Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The problem that in the prior art, the preparation process of a display panel is complex is solved. The preparation method of the display panel comprises the following steps: preparing a plurality of second electrodes on a substrate, wherein the plurality of second electrodes comprise first pixel second electrodes; sequentially preparing a first luminescent material layer and a first auxiliary material layer on one side, deviating from the substrate, of the second electrode of the first pixel; partially removing the first auxiliary material layer which does not cover the second electrode of the first pixel; removing the remaining first auxiliary material layer which does not cover the second electrode of the first pixel; patterning the first light-emitting material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain a first light-emitting unit; and preparing a first pixel first electrode on one side, deviating from the substrate, of the first light-emitting unit.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] With the advancement of terminal display technology such as mobile phones, active-matrix organic light-emitting diode (AMOLED) displays have gradually become mainstream. People have also put forward requirements for AMOLED mobile phone displays such as flexibility, full screen, and ultra-narrow borders. Therefore, the borders of mobile phone display screens are required to be smaller and smaller, and the panel size is no longer limited by fine metal mask plates.

[0003] However, the current manufacturing process of display panels is relatively complicated. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, which solve the problem of a complicated manufacturing process of the display panel in the prior art.

[0005] In a first aspect, the present application provides a display panel, comprising a substrate, a plurality of light-emitting devices and an auxiliary layer, wherein the plurality of light-emitting devices are located on one side of the substrate, the light-emitting devices include a light-emitting unit and a first electrode, and the first electrode is located on the side of the light-emitting unit away from the substrate; the auxiliary layer is located between the light-emitting unit and the first electrode, and the orthographic projection of the auxiliary layer on the substrate is located within the orthographic projection of the light-emitting unit on the substrate; the auxiliary layer includes a plurality of auxiliary units, and the auxiliary units correspond to the light-emitting units one by one.

[0006] In combination with the first aspect, in some possible implementations, the thickness of the auxiliary layer is greater than or equal to 500 angstroms and less than or equal to 5000 angstroms; preferably, the thickness of the auxiliary layer is greater than or equal to 500 angstroms and less than or equal to 1000 angstroms; preferably, the auxiliary layer is a single layer.

[0007] In combination with the first aspect, in some possible implementations, the light-emitting device further includes a common layer, the common layer is located on the side of the light-emitting unit facing away from the substrate, and the auxiliary layer is located between the light-emitting unit and the common layer; preferably, the auxiliary unit covers the periphery of the light-emitting unit facing away from the substrate.

[0008] In combination with the first aspect, in some possible implementations, the material of the auxiliary layer includes any one of an organic material and an inorganic material; preferably, the material of the auxiliary layer includes any one of an oxide, a nitride, a metal, an alloy, polyvinyl alcohol, polyvinyl butyral, polyvinyl pyrrolidone, polyethylene glycol, polyglycerol, pullulan, water-soluble cellulose, and an alcohol-soluble polyamide resin.

[0009] In combination with the first aspect, in some possible implementations, the light-emitting device further includes a common layer, and the common layer is located on a side of the auxiliary layer close to the substrate; preferably, the auxiliary unit covers a periphery of a side of the common layer away from the substrate.

[0010] In combination with the first aspect, in some possible implementations, the auxiliary layer is a conductive layer; and the material of the auxiliary layer includes metal.

[0011] In combination with the first aspect, in some possible implementations, an insulating structure layer is further included, which is located on a side of the auxiliary layer away from the substrate and between adjacent light-emitting devices.

[0012] In combination with the first aspect, in some possible implementations, the insulating structure layer includes a protective layer, the protective layer includes a first protective portion and a second protective portion connected in sequence, the first protective portion is located between adjacent light-emitting devices, and the second protective portion covers the side walls of the light-emitting unit and the side walls of the auxiliary unit; preferably, the orthographic projection of the protective layer on the substrate covers the orthographic projection of the auxiliary layer on the substrate; preferably, the first protective portion and the second protective portion enclose a groove; preferably, the material of the protective layer includes any one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide; preferably, the protective layer also includes a third protective portion, the third protective portion is connected to a side of the second protective portion away from the first protective portion, and the third protective portion is located on a side of the auxiliary layer away from the substrate.

[0013] In combination with the first aspect, in some possible implementations, the insulating structure layer also includes a planarization layer, which is located on the side of the protective layer facing away from the substrate; the orthographic projection of the planarization layer on the substrate and the orthographic projection of the protective layer on the substrate at least partially overlap; preferably, the orthographic projection of the planarization layer on the substrate is located within the range of the orthographic projection of the protective layer on the substrate.

[0014] In combination with the first aspect, in some possible implementations, the light-emitting device also includes a second electrode, which is located on a side of the light-emitting unit close to the substrate, and the orthographic projection of the second electrode on the substrate and the orthographic projection of the light-emitting unit on the substrate at least partially overlap; preferably, it also includes a first inorganic encapsulation layer, which is located on the side of the light-emitting device away from the substrate, and the orthographic projection of the first inorganic encapsulation layer on the substrate covers the orthographic projection of the light-emitting device on the substrate; preferably, it also includes an organic encapsulation layer, which is located on the side of the first inorganic encapsulation layer away from the substrate, and the orthographic projection of the first inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate; preferably, it also includes a second inorganic encapsulation layer, which is located on the side of the organic encapsulation layer away from the substrate, and the orthographic projection of the second inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

[0015] The second aspect of the present application provides a display panel, including a substrate, a plurality of light-emitting devices and an auxiliary layer, wherein the plurality of light-emitting devices are located on one side of the substrate, the light-emitting devices include a light-emitting unit, the plurality of light-emitting devices also include a common layer, the common layer is located on the side of the plurality of light-emitting units away from the substrate; the auxiliary layer is located between the light-emitting unit and the common layer; the auxiliary layer includes a plurality of auxiliary units, the auxiliary units correspond to the light-emitting units one by one, and the auxiliary units cover the periphery of the side of the light-emitting unit away from the substrate.

