Display module and display device

Abstract

The invention relates to a display module and a display device. The display module is provided with an island area, and the island area comprises a light-emitting area and a packaging blocking area at least surrounding a part of the light-emitting area. The display module comprises a substrate; an insulating layer on the substrate; the interlayer dielectric layer is positioned on one side, far away from the substrate, of the insulating layer; and the buffer layer is located between the insulating layer and the interlayer dielectric layer, the buffer layer is located in the packaging barrier region, and the elasticity of the buffer layer is larger than that of the insulating layer and / or the interlayer dielectric layer. According to the display module applying the technical scheme of the invention, the buffer layer is located between the insulating layer and the interlayer dielectric layer, the buffer layer is located in the packaging barrier region, and the elasticity of the buffer layer is greater than that of the insulating layer and / or the interlayer dielectric layer, so that the problem of high rigidity caused by too thick stacking of the inorganic layers in a linear packaging path is avoided; the rigidity between the inorganic layers is dispersed, the buffering effect during stretching is improved, and the packaging reliability can be improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the development of technology, the display screen shape will develop from fixed, bent, curled to fully flexible display forms, and will also develop into 3D conformal / conformal display, that is, the display screen can change accordingly with the shape of the object, which requires the display screen to have multi-directional stretching properties similar to natural rubber. Stretch display can be applied to wearable electronic products, electronic skin, non-planar or spherical object surfaces, and drop-resistant and shock-resistant products. It is one of the important development directions of the next generation of display technology. In traditional stretchable displays, the stretchable pixel island encapsulation is contacted through the inorganic encapsulation layer and the interlayer dielectric layer, but the thickness of the inorganic layer of this stacked structure is too large, the rigidity becomes larger, and there is a risk of falling off from the lower film layer during stretching. Once the inorganic encapsulation layer falls off, water and oxygen will immediately enter the OLED pixel area, causing failure and inability to display, which is not conducive to application. Summary of the invention

[0003] Based on this, it is necessary to provide a display module and a display device to improve the packaging reliability.

[0004] A display module, the display module having an island area, the island area including a light-emitting area and a packaging barrier area arranged at least around a portion of the light-emitting area; the display module comprises:

[0005] substrate;

[0006] an insulating layer, located on the substrate;

[0007] an interlayer dielectric layer, located on a side of the insulating layer away from the substrate; and

[0008] A buffer layer is located between the insulating layer and the interlayer dielectric layer, the buffer layer is located in the packaging barrier region, and the elasticity of the buffer layer is greater than the elasticity of the insulating layer and / or the interlayer dielectric layer.

[0009] In the display module using the technical solution of the present invention, since the buffer layer is located between the insulating layer and the interlayer dielectric layer, and the buffer layer is located in the packaging barrier area, and the elasticity of the buffer layer is greater than the elasticity of the insulating layer and / or the interlayer dielectric layer, the problem of high rigidity caused by excessively thick inorganic layer stacking in a straight packaging path is avoided, the rigidity between the inorganic layers is dispersed, the buffer effect during stretching is increased, and the packaging reliability is helped to be improved.

[0010] In a feasible implementation, a groove is provided on the buffer layer.

[0011] In a feasible implementation, at least a portion of the opening of the groove is retracted inward, and the portion of the buffer layer located at the opening of the groove includes a portion extending toward the inside of the groove.

[0012] In a feasible implementation, the ratio of the depth of the groove to the thickness of the buffer layer is 1:2 to 1:3;

[0013] Preferably, an opening size of the groove from the center of the island area to the outside is 3 μm to 4 μm.

[0014] In a feasible implementation, the projection of the groove on the insulating layer includes a closed ring and / or a plurality of spaced portions arranged around the light-emitting area;

[0015] Preferably, the projection of the groove on the insulating layer includes a plurality of rings, and the plurality of rings are nested;

[0016] Preferably, the shapes of the plurality of spacing portions are selected from at least one of a circle, an ellipse, a strip, a continuous or disconnected S-shape, and a continuous or disconnected W-shape.

[0017] In a feasible implementation, the buffer layer is made of organic glue.

[0018] In a feasible implementation, the buffer layer includes at least two buffer sub-layers;

[0019] Preferably, the thickness of each buffer sublayer is 0.8 μm to 1.6 μm.

