Display panel, display equipment and preparation method of display panel

Abstract

The invention provides a display panel, a display device and a preparation method of the display panel, the display panel comprises a substrate, an isolation structure, sub-pixels and a packaging structure, and the isolation structure is arranged on one side of the substrate; each sub-pixel comprises a light-emitting structure and a first electrode which are sequentially stacked in the direction away from the substrate, part of the light-emitting structure and part of the first electrode are located in the corresponding isolation opening, and the end, in the extending direction of the substrate, of each light-emitting structure is in lap joint with the surface of the side, away from the substrate, of the corresponding isolation structure. The packaging structure comprises a first packaging part and a second packaging part, the first packaging part covers the surface of the side, away from the substrate, of the sub-pixel, and the second packaging part is arranged on the isolation structure and makes contact with the side wall of the end, in the extending direction of the substrate, of the light-emitting structure; wherein in the direction perpendicular to the substrate, the distance between the side, away from the substrate, of the second packaging part and the side, away from the substrate, of the isolation structure is larger than the sum of the thickness, in the isolation opening, of the light-emitting structure and the thickness, in the isolation opening, of the first electrode.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and in particular, to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] As electronic display devices are widely used, people have higher requirements for the performance of electronic display devices. Display panels based on technologies such as organic light emitting diodes (OLED) and light emitting diodes (LED) are widely used in various electronic display devices such as mobile phones, televisions, laptops, and desktop computers due to their advantages of high image quality, power saving, and thin body.

[0003] In the related art, during the manufacturing process of the display panel, problems are prone to occur in the internal packaging structure of the display panel. Summary of the invention

[0004] In order to solve the above problems, embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel, so as to at least partially solve the above problems.

[0005] In a first aspect, the present application provides a display panel, comprising a substrate, an isolation structure, a sub-pixel and a packaging structure, wherein the isolation structure is arranged on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; the sub-pixels and the isolation openings are arranged correspondingly, and the sub-pixels include a light-emitting structure and a first electrode stacked in sequence in a direction away from the substrate, part of the light-emitting structure and part of the first electrode are located in the isolation opening, and the end of the light-emitting structure in the extension direction of the substrate overlaps the surface of the isolation structure on the side away from the substrate; the packaging structure is arranged correspondingly to the sub-pixels, and the packaging structure includes a first packaging part and a second packaging part, the first packaging part covers the surface of the sub-pixel on the side away from the substrate, and the second packaging part is arranged on the isolation structure and contacts the side wall of the end of the light-emitting structure in the extension direction of the substrate; wherein, along a direction perpendicular to the substrate, the distance between the side of the second packaging part away from the substrate and the side of the isolation structure away from the substrate is greater than the sum of the thickness of the light-emitting structure in the isolation opening and the thickness of the first electrode in the isolation opening.

[0006] In one embodiment, the second encapsulation part is arranged on a surface of the isolation structure away from the substrate, and along a direction away from the substrate, a part of the light emitting structure, a part of the first electrode and a part of the first encapsulation part are sequentially stacked on the side of the second encapsulation part away from the substrate;

[0007] Preferably, along a direction perpendicular to the substrate, a distance between a side of the second encapsulation portion facing away from the substrate and a side of the isolation structure facing away from the substrate is equal to 1.5 to 2 times the sum of a thickness of the light emitting structure in the isolation opening and a thickness of the first electrode in the isolation opening;

[0008] Preferably, the first packaging part and the second packaging part are made of different materials;

[0009] Preferably, the material of the first packaging part includes an inorganic material, and / or the material of the second packaging part includes a metal material;

[0010] Preferably, the material of the second packaging part includes aluminum;

[0011] Preferably, along an extension direction parallel to the substrate, a width of the second encapsulation portion is 0.08 micrometers to 0.2 micrometers;

[0012] Preferably, along an extension direction parallel to the substrate, a width of the second encapsulation portion is 0.08 micrometers to 0.12 micrometers.

[0013] In one embodiment, the isolation structure includes a trench located between two adjacent isolation openings, and is separated into at least two isolation portions by the trench, wherein the at least two isolation portions include a first isolation portion adjacent to one isolation opening and a second isolation portion adjacent to another isolation opening;

[0014] The second encapsulation part adjacent to the first isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first encapsulation part, and the other end extends into the channel and contacts with the first isolation part;

[0015] The second packaging part adjacent to the second isolation part extends in a direction perpendicular to the substrate, and one end of the second packaging part extends to connect with the first packaging part, and the other end of the second packaging part extends into the channel and contacts with the second isolation part.

[0016] In one embodiment, the orthographic projection of the channel between two adjacent isolation openings on the substrate includes a polygonal solid shadow, an elliptical solid shadow or a circular solid shadow; preferably, the second packaging part adjacent to the first isolation part and the second packaging part adjacent to the second isolation part extend into the same channel; or, the orthographic projection of the channel between two adjacent isolation openings on the substrate includes a ring shape, and the at least two isolation parts also include an intermediate isolation part located between the channels; preferably, the second packaging part adjacent to the first isolation part extends into the channel between the intermediate isolation part and the first isolation part, and the second packaging part adjacent to the second isolation part extends into the channel between the intermediate isolation part and the second isolation part.

[0017] In one embodiment, the channel penetrates at least a portion of the isolation structure along a direction perpendicular to the substrate; preferably, the channel penetrates the isolation structure along a direction perpendicular to the substrate.

[0018] In one embodiment, the second packaging portion corresponding to part of the isolation opening is arranged on the surface of the isolation structure on the side away from the substrate, and along the direction away from the substrate, part of the light-emitting structure, part of the first electrode and part of the first packaging portion are sequentially stacked on the side of the second packaging portion away from the substrate; part of the isolation structure located between two adjacent isolation openings has a channel and is separated into at least two isolation portions by the channel, and the at least two isolation portions include a first isolation portion adjacent to one isolation opening and a second isolation portion adjacent to the other isolation opening, the second packaging portion adjacent to the first isolation portion extends in a direction perpendicular to the substrate, and one end extends to connect with the first packaging portion, and the other end extends into the channel and contacts with the first isolation portion, and the second packaging portion adjacent to the second isolation portion extends in a direction perpendicular to the substrate, and one end extends to connect with the first packaging portion, and the other end extends into the channel and contacts with the second isolation portion.

[0019] In one embodiment, the orthographic projection of the channel between two adjacent isolation openings on the substrate includes a polygonal solid shadow, an elliptical solid shadow, or a circular solid shadow;

[0020] Preferably, the second encapsulation portion adjacent to the first isolation portion and the second encapsulation portion adjacent to the second isolation portion extend into the same channel; or,

[0021] The orthographic projection of the channel between two adjacent isolation openings on the substrate includes a ring shape;

[0022] Preferably, the at least two isolation parts also include an intermediate isolation part located between the channels, the second packaging part adjacent to the first isolation part extends into the channel between the intermediate isolation part and the first isolation part, and the second packaging part adjacent to the second isolation part extends into the channel between the intermediate isolation part and the second isolation part.

[0023] In one embodiment, the multiple isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening, the sub-pixels include a first sub-pixel, a second sub-pixel, and a third sub-pixel, the first sub-pixel is arranged in the first isolation opening, the second sub-pixel is arranged in the second isolation opening, and the third sub-pixel is arranged in the third isolation opening, preferably, the light-emitting color of the second sub-pixel is different from the light-emitting color of the first sub-pixel, preferably, the light-emitting color of the third sub-pixel is different from the light-emitting color of the first sub-pixel, preferably, the light-emitting color of the third sub-pixel is different from the light-emitting color of the first sub-pixel, preferably, the light-emitting color of the third sub-pixel is different from the light-emitting color of the second sub-pixel.

[0024] In one embodiment, the isolation structure includes a first structure layer and a second structure layer, the first structure layer and the second structure layer are stacked in sequence along a direction toward the substrate, and a side of the first structure layer facing the isolation opening protrudes beyond a side wall of the second structure layer; preferably, at least a portion of an orthographic projection of the second encapsulation portion on the substrate overlaps with an orthographic projection of a surface of the second structure layer on a side facing away from the substrate on the substrate;

[0025] Preferably, the material of the first structural layer is different from the material of the second structural layer;

[0026] Preferably, the material of the second structural layer includes a conductive material;

[0027] Preferably, the first electrode and the second structure layer are in conductive contact;

[0028] Preferably, the material of the first structural layer includes metal titanium, and / or the material of the second structural layer includes metal aluminum;

[0029] Preferably, the isolation structure further comprises a third structure layer, and the first structure layer, the second structure layer and the third structure layer are stacked in sequence along a direction toward the substrate;

[0030] Preferably, the material of the third structural layer and the material of the first structural layer both include metal molybdenum.

[0031] In one embodiment, the display panel further includes a pixel defining layer, wherein the pixel defining layer is located between the substrate and the isolation structure; preferably, the isolation structure includes a channel located between two adjacent isolation openings, a portion of the pixel defining layer is exposed in the channel, and the second packaging portion is stacked on the pixel defining layer through the channel.

[0032] In one embodiment, the sub-pixel also includes a second electrode, and the second electrode and the pixel defining layer are both located between the substrate and the isolation structure, and are stacked in sequence in a direction away from the substrate, the pixel defining layer has a plurality of pixel openings, the isolation openings and the pixel openings are connected one-to-one, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the corresponding isolation opening on the substrate, and a portion of the second electrode is exposed in the pixel opening; preferably, at least a portion of the material of the isolation structure includes a metal conductive material, and the first electrode is in conductive contact with the metal conductive material of the isolation structure.

[0033] In one embodiment, the display panel further includes a first encapsulation layer and a second encapsulation layer, the first encapsulation layer being arranged on a side of the encapsulation structure away from the substrate, and the second encapsulation layer being arranged on a side of the first encapsulation layer away from the substrate; preferably, the first encapsulation layer is in contact with the isolation structure; preferably, the first encapsulation layer includes an organic material, and / or the second encapsulation layer includes an inorganic material.

