Method for generating a preform and device for generating a preform
By acquiring and filtering the component information and connection point coordinates in the embedded parts generation instructions, performing component interference detection, and generating a three-dimensional embedded parts model, the problems of insufficient accuracy and stability in traditional embedded parts generation methods are solved, achieving higher accuracy and stability.
Patent Information
- Application Number
- CN202411866310.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2044-12-18
AI Technical Summary
Traditional embedded parts generation methods rely on manual labor and cannot guarantee accuracy and stability.
By obtaining the component information and connection point coordinates in the embedded part generation instruction, the target embedded parts that match the component information are screened out, and component interference detection is performed to generate a three-dimensional embedded part model.
The accuracy of embedded parts generation and the stability of installation are improved, avoiding the influence of interference from surrounding components.
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Figure CN119903575B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of embedded part generation, in particular to a method for generating an embedded part and a device for generating an embedded part. BACKGROUND
[0002] In the process of nuclear power plant construction, a large number of process pipes, equipment, supports, steel structures and the like are fixed to the plant civil structure using embedded parts. Such embedded parts, which are numerous and various in type, are an important carrier for connecting process equipment and civil items, and are of great significance to ensuring the safe and stable operation of nuclear power plants.
[0003] Traditional embedded part generation methods generally rely on manual execution and cannot guarantee the accuracy of embedded part generation. SUMMARY
[0004] Therefore, it is necessary to provide a method for generating an embedded part and a device for generating an embedded part that can improve the accuracy of embedded part generation.
[0005] In a first aspect, the present application provides a method for generating an embedded part, comprising: in response to an embedded part generation instruction for a bearing member, obtaining member information of a target member indicated by the embedded part generation instruction and connection point coordinates between the target member and the bearing member; the target member is connected to the bearing member through a generated embedded part; from a plurality of candidate embedded parts, a target embedded part that matches the member information is selected; the connection point coordinates are taken as the position coordinates of the target embedded part, and based on the position coordinates, the target embedded part is subjected to member interference detection to obtain a member interference detection result of the target embedded part; when the member interference detection result indicates that the target embedded part does not have member interference, a three-dimensional embedded part model of the target embedded part is generated.
[0006] In one embodiment, the connection point coordinates are taken as the position coordinates of the target embedded part, and based on the position coordinates, the target embedded part is subjected to member interference detection to obtain a member interference detection result of the target embedded part, comprising: the connection point coordinates are taken as the position coordinates of the target embedded part to determine a surrounding area centered on the position coordinates; for each surrounding boundary of the surrounding area, member selection is performed to obtain a nearest neighboring member from each surrounding boundary; member spacing detection is performed between the target embedded part and each neighboring member to obtain a member spacing detection result between the target embedded part and each neighboring member; based on the member spacing detection results, the member interference detection result of the target embedded part is determined.
[0007] In one embodiment, selecting a target embedded part that matches the component information from a plurality of candidate embedded parts includes: selecting at least one selected embedded part that matches the component information from the plurality of candidate embedded parts; obtaining the embedded part model of each selected embedded part, and selecting the selected embedded part with the smallest embedded part model as the target embedded part.
[0008] In one embodiment, at least one selected embedded part that matches the component information is screened out from multiple candidate embedded parts, including: obtaining an embedded parts list; the embedded parts list records the embedded parts attribute information of each of the multiple candidate embedded parts; matching the component information with each embedded parts attribute information respectively to obtain information matching results between the component information and each embedded parts attribute information; and using the candidate embedded part that matches the information matching result as the selected embedded part.
[0009] In one embodiment, when the component interference detection result indicates that there is no component interference with the target embedded part, a three-dimensional embedded part model of the target embedded part is generated, including: when the component interference detection result indicates that there is no component interference with the target embedded part, obtaining target attribute information of the target embedded part; based on the target attribute information, constructing a three-dimensional model of the target embedded part to obtain a three-dimensional embedded part model of the target embedded part.
[0010] In one embodiment, the method further includes: when the component interference detection result indicates that the target embedded part has component interference, updating the position coordinates of the target embedded part to obtain updated coordinates; and performing component interference detection on the target embedded part based on the updated coordinates.
[0011] In the second aspect, the present application also provides a device for generating embedded parts, including: an information acquisition module, used to respond to an embedded part generation instruction for a load-bearing component, obtain the component information of the target component indicated by the embedded part generation instruction, and the connection point coordinates between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; an embedded part screening module, used to screen out the target embedded part that matches the component information from multiple candidate embedded parts; a component interference detection module, used to use the connection point coordinates as the position coordinates of the target embedded part, and based on the position coordinates, perform component interference detection on the target embedded part to obtain a component interference detection result of the target embedded part; an embedded part generation module, used to generate a three-dimensional embedded part model of the target embedded part when the component interference detection result indicates that there is no component interference in the target embedded part.
[0012] On the third aspect, the present application also provides a computer device, including a memory and a processor, the memory storing a computer program, and the processor implementing the following steps when executing the computer program: in response to an embedded part generation instruction for a load-bearing component, obtaining component information of a target component indicated by the embedded part generation instruction, and the coordinates of the connection point between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; from multiple candidate embedded parts, the target embedded part that matches the component information is screened out; the connection point coordinates are used as the position coordinates of the target embedded part, and based on the position coordinates, component interference detection is performed on the target embedded part to obtain a component interference detection result of the target embedded part; when the component interference detection result indicates that there is no component interference in the target embedded part, a three-dimensional embedded part model of the target embedded part is generated.