[0020] In a feasible implementation, the insulating layer includes a first gate insulating layer and a second gate insulating layer;

[0021] The projection of the buffer sublayer close to the second gate insulating layer on the second gate insulating layer covers the projection of the buffer sublayer far from the second gate insulating layer on the second gate insulating layer, and the projection area of ​​the buffer sublayer close to the second gate insulating layer on the second gate insulating layer is larger than the projection area of ​​the buffer sublayer far from the second gate insulating layer on the second gate insulating layer.

[0022] In a feasible implementation, the display module further includes an inorganic packaging layer, and the inorganic packaging layer is located on a side of the interlayer dielectric layer away from the buffer layer.

[0023] A display device comprises any one of the above display modules.

[0024] In the display device using the technical solution of the present invention, since the buffer layer in the display module is located between the insulating layer and the interlayer dielectric layer, and the buffer layer is located in the packaging barrier area, and the elasticity of the buffer layer is greater than the elasticity of the insulating layer and / or the interlayer dielectric layer, the problem of high rigidity caused by excessive thickness of inorganic layer stacking due to a straight packaging path is avoided, the rigidity between the inorganic layers is dispersed, the buffer effect during stretching is increased, and the packaging reliability is helped to be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic diagram of a display module according to a first embodiment of the present invention;

[0026] Figure 2 is a schematic diagram of a display module according to a second embodiment of the present invention;

[0027] Figure 3 is a schematic diagram of a display module according to a third embodiment of the present invention;

[0028] Figure 4 is a schematic plan view of a repeating unit in a display module according to a third embodiment of the present invention;

[0029] Figure 5 is a top view of an island area 1 of a display module according to a third embodiment of the present invention;

[0030] Figure 6 is a top view of the island area 2 of the display module according to the third embodiment of the present invention;

[0031] Figure 7 is a top view of the island area 3 of the display module according to the third embodiment of the present invention;

[0032] Figure 8 is a top view of an island area 4 of a display module according to a third embodiment of the present invention;

[0033] Fig. 9 is a top view of the island area 5 of the display module according to the third embodiment of the present invention;

[0034] Fig.10 is a top view of the island area 6 of the display module according to the third embodiment of the present invention;

[0035] Fig.11 is a top view of the island area 7 of the display module according to the third embodiment of the present invention;

[0036] Fig.12 is a schematic diagram of a display module according to a fourth embodiment of the present invention. DETAILED DESCRIPTION

[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0038] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0040] See also Figure 1 The display module 100 of the first embodiment of the present invention has an island area 110, and the island area 110 includes a light-emitting area 112 and a packaging barrier area 114 disposed around at least a portion of the light-emitting area 112. Furthermore, a bridge area 120 is provided between two adjacent island areas 110, and the packaging barrier area 114 is located in the peripheral area of ​​the light-emitting area 112 and between the light-emitting area 112 and the bridge area 120.

[0041] The display module 100 of the first embodiment includes a substrate 130, an insulating layer 140, an interlayer dielectric layer (ILD layer) 150 and a buffer layer 160. The substrate 130 includes a PI substrate 131, a barrier layer 132 and a buffer layer 133 which are stacked in sequence, and the thickness and number of layers of the PI substrate 131, the barrier layer 132 and the buffer layer 133 can be set according to actual conditions.

[0042] The insulating layer 140 is located on the substrate 130, and the interlayer dielectric layer 150 is located on a side of the insulating layer 140 away from the substrate 130. In this embodiment, the insulating layer 140 includes a first gate insulating layer (GI layer) 141 and a second gate insulating layer (CI layer) 142, the first gate insulating layer 141 is located on the substrate 130, and the second gate insulating layer 142 is located on a side of the first gate insulating layer 141 away from the substrate 130.

[0043] The buffer layer 160 is located between the insulating layer 140 and the interlayer dielectric layer 150, and the buffer layer 160 is located in the package barrier region 114. The elasticity of the buffer layer 160 is greater than the elasticity of the insulating layer 140 and / or the interlayer dielectric layer 150. Introducing the buffer layer 160 between the inorganic insulating layer 140 and the inorganic interlayer dielectric layer 150 can avoid the problem of excessively thick inorganic layer stacking in a linear package path, resulting in high rigidity, and disperses the rigidity between the inorganic layers, increasing the buffering effect during stretching, and helping to improve package reliability.