[0034] In a second aspect, the present application also provides another display panel, which includes a substrate, an isolation structure, a sub-pixel and a packaging structure, wherein the isolation structure is arranged on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; the sub-pixels and the isolation openings are arranged correspondingly, and the sub-pixels include a light-emitting structure and a first electrode stacked in sequence in a direction away from the substrate, part of the light-emitting structure and part of the first electrode are located in the isolation opening, and the end of the light-emitting structure in the extension direction of the substrate overlaps the surface of the isolation structure on the side away from the substrate; the packaging structure is arranged correspondingly to the sub-pixels, and the packaging structure includes a first packaging part and a second packaging part, the first packaging part covers the surface of the sub-pixel on the side away from the substrate, and the second packaging part is arranged on the side of the isolation structure away from the substrate, and contacts the side wall of the end of the light-emitting structure in the extension direction of the substrate; wherein, along the direction perpendicular to the substrate, the distance between the side of the second packaging part away from the substrate and the side of the isolation structure away from the substrate is greater than the sum of the thickness of the light-emitting structure in the isolation opening and the thickness of the first electrode in the isolation opening.

[0035] In one embodiment, along a direction perpendicular to the substrate, the thickness of the second packaging portion is 0.2-0.8 micrometers; preferably, along a direction perpendicular to the substrate, the thickness of the second packaging portion is 0.4-0.6 micrometers.

[0036] In a third aspect, the present application provides a method for preparing a display panel, the method comprising:

[0037] Providing a backplane, the backplane comprising a substrate and an isolation structure, wherein the isolation structure is disposed on one side of the substrate;

[0038] forming a second encapsulation portion on a surface of the isolation structure that is away from the substrate;

[0039] Sequentially forming a light emitting material layer, a first conductive material layer, and a first packaging material layer on one side of the backplane where the isolation structure is located;

[0040] The first packaging material layer, the first conductive material layer and the light-emitting material layer are patterned in sequence to obtain a first packaging part, a first electrode of the sub-pixel and a light-emitting structure, wherein part of the sub-pixel is located in the isolation opening, and along the direction away from the substrate, part of the light-emitting structure, part of the first electrode and part of the first packaging part are sequentially stacked on the side of the second packaging part away from the substrate, and along the direction perpendicular to the substrate, the distance between the side of the second packaging part away from the substrate and the side of the isolation structure away from the substrate is greater than the sum of the thickness of the light-emitting structure in the isolation opening and the thickness of the first electrode in the isolation opening.

[0041] In one embodiment, forming a second encapsulation portion on a side of the isolation structure away from the substrate includes:

[0042] forming a second packaging material layer on a side of the isolation structure facing away from the substrate;

[0043] The second packaging material layer is patterned to obtain a plurality of second packaging parts located on a surface of the isolation structure facing away from the substrate.

[0044] In a fourth aspect, the present application provides another method for preparing a display panel, the method comprising:

[0045] Providing a back plate, the back plate comprising a substrate and an isolation structure, the isolation structure is arranged on one side of the substrate, and the isolation structure encloses a plurality of isolation openings;

[0046] Patterning the isolation structure to form a trench on the isolation structure between two adjacent isolation openings, wherein the isolation structure is separated into at least two isolation portions by the trench, wherein the at least two isolation portions include a first isolation portion adjacent to one isolation opening and a second isolation portion adjacent to the other isolation opening;

[0047] Sequentially forming a light-emitting material layer, a first conductive material layer and a first material film layer on one side of the backplane where the isolation structure is located;

[0048] The first material film layer, the first conductive material layer and the light-emitting material layer are patterned in sequence to obtain a packaging structure, a first electrode and a light-emitting structure.

[0049] Among them, the packaging structure is a patterned film layer of the first material, and the packaging structure includes a first packaging part and a second packaging part. The first packaging part covers the surface of the sub-pixel facing away from the substrate. The second packaging part adjacent to the first isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first packaging part, and the other end extends into the channel and contacts with the first isolation part. The second packaging part adjacent to the second isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first packaging part, and the other end extends into the channel and contacts with the second isolation part. The distance between the side of the second packaging part facing away from the substrate and the side of the isolation structure facing away from the substrate is greater than the sum of the thickness of the light-emitting structure in the isolation opening and the thickness of the first electrode in the isolation opening.

[0050] In a fifth aspect, the present application provides another method for preparing a display panel, the method comprising:

[0051] Providing a back plate, the back plate comprising a substrate and an isolation structure, the isolation structure is arranged on one side of the substrate, and the isolation structure encloses a plurality of isolation openings;

[0052] forming a portion of a second encapsulation portion on a surface of a portion of the isolation structure that is away from the substrate;

[0053] A patterned partial isolation structure, wherein the isolation structure has a channel located between two adjacent isolation openings and is separated into at least two isolation parts by the channel, wherein the at least two isolation parts include a first isolation part adjacent to one isolation opening and a second isolation part adjacent to the other isolation opening;

[0054] A light emitting material layer, a first conductive material layer, and a first packaging material layer are sequentially formed on one side of the back plate where the isolation structure is located;

[0055] The first packaging material layer, the first conductive material layer and the light-emitting material layer are patterned in sequence to obtain a first packaging portion, another portion of the second packaging portion, a first electrode and a light-emitting structure,

[0056] The part of the second encapsulation part corresponding to the part of the isolation opening is arranged on the surface of the isolation structure away from the substrate, and along the direction away from the substrate, a part of the light-emitting structure, a part of the first electrode and a part of the first encapsulation part are sequentially stacked on the side of the part of the second encapsulation part away from the substrate;

[0057] The isolation structure partially located between two adjacent isolation openings has a trench and is divided into at least two isolation parts by the trench, wherein the at least two isolation parts include a first isolation part adjacent to one isolation opening and a second isolation part adjacent to the other isolation opening.

[0058] The other part of the second packaging part adjacent to the first isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first packaging part, and the other end extends into the channel and contacts with the first isolation part.

[0059] The other part of the second packaging part adjacent to the second isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first packaging part, and the other end extends into the channel and contacts with the second isolation part.

[0060] In one embodiment, forming a portion of the second encapsulation portion on a side of the partial isolation structure away from the substrate includes:

[0061] forming a second packaging material layer on a side of the isolation structure facing away from the substrate;

[0062] The second packaging material layer is patterned to obtain a plurality of second packaging parts located on a surface of the isolation structure facing away from the substrate.

[0063] In a sixth aspect, the present application provides a display device, comprising the above-mentioned display panel.

[0064] Based on the above display panel provided by the present application, since a light-emitting structure is stacked on the surface of the isolation structure away from the substrate, and the first encapsulation part covers the surface of the sub-pixel away from the substrate, at least the light-emitting structure of the sub-pixel is supported between the first encapsulation part and the surface of the isolation structure away from the substrate. Since the second encapsulation part contacts the side wall of the end of the light-emitting structure of the sub-pixel in the extension direction of the substrate, and the distance between the side of the second encapsulation part away from the substrate and the side of the isolation structure away from the substrate is greater than the sum of the thickness of the light-emitting structure in the isolation opening and the thickness of the first electrode in the isolation opening, the second encapsulation part can protect the end side wall of the sub-pixel in the extension direction of the substrate, and avoid the light-emitting structure being etched to cause a gap between the first encapsulation part and the isolation structure, thereby avoiding the connection between the first encapsulation part and the isolation structure at the gap from being broken, so that the first encapsulation part has sufficient thickness to protect the corresponding sub-pixel, and avoid the sub-pixel being etched to cause dark spots when the display panel is lit. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] The following drawings are intended only to illustrate and explain the present application, and do not limit the scope of the present application.

[0066] Figure 1a It is a structural schematic diagram of a display panel in the related art;

[0067] Figure 1b It is a structural schematic diagram of a state of a display panel during a preparation process in the related art;

[0068] Figure 1c It is a structural schematic diagram of a state of a display panel during a preparation process in the related art;

[0069] Figure 1d It is a structural schematic diagram of a state of a display panel during a preparation process in the related art;

[0070] Figure 2a is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0071] Figure 2b is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0072] Figure 3a is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0073] Figure 3b is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0074] Figure 3cis a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0075] Figure 3d is based on Figure 3b A top view of a portion of the isolation structure is shown;

[0076] Figure 4a is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0077] Figure 4b is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0078] Figure 5 is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0079] Figure 6 is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0080] Figure 7 is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0081] Figure 8 is a flow chart of a method for preparing a display panel provided in the present application;

[0082] Figure 9a is based on Figure 8 A method for preparing a panel, and a schematic diagram showing a structure of a panel in a state during the preparation process;

[0083] Figure 9b is based on Figure 8 A method for preparing a panel, and a schematic diagram showing a structure of a panel in a state during the preparation process;

[0084] Fig.10 is a flow chart of another method for preparing a display panel provided in the present application;

[0085] Fig.11a is based on Fig.10 A method for preparing a panel, and a schematic diagram showing a structure of a panel in a state during the preparation process;

[0086] Fig.11b is based on Fig.10 A method for preparing a panel, and a schematic diagram showing a structure of a panel in a state during the preparation process;

[0087] Fig.12 is a flow chart of another method for preparing a display panel provided in the present application;

[0088] Fig.13a is based on Fig.12A method for preparing a panel, and a schematic diagram showing a structure of a panel in a state during the preparation process;

[0089] Fig.13b is based on Fig.12 A preparation method is provided, and a structural schematic diagram of a display panel in a state during the preparation process.

[0090] Description of reference numerals:

[0091] 11-substrate, 12-isolation structure, 13-light-emitting structure, 14-cathode structure, 151-first sub-pixel, 152-second sub-pixel, 16-packaging structure, 17-second packaging structure, 18-photoresist, 130-light-emitting material layer, 140-cathode material layer, 160-first packaging material layer;

[0092] 21-substrate, 22-isolation structure, 224-isolation opening, 221-first structure layer, 222-second structure layer, 223-channel, 2201-first isolation part, 2202-second isolation part, 2203-middle isolation part,

[0093] 23-pixel defined layer,

[0094] 31 - first sub-pixel, 32 - second sub-pixel, 33 - third sub-pixel, 301 - first electrode, 302 - light-emitting structure, 303 - second electrode;

[0095] 40-packaging structure, 41-first packaging part, 42-second packaging part;

[0096] 71-first encapsulation layer, 72-second encapsulation layer;

[0097] 81 - a first conductive material layer, 82 - a light-emitting material layer, 83 - a first packaging material layer, 84 - a first material film layer. DETAILED DESCRIPTION

[0098] In order to have a clearer understanding of the technical features, purposes and effects of the embodiments of the present application, the specific implementation methods of the embodiments of the present application are now described with reference to the accompanying drawings.

