Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel includes: a substrate; the first conductive layer is arranged on one side of the substrate, and the first conductive layer comprises a plurality of first conductive parts; the first insulating layer is arranged on the side, away from the substrate, of the first conductive layer, and the first insulating layer comprises a plurality of via holes; the isolation structure is arranged on the side, away from the substrate, of the first insulation layer, and a plurality of isolation openings and grooves are defined by the isolation structure; the light-emitting devices are arranged on the side, away from the substrate, of the first insulating layer, at least parts of the light-emitting devices are located in the corresponding isolation openings, and the light-emitting devices are connected with the corresponding first conductive parts through via holes; the protection part is arranged on the side, away from the substrate, of the isolation structure, and the orthographic projection of the protection part on the substrate covers the orthographic projection of the corresponding via hole on the substrate; the problem of poor display can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] OLED (Organic Light Emitting Diode) display panel is one of the hot topics in the current display panel research field. OLED display panel has the advantages of low energy consumption, low cost, self-luminescence, wide viewing angle and fast response speed.

[0003] However, the OLED display panel in the related art has the problem of poor display. Summary of the invention

[0004] Based on this, it is necessary to provide a display panel and a display device to improve the problem of poor display of OLED display panels.

[0005] According to a first aspect of the present application, a display panel is provided, comprising:

[0006] substrate;

[0007] A first conductive layer, disposed on one side of the substrate, the first conductive layer comprising a plurality of first conductive parts;

[0008] A first insulating layer, disposed on a side of the first conductive layer away from the substrate, the first insulating layer comprising a plurality of vias;

[0009] An isolation structure, disposed on a side of the first insulating layer away from the substrate, the isolation structure enclosing a plurality of isolation openings and grooves;

[0010] A plurality of light-emitting devices are arranged on a side of the first insulating layer away from the substrate, the light-emitting devices are at least partially located in the corresponding isolation openings, and the light-emitting devices are connected to the corresponding first conductive parts through the via holes;

[0011] A protection portion, disposed on a side of the isolation structure away from the substrate, wherein an orthographic projection of the protection portion on the substrate covers an orthographic projection of the corresponding via hole on the substrate;

[0012] Wherein, at least a portion of the protection portion is disposed in the groove.

[0013] In some embodiments, it further comprises:

[0014] An encapsulation layer, disposed on a side of the light emitting device away from the substrate;

[0015] The protection portion includes a first sub-layer, the first sub-layer and at least a portion of the encapsulation layer are formed in the same layer and made of the same material, and the first sub-layer is in direct contact with at least a portion of the sidewall of the groove.

[0016] In some embodiments, the isolation structure includes a support portion and a crown portion sequentially stacked on one side of the substrate;

[0017] Optionally, the groove includes a first sub-opening and a second sub-opening that are connected, the support portion encloses the first sub-opening, the crown portion encloses the second sub-opening, and the orthographic projection of the second sub-opening on the base is located within the orthographic projection range of the first sub-opening on the base;

[0018] On a plane parallel to the substrate, an area of ​​the first sub-opening is larger than an area of ​​the second sub-opening;

[0019] Optionally, on a plane perpendicular to the substrate, the first sub-opening passes through the support portion;

[0020] Optionally, on a plane perpendicular to the substrate, the first sub-opening passes through a portion of the support portion.

[0021] In some embodiments, in a direction perpendicular to the plane where the base is located, the groove runs through the crown portion and at least a portion of the support portion;

[0022] Optionally, in a direction perpendicular to the plane where the base is located, the groove passes through the support portion;

[0023] Optionally, the isolation structure further comprises a cushion portion, wherein the cushion portion, the support portion and the crown portion are sequentially stacked on one side of the base;

[0024] Optionally, in a direction perpendicular to the plane where the base is located, the groove runs through the crown portion, the support portion and the pad portion;

[0025] Optionally, in a direction perpendicular to the plane where the substrate is located, the depth of the groove is less than the thickness of the isolation structure.

[0026] In some embodiments, the plurality of light-emitting devices include a first light-emitting device and a second light-emitting device disposed adjacent to each other, and the via hole corresponding to the second light-emitting device is disposed between the first light-emitting device and the second light-emitting device;

[0027] The groove is disposed between the via holes correspondingly connected to the first light emitting device and the second light emitting device.

[0028] In some embodiments, the plurality of light-emitting devices include a first light-emitting device and a second light-emitting device, the vias include a first device via and a second device via, the plurality of first conductive portions include a first device conductive portion and a second device conductive portion, the first light-emitting device is connected to the first device conductive portion through the first device via, the second light-emitting device is connected to the second device conductive portion through the second device via, and the second device via corresponding to the second light-emitting device is disposed between the first light-emitting device and the second light-emitting device;

[0029] Optionally, the groove comprises a first groove arranged on a side of the second device via hole close to the first light-emitting device;

[0030] Optionally, the plurality of light-emitting devices further include a third light-emitting device, the via further includes a third device via, the first conductive portion further includes a third device conductive portion, the third light-emitting device is connected to the third device conductive portion through the third device via, and the groove includes a second groove arranged on a side of the third device via close to the first light-emitting device.

[0031] In some embodiments, the orthographic projection of the groove on the substrate is arranged around the orthographic projection of the via hole correspondingly connected to the light-emitting device on the substrate, and the groove is arranged in a ring shape.

[0032] In some embodiments, the light emitting device includes a first electrode, and the first electrode is connected to the corresponding first conductive part through the via hole;

[0033] The orthographic projection of the groove on the substrate and the orthographic projection of the corresponding via hole on the substrate are both located within the orthographic projection range of the first electrode of the same corresponding light-emitting device on the substrate.

[0034] In some embodiments, on a plane parallel to the substrate, the groove includes a plurality of groove sub-segments disposed at intervals, the groove sub-segments are arranged in an arc shape and are disposed on at least one side of the via hole;

[0035] Optionally, the groove is arranged around the via hole.

[0036] In some embodiments, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode, wherein the first electrode, the light-emitting functional layer, and the second electrode are sequentially stacked on a side of the first insulating layer away from the substrate, and the first electrode is connected to the corresponding first conductive portion through the via hole;

[0037] Optionally, the protection portion includes a first protection sub-portion located in the groove;

[0038] The first protection sub-part further includes a second sub-layer and a third sub-layer located on a side of the first sub-layer close to the substrate, the second sub-layer and the second electrode of at least part of the light-emitting device are arranged in the same layer and the same material, and the third sub-layer and the light-emitting functional layer of at least part of the light-emitting device are arranged in the same layer and the same material;

[0039] The second sub-layer and the third sub-layer are arranged on the bottom wall of the groove close to the substrate, and at least part of the first sub-layer covers the side wall of the groove;

[0040] Optionally, in a direction parallel to the plane where the substrate is located, the isolation structure includes a first isolation substructure with a first height, and a second isolation substructure with a second height, the orthographic projection of the first isolation substructure on the substrate overlaps with the orthographic projection of the via hole on the substrate, the second isolation substructure is located between the via hole and the groove, and the second height is greater than the first height;

[0041] Optionally, the protection portion includes a second protection sub-portion located on a side of the second isolation sub-structure away from the substrate, and a first gap is provided between the first sub-layer of the second protection sub-portion and a surface of a side of the second isolation sub-structure away from the substrate;

[0042] Optionally, the second protection sub-section further includes a second sub-layer and a third sub-layer, and parts of the second sub-layer and the third sub-layer fill the first gap;

[0043] Optionally, the second sub-layer includes a first sub-portion and a second sub-portion that are spaced apart from each other, the first sub-portion is located on a side of the isolation structure away from the substrate, and the second sub-portion is located in the groove;

[0044] The third sublayer comprises a third sub-portion and a fourth sub-portion which are arranged at intervals, the third sub-portion is located at a side of the isolation structure away from the substrate, and the fourth sub-portion is located in the groove;

[0045] The first sub-layer covers the second sub-portion and covers the sidewall of the groove;

[0046] Optionally, the protection portion includes a third protection sub-portion located on a side of the first isolation sub-structure away from the substrate, and a first gap is provided between the third protection sub-portion and a side surface of the first isolation sub-structure away from the substrate.

[0047] In some embodiments, the display panel further includes a pixel definition layer, the pixel definition layer is disposed on a side of the first insulating layer away from the substrate, the pixel definition layer includes a pixel definition structure, and a plurality of pixel openings surrounded by the pixel definition structure, the light-emitting device includes a first electrode, the first electrode is connected to the corresponding first conductive portion through the via hole, and the pixel opening is disposed corresponding to the first electrode;

[0048] In a direction perpendicular to the plane where the substrate is located, part of the pixel definition structure is arranged between the protection portion and the first electrode, and the orthographic projection of the pixel definition structure on the substrate covers the orthographic projection of the via hole on the substrate.

[0049] In some embodiments, the plurality of light emitting devices include a plurality of first color light emitting devices and a plurality of second color light emitting devices, and the first color light emitting devices and the second color light emitting devices emit light of different colors;

[0050] The plurality of via holes include a plurality of first via holes and a plurality of second via holes, the first color light emitting device is connected to the corresponding first conductive part through the corresponding first via hole, and the second color light emitting device is connected to the corresponding first conductive part through the corresponding second via hole;

[0051] The display panel further includes an encapsulation layer, which is disposed on a side of the corresponding light-emitting device away from the substrate, and includes a plurality of first encapsulation layers and a plurality of second encapsulation layers, wherein the first encapsulation layer is disposed on a side of the corresponding light-emitting device of the first color away from the substrate, and the second encapsulation layer is disposed on a side of the corresponding light-emitting device of the second color away from the substrate;

[0052] The plurality of protection parts include a plurality of first protection parts and a plurality of second protection parts, the orthographic projection of the first protection part on the substrate covers the orthographic projection of the corresponding first via hole on the substrate, and the orthographic projection of the second protection part on the substrate covers the orthographic projection of the corresponding second via hole on the substrate; optionally, the first protection part includes a first sublayer, and the first sublayer and the first encapsulation layer are provided in the same layer and with the same material;

[0053] Optionally, the second protection portion includes the first sublayer;

[0054] Optionally, a thickness of the first sub-layer is the same as a thickness of the first encapsulation layer.

[0055] In some embodiments, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode, wherein the first electrode, the light-emitting functional layer, and the second electrode are sequentially stacked on one side of the substrate;

[0056] The first protection portion includes a second sublayer, and the second sublayer and the second electrode of the first color light emitting device are provided in the same layer and the same material;

[0057] Optionally, the second protection portion includes the second sublayer;

[0058] Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode of the first color light emitting device;

[0059] Optionally, the first protection portion includes a third sublayer, and the third sublayer and the light-emitting functional layer of the first color light-emitting device are arranged in the same layer and with the same material;

[0060] Optionally, the second protection portion includes the third sublayer;

[0061] Optionally, the thickness of the third sublayer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device.

[0062] In some embodiments, the plurality of light emitting devices further include a plurality of third color light emitting devices, and the first color light emitting device, the second color light emitting device, and the third color light emitting device respectively emit light of different colors;

[0063] The plurality of via holes further include a plurality of third via holes, and the third color light emitting device is connected to the corresponding first conductive part through the corresponding third via holes;

[0064] The encapsulation layer further comprises a plurality of third encapsulation layers, wherein the third encapsulation layers are arranged on a side of the corresponding third color light emitting device away from the substrate;

[0065] The plurality of protection parts further include a plurality of third protection parts, and the orthographic projections of the third protection parts on the substrate cover the orthographic projections of the corresponding third via holes on the substrate;

[0066] Optionally, the third protection portion includes the first sublayer.