[0016] The third aspect of the present application provides a method for preparing a display panel, including preparing a plurality of second electrodes on a substrate, the plurality of second electrodes including a first pixel second electrode; sequentially preparing a first light-emitting material layer and a first auxiliary material layer on a side of the first pixel second electrode facing away from the substrate; partially removing the first auxiliary material layer not covering the first pixel second electrode; removing the remaining first auxiliary material layer not covering the first pixel second electrode; patterning the first light-emitting material layer based on the first auxiliary material layer covering the first pixel second electrode to obtain a first light-emitting unit; and preparing a first pixel first electrode on a side of the first light-emitting unit facing away from the substrate.

[0017] In combination with the third aspect, in some possible implementations, partially removing the first auxiliary material layer not covering the first pixel second electrode includes: removing 20%-80% of the thickness of the first auxiliary material layer not covering the first pixel second electrode; preferably, partially removing the first auxiliary material layer not covering the first pixel second electrode includes: removing 30%-70% of the thickness of the first auxiliary material layer not covering the first pixel second electrode.

[0018] In combination with the third aspect, in some possible implementations, partially removing the first auxiliary material layer that does not cover the second electrode of the first pixel includes: preparing a photoresist pattern on the side of the first auxiliary material layer facing away from the substrate; and partially removing the first auxiliary material layer that does not cover the second electrode of the first pixel based on the photoresist pattern.

[0019] In combination with the third aspect, in some possible implementations, before removing the remaining first auxiliary material layer not covering the first pixel and the second electrode, it also includes: removing the photoresist pattern; preferably, while removing the remaining first auxiliary material layer not covering the first pixel and the second electrode, the preparation method also includes: thinning the first auxiliary material layer covering the first pixel and the second electrode.

[0020] In combination with the third aspect, in some possible implementations, preparing the first electrode on the side of the light-emitting unit facing away from the substrate includes: sequentially preparing a common layer and the first electrode on the side of the light-emitting unit facing away from the substrate.

[0021] In combination with the third aspect, in some possible implementations, preparing a first light-emitting material layer and a first auxiliary material layer in sequence on a side of the second electrode of the first pixel facing away from the substrate includes: preparing a first light-emitting material layer, a common material layer and a first auxiliary material layer in sequence on a side of the second electrode facing away from the substrate; preferably, patterning the first light-emitting material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain a first light-emitting unit includes: patterning the first light-emitting material layer and the common material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain a first light-emitting unit and a common layer.

[0022] In combination with the third aspect, in some possible implementations, the multiple second electrodes also include a second pixel second electrode; after the first light-emitting material layer is patterned based on the first auxiliary material layer covering the first pixel second electrode to obtain the first light-emitting unit, it also includes: sequentially preparing a second light-emitting material layer and a second auxiliary material layer on the side of the first auxiliary material layer facing away from the substrate; partially removing the second auxiliary material layer that does not cover the second pixel second electrode; removing the remaining second auxiliary material layer that does not cover the second pixel second electrode; patterning the second light-emitting material layer based on the second auxiliary material layer covering the second pixel second electrode to obtain a second light-emitting unit; while preparing the first pixel first electrode on the side of the first light-emitting unit facing away from the substrate, prepare the second pixel first electrode on the side of the second light-emitting unit facing away from the substrate.

[0023] In combination with the third aspect, in some possible implementations, the preparation method also includes: sequentially preparing a protective material layer and a planarization layer on the side of the first auxiliary material layer covering the first light-emitting unit and the second auxiliary material layer covering the second light-emitting unit away from the substrate, wherein at least part of the orthographic projection of the planarization layer on the substrate is located between the orthographic projections of the adjacent first light-emitting unit and the second light-emitting unit on the substrate; etching away part of the protective material layer on the side of the first light-emitting unit and the second light-emitting unit away from the substrate to obtain a protective layer, and the protective layer and the planarization layer constitute an insulating structure layer.

[0024] A fourth aspect of the present application provides a display device, comprising the above-mentioned display panel, or a display panel obtained according to the above-mentioned preparation method.

[0025] According to the display panel, preparation method thereof and display device provided by the embodiments of the present application, an auxiliary layer is set on the light-emitting unit, the auxiliary layer is etched step by step, and then the auxiliary layer and the light-emitting unit are patterned in sequence, that is, the patterning of the light-emitting unit is achieved through the auxiliary layer, and the light-emitting unit can be protected during the etching process, thereby simplifying the manufacturing process of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0027] Figure 1 A schematic diagram of the cross-sectional structure of a display panel provided in the first embodiment of the present application.

[0028] Figure 2 yes Figure 1 A schematic diagram of a partial cross-sectional structure of a display panel is shown.

[0029] Figure 3 A schematic diagram of the cross-sectional structure of a display panel provided in the second embodiment of the present application.

[0030] Figure 4 A schematic diagram of the cross-sectional structure of a display panel provided in the third embodiment of the present application.

[0031] Figure 5 A schematic diagram of a partial cross-sectional structure of a display panel provided in the fourth embodiment of the present application.

[0032] Figure 6 A flow chart of a method for manufacturing a display panel provided in the first embodiment of the present application.

[0033] Figure 7a-7h A schematic structural diagram of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application.

[0034] Figure 8 A flow chart of a method for preparing a display panel provided in the second embodiment of the present application.

[0035] Figure 9a-9h A schematic structural diagram of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application.

