Chip manufacturing methods, apparatus, equipment, media and process products

Abstract

This disclosure provides a chip manufacturing method, apparatus, equipment, medium, and program product applicable to the cloud computing field. The method includes: responding to a received chip manufacturing request by retrieving a data file for chip manufacturing; analyzing production requirements and machine information to plan the output ratio of each production unit in each production step according to a constructed objective function, obtaining a planning result; the objective function is constructed based on the utilization rate of machines in each production machine group during chip manufacturing; and, if the planning result meets preset conditions, controlling the machines in each production machine group according to the planning result so that the machines can produce chips based on the output ratio, wherein the preset conditions are that the machine utilization rate is minimized when producing chips based on the output ratio, and the difference in utilization rates between multiple production units is minimized.

Description

Technical Field

[0001] This disclosure relates to the field of cloud computing, and more specifically, to a chip manufacturing method, apparatus, equipment, medium, and program product. Background Technology

[0002] Semiconductor chip manufacturing is a process involving multiple production steps and the coordinated operation of multiple production units. This process requires determining the output proportion of each production unit in each production step and producing according to these proportions. To achieve reasonable output proportion planning, heuristic algorithms are used in related technologies. Based on the planning results provided by the algorithm, manual intervention and adjustments are made to the operation of the machines to ensure the smooth progress of production tasks.

[0003] In realizing the concept disclosed herein, the inventors discovered at least the following problem in the related technology: because heuristic algorithms rely on guessing and searching when formulating strategies, this leads to low accuracy of the planning results. Therefore, manual intervention to adjust machine operation to correct these results results in low production efficiency of semiconductor chips. Summary of the Invention

[0004] In view of this, the present disclosure provides a chip manufacturing method, apparatus, equipment, medium, and program product.

[0005] One aspect of this disclosure provides a chip manufacturing method, comprising: responding to a received chip manufacturing request, retrieving a data file for chip manufacturing, wherein the data file includes chip manufacturing requirements at different manufacturing steps and machine information of multiple manufacturing units; analyzing the manufacturing requirements and machine information to plan the output ratio of the manufacturing units in each manufacturing step according to a constructed objective function, obtaining a planning result, wherein the objective function is constructed based on the utilization rate of the machines in each manufacturing unit when manufacturing the chip; and, if the planning result satisfies preset conditions, controlling the machines in each manufacturing unit according to the planning result so that the machines can manufacture the chip based on the output ratio, wherein the preset conditions are that the utilization rate of the machines is minimized when manufacturing the chip based on the output ratio, and the difference in utilization rates among the multiple manufacturing units is minimized.

[0006] According to embodiments of this disclosure, the above-described analysis of production demand and machine information to plan the output ratio of the production unit in each production step according to the constructed objective function, and to obtain the planning result, includes: generating variable factors corresponding to each production unit based on the production demand and machine information, wherein the variable factors are used to calculate the utilization rate of the machines in the production machine group, and the decision variable in the variable factors is the output ratio of the production unit in each production step; integrating multiple variable factors to complete the construction of the objective function; and performing linear programming on the decision variable representing the output ratio in the objective function under preset constraints to obtain the planning result.

[0007] According to embodiments of this disclosure, the above-mentioned generation of variable factors corresponding to each production unit based on the above-mentioned production demand and the above-mentioned machine information includes: for each of the above-mentioned production units, constructing a production factor based on the above-mentioned production demand and a decision variable representing the above-mentioned output ratio, wherein the above-mentioned production factor is used to calculate the number of chips that the above-mentioned production unit needs to produce in each of the above-mentioned production steps; dividing the above-mentioned production factor by the production efficiency of the machines in the above-mentioned machine information to obtain a demand factor; and dividing the above-mentioned demand factor by the total number of machines in the above-mentioned production units to obtain a variable factor used to calculate the utilization rate of the above-mentioned machines.

[0008] According to embodiments of this disclosure, the above-mentioned integration of multiple variable factors to construct the objective function includes: summing the multiple variable factors to obtain a summed factor; dividing the summed factor by the total number of production units to obtain an average factor; successively subtracting the multiple variable factors from the average factor to obtain a difference assessment factor characterizing the difference between the variable factors and the average factor; and constructing the objective function based on the summed factor and the difference assessment factor.

[0009] According to embodiments of this disclosure, the construction of the objective function based on the cumulative factor and the difference assessment factor includes: introducing an auxiliary variable to characterize the difference between the variable factor and the average factor; performing a linear transformation on the difference assessment factor based on the auxiliary variable to obtain a difference transformation factor; and summing the cumulative factor and the difference transformation factor to obtain the objective function.

[0010] According to embodiments of this disclosure, the preset constraints include constraints corresponding to the decision variables and constraints corresponding to the auxiliary variables; the constraints corresponding to the decision variables include a preset range of values ​​for the decision variables and the sum of the decision variables in multiple production steps being a preset value; the constraints corresponding to the auxiliary variables include the auxiliary variables being greater than the absolute value of the result of the difference transformation factor calculation.

[0011] According to an embodiment of this disclosure, controlling the machines in each of the production machine groups based on the planning results so that the machines can produce the chips based on the production output ratio includes: for each of the production machine groups, sending production instructions to the machines in the production group based on the production output ratio of the production group in each of the production steps in the planning results, so as to control each of the machines to produce the chips based on the production output ratio.