[0067] In some embodiments, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode, wherein the first electrode, the light-emitting functional layer, and the second electrode are sequentially stacked on one side of the substrate;

[0068] The first protection portion further includes a second sublayer, and the second sublayer and the second electrode of the first color light-emitting device are provided in the same layer and with the same material;

[0069] Optionally, the second protection portion further includes the second sublayer;

[0070] Optionally, the third protection portion further includes the second sublayer;

[0071] Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode of the first color light emitting device;

[0072] Optionally, the first protection portion further includes a third sublayer, and the third sublayer and the light-emitting functional layer of the first color light-emitting device are arranged in the same layer and with the same material;

[0073] Optionally, the second protection portion further includes the third sublayer;

[0074] Optionally, the third protection portion further includes the third sublayer;

[0075] Optionally, the thickness of the third sublayer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device;

[0076] Optionally, on a side of the corresponding via hole away from the substrate, the isolation structure, the third sub-layer, the second sub-layer and the first sub-layer are stacked in sequence on one side of the substrate.

[0077] In some embodiments, the display panel further includes a pixel definition layer, the pixel definition layer is disposed on a side of the first insulating layer away from the substrate, the pixel definition layer includes a pixel definition structure, and a plurality of pixel openings surrounded by the pixel definition structure, the pixel openings exposing a portion of the first electrode;

[0078] The orthographic projection of the pixel opening on the substrate is within the range of the orthographic projection of the isolation opening on the substrate;

[0079] The groove exposes a portion of the pixel definition layer.

[0080] According to a second aspect of the present application, a display panel is provided, comprising:

[0081] substrate;

[0082] A first conductive layer, disposed on one side of the substrate, the first conductive layer comprising a plurality of first conductive parts;

[0083] A first insulating layer, disposed on a side of the first conductive layer away from the substrate, the first insulating layer comprising a plurality of vias;

[0084] An isolation structure is arranged on a side of the first insulating layer away from the substrate, and a plurality of the isolation structures are combined to form a plurality of isolation openings and grooves;

[0085] A plurality of light-emitting devices are arranged on a side of the first insulating layer away from the substrate, the light-emitting devices are at least partially located in the corresponding isolation openings, and the light-emitting devices are connected to the corresponding first conductive parts through the via holes;

[0086] The encapsulation layer is arranged on the side of the light-emitting device away from the substrate, and part of the encapsulation layer extends to the side of the isolation structure away from the substrate and covers the corresponding groove. The orthographic projection of the via hole on the substrate is located within the range of the orthographic projection of the encapsulation layer on the substrate.

[0087] In some embodiments, it further comprises:

[0088] A protection portion, arranged on a side of the isolation structure away from the substrate, and arranged corresponding to the plurality of via holes, wherein the orthographic projection of the protection portion on the substrate covers the orthographic projection of the corresponding via hole on the substrate;

[0089] The protection portion includes a first sub-layer, the first sub-layer and at least a portion of the encapsulation layer are provided in the same layer and with the same material, and the first sub-layer is in direct contact with at least a portion of the sidewall of the groove.

[0090] In some embodiments, the plurality of light-emitting devices include a first light-emitting device and a second light-emitting device disposed adjacent to each other, and the via hole corresponding to the second light-emitting device is disposed between the first light-emitting device and the second light-emitting device;

[0091] Optionally, the groove is provided between the via holes corresponding to the first light emitting device and the second light emitting device;

[0092] Optionally, the orthographic projection of the groove on the substrate is arranged around the orthographic projection of the corresponding via hole on the substrate, and the groove is arranged in a ring shape.

[0093] According to a third aspect of the present application, a display device is provided, comprising any one of the display panels described above.

[0094] In the embodiment of the present application, in some parts of the display panel, the encapsulation layer covers a large area, making it easy for the encapsulation layer to break and other undesirable phenomena. At least part of the protection part is arranged in the groove, that is, the groove is arranged on at least one side around at least part of the via hole, and the protection part can be in direct contact with the side wall of the groove at least in part. Even if the encapsulation layer breaks and other undesirable phenomena occur on the side of the groove away from the via hole, the protection part can also be supported at the groove, so that the protection part covers the top of the via hole, avoiding the collapse and breakage of the protection part above the via hole. Furthermore, the protection part can prevent the etching liquid from penetrating through the part between the protection part and the isolation structure to destroy the isolation structure at the via hole, or can prevent the etching liquid from penetrating through the part of the side end surface of the protection part to destroy the isolation structure at the via hole, thereby avoiding defects such as voids in the isolation structure at the via hole, preventing or improving poor display such as dark spots, and improving the display quality and reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0095] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0096] Figure 1 A first partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0097] Figure 2 A schematic diagram of a first partial cross-sectional structure of a display panel provided in some embodiments of the present application.

[0098] Figure 3 Another schematic diagram of a first partial cross-sectional structure of a display panel provided in some embodiments of the present application.

[0099] Figure 4 Another schematic diagram of a first partial cross-sectional structure of a display panel provided in some embodiments of the present application.

[0100] Figure 5 A schematic diagram of a second partial cross-sectional structure of a display panel provided in some embodiments of the present application.

[0101] Figure 6 A second partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0102] Figure 7 A schematic diagram of a third partial cross-sectional structure of a display panel provided in some embodiments of the present application.

[0103] Figure 8 A schematic diagram of a fourth partial cross-sectional structure of a display panel provided in some embodiments of the present application.

[0104] Fig. 9 A third partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0105] Fig.10 A fourth partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0106] Fig.11 A fifth partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0107] Fig.12A sixth partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0108] Fig.13 A seventh partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0109] Fig.14 A schematic diagram of a display device 200 provided in some embodiments of the present application.

[0110] Reference numerals: display panel 100 ; display device 200 ; substrate 11 ; first conductive layer 12 ; first insulating layer 13 ; first conductive portion 121 ; sub-pixel 10P; first color sub-pixel 10R; second color sub-pixel 10G; third color sub-pixel 10B;

[0111] Protection part 101; first sublayer 111D; second sublayer 112D; third sublayer 113D; first protection part 101R; second protection part 101G; third protection part 101B; first protection sub-part 101a; second protection sub-part 101b; third protection sub-part 101c; first isolation substructure 16a; second isolation substructure 16b; first gap 30J1; second gap 30J2; third gap 30J3; first sub-part 112D1; second sub-part 112D2; third sub-part 113D3; fourth sub-part 113D4;

[0112] Light-emitting device 20; first electrode 14; light-emitting functional layer 21; second electrode 22; first color light-emitting device 20R; second color light-emitting device 20G; third color light-emitting device 20B; first device electrode 14R; first device light-emitting functional layer 21R; fourth device electrode 22R; second device electrode 14G; second device light-emitting functional layer 21G; fifth device electrode 22G; third device electrode 14B; third device light-emitting functional layer 21B; sixth device electrode 22B;

[0113] Encapsulation layer 30; first encapsulation layer 30R; second encapsulation layer 30G; third encapsulation layer 30B;

[0114] Via hole 131; first via hole 131R; second via hole 131G; third via hole 131B;

[0115] Isolation structure 16; isolation opening 16K; support portion 1601; crown portion 1602; pad portion 1600; pixel definition layer 15; pixel definition structure 151; pixel opening 152; first isolation substructure 16a; second isolation substructure 16b;

[0116] Groove 16C; first groove side wall 1601a1; second groove side wall 1601a2; first sub-opening 16011; second sub-opening 16021; first groove 16Ca; second groove 16Cb;

[0117] First light emitting device 201; second light emitting device 202; third light emitting device 203; first device via 1311; second device via 1312; groove sub-segment 16C1; first dotted circle XQ1; second dotted circle XQ2; first dotted frame XQ3; first device conductive part 1211; second device conductive part 1212; third device conductive part 1213. DETAILED DESCRIPTION

[0118] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0119] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0120] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0121] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0122] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0123] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0124] In the related art, OLED display panels have the problem of poor display.

[0125] In order to solve the problem of how to improve poor display and enhance the display quality of a display panel, the present application designs a display panel and a display device, aiming to improve the display quality of the display panel.

[0126] See also Figures 1 to 4 , Figure 5 , Figure 1 A first partial top view schematic diagram of a display panel provided in some embodiments of the present application. Figure 2 A schematic diagram of a first partial cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 3 Another schematic diagram of a first partial cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 4Another schematic diagram of a first partial cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 5 A schematic diagram of a second partial cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 2 , Figure 3 and Figure 4 for Figure 1 Schematic diagram of the cross-sectional structure at the dotted line C1-C1. Figure 2 , Figure 3 and Figure 4 is the cross-sectional structure at the same location, Figure 2 The encapsulation layer 30, the light-emitting functional layer 21 and the second electrode 22 are not shown. Figure 4 and Figure 3 Different numbers are shown in the figure. Figure 4 Also illustrated are a first sub-section 112D1 and a second sub-section 112D2 , a third sub-section 113D3 and a fourth sub-section 113D4 . Figure 5 for Figure 1 Schematic diagram of the cross-sectional structure at the dotted line C2-C2.

[0127] See also Figures 6 to 8 , Figure 6 A second partial top view schematic diagram of a display panel provided in some embodiments of the present application. Figure 7 A schematic diagram of a third partial cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 8 A schematic diagram of a fourth partial cross-sectional structure of a display panel provided in some embodiments of the present application. Figure 7 for Figure 6 Schematic diagram of the cross-sectional structure at the dotted line C3-C3, Figure 8 for Figure 6 Schematic diagram of the cross-sectional structure at the dotted line C4-C4.

[0128] See also Figures 9 to 13 , Fig. 9 A third partial top view schematic diagram of a display panel provided in some embodiments of the present application. Fig.10 A fourth partial top view schematic diagram of a display panel provided in some embodiments of the present application. Fig.11 A fifth partial top view schematic diagram of a display panel provided in some embodiments of the present application. Fig.12 A sixth partial top view schematic diagram of a display panel provided in some embodiments of the present application. Fig.13 A seventh partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0129] The composition, preparation and other contents of the isolation structure mentioned below are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, Further description is provided in CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0130] First, see Figures 1 to 11 The present application provides a display panel 100 , which includes a substrate 11 , a first conductive layer 12 , a first insulating layer 13 , an isolation structure 16 , a plurality of light emitting devices 20 and a protection portion 101 . The first conductive layer 12 is arranged on one side of the substrate 11, and the first conductive layer 12 includes a plurality of first conductive parts 121; the first insulating layer 13 is arranged on the side of the first conductive layer 12 away from the substrate 11, and the first insulating layer 13 includes a plurality of vias 131; the isolation structure 16 is arranged on the side of the first insulating layer 13 away from the substrate 11, and the isolation structure 16 is surrounded by a plurality of isolation openings 16K and grooves 16C; a plurality of light-emitting devices 20 are arranged on the side of the first insulating layer 13 away from the substrate 11, and the light-emitting devices 20 are at least partially located in the corresponding isolation openings 16K, and the light-emitting devices 20 are connected to the corresponding first conductive parts 121 through the vias 131; the protection part 101 is arranged on the side of the isolation structure 16 away from the substrate 11, and the orthographic projection of the protection part 101 on the substrate 11 covers the orthographic projection of the corresponding via 131 on the substrate 11; wherein, at least part of the protection part 101 is arranged in the groove 16C.

[0131] For example, in some embodiments, the display panel 100 includes a substrate 11 and an array composite layer disposed on one side of the substrate 11, and the film layer structure of the array composite layer may include a film layer of multiple transistors and drive lines in multiple drive circuits. In some embodiments, multiple light-emitting devices 20 are disposed on a side of the array composite layer away from the substrate 11.

