Label sensor and assembly structure, forming die and forming method thereof

Abstract

The invention relates to the technical field of sensor packaging, in particular to a label sensor and an assembly structure, a forming mold and a forming method thereof, the label sensor comprises an outer shell, a sensor chip and two heat insulation layers, the outer shell and the sensor chip are coaxially arranged, the heat insulation layers are arranged, and the shaft diameter of the heat insulation layers is equal to that of the sensor; the two ends are located between the two end faces of the sensor chip and the inner side wall of the outer shell. Wherein the outer shell, the sensor chip and the heat insulation layer are integrally formed in an injection molding mode, and an annular assembly groove is formed in the middle of the outer axial surface of the outer shell. According to the utility model, by arranging the outer shell which is integrally formed in an injection molding manner outside the sensor chip, manual glue filling is avoided, so that the phenomena of liquid accumulation and liquid hanging at the chip are reduced, and the stability and reliability of the sensor are improved; by arranging the annular assembly groove for cooperative connection, the assembly and replacement process of the label sensor is simplified, so that the label sensor can be rapidly replaced when damaged, and the assembly positioning precision and consistency are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor packaging, and in particular to a tag sensor and an assembly structure, a molding die and a molding method thereof. Background Art

[0002] A tag sensor is a sensor used to detect and read tags, labels or identifiers. It is widely used in automation systems, packaging industry, warehousing and logistics, etc. It has the advantages of high precision, reliability, stability and easy integration.

[0003] During the application process, in order to prevent the label sensor from being damaged during use and affecting its continuous use, a groove is usually processed on the end plate using a mold or equipment, and the label sensor is built into the groove. The label sensor is fixed and sealed in the groove by glue injection. Although this method can realize the assembly process of the label, the assembly process is inconvenient and requires manual glue pouring, which affects the positioning accuracy and consistency of the overall assembly. The potting glue requires long-term heating or UV curing, and it is difficult to ensure the effect after curing. There is liquid accumulation at the glue injection port; and the assembly efficiency is difficult to improve. Moreover, this assembly method is prone to damage to the end plate during the subsequent replacement of the label sensor if it is damaged, and the glue cleaning process is cumbersome, which is not convenient for achieving the purpose of rapid replacement.

[0004] The information disclosed in this background technology section is only intended to deepen the understanding of the overall background technology of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art known to those skilled in the art. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a tag sensor and its assembly structure, molding mold and molding method, so as to realize a convenient replacement process of a damaged tag sensor, prevent the tag sensor from being damaged by excessive temperature due to recycled use, and effectively avoid the phenomenon of liquid accumulation and hanging on the chip.

[0006] In order to achieve the above-mentioned object, the technical solution adopted by the present invention is: a tag sensor, comprising: an outer shell, a sensor chip and a heat insulation layer, wherein the outer shell and the sensor chip are coaxially arranged, and the heat insulation layer is provided with two layers, and the axial diameter is equal to the axial diameter of the sensor, and is respectively located between the two end surfaces of the sensor chip and the inner side wall of the outer shell; The outer shell, the sensor chip and the heat insulation layer are integrally injection molded, and an annular assembly groove is provided in the middle of the outer axial surface of the outer shell.

[0007] Furthermore, the outer shell includes an upper section and a lower section, the inner and outer end surfaces of the upper section and the lower section are both planes, the lower section is provided with an annular protrusion on the side facing the upper section, the inner end surface of the upper section, the outer axial surface of the annular protrusion and the inner end surface of the lower section are sequentially connected to form the assembly groove; the inner end surface of the upper section, the inner axial surface of the annular protrusion and the inner end surface of the lower section are surrounded to form a built-in groove, and the sensor chip and the two layers of the thermal insulation layer are arranged in the built-in groove.

[0008] Furthermore, the inner end face edge of the upper section is inclined toward the inner side of the assembly groove to form a first guide surface, and the inner end face edge of the lower section is inclined toward the inner side of the assembly groove to form a second guide surface, and the inclination angle of the first guide surface is smaller than the inclination angle of the second guide surface.

[0009] The present invention also provides an assembly structure of a tag sensor, including the tag sensor as described above, and also includes an assembly plate, one side of the assembly plate is provided with an assembly hole, the depth of the assembly hole is set equal to the thickness of the tag sensor, and the tag sensor is clamped in the assembly hole.