[0012] Another aspect of this disclosure provides a chip manufacturing apparatus, comprising: a data retrieval module, configured to retrieve a data file for chip manufacturing in response to a received chip manufacturing request, wherein the data file includes chip manufacturing requirements at different manufacturing steps and machine information of multiple manufacturing units; a proportional planning module, configured to analyze the manufacturing requirements and machine information to plan the output ratio of the manufacturing units in each manufacturing step according to a constructed objective function, thereby obtaining a planning result, wherein the objective function is constructed based on the utilization rate of the machines in each manufacturing unit when manufacturing the chip; and a production control module, configured to control the machines in each manufacturing unit according to the planning result when the planning result meets preset conditions, so that the machines can manufacture the chip based on the output ratio, wherein the preset conditions are that the utilization rate of the machines is minimized when manufacturing the chip based on the output ratio, and the difference in utilization rates among multiple manufacturing units is minimized.

[0013] Another aspect of this disclosure provides an electronic device comprising: one or more processors; and a memory for storing one or more programs, wherein, when the one or more programs are executed by the one or more processors, the one or more processors cause the one or more processors to perform the method as described above.

[0014] Another aspect of this disclosure provides a computer-readable storage medium storing computer-executable instructions, which, when executed, are used to implement the method described above.

[0015] Another aspect of this disclosure provides a computer program product including computer-executable instructions that, when executed, implement the method described above.

[0016] According to embodiments of this disclosure, by analyzing production requirements and machine information in a data file and planning the output ratio of the production unit in each production step based on a constructed objective function, automatic capacity allocation is achieved during chip manufacturing. Since the objective function is constructed based on the utilization rate of the machines in the production machine group, the output ratio obtained by optimizing the objective function is highly feasible. When the planning result meets preset conditions, each machine is controlled to produce according to the corresponding output ratio. By controlling the machines, automated production is achieved, and by linking the output ratio with the machine utilization rate, the automated control of machine production becomes more targeted, effectively improving chip manufacturing efficiency. Attached Figure Description

[0017] The above and other objects, features and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0018] Figure 1 An exemplary system architecture for chip manufacturing methods and apparatus to which this disclosure can be applied is illustrated schematically;

[0019] Figure 2 A flowchart illustrating a chip manufacturing method according to an embodiment of the present disclosure is shown schematically.

[0020] Figure 3 This illustration schematically depicts a chip manufacturing scenario in a chip manufacturing method according to an embodiment of the present disclosure.

[0021] Figure 4 The illustration shows a schematic diagram of a machine control scenario in a chip manufacturing method according to an embodiment of the present disclosure;

[0022] Figure 5 A block diagram of a chip manufacturing apparatus according to an embodiment of the present disclosure is shown schematically;

[0023] Figure 6 A block diagram of an electronic device suitable for implementing a chip manufacturing method according to an embodiment of the present disclosure is shown schematically. Detailed Implementation

[0024] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0025] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0026] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0027] When using expressions such as "at least one of A, B and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (e.g., "a system having at least one of A, B and C" should include, but is not limited to, a system having A alone, a system having B alone, a system having C alone, a system having A and B, a system having A and C, a system having B and C, and / or a system having A, B and C, etc.).

[0028] In the embodiments disclosed herein, the collection, updating, analysis, processing, use, transmission, provision, disclosure, and storage of data (e.g., including but not limited to user personal information) comply with relevant laws and regulations, are used for legitimate purposes, and do not violate public order and good morals. In particular, necessary measures have been taken to prevent unauthorized access to user personal information data and to safeguard user personal information security and network security.

[0029] In the embodiments disclosed herein, user authorization or consent is obtained before acquiring or collecting user personal information.

[0030] Embodiments of this disclosure provide a chip manufacturing method, apparatus, equipment, medium, and program product. The method includes: responding to a received chip manufacturing request, retrieving a data file for chip manufacturing, wherein the data file includes chip manufacturing requirements at different manufacturing steps and machine information of multiple manufacturing units; analyzing the manufacturing requirements and machine information to plan the output ratio of the manufacturing units in each manufacturing step according to a constructed objective function, obtaining a planning result, wherein the objective function is constructed based on the utilization rate of the machines in each manufacturing unit group during chip manufacturing; and, if the planning result meets preset conditions, controlling the machines in each manufacturing unit group according to the planning result, so that the machines can manufacture chips based on the output ratio, wherein the preset conditions are that the machine utilization rate is minimized when manufacturing chips based on the output ratio, and the difference in utilization rates among multiple manufacturing units is minimized.

[0031] Figure 1 An exemplary system architecture is schematically illustrated, to which the chip manufacturing methods and apparatus of this disclosure can be applied. It should be noted that... Figure 1 The examples shown are merely examples of system architectures that can be applied to the embodiments of this disclosure, in order to help those skilled in the art understand the technical content of this disclosure, but do not mean that the embodiments of this disclosure cannot be used in other devices, systems, environments or scenarios.

