Display panel, preparation method of display panel and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and a display device, the display panel is provided with a display area, a non-display area and a packaging area, and the packaging area is located in the display area and the non-display area; the display panel comprises a substrate, an isolation structure, a light-emitting function layer and a first packaging layer, the isolation structure is arranged on one side of the substrate, the isolation structure is located in a display area, and a plurality of limiting openings are defined by the isolation structure; the light-emitting functional layer comprises a plurality of light-emitting units located in the display area, and the light-emitting units are at least partially arranged in the limited openings; the first packaging layer is located on the side, away from the substrate, of the light-emitting functional layer and extends to the packaging area. Wherein the first packaging layer located in the packaging area is stacked on the substrate, and the surface, away from the substrate, of the first packaging layer located in the packaging area is a plane. According to the display panel, the substrate and the first packaging layer are stacked in the packaging area, the manufacturing process of preparing an isolation column and a planarization layer is omitted, and the preparation efficiency of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and display panels based on light emitting diode (LED) technologies have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages of high image quality, power saving, thin body and wide application range, becoming the mainstream of display devices. However, the current display panel manufacturing process needs to be improved. Summary of the invention

[0003] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to optimize the manufacturing process of the display panel and improve the production efficiency of the display panel.

[0004] An embodiment of a first aspect of the present application provides a display panel, the display panel having a display area, a non-display area and a packaging area, wherein the packaging area is located between the display area and the non-display area; the display panel comprises:

[0005] substrate;

[0006] An isolation structure is disposed on one side of the substrate, the isolation structure is located in the display area, and the isolation structure encloses a plurality of defined openings;

[0007] The light-emitting functional layer includes a plurality of light-emitting units located in the display area, wherein the light-emitting units are at least partially disposed in the defined openings;

[0008] A first encapsulation layer is located on a side of the light-emitting functional layer away from the substrate and extends to the encapsulation area;

[0009] The first packaging layer located in the packaging area is stacked on the substrate, and the surface of the first packaging layer located in the packaging area away from the substrate is a plane.

[0010] According to an embodiment of the first aspect of the present application, the first encapsulation layer includes a first encapsulation portion and a second encapsulation portion connected to each other, the first encapsulation portion is located in the display area, the first encapsulation portion is located on the side of the light-emitting functional layer away from the substrate, the second encapsulation portion is located in the encapsulation area, and the second encapsulation portion is stacked on the substrate and in contact with the substrate.

[0011] According to any of the aforementioned implementations of the first aspect of the present application, the second encapsulation portion is disposed around the non-display area.

[0012] According to any of the aforementioned implementations of the first aspect of the present application, the second packaging portion covers the packaging area.

[0013] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a second encapsulation layer, the second encapsulation layer is disposed in the display area, and the second encapsulation layer is disposed between the light-emitting functional layer and the first encapsulation layer.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the second encapsulation layer covers a side of the isolation structure facing away from the substrate.

[0015] According to any of the aforementioned implementations of the first aspect of the present application, the second encapsulation layer covers the display area.

[0016] According to any of the aforementioned implementations of the first aspect of the present application, the second encapsulation layer is located on a side of the second encapsulation portion away from the non-display area.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the second encapsulation layer is arranged around the encapsulation area.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the first encapsulation layer is an inorganic material layer, and the second encapsulation layer is an organic material layer.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a third encapsulation layer, which is disposed between the second encapsulation layer and the light-emitting functional layer, and covers a side of the light-emitting unit facing away from the substrate.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the third encapsulation layer includes a plurality of spaced-apart third encapsulation parts, at least part of the third encapsulation part is located within the defined opening and covers the side of the light-emitting unit facing away from the substrate, and the edge of the third encapsulation part overlaps the isolation structure.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the third encapsulation layer is an inorganic material layer.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a dam structure, which is disposed on one side of the substrate, and the dam structure is located in the display area and is disposed around the light-emitting functional layer.

[0023] According to any of the aforementioned implementations of the first aspect of the present application, the first encapsulation layer is located on a side of the dam structure facing away from the substrate.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the first encapsulation layer covers the surface of the dam structure facing away from the substrate.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the first encapsulation layer extends along the dam structure.

[0026] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a second encapsulation layer, the second encapsulation layer is disposed in the display area, and the second encapsulation layer is disposed between the light-emitting functional layer and the first encapsulation layer;

[0027] The second encapsulation layer is in contact with the dam structure near an edge of the encapsulation region.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the distance from the surface of the dam structure facing away from the substrate to the substrate is H1, the distance from the surface of the isolation structure facing away from the substrate to the substrate is H2, and H1≥H2.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the dam structure has a first surface facing away from the packaging area, and the second packaging layer is in contact with the first surface near the edge of the packaging area.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, a surface of the second encapsulation layer facing away from the substrate protrudes in a direction away from the substrate compared to a surface of the dam structure facing away from the substrate.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the second encapsulation layer is located near an edge of the encapsulation area on a side of the dam structure facing away from the substrate.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the second encapsulation layer on the substrate and the orthographic projection of the dam structure on the substrate.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a touch layer, which is located on a side of the first packaging layer away from the substrate. In the packaging area, the substrate, the first packaging layer and the touch layer are stacked in sequence along a direction away from the substrate.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, in the packaging area, oppositely disposed surfaces of the first packaging layer are in contact with the substrate and the touch layer, respectively.

[0035] According to any of the aforementioned implementations of the first aspect of the present application, the touch layer is disposed around the non-display area.

[0036] According to any of the aforementioned implementations of the first aspect of the present application, the touch layer includes a touch electrode layer, and the touch electrode layer includes a plurality of touch electrodes located in the display area and the packaging area;

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, the touch layer also includes a first touch insulating layer, which covers the side of the touch electrode facing away from the substrate, and the first touch insulating layer is stacked on the side of the first encapsulation layer facing away from the substrate near the edge of the non-display area.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the touch layer also includes a second touch insulating layer, the second touch insulating layer is located on a side of the touch electrode layer close to the substrate, and the first encapsulation layer, the second touch insulating layer close to an edge of the non-display area, and the first touch insulating layer close to an edge of the non-display area away from the substrate are stacked in sequence.

[0039] According to any of the aforementioned implementations of the first aspect of the present application, the minimum distance from the touch electrode layer to the non-display area is H3, and H3 ≥ 30 micrometers.

[0040] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes:

[0041] The polarizing layer is located on the side of the first encapsulation layer away from the substrate, and the polarizing layer is located in the display area and the encapsulation area.

[0042] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a touch layer, which is located on the side of the first packaging layer away from the substrate. In the packaging area, the substrate, the first packaging layer, the touch layer and the polarizing layer are stacked in sequence along the direction away from the substrate.

[0043] According to any of the aforementioned implementations of the first aspect of the present application, the polarizing layer is disposed around the non-display area.

[0044] According to any of the aforementioned embodiments of the first aspect of the present application, the surface of the polarizing layer facing away from the substrate is a plane;

[0045] According to any of the aforementioned implementations of the first aspect of the present application, in the display area, a distance from a surface of the first encapsulation layer facing away from the substrate to the substrate is H4.

[0046] In the encapsulation region, a distance from a surface of the first encapsulation layer facing away from the substrate to the substrate is H5, and H4>H5.

[0047] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the polarizing layer in the display area along the direction away from the substrate is smaller than the thickness of the polarizing layer in the encapsulation area along the direction away from the substrate.

[0048] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes:

[0049] The cover plate is located at a side of the first packaging layer away from the substrate, and the cover plate is located in the display area, the packaging area and the non-display area.

[0050] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes an optical adhesive layer and a polarizing layer, the optical adhesive layer bonds the polarizing layer and the cover plate, and the polarizing layer is arranged on a side of the first encapsulation layer away from the substrate.

[0051] According to any of the aforementioned implementations of the first aspect of the present application, the optical adhesive layer is disposed around the non-display area.

[0052] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first part and a second part which are stacked together, the first part is arranged on a side of the second part close to the substrate, and the orthographic projection of the first part on the substrate is located within the orthographic projection of the second part on the substrate.

[0053] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection area of ​​the surface of the second portion facing away from the substrate on the substrate is smaller than the orthographic projection area of ​​the surface of the second portion close to the substrate on the substrate.