[0036] Fig.10 A schematic diagram of the structure of a display device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0037] As mentioned in the background technology, with the advancement of terminal display technology such as mobile phones, active-matrix organic light-emitting diode (AMOLED) display has gradually become mainstream. People have also put forward requirements for AMOLED mobile phone displays such as flexibility, full screen, and ultra-narrow borders. Therefore, the border requirements for mobile phone display screens are getting smaller and smaller, and the panel size is no longer limited by fine metal mask plates.

[0038] However, in the current method for manufacturing a display panel, the manufacturing process of the display panel is relatively complicated.

[0039] In view of this, according to the display panel, its preparation method and display device provided in the embodiments of the present application, an auxiliary layer is set on the light-emitting unit, the auxiliary layer is etched step by step, and then the auxiliary layer and the light-emitting unit are patterned in sequence, that is, the patterning of the light-emitting unit is achieved through the auxiliary layer, and the light-emitting unit can be protected during the etching process, thereby simplifying the manufacturing process of the display panel.

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0041] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is understood that when a structure is referred to as being "on or under" another structure, the structure may be directly on or under the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. The structures mentioned herein include any of a film layer, an element, a device, a component, and an assembly.

[0042] When a structure is referred to as being “connected” to another structure, the structure may be directly connected to the other structure or indirectly connected to the other structure with one or more intervening structures interposed therebetween.

[0043] Figure 1 This is a schematic cross-sectional structure diagram of a display panel provided in the first embodiment of the present application. Figure 2 yes Figure 1 The partial cross-sectional structure diagram of the display panel is shown in FIG. Figure 1 and Figure 2As shown, the display panel includes a substrate 11, a plurality of light-emitting devices 12 and an auxiliary layer 13, the plurality of light-emitting devices 12 are located on one side of the substrate 11, the light-emitting device 12 includes a light-emitting unit 121 and a first electrode 124, the first electrode 124 is located on the side of the light-emitting unit 121 away from the substrate 11, the auxiliary layer 13 is located between the light-emitting unit 121 and the first electrode 124, the orthographic projection of the auxiliary layer 13 on the substrate 11 is located within the orthographic projection of the light-emitting unit 121 on the substrate 11, the auxiliary layer 13 includes a plurality of auxiliary units 131, and the auxiliary units 131 correspond to the light-emitting units 121 one by one.

[0044] Among them, the substrate 11 can be a substrate substrate. In some embodiments, the substrate substrate can be a glass-based substrate. In some embodiments, the substrate substrate can include an organic resin material such as epoxy resin, triazine, silicone resin or polyimide. For example, the substrate substrate can be an FR4 type printed circuit board (Printed circuit board, PCB), or it can be a flexible PCB that is easy to deform. In some embodiments, the substrate substrate can include a ceramic material such as silicon nitride, aluminum nitride or aluminum oxide, or include a metal or a metal compound. For example, the substrate substrate can be a metal core printed circuit board (Metal Core PCB, MCPCB) or a metal copper clad laminate (Metal Copper Clad Laminate, MCCL).

[0045] Furthermore, in one embodiment, the substrate 11 may have a driving circuit, which is used to drive multiple light-emitting devices 12 to emit light of corresponding colors. For example, the substrate 11 may include a substrate layer, a barrier layer (Barrier), a buffer layer (Buffer), a gate insulating layer (Gate Insulator, GI), a capacitor insulating layer (Capacitance Insulator, CI), a gate, a source and drain, an interlayer dielectric layer (Interlayer Dielectric, ILD), etc.

[0046] The light-emitting device 12 may be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), etc. The light-emitting device 12 may be a light-emitting device of various colors, such as a red light-emitting device R, a green light-emitting device G, a blue light-emitting device B, a white light-emitting device W, etc.

[0047] In one embodiment, the light emitting device 12 further includes a common layer 122, which is located on the side of the light emitting unit 121 away from the substrate 11. The common layer 122 can be at least one of an electron injection layer (Electron Inject Layer, EIL), an electron transport layer (Electron Transport Layer, ETL), and a hole blocking layer (HBL).

[0048] The light emitting device 12 further includes a second electrode 123, which is located on a side of the light emitting unit 121 close to the substrate 11, and the orthographic projection of the second electrode 123 on the substrate 11 at least partially overlaps with the orthographic projection of the light emitting unit 121 on the substrate 11. Exemplarily, the first electrode 124 may be a cathode, and the second electrode 123 may be an anode.

[0049] In one embodiment, the light-emitting device 12 may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron blocking layer (EBL) located between the second electrode 123 and the light-emitting unit 121 .

[0050] In one embodiment, the at least one light emitting device 12 includes a plurality of light emitting devices, and the plurality of light emitting devices include at least one of a red light emitting device, a green light emitting device, a blue light emitting device, and a white light emitting device. In one embodiment, the auxiliary layer 13 is located between the light emitting unit 121 and the common layer 122 .

[0051] Furthermore, the auxiliary layer 13 covers the periphery of the light emitting unit 121 which is away from the substrate 11 .

[0052] In one embodiment, the thickness T of the auxiliary layer 13 is greater than or equal to 500 angstroms and less than or equal to 5000 angstroms. For example, the thickness T of the auxiliary layer 13 can be 500 angstroms, 2500 angstroms, 5000 angstroms, etc., which simplifies the preparation process of the display panel and shortens the preparation time of the display panel.

[0053] Further in one embodiment, the thickness T of the auxiliary layer 13 is greater than or equal to 500 angstroms and less than or equal to 1000 angstroms. For example, the thickness T of the auxiliary layer 13 may be 500 angstroms, 700 angstroms, 1000 angstroms, and the like.

[0054] In one embodiment, the auxiliary layer 13 may be a single layer.