[0044] Based on the above embodiment, the material of the buffer layer 160 is organic glue. The material of the buffer layer 160 can be, for example, polyimide or other organic glue, and is preferably the same as the material of the planar layer (PLN layer).

[0045] Based on the above embodiment, the thickness of the buffer layer 160 is 0.8 μm to 1.6 μm. At this time, the buffer layer 160 has a moderate thickness, which not only disperses the rigidity between the inorganic layers and improves the packaging reliability, but also avoids the overall performance of the display module being affected by excessive thickness.

[0046] On the basis of the foregoing embodiment, the display module 100 further includes an inorganic encapsulation layer 170, which is located on the side of the interlayer dielectric layer 150 away from the buffer layer 160. The inorganic encapsulation layer 170 can be prepared by ALD and CVD processes. The introduction of the buffer layer 160 between the inorganic insulating layer 140 and the inorganic interlayer dielectric layer 150 can avoid the problem of excessively thick inorganic layer stacking in the straight-line encapsulation path, resulting in high rigidity, disperse the rigidity between the inorganic layers, increase the buffering effect during stretching, and help improve the reliability of the package. Furthermore, it also avoids the direct impact of the inorganic encapsulation layer on the metal routing after the failure of the ability to isolate water and oxygen, thereby extending the life of the display module.

[0047] Furthermore, the display module 100 of this embodiment further includes a planarization layer 180 and a pixel definition layer 190 which are sequentially stacked on the interlayer dielectric layer 150. Figure 1 The thickness and number of the planar layer 180 and the pixel definition layer 190 can be set according to actual conditions. Of course, the display module 100 of this embodiment can also include other functional layers, which is not limited by the present invention.

[0048] In the display module 100 of the first embodiment described above, the number of layers of the buffer layer 160 is one layer. It should be noted that the number of layers of the buffer layer 160 is not limited thereto, and may also be two layers or more. Further, the number of layers of the buffer layer 160 is preferably one layer, two layers or three layers. When the number of layers of the buffer layer 160 is two layers or more, the thickness of the buffer layer 160 is relatively large, which can provide a better buffering effect and further improve the packaging reliability.

[0049] See also Figure 2 The display module 200 of the second embodiment of the present invention has an island area 210, and the island area 210 includes a light-emitting area 212 and a packaging barrier area 214 disposed around at least a portion of the light-emitting area 212. Furthermore, a bridge area 220 is provided between two adjacent island areas 210, and the packaging barrier area 214 is located in the peripheral area of ​​the light-emitting area 212 and between the light-emitting area 212 and the bridge area 220.

[0050] The display module 200 of this embodiment includes a substrate 230, an insulating layer 240, an interlayer dielectric layer 250, a buffer layer 260 and an inorganic encapsulation layer 270. The buffer layer 260 is located between the insulating layer 240 and the interlayer dielectric layer 250, and the buffer layer 260 is located in the encapsulation barrier region 214. The elasticity of the buffer layer 260 is greater than the elasticity of the insulating layer 240 and / or the interlayer dielectric layer 250. The introduction of the buffer layer 260 between the inorganic insulating layer 240 and the inorganic interlayer dielectric layer 250 can avoid the problem of excessively thick inorganic layer stacking in a linear encapsulation path, resulting in high rigidity, disperse the rigidity between the inorganic layers, increase the buffering effect during stretching, and help improve the reliability of the encapsulation.

[0051] In this embodiment, the buffer layer 260 includes two buffer sublayers, namely a buffer sublayer 261 and a buffer sublayer 262. In this embodiment, the insulating layer 240 includes a first gate insulating layer 241 and a second gate insulating layer 242. The projection of the buffer sublayer 261 close to the second gate insulating layer 242 on the second gate insulating layer 242 covers the projection of the buffer sublayer 262 far from the second gate insulating layer 242 on the second gate insulating layer 242, and the projection area of ​​the buffer sublayer 261 close to the second gate insulating layer 242 on the second gate insulating layer 242 is larger than the projection area of ​​the buffer sublayer 262 far from the second gate insulating layer 242 on the second gate insulating layer 242. At this time, the edges of the buffer sublayer 261 and the buffer sublayer 262 form a stepped structure, which is conducive to forming a climbing connection between the buffer layer 260 and the inorganic encapsulation layer 270, thereby improving the connection reliability.

