Display panel, preparation method thereof and display device

Abstract

This application provides a display panel, its fabrication method, and a display device, solving the problem of complex fabrication processes in existing display panels. The fabrication method includes fabricating a plurality of second electrodes on a substrate, the plurality of second electrodes including a first pixel second electrode; sequentially fabricating a first light-emitting material layer and a first auxiliary material layer on the side of the first pixel second electrode facing away from the substrate; partially removing the first auxiliary material layer not covering the first pixel second electrode; removing the remaining first auxiliary material layer not covering the first pixel second electrode; patterning the first light-emitting material layer based on the first auxiliary material layer covering the first pixel second electrode to obtain a first light-emitting unit; and fabricating a first pixel first electrode on the side of the first light-emitting unit facing away from the substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, its manufacturing method, and a display device. Background Technology

[0002] With the advancement of display technologies in mobile phones and other terminals, Active-matrix Organic Light-Emitting Diode (AMOLED) displays have gradually become mainstream. People have also raised demands for AMOLED mobile phone displays such as flexibility, full-screen design, and ultra-narrow bezels. Therefore, the bezels of mobile phone display screens are becoming increasingly smaller, and panel size is no longer limited by the precision metal mask.

[0003] However, the current manufacturing process for display panels is quite complex. Summary of the Invention

[0004] In view of this, the present application provides a display panel, a method for manufacturing the same, and a display device, which solves the problem that the manufacturing process of the display panel in the prior art is relatively complex.

[0005] The first aspect of this application provides a display panel, including a substrate, a plurality of light-emitting devices, and an auxiliary layer. The plurality of light-emitting devices are located on one side of the substrate, and each light-emitting device includes a light-emitting unit and a first electrode. The first electrode is located on the side of the light-emitting unit away from the substrate. The auxiliary layer is located between the light-emitting unit and the first electrode, and the orthographic projection of the auxiliary layer on the substrate is located within the orthographic projection of the light-emitting unit on the substrate. The auxiliary layer includes a plurality of auxiliary units, and the auxiliary units correspond one-to-one with the light-emitting units.

[0006] In conjunction with the first aspect, in some possible implementations, the thickness of the auxiliary layer is greater than or equal to 500 angstroms and less than or equal to 5000 angstroms; preferably, the thickness of the auxiliary layer is greater than or equal to 500 angstroms and less than or equal to 1000 angstroms; preferably, the auxiliary layer is a single layer.

[0007] In conjunction with the first aspect, in some possible implementations, the light-emitting device further includes a common layer located on the side of the light-emitting unit away from the substrate, and an auxiliary layer located between the light-emitting unit and the common layer; preferably, the auxiliary unit covers the periphery of the side of the light-emitting unit away from the substrate.

[0008] In conjunction with the first aspect, in some possible implementations, the material of the auxiliary layer includes any one of organic and inorganic materials; preferably, the material of the auxiliary layer includes any one of oxides, nitrides, metals, alloys, polyvinyl alcohol, polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerol, amylopectin, water-soluble cellulose, and alcohol-soluble polyamide resin.

[0009] In conjunction with the first aspect, in some possible implementations, the light-emitting device further includes a common layer located on the side of the auxiliary layer closer to the substrate; preferably, the auxiliary unit covers the periphery of the common layer on the side away from the substrate.

[0010] In conjunction with the first aspect, in some possible implementations, the auxiliary layer is a conductive layer; the material of the auxiliary layer includes metal.

[0011] In conjunction with the first aspect, some possible implementations also include an insulating structure layer located on the side of the auxiliary layer away from the substrate and between adjacent light-emitting devices.

[0012] In conjunction with the first aspect, in some possible implementations, the insulating structure layer includes a protective layer, which includes a first protective portion and a second protective portion connected in sequence. The first protective portion is located between adjacent light-emitting devices, and the second protective portion covers the sidewall of the light-emitting unit and the sidewall of the auxiliary unit. Preferably, the orthographic projection of the protective layer on the substrate covers the orthographic projection of the auxiliary layer on the substrate. Preferably, the first and second protective portions enclose a groove. Preferably, the material of the protective layer includes any one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide. Preferably, the protective layer further includes a third protective portion, which is connected to the side of the second protective portion away from the first protective portion, and the third protective portion is located on the side of the auxiliary layer opposite to the substrate.

[0013] In conjunction with the first aspect, in some possible implementations, the insulating structure layer further includes a planarization layer located on the side of the protective layer away from the substrate; the orthographic projection of the planarization layer on the substrate and the orthographic projection of the protective layer on the substrate at least partially overlap; preferably, the orthographic projection of the planarization layer on the substrate is located within the range of the orthographic projection of the protective layer on the substrate.