[0010] Furthermore, an annular groove is provided on the inner side wall of the assembly hole, a clamping ring is provided in the annular groove, and the side of the clamping ring facing the inside of the assembly hole is clamped in the assembly groove.

[0011] Furthermore, the snap ring includes a connecting portion and a clamping portion, the connecting portion is arranged in the ring groove, the clamping portion protrudes from the inner wall of the assembly hole, and forms a clamping surface facing the side of the tag sensor, and the clamping surface is fitted with the second guide surface and the assembly groove.

[0012] The present invention also provides a molding mold for a tag sensor, which is used to mold the tag sensor as described above, comprising: a substrate, a glue injection plate, and a molding mold arranged between the substrate and the glue injection plate, the substrate is arranged on the ground, a molding cavity is arranged in the molding mold, the shape of the molding cavity is arranged to be the same as the shape of the outer shell, the sensor chip and the two thermal insulation layers are built into the molding cavity, a glue injection port is arranged on the glue injection plate, a flow channel is arranged between the glue injection port and the molding mold, and the flow channel connects the glue injection port and the molding cavity.

[0013] Furthermore, there are two molding cavities, and the flow channel is located between the two molding cavities, including a main flow channel connected to the injection port and four auxiliary flow channels connected to the main flow channel, and the other ends of the four auxiliary flow channels are respectively connected to the spaces at both ends of the sensor chip in the two molding cavities.

[0014] Furthermore, the molding mold includes a lower mold and two upper molds arranged in parallel, six positioning columns are arranged in the lower mold along the mold opening direction, three positioning columns are arranged in each molding cavity, the three positioning columns are symmetrically distributed around the axis of the sensor chip, and the tops of the positioning columns form a step structure, and the end of the thermal insulation layer facing away from the sensor chip is stuck in the step structure.

[0015] The present invention also provides a method for forming a tag sensor, using the above-mentioned tag sensor forming mold, comprising the following steps: Separating the glue injection plate from the molding die so that the molding cavity is opened; Attaching two layers of the heat-insulating layers to both end surfaces of the sensor chip respectively, and placing the heat-insulating layers and the sensor chip in the molding cavity; Separating the glue injection plate from the molding die so that the molding cavity is closed; Injecting polyvinylidene fluoride material into the molding cavity through the injection port and the flow channel, and maintaining pressure according to the set time and temperature, so that the polyvinylidene fluoride material is coated on the insulation layer and the outside of the sensor chip to form the outer shell; Separating the glue injection plate from the molding die so that the molding cavity is opened, and taking out the label sensor blank from the molding cavity; The waste material on the label sensor blank is removed to obtain a label sensor product.

[0016] The beneficial effects of the present invention are as follows: the present invention avoids manual glue filling by arranging an integrated injection-molded outer shell outside the sensor chip, thereby reducing the phenomenon of liquid accumulation and hanging at the chip and improving the stability and reliability of the sensor; by arranging a ring-shaped assembly groove for matching connection, the assembly and replacement process of the tag sensor is simplified, so that the tag sensor can be quickly replaced when it is damaged, improving maintenance efficiency, and ensuring assembly positioning accuracy and consistency. During the replacement process, it can be achieved by only using tools such as a hole opener, reducing damage to the end plate and avoiding glue cleaning, thereby realizing a rapid replacement process; by arranging a heat insulation layer at both ends of the sensor chip, the tag sensor is effectively prevented from being damaged due to excessive temperature during cyclic use, thereby extending the service life of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is a schematic diagram of the structure of a tag sensor in an embodiment of the present invention; Figure 2 An exploded diagram of a tag sensor in an embodiment of the present invention; Figure 3 It is a structural schematic diagram of the tag sensor assembly structure in an embodiment of the present invention; Figure 4 A top view of the tag sensor assembly structure in an embodiment of the present invention; Figure 5 for Figure 4 Sectional view at AA in the middle; Figure 6 This is a schematic diagram of the structure of a label sensor forming mold in an embodiment of the present invention; Figure 7 A top view of a label sensor forming mold in an embodiment of the present invention; Figure 8 for Figure 7 Sectional view at the middle BB; Fig. 9 for Figure 8 Method diagram at A in the middle; Fig.10 This is a schematic diagram of the internal structure of a label sensor molding die in an embodiment of the present invention; Fig.11 Flow chart of the label sensor forming method in an embodiment of the present invention.