[0032] like Figure 1 As shown, the system architecture 100 according to this embodiment may include a first terminal device 101, a second terminal device 102, a third terminal device 103, a network 104, and a server 105. The network 104 serves as a medium for providing communication links between the first terminal device 101, the second terminal device 102, the third terminal device 103, and the server 105. The network 104 may include various connection types, such as wired and / or wireless communication links, etc.

[0033] Users can use the first terminal device 101, the second terminal device 102, and the third terminal device 103 to interact with the server 105 via the network 104 to receive or send messages, etc. Various communication client applications can be installed on the first terminal device 101, the second terminal device 102, and the third terminal device 103, such as shopping applications, web browser applications, search applications, instant messaging tools, email clients, and / or social media platform software, etc. (for example only).

[0034] The first terminal device 101, the second terminal device 102, and the third terminal device 103 can be various electronic devices with displays and support web browsing, including but not limited to smartphones, tablets, laptops, and desktop computers.

[0035] Server 105 can be a server that provides various services, such as a backend management server that supports websites browsed by users using the first terminal device 101, the second terminal device 102, and the third terminal device 103 (this is just an example). The backend management server can analyze and process data such as received user requests, and feed back the processing results (such as web pages, information, or data obtained or generated according to user requests) to the terminal devices.

[0036] It should be noted that the chip manufacturing method provided in this embodiment can generally be executed by server 105. Correspondingly, the chip manufacturing apparatus provided in this embodiment can generally be located in server 105. The chip manufacturing method provided in this embodiment can also be executed by a server or server cluster that is different from server 105 and capable of communicating with the first terminal device 101, the second terminal device 102, the third terminal device 103, and / or server 105. Correspondingly, the chip manufacturing apparatus provided in this embodiment can also be located in a server or server cluster that is different from server 105 and capable of communicating with the first terminal device 101, the second terminal device 102, the third terminal device 103, and / or server 105. Alternatively, the chip manufacturing method provided in this embodiment can also be executed by the first terminal device 101, the second terminal device 102, or the third terminal device 103, or by other terminal devices different from the first terminal device 101, the second terminal device 102, or the third terminal device 103. Accordingly, the chip manufacturing apparatus provided in this embodiment may also be disposed in the first terminal device 101, the second terminal device 102 or the third terminal device 103, or disposed in other terminal devices different from the first terminal device 101, the second terminal device 102 or the third terminal device 103.

[0037] It should be understood that Figure 1 The number of terminal devices, networks, and servers shown is merely illustrative. Depending on implementation needs, any number of terminal devices, networks, and servers can be included.

[0038] Figure 2 A flowchart illustrating a chip manufacturing method according to an embodiment of the present disclosure is shown schematically.

[0039] like Figure 2 As shown, the method includes operations S210~S230.

[0040] In operation S210, in response to the received chip production request, a data file for chip production is retrieved. The data file includes the chip production requirements at different production steps and machine information for multiple production units.

[0041] In operation S220, production demand and machine information are analyzed to plan the output ratio of the production unit in each production step according to the constructed objective function, and the planning result is obtained. The objective function is constructed based on the utilization rate of the machines in each production machine group when producing chips.

[0042] In operation S230, if the planning result meets the preset conditions, the machines in each production machine group are controlled according to the planning result so that the machines can produce chips based on the production ratio. The preset conditions are that the utilization rate of the machines reaches the minimum when producing chips based on the production ratio, and the difference in utilization rate between multiple production machine groups reaches the minimum.

[0043] According to embodiments of this disclosure, the semiconductor chip manufacturing process includes multiple manufacturing steps and involves the coordinated operation of multiple production units. These multiple manufacturing steps include: wafer fabrication, oxidation, photolithography, etching, ion implantation, thin film deposition, and chemical mechanical polishing. These manufacturing steps are repeated hundreds of times until the fabrication of all circuit layers in the chip is completed.

[0044] According to embodiments of this disclosure, the wafer fabrication step in the production process is used to manufacture high-purity single-crystal silicon and process it into polished silicon wafers. The oxidation step is used to form silicon dioxide (SiO2) as an insulating layer on the wafer surface. The photolithography step is used to project a circuit design onto the wafer through a mask. The etching step is used to remove unwanted material to form specific circuit patterns. The ion implantation step is used to modify the electrical properties of silicon (doping process). The thin film deposition step is used to deposit various functional thin films on the wafer surface. The chemical mechanical polishing step is used to planarize the surface, providing a flat substrate for subsequent processes.

[0045] Figure 3 The illustration shows a schematic diagram of a chip manufacturing scenario in a chip manufacturing method according to an embodiment of the present disclosure.

[0046] According to embodiments of this disclosure, a production unit includes multiple machines, with different production units responsible for executing different production steps. The same production unit may process chips in multiple production steps. For example... Figure 3 As shown, the chip manufacturing process involves three production steps 310, namely step 1, step 2, and step 3. Production unit 1 and production unit 2 work together to complete the chip production. Specifically, production unit 1 is responsible for the production of steps 2 and 3, while production unit 2 is responsible for the production of steps 1 and 2.

[0047] According to embodiments of this disclosure, upon receiving a chip production request triggered by a user, a data file used for chip production is retrieved. This data file may be presented in tabular form, containing attribute identifiers corresponding to multiple production steps and production units, as well as data information corresponding to each attribute identifier.