[0013] In a fourth aspect, the present application also provides a computer-readable storage medium having a computer program stored thereon, which implements the following steps when the computer program is executed by a processor: in response to an embedded part generation instruction for a load-bearing component, obtaining component information of a target component indicated by the embedded part generation instruction, and the coordinates of the connection points between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; from a plurality of candidate embedded parts, a target embedded part that matches the component information is screened out; the connection point coordinates are used as the position coordinates of the target embedded part, and based on the position coordinates, a component interference detection is performed on the target embedded part to obtain a component interference detection result of the target embedded part; when the component interference detection result indicates that there is no component interference of the target embedded part, a three-dimensional embedded part model of the target embedded part is generated.
[0014] In a fifth aspect, the present application also provides a computer program product, comprising a computer program, which, when executed by a processor, implements the following steps: in response to an embedded part generation instruction for a load-bearing component, obtains component information of a target component indicated by the embedded part generation instruction, and the coordinates of the connection points between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; from a plurality of candidate embedded parts, the target embedded part that matches the component information is screened out; the connection point coordinates are used as the position coordinates of the target embedded part, and based on the position coordinates, component interference detection is performed on the target embedded part to obtain a component interference detection result of the target embedded part; when the component interference detection result indicates that there is no component interference in the target embedded part, a three-dimensional embedded part model of the target embedded part is generated.
[0015] The above-described embedded component generation method, apparatus, computer device, computer-readable storage medium, and computer program product, in response to an embedded component generation instruction for a load-bearing component, first obtains component information of a target component indicated by the embedded component generation instruction, as well as the coordinates of the connection points between the target component and the load-bearing component; the target component is then connected to the load-bearing component via the generated embedded component. A target embedded component that matches the component information is then screened from multiple candidate embedded components. The connection point coordinates are then used as the position coordinates of the target embedded component. Based on these position coordinates, component interference detection is performed on the target embedded component to obtain a component interference detection result for the target embedded component. If no component interference is detected for the target embedded component, a three-dimensional embedded component model of the target embedded component is generated. In this manner, the present application eliminates the need for manual intervention. On the one hand, the embedded components are screened to select the optimal embedded component. On the other hand, the component interference detection effectively prevents interference from surrounding components from affecting the accuracy and stability of the embedded component's installation after generation, thereby improving the accuracy of both embedded component generation and embedded component installation. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments of the present application or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying any creative work.
[0017] Figure 1 FIG. 1 is an application environment diagram of a method for generating embedded parts in one embodiment;
[0018] Figure 2 1 is a flow chart of a method for generating embedded parts in one embodiment;
[0019] Figure 3 1. A schematic diagram of a flow chart for calculating the distance between an embedded part and an adjacent component in one embodiment;
[0020] Figure 4 A schematic diagram of an embedded part and surrounding components in one embodiment;
[0021] Figure 5 A schematic diagram of an embedded part and surrounding components in another embodiment;
[0022] Figure 6 A schematic diagram of a process for screening embedded parts in one embodiment;
[0023] Figure 7 A schematic diagram of a process for screening embedded parts in another embodiment;
[0024] Figure 8A schematic diagram of a process for constructing a three-dimensional model of an embedded part in one embodiment;
[0025] Figure 9 Schematic diagram of a flow chart of a method for generating embedded parts in a specific embodiment;
[0026] Figure 10 is a flow chart of a method for generating embedded parts in another specific embodiment;
[0027] Figure 11 1 is a structural block diagram of a device for generating embedded parts in one embodiment;
[0028] Figure 12 FIG. 1 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.
[0030] The method for generating embedded parts provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown, terminal 102 communicates with server 104 via a network. A data storage system can store data that server 104 needs to process. The data storage system can be integrated with server 104 or placed in the cloud or on other network servers. Terminal 102 can be, but is not limited to, various personal computers, laptops, smartphones, tablets, and IoT devices. Server 104 can be a standalone physical server, a server cluster or distributed system consisting of multiple physical servers, or a cloud server providing cloud computing services.
[0031] Specifically, in response to a pre-embedded component generation instruction for a load-bearing component initiated by terminal 102, server 104 first obtains component information of the target component indicated by the pre-embedded component generation instruction, as well as the coordinates of the connection points between the target component and the load-bearing component. The target component is then connected to the load-bearing component via the generated pre-embedded component. The target embedded component that matches the component information is then selected from multiple candidate embedded components. The connection point coordinates are then used as the position coordinates of the target embedded component. Based on the position coordinates, component interference detection is performed on the target embedded component to obtain a component interference detection result for the target embedded component. Finally, if the component interference detection result indicates that the target embedded component does not have component interference, a three-dimensional embedded component model of the target embedded component is generated.
[0032] In an exemplary embodiment, Figure 2 As shown, a method for generating embedded parts is provided, which is applied to Figure 1 The server 104 in FIG. 1 is used as an example to illustrate the invention, including:
[0033] Step S202 , in response to an embedded component generation instruction for a load-bearing component, obtain component information of a target component indicated by the embedded component generation instruction and the coordinates of the connection points between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded component.