[0014] In conjunction with the first aspect, in some possible implementations, the light-emitting device further includes a second electrode located on the side of the light-emitting unit closer to the substrate, wherein the orthographic projection of the second electrode on the substrate and the orthographic projection of the light-emitting unit on the substrate at least partially overlap; preferably, it further includes a first inorganic encapsulation layer located on the side of the light-emitting device away from the substrate, wherein the orthographic projection of the first inorganic encapsulation layer on the substrate covers the orthographic projection of the light-emitting device on the substrate; preferably, it further includes an organic encapsulation layer located on the side of the first inorganic encapsulation layer away from the substrate, wherein the orthographic projection of the first inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate; preferably, it further includes a second inorganic encapsulation layer located on the side of the organic encapsulation layer away from the substrate, wherein the orthographic projection of the second inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

[0015] A second aspect of this application provides a display panel, including a substrate, a plurality of light-emitting devices, and an auxiliary layer. The plurality of light-emitting devices are located on one side of the substrate, and each light-emitting device includes a light-emitting unit. The plurality of light-emitting devices also include a common layer, which is located on the side of the plurality of light-emitting units away from the substrate. An auxiliary layer is located between the light-emitting units and the common layer. The auxiliary layer includes a plurality of auxiliary units, which correspond one-to-one with the light-emitting units. The auxiliary units cover the periphery of the side of the light-emitting units away from the substrate.

[0016] A third aspect of this application provides a method for fabricating a display panel, comprising: fabricating a plurality of second electrodes on a substrate, the plurality of second electrodes including a first pixel second electrode; sequentially fabricating a first light-emitting material layer and a first auxiliary material layer on the side of the first pixel second electrode away from the substrate; partially removing the first auxiliary material layer that does not cover the first pixel second electrode; removing the remaining first auxiliary material layer that does not cover the first pixel second electrode; patterning the first light-emitting material layer based on the first auxiliary material layer covering the first pixel second electrode to obtain a first light-emitting unit; and fabricating a first pixel first electrode on the side of the first light-emitting unit away from the substrate.

[0017] In conjunction with the third aspect, in some possible implementations, partially removing the first auxiliary material layer that does not cover the second electrode of the first pixel includes removing 20%-80% of the thickness of the first auxiliary material layer that does not cover the second electrode of the first pixel; preferably, partially removing the first auxiliary material layer that does not cover the second electrode of the first pixel includes removing 30%-70% of the thickness of the first auxiliary material layer that does not cover the second electrode of the first pixel.

[0018] In conjunction with the third aspect, in some possible implementations, partially removing the first auxiliary material layer that does not cover the second electrode of the first pixel includes: preparing a photoresist pattern on the side of the first auxiliary material layer away from the substrate; and partially removing the first auxiliary material layer that does not cover the second electrode of the first pixel based on the photoresist pattern.

[0019] In conjunction with the third aspect, in some possible implementations, before removing the remaining first auxiliary material layer that does not cover the second electrode of the first pixel, the method further includes: removing the photoresist pattern; preferably, while removing the remaining first auxiliary material layer that does not cover the second electrode of the first pixel, the fabrication method further includes: thinning the first auxiliary material layer covering the second electrode of the first pixel.

[0020] In conjunction with the third aspect, in some possible implementations, fabricating the first electrode on the side of the light-emitting unit away from the substrate includes: sequentially fabricating a common layer and the first electrode on the side of the light-emitting unit away from the substrate.

[0021] In conjunction with the third aspect, in some possible implementations, sequentially fabricating a first light-emitting material layer and a first auxiliary material layer on the side of the second electrode of the first pixel away from the substrate includes: sequentially fabricating a first light-emitting material layer, a common material layer, and a first auxiliary material layer on the side of the second electrode away from the substrate; preferably, patterning the first light-emitting material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain a first light-emitting unit includes: patterning the first light-emitting material layer and the common material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain a first light-emitting unit and a common layer.

[0022] In conjunction with the third aspect, in some possible implementations, the plurality of second electrodes further include a second pixel second electrode; after patterning the first light-emitting material layer based on the first auxiliary material layer covering the first pixel second electrode to obtain the first light-emitting unit, the method further includes: sequentially fabricating a second light-emitting material layer and a second auxiliary material layer on the side of the first auxiliary material layer away from the substrate; partially removing the second auxiliary material layer that does not cover the second pixel second electrode; removing the remaining second auxiliary material layer that does not cover the second pixel second electrode; patterning the second light-emitting material layer based on the second auxiliary material layer covering the second pixel second electrode to obtain the second light-emitting unit; while fabricating the first pixel first electrode on the side of the first light-emitting unit away from the substrate, fabricating the second pixel first electrode on the side of the second light-emitting unit away from the substrate.