[0019] Figure numerals: 1. tag sensor; 11. outer shell; 11a. assembly groove; 111. upper subdivision; 111a. first guide surface; 112. lower subdivision; 112a. second guide surface; 113. annular protrusion; 12. sensor chip; 13. thermal insulation layer; 2. assembly plate; 2a. assembly hole; 2b. annular groove; 3. snap ring; 31. connecting part; 32. snap-fitting part; 32a. snap-fitting surface; 10. substrate; 20. glue injection plate; 21. glue injection port; 30. molding mold; 30a. molding cavity; 30b. positioning column; 31. lower mold plate; 32. upper mold plate; 41. main flow channel; 42. auxiliary flow channel. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0023] like Figure 1 to Figure 2 The tag sensor shown includes: an outer shell 11, a sensor chip 12 and a heat insulation layer 13. The outer shell 11 and the sensor chip 12 are coaxially arranged. The heat insulation layer 13 has two layers, and the axial diameter is equal to the axial diameter of the sensor, and is respectively located between the two end surfaces of the sensor chip 12 and the inner side wall of the outer shell 11; The outer shell 11 , the sensor chip 12 and the heat insulation layer 13 are integrally formed by injection molding, and an annular assembly groove 11 a is provided in the middle of the outer axial surface of the outer shell 11 .

[0024] The present invention avoids manual glue filling by arranging an integrated injection-molded outer shell body 11 outside the sensor chip 12, thereby reducing the phenomenon of liquid accumulation and hanging at the chip and improving the stability and reliability of the sensor; by arranging the annular assembly groove 11a for matching connection, the assembly and replacement process of the tag sensor 1 is simplified, so that the tag sensor 1 can be quickly replaced when it is damaged, improving the maintenance efficiency and ensuring the assembly positioning accuracy and consistency. During the replacement process, it can be achieved by only using tools such as a hole opener, reducing damage to the end plate and avoiding glue cleaning, thereby realizing a quick replacement process; by arranging a heat insulation layer 13 at both ends of the sensor chip 12, the tag sensor 1 is effectively prevented from being damaged due to excessive temperature during cyclic use, thereby extending the service life of the sensor.

[0025] Among them, the outer shell 11 is coaxially arranged with the sensor chip 12, providing structural support and protection, and at the same time is integrally injection-molded with the sensor chip 12 and the thermal insulation layer 13, thereby enhancing the stability of the overall structure; the sensor chip 12 is the core component of the tag sensor 1, responsible for detecting and reading tags, marks or identifiers, and two layers of thermal insulation layers 13 are arranged on both end surfaces of the sensor chip 12 to prevent excessive temperature caused by cyclic use, effectively isolate heat and protect the sensor chip 12.

[0026] On the basis of the above embodiment, the outer shell 11 includes an upper sub-section 111 and a lower sub-section 112. The inner and outer end surfaces of the upper sub-section 111 and the lower sub-section 112 are both planes, so that the inner end surfaces of the upper sub-section 111 and the lower sub-section 112 can form an abutment effect with the internal heat insulation layer 13 to prevent relative displacement and improve the assembly accuracy. The lower sub-section 112 is provided with an annular protrusion 113 on one side facing the upper sub-section 111. The upper sub-section 111 The inner end face of the upper part 111, the outer axial face of the annular protrusion 113 and the inner end face of the lower part 112 are connected in sequence to form an assembly groove 11a; the inner end face of the upper part 111, the inner axial face of the annular protrusion 113 and the inner end face of the lower part 112 are surrounded to form a built-in groove, and the sensor chip 12 and the two layers of thermal insulation layers 13 are arranged in the built-in groove; the built-in groove is formed by the height of the annular protrusion 113 to ensure that the sensor chip 12 and the thermal insulation layer 13 are fixed in the correct position.