[0048] According to embodiments of this disclosure, the data file includes the production requirements of the chip at different production steps and machine information for multiple production units. The production requirements and machine information are analyzed to construct an objective function. The decision variable in the objective function is the output ratio of each production unit in each production step. The objective function calculates the utilization rate of the machines in each production unit during chip production to plan the output ratio, thus obtaining the planning result.

[0049] According to embodiments of this disclosure, when the planning results meet preset conditions, the production machines are controlled based on the output ratio of each production machine in each production step according to the planning results, so that they produce chips according to the calculated output ratio. The preset conditions are that the machine utilization rate is minimized when producing chips based on the output ratio, and the difference in utilization rates between multiple production groups is minimized. By minimizing the machine utilization rate, the need for additional machines can be reduced during chip production. Furthermore, by constraining the difference in utilization rates between multiple production groups to minimize the need for additional machines, load balancing is achieved as much as possible during the chip production process, thus extending the machine lifespan.

[0050] According to embodiments of this disclosure, by analyzing production requirements and machine information in a data file and planning the output ratio of the production unit in each production step based on a constructed objective function, automatic capacity allocation is achieved during chip manufacturing. Since the objective function is constructed based on the utilization rate of the machines in the production machine group, the output ratio obtained by optimizing the objective function is highly feasible. When the planning result meets preset conditions, each machine is controlled to produce according to the corresponding output ratio. By controlling the machines, automated production is achieved, and by linking the output ratio with the machine utilization rate, the automated control of machine production becomes more targeted, effectively improving chip manufacturing efficiency.

[0051] According to embodiments of this disclosure, production demand and machine information are analyzed to plan the output ratio of production units in each production step based on a constructed objective function, thereby obtaining a planning result. This includes: generating variable factors corresponding to each production unit based on production demand and machine information, wherein the variable factors are used to calculate the utilization rate of machines in the production machine group, and the decision variables in the variable factors are the output ratio of the production unit in each production step; integrating multiple variable factors to complete the construction of the objective function; and performing linear programming on the decision variables representing the output ratio in the objective function under preset constraints to obtain the planning result.

[0052] According to embodiments of this disclosure, production requirements and machine information can be presented in tabular form. As shown in Table 1, production requirements include the output requirement for each production step, the batch size of each production unit in each production step, and the standard processing time for a single batch or single piece for each production unit in each production step. As shown in Table 2, machine information includes the production efficiency of the machines in each production machine group, representing the ratio of actual efficiency to theoretical efficiency (range 0~1), and the total number of machines in each production group.

[0053] Table 1

[0054]

[0055] Table 2

[0056]

[0057] According to embodiments of this disclosure, based on production demand and machine information, variable factors are generated for each production unit to calculate the utilization rate of machines within that production unit. The decision variable in these variable factors is the output proportion of the production unit in each production step. These variable factors are linear; as the output proportion increases, the machine utilization rate also increases. The variable factors for each production unit are integrated, and the minimum value of the integrated factor is calculated to obtain the objective function.

[0058] According to embodiments of this disclosure, under preset constraints, linear programming is performed on the decision variables representing the output ratio in the objective function to obtain the planning result. The preset constraints include the range of values ​​associated with the decision variables, and restrictions on the output ratio and production steps. By establishing variable factors for calculating the utilization rate of machines in the production machine group, and performing linear programming on the objective function constructed based on multiple variable factors, the allocation of the output ratio in the final planning result is more reasonable.

[0059] According to embodiments of this disclosure, based on production demand and machine information, a variable factor corresponding to each production unit is generated, including: for each production unit, constructing a production factor based on production demand and decision variables representing the proportion of output, wherein the production factor is used to calculate the number of chips that the production unit needs to produce in each production step; dividing the production factor by the production efficiency of the machines in the machine information to obtain a demand factor; and dividing the demand factor by the total number of machines in the production units in the machine information to obtain a variable factor for the utilization rate of computer machines.

[0060] According to embodiments of this disclosure, based on production demand and decision variables characterizing the output ratio, a production factor is constructed to calculate the number of chips the production unit needs to produce at each production step. The specific factor is as follows:

[0061]

[0062] Where, x ij Identify the decision variables, where i represents the i-th production unit, j represents the j-th production step, and Capa_Req j RPT represents the output demand in the j-th production step. ij BS represents the standard processing time for a single batch or single piece in the j-th production step of the i-th production unit. ij This indicates the batch size of the j-th production step in the i-th production unit, and 60·60·24 represents the conversion to time / day units.

[0063] According to embodiments of this disclosure, the demand factor is obtained by dividing the output factor by the production efficiency of the machine in the machine information, as follows:

[0064]

[0065] Among them, OEE i Req represents the production efficiency of the machines in the i-th production machine group. i This indicates the number of machines required for the i-th production machine group to produce chips.

[0066] According to embodiments of this disclosure, the demand factor is divided by the total number of production units in the machine information to obtain the variable factor for the utilization rate of computer machines. The specific factor is as follows:

[0067]

[0068] Among them, F i This represents the utilization rate of the machines in the i-th production unit. (Installed) i This represents the total number of machines in the i-th production unit.