[0023] In conjunction with the third aspect, in some possible implementations, the fabrication method further includes: sequentially fabricating a protective material layer and a planarization layer on the side of the first auxiliary material layer covering the first light-emitting unit and the second auxiliary material layer covering the second light-emitting unit away from the substrate, wherein at least a portion of the orthographic projection of the planarization layer on the substrate is located between the orthographic projections of the adjacent first light-emitting unit and the second light-emitting unit on the substrate; etching away a portion of the protective material layer on the side of the first light-emitting unit and the second light-emitting unit away from the substrate to obtain a protective layer, wherein the protective layer and the planarization layer constitute an insulating structure layer.

[0024] A fourth aspect of this application provides a display device, including the display panel described above, or a display panel obtained according to the preparation method described above.

[0025] According to the display panel and its preparation method and display device provided in the embodiments of this application, an auxiliary layer is provided on the light-emitting unit. The auxiliary layer is etched in steps, and then the auxiliary layer and the light-emitting unit are patterned in sequence. That is, the patterning of the light-emitting unit is realized through the auxiliary layer, and the light-emitting unit can be protected during the etching process, which simplifies the manufacturing process of the display panel. Attached Figure Description

[0026] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0027] Figure 1 This is a cross-sectional structural diagram of the display panel provided in the first embodiment of this application.

[0028] Figure 2 yes Figure 1 The diagram shows a partial cross-sectional structure of the display panel.

[0029] Figure 3 This is a cross-sectional structural diagram of the display panel provided in the second embodiment of this application.

[0030] Figure 4 This is a cross-sectional structural diagram of the display panel provided in the third embodiment of this application.

[0031] Figure 5 This is a partial cross-sectional structural diagram of the display panel provided in the fourth embodiment of this application.

[0032] Figure 6 This is a flowchart illustrating the method for fabricating a display panel according to the first embodiment of this application.

[0033] Figures 7a-7h This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application.

[0034] Figure 8 This is a flowchart illustrating the method for fabricating a display panel according to the second embodiment of this application.

[0035] Figures 9a-9h This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application.

[0036] Figure 10 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0037] As mentioned in the background section, with the advancement of display technologies in mobile phones and other terminals, Active-matrix organic light-emitting diode (AMOLED) displays have gradually become mainstream. People have also raised demands for AMOLED mobile phone displays such as flexibility, full-screen design, and ultra-narrow bezels. Therefore, the bezels of mobile phone display screens are becoming increasingly smaller, and the panel size is no longer limited by the precision metal mask.

[0038] However, the current methods for manufacturing display panels involve relatively complex processes.

[0039] In view of this, the display panel and its manufacturing method and display device provided in the embodiments of this application provide an auxiliary layer on the light-emitting unit. The auxiliary layer is etched in steps, and then the auxiliary layer and the light-emitting unit are patterned in sequence. That is, the patterning of the light-emitting unit is realized through the auxiliary layer, and the light-emitting unit can be protected during the etching process, which simplifies the manufacturing process of the display panel.

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0042] When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.

[0043] Figure 1 This is a schematic cross-sectional view of the display panel provided in the first embodiment of this application. Figure 2 yes Figure 1 The diagram shows a partial cross-sectional structure of the display panel. Figure 1 and Figure 2As shown, the display panel includes a substrate 11, multiple light-emitting devices 12, and an auxiliary layer 13. The multiple light-emitting devices 12 are located on one side of the substrate 11. Each light-emitting device 12 includes a light-emitting unit 121 and a first electrode 124. The first electrode 124 is located on the side of the light-emitting unit 121 away from the substrate 11. The auxiliary layer 13 is located between the light-emitting unit 121 and the first electrode 124. The orthographic projection of the auxiliary layer 13 on the substrate 11 is located within the orthographic projection of the light-emitting unit 121 on the substrate 11. The auxiliary layer 13 includes multiple auxiliary units 131, and each auxiliary unit 131 corresponds to a light-emitting unit 121.

[0044] The substrate 11 may be a substrate substrate. In some embodiments, the substrate substrate may be a glass substrate. In some embodiments, the substrate substrate may include organic resin materials such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board (PCB), or a flexible PCB that is easily deformable. In some embodiments, the substrate substrate may include ceramic materials such as silicon nitride, aluminum nitride, or aluminum oxide, or include metals or metal compounds. For example, the substrate substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL).

[0045] Furthermore, in one embodiment, the substrate 11 may have a driving circuit for driving multiple light-emitting devices 12 to emit light of corresponding colors. For example, the substrate 11 may include a substrate layer, a barrier layer, a buffer layer, a gate insulator (GI), a capacitance insulator (CI), a gate, a source and drain, an interlayer dielectric (ILD), etc.