[0099] In this document, “exemplary” means “serving as an example, instance or illustration”, and any diagram or implementation described in this document as “exemplary” should not be interpreted as a more preferred or more advantageous technical solution.

[0100] In order to simplify the drawings, only the parts related to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one or more of the parts with the same structure or function are schematically drawn or only one or more of them are marked.

[0101] The corresponding structural parts mentioned below, such as the contents of the isolation structure, are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072 , CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A are further described for reference.

[0102] In the related art, reference Figure 1a The display panel includes a substrate 11, an isolation structure 12 and a plurality of sub-pixels arranged on the same side of the substrate. The inventor has found through long-term research that the preparation process of the display panel in the related art can be referred to Figure 1b-1d There is a problem that the packaging structure 16 in the K area is easy to break, resulting in damage to the sub-pixels, which in turn causes dark spots to appear when the display panel is lit.

[0103] In order to solve the above technical problems, the present application provides a display panel, referring to Figure 2a , Figure 3a or Figure 3c The display panel includes a substrate 21, an isolation structure 22, a sub-pixel and a packaging structure 40. The isolation structure 22 is arranged on one side of the substrate 21. The isolation structure 22 encloses a plurality of isolation openings 224. The sub-pixels and the isolation openings 224 are arranged correspondingly. The sub-pixels include a light-emitting structure 302 and a first electrode 301 stacked in sequence in a direction away from the substrate 21. Part of the light-emitting structure 302 and part of the first electrode 301 are located in the isolation opening 224. The end of the light-emitting structure 302 in the extension direction of the substrate 21 is overlapped on the surface of the isolation structure 22 on the side away from the substrate 21. The packaging structure 40 and the sub-pixel The encapsulation structure 40 is arranged corresponding to the sub-pixel 31, and includes a first encapsulation portion 41 and a second encapsulation portion 42. The first encapsulation portion 41 covers the surface of the first sub-pixel 31 on the side away from the substrate 21, and the second encapsulation portion 42 is arranged on the isolation structure 22 and contacts the side wall of the end of the light-emitting structure 302 in the extension direction of the substrate 21; wherein, along the direction perpendicular to the substrate 21, the distance between the side of the second encapsulation portion 42 away from the substrate 21 and the side of the isolation structure 22 away from the substrate 21 is greater than the sum of the thickness of the light-emitting structure 302 in the isolation opening 224 and the thickness of the first electrode 301 in the isolation opening 224.

[0104] Based on the above technical solution, since the light-emitting structure 302 is stacked on the surface of the isolation structure 22 facing away from the substrate 21, and the first packaging part 41 covers the surface of the sub-pixel facing away from the substrate 21, at least the light-emitting structure 302 of the sub-pixel is supported between the first packaging part 41 and the surface of the isolation structure 22 facing away from the substrate 21. Since the second encapsulation portion 42 contacts the side wall of the end of the sub-pixel's light-emitting structure 302 in the extension direction of the substrate 21, and the distance between the side of the second encapsulation portion 42 facing away from the substrate 21 and the side of the isolation structure 22 facing away from the substrate 21 is greater than the sum of the thickness of the light-emitting structure 302 in the isolation opening 224 and the thickness of the first electrode 301 in the isolation opening 224, the second encapsulation portion 42 can protect the end side wall of the sub-pixel in the extension direction of the substrate 21, thereby preventing the light-emitting structure 302 from being etched, which may cause a gap to appear between the first encapsulation portion 41 and the isolation structure 22, thereby preventing the connection between the first encapsulation portion 41 and the isolation structure 22 from being broken at the gap, so that the first encapsulation portion 41 has sufficient thickness to protect the corresponding sub-pixel, thereby preventing the sub-pixel from being etched, which may cause dark spots to appear when the display panel is lit.

[0105] In an example, the end of the first electrode 301 in the extension direction of the substrate 21 and the end of the light emitting structure 302 in the extension direction of the substrate 21 may be overlapped on the side of the isolation structure 22 away from the substrate 21. The first electrode 301 and the light emitting structure 302 may be jointly supported between the first packaging portion 41 and the surface of the isolation structure 22 away from the substrate 21.

[0106] Among them, reference Figure 2b , Figure 3b ,or Figure 3c, the plurality of isolation openings 224 include a first isolation opening, a second isolation opening and a third isolation opening, the sub-pixels include a first sub-pixel 31, a second sub-pixel 32 and a third sub-pixel 33, the first sub-pixel 31 is arranged in the first isolation opening, the second sub-pixel 32 is arranged in the second isolation opening, and the third sub-pixel 33 is arranged in the second isolation opening. As can be seen from the above, the end sidewall of the first sub-pixel 31 in the extension direction of the substrate 21 can be protected by the corresponding second encapsulation part 42, the end sidewall of the second sub-pixel 32 in the extension direction of the substrate 21 can be protected by the corresponding second encapsulation part 42, and the end sidewall of the third sub-pixel 33 in the extension direction of the substrate 21 can be protected by the corresponding second encapsulation part 42, so as to avoid the light emitting structure 302 being etched to cause a gap between the first encapsulation part 41 and the isolation structure 22, so as to avoid the connection between the first encapsulation part 41 and the isolation structure 22 at the gap being broken, so that the first encapsulation part 41 has a sufficient thickness to protect the first sub-pixel 31, and avoid the first sub-pixel 31 being etched to cause a dark spot when the display panel is lit. During preparation, the first sub-pixel 31 and the packaging structure 40 corresponding to the first sub-pixel 31 can be prepared in order, then the second sub-pixel 32 and the packaging structure 40 corresponding to the second sub-pixel 32 can be prepared, and then the third sub-pixel 33 and the packaging structure 40 corresponding to the third sub-pixel can be prepared.

[0107] Preferably, the luminous color of the second sub-pixel 32 is different from the luminous color of the first sub-pixel 31. Preferably, the luminous color of the third sub-pixel 33 is different from the luminous color of the first sub-pixel 31. Preferably, the luminous color of the third sub-pixel 33 is different from the luminous color of the second sub-pixel 32.

[0108] In one implementation, reference Figure 2a and Figure 2b In a possible embodiment, the second encapsulation part 42 is arranged on the surface of the isolation structure 22 away from the substrate 21, and along the direction away from the substrate 21, a part of the light emitting structure 302, a part of the first electrode 301 and a part of the first encapsulation part 41 are sequentially stacked on the side of the second encapsulation part 42 away from the substrate 21. In this way, the second encapsulation part 42, a part of the light emitting structure 302 and a part of the first electrode 301 are jointly supported between the first encapsulation part 41 and the surface of the isolation structure 22 away from the substrate 21, and because the second encapsulation part 42 has a high height in the direction perpendicular to the substrate 21, it can protect the light emitting structure 302 and the first electrode 301, so that the side wall of the light emitting structure 302 and the side wall of the first electrode 301 can be prevented from being etched to cause a gap between the first encapsulation part 41 and the isolation structure 22.

[0109] Preferably, along the direction perpendicular to the substrate 21 , the distance between the side of the second packaging portion 42 facing away from the substrate 21 and the side of the isolation structure 22 facing away from the substrate 21 is equal to 1.5 to 2 times the sum of the thickness of the light-emitting structure 302 in the isolation opening 224 and the thickness of the first electrode 301 in the isolation opening 224 .

[0110] Preferably, the first encapsulation portion 41 and the second encapsulation portion 42 are made of different materials.

[0111] Preferably, the material of the first packaging part 41 includes an inorganic material, and / or the material of the second packaging part 42 includes a metal material;

[0112] Preferably, the material of the second encapsulation part 42 includes aluminum.

[0113] Preferably, the width of the second encapsulation portion 42 is 0.08 micrometers to 0.2 micrometers along the extension direction parallel to the substrate 21. For example, the width of the second encapsulation portion 42 can be 0.08 micrometers, 0.09 micrometers, 0.10 micrometers, 0.11 micrometers, 0.12 micrometers, 0.13 micrometers, 0.14 micrometers, 0.15 micrometers, 0.16 micrometers, 0.17 micrometers, 0.18 micrometers, 0.19 micrometers, and 0.2 micrometers.

[0114] Preferably, along the extension direction parallel to the substrate 21, the width of the second encapsulation portion 42 is 0.08 micrometers to 0.12 micrometers. For example, the width of the second encapsulation portion 42 may be 0.08 micrometers, 0.09 micrometers, 0.10 micrometers, 0.11 micrometers, or 0.12 micrometers.

[0115] In one implementation, reference Figure 3a or Figure 3cThe isolation structure 22 includes a channel 223 located between two adjacent isolation openings 224, and is separated into at least two isolation parts by the channel 223, and the at least two isolation parts include a first isolation part 2201 adjacent to one isolation opening 224 and a second isolation part 2202 adjacent to the other isolation opening 224; the second packaging part 42 adjacent to the first isolation part 2201 extends in a direction perpendicular to the substrate 21, and one end extends to connect with the first packaging part 41, and the other end extends into the channel 223 and contacts with the first isolation part 2201; the second packaging part 42 adjacent to the second isolation part 2202 extends in a direction perpendicular to the substrate 21, and one end extends to connect with the first packaging part 41, and the other end extends into the channel 223 and contacts with the second isolation part 2202. Based on this technical solution, since the first encapsulation part 41 and the second encapsulation part 42 are connected, the first encapsulation part 41 and the second encapsulation part 42 can surround the corresponding sub-pixel, so as to protect the end sidewall of the corresponding sub-pixel in the extension direction of the substrate 21, and avoid the light emitting structure 302 and / or the first electrode 301 being etched to cause a gap between the first encapsulation part 41 and the isolation structure 22, thereby avoiding the connection between the first encapsulation part 41 and the isolation structure 22 at the gap. The first encapsulation part 41 has sufficient thickness to protect the corresponding sub-pixel and avoid the corresponding sub-pixel being etched to cause dark spots on the display panel. The second encapsulation part 42 has been indicated by a dotted frame in some or all of the drawings.

