Display assembly, manufacturing method thereof and display device

Abstract

The invention is suitable for the technical field of display equipment, and provides a display assembly, a manufacturing method thereof and a display device.The manufacturing method of the display assembly comprises the steps that an isolation layer is arranged on one side of a substrate, and the isolation layer covers a display area and a non-display area; etching the isolation layer to form a first isolation opening in the display area and form an accommodating groove in the non-display area; a first light-emitting function layer and a first sub-packaging material layer are arranged in the display area and the non-display area, and at least part of the first light-emitting function layer is arranged in the containing groove in the non-display area. The adhesive force between the first light-emitting functional layer and the isolation layer is increased, the first light-emitting functional layer is prevented from being separated from the isolation layer, and the display effect of the display assembly is not affected.

Description

Technical Field

[0001] The present application belongs to the technical field of display devices, and in particular, relates to a display component and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, OLED (Organic Light Emitting Diode) display components have been widely used due to their advantages such as lighter weight, higher brightness, lower power consumption, faster response and higher definition.

[0003] During the manufacturing process of the display component, the film layer in the non-display area may peel off in a large area, and the peeled film layer may enter the display area, affecting the normal manufacturing of the display area and further affecting the display effect of the display component. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a display component and a manufacturing method thereof, and a display device to solve the problem that the film layer located in the current non-display area may peel off on a large scale, and the peeled film layer may enter the display area, affecting the normal manufacturing of the display area and further affecting the display effect of the display component.

[0005] A first aspect of an embodiment of the present application provides a method for manufacturing a display component, comprising: disposing an isolation layer on one side of a substrate, the isolation layer covering a display area and a non-display area; etching the isolation layer to form a first isolation opening in the display area and to form a receiving groove in the non-display area; disposing a first light-emitting functional layer and a first sub-packaging material layer in the display area and the non-display area, wherein in the non-display area, the first light-emitting functional layer is at least partially disposed in the receiving groove.

[0006] The manufacturing method of the above-mentioned display component etches the isolation layer to form a receiving groove in the non-display area, and in the process of manufacturing the first light-emitting layer, the first light-emitting functional layer is at least partially arranged in the receiving groove. In this way, a certain step difference is formed between the portion of the first light-emitting functional layer extending into the receiving groove and the portion not extending into the receiving groove, thereby increasing the adhesion between the first light-emitting functional layer and the isolation layer, making it difficult for the first light-emitting functional layer to be peeled off, and the first light-emitting functional layer can also fit with the inner wall of the receiving groove, thereby increasing the contact area between the first light-emitting functional layer and the isolation layer, further increasing the adhesion between the first light-emitting functional layer and the isolation layer, avoiding the separation of the first light-emitting functional layer and the isolation layer, and thus avoiding the peeled first light-emitting functional layer from entering the display area and affecting the normal manufacturing of the display area, thereby not affecting the display effect of the display component.

[0007] In one embodiment, in the non-display area, the first sub-encapsulation material layer is at least partially disposed in the receiving groove. By disposing the first sub-encapsulation material layer in the non-display area at least partially in the receiving groove, the adhesion between the first sub-encapsulation material layer and the isolation layer can be increased, and since the first sub-encapsulation material layer is stacked on the first light-emitting functional layer, the first light-emitting functional layer can be prevented from being separated from the isolation layer.

[0008] In one embodiment, after the step of setting the first light-emitting functional layer and the first sub-encapsulation material layer in the display area and the non-display area, the manufacturing method further includes: etching and removing part of the first light-emitting functional layer and the first sub-encapsulation material layer located in the display area to form a first light-emitting layer and a first sub-encapsulation unit at least partially located in the first isolation opening; setting a second light-emitting functional layer and a second sub-encapsulation material layer in the display area and the non-display area, and in the non-display area, the second light-emitting functional layer is at least partially set in the receiving groove. In the manufacturing process of the second light-emitting layer, the second light-emitting functional layer is at least partially set in the receiving groove, which increases the adhesion between the second light-emitting functional layer and the isolation layer, making it difficult for the second light-emitting functional layer to be peeled off, and the second light-emitting functional layer can also fit with the inner wall of the receiving groove, which increases the contact area between the second light-emitting functional layer and the isolation layer, further increases the adhesion between the second light-emitting functional layer and the isolation layer, and avoids the second light-emitting functional layer from separating from the isolation layer.

[0009] In one embodiment, in the non-display area, the second sub-encapsulation material layer is at least partially disposed in the receiving groove. By disposing the second sub-encapsulation material layer in the non-display area at least partially in the receiving groove, the adhesion between the second sub-encapsulation material layer and the isolation layer can be increased, and since the second sub-encapsulation material layer is stacked on the second light-emitting functional layer, the second light-emitting functional layer can also be prevented from being separated from the isolation layer.

[0010] In one embodiment, while etching the isolation layer to form a first isolation opening in the display area, a second isolation opening is also formed in the display area. After the step of setting a second light-emitting functional layer and a second sub-packaging material layer in the display area and the non-display area, the manufacturing method further includes: etching and removing part of the second light-emitting functional layer and the second sub-packaging material layer located in the display area to form a second light-emitting layer and a second sub-packaging unit at least partially located in the second isolation opening; etching and removing the first light-emitting functional layer, the first sub-packaging material layer, the second light-emitting functional layer and the second sub-packaging material layer located in the non-display area.

[0011] In one embodiment, after the step of etching away the first light-emitting functional layer, the first sub-packaging material layer, the second light-emitting functional layer and the second sub-packaging material layer located in the non-display area, the manufacturing method further includes: etching the isolation layer to form a third isolation opening in the display area, and removing the isolation layer in the non-display area at the same time; setting a third light-emitting functional layer and a third sub-packaging material layer in the display area; etching away part of the third light-emitting functional layer and the third sub-packaging material layer located in the display area to form a third light-emitting layer and a third sub-packaging unit that are at least partially located in the third isolation opening.

[0012] A second aspect of an embodiment of the present application provides a display component, comprising at least one display screen, wherein the display screen comprises a display area and a non-display area, wherein the non-display area is located on at least one side of the display area and is adjacent to the display area, and the display component comprises a substrate, an isolation layer, and a light-emitting layer stacked in sequence, wherein a receiving groove is provided on the isolation layer in the non-display area, and the light-emitting layer is at least partially disposed in the receiving groove.