[0046] The light-emitting device 12 can be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), or the like. The light-emitting device 12 can be a light-emitting device of various colors, such as a red light-emitting device R, a green light-emitting device G, a blue light-emitting device B, a white light-emitting device W, etc.

[0047] In one embodiment, the light-emitting device 12 further includes a common layer 122, which is located on the side of the light-emitting unit 121 facing away from the substrate 11. The common layer 122 may be at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole-blocking layer (HBL).

[0048] The light-emitting device 12 also includes a second electrode 123, which is located on the side of the light-emitting unit 121 near the substrate 11. The orthographic projection of the second electrode 123 on the substrate 11 and the orthographic projection of the light-emitting unit 121 on the substrate 11 at least partially overlap. For example, the first electrode 124 may be a cathode, and the second electrode 123 may be an anode.

[0049] In one embodiment, the light-emitting device 12 may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron-blocking layer (EBL) located between the second electrode 123 and the light-emitting unit 121.

[0050] In one embodiment, at least one light-emitting device 12 includes multiple light-emitting devices, and the multiple light-emitting devices include at least one of red light-emitting devices, green light-emitting devices, blue light-emitting devices, and white light-emitting devices. In one embodiment, an auxiliary layer 13 is located between the light-emitting unit 121 and the common layer 122.

[0051] Furthermore, the auxiliary layer 13 covers the periphery of the light-emitting unit 121 on the side opposite to the substrate 11.

[0052] In one embodiment, the thickness T of the auxiliary layer 13 is greater than or equal to 500 angstroms and less than or equal to 5000 angstroms. For example, the thickness T of the auxiliary layer 13 can be 500 angstroms, 2500 angstroms, 5000 angstroms, etc., which simplifies the manufacturing process of the display panel and shortens the manufacturing time of the display panel.

[0053] In one further embodiment, the thickness T of the auxiliary layer 13 is greater than or equal to 500 angstroms and less than or equal to 1000 angstroms. For example, the thickness T of the auxiliary layer 13 can be 500 angstroms, 700 angstroms, 1000 angstroms, etc.

[0054] In one embodiment, the auxiliary layer 13 can be a single layer.

[0055] In one embodiment, the material of the auxiliary layer 13 includes either organic or inorganic materials.

[0056] In one embodiment, the material of the auxiliary layer 13 includes any one of oxides, nitrides, metals, alloys, polyvinyl alcohol, polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerol, amylopectin, water-soluble cellulose, and alcohol-soluble polyamide resin, so that the auxiliary layer 13 will not damage the light-emitting unit 121 during the etching process.

[0057] In one embodiment, the display panel further includes an insulating structure layer 14, which is located on the side of the auxiliary layer 13 away from the substrate 11 and between adjacent light-emitting devices 12.

[0058] In one embodiment, the insulating structure layer 14 includes a protective layer 141 for protecting the sidewalls of the light-emitting unit 121. Specifically, the protective layer 141 includes a first protective portion 1411 and a second protective portion 1412 connected in sequence. The first protective portion 1411 is located between adjacent light-emitting devices 12, and the second protective portion 1412 covers the sidewalls of the light-emitting unit 121 and the auxiliary unit 131.

[0059] In one embodiment, the orthographic projection of the protective layer 141 on the substrate 11 covers the orthographic projection of the auxiliary layer 13 on the substrate 11.

[0060] In one embodiment, the first protective part 1411 and the second protective part 1412 enclose a groove 1414.

[0061] In one embodiment, the material of the protective layer 141 includes any one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide, which can prevent water and oxygen from entering the light-emitting unit 121 and avoid water and oxygen from affecting the performance of the light-emitting unit 121.

[0062] In one embodiment, the protective layer 141 may further include a third protective portion 1413, which is connected to the side of the second protective portion 1412 away from the first protective portion 1411 and is located on the side of the auxiliary layer 13 away from the substrate 11.

[0063] In one embodiment, the insulating structure layer 14 further includes a planarization layer 142, which is located on the side of the protective layer 141 away from the substrate 11, and the orthographic projection of the planarization layer 142 on the substrate 11 and the orthographic projection of the protective layer 141 on the substrate 11 at least partially overlap.

[0064] In one embodiment, the orthographic projection of the planarization layer 142 onto the substrate 11 is within the orthographic projection range of the protective layer 141 onto the substrate 11.

[0065] In one embodiment, at least a partial planarization layer 142 fills the groove 1414 to improve the flatness of the film layer of the display panel.

