Memory device and forming method thereof
By setting a dielectric protection ring in the memory device to isolate transistors of different conductivity types, the doping diffusion problem caused by heat treatment in semiconductor device manufacturing is solved, and the effect of improving gate stability and yield is achieved.
Patent Information
- Application Number
- CN202410042946.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-10-25
- Filing Date
- 2024-01-11
- Publication Date
- 2025-04-29
AI Technical Summary
As the size of the semiconductor device shrinks, the difficulty of manufacturing a semiconductor device increases, and unwanted defects are easily generated, resulting in reduced device performance or damage. It is difficult for the prior art to effectively solve this problem.
By providing a dielectric protection ring in the memory device, transistors with different conductivity types are separated, and doping diffusion is avoided by subsequent heat treatment, thereby improving gate stability.
It effectively avoids doping diffusion caused by heat treatment, improves the gate stability of the memory device, and improves the yield and process margin.
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Figure CN119907244A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to semiconductor manufacturing technology, and more particularly to a memory device and a method for forming the same. Background Art
[0002] As the size of semiconductor devices shrinks, the difficulty of manufacturing semiconductor devices has also increased significantly. Unwanted defects may occur during the process of semiconductor devices, which may cause the performance of the device to be reduced or damaged. Therefore, it is necessary to continuously improve semiconductor devices to increase the yield rate and improve the process margin. Summary of the invention
[0003] The present invention provides a memory device. The memory device includes a substrate, an isolation structure, a first transistor, a second transistor, a first guard ring and a dielectric guard ring. The substrate has a first region and a second region adjacent to each other. The isolation structure is buried in the substrate. The first transistor is disposed above the first region of the substrate and has a first conductivity type. The second transistor is disposed above the second region of the substrate and has a second conductivity type, which is different from the first conductivity type. The first guard ring is disposed above the first region of the substrate and surrounds the first transistor, wherein the first guard ring includes the same material as the first transistor and has the first conductivity type. The dielectric guard ring is disposed above the substrate and surrounds the first guard ring.
[0004] The present invention provides a method for forming a memory device. The method comprises forming a gate material layer having a first conductivity type over a first region and a second region of a substrate; shielding the gate material layer over the first region of the substrate and injecting the gate material layer over the second region of the substrate so that the gate material layer over the second region has a second conductivity type, which is different from the first conductivity type; forming a groove in the gate material layer at the interface between the first region and the second region; performing a heat treatment after forming the groove; and etching the gate material layer on both sides of the groove after the heat treatment to form a first transistor over the first region and a second transistor over the second region.
[0005] The memory device provided by the embodiment of the present invention separates transistors with different conductivity types through a dielectric guard ring, thereby preventing dopant diffusion caused by subsequent heat treatment, thereby improving gate stability. BRIEF DESCRIPTION OF THE DRAWINGS
[0006] Figure 1A to Figure 1D Cross-sectional views are shown of various stages in forming a memory device according to some embodiments of the present invention.
[0007] Figure 2 A top view of a memory device is shown according to some embodiments of the present invention.
[0008] Figure 3Some other embodiments of the present invention are shown in top view of a memory device.
[0009] Reference numerals:
[0010] 100,200: memory device
[0011] 100A: Zone 1
[0012] 100B: Zone 2
[0013] 102: substrate
[0014] 104: Isolation Structure
[0015] 106: Gate dielectric layer
[0016] 108: floating gate
[0017] 108A,112A:Part 1
[0018] 108B,112B:Part 2
[0019] 110: inter-gate dielectric layer
[0020] 110A: Open
[0021] 112: Control gate
[0022] 114: Mask layer
[0023] 116: Injection process
[0024] 118:Metal Gate
[0025] 120,122: Insulation film
[0026] 124,126A,126B: Groove
[0027] 128: First protection ring
[0028] 130: Second protection ring
[0029] 132: Dielectric layer
[0030] 132A: Dielectric guard ring
[0031] 150A: First transistor
[0032] 150B: Second transistor
[0033] 250A1, 250A2, 250A3, 250A4, 250B: Transistor
[0034] I-I': line
[0035] W1,W2,W3,W4,W5: Width DETAILED DESCRIPTION
[0036] The following describes a memory device and a method for forming the same according to some embodiments of the present invention, and is particularly applicable to a flash memory device. The memory device according to an embodiment of the present invention includes a dielectric guard ring that can separate transistors with different conductivity types to avoid defects caused by subsequent thermal processing, thereby improving gate stability.
