Display panel, display device and preparation method of display panel

Abstract

The embodiment of the invention provides a display panel, a display device and a preparation method of the display panel, the display panel comprises a substrate, a first flat layer, a pixel definition layer, an isolation structure, a light emitting device layer, a packaging layer and an isolation piece, the first flat layer is arranged on one side of the substrate; the pixel definition layer is arranged on the side, away from the substrate, of the first flat layer, and the pixel definition layer comprises a pixel opening located in the display area and a first opening located in the non-display area; the isolation structure is located on the side, away from the substrate, of the pixel definition layer and provided with a plurality of isolation openings; the light-emitting device layer comprises a plurality of light-emitting units located in the display area. The packaging layer is located on the side, away from the substrate, of the isolation structure; the separator is located in the non-display area, and the separator is arranged between the first flat layer and the packaging layer. According to the invention, the separator reduces or prevents water vapor from flowing between the first flat layer and the packaging layer, and the service life of the light-emitting unit is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a display device and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Diode (OLED) and display panels based on light emitting diode (LED) technologies have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages of high image quality, power saving, thin body and wide application range, becoming the mainstream of display devices. However, existing display panels still need to be improved. Summary of the invention

[0003] The embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel, aiming to optimize the technical problems of reduced service life and abnormal display of the display panel.

[0004] An embodiment of a first aspect of the present application provides a display panel, the display panel having a display area and a non-display area, wherein the non-display area is arranged around at least a portion of the display area; the display panel comprises:

[0005] substrate;

[0006] A first flat layer is disposed on one side of the substrate;

[0007] A pixel definition layer is disposed on a side of the first flat layer away from the substrate, and the pixel definition layer includes a pixel opening located in the display area and a first opening located in the non-display area;

[0008] An isolation structure is located on a side of the pixel definition layer away from the substrate, and the isolation structure has a plurality of isolation openings, and the isolation openings are connected to the pixel openings;

[0009] The light emitting device layer includes a plurality of light emitting units located in the display area, and the light emitting units are arranged in the isolation opening and the pixel opening;

[0010] The encapsulation layer is located on a side of the isolation structure facing away from the substrate;

[0011] The isolation member is located in the non-display area, the orthographic projection of the isolation member on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate, and the isolation member is arranged between the first flat layer and the encapsulation layer.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation element includes an inorganic material.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first isolation portion and a second isolation portion connected to each other, the first isolation portion is located on the side of the pixel definition layer facing away from the substrate, the second isolation portion is located in the first opening, and the second isolation portion is reused as an isolation member.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first isolation layer and a second isolation layer that are stacked together, the first isolation layer is arranged on a side of the second isolation layer close to the substrate, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, in the display area, the orthographic projection area of ​​the surface of the second isolation layer facing away from the substrate on the substrate is smaller than the orthographic projection area of ​​the surface of the second isolation layer close to the substrate on the substrate.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, in the display area, the orthographic projection area of ​​the surface of the first isolation layer facing away from the substrate on the substrate is smaller than the orthographic projection area of ​​the surface of the second isolation layer close to the substrate on the substrate.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, at least one of the first isolation layer and the second isolation layer extends into the first opening and is reused as an isolation member.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the first isolation layer includes a first conductive portion and a second conductive portion connected to each other, the first conductive portion is located within the first opening and is reused as at least a portion of the isolation member, and the second conductive portion is located outside the first opening and on the side of the pixel definition layer facing away from the substrate.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, opposite sides of the first conductive portion are in contact with the first planarizing layer and the packaging layer, respectively.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, opposite sides of the first conductive portion are in contact with the first planarizing layer and the second isolation layer, respectively.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the second isolation layer includes a third conductive portion and a fourth conductive portion that are connected to each other, the third conductive portion is located within the first opening and is reused as at least a portion of the isolation member, and the fourth conductive portion is located outside the first opening and on the side of the pixel definition layer that is away from the substrate.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, opposite sides of the third conductive portion are in contact with the first planarization layer and the packaging layer, respectively.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure also includes a third isolation layer, which is arranged on a side of the first isolation layer close to the substrate, and at least one of the first isolation layer, the second isolation layer and the third isolation layer extends into the first opening and is reused as an isolation member.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, in the display area, the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the third isolation layer on the substrate.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the third isolation layer includes a fifth conductive portion and a sixth conductive portion that are connected to each other, the fifth conductive portion is located in the first opening and is reused as at least a portion of the isolation member, and the sixth conductive portion is located in the first opening and is located on the side of the pixel definition layer facing away from the substrate.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, opposite sides of the fifth conductive portion are in contact with the first planarization layer and the packaging layer, respectively.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, opposite sides of the fifth conductive portion are in contact with the first planarization layer and the first isolation layer, respectively.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the encapsulation layer includes a first encapsulation sublayer, the first encapsulation sublayer covers the side of the light-emitting device layer facing away from the substrate, the side of the isolation structure facing away from the substrate, and the side of the isolation member facing away from the substrate, the first encapsulation sublayer includes organic material, and the first planarization layer includes organic material.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the encapsulation layer further includes a second encapsulation sublayer, the second encapsulation layer is disposed in the display area, and the second encapsulation sublayer is located between the first encapsulation sublayer and the light-emitting unit.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the second encapsulation sublayer includes a plurality of encapsulation parts that are spaced apart, and the orthographic projections of the encapsulation parts on the substrate cover the orthographic projections of the light-emitting units on the substrate.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the second encapsulation sublayer is an inorganic material layer.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a first conductive layer, the first conductive layer is arranged on the side of the first flat layer facing the substrate, the first conductive layer includes a first signal line located in the non-display area, the first flat layer has a third opening, and part of the isolation structure is located in the third opening and electrically connected to the first signal line.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the isolation element on the substrate is located in the orthographic projection of the first signal line on the substrate.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the third opening on the substrate is arranged at an interval from the orthographic projection of the first opening on the substrate.

[0035] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a second planar layer, and the second planar layer is located on a side of the first conductive layer close to the substrate.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, the first conductive layer further includes a fourth opening penetrating the first signal line, and the first planar layer and the second planar layer are in contact through the fourth opening.

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, an orthographic projection of the first opening on the substrate is spaced apart from an orthographic projection of the fourth opening on the substrate.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projections of the multiple first openings on the substrate and the orthographic projections of the multiple third openings on the substrate are alternately arranged along the first direction; the orthographic projections of the multiple first openings on the substrate and the multiple fourth openings are alternately arranged along the first direction.

[0039] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting unit includes a first electrode, a light-emitting portion, and a second electrode stacked in sequence along a direction away from the substrate, and the second electrode overlaps the isolation structure.

[0040] The second aspect of the present application also provides a display panel, the display panel having a display area and a non-display area, the non-display area being arranged around at least a portion of the display area; the display panel comprises:

[0041] substrate;

[0042] A transistor active layer is disposed on one side of the substrate;

[0043] An organic layer is disposed on a side of the transistor active layer facing away from the substrate;

[0044] The inorganic layer is disposed on a side of the organic layer facing away from the substrate and comprises a first opening located in the non-display area, wherein the first opening exposes the organic layer;

[0045] An auxiliary cathode is located on a side of the inorganic layer facing away from the substrate and extends into the first opening, and an orthographic projection of the first opening on the substrate is located within an orthographic projection of the auxiliary cathode on the substrate;

[0046] The first encapsulation sublayer includes an organic material and is located on a side of the auxiliary cathode facing away from the substrate; the orthographic projection of the first opening on the substrate is located within the orthographic projection of the first encapsulation sublayer on the substrate.