[0054] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection area of ​​the surface of the first portion facing away from the substrate on the substrate is smaller than the orthographic projection area of ​​the surface of the second portion close to the substrate on the substrate.

[0055] According to any of the aforementioned implementations of the first aspect of the present application, the non-display area is a light-transmitting area, and the display area is disposed around at least a portion of the light-transmitting area.

[0056] According to any of the aforementioned implementations of the first aspect of the present application, the non-display area is a border area, and the border area is arranged around at least a portion of the display area.

[0057] The embodiment of the second aspect of the present application further provides a display panel, the display panel having a display area, a non-display area and a packaging area, wherein the packaging area is located between the display area and the non-display area; the display panel comprises:

[0058] substrate;

[0059] An isolation structure is disposed on one side of the substrate, the isolation structure is located in the display area, and the isolation structure encloses a plurality of defined openings;

[0060] The light-emitting functional layer includes a plurality of light-emitting units located in the display area, wherein the light-emitting units are at least partially disposed in the defined openings;

[0061] A first encapsulation layer is located on a side of the light-emitting functional layer away from the substrate and extends to the encapsulation area;

[0062] The first packaging layer located in the packaging area is stacked on the substrate and contacts the substrate.

[0063] The third aspect of the present application also provides a display panel, the display panel having a display area, a non-display area and a packaging area, wherein the packaging area is located between the display area and the non-display area; the display panel comprises:

[0064] substrate;

[0065] An isolation structure is disposed on one side of the substrate, the isolation structure is located in the display area, and the isolation structure encloses a plurality of defined openings;

[0066] The light-emitting functional layer includes a plurality of light-emitting units located in the display area, wherein the light-emitting units are at least partially disposed in the defined openings;

[0067] A first encapsulation layer is located on a side of the light-emitting functional layer away from the substrate and extends to the encapsulation area;

[0068] The touch layer is located on a side of the first packaging layer away from the substrate and extends to the packaging area.

[0069] The fourth aspect of the present application also provides a method for preparing a display panel, the method comprising:

[0070] Providing a substrate, the substrate having a display area, a non-display area and a packaging area, wherein the packaging area is located between the display area and the non-display area;

[0071] An isolation structure is arranged on one side of the substrate, the isolation structure is located in the display area, and the isolation structure encloses a plurality of defined openings;

[0072] A light-emitting functional layer is disposed on one side of the substrate, wherein the light-emitting functional layer includes a plurality of light-emitting units located in the display area, and the light-emitting units are at least partially disposed in the defined opening;

[0073] A first encapsulation layer is arranged on one side of the light-emitting functional layer, a portion of the first encapsulation layer is located in the encapsulation area, and the first encapsulation layer located in the encapsulation area is stacked on the substrate and in contact with the substrate.

[0074] An embodiment of the fifth aspect of the present application further provides a display device, comprising a display panel as provided in the first, second, or third aspects, or a display panel prepared by the method for preparing a display panel as provided in the fourth aspect.

[0075] According to an implementation manner of the fifth aspect of the present application, the non-display area is a light-transmitting area, and the display area is arranged around at least a portion of the light-transmitting area; the display device further includes:

[0076] The light sensing element is arranged opposite to the display panel, and the orthographic projection of the light sensing element on the display panel at least partially overlaps with the non-display area.

[0077] In the display panel, the method for preparing the display panel and the display device provided in the embodiments of the present application, a substrate, an isolation structure and a light-emitting functional layer can be set first. Since the isolation structure is spaced between adjacent light-emitting units, there is no need to set structures such as isolation columns in the packaging area to isolate the common layer of adjacent light-emitting units, thereby eliminating the need to set a planarization layer to cover the isolation columns in the packaging area. In this way, in the packaging area, the substrate and the first packaging layer can be stacked, eliminating the steps of setting isolation columns in the packaging area to isolate the common layer and setting a planarization layer to cover the isolation columns in the packaging area, thereby optimizing the preparation process of the display panel and improving the preparation efficiency of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0079] Figure 1 is a schematic diagram of a planar structure of a display panel provided in some embodiments of the present application;

[0080] Figure 2 is along Figure 1 A schematic diagram of a partial cross-sectional structure of line AA shown;

[0081] Figure 3 is a schematic diagram of a planar structure of a display panel provided in some embodiments of the present application;

[0082] Figure 4 is along Figure 3 A schematic diagram of a partial cross-sectional structure of line BB shown;

[0083] Figure 5 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0084] Figure 6 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0085] Figure 7 It is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application.

[0086] Description of reference numerals:

[0087] 100, display panel; AA, display area; NA, non-display area; PA, packaging area; 101, light-transmitting hole;

[0088] 1. substrate; 11. underlay; 12. driving circuit layer;

[0089] 2. Isolation structure; 21. First part; 22. Second part; 23. Defined opening;

[0090] 3. Light-emitting functional layer; 31. Light-emitting unit; 311. Light-emitting layer; 312. First electrode; 313. Second electrode;

[0091] 4. touch layer; 41. touch electrode layer; 411. touch electrode; 42. first touch insulating layer; 43. second touch insulating layer;

[0092] 51, first encapsulation layer; 511, first encapsulation part; 512, second encapsulation part; 52, second encapsulation layer; 53, third encapsulation layer; 531, third encapsulation part; 54, dam structure; 541, first surface;

[0093] 6. Optical adhesive layer; 7. Cover plate; 8. Polarizing layer; 9. Pixel definition layer; 91. Pixel opening. DETAILED DESCRIPTION

[0094] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0095] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0096] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0097] In the display panel, the light-emitting functional layer is arranged in the display area, and the side of the light-emitting functional layer facing the non-display area needs to be encapsulated. When encapsulating in the related art, an isolation column is arranged in the encapsulation area to separate the common layer of the light-emitting functional layer, a flattening layer is arranged on one side of the isolation column to flatten the isolation column, and then an encapsulation layer is arranged on one side of the flattening layer. Therefore, in order to encapsulate the side of the light-emitting functional layer facing the non-display area, three preparation processes are involved, namely, the isolation column, the flattening layer and the encapsulation layer, which results in low display panel production efficiency.

[0098] To solve the above problems, embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. Embodiments of the display panel, a method for manufacturing a display panel, and a display device will be described below in conjunction with the accompanying drawings.

[0099] In a first aspect, the present application provides a display panel 100, such as Figure 1 and Figure 2 As shown, the display panel 100 has a display area AA, a non-display area NA and a packaging area PA, the display area AA is arranged around at least a portion of the non-display area NA, and the packaging area PA is located between the display area AA and the non-display area NA; the display panel 100 includes: a substrate 1, an isolation structure 2, a light-emitting functional layer 3 and a first packaging layer 51, the isolation structure 2 is arranged on one side of the substrate 1, the isolation structure 2 is located in the display area AA, and the isolation structure 2 surrounds a plurality of defined openings 23; the light-emitting functional layer 3 includes a plurality of light-emitting units 31 located in the display area AA, and the light-emitting units 31 are at least partially arranged in the defined openings 23; the first packaging layer 51 is located on the side of the light-emitting functional layer 3 away from the substrate 1 and extends to the packaging area PA; the first packaging layer 51 located in the packaging area PA is stacked on the substrate 1, and the surface of the first packaging layer 51 located in the packaging area PA away from the substrate 1 is a plane.

[0100] The specific design of the isolation structure 2 can refer to existing patents, such as application numbers 202310771124.9, 202310740412.8, 202310855866.X, 202311017132.0, 202311124847.6, and 202311091555.7, which record the relevant contents of the isolation structure.

[0101] The display panel 100 provided in the embodiment of the present application may be an organic light emitting diode (OLED) display panel.

[0102] In the display panel 100 provided in the embodiment of the present application, the substrate 1 can not only provide support for the isolation structure 2, but also provide electrical signals for the light-emitting functional layer 3 and the touch layer 4. There are many ways to set the substrate 1. In some embodiments, the substrate 1 may include a substrate 11 and a driving circuit layer 12 arranged on the substrate 11, and the driving circuit layer 12 may include a pixel driving circuit, a plurality of conductive connection structures stacked, etc. Exemplarily, the pixel driving circuit arranged in the driving circuit layer 12 includes a transistor and a storage capacitor. The transistor includes an active layer, a gate, a drain and a source. The storage capacitor includes a first plate and a second plate.