[0055] In one embodiment, the material of the auxiliary layer 13 includes any one of an organic material and an inorganic material.

[0056] In one embodiment, the material of the auxiliary layer 13 includes any one of oxide, nitride, metal, alloy, polyvinyl alcohol, polyvinyl butyral, polyvinyl pyrrolidone, polyethylene glycol, polyglycerol, pullulan, water-soluble cellulose, and alcohol-soluble polyamide resin, so that the auxiliary layer 13 will not cause damage to the light-emitting unit 121 during the etching process.

[0057] In one embodiment, the display panel further includes an insulating structure layer 14 , which is located on a side of the auxiliary layer 13 away from the substrate 11 and between adjacent light emitting devices 12 .

[0058] In one embodiment, the insulating structure layer 14 includes a protective layer 141, and the protective layer 141 is used to protect the side of the light emitting unit 121. Specifically, the protective layer 141 includes a first protective portion 1411 and a second protective portion 1412 connected in sequence, the first protective portion 1411 is located between adjacent light emitting devices 12, and the second protective portion 1412 covers the side wall of the light emitting unit 121 and the side wall of the auxiliary unit 131.

[0059] In one embodiment, the orthographic projection of the protection layer 141 on the substrate 11 covers the orthographic projection of the auxiliary layer 13 on the substrate 11 .

[0060] In one embodiment, the first protection portion 1411 and the second protection portion 1412 enclose a groove 1414 .

[0061] In one embodiment, the material of the protection layer 141 includes any one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide, which can prevent water and oxygen from entering the light-emitting unit 121 and avoid water and oxygen from affecting the performance of the light-emitting unit 121 .

[0062] In one embodiment, the protection layer 141 may further include a third protection portion 1413 , which is connected to a side of the second protection portion 1412 away from the first protection portion 1411 , and is located on a side of the auxiliary layer 13 away from the substrate 11 .

[0063] In one embodiment, the insulating structure layer 14 further includes a planarization layer 142 , which is located on the side of the protective layer 141 away from the substrate 11 , and the orthographic projection of the planarization layer 142 on the substrate 11 at least partially overlaps with the orthographic projection of the protective layer 141 on the substrate 11 .

[0064] In one embodiment, the orthographic projection of the planarization layer 142 on the substrate 11 is located within the orthographic projection range of the protection layer 141 on the substrate 11 .

[0065] In one embodiment, at least a portion of the planarization layer 142 fills the groove 1414 to improve the flatness of the film layer of the display panel.

[0066] Figure 3 FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel provided in the second embodiment of the present application. Figure 3 As shown, in one embodiment, the display panel further includes a first inorganic encapsulation layer 15, and the first inorganic encapsulation layer 15 is located on the side of the light-emitting device 12 away from the substrate 11. The orthographic projection of the first inorganic encapsulation layer 15 on the substrate 11 covers the orthographic projection of the light-emitting device 12 on the substrate 11. Exemplarily, the material of the first inorganic encapsulation layer 15 is silicon oxide, silicon oxynitride or silicon nitride, etc. The first inorganic encapsulation layer 15 can be a single layer, a multi-layer, a composite layer, etc.

[0067] In one embodiment, the display panel further includes an organic encapsulation layer 16, which is located on the side of the first inorganic encapsulation layer 15 away from the substrate 11. The orthographic projection of the first inorganic encapsulation layer 15 on the substrate 11 covers the orthographic projection of the organic encapsulation layer 16 on the substrate 11. Exemplarily, the material of the organic encapsulation layer 16 is a fiber material, a resin material, or a material for a laminated multilayer board, etc. The organic encapsulation layer 16 can be a single layer, a multilayer, a composite layer, etc.

[0068] In one embodiment, the display panel further includes a second inorganic encapsulation layer 17, which is located on the side of the organic encapsulation layer 16 away from the substrate 11, and the orthographic projection of the second inorganic encapsulation layer 17 on the substrate 11 covers the orthographic projection of the organic encapsulation layer 16 on the substrate. Exemplarily, the material of the second inorganic encapsulation layer 17 is silicon oxide, silicon oxynitride or silicon nitride, etc. The second inorganic encapsulation layer 17 can be a single layer, a multi-layer, a composite layer, etc.

[0069] Figure 4 This is a schematic diagram of the cross-sectional structure of a display panel provided in the third embodiment of the present application. Figure 1 and Figure 4 The display panel shown in the figure is different in that, in this embodiment, the common layer 122 is located on the side of the auxiliary layer 13 close to the substrate 11 .

[0070] In one embodiment, the orthographic projection of the auxiliary unit 131 on the substrate 11 covers the orthographic projection of the common layer 122 on the substrate 11 .

[0071] Figure 5 FIG. 4 is a schematic diagram of a partial cross-sectional structure of a display panel provided in the fourth embodiment of the present application. Figure 5 As shown, in one embodiment, the auxiliary unit 131 covers the periphery of the common layer 122 facing away from the substrate 11 .

[0072] In one embodiment, the auxiliary layer 13 is a conductive layer. Specifically, the material of the auxiliary layer 13 is metal.

[0073] In one embodiment, the auxiliary layer 13 is located between the common layer 122 and the second electrode 123 . The auxiliary layer 13 can overlap the second electrode 123 and serve as an auxiliary cathode to reduce the resistance voltage drop of the second electrode 123 .

[0074] Please refer again Figure 1 The embodiment of the present application also provides a display panel. The display panel includes a substrate 11, a plurality of light-emitting devices 12, and an auxiliary layer 13. The plurality of light-emitting devices 12 are located on one side of the substrate 11. The light-emitting devices 12 include a light-emitting unit 121. The plurality of light-emitting devices 12 also include a common layer 122. The common layer 122 is located on the side of the light-emitting unit 121 away from the substrate 11. The auxiliary layer 13 is located between the light-emitting unit 121 and the common layer 122. The auxiliary layer 13 includes a plurality of auxiliary units 131. The auxiliary units 131 correspond to the light-emitting units 121 one by one. The auxiliary units 131 cover the periphery of the side of the light-emitting unit 121 away from the substrate 11.

