Epoxy resin adhesive, preparation method and application of epoxy resin adhesive in manufacturing EPS foam-aluminum plate composite die

Abstract

The invention discloses an epoxy resin adhesive, a preparation method and application of the epoxy resin adhesive in manufacturing of an EPS (Expandable Polystyrene) foam-aluminum plate composite die. The EPS foam-aluminum plate composite die is formed by adhering an aluminum plate reinforcing plate to a parting surface of a drawing part of an EPS foam die by adopting the epoxy resin adhesive. The composite die is mainly designed for the special structure of the jaw plate of the jaw crusher, the composite die can meet the requirements for rapid die making, the overall strength of the die and repeated use of the die, meanwhile, an aluminum plate is easy to cut and form, the surface is smooth, the drawing resistance is small, and the problems that an existing EPS die can only be used once, damage to a cavity is large during drawing, and the surface of the cavity is rough can be solved.

Description

Technical Field

[0001] The invention belongs to the technical field of special structural design of jaw plates of jaw crushers, and specifically relates to an epoxy resin adhesive, a preparation method and application thereof in manufacturing EPS foam-aluminum plate composite molds. Background Art

[0002] Regarding the special structural design of the jaw plate, a key component of the jaw crusher, the research background and technological development at home and abroad present the characteristics of both challenges and opportunities. As an indispensable equipment in the mining, construction and material recycling industries, the jaw crusher, its core component, the jaw plate, bears the heavy responsibility of material crushing. Its performance is directly related to the crushing efficiency, durability and maintenance cost of the whole machine. The shape of the jaw plate is complex and changeable, and it often needs to be customized according to different crushing requirements and material characteristics, which puts extremely high demands on mold manufacturing technology.

[0003] In the existing technical system, EPS (expanded polystyrene) molds were once widely used in the initial molding stage of jaw plates because of their light weight, easy molding and relatively low cost. However, faced with the complex and delicate special structural design of the jaw plate of the jaw crusher, the limitations of EPS molds gradually emerged. The most prominent problem is that the durability of the mold is seriously insufficient, and it often needs to be scrapped after only one use. This is mainly because the structural strength of the EPS material drops significantly after being heated and foamed, and it is difficult to withstand the mechanical stress during demolding, which causes the mold to deform or even break during the demolding process, seriously limiting production efficiency and increasing costs.

[0004] In addition, damage to the cavity during demolding is also a major problem. Due to the brittleness of the EPS material and the particularity of the mold structure, it is often necessary to apply a large external force to the mold during demolding, which not only aggravates the damage to the mold, but also often leads to scratches, dents and other defects on the surface of the cavity, seriously affecting the surface quality and dimensional accuracy of subsequent castings or forgings. The increase in the roughness of the cavity surface means that more machining and surface treatment are required in the future, which not only increases production costs, but may also affect the final performance and service life of the jaw plate. Summary of the invention

[0005] In view of the above problems, the present invention provides an epoxy resin adhesive, a preparation method and its application in manufacturing EPS foam-aluminum plate composite molds, so as to solve the problems that the existing EPS molds can only be used once, cause great damage to the cavity during demolding, and have a rough cavity surface.

[0006] In order to achieve the above technical objectives, the present invention adopts the following technical solutions:

[0007] A method for preparing an epoxy resin adhesive comprises the following steps:

[0008] (1) adding 65-75 parts by weight of bisphenol A epoxy vinyl ester resin, 4-6 parts by weight of polymethacrylamide, 3-5 parts by weight of montmorillonite powder, and 15-25 parts by weight of water into a reaction kettle, and stirring with a stirrer to prepare a mixture;

[0009] (2) adding 14-18 parts of dipropylene glycol methyl ether and stirring at 200-300 r / min for 4-6 min to mix the components evenly;

[0010] (3) After the kettle temperature reaches a certain value, stop heating and stirring, evacuate until no bubbles are released, and detect the solid content;

[0011] (4) Add 1.6-2.3 parts of curing agent and stir rapidly at 1000-1500 r / min for 2-3 minutes to evenly disperse it with the base liquid;

[0012] (5) Add 1.4-2.1 parts of penetrant pentaerythritol tetraglycidyl ether, stir at 200-250 r / min for 23-28 min, and heat to a certain value to fully dissolve the penetrant and curing agent;

[0013] (6) stirring rapidly at 1200-1600 r / min, and then adding 10-16 parts of bisphenol A epoxy vinyl ester resin and stirring to reduce the viscosity of the bisphenol A epoxy vinyl ester resin;

[0014] (7) stirring and cooling, and packaging into vacuum tanks using sealed bags to obtain epoxy resin adhesive.

[0015] Preferably, the stirring condition in step (1) is: stirring at 200-300 r / min for 10-15 min.

[0016] Preferably, in step (3), the kettle temperature reaches a certain value of 55-58°C.

[0017] Preferably, the vacuuming time in step (3) is 20-24 min.

[0018] Preferably, the temperature in step (5) is raised to a certain value of 78-82°C.

[0019] Preferably, the stirring condition for adding the bisphenol A epoxy vinyl ester resin in step (6) is 300-400 r / min for 1-1.5 h.

[0020] Preferably, in step (7), the mixture is stirred and cooled to below 38°C.

[0021] The present invention also provides an application of an epoxy resin adhesive in manufacturing an EPS foam-aluminum plate composite mold. The EPS foam-aluminum plate composite mold is composited by pasting an aluminum plate reinforcement plate on a parting surface of a demolding portion of an EPS foam mold using an epoxy resin adhesive.

[0022] Preferably, the thickness of the aluminum plate reinforcement plate is 1-2 mm.