[0034] Among them, the load-bearing component may refer to a component used to bear loads in a building structure, such as a column, wall, beam, etc. The embedded part generation instruction refers to an instruction to install embedded parts on the load-bearing component, so that the target component can be connected to the load-bearing component through the generated embedded parts. The target component may refer to a component that needs to be connected and fixed to other components. Component information may refer to the attribute information of the target component, including but not limited to size, shape, load, purpose, corrosion resistance, etc. The connection point coordinates refer to the coordinates of the connection point between the target component and the load-bearing component, also known as the fixed point. The coordinates can generally be used as the position coordinates of the embedded parts.
[0035] For example, when a load-bearing component requires the installation of embedded parts, or when a target component needs to be fixed to a load-bearing component, a user can initiate a command to generate embedded parts for the load-bearing component through a terminal. After receiving this command, the server can parse it to obtain relevant attribute information of the target component and the coordinates of the connection point between the target component and the load-bearing component.
[0036] Step S204: Filter out target embedded parts that match the component information from multiple candidate embedded parts.
[0037] The candidate embedded parts can be various embedded parts pre-stored by the server. That is, the server will pre-establish an embedded parts database or embedded parts list to comprehensively record the information of each candidate embedded part. The target embedded part refers to the candidate embedded part that matches the component information.
[0038] Illustratively, after acquiring the component information of the target component, the server may perform information matching among a plurality of pre-stored candidate embedded parts based on the component information to match a candidate embedded part that matches the component information as the target embedded part.
[0039] Step S206 , using the connection point coordinates as the position coordinates of the target embedded part, and performing component interference detection on the target embedded part based on the position coordinates to obtain a component interference detection result of the target embedded part.
[0040] The position coordinates can also be understood as the surface center coordinates of the target embedded part. Component interference detection is the process of detecting whether interference exists between the target embedded part and surrounding components. The component interference detection result indicates whether interference exists between the target embedded part and surrounding components, and can include either the presence or absence of component interference.
[0041] Exemplarily, the server uses the coordinates of the connection point between the target component and the load-bearing component as the position coordinates of the target embedded part, and based on the position coordinates, detects whether there is interference between the target embedded part and surrounding components.
[0042] Step S208 : When the component interference detection result indicates that there is no component interference in the target embedded part, a three-dimensional embedded part model of the target embedded part is generated.
[0043] The three-dimensional embedded part model refers to the three-dimensional model of the target embedded part, and subsequent professionals can install the embedded parts on the load-bearing components based on the three-dimensional model of the target embedded part.
[0044] For example, when the component interference detection result indicates that there is no component interference with the target embedded part, the server can construct a 3D model of the target embedded part, thereby obtaining a 3D embedded part model of the target embedded part. The 3D model construction can use a dedicated 3D modeling tool, which is not limited in this embodiment.
[0045] In this embodiment, in response to an embedded part generation instruction for a load-bearing component, the server first obtains component information of the target component indicated by the embedded part generation instruction, as well as the coordinates of the connection points between the target component and the load-bearing component. The target component is then connected to the load-bearing component via the generated embedded part. The target embedded part that matches the component information is then screened from multiple candidate embedded parts. The connection point coordinates are then used as the position coordinates of the target embedded part. Based on these position coordinates, a component interference detection is performed on the target embedded part to obtain the component interference detection result. If no component interference is found for the target embedded part, a three-dimensional embedded part model of the target embedded part is generated. This eliminates the need for manual intervention. On the one hand, the embedded parts are screened to select the optimal one. On the other hand, the component interference detection effectively prevents interference from surrounding components from affecting the accuracy and stability of the embedded part's installation after generation, thereby improving the accuracy of both embedded part generation and embedded part installation.
[0046] In an exemplary embodiment, Figure 3 As shown, the connection point coordinates are used as the position coordinates of the target embedded part. Based on the position coordinates, component interference detection is performed on the target embedded part to obtain the component interference detection result of the target embedded part, including:
[0047] Step S302, taking the connection point coordinate as the position coordinate of the target embedded part, determining a surrounding area with the position coordinate as the center.
[0048] The surrounding area refers to a surrounding core formed with the position coordinate as the center, as shown in Figure 4 Figure 4 The hole, the existing embedded part, the allowed eccentric range of the target embedded part, and the surrounding component boundary are also shown in the figure. The surrounding area has multiple surrounding boundaries. The distance between the position coordinate and the surrounding boundary can be set according to actual conditions.
[0049] For example, the server can extend a certain distance outward with the connection point coordinate as the position coordinate of the target embedded part, thereby forming the surrounding area of the target embedded part.
[0050] Step S304, for each surrounding boundary of the surrounding area, component screening is performed to obtain the adjacent component closest to each surrounding boundary.
[0051] The surrounding boundary refers to each boundary that constitutes the surrounding area. The adjacent component refers to the existing component or the existing embedded part closest to each surrounding boundary. It should be noted that the distance here refers to the distance between the boundary center point of the adjacent component and the surrounding boundary, such as the minimum distance min d in Figure 5
[0052] For example, the server can diffuse outward for each surrounding boundary of the surrounding area to find the surrounding existing component or embedded part. The distance between the center point of the component boundary of these components and the surrounding boundary is calculated, and the surrounding component with the smallest distance is taken as the adjacent component.
[0053] Step S306, component spacing detection is performed between the target embedded part and each adjacent component respectively to obtain the component spacing detection result between the target embedded part and each adjacent component respectively.
