult. Traditional mechanical polishing methods have problems such as low efficiency, thick damage layer, and low material removal rate, which makes it difficult to meet the needs of high-precision and high-efficiency processing. In recent years, the introduction of laser processing technology has improved the processing accuracy of diamond materials, but since the surface of the material is prone to thermal damage under the action of laser, subsequent polishing becomes a key link.

[0003] The polishing discs commonly used in the market usually use a single abrasive, such as single crystal diamond or cerium oxide. However, such single abrasive polishing discs have defects such as unstable removal rate, poor wear resistance, and short service life during processing, which makes it difficult to meet the needs of efficient and high-quality polishing of diamond materials. In addition, the traditional polishing disc preparation method is complicated and costly, and cannot be mass-produced, which limits its wide application in industry.

[0004] In view of the above problems, the present invention provides a new type of composite abrasive polishing disc and its preparation method, which improves polishing efficiency, stability and service life by optimizing abrasive combination and distribution. The composite abrasive of the present invention is composed of diamond micropowder, aluminum oxide, silicon carbide and a binder, and adopts compression molding and optimized sintering process to make the polishing disc have excellent wear resistance, stable material removal rate and long service life. Through this technology, the processing quality of diamond materials can be effectively improved, the cost can be reduced, and its further application in the field of high-end manufacturing can be promoted. Summary of the invention

[0005] The technical problem to be solved by the present invention is to address the deficiencies in the above-mentioned prior art and to propose a method for preparing a composite abrasive polishing disc for diamond laser processing.

[0006] In order to solve the above problems, the present invention provides a method for preparing a composite abrasive polishing disc for diamond laser processing, comprising:

[0007] Diamond micro powder, aluminum oxide and silicon carbide are mixed, and a binder is added to obtain a mixed raw material;

[0008] The mixed raw materials are ball-milled and stirred;

[0009] The mixed raw materials after ball milling and stirring are dried and molded to obtain a molded blank;

[0010] The formed blank is sintered and post-processed to obtain a composite abrasive polishing disc.

[0011] The diamond powder, aluminum oxide and silicon carbide are mixed, and a binder is added to obtain a mixed raw material:

[0012] The particle size range of diamond micropowder is 0.5-5 μm, and the particle size range of aluminum oxide and silicon carbide is 1-10 μm.

[0013] The diamond powder, aluminum oxide and silicon carbide are mixed, and a binder is added to obtain a mixed raw material:

[0014] The mass percentage of diamond powder ranges from 10% to 30%, the mass percentage of aluminum oxide ranges from 20% to 40%, the mass percentage of silicon carbide ranges from 20% to 40%, and the mass percentage of binder ranges from 10% to 20%.

[0015] The binder is a resin-based material or a metal-based material. The resin-based material includes one or more of phenolic resin and epoxy resin, and the metal-based material includes one or more of copper, nickel and cobalt.

[0016] The process of drying and molding the mixed raw materials after ball milling to obtain a molded blank comprises:

[0017] The compression molding is performed at a pressure of 20 to 50 MPa.

[0018] The method of sintering and post-processing the formed blank to obtain a composite abrasive polishing disc comprises:

[0019] Sintering is carried out in the range of 850-1100°C and the sintering time is 1-3 hours to ensure stable bonding of the abrasive and optimized microstructure.

[0020] Also includes:

[0021] The porosity of the composite abrasive polishing disc is controlled between 5% and 15% to ensure uniform distribution of the abrasive and stable processing performance;

[0022] Also includes:

[0023] The thickness of the composite abrasive polishing disc is set between 3 and 10 mm to ensure appropriate mechanical strength and service life.

[0024] Also includes:

[0025] The hardness range of the composite abrasive polishing disc is controlled between 70 and 90 HRB to ensure good wear resistance and polishing effect.

[0026] The mixed raw materials are subjected to ball milling and stirring:

[0027] The ball mill stirring time ranges from 2 to 6 hours to ensure uniform dispersion of the abrasive.

[0028] The beneficial effects of the present invention are:

[0029] By optimizing the selection and ratio of composite abrasives, efficient and uniform polishing effects can be achieved, significantly improving the removal rate of diamond materials, while reducing surface roughness and improving processing quality.

[0030] The combination of diamond powder, aluminum oxide and silicon carbide makes the polishing disc have both high cutting force and wear resistance, effectively extending the service life, reducing the replacement frequency and improving processing stability.

[0031] The binder is made of resin-based or metal-based materials, and by optimizing the sintering process, the polishing disc has excellent mechanical strength and stability under high temperature and high pressure environment, thereby improving its reliability in use.

[0032] By optimizing the forming process, we can ensure that the abrasive is evenly distributed, avoid local excessive wear, improve processing consistency, and reduce processing defects caused by uneven polishing.