[0132] It should be noted that Figure 1 and Figure 6The example in the figure shows that the display panel includes a plurality of sub-pixels 10P, the plurality of sub-pixels 10P include a first color sub-pixel 10R, a second color sub-pixel 10G and a third color sub-pixel 10B, the first color sub-pixel 10R includes a first color light-emitting device 20R, the second color sub-pixel 10G includes a second color light-emitting device 20G, and the third color sub-pixel 10B includes a third color light-emitting device 20B, but the arrangement of the sub-pixels 10P in the display panel 100 and the arrangement of the light-emitting devices 20 in the sub-pixels are not limited to Figure 1 and Figure 6 Example shown.

[0133] For example, in some embodiments, the first electrode 14 is connected to the corresponding first conductive portion 121 through the corresponding via 131, and the first electrode 14 provides an electrical signal to the first conductive portion 121 exposed through the corresponding via 131. For example, the first conductive portion 121 is a source or drain of a transistor in a driving circuit; for example, the first conductive portion 121 is a connecting electrode, and the first conductive portion 121 is connected to a source or drain of a transistor in a driving circuit.

[0134] By way of example, in some embodiments, the protection portion 101 is disposed on a side of the isolation structure 16 away from the substrate 11, and the orthographic projection of the protection portion 101 on the substrate 11 covers the orthographic projection of the corresponding via 131 on the substrate 11, that is, the orthographic projection of the protection portion 101 on the substrate 11 covers the orthographic projection of the side wall and bottom wall of the corresponding via 131 on the substrate 11, or the orthographic projection of the protection portion 101 on the substrate 11 covers the orthographic projection of the corresponding via 131 area on the substrate 11.

[0135] For example, the orthographic projection of the isolation structure 16 on the substrate 11 covers the orthographic projection of the via hole 131 on the substrate 11 , that is, a portion of the isolation structure 16 is located between the protection portion 101 and the via hole 131 .

[0136] For example, in an embodiment of the present application, the protection portion 101 includes at least one sublayer of non-metallic material, and the orthographic projection of the protection portion 101 on the substrate 11 covers the orthographic projection of the corresponding via 131 on the substrate 11. During the manufacturing process of the display panel 100, after the protection portion 101 is formed, the sublayer of non-metallic material can protect the via 131, and can prevent the electrode or wiring at the via 131 from being over-etched by subsequent manufacturing processes. For example, it can prevent the electrode or wiring at the via 131 from being over-etched by the etching solution in the subsequent manufacturing process (for example, it can prevent the isolation structure 16 at the via 131 from being over-etched by the etching solution in the subsequent manufacturing process), thereby avoiding defects such as voids in the electrode or wiring at the via 131, preventing or improving display defects such as dark spots, and improving the display quality of the display panel.

[0137] By way of example, in some embodiments, the light-emitting device 20 includes a first electrode 14, which is connected to the corresponding first conductive portion 121 through a corresponding via 131, the orthographic projection of the groove 16C on the substrate 11 does not overlap with the orthographic projection of the first electrode 14 on the substrate 11, the orthographic projection of the isolation structure 16 on the substrate 11 covers the orthographic projection of the via 131 on the substrate 11, the opening of the groove 16C faces the side of the isolation structure 16 away from the substrate 11, and on a plane parallel to the substrate 11, the protective portion 101 is in direct contact with at least part of the side wall of the groove 16C.

[0138] It should be noted that, on a plane parallel to the substrate 11, Figure 3 and Figure 5 middle, Figure 3 The rightmost part of the middle protection part 101 (the first dotted circle XQ1) is connected Figure 5 The leftmost part of the middle protection portion 101 (the second dotted circle XQ2), that is, Figure 3 The first protection portion 101R extends to Figure 5 The second via hole 131G is located above a side away from the substrate 11. In some examples, such as Figure 1 As shown, the first encapsulation layer 30R (first dotted frame XQ3 ) covers the first color light emitting device 20R, the first via hole 131R, the groove 16C and the second via hole 131G on the plane where the substrate 11 is located.

[0139] It should be noted that, on a plane parallel to the substrate 11, Figure 7 and Figure 8 middle, Figure 7 The rightmost part of the middle protection part 101 is connected Figure 8 The leftmost part of the middle protection portion 101, i.e. Figure 7 The first protection portion 101R extends to Figure 8 The second via hole 131G is located above a side away from the substrate 11. In some examples, such as Figure 6 As shown, the first encapsulation layer 30R (first dotted frame XQ3 ) covers the first color light emitting device 20R, the first via hole 131R, the groove 16C and the third via hole 131B on the plane where the substrate 11 is located.

[0140] For example, in some embodiments, in some parts of the display panel 100, the encapsulation layer 30 covers a large area, so that the encapsulation layer 30 is prone to cracks and other undesirable phenomena. At least part of the protection part 101 is arranged in the groove 16C, that is, the groove 16C is arranged on at least one side around at least part of the via hole 131, and the protection part 101 is at least partially in direct contact with the side wall of the groove 16C. Even if the encapsulation layer 30 has cracks and other undesirable phenomena on the side of the groove 16C away from the via hole 131, the protection part 101 can also be supported at the groove 16C, so that the protection part 101 continues to cover the via hole 131, thereby preventing the protection part 101 from collapsing and breaking above the via hole 131. For example, Figure 3 Even if the middle protection part 101 collapses or breaks on the left side of the groove 16C, it will not affect the shape maintenance of the protection part 101 in the groove 16C. After being supported in the groove 16C, the protection part 101 continues to extend rightward to the groove 16C. Figure 5 Above the side of the second via hole 131G away from the substrate 11 , the protection portion 101 may continue to protect the second via hole 131G.

[0141] For example, in some embodiments, at the via hole 131, the protection part 101 can also block water vapor, oxygen, etc. from entering the via hole 131. For example, water vapor and oxygen can be prevented from entering and oxidizing the isolation structure 16, thereby improving the reliability of the display panel 100. At the same time, during the manufacturing process of the display panel 100, after the protection part 101 is formed, the protection part 101 and the groove 16C can protect the via hole 131. In the subsequent manufacturing process, the etching liquid can be prevented from penetrating through the part between the protection part and the isolation structure to damage the isolation structure 16 at the via hole 131, or the etching liquid can be prevented from penetrating through the part of the side end surface of the protection part to damage the isolation structure 16 at the via hole 131, thereby preventing the isolation structure 16 at the via hole 131 from having defects such as cavities, preventing or improving poor display such as dark spots, and improving the display quality and reliability of the display panel.

[0142] In the embodiment of the present application, in some parts of the display panel 100, the encapsulation layer 30 covers a large area, which makes it easy for the encapsulation layer 30 to break and other undesirable phenomena. At least part of the protection part 101 is arranged in the groove 16C, that is, the groove 16C is arranged on at least one side around at least part of the via 131. The protection part 101 can be in direct contact with the side wall of the groove 16C at least partially. Even if the encapsulation layer 30 breaks and other undesirable phenomena occur on the side of the groove 16C away from the via 131, the protection part 101 can also be supported at the groove 16C, so that the protection part 101 covers the top of the via 131, thereby preventing the protection part 101 from collapsing and breaking above the via 131. Furthermore, the protection portion 101 can prevent the etching solution from penetrating through the portion between the protection portion 101 and the isolation structure 16 and damaging the isolation structure 16 at the via 131, or can prevent the etching solution from penetrating through the side end surface of the protection portion 101 and damaging the isolation structure 16 at the via 131, thereby avoiding defects such as voids in the isolation structure 16 at the via 131, preventing or improving display defects such as dark spots, and improving the display quality and reliability of the display panel.

[0143] In some embodiments, the display panel 100 also includes an encapsulation layer 30, which is disposed on a side of the light-emitting device 20 away from the substrate 11; the protective portion 101 includes a first sublayer 111D, and the first sublayer 111D and at least part of the encapsulation layer 30 are disposed in the same layer and material, and the first sublayer 111D is in direct contact with at least part of the side wall of the groove 16C.

[0144] For example, in some embodiments, the first sublayer 111D and at least a portion of the encapsulation layer 30 are provided in the same layer and the same material. For example, the first sublayer 111D and at least a portion of the encapsulation layer 30 are manufactured in the same manufacturing process, which can simplify the production process.

[0145] For example, in some embodiments, the first sublayer 111D and at least part of the encapsulation layer 30 are arranged in the same layer and the same material, and the encapsulation layer 30 includes at least one film layer of an inorganic material, for example, the encapsulation layer 30 includes a silicon nitride film layer and / or a silicon oxide film layer, and the first sublayer 111D can play a role in protecting the film layer between the via 131 and the first sublayer 111D.

[0146] For example, Figure 3 and Figure 4 , Figure 7As shown, on the one hand, the first sublayer 111D is in direct contact with at least part of the sidewall of the groove 16C. Even if the encapsulation layer 30 breaks or has other undesirable phenomena on the side of the groove 16C away from the via 131, the first sublayer 111D can also be supported at the groove 16C, so that the first sublayer 111D covers the via 131, thereby preventing the first sublayer 111D from collapsing and breaking above the via 131. On the other hand, the first sublayer 111D has good water vapor and oxygen blocking and isolation capabilities. When the encapsulation layer 30 on the side of the groove 16C away from the via 131 breaks or has other undesirable phenomena, the protection part 101 can also protect the via 131. The protection part 101 blocks the diffusion path of water vapor and oxygen in the groove 16C. For example, water vapor and oxygen can be prevented from entering the oxidation isolation structure 16, thereby improving the reliability of the display panel 100. Thirdly, the first sublayer 111D has excellent etching liquid blocking and isolation capabilities. During the manufacturing process of the display panel 100, after the protective portion 101 is formed, the protective portion 101 and the groove 16C can protect the via 131. In the subsequent manufacturing process, the etching liquid can be prevented from penetrating through the area between the protective portion and the isolation structure to damage the isolation structure 16 at the via 131, or the etching liquid can be prevented from penetrating through the side end surface of the protective portion to damage the isolation structure 16 at the via 131, thereby avoiding defects such as voids in the isolation structure 16 at the via 131, preventing or improving display defects such as dark spots, and improving the display quality and reliability of the display panel.

[0147] In some embodiments, the isolation structure 16 includes a support portion 1601 and a crown portion 1602 which are sequentially stacked on one side of the substrate 11 .

[0148] Optionally, in some embodiments, Figure 2 As shown, the groove 16C includes a first sub-opening 16011 and a second sub-opening 16021 that are connected. The support portion 1601 encloses the first sub-opening 16011, and the crown portion 1602 encloses the second sub-opening 16021. The orthographic projection of the second sub-opening 16021 on the substrate 11 is located within the range of the orthographic projection of the first sub-opening 16011 on the substrate 11. On a plane parallel to the substrate 11, the area of ​​the first sub-opening 16011 is greater than the area of ​​the second sub-opening 16021.

[0149] Optionally, in some embodiments, the first sub-opening 16011 passes through the supporting portion 1601 in a plane perpendicular to the substrate 11 .

[0150] Optionally, in some embodiments, on a plane perpendicular to the substrate 11 , the first sub-opening 16011 penetrates a portion of the supporting portion 1601 .

[0151] For example, in some embodiments, the isolation structure 16 includes a support portion 1601 and a crown portion 1602 stacked in sequence on the substrate 11, and between two adjacent light-emitting devices 20, the orthographic projection of the support portion 1601 on the substrate 11 is located within the orthographic projection of the crown portion 1602 on the substrate 11. In this way, between two adjacent light-emitting devices 20, around the isolation opening 16K, at least the portion of the isolation structure 16 away from the substrate 11 is set to a shape that is wide at the top and narrow at the bottom, so that the isolation structure 16 can block other film layers such as the light-emitting layer EML or the hole transport layer HTL of the adjacent light-emitting device 20, which can save expensive fine metal mask plates (FMM), thereby reducing the manufacturing cost of the display panel. At the same time, after not using the fine metal mask plate (FMM), the light-emitting area of ​​the sub-pixel is not limited by the opening of the fine metal mask plate, the light-emitting area of ​​the sub-pixel can be made smaller, and a larger number of sub-pixels can be formed in the display panel, thereby improving the resolution of the display panel.