[0103] The isolation structure 2 encloses a plurality of defined openings 23, and adjacent defined openings 23 are spaced apart by the isolation structure 2. The number of the defined openings 23 may correspond to the number of the light emitting units 31 one by one.

[0104] The plurality of light emitting units 31 may be light emitting units 31 capable of emitting light of different colors, for example, a red light emitting unit capable of emitting red light, a green light emitting unit capable of emitting green light, and a blue light emitting unit capable of emitting blue light.

[0105] The first encapsulation layer 51 is disposed on one side of the light-emitting functional layer 3 . The first encapsulation layer 51 may include organic materials and / or inorganic materials. The first encapsulation layer 51 may improve the barrier capability of the display panel 100 against water and oxygen, thereby preventing external water and oxygen from entering the light-emitting functional layer 3 and affecting the light emission of the light-emitting unit 31 .

[0106] In some embodiments, the non-display area NA, the encapsulation area PA, and the display area AA may be arranged in sequence from the outside to the inside. The light emitting unit 31 may not be arranged in the non-display area NA, so that the non-display area NA is not used for displaying light. Part of the wiring connecting the light emitting unit 31 may extend from the display area AA to the non-display area NA, and the external circuit is connected from the non-display area NA.

[0107] See also Figure 3 and Figure 4 In some embodiments, the non-display area NA, the encapsulation area PA and the display area AA can be arranged in sequence from the inside to the outside. The light transmittance of the non-display area NA is greater than the light transmittance of the display area AA, so that the light entering the display panel 100 from one side of the display panel 100 can pass through the non-display area NA and be emitted from the other side of the display panel 100. A light sensor is preferably arranged on one side of the non-display area NA, and the light sensor located on one side of the display panel 100 receives the light to realize photoelectric conversion. The light sensor can specifically be an infrared sensor, a camera, etc.

[0108] The first packaging layer 51 located in the packaging area PA is stacked on the substrate 1, which means that no isolation structure 2 or other structure with a height difference is set between the first packaging layer 51 located in the packaging area PA and the substrate 1. The first packaging layer 51 is in contact with the substrate 1, and the surface of the first packaging layer 51 away from the substrate 1 is relatively flat, and there is no need to further set a planarization layer to fill the uneven position.

[0109] When preparing the display panel 100 provided in the present application, a substrate 1, an isolation structure 2 and a light-emitting functional layer 3 can be set first. Since the isolation structure 2 is spaced between adjacent light-emitting units 31, there is no need to set isolation columns and other structures in the packaging area PA to isolate the common layer of adjacent light-emitting units 31, thereby eliminating the need to set a planarization layer to cover the isolation columns in the packaging area PA, so that in the packaging area PA, the first packaging layer 51 can be directly stacked on the substrate 1, eliminating the steps of setting isolation columns in the packaging area PA to isolate the common layer and setting a planarization layer to cover the isolation columns in the packaging area PA, thereby optimizing the preparation process of the display panel 100 and improving the preparation efficiency of the display panel 100.

[0110] In some embodiments, the first encapsulation layer 51 includes a first encapsulation portion 511 and a second encapsulation portion 512 connected to each other, the first encapsulation portion 511 is located in the display area AA, the first encapsulation portion 511 is located on the side of the light-emitting functional layer 3 away from the substrate 1, the second encapsulation portion 512 is located in the encapsulation area PA, and the second encapsulation portion 512 is stacked on the substrate 1 and in contact with the substrate 1.

[0111] The first encapsulation part 511 and the second encapsulation part 512 can be manufactured simultaneously, thereby improving the uniformity of the first encapsulation part 511 and the second encapsulation part 512. The first encapsulation part 511 can effectively prevent water and oxygen from entering the light-emitting functional layer 3 from the side of the light-emitting functional layer 3 away from the substrate 1, and the second encapsulation part 512 can effectively prevent water and oxygen from entering the light-emitting functional layer 3 from the side of the light-emitting functional layer 3.

[0112] See also Figure 2 In some embodiments, the second encapsulation portion 512 is disposed around the non-display area NA.

[0113] The first encapsulation layer 51 may extend in the display area AA and the encapsulation area PA, and the first encapsulation layer 51 may not be provided in the non-display area NA, thereby improving the light transmittance of the non-display area NA. The second encapsulation part 512 is provided around the non-display area NA, thereby preventing water and oxygen from entering the display area AA from the non-display area NA.

[0114] In some embodiments, the second encapsulation portion 512 covers the encapsulation area PA.

[0115] The second packaging part 512 can be laid out on the entire surface of the packaging area PA, and the surface of the substrate 1 exposed in the packaging area PA is stacked with the second packaging part 512, thereby reducing or avoiding packaging failure of the second packaging part 512.

[0116] Optionally, the first encapsulation part 511 covers the display area AA, that is, the first encapsulation part 511 may be laid out on the entire surface of the display area AA, thereby reducing or avoiding encapsulation failure of the first encapsulation part 511 .

[0117] In some embodiments, the display panel 100 further includes a second encapsulation layer 52 , the second encapsulation layer 52 is disposed in the display area AA, and the second encapsulation layer 52 is disposed between the light emitting functional layer 3 and the first encapsulation layer 51 .

[0118] The second encapsulation layer 52 can be made of organic or inorganic materials. The first encapsulation layer 51 and the second encapsulation layer 52 can be made of the same or different materials. The second encapsulation layer 52 is conducive to improving the water and oxygen isolation capability of the display panel 100 to the light-emitting functional layer 3. The first encapsulation layer 51 and the second encapsulation layer 52 are made of different materials, so that the first encapsulation layer 51 and the second encapsulation layer 52 can have different properties to improve the water and oxygen resistance capability of the display panel 100.

[0119] In some embodiments, the second encapsulation layer 52 covers a side of the isolation structure 2 facing away from the substrate 1 .

[0120] The second encapsulation layer 52 covers the side of the isolation structure 2 facing away from the substrate 1 , so that the second encapsulation layer 52 can flatten the isolation structure 2 , which is conducive to forming a flat first encapsulation layer 51 on the side of the second encapsulation layer 52 facing away from the substrate 1 .

[0121] In some embodiments, the second encapsulation layer 52 covers the display area AA.

[0122] The second encapsulation layer 52 may be laid over the entire display area AA to ensure that each light emitting unit 31 may be encapsulated by the second encapsulation layer 52 .

[0123] In some embodiments, the second encapsulation layer 52 is located on the side of the second encapsulation portion 512 away from the non-display area NA, so that the second encapsulation portion 512 can protect the side of the second encapsulation layer 52, avoiding or reducing the entry of water, oxygen, etc. into the second encapsulation layer 52 from the side of the second encapsulation layer 52 toward the non-display area NA.

[0124] In some embodiments, the second encapsulation layer 52 is disposed around the encapsulation area PA, so that the second encapsulation layer 52 can protect the surrounding side of the encapsulation area PA from water and oxygen.

[0125] In some embodiments, the first encapsulation layer 51 is an inorganic material layer, and the second encapsulation layer 52 is an organic material layer.

[0126] Compared with the organic material layer, the inorganic material layer has a better ability to block water and oxygen. Compared with the inorganic material layer, the organic material layer has better flexibility and good film-forming properties. The second encapsulation layer 52 has a flattening effect. The light-emitting functional layer 3 is encapsulated by the organic material layer and the inorganic material layer together to improve the comprehensive ability of the display panel 100 to resist water and oxygen.

[0127] In some embodiments, the display panel 100 further includes a third encapsulation layer 53 , which is disposed between the second encapsulation layer 52 and the light-emitting functional layer 3 , and covers a side of the light-emitting unit 31 facing away from the substrate 1 .