[0066] Figure 3 This is a schematic cross-sectional view of the display panel provided in the second embodiment of this application. Figure 3 As shown, in one embodiment, the display panel further includes a first inorganic encapsulation layer 15, which is located on the side of the light-emitting device 12 facing away from the substrate 11. The orthographic projection of the first inorganic encapsulation layer 15 onto the substrate 11 covers the orthographic projection of the light-emitting device 12 onto the substrate 11. Exemplarily, the material of the first inorganic encapsulation layer 15 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The first inorganic encapsulation layer 15 can be a single layer, multiple layers, composite layers, etc.

[0067] In one embodiment, the display panel further includes an organic encapsulation layer 16 located on the side of the first inorganic encapsulation layer 15 facing away from the substrate 11. The orthographic projection of the first inorganic encapsulation layer 15 onto the substrate 11 overlaps the orthographic projection of the organic encapsulation layer 16 onto the substrate 11. Exemplarily, the material of the organic encapsulation layer 16 is a fiber material, a resin material, or a multilayer board material, etc. The organic encapsulation layer 16 can be a single layer, a multilayer, a composite layer, etc.

[0068] In one embodiment, the display panel further includes a second inorganic encapsulation layer 17 located on the side of the organic encapsulation layer 16 facing away from the substrate 11, wherein the orthographic projection of the second inorganic encapsulation layer 17 on the substrate 11 covers the orthographic projection of the organic encapsulation layer 16 on the substrate. Exemplarily, the material of the second inorganic encapsulation layer 17 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The second inorganic encapsulation layer 17 can be a single layer, multiple layers, composite layers, etc.

[0069] Figure 4 This is a cross-sectional structural diagram of the display panel provided in the third embodiment of this application. (Comparison) Figure 1 and Figure 4 The difference in the display panel shown is that, in this embodiment, the common layer 122 is located on the side of the auxiliary layer 13 closer to the substrate 11.

[0070] In one embodiment, the orthographic projection of the auxiliary unit 131 on the substrate 11 covers the orthographic projection of the common layer 122 on the substrate 11.

[0071] Figure 5 This is a partial cross-sectional structural diagram of the display panel provided in the fourth embodiment of this application. Figure 5 As shown, in one embodiment, the auxiliary unit 131 covers the periphery of the common layer 122 on the side opposite to the substrate 11.

[0072] In one embodiment, the auxiliary layer 13 is a conductive layer. Specifically, the material of the auxiliary layer 13 is a metal.

[0073] In one embodiment, the auxiliary layer 13 is located between the common layer 122 and the second electrode 123. The auxiliary layer 13 can overlap with the second electrode 123 to reduce the resistance voltage drop of the second electrode 123 as an auxiliary cathode.

[0074] Please refer to it again. Figure 1 This application also provides a display panel. The display panel includes a substrate 11, a plurality of light-emitting devices 12, and an auxiliary layer 13. The plurality of light-emitting devices 12 are located on one side of the substrate 11. Each light-emitting device 12 includes a light-emitting unit 121. The plurality of light-emitting devices 12 also include a common layer 122, which is located on the side of the light-emitting unit 121 away from the substrate 11. The auxiliary layer 13 is located between the light-emitting unit 121 and the common layer 122. The auxiliary layer 13 includes a plurality of auxiliary units 131, which correspond one-to-one with the light-emitting unit 121. The auxiliary units 131 cover the periphery of the side of the light-emitting unit 121 away from the substrate 11.

[0075] The display panel 100 provided in the embodiments of this application belongs to the same inventive concept as the display panel 100 provided in the foregoing embodiments of this application, and has corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of this display panel 100 can be found in the embodiments section of the foregoing display panel 100, and will not be repeated here.

[0076] This application also provides a method for manufacturing a display panel. Figure 6 This is a flowchart illustrating a method for fabricating a display panel according to a first embodiment of this application. This fabrication method is used to fabricate the display panel provided in any of the above embodiments. Figure 6 As shown, the preparation method includes:

[0077] Step S610: A plurality of second electrodes are fabricated on the substrate, the plurality of second electrodes including the first pixel second electrode.

[0078] In step S620, a first light-emitting material layer and a first auxiliary material layer are sequentially prepared on the side of the second electrode of the first pixel away from the substrate.

[0079] Step S630: Partially remove the first auxiliary material layer that does not cover the second electrode of the first pixel.

[0080] Step S640: Remove the remaining first auxiliary material layer that does not cover the second electrode of the first pixel.

[0081] Step S650: Pattern the first light-emitting material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain the first light-emitting unit.

[0082] Step S660: Prepare the first electrode of the first pixel on the side of the first light-emitting unit away from the substrate.

[0083] Figures 7a-7h This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application. The preparation method specifically includes:

[0084] According to step S610, refer to Figure 7a A plurality of second electrodes 123 are fabricated on the substrate 11, including a first pixel second electrode 1231.

[0085] The second electrode 1231 of the first pixel can be the second electrode of any of the following pixels: red pixel, blue pixel, green pixel, and white pixel.