[0069] According to embodiments of this disclosure, if F i A value greater than 1 indicates that the number of currently installed machines is insufficient to meet the chip production needs, requiring the addition of new machines. By planning the production ratio based on machine utilization, the utilization rate of machines can be maximized while completing the current chip production, thereby reducing the need for additional machines and improving production efficiency.

[0070] According to embodiments of this disclosure, multiple variable factors are integrated to construct an objective function, including: summing the multiple variable factors to obtain a summed factor; dividing the summed factor by the total number of production units to obtain an average factor; subtracting the average factor from each of the multiple variable factors to obtain a difference assessment factor characterizing the difference between the variable factors and the average factor; and constructing an objective function based on the summed factor and the difference assessment factor.

[0071] According to embodiments of this disclosure, multiple variable factors are summed to calculate the total utilization rate of multiple production units. The summation factor can be represented as sum(F) i The average utilization rate of each production unit is obtained by dividing the summed factor by the total number of production units. The average factor can be represented as... The differences between the variable factors and the mean factor are determined by successively subtracting the variable factors from the mean factor. The difference assessment factor can be characterized as follows: .

[0072] According to embodiments of this disclosure, the objective function is constructed based on the difference evaluation factor and the cumulative factor, that is, the production ratio is planned from the perspective of the overall utilization rate of the machine and the load balancing among multiple machines, so that the planning result is more reasonable.

[0073] According to embodiments of this disclosure, constructing an objective function based on a cumulative factor and a difference assessment factor includes: introducing an auxiliary variable to characterize the difference between the variable factor and the average factor; performing a linear transformation on the difference assessment factor based on the auxiliary variable to obtain a difference transformation factor; and summing the cumulative factor and the difference transformation factor to obtain the objective function.

[0074] According to embodiments of this disclosure, since the difference assessment factor is a non-linear factor, it is not convenient to optimize the function. Therefore, the non-linear factor can be converted into a linear factor. An auxiliary variable z is introduced to characterize the difference between the variable factor and the average factor. i .in, Based on the auxiliary variables, a linear transformation is performed on the difference assessment factor to obtain the difference transformation factor, as follows:

[0075]

[0076] According to embodiments of this disclosure, the objective function is obtained by summing the cumulative factors and the difference transformation factors. The objective function is a linear function. Specifically, the factors of the objective function are as follows:

[0077]

[0078] According to embodiments of this disclosure, by calculating the minimum value of the difference transformation factor and the sum of the cumulative factors, the production ratio is planned from the perspective of the overall utilization of the machine and the load balancing among multiple machines, so that the production ratio is more reasonable and the load is minimized while completing the chip production task.

[0079] According to embodiments of this disclosure, the preset constraints include constraints corresponding to decision variables and constraints corresponding to auxiliary variables; the constraints corresponding to decision variables include a preset range of values ​​for the decision variables and the sum of the decision variables in multiple production steps being a preset value; the constraints corresponding to auxiliary variables include the auxiliary variables being greater than the absolute value of the result of the difference transformation factor calculation.

[0080] According to embodiments of this disclosure, since the decision variable represents the proportion of output, one of the constraints corresponding to the decision variable is that its value is between 0 and 100. This translates to the expression: 0 ≤ x ij ≤100. Furthermore, since the sum of the output proportions of multiple production units for each production step must be exactly 100%, another constraint expression corresponding to the decision variable can be determined as follows:

[0081]

[0082] According to embodiments of this disclosure, the constraint condition corresponding to the auxiliary variable includes that the auxiliary variable is greater than the absolute value of the result of the difference transformation factor calculation, which can be specifically expressed as: and It can also be expressed as By setting constraints for both the decision variables and the auxiliary variables, the feasibility of the planned output ratio can be ensured.

[0083] According to embodiments of this disclosure, to verify the performance of the above method in planning the production ratio in the objective function, simulation tests were conducted on data of different scales. The results are as follows: For 600 rows of data, the solution time was 0.863 seconds, successfully finding a planning result that meets the preset conditions. For 700 rows of data, the solution time was 0.625 seconds, successfully finding a planning result that meets the preset conditions. For 900 rows of data, the solution time was 0.792 seconds, successfully finding a planning result that meets the preset conditions. For data with up to 10,000 rows, the algorithm can complete the solution within 10 seconds and find a planning result that meets the preset conditions. The above test results fully demonstrate the efficiency and stability of using the objective function to process large-scale data, providing a reliable optimization tool for semiconductor chip production management.

[0084] Figure 4 The illustration schematically depicts a scenario of machine control in a chip manufacturing method according to an embodiment of the present disclosure.

[0085] According to embodiments of this disclosure, the machines in each production machine group are controlled based on the planning results so that the machines can produce chips based on the production output ratio. This includes: for each production machine group, sending production instructions to the machines in the production group according to the production output ratio of the production group in each production step in the planning results, so as to control each machine to produce chips based on the production output ratio.

[0086] According to embodiments of this disclosure, the planning results output by the objective function can be presented in a tabular form, as shown in Table 3, to determine the output ratio of each production unit in each production step.

[0087] Table 3

[0088]

[0089] According to embodiments of this disclosure, after determining the output ratio of each production unit, production instructions are sent to multiple production units, wherein the production instructions include the output ratio for different production steps. For example... Figure 4 As shown, server 410 sends production instructions to multiple machines in production group 1 and multiple machines in production group 2, respectively. The production steps and output ratios can be communicated to the machines in key-value pairs. By controlling the machines to produce chips according to the output ratios, chip production is automated, thereby improving chip production efficiency.