[0128] The light-emitting unit 31 may include a light-emitting layer 311, a first electrode 312 and a second electrode 313 disposed on opposite sides thereof, wherein the first electrode 312, the light-emitting layer 311 and the second electrode 313 are stacked in a direction away from the substrate 1. One of the first electrode 312 and the second electrode 313 may be a cathode, and the other may be an anode. The first electrode 312 and the second electrode 313 are respectively connected to the light-emitting layer 311 and are used to drive the light-emitting layer 311 to emit light. The third encapsulation layer 53 may cover the side of the second electrode 313 away from the substrate 1, and the third encapsulation layer 53 may reduce or prevent water and oxygen from entering the light-emitting unit 31, thereby increasing the service life of the light-emitting unit 31.

[0129] The third encapsulation layer 53 can be made of organic or inorganic materials. The first encapsulation layer 51, the second encapsulation layer 52 and the third encapsulation layer 53 can be made of the same or different materials. The third encapsulation layer 53 is conducive to improving the water and oxygen isolation ability of the display panel 100 to the light-emitting functional layer 3. The third encapsulation layer 53 and the second encapsulation layer 52 are made of different materials, so that the third encapsulation layer 53 and the second encapsulation layer 52 can have different properties to improve the ability of the display panel 100 to resist water and oxygen.

[0130] In some embodiments, the third encapsulation layer 53 includes a plurality of spaced third encapsulation portions 531 , at least part of which is located within the defined opening 23 and covers a side of the light emitting unit 31 facing away from the substrate 1 , and an edge of the third encapsulation portion 531 overlaps the isolation structure 2 .

[0131] The third encapsulation part 531 and the light emitting unit 31 can be arranged in a one-to-one correspondence, that is, one third encapsulation part 531 is used to encapsulate one light emitting unit 31. The third encapsulation part 531 can be arranged entirely within the defined opening 23, or partially extend to the outside of the defined opening 23. The edge of the third encapsulation part 531 overlaps the isolation structure 2 to avoid or reduce the formation of a gap between the third encapsulation part 531 and the isolation structure 2 through which water and oxygen can pass.

[0132] Since the light-emitting unit 31 is not provided in the encapsulation area PA and the non-display area NA, the second encapsulation layer 52 and the third encapsulation layer 53 may not be provided in the encapsulation area PA and the non-display area NA, thereby simplifying the layer structure in the encapsulation area PA, reducing or avoiding unnecessary refraction of light incident on the non-display area NA in the non-display area NA, and improving the light transmittance of the non-display area NA.

[0133] In some embodiments, the third encapsulation layer 53 is an inorganic material layer.

[0134] The material of the third encapsulation layer 53 may be the same as that of the first encapsulation layer 51 to simplify the manufacturing process.

[0135] In some embodiments, the display panel 100 further includes a dam structure 54 . The dam structure 54 is disposed on one side of the substrate 1 . The dam structure 54 is located in the display area AA and is disposed around the light-emitting functional layer.

[0136] The dam structure 54 can also be arranged around the isolation structure 2. The dam structure 54 is arranged at the edge of the display area AA close to the encapsulation area PA, so that the dam structure 54 can effectively isolate the display area AA and the encapsulation area PA. The dam structure 54 can also block part of the preparation material, so that the preparation material can be limited to the display area AA or the encapsulation area PA, improving the consistency of the prepared display panel. Part of the preparation material can be the material for preparing the second encapsulation layer 52 as mentioned above.

[0137] In some embodiments, the first encapsulation layer 51 is located on a side of the dam structure 54 facing away from the substrate 1 .

[0138] The first encapsulation layer 51 extends from the display area AA to the encapsulation area PA and is located on a side of the dam structure 54 facing away from the substrate 1 , thereby achieving full-surface encapsulation of the display area AA and the encapsulation area PA.

[0139] In some embodiments, the first encapsulation layer 51 covers the surface of the dam structure 54 facing away from the substrate 1 , so that the side of the display area AA is encapsulated by the first encapsulation layer 51 and the dam structure 54 .

[0140] In some embodiments, the first encapsulation layer 51 extends along the dam structure 54 , thereby increasing the contact area between the first encapsulation layer 51 and the dam structure 54 , which is beneficial to improving the encapsulation capability of the first encapsulation layer 51 and the dam structure 54 to the display area AA.

[0141] In some embodiments, the display panel 100 further includes a second encapsulation layer 52 , which is disposed in the display area AA and between the light-emitting functional layer 3 and the first encapsulation layer 51 ; the second encapsulation layer 52 contacts the dam structure 54 near the edge of the encapsulation area PA.

[0142] The second encapsulation layer 52 is an organic material layer. If the second encapsulation layer 52 extends to the encapsulation area PA, water vapor may enter the display area AA along the second encapsulation layer 52. Therefore, the second encapsulation layer 52 is disposed in the display area AA to prevent water vapor from entering the display area AA through the second encapsulation layer 52 extending to the encapsulation area PA. The second encapsulation layer 52 is in contact with the dam structure 54 near the edge of the encapsulation area PA, so that the dam structure 54 can prevent the second encapsulation layer 52 from extending to the encapsulation area PA. The dam structure 54 can isolate the second encapsulation layer 52 and the encapsulation area PA at the edge of the second encapsulation layer 52.

[0143] In some embodiments, the distance between the surface of the dam structure 54 facing away from the substrate 1 and the substrate 1 is H1, the distance between the surface of the isolation structure 2 facing away from the substrate 1 and the substrate 1 is H2, and H1≥H2.

[0144] The second encapsulation layer 52 covers the side of the isolation structure 2 facing away from the substrate, H1 ≥ H2, so that the dam structure 54 can protrude or be flush with the isolation structure 2, which is beneficial to improve the blocking ability of the dam structure 54 to the material used to prepare the second encapsulation layer 52.

[0145] In some embodiments, the dam structure 54 has a first surface 541 facing away from the encapsulation area PA, and the second encapsulation layer 52 is in contact with the first surface 541 near an edge of the encapsulation area PA.

[0146] The material for preparing the second encapsulation layer 52 has the ability to flow. When the material for preparing the second encapsulation layer 52 is coated on one side of the substrate 1, the material for preparing the second encapsulation layer 52 flows to the first surface 541 so that the second encapsulation layer 52 can fill the space between the dam structure 54 and the isolation structure 2. The flow of the material for preparing the second encapsulation layer 52 is blocked by the first surface 541, forming a structure in which the edge of the second encapsulation layer 52 near the encapsulation area PA is in contact with the first surface 541.

[0147] In some embodiments, the surface of the dam structure 54 facing away from the substrate 1 is more protruding in a direction away from the substrate 1 than the surface of the second encapsulation layer 52 facing away from the substrate 1. That is, the second encapsulation layer 52 is disposed in a space enclosed by the annular dam structure 54.

[0148] In some embodiments, the surface of the second encapsulation layer 52 facing away from the substrate 1 is more protruding in a direction facing away from the substrate 1 than the surface of the dam structure 54 facing away from the substrate 1 .

[0149] Keeping the surface of the second encapsulation layer 52 away from the substrate 1 flush with the surface of the dam structure 54 away from the substrate 1 requires high process requirements. When preparing the second encapsulation layer 52, sufficient organic material is provided, and the organic material has good plasticity, so that the surface of the second encapsulation layer 52 away from the substrate 1 is convex in the direction away from the substrate 1 compared with the surface of the dam structure 54 away from the substrate 1, which is conducive to providing a smooth first encapsulation layer 51 on one side of the second encapsulation layer 52 and the dam structure 54, and avoiding the first encapsulation layer 51 from being broken or collapsed.

[0150] See also Figure 5 In some embodiments, the second encapsulation layer 52 is located near an edge of the encapsulation area PA and on a side of the dam structure 54 facing away from the substrate 1 .

[0151] Since the organic material used to prepare the second encapsulation layer 52 has good plasticity, the second encapsulation layer 52 extends from the edge of the encapsulation area PA to the side of the dam structure 54 away from the substrate 1, so that the surface of the second encapsulation layer 52 away from the substrate 1 and the surface of the dam structure 54 away from the substrate 1 can have a smooth transition, which is conducive to the preparation of a smooth first encapsulation layer 51.

[0152] In some embodiments, the orthographic projection of the first encapsulation layer 51 on the substrate 1 covers the orthographic projection of the second encapsulation layer 52 on the substrate 1 and the orthographic projection of the dam structure 54 on the substrate. The first encapsulation layer 51 can encapsulate the second encapsulation layer 52 and the dam structure 54 together.