[0013] The above-mentioned display component is provided with a receiving groove on the isolation layer in the non-display area, and the light-emitting layer is at least partially provided in the receiving groove. In this way, a certain step difference is formed between the part of the light-emitting layer extending into the receiving groove and the part not extending into the receiving groove, thereby increasing the adhesion between the light-emitting layer and the isolation layer, making it difficult for the light-emitting layer to be peeled off. In addition, the light-emitting layer can also fit with the inner wall of the receiving groove, thereby increasing the contact area between the light-emitting layer and the isolation layer, further increasing the adhesion between the light-emitting layer and the isolation layer, avoiding separation of the light-emitting layer and the isolation layer, and thus avoiding the problem that the peeled light-emitting layer enters the display area and affects the normal production of the display area, thereby not affecting the display effect of the display component.

[0014] In one embodiment, the receiving groove penetrates the isolation layer in a direction perpendicular to the surface of the substrate. By making the receiving groove penetrate the isolation layer, the recess of the receiving groove is deeper, the light-emitting layer can go deeper into the receiving groove, and the step difference between the part of the light-emitting layer extending into the receiving groove and the part not extending into the receiving groove can be increased, thereby increasing the adhesion between the light-emitting layer and the isolation layer, making it difficult for the light-emitting layer to be peeled off.

[0015] In one embodiment, along a direction perpendicular to the surface of the substrate, the depth dimension of the receiving groove is greater than the thickness dimension of the light-emitting layer. By making the depth dimension of the receiving groove greater than the thickness dimension of the light-emitting layer, the concave structure on the light-emitting layer can be completely arranged in the receiving groove in the thickness direction thereof, which is conducive to increasing the adhesion between the light-emitting layer and the isolation layer.

[0016] In one embodiment, the display component further comprises an encapsulation layer, the encapsulation layer is arranged on a side of the light-emitting layer away from the isolation layer, and the encapsulation layer is at least partially arranged in the receiving groove. By making the encapsulation layer on the side of the light-emitting layer away from the isolation layer at least partially arranged in the receiving groove, the adhesion between the encapsulation layer and the light-emitting layer can be increased, so that the encapsulation effect of the encapsulation layer is better, and at the same time, the encapsulation layer can be prevented from separating from the light-emitting layer, thereby preventing the peeled encapsulation layer from entering the display area and affecting the normal production of the display area.

[0017] In one embodiment, along a direction perpendicular to the surface of the substrate, the depth dimension of the receiving groove is smaller than the thickness dimension of the encapsulation layer. By making the depth dimension of the receiving groove smaller than the thickness dimension of the encapsulation layer, the encapsulation layer can completely fill the receiving groove, so that the encapsulation layer can better achieve the protective effect of isolating the external water vapor, and will not affect the subsequent processing and manufacturing process.

[0018] In one embodiment, the isolation layer is provided with a plurality of the receiving grooves, and the receiving grooves are arranged at intervals from each other. By providing a plurality of receiving grooves on the isolation layer, multiple structures at different positions on the light-emitting layer can be at least partially arranged in the receiving grooves, thereby increasing the adhesion between the light-emitting layer as a whole and the isolation layer, and preventing the light-emitting layer from being separated from the isolation layer as a whole.

[0019] In one embodiment, the receiving grooves are arranged in rows along a first direction and in columns along a second direction, the first direction and the second direction are both parallel to the surface of the substrate, and the second direction intersects the first direction. By arranging the receiving grooves in an array along the first direction and the second direction, the receiving grooves on the light-emitting layer are arranged more uniformly, which makes the adhesion between the light-emitting layer and the isolation layer more uniform, which is conducive to reducing the stress concentration problem between the light-emitting layer and the isolation layer.

[0020] In one embodiment, along the direction perpendicular to the substrate surface, the shape of the orthographic projection outline of the receiving groove on the substrate is an axisymmetric figure; preferably, along the direction perpendicular to the substrate surface, the shape of the orthographic projection outline of the receiving groove on the substrate is a polygon, a circle, an ellipse or a ring. In this way, it is not only easy to make and shape the receiving groove, but also conducive to at least partially setting the light-emitting layer in the receiving groove.

[0021] In one embodiment, along a direction perpendicular to the surface of the substrate, the orthographic projection profile of the receiving groove on the substrate has a main body region and at least one protruding region extending from the main body region along the first direction and / or the second direction to a side away from the main body region. In this way, the main body region and the protruding region of the receiving groove can respectively accommodate different parts of the light-emitting layer, which can further increase the adhesion between the light-emitting layer and the isolation layer.

[0022] In one embodiment, the symmetry axis of the protruding area extending along the first direction coincides with the symmetry axis of the main body area in the first direction; the symmetry axis of the protruding area extending along the second direction coincides with the symmetry axis of the main body area in the second direction. This arrangement makes the overall shape of the receiving groove more regular, which is not only convenient for the production and molding of the receiving groove, but also helps to improve the force uniformity between the isolation layer and the light-emitting layer.

[0023] In one embodiment, the isolation layer includes an isolation body and a blocking portion which are stacked in sequence, and the isolation body and the blocking portion jointly define the receiving groove.

[0024] In one embodiment, the orthographic projection of the isolating body on the substrate is located within the orthographic projection of the blocking portion on the substrate; the light-emitting layer at least partially contacts the side wall of the isolating body; preferably, the light-emitting layer at least partially contacts the surface of the blocking portion facing the substrate. Such a design can increase the number and area of ​​contact surfaces between the light-emitting layer and the receiving groove, further increase the adhesion between the light-emitting layer and the isolating layer, and prevent the light-emitting layer from separating from the isolating layer.

[0025] In one embodiment, the isolation layer further includes a base portion, the base portion is located on a side of the isolation body close to the substrate; the orthographic projection of the isolation body on the substrate is located within the orthographic projection of the base portion on the substrate. Such a design can facilitate the processing and molding of the isolation layer.

[0026] A third aspect of an embodiment of the present application provides a display device, comprising a display panel, wherein the display panel is made from a display component prepared by the manufacturing method of the display component described in the first aspect; or is made from the display component described in the second aspect.