[0152] By way of example, in some embodiments, the isolation structure 16 is a conductive structure, the support portion 1601 is a conductive material, and the second electrode 22 can be overlapped on the side wall of the support portion 1601 facing the corresponding light-emitting device 20. At this time, the isolation structure 16 can provide the second electrode 22 with a corresponding electrical signal. For example, the isolation structure 16 can provide the second electrode 22 with a VSS signal (cathode signal).

[0153] For example, the orthographic projection of the second sub-opening 16021 on the substrate 11 is located within the range of the orthographic projection of the first sub-opening 16011 on the substrate 11; on a plane parallel to the substrate 11, the area of ​​the first sub-opening 16011 is larger than the area of ​​the second sub-opening 16021, that is, around the groove 16C, at least the portion of the isolation structure 16 away from the substrate 11 is set to be wide at the top and narrow at the bottom (bottom cut structure).

[0154] For example, in some embodiments, the groove 16C and the isolation opening 16K may be formed in the same process step, so that around the groove 16C, at least a portion of the isolation structure 16 away from the substrate 11 is configured to be wide at the top and narrow at the bottom.

[0155] In some embodiments, the groove 16C passes through the crown 1602 and at least part of the support 1601 in a direction perpendicular to the plane of the substrate 11. For example, the groove 16C passes through the crown 1602 and at least part of the support 1601, so that the crown 1602 forms an undercut structure relative to the support 1601.

[0156] Optionally, in some embodiments, the groove 16C passes through the support portion 1601 in a direction perpendicular to the plane where the substrate 11 is located.

[0157] Optionally, in some embodiments, Figure 2 As shown, the isolation structure 16 further includes a pad portion 1600 , and the pad portion 1600 , the support portion 1601 and the crown portion 1602 are sequentially stacked on one side of the substrate 11 .

[0158] For example, Figure 2 The isolation structure 16 is shown to include a pad 1600, a support portion 1601 and a crown portion 1602. The pad 1600, the support portion 1601 and the crown portion 1602 can form an "I" shape or a "T" shape. The material of the pad 1600 includes titanium or molybdenum, but is not limited thereto.

[0159] For example, Figure 2 , the isolation structure 16 is shown as a laminated structure of a pad portion 1600, a support portion 1601, and a crown portion 1602. For example, the laminated structure of the isolation structure 16 may be titanium / aluminum / titanium or molybdenum / aluminum / molybdenum, the pad portion 1600 is made of titanium or molybdenum, the support portion 1601 is made of aluminum, and the crown portion 1602 is made of titanium or molybdenum. By providing three laminated metal layers, the resistance of the isolation structure 16 can be reduced, thereby reducing the power consumption of the display panel 100.

[0160] Optionally, in some embodiments, the groove 16C runs through the crown portion 1602 , the support portion 1601 and the pad portion 1600 in a direction perpendicular to the plane where the base 11 is located.

[0161] For example, Figure 2 As shown, the groove 16C runs through the crown portion 1602, the support portion 1601 and the pad portion 1600, and the groove 16C and the isolation opening 16K can be formed in the same process, thereby simplifying the production process.

[0162] Optionally, in some embodiments, in a direction perpendicular to the plane where the substrate 11 is located, the depth of the groove 16C is less than the thickness of the isolation structure 16 .

[0163] For example, in a direction perpendicular to the plane of the substrate 11, the depth of the groove 16C is less than the thickness of the isolation structure 16, that is, the groove 16C does not completely penetrate the isolation structure 16. For example, the groove 16C penetrates the crown portion 1602 and the support portion 1601, but the groove 16C does not penetrate the pad portion 1600. The depth of the groove 16C can be reduced, and the risk of the first sub-layer 111D being disconnected in the groove 16C can be reduced.

[0164] See also Figures 9 to 12 .

[0165] In some embodiments, Fig. 9As shown, the multiple light-emitting devices 20 include a first light-emitting device 201 and a second light-emitting device 202 arranged adjacent to each other, and the via hole 131 corresponding to the second light-emitting device 202 is arranged between the first light-emitting device 201 and the second light-emitting device 202; the groove 16C is arranged between the via holes 131 correspondingly connected to the first light-emitting device 201 and the second light-emitting device 202.

[0166] For example, please combine Figure 3 and Figure 5 , Fig. 9 As shown, the protection portion 101 includes a first sub-layer 111D, and the first sub-layer 111D and at least a portion of the encapsulation layer 30 are provided in the same layer and the same material, that is, for the via hole corresponding to the second light emitting device 202 ( Figure 3 and Figure 5 The second via hole 131G, or Fig. 9 The protection portion 101 covering the via hole corresponding to the second light-emitting device 202 includes a first sublayer 111D provided in the same layer and the same material as the encapsulation layer 30 covering the first light-emitting device 201 (in some embodiments, the encapsulation layer 30 covering the first light-emitting device partially extends to cover the via hole corresponding to the second light-emitting device 202), the first light-emitting device 201 is far away from the second light-emitting device 202, and the first sublayer 111D (the encapsulation layer 30 covering the first light-emitting device) is between the via hole corresponding to the second light-emitting device 202 and the first light-emitting device 201 Therefore, the groove 16C is arranged between the via holes corresponding to the first light-emitting device 201 and the second light-emitting device 202. Even if the first sublayer 111D (the encapsulation layer 30 covering the first light-emitting device) collapses and breaks on the side of the groove 16C away from the via hole corresponding to the second light-emitting device 202, the protection part 101 can also be supported at the groove 16C, so that the protection part 101 continues to cover the via hole corresponding to the second light-emitting device 202, thereby preventing the protection part 101 from collapsing and breaking above the via hole corresponding to the second light-emitting device 202.

[0167] In some embodiments, Fig. 9 As shown, the plurality of light-emitting devices 20 include a first light-emitting device 201 and a second light-emitting device 202, the via 131 includes a first device via 1311 and a second device via 1312, the plurality of first conductive parts 121 include a first device conductive part 1211 and a second device conductive part 1212, the first light-emitting device 201 is connected to the first device conductive part 1211 through the first device via 1311, the second light-emitting device 202 is connected to the second device conductive part 1212 through the second device via 1312, and the second device via 1312 corresponding to the second light-emitting device 202 is arranged between the first light-emitting device 201 and the second light-emitting device 202.

[0168] For example, please combine Figure 3 and Figure 5 , Fig. 9 As shown, the protection part 101 includes a first sublayer 111D, and the first sublayer 111D and at least a part of the encapsulation layer 30 are arranged in the same layer and the same material, that is, for the second device via hole 1312 corresponding to the second light-emitting device 202, the protection part 101 covering the second device via hole 1312 includes a first sublayer 111D which is arranged in the same layer and the same material as the encapsulation layer 30 covering the first light-emitting device 201 (in some embodiments, the encapsulation layer 30 covering the first light-emitting device partially extends to cover the second device via hole 1312), the first light-emitting device 201 is far away from the second device via hole 1312, and the first sublayer 111D (covering the first device via hole 1312) is arranged in the same layer and the same material as the encapsulation layer 30 covering the first light-emitting device 201. The packaging layer 30 of the light-emitting device is easily broken between the second device via 1312 and the first light-emitting device 201. Therefore, the groove 16C is arranged between the first light-emitting device 201 and the second device via 1312. Even if the first sublayer 111D (the packaging layer 30 covering the first light-emitting device) collapses and breaks on the side of the groove 16C away from the second device via 1312, the protection part 101 can also be supported at the groove 16C, so that the protection part 101 continues to cover the top of the second device via 1312, thereby preventing the protection part 101 from collapsing and breaking above the second device via 1312.

[0169] Optionally, in some embodiments, Fig. 9 As shown, the groove 16C includes a first groove 16Ca disposed on a side of the second device via hole 1312 close to the first light emitting device 201 .

[0170] Optionally, in some embodiments, Fig.10 As shown, the multiple light-emitting devices 20 also include a third light-emitting device 203, the via 131 also includes a third device via 1313, the first conductive portion 121 also includes a third device conductive portion 1213, the third light-emitting device 203 is connected to the third device conductive portion 1213 through the third device via 1313, and the groove 16C includes a second groove 16Cb arranged on the side of the third device via 1313 close to the first light-emitting device 20.

[0171] For example, please combine Figure 7 and Figure 8 , Fig.10As shown, the first light-emitting device 201 is far away from the third device via 1313, and the first sub-layer 111D (the packaging layer 30 covering the first light-emitting device) is easily broken between the third device via 1313 and the first light-emitting device 201. Therefore, the groove 16C is arranged between the first light-emitting device 201 and the third device via 1313. Even if the first sub-layer 111D (the packaging layer 30 covering the first light-emitting device) collapses and breaks on the side of the groove 16C away from the third device via 1313, the protection part 101 can also be supported at the groove 16C, so that the protection part 101 continues to cover the top of the third device via 1313, thereby preventing the protection part 101 from collapsing and breaking above the third device via 1313.

[0172] In some embodiments, Fig.11 As shown, the orthographic projection of the groove 16C on the substrate 11 is arranged around the orthographic projection of the via hole 131 correspondingly connected to the light-emitting device 20 on the substrate 11, and the groove 16C is arranged in a ring shape.

[0173] For example, Fig.11 As shown, in some embodiments, the orthographic projection of the groove 16C on the substrate 11 is arranged around the orthographic projection of the via hole 131 correspondingly connected to the light emitting device 20 on the substrate 11, for example Fig.11 The first groove 16Ca is arranged around the second device via hole 1312, and the groove 16C is arranged in a ring shape. The groove 16C can provide support for the protection part 101 from all directions.

[0174] In some embodiments, Figure 2 As shown, the light-emitting device 20 includes a first electrode 14, which is connected to the corresponding first conductive portion 121 through a corresponding via hole 131, and the orthographic projection of the groove 16C on the substrate 11 and the orthographic projection of the corresponding via hole 131 on the substrate 11 are both located within the orthographic projection range of the first electrode 14 of the same light-emitting device 20 on the substrate 11.

[0175] For example, the groove 16C is closer to the corresponding via hole 131, which can reduce the risk of the protection part 101 being broken between the groove 16C and the corresponding via hole 131. Fig.11 The orthographic projections of the first groove 16Ca and the second device via 1312 on the substrate 11 are both within the range of the orthographic projection of the first electrode 14 of the second light-emitting device 202 on the substrate 11. The first groove 16Ca is closer to the second device via 1312, which can reduce the risk of the protective part 101 breaking between the first groove 16Ca and the second device via 1312.

[0176] In some embodiments, Fig.12As shown, on a plane parallel to the substrate 11 , the groove 16C includes a plurality of groove sub-segments 16C1 disposed at intervals. The groove sub-segments 16C1 are arranged in an arc shape and are disposed on at least one side of the via 131 .

[0177] By way of example, the plurality of groove sub-segments 16C1 may also support the protecting portion 101 .

[0178] Optionally, in some embodiments, Fig.12 As shown, the groove 16C is arranged around the via hole. The groove 16C can provide support for the protection part 101 from all directions.