[0047] According to any of the aforementioned embodiments of the second aspect of the present application, the organic layer is a first planarization layer, and the inorganic layer is a pixel definition layer;

[0048] Preferably, the auxiliary cathode is an isolation structure, which includes a first isolation layer and a second isolation layer stacked together, the first isolation layer is arranged on the side of the second isolation layer close to the substrate, and in the display area, the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate.

[0049] The third aspect of the present application also provides a method for preparing a display panel, wherein the display panel has a display area and a non-display area, and the non-display area is arranged around at least a portion of the display area; the preparation method comprises:

[0050] Providing a substrate, and sequentially arranging a first flat layer and a plurality of first electrodes located in a display area on the substrate;

[0051] A pixel definition material layer is disposed on the first planar layer, the pixel definition material layer covers the first electrode, and the pixel definition material layer is patterned to obtain a first opening located in the non-display area;

[0052] forming an isolation material layer on the pixel definition material layer, wherein a portion of the isolation material layer is located in the first opening to form an isolation member;

[0053] The isolation material layer and the pixel definition material layer are patterned to obtain an isolation structure and a pixel definition layer, wherein the pixel definition layer includes a pixel opening located in the display area, the isolation structure has a plurality of isolation openings, the isolation openings are connected to the pixel openings, and the first electrode is exposed from the pixel openings;

[0054] A portion of a light emitting device layer is provided through the isolation structure, wherein the light emitting device layer includes a plurality of light emitting units located in the display area, and the light emitting units are provided in the isolation opening and the pixel opening;

[0055] A portion of the encapsulation layer is formed on a side of the isolation structure facing away from the substrate, and the isolation member is arranged between the first flat layer and the encapsulation layer.

[0056] An embodiment of the fourth aspect of the present application further provides a display device, comprising a display panel according to any embodiment of the first or second aspect above, or a display panel prepared according to any embodiment of the third aspect above.

[0057] In the display panel, display device and display panel manufacturing method provided in the embodiments of the present application, a first opening is set in the pixel definition layer so that during the preparation of the display panel, water vapor in the first flat layer can be discharged outward through the first opening; the first opening is set in the non-display area, which is beneficial to increasing the distribution density of the light-emitting unit in the display area; the isolation member is set so that the orthographic projection of the isolation member on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate, and the isolation member is set between the first flat layer and the encapsulation layer, so that the isolation member can isolate the first flat layer and the encapsulation layer to avoid contact between the first flat layer and the encapsulation layer, thereby avoiding or reducing the first flat layer from absorbing the liquid preparation during the preparation process, avoiding or reducing the water vapor in the first flat layer from entering the encapsulation layer through the first opening, thereby increasing the service life of the light-emitting unit and avoiding or reducing display abnormalities of the light-emitting unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0059] Figure 1 is a schematic diagram of a planar structure of a display panel provided in some embodiments of the present application;

[0060] Figure 2 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0061] Figure 3 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0062] Figure 4 is a partial planar structural schematic diagram of a display panel provided in some embodiments of the present application;

[0063] Figure 5 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0064] Figure 6 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0065] Figure 7 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0066] Figure 8 is a partial planar structural schematic diagram of a display panel provided in some embodiments of the present application;

[0067] Fig. 9is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0068] Fig.10 It is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application.

[0069] Description of reference numerals:

[0070] 100, display panel; AA, display area; NA, non-display area;

[0071] 1. substrate; 11. underlay; 12. driving circuit layer; 13. transistor; 131. source; 132. drain; 133. gate; 134. transistor active layer; 135. first plate; 136. second plate; 14. second flat layer; 15. first signal line; 151. fourth opening;

[0072] 2. Isolation structure; 21. First isolation layer; 211. First conductive part; 212. Second conductive part; 22. Second isolation layer; 221. Third conductive part; 222. Fourth conductive part; 23. Isolation opening; 24. Third isolation layer; 231. Fifth conductive part; 232. Sixth conductive part; 2a. First isolation part; 2b. Second isolation part;

[0073] 3. Light-emitting unit; 31. Light-emitting portion; 32. First electrode; 33. Second electrode;

[0074] 4. pixel definition layer; 41. pixel opening; 42. first opening; 43. second opening;

[0075] 51. a first flat layer; 511. a third opening;

[0076] 7, encapsulation layer; 71, first encapsulation sublayer; 72, second encapsulation sublayer; 721, encapsulation part; 73, third encapsulation sublayer;

[0077] 8. touch layer; 81. touch unit;

[0078] X, third direction; Y, first direction; Z, second direction. DETAILED DESCRIPTION

[0079] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0080] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0081] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0082] During the process of preparing the display panel, the first flat layer discharges water vapor through the first opening provided in the pixel definition layer. In the subsequent process, part of the liquid preparation may enter the first flat layer through the first opening. In the prepared display panel, the water vapor in the first flat layer may enter the encapsulation layer located on one side of the pixel definition layer through the first opening, thereby increasing the probability of water vapor entering the light-emitting unit through the encapsulation layer, resulting in a reduced display service life of the light-emitting unit and display abnormality.

[0083] To solve the above problems, embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. Embodiments of the display panel, the display device, and the method for manufacturing a display panel will be described below in conjunction with the accompanying drawings.

[0084] like Figure 1 and Figure 2As shown, the first aspect of the present application provides a display panel 100, the display panel 100 has a display area AA and a non-display area NA, and the non-display area NA is arranged around at least a portion of the display area AA; the display panel 100 includes: a substrate 1, a first flat layer 51, a pixel definition layer 4, an isolation structure 2, a light-emitting device layer, an encapsulation layer 7 and an isolation member 20, the first flat layer 51 is arranged on one side of the substrate 1; the pixel definition layer 4 is arranged on the side of the first flat layer 51 away from the substrate 1, and the pixel definition layer 4 includes a pixel opening 41 located in the display area AA and a first opening located in the non-display area NA 42; the isolation structure 2 is located on the side of the pixel definition layer 4 away from the substrate 1, the isolation structure 2 has a plurality of isolation openings 23, and the isolation openings 23 are connected to the pixel openings 41; the light-emitting device layer includes a plurality of light-emitting units 3 located in the display area AA, and the light-emitting units 3 are arranged in the isolation openings 23 and the pixel openings 41; the encapsulation layer 7 is located on the side of the isolation structure 2 away from the substrate 1; the isolation member 20 is located in the non-display area NA, the orthographic projection of the isolation member 20 on the substrate 1 at least partially overlaps with the orthographic projection of the first opening 42 on the substrate 1, and the isolation member 20 is arranged between the first flat layer 51 and the encapsulation layer 7.

[0085] In the display panel 100 provided in the embodiment of the present application, the display panel 100 may be a display panel based on organic light emitting diode (OLED) technology. Among them, the isolation structure 2 is described in patents CN118251982A, 202410864269.8, PT / N2024 / 09R407, PCT / CNP02A09R217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0086] A plurality of light emitting units 3 are arranged in the display area AA so that the display area AA can emit light for display. The non-display area NA is not used for displaying light, and no light emitting unit 3 may be arranged in the non-display area NA. Signal lines for electrically connecting the light emitting units 3 may be distributed in the non-display area NA to reduce the space occupied by the signal lines in the display area AA, which is conducive to improving the distribution density of the light emitting units 3 in the display area AA.

[0087] In the display panel 100 provided in the embodiment of the present application, the substrate 1 can not only provide support for the isolation structure 2, but also provide electrical signals for the light-emitting device layer. The substrate 1 includes a substrate 11 and a driving circuit layer 12, and the driving circuit layer 12 is arranged between the substrate 11 and the light-emitting device layer. The driving circuit layer 12 may include a pixel driving circuit. Exemplarily, the pixel driving circuit arranged in the driving circuit layer 12 includes a transistor 13 and a storage capacitor. The transistor 13 includes a transistor active layer 134, a gate 133, a drain 132 and a source 131. The storage capacitor includes a first plate 135 and a second plate 136. A plurality of patterned conductive layers form the aforementioned transistor 13 and storage capacitor.