[0090] Figure 5 A block diagram of a chip manufacturing apparatus according to an embodiment of the present disclosure is shown schematically.

[0091] like Figure 5As shown, the chip manufacturing apparatus 500 includes a data retrieval module 510, a proportional planning module 520, and a production control module 530.

[0092] The data retrieval module 510 is used to retrieve the data file for chip production in response to the received chip production request. The data file includes the production requirements of the chip at different production steps and the machine information of multiple production units.

[0093] The proportional planning module 520 is used to analyze production requirements and machine information to plan the output ratio of the production unit in each production step according to the constructed objective function, and obtain the planning result. The objective function is constructed based on the utilization rate of the machines in each production machine group when producing chips.

[0094] The production control module 530 is used to control the machines in each production machine group according to the planning results when the planning results meet the preset conditions, so that the machines can produce chips based on the production output ratio. The preset conditions are that the utilization rate of the machines reaches the minimum when producing chips based on the production output ratio, and the difference in utilization rate between multiple production machine groups reaches the minimum.

[0095] According to embodiments of this disclosure, the proportional programming module 520 includes a factoring generation submodule, a factoring integration submodule, and a proportional programming submodule.

[0096] The factor generation submodule is used to generate variable factors corresponding to each production unit based on production demand and machine information. The variable factors are used to calculate the utilization rate of machines in the production machine group, and the decision variable in the variable factors is the output ratio of the production unit in each production step.

[0097] The factor integration submodule is used to integrate multiple variable factors to complete the construction of the objective function.

[0098] The proportional programming submodule is used to perform linear programming on the decision variables representing the proportion of output in the objective function under preset constraints, and obtain the planning results.

[0099] According to embodiments of this disclosure, the factorization submodule includes a production generation unit, a demand determination unit, and a variable determination unit.

[0100] The production capacity building unit is used to construct a production capacity factor for each production unit based on production demand and decision variables representing the production capacity ratio. The production capacity factor is used to calculate the number of chips that the production unit needs to produce in each production step.

[0101] The demand determination unit is used to divide the output factor by the production efficiency of the machine in the machine information to obtain the demand factor.

[0102] The variable determination unit is used to divide the demand factor by the total number of production units in the machine information to obtain the variable factor for the utilization rate of computer machines.

[0103] According to embodiments of this disclosure, the factorization integration submodule includes an accumulation determination unit, an average determination unit, an evaluation determination unit, and a target determination unit.

[0104] The cumulative determination unit is used to accumulate multiple variable factors to obtain the cumulative factor.

[0105] The average determination unit is used to divide the cumulative factor by the total number of production units to obtain the average factor.

[0106] The evaluation determination unit is used to successively subtract multiple variable factors from the mean factor to obtain the difference evaluation factor that characterizes the difference between the variable factors and the mean factor.

[0107] The objective determination unit is used to construct the objective function based on the cumulative factor and the difference evaluation factor.

[0108] According to embodiments of this disclosure, the target determination unit includes a variable introduction subunit, a linear transformation subunit, and a factoring subunit.

[0109] The variable introduction sub-unit is used to introduce auxiliary variables that characterize the difference between the variable factor and the average factor.

[0110] The linear transformation subunit performs a linear transformation on the difference assessment factor based on the auxiliary variable to obtain the difference transformation factor.

[0111] The factor summation subunit is used to sum the cumulative factors and the difference transformation factors to obtain the objective function.

[0112] According to embodiments of this disclosure, the preset constraints include constraints corresponding to decision variables and constraints corresponding to auxiliary variables; the constraints corresponding to decision variables include a preset range of values ​​for the decision variables and the sum of the decision variables in multiple production steps being a preset value; the constraints corresponding to auxiliary variables include the auxiliary variables being greater than the absolute value of the result of the difference transformation factor calculation.

[0113] According to an embodiment of this disclosure, the production control module 530 includes an instruction sending submodule.

[0114] The instruction sending submodule is used to send production instructions to the machines in each production unit according to the production output ratio of the production unit in each production step in the planning results, so as to control each machine to produce chips based on the output ratio.

[0115] Any one or more of the modules, submodules, units, and subunits according to embodiments of the present disclosure, or at least part of the functions of any one or more of them, can be implemented in one module. Any one or more of the modules, submodules, units, and subunits according to embodiments of the present disclosure can be implemented by dividing them into multiple modules. Any one or more of the modules, submodules, units, and subunits according to embodiments of the present disclosure can be at least partially implemented as hardware circuitry, such as a Field-Programmable Gate Array (FPGA), a Programmable Logic Array (PLA), a System-on-Chip, a System-on-a-Substrate, a System-on-Package, an Application-Specific Integrated Circuit (ASIC), or implemented in hardware or firmware by any other reasonable means of integrating or packaging circuitry, or implemented in software, hardware, or firmware, or in any suitable combination of any of these three implementation methods. Alternatively, one or more of the modules, submodules, units, and subunits according to embodiments of the present disclosure can be at least partially implemented as computer program modules, which, when run, can perform corresponding functions.