[0037] Figure 1A to Figure 1D Some embodiments of the present invention depict cross-sectional views of various stages of forming a memory device 100. Additional components may be added to the memory device 100. Some components described below may be replaced or eliminated for different embodiments. To simplify the drawing, only a portion of the memory device 100 is depicted.
[0038] Reference Figure 1A , the memory device 100 includes a substrate 102. The substrate 102 may use any substrate material suitable for a memory device, and may be a whole semiconductor substrate or a composite substrate formed of different materials. One or more semiconductor elements (including active elements and / or passive elements) may be pre-formed on the substrate 102. To simplify the diagram, only a flat substrate 102 is shown here. According to some embodiments, the substrate 102 has a memory array region and a peripheral circuit region, and only the peripheral circuit region is shown here.
[0039] An isolation structure 104 is formed in the substrate 102. The isolation structure 104 may be formed by etching a trench in the substrate 102 using an etching process, and then filling the trench with a material of the isolation structure 104 using a deposition process. The deposition process may include a chemical vapor deposition process (CVD), a plasma-enhanced chemical vapor deposition process (PECVD), an atomic layer deposition process (ALD), a similar process, or a combination thereof. The material of the isolation structure 104 may include a dielectric material, such as silicon oxide, silicon nitride, silicon oxynitride, a similar material, or a combination thereof. According to some embodiments, the isolation structure 104 may include a multilayer structure, such as a dielectric liner.
[0040] A gate dielectric layer 106 is formed over the substrate 102. The gate dielectric layer 106 may be formed by a diffusion or deposition process, such as a high temperature oxidation process, a wet oxidation process, CVD, PECVD, ALD, a similar process, or a combination thereof. The material of the gate dielectric layer 106 may include an oxide, such as silicon oxide, or may include any suitable material.
[0041] A gate material layer having a first conductivity type may be formed over the gate dielectric layer 106. For example, a floating gate 108, an inter-gate dielectric layer 110, and a control gate 112 may be sequentially formed over the gate dielectric layer 106.
[0042] The floating gate 108 may be formed by a deposition process such as CVD, PECVD, ALD, a similar process or a combination thereof. The material of the floating gate 108 may include any suitable material, such as polysilicon. The material of the floating gate 108 may be implanted with n-type or p-type dopants. The p-type dopant is, for example, boron. The n-type dopant is, for example, phosphorus or arsenic.
[0043] The intergate dielectric layer 110 may be interposed between the floating gate 108 and the control gate 112 and directly contact the floating gate 108 and the control gate 112. Figure 1A As shown, the intergate dielectric layer 110 covers the top surface and sidewalls of the floating gate 108 and extends to the top surface of the isolation structure 104. The intergate dielectric layer 110 may have one or more openings 110A exposing a portion of the floating gate 108.
[0044] The inter-gate dielectric layer 110 may be formed by a deposition process, such as CVD, PECVD, ALD, a similar process or a combination thereof. In some embodiments, the material of the inter-gate dielectric layer 110 may include any suitable material, such as an oxide-nitride-oxide structure having a silicon nitride layer sandwiched between two silicon oxide layers. In other embodiments, the material of the inter-gate dielectric layer 110 may be a single-layer material, such as a single-layer oxide layer or a single-layer nitride layer.
[0045] The control gate 112 may be disposed above the inter-gate dielectric layer 110 and extend through the opening 110A. In the opening 110A, the control gate 112 may contact the floating gate 108. The control gate 112 may be formed by a deposition process such as CVD, PECVD, ALD, a similar process or a combination thereof. The material of the control gate 112 may include a conductive material such as polysilicon, and may be doped with n-type or p-type dopants. An annealing process may be performed to activate the implanted dopants.
[0046] Thereafter, a mask layer 114 may be formed over the control gate 112 to shield a first portion 112A of the control gate 112 over the first region 100A of the substrate 102 and a memory array region (not shown), and to expose a second portion 112B of the control gate 112 over the second region 100B of the substrate 102. The second region 100B may surround the first region 100A. The mask layer 114 may include a photoresist, a hard mask, or a combination thereof, and may be a single-layer or multi-layer structure.