[0088] The first planarization layer 51 can be used to planarize a functional layer located on the side close to the substrate 1 . The functional layer can be a conductive layer forming the aforementioned source 131 and drain 132 , or a conductive layer electrically connected to the source 131 and drain 132 .

[0089] The pixel definition layer 4 is disposed between the substrate 1 and the isolation structure 2. The pixel definition layer 4 encloses a pixel opening 41 and a first opening 42. The position, shape and size of the light-emitting unit 3 are defined by the pixel opening 41. In the process of preparing the display panel 100, the pixel definition layer 4 is located on the side of the first flat layer 51 away from the substrate 1, and the first flat layer 51 is baked, and the water vapor in the first flat layer 51 can be discharged outward through the first opening 42 to keep the first flat layer 51 dry.

[0090] The isolation structure 2 is surrounded by a plurality of isolation openings 23, and adjacent isolation openings 23 are spaced apart by the isolation structure 2. The isolation structure 2 can be directly disposed on the side of the pixel definition layer 4 facing away from the substrate 1, and the isolation structure 2 is supported by the pixel definition layer 4. The number of isolation openings 23 can correspond to the number of light-emitting units 3 one by one. The plurality of light-emitting units 3 can be light-emitting units 3 capable of emitting light of different colors. For example, they can be a red light-emitting unit capable of emitting red light, a green light-emitting unit capable of emitting green light, and a blue light-emitting unit capable of emitting blue light.

[0091] The encapsulation layer 7 can be made of organic and / or inorganic materials. The encapsulation layer 7 is beneficial to improving the water-oxygen isolation capability of the light-emitting device layer.

[0092] The encapsulation layer 7 extends from the display area AA to the non-display area NA, and is located on the side of the light-emitting device layer away from the substrate 1, thereby achieving full-surface encapsulation of the display area AA and the non-display area NA. The encapsulation layer 7 located in the display area AA can encapsulate the side of the light-emitting device layer and the isolation structure 2 away from the substrate 1, preventing external water and oxygen from entering the light-emitting unit 3 from the side of the light-emitting device layer and the isolation structure 2 away from the substrate 1, thereby affecting the display and light emission of the light-emitting unit 3. The encapsulation layer 7 located in the non-display area NA is stacked on the side of the isolation structure 2 away from the substrate 1, thereby preventing external water and oxygen from entering the display area AA from the non-display area NA, thereby affecting the display and light emission of the light-emitting unit 3.

[0093] The orthographic projection of the spacer 20 on the substrate 1 at least partially overlaps with the orthographic projection of the first opening 42 on the substrate 1. The spacer 20 can be completely disposed in the first opening 42, or partially disposed in the first opening 42, or can be located outside the first opening 42. The spacer 20 is disposed between the first flat layer 51 and the encapsulation layer 7, that is, the first flat layer 51 and the encapsulation layer 7 are not in contact, so that the water vapor in the first flat layer 51 cannot enter the encapsulation layer 7 through the first opening 42, and the water vapor in the encapsulation layer 7 cannot enter the first flat layer 51 through the first opening 42. If not otherwise specified, the orthographic projection on the substrate 1 in the present application is a projection along the third direction X, and the third direction X can be the thickness direction of the display panel 100 or a direction perpendicular to the substrate 1.

[0094] The display panel 100 provided in the present application may further include a cover plate located on the side of the light emitting device layer facing away from the substrate 1, a touch layer 8 located between the cover plate and the light emitting device layer, an optical adhesive layer located between the cover plate and the touch layer 8, etc. The cover plate provides protection for the display panel 100 to prevent external forces from scratching or damaging the display panel 100. The touch layer 8 can realize a touch function. The optical adhesive layer bonds the cover plate and the touch layer 8.

[0095] In the display panel 100 provided in the present application, by setting the first opening 42 in the pixel definition layer 4, the water vapor in the first flat layer 51 can be discharged outward through the first opening 42 during the preparation of the display panel 100; the first opening 42 is set in the non-display area NA, which is beneficial to improve the distribution density of the light-emitting unit 3 in the display area AA; by setting the orthographic projection of the isolation member 20 on the substrate 1 to at least partially overlap with the orthographic projection of the first opening 42 on the substrate 1, the isolation member 20 is set between the first flat layer 51 and the encapsulation layer 7, so that the isolation member 20 can isolate the first flat layer 51 and the encapsulation layer 7 to avoid contact between the first flat layer 51 and the encapsulation layer 7, thereby avoiding or reducing the first flat layer 51 absorbing the liquid preparation during the preparation process, avoiding or reducing the water vapor in the first flat layer 51 entering the encapsulation layer 7 through the first opening 42, improving the service life of the light-emitting unit 3, and avoiding or reducing the display abnormality of the light-emitting unit 3.

[0096] In some embodiments, the spacer 20 includes an inorganic material.

[0097] Compared with organic materials, inorganic materials have better compactness, which is beneficial for the isolation member 20 to block water vapor.

[0098] In other embodiments, the isolating member 20 is a conductive member, and has the function of preventing signals. For example, the isolating member 20 can shield the mutual interference between the touch layer 8 located on the side away from the substrate 11 and the driving circuit layer 12 located on the side close to the substrate 11 .

[0099] In some embodiments, the isolation structure 2 includes a first isolation portion 2a and a second isolation portion 2b connected to each other. The first isolation portion 2a is located on the side of the pixel definition layer 4 facing away from the substrate 1, and the second isolation portion 2b is located in the first opening 42. The second isolation portion 2b is reused as the isolation member 20.

[0100] The isolation material for preparing the isolation structure 2 can be laid on one side of the substrate 1 in its entirety, part of the isolation material falls outside the first opening 42 and is located on the side of the pixel definition layer 4 facing away from the substrate 1, forming a first isolation portion 2a, and part of the isolation material falls inside the first opening 42, forming a second isolation portion 2b. The second isolation portion 2b is reused as the isolation member 20, that is, the second isolation portion 2b isolates the first flat layer 51 and the encapsulation layer 7, and the orthographic projection of the second isolation layer 22 on the substrate 1 overlaps with the orthographic projection of the first opening 42 on the substrate 1, and the second isolation portion 2b has the ability to prevent water vapor from flowing between the first flat layer 51 and the encapsulation layer 7.

[0101] By reusing the second isolation portion 2 b as the isolation member 20 , the step of separately preparing the isolation member 20 is omitted, thereby simplifying the preparation process.

[0102] In some embodiments, the second isolation portion 2b includes a main portion and an extension portion connected to each other, the main portion isolates the first planarizing layer 51 and the encapsulation layer 7, the extension portion extends from the main portion along the pixel definition layer 4 to connect with the first isolation portion 2a, and the extension portion isolates the pixel definition layer 4 and the encapsulation layer 7.

[0103] The isolation material for preparing the isolation structure 2 partially enters the first opening 42, partially falls on the first planar layer 51 to form a main body, and partially falls on the pixel definition layer 4 to form an extension. The extension extends from the main body along the pixel definition layer 4 to connect with the first isolation part 2a, thereby preventing the water vapor in the first planar layer 51 from entering the planar layer along the contact interface between the second isolation part 2b and the pixel definition layer 4.

[0104] See also Figure 3 and Figure 4In some embodiments, the isolation structure 2 includes a first isolation layer 21 and a second isolation layer 22 which are stacked together, the first isolation layer 21 is arranged on a side of the second isolation layer 22 close to the substrate 1, and the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the second isolation layer 22 on the substrate 1.