[0033] The preparation method adopts efficient mixing and sintering processes, which reduces manufacturing costs while ensuring product quality, so that the present invention has significant economic advantages in large-scale production and improves market competitiveness. DETAILED DESCRIPTION

[0034] In order to clearly explain the purpose, technical solutions and advantages of the embodiments of the present invention, this section will provide a detailed and complete explanation of the technical solutions of the embodiments of the present invention. Obviously, the embodiments described here are only some examples of the present invention, not all. Based on the embodiments disclosed in the present invention, all other embodiments that can be obtained by those skilled in the art without creative work should be regarded as the scope covered by the present invention.

[0035] The present invention provides a method for preparing a composite abrasive polishing disc for diamond laser processing, comprising steps S1-S4:

[0036] S1. Diamond powder, aluminum oxide and silicon carbide are mixed, and a binder is added to obtain a mixed raw material; the particle size of the diamond powder is in the range of 0.5 to 5 μm, and the particle size of aluminum oxide and silicon carbide are both in the range of 1 to 10 μm. The mass percentage of the diamond powder is in the range of 10% to 30%, the mass percentage of aluminum oxide is in the range of 20% to 40%, the mass percentage of silicon carbide is in the range of 20% to 40%, and the mass percentage of the binder is in the range of 10% to 20%. The binder is a resin-based material or a metal-based material, the resin-based material includes one or more of phenolic resin and epoxy resin, and the metal-based material includes one or more of copper, nickel and cobalt.

[0037] In this embodiment, the raw materials of the composite abrasive polishing disc include diamond powder, aluminum oxide, silicon carbide and a binder. The particle size of the diamond powder is 0.5 to 5 μm, and the particle size of aluminum oxide and silicon carbide is 1 to 10 μm. The mass fraction of the diamond powder is 10% to 30%, the mass fraction of aluminum oxide is 20% to 40%, the mass fraction of silicon carbide is 20% to 40%, and the mass fraction of the binder is 10% to 20%. The binder is a resin-based or metal-based material, the resin-based material includes one or more of phenolic resin and epoxy resin, and the metal-based material includes one or more of copper, nickel or cobalt.

[0038] S2. The mixed raw materials are subjected to ball mill stirring; the ball mill stirring time ranges from 2 to 6 hours to ensure uniform dispersion of the abrasive.

[0039] S3, drying and compression molding the mixed raw materials after ball milling to obtain a molded blank; step S3 includes step S31:

[0040] S31. Compression molding is performed at a pressure of 20 to 50 MPa.

[0041] In this embodiment, the polishing disc is formed by a compression molding process at a pressure of 20 to 50 MPa.

[0042] S4, sintering and post-processing the formed blank to obtain a composite abrasive polishing disc. Step S4 includes step S41:

[0043] S41, sintering in the range of 850-1100℃, sintering time is 1-3h to ensure stable bonding of abrasive and optimized microstructure.

[0044] In this embodiment, the sintering is performed at a temperature ranging from 850 to 1100° C. The sintering time is 1 to 3 hours to ensure stable bonding of the abrasive and an optimized microstructure.

[0045] Preferably, the method for preparing a composite abrasive polishing disc for diamond laser processing provided by the present invention comprises steps S5-S7:

[0046] S5. Control the porosity of the composite abrasive polishing disc between 5% and 15% to ensure uniform distribution of the abrasive and stable processing performance;

[0047] S6. Set the thickness of the composite abrasive polishing disc to between 3 and 10 mm to ensure appropriate mechanical strength and service life.

[0048] S7. Control the hardness range of the composite abrasive polishing disc between 70 and 90 HRB to ensure good wear resistance and polishing effect.

[0049] Thus, the wear resistance of the composite abrasive polishing disc prepared by the method for preparing the composite abrasive polishing disc for diamond laser processing is improved by 20% to 40%, and the surface roughness can be reduced by 30% to 35%. At the same time, the service life of the composite abrasive polishing disc is extended by 40% to 50% compared with the existing polishing disc.

[0050] The preparation method of the composite abrasive polishing disc for diamond laser processing provides the following specific embodiments:

[0051] Embodiment 1:

[0052] Diamond powder (particle size 2 μm), alumina (particle size 6 μm) and silicon carbide (particle size 8 μm) were selected as composite abrasives, mixed at a mass ratio of 40:30:30, and a resin-based binder (accounting for 15% of the total mass) was added. First, diamond powder, alumina and silicon carbide were placed in a ball mill and stirred at a speed of 250 rpm for 6 hours to ensure that the abrasives were evenly dispersed and fully mixed. Subsequently, the mixed material was dried and dried at 120 ° C for 6 hours to remove moisture and volatile impurities and improve the subsequent molding quality. The dried mixture was pressed into a polishing disc blank with a diameter of 200 mm and a thickness of 10 mm at a pressure of 30 MPa through a compression molding process. The formed blank was placed in a high-temperature furnace and sintered at 900 ° C. After keeping warm for 2 hours, it was cooled to room temperature with the furnace to finally obtain a densified composite abrasive polishing disc.