[0047] The mask layer 114 may be formed by a deposition process, a photolithography process, other suitable processes or a combination thereof. In some embodiments, the deposition process includes spin coating, CVD, ALD, similar processes or a combination thereof. For example, the photolithography process may include photoresist coating, soft baking, mask lithography, exposure, post-exposure baking, development, cleaning, drying (e.g., hard baking), other suitable processes or a combination thereof.
[0048] Next, different dopants may be used to perform an implantation process 116 on the floating gate 108 and the control gate 112, so that the floating gate 108 and the control gate 112 above the exposed second region 100B have a second conductivity type different from the first conductivity type. For example, the first conductivity type may be p-type, and the second conductivity type may be n-type.
[0049] Specifically, the first portion 108A of the floating gate 108 may have a first conductivity type, and the second portion 108B may have a second conductivity type. The second portion 108B of the floating gate 108 may surround the first portion 108A. The first portion 112A of the control gate 112 may have a first conductivity type, and the second portion 112B may have a second conductivity type. The second portion 112B of the control gate 112 may surround the first portion 112A.
[0050] Afterwards, if Figure 1B As shown, the mask layer 114 is removed. Then, a metal gate 118 is formed over the control gate 112. The metal gate 118 may be formed by a deposition process such as CVD, PECVD, ALD, a similar process or a combination thereof. The material of the metal gate 118 may include a metal material such as tungsten or any suitable material.
[0051] Thereafter, insulating films 120 and 122 are formed over the metal gate 118. The insulating films 120 and 122 may be formed by the same or different deposition processes, such as CVD, PECVD, ALD, similar processes, or a combination thereof. The materials of the insulating films 120 and 122 may include the same or different materials, for example, the material of the insulating film 120 may include a nitride (e.g., silicon nitride) and the material of the insulating film 122 may include an oxide (e.g., silicon oxide). In addition, the two layers of insulating films 120 and 122 are only examples, and the memory device 100 may also include more or fewer layers of insulating films.
[0052] Thereafter, a trench 124 is formed through the insulating films 120, 122, the metal gate 118, and the control gate 112, and exposes a portion of the inter-gate dielectric layer 110. The trench 124 may be located directly above the isolation structure 104 and separates a first portion 112A of the control gate 112 having a first conductivity type from a second portion 112B of the control gate 112 having a second conductivity type. Therefore, it is possible to prevent subsequent heat treatment processes from causing dopant diffusion and affecting gate stability of the memory device 100.
[0053] The formation of the groove 124 can be achieved by setting a mask layer (not shown) above the insulating film 122, and then using the mask layer as an etching mask to perform an etching process. The material and formation method of the mask layer can refer to the material and formation method of the aforementioned mask layer 114, so they are not repeated here. The etching process may include a dry etching process, a wet etching process, or a combination thereof. For example, the dry etching process may include reactive ion etching (RIE), inductively-coupled plasma (ICP) etching, neutral beam etching (NBE), similar etching processes, or a combination thereof. For example, the wet etching process may use any suitable etchant, such as hydrofluoric acid, ammonium hydroxide, or a similar material.
[0054] Thereafter, one or more thermal treatments are performed on the memory device 100. Then, as shown in FIG. Figure 1C As shown, a patterning process is performed to form a first transistor 150A and a second transistor 150B respectively on the first region 100A and the second region 100B of the substrate 100. The patterning process may include setting a mask layer (not shown) on the insulating film 122, and then performing an etching process using the mask layer as an etching mask. The material of the mask layer, the formation method, and the example of the etching process are described above, so they are not repeated here.
[0055] According to some embodiments, during the formation of the first transistor 150A and the second transistor 150B, the trenches 126A and 126B are formed to surround the first transistor 150A and the second transistor 150B, respectively. The trenches 126A and 126B may be formed in the same process. Therefore, the first guard ring 128 surrounding the first transistor 150A and the second guard ring 130 surrounding the first guard ring 128 may be formed at the same time without an additional process. In addition, the trenches 126A and 126B may expose a portion of the intergate dielectric layer 110.
[0056] According to some embodiments, the first guard ring 128 and the second guard ring 130 may include the same material as the first transistor 150A and the second transistor 150B. Specifically, the first guard ring 128 and the second guard ring 130 may each include a portion of the control gate 112, the metal gate 118, and the insulating films 120, 122. For example, the first guard ring 128 and the second guard ring 130 may each include polysilicon, tungsten, nitride, and oxide. The first guard ring 128 and the second guard ring 130 may be located above the inter-gate dielectric layer 110 above the isolation structure 104.