[0116] For example, any plurality of the data retrieval module 510, the proportional planning module 520, and the production control module 530 can be combined into one module / unit / subunit, or any one of these modules / units / subunits can be split into multiple modules / units / subunits. Alternatively, at least part of the functionality of one or more of these modules / units / subunits can be combined with at least part of the functionality of other modules / units / subunits and implemented in one module / unit / subunit. According to embodiments of this disclosure, at least one of the data retrieval module 510, the proportional planning module 520, and the production control module 530 can be at least partially implemented as hardware circuitry, such as a field-programmable gate array (FPGA), a programmable logic array (PLA), a system-on-a-chip, a system-on-a-substrate, a system-on-package, an application-specific integrated circuit (ASIC), or any other reasonable means of integrating or packaging the circuitry, or implemented in software, hardware, or firmware, or in any suitable combination of any of these three implementation methods. Alternatively, at least one of the data retrieval module 510, the proportional planning module 520, and the production control module 530 may be at least partially implemented as a computer program module, which can perform corresponding functions when the computer program module is run.

[0117] It should be noted that the chip manufacturing apparatus section in the embodiments of this disclosure corresponds to the chip manufacturing method section in the embodiments of this disclosure. For a detailed description of the chip manufacturing apparatus section, please refer to the chip manufacturing method section, which will not be repeated here.

[0118] Figure 6A block diagram of an electronic device suitable for implementing a chip manufacturing method according to an embodiment of the present disclosure is shown schematically. Figure 6 The electronic device shown is merely an example and should not be construed as limiting the functionality and scope of the embodiments disclosed herein.

[0119] like Figure 6 As shown, an electronic device 600 according to an embodiment of this disclosure includes a processor 601, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 602 or a program loaded from a storage portion 608 into a random access memory (RAM) 603. The processor 601 may include, for example, a general-purpose microprocessor (e.g., a CPU), an instruction set processor and / or an associated chipset and / or a special-purpose microprocessor (e.g., an application-specific integrated circuit (ASIC)), etc. The processor 601 may also include onboard memory for caching purposes. The processor 601 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of this disclosure.

[0120] RAM 603 stores various programs and data required for the operation of electronic device 600. Processor 601, ROM 602, and RAM 603 are interconnected via bus 604. Processor 601 performs various operations of the method flow according to embodiments of the present disclosure by executing programs in ROM 602 and / or RAM 603. It should be noted that programs may also be stored in one or more memories other than ROM 602 and RAM 603. Processor 601 may also perform various operations of the method flow according to embodiments of the present disclosure by executing programs stored in one or more memories.

[0121] According to embodiments of this disclosure, the electronic device 600 may further include an input / output (I / O) interface 605, which is also connected to a bus 604. The electronic device 600 may also include one or more of the following components connected to the input / output (I / O) interface 605: an input section 606 including a keyboard, mouse, etc.; an output section 607 including a cathode ray tube (CRT), liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 608 including a hard disk, etc.; and a communication section 609 including a network interface card such as a LAN card, modem, etc. The communication section 609 performs communication processing via a network such as the Internet. A drive 610 is also connected to the input / output (I / O) interface 605 as needed. A removable medium 611, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., is installed on the drive 610 as needed so that computer programs read from it can be installed into the storage section 608 as needed.

[0122] According to embodiments of this disclosure, the method flow according to embodiments of this disclosure can be implemented as a computer software program. For example, embodiments of this disclosure include a computer program product comprising a computer program carried on a computer-readable storage medium, the computer program containing program code for performing the methods shown in the flowchart. In such embodiments, the computer program can be downloaded and installed from a network via communication section 609, and / or installed from removable medium 611. When the computer program is executed by processor 601, it performs the functions defined in the system of embodiments of this disclosure. According to embodiments of this disclosure, the systems, devices, apparatuses, modules, units, etc., described above can be implemented by computer program modules.

[0123] This disclosure also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiments; or it may exist independently and not assembled into the device / apparatus / system. The computer-readable storage medium carries one or more programs that, when executed, implement the method according to the embodiments of this disclosure.

[0124] According to embodiments of this disclosure, the computer-readable storage medium can be a non-volatile computer-readable storage medium. Examples include, but are not limited to: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this disclosure, the computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0125] For example, according to embodiments of this disclosure, a computer-readable storage medium may include the ROM 602 and / or RAM 603 described above and / or one or more memories other than ROM 602 and RAM 603.

[0126] Embodiments of this disclosure also include a computer program product comprising a computer program containing program code for performing the methods provided in the embodiments of this disclosure. When the computer program product is run on an electronic device, the program code is used to enable the electronic device to implement the chip manufacturing method provided in the embodiments of this disclosure.

[0127] When the computer program is executed by the processor 601, it performs the functions defined in the system / apparatus of this disclosure embodiments. According to embodiments of this disclosure, the systems, apparatuses, modules, units, etc., described above can be implemented by computer program modules.

[0128] In one embodiment, the computer program may rely on a tangible storage medium such as an optical storage device or a magnetic storage device. In another embodiment, the computer program may also be transmitted and distributed in the form of signals over a network medium, and downloaded and installed via the communication section 609, and / or installed from the removable medium 611. The program code contained in the computer program can be transmitted using any suitable network medium, including but not limited to: wireless, wired, etc., or any suitable combination thereof.