[0027] On the basis of the above embodiment, the edge of the inner end surface of the upper section 111 is inclined toward the inner side of the assembly groove 11a to form a first guide surface 111a, and the edge of the inner end surface of the lower section 112 is inclined toward the inner side of the assembly groove 11a to form a second guide surface 112a. The inclination angle of the first guide surface 111a is smaller than the inclination angle of the second guide surface 112a. The first guide surface 111a and the second guide surface 112a are helpful in guiding the position of the tag sensor 1 during the assembly process, and the inclination angle of the first guide surface 111a is smaller than the inclination angle of the second guide surface 112a, which is helpful in identifying the assembly direction of the tag sensor 1, and can also prevent the tag sensor 1 from detaching after the assembly is completed, thereby ensuring the structural stability of the assembly.

[0028] like Figures 3 to 5 As shown, the present invention also provides an assembly structure of a tag sensor 1, including the tag sensor 1 as above, and also including an assembly plate 2, an assembly hole 2a is opened on one side of the assembly plate 2, the depth of the assembly hole 2a is set equal to the thickness of the tag sensor 1, and the tag sensor 1 is clamped in the assembly hole 2a; through the design of the assembly plate 2 and the assembly hole 2a, the tag sensor 1 can be accurately positioned at a predetermined position, thereby improving the assembly efficiency; and the tag sensor 1 is fixed in the assembly hole 2a by clamping, which provides additional stability and reduces displacement or damage caused by vibration or impact. When the tag sensor 1 needs to be maintained or replaced, since it is clamped in the assembly hole 2a, the end plate and the tag sensor 1 can be separated by using tools such as a hole opener, thereby greatly improving the convenience of maintenance.

[0029] On the basis of the above embodiment, an annular groove 2b is opened on the inner wall of the assembly hole 2a, and a snap ring 3 is arranged in the annular groove 2b. The snap ring 3 is clamped in the assembly groove 11a on the side facing the inside of the assembly hole 2a; the use of the snap ring 3 provides additional fixing force, so that the tag sensor 1 is more firmly installed on the assembly plate 2, reducing displacement or damage caused by external force.

[0030] On the basis of the above embodiment, the snap ring 3 includes a connecting portion 31 and a clamping portion 32, the connecting portion 31 is arranged in the annular groove 2b, the clamping portion 32 protrudes from the inner wall of the assembly hole 2a, and forms a clamping surface 32a on the side facing the tag sensor 1, and the clamping surface 32a is arranged in contact with the second guide surface 112a and the assembly groove 11a; the connecting portion 31 of the snap ring 3 is arranged in the annular groove 2b, and the snap ring 3 is fixed on the inner wall of the assembly hole 2a to ensure that the snap ring 3 can be stably installed on the assembly plate 2; the design of the clamping surface 32a enables the snap ring 3 to directly contact the assembly groove 11a of the tag sensor 1 and maintain a tight fit, thereby improving the fixing strength and stability.

[0031] like Figures 6 to 10 The present invention also provides a molding mold 30 of a tag sensor 1, which is used to mold the tag sensor 1 as above, including: a substrate 10, a glue injection plate 20 and a molding mold 30 arranged between the substrate 10 and the glue injection plate 20, the substrate 10 is arranged on the ground, a molding cavity 30a is arranged in the molding mold 30, the shape of the molding cavity 30a is arranged the same as the shape of the outer shell 11, the sensor chip 12 and two heat insulation layers 13 are built in the molding cavity 30a, a glue injection port 21 is arranged on the glue injection plate 20, a flow channel is arranged between the glue injection port 21 and the molding mold 30, and the flow channel connects the glue injection port 21 and the molding cavity 30a; by using the molding mold 30, the tag sensor 1 can be produced on a large scale and quickly, the production efficiency is improved, and the consistency of the shape and size of the tag sensor 1 can be ensured, thereby ensuring product quality.

[0032] Among them, the substrate 10 is the basic part of the molding mold 30, which is used to support the entire mold structure and ensure the stability of the molding process; the injection plate 20 is a part used to inject materials, such as PVDF materials, into the molding cavity 30a of the molding mold 30, the injection port 21 is a channel for material injection, and the flow channel is a channel connecting the injection port 21 and the molding cavity 30a, ensuring that the material can flow into the molding cavity 30a evenly and effectively; the molding mold 30 is a core component, and is provided with a molding cavity 30a, whose shape matches the shape of the outer shell 11 of the tag sensor 1, and is used to form the outer shell 11 part of the tag sensor 1 and ensure molding accuracy; the sensor chip 12 and the heat insulation layer 13 are built into the molding cavity 30a, and are fixed in the outer shell 11 through the injection molding process to form a complete tag sensor 1; and the heat insulation layer 13 can effectively prevent high temperature from damaging the sensor chip 12 during the injection molding process to ensure product quality.