[0116] Preferably, the material of the first encapsulation part 41 is the same as the material of the second encapsulation part 42. In this way, the first encapsulation part 41 and the second encapsulation part 42 can be obtained through the same preparation process, which is conducive to simplifying the preparation process.

[0117] Among them, reference Figure 3b and Figure 3d , the positive projection of the channel 223 between two adjacent isolation openings 224 on the substrate includes a polygonal solid shadow, an elliptical solid shadow or a circular solid shadow. Preferably, the second packaging part 42 adjacent to the first isolation part 2201 and the second packaging part 42 adjacent to the second isolation part 2202 extend into the same channel 223. Regarding the positive projection of the channel 223 on the substrate being a polygonal solid shadow, an elliptical solid shadow or a circular solid shadow, it can be understood that the channel 223 is a hole with a polygonal, elliptical or circular cross-section provided on the isolation structure, which is equivalent to hollowing out the central part of the isolation structure between two adjacent isolation openings 224, and the hollowed-out part of the isolation structure is annular. In this way, the channel can separate the isolation structure into a first isolation part 2201 close to one isolation opening 224, and a second isolation part 2202 close to another isolation opening 224, and the channel simultaneously accommodates two second packaging parts 42 corresponding to two adjacent isolation openings 224.

[0118] In another implementation, the orthographic projection of the channel 223 between two adjacent isolation openings on the substrate includes a ring shape. Preferably, at least two isolation parts also include an intermediate isolation part 2203 located between the two channels 223, the second encapsulation part 42 adjacent to the first isolation part 2201 extends into the channel 223 between the intermediate isolation part 2203 and the first isolation part 2201, and the second encapsulation part 42 adjacent to the second isolation part 2202 extends into the channel 223 between the intermediate isolation part 2203 and the second isolation part 2202. With regard to the orthographic projection of the channel 223 on the substrate including a ring shape, it can be understood that an annular channel is provided on the isolation structure 22 between two adjacent isolation openings 224. In this way, the isolation structure is divided into three parts with the annular channel as the boundary, and the three parts are the first isolation part 2201 close to one isolation opening, the second isolation part 2202 close to the other isolation opening, and the part surrounded by the annular channel is the intermediate isolation part 2203.

[0119] The orthographic projection of the channel 223 between two adjacent isolation openings 22 on the substrate may include any one of a polygonal ring, an elliptical ring and a circular ring.

[0120] In one embodiment, the channel 223 penetrates at least a portion of the isolation structure along a direction perpendicular to the substrate 21. Preferably, the channel 223 penetrates the isolation structure 22 along a direction perpendicular to the substrate 21.

[0121] In one implementation, reference Figure 4a or Figure 4b The second encapsulation part 42 corresponding to the part of the isolation opening 224 is arranged on the surface of the isolation structure 22 away from the substrate 21, and along the direction away from the substrate 21, a part of the light emitting structure 302, a part of the first electrode 301 and a part of the first encapsulation part 41 are sequentially stacked on the side of the second encapsulation part 42 away from the substrate 21;

[0122] The isolation structure 22 partially located between two adjacent isolation openings 224 has a channel 223 and is separated into at least two isolation parts by the channel 223. The at least two isolation parts include a first isolation part 2201 adjacent to one isolation opening and a second isolation part 2202 adjacent to the other isolation opening. The second packaging part 42 adjacent to the first isolation part 2201 extends in a direction perpendicular to the substrate 21, and one end extends to connect with the first packaging part 41, and the other end extends into the channel 223 and contacts with the first isolation part 2201. The second packaging part 42 adjacent to the second isolation part 2202 extends in a direction perpendicular to the substrate 21, and one end extends to connect with the first packaging part 41, and the other end extends into the channel 223 and contacts with the second isolation part 2202.

[0123] It can be seen from the above technical solution that, on the side of the partial isolation structure 22 facing away from the substrate 21, the second packaging part 42, part of the light-emitting structure 302, and part of the first electrode 301 are jointly supported between the first packaging part 41 and the surface of the isolation structure 22 facing away from the substrate 21. The height of the second packaging part 42 in the direction perpendicular to the substrate 21 is relatively high, which can protect the light-emitting structure 302 and the first electrode 301, and prevent the side walls of the light-emitting structure 302 and the side walls of the first electrode 301 from being etched, thereby preventing gaps from appearing between the first packaging part 41 and the isolation structure 22. On the side of the other part of the isolation structure 22 away from the substrate 21, since the first encapsulation part 41 and the second encapsulation part 42 are connected, the first encapsulation part 41 and the second encapsulation part 42 can surround the corresponding sub-pixel, so as to protect the end side wall of the corresponding sub-pixel in the extension direction of the substrate 21, and avoid the light-emitting structure 302 being etched to cause a gap between the first encapsulation part 41 and the isolation structure 22, thereby avoiding the connection between the first encapsulation part 41 and the isolation structure 22 at the gap from being broken, so that the first encapsulation part 41 has sufficient thickness to protect the corresponding sub-pixel, and avoid the corresponding sub-pixel being etched to cause dark spots on the display panel. For example, as shown in FIG. 4, the second encapsulation part 42 corresponding to the first isolation opening and the second encapsulation part 42 corresponding to the second isolation opening are both arranged on the surface of the isolation structure 22 away from the substrate 21; the second encapsulation part 42 corresponding to the third isolation opening is connected to the first encapsulation part 41, which can protect the end side wall of the third sub-pixel in the extension direction of the substrate 21. The isolation structure 22 located between the second isolation opening and the third isolation opening is provided with a second packaging portion 42 corresponding to the second isolation opening and a channel 223 .

[0124] Among them, reference Figure 4a , the positive projection of the channel 223 between two adjacent isolation openings on the substrate 21 includes a polygonal solid shadow, an elliptical solid shadow or a circular solid shadow. Preferably, the second packaging part 42 adjacent to the first isolation part 2201 and the second packaging part 42 adjacent to the second isolation part 2202 extend into the same channel 223. Regarding the positive projection of the channel 223 on the substrate as a polygonal solid shadow or a circular solid shadow, it can be understood that the channel is a hole with a polygonal, elliptical or circular cross-section provided on the isolation structure, which is equivalent to hollowing out the central part of the isolation structure between the two adjacent isolation openings, and the hollowed-out part of the isolation structure is annular. In this way, the channel can separate the isolation structure into a first isolation part 2201 close to one isolation opening, and a second isolation part 2202 close to another isolation opening, and the channel simultaneously accommodates two second packaging parts 42 corresponding to the two adjacent isolation openings.

[0125] In another implementation, reference Figure 4b, the orthographic projection of the channel 223 between two adjacent isolation openings on the substrate includes a ring shape. Preferably, at least two isolation parts also include an intermediate isolation part 2203 located between the two channels 223, the second packaging part 42 adjacent to the first isolation part 2201 extends between the intermediate isolation part 2203 and the first isolation part 2201, and the second packaging part 42 adjacent to the second isolation part 2202 extends between the intermediate isolation part 2203 and the second isolation part 2202. Regarding the orthographic projection of the channel 223 on the substrate including a ring shape, it can be understood that an annular channel is provided on the isolation structure between two adjacent isolation openings. In this way, the isolation structure is divided into three parts with the annular channel as the boundary, and the three parts are the first isolation part 2201 close to one isolation opening, the second isolation part 2202 close to the other isolation opening, and the part surrounded by the annular channel is the intermediate isolation part 2203.

[0126] The orthographic projection of the channel 223 between two adjacent isolation openings on the substrate may include any one of a polygonal ring, an elliptical ring and a circular ring.

[0127] In one possible implementation, reference Figure 5 The isolation structure 22 includes a first structure layer 221 and a second structure layer 222, which are stacked in sequence along the direction toward the substrate 21, and the side of the first structure layer 221 facing the isolation opening protrudes from the side wall of the second structure layer 222. In this way, the first structure layer 221 protrudes from the second structure layer 222 to form an eaves-like structure.

[0128] Preferably, at least a part of the orthographic projection of the second encapsulation part 42 on the substrate 21 overlaps with the orthographic projection of the surface of the second structure layer 222 on the side away from the substrate 21 on the substrate 21. It can be understood that along the extension direction of the substrate 21, the first structure layer 221 protrudes toward the isolation opening relative to the second structure layer 222. Since at least a part of the orthographic projection of the second encapsulation part 42 on the substrate 21 overlaps with the orthographic projection of the surface of the second structure layer 222 on the side away from the substrate 21. Therefore, a part of the second encapsulation part 42 can be located on the protruding part of the first structure layer 221, and another part is located on the part of the first structure layer 221 and the second structure layer 222 overlapping; or, the second encapsulation part 42 is entirely located on the part of the first structure layer 221 and the second structure layer 222 overlapping. In this way, the bearing stress of the protruding part of the first structure layer 221 can be reduced, and the risk of the protruding part of the first structure layer 221 being broken can be reduced.

[0129] Preferably, the material of the first structure layer 221 and the material of the second structure layer 222 are different.

[0130] Preferably, the material of the second structure layer 222 includes a conductive material.

[0131] Preferably, the first electrode 301 is in conductive contact with the second structure layer 222. In this way, each sub-pixel can be in conductive contact with the isolation structure 22, thereby ensuring the conductive uniformity of each sub-pixel.

[0132] Preferably, the material of the first structure layer 221 includes metal titanium, and / or the material of the second structure layer 222 includes metal aluminum.

[0133] Preferably, the isolation structure 22 further includes a third structure layer 223 , and the first structure layer 221 , the second structure layer 222 , and the third structure layer 223 are stacked in sequence along a direction toward the substrate 21 .