[0153] See also Figure 6 The display panel 100 further includes a touch layer 4 , which is located on a side of the first encapsulation layer 51 away from the substrate 1 . In the encapsulation area PA, the substrate 1 , the first encapsulation layer 51 and the touch layer 4 are stacked in sequence in a direction away from the substrate 1 .

[0154] The touch layer 4 enables the display device to perform touch operation. The touch layer 4 can be arranged on the light-emitting side of the light-emitting functional layer 3. In order to prevent the touch layer 4 from affecting the display of the light-emitting functional layer 3, the touch layer 4 can be made of a light-transmitting material. The touch layer 4 can include touch electrodes 4111 arranged at intervals. Adjacent touch electrodes 4111 cooperate to form touch capacitors. By analyzing the electrical signal of the touch capacitor change, the user's touch position on the display panel 100 can be determined.

[0155] The touch layer 4 extends to the packaging area PA, so that the conductive wires in the touch layer 4 can guide static electricity, thereby improving the anti-static capability of the display panel.

[0156] In some embodiments, in the encapsulation area PA, oppositely disposed surfaces of the first encapsulation layer 51 are in contact with the substrate 1 and the touch layer 4 , respectively.

[0157] The first encapsulation layer 51 may directly contact the substrate 1 and the touch layer 4 , thereby simplifying the layer structure in the encapsulation area PA.

[0158] In some embodiments, the touch layer 4 is disposed around the non-display area NA.

[0159] The touch layer 4 may extend in the display area AA and the encapsulation area PA, and the touch layer 4 may not be provided in the non-display area NA, thereby improving the light transmittance of the non-display area NA. The touch layer 4 is provided around the non-display area NA, thereby effectively guiding static electricity from the non-display area NA into the encapsulation area PA.

[0160] In some embodiments, the touch layer 4 includes a touch electrode layer 41 , and the touch electrode layer 41 includes a plurality of touch electrodes 411 located in the display area AA and the packaging area PA.

[0161] In some embodiments, the touch layer 4 further includes a first touch insulating layer 42 , which covers the side of the touch electrode 411 facing away from the substrate 1 , and is stacked near an edge of the non-display area NA on a side of the first encapsulation layer 51 facing away from the substrate 1 .

[0162] The first touch insulating layer 42 can prevent the touch electrode layer 41 from having an unwanted current cross-flow with other layer structures. The first touch insulating layer 42 is stacked and contacted with the side of the first encapsulation layer 51 away from the substrate 1 near the edge of the non-display area NA, so that the first touch insulating layer 42 can prevent water and oxygen from entering the encapsulation area PA from the non-display area NA and affecting the touch electrode layer 41 located in the encapsulation area PA. The first touch insulating layer 42 can cover the side of the touch electrode 411 near the non-display area NA.

[0163] In some embodiments, the touch layer 4 further includes a second touch insulating layer 43, the second touch insulating layer 43 is located on a side of the touch electrode layer 41 close to the substrate 1, the first encapsulation layer 51, the edge of the second touch insulating layer 43 close to the non-display area NA, and the edge of the first touch insulating layer 42 close to the non-display area NA away from the substrate are sequentially stacked and contacted in sequence, so that the first touch insulating layer 42 and the second touch insulating layer 43 can be located on opposite sides of the touch electrode layer 41 and cover the touch electrode layer 41, which can prevent water and oxygen from entering the encapsulation area PA from the non-display area NA and affecting the touch electrode layer 41 located in the encapsulation area PA.

[0164] In some embodiments, the minimum distance from the touch electrode layer 41 to the non-display area is H3, where H3 ≥ 30 micrometers.

[0165] During the process of preparing the display panel 100, the display panel 100 needs to be cut. If H3 is too small, the cracks generated during the cutting process will easily extend to the touch electrode layer 41, so that water and oxygen can enter the touch electrode layer 41 through the cracks, thus affecting the life of the touch electrode layer 41.

[0166] In some embodiments, the display panel 100 further includes a polarizing layer 8 , which is located on a side of the first encapsulation layer 51 away from the substrate 1 , and the polarizing layer 8 is located in the display area AA and the encapsulation area PA.

[0167] The polarizing layer 8 can adjust the light emitted by the light emitting unit 31 to improve the display effect of the display panel 100 .

[0168] In some embodiments, the display panel 100 also includes a touch layer 4, which is located on the side of the first packaging layer 51 away from the substrate 1. In the packaging area PA, the substrate 1, the first packaging layer 51, the touch layer 4 and the polarizing layer 8 are stacked in sequence along the direction away from the substrate 1, thereby eliminating the need to set an isolation member and a flat isolation member in the packaging area PA. Planarization layer.

[0169] In some embodiments, the polarizing layer 8 is disposed around the non-display area NA, thereby improving light transmittance of the non-display area NA.

[0170] In some embodiments, the surface of the polarizing layer 8 facing away from the substrate 1 is a plane, which is conducive to providing other functional layers on the side of the polarizing layer 8 facing away from the substrate 1 .

[0171] In some embodiments, in the display area AA, the distance between the surface of the first encapsulation layer 51 facing away from the substrate 1 and the substrate 1 is H4.

[0172] In the encapsulation region, the distance between the surface of the first encapsulation layer 51 facing away from the substrate 1 and the substrate 1 is H5, and H4>H5.

[0173] Since the light emitting unit 31 and the isolation structure 2 need to be disposed between the substrate 1 and the first encapsulation layer 51 in the display area AA, the first encapsulation layer 51 in the encapsulation area can be directly stacked on the substrate 1, so that H4>H5.

[0174] In some embodiments, the first encapsulation layer 51 has the same thickness in the display area AA and the encapsulation area PA along the direction away from the substrate 1 , and the touch layer 4 has the same thickness in the display area AA and the encapsulation area PA along the direction away from the substrate 1 .

[0175] The thickness of the polarizing layer 8 in the display area AA along the direction away from the substrate 1 is less than the thickness of the polarizing layer 8 in the packaging area PA along the direction away from the substrate 1, so that part of the polarizing layer 8 can make up for the difference between H4 and H5, so that the surface of the polarizing layer 8 away from the substrate 1 is flat.

[0176] The polarizing layer 8 may include one or more structural layers, and the materials of each structural layer may be the same or different. The materials of the polarizing layer 8 include, but are not limited to, monomers or mixed materials such as epoxy resin, vinyl acetate, aldehydes, acrylates, and isocyanates. The thickness of all or part of the structural layers in the polarizing layer 8 is set differently in the display area AA and the encapsulation area PA.

[0177] In some embodiments, the display panel 100 further includes a cover plate 7 , which is located on a side of the first encapsulation layer 51 away from the substrate 1 , and the cover plate 7 is located in the display area AA, the encapsulation area PA, and the non-display area NA.

[0178] The cover plate 7 extends in the display area AA, the encapsulation area PA and the non-display area NA, so that the cover plate 7 can effectively protect the layer structures in the display area AA, the encapsulation area PA and the non-display area NA from external force damage.

[0179] In some embodiments, the display panel 100 further includes an optical adhesive layer 6 and a polarizing layer 8 . The optical adhesive layer 6 bonds the polarizing layer 8 and the cover plate 7 . The polarizing layer 8 is disposed on a side of the first encapsulation layer 51 facing away from the substrate 1 .

[0180] The optical adhesive layer 6 may be an optical adhesive (OCA) to fix the cover plate 7 and the polarizing layer 8 .

[0181] In some embodiments, the optical adhesive layer 6 is disposed around the non-display area NA, so that the optical adhesive layer 6 may not be disposed in the non-display area NA, thereby improving the light transmittance of the non-display area NA.

[0182] Please refer to Figure 7 In some embodiments, the isolation structure 2 includes a first portion 21 and a second portion 22 which are stacked, the first portion 21 is disposed on a side of the second portion 22 close to the substrate 1, and the orthographic projection of the first portion 21 on the substrate 1 is located within the orthographic projection of the second portion 22 on the substrate 1.