[0023] Compared with the prior art, the present invention has the following technical advantages:

[0024] (1) Compared with the traditional technologies widely used in the current market, the present invention demonstrates significant technical superiority, which is mainly reflected in a series of special and careful structural designs for the jaw plate of the jaw crusher. This innovative design not only deepens our understanding of the performance optimization of crusher components, but also effectively improves the practicality and durability of the equipment. Specifically, the structure of the composite mold in the present invention is a highlight. It uses EPS (expanded polystyrene) foam board and aluminum plate as core materials, and they are firmly bonded together by the high-performance epoxy resin adhesive of the present invention. This unique combination method not only ensures that the mold can be made quickly and efficiently, meeting the urgent needs of modern industry for production efficiency, but also greatly extends the service life of the mold while ensuring the overall structural strength of the mold.

[0025] (2) The epoxy resin adhesive innovatively prepared by the present invention exhibits excellent viscosity performance, and its viscosity value reaches above 1361.2 mPa·s, which is better than the viscosity of the Asia-Pacific foam adhesive in the prior art and can meet the application requirements of EPS foam-aluminum plate composite molds.

[0026] (3) The aluminum plate used in the present invention has good ductility and easy processing properties, making the mold cutting and molding process extremely simple and quick, greatly shortening the mold production cycle. More importantly, the aluminum plate has a smooth surface, which is particularly important during the use of the mold because it significantly reduces the resistance during demolding, thereby effectively avoiding damage to the mold cavity caused by demolding difficulties. In contrast, traditional EPS molds are often damaged after one use because they cannot withstand the pressure during the demolding process, and their cavity surfaces are rough, which seriously affects the molding quality and appearance of the product.

[0027] (4) The EPS foam-aluminum plate composite mold of the present invention can still maintain good dimensional stability and precision after repeated use, which not only solves the limitation of one-time use of EPS molds, but also significantly reduces production costs by improving the durability and reusability of the molds, injecting new vitality into the sustainable development of enterprises.

[0028] In summary, the present invention, through a special structural design for the jaw plate of the jaw crusher, adopts an innovative composite mold of EPS foam board and aluminum plate combined with epoxy resin adhesive, which not only meets the needs of rapid molding, but also shows excellent technical advantages in terms of the overall strength of the mold, multiple use performance and demolding resistance, etc., and provides an effective solution to the problems existing in traditional molds. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Schematic diagram of the end parting composite plate.

[0030] Figure 2 Schematic diagram of the bottom plane parting plate.

[0031] Figure 3 Schematic diagram of a typical jaw crusher jaw plate model.

[0032] Figure 4 Schematic diagram of the EPS foam-aluminum plate composite model.

[0033] Figure 5 This is the EPS foam-aluminum plate composite mold prepared in Example 3. DETAILED DESCRIPTION

[0034] In order to facilitate a better understanding of the present invention, the following examples are used to illustrate the present invention. These examples belong to the protection scope of the present invention, but do not limit the protection scope of the present invention.

[0035] In an embodiment of the present invention, a method for preparing an epoxy resin adhesive comprises the following steps:

[0036] (1) adding 65-75 parts of bisphenol A epoxy vinyl ester resin, 4-6 parts of polymethacrylamide, 3-5 parts of montmorillonite powder, and 15-25 parts of water in a reaction kettle, starting a stirrer, and stirring at 200-300 r / min for 10-15 minutes to prepare a mixture;

[0037] (2) adding 14-18 parts of dipropylene glycol methyl ether and stirring at 200-300 r / min for 4-6 min to mix the components evenly;

[0038] (3) When the kettle temperature reaches 55-58°C, stop heating and stirring, evacuate for 20-24 minutes until no bubbles are released, and detect the solid content;

[0039] (4) Add 1.6-2.3 parts of curing agent and stir rapidly at 1000-1500 r / min for 2-3 minutes to evenly disperse it with the base liquid;

[0040] (5) Add 1.4-2.1 parts of penetrant pentaerythritol tetraglycidyl ether, stir at 200-250 r / min for 23-28 min, and heat to 78-82° C. to fully dissolve the penetrant and curing agent;

[0041] (6) stirring rapidly at 1200-1600 r / min, then adding 10-16 parts of bisphenol A epoxy vinyl ester resin, and stirring at 300-400 r / min for 1-1.5 hours to reduce the viscosity of the bisphenol A epoxy vinyl ester resin;

[0042] (7) stirring and cooling the mixture to below 38° C., and packaging the mixture into vacuum containers using sealed bags to obtain an epoxy resin adhesive.

[0043] The preparation method of the curing agent comprises the following steps:

[0044] S1. Add epichlorohydrin and water to a reaction kettle, stir at 200-300 r / min, heat to 42-45° C., add methanol dropwise, stir at 300-400 r / min, add potassium hydroxide solution dropwise, adjust the pH value of the reaction solution to 9.2-9.8, heat to 103-110° C., and reflux for 4.5-5.5 h; and cool to obtain an epoxy resin solution;

[0045] S2. Add ricinoleic acid dropwise to the epoxy resin solution obtained in step S1, stir at 300-600 r / min for 25-45 min, adjust the pH value of the reaction solution to 2.5-3, raise the temperature to 63-67° C., and reflux for 3.5-4.2 h; remove water and methanol by reduced pressure distillation, raise the temperature to 125-130° C., add hydrogen peroxide solution, and stir well for 4.6-5.3 h to obtain a curing agent; the molar ratio of epichlorohydrin, methanol, water, potassium hydroxide, ricinoleic acid, and hydrogen peroxide is 2:2:6.3:1.3:1:2.1.