[0027] It can be understood that the beneficial effects of the third aspect mentioned above can be found in the relevant descriptions of the first and second aspects mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 is a partial structural cross-sectional view of a display assembly in the related art;

[0030] Figure 2 is a flow chart of a method for manufacturing a display component provided by an embodiment of the present application;

[0031] Figure 3 is a schematic diagram of the overall structure of a display assembly provided by an embodiment of the present application;

[0032] Figure 4 It is a structural schematic diagram of a display assembly during the manufacturing process provided by an embodiment of the present application;

[0033] Figure 5 It is a structural schematic diagram of a display assembly during the manufacturing process provided by an embodiment of the present application;

[0034] Figure 6 It is a structural schematic diagram of a display assembly during the manufacturing process provided by an embodiment of the present application;

[0035] Figure 7 is a structural schematic diagram of a display assembly during manufacturing provided by another embodiment of the present application;

[0036] Figure 8 is a structural schematic diagram of a display assembly during manufacturing provided by another embodiment of the present application;

[0037] Fig. 9 is a structural schematic diagram of a display assembly during manufacturing provided by yet another embodiment of the present application;

[0038] Fig.10 is a structural schematic diagram of a display assembly during manufacturing provided by yet another embodiment of the present application;

[0039] Fig.11 is a structural schematic diagram of a display assembly during manufacturing provided by yet another embodiment of the present application;

[0040] Fig.12 is an enlarged schematic diagram of a local structure of a display assembly provided by an embodiment of the present application;

[0041] Fig.13 It is a schematic diagram of the structure of an isolation layer in a display assembly provided by an embodiment of the present application;

[0042] Fig.14 is a schematic structural diagram of an isolation layer in a display assembly provided by another embodiment of the present application;

[0043] Fig.15 is a schematic structural diagram of an isolation layer in a display assembly provided in yet another embodiment of the present application;

[0044] Fig.16 is a schematic structural diagram of an isolation layer in a display assembly provided in yet another embodiment of the present application;

[0045] Fig.17 yes Fig.16 An enlarged schematic diagram of the structure of the middle receiving tank;

[0046] Fig.18 is a schematic structural diagram of an isolation layer in a display assembly provided in yet another embodiment of the present application;

[0047] Fig.19 yes Fig.18 An enlarged schematic diagram of the structure of the middle receiving tank;

[0048] Fig. 20 is a schematic structural diagram of an isolation layer in a display assembly provided in yet another embodiment of the present application;

[0049] Fig.21 It is a schematic diagram of the structure of a display device provided by an embodiment of the present application.

[0050] Figure Number:

[0051] 10. Display device;

[0052] 100. Display component;

[0053] 110. Substrate;

[0054] 120, isolation layer, 121, first isolation opening, 122, second isolation opening, 123, third isolation opening, 124, receiving groove, 1241, main body area, 1242, protruding area, 125, isolation body, 126, blocking part, 127, base part;

[0055] 130, light-emitting layer, 131, first light-emitting unit, 1311, first anode, 1312, first light-emitting layer, 1313, first cathode, 132, second light-emitting unit, 1321, second anode, 1322, second light-emitting layer, 1323, second cathode, 133, third light-emitting unit, 1331, third anode, 1332, third light-emitting layer, 1333, third cathode;

[0056] 140, encapsulation layer, 141, first sub-encapsulation unit, 142, second sub-encapsulation unit, 143, third sub-encapsulation unit;

[0057] 150, a first metal layer;

[0058] 160, second metal layer;

[0059] 170, pixel defining layer, 171, pixel opening;

[0060] 180, planarization layer;

[0061] AA, display area, NA, non-display area;

[0062] x, first direction, y, second direction. DETAILED DESCRIPTION

[0063] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0064] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0065] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0066] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0067] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0068] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways. "Multiple" means two or more.

[0069] like Figure 1 As shown, the display component 1 in the related art includes a substrate 11, a first metal layer 12, a second metal layer 13, a pixel defining layer 14, an isolation layer 15, a light-emitting layer 17 and a packaging layer 18 which are stacked in sequence. On one side of the second metal layer 13, a planarization layer 16 is also provided thereon. During the manufacturing process of the display component 1, the light-emitting layer 17 and the packaging layer 18 located in the non-display area may peel off over a large area. After peeling, the light-emitting layer 17 and the packaging layer 18 may enter the display area, affecting the normal manufacturing of the display area, and further affecting the display effect of the display component 1.

[0070] To at least partially address the above issues, see Figures 2 to 11 The present application embodiment provides a method for manufacturing a display assembly 100, the manufacturing method comprising the following steps:

[0071] S102 , disposing an isolation layer 120 on one side of the substrate 110 , wherein the isolation layer 120 covers the display area AA and the non-display area NA.

[0072] Among them, Figure 3 As shown, the display area AA is an area in the display component 100 that has an image display function. The user can observe the image displayed by the display area AA from the light-emitting side of the display component 100. The display area AA displays the image by arranging a plurality of light-emitting units in a pixel arrangement structure in the display area AA. The non-display area NA is an area in the display component 100 that is used for component arrangement, line connection arrangement, etc. The non-display area NA usually does not have an image display function. Specifically, the display area AA may be rectangular, the non-display area NA may be annular, the non-display area NA may be arranged around the display area AA, the non-display area NA may also be rectangular, the non-display area NA may also be located on at least one side of the display area AA, and the display area AA and the non-display area NA are adjacent to each other.

[0073] Of course, the shapes and arrangements of the display area AA and the non-display area NA include but are not limited to the above examples. For example, when the display assembly 100 is used for a wearable device worn on a user, the display area AA may have a circular shape like a watch; when the display assembly 100 is used for display on a vehicle, the display area AA and the non-display area NA may have, for example, a circular, polygonal or other similar shapes. A plurality of light-emitting units emitting light of different colors are provided in the display area AA, and the light-emitting unit is characterized as the smallest unit for emitting light.

[0074] The isolation layer 120 may be a single-layer structure made of an inorganic material or an organic material, or a stacked-layer structure made of at least one of an inorganic material or an organic material, which is not limited here.

[0075] S104 , etching the isolation layer 120 to form a first isolation opening 121 in the display area AA, and forming a receiving groove 124 in the non-display area NA.

[0076] Combination Figure 3 and Figure 4 , the isolation layer 120 is etched to remove the material at a portion of the isolation layer 120, so as to form a first isolation opening 121 in the display area AA and a receiving groove 124 in the non-display area NA. The specific shape, number, size, etc. of the first isolation opening 121 and the receiving groove 124 are not limited.

[0077] S106 , disposing a first light-emitting functional layer and a first sub-encapsulation material layer in the display area AA and the non-display area NA. In the non-display area NA, the first light-emitting functional layer is at least partially disposed in the receiving groove 124 .