[0054] Wherein, component spacing detection is the process of detecting the distance relationship between the target embedded part and the adjacent component. The component spacing detection result is then used to characterize the distance relationship between the target embedded part and the adjacent component. It should be noted that the distance relationship between the target embedded part and the adjacent component can be determined directly based on the distance between the boundary center point of the adjacent component and the encircling boundary. For example, when the distance between the boundary center point of the adjacent component and the encircling boundary is within the allowable distance range, it is considered that the distance between the target embedded part and the adjacent component is within the safe range. Otherwise, it is considered that the distance between the target embedded part and the adjacent component is not within the safe range, and there is a risk of interference. Of course, the distance relationship between the target embedded part and the adjacent component can also be determined based on the distance between the center position coordinates of the adjacent component and the position coordinates of the target embedded part. For example, when the distance between the center position coordinates of the adjacent component and the position coordinates of the target embedded part is within the allowable distance range, it is also considered that the distance between the target embedded part and the adjacent component is within the safe range. Otherwise, it is considered that the distance between the target embedded part and the adjacent component is not within the safe range, and there is a risk of interference. In actual applications, other component spacing detection basis can also be defined according to actual operating conditions, and this embodiment does not limit this.
[0055] For example, after the server has screened out the adjacent components, it can calculate the spacing between the target embedded component and each adjacent component, thereby obtaining the distance relationship between the target embedded component and each adjacent component.
[0056] Step S308: Determine the component interference detection result of the target embedded part based on the detection results of the spacing between the components.
[0057] For example, when the component spacing detection result indicates that the spacing between the target embedded part and each adjacent component is within the allowable distance range, it indicates that the distance between the target embedded part and the adjacent components is within a safe range and there is no mutual interference. When the component spacing detection result indicates that the spacing between the target embedded part and each adjacent component is not within the allowable distance range, it indicates that the distance between the target embedded part and the adjacent components is not within a safe range and there is a risk of mutual interference.
[0058] In one embodiment, it should be noted that, in addition to determining whether the spacing between the target embedded part and the surrounding components meets the requirements, it is also possible to detect whether the concrete margin meets the minimum concrete margin requirement, and whether the allowable eccentricity range of the target embedded part meets the maximum allowable eccentricity distance. Specific detection requirements can be set according to actual conditions, and this embodiment does not impose any restrictions on this.
[0059] In this embodiment, by calculating the spacing between the target embedded part and the adjacent components, the distance relationship between the target embedded part and the adjacent components is determined, and then whether there is a component interference risk between the target embedded part and the adjacent components is determined, thereby improving the accuracy of embedded part generation.
[0060] In an example embodiment, as shown in Figure 6 selecting a target embedded part from the plurality of candidate embedded parts that matches the component information, includes:
[0061] Step S602, selecting at least one selected embedded part from the plurality of candidate embedded parts that matches the component information.
[0062] Step S604, obtaining the embedded part model of each selected embedded part respectively, and selecting the selected embedded part with the smallest embedded part model as the target embedded part.
[0063] The selected embedded part refers to the candidate embedded part that matches the component information, and further selection, i.e., model selection, is required in the selected embedded part to obtain the final target embedded part. The embedded part model includes but is not limited to the width, thickness, diameter, length, etc. of the embedded part.
[0064] For example, the server first selects a batch of selected embedded parts that match the component information from the plurality of candidate embedded parts. In these selected embedded parts, the server further obtains the width, thickness, diameter, length, etc. of each selected embedded part. The selected embedded part with the smallest embedded part model is selected as the final target embedded part.
[0065] In this embodiment, by selecting the selected embedded part with the smallest embedded part model from the selected embedded parts that meet the requirements, material consumption is reduced, and the cost of embedded part generation and installation is reduced.
[0066] In an example embodiment, as shown in Figure 7 selecting at least one selected embedded part from the plurality of candidate embedded parts that matches the component information, includes:
[0067] Step S702, obtaining an embedded part list; the embedded part list records the embedded part attribute information of each of the plurality of candidate embedded parts.
[0068] The embedded part attribute information refers to the attribute information of the candidate embedded part, including but not limited to the embedded part model, the minimum component spacing requirement, the minimum concrete margin requirement, the maximum eccentric distance requirement, the maximum load, etc.
[0069] For example, the server can pre-establish a standard embedded part list, which records various candidate embedded parts and the attribute information of each candidate embedded part, i.e., the embedded part model, the minimum component spacing requirement, the minimum concrete margin requirement, the maximum eccentric distance requirement, the maximum load, etc.
[0070] Step S704 : Match the component information with the attribute information of each embedded part respectively, and obtain the information matching results between the component information and the attribute information of each embedded part respectively.
[0071] Step S706: The candidate embedded parts that are matched according to the information matching result are selected as embedded parts.
[0072] The information matching result can be understood as the degree of match between the component information and the embedded part attribute information. In this embodiment, the matching is primarily performed using load information, that is, matching the load of the target component with the maximum load of each candidate embedded part. Of course, in actual applications, other information can also be selected for matching, and this embodiment does not limit this.
[0073] For example, the server matches the target component's load with the maximum load of each candidate embedded part. If the target component's load does not exceed the maximum load of the candidate embedded part, the information matching result is a match, and the matching candidate embedded part is selected as the embedded part. If the target component's load exceeds the maximum load of the candidate embedded part, the information matching result is a mismatch, and the candidate embedded part is eliminated.