[0183] The isolation structure 2 encloses and forms a limited opening 23 to limit the setting range of the light-emitting functional layer 3. The isolation structure 2 includes a first portion 21 and a second portion 22 which are stacked, and the orthographic projection of the first portion 21 on the substrate 1 is located within the orthographic projection of the second portion 22 on the substrate 1, so that the cross-sectional area of ​​the end of the isolation structure 2 away from the substrate 1 is larger, and the cross-sectional area of ​​the end of the isolation structure 2 close to the substrate 1 is smaller. Along the direction from the isolation structure 2 to the substrate 1, the second portion 22 completely covers the first portion 21.

[0184] When preparing the light-emitting unit 31, the light-emitting material A used to prepare the light-emitting unit 31 can be covered on the isolation structure 2 based on the evaporation technology. Since the second part 22 blocks the first part 21, the light-emitting material A used to prepare the light-emitting unit 31 has a large drop at the edge of the second part 22, and the light-emitting material A falling in the defined opening 23 and the light-emitting material A falling on the second part 22 are difficult to connect, so they are broken, forming light-emitting materials A arranged in adjacent defined openings 23 at intervals. The light-emitting material A falling on the second part 22 can be removed as needed. Compared with the preparation of the light-emitting functional layer 3 by mask evaporation in the related art, the present application sets the first part 21 and the second part 22, so that the light-emitting unit 31 located in the defined opening 23 can be prepared without a metal mask, thereby saving the cost of preparing the metal mask. Compared with preparing the light-emitting functional layer 3 by preparing a high-precision metal mask for evaporation, it is easier to directly prepare the isolation structure 2 with high precision, so that the structure of the display panel 100 provided by the present application has low requirements on the preparation process, and the consistency of the prepared display panel 100 is good. The luminescent material A may be a complex containing indium element.

[0185] In some embodiments, the orthographic projection area of ​​the surface of the second portion 22 facing away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the surface of the second portion 22 close to the substrate 1 on the substrate 1 .

[0186] The second portion 22 extends outwardly by a predetermined distance relative to the first portion 21, that is, the orthographic projection area of ​​the surface of the second portion 22 facing away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the surface of the second portion 22 close to the substrate 1 on the substrate 1, so that the second portion 22 has an inclined slope structure, so that the pattern of the light-emitting functional layer 3 can be defined by the second portion 22.

[0187] In some embodiments, the cross-sectional area of ​​the second portion 22 gradually decreases in a direction away from the substrate 1 .

[0188] Optionally, the cross-section of the second portion 22 is a trapezoid with the bottom edge facing the substrate 1, so that the second portion 22 has a sloped surface, which is conducive to the preparation material being disconnected at the partition edge, forming a state in which part of the preparation material is located on the second portion 22 and part of the preparation material is located in the limited opening 23.

[0189] In some embodiments, the orthographic projection area of ​​the surface of the first portion 21 facing away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the surface of the second portion 22 close to the substrate 1 on the substrate 1 .

[0190] That is, the second part 22 extends outward relative to the first part 21, so as to limit the pattern of the light-emitting functional layer 3 through the second part 22. The area of ​​the second part 22 is larger than that of the first part 21, and it is completely covered by the first part 21. At this time, the first part 21 is recessed relative to the second part 22 in a direction away from the defined opening 23. When preparing the light-emitting unit 31, the material forming the light-emitting unit 31 has a large drop at the edge of the isolation structure 2, and the first part 21 is concavely arranged, so that the material forming the light-emitting unit 31 is difficult to connect outside the isolation structure 2, so that a break is found, forming mutually isolated light-emitting units 31.

[0191] In some embodiments, the orthographic projection area of ​​the surface of the second portion 22 facing away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the surface of the second portion 22 close to the substrate 1 on the substrate 1. This allows the second portion 22 to be in the shape of a trapezoid with the bottom edge facing the substrate 1. The second portion 22 can effectively block part of the material from falling into the defined openings 23, forming a light-emitting unit 31 located in each defined opening 23.

[0192] In some embodiments, the cross-sectional area of ​​the first portion 21 gradually decreases in a direction away from the substrate 1 .

[0193] The cross section of the first part 21 may be a trapezoid, which increases the size of the defined opening 23. The cross section of the first part 21 may be a regular trapezoid, which can stably support the second part 22 on the one hand, and on the other hand, makes the contact area between the end of the first part 21 away from the substrate 1 and the second part 22 smaller, so that the first part 21 is concavely arranged relative to the second part 22 in the direction away from the central axis of the defined opening 23, which facilitates the disconnection of the light-emitting functional layer 3 at the isolation structure 2.

[0194] In these optional embodiments, in order to obtain the first portion 21 with a concave setting, during the etching process, the end of the first portion 21 away from the substrate 1 has a faster etching rate than the end of the first portion 21 close to the substrate 1 and / or the second portion 22, thereby forming the concave first portion 21. Since the etching rate of the end of the first portion 21 away from the substrate 1 is faster, more waste generated by etching is easy to enter other positions of the display panel 100, thereby causing adverse effects. The orthographic projection of the end of the first portion 21 away from the substrate 1 on the substrate 1 is set to be within the orthographic projection of the end of the first portion 21 close to the substrate 1 on the substrate 1, so that the end of the first portion 21 away from the substrate 1 can be better supported on the end of the first portion 21 close to the substrate 1, and the generated etching waste falls on the end of the first portion 21 close to the substrate 1, which is easy to clean.

[0195] In some embodiments, the display panel 100 further includes a pixel definition layer 9 disposed between the substrate 1 and the isolation structure 2 , the pixel definition layer 9 includes a pixel opening 91 , and the orthographic projection of the pixel opening 91 on the substrate 1 is located within the orthographic projection range of the limiting opening 23 on the substrate 1 .

[0196] The pixel definition layer 9 includes a pixel defining portion, which encloses a pixel opening 91. At least a portion of the light emitting unit 31 can be disposed in the pixel opening 91 to achieve light emitting display of the display panel 100. The pixel opening 91 can be disposed corresponding to the defining opening 23.

[0197] In some embodiments, the isolation structure 2 is disposed on a side of the pixel definition layer 9 facing away from the substrate 1 , and the light-emitting functional layer 3 is at least partially disposed in the pixel opening 91 .

[0198] The isolation structure 2 is arranged on the side of the pixel definition layer 9 facing away from the substrate 1, and the orthographic projection of the pixel opening 91 on the substrate 1 is located within the orthographic projection of the limiting opening 23 on the substrate 1. The isolation structure 2 can be directly arranged on the side of the pixel definition layer 9 facing away from the substrate 1, and the isolation structure 2 is supported by the pixel definition layer 9. The orthographic projection of the pixel opening 91 on the substrate 1 can be located within the orthographic projection of the limiting opening 23 on the substrate 1. The area of ​​the limiting opening 23 is larger than the area of ​​the pixel opening 91, which can reduce the influence of the isolation structure 2 on the light output viewing angle of the light-emitting functional layer 3.

[0199] Optionally, there are multiple pixel openings 91, and the multiple pixel openings 91 are distributed at intervals, and the isolation structure 2 can be disposed on at least part of the pixel defining portion between two adjacent pixel openings 91. Optionally, the isolation structure 2 can be disposed around at least part of the pixel openings 91.

[0200] See also Figure 3 and Figure 4 In some embodiments, the non-display area NA is a light-transmitting area, and the display area AA is disposed around at least a portion of the light-transmitting area.

[0201] The light transmittance of the non-display area NA is greater than that of the display area AA, so that the light entering the display panel 100 from one side of the display panel 100 can pass through the non-display area NA and exit from the other side of the display panel 100. A light sensor is suitably arranged on one side of the non-display area NA, and the light sensor located on one side of the display panel 100 receives the light to realize photoelectric conversion. The light sensor can specifically be an infrared sensor, a camera, etc. The shape of the non-display area NA can be adapted to the shape of the light sensor, so that all the light exiting from the non-display area NA can enter the light sensor.

[0202] The shape of the non-display area NA may be adapted to the shape of the light sensor, so that all light emitted from the non-display area NA may be incident on the light sensor.

[0203] See also Figure 1 and Figure 2 In some other embodiments, the non-display area NA is a border area, and the border area is disposed around at least a portion of the display area AA.