[0046] An EPS foam-aluminum plate composite mold is composited by pasting an aluminum plate reinforcement plate with a thickness of 1-2 mm on a parting surface of a demoulding part of an EPS foam mold by using an epoxy resin adhesive.

[0047] Technical principle of the present invention:

[0048] (I) Preparation technology principle of curing agent

[0049] The preparation method of the curing agent of the present invention is a delicate and systematic process, which aims to synthesize a curing agent with excellent performance by accurately controlling the reaction conditions and the raw material ratio. The following is an introduction to the preparation technology principle of the curing agent.

[0050] 1. Raw material function and dosage control

[0051] (1) Epichlorohydrin: As one of the main reactants, epichlorohydrin provides the basic skeleton of epoxy resin and is the basis for forming the curing agent structure. Its dosage directly affects the crosslinking density and mechanical properties of the final curing agent. Strictly controlling the molar ratio of epichlorohydrin (here 2) is crucial to ensure the performance stability and reliability of the curing agent.

[0052] (2) Methanol: Methanol, as a solvent, helps the reactants to mix evenly and the reaction to proceed smoothly. At the same time, it can also participate in the partial hydrolysis reaction and adjust the hydrophilicity of the system. The amount of methanol (molar ratio of 2) needs to be precisely controlled. Too much methanol will cause the reaction system to be too diluted, affecting the reaction efficiency; too little methanol may cause the reactants to mix unevenly, affecting the product quality.

[0053] (3) Water: Water, as a reaction medium, promotes the dissolution of potassium hydroxide and the progress of the reaction. An appropriate amount of water (molar ratio of 6.3) helps to form a stable reaction environment, but too much water will increase the difficulty of subsequent processing and affect the purity of the product.

[0054] (4) Potassium hydroxide: As an alkaline catalyst, potassium hydroxide (molar ratio of 1.3) can accelerate the ring-opening reaction of epichlorohydrin and promote the formation of epoxy resin. Its dosage directly affects the reaction rate and the structure of the product and is a key factor in controlling the reaction process.

[0055] (5) Ricinoleic acid: As a fatty acid containing unsaturated double bonds, the introduction of ricinoleic acid (molar ratio of 1) not only improves the flexibility of the curing agent, but also enhances its adhesion to certain substrates. Its dosage needs to be precisely controlled to balance the hardness and toughness of the curing agent.

[0056] (6) Hydrogen peroxide: As an oxidant, hydrogen peroxide (molar ratio of 2.1) participates in the cross-linking reaction in the later stage of the reaction and promotes the formation of the curing agent network structure. Its dosage directly affects the cross-linking degree and heat resistance of the curing agent.

[0057] 2. Step sequence and process parameter optimization

[0058] In step S1: First, add epichlorohydrin and water to the reactor, and mix the reactants thoroughly by stirring (200-300r / min) and heating (to 42-45°C). Then, add methanol dropwise, increase the stirring speed (to 300-400r / min) to ensure uniform mixing, and then add potassium hydroxide solution dropwise to adjust the pH value to 9.2-9.8 to create suitable reaction conditions. Heat to 103-110°C and reflux for 4.5-5.5h to fully form the epoxy resin. The order of this step cannot be changed, because each step lays the foundation for the next step of the reaction.

[0059] In step S2: add ricinoleic acid to the epoxy resin solution obtained in step S1, and continue stirring (300-600r / min) to ensure uniform dispersion. Adjust the pH value to 2.5-3 to change the reaction environment and prepare for the subsequent cross-linking reaction. Heat to 63-67°C for reflux reaction for 3.5-4.2h to allow ricinoleic acid to react chemically with the epoxy resin. Remove water and methanol by vacuum distillation to reduce impurities and improve product purity. Finally, heat to 125-130°C, add hydrogen peroxide solution, stir thoroughly for 4.6-5.3h to complete the cross-linking reaction and form a curing agent. This step also follows a strict order, and each step has a direct impact on the performance of the final product.

[0060] 3. Necessity and technical effect of optimizing process parameters

[0061] Optimizing process parameters (such as temperature, stirring speed, reaction time, pH value, etc.) is crucial to improving the performance of curing agents. By precisely controlling these parameters, the efficient reaction can be ensured, the generation of by-products can be reduced, and the purity and stability of the product can be improved. In addition, the optimized process parameters can also significantly improve the crosslinking density, heat resistance, flexibility and adhesion of the curing agent, making it perform better in various application scenarios. The realization of these technical effects not only improves the market competitiveness of the product, but also provides strong support for technological innovation in the field of curing agents.

[0062] (II) Preparation technology principle of epoxy resin adhesive

[0063] The preparation method of the high-performance epoxy resin adhesive of the present invention has a preparation process that is not only rigorous but also full of scientific wisdom, and each step is carefully designed to ensure the excellent performance of the final product.

[0064] 1. Initial stage of raw material mixing

[0065] First, slowly add 65-75 parts of bisphenol A epoxy vinyl ester resin in the reactor in parts by weight. This resin is known for its good adhesion, chemical corrosion resistance and mechanical strength, and is the basic skeleton of the adhesive. Subsequently, add 4-6 parts of polymethacrylamide as a modifier, which can effectively improve the flexibility and impact resistance of the resin system, while promoting the reaction rate of the resin and the curing agent. 3-5 parts of montmorillonite powder are used as fillers, which can not only reduce costs, but also enhance the heat resistance and flame retardancy of the product. Finally, add 15-25 parts of water as a solvent to help the components mix better and adjust the viscosity of the system. Turn on the agitator and stir at a speed of 200-300r / min for 10-15min to ensure that all ingredients are initially mixed evenly. In this step, precise control of the amount of raw materials is crucial, which directly affects the efficiency of subsequent reactions and the final performance of the product.