[0074] In this embodiment, by matching the component information of the target component with the embedded part attribute information of each candidate embedded part in the embedded parts list, the candidate embedded parts with matching information are selected as the embedded parts, thereby improving the accuracy of embedded parts screening and further improving the accuracy of the entire embedded parts generation.
[0075] In an exemplary embodiment, Figure 8 As shown, when the component interference detection result indicates that there is no component interference with the target embedded part, a three-dimensional embedded part model of the target embedded part is generated, including:
[0076] Step S802 : When the component interference detection result indicates that there is no component interference with the target embedded part, target attribute information of the target embedded part is obtained.
[0077] Step S804: constructing a three-dimensional model of the target embedded part based on the target attribute information to obtain a three-dimensional embedded part model of the target embedded part.
[0078] The target attribute information refers to the attribute information of the target embedded part, including but not limited to the embedded part model, type, purpose, size, etc. of the target embedded part.
[0079] For example, if the component interference detection result indicates that the target embedded part does not interfere with the component, it indicates that the target embedded part is the optimal embedded part for the load-bearing component, and the embedded part generation operation can be performed. The server invokes a pre-deployed 3D modeling tool and inputs the relevant attribute information of the target embedded part into the 3D modeling tool. The 3D modeling tool then constructs a 3D model of the target embedded part based on this attribute information.
[0080] In this embodiment, a three-dimensional model of the target embedded part is constructed based on the attribute information of the target embedded part, thereby improving the accuracy of the three-dimensional embedded part model, that is, improving the accuracy of the entire embedded part generation.
[0081] In an exemplary embodiment, the embedded part generation method further includes: when the component interference detection result indicates that the target embedded part has component interference, updating the position coordinates of the target embedded part to obtain updated coordinates, and performing component interference detection on the target embedded part based on the updated coordinates.
[0082] The updated coordinates refer to the updated position coordinates.
[0083] For example, when the component interference detection result indicates that the target embedded part has component interference, the server will update the position coordinates, that is, recalculate a position coordinate for the target embedded part, and perform component interference detection on the target embedded part based on the updated position coordinates.
[0084] In this embodiment, when there is component interference in the target embedded part, the position coordinates of the target embedded part will be recalculated, thereby ensuring the reliability of the generation and installation of the embedded part.
[0085] In a specific embodiment, if Figure 9 As shown, Figure 9 The flowchart of the method for generating embedded parts is shown. It includes:
[0086] S1: In response to an embedded component generation instruction for a load-bearing component, obtain load information of a target component indicated by the embedded component generation instruction and coordinates of connection points between the target component and the load-bearing component.
[0087] S2: Filter out the target embedded part that matches the load information from multiple candidate embedded parts in the embedded parts list. Use the connection point coordinates as the position coordinates of the target embedded part, and generate a bounding core centered on the position coordinates.
[0088] S3: Calculate the distance relationship between the target embedded part and the adjacent components surrounding the core, and determine whether there is component interference between the target embedded part and the adjacent components based on the distance relationship.
[0089] S4: If it does not exist, generate a three-dimensional embedded part model of the target embedded part according to the position coordinates.
[0090] S5: If yes, return to step S2.
[0091] Further references Figure 10 , Figure 10 Another flowchart of the embedded part generation method is shown. The server first creates an embedded part list and adds the restriction and load requirements for various candidate embedded parts to the list. In response to the embedded part generation instruction initiated by the user, the server reads the coordinates of the connection points between the target component and the load-bearing component, as well as the load information of the target component. The server then enters the embedded part screening module, filters out the target embedded part, and generates the position coordinates and enclosing core of the target embedded part. Next, the adjacent components of the target embedded part are searched, and the distance relationship between the adjacent components and the target embedded part is calculated. Based on the distance relationship, it is determined whether there is component interference between the target embedded part and the adjacent components. Of course, further determinations can be made here to determine whether the concrete margin meets the minimum concrete margin requirement, whether the allowable eccentricity range of the target embedded part meets the maximum eccentricity distance, etc., so this is a multi-conditional judgment. If these conditions are met, a three-dimensional model of the target embedded part is generated, and the final physical embedded part can be generated subsequently through the process system. If these conditions are not met, the position coordinates are recalculated.
[0092] In this embodiment, in response to an embedded part generation instruction for a load-bearing component, the server first obtains component information of the target component indicated by the embedded part generation instruction, as well as the coordinates of the connection points between the target component and the load-bearing component. The target component is then connected to the load-bearing component via the generated embedded part. The target embedded part that matches the component information is then screened from multiple candidate embedded parts. The connection point coordinates are then used as the position coordinates of the target embedded part. Based on these position coordinates, a component interference detection is performed on the target embedded part to obtain the component interference detection result. If no component interference is found for the target embedded part, a three-dimensional embedded part model of the target embedded part is generated. This eliminates the need for manual intervention. On the one hand, the embedded parts are screened to select the optimal one. On the other hand, the component interference detection effectively prevents interference from surrounding components from affecting the accuracy and stability of the embedded part's installation after generation, thereby improving the accuracy of both embedded part generation and embedded part installation.
[0093] It should be understood that although the steps in the flowcharts involved in the embodiments described above are shown in sequence according to the arrows, the steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, the execution of the steps is not strictly limited in sequence, and the steps can be executed in other sequences. Moreover, at least some of the steps in the flowcharts involved in the embodiments described above can include multiple steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence of the steps or stages is not necessarily sequential, but can be executed alternately or alternately with at least part of other steps or steps or stages in other steps.