[0086] According to step S620, refer to Figure 7b A first light-emitting material layer 1201 and a first auxiliary material layer 1301 are sequentially prepared on the side of the second electrode 1231 of the first pixel away from the substrate 11.

[0087] The first luminescent material layer 1201 can be formed by vapor deposition.

[0088] The first luminescent material layer 1201 can be any one of a red luminescent material layer, a blue luminescent material layer, a green luminescent material layer, or a white luminescent material layer.

[0089] In one embodiment, the sequential fabrication of a first light-emitting material layer 1201 and a first auxiliary material layer 1301 on the side of the first pixel second electrode 1231 away from the substrate 11 includes: sequentially fabricating a first light-emitting material layer 1201, a common material layer, and a first auxiliary material layer 1301 on the side of the first pixel second electrode 1231 away from the substrate 11.

[0090] According to step S630, firstly, refer to Figure 7c A photoresist pattern 18 is prepared on the side of the first auxiliary material layer 1301 away from the substrate 11.

[0091] Secondly, see Figure 7d The first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel is removed based on the photoresist pattern 18.

[0092] Furthermore, partially removing the first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel includes: removing 20%-80% of the first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel in the thickness direction of the substrate 11, for example, removing 20%, 50%, 80% of the first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel in the thickness direction of the substrate 11, so that the first auxiliary material layer 1301 protects the first light-emitting material layer 1201 while realizing patterning.

[0093] Preferably, partially removing the first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel includes removing 30%-70% of the first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel in the thickness direction of the substrate 11, for example, removing 30%, 50%, 70% of the first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel in the thickness direction of the substrate 11.

[0094] In one embodiment, a dry etching process is used to etch the first auxiliary material layer 1301 to remove the first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel.

[0095] According to step S640, see Figure 7e Remove the remaining first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel.

[0096] In one embodiment, before removing the remaining first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel, the preparation method further includes removing the photoresist pattern 18.

[0097] In one embodiment, the first auxiliary material layer 1301 covering the second electrode 1231 of the first pixel can protect the first light-emitting material layer 1201 covered by the first auxiliary material layer 1301 from damage by the stripping solution.

[0098] In one embodiment, since the first auxiliary material layer 1301 covering the second electrode 1231 of the first pixel is not protected by the photoresist pattern 18 after the photoresist pattern 18 is removed, the preparation method further includes: thinning the first auxiliary material layer 1301 covering the second electrode 1231 of the first pixel while removing the remaining first auxiliary material layer 1301 that does not cover the second electrode 1231 of the first pixel.

[0099] According to step S650, see [link / reference] Figure 7f The first light-emitting material layer 1201 is patterned based on the first auxiliary material layer 1301 covering the second electrode 1231 of the first pixel to obtain the first light-emitting unit 1211.

[0100] The first light-emitting unit 1211 can be any one of a red light-emitting unit, a blue light-emitting unit, a green light-emitting unit, or a white light-emitting unit.

[0101] In one embodiment, patterning the first light-emitting material layer 1201 based on the first auxiliary material layer 1301 covering the second electrode 1231 of the first pixel to obtain the first light-emitting unit 1211 includes: patterning the first light-emitting material layer 1201 and the common material layer based on the first auxiliary material layer 1301 covering the second electrode 1231 of the first pixel to obtain the first light-emitting unit 1211 and the common layer.

[0102] In one embodiment, see Figure 7g At least partially, the first auxiliary material layer 1301 covering the second electrode 1231 of the first pixel is removed to obtain the first auxiliary unit 1311, thereby exposing at least a portion of the first light-emitting unit 1211. According to step S660, see [reference needed]. Figure 7h A first electrode of a first pixel is prepared on the side of the first light-emitting unit 1211 away from the substrate 11, and the first electrode of the first pixel constitutes the first electrode 124.

[0103] In one embodiment, the preparation of the first pixel first electrode on the side of the first light-emitting unit 1211 away from the substrate 11 includes the sequential preparation of a common layer 122 and the first pixel first electrode on the side of the first light-emitting unit 1211 away from the substrate 11.

[0104] In one embodiment, the preparation method may further include the step of preparing a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer on the side of the first electrode away from the substrate.

[0105] According to the display panel fabrication method provided in the embodiments of this application, an auxiliary layer is provided on the light-emitting unit. The auxiliary layer is etched in steps, and then the auxiliary layer and the light-emitting unit are patterned in sequence. That is, the patterning of the light-emitting unit is realized through the auxiliary layer, and the light-emitting unit can be protected during the etching process, which simplifies the manufacturing process of the display panel.