[0134] Preferably, the material of the third structure layer 223 and the material of the first structure layer 221 both include metal molybdenum.

[0135] In one possible embodiment, reference Figure 5 , the display panel further includes a pixel defining layer 23, and the pixel defining layer 23 is located between the substrate 21 and the isolation structure 22. Preferably, the isolation structure 22 includes a channel 223 located between two adjacent isolation openings, a portion of the pixel defining layer 23 is exposed in the channel 223, and the second encapsulation part 42 is stacked on the pixel defining layer 23 through the channel 223. Based on this technical solution, since the second encapsulation part 42 is stacked on the pixel defining layer 23 through the channel 223, the second encapsulation part 42 can cover the side wall of the first isolation part 2201 exposed in the channel 223 to protect the first isolation part 2201, and can also cover the side wall of the second isolation part 2202 exposed in the channel 223 to protect the second isolation part 2202.

[0136] In a possible implementation, referring to FIG. 2 or FIG. 4 , the sub-pixel further includes a second electrode 303, the second electrode 303 and the pixel defining layer 23 are both located between the substrate 21 and the isolation structure 22, and are sequentially stacked in a direction away from the substrate 21, the pixel defining layer 23 has a plurality of pixel openings, the isolation openings and the pixel openings are connected one by one, and the positive projection of the pixel opening on the substrate 21 is located within the positive projection range of the corresponding isolation opening on the substrate 21, and part of the second electrode 303 is exposed in the pixel opening. In this way, a portion of the light-emitting structure 302 can be stacked on the surface of the second electrode 303 away from the substrate 21 through the pixel opening. Based on this technical solution, in each isolation opening, the second electrode 303, the light-emitting structure 302 and the first electrode 301 can be combined to form a sub-pixel to emit colored light. By arranging different sub-pixels in different isolation openings, a color visual effect can be presented on the display panel.

[0137] Preferably, at least part of the isolation structure 22 is made of a metal conductive material, and the first electrode 301 is in conductive contact with the metal conductive material of the isolation structure 22. Thus, each sub-pixel can be in conductive contact with the isolation structure 22, thereby ensuring the conductive uniformity of each sub-pixel.

[0138] In one example, reference Figure 6 or Figure 7 The display panel further includes a first encapsulation layer 71 and a second encapsulation layer 72. The first encapsulation layer 71 is disposed on a side of the encapsulation structure 40 away from the substrate 21, and the second encapsulation layer 72 is disposed on a side of the first encapsulation layer 71 away from the substrate 21. In this way, the first encapsulation layer 71 and the second encapsulation layer 72 can jointly protect the encapsulation structure 40 and the isolation structure 22, thereby protecting the sub-pixels and avoiding the occurrence of dark spots when the display panel is lit.

[0139] Preferably, the first encapsulation layer 71 contacts the isolation structure 22. That is, a portion of the surface of the isolation structure 22 facing away from the substrate 21 is covered by the second encapsulation portion, and another portion may be covered by the first encapsulation layer 71, so that the isolation structure 22 can be protected.

[0140] Preferably, the first encapsulation layer 71 is an organic material, and / or the second encapsulation layer 72 is an inorganic material. In this way, the first encapsulation layer 71 has good insulation performance and can prevent leakage. The second encapsulation layer 72 can isolate water vapor and protect the first encapsulation layer 71.

[0141] The present application also provides another display panel, referring to FIG. 2 or FIG. 4 , the display panel includes a substrate 21, an isolation structure 22, a sub-pixel and a packaging structure 40, the isolation structure 22 is arranged on one side of the substrate 21, and the isolation structure 22 encloses a plurality of isolation openings; the sub-pixel includes a light-emitting structure 302 and a first electrode 301 sequentially stacked in a direction away from the substrate 21, a portion of the light-emitting structure 302 and a portion of the first electrode 30 are located in the isolation opening, and an end of the light-emitting structure 302 in the extension direction of the substrate 21 overlaps the surface of the isolation structure 22 on the side away from the substrate 21; the packaging structure 40 The encapsulation structure 40 is arranged corresponding to the sub-pixel, and includes a first encapsulation portion 41 and a second encapsulation portion 42. The first encapsulation portion 41 covers the surface of the sub-pixel on the side away from the substrate 21, and the second encapsulation portion 42 is arranged on the side of the isolation structure 22 away from the substrate, and contacts the side wall of the end of the light-emitting structure in the extension direction of the substrate; wherein, along the direction perpendicular to the substrate 21, the distance between the side of the second encapsulation portion 42 away from the substrate 21 and the side of the isolation structure 22 away from the substrate 21 is greater than the sum of the thickness of the light-emitting structure 302 in the isolation opening and the thickness of the first electrode 301 in the isolation opening.

[0142] Based on the above technical solution, since the light-emitting structure 302 is stacked on the surface of the isolation structure 22 facing away from the substrate 21, and the first packaging part 41 covers the surface of the sub-pixel facing away from the substrate 21, at least the light-emitting structure 302 of the sub-pixel is supported between the first packaging part 41 and the surface of the isolation structure 22 facing away from the substrate 21. Since the second encapsulation portion 42 contacts the side wall of the end of the sub-pixel's light-emitting structure 302 in the extension direction of the substrate 21, and the distance between the side of the second encapsulation portion 42 facing away from the substrate 21 and the side of the isolation structure 22 facing away from the substrate 21 is greater than the sum of the thickness of the light-emitting structure 302 in the isolation opening 224 and the thickness of the first electrode 301 in the isolation opening 224, the second encapsulation portion 42 can protect the end side wall of the sub-pixel in the extension direction of the substrate 21, thereby preventing the light-emitting structure 302 from being etched, which may cause a gap to appear between the first encapsulation portion 41 and the isolation structure 22, thereby preventing the connection between the first encapsulation portion 41 and the isolation structure 22 from being broken at the gap, so that the first encapsulation portion 41 has sufficient thickness to protect the corresponding sub-pixel, thereby preventing the sub-pixel from being etched, which may cause dark spots to appear when the display panel is lit.

[0143] In a possible embodiment, along a direction perpendicular to the substrate, the thickness of the second encapsulation portion 42 is 0.2-0.8 micrometers. For example, the thickness of the second encapsulation portion 42 is 0.2 micrometers, 0.3 micrometers, 0.4 micrometers, 0.5 micrometers, 0.6 micrometers, 0.7 micrometers, and 0.8 micrometers.

[0144] Preferably, along the direction perpendicular to the substrate, the thickness of the second encapsulation portion 42 is 0.4-0.6 micrometers. For example, the thickness of the second encapsulation portion 42 is 0.4 micrometers, 0.45 micrometers, 0.5 micrometers, 0.55 micrometers, or 0.6 micrometers.

[0145] The present application also provides a method for preparing a display panel, referring to Figure 8 ,as well as Figure 9a and Figure 9b , the preparation method comprises:

[0146] Step S91 , providing a back plate, the back plate comprising a substrate 21 and an isolation structure 22 , the isolation structure 22 being disposed on one side of the substrate 21 , and the isolation structure 22 encloses a plurality of isolation openings.

[0147] Step S92, forming a second encapsulation portion 42 on a surface of the isolation structure 22 that is away from the substrate 21. For details, see Figure 9a .

[0148] Step S93, forming a light emitting material layer 82, a first conductive material layer 81, and a first packaging material layer 83 in sequence on the side of the isolation structure 22 of the backplane. Figure 9bFor example, the light emitting layer and the conductive material layer may be formed by evaporation first, and then the first packaging material layer 83 may be formed by deposition.

[0149] Step S94, patterning the first packaging material layer 83, the first conductive material layer 81 and the light-emitting material layer 82 in sequence to obtain the first packaging part 41, the first electrode 301 of the sub-pixel and the light-emitting structure 302, wherein part of the sub-pixel is located in the isolation opening, and along the direction away from the substrate 21, part of the light-emitting structure 302, part of the first electrode 301 and part of the first packaging part 41 are sequentially stacked on the side of the second packaging part 42 away from the substrate 21, and along the direction perpendicular to the substrate 21, the distance between the side of the second packaging part 42 away from the substrate 21 and the side of the isolation structure 22 away from the substrate 21 is greater than the sum of the thickness of the light-emitting structure 302 in the isolation opening and the thickness of the first electrode 301 in the isolation opening. For details, please refer to Figure 2a .

[0150] For example, the distance between the side of the second packaging portion 42 facing away from the substrate 21 and the side of the isolation structure 22 facing away from the substrate 21 may be 1.5 to 2 times the sum of the thickness of the light emitting structure 302 in the isolation opening and the thickness of the first electrode 301 in the isolation opening.

[0151] Based on the above technical solution, it should be understood that the first encapsulation part 41 is obtained by patterning the first encapsulation material layer 83, the first electrode 301 is obtained by patterning the first conductive material layer 81, and the light-emitting structure 302 is obtained by patterning the light-emitting material layer 82. Obviously, since the height of the second encapsulation part 42 is relatively high, the end sidewalls of the sub-pixels in the extension direction of the substrate 21 can be protected to prevent the light-emitting structure 302 from being etched and causing a gap between the first encapsulation part 41 and the isolation structure 22, thereby preventing the connection between the first encapsulation part 41 and the isolation structure 22 from being broken at the gap, so that the first encapsulation part 41 has sufficient thickness to protect the sub-pixels and prevent the sub-pixels from being etched and causing dark spots on the display panel.

[0152] In the preparation method provided in the present application, step S92, forming a second packaging portion 42 on a side of the isolation structure 22 away from the substrate 21, specifically includes:

[0153] forming a second packaging material layer on a side of the isolation structure 22 facing away from the substrate 21;

[0154] The second packaging material layer is patterned to obtain a plurality of second packaging portions 42 located on the surface of the isolation structure 22 facing away from the substrate 21 .