[0094] Based on the same inventive concept, the embodiments of the present application also provide a pre-embedded part generation device for implementing the pre-embedded part generation method described above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more pre-embedded part generation device embodiments provided below can refer to the limitations of the pre-embedded part generation method described above, which will not be repeated here.
[0095] In one exemplary embodiment, as shown in Figure 11 A pre-embedded part generation device is provided, including: an information acquisition module 1102, configured to acquire, in response to a pre-embedded part generation instruction for a bearing member, member information of a target member indicated by the pre-embedded part generation instruction and connection point coordinates between the target member and the bearing member; the target member is connected to the bearing member through a generated pre-embedded part; a pre-embedded part screening module 1104, configured to screen a target pre-embedded part matching the member information from a plurality of candidate pre-embedded parts; a member interference detection module 1106, configured to take the connection point coordinates as position coordinates of the target pre-embedded part, perform member interference detection on the target pre-embedded part based on the position coordinates, and obtain a member interference detection result of the target pre-embedded part; and a pre-embedded part generation module 1108, configured to generate a three-dimensional pre-embedded part model of the target pre-embedded part when the member interference detection result indicates that the target pre-embedded part does not have member interference.
[0096] In one embodiment, the member interference detection module 1106 is further configured to: take the connection point coordinates as the position coordinates of the target pre-embedded part, and determine a surrounding area centered on the position coordinates; perform member screening for each surrounding boundary of the surrounding area to obtain a nearest neighboring member to each surrounding boundary; perform member spacing detection between the target pre-embedded part and each neighboring member respectively to obtain a member spacing detection result between the target pre-embedded part and each neighboring member respectively; and determine the member interference detection result of the target pre-embedded part based on the member spacing detection results.
[0097] In one of the embodiments, the embedded part screening module 1104 is further configured to: screen at least one selected embedded part matching the component information from the plurality of candidate embedded parts; and obtain a respective embedded part model of each selected embedded part, and select the selected embedded part with the smallest embedded part model as the target embedded part.
[0098] In one of the embodiments, the embedded part screening module 1104 is further configured to: obtain an embedded part list, the embedded part list recording respective embedded part attribute information of the plurality of candidate embedded parts; match the component information with each embedded part attribute information respectively to obtain information matching results between the component information and each embedded part attribute information; and indicate the candidate embedded part with a matching information matching result as the selected embedded part.
[0099] In one of the embodiments, the embedded part generating module 1108 is further configured to: when the component interference detection result indicates that the target embedded part does not exist component interference, obtain target attribute information of the target embedded part; and perform three-dimensional model construction on the target embedded part based on the target attribute information to obtain a three-dimensional embedded part model of the target embedded part.
[0100] In one of the embodiments, the apparatus is further configured to: when the component interference detection result indicates that the target embedded part exists component interference, perform position coordinate updating on the target embedded part to obtain updated coordinates; and perform component interference detection on the target embedded part based on the updated coordinates.
[0101] The above modules in the embedded part generation apparatus can be realized by software, hardware, or a combination thereof. The above modules can be embedded in or independent of a processor in a computer device in hardware form, or stored in a memory in a computer device in software form, so as to be called and executed by a processor to perform operations corresponding to the above modules.
[0102] In one of the embodiments, a computer device is provided, which can be a server, and an internal structure diagram of the computer device can be as shown in FIG. 8. Figure 12As shown in the figure. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. Among them, the processor, the memory and the input / output interface are connected through the system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capability. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store the generation data of the embedded part. The input / output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used to communicate with the terminal outside through the network connection. The computer program is executed by the processor to realize a generation method of an embedded part.
[0103] Those skilled in the art can understand that, Figure 12 The structure shown in the figure is only a block diagram of part of the structure related to the scheme of the present application, and does not constitute a limitation on the computer device to which the scheme of the present application is applied. The specific computer device can include more or fewer components than those shown in the figure, or combine certain components, or have a different component arrangement.
[0104] In one exemplary embodiment, a computer device is provided, comprising a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the following steps: in response to an embedded part generation instruction for a bearing member, obtaining member information of a target member indicated by the embedded part generation instruction and connection point coordinates between the target member and the bearing member; the target member is connected to the bearing member through the generated embedded part; from a plurality of candidate embedded parts, a target embedded part matching the member information is selected; the connection point coordinates are taken as the position coordinates of the target embedded part, and the target embedded part is subjected to member interference detection based on the position coordinates to obtain a member interference detection result of the target embedded part; when the member interference detection result indicates that the target embedded part does not exist member interference, a three-dimensional embedded part model of the target embedded part is generated.
[0105] In one embodiment, the processor executing the computer program further implements the following steps: taking the connection point coordinates as the position coordinates of the target embedded part, determining a surrounding area centered on the position coordinates; for each surrounding boundary of the surrounding area, member selection is performed to obtain a nearest neighboring member from each surrounding boundary; member spacing detection is performed between the target embedded part and each neighboring member respectively to obtain member spacing detection results between the target embedded part and each neighboring member respectively; based on the member spacing detection results, the member interference detection result of the target embedded part is determined.
[0106] In one embodiment, the processor, when executing the computer program, further implements the following steps: selecting at least one selected embedded part from the plurality of candidate embedded parts that matches the component information; and obtaining a respective embedded part model of each selected embedded part, and selecting the selected embedded part with the smallest embedded part model as the target embedded part.