[0075] The display panel 100 provided according to the embodiment of the present application and the display panel 100 provided in the aforementioned embodiment of the present application belong to the same inventive concept, and have corresponding film layer structures and beneficial effects. Details not fully described in the embodiment of the display panel 100 can be found in the aforementioned embodiment of the display panel 100, and will not be repeated here.

[0076] The embodiment of the present application also provides a method for preparing a display panel. Figure 6 This is a flow chart of a method for preparing a display panel provided in the first embodiment of the present application. The preparation method is used to prepare a display panel provided in any of the above embodiments. Figure 6 As shown, the preparation method comprises:

[0077] Step S610: preparing a plurality of second electrodes on a substrate, wherein the plurality of second electrodes include a first pixel second electrode.

[0078] Step S620 , sequentially preparing a first light-emitting material layer and a first auxiliary material layer on a side of the second electrode of the first pixel facing away from the substrate.

[0079] Step S630 , partially removing the first auxiliary material layer that does not cover the second electrode of the first pixel.

[0080] Step S640, removing the remaining first auxiliary material layer that does not cover the second electrode of the first pixel.

[0081] Step S650: patterning the first light-emitting material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain a first light-emitting unit.

[0082] Step S660: preparing a first pixel first electrode on a side of the first light emitting unit facing away from the substrate.

[0083] Figure 7a-7h This is a schematic diagram of the structure of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application. The preparation method specifically includes:

[0084] According to step S610, refer to Figure 7a , a plurality of second electrodes 123 are prepared on the substrate 11 , and the plurality of second electrodes 123 include a first pixel second electrode 1231 .

[0085] The first pixel second electrode 1231 may be the second electrode of any one of a red pixel, a blue pixel, a green pixel, and a white pixel.

[0086] According to step S620, refer to Figure 7b A first light-emitting material layer 1201 and a first auxiliary material layer 1301 are sequentially prepared on the side of the first pixel second electrode 1231 facing away from the substrate 11 .

[0087] The first light emitting material layer 1201 can be formed by an evaporation process.

[0088] The first light-emitting material layer 1201 may be any one of a red light-emitting material layer, a blue light-emitting material layer, a green light-emitting material layer, and a white light-emitting material layer.

[0089] In one embodiment, sequentially preparing a first light-emitting material layer 1201 and a first auxiliary material layer 1301 on a side of the first pixel second electrode 1231 facing away from the substrate 11 includes: sequentially preparing a first light-emitting material layer 1201, a common material layer and a first auxiliary material layer 1301 on a side of the first pixel second electrode 1231 facing away from the substrate 11.

[0090] According to step S630, first, refer to Figure 7c , a photoresist pattern 18 is prepared on the side of the first auxiliary material layer 1301 facing away from the substrate 11 .

[0091] Second, see Figure 7d , based on the photoresist pattern 18 , the first auxiliary material layer 1301 that does not cover the first pixel second electrode 1231 is partially removed.

[0092] Furthermore, partially removing the first auxiliary material layer 1301 that does not cover the first pixel second electrode 1231 includes: removing 20%-80% of the first auxiliary material layer 1301 that does not cover the first pixel second electrode 1231 in the thickness direction of the substrate 11. For example, removing 20%, 50%, 80%, etc. of the first auxiliary material layer 1301 that does not cover the first pixel second electrode 1231 in the thickness direction of the substrate 11, so that the first auxiliary material layer 1301 protects the first light-emitting material layer 1201 while achieving patterning.

[0093] Preferably, partially removing the first auxiliary material layer 1301 not covering the first pixel second electrode 1231 includes: removing 30%-70% of the first auxiliary material layer 1301 not covering the first pixel second electrode 1231 in the thickness direction of the substrate 11, for example, removing 30%, 50%, 70%, etc. of the first auxiliary material layer 1301 not covering the first pixel second electrode 1231 in the thickness direction of the substrate 11.

[0094] In one embodiment, the first auxiliary material layer 1301 is etched by a dry etching process to remove the first auxiliary material layer 1301 that does not cover the first pixel second electrode 1231 .

[0095] According to step S640, refer to Figure 7e , remove the remaining first auxiliary material layer 1301 that does not cover the first pixel second electrode 1231.

[0096] In one embodiment, before removing the remaining first auxiliary material layer 1301 not covering the first pixel second electrode 1231 , the preparation method further includes: removing the photoresist pattern 18 .

[0097] In one embodiment, the first auxiliary material layer 1301 covering the first pixel second electrode 1231 can protect the first light-emitting material layer 1201 covered by the first auxiliary material layer 1301 from being damaged by a stripping solution.

[0098] In one embodiment, since the first auxiliary material layer 1301 covering the first pixel second electrode 1231 is not protected by the photoresist pattern 18 after the photoresist pattern 18 is removed, while removing the remaining first auxiliary material layer 1301 not covering the first pixel second electrode 1231, the preparation method also includes: thinning the first auxiliary material layer 1301 covering the first pixel second electrode 1231.

[0099] According to step S650, refer to Figure 7f , the first light-emitting material layer 1201 is patterned based on the first auxiliary material layer 1301 covering the first pixel second electrode 1231 to obtain the first light-emitting unit 1211.

[0100] The first light emitting unit 1211 may be any one of a red light emitting unit, a blue light emitting unit, a green light emitting unit, and a white light emitting unit.