[0155] In the preparation method provided in the present application, the plurality of isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening, the sub-pixels include a first sub-pixel, a second sub-pixel 32, and a third sub-pixel 33, the first sub-pixel 31 is arranged in the first isolation opening, the second sub-pixel 32 is arranged in the second isolation opening, and the third sub-pixel 33 is arranged in the third isolation opening. During preparation, the first sub-pixel 31 and the encapsulation structure 40 corresponding to the first sub-pixel 31 can be prepared in order, then the second sub-pixel 32 and the encapsulation structure 40 corresponding to the second sub-pixel 32 can be prepared, and then the third sub-pixel 33 and the encapsulation structure 40 corresponding to the third sub-pixel can be prepared. Specifically, after completing step S92, steps S93 and S94 can be performed cyclically according to the classification of the sub-pixels.

[0156] For example, by performing step S93 and step S94 for the first time to complete the first sub-pixel preparation process, that is, the light-emitting material layer 82, the first conductive material layer 81, and the first packaging material layer 83 of the first sub-pixel 31 can be sequentially formed on the side where the isolation structure 22 of the backplane is located. For details, please refer to Figure 9b Then, the first packaging material layer 83, the first conductive material layer 81 and the light-emitting material layer 82 are patterned in sequence to obtain the first packaging portion 41, the first electrode 301 and the light-emitting structure 302 of the first sub-pixel 31, part of the first sub-pixel 31 is located in the first isolation opening, and along the direction toward the substrate 21, part of the light-emitting structure 302 of the first sub-pixel 31, part of the first electrode 301 and part of the first packaging portion 41 are sequentially stacked on the side of the second packaging portion 42 away from the substrate 21, and along the direction perpendicular to the substrate 21, the distance between the side of the second packaging portion 42 away from the substrate 21 and the side of the isolation structure 22 away from the substrate 21 is greater than the sum of the thickness of the light-emitting structure 302 in the first isolation opening and the thickness of the first electrode 301 in the first isolation opening. For details, please refer to Figure 2a .

[0157] After obtaining the second encapsulation part 42 corresponding to the first sub-pixel 31, the first encapsulation part 41, and the light-emitting structure 302 and the first electrode 301 of the first sub-pixel 31, steps S93 and S94 can be performed again to complete the relevant preparation process of the second sub-pixel 32, that is, the light-emitting material layer 82, the first conductive material layer 81, and the first encapsulation material layer 83 of the second sub-pixel 32 can be sequentially formed on the side where the isolation structure 22 of the backplane is located. For details, please refer to Figure 9b. Then, the first packaging material layer 83, the first conductive material layer 81 and the light-emitting material layer 82 are patterned in sequence to obtain the first packaging part 41, the first electrode 301 and the light-emitting structure 302 of the second sub-pixel 31. Part of the second sub-pixel 31 is located in the second isolation opening. Along the direction away from the substrate 21, part of the light-emitting structure 302 of the first sub-pixel 31, part of the first electrode 301 and part of the first packaging part 41 are sequentially stacked on the side of the second packaging part 42 away from the substrate 21. Along the direction perpendicular to the substrate 21, the distance between the side of the second packaging part 42 away from the substrate 21 and the side of the isolation structure 22 away from the substrate 21 is greater than the sum of the thickness of the light-emitting structure 302 in the second isolation opening and the thickness of the first electrode 301 in the second isolation opening. Thus, the second packaging part 42, the first packaging part 41, and the light-emitting structure 302 and the first electrode 301 of the second sub-pixel 32 corresponding to the second sub-pixel 32 are obtained. For details, please refer to Figure 9b .

[0158] After obtaining the second packaging part 42 and the first packaging part 41 corresponding to the second sub-pixel 32, as well as the light-emitting structure 302 and the first electrode 301 of the second sub-pixel 32, steps S93 and S94 can be executed again to complete the relevant preparation process of the third sub-pixel 33. For details, please refer to the preparation process of the first sub-pixel and the second sub-pixel, which will not be repeated here.

[0159] It should be understood that in the above preparation process, the first packaging part 41 is obtained by patterning the first packaging material layer 83 , the first electrode 301 is obtained by patterning the first conductive material layer 81 , and the light emitting structure 302 is obtained by patterning the light emitting material layer 82 .

[0160] In one example, the first packaging material layer 83 can be dry-etched using photoresist to obtain the first packaging part 41, and then the patterned light-emitting material layer 82 and the cathode material can be etched using an etching solution. After completing step S94 corresponding to the first sub-pixel 31, the photoresist on the first packaging part 41 needs to be removed before the light-emitting material layer 82 and the first conductive material layer 81 of the second sub-pixel 32 can be evaporated. Similarly, after completing step S94 corresponding to the second sub-pixel 32, the photoresist on the first packaging part 41 needs to be removed before the light-emitting material layer 82 and the first conductive material layer 81 of the third sub-pixel 33 can be evaporated.

[0161] In addition, the backplane provided in the above preparation method may also include a pixel defining layer 23 and a second electrode 303 of the sub-pixel, the second electrode 303 and the pixel defining layer 23 are both located between the substrate 21 and the isolation structure 22, and are stacked in sequence along the direction away from the substrate 21, the pixel defining layer 23 has a plurality of pixel openings, the plurality of pixel openings include a first pixel opening, the isolation openings and the pixel openings are connected one-to-one, and the orthographic projection of the pixel opening on the substrate 21 falls within the orthographic projection range of the corresponding isolation opening on the substrate 21, a portion of the second electrode 303 is exposed in the pixel opening, and a portion of the light-emitting structure 302 is located in the pixel opening and is stacked on the surface of the second electrode 303 on the side away from the substrate 21.

[0162] This application also provides another method for preparing a display panel, referring to Fig.10 ,as well as Fig.11a and Fig.11b , the preparation method comprises:

[0163] Step S101 , providing a back plate, the back plate comprising a substrate 21 and an isolation structure 22 , the isolation structure 22 being disposed on one side of the substrate 21 , and the isolation structure 22 encloses a plurality of isolation openings.

[0164] Step S102, patterning the isolation structure 22 to form a channel 223 on the isolation structure 22 located between two adjacent isolation openings, the isolation structure 22 is separated into at least two isolation parts by the channel 223, and the at least two isolation parts include a first isolation part 2201 adjacent to one isolation opening and a second isolation part 2202 adjacent to the other isolation opening. For details, please refer to Fig.11a .

[0165] Step S103, forming a light emitting material layer 82, a first conductive material layer 81 and a first material film layer 84 in sequence on the side where the isolation structure 22 of the backplane is located. For details, please refer to Fig.11b .

[0166] Step S104, patterning the first material film layer 84, the first conductive material layer 81 and the light-emitting material layer 82 in sequence to obtain a packaging structure 40, a first electrode 301 and a light-emitting structure 302, wherein the packaging structure 40 is the patterned first material film layer 84, and the packaging structure 40 includes a first packaging portion 41 and a second packaging portion 42, the first packaging portion 41 covers the surface of the sub-pixel away from the substrate 21, and the second packaging portion 42 adjacent to the first isolation portion 2201 extends in a direction perpendicular to the substrate 21, and one end extends to the first packaging portion 41 adjacent to the substrate 21. The second encapsulation portion 42 adjacent to the second isolation portion 2202 extends in a direction perpendicular to the substrate 21, and one end extends to be connected to the first encapsulation portion 41, and the other end extends into the channel 223 and contacts the second isolation portion 2202. The distance between the side of the second encapsulation portion 42 facing away from the substrate 21 and the side of the isolation structure 22 facing away from the substrate 21 is greater than the sum of the thickness of the light emitting structure 302 in the isolation opening and the thickness of the first electrode 301 in the isolation opening. For details, please refer to Figure 3b .

[0167] Based on the above technical solution, it should be understood that in the above preparation process, the first electrode 301 is obtained by patterning the conductive material layer, and the light-emitting structure 302 is obtained by patterning the light-emitting material layer 82. Obviously, since the height of the second encapsulation part 42 is relatively high, the end sidewall of the sub-pixel in the extension direction of the substrate 21 can be protected, and the light-emitting structure 302 is prevented from being etched to cause a gap between the first encapsulation part 41 and the isolation structure 22, thereby preventing the connection between the first encapsulation part 41 and the isolation structure 22 from being broken at the gap, so that the first encapsulation part 41 has sufficient thickness to protect the sub-pixel, and prevent the sub-pixel from being etched to cause dark spots on the display panel.

[0168] In the preparation method provided in the present application, the plurality of isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening, the sub-pixels include a first sub-pixel, a second sub-pixel 32, and a third sub-pixel 33, the first sub-pixel 31 is arranged in the first isolation opening, the second sub-pixel 32 is arranged in the second isolation opening, and the third sub-pixel 33 is arranged in the third isolation opening. During preparation, the first sub-pixel 31 and the encapsulation structure 40 corresponding to the first sub-pixel 31 can be prepared in order, and then the encapsulation structure 40 corresponding to the second sub-pixel 32 can be prepared, and then the third sub-pixel 33 and the encapsulation structure 40 corresponding to the third sub-pixel can be prepared. Specifically, after completing step S102, steps S103 and S104 can be performed cyclically according to the classification of the sub-pixels.

[0169] For example, the first sub-pixel preparation process is completed by performing step S103 and step S104 for the first time, that is:

[0170] The light emitting material layer 82, the first conductive material layer 81 and the first material film layer 84 of the first sub-pixel 31 can be formed in sequence on the side where the isolation structure 22 of the backplane is located. Fig.11b , and then patterning the first material film layer 84, the first conductive material layer 81 and the light-emitting material layer 82 in sequence to obtain the encapsulation structure 40, the first electrode 301 of the first sub-pixel 31 and the light-emitting structure 302, refer to Figure 3a .

[0171] After obtaining the second packaging part 42 and the first packaging part 41 corresponding to the first sub-pixel 31, as well as the light-emitting structure 302 and the first electrode 301 of the first sub-pixel 31, steps S103 and S104 can be performed again to complete the relevant preparation process of the second sub-pixel 32, that is, the light-emitting material layer 82, the first conductive material layer 81 and the first material film layer 84 of the second sub-pixel 31 can be formed in sequence on the side of the isolation structure 22 of the backplane, and then the first material film layer 84, the first conductive material layer 81 and the light-emitting material layer 82 are patterned in sequence to obtain the packaging structure 40, the first electrode 301 and the light-emitting structure 302 corresponding to the second sub-pixel 32.