[0105] The isolation structure 2 encloses an isolation opening 23 to limit the setting range of the light-emitting device layer. The isolation structure 2 includes a first isolation layer 21 and a second isolation layer 22 that are stacked, and the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the second isolation layer 22 on the substrate 1, so that the cross-sectional area of ​​the end of the isolation structure 2 away from the substrate 1 is larger, and the cross-sectional area of ​​the end of the isolation structure 2 close to the substrate 1 is smaller. Along the direction from the isolation structure 2 to the substrate 1, the second isolation layer 22 completely blocks the first isolation layer 21.

[0106] When preparing the light-emitting unit 3, the light-emitting material A used to prepare the light-emitting unit 3 can be covered on the isolation structure 2 based on the evaporation technology. Since the second isolation layer 22 blocks the first isolation layer 21, the light-emitting material A used to prepare the light-emitting unit 3 has a large drop at the edge of the second isolation layer 22, and the light-emitting material A falling in the isolation opening 23 and the light-emitting material A falling on the second isolation layer 22 are difficult to connect, so they are broken, forming light-emitting materials A arranged in adjacent isolation openings 23. Compared with the preparation of the light-emitting device layer by evaporation of the mask in the related art, the present application sets the first isolation layer 21 and the second isolation layer 22, so that the light-emitting unit 3 located in the isolation opening 23 can be prepared without a metal mask, thereby saving the cost of preparing the metal mask. Compared with preparing the light-emitting device layer by evaporation of the metal mask with high precision, it is easier to directly prepare the isolation structure 2 with high precision, so that the structure of the display panel 100 provided by the present application has low requirements on the preparation process, and the consistency of the prepared display panel 100 is good. The light-emitting material A can be a complex containing indium element.

[0107] In some embodiments, in the display area AA, the orthographic projection area of ​​the surface of the second isolation layer 22 facing away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the surface of the second isolation layer 22 close to the substrate 1 on the substrate 1 .

[0108] The second isolation layer 22 extends outwardly by a predetermined distance relative to the first isolation layer 21, that is, the orthographic projection area of ​​the surface of the second isolation layer 22 facing away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the surface of the second isolation layer 22 close to the substrate 1 on the substrate 1, so that the second isolation layer 22 has an inclined slope structure, so that the pattern of the light-emitting unit 3 can be limited by the second isolation layer 22.

[0109] In some embodiments, in the display area AA, the cross-sectional area of ​​the second isolation layer 22 gradually decreases in a direction away from the substrate 1 .

[0110] Optionally, the cross-section of the second isolation layer 22 is a trapezoid with the bottom edge facing the substrate 1, so that the second isolation layer 22 has a sloped surface, which is conducive to the preparation material being disconnected at the partition edge, forming a state in which part of the preparation material is located on the second isolation layer 22 and part of the preparation material is located in the isolation opening.

[0111] In some embodiments, in the display area AA, the orthographic projection area of ​​the surface of the first isolation layer 21 facing away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the surface of the second isolation layer 22 close to the substrate 1 on the substrate 1 .

[0112] That is, the second isolation layer 22 extends outward relative to the first isolation layer 21, so as to limit the pattern of the light-emitting unit 3 through the second isolation layer 22. The area of ​​the second isolation layer 22 is larger than that of the first isolation layer 21, and it is completely covered by the first isolation layer 21. At this time, the first isolation layer 21 is recessed relative to the second isolation layer 22 in a direction away from the isolation opening. When preparing the light-emitting unit 3, at least part of the material used to prepare the light-emitting unit 3 has a large drop at the edge of the isolation structure 2, and the first isolation layer 21 is concavely arranged, and the material used to prepare the light-emitting unit 3 is difficult to connect on the outside of the isolation structure 2, so that a break is found, forming mutually isolated light-emitting units 3.

[0113] Optionally, in the display area AA, the isolation structure 2 is in a grid shape, and the isolation openings are arranged in an array, so as to improve the light emission uniformity of the light emitting units 3 .

[0114] In some embodiments, at least one of the first isolation layer 21 and the second isolation layer 22 extends into the first opening 42 and is reused as the isolation member 20 , that is, the aforementioned second isolation portion 2b may be composed of a portion of the first isolation layer 21 and / or a portion of the second isolation layer 22 .

[0115] In some embodiments, the first isolation layer 21 includes a first conductive portion 211 and a second conductive portion 212 connected to each other, the first conductive portion 211 is located within the first opening 42 and is reused as at least a portion of the isolation member 20, and the second conductive portion 212 is located outside the first opening 42 and is located on the side of the pixel definition layer 4 facing away from the substrate 1.

[0116] The second conductive portion 212 located outside the first opening 42 can be located in the display area AA and the non-display area NA. The second conductive portion 212 located in the display area AA can enclose a portion of the isolation opening 23 and contact the light-emitting unit 3. The second conductive portion 212 located in the non-display area NA can cover the side of the pixel definition layer 4 away from the substrate 1 and be connected to the external circuit. The first conductive portion 211 is connected to the second conductive portion 212, so that both the first conductive portion 211 and the second conductive portion 212 can be energized to transmit electrical signals.

[0117] In some embodiments, opposite sides of the first conductive portion 211 are in contact with the first planar layer 51 and the encapsulation layer 7, respectively, that is, when the first conductive portion 211 is reused as the entirety of the isolation member 20, the orthographic projection of the second isolation layer 22 on the substrate 1 does not overlap with the orthographic projection of the first conductive portion 211 on the substrate 1. At the first opening 42, the first planar layer 51 and the encapsulation layer 7 are isolated by the first conductive portion 211.

[0118] In some embodiments, opposite sides of the first conductive portion 211 are in contact with the first planar layer 51 and the second isolation layer 22, respectively, that is, the first conductive portion 211 and the second isolation layer 22 are reused as all or part of the isolation member 20, and the orthographic projection of the second isolation layer 22 on the substrate 1 overlaps with the orthographic projection of the first conductive portion 211 on the substrate 1. At the first opening 42, the first planar layer 51 and the encapsulation layer 7 are isolated by the first conductive portion 211 and the second isolation layer 22 that are stacked.

[0119] See also Figure 4 and Figure 5 In some embodiments, the second isolation layer 22 includes a third conductive portion 221 and a fourth conductive portion 222 connected to each other, the third conductive portion 221 is located in the first opening 42 and is reused as at least a portion of the isolation member 20, and the fourth conductive portion 222 is located outside the first opening 42 and is located on the side of the pixel definition layer 4 facing away from the substrate 1.

[0120] The fourth conductive portion 222 located outside the first opening 42 can be located in the display area AA and the non-display area NA, the fourth conductive portion 222 located in the display area AA can enclose a portion of the isolation opening 23, the fourth conductive portion 222 located in the display area AA can extend toward the isolation opening 23 relative to the first isolation layer 21, and the fourth conductive portion 222 located in the non-display area NA can cover the side of the pixel definition layer 4 away from the substrate 1.

[0121] See also Figure 6 and Figure 7In some embodiments, opposite sides of the third conductive portion 221 are in contact with the first planar layer 51 and the encapsulation layer 7, respectively, that is, when the third conductive portion 221 is reused as the entire isolation member 20, the orthographic projection of the first isolation layer 21 on the substrate 1 does not overlap with the orthographic projection of the third conductive portion 221 on the substrate 1. At the first opening 42, the first planar layer 51 and the encapsulation layer 7 are isolated by the third conductive portion 221.