[0179] It should be noted that the first light emitting device 201 and the second light emitting device 202 disposed adjacent to each other may be light emitting devices 20 of different colors, or the first light emitting device 201 and the second light emitting device 202 disposed adjacent to each other may be light emitting devices 20 of the same color. Figure 1 In the example, the first light emitting device 201 and the second light emitting device 202 are light emitting devices of different colors.

[0180] It should be noted that the first light emitting device 201 and the third light emitting device 203 disposed adjacent to each other may be light emitting devices 20 of different colors, or the first light emitting device 201 and the third light emitting device 203 disposed adjacent to each other may be light emitting devices 20 of the same color. Figure 6 In the example, the first light emitting device 201 and the third light emitting device 203 are light emitting devices of different colors.

[0181] like Fig.13 As shown, in some other embodiments, the groove 16C is disposed between the via hole 131 corresponding to the second light emitting device 202 and the isolation opening 16K corresponding to the second light emitting device 202. In this case, the groove 16C can also provide support for the protection portion 101.

[0182] See also Figures 1 to 5 ,or Figures 6 to 8 shown.

[0183] In some embodiments, the light-emitting device 20 includes a first electrode 14, a light-emitting functional layer 21 and a second electrode 22. The first electrode 14, the light-emitting functional layer 21 and the second electrode 22 are stacked in sequence on the side of the first insulating layer 13 away from the substrate 11, and the first electrode 14 is connected to the corresponding first conductive part 121 through a via 131.

[0184] For example, one of the first electrode 14 and the second electrode 22 may be an anode, and the other may be a cathode, which is not limited here.

[0185] By way of example, the light-emitting functional layer 21 may include a light-emitting layer (Emission layer, EML), and the light-emitting functional layer 21 may also include other film layers other than the light-emitting layer (Emission layer, EML), for example, it may also include one or more of a hole injection layer (Hole Injection Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), an electron injection layer (Electron Injection Layer, EIL), an electron transport layer (Electron Transport Layer, ETL), a hole blocking layer (Hole Block Layer, HBL) and an electron blocking layer (Electron Block Layer, EBL).

[0186] Optionally, in some embodiments, the protection portion 101 includes a first protection sub-portion 101a located in the groove 16C;

[0187] The first protection sub-part 101a further includes a second sub-layer 112D and a third sub-layer 113D located on a side of the first sub-layer 111D close to the substrate 11, the second sub-layer 112D and the second electrode 22 of at least part of the light-emitting device 20 are arranged in the same layer and the same material, and the third sub-layer 113D and the light-emitting functional layer 21 of at least part of the light-emitting device 20 are arranged in the same layer and the same material;

[0188] The second sub-layer 112D and the third sub-layer 113D are disposed on the bottom wall of the groove 16C close to the substrate 11 , and at least a portion of the first sub-layer 111D covers the side wall of the groove 16C.

[0189] For example, Figure 3 and 7 As shown, since the orthographic projection of the second sub-opening 16021 on the substrate is within the orthographic projection range of the first sub-opening 16011 on the substrate 11, that is, an undercut structure is formed at the groove 16C, the second sub-layer 112D and the third sub-layer 113D are disconnected at the edge of the groove 16C, so that the second sub-layer 112D and the third sub-layer 113D are arranged on the bottom wall of the groove 16C close to the substrate 11; at the same time, the second sub-layer 112D and the third sub-layer 113D disconnected at the edge of the groove 16C expose the side wall of the groove 16C, so that at least part of the first sub-layer 111D covers the side wall of the groove 16C, so that the first sub-layer 111D is supported at the groove 16C.

[0190] Optionally, in some embodiments, Figure 2 , Figure 3 and 7As shown, in a direction parallel to the plane where the substrate 11 is located, the isolation structure 16 includes a first isolation substructure 16a with a first height, and a second isolation substructure 16b with a second height, the orthographic projection of the first isolation substructure 16a on the substrate 11 overlaps with the orthographic projection of the via 131 on the substrate 11, and the second isolation substructure 16b is located between the via 131 and the groove 16C, and the second height is greater than the first height.

[0191] For example, in a direction perpendicular to the plane where the substrate 11 is located, the second height is greater than the first height.

[0192] Optionally, in some embodiments, Figure 3 and 7 As shown, the protection portion 101 includes a second protection sub-portion 101b located on the side of the second isolation substructure 16b away from the substrate 11 , and a first gap 30J1 is provided between the first sublayer 111D of the second protection sub-portion 101b and the surface of the side of the second isolation substructure 16b away from the substrate 11 .

[0193] For example, the film layer between the first sublayer 111D and the surface of the second isolation substructure 16b facing away from the substrate 11 is etched to form the first gap 30J1. For example, the film layer between the first encapsulation layer 30R and the isolation structure 16 (the light-emitting functional layer 21 and the second electrode 22 of the first color light-emitting device 20R) is etched to form the first gap 30J1.

[0194] For example, Figure 3 In the embodiment, the isolation structure 16 includes a third isolation substructure 16 c located between the light emitting device 20 and the groove 16 c, and a first gap 30J1 is provided between the first sublayer 111D and a surface of the third isolation substructure 16 c away from the substrate 11 .

[0195] For example, Figure 3 As shown, there is a first gap 30J1 between the first sublayer 111D and the surface of the third isolation substructure 16c away from the substrate 11, so that the first sublayer 111D is suspended at this position, so that the first sublayer 111D is easy to collapse and break at this position. The groove 16C of the present application can improve or avoid the collapse and breakage of the first sublayer 111D.

[0196] Optionally, in some embodiments, Figure 4 As shown, the second protection sub-portion 101 b further includes a second sub-layer 112D and a third sub-layer 113D, and parts of the second sub-layer 112D and the third sub-layer 113D fill the first gap 30J1 .

[0197] For example, when etching the film layer between the first sub-layer 111D and the surface of the second isolation sub-structure 16 b facing away from the substrate 11 , part of the second sub-layer 112D and the third sub-layer 113D remain.

[0198] Optionally, in some embodiments, Figure 4 As shown, the second sub-layer 112D includes a first sub-portion 112D1 and a second sub-portion 112D2 that are spaced apart from each other. The first sub-portion 112D1 is located on a side of the isolation structure 16 that is away from the substrate 11 , and the second sub-portion 112D2 is located in the groove 16C.

[0199] The third sub-layer 113D includes a third sub-portion 113D3 and a fourth sub-portion 113D4 which are arranged at intervals. The third sub-portion 113D3 is located on a side of the isolation structure 16 away from the substrate 11, and the fourth sub-portion 113D4 is located in the groove 16C.

[0200] The first sub-layer 111D covers the second sub-portion 112D2 and covers the sidewall of the groove 16C.

[0201] For example, Figure 4 As shown, part of the second sublayer 112D and the third sublayer 113D fills the first gap 30J1 , the part of the second sublayer 112D filling the first gap 30J1 may be the first subportion 112D1 , and the part of the third sublayer 113D filling the first gap 30J1 may be the third subportion 113D3 .

[0202] For example, in some parts of the display panel 100, the second electrode 22 of the first color light emitting device 20R between the first sublayer 111D and the isolation structure 16 is retained to form a first sub-portion 112D1, and the light emitting function layer 21 of the first color light emitting device 20R between the first sublayer 111D and the isolation structure 16 is retained to form a third sub-portion 113D3. Figure 4 In the figure, the isolation structure 16 includes a third isolation substructure 16c located between the light-emitting device 20 and the groove 16C, and a first sub-portion 112D1 and a third sub-portion 113D3 are provided between the first sublayer 111D and the surface of the third isolation substructure 16c away from the substrate 11. The first sub-portion 112D1 and the third sub-portion 113D3 at least partially fill the first gap 30J1 between the first sublayer 111D and the surface of the third isolation substructure 16c away from the substrate 11.

[0203] Optionally, in some embodiments, Figure 3 and Figure 4 , Figure 7As shown, the protection portion 101 includes a third protection sub-portion 101c located on a side of the first isolation sub-structure 16a away from the substrate 11 , and a first gap 30J1 is formed between the third protection sub-portion 101c and a surface of the first isolation sub-structure 16a away from the substrate 11 .

[0204] For example, Figure 3 and Figure 4 , Figure 7 As shown, the film layer between the first sublayer 111D and the surface of the first isolation substructure 16a facing away from the substrate 11 is etched to form a first gap 30J1. For example, the film layer between the first encapsulation layer 30R and the isolation structure 16 (the light-emitting functional layer 21 and the second electrode 22 of the first color light-emitting device 20R) is etched to form the first gap 30J1.

[0205] In some embodiments, the display panel 100 also includes a pixel definition layer 15, which is disposed on a side of the first insulating layer 13 away from the substrate 11, and the pixel definition layer 15 includes a pixel definition structure 151, and a plurality of pixel openings 152 surrounded by the pixel definition structure 151, and the pixel openings 152 are disposed corresponding to the first electrode 14; in a direction perpendicular to the plane where the substrate 11 is located, a portion of the pixel definition structure 151 is disposed between the protective portion 101 and the first electrode 14, and the orthographic projection of the pixel definition structure 151 on the substrate 11 covers the orthographic projection of the via 131 on the substrate 11.

[0206] For example, in some embodiments, the pixel definition structure 151 surrounds a plurality of pixel openings 152 , and the pixel openings 152 expose corresponding first electrodes 14 .

[0207] For example, in some embodiments, at the pixel opening 152 , the pixel definition structure 151 covers the edge of the corresponding first electrode 14 .

[0208] For example, in some embodiments, on the side of the corresponding via hole 131 away from the substrate 11 , the first electrode 14 , the pixel definition structure 151 , the isolation structure 16 and the protection part 101 are stacked in sequence, and the protection part 101 can play a role in protecting the via hole 131 .

[0209] See also Figures 1 to 5 .

[0210] In some embodiments, Figures 1 to 5 As shown, the plurality of light emitting devices 20 include a plurality of first color light emitting devices 20R and a plurality of second color light emitting devices 20G, and the first color light emitting devices 20R and the second color light emitting devices 20G emit light of different colors;

[0211] The plurality of vias 131 include a plurality of first vias 131R and a plurality of second vias 131G, the first color light emitting device 20R is connected to the corresponding first conductive portion 121 through the corresponding first vias 131R, and the second color light emitting device 20G is connected to the corresponding first conductive portion 121 through the corresponding second vias 131G;

[0212] The display panel 100 further includes an encapsulation layer 30, which is disposed on a side of the corresponding light-emitting device 20 away from the substrate 11. The encapsulation layer 30 includes a plurality of first encapsulation layers 30R and a plurality of second encapsulation layers 30G. The first encapsulation layer 30R is disposed on a side of the corresponding first-color light-emitting device 20R away from the substrate 11, and the second encapsulation layer 30G is disposed on a side of the corresponding second-color light-emitting device 20G away from the substrate 11.

[0213] The multiple protection parts 101 include multiple first protection parts 101R and multiple second protection parts 101G. The orthographic projection of the first protection part 101R on the substrate 11 covers the orthographic projection of the corresponding first via hole 131R on the substrate 11, and the orthographic projection of the second protection part 101G on the substrate 11 covers the orthographic projection of the corresponding second via hole 131G on the substrate 11.

[0214] For example, in some embodiments, the first color light emitting device 20R and the second color light emitting device 20G may be different ones of a red light emitting device, a green light emitting device, and a blue light emitting device. For example, the first color light emitting device 20R is a red light emitting device, and the second color light emitting device 20G is a green light emitting device; for example, the first color light emitting device 20R is a blue light emitting device, and the second color light emitting device 20G is a red light emitting device.

[0215] For example, Figures 1 to 5 As shown, the first electrode 14 of the first color light emitting device 20R is a first device electrode 14R, the light emitting functional layer 21 of the first color light emitting device 20R is a first device light emitting functional layer 21R, and the second electrode 22 of the first color light emitting device 20R is a fourth device electrode 22R.