[0078] like Figure 5 As shown, the first light-emitting functional layer is at least partially disposed in the receiving groove 124, that is, in the direction perpendicular to the surface of the substrate 110, the first light-emitting functional layer corresponding to the position of the receiving groove 124 may have only a part of its structure disposed in the receiving groove 124, and the remaining part of the structure protrudes out of the receiving groove 124, or the first light-emitting functional layer corresponding to the position of the receiving groove 124 may be completely disposed in the receiving groove 124 in the direction perpendicular to the surface of the substrate 110. The first sub-encapsulation material layer corresponding to the position of the receiving groove 124 may be at least partially disposed in the receiving groove 124, or may completely protrude out of the receiving groove 124, which is not limited here.

[0079] The display assembly 100 in the embodiment of the present application may include multiple display screens. After the display assembly 100 is manufactured, the display assembly 100 may be cut to separate the display screens from each other. The specific number, size, and arrangement of the display screens are not limited here.

[0080] The manufacturing method of the display component 100 of the embodiment of the present application etches the isolation layer 120 to form a receiving groove 124 in the non-display area NA, and in the process of manufacturing the first light-emitting layer 1312, the first light-emitting functional layer is at least partially arranged in the receiving groove 124. In this way, a certain step difference is formed between the portion of the first light-emitting functional layer extending into the receiving groove 124 and the portion not extending into the receiving groove 124, thereby increasing the adhesion between the first light-emitting functional layer and the isolation layer 120, making it difficult for the first light-emitting functional layer to be peeled off, and the first light-emitting functional layer can also fit with the inner wall of the receiving groove 124, thereby increasing the contact area between the first light-emitting functional layer and the isolation layer 120, further increasing the adhesion between the first light-emitting functional layer and the isolation layer 120, avoiding the first light-emitting functional layer from separating from the isolation layer 120, and thus avoiding the peeled first light-emitting functional layer from entering the display area AA, affecting the normal manufacturing of the display area AA, and not affecting the display effect of the display component 100.

[0081] like Figure 4 and Figure 5 As shown, in some embodiments, optionally, in the non-display area NA, the first sub-encapsulation material layer is at least partially disposed in the receiving groove 124 .

[0082] By at least partially disposing the first sub-packaging material layer of the non-display area NA in the receiving groove 124, the adhesion between the first sub-packaging material layer and the isolation layer 120 can be increased. In addition, since the first sub-packaging material layer is stacked on the first light-emitting functional layer, the separation of the first light-emitting functional layer and the isolation layer 120 can also be avoided.

[0083] Exemplarily, after step S106, the method for manufacturing the display assembly 100 further includes the following steps:

[0084] S108 , etching and removing a portion of the first light-emitting function layer and the first sub-encapsulation material layer located in the display area AA to form a first light-emitting layer 1312 and a first sub-encapsulation unit 141 that are at least partially located in the first isolation opening 121 .

[0085] The first light-emitting functional layer may include a hole material layer, an electron material layer, an electrode material layer, etc., to form a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, a cathode layer, etc. in the first isolation opening 121 .

[0086] like Figure 6 As shown, part of the first light-emitting functional layer and the first sub-packaging material layer located in the display area AA are etched to remove the material at some positions on the part of the first light-emitting functional layer and the first sub-packaging material layer, so as to form a first light-emitting layer 1312 and a first sub-packaging unit 141 in the first isolation opening 121.

[0087] like Figures 4 to 11 As shown, on this basis, the manufacturing method may further include the following steps: an electrode material layer, such as an anode, is provided on one side of the substrate 110, and the electrode material layer is etched to form a first anode 1311, a second anode 1321, a third anode 1331, etc. in the display area AA, and then a pixel defining material layer is provided on one side of the substrate 110, and the pixel defining material layer is etched to form a pixel defining layer 170 in the display area AA, wherein the pixel defining layer 170 defines a plurality of pixel openings 171, and the first anode 1311, the second anode 1321, and the third anode 1331 are at least partially exposed from the position of the pixel opening 171. An electrode material layer, such as a cathode, is provided on one side of the substrate 110, and the electrode material layer is etched to form a first cathode 1313, a second cathode 1323, and a third cathode 1333 in the display area AA. The first light emitting layer 1312 and the first cathode 1313 are stacked on the first anode 1311 to form a first light emitting unit 131, and the first sub-packaging unit 141 packages the first light emitting unit 131.

[0088] S110 , disposing a second light emitting functional layer and a second sub-encapsulation material layer in the display area AA and the non-display area NA. In the non-display area NA, the second light emitting functional layer is at least partially disposed in the receiving groove 124 .

[0089] like Figure 7 As shown, the second light-emitting functional layer is at least partially disposed in the receiving groove 124, that is, in the direction perpendicular to the surface of the substrate 110, the second light-emitting functional layer corresponding to the position of the receiving groove 124 may have only a part of its structure disposed in the receiving groove 124, and the remaining part of the structure protrudes out of the receiving groove 124, or the first and second light-emitting functional layers corresponding to the position of the receiving groove 124 in the direction perpendicular to the surface of the substrate 110 may be completely disposed in the receiving groove 124. The second sub-encapsulation material layer corresponding to the position of the receiving groove 124 may be at least partially disposed in the receiving groove 124, or may completely protrude out of the receiving groove 124, which is not limited here.

[0090] like Figure 7 As shown, in some embodiments, optionally, in the non-display area NA, the second sub-encapsulation material layer is at least partially disposed in the receiving groove 124 .

[0091] By at least partially disposing the second sub-packaging material layer of the non-display area NA in the receiving groove 124, the adhesion between the second sub-packaging material layer and the isolation layer 120 can be increased. In addition, since the second sub-packaging material layer is stacked on the second light-emitting functional layer, the second light-emitting functional layer and the isolation layer 120 can be prevented from being separated.

[0092] See also Figures 7 and 8In some embodiments, the isolation layer 120 is optionally etched to form a first isolation opening 121 in the display area AAA and a second isolation opening 122 in the display area AA. Figure 8 Also see Fig. 9 After step S110, the method for manufacturing the display assembly 100 further includes the following steps:

[0093] S112 , etching and removing a portion of the second light-emitting function layer and the second sub-encapsulation material layer located in the display area AA to form a second light-emitting layer 1322 and a second sub-encapsulation unit 142 that are at least partially located in the second isolation opening 122 .