[0057] like Figure 1C As shown, the first guard ring 128 is located above the first region 100A of the substrate 100 and has the same first conductivity type as the first transistor 150A. The second guard ring 130 is located above the second region 100B of the substrate 100 and has the same second conductivity type as the second transistor 150B.
[0058] Afterwards, if Figure 1D As shown, a dielectric layer 132 is formed to cover the first transistor 150A, the second transistor 150B, the first guard ring 128 and the second guard ring 130, and extend into the trenches 124, 126A and 126B. The material of the dielectric layer 132 may include a dielectric material, such as silicon oxide, silicon nitride, silicon oxynitride, similar materials or combinations thereof. The dielectric layer 132 may be formed by any suitable deposition process, such as CVD, PECVD, ALD, similar processes or combinations thereof.
[0059] The dielectric layer 132 in the trench 124 may form a dielectric guard ring 132A that separates the first guard ring 128 and the second guard ring 130. In a direction parallel to the top surface of the substrate 102, the width W1 of the dielectric guard ring 132A may be substantially equal to the width W2 of the first guard ring 128. For example, the ratio of the width W1 of the dielectric guard ring 132A to the width W2 of the first guard ring 128 may be about 0.9 to about 1.1, such as about 1. Similarly, the width W1 of the dielectric guard ring 132A may be substantially equal to the width W3 of the second guard ring 130. For example, the ratio of the width W1 of the dielectric guard ring 132A to the width W3 of the second guard ring 130 may be about 0.5 to about 2, such as about 1.
[0060] The width W2 of the first guard ring 128 may be substantially equal to the width W3 of the second guard ring 130. For example, the ratio of the width W2 of the first guard ring 128 to the width W3 of the second guard ring 130 may be about 0.8 to about 1.2, such as about 1.
[0061] A width W4 separating the first guard ring 128 from the first transistor 150A may be greater than a width W1 of the dielectric guard ring 132A, greater than a width W2 of the first guard ring 128, and greater than a width W3 of the second guard ring 130. A width W5 separating the second guard ring 130 from the second transistor 150B may be greater than a width W1 of the dielectric guard ring 132A, greater than a width W2 of the first guard ring 128, and greater than a width W3 of the second guard ring 130.
[0062] Figure 2 A top view of a memory device 100 is shown according to some embodiments. Figure 1D The memory device 100 may be along Figure 2 1 . In order to simplify the diagram, only a portion of the memory device 100 is shown. Figure 2 As shown, the dielectric guard ring 132A may surround the first guard ring 128 , and the second guard ring 130 may surround the dielectric guard ring 132A.
[0063] In the above-mentioned embodiment, by providing the trench 124 (ie, the dielectric guard ring 132A) surrounding the first transistor 150A, it is possible to prevent the thermal treatment process from causing dopants to diffuse and generate defects, such as affecting the gate stability of the first transistor 150A.
[0064] Figure 3 Other embodiments of the present invention depict top views of memory device 200. Additional components may be added to memory device 200. Some components described below may be replaced or eliminated for different embodiments. In the following embodiments, memory device 200 includes more than two transistors.
[0065] like Figure 3 As shown, according to some embodiments, the memory device 200 includes transistors 250A1, 250A2, 250A3, 250A4 disposed above a first region 100A of a substrate and a transistor 250B disposed above a second region 100B of the substrate. The transistors 250A1, 250A2, 250A3, 250A4 may have a first conductivity type, and the transistor 250B may have a second conductivity type different from the first conductivity type. For example, the first conductivity type may be a p-type, and the second conductivity type may be an n-type.
[0066] According to some embodiments, the memory device 200 includes a first guard ring 128 surrounding transistors 250A1, 250A2, 250A3, 250A4, a dielectric guard ring 132A surrounding the first guard ring 128, and a second guard ring 130 surrounding the dielectric guard ring 132A. The first guard ring 128 may be located above the first region 100A of the substrate and have a first conductivity type. The second guard ring 130 may be located above the second region 100B of the substrate and have a second conductivity type.
[0067] In the above-mentioned embodiment, by disposing the dielectric guard ring 132A surrounding the transistors 250A1 , 250A2 , 250A3 , and 250A4 , it is possible to prevent the thermal treatment process from causing dopants to diffuse and generate defects, such as affecting gate stability.