[0216] For example, Figure 3 As shown, the first color light-emitting device 20R is connected to the corresponding first conductive part 121 through the corresponding first via 131R, the first encapsulation layer 30R is arranged on the side of the corresponding first color light-emitting device 20R away from the substrate 11, and the orthographic projection of the first protective part 101R on the substrate 11 covers the orthographic projection of the corresponding first via 131R on the substrate 11.

[0217] For example, Figure 5As shown, the first electrode 14 of the second color light emitting device 20G is the second device electrode 14G, the light emitting function layer 21 of the second color light emitting device 20G is the second device light emitting function layer 21G, and the second electrode 22 of the second color light emitting device 20G is the fifth device electrode 22G.

[0218] For example, Figure 5 As shown, the second color light-emitting device 20G is connected to the corresponding first conductive part 121 through the corresponding second via 131G, the second encapsulation layer 30G is arranged on the side of the corresponding second color light-emitting device 20G away from the substrate 11, and the orthographic projection of the second protective part 101G on the substrate 11 covers the orthographic projection of the corresponding second via 131G on the substrate 11.

[0219] For example, Figure 5 As shown, a second gap 30J2 is formed between the second encapsulation layer 30G and the surface of the isolation structure 16 away from the substrate 11 .

[0220] Optionally, in some embodiments, the first protection portion 101R includes a first sub-layer 111D, and the first sub-layer 111D and the first encapsulation layer 30R are provided in the same layer and with the same material.

[0221] Optionally, the second protection portion 101G includes a first sub-layer 111D.

[0222] For example, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first sub-layer 111D in the first protection portion 101R is formed at the same time, which can simplify the manufacturing process.

[0223] Optionally, in some embodiments, the thickness of the first sub-layer 111D is the same as the thickness of the first encapsulation layer 30R.

[0224] For example, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first sub-layer 111D is formed at the same time, so that the thickness of the first sub-layer 111D is the same as the thickness of the first encapsulation layer 30R.

[0225] For example, in some embodiments, at least part of the protection portion 101 includes only the first sub-layer 111D, for example, the entire protection portion 101 includes only the first sub-layer 111D.

[0226] In some embodiments, the light-emitting device 20 also includes a light-emitting functional layer 21 and a second electrode 22, and the first electrode 14, the light-emitting functional layer 21 and the second electrode 22 are stacked in sequence on one side of the substrate 11; the first protective portion 101R includes a second sublayer 112D, and the second sublayer 112D and the second electrode 22 of the first color light-emitting device 20R are arranged in the same layer and material.

[0227] For example, during the manufacturing process of the display panel, when the second electrode 22 of the first color light emitting device 20R is formed, the second sublayer 112D in the first protection portion 101R is formed at the same time, which can simplify the manufacturing process.

[0228] Optionally, in some embodiments, the second protection portion 101G includes a second sub-layer.

[0229] For example, during the manufacturing process of the display panel, when the second electrode 22 of the first color light emitting device 20R is formed, the second sublayer 112D in the second protection portion 101G is formed at the same time, which can simplify the manufacturing process.

[0230] Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode 22 of the first color light emitting device 20R;

[0231] For example, during the manufacturing process of the display panel, when the second electrode 22 of the first color light emitting device 20R is formed, the second sublayer 112D is formed at the same time, so that the thickness of the second sublayer 112D is the same as the thickness of the second electrode 22 of the first color light emitting device 20R.

[0232] Optionally, the first protection portion 101R includes a third sublayer 113D, and the third sublayer 113D and the light-emitting functional layer 21 of the first color light-emitting device 20R are provided in the same layer and with the same material.

[0233] For example, during the manufacturing process of the display panel, when the light-emitting functional layer 21 of the first color light-emitting device 20R is formed, the third sublayer 113D in the first protection portion 101R is formed at the same time, which can simplify the manufacturing process.

[0234] Optionally, the second protection portion 101G includes a third sub-layer 113D.

[0235] For example, during the manufacturing process of the display panel, when the light-emitting functional layer 21 of the first color light-emitting device 20R is formed, the third sublayer 113D in the second protection portion 101G is formed at the same time, which can simplify the manufacturing process.

[0236] Optionally, the thickness of the third sublayer 113D is the same as the thickness of the light-emitting functional layer 21 of the first color light-emitting device 20R.

[0237] For example, during the manufacturing process of the display panel, when the light emitting functional layer 21 of the first color light emitting device 20R is formed, the third sublayer 113D is formed at the same time, so that the thickness of the third sublayer 113D is the same as the thickness of the second electrode 22 of the first color light emitting device 20R.

[0238] For example, in some embodiments of the present application, on the first aspect, the first color light-emitting device 20R is far away from the second color light-emitting device 20G, and the first sublayer 111D (the packaging layer 30 covering the first light-emitting device) is easily broken between the second via hole 131G and the first color light-emitting device 20R. Therefore, the groove 16C is arranged between the first color light-emitting device 20R and the second via hole 131G. Even if the first sublayer 111D (the packaging layer 30 covering the first light-emitting device) collapses and breaks on the side of the groove 16C away from the second via hole 131G, the protection part 101 can also be supported at the groove 16C, so that the protection part 101 continues to cover above the second via hole 131G, avoiding the collapse and breakage of the protection part 101 above the second via hole 131G, so that the protection part 101 can protect the second via hole 131G. Secondly, the protection portion 101 blocks the diffusion path of water vapor and oxygen in the groove 16C, for example, preventing water vapor and oxygen from entering the oxidation isolation structure 16 , thereby improving the display quality and reliability of the display panel 100 .

[0239] For example, in some embodiments of the present application, compared with the second color light-emitting device 20G and the second encapsulation layer 30G, the first color light-emitting device 20R and the first encapsulation layer 30R are manufactured first, and the first protection portion 101R and the second protection portion 101G are manufactured when the first color light-emitting device 20R and the first encapsulation layer 30R are manufactured. In the subsequent manufacturing process of the second color light-emitting device 20G and the second encapsulation layer 30G, on the second aspect, the first protection portion 101R can protect the first via 131R and the second via 131G, and can prevent the electrodes or traces at the first via 131R and the second via 131G from being over-etched by the subsequent manufacturing process, for example, it can prevent them from being over-etched by the etching solution in the subsequent manufacturing process, thereby It avoids defects such as voids in the electrode or wiring (such as the isolation structure 16) at the second via 131G, and prevents or improves display defects such as dark spots. Thirdly, during the manufacturing process of the display panel 100, after the protection portion 101 is formed, the protection portion 101 and the groove 16C can protect the via 131. In the subsequent manufacturing process, it can avoid that the etching solution penetrates through the portion between the protection portion and the isolation structure to damage the isolation structure 16 at the via 131, or it can avoid that the etching solution penetrates through the side end surface of the protection portion to damage the isolation structure 16 at the via 131, thereby avoiding defects such as voids in the isolation structure 16 at the via 131, preventing or improving display defects such as dark spots, and improving the display quality and reliability of the display panel.

[0240] See also Figures 6 to 8 .

[0241] In some embodiments, Figures 6 to 8As shown, the plurality of light emitting devices 20 further include a plurality of third color light emitting devices 20B, and the first color light emitting device 20R, the second color light emitting device 20G and the third color light emitting device 20B respectively emit light of different colors;

[0242] The plurality of via holes 131 further include a plurality of third via holes 131B, and the third color light emitting device 20B is connected to the corresponding first conductive portion 121 through the corresponding third via holes 131B;

[0243] The encapsulation layer 30 further includes a plurality of third encapsulation layers 30B, and the third encapsulation layers 30B are arranged on a side of the corresponding third color light emitting device 20B away from the substrate 11;

[0244] The plurality of protection portions 101 further include a plurality of third protection portions 101B, and the orthographic projections of the third protection portions 101B on the substrate 11 cover the orthographic projections of the corresponding third via holes 131B on the substrate 11 .

[0245] For example, in some embodiments, the first color light emitting device 20R, the second color light emitting device 20G, and the third color light emitting device 20B may be different ones of a red light emitting device, a green light emitting device, and a blue light emitting device. For example, the first color light emitting device 20R is a red light emitting device, the second color light emitting device 20G is a green light emitting device, and the third color light emitting device 20B is a blue light emitting device; for example, the first color light emitting device 20R is a blue light emitting device, the second color light emitting device 20G is a red light emitting device, and the third color light emitting device 20B is a green light emitting device.

[0246] For example, Figure 7 and Figure 8 As shown, the first electrode 14 of the third color light emitting device 20B is the third device electrode 14B, the light emitting functional layer 21 of the third color light emitting device 20B is the third device light emitting functional layer 21B, and the second electrode 22 of the third color light emitting device 20B is the sixth device electrode 22B.

[0247] For example, Figure 7 and Figure 8 As shown, the third color light emitting device 20B is connected to the corresponding first conductive part 121 through the corresponding third via 131B, the third encapsulation layer 30B is arranged on the side of the corresponding third color light emitting device 20B away from the substrate 11, and the orthographic projection of the third protection part 101B on the substrate 11 covers the orthographic projection of the corresponding third via 131B on the substrate 11.

[0248] For example, Figure 8 As shown, a third gap 30J3 is formed between the third encapsulation layer 30B and the surface of the isolation structure 16 away from the substrate 11 .

[0249] Optionally, in some embodiments, the third protection portion 101B includes a first sub-layer 111D.

[0250] For example, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first sub-layer 111D in the third protection portion 101B is formed at the same time, which can simplify the manufacturing process.

[0251] For example, in some embodiments, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first protection portion 101R, the second protection portion 101G, and the first sub-layer 111D in the third protection portion 101B are formed at the same time, which can simplify the manufacturing process.

[0252] In some embodiments, the light-emitting device 20 also includes a light-emitting functional layer 21 and a second electrode 22, and the first electrode 14, the light-emitting functional layer 21 and the second electrode 22 are stacked in sequence on one side of the substrate 11; the first protective portion 101R also includes a second sublayer 112D, and the second sublayer 112D and the second electrode 22 of the first color light-emitting device 20R are arranged in the same layer and material.

[0253] Optionally, in some embodiments, the second protection portion 101G further includes a second sub-layer 112D.

[0254] Optionally, in some embodiments, the third protection portion 101B further includes a second sub-layer 112D.

[0255] Optionally, in some embodiments, the thickness of the second sublayer 112D is the same as the thickness of the second electrode 22 of the first color light emitting device 20R.

[0256] For example, during the manufacturing process of the display panel, when the second electrode 22 of the first color light emitting device 20R is formed, the second protection portion 101G and / or the first sublayer 111D in the third protection portion 101B are simultaneously formed, which can simplify the manufacturing process.

[0257] For example, in some embodiments, during the manufacturing process of the display panel, when the second electrode 22 of the first color light-emitting device 20R is formed, the second sublayer 112D in the first protective portion 101R, the second protective portion 101G and / or the third protective portion 101B is formed at the same time, which can simplify the manufacturing process.

[0258] Optionally, in some embodiments, the first protection portion 101R further includes a third sublayer 113D, and the third sublayer 113D and the light-emitting functional layer 21 of the first color light-emitting device 20R are provided in the same layer and with the same material.

[0259] Optionally, in some embodiments, the second protection portion 101G further includes a third sublayer 113D.

[0260] Optionally, in some embodiments, the third protection portion 101B further includes a third sub-layer 113D.

[0261] Optionally, the thickness of the third sublayer 113D is the same as the thickness of the light-emitting functional layer 21 of the first color light-emitting device 20R.