[0094] like Figure 8 As shown, similar to the first light-emitting unit 131, the second light-emitting layer 1322 and the second cathode 1323 are stacked on the second anode 1321 to form the second light-emitting unit 132, and the second sub-packaging unit 142 packages the second light-emitting unit 132. In the process of manufacturing the second light-emitting layer 1322, the second light-emitting functional layer is at least partially arranged in the receiving groove 124, which increases the adhesion between the second light-emitting functional layer and the isolation layer 120, making it difficult for the second light-emitting functional layer to be peeled off, and the second light-emitting functional layer can also fit with the inner wall of the receiving groove 124, increasing the contact area between the second light-emitting functional layer and the isolation layer 120, further increasing the adhesion between the second light-emitting functional layer and the isolation layer 120, and avoiding the second light-emitting functional layer and the isolation layer 120 from being separated.

[0095] S114 , etching and removing the first light emitting functional layer, the first sub-encapsulation material layer, the second light emitting functional layer and the second sub-encapsulation material layer located in the non-display area NA.

[0096] like Fig. 9 As shown, that is to say, after the second light-emitting unit 132 is formed in the second isolation opening 122, the first light-emitting functional layer and the second light-emitting functional layer will no longer be separated from the isolation layer 120, and there will be no problem of peeling of the first light-emitting functional layer and the second light-emitting functional layer entering the display area AA and affecting the normal production of the display area AA. Therefore, the first light-emitting functional layer, the first sub-packaging material layer, the second light-emitting functional layer and the second sub-packaging material layer located in the non-display area NA and at least partially arranged in the accommodating groove 124 are all etched away.

[0097] Furthermore, in some embodiments, after step S114, the manufacturing method further includes:

[0098] S116 , etching the isolation layer 120 to form a third isolation opening 123 in the display area AA, and removing the isolation layer 120 in the non-display area NA.

[0099] like Fig.10 As shown, the isolation layer 120 is etched to remove the material at a portion of the isolation layer 120 , so as to form a third isolation opening 123 in the display area AA.

[0100] S118 , disposing a third light-emitting functional layer and a third sub-encapsulation material layer in the display area AA.

[0101] S120 , etching and removing a portion of the third light-emitting function layer and the third sub-encapsulation material layer located in the display area AA to form a third light-emitting layer 1332 and a third sub-encapsulation unit 143 at least partially located in the third isolation opening 123 .

[0102] like Fig.11 As shown, similar to the first light-emitting unit 131 and the second light-emitting unit 132, the third light-emitting layer 1332 and the third cathode 1333 are stacked on the third anode 1331 to form the third light-emitting unit 133, and the third sub-packaging unit 143 packages the third light-emitting unit 133. That is, the third light-emitting unit 133 is manufactured and formed in the display component 100.

[0103] Based on the same invention concept, please combine Figures 3 to 11 Also see Figures 12 to 20 The embodiment of the present application further provides a display component 100, which includes a display area AA and a non-display area NA, wherein the non-display area NA is located on at least one side of the display area AA and is adjacent to the display area AA.

[0104] like Figure 8 As shown, specifically, the display component 100 includes a substrate 110, an isolation layer 120 and a light-emitting layer 130 which are stacked in sequence. In the non-display area NA, a receiving groove 124 is provided on the isolation layer 120, and the light-emitting layer 130 is at least partially disposed in the receiving groove 124.

[0105] The substrate 110 is used to support and carry other film layers in the display component 100. For example, the substrate 110 can be made of materials such as glass and polyimide (PI). In some embodiments, the substrate 110 can also include an array substrate, on which a driving circuit for driving the light-emitting units in the display area AA of the display component 100 to emit light is provided. Under the drive of the driving circuit, different light-emitting units in the display area AA, such as the first light-emitting unit 131, the second light-emitting unit 132, and the third light-emitting unit 133, can be excited to emit light of different colors, so that the display component 100 can achieve a colorful display effect.

[0106] The isolation layer 120 is disposed on the substrate 110. In the display area AA, the isolation layer 120 is used to define a plurality of openings, such as a first isolation opening 121, a second isolation opening 122, and a third isolation opening 123, etc., to at least partially accommodate a plurality of light-emitting units in the light-emitting layer 130, thereby isolating two adjacent light-emitting units. Among the plurality of light-emitting units, a portion of two adjacent light-emitting units are isolated by the isolation layer 120, or every two adjacent light-emitting units are isolated by the isolation layer 120. In this way, the light emitted by each light-emitting unit will be blocked by the isolation layer 120 and will not interfere with the light emitted by the adjacent light-emitting unit, thereby avoiding signal crosstalk between adjacent light-emitting units. The specific structural form of the isolation layer 120 is not limited, as long as it can separate the two light-emitting units.

[0107] The light-emitting layer 130 may include a plurality of light-emitting units spaced apart from each other. For example, the light-emitting unit may be a red light-emitting unit for emitting red light, a green light-emitting unit for emitting green light, a blue light-emitting unit for emitting blue light, or a white light-emitting unit for emitting white light. The number of light-emitting units of different types, the arrangement of the plurality of light-emitting units, the spacing between two adjacent light-emitting units, etc. may be flexibly set and are not limited here. The light-emitting unit can emit light under the driving action of the driving circuit. Specifically, the light-emitting material in the light-emitting unit can emit light under the action of an electric field. In some embodiments, the light-emitting unit may include a first electrode, a light-emitting functional unit, and a second electrode. The first electrode and the second electrode are opposite to each other and spaced apart. The light-emitting functional unit is disposed between the first electrode and the second electrode. After the first electrode and the second electrode are energized respectively, an electric field can be generated between the first electrode and the second electrode, so that the light-emitting functional unit can emit light under the driving action of the electric field.

[0108] In order to prevent the light emitting layer 130 and the encapsulation layer 140 located in the non-display area NA from peeling off in a large area during the preparation process, in the embodiment of the present application, Fig.12As shown, in the non-display area NA, the isolation layer 120 is provided with a receiving groove 124, and the light-emitting layer 130 is at least partially disposed in the receiving groove 124. The receiving groove 124 can at least partially accommodate the light-emitting layer 130, and the number of the receiving grooves 124, the location of the receiving grooves 124 in the non-display area NA, the shape of the receiving grooves 124, the size of the receiving grooves 124, etc. are not limited. Due to the presence of the receiving groove 124, the light-emitting layer 130 can be at least partially disposed in the receiving groove 124. In this way, a certain step difference is formed between the portion of the light-emitting layer 130 extending into the receiving groove 124 and the portion not extending into the receiving groove 124, thereby increasing the adhesion between the light-emitting layer 130 and the isolation layer 120, making it difficult for the light-emitting layer 130 to be peeled off. In addition, the light-emitting layer 130 can also fit with the inner wall of the receiving groove 124, thereby increasing the contact area between the light-emitting layer 130 and the isolation layer 120, further increasing the adhesion between the light-emitting layer 130 and the isolation layer 120, and avoiding separation of the light-emitting layer 130 and the isolation layer 120.