[0122] In some embodiments, the isolation structure 2 also includes a third isolation layer 24, which is disposed on a side of the first isolation layer 21 close to the substrate 1, and at least one of the first isolation layer 21, the second isolation layer 22 and the third isolation layer 24 extends into the first opening and is reused as an isolation member 20.

[0123] At least one of the first isolation layer 21, the second isolation layer 22 and the third isolation layer 24 extends into the first opening and is reused as the isolation member 20, that is, any one of the first isolation layer 21, the second isolation layer 22 and the third isolation layer 24 can be arranged in the first opening 42 and reused as the isolation member 20, any two of them can be arranged in the first opening and reused as the isolation member 20, or all three can be arranged in the first opening and reused as the isolation member 20.

[0124] In some embodiments, in the display area AA, the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the third isolation layer 24 on the substrate 1 .

[0125] In the display area AA, the cross section of the isolation structure 2 may be in the shape of an I. Optionally, the orthographic projection area of ​​the first isolation layer 21 on the substrate 1 is smaller than the orthographic projection area of ​​the third isolation layer 24 on the substrate 1 .

[0126] The cross section of the first isolation layer 21 can be trapezoidal, which increases the size of the isolation opening 23. The cross section of the first isolation layer 21 can be a regular trapezoid, which can stably support the second isolation layer 22 on the one hand, and on the other hand, makes the contact surface area between the first isolation layer 21 and the second isolation layer 22 smaller. The orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the third isolation layer 24 on the substrate 1, so that the third isolation layer 24 can stably support the first isolation layer 21, thereby realizing that the first isolation layer 21 is concavely arranged relative to the second isolation layer 22 in the direction away from the central axis of the isolation opening 23, which facilitates the disconnection of the light-emitting device layer at the isolation structure 2, and the etching waste generated by etching the first isolation layer 21 falls on the third isolation layer 24, which is easy to clean.

[0127] In some embodiments, the third isolation layer 24 includes a fifth conductive portion 231 and a sixth conductive portion 232 connected to each other, the fifth conductive portion 231 is located in the first opening 42 and is reused as at least a portion of the isolation member 20, and the sixth conductive portion 232 is located in the first opening 42 and is located on the side of the pixel definition layer 4 facing away from the substrate 1.

[0128] The sixth conductive portion 232 located outside the first opening 42 can be located in the display area AA and the non-display area NA. The sixth conductive portion 232 located in the display area AA can enclose a portion of the isolation opening 23 and contact the light-emitting unit 3. The sixth conductive portion 232 located in the non-display area NA can cover the side of the pixel definition layer 4 away from the substrate 1 and be connected to the external circuit. The fifth conductive portion 231 is connected to the sixth conductive portion 232, so that both the fifth conductive portion 231 and the sixth conductive portion 232 can be energized to transmit electrical signals.

[0129] In some embodiments, opposite sides of the fifth conductive portion 231 are in contact with the first planar layer 51 and the encapsulation layer 7, respectively, that is, the fifth conductive portion 231 is reused as the entirety of the isolation member 20, and the orthographic projections of the first isolation layer 21 and the second isolation layer 22 on the substrate 1 do not overlap with the orthographic projection of the fifth conductive portion 231 on the substrate 1. At the first opening 42, the first planar layer 51 and the encapsulation layer 7 are isolated by the stacked fifth conductive portion.

[0130] In other embodiments, opposite sides of the fifth conductive portion 231 are in contact with the first flat layer 51 and the first isolation layer 21, respectively, that is, opposite sides of the fifth conductive portion 231 are in contact with the first flat layer 51 and the first isolation layer 21, respectively, that is, the fifth conductive portion 231 and the first isolation layer 21 are reused as all or part of the isolation member 20, and the orthographic projection of the first isolation layer 21 on the substrate 1 overlaps with the orthographic projection of the fifth conductive portion 231 on the substrate 1. At the first opening 42, the first flat layer 51 and the encapsulation layer 7 are isolated by the fifth conductive portion 231 and the first isolation layer 21 that are stacked.

[0131] In some embodiments, the encapsulation layer 7 includes a first encapsulation sublayer 71, which covers the side of the light-emitting device layer facing away from the substrate 1, the side of the isolation structure 2 facing away from the substrate 1, and the side of the isolation member 20 facing away from the substrate 1. The first encapsulation sublayer 71 is an organic material layer, and the first planarizing layer 51 is an organic material layer.

[0132] Compared with inorganic materials, organic materials have better flexibility, so that the first encapsulation sublayer 71 and the first planarization layer 51 have a planarization effect. The first encapsulation sublayer 71 and the first planarization layer 51 are also more likely to absorb water vapor, so the isolation member 20 is provided between the first encapsulation sublayer 71 and the first planarization layer 51 to reduce the flow of water vapor between the two.

[0133] In some embodiments, the encapsulation layer 7 further includes a second encapsulation sublayer 72 . The second encapsulation layer 7 is disposed in the display area AA. The second encapsulation sublayer 72 is located between the first encapsulation sublayer 71 and the light emitting unit 3 .

[0134] The second encapsulation sublayer 72 can be made of an organic material or an inorganic material. The first encapsulation sublayer 71 and the second encapsulation sublayer 72 can be made of the same or different materials. The first encapsulation sublayer 71 and the second encapsulation sublayer 72 are made of different materials, so that the first encapsulation sublayer 71 and the second encapsulation sublayer 72 can have different properties to improve the ability of the display panel 100 to resist water and oxygen.

[0135] In some embodiments, the second encapsulation sublayer 72 includes a plurality of encapsulation portions 721 disposed at intervals, and the orthographic projection of the encapsulation portion 721 on the substrate 1 covers the orthographic projection of the light emitting unit 3 on the substrate 1 .

[0136] The encapsulation part 721 and the light emitting unit 3 may be arranged in a one-to-one correspondence, that is, one encapsulation part 721 is used to encapsulate one light emitting unit 3. The encapsulation part 721 may be arranged entirely within the isolation opening 23, or may partially extend to the outside of the isolation opening 23. The edge of the encapsulation part 721 overlaps the isolation structure 2 to avoid or reduce the formation of a gap between the encapsulation part 721 and the isolation structure 2 through which water and oxygen can pass.

[0137] Compared with the second encapsulation sublayer 72 distributed in the display area AA, the first encapsulation sublayer 71 is distributed in the display area AA and the non-display area NA.

[0138] In some embodiments, the second encapsulation sub-layer 72 is an inorganic material layer.

[0139] Compared with the organic material layer, the inorganic material layer has a better ability to block water and oxygen. Compared with the inorganic material layer, the organic material layer has better flexibility and good film-forming properties. The light-emitting device layer is encapsulated by the organic material layer and the inorganic material layer together to improve the comprehensive ability of the display panel 100 to resist water and oxygen.

[0140] In some embodiments, the encapsulation layer 7 further includes a third encapsulation sublayer 73 , and the third encapsulation sublayer 73 is disposed on a side of the first encapsulation sublayer 71 facing away from the substrate 1 .

[0141] The third encapsulation sublayer 73 can be made of organic or inorganic materials. The first encapsulation sublayer 71, the second encapsulation sublayer 72 and the third encapsulation sublayer 73 can be made of the same or different materials. The third encapsulation sublayer 73 is conducive to improving the water and oxygen isolation capability of the display panel 100 to the light-emitting device layer. The third encapsulation sublayer 73 and the first encapsulation sublayer 71 are made of different materials, so that the third encapsulation sublayer 73 and the first encapsulation sublayer 71 can have different properties to improve the water and oxygen resistance capability of the display panel 100.

[0142] In some embodiments, the third encapsulation sub-layer 73 is an inorganic material layer.

[0143] The material of the third encapsulation sublayer 73 may be the same as that of the first encapsulation sublayer 71 to simplify the manufacturing process.