[0106] Figure 8 This is a flowchart illustrating a method for fabricating a display panel according to a second embodiment of this application. The plurality of second electrodes 123 further include a second pixel second electrode 1232, wherein the second pixel second electrode 1232 can be the second electrode of any one of a red pixel, blue pixel, green pixel, or white pixel. After patterning the first light-emitting material layer based on the first auxiliary material layer covering the first pixel second electrode to obtain the first light-emitting unit (step S650), the fabrication method further includes:

[0107] Step S651: Sequentially prepare a second light-emitting material layer and a second auxiliary material layer on the side of the first auxiliary material layer away from the substrate.

[0108] Step S652: Partially remove the second auxiliary material layer that does not cover the second electrode of the second pixel.

[0109] Step S653: Remove the remaining second auxiliary material layer that does not cover the second electrode of the second pixel.

[0110] Step S654: Pattern the second light-emitting material layer based on the second auxiliary material layer covering the second electrode of the second pixel to obtain the second light-emitting unit.

[0111] In step S661, while preparing the first electrode of the first pixel on the side of the first light-emitting unit away from the substrate, a first electrode of the second pixel is prepared on the side of the second light-emitting unit away from the substrate.

[0112] Figures 9a-9h This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the second embodiment of this application. The preparation method specifically includes:

[0113] According to step S651, see Figure 9a A second light-emitting material layer 1202 and a second auxiliary material layer 1302 are sequentially prepared on the side of the first auxiliary material layer 1301 away from the substrate 11.

[0114] The second luminescent material layer 1202 can be formed by vapor deposition.

[0115] The second luminescent material layer 1202 can be any one of a red luminescent material layer, a blue luminescent material layer, a green luminescent material layer, or a white luminescent material layer.

[0116] According to step S652, firstly, refer to Figure 9b A photoresist pattern 18 is prepared on the side of the second auxiliary material layer 1302 away from the substrate 11.

[0117] Secondly, see Figure 9c The second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel is removed based on the photoresist pattern 18.

[0118] Furthermore, partially removing the second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel includes removing 20%-80% of the second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel in the thickness direction of the substrate 11. For example, removing 20%, 50%, or 80% of the second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel in the thickness direction of the substrate 11, so that the second auxiliary material layer 1302 protects the second light-emitting material layer 1202 while realizing patterning.

[0119] Preferably, partially removing the second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel includes removing 30%-70% of the second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel in the thickness direction of the substrate 11, for example, removing 30%, 50%, 70% of the second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel in the thickness direction of the substrate 11.

[0120] In one embodiment, a dry etching process is used to etch the second auxiliary material layer 1302 to partially remove the second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel.

[0121] According to step S653, see [link / reference] Figure 9d Remove the remaining second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel.

[0122] In one embodiment, before removing the remaining second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel, the preparation method further includes removing the photoresist pattern 18.

[0123] In one embodiment, the second auxiliary material layer 1302 covering the second electrode 1232 of the second pixel can protect the second light-emitting material layer 1202 covered by the second auxiliary material layer 1302 from damage by the stripping solution.

[0124] In one embodiment, since the second auxiliary material layer 1302 covering the second electrode 1232 of the second pixel is not protected by the photoresist pattern 18 after the photoresist pattern 18 is removed, the preparation method further includes: thinning the second auxiliary material layer 1302 covering the second electrode 1232 of the second pixel while removing the remaining second auxiliary material layer 1302 that does not cover the second electrode 1232 of the second pixel.

[0125] According to step S654, see [link / reference] Figure 9e The second light-emitting material layer 1202 is patterned based on the second auxiliary material layer 1302 covering the second electrode 1232 of the second pixel to obtain the second light-emitting unit 1212.

[0126] The second light-emitting unit 1212 can be any one of a red light-emitting unit, a blue light-emitting unit, a green light-emitting unit, or a white light-emitting unit.

[0127] In one embodiment, the preparation method further includes: first, referring to... Figure 9fA protective material layer 1410 and a planarization layer 142 are sequentially prepared on the side of the first auxiliary material layer 1301 covering the first light-emitting unit 1211 and the second auxiliary material layer 1302 covering the second light-emitting unit 1212 away from the substrate 11. At least a portion of the orthographic projection of the planarization layer 142 on the substrate 11 is located between the orthographic projections of the adjacent first light-emitting unit 1211 and the second light-emitting unit 1212 on the substrate 11.

[0128] Secondly, see Figure 9g The protective material layer 1410 on the side of the first light-emitting unit 1211 and the second light-emitting unit 1212 away from the substrate 11 is etched away to obtain a protective layer 141. The protective layer 141 and the planarization layer 142 constitute an insulating structure layer 14.

[0129] According to step S661, see Figure 9h While the first electrode of the first pixel is prepared on the side of the first light-emitting unit 1211 away from the substrate 11, the first electrode of the second pixel is prepared on the side of the second light-emitting unit 1212 away from the substrate 11. The first electrode of the first pixel and the first electrode of the second pixel are integral structures, forming the first electrode 124.