[0109] The display component 100 of the embodiment of the present application is provided with a receiving groove 124 on the isolation layer 120 in the non-display area NA, and the light-emitting layer 130 is at least partially provided in the receiving groove 124. In this way, a certain step difference is formed between the portion of the light-emitting layer 130 extending into the receiving groove 124 and the portion not extending into the receiving groove 124, thereby increasing the adhesion between the light-emitting layer 130 and the isolation layer 120, making it difficult for the light-emitting layer 130 to be peeled off. In addition, the light-emitting layer 130 can also fit with the inner wall of the receiving groove 124, thereby increasing the contact area between the light-emitting layer 130 and the isolation layer 120, further increasing the adhesion between the light-emitting layer 130 and the isolation layer 120, avoiding the light-emitting layer 130 from separating from the isolation layer 120, and thus avoiding the peeled light-emitting layer 130 from entering the display area AA, affecting the normal production of the display area AA, and not affecting the display effect of the display component 100.

[0110] In some embodiments, other film layers may be provided between the substrate 110 and the isolation layer 120. For example, a first metal layer 150 and a second metal layer 160 may be provided between the substrate 110 and the isolation layer 120. The first metal layer 150 and the second metal layer 160 may be used to form different signal routings to achieve different types of signal connections in the display component 100. A pixel defining layer 170 may be provided between the substrate 110 and the isolation layer 120. The pixel defining layer 170 is provided on the substrate 110. The pixel defining layer 170 defines a plurality of pixel openings 171 spaced apart from each other. Each light-emitting unit in the light-emitting layer is provided corresponding to each pixel opening, so as to avoid signal crosstalk between adjacent light-emitting units. A planarization layer 180 may also be provided between the substrate 110 and the isolation layer 120. The planarization layer 180 is used to achieve the planarization function of the film layer.

[0111] Please continue reading Fig.12 In some embodiments, optionally, the receiving groove 124 penetrates the isolation layer 120 along a direction perpendicular to the surface of the substrate 110 .

[0112] The receiving groove 124 penetrates the isolation layer 120 along a direction perpendicular to the surface of the substrate 110, that is, in the thickness direction of the isolation layer 120. In this way, the depth dimension of the receiving groove 124 is equal to the thickness dimension of the isolation layer 120, so that the portion of the light-emitting layer 130 extending into the receiving groove 124 is more deeply recessed, and the light-emitting layer 130 can go deeper into the receiving groove 124, which can increase the step difference between the portion of the light-emitting layer 130 extending into the receiving groove 124 and the portion not extending into the receiving groove 124, thereby increasing the adhesion between the light-emitting layer 130 and the isolation layer 120, making it difficult for the light-emitting layer 130 to be peeled off.

[0113] In order to allow the receiving groove 124 to accommodate more light-emitting layers 130 , in some embodiments, optionally, along a direction perpendicular to the surface of the substrate 110 , the depth dimension of the receiving groove 124 is greater than the thickness dimension of the light-emitting layer 130 .

[0114] The depth dimension of the accommodating groove 124 is greater than the thickness dimension of the light-emitting layer 130. Then, in the partial area with the accommodating groove 124, the concave structure on the light-emitting layer 130 can be completely set into the accommodating groove 124 in its thickness direction, which is beneficial to increase the adhesion between the light-emitting layer 130 and the isolation layer 120.

[0115] In some embodiments, optionally, the display component 100 further includes an encapsulation layer 140 , which is disposed on a side of the light emitting layer 130 away from the isolation layer 120 , and the encapsulation layer 140 is at least partially disposed in the receiving groove 124 .

[0116] The encapsulation layer 140 can encapsulate and protect the display component 100 as a whole. The encapsulation layer 140 can be a single-layer structure made of inorganic materials or organic materials, or a stacked structure made of at least one of inorganic materials or organic materials. It can be set according to actual use requirements and is not limited here. By making the encapsulation layer 140 on the side of the light-emitting layer 130 away from the isolation layer 120 also at least partially arranged in the receiving groove 124, the adhesion between the encapsulation layer 140 and the light-emitting layer 130 can be increased, so that the encapsulation effect of the encapsulation layer 140 is better. At the same time, it can also avoid the separation of the encapsulation layer 140 and the light-emitting layer 130, thereby avoiding the peeled encapsulation layer 140 from entering the display area AA and affecting the normal production of the display area AA.

[0117] On the basis of the above embodiment, optionally, along a direction perpendicular to the surface of the substrate 110 , the depth dimension of the receiving groove 124 is smaller than the thickness dimension of the encapsulation layer 140 .

[0118] The depth dimension of the receiving groove 124 is smaller than the thickness dimension of the packaging layer 140. Therefore, in the partial area with the receiving groove 124, the packaging layer 140 can completely fill the receiving groove 124, so that the packaging layer 140 can better achieve the protective effect of isolating the external water vapor and will not affect the subsequent processing and manufacturing process.

[0119] The number of the receiving grooves 124 and the location of the receiving grooves 124 in the non-display area NA are not limited. Figure 3 Also see Figure 4 In some embodiments, the isolation layer 120 is optionally provided with a plurality of receiving grooves 124, and the receiving grooves 124 are arranged at intervals from each other. By providing a plurality of receiving grooves 124 on the isolation layer 120, multiple structures at different positions on the light-emitting layer 130 can be at least partially arranged in the receiving grooves 124, thereby increasing the adhesion between the light-emitting layer 130 as a whole and the isolation layer 120, and preventing the light-emitting layer 130 from being separated from the isolation layer 120 as a whole.

[0120] The isolation layer 120 is provided with a plurality of accommodating grooves 124 spaced apart from each other, and their arrangement is not limited. In some embodiments, optionally, the accommodating grooves 124 are arranged in rows along the first direction x and in columns along the second direction y. Both the first direction x and the second direction y are parallel to the surface of the substrate 110, and the second direction y intersects with the first direction x.

[0121] The receiving grooves 124 are arranged in rows along the first direction x and in columns along the second direction y, that is, the receiving grooves 124 are arranged in a rectangular array on the isolation layer 120. By arranging the receiving grooves 124 in an array along the first direction x and the second direction y, the receiving grooves 124 on the light-emitting layer 130 are arranged more evenly, which makes the adhesion between the light-emitting layer 130 and the isolation layer 120 more uniform, which is beneficial to reducing the stress concentration problem between the light-emitting layer 130 and the isolation layer 120.