[0262] For example, in some embodiments, during the manufacturing process of the display panel, when the second electrode 22 of the first color light-emitting device 20R is formed, the third sublayer 113D in the first protective portion 101R, the second protective portion 101G and / or the third protective portion 101B is formed at the same time, which can simplify the manufacturing process.

[0263] Optionally, in some embodiments, on a side of the corresponding via hole 131 away from the substrate 11 , the isolation structure 16 , the third sublayer 113D, the second sublayer and the first sublayer 111D are sequentially stacked on one side of the substrate 11 .

[0264] For example, in some embodiments, the first protection portion 101R includes a first sublayer 111D, a second sublayer 112D, and a third sublayer 113D, the second protection portion 101G includes a first sublayer 111D, a second sublayer 112D, and a third sublayer 113D, and the third protection portion 101B includes a first sublayer 111D, a second sublayer 112D, and a third sublayer 113D. The first sublayer 111D and the first encapsulation layer 30R are provided in the same layer and the same material, the second sublayer 112D and the second electrode 22 of the first color light emitting device 20R are provided in the same layer and the same material, and the third sublayer 113D and the light emitting functional layer 21 of the first color light emitting device 20R are provided in the same layer and the same material. On the side of the corresponding via 131 away from the substrate 11, the third sublayer 113D, the second sublayer 112D, and the first sublayer 111D are stacked in sequence on one side of the substrate 11.

[0265] In some embodiments, Figure 2 As shown, the display panel 100 also includes a pixel definition layer 15, which is arranged on a side of the first insulating layer 13 away from the substrate 11. The pixel definition layer 15 includes a pixel definition structure 151 and a plurality of pixel openings 152 surrounded by the pixel definition structure 151. The pixel opening 152 exposes a portion of the first electrode 14; the orthographic projection of the pixel opening 152 on the substrate 11 is located within the orthographic projection range of the isolation opening 16K on the substrate 11; and the groove 16C exposes a portion of the pixel definition layer 15.

[0266] For example, the pixel definition layer 15 and the isolation structure 16 are made of different materials, and when the groove 16C is formed, the pixel definition layer 15 is retained, so that the groove 16C exposes a portion of the pixel definition layer 15. The depth of the groove 16C can be reduced, the protection part 101 can be prevented from breaking at the edge of the groove 16C, and better support can be provided for the protection part 101.

[0267] For example, in some embodiments of the present application, on the first aspect, the first color light-emitting device 20R is far away from the third color light-emitting device 20B, and the first sublayer 111D (the packaging layer 30 covering the first light-emitting device) is easily broken between the third via hole 131B and the first color light-emitting device 20R. Therefore, the groove 16C is provided between the first color light-emitting device 20R and the third via hole 131B. Even if the first sublayer 111D (the packaging layer 30 covering the first light-emitting device) collapses and breaks on the side of the groove 16C away from the third via hole 131B, the protection part 101 can also be supported at the groove 16C, so that the protection part 101 continues to cover the top of the third via hole 131B, avoiding the collapse and breakage of the protection part 101 above the third via hole 131B, so that the protection part 101 can protect the third via hole 131B. Secondly, the protection portion 101 blocks the diffusion path of water vapor and oxygen in the groove 16C, for example, preventing water vapor and oxygen from entering the oxidation isolation structure 16 , thereby improving the display quality and reliability of the display panel 100 .

[0268] For example, in some embodiments of the present application, compared with the second color light-emitting device 20G and the second packaging layer 30G, the third color light-emitting device 20B and the third packaging layer 30B, the first color light-emitting device 20R and the first packaging layer 30R are manufactured first, and the first protection part 101R, the second protection part 101G and the third protection part 101B are manufactured when the first color light-emitting device 20R and the first packaging layer 30R are manufactured. In the subsequent manufacturing process of the second color light-emitting device 20G and the second packaging layer 30G, and in the subsequent manufacturing process of the third color light-emitting device 20B and the third packaging layer 30B, on the second aspect, the first protection part 101R can protect the first via 131R, the second via 131G and the third via 131B, and can avoid the electrodes or traces at the first via 131R, the second via 131G and the third via 131B. It can avoid being over-etched by the subsequent manufacturing process, for example, it can avoid being over-etched by the etching solution in the subsequent manufacturing process, so as to avoid defects such as voids in the electrodes or wirings (such as the isolation structure 16) at the second via hole 131G and the third via hole 131B, and prevent or improve display defects such as dark spots; thirdly, in the manufacturing process of the display panel 100, after the protection part 101 is formed, the protection part 101 and the groove 16C can protect the via hole 131, and in the subsequent manufacturing process, it can avoid the etching solution from penetrating through the part between the protection part and the isolation structure to damage the isolation structure 16 at the via hole 131, or it can avoid the etching solution from penetrating through the part of the side end surface of the protection part to damage the isolation structure 16 at the via hole 131, so as to avoid defects such as voids in the isolation structure 16 at the via hole 131, and prevent or improve display defects such as dark spots, thereby improving the display quality and reliability of the display panel.

[0269] Second, see Figures 1 to 13 .

[0270] The present application provides a display panel 100, which includes a substrate 11, a first conductive layer 12, a first insulating layer 13, an isolation structure 16, a plurality of light-emitting devices 20 and an encapsulation layer 30; the first conductive layer 12 is arranged on one side of the substrate 11, and the first conductive layer 12 includes a plurality of first conductive portions 121; the first insulating layer 13 is arranged on a side of the first conductive layer 12 away from the substrate 11, and the first insulating layer 13 includes a plurality of vias 131; the isolation structure 16 is arranged on a side of the first insulating layer 13 away from the substrate 11, and the plurality of isolation structures 16 are enclosed to form a plurality of isolation portions 131. The light-emitting devices 20 are disposed on the side of the first insulating layer 13 away from the substrate 11, and the light-emitting devices 20 are at least partially located in the corresponding isolation opening 16K. The light-emitting devices 20 are connected to the corresponding first conductive portion 121 through the via hole 131. The encapsulation layer 30 is disposed on the side of the light-emitting device 20 away from the substrate 11, and part of the encapsulation layer 30 extends to the side of the isolation structure 16 away from the substrate 11 and covers the corresponding groove 16C. The orthographic projection of the via hole 131 on the substrate 11 is located within the orthographic projection range of the encapsulation layer 30 on the substrate 11.

[0271] For example, Figure 2 As shown, the orthographic projection of the isolation structure 16 on the substrate 11 covers the orthographic projection of the via 131 on the substrate 11, the isolation structure 16 includes a plurality of grooves 16C, the openings of the grooves 16C are toward the side of the isolation structure 16 away from the substrate 11, and the grooves 16C are arranged on at least one side of at least part of the via 131 on a plane parallel to the substrate 11; the isolation structure 16 includes a support portion 1601 and a crown portion 1602 stacked in sequence on one side of the substrate 11, the support portion 1601 includes a first groove side wall 1601a1 close to the via 131, and a second groove side wall 1601a2 away from the via 131; the crown portion 1602 protrudes relative to at least one of the first groove side wall 1601a1 and the second groove side wall 1601a2 in a direction toward the groove 16C to form a protruding structure.

[0272] In some embodiments, the display panel 100 further includes a plurality of protection parts 101. The plurality of protection parts 101 are disposed on a side of the isolation structure 16 away from the substrate 11, and are disposed corresponding to the plurality of via holes 131, and the orthographic projections of the protection parts 101 on the substrate 11 cover the orthographic projections of the corresponding via holes 131 on the substrate 11; wherein the protection parts 101 include a first sublayer 111D, the first sublayer 111D and at least a portion of the encapsulation layer 30 are disposed in the same layer and the same material, and the first sublayer 111D is in direct contact with at least a portion of the sidewall of the groove 16C.

[0273] In some embodiments, the plurality of light emitting devices 20 include a first light emitting device 201 and a second light emitting device 202 that are adjacently disposed, and the via hole 131 corresponding to the second light emitting device 202 is disposed between the first light emitting device 201 and the second light emitting device 202 .

[0274] Optionally, in some embodiments, the groove 16C is disposed between the via holes 131 corresponding to the first light emitting device 201 and the second light emitting device 202 .

[0275] Optionally, in some embodiments, the orthographic projection of the groove 16C on the substrate 11 is arranged around the orthographic projection of the corresponding via hole 131 on the substrate 11 , and the groove 16C is arranged in a ring shape.

[0276] It should be noted that, in the above embodiments, under the combined conditions of the dry etching process and the wet etching process, the first protection portion 101R, the second protection portion 101G and the third protection portion 101B may only include the first sub-layer 111D.

[0277] It should be noted that in the above embodiments, under the combined conditions of dry etching process and wet etching process, the first protection part 101R, the second protection part 101G and the third protection part 101B include a first sub-layer 111D, and there is a gap between the protection part 101 and the isolation structure 16, and in the wet etching process, part of the second sub-layer 112D and part of the third sub-layer 113D may remain in the gap, that is, part of the second sub-layer 112D and part of the third sub-layer 113D fill the gap.

[0278] For example, in some other embodiments, in the dry etching process, under the dry etching process conditions, the first protection part 101R, the second protection part 101G and the third protection part 101B include a first sublayer 111D, a second sublayer 112D and a third sublayer 113D, the first sublayer 111D and the first encapsulation layer 30R are arranged in the same layer and the same material, the second sublayer 112D and the second electrode 22 of the first color light-emitting device 20R are arranged in the same layer and the same material, and the third sublayer 113D and the light-emitting functional layer 21 of the first color light-emitting device 20R are arranged in the same layer and the same material.

[0279] See also Fig.14 , Fig.14 A schematic diagram of a display device 200 provided in some embodiments of the present application.

[0280] Third, see Fig.14 The present application provides a display device 200, which includes the display panel 100 of any one of the above items, or the display device 200 includes the display panel 100 having any combination of the above features.

[0281] For example, the display device 200 may be a mobile phone, a laptop computer, a television, etc., but is not limited thereto.

[0282] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0283] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: include: substrate; A first conductive layer, disposed on one side of the substrate, the first conductive layer comprising a plurality of first conductive parts; A first insulating layer, disposed on a side of the first conductive layer away from the substrate, the first insulating layer comprising a plurality of vias; An isolation structure, disposed on a side of the first insulating layer away from the substrate, the isolation structure enclosing a plurality of isolation openings and grooves; A plurality of light-emitting devices are arranged on a side of the first insulating layer away from the substrate, the light-emitting devices are at least partially located in the corresponding isolation openings, and the light-emitting devices are connected to the corresponding first conductive parts through the via holes; A protection portion, disposed on a side of the isolation structure away from the substrate, wherein an orthographic projection of the protection portion on the substrate covers an orthographic projection of the corresponding via hole on the substrate; Wherein, at least a portion of the protection portion is disposed in the groove.

2. The display panel according to claim 1, characterized in that: Also includes: An encapsulation layer, disposed on a side of the light emitting device away from the substrate; The protection portion includes a first sub-layer, the first sub-layer and at least a portion of the encapsulation layer are formed in the same layer and made of the same material, and the first sub-layer is in direct contact with at least a portion of the sidewall of the groove.

3. The display panel according to claim 2, characterized in that: The isolation structure includes a support portion and a crown portion sequentially stacked on one side of the base; Optionally, the groove includes a first sub-opening and a second sub-opening that are connected, the support portion encloses the first sub-opening, the crown portion encloses the second sub-opening, and the orthographic projection of the second sub-opening on the base is located within the orthographic projection range of the first sub-opening on the base; On a plane parallel to the substrate, an area of ​​the first sub-opening is larger than an area of ​​the second sub-opening; Optionally, on a plane perpendicular to the substrate, the first sub-opening passes through the support portion; Optionally, on a plane perpendicular to the substrate, the first sub-opening passes through a portion of the support portion.