[0101] In one embodiment, the first light-emitting material layer 1201 is patterned based on the first auxiliary material layer 1301 covering the second electrode 1231 of the first pixel to obtain the first light-emitting unit 1211, including: the first light-emitting material layer 1201 and the common material layer are patterned based on the first auxiliary material layer 1301 covering the second electrode 1231 of the first pixel to obtain the first light-emitting unit 1211 and the common layer.

[0102] In one embodiment, see Figure 7g , at least partially remove the first auxiliary material layer 1301 covering the first pixel second electrode 1231 to obtain the first auxiliary unit 1311, so as to expose at least part of the first light emitting unit 1211. According to step S660, refer to Figure 7h A first pixel first electrode is prepared on a side of the first light emitting unit 1211 facing away from the substrate 11 , and the first pixel first electrode constitutes a first electrode 124 .

[0103] In one embodiment, preparing the first pixel first electrode on the side of the first light emitting unit 1211 facing away from the substrate 11 includes sequentially preparing a common layer 122 and a first pixel first electrode on the side of the first light emitting unit 1211 facing away from the substrate 11 .

[0104] In one embodiment, the preparation method may further include: forming a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer on a side of the first electrode facing away from the substrate.

[0105] According to the method for preparing a display panel provided in an embodiment of the present application, an auxiliary layer is provided on the light-emitting unit, the auxiliary layer is etched step by step, and then the auxiliary layer and the light-emitting unit are patterned in sequence, that is, the patterning of the light-emitting unit is achieved through the auxiliary layer, and the light-emitting unit can be protected during the etching process, thereby simplifying the manufacturing process of the display panel.

[0106] Figure 8 A flow chart of a method for preparing a display panel provided for the second embodiment of the present application. The plurality of second electrodes 123 also include a second pixel second electrode 1232, wherein the second pixel second electrode 1232 may be a second electrode of any one of a red pixel, a blue pixel, a green pixel, and a white pixel. After patterning the first light-emitting material layer based on the first auxiliary material layer covering the first pixel second electrode to obtain a first light-emitting unit (step S650), the preparation method further includes:

[0107] Step S651 , sequentially preparing a second light-emitting material layer and a second auxiliary material layer on a side of the first auxiliary material layer facing away from the substrate.

[0108] Step S652, partially removing the second auxiliary material layer that does not cover the second electrode of the second pixel.

[0109] Step S653, removing the remaining second auxiliary material layer that does not cover the second electrode of the second pixel.

[0110] Step S654: patterning the second light-emitting material layer based on the second auxiliary material layer covering the second electrode of the second pixel to obtain a second light-emitting unit.

[0111] Step S661 , while preparing a first pixel first electrode on a side of the first light emitting unit away from the substrate, preparing a second pixel first electrode on a side of the second light emitting unit away from the substrate.

[0112] Figure 9a-9h A schematic diagram of the structure of an intermediate product obtained during the execution of the preparation method provided in the second embodiment of the present application. The preparation method specifically comprises:

[0113] According to step S651, refer to Figure 9a A second light-emitting material layer 1202 and a second auxiliary material layer 1302 are sequentially prepared on the side of the first auxiliary material layer 1301 facing away from the substrate 11 .

[0114] The second light emitting material layer 1202 can be formed by an evaporation process.

[0115] The second light-emitting material layer 1202 can be any one of a red light-emitting material layer, a blue light-emitting material layer, a green light-emitting material layer, and a white light-emitting material layer.

[0116] According to step S652, first, refer to Figure 9b , a photoresist pattern 18 is prepared on the side of the second auxiliary material layer 1302 facing away from the substrate 11 .

[0117] Second, see Fig.9c , based on the photoresist pattern 18 , the second auxiliary material layer 1302 that does not cover the second pixel second electrode 1232 is partially removed.

[0118] Furthermore, partially removing the second auxiliary material layer 1302 that does not cover the second pixel second electrode 1232 includes: removing 20%-80% of the second auxiliary material layer 1302 that does not cover the second pixel second electrode 1232 in the thickness direction of the substrate 11. For example, in the thickness direction of the substrate 11, removing 20%, 50%, 80%, etc. of the second auxiliary material layer 1302 that does not cover the second pixel second electrode 1232, so that the second auxiliary material layer 1302 can protect the second light-emitting material layer 1202 while achieving patterning.

[0119] Preferably, partially removing the second auxiliary material layer 1302 not covering the second pixel second electrode 1232 includes: removing 30%-70% of the second auxiliary material layer 1302 not covering the second pixel second electrode 1232 in the thickness direction of the substrate 11, for example, removing 30%, 50%, 70%, etc. of the second auxiliary material layer 1302 not covering the second pixel second electrode 1232 in the thickness direction of the substrate 11.

[0120] In one embodiment, the second auxiliary material layer 1302 is etched by a dry etching process to partially remove the second auxiliary material layer 1302 that does not cover the second pixel second electrode 1232 .

[0121] According to step S653, refer to Figure 9d , remove the remaining second auxiliary material layer 1302 that does not cover the second pixel second electrode 1232.

[0122] In one embodiment, before removing the remaining second auxiliary material layer 1302 that does not cover the second pixel second electrode 1232 , the preparation method further includes: removing the photoresist pattern 18 .

[0123] In one embodiment, the second auxiliary material layer 1302 covering the second pixel second electrode 1232 can protect the second light-emitting material layer 1202 covered by the second auxiliary material layer 1302 from being damaged by the stripping solution.

[0124] In one embodiment, since the second auxiliary material layer 1302 covering the second pixel second electrode 1232 is not protected by the photoresist pattern 18 after the photoresist pattern 18 is removed, while removing the remaining second auxiliary material layer 1302 not covering the second pixel second electrode 1232, the preparation method also includes: thinning the second auxiliary material layer 1302 covering the second pixel second electrode 1232.