[0107] In one embodiment, the processor, when executing the computer program, further implements the following steps: obtaining an embedded part list; the embedded part list records respective embedded part attribute information of the plurality of candidate embedded parts; respectively matching the component information with each embedded part attribute information to obtain information matching results between the component information and each embedded part attribute information; and indicating the candidate embedded part with a matching information matching result as the selected embedded part.
[0108] In one embodiment, the processor, when executing the computer program, further implements the following steps: when the component interference detection result indicates that the target embedded part does not have component interference, obtaining target attribute information of the target embedded part; and constructing a three-dimensional model of the target embedded part based on the target attribute information to obtain a three-dimensional embedded part model of the target embedded part.
[0109] In one embodiment, the processor, when executing the computer program, further implements the following steps: when the component interference detection result indicates that the target embedded part has component interference, updating a position coordinate of the target embedded part to obtain an updated coordinate; and detecting component interference of the target embedded part based on the updated coordinate.
[0110] In one embodiment, a computer readable storage medium is provided, and the computer readable storage medium stores a computer program. The computer program, when executed by a processor, implements the following steps: in response to a pre-embedded part generation instruction for a bearing component, obtaining component information of a target component indicated by the pre-embedded part generation instruction and a connection point coordinate between the target component and the bearing component; the target component is connected to the bearing component through the generated pre-embedded part; selecting a target pre-embedded part from a plurality of candidate pre-embedded parts that matches the component information; taking the connection point coordinate as a position coordinate of the target pre-embedded part, detecting component interference of the target pre-embedded part based on the position coordinate to obtain a component interference detection result of the target pre-embedded part; and when the component interference detection result indicates that the target pre-embedded part does not have component interference, generating a three-dimensional pre-embedded part model of the target pre-embedded part.
[0111] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: using the connection point coordinates as the position coordinates of the target embedded part, determining an enclosing area centered on the position coordinates; performing component screening for each enclosing boundary of the enclosing area to obtain the adjacent components closest to each enclosing boundary; performing component spacing detection between the target embedded part and each adjacent component to obtain component spacing detection results between the target embedded part and each adjacent component; and determining the component interference detection result of the target embedded part based on the component spacing detection results.
[0112] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented: screening out at least one selected embedded part that matches the component information from multiple candidate embedded parts; obtaining the embedded part model of each selected embedded part respectively, and selecting the selected embedded part with the smallest embedded part model as the target embedded part.
[0113] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: obtaining an embedded parts list; the embedded parts list records the embedded parts attribute information of multiple candidate embedded parts; matching the component information with each embedded parts attribute information respectively to obtain the information matching results between the component information and each embedded parts attribute information respectively; and using the candidate embedded parts that are matched by the information matching results as selected embedded parts.
[0114] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: when the component interference detection result indicates that there is no component interference in the target embedded part, the target attribute information of the target embedded part is obtained; based on the target attribute information, a three-dimensional model of the target embedded part is constructed to obtain a three-dimensional embedded part model of the target embedded part.
[0115] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented: when the component interference detection result indicates that there is component interference in the target embedded part, the position coordinates of the target embedded part are updated to obtain updated coordinates; based on the updated coordinates, component interference detection is performed on the target embedded part.
[0116] In one embodiment, a computer program product is provided, comprising a computer program, which, when executed by a processor, implements the following steps: in response to an embedded part generation instruction for a load-bearing component, obtaining component information of a target component indicated by the embedded part generation instruction, and the coordinates of the connection points between the target component and the load-bearing component; connecting the target component to the load-bearing component through the generated embedded part; screening out a target embedded part that matches the component information from a plurality of candidate embedded parts; using the connection point coordinates as the position coordinates of the target embedded part, and performing component interference detection on the target embedded part based on the position coordinates to obtain a component interference detection result of the target embedded part; and generating a three-dimensional embedded part model of the target embedded part when the component interference detection result indicates that there is no component interference of the target embedded part.
[0117] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: using the connection point coordinates as the position coordinates of the target embedded part, determining an enclosing area centered on the position coordinates; performing component screening for each enclosing boundary of the enclosing area to obtain the adjacent components closest to each enclosing boundary; performing component spacing detection between the target embedded part and each adjacent component to obtain component spacing detection results between the target embedded part and each adjacent component; and determining the component interference detection result of the target embedded part based on the component spacing detection results.
[0118] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented: screening out at least one selected embedded part that matches the component information from multiple candidate embedded parts; obtaining the embedded part model of each selected embedded part respectively, and selecting the selected embedded part with the smallest embedded part model as the target embedded part.
[0119] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: obtaining an embedded parts list; the embedded parts list records the embedded parts attribute information of multiple candidate embedded parts; matching the component information with each embedded parts attribute information respectively to obtain the information matching results between the component information and each embedded parts attribute information respectively; and using the candidate embedded parts that are matched by the information matching results as selected embedded parts.
[0120] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: when the component interference detection result indicates that there is no component interference in the target embedded part, target attribute information of the target embedded part is obtained; based on the target attribute information, a three-dimensional model of the target embedded part is constructed to obtain a three-dimensional embedded part model of the target embedded part.
[0121] In one embodiment, the computer program, when executed by the processor, further implements the following steps: when the component interference detection result indicates that the target embedded part exists component interference, updating the position coordinates of the target embedded part to obtain updated coordinates; and performing component interference detection on the target embedded part based on the updated coordinates.