[0129] According to embodiments of this disclosure, program code for executing the computer programs provided in embodiments of this disclosure can be written in any combination of one or more programming languages. Specifically, these computational programs can be implemented using high-level procedural and / or object-oriented programming languages, and / or assembly / machine languages. Programming languages ​​include, but are not limited to, languages ​​such as Java, C++, Python, "C", or similar programming languages. The program code can execute entirely on a user's computing device, partially on a user's device, partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0130] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram or flowchart, and combinations of blocks in a block diagram or flowchart, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions. Those skilled in the art will understand that the features described in the various embodiments of the present disclosure can be combined and / or combined in various ways, even if such combinations are not explicitly described in the present disclosure. In particular, the features described in the various embodiments of this disclosure may be combined and / or combined in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or combinations fall within the scope of this disclosure.

[0131] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.

Claims

1. A chip manufacturing method, comprising: In response to a received chip production request, a data file for chip production is retrieved, wherein the data file includes the chip production requirements at different production steps and machine information for multiple production units; The production demand and the machine information are analyzed to plan the output ratio of the production unit in each production step according to the constructed objective function, and the planning result is obtained. The objective function is constructed based on the utilization rate of the machines in each production unit when producing the chip. If the planning result meets the preset conditions, the machines in each production unit are controlled according to the planning result so that the machines can produce the chips based on the production ratio. The preset conditions are that the utilization rate of the machines reaches the minimum when the chips are produced based on the production ratio, and the difference in utilization rates between multiple production units reaches the minimum.

2. The method according to claim 1, wherein, The analysis of the production demand and the machine information, to plan the output ratio of the production unit in each production step according to the constructed objective function, and to obtain the planning result, includes: Based on the production demand and the machine information, a variable factor corresponding to each production unit is generated, wherein the variable factor is used to calculate the utilization rate of the machines in the production unit, and the decision variable in the variable factor is the output ratio of the production unit in each production step; The multiple variable factors are integrated to complete the construction of the objective function; Under preset constraints, linear programming is performed on the decision variables representing the output ratio in the objective function to obtain the planning results.

3. The method according to claim 2, wherein, The step of generating variable factors corresponding to each production unit based on the production demand and the machine information includes: For each production unit, a production factor is constructed based on the production demand and the decision variables characterizing the output ratio, wherein the production factor is used to calculate the number of chips that the production unit needs to produce in each production step; The demand factor is obtained by dividing the output factor by the production efficiency of the machine in the machine information. The demand factor is divided by the total number of production units in the machine information to obtain the variable factor used to calculate the utilization rate of the machine.

4. The method according to claim 2, wherein, The process of integrating multiple variable factors to construct the objective function includes: The summation of multiple variable factors yields the summation factor. The average factor is obtained by dividing the summation factor by the total number of production units. The difference between the multiple variable factors and the average factor is calculated sequentially to obtain the difference assessment factor that characterizes the difference between the variable factors and the average factor; The objective function is constructed based on the summation factor and the difference evaluation factor.

5. The method according to claim 4, wherein, The construction of the objective function based on the cumulative factor and the difference evaluation factor includes: Introduce auxiliary variables that characterize the difference between the variable factor and the average factor; Based on the auxiliary variables, the difference assessment factor is linearly transformed to obtain the difference transformation factor; The objective function is obtained by summing the accumulated factors and the difference transformation factors.

6. The method according to claim 5, wherein, The preset constraints include constraints corresponding to the decision variables and constraints corresponding to the auxiliary variables; The constraints corresponding to the policy variables include a preset range of values ​​for the policy variables, and the sum of the policy variables in multiple production steps being a preset value; The constraints corresponding to the auxiliary variable include that the auxiliary variable is greater than the absolute value of the result of the difference transformation factor calculation.

7. The method according to claim 1, wherein, The step of controlling the machines in each production unit according to the planning results, so that the machines can produce the chips based on the production output ratio, includes: For each production unit, a production instruction is sent to the machines in the production unit according to the production output ratio of the production unit in each production step in the planning results, so as to control each machine to produce the chip based on the production output ratio.

8. A chip manufacturing apparatus, comprising: The data retrieval module is used to retrieve data files for chip production in response to a received chip production request. The data files include the chip production requirements at different production steps and machine information for multiple production units. The proportional planning module is used to analyze the production requirements and the machine information to plan the output ratio of the production unit in each production step according to the constructed objective function, and obtain the planning result. The objective function is constructed based on the utilization rate of the machines in each production unit when producing the chip. The production control module is used to control the machines in each production unit according to the planning results when the planning results meet preset conditions, so that the machines can produce the chips based on the production output ratio. The preset conditions are that the utilization rate of the machines reaches the minimum when the chips are produced based on the production output ratio, and the difference in utilization rates between multiple production units reaches the minimum.

9. An electronic device, comprising: One or more processors; Memory, used to store one or more programs. Wherein, when the one or more programs are executed by the one or more processors, the one or more processors implement the method of any one of claims 1 to 7.

10. A computer-readable storage medium having executable instructions stored thereon, which, when executed by a processor, cause the processor to perform the method of any one of claims 1 to 7.

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