[0204] In a second aspect, a display panel is provided. Figures 1 to 7 The display panel 100 has a display area AA, a non-display area NA and a packaging area PA, the display area AA is arranged around at least a portion of the non-display area NA, and the packaging area PA is located between the display area AA and the non-display area NA; the display panel 100 includes: a substrate 1, an isolation structure 2, a light-emitting functional layer 3 and a first packaging layer 51, the isolation structure 2 is arranged on one side of the substrate 1, the isolation structure 2 is located in the display area AA, and the isolation structure 2 surrounds a plurality of defined openings 23; the light-emitting functional layer 3 includes a plurality of light-emitting units 31 located in the display area AA, and the light-emitting units 31 are at least partially arranged in the defined openings 23; the first packaging layer 51 is located on a side of the light-emitting functional layer 3 away from the substrate 1 and extends to the packaging area PA; the first packaging layer 51 located in the packaging area PA is superimposed on the substrate 1 and in contact with the substrate 1.

[0205] When preparing the display panel 100 provided in the present application, a substrate 1, an isolation structure 2 and a light-emitting functional layer 3 can be set first. Since the isolation structure 2 is spaced between adjacent light-emitting units 31, there is no need to set isolation columns and other structures in the packaging area PA to isolate the common layer of adjacent light-emitting units 31, thereby eliminating the need to set a planarization layer to cover the isolation columns in the packaging area PA, so that in the packaging area PA, the first packaging layer 51 can be directly stacked on the substrate 1, eliminating the steps of setting isolation columns in the packaging area PA to isolate the common layer and setting a planarization layer to cover the isolation columns in the packaging area PA, thereby optimizing the preparation process of the display panel 100 and improving the preparation efficiency of the display panel 100.

[0206] In a third aspect, a display panel is provided. Figure 6 The display panel 100 has a display area AA, a non-display area NA and a packaging area PA, and the packaging area PA is located between the display area AA and the non-display area NA; the display panel 100 includes: a substrate 1, an isolation structure 2, a light-emitting functional layer 3, a first packaging layer 51 and a touch layer 4, the isolation structure 2 is arranged on one side of the substrate 1, the isolation structure 2 is located in the display area AA, and the isolation structure 2 surrounds a plurality of defined openings 23; the light-emitting functional layer 3 includes a plurality of light-emitting units 31 located in the display area AA, and the light-emitting units 31 are at least partially arranged in the defined openings 23; the first packaging layer 51 is located on the side of the light-emitting functional layer 3 away from the substrate 1 and extends to the packaging area PA; the touch layer 4 is located on the side of the first packaging layer 51 away from the substrate 1 and extends to the packaging area PA.

[0207] The touch layer 4 extends to the packaging area PA, so that the conductive wires in the touch layer 4 can guide static electricity, thereby improving the anti-static capability of the display panel.

[0208] In a fourth aspect, a method for preparing a display panel 100 is provided, the method comprising:

[0209] S100, providing a substrate 1, the substrate 1 having a display area AA, a non-display area NA and a packaging area PA, the packaging area PA is located between the display area AA and the non-display area NA;

[0210] S200, disposing an isolation structure 2 on one side of the substrate 1, the isolation structure 2 being located in the display area AA, and the isolation structure 2 enclosing a plurality of defined openings 23;

[0211] S300, a light-emitting functional layer 3 is disposed on one side of the substrate 1, wherein the light-emitting functional layer 3 includes a plurality of light-emitting units 31 located in the display area AA, and the light-emitting units 31 are at least partially disposed in the defined opening 23;

[0212] S400 , a first encapsulation layer 51 is disposed on one side of the light-emitting functional layer 3 , a portion of the first encapsulation layer 51 is located in the encapsulation area PA, and the first encapsulation layer 51 located in the encapsulation area PA is stacked on the substrate 1 and in contact with the substrate.

[0213] In the preparation method of the display panel 100 provided in the present application, a substrate 1, an isolation structure 2 and a light-emitting functional layer 3 may be firstly arranged. Since the isolation structure 2 is spaced between adjacent light-emitting units 31, there is no need to arrange structures such as isolation columns in the encapsulation area PA to isolate the common layer of adjacent light-emitting units 31, thereby eliminating the need to arrange a planarization layer to cover the isolation columns in the encapsulation area PA. The first encapsulation layer 51 is directly arranged through S400. In the encapsulation area PA, the substrate 1 and the first encapsulation layer 51 are stacked, eliminating the steps of arranging isolation columns in the encapsulation area PA to isolate the common layer and arranging a planarization layer to cover the isolation columns in the encapsulation area PA, thereby optimizing the preparation process of the display panel 100 and improving the preparation efficiency of the display panel 100.

[0214] After S5400, it can also include:

[0215] S500 , a touch layer 4 is disposed on one side of the first encapsulation layer 51 , located on the side of the first encapsulation layer 51 facing away from the substrate 1 , and a portion of the touch layer 4 is overlapped on the first encapsulation layer 51 located in the encapsulation area PA.

[0216] The method for preparing the display panel 100 provided in the present application can prepare the display panel 100 provided in any embodiment of the first aspect. Therefore, the method for preparing the display panel 100 provided in the embodiment of the second aspect of the present application has the beneficial effects of the display panel 100 of any embodiment of the first aspect mentioned above, which will not be repeated here.

[0217] The embodiment of the fifth aspect of the present application further provides a display device, including the display panel 100 of any of the first, second, and third aspects, or the display panel 100 prepared by any of the fourth aspects. Since the display device provided by the embodiment of the fifth aspect of the present application includes the display panel 100 of any of the first, second, and third aspects, or the display panel 100 prepared by any of the fourth aspects, the display device provided by the embodiment of the fifth aspect of the present application has the beneficial effects of the display panel 100 of any of the first, second, and third aspects, or the display panel 100 prepared by any of the fourth aspects, which will not be described in detail here.

[0218] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0219] In some embodiments, the non-display area NA is a light-transmitting area, and the display area AA is arranged around at least a portion of the light-transmitting area; the display device includes a light-sensing element, which is arranged opposite to the display panel 100, and the orthographic projection of the light-sensing element on the display panel 100 at least partially overlaps with the non-display area NA.

[0220] The display panel 100 has a light-transmitting hole 101 penetrating the substrate 1, the first encapsulation layer 51, and the touch layer 4. The light-transmitting hole 101 is located in the non-display area NA. The light-sensing element can be arranged on one side of the light-transmitting hole 101, or can be fully or partially extended into the light-transmitting hole 101. The light-sensing element can be a photoelectric conversion element such as an infrared sensor or a camera.

[0221] According to the embodiments of the present application as above, these embodiments do not describe all the details in detail, nor do they limit the invention to specific embodiments. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel has a display area, a non-display area and a packaging area, wherein the packaging area is located between the display area and the non-display area; the display panel includes: substrate; An isolation structure, disposed on one side of the substrate, the isolation structure is located in the display area, and the isolation structure encloses a plurality of defined openings; A light-emitting functional layer, comprising a plurality of light-emitting units located in the display area, wherein the light-emitting units are at least partially disposed in the defined opening; A first encapsulation layer, located on a side of the light-emitting functional layer away from the substrate and extending to the encapsulation area; The first packaging layer located in the packaging area is stacked on the substrate, and a surface of the first packaging layer located in the packaging area away from the substrate is a plane.

2. The display panel according to claim 1, characterized in that: The first encapsulation layer comprises a first encapsulation part and a second encapsulation part connected to each other, the first encapsulation part is located in the display area, the first encapsulation part is located on a side of the light-emitting functional layer away from the substrate, the second encapsulation part is located in the encapsulation area, and the second encapsulation part is superimposed on the substrate and in contact with the substrate; Preferably, the second packaging portion is arranged around the non-display area; Preferably, the second packaging portion covers the packaging area.

3. The display panel according to claim 2, characterized in that: The display panel further includes a second encapsulation layer, which is disposed in the display area and between the light-emitting functional layer and the first encapsulation layer; Preferably, the second encapsulation layer covers a side of the isolation structure away from the substrate; Preferably, the second encapsulation layer covers the display area; Preferably, the second encapsulation layer is located on a side of the second encapsulation portion away from the non-display area; Preferably, the second encapsulation layer is arranged around the encapsulation area; Preferably, the first encapsulation layer is an inorganic material layer, and the second encapsulation layer is an organic material layer.