[0130] Figure 10 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 10 As shown, the display device is a product with image display capabilities. For example, the display device can be used to display static images, such as pictures or photographs. The display device can also be used to display dynamic images, such as videos.

[0131] Display devices can be laptops, mobile phones, handheld or portable computers, cameras, camcorders, in-vehicle smart central control screens, calculators, smartwatches, GPS navigators, electronic photographs, electronic billboards or signs, projectors, etc.

[0132] The display device includes the display panel 100 provided in any of the above embodiments or the display panel obtained by the manufacturing method provided in any of the above embodiments. The display panel 100 may be an organic light-emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0133] In addition, the display device can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0134] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0135] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A method for manufacturing a display panel, characterized in that, include: Multiple second electrodes are fabricated on a substrate, and the multiple second electrodes include a first pixel second electrode; A first light-emitting material layer and a first auxiliary material layer are sequentially prepared on the side of the second electrode of the first pixel away from the substrate; A photoresist pattern is prepared on the side of the first auxiliary material layer opposite to the substrate; The first auxiliary material layer that does not cover the second electrode of the first pixel is removed based on the photoresist pattern. Remove the photoresist pattern; Remove the remaining portion of the first auxiliary material layer that does not cover the second electrode of the first pixel, and thin the first auxiliary material layer that covers the second electrode of the first pixel; The first light-emitting material layer is patterned based on the first auxiliary material layer covering the second electrode of the first pixel to obtain the first light-emitting unit; A first electrode for a first pixel is prepared on the side of the first light-emitting unit away from the substrate.

2. The preparation method according to claim 1, characterized in that, The removal of the first auxiliary material layer that does not cover the second electrode of the first pixel based on the photoresist pattern includes: The thickness of the first auxiliary material layer that does not cover the second electrode of the first pixel is removed based on the photoresist pattern portion, which is 20%-80% of its original thickness.

3. The preparation method according to claim 2, characterized in that, The removal of the first auxiliary material layer that does not cover the second electrode of the first pixel based on the photoresist pattern includes: Based on the photoresist pattern, remove 30%-70% of the thickness of the first auxiliary material layer that does not cover the second electrode of the first pixel.

4. The preparation method according to claim 1, characterized in that, The step of fabricating the first electrode on the side of the first light-emitting unit away from the substrate includes: A common layer and the first electrode are sequentially fabricated on the side of the first light-emitting unit away from the substrate.

5. The preparation method according to claim 1, characterized in that, The step of sequentially fabricating a first light-emitting material layer and a first auxiliary material layer on the side of the second electrode of the first pixel away from the substrate includes: A first light-emitting material layer, a common material layer, and a first auxiliary material layer are sequentially prepared on the side of the second electrode away from the substrate.

6. The preparation method according to claim 5, characterized in that, The step of patterning the first light-emitting material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain the first light-emitting unit includes: patterning the first light-emitting material layer and the common material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain the first light-emitting unit and the common layer.

7. The preparation method according to claim 1, characterized in that, The plurality of second electrodes also include a second pixel second electrode; After patterning the first light-emitting material layer based on the first auxiliary material layer covering the second electrode of the first pixel to obtain the first light-emitting unit, the method further includes: A second light-emitting material layer and a second auxiliary material layer are sequentially prepared on the side of the first auxiliary material layer away from the substrate; Partially remove the second auxiliary material layer that does not cover the second electrode of the second pixel; Remove the remaining second auxiliary material layer that does not cover the second electrode of the second pixel; The second light-emitting material layer is patterned based on the second auxiliary material layer covering the second electrode of the second pixel to obtain the second light-emitting unit; While the first electrode of the first pixel is formed on the side of the first light-emitting unit away from the substrate, the first electrode of the second pixel is formed on the side of the second light-emitting unit away from the substrate.

8. The preparation method according to claim 7, characterized in that, The preparation method further includes: A protective material layer and a planarization layer are sequentially prepared on the side of the first auxiliary material layer covering the first light-emitting unit and the second auxiliary material layer covering the second light-emitting unit away from the substrate. At least a portion of the orthographic projection of the planarization layer on the substrate is located between the orthographic projections of the adjacent first light-emitting unit and the second light-emitting unit on the substrate. The protective material layer on the side of the first light-emitting unit and the second light-emitting unit facing away from the substrate is etched away to obtain a protective layer. The protective layer and the planarization layer constitute an insulating structure layer.

9. A display panel, characterized in that, The display panel includes those prepared by any one of claims 1-8.

10. A display device, characterized in that, The display panel includes those prepared by any one of claims 1-8.

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