[0068] In summary, the memory device provided by the embodiment of the present invention separates transistors with different conductivity types through a dielectric guard ring, which can avoid dopant diffusion caused by subsequent heat treatment, thereby improving gate stability.
[0069] Although the present invention is described by way of example and according to preferred embodiments, it should be understood that the present invention is not limited to the disclosed embodiments. On the contrary, the present invention is intended to cover various variations and similar arrangements (which are obvious to those skilled in the art). Therefore, the appended claims should be given the broadest interpretation to cover all such variations and similar arrangements.
Claims
1. A memory device, characterized in that: include: A substrate having a first region and a second region adjacent to each other; an isolation structure buried in the substrate; a first transistor disposed above the first region of the substrate and having a first conductivity type; a second transistor disposed above the second region of the substrate and having a second conductivity type, the second conductivity type being different from the first conductivity type; a first guard ring disposed above the first region of the substrate and surrounding the first transistor, wherein the first guard ring comprises the same material as the first transistor and has the first conductivity type; and A dielectric guard ring is disposed above the substrate and surrounds the first guard ring.
2. The memory device according to claim 1, wherein: The first protection ring is disposed above the isolation structure.
3. The memory device according to claim 1, wherein: The first guard ring and the first transistor include polysilicon.
4. The memory device according to claim 1, wherein: Also includes: A second guard ring is disposed above the isolation structure and surrounds the dielectric guard ring, wherein the second guard ring comprises polysilicon.
5. The memory device according to claim 4, wherein: The second guard ring is disposed above the second region of the substrate and has the second conductivity type.
6. The memory device according to claim 4, wherein: In a direction parallel to the top surface of the substrate, a width of the second guard ring is substantially equal to a width of the first guard ring.
7. The memory device according to claim 1, wherein: Also includes: A third transistor is adjacent to the first transistor and has the first conductivity type, wherein the first guard ring surrounds the third transistor.
8. The memory device according to claim 1, wherein: The first transistor includes a floating gate, an inter-gate dielectric layer and a control gate, and the first guard ring is arranged above the inter-gate dielectric layer.
9. The memory device according to claim 1, wherein: In a direction parallel to the top surface of the substrate, a width of the dielectric guard ring is substantially equal to a width of the first guard ring.
10. The memory device according to claim 1, wherein: The first transistor and the second transistor are both located in the peripheral circuit.
11. A method for forming a memory device, characterized in that: include: Forming a gate material layer having a first conductivity type over a first region and a second region of a substrate; Shielding the gate material layer above the first region of the substrate and implanting the gate material layer above the second region of the substrate so that the gate material layer above the second region has a second conductivity type, which is different from the first conductivity type; forming a trench in the gate material layer at an interface between the first region and the second region; After forming the trench, performing a heat treatment; and After the heat treatment, the gate material layer on both sides of the trench is etched to form a first transistor above the first region and a second transistor above the second region.
12. The method for forming a memory device according to claim 11, wherein: During the formation of the first transistor and the second transistor, a first portion of the gate material layer forms a first guard ring, wherein the first guard ring surrounds the first transistor and has the first conductivity type.
13. The method for forming a memory device according to claim 12, wherein: During the formation of the first transistor and the second transistor, a second portion of the gate material layer forms a second guard ring, wherein the second guard ring surrounds the first guard ring and the trench is located between the first guard ring and the second guard ring.
14. The method for forming a memory device according to claim 13, wherein: The second guard ring is located above the second region of the substrate and has the second conductivity type.
15. The method for forming a memory device according to claim 11, wherein: The method further includes forming a dielectric layer covering the first transistor and the second transistor and extending into the trench.
16. The method for forming a memory device according to claim 11, wherein: The gate material layer includes an inter-gate dielectric layer sandwiched between a first conductive layer and a second conductive layer, and the trench exposes a first portion of the inter-gate dielectric layer.
17. The method for forming a memory device according to claim 16, wherein: After forming the first transistor and the second transistor, a second portion of the intergate dielectric layer between the trench and the first transistor is exposed.
18. The method for forming a memory device according to claim 16, wherein: The substrate has an isolation structure between the first transistor and the second transistor, and the inter-gate dielectric layer covers the isolation structure.
19. The method for forming a memory device according to claim 18, wherein: The trench is located above the isolation structure.
20. The method for forming a memory device according to claim 11, wherein: The first transistor and the second transistor are both located in the peripheral circuit.