[0033] On the basis of the above embodiment, two molding cavities 30a are provided, which can simultaneously perform glue injection molding on the outer shell 11 parts of the two tag sensors 1, thereby improving the production efficiency and the utilization rate of the mold; the flow channel is located between the two molding cavities 30a, including a main flow channel 41 connected to the glue injection port 21 and four auxiliary flow channels 42 connected to the main flow channel 41, the main flow channel 41 is connected to the glue injection port 21, and is responsible for guiding the material from the glue injection port 21 to the vicinity of the molding cavity 30a; the four auxiliary flow channels 42 are responsible for guiding the material from the main flow channel 41 to each molding cavity 30a, ensuring that the material can be evenly distributed into the two molding cavities 30a, ensuring the consistency and uniformity of the material during the molding process; wherein, the other ends of the four auxiliary flow channels 42 are respectively connected to the spaces at both ends of the sensor chip 12 in the two molding cavities 30a; ensuring that the material can be evenly filled into each part of the molding cavity 30a at both ends of the sensor chip 12, ensuring the integrity and uniformity of the outer shell 11 after molding.

[0034] On the basis of the above embodiment, the molding mold 30 includes a lower mold plate 31 and two upper mold plates 32 arranged in parallel. Six positioning columns 30b are arranged in the lower mold plate 31 along the mold opening direction. Three positioning columns 30b are respectively arranged in each molding cavity 30a. The three positioning columns 30b are symmetrically distributed with the axis of the sensor chip 12 as the center, and the tops of the positioning columns 30b form a step structure. The end of the thermal insulation layer 13 away from the sensor chip 12 is stuck in the step structure; that is, the sensor chip 12 and the thermal insulation layer are located at the center position of the corresponding molding cavity 30a after installation, ensuring the uniformity of the thickness of the outer shell after injection molding, and preventing the impact of the colloid on the sensor chip 12 and the thermal insulation layer 13 during the injection molding process to cause displacement, thereby ensuring the accuracy of the position of the sensor chip 12 and the thermal insulation layer 13 during the molding process, thereby ensuring the precise packaging of the sensor chip 12 and the thermal insulation layer 13, and also ensuring the accuracy of the relative position of the upper mold plate 32 and the lower mold plate 31 during the mold opening and closing process of the molding mold 30, and ensuring the dimensional accuracy of the molding cavity 30a.

[0035] like Fig.11 As shown, the present invention also provides a molding method of a tag sensor 1, using the above molding mold 30, through an automated mold injection molding method, reducing manual intervention, ensuring the uniformity and molding quality of the outer shell 11, and improving production efficiency; specifically comprising the following steps: Separate the injection plate 20 from the molding die 30 so that the molding cavity 30a is opened; so that the sensor chip 12 and the heat insulation layer 13 can be correctly placed in the molding cavity 30a; Two heat-insulating layers 13 are attached to both end surfaces of the sensor chip 12, and the heat-insulating layers 13 and the sensor chip 12 are placed in the molding cavity 30a; Separate the injection plate 20 from the molding die 30 so that the molding cavity 30a is closed; seal the molding cavity 30a to prepare for injecting material, ensure that the material does not leak, and maintain the sealing of the molding cavity 30a; Inject polyvinylidene fluoride material into the molding cavity 30a through the injection port 21 and the flow channel, and maintain the pressure according to the set time and temperature, so that the polyvinylidene fluoride material is coated on the outside of the heat insulation layer 13 and the sensor chip 12 to form the outer shell 11; Separate the glue injection plate 20 from the molding die 30 to open the molding cavity 30a, and take out the label sensor 1 blank from the molding cavity 30a; The waste material on the label sensor 1 blank is removed to obtain the label sensor 1 product to ensure the surface accuracy of the product.