[0172] After obtaining the second packaging part 42 and the first packaging part 41 corresponding to the second sub-pixel 32, as well as the light-emitting structure 302 and the first electrode 301 of the second sub-pixel 32, steps S103 and S104 can be executed again to complete the relevant preparation process of the third sub-pixel 33. For details, please refer to the preparation process of the first sub-pixel and the second sub-pixel, which will not be repeated here.

[0173] In one example, the first material film layer 84 can be firstly etched by dry etching with photoresist to obtain the first packaging part 41, and then the patterned light emitting material layer 82 and the cathode material are etched with etching liquid. After completing step S94, the photoresist on the first packaging part 41 needs to be removed, and then the light emitting material layer 82 and the cathode material layer of the second sub-pixel 32 can be evaporated.

[0174] In addition, the backplane provided in the above preparation method may also include a pixel defining layer 23 and a second electrode 303 of the sub-pixel, the second electrode 303 and the pixel defining layer 23 are both located between the substrate 21 and the isolation structure 22, and are stacked in sequence along the direction away from the substrate 21, the pixel defining layer 23 has a plurality of pixel openings, the isolation openings and the pixel openings are connected one by one, and the orthographic projection of the pixel opening on the substrate 21 falls within the orthographic projection range of the corresponding isolation opening on the substrate 21, part of the second electrode 303 is exposed in the pixel opening, and a part of the light-emitting structure 302 is located in the pixel opening and is stacked on the surface of the second electrode 303 on the side away from the substrate 21.

[0175] In one example, in the preparation method provided in the present application, the channel 223 can be made to penetrate the isolation structure 22, so that part of the pixel defining layer 23 can be exposed in the channel 223, and the second encapsulation part 42 can be stacked on the pixel defining layer 23 through the channel 223. In this way, the second encapsulation part 42 can cover the sidewall of the first isolation part 2201 exposed in the channel 223 to protect the first isolation part 2201. And the second encapsulation part 42 can cover the sidewall of the second isolation part 2202 exposed in the channel 223 to protect the second isolation part 2202.

[0176] This application also provides another method for preparing a display panel, referring to Fig.12 , Fig.13a and Fig.13b , the preparation method comprises:

[0177] Step S111 , providing a back plate, the back plate comprising a substrate 21 and an isolation structure 22 , the isolation structure 22 being disposed on one side of the substrate 21 , and the isolation structure 22 encloses a plurality of isolation openings.

[0178] Step S112, forming a portion of the second packaging portion 42 on the surface of the partial isolation structure 22 on the side away from the substrate 21, for details, please refer to Fig.13a .

[0179] Step S113, patterning a portion of the isolation structure 22, the isolation structure 22 having a channel 223 located between two adjacent isolation openings, and being separated into at least two isolation portions by the channel 223, the at least two isolation portions including a first isolation portion 2201 adjacent to one isolation opening and a second isolation portion 2202 adjacent to the other isolation opening, for details, see Fig.13b .

[0180] Step S114, sequentially forming a light emitting material layer 82, a first conductive material layer 81, and a first packaging material layer 83 on the side of the isolation structure 22 of the backplane. For example, the light emitting layer and the conductive material layer may be formed by evaporation first, and then the first packaging material layer 83 may be formed by deposition.

[0181] Step S115, patterning the first packaging material layer 83, the first conductive material layer 81 and the light emitting material layer 82 in sequence to obtain the first packaging portion 41, another portion of the second packaging portion 42, the first electrode 301 and the light emitting structure 302;

[0182] Among them, reference Figure 4a and 4bA portion of the second encapsulation portion 42 corresponding to the partial isolation opening is disposed on the surface of the isolation structure 22 on the side away from the substrate 21, and along the direction away from the substrate 21, a portion of the light emitting structure 302, a portion of the first electrode 301 and a portion of the first encapsulation portion 41 are sequentially stacked on the side of the portion of the second encapsulation portion 42 away from the substrate 21;

[0183] The isolation structure 22 partially located between two adjacent isolation openings has a channel 223 and is separated into at least two isolation parts by the channel 223. The at least two isolation parts include a first isolation part 2201 adjacent to one isolation opening and a second isolation part 2202 adjacent to the other isolation opening.

[0184] Another portion of the second packaging portion 42 adjacent to the first isolation portion 2201 extends in a direction perpendicular to the substrate 21, and one end extends to connect with the first packaging portion 41, and the other end extends into the channel 223 and contacts the first isolation portion 2201.

[0185] Another portion of the second packaging portion 42 adjacent to the second isolation portion 2202 extends in a direction perpendicular to the substrate 21 , with one end extending to connect with the first packaging portion 41 , and the other end extending into the channel 223 and contacting the second isolation portion 2202 .

[0186] In step S112, forming a portion of the second packaging portion 42 on a side of the partial isolation structure 22 away from the substrate 21 specifically includes:

[0187] forming a second packaging material layer on a side of the isolation structure 22 facing away from the substrate 21;

[0188] The second packaging material layer is patterned to obtain a plurality of second packaging portions 42 located on the surface of the isolation structure 22 facing away from the substrate 21 .

[0189] The present application also provides a display device, the display device comprising the above display panel. Based on the beneficial effects of the above display panel, the display device has the advantage of a low probability of dark spots appearing.

[0190] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0191] It should be understood that although the specific embodiments of the present application are described in detail in conjunction with the accompanying drawings, it should not be understood as limiting the scope of protection of the present application. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still fall within the scope of protection of the present application. Although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0192] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: include: substrate, An isolation structure is disposed on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; A sub-pixel, wherein the sub-pixel and the isolation opening are arranged correspondingly, the sub-pixel comprises a light-emitting structure and a first electrode which are sequentially stacked in a direction away from the substrate, a part of the light-emitting structure and a part of the first electrode are located in the isolation opening, and an end of the light-emitting structure in the extension direction of the substrate overlaps a surface of the isolation structure on a side away from the substrate; an encapsulation structure, arranged corresponding to the sub-pixel, the encapsulation structure comprising a first encapsulation portion and a second encapsulation portion, the first encapsulation portion covers a surface of the sub-pixel that is away from the substrate, and the second encapsulation portion is arranged on the isolation structure and contacts a side wall of an end portion of the light-emitting structure in an extending direction of the substrate; Among them, along the direction perpendicular to the substrate, the distance between the side of the second packaging portion facing away from the substrate and the side of the isolation structure facing away from the substrate is greater than the sum of the thickness of the light-emitting structure in the isolation opening and the thickness of the first electrode in the isolation opening.

2. The display panel according to claim 1, characterized in that: The second encapsulation part is arranged on a surface of the isolation structure away from the substrate, and along a direction away from the substrate, a part of the light emitting structure, a part of the first electrode and a part of the first encapsulation part are sequentially stacked on the side of the second encapsulation part away from the substrate; Preferably, along a direction perpendicular to the substrate, a distance between a side of the second encapsulation portion facing away from the substrate and a side of the isolation structure facing away from the substrate is equal to 1.5 to 2 times the sum of a thickness of the light emitting structure in the isolation opening and a thickness of the first electrode in the isolation opening; Preferably, the first packaging part and the second packaging part are made of different materials; Preferably, the material of the first packaging part includes an inorganic material, and / or the material of the second packaging part includes a metal material; Preferably, the material of the second packaging part includes aluminum; Preferably, along an extension direction parallel to the substrate, a width of the second encapsulation portion is 0.08 micrometers to 0.2 micrometers; Preferably, along an extension direction parallel to the substrate, a width of the second encapsulation portion is 0.08 micrometers to 0.12 micrometers.

3. The display panel according to claim 1, characterized in that: The isolation structure includes a channel located between two adjacent isolation openings and is divided into at least two isolation parts by the channel, wherein the at least two isolation parts include a first isolation part adjacent to one isolation opening and a second isolation part adjacent to the other isolation opening; The second encapsulation part adjacent to the first isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first encapsulation part, and the other end extends into the channel and contacts with the first isolation part; The second packaging part adjacent to the second isolation part extends in a direction perpendicular to the substrate, and one end of the second packaging part extends to connect with the first packaging part, and the other end of the second packaging part extends into the channel and contacts with the second isolation part.

4. The display panel according to claim 3, characterized in that: The orthographic projection of the channel between two adjacent isolation openings on the substrate includes a polygonal solid shadow, an elliptical solid shadow or a circular solid shadow; Preferably, the second encapsulation portion adjacent to the first isolation portion and the second encapsulation portion adjacent to the second isolation portion extend into the same channel; or, The orthographic projection of the channel between two adjacent isolation openings on the substrate includes a ring shape, and the at least two isolation portions also include an intermediate isolation portion located between the channels; Preferably, the second encapsulation portion adjacent to the first isolation portion extends into a channel between the intermediate isolation portion and the first isolation portion, and the second encapsulation portion adjacent to the second isolation portion extends into a channel between the intermediate isolation portion and the second isolation portion.

5. The display panel according to claim 3, characterized in that: Along a direction perpendicular to the substrate, the channel penetrates at least a portion of the isolation structure; Preferably, along a direction perpendicular to the substrate, the channel penetrates the isolation structure.

6. The display panel according to claim 1, characterized in that: The second encapsulation part corresponding to part of the isolation opening is arranged on a surface of the isolation structure away from the substrate, and along a direction away from the substrate, part of the light emitting structure, part of the first electrode and part of the first encapsulation part are sequentially stacked on the side of the second encapsulation part away from the substrate; The isolation structure partially located between two adjacent isolation openings has a trench and is divided into at least two isolation parts by the trench, wherein the at least two isolation parts include a first isolation part adjacent to one isolation opening and a second isolation part adjacent to the other isolation opening. The second encapsulation part adjacent to the first isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first encapsulation part, and the other end extends into the channel and contacts with the first isolation part. The second packaging part adjacent to the second isolation part extends in a direction perpendicular to the substrate, and one end of the second packaging part extends to connect with the first packaging part, and the other end of the second packaging part extends into the channel and contacts with the second isolation part.