[0122] Please combine Fig.12 Also see Figures 13 to 20 In some embodiments, optionally, along a direction perpendicular to the surface of the substrate 110 , the shape of the positive projection contour of the receiving groove 124 on the substrate 110 is an axisymmetric figure.

[0123] An axially symmetrical figure is a special figure. If a plane figure can be folded along a straight line and the parts on both sides of the straight line can overlap with each other, then this figure is called an axially symmetrical figure, and the straight line is the axis of symmetry of the axially symmetrical figure.

[0124] In such Fig.13 In the embodiment shown, the shape of the receiving groove 124 is rectangular, and in particular, the shape of the receiving groove 124 can be square. Fig.14 In the embodiment shown, the shape of the receiving groove 124 is a parallelogram. Fig.15 In the embodiment shown, the shape of the receiving groove 124 is a hexagon, and in particular, the shape of the receiving groove 124 can be a regular hexagon. Fig.16 In the embodiment shown, the shape of the receiving groove 124 is a dodecagon. Fig.17 , is a graphic with a small rectangular corner missing at each of the four corners of a large rectangle. Fig.18 In the embodiment shown, the shape of the receiving groove 124 is hexagonal. Fig.19 The shape of the receiving groove 124 can be a pattern with a small rectangular corner missing at one corner of a large rectangle. Fig. 20 In the embodiment shown, the shape of the receiving groove 124 is annular, and in particular, the shape of the receiving groove 124 is an elliptical ring. The above are only some examples of the shape of the receiving groove 124. In actual embodiments, the shape of the receiving groove 124 can also be circular, triangular, octagonal, etc. By making the shape of the receiving groove 124 an axisymmetric figure, it is not only convenient to make and shape the receiving groove 124, but also conducive to at least partially setting the light-emitting layer 130 in the receiving groove 124.

[0125] Please also read Figures 16 to 19 In some embodiments, optionally, along a direction perpendicular to the surface of the substrate 110, the positive projection profile of the receiving groove 124 on the substrate has a main body area 1241, and at least one protruding area 1242 extending from the main body area 1241 along the first direction x and / or the second direction y toward a side away from the main body area 1241.

[0126] exist Fig.16 and Fig.17 In the illustrated embodiment, the orthographic projection profile of the receiving groove 124 on the substrate has a main body region 1241, two protruding regions 1242 extending from the main body region 1241 along a first direction x to a side away from the main body region 1241, and two protruding regions 1242 extending from the main body region 1241 along a second direction y to a side away from the main body region 1241. Fig.18 and Fig.19In the illustrated embodiment, the orthographic projection profile of the receiving groove 124 on the substrate has a main body region 1241, a protruding region 1242 extending from the main body region 1241 along the first direction x to a side away from the main body region 1241, and a protruding region 1242 extending from the main body region 1241 along the second direction y to a side away from the main body region 1241. In this way, the main body region 1241 and the protruding region 1242 of the receiving groove 124 can respectively accommodate different parts of the light-emitting layer 130, which can further increase the adhesion between the light-emitting layer 130 and the isolation layer 120.

[0127] Please continue reading Figures 16 to 19 On the basis of the above embodiment, further, the symmetry axis of the protruding area 1242 extending along the first direction x in the first direction x coincides with the symmetry axis of the main body area 1241 in the first direction x. The symmetry axis of the protruding area 1242 extending along the second direction y in the second direction y coincides with the symmetry axis of the main body area 1241 in the second direction y.

[0128] Such a configuration makes the overall shape of the receiving groove 124 more regular, which not only facilitates the manufacturing and forming of the receiving groove 124 , but also helps to improve the force uniformity between the isolation layer 120 and the light-emitting layer 130 .

[0129] The specific structure of the isolation layer 120 is not limited, such as Fig.11 As shown, in some embodiments, optionally, the isolation layer 120 includes an isolation body 125 and a blocking portion 126 which are stacked in sequence, and the isolation body 125 and the blocking portion 126 together define a receiving groove 124 .

[0130] That is, the isolation layer 120 includes a relatively independent isolation body 125 and a blocking portion 126 , wherein the isolation body 125 is located on the substrate 110 or the pixel defining layer 170 , and the blocking portion 126 is located on a side of the isolation body 125 away from the substrate 110 .

[0131] Further, the orthographic projection of the isolator 125 on the substrate 110 is located within the orthographic projection of the blocking portion 126 on the substrate 110. That is, the area covered by the orthographic projection of the blocking portion 126 on the substrate 110 is relatively large, while the area covered by the orthographic projection of the isolator 125 on the substrate 110 is relatively small, so that the orthographic projection of the blocking portion 126 on the substrate 110 can cover the orthographic projection of the isolator 125 on the substrate 110.

[0132] The light-emitting layer 130 is at least partially in contact with the side wall of the isolating body 125; preferably, the light-emitting layer 130 is at least partially in contact with the surface of the blocking portion 126 facing the substrate 110. Such a design can increase the number and area of ​​contact surfaces between the light-emitting layer 130 and the receiving groove 124, further increase the adhesion between the light-emitting layer 130 and the isolating layer 120, and prevent the light-emitting layer 130 from separating from the isolating layer 120.

[0133] In some embodiments, optionally, the isolation layer 120 further includes a base portion 127 , which is located on a side of the isolation body 125 close to the substrate 110 ; the orthographic projection of the isolation body 125 on the substrate 110 is located within the orthographic projection of the base portion 127 on the substrate 110 .

[0134] Similarly, the area covered by the orthographic projection of the base portion 127 on the substrate 110 is relatively large, while the area covered by the orthographic projection of the isolator 125 on the substrate 110 is relatively small, so that the orthographic projection of the base portion 127 on the substrate 110 can cover the orthographic projection of the isolator 125 on the substrate 110. Such a design can facilitate the processing and molding of the isolation layer 120.

[0135] See also Fig.21 The embodiment of the present application also provides a display device 10, which includes a display panel, which is made of a display component 100 prepared by the manufacturing method of the display component 100 in any one of the above embodiments, or is prepared by the display component 100 in any one of the above embodiments.