[0144] In some embodiments, the display panel 100 also includes a first conductive layer, which is disposed on a side of the first flat layer 51 facing the substrate 1, the first conductive layer includes a first signal line 15 located in the non-display area NA, the first flat layer 51 has a third opening 511, and a portion of the isolation structure 2 is located in the third opening 511 and is electrically connected to the first signal line 15.

[0145] The first signal line 15 may be arranged around the display area AA. The first signal line 15, the first flat layer 51 and the isolation member 20 may be formed in sequence. A portion of the isolation material used to prepare the isolation structure 2 falls into the third opening 511, and the portion of the isolation material is in contact with the first signal line 15 exposed from the third opening 511, thereby achieving electrical connection between the isolation structure 2 and the first signal line 15, so that the isolation structure 2 can be used to transmit electrical signals.

[0146] In some embodiments, the isolation member 20 has an orthographic projection on the substrate 1 located in the orthographic projection of the first signal line 15 on the substrate 1, so that the isolation member 20 can shield the electrical signal of the first signal line 15, reduce interference between the first signal line 15 and the electrical signal transmission structure located on the side of the isolation member 20 away from the substrate 1, and the electrical signal transmission structure located on the side of the isolation member 20 away from the substrate 1 can be a touch signal line 82 (trace) electrically connected to the touch unit 81.

[0147] Please refer to Figure 7 and Figure 8 In some embodiments, the orthographic projection of the third opening 511 on the substrate 1 is spaced apart from the orthographic projection of the first opening 42 on the substrate 1 .

[0148] The pixel definition layer 4 may extend into the third opening 511, and the pixel definition layer 4 has a second opening 43 located in the third opening 511, and the first signal line 15 is exposed from the second opening 43. The pixel definition layer 4 extends along the wall surface of the third opening 511, so that the water vapor in the first flat layer 51 cannot be discharged through the third opening 511, and the first opening 42 is arranged on the pixel definition layer 4, so that the water vapor in the first flat layer 51 can be discharged through the first opening 42, so that the third opening 511 and the first opening 42 are arranged at intervals. The third opening 511 and the second opening 43 may be arranged coaxially.

[0149] In some embodiments, the display panel 100 further includes a second planar layer 14 , and the second planar layer 14 is located on a side of the first conductive layer close to the substrate 1 .

[0150] The second planar layer 14 may be prepared first, and the functional layer located on the side of the second planar layer 14 close to the substrate 11 may be planarized, thereby facilitating the preparation of the first conductive layer on the second planar layer 14 .

[0151] Please refer to Fig. 9 In some embodiments, the first conductive layer further includes a fourth opening 151 penetrating the first signal line 15 , and the first planar layer 51 and the second planar layer 14 are in contact with each other through the fourth opening 151 .

[0152] The water vapor in the second flat layer 14 can be discharged to the outside through the fourth opening 151 , or can move into the first flat layer 51 through the fourth opening 151 and then be discharged through the first opening 42 .

[0153] In some embodiments, the orthographic projection of the first opening 42 on the substrate 1 is spaced apart from the orthographic projection of the fourth opening 151 on the substrate 1, thereby avoiding interference between the conductive structure located on the side of the fourth opening 151 close to the substrate 11 and the electrical signal transmission structure located on the side of the first opening 42 away from the substrate 11.

[0154] In some embodiments, the orthographic projections of the plurality of first openings 42 on the substrate 1 and the orthographic projections of the plurality of third openings 511 on the substrate 1 are alternately arranged along the first direction Y; the orthographic projections of the plurality of third openings 511 on the substrate 1 and the plurality of fourth openings 151 are alternately arranged along the first direction Y.

[0155] The plurality of first openings 42 and the plurality of third openings 511 are provided to facilitate the discharge of water vapor from the first flat layer 51 and the second flat layer 14. The plurality of first openings 42 and the plurality of third openings 511 are regularly arranged to avoid or reduce the inability to effectively discharge water vapor from some areas of the first flat layer 51 and the second flat layer 14. Optionally, the plurality of first openings 42 and the plurality of third openings 511 arranged in a row and the plurality of fourth openings 151 and the plurality of third openings 511 arranged in a row may be arranged at intervals along the second direction Z, and the first direction Y and the second direction Z are perpendicular.

[0156] In some embodiments, the light-emitting unit 3 includes a first electrode 32 , a light-emitting portion 31 , and a second electrode 33 which are sequentially stacked in a direction away from the substrate 1 , and an edge of the second electrode 33 overlaps the isolation structure 2 .

[0157] One of the first electrode 32 and the second electrode 33 may be a cathode, and the other may be an anode. The first electrode 32 and the second electrode 33 are respectively connected to the light-emitting unit 3 and are used to drive the light-emitting unit 3 to emit light. The encapsulation portion 721 may cover the side of the second electrode 33 away from the substrate 1. The encapsulation portion 721 may reduce or prevent water and oxygen from entering the light-emitting unit 3, thereby increasing the service life of the light-emitting unit 3. Optionally, the first electrode 32 is an anode, and the second electrode 33 is a cathode.

[0158] In some embodiments, the second electrode 33 is electrically connected to the isolation structure 2 .

[0159] The edge of the second electrode 33 overlaps the first isolation layer 21 , so that the first isolation layer 21 can supply power to the second electrode 33 and also enable the adjacent second electrodes 33 to conduct electricity, thereby forming a surface electrode with full surface conductivity.

[0160] In some other embodiments, the second electrode 33 is electrically connected to the third isolation layer 24. The third isolation layer 24 is made of molybdenum metal; and / or the first isolation layer 21 is made of aluminum metal; and / or the second isolation layer 22 is made of titanium metal.

[0161] In some embodiments, the orthographic projection of the pixel opening 41 on the substrate 1 is located within the orthographic projection range of the isolation opening 23 on the substrate 1 .

[0162] The area of ​​the isolation opening 23 is larger than the area of ​​the pixel opening 41 , which can reduce the influence of the isolation structure 2 on the light emitting viewing angle of the light emitting device layer.

[0163] Optionally, there are multiple pixel openings 41, which are spaced apart, and the isolation structure 2 can be disposed on at least a portion of the pixel defining portion between two adjacent pixel openings 41. Optionally, the isolation structure 2 can be disposed around at least a portion of the pixel openings 41.

[0164] The second aspect of the present application also provides a display panel. Fig.10 The display panel 100 has a display area AA and a non-display area NA, and the non-display area NA is arranged around at least a portion of the display area AA; the display panel 100 includes: a substrate 1, a transistor active layer 134, an organic layer 50, an inorganic layer 40, an auxiliary cathode 20 and a first encapsulation sublayer 71, the transistor active layer 134 is arranged on one side of the substrate; the organic layer 50 is arranged on the side of the transistor active layer 134 away from the substrate; the inorganic layer 40 is arranged on the side of the organic layer 50 away from the substrate 1, and includes a first opening 42 located in the non-display area NA, the first opening 42 exposes the organic layer 50; the auxiliary cathode 20 is located on the side of the inorganic layer 40 away from the substrate 1, and extends into the first opening 42, and the orthographic projection of the first opening 42 on the substrate 1 is located within the orthographic projection of the auxiliary cathode 20 on the substrate 1; the first encapsulation sublayer 71 includes an organic material, and is located on the side of the auxiliary cathode 20 away from the substrate 1; the orthographic projection of the first opening 42 on the substrate 1 is located within the orthographic projection of the first encapsulation sublayer 71 on the substrate 1.

[0165] The transistor active layer 134 is used to form a transistor for controlling the light emission of the light emitting unit 3. The auxiliary cathode 20 can assist the cathode in the light emitting unit 3 in transmitting an electrical signal.