[0125] According to step S654, refer to Fig.9e , the second light-emitting material layer 1202 is patterned based on the second auxiliary material layer 1302 covering the second pixel second electrode 1232 to obtain the second light-emitting unit 1212.

[0126] The second light emitting unit 1212 may be any one of a red light emitting unit, a blue light emitting unit, a green light emitting unit, and a white light emitting unit.

[0127] In one embodiment, the preparation method further comprises: first, referring to Figure 9fA protective material layer 1410 and a planarization layer 142 are sequentially prepared on the side of the first auxiliary material layer 1301 covering the first light-emitting unit 1211 and the side of the second auxiliary material layer 1302 covering the second light-emitting unit 1212 facing away from the substrate 11, and at least part of the orthographic projection of the planarization layer 142 on the substrate 11 is located between the orthographic projections of the adjacent first light-emitting unit 1211 and the second light-emitting unit 1212 on the substrate 11.

[0128] Second, see Figure 9g , a portion of the protective material layer 1410 on the side of the first light emitting unit 1211 and the second light emitting unit 1212 facing away from the substrate 11 is etched to obtain a protective layer 141 , and the protective layer 141 and the planarization layer 142 constitute an insulating structure layer 14 .

[0129] According to step S661, refer to Figure 9h While preparing the first pixel first electrode on the side of the first light-emitting unit 1211 facing away from the substrate 11, the second pixel first electrode is prepared on the side of the second light-emitting unit 1212 facing away from the substrate 11. The first pixel first electrode and the second pixel first electrode are an integrated structure to constitute a first electrode 124.

[0130] Fig.10 This is a schematic diagram of the structure of a display device provided in one embodiment of the present application. Fig.10 As shown, the display device is a product with an image display function. For example, the display device can be used to display static images, such as pictures or photos. The display device can also be used to display dynamic images, such as videos.

[0131] The display device can be a laptop computer, a mobile phone, a handheld or portable computer, a camera, a camcorder, a vehicle-mounted intelligent central control screen, a calculator, a smart watch, a GPS navigator, an electronic photo, an electronic billboard or sign, a projector, etc.

[0132] The display device includes the display panel 100 provided in any of the above embodiments or the display panel obtained by the preparation method provided in any of the above embodiments. The display panel 100 may be an organic light emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0133] In addition, the display device may also have functions such as taking photos, recording videos, fingerprint recognition, and face recognition. Accordingly, the display device also includes at least one functional module for realizing the above functions, such as an under-screen camera, an under-screen fingerprint recognition sensor, and the like.

[0134] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0135] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: include: substrate; A plurality of light-emitting devices are located on one side of the substrate, wherein the light-emitting devices include a light-emitting unit and a first electrode, and the first electrode is located on a side of the light-emitting unit away from the substrate; as well as The auxiliary layer is located between the first electrode and the light-emitting unit, and the orthographic projection of the auxiliary layer on the substrate is located within the orthographic projection of the light-emitting unit on the substrate; the auxiliary layer includes a plurality of auxiliary units, and the auxiliary units correspond to the light-emitting units one by one.

2. The display panel according to claim 1, characterized in that: The thickness of the auxiliary layer is greater than or equal to 500 angstroms and less than or equal to 5000 angstroms; Preferably, the thickness of the auxiliary layer is greater than or equal to 500 angstroms and less than or equal to 1000 angstroms; Preferably, the auxiliary layer is a single layer.

3. The display panel according to claim 1, characterized in that: The light emitting device further comprises a common layer, the common layer is located at a side of the light emitting unit away from the substrate, and the auxiliary layer is located between the light emitting unit and the common layer; Preferably, the auxiliary unit covers a periphery of the light emitting unit that is away from the substrate.

4. The display panel according to claim 3, characterized in that: The material of the auxiliary layer includes any one of an organic material and an inorganic material; Preferably, the material of the auxiliary layer includes any one of oxide, nitride, metal, alloy, polyvinyl alcohol, polyvinyl butyral, polyvinyl pyrrolidone, polyethylene glycol, polyglycerol, pullulan, water-soluble cellulose, and alcohol-soluble polyamide resin.

5. The display panel according to claim 1, characterized in that: The light emitting device further comprises a common layer, and the common layer is located on a side of the auxiliary layer close to the substrate; Preferably, the auxiliary unit covers a periphery of a side of the common layer facing away from the substrate.

6. The display panel according to claim 5, characterized in that: The auxiliary layer is a conductive layer; Preferably, the material of the auxiliary layer includes metal.

7. The display panel according to claim 1, characterized in that: It also includes an insulating structure layer, which is located on the side of the auxiliary layer away from the substrate and between adjacent light-emitting devices.

8. The display panel according to claim 7, characterized in that: The insulating structure layer includes a protective layer, the protective layer includes a first protective portion and a second protective portion connected in sequence, the first protective portion is located between adjacent light-emitting devices, and the second protective portion covers the side wall of the light-emitting unit and the side wall of the auxiliary unit; Preferably, the orthographic projection of the protective layer on the substrate at least partially covers the orthographic projection of the auxiliary layer on the substrate; Preferably, the first protection portion and the second protection portion enclose a groove; Preferably, the material of the protective layer includes any one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide; Preferably, the protection layer further includes a third protection portion, the third protection portion is connected to a side of the second protection portion away from the first protection portion, and the third protection portion is located on a side of the auxiliary layer away from the substrate.