[0122] It should be noted that the user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the present application are all information and data authorized by the user or authorized by all parties, and the collection, use and processing of related data need to comply with relevant regulations.
[0123] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, database or other media used in the embodiments provided in this application may include at least one of non-volatile memory and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory may include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchains. The processor involved in the various embodiments provided herein may be, but are not limited to, a general-purpose processor, a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), a programmable logic unit (PLC), a data processing logic unit based on quantum computing, an artificial intelligence (AI) processor, and the like.
[0124] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.
[0125] The above-described embodiments are merely illustrative of several embodiments of the present application, and the description is relatively specific and detailed, but should not be understood as a limitation on the scope of the patent. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.
Claims
1. A method for generating embedded parts, characterized in that: The method comprises: In response to an embedded component generation instruction for a load-bearing component, obtaining component information of a target component indicated by the embedded component generation instruction and coordinates of a connection point between the target component and the load-bearing component; the target component is connected to the load-bearing component via the generated embedded component; Selecting a target embedded part that matches the component information from a plurality of candidate embedded parts; Using the connection point coordinates as the position coordinates of the target embedded part, and determining an enclosing area centered on the position coordinates; For each enclosing boundary of the enclosing area, component screening is performed to obtain adjacent components closest to each enclosing boundary; Performing component spacing detection between the target embedded part and each of the adjacent components respectively to obtain component spacing detection results between the target embedded part and each of the adjacent components respectively; Determining a component interference detection result of the target embedded part based on the component spacing detection results; When the component interference detection result indicates that there is no component interference in the target embedded part, a three-dimensional embedded part model of the target embedded part is generated.
2. The method according to claim 1, characterized in that The step of selecting a target embedded part that matches the component information from a plurality of candidate embedded parts includes: Screening out at least one selected embedded part that matches the component information from a plurality of candidate embedded parts; The embedded part model of each selected embedded part is obtained respectively, and the selected embedded part with the smallest embedded part model is used as the target embedded part.
3. The method according to claim 2, characterized in that The step of selecting at least one selected embedded part that matches the component information from a plurality of candidate embedded parts comprises: Obtaining an embedded parts list; the embedded parts list records embedded parts attribute information of each of a plurality of candidate embedded parts; Matching the component information with each of the embedded part attribute information respectively to obtain information matching results between the component information and each of the embedded part attribute information respectively; The candidate embedded parts that are matched by the information matching result are taken as selected embedded parts.
4. The method according to claim 1, wherein When the component interference detection result indicates that there is no component interference with the target embedded part, generating a three-dimensional embedded part model of the target embedded part includes: When the component interference detection result indicates that there is no component interference with the target embedded part, obtaining target attribute information of the target embedded part; Based on the target attribute information, a three-dimensional model of the target embedded part is constructed to obtain a three-dimensional embedded part model of the target embedded part.
5. The method according to claim 1, wherein The method further comprises: When the component interference detection result indicates that component interference exists in the target embedded part, updating the position coordinates of the target embedded part to obtain updated coordinates; Based on the updated coordinates, component interference detection is performed on the target embedded part.
6. A device for generating embedded parts, characterized in that: The device comprises: an information acquisition module, configured to, in response to an embedded component generation instruction for a load-bearing component, acquire component information of a target component indicated by the embedded component generation instruction and coordinates of a connection point between the target component and the load-bearing component; the target component is connected to the load-bearing component via the generated embedded component; An embedded part screening module is used to screen out a target embedded part that matches the component information from a plurality of candidate embedded parts; a component interference detection module, configured to use the connection point coordinates as the position coordinates of the target embedded part, determine an enclosing area centered on the position coordinates; perform component screening for each enclosing boundary of the enclosing area to obtain an adjacent component closest to each enclosing boundary; perform component spacing detection between the target embedded part and each adjacent component to obtain a component spacing detection result between the target embedded part and each adjacent component; and determine a component interference detection result for the target embedded part based on each component spacing detection result; The embedded part generating module is configured to generate a three-dimensional embedded part model of the target embedded part when the component interference detection result indicates that the target embedded part does not have component interference.
7. The device according to claim 6, characterized in that The embedded parts screening module is also used for: Screening out at least one selected embedded part that matches the component information from a plurality of candidate embedded parts; The embedded part model of each selected embedded part is obtained respectively, and the selected embedded part with the smallest embedded part model is used as the target embedded part.
8. The device according to claim 7, characterized in that The embedded parts screening module is also used for: Obtaining an embedded parts list; the embedded parts list records embedded parts attribute information of each of a plurality of candidate embedded parts; Matching the component information with each of the embedded part attribute information respectively to obtain information matching results between the component information and each of the embedded part attribute information respectively; The candidate embedded parts that are matched by the information matching result are taken as selected embedded parts.
9. The device according to claim 6, characterized in that The embedded parts generating module is further used for: When the component interference detection result indicates that there is no component interference with the target embedded part, obtaining target attribute information of the target embedded part; Based on the target attribute information, a three-dimensional model of the target embedded part is constructed to obtain a three-dimensional embedded part model of the target embedded part.
10. The device according to claim 6, characterized in that The device is also used for: When the component interference detection result indicates that component interference exists in the target embedded part, updating the position coordinates of the target embedded part to obtain updated coordinates; Based on the updated coordinates, component interference detection is performed on the target embedded part.
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