[0036] Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A tag sensor, characterized in that: include: An outer shell, a sensor chip and a heat insulation layer, wherein the outer shell and the sensor chip are coaxially arranged, and the heat insulation layer is provided with two layers, and the axial diameter is set equal to the axial diameter of the sensor, and is respectively located between the two end surfaces of the sensor chip and the inner side wall of the outer shell; The outer shell, the sensor chip and the heat insulation layer are integrally injection molded, and an annular assembly groove is provided in the middle of the outer axial surface of the outer shell.

2. The tag sensor according to claim 1, characterized in that: The outer shell includes an upper part and a lower part, the inner and outer end faces of the upper part and the lower part are both planes, the lower part is provided with an annular protrusion on the side facing the upper part, the inner end face of the upper part, the outer axial face of the annular protrusion and the inner end face of the lower part are connected in sequence to form the assembly groove; the inner end face of the upper part, the inner axial face of the annular protrusion and the inner end face of the lower part are surrounded to form a built-in groove, and the sensor chip and the two layers of the thermal insulation layer are arranged in the built-in groove.

3. The tag sensor according to claim 2, characterized in that: The inner end face edge of the upper section is tilted toward the inner side of the assembly groove to form a first guide surface, and the inner end face edge of the lower section is tilted toward the inner side of the assembly groove to form a second guide surface. The inclination angle of the first guide surface is smaller than the inclination angle of the second guide surface.

4. An assembly structure of a tag sensor, comprising the tag sensor according to claim 3, characterized in that: It also includes an assembly plate, one side of which is provided with an assembly hole, the depth of the assembly hole is set equal to the thickness of the tag sensor, and the tag sensor is clamped in the assembly hole.

5. The assembly structure of the tag sensor according to claim 4, characterized in that: An annular groove is provided on the inner side wall of the assembly hole, a clamping ring is arranged in the annular groove, and the side of the clamping ring facing the inside of the assembly hole is clamped in the assembly groove.

6. The assembly structure of the tag sensor according to claim 5, characterized in that: The snap ring includes a connecting portion and a clamping portion, the connecting portion is arranged in the annular groove, the clamping portion protrudes from the inner side wall of the assembly hole, and forms a clamping surface facing the side of the tag sensor, and the clamping surface is fitted with the second guide surface and the assembly groove.

7. A molding die for a tag sensor, used for molding the tag sensor according to any one of claims 1 to 3, characterized in that: include: A substrate, a glue injection plate and a molding mold arranged between the substrate and the glue injection plate, the substrate is arranged on the ground, a molding cavity is arranged in the molding mold, the shape of the molding cavity is arranged the same as the shape of the outer shell, the sensor chip and the two thermal insulation layers are built in the molding cavity, a glue injection port is arranged on the glue injection plate, a flow channel is arranged between the glue injection port and the molding mold, and the flow channel connects the glue injection port and the molding cavity.

8. The molding die of the tag sensor according to claim 7, characterized in that: There are two molding cavities, and the flow channel is located between the two molding cavities, including a main flow channel connected to the injection port and four auxiliary flow channels connected to the main flow channel. The other ends of the four auxiliary flow channels are respectively connected to the spaces at both ends of the sensor chip in the two molding cavities.

9. The molding die of the tag sensor according to claim 8, characterized in that: The molding mold includes a lower mold plate and two upper mold plates arranged in parallel. Six positioning columns are arranged in the lower mold plate along the mold opening direction. Three positioning columns are arranged in each molding cavity. The three positioning columns are symmetrically distributed with the axis of the sensor chip as the center, and the tops of the positioning columns form a step structure. The end of the thermal insulation layer away from the sensor chip is stuck in the step structure.

10. A method for molding a tag sensor, using the molding die of the tag sensor according to claim 7, characterized in that: The following steps are involved: Separating the glue injection plate from the molding die so that the molding cavity is opened; Attaching two layers of the heat-insulating layers to both end surfaces of the sensor chip respectively, and placing the heat-insulating layers and the sensor chip in the molding cavity; Separating the glue injection plate from the molding die so that the molding cavity is closed; Injecting polyvinylidene fluoride material into the molding cavity through the injection port and the flow channel, and maintaining pressure according to the set time and temperature, so that the polyvinylidene fluoride material is coated on the insulation layer and the outside of the sensor chip to form the outer shell; Separating the glue injection plate from the molding die so that the molding cavity is opened, and taking out the label sensor blank from the molding cavity; The waste material on the label sensor blank is removed to obtain a label sensor product.

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