[0052] On the basis of the aforementioned embodiment, the thickness of the buffer sublayer 261 and the buffer sublayer 262 are both 0.8μm to 1.6μm. At this time, the thickness of the buffer sublayer 261 and the buffer sublayer 262 is moderate, which not only disperses the rigidity between the inorganic layers and improves the reliability of the package, but also avoids the overall performance of the display module being affected by excessive thickness. In addition, it should be noted that in the display module of the present invention, the buffer layer may also include three or more buffer sublayers. When the buffer layer includes at least two buffer sublayers, the thickness of each buffer sublayer is preferably 0.8μm to 1.6μm.

[0053] Furthermore, the display module 200 of this embodiment further includes a planarization layer 280 and a pixel definition layer 290 which are sequentially stacked on the interlayer dielectric layer 250. Figure 2 shown.

[0054] In this embodiment, a buffer layer 260 is introduced between the inorganic second gate insulating layer 242 and the inorganic interlayer dielectric layer 250 to avoid the problem of excessive rigidity caused by excessive thickness of the inorganic layers in the straight packaging path. It disperses the rigidity between the inorganic layers, increases the buffering effect during stretching, and helps to improve packaging reliability.

[0055] See also Figure 3 and Figure 4 The display module 300 of the third embodiment of the present invention has an island area 310, and the island area 310 includes a light-emitting area 312 and a packaging barrier area 314 disposed around at least a portion of the light-emitting area 312. Furthermore, a bridge area 320 is provided between two adjacent island areas 310, and the packaging barrier area 314 is located in the peripheral area of ​​the light-emitting area 312 and between the light-emitting area 312 and the bridge area 320.

[0056] The display module 300 of this embodiment includes a substrate 330, an insulating layer 340, an interlayer dielectric layer 350, a buffer layer 360 and an inorganic encapsulation layer 370. The insulating layer 340 includes a first gate insulating layer 341 and a second gate insulating layer 342. The buffer layer 360 is located between the insulating layer 340 and the interlayer dielectric layer 350, and the buffer layer 360 is located in the encapsulation barrier region 314. The elasticity of the buffer layer 360 is greater than the elasticity of the insulating layer 340 and / or the interlayer dielectric layer 350.

[0057] In this embodiment, the buffer layer 360 has one layer, and a groove 363 is provided on the buffer layer 360. In this way, on the one hand, the encapsulation path is extended, and on the other hand, the mortise and tenon contact force between the laminated inorganic encapsulation layer 380 and the buffer layer 370 is strengthened, and the 3D spatial bonding force between the rigid island and the inorganic encapsulation layer 370 is increased, thereby preventing the risk of peeling between the inorganic encapsulation layer 370 and the rigid island during the 3D stretching process of the display module.

[0058] Furthermore, the groove 363 can be prepared in the following two ways: first, it can be achieved through a negative photoresist process; second, a metal covering layer can be introduced on the positive photoresist, and then the metal layer and the organic photoresist layer can be etched simultaneously.

[0059] On the basis of the above-mentioned embodiments, at least part of the opening of the groove 363 is retracted, and the portion of the buffer layer 360 located at the opening of the groove 363 includes a portion extending into the groove 363. The groove design of each embodiment is equivalent to a safety helmet, which serves as a multi-layer safety protection measure, so that the mortise and tenon contact force between the laminated inorganic encapsulation layer 370 and the buffer layer 360 can be further strengthened, thereby increasing the 3D spatial bonding force between the rigid island and the inorganic encapsulation layer 370, and preventing the inorganic encapsulation layer 370 from extending inward after peeling from the rigid island during the 3D stretching process of the display module.

[0060] On the basis of the aforementioned embodiment, the ratio of the depth of the groove 363 to the thickness of the buffer layer 360 is 1:2 to 1:3. Preferably, the opening size of the groove 363 from the center of the island area 310 to the outside is 3μm to 4μm. Among them, the depth of the groove 363 refers to the depth of the groove 363 from the opening to the bottom in the buffer layer 360. When the ratio of the depth of the groove 363 to the thickness of the buffer layer 360 and the opening size of the groove 363 are within the above numerical range, it can play a role in better extending the packaging path and strengthening the mortise and tenon contact force. Of course, the depth and opening size of the groove 363 are not limited to the above numerical range, and can also be set according to actual conditions.