[0066] 2. Solvent addition and homogenization

[0067] Next, add 14-18 parts of dipropylene glycol methyl ether to the system to further promote the dissolution and dispersion of each component and adjust the fluidity of the system. Continue stirring for 4-6 minutes at the same speed to fully blend the newly added solvent with the mixed materials to ensure the uniformity of the system. The precise control of this step ensures the smooth progress of the curing reaction in the subsequent steps.

[0068] 3. Vacuum degassing and solid content detection

[0069] When the kettle temperature reaches 55-58℃, stop heating and stirring, and immediately perform vacuum treatment for 20-24 minutes. The purpose of this step is to remove bubbles in the system to avoid pores in the product after curing, which will affect the strength and appearance. Strict control of temperature and time at this stage is the key to ensuring product quality.

[0070] 4. Addition of curing agent and rapid dispersion

[0071] Then, add 1.6-2.3 parts of curing agent, which is the key to trigger the cross-linking reaction of epoxy resin. Stir quickly at a high speed of 1000-1500r / min for 2-3 minutes to ensure that the curing agent is quickly and evenly dispersed in the base liquid, laying a solid foundation for the subsequent curing process. The amount of curing agent must be accurate. Too much will cause the system to cure too quickly and be difficult to operate; too little will cause incomplete curing and affect performance.

[0072] 5. Penetrant addition and dissolution

[0073] Next, add 1.4-2.1 parts of penetrant pentaerythritol tetraglycidyl ether, which is a substance that can effectively improve the permeability and wettability of the resin system, and is essential for enhancing the bonding between the adhesive and the substrate. Stir at a low speed of 200-250r / min for 23-28min, and gradually increase the temperature to 78-82℃ to fully dissolve the penetrant and curing agent to ensure the uniformity and stability of the system. In this step, the optimization of temperature and time is the key, which directly affects the effect of the penetrant.

[0074] 6. Viscosity adjustment and final mixing

[0075] Then, stir quickly at a high speed of 1200-1600r / min, and then add 10-16 parts of bisphenol A epoxy vinyl ester resin to adjust the viscosity of the system again to make it easier to operate in subsequent applications. Stir at a speed of 300-400r / min for 1-1.5h. This process not only reduces the viscosity of the resin, but also promotes further reactions between the components and improves the overall performance of the product.

[0076] 7. Cooling, packaging and finished products

[0077] Finally, the mixture is stirred and cooled to below 38°C, and the product is packaged into vacuum tanks using sealed bags, which not only maintains the purity of the product but also facilitates long-term storage and transportation. At this point, the epoxy resin adhesive is ready.

[0078] Importance of optimizing process parameters and non-interchangeable steps:

[0079] During the entire preparation process, each step is closely linked and the order cannot be changed at will. For example, if the curing agent is added first and then the solvent is adjusted, it may cause the curing agent to react prematurely, affecting the uniformity and final performance of the system. In addition, the optimization of process parameters, such as stirring speed, temperature and time, are all based on a large amount of experimental data and theoretical analysis to obtain the best values. Any slight change may have a significant impact on the performance of the product. It is precisely these fine adjustments that enable the preparation method to achieve unexpected technical effects and obtain higher viscosity, thereby meeting more diverse application needs.

[0080] In order to make the disclosure of the present invention more complete, it is described below through more specific embodiments.

[0081] Example 1

[0082] A method for preparing an epoxy resin adhesive comprises the following steps:

[0083] (1) In a reaction kettle, 66 parts by weight of bisphenol A epoxy vinyl ester resin, 4 parts of polymethacrylamide, 3 parts of montmorillonite powder, and 17 parts of water were added, and the agitator was turned on and stirred at 200 r / min for 15 minutes to prepare a mixture;

[0084] (2) adding 14.2 parts of dipropylene glycol methyl ether and stirring at 200 r / min for 6 min to mix the components evenly;

[0085] (3) When the kettle temperature reaches 55°C, stop heating and stirring, evacuate for 24 min until no bubbles are released, and measure the solid content;

[0086] (4) Add 1.6 parts of curing agent and stir rapidly at 1000 r / min for 3 minutes to make it evenly dispersed with the base liquid;

[0087] (5) Add 1.5 parts of penetrant pentaerythritol tetraglycidyl ether, stir at 200 r / min for 28 min, and heat to 78° C. to fully dissolve the penetrant and curing agent;

[0088] (6) stirring rapidly at 1200 r / min, then adding 10.5 parts of bisphenol A epoxy vinyl ester resin, and stirring at 300 r / min for 1.5 h to reduce the viscosity of the bisphenol A epoxy vinyl ester resin;

[0089] (7) stirring and cooling to 38° C., and packaging into vacuum tanks using sealed bags to obtain an epoxy resin adhesive.

[0090] The preparation method of the curing agent comprises the following steps:

[0091] S1. Add epichlorohydrin and water into a reaction kettle, stir at 200 r / min, heat to 43° C., add methanol dropwise, stir at 300 r / min, add potassium hydroxide solution dropwise, adjust the pH value of the reaction solution to 9.2, heat to 103° C., and reflux for 5.5 h; and cool to obtain an epoxy resin solution;

[0092] S2. Add ricinoleic acid dropwise to the epoxy resin solution obtained in step S1, stir at 300 r / min for 45 min, adjust the pH value of the reaction solution to 2.6, raise the temperature to 63° C., and reflux for 4.2 h; remove water and methanol by reduced pressure distillation, raise the temperature to 125° C., add hydrogen peroxide solution, and stir well for 5.3 h to obtain a curing agent; the molar ratio of epichlorohydrin, methanol, water, potassium hydroxide, ricinoleic acid, and hydrogen peroxide is 2:2:6.3:1.3:1:2.1.