[0166] In the display panel 100 provided in the present application, by setting the first opening 42 in the inorganic layer 40, water vapor in the organic layer 50 can be discharged outward through the first opening 42 during the preparation of the display panel 100; by setting the auxiliary cathode 20 so that the orthographic projection on the substrate 1 at least partially overlaps with the orthographic projection of the first opening 42 on the substrate 1, the auxiliary cathode 20 is arranged between the organic layer 50 and the encapsulation layer 7, so that the auxiliary cathode 20 can isolate the organic layer 50 and the first encapsulation sublayer 71, and avoid contact between the organic layer 50 and the first encapsulation sublayer 71, thereby avoiding or reducing the first flat layer 51 absorbing the liquid preparation during the preparation process, avoiding or reducing the water vapor in the organic layer 50 from entering the first encapsulation sublayer 71 through the first opening 42, and avoiding or reducing display abnormalities of the display panel 100.

[0167] In some embodiments, the organic layer 50 is a first planar layer 51 , and the inorganic layer 40 is a pixel definition layer 4 .

[0168] The first planarization layer 51 can be used to planarize the functional layer located on the side close to the substrate 1 , and the pixel definition layer 4 encloses and forms a pixel opening 41 and a first opening 42 . The pixel opening 41 defines the position, shape and size of the light emitting unit 3 .

[0169] In some embodiments, the auxiliary cathode 20 is an isolation structure 2, which includes a first isolation layer 21 and a second isolation layer 22 that are stacked together. The first isolation layer 21 is arranged on the side of the second isolation layer 22 close to the substrate 1. In the display area AA, the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the second isolation layer 22 on the substrate 1.

[0170] The isolation structure 2 encloses an isolation opening 23 to limit the setting range of the light-emitting device layer. The orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the second isolation layer 22 on the substrate 1, so that the cross-sectional area of ​​the end of the isolation structure 2 away from the substrate 1 is larger, and the cross-sectional area of ​​the end of the isolation structure 2 close to the substrate 1 is smaller. The light-emitting unit 3 can be prepared by the evaporation process through the isolation structure 2. Compared with preparing the light-emitting unit 3 by evaporation of a high-precision metal mask, it is easier to directly prepare the high-precision isolation structure 2, so that the structure of the display panel 100 provided in the present application has low requirements on the preparation process, and the consistency of the prepared display panel 100 is good.

[0171] The third aspect of the present application also provides a method for manufacturing a display panel. The display panel 100 has a display area AA and a non-display area NA. The non-display area NA is disposed around at least a portion of the display area AA. The manufacturing method includes:

[0172] S100, providing a substrate 1, and sequentially disposing a first planar layer 51 and a plurality of first electrodes 32 located in the display area AA on the substrate 1;

[0173] S200, a pixel definition material layer is provided on the first planar layer 51, the pixel definition material layer covers the first electrode 32, and the pixel definition material layer is patterned to obtain a first opening 42 located in the non-display area NA;

[0174] S300, forming an isolation material layer on the pixel definition material layer, wherein a portion of the isolation material layer is located in the first opening 42 to form an isolation member 20;

[0175] S400, patterning the isolation material layer and the pixel definition material layer to obtain an isolation structure 2 and a pixel definition layer 4, wherein the pixel definition layer 4 includes a pixel opening 41 located in the display area AA, and the isolation structure 2 has a plurality of isolation openings 23, the isolation openings 23 are connected to the pixel openings 41, and the first electrode 32 is exposed from the pixel openings 41;

[0176] S500, a portion of a light-emitting device layer is provided through an isolation structure 2, wherein the light-emitting device layer includes a plurality of light-emitting units 3 located in the display area AA, and the light-emitting units 3 are provided in the isolation opening 23 and the pixel opening 41;

[0177] S600 , forming a portion of the encapsulation layer 7 on a side of the isolation structure 2 facing away from the substrate 1 , and the isolation member 20 is disposed between the first planar layer 51 and the encapsulation layer 7 .

[0178] In S200, the pixel definition material layer is used to prepare the pixel definition layer 4. The pixel definition material layer can be patterned by a dry etching process so that the first planar layer 51 is exposed from the first opening 42. Between S200 and S300, the first planar layer 51 can also be dried so that the water vapor in the first planar layer 51 is discharged from the first opening 42.

[0179] In S400, the isolation material layer and the pixel definition material layer may be patterned by wet etching and dry etching processes to obtain the desired isolation structure 2 and pixel definition layer 4. The isolation material layer and the pixel definition material layer located in the non-display area NA do not need to form the pixel opening 41 and the isolation opening 23, and a photoresist may be provided to cover the isolation material layer and the pixel definition material layer located in the non-display area NA. After the isolation structure 2 and the pixel definition layer 4 are prepared, the photoresist is removed.

[0180] The etching solution used in the process of forming the isolation structure 2, the preparation of the light-emitting unit 3 to remove excess light-emitting material, and the photoresist preparation are all blocked by the isolation member 20, thereby preventing the preparation from entering the first flat layer 51, thereby preventing or reducing the water vapor in the prepared display panel 100 from entering the encapsulation layer 7 and the light-emitting unit 3 in turn from the first flat layer 51, thereby improving the service life of the light-emitting unit 3.

[0181] In some embodiments, S100 includes:

[0182] A first electrode material layer is disposed on the first planar layer 51 , and the first electrode material layer is patterned to obtain a plurality of spaced first electrodes 32 .

[0183] In S500, the other parts of the light-emitting unit 3 except the first electrode 32 are prepared, and light-emitting units 3 of different colors can be prepared in steps. For example, the first light-emitting material is evaporated by an evaporation process, and the light-emitting material located in the first isolation opening 23 is retained to form a first light-emitting unit 3 for emitting a first color of light, and the light-emitting material in other isolation openings 23 is removed, and then the second light-emitting material is evaporated by an evaporation process, and the light-emitting material located in the second isolation opening 23 is retained to form a first light-emitting unit 3 for emitting a second color of light, and the light-emitting material in other isolation openings 23 is removed, and so on, until the desired type of light-emitting unit 3 is prepared.

[0184] In some embodiments, S200 includes:

[0185] S210 , disposing a pixel definition material layer on the first planar layer 51 , wherein the pixel definition material layer covers the first electrode 32 ;

[0186] S220 , patterning the pixel definition material layer to obtain a first opening 42 and a second opening 43 located in the non-display area NA, a portion of the first planar layer 51 is exposed from the first opening 42 , and a portion of the first signal line 15 located in the substrate 1 is exposed from the second opening 43 .

[0187] When the first opening 42 is formed, the second opening 43 may also be formed simultaneously, so that the isolation material layer formed in S300 can fall within the first opening 42 and the second opening 43 .

[0188] The fourth aspect of the present application also provides a display device. Figure 1 and Figure 2 , the display device includes the display panel 100 of any of the first and second embodiments, or the display panel 100 prepared by any of the third embodiments. Since the display device provided by the fourth embodiment of the present application includes the display panel 100 of any of the first and second embodiments, or the display panel 100 prepared by any of the third embodiments, the display device provided by the fourth embodiment of the present application has the beneficial effects of the display panel 100 of any of the first and second embodiments, or the display panel 100 prepared by any of the third embodiments, which will not be repeated here.