4. The display panel according to claim 3, characterized in that: The display panel further includes a third encapsulation layer, which is disposed between the second encapsulation layer and the light-emitting functional layer, and covers a side of the light-emitting unit away from the substrate; Preferably, the third encapsulation layer comprises a plurality of third encapsulation parts arranged at intervals, at least a portion of the third encapsulation part is located in the defined opening and covers a side of the light-emitting unit away from the substrate, and an edge of the third encapsulation part overlaps the isolation structure; Preferably, the third encapsulation layer is an inorganic material layer.

5. The display panel according to claim 1, characterized in that: The display panel further comprises a dam structure, wherein the dam structure is arranged on one side of the substrate, the dam structure is located in the display area and is arranged around the light-emitting functional layer; Preferably, the first encapsulation layer is located on a side of the dam structure away from the substrate; Preferably, the first encapsulation layer covers the surface of the dam structure facing away from the substrate; Preferably, the first encapsulation layer extends along the dam structure.

6. The display panel according to claim 5, characterized in that: The display panel further includes a second encapsulation layer, which is disposed in the display area and between the light-emitting functional layer and the first encapsulation layer; The second encapsulation layer is in contact with the dam structure near an edge of the encapsulation region; Preferably, the distance between the surface of the dam structure facing away from the substrate and the substrate is H1, the distance between the surface of the isolation structure facing away from the substrate and the substrate is H2, and H1≥H2; Preferably, the dam structure has a first surface facing away from the packaging area, and the second packaging layer is in contact with the first surface near an edge of the packaging area; Preferably, a surface of the second encapsulation layer facing away from the substrate is more protruding in a direction away from the substrate than a surface of the dam structure facing away from the substrate; Preferably, the second encapsulation layer is located close to an edge of the encapsulation area on a side of the dam structure away from the substrate; Preferably, the orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the second encapsulation layer on the substrate and the orthographic projection of the dam structure on the substrate.

7. The display panel according to claim 1, characterized in that: The display panel further includes a touch layer, the touch layer is located on a side of the first encapsulation layer away from the substrate, and in the encapsulation area, the substrate, the first encapsulation layer and the touch layer are stacked in sequence in a direction away from the substrate; Preferably, in the packaging area, oppositely disposed surfaces of the first packaging layer are in contact with the substrate and the touch layer respectively; Preferably, the touch layer is arranged around the non-display area; Preferably, in the packaging area, a surface of the touch layer away from the substrate is a plane.

8. The display panel according to claim 7, characterized in that: The touch layer includes a touch electrode layer, and the touch electrode layer includes a plurality of touch electrodes located in the display area and the packaging area; Preferably, the touch layer further includes a first touch insulating layer, the first touch insulating layer covers a side of the touch electrode away from the substrate, and the first touch insulating layer is stacked on a side of the first encapsulation layer away from the substrate near an edge of the non-display area; Preferably, the touch layer further includes a second touch insulating layer, the second touch insulating layer is located on a side of the touch electrode layer close to the substrate, and the first encapsulation layer, the second touch insulating layer close to an edge of the non-display area, and the first touch insulating layer close to an edge of the non-display area away from the substrate are stacked in sequence; Preferably, the minimum distance from the touch electrode layer to the non-display area is H3, and H3 is ≥ 30 micrometers.

9. The display panel according to claim 1, characterized in that: The display panel further includes: a polarizing layer, the polarizing layer being located on a side of the first encapsulation layer away from the substrate, and the polarizing layer being located in the display area and the encapsulation area; Preferably, the display panel further comprises a touch layer, the touch layer is located on a side of the first encapsulation layer away from the substrate, and in the encapsulation area, the substrate, the first encapsulation layer, the touch layer and the polarizing layer are stacked in sequence in a direction away from the substrate; Preferably, the polarizing layer is disposed around the non-display area.

10. The display panel according to claim 9, characterized in that: The surface of the polarizing layer facing away from the substrate is a plane; Preferably, in the display area, a distance between a surface of the first encapsulation layer facing away from the substrate and the substrate is H4; In the encapsulation area, a distance from a surface of the first encapsulation layer facing away from the substrate to the substrate is H5, H4>H5; Preferably, a thickness of the polarizing layer in the display area along a direction away from the substrate is smaller than a thickness of the polarizing layer in the encapsulation area along a direction away from the substrate.

11. The display panel according to claim 1, characterized in that: The display panel further includes: a cover plate, the cover plate being located at a side of the first encapsulation layer away from the substrate, the cover plate being located in the display area, the encapsulation area and the non-display area; Preferably, the display panel further comprises an optical adhesive layer and a polarizing layer, the optical adhesive layer adheres the polarizing layer and the cover plate, and the polarizing layer is arranged on a side of the first encapsulation layer away from the substrate; Preferably, the optical adhesive layer is arranged around the non-display area.

12. The display panel according to claim 1, characterized in that: The isolation structure comprises a first part and a second part which are stacked, wherein the first part is arranged on a side of the second part close to the substrate, and an orthographic projection of the first part on the substrate is located within an orthographic projection of the second part on the substrate; Preferably, the orthographic projection area of ​​the surface of the second part facing away from the substrate on the substrate is smaller than the orthographic projection area of ​​the surface of the second part close to the substrate on the substrate; Preferably, an orthographic projection area of ​​a surface of the first portion facing away from the substrate on the substrate is smaller than an orthographic projection area of ​​a surface of the second portion close to the substrate on the substrate.

13. The display panel according to claim 1, characterized in that: The non-display area is a light-transmitting area, and the display area is arranged around at least a portion of the light-transmitting area; Alternatively, the non-display area is a frame area, and the frame area is disposed around at least a portion of the display area.

14. A display panel, characterized in that: The display panel has a display area, a non-display area and a packaging area, wherein the packaging area is located between the display area and the non-display area; the display panel includes: substrate; An isolation structure, disposed on one side of the substrate, the isolation structure is located in the display area, and the isolation structure encloses a plurality of defined openings; A light-emitting functional layer, comprising a plurality of light-emitting units located in the display area, wherein the light-emitting units are at least partially disposed in the defined opening; A first encapsulation layer, located on a side of the light-emitting functional layer away from the substrate and extending to the encapsulation area; The first packaging layer located in the packaging area is stacked on the substrate and contacts the substrate.

15. A display panel, characterized in that: The display panel has a display area, a non-display area and a packaging area, wherein the packaging area is located between the display area and the non-display area; the display panel includes: substrate; An isolation structure, disposed on one side of the substrate, the isolation structure is located in the display area, and the isolation structure encloses a plurality of defined openings; A light-emitting functional layer, comprising a plurality of light-emitting units located in the display area, wherein the light-emitting units are at least partially disposed in the defined opening; A first encapsulation layer, located on a side of the light-emitting functional layer away from the substrate and extending to the encapsulation area; The touch layer is located on a side of the first packaging layer away from the substrate and extends to the packaging area.

16. A method for preparing a display panel, characterized in that: The method comprises: Providing a substrate, the substrate having a display area, a non-display area and a packaging area, wherein the packaging area is located between the display area and the non-display area; An isolation structure is provided on one side of the substrate, the isolation structure is located in the display area, and the isolation structure encloses a plurality of defined openings; A light-emitting functional layer is disposed on one side of the substrate, wherein the light-emitting functional layer includes a plurality of light-emitting units located in the display area, and the light-emitting units are at least partially disposed in the defined opening; A first encapsulation layer is disposed on one side of the light-emitting functional layer, a portion of the first encapsulation layer is located in the encapsulation area, and the first encapsulation layer located in the encapsulation area is stacked on the substrate and in contact with the substrate.

17. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 15, or a display panel prepared by the method for preparing a display panel according to claim 16.

18. The display device according to claim 17, characterized in that: The non-display area is a light-transmitting area, and the display area is arranged around at least a portion of the light-transmitting area; the display device further includes: The light sensing element is arranged opposite to the display panel, and the orthographic projection of the light sensing element on the display panel at least partially overlaps with the non-display area.

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