[0093] An EPS foam-aluminum plate composite mold is composited by pasting an aluminum plate reinforcement plate with a thickness of 2 mm on a parting surface of a demoulding portion of an EPS foam mold by using an epoxy resin adhesive.

[0094] The main technical points and production process of the EPS foam-aluminum plate composite mold are as follows:

[0095] (1) The thickness of the aluminum plate is 2mm, which is easy to cut and shape;

[0096] (2) Aluminum plates are mainly used on the main force-bearing surfaces and demolding surfaces of the mold parting, such as the ribs on the back of the jaw plate and the surrounding sides. Non-main force-bearing surfaces such as the tooth surface and the groove surface on the back of the jaw plate are not used;

[0097] (3) First determine the composite surface of the composite mold, then lay it out on the aluminum plate, and then cut it directly using scissors or other tools;

[0098] (4) After the composite surface of the composite mold is determined, the EPS foam mold is processed and formed, and the thickness difference of the aluminum plate should be reserved on the composite surface to be composited;

[0099] (5) preparing the epoxy resin adhesive of Example 1 for later use;

[0100] (6) Epoxy resin adhesive is evenly applied to one side of the composite aluminum plate, fitted with the foam mold, and evenly pressed and maintained until it is bonded.

[0101] Example 2

[0102] A method for preparing an epoxy resin adhesive comprises the following steps:

[0103] (1) In a reaction kettle, 68 parts by weight of bisphenol A epoxy vinyl ester resin, 4.5 parts of polymethacrylamide, 3.2 parts of montmorillonite powder, and 17 parts of water were added, and the agitator was turned on and stirred at 200 r / min for 14 minutes to prepare a mixture;

[0104] (2) adding 15 parts of dipropylene glycol methyl ether and stirring at 200 r / min for 6 min to mix the components evenly;

[0105] (3) When the kettle temperature reaches 55°C, stop heating and stirring, evacuate for 23 min until no bubbles are released, and detect the solid content;

[0106] (4) Add 1.7 parts of curing agent and stir rapidly at 1000 r / min for 3 min to make it evenly dispersed with the base liquid;

[0107] (5) Add 1.5 parts of penetrant pentaerythritol tetraglycidyl ether, stir at 200 r / min for 28 min, and heat to 79° C. to fully dissolve the penetrant and curing agent;

[0108] (6) stirring rapidly at 1300 r / min, then adding 11 parts of bisphenol A epoxy vinyl ester resin, and stirring at 300 r / min for 1.5 h to reduce the viscosity of the bisphenol A epoxy vinyl ester resin;

[0109] (7) stirring and cooling to 38° C., and packaging into vacuum tanks using sealed bags to obtain an epoxy resin adhesive.

[0110] The preparation method of the curing agent comprises the following steps:

[0111] S1. Add epichlorohydrin and water into a reaction kettle, stir at 200 r / min, heat to 45° C., drop methanol, stir at 300 r / min, drop potassium hydroxide solution, adjust the pH value of the reaction solution to 9.3, heat to 104° C., and reflux for 5.4 h; cool to obtain an epoxy resin solution;

[0112] S2. Add ricinoleic acid dropwise to the epoxy resin solution obtained in step S1, stir at 400 r / min for 38 min, adjust the pH value of the reaction solution to 2.7, raise the temperature to 64° C., and reflux for 4 h; remove water and methanol by reduced pressure distillation, raise the temperature to 126° C., add hydrogen peroxide solution, and stir sufficiently for 4.8 h to obtain a curing agent; the molar ratio of epichlorohydrin, methanol, water, potassium hydroxide, ricinoleic acid, and hydrogen peroxide is 2:2:6.3:1.3:1:2.1.

[0113] An EPS foam-aluminum plate composite mold is composited by pasting an aluminum plate reinforcement plate with a thickness of 2 mm on a parting surface of a demoulding portion of an EPS foam mold by using an epoxy resin adhesive.

[0114] The main technical points and production process of the EPS foam-aluminum plate composite mold are as follows:

[0115] (1) The thickness of the aluminum plate is 2mm, which is easy to cut and shape;

[0116] (2) Aluminum plates are mainly used on the main force-bearing surfaces and demolding surfaces of the mold parting, such as the ribs on the back of the jaw plate and the surrounding sides. Non-main force-bearing surfaces such as the tooth surface and the groove surface on the back of the jaw plate are not used;

[0117] (3) First determine the composite surface of the composite mold, then lay it out on the aluminum plate, and then cut it directly using scissors or other tools;

[0118] (4) After the composite surface of the composite mold is determined, the EPS foam mold is processed and formed, and the thickness difference of the aluminum plate should be reserved on the composite surface to be composited;

[0119] (5) preparing the epoxy resin adhesive of Example 2 for later use;

[0120] (6) Epoxy resin adhesive is evenly applied to one side of the composite aluminum plate, fitted with the foam mold, and evenly pressed and maintained until it is bonded.