[0189] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0190] According to the embodiments of the present application as above, these embodiments do not describe all the details in detail, nor do they limit the invention to specific embodiments. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel has a display area and a non-display area, and the non-display area is arranged around at least a portion of the display area; the display panel includes: substrate; A first flat layer is disposed on one side of the substrate; A pixel definition layer, disposed on a side of the first planar layer away from the substrate, the pixel definition layer comprising a pixel opening located in the display area and a first opening located in the non-display area; An isolation structure, located on a side of the pixel definition layer away from the substrate, the isolation structure having a plurality of isolation openings, the isolation openings being connected to the pixel openings; a light emitting device layer, comprising a plurality of light emitting units located in the display area, wherein the light emitting units are arranged in the isolation opening and the pixel opening; an encapsulation layer, located on a side of the isolation structure away from the substrate; The isolating member is located in the non-display area, the orthographic projection of the isolating member on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate, and the isolating member is arranged between the first planar layer and the encapsulation layer.

2. The display panel according to claim 1, characterized in that: The separator comprises an inorganic material; Preferably, the isolation structure includes a first isolation portion and a second isolation portion connected to each other, the first isolation portion is located on a side of the pixel definition layer away from the substrate, the second isolation portion is located in the first opening, and the second isolation portion is reused as the isolation member.

3. The display panel according to claim 1, characterized in that: The isolation structure comprises a first isolation layer and a second isolation layer which are stacked, wherein the first isolation layer is arranged on a side of the second isolation layer close to the substrate, and an orthographic projection of the first isolation layer on the substrate is located within an orthographic projection of the second isolation layer on the substrate; Preferably, in the display area, an orthographic projection area of ​​a surface of the first isolation layer away from the substrate on the substrate is smaller than an orthographic projection area of ​​a surface of the second isolation layer close to the substrate on the substrate; Preferably, at least one of the first isolation layer and the second isolation layer extends into the first opening and is reused as the isolation member.

4. The display panel according to claim 3, characterized in that: The first isolation layer comprises a first conductive portion and a second conductive portion connected to each other, the first conductive portion is located in the first opening and reused as at least a part of the isolation member, and the second conductive portion is located outside the first opening and located on a side of the pixel definition layer away from the substrate; Preferably, opposite sides of the first conductive portion are in contact with the first planar layer and the packaging layer respectively; Preferably, opposite sides of the first conductive portion are in contact with the first planar layer and the second isolation layer respectively.

5. The display panel according to claim 3, characterized in that: The second isolation layer comprises a third conductive portion and a fourth conductive portion connected to each other, the third conductive portion is located in the first opening and reused as at least a part of the isolation member, and the fourth conductive portion is located outside the first opening and located on a side of the pixel definition layer away from the substrate; Preferably, two opposite sides of the third conductive portion are in contact with the first planar layer and the packaging layer respectively.

6. The display panel according to claim 3, characterized in that: The isolation structure also includes a third isolation layer, which is arranged on a side of the first isolation layer close to the substrate, and at least one of the first isolation layer, the second isolation layer and the third isolation layer extends into the first opening and is reused as the isolation member; in the display area, the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the third isolation layer on the substrate.

7. The display panel according to claim 6, characterized in that: The third isolation layer includes a fifth conductive portion and a sixth conductive portion connected to each other, the fifth conductive portion is located in the first opening and reused as at least a part of the isolation member, and the sixth conductive portion is located in the first opening and located on a side of the pixel definition layer away from the substrate; Preferably, two opposite sides of the fifth conductive portion are in contact with the first planar layer and the packaging layer respectively; Preferably, two opposite sides of the fifth conductive portion are in contact with the first planar layer and the first isolation layer respectively.

8. The display panel according to claim 1, characterized in that: The encapsulation layer includes a first encapsulation sublayer, the first encapsulation sublayer covers a side of the light-emitting device layer away from the substrate, a side of the isolation structure away from the substrate, and a side of the isolation member away from the substrate; the first encapsulation sublayer includes an organic material, and the first planar layer includes an organic material; Preferably, the encapsulation layer further comprises a second encapsulation sublayer, the second encapsulation sublayer is arranged in the display area, and the second encapsulation sublayer is located between the first encapsulation sublayer and the light-emitting unit; Preferably, the second encapsulation sublayer comprises a plurality of encapsulation parts arranged at intervals, and the orthographic projection of the encapsulation part on the substrate covers the orthographic projection of the light-emitting unit on the substrate; Preferably, the second encapsulation sublayer is an inorganic material layer.

9. The display panel according to claim 1, characterized in that: The display panel further includes a first conductive layer, the first conductive layer is disposed on a side of the first flat layer facing the substrate, the first conductive layer includes a first signal line located in the non-display area, the first flat layer has a third opening, a portion of the isolation structure is located in the third opening and is electrically connected to the first signal line; Preferably, the orthographic projection of the third opening on the substrate is arranged at a distance from the orthographic projection of the first opening on the substrate.

10. The display panel according to claim 9, characterized in that: The display panel further includes a second flat layer, which is located on a side of the first conductive layer close to the substrate; Preferably, the first conductive layer further comprises a fourth opening penetrating the first signal line, and the first flat layer and the second flat layer are in contact with each other through the fourth opening; Preferably, the orthographic projection of the first opening on the substrate is spaced apart from the orthographic projection of the fourth opening on the substrate; Preferably, the orthographic projections of the plurality of first openings on the substrate and the orthographic projections of the plurality of third openings on the substrate are alternately arranged along the first direction; The plurality of third openings are alternately arranged at intervals along the first direction on the orthographic projection of the substrate and the plurality of fourth openings.

11. The display panel according to claim 1, characterized in that: The light-emitting unit includes a first electrode, a light-emitting portion, and a second electrode which are sequentially stacked in a direction away from the substrate, and the second electrode is overlapped with the isolation structure.

12. A display panel, characterized in that: The display panel has a display area and a non-display area, and the non-display area is arranged around at least a portion of the display area; the display panel includes: substrate; A transistor active layer is disposed on one side of the substrate; An organic layer is disposed on a side of the transistor active layer away from the substrate; an inorganic layer, disposed on a side of the organic layer away from the substrate, and comprising a first opening located in the non-display area, wherein the first opening exposes the organic layer; an auxiliary cathode, located on a side of the inorganic layer away from the substrate and extending into the first opening, wherein an orthographic projection of the first opening on the substrate is located within an orthographic projection of the auxiliary cathode on the substrate; The first encapsulation sublayer includes an organic material and is located on a side of the auxiliary cathode facing away from the substrate; the orthographic projection of the first opening on the substrate is located within the orthographic projection of the first encapsulation sublayer on the substrate.

13. The display panel according to claim 12, characterized in that: The organic layer is a first planarization layer, and the inorganic layer is a pixel definition layer; Preferably, the auxiliary cathode is an isolation structure, which includes a first isolation layer and a second isolation layer which are stacked together, the first isolation layer is arranged on a side of the second isolation layer close to the substrate, and in the display area, the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate.

14. A method for preparing a display panel, characterized in that: The display panel has a display area and a non-display area, and the non-display area is arranged around at least a portion of the display area; the preparation method includes: Providing a substrate, on which a first planar layer and a plurality of first electrodes located in the display area are sequentially arranged; Disposing a pixel definition material layer on the first planar layer, the pixel definition material layer covering the first electrode, and patterning the pixel definition material layer to obtain a first opening located in the non-display area; forming an isolation material layer on the pixel definition material layer, wherein a portion of the isolation material layer is located in the first opening to form an isolation member; The isolation material layer and the pixel definition material layer are patterned to obtain an isolation structure and a pixel definition layer, wherein the pixel definition layer includes a pixel opening located in the display area, and the isolation structure has a plurality of isolation openings, wherein the isolation openings are connected to the pixel openings, and the first electrode is exposed from the pixel openings.

15. A display device, characterized in that: A display panel comprising the display panel as claimed in any one of claims 1 to 13, or a display panel prepared by the preparation method as claimed in claim 14.

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