9. The display panel according to claim 8, characterized in that: The insulating structure layer further includes a planarization layer, which is located on the side of the protective layer away from the substrate; the orthographic projection of the planarization layer on the substrate and the orthographic projection of the protective layer on the substrate at least partially overlap; Preferably, the orthographic projection of the planarization layer on the substrate is located within the range of the orthographic projection of the protection layer on the substrate.

10. The display panel according to claim 1, characterized in that: The light emitting device further comprises a second electrode, which is located on a side of the light emitting unit close to the substrate, and an orthographic projection of the second electrode on the substrate and an orthographic projection of the light emitting unit on the substrate at least partially overlap; Preferably, it further comprises a first inorganic encapsulation layer, wherein the first inorganic encapsulation layer is located on a side of the light-emitting device away from the substrate, and an orthographic projection of the first inorganic encapsulation layer on the substrate covers an orthographic projection of the light-emitting device on the substrate; Preferably, it further comprises an organic encapsulation layer, which is located on the side of the first inorganic encapsulation layer away from the substrate, and the orthographic projection of the first inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate; Preferably, a second inorganic encapsulation layer is further included, which is located on a side of the organic encapsulation layer away from the substrate, and the orthographic projection of the second inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

11. A display panel, characterized in that: include: substrate; A plurality of light-emitting devices are located on one side of the substrate, the light-emitting devices include light-emitting units, and the plurality of light-emitting devices further include a common layer, and the common layer is located on a side of the plurality of light-emitting units away from the substrate; as well as The auxiliary layer is located between the light-emitting unit and the common layer; the auxiliary layer includes a plurality of auxiliary units, the auxiliary units correspond to the light-emitting units one by one, and the auxiliary units cover the periphery of the light-emitting unit away from the substrate.

12. A method for preparing a display panel, characterized in that: include: Preparing a plurality of second electrodes on a substrate, wherein the plurality of second electrodes include a first pixel second electrode; Sequentially preparing a first light-emitting material layer and a first auxiliary material layer on a side of the second electrode of the first pixel away from the substrate; Partially removing the first auxiliary material layer that does not cover the second electrode of the first pixel; removing the remaining first auxiliary material layer not covering the second electrode of the first pixel; Patterning the first light-emitting material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain a first light-emitting unit; A first pixel first electrode is prepared on a side of the first light emitting unit away from the substrate.

13. The preparation method according to claim 12, characterized in that: The partially removing the first auxiliary material layer not covering the second electrode of the first pixel comprises: removing 20%-80% of the thickness of the first auxiliary material layer not covering the second electrode of the first pixel; Preferably, the partially removing the first auxiliary material layer not covering the first pixel second electrode comprises: 30%-70% of the thickness of the first auxiliary material layer not covering the first pixel second electrode is removed.

14. The preparation method according to claim 12, characterized in that: The partially removing the first auxiliary material layer not covering the second electrode of the first pixel comprises: preparing a photoresist pattern on a side of the first auxiliary material layer facing away from the substrate; The first auxiliary material layer not covering the first pixel second electrode is partially removed based on the photoresist pattern.

15. The preparation method according to claim 14, characterized in that: Before removing the remaining first auxiliary material layer not covering the second electrode of the first pixel, the method further includes: removing the photoresist pattern; Preferably, while removing the remaining first auxiliary material layer not covering the first pixel second electrode, the preparation method further comprises: The first auxiliary material layer covering the second electrode of the first pixel is thinned.

16. The preparation method according to claim 12, characterized in that: The step of preparing a first electrode on a side of the first light-emitting unit facing away from the substrate comprises: A common layer and the first electrode are sequentially prepared on a side of the first light-emitting unit facing away from the substrate.

17. The preparation method according to claim 12, characterized in that: The step of sequentially preparing a first light-emitting material layer and a first auxiliary material layer on a side of the second electrode of the first pixel away from the substrate comprises: Sequentially preparing a first light-emitting material layer, a common material layer and a first auxiliary material layer on a side of the second electrode facing away from the substrate; Preferably, the first light-emitting material layer is patterned based on the first auxiliary material layer covering the second electrode of the first pixel to obtain the first light-emitting unit, which includes: the first light-emitting material layer and the common material layer are patterned based on the first auxiliary material layer covering the second electrode of the first pixel to obtain the first light-emitting unit and the common layer.

18. The preparation method according to claim 12, characterized in that: The plurality of second electrodes further include a second pixel second electrode; After patterning the first light-emitting material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain the first light-emitting unit, the method further includes: sequentially preparing a second light-emitting material layer and a second auxiliary material layer on a side of the first auxiliary material layer away from the substrate; Partially removing the second auxiliary material layer that does not cover the second electrode of the second pixel; removing the remaining second auxiliary material layer not covering the second electrode of the second pixel; Patterning the second light-emitting material layer based on the second auxiliary material layer covering the second electrode of the second pixel to obtain a second light-emitting unit; At the same time as the first pixel first electrode is prepared on the side of the first light emitting unit away from the substrate, the second pixel first electrode is prepared on the side of the second light emitting unit away from the substrate.

19. The preparation method according to claim 18, characterized in that: The preparation method further comprises: A protective material layer and a planarization layer are sequentially prepared on the first auxiliary material layer covering the first light-emitting unit and the second auxiliary material layer covering the second light-emitting unit on the side away from the substrate, wherein at least a portion of the orthographic projection of the planarization layer on the substrate is located between the orthographic projections of the adjacent first light-emitting unit and the second light-emitting unit on the substrate; Parts of the protective material layer on the side of the first light-emitting unit and the second light-emitting unit facing away from the substrate are etched away to obtain a protective layer, and the protective layer and the planarization layer constitute an insulating structure layer.

20. A display device, characterized in that: A display panel comprising any one of claims 1-11, or a display panel obtained by the preparation method according to any one of claims 12-19.

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