[0121] Example 3

[0122] A method for preparing an epoxy resin adhesive comprises the following steps:

[0123] (1) In a reaction kettle, 72 parts by weight of bisphenol A epoxy vinyl ester resin, 5.2 parts of polymethacrylamide, 4 parts of montmorillonite powder, and 21 parts of water were added, and a stirrer was turned on and stirred at 250 r / min for 13 min to prepare a mixture;

[0124] (2) adding 16 parts of dipropylene glycol methyl ether and stirring at 300 r / min for 4 min to mix the components evenly;

[0125] (3) When the kettle temperature reaches 57°C, stop heating and stirring, evacuate for 22 min until no bubbles are released, and measure the solid content;

[0126] (4) Add 2 parts of curing agent and stir rapidly at 1300 r / min for 3 minutes to make it evenly dispersed with the base liquid;

[0127] (5) Add 1.8 parts of penetrant pentaerythritol tetraglycidyl ether, stir at 250 r / min for 24 min, and heat to 80° C. to fully dissolve the penetrant and curing agent;

[0128] (6) stirring rapidly at 1500 r / min, then adding 13 parts of bisphenol A epoxy vinyl ester resin, and stirring at 400 r / min for 1.1 h to reduce the viscosity of the bisphenol A epoxy vinyl ester resin;

[0129] (7) stirring and cooling to 37° C., and packaging into vacuum tanks using sealed bags to obtain an epoxy resin adhesive.

[0130] The preparation method of the curing agent comprises the following steps:

[0131] S1. Add epichlorohydrin and water into a reaction kettle, stir at 250 r / min, heat to 44° C., drop methanol, stir at 400 r / min, drop potassium hydroxide solution, adjust the pH value of the reaction solution to 9.5, heat to 108° C., and reflux for 5 hours; cool to obtain an epoxy resin solution;

[0132] S2. Add ricinoleic acid dropwise to the epoxy resin solution obtained in step S1, stir at 500 r / min for 32 min, adjust the pH value of the reaction solution to 2.8, raise the temperature to 65° C., and reflux for 4 h; remove water and methanol by reduced pressure distillation, raise the temperature to 127° C., add hydrogen peroxide solution, and stir well for 5 h to obtain a curing agent; the molar ratio of epichlorohydrin, methanol, water, potassium hydroxide, ricinoleic acid, and hydrogen peroxide is 2:2:6.3:1.3:1:2.1.

[0133] An EPS foam-aluminum plate composite mold is composited by pasting a 2mm thick aluminum plate reinforcement plate on the parting surface of the EPS foam mold with an epoxy resin adhesive. Figure 1-5 .

[0134] The main technical points and production process of the EPS foam-aluminum plate composite mold are as follows:

[0135] (1) The thickness of the aluminum plate is 2mm, which is easy to cut and shape;

[0136] (2) Aluminum plates are mainly used on the main force-bearing surfaces and demolding surfaces of the mold parting, such as the ribs on the back of the jaw plate and the surrounding sides. Non-main force-bearing surfaces such as the tooth surface and the groove surface on the back of the jaw plate are not used;

[0137] (3) First determine the composite surface of the composite mold, then lay it out on the aluminum plate, and then cut it directly using scissors or other tools;

[0138] (4) After the composite surface of the composite mold is determined, the EPS foam mold is processed and formed, and the thickness difference of the aluminum plate should be reserved on the composite surface to be composited;

[0139] (5) preparing the epoxy resin adhesive of Example 3 for later use;

[0140] (6) Epoxy resin adhesive is evenly applied to one side of the composite aluminum plate, fitted with the foam mold, and evenly pressed and maintained until it is bonded.

[0141] Example 4

[0142] A method for preparing an epoxy resin adhesive comprises the following steps:

[0143] (1) In a reaction kettle, 73 parts by weight of bisphenol A epoxy vinyl ester resin, 5.4 parts of polymethacrylamide, 4.5 parts of montmorillonite powder, and 22 parts of water were added, and the agitator was turned on and stirred at 200 r / min for 15 minutes to prepare a mixture;

[0144] (2) adding 17 parts of dipropylene glycol methyl ether and stirring at 300 r / min for 4 min to mix the components evenly;

[0145] (3) When the kettle temperature reaches 55°C, stop heating and stirring, evacuate for 24 min until no bubbles are released, and measure the solid content;

[0146] (4) Add 2.1 parts of curing agent and stir rapidly at 1200 r / min for 3 min to ensure that it is evenly dispersed with the base liquid;

[0147] (5) Add 1.9 parts of penetrant pentaerythritol tetraglycidyl ether, stir at 250 r / min for 23 min, and heat to 79° C. to fully dissolve the penetrant and curing agent;

[0148] (6) stirring rapidly at 1200 r / min, then adding 14.3 parts of bisphenol A epoxy vinyl ester resin, and stirring at 300 r / min for 1.5 h to reduce the viscosity of the bisphenol A epoxy vinyl ester resin;

[0149] (7) stirring and cooling to 38° C., and packaging into vacuum tanks using sealed bags to obtain an epoxy resin adhesive.

[0150] The preparation method of the curing agent comprises the following steps:

[0151] S1. Add epichlorohydrin and water to a reaction kettle, stir at 200 r / min, heat to 45° C., drop methanol, stir at 300 r / min, drop potassium hydroxide solution, adjust the pH value of the reaction solution to 9.4, heat to 105° C., and reflux for 4.8 hours; cool to obtain an epoxy resin solution;

[0152] S2. Add ricinoleic acid dropwise to the epoxy resin solution obtained in step S1, stir at 300 r / min for 45 min, adjust the pH value of the reaction solution to 2.5, raise the temperature to 63° C., and reflux for 4.2 h; remove water and methanol by reduced pressure distillation, raise the temperature to 127° C., add hydrogen peroxide solution, and stir well for 5 h to obtain a curing agent; the molar ratio of epichlorohydrin, methanol, water, potassium hydroxide, ricinoleic acid, and hydrogen peroxide is 2:2:6.3:1.3:1:2.1.