7. The display panel according to claim 6, characterized in that: The orthographic projection of the channel between two adjacent isolation openings on the substrate includes a polygonal solid shadow, an elliptical solid shadow or a circular solid shadow; Preferably, the second encapsulation portion adjacent to the first isolation portion and the second encapsulation portion adjacent to the second isolation portion extend into the same channel; or, The orthographic projection of the channel between two adjacent isolation openings on the substrate includes a ring shape; Preferably, the at least two isolation parts also include an intermediate isolation part located between the channels, the second packaging part adjacent to the first isolation part extends into the channel between the intermediate isolation part and the first isolation part, and the second packaging part adjacent to the second isolation part extends into the channel between the intermediate isolation part and the second isolation part.

8. The display panel according to any one of claims 1 to 7, characterized in that: The plurality of isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening, the sub-pixels include a first sub-pixel, a second sub-pixel, and a third sub-pixel, the first sub-pixel is disposed in the first isolation opening, the second sub-pixel is disposed in the second isolation opening, and the third sub-pixel is disposed in the third isolation opening, Preferably, the light emitting color of the second sub-pixel is different from the light emitting color of the first sub-pixel; Preferably, the light-emitting color of the third sub-pixel is different from the light-emitting color of the first sub-pixel; Preferably, the light-emitting color of the third sub-pixel is different from the light-emitting color of the second sub-pixel.

9. The display panel according to claim 1, characterized in that: The isolation structure comprises a first structure layer and a second structure layer, the first structure layer and the second structure layer are stacked in sequence along a direction toward the substrate, and a side of the first structure layer facing the isolation opening protrudes from a side wall of the second structure layer; Preferably, at least a part of the orthographic projection of the second encapsulation portion on the substrate overlaps with the orthographic projection of the surface of the second structure layer on the side facing away from the substrate on the substrate; Preferably, the material of the first structural layer is different from the material of the second structural layer; Preferably, the material of the second structural layer includes a conductive material; Preferably, the first electrode and the second structure layer are in conductive contact; Preferably, the material of the first structural layer includes metal titanium, and / or the material of the second structural layer includes metal aluminum; Preferably, the isolation structure further comprises a third structure layer, and the first structure layer, the second structure layer and the third structure layer are stacked in sequence along a direction toward the substrate; Preferably, the material of the third structural layer and the material of the first structural layer both include metal molybdenum.

10. The display panel according to claim 1, characterized in that: The display panel further includes a pixel defining layer, wherein the pixel defining layer is located between the substrate and the isolation structure; Preferably, the isolation structure comprises a channel between two adjacent isolation openings, a portion of the pixel defining layer is exposed in the channel, and the second encapsulation part is stacked on the pixel defining layer through the channel.

11. The display panel according to claim 10, characterized in that: The sub-pixel further includes a second electrode, the second electrode and the pixel defining layer are both located between the substrate and the isolation structure, and are sequentially stacked in a direction away from the substrate, the pixel defining layer has a plurality of pixel openings, the isolation openings are connected to the pixel openings in a one-to-one correspondence, and the orthographic projections of the pixel openings on the substrate are located within the orthographic projection range of the corresponding isolation openings on the substrate, and a portion of the second electrode is exposed in the pixel openings; Preferably, at least a portion of the isolation structure is made of a metal conductive material, and the first electrode is in conductive contact with the metal conductive material of the isolation structure.

12. The display panel according to claim 1, characterized in that: The display panel further comprises a first encapsulation layer and a second encapsulation layer, wherein the first encapsulation layer is arranged on a side of the encapsulation structure away from the substrate, and the second encapsulation layer is arranged on a side of the first encapsulation layer away from the substrate; Preferably, the first encapsulation layer is in contact with the isolation structure; Preferably, the first encapsulation layer comprises an organic material, and / or the second encapsulation layer comprises an inorganic material.

13. A display panel, characterized in that: include: substrate, An isolation structure is disposed on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; A sub-pixel, wherein the sub-pixel and the isolation opening are arranged correspondingly, the sub-pixel comprises a light-emitting structure and a first electrode which are sequentially stacked in a direction away from the substrate, a part of the light-emitting structure and a part of the first electrode are located in the isolation opening, and an end of the light-emitting structure in the extension direction of the substrate overlaps a surface of the isolation structure on a side away from the substrate; an encapsulation structure, arranged corresponding to the sub-pixel, the encapsulation structure comprising a first encapsulation portion and a second encapsulation portion, the first encapsulation portion covers a surface of the sub-pixel away from the substrate, the second encapsulation portion is arranged on a side of the isolation structure away from the substrate and contacts a side wall of an end portion of the light-emitting structure in an extending direction of the substrate; Among them, along the direction perpendicular to the substrate, the distance between the side of the second packaging portion facing away from the substrate and the side of the isolation structure facing away from the substrate is greater than the sum of the thickness of the light-emitting structure in the isolation opening and the thickness of the first electrode in the isolation opening.

14. The display panel according to claim 13, characterized in that: Along the direction perpendicular to the substrate, the thickness of the second packaging portion is 0.2-0.8 microns; Preferably, along a direction perpendicular to the substrate, a thickness of the second packaging portion is 0.4-0.6 micrometers.

15. A method for preparing a display panel, characterized in that: The preparation method comprises: Providing a backplane, the backplane comprising a substrate and an isolation structure, wherein the isolation structure is disposed on one side of the substrate; forming a second encapsulation portion on a surface of the isolation structure that is away from the substrate; Sequentially forming a light emitting material layer, a first conductive material layer, and a first packaging material layer on one side of the backplane where the isolation structure is located; The first packaging material layer, the first conductive material layer and the light-emitting material layer are patterned in sequence to obtain a first packaging part, a first electrode of a sub-pixel and a light-emitting structure, wherein part of the sub-pixel is located in the isolation opening, and along the direction away from the substrate, part of the light-emitting structure, part of the first electrode and part of the first packaging part are sequentially stacked on the side of the second packaging part away from the substrate, and along the direction perpendicular to the substrate, the distance between the side of the second packaging part away from the substrate and the side of the isolation structure away from the substrate is greater than the sum of the thickness of the light-emitting structure in the isolation opening and the thickness of the first electrode in the isolation opening.

16. The method for preparing a display panel according to claim 15, characterized in that: The second encapsulation portion is formed on a side of the isolation structure away from the substrate, comprising: forming a second packaging material layer on a side of the isolation structure facing away from the substrate; The second packaging material layer is patterned to obtain a plurality of second packaging parts located on a surface of the isolation structure facing away from the substrate.

17. A method for preparing a display panel, characterized in that: The preparation method comprises: Providing a back plate, the back plate comprising a substrate and an isolation structure, the isolation structure is arranged on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; Patterning the isolation structure to form a trench on the isolation structure between two adjacent isolation openings, wherein the isolation structure is separated into at least two isolation portions by the trench, wherein the at least two isolation portions include a first isolation portion adjacent to one isolation opening and a second isolation portion adjacent to the other isolation opening; Sequentially forming a light-emitting material layer, a first conductive material layer and a first material film layer on one side of the backplane where the isolation structure is located; The first material film layer, the first conductive material layer and the light-emitting material layer are patterned in sequence to obtain a packaging structure, a first electrode and a light-emitting structure. Among them, the packaging structure is a patterned film layer of the first material, and the packaging structure includes a first packaging part and a second packaging part, the first packaging part covers the surface of the sub-pixel facing away from the substrate, the second packaging part adjacent to the first isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first packaging part, and the other end extends into the channel and contacts with the first isolation part, the second packaging part adjacent to the second isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first packaging part, and the other end extends into the channel and contacts with the second isolation part, and the distance between the side of the second packaging part facing away from the substrate and the side of the isolation structure facing away from the substrate is greater than the sum of the thickness of the light-emitting structure in the isolation opening and the thickness of the first electrode in the isolation opening.

18. A method for preparing a display panel, characterized in that: The preparation method comprises: Providing a back plate, the back plate comprising a substrate and an isolation structure, the isolation structure is arranged on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; forming a portion of a second encapsulation portion on a surface of a portion of the isolation structure that is away from the substrate; A patterned partial isolation structure, wherein the isolation structure has a channel located between two adjacent isolation openings and is separated into at least two isolation parts by the channel, wherein the at least two isolation parts include a first isolation part adjacent to one isolation opening and a second isolation part adjacent to the other isolation opening; A light emitting material layer, a first conductive material layer, and a first packaging material layer are sequentially formed on one side of the back plate where the isolation structure is located; The first packaging material layer, the first conductive material layer and the light-emitting material layer are patterned in sequence to obtain a first packaging portion, another portion of the second packaging portion, a first electrode and a light-emitting structure, The part of the second encapsulation part corresponding to the part of the isolation opening is arranged on the surface of the isolation structure away from the substrate, and along the direction away from the substrate, a part of the light-emitting structure, a part of the first electrode and a part of the first encapsulation part are sequentially stacked on the side of the part of the second encapsulation part away from the substrate; The isolation structure partially located between two adjacent isolation openings has a trench and is divided into at least two isolation parts by the trench, wherein the at least two isolation parts include a first isolation part adjacent to one isolation opening and a second isolation part adjacent to the other isolation opening. The other part of the second packaging part adjacent to the first isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first packaging part, and the other end extends into the channel and contacts with the first isolation part. The other part of the second packaging part adjacent to the second isolation part extends in a direction perpendicular to the substrate, and one end extends to connect with the first packaging part, and the other end extends into the channel and contacts with the second isolation part.

19. The method for preparing a display panel according to claim 18, characterized in that: The forming of a portion of the second packaging portion on a side of the partial isolation structure away from the substrate comprises: forming a second packaging material layer on a side of the isolation structure facing away from the substrate; The second packaging material layer is patterned to obtain a plurality of second packaging parts located on a surface of the isolation structure facing away from the substrate.

20. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 14.

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