[0061] Based on the above-mentioned embodiment, the projection of the groove 363 on the insulating layer 340 includes a closed ring and / or a plurality of spaced portions arranged around the light emitting area 312, such as Figure 5 to Figure 11 shown.

[0062] Preferably, see Figure 5 The projection of the groove 363 on the insulating layer 340 includes a plurality of rings, and the plurality of rings are nested. Further, the distance between two adjacent grooves 363 is preferably 3 μm to 4 μm. Figure 6 The projection of the groove 363 on the insulating layer 340 includes a ring, and a plurality of long strips arranged at intervals and perpendicular to the ring are provided on the ring. The groove 363 on the insulating layer 340 is a cross-mortise and tenon structure.

[0063] Preferably, see Figure 7 to Figure 11 The shapes of the plurality of spacing portions are selected from at least one of a circle, an ellipse, a strip, a continuous or disconnected S-shape, and a continuous or disconnected W-shape.

[0064] For details, see Figure 7 and Figure 8 , the groove 363 is a cross-mortise and tenon structure on the insulating layer 340; see Fig. 9 and Fig.10 , the projection shape of the plurality of grooves 363 on the insulating layer 340 is circular or elliptical, and is arranged in one or more circles in a staggered manner; see Fig.11, the projection shape of the plurality of grooves 363 on the insulating layer 340 is a disconnected S-shape. Of course, the projection shape of the plurality of grooves 363 on the insulating layer 340 is not limited thereto, and may also be any other shape, such as a polygon.

[0065] Furthermore, the display module 300 of this embodiment further includes a planarization layer 380 and a pixel definition layer 390 which are sequentially stacked on the interlayer dielectric layer 350. Figure 3 shown.

[0066] In this embodiment, a buffer layer 360 with a groove 363 is introduced between the inorganic insulating layer 340 and the inorganic interlayer dielectric layer 350. This can avoid the problem of excessive rigidity caused by excessive thickness of the inorganic layers in the straight packaging path, disperse the rigidity between the inorganic layers, increase the buffering effect during stretching, and help improve packaging reliability.

[0067] See also Fig.12 The display module 400 of the fourth embodiment of the present invention has an island area 410, and the island area 410 includes a light-emitting area 412 and a packaging barrier area 414 disposed around at least a portion of the light-emitting area 412. Furthermore, a bridge area 420 is provided between two adjacent island areas 410, and the packaging barrier area 414 is located in the peripheral area of ​​the light-emitting area 412 and between the light-emitting area 412 and the bridge area 420.

[0068] The display module 400 of this embodiment includes a substrate 430, an insulating layer 440, an interlayer dielectric layer 450, a buffer layer 460 and an inorganic packaging layer 470. The buffer layer 460 is located between the insulating layer 440 and the interlayer dielectric layer 450, and the buffer layer 460 is located in the packaging barrier region 414. The elasticity of the buffer layer 460 is greater than the elasticity of the insulating layer 440 and / or the interlayer dielectric layer 450.

[0069] In this embodiment, the buffer layer 460 includes two buffer sub-layers, namely a buffer sub-layer 461 and a buffer sub-layer 462. A groove 463 is provided on the buffer sub-layer 462 close to the inorganic encapsulation layer 470, and the shape of the groove 463 is not limited.

[0070] In this embodiment, the insulating layer 440 includes a first gate insulating layer 441 and a second gate insulating layer 442. The projection of the buffer sublayer 461 close to the second gate insulating layer 442 on the second gate insulating layer 442 covers the projection of the buffer sublayer 462 far from the second gate insulating layer 442 on the second gate insulating layer 442, and the projection area of ​​the buffer sublayer 461 close to the second gate insulating layer 442 on the second gate insulating layer 442 is larger than the projection area of ​​the buffer sublayer 462 far from the second gate insulating layer 442 on the second gate insulating layer 442. At this time, the edges of the buffer sublayer 461 and the buffer sublayer 462 form a stepped structure, which is conducive to forming a climbing connection between the buffer layer 460 and the inorganic encapsulation layer 470, thereby improving the connection reliability.

[0071] Furthermore, the display module 400 of this embodiment further includes a planarization layer 480 and a pixel definition layer 490 which are sequentially stacked on the interlayer dielectric layer 450. Fig.12 shown.