[0153] An EPS foam-aluminum plate composite mold is composited by pasting an aluminum plate reinforcement plate with a thickness of 1.8 mm on a parting surface of a demoulding portion of an EPS foam mold by using an epoxy resin adhesive.

[0154] The main technical points and production process of the EPS foam-aluminum plate composite mold are as follows:

[0155] (1) The thickness of the aluminum plate is 1.8 mm, which is easy to cut and shape;

[0156] (2) Aluminum plates are mainly used on the main force-bearing surfaces and demolding surfaces of the mold parting, such as the ribs on the back of the jaw plate and the surrounding sides. Non-main force-bearing surfaces such as the tooth surface and the groove surface on the back of the jaw plate are not used;

[0157] (3) First determine the composite surface of the composite mold, then lay it out on the aluminum plate, and then cut it directly using scissors or other tools;

[0158] (4) After the composite surface of the composite mold is determined, the EPS foam mold is processed and formed, and the thickness difference of the aluminum plate should be reserved on the composite surface to be composited;

[0159] (5) preparing the epoxy resin adhesive of Example 4 for later use;

[0160] (6) Epoxy resin adhesive is evenly applied to one side of the composite aluminum plate, fitted with the foam mold, and evenly pressed and maintained until it is bonded.

[0161] Example 5

[0162] A method for preparing an epoxy resin adhesive comprises the following steps:

[0163] (1) In a reaction kettle, 74 parts by weight of bisphenol A epoxy vinyl ester resin, 5.8 parts of polymethacrylamide, 5 parts of montmorillonite powder, and 25 parts of water were added, and the agitator was turned on and stirred at 300 r / min for 10 min to prepare a mixture;

[0164] (2) adding 17.5 parts of dipropylene glycol methyl ether and stirring at 300 r / min for 4 min to mix the components evenly;

[0165] (3) When the kettle temperature reaches 58°C, stop heating and stirring, evacuate for 20 min until no bubbles are released, and detect the solid content;

[0166] (4) Add 2.3 parts of curing agent and stir rapidly at 1500 r / min for 2 min to ensure that it is evenly dispersed with the base liquid;

[0167] (5) Add 2 parts of penetrant pentaerythritol tetraglycidyl ether, stir at 200 r / min for 27 min, and heat to 82° C. to fully dissolve the penetrant and curing agent;

[0168] (6) stirring rapidly at 1600 r / min, then adding 16 parts of bisphenol A epoxy vinyl ester resin, and stirring at 300 r / min for 1.5 hours to reduce the viscosity of the bisphenol A epoxy vinyl ester resin;

[0169] (7) stirring and cooling to 36° C., and packaging into vacuum tanks using sealed bags to obtain an epoxy resin adhesive.

[0170] The preparation method of the curing agent comprises the following steps:

[0171] S1. Add epichlorohydrin and water into a reaction kettle, stir at 200 r / min, heat to 45° C., add methanol dropwise, stir at 300 r / min, add potassium hydroxide solution dropwise, adjust the pH value of the reaction solution to 9.8, heat to 110° C., and reflux for 4.6 hours; and cool to obtain an epoxy resin solution;

[0172] S2. Add ricinoleic acid dropwise to the epoxy resin solution obtained in step S1, stir at 600 r / min for 25 min, adjust the pH value of the reaction solution to 2.8, raise the temperature to 67° C., and reflux for 3.6 h; remove water and methanol by reduced pressure distillation, raise the temperature to 125° C., add hydrogen peroxide solution, and stir well for 5.2 h to obtain a curing agent; the molar ratio of epichlorohydrin, methanol, water, potassium hydroxide, ricinoleic acid, and hydrogen peroxide is 2:2:6.3:1.3:1:2.1.

[0173] An EPS foam-aluminum plate composite mold is composited by pasting an aluminum plate reinforcement plate with a thickness of 1.5 mm on a parting surface of a demoulding portion of an EPS foam mold by using an epoxy resin adhesive.

[0174] The main technical points and production process of the EPS foam-aluminum plate composite mold are as follows:

[0175] (1) The thickness of the aluminum plate is 1.5 mm, which is easy to cut and shape;

[0176] (2) Aluminum plates are mainly used on the main force-bearing surfaces and demolding surfaces of the mold parting, such as the ribs on the back of the jaw plate and the surrounding sides. Non-main force-bearing surfaces such as the tooth surface and the groove surface on the back of the jaw plate are not used;

[0177] (3) First determine the composite surface of the composite mold, then lay it out on the aluminum plate, and then cut it directly using scissors or other tools;

[0178] (4) After the composite surface of the composite mold is determined, the EPS foam mold is processed and formed, and the thickness difference of the aluminum plate should be reserved on the composite surface to be composited;

[0179] (5) preparing the epoxy resin adhesive of Example 5 for later use;

[0180] (6) Epoxy resin adhesive is evenly applied to one side of the composite aluminum plate, fitted with the foam mold, and evenly pressed and maintained until it is bonded.

[0181] Comparative Example 1

[0182] The preparation process of the epoxy resin adhesive is basically the same as that of Example 3, except that a traditional phosphoric acid curing agent is used instead of the innovative curing agent in Example 3, and the amount used is the same.

[0183] Comparative Example 2

[0184] The epoxy resin adhesive in Example 3 was replaced by conventional Asia-Pacific foam adhesive in the same amount.