4. The display panel according to claim 3, characterized in that: In a direction perpendicular to the plane where the base is located, the groove passes through the crown portion and at least a portion of the support portion; Optionally, in a direction perpendicular to the plane where the base is located, the groove passes through the support portion; Optionally, the isolation structure further comprises a cushion portion, wherein the cushion portion, the support portion and the crown portion are sequentially stacked on one side of the base; Optionally, in a direction perpendicular to the plane where the base is located, the groove runs through the crown portion, the support portion and the pad portion; Optionally, in a direction perpendicular to the plane where the substrate is located, the depth of the groove is less than the thickness of the isolation structure.

5. The display panel according to claim 1, characterized in that: The plurality of light emitting devices include a first light emitting device and a second light emitting device that are adjacently arranged, and the via hole corresponding to the second light emitting device is arranged between the first light emitting device and the second light emitting device; The groove is disposed between the via holes correspondingly connected to the first light emitting device and the second light emitting device.

6. The display panel according to claim 1, characterized in that: The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device, the vias include a first device via and a second device via, the plurality of first conductive portions include a first device conductive portion and a second device conductive portion, the first light-emitting device is connected to the first device conductive portion through the first device via, the second light-emitting device is connected to the second device conductive portion through the second device via, and the second device via corresponding to the second light-emitting device is arranged between the first light-emitting device and the second light-emitting device; Optionally, the groove comprises a first groove arranged on a side of the second device via hole close to the first light-emitting device; Optionally, the plurality of light-emitting devices further include a third light-emitting device, the via further includes a third device via, the first conductive portion further includes a third device conductive portion, the third light-emitting device is connected to the third device conductive portion through the third device via, and the groove includes a second groove arranged on a side of the third device via close to the first light-emitting device.

7. The display panel according to claim 1, characterized in that: The orthographic projection of the groove on the substrate is arranged around the orthographic projection of the via hole correspondingly connected to the light-emitting device on the substrate, and the groove is arranged in a ring shape.

8. The display panel according to claim 1, characterized in that: The light emitting device comprises a first electrode, and the first electrode is connected to the corresponding first conductive part through the via hole; The orthographic projection of the groove on the substrate and the orthographic projection of the corresponding via hole on the substrate are both located within the orthographic projection range of the first electrode of the same corresponding light-emitting device on the substrate.

9. The display panel according to claim 1, characterized in that: On a plane parallel to the substrate, the groove includes a plurality of groove sub-segments arranged at intervals, the groove sub-segments are arranged in an arc shape and are arranged on at least one side of the via hole; Optionally, the groove is arranged around the via hole.

10. The display panel according to claim 2, characterized in that: The light-emitting device comprises a first electrode, a light-emitting functional layer and a second electrode, wherein the first electrode, the light-emitting functional layer and the second electrode are sequentially stacked on a side of the first insulating layer away from the substrate, and the first electrode is connected to the corresponding first conductive part through the via hole; Optionally, the protection portion includes a first protection sub-portion located in the groove; The first protection sub-part further includes a second sub-layer and a third sub-layer located on a side of the first sub-layer close to the substrate, the second sub-layer and the second electrode of at least part of the light-emitting device are arranged in the same layer and the same material, and the third sub-layer and the light-emitting functional layer of at least part of the light-emitting device are arranged in the same layer and the same material; The second sub-layer and the third sub-layer are arranged on the bottom wall of the groove close to the substrate, and at least part of the first sub-layer covers the side wall of the groove; Optionally, in a direction parallel to the plane where the substrate is located, the isolation structure includes a first isolation substructure with a first height, and a second isolation substructure with a second height, the orthographic projection of the first isolation substructure on the substrate overlaps with the orthographic projection of the via hole on the substrate, the second isolation substructure is located between the via hole and the groove, and the second height is greater than the first height; Optionally, the protection portion includes a second protection sub-portion located on a side of the second isolation sub-structure away from the substrate, and a first gap is provided between the first sub-layer of the second protection sub-portion and a surface of a side of the second isolation sub-structure away from the substrate; Optionally, the second protection sub-section further includes a second sub-layer and a third sub-layer, and parts of the second sub-layer and the third sub-layer fill the first gap; Optionally, the second sub-layer includes a first sub-portion and a second sub-portion that are spaced apart from each other, the first sub-portion is located on a side of the isolation structure away from the substrate, and the second sub-portion is located in the groove; The third sub-layer comprises a third sub-portion and a fourth sub-portion which are arranged at intervals, the third sub-portion is located at a side of the isolation structure away from the substrate, and the fourth sub-portion is located in the groove; The first sub-layer covers the second sub-portion and covers the sidewall of the groove; Optionally, the protection portion includes a third protection sub-portion located on a side of the first isolation sub-structure away from the substrate, and a first gap is provided between the third protection sub-portion and a side surface of the first isolation sub-structure away from the substrate.

11. The display panel according to claim 2, characterized in that: The display panel further comprises a pixel definition layer, the pixel definition layer is arranged on a side of the first insulating layer away from the substrate, the pixel definition layer comprises a pixel definition structure, and a plurality of pixel openings surrounded by the pixel definition structure, the light emitting device comprises a first electrode, the first electrode is connected to the corresponding first conductive part through the via hole, and the pixel opening is arranged corresponding to the first electrode; In a direction perpendicular to the plane where the substrate is located, part of the pixel definition structure is arranged between the protection portion and the first electrode, and the orthographic projection of the pixel definition structure on the substrate covers the orthographic projection of the via hole on the substrate.

12. The display panel according to claim 2, characterized in that: The plurality of light emitting devices include a plurality of first color light emitting devices and a plurality of second color light emitting devices, and the first color light emitting devices and the second color light emitting devices emit light of different colors; The plurality of via holes include a plurality of first via holes and a plurality of second via holes, the first color light emitting device is connected to the corresponding first conductive part through the corresponding first via hole, and the second color light emitting device is connected to the corresponding first conductive part through the corresponding second via hole; The display panel further includes an encapsulation layer, which is disposed on a side of the corresponding light-emitting device away from the substrate, and includes a plurality of first encapsulation layers and a plurality of second encapsulation layers, wherein the first encapsulation layer is disposed on a side of the corresponding light-emitting device of the first color away from the substrate, and the second encapsulation layer is disposed on a side of the corresponding light-emitting device of the second color away from the substrate; The plurality of protection parts include a plurality of first protection parts and a plurality of second protection parts, the orthographic projection of the first protection part on the substrate covers the orthographic projection of the corresponding first via hole on the substrate, and the orthographic projection of the second protection part on the substrate covers the orthographic projection of the corresponding second via hole on the substrate; Optionally, the first protection portion includes a first sublayer, and the first sublayer and the first encapsulation layer are provided in the same layer and with the same material; Optionally, the second protection portion includes the first sublayer; Optionally, a thickness of the first sub-layer is the same as a thickness of the first encapsulation layer.

13. The display panel according to claim 12, characterized in that: The light emitting device comprises a first electrode, a light emitting functional layer and a second electrode, wherein the first electrode, the light emitting functional layer and the second electrode are sequentially stacked on one side of the substrate; The first protection portion includes a second sublayer, and the second sublayer and the second electrode of the first color light emitting device are provided in the same layer and the same material; Optionally, the second protection portion includes the second sublayer; Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode of the first color light emitting device; Optionally, the first protection portion includes a third sublayer, and the third sublayer and the light-emitting functional layer of the first color light-emitting device are arranged in the same layer and with the same material; Optionally, the second protection portion includes the third sublayer; Optionally, the thickness of the third sublayer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device.

14. The display panel according to claim 12, characterized in that: The plurality of light emitting devices further include a plurality of third color light emitting devices, wherein the first color light emitting device, the second color light emitting device and the third color light emitting device emit light of different colors respectively; The plurality of via holes further include a plurality of third via holes, and the third color light emitting device is connected to the corresponding first conductive part through the corresponding third via holes; The encapsulation layer further comprises a plurality of third encapsulation layers, wherein the third encapsulation layers are arranged on a side of the corresponding third color light emitting device away from the substrate; The plurality of protection parts further include a plurality of third protection parts, and the orthographic projections of the third protection parts on the substrate cover the orthographic projections of the corresponding third via holes on the substrate; Optionally, the third protection portion includes the first sublayer.

15. The display panel according to claim 14, characterized in that: The light emitting device comprises a first electrode, a light emitting functional layer and a second electrode, wherein the first electrode, the light emitting functional layer and the second electrode are sequentially stacked on one side of the substrate; The first protection portion further includes a second sublayer, and the second sublayer and the second electrode of the first color light-emitting device are provided in the same layer and with the same material; Optionally, the second protection portion further includes the second sublayer; Optionally, the third protection portion further includes the second sublayer; Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode of the first color light emitting device; Optionally, the first protection portion further includes a third sublayer, and the third sublayer and the light-emitting functional layer of the first color light-emitting device are arranged in the same layer and with the same material; Optionally, the second protection portion further includes the third sublayer; Optionally, the third protection portion further includes the third sublayer; Optionally, the thickness of the third sublayer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device; Optionally, on a side of the corresponding via hole away from the substrate, the isolation structure, the third sub-layer, the second sub-layer and the first sub-layer are stacked in sequence on one side of the substrate.

16. The display panel according to claim 15, characterized in that: The display panel further includes a pixel definition layer, which is disposed on a side of the first insulating layer away from the substrate, the pixel definition layer includes a pixel definition structure, and a plurality of pixel openings surrounded by the pixel definition structure, and the pixel openings expose a portion of the first electrode; The orthographic projection of the pixel opening on the substrate is within the range of the orthographic projection of the isolation opening on the substrate; The groove exposes a portion of the pixel definition layer.

17. A display panel, characterized in that: include: substrate; A first conductive layer, disposed on one side of the substrate, the first conductive layer comprising a plurality of first conductive parts; A first insulating layer, disposed on a side of the first conductive layer away from the substrate, the first insulating layer comprising a plurality of vias; An isolation structure is arranged on a side of the first insulating layer away from the substrate, and a plurality of the isolation structures are combined to form a plurality of isolation openings and grooves; A plurality of light-emitting devices are arranged on a side of the first insulating layer away from the substrate, the light-emitting devices are at least partially located in the corresponding isolation openings, and the light-emitting devices are connected to the corresponding first conductive parts through the via holes; The encapsulation layer is arranged on the side of the light-emitting device away from the substrate, and part of the encapsulation layer extends to the side of the isolation structure away from the substrate and covers the corresponding groove. The orthographic projection of the via hole on the substrate is located within the range of the orthographic projection of the encapsulation layer on the substrate.

18. The display panel according to claim 17, characterized in that: Also includes: A protection portion, arranged on a side of the isolation structure away from the substrate, and arranged corresponding to the plurality of via holes, wherein the orthographic projection of the protection portion on the substrate covers the orthographic projection of the corresponding via hole on the substrate; The protection portion includes a first sub-layer, the first sub-layer and at least a portion of the encapsulation layer are provided in the same layer and with the same material, and the first sub-layer is in direct contact with at least a portion of the sidewall of the groove.

19. The display panel according to claim 18, characterized in that: The plurality of light emitting devices include a first light emitting device and a second light emitting device that are adjacently arranged, and the via hole corresponding to the second light emitting device is arranged between the first light emitting device and the second light emitting device; Optionally, the groove is provided between the via holes corresponding to the first light emitting device and the second light emitting device; Optionally, the orthographic projection of the groove on the substrate is arranged around the orthographic projection of the corresponding via hole on the substrate, and the groove is arranged in a ring shape.

20. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 19.

Images