[0053] In order to evaluate the performance of the polishing disc prepared in this embodiment, diamond sheet was selected as the processing object, and a polishing test was performed at a speed of 3000rpm using a standard polishing equipment. The experimental results show that the material removal rate of the polishing disc reaches 1.8μm / min, which is 38% higher than that of the traditional single abrasive polishing disc (1.3μm / min). At the same time, the surface roughness Ra value of the polished diamond sheet is 5.2nm, which is 35% lower than the Ra value of 8.0nm of the traditional polishing disc, and the surface finish is significantly improved. In addition, under the same working conditions, the service life of this polishing disc reaches 120h, while the service life of the traditional polishing disc is only 85h, and the service life is extended by 41%. The results show that the composite abrasive polishing disc of the present invention has higher processing efficiency, better surface quality and longer service life, and is suitable for the processing requirements of high-precision diamond materials.

[0054] Embodiment 2:

[0055] Diamond powder (particle size 3μm), aluminum oxide (particle size 5μm) and silicon carbide (particle size 7μm) were selected as composite abrasives, mixed at a mass ratio of 35:35:30, and a metal-based binder (accounting for 20% of the total mass) was added. First, diamond powder, aluminum oxide and silicon carbide were placed in a high-speed stirrer and stirred at 500rpm for 4h to uniformly mix the abrasives and disperse them in the binder. The mixed material was cold pressed and pressed into a polishing disc blank with a diameter of 250mm and a thickness of 12mm at a pressure of 50MPa. Subsequently, the blank was placed in a sintering furnace, sintered at 1050℃ for 3h, and slowly cooled to room temperature with the furnace to improve the bonding strength and structural stability of the material.

[0056] The polishing disc prepared in this embodiment is used for precision polishing of semiconductor material silicon wafers, and is tested using a standard polishing machine at a speed of 3500rpm and a pressure of 20N. Experimental data show that the material removal rate of the polishing disc is 2.1μm / min, which is 40% higher than that of the traditional resin-based polishing disc (1.5μm / min). The surface roughness Ra value of the polished silicon wafer is 4.8nm, which is 32% lower than the Ra value of 7.1nm of the traditional polishing disc, and the surface quality is greatly improved. In addition, the polishing disc still maintains a high processing stability after continuous use for 150h, while the traditional polishing disc is severely worn after 100h and cannot be used further, and the life span is extended by 50%. This embodiment shows that the composite abrasive polishing disc of the present invention has excellent wear resistance, processing stability and long life characteristics under high-load polishing environment, and is suitable for the precision manufacturing field of high-end semiconductor materials and optical components.

[0057] The above two embodiments have the following performance improvements compared to the prior art:

[0058]

[0059]

[0060] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing a composite abrasive polishing disc for diamond laser processing, characterized in that: include: Diamond micro powder, aluminum oxide and silicon carbide are mixed, and a binder is added to obtain a mixed raw material; The mixed raw materials are ball-milled and stirred; The mixed raw materials after ball milling and stirring are dried and molded to obtain a molded blank; The formed blank is sintered and post-processed to obtain a composite abrasive polishing disc.

2. The preparation method according to claim 1, characterized in that: The diamond powder, aluminum oxide and silicon carbide are mixed, and a binder is added to obtain a mixed raw material: The particle size range of diamond micropowder is 0.5-5 μm, and the particle size range of aluminum oxide and silicon carbide is 1-10 μm.

3. The preparation method according to claim 1, characterized in that: The diamond powder, aluminum oxide and silicon carbide are mixed, and a binder is added to obtain a mixed raw material: The mass percentage of diamond powder ranges from 10% to 30%, the mass percentage of aluminum oxide ranges from 20% to 40%, the mass percentage of silicon carbide ranges from 20% to 40%, and the mass percentage of binder ranges from 10% to 20%.

4. The preparation method according to claim 1 or 2, characterized in that: The binder is a resin-based material or a metal-based material. The resin-based material includes one or more of phenolic resin and epoxy resin, and the metal-based material includes one or more of copper, nickel and cobalt.

5. The preparation method according to claim 1, characterized in that: The process of drying and molding the mixed raw materials after ball milling to obtain a molded blank comprises: The compression molding is performed at a pressure of 20 to 50 MPa.

6. The preparation method according to claim 5, characterized in that: The method of sintering and post-processing the formed blank to obtain a composite abrasive polishing disc comprises: Sintering is carried out in the range of 850-1100°C and the sintering time is 1-3 hours to ensure stable bonding of the abrasive and optimized microstructure.

7. The preparation method according to claim 1, characterized in that: Also includes: The porosity of the composite abrasive polishing disc is controlled between 5% and 15% to ensure uniform distribution of the abrasive and stable processing performance.

8. The preparation method according to claim 1, characterized in that: Also includes: The thickness of the composite abrasive polishing disc is set between 3 and 10 mm to ensure appropriate mechanical strength and service life.

9. The preparation method according to claim 1, characterized in that: Also includes: The hardness range of the composite abrasive polishing disc is controlled between 70 and 90 HRB to ensure good wear resistance and polishing effect.

10. The preparation method according to claim 1, characterized in that: The mixed raw materials are subjected to ball milling and stirring: The ball mill stirring time ranges from 2 to 6 hours to ensure uniform dispersion of the abrasive.

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