[0185] Viscosity test of adhesive:

[0186] The viscosity of the epoxy resin adhesives prepared in Examples 1-5, the adhesives of Comparative Examples 1 and 2, and the Asia-Pacific foam adhesive were tested, and the test results are shown in the following table:

[0187]

[0188]

[0189] From the detailed data in the above table, we can clearly observe the following key points, which are further analyzed as follows:

[0190] (1) In Examples 1-5 of the present invention, the prepared epoxy resin adhesive exhibited excellent viscosity performance, and its viscosity value reached 1361.2 mPa·s or more. This data not only fully meets the promotion and application needs of the epoxy resin adhesive in the application of the present invention and various application scenarios, but also indicates that this series of adhesives can maintain excellent adhesion and stability in actual use, providing great convenience and protection for the user's operation. Whether in construction, automobiles or other fields requiring high-strength bonding, the epoxy resin adhesive of the present invention can play its unique advantages and inject new vitality into the development of the industry.

[0191] (2) In order to more intuitively demonstrate the superior performance of the innovative curing agent of the present invention, the present invention sets Comparative Example 1 as a reference. In Comparative Example 1, the present invention uses a traditional phosphoric acid curing agent to replace the innovative curing agent in Example 3. The results show that the viscosity of the adhesive obtained using the traditional curing agent is only 1230.7 mPa·s, which is significantly different from the viscosity of the epoxy resin adhesive prepared using the innovative curing agent of the present invention in Example 3, which is 1420.1 mPa·s. Specifically, the viscosity of the adhesive in Example 3 is 15.4% higher than that in Comparative Example 1. This data not only strongly proves that the use of the curing agent of the present invention can significantly improve the viscosity of the epoxy resin adhesive, but also further reveals the huge potential of the innovative curing agent in improving product performance. Through this comparison, the present invention can clearly see that the innovative achievements of the present invention in the field of curing agents are of great significance for promoting the development of the epoxy resin adhesive industry.

[0192] (3) The present invention also compares the viscosity of the epoxy resin adhesive prepared in Examples 1-5 of the present invention and the Asia-Pacific foam adhesive in Comparative Example 2. The results show that the epoxy resin adhesive of the present invention exhibits a huge advantage in viscosity, and its viscosity value is at least 36.4% higher than that of the Asia-Pacific foam adhesive in Comparative Example 2. This data not only further verifies the excellent performance of the epoxy resin adhesive prepared by the present invention in terms of viscosity, but also highlights the significant progress of the technology of the present invention on the basis of the prior art. Compared with the existing adhesives, the epoxy resin adhesive of the present invention not only has a higher viscosity, but also performs well in adhesion, stability and other aspects. Therefore, the present invention has reason to believe that with the continuous promotion and application of the present invention, it will play its unique advantages in more fields and make greater contributions to the development and progress of the industry.

[0193] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for preparing an epoxy resin adhesive, characterized in that: The following steps are involved: (1) adding 65-75 parts by weight of bisphenol A epoxy vinyl ester resin, 4-6 parts by weight of polymethacrylamide, 3-5 parts by weight of montmorillonite powder, and 15-25 parts by weight of water into a reaction kettle, and stirring with a stirrer to prepare a mixture; (2) adding 14-18 parts of dipropylene glycol methyl ether and stirring at 200-300 r / min for 4-6 min to mix the components evenly; (3) After the kettle temperature reaches a certain value, stop heating and stirring, evacuate until no bubbles are released, and detect the solid content; (4) Add 1.6-2.3 parts of curing agent and stir rapidly at 1000-1500 r / min for 2-3 minutes to evenly disperse it with the base liquid; (5) Add 1.4-2.1 parts of penetrant pentaerythritol tetraglycidyl ether, stir at 200-250 r / min for 23-28 min, and heat to a certain value to fully dissolve the penetrant and curing agent; (6) stirring rapidly at 1200-1600 r / min, and then adding 10-16 parts of bisphenol A epoxy vinyl ester resin and stirring to reduce the viscosity of the bisphenol A epoxy vinyl ester resin; (7) stirring and cooling, and packaging into vacuum tanks using sealed bags to obtain epoxy resin adhesive.

2. The method for preparing the epoxy resin adhesive according to claim 1, wherein The stirring condition in step (1) is: stirring at 200-300 r / min for 10-15 min.

3. The method for preparing the epoxy resin adhesive according to claim 1, wherein: In step (3), the kettle temperature reaches a certain value of 55-58°C.

4. The method for preparing the epoxy resin adhesive according to claim 1, wherein: The vacuuming time in step (3) is 20-24 minutes.

5. The method for preparing the epoxy resin adhesive according to claim 1, characterized in that: In step (5), the temperature is raised to a certain value of 78-82°C.

6. The method for preparing the epoxy resin adhesive according to claim 1, characterized in that: The stirring condition for adding bisphenol A epoxy vinyl ester resin in step (6) is 300-400 r / min for 1-1.5 h.

7. The method for preparing the epoxy resin adhesive according to claim 1, characterized in that: In step (7), the mixture is stirred and cooled to below 38°C.

8. An epoxy resin adhesive prepared according to the method according to any one of claims 1 to 7.

9. Use of the epoxy resin adhesive according to claim 8 in manufacturing EPS foam-aluminum plate composite mold, characterized in that: The EPS foam-aluminum plate composite mold is composited by pasting an aluminum plate reinforcement plate on a parting surface of a demoulding portion of an EPS foam mold using an epoxy resin adhesive.

10. Use of the epoxy resin adhesive according to claim 9 in manufacturing EPS foam-aluminum plate composite mold, characterized in that: The thickness of the aluminum plate reinforcement plate is 1-2 mm.

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