[0072] In this embodiment, a buffer layer 460 with a groove 463 is introduced between the inorganic insulating layer 440 and the inorganic interlayer dielectric layer 450. This can avoid the problem of excessive rigidity caused by excessive thickness of the inorganic layers in the straight packaging path, disperse the rigidity between the inorganic layers, increase the buffering effect during stretching, and help improve packaging reliability.

[0073] The display module using the technical solution of the present invention avoids the problem of high rigidity caused by excessively thick inorganic layer stacking in a linear packaging path, because the buffer layer is located between the insulating layer and the interlayer dielectric layer, and the buffer layer is located in the packaging barrier area, and the elasticity of the buffer layer is greater than the elasticity of the insulating layer and / or the interlayer dielectric layer. The rigidity between the inorganic layers is dispersed, the buffer effect during stretching is increased, and the packaging reliability is improved. Furthermore, the display module of the technical solution of the present invention can be prepared based on existing film layers and existing masks, without the need to introduce other complex processes, with obvious packaging effects, simple structure, easy implementation, and low mask cost.

[0074] A display device according to an embodiment includes any one of the above display modules, wherein the display device is a stretchable display device.

[0075] Specifically, the display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc., and may also be a product or component with a virtual reality (VR), augmented reality (AR) and three-dimensional (3D) display function. The present invention is not limited to this.

[0076] In the display device using the technical solution of the present invention, since the buffer layer in the display module is located between the insulating layer and the interlayer dielectric layer, and the buffer layer is located in the packaging barrier area, and the elasticity of the buffer layer is greater than the elasticity of the insulating layer and / or the interlayer dielectric layer, the problem of high rigidity caused by excessive thickness of inorganic layer stacking due to a straight packaging path is avoided, the rigidity between the inorganic layers is dispersed, the buffer effect during stretching is increased, and the packaging reliability is helped to be improved.

[0077] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display module, characterized in that: The display module has an island area, and the island area includes a light-emitting area and a packaging barrier area at least surrounding a portion of the light-emitting area; The display module comprises: substrate; an insulating layer, located on the substrate; an interlayer dielectric layer, located on a side of the insulating layer away from the substrate; and A buffer layer is located between the insulating layer and the interlayer dielectric layer, the buffer layer is located in the packaging barrier region, and the elasticity of the buffer layer is greater than the elasticity of the insulating layer and / or the interlayer dielectric layer.

2. The display module according to claim 1, characterized in that: The buffer layer is provided with a groove.

3. The display module according to claim 2, characterized in that: At least a portion of the opening of the groove is retracted inward, and the portion of the buffer layer located at the opening of the groove includes a portion extending toward the inside of the groove.

4. The display module according to claim 2, characterized in that: The ratio of the depth of the groove to the thickness of the buffer layer is 1:2 to 1:3; Preferably, an opening size of the groove from the center of the island area to the outside is 3 μm to 4 μm.

5. The display module according to claim 2, characterized in that: The projection of the groove on the insulating layer includes a closed ring and / or a plurality of spaced portions arranged around the light emitting area; Preferably, the projection of the groove on the insulating layer includes a plurality of rings, and the plurality of rings are nested; Preferably, the shapes of the plurality of spacing portions are selected from at least one of a circle, an ellipse, a strip, a continuous or disconnected S-shape, and a continuous or disconnected W-shape.

6. The display module according to claim 1, characterized in that: The material of the buffer layer is organic glue.

7. The display module according to claim 1, characterized in that: The buffer layer includes at least two buffer sublayers; Preferably, the thickness of each buffer sublayer is 0.8 μm to 1.6 μm.

8. The display module according to claim 7, characterized in that: The insulating layer comprises a first gate insulating layer and a second gate insulating layer; The projection of the buffer sublayer close to the second gate insulating layer on the second gate insulating layer covers the projection of the buffer sublayer far from the second gate insulating layer on the second gate insulating layer, and the projection area of ​​the buffer sublayer close to the second gate insulating layer on the second gate insulating layer is larger than the projection area of ​​the buffer sublayer far from the second gate insulating layer on the second gate insulating layer.

9. The display module according to claim 1, characterized in that: The display module further includes an inorganic packaging layer, and the inorganic packaging layer is located on a side of the interlayer dielectric layer away from the buffer layer.

10. A display device, characterized in that: A display module comprising any one of claims 1 to 9.

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