[0136] The display panel prepared by the display assembly 100 disclosed in the embodiment of the present application is applied to the display device 10 to provide the function of displaying the picture. The display device 10 can be any product or component with a display function, including but not limited to mobile phones, tablet computers, laptop computers, e-readers, wearable devices, remote controls, televisions, desktop computers, vehicle-mounted devices, etc. Since the display panel is prepared by the display assembly 100 in any of the above embodiments, the content of the display panel can refer to patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099420, PCT / CN2024 / 099421, PCT / CN2024 / 099422, PCT / CN2024 / 099423, PCT / CN2024 / 099424, PCT / CN2024 / 099425, PCT / CN2024 / 099426, PCT / CN2024 / 099427, PCT / CN2024 / 099428, PCT / CN2024 / 099429, PCT / CN2024 / 099429, PCT / CN2024 / 099427, PCT / CN2024 / 099429 ... CT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN11 6583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, CN117500332A. By setting a receiving groove 124 on the isolation layer 120 in the non-display area NA of the display component 100, and making the light-emitting layer 130 at least partially set in the receiving groove 124, a certain step difference is formed between the part of the light-emitting layer 130 extending into the receiving groove 124 and the part not extending into the receiving groove 124, thereby increasing the adhesion between the light-emitting layer 130 and the isolation layer 120, making it difficult for the light-emitting layer 130 to be peeled off, and the light-emitting layer 130 can also fit with the inner wall of the receiving groove 124, thereby increasing the contact area between the light-emitting layer 130 and the isolation layer 120, further increasing the adhesion between the light-emitting layer 130 and the isolation layer 120, avoiding the separation of the light-emitting layer 130 and the isolation layer 120 in the subsequent process, thereby avoiding the peeled light-emitting layer 130 from entering the display area AA, affecting the normal production of the display area AA, and not affecting the display effect of the display component 100.

[0137] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0138] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for manufacturing a display component, characterized in that: include: An isolation layer is disposed on one side of the substrate, wherein the isolation layer covers the display area and the non-display area; Etching the isolation layer to form a first isolation opening in the display area and forming a receiving groove in the non-display area; A first light-emitting functional layer and a first sub-encapsulation material layer are disposed in the display area and the non-display area. In the non-display area, the first light-emitting functional layer is at least partially disposed in the receiving groove.

2. The method according to claim 1, characterized in that: In the non-display area, the first sub-packaging material layer is at least partially disposed in the receiving groove.

3. The method according to claim 1, characterized in that: After the step of providing the first light-emitting functional layer and the first sub-encapsulation material layer in the display area and the non-display area, the manufacturing method further includes: Etching and removing a portion of the first light-emitting function layer and the first sub-encapsulation material layer located in the display area to form a first light-emitting layer and a first sub-encapsulation unit at least partially located in the first isolation opening; A second light-emitting functional layer and a second sub-encapsulation material layer are disposed in the display area and the non-display area. In the non-display area, the second light-emitting functional layer is at least partially disposed in the receiving groove.

4. The method according to claim 3, characterized in that: In the non-display area, the second sub-packaging material layer is at least partially disposed in the receiving groove.

5. The method according to claim 3, characterized in that: The isolation layer is etched to form a first isolation opening in the display area, and a second isolation opening is formed in the display area. After the step of providing a second light-emitting functional layer and a second sub-encapsulation material layer in the display area and the non-display area, the manufacturing method further includes: Etching and removing a portion of the second light-emitting function layer and the second sub-encapsulation material layer located in the display area to form a second light-emitting layer and a second sub-encapsulation unit at least partially located in the second isolation opening; The first light-emitting function layer, the first sub-encapsulation material layer, the second light-emitting function layer and the second sub-encapsulation material layer located in the non-display area are removed by etching.

6. The method according to claim 5, characterized in that: After the step of etching and removing the first light-emitting functional layer, the first sub-encapsulation material layer, the second light-emitting functional layer and the second sub-encapsulation material layer located in the non-display area, the manufacturing method further includes: Etching the isolation layer to form a third isolation opening in the display area, and removing the isolation layer in the non-display area; Disposing a third light-emitting functional layer and a third sub-encapsulation material layer in the display area; Parts of the third light-emitting function layer and the third sub-encapsulation material layer located in the display area are removed by etching to form a third light-emitting layer and a third sub-encapsulation unit at least partially located in the third isolation opening.

7. A display component, characterized in that: The invention comprises at least one display screen, wherein the display screen comprises a display area and a non-display area, wherein the non-display area is located on at least one side of the display area and is adjacent to the display area, and the display component comprises a substrate, an isolation layer and a light-emitting layer which are stacked in sequence, wherein a receiving groove is provided on the isolation layer in the non-display area, and the light-emitting layer is at least partially arranged in the receiving groove.

8. The display assembly according to claim 7, characterized in that The receiving groove penetrates the isolation layer along a direction perpendicular to the surface of the substrate.

9. The display assembly according to claim 7, characterized in that: Along a direction perpendicular to the surface of the substrate, the depth dimension of the receiving groove is greater than the thickness dimension of the light-emitting layer.

10. The display assembly according to claim 9, characterized in that The display component further includes an encapsulation layer, which is disposed on a side of the light-emitting layer away from the isolation layer, and at least a portion of the encapsulation layer is disposed in the receiving groove.

11. The display assembly according to claim 10, characterized in that Along a direction perpendicular to the surface of the substrate, a depth dimension of the receiving groove is smaller than a thickness dimension of the packaging layer.

12. The display assembly according to claim 7, wherein: A plurality of the accommodating grooves are arranged on the isolation layer, and the accommodating grooves are arranged at intervals from each other.

13. The display assembly according to claim 12, wherein: The receiving grooves are arranged in rows along a first direction and in columns along a second direction. The first direction and the second direction are both parallel to the surface of the substrate, and the second direction intersects the first direction.

14. The display assembly according to claim 13, wherein: Along the direction perpendicular to the surface of the substrate, the shape of the orthographic projection outline of the receiving groove on the substrate is an axisymmetric figure; Preferably, along a direction perpendicular to the surface of the substrate, the shape of the orthographic projection contour of the accommodating groove on the substrate is polygonal, circular, elliptical or ring-shaped.

15. The display assembly according to claim 14, wherein: Along a direction perpendicular to the substrate surface, the orthographic projection contour of the receiving groove on the substrate has a main body area and at least one protruding area extending from the main body area along the first direction and / or the second direction to a side away from the main body area.

16. The display assembly according to claim 15, characterized in that The symmetry axis of the protruding area extending along the first direction in the first direction coincides with the symmetry axis of the main body area in the first direction; A symmetry axis of the protruding area extending along the second direction in the second direction coincides with a symmetry axis of the main body area in the second direction.

17. The display assembly according to claim 7, wherein: The isolation layer includes an isolation body and a blocking portion which are stacked in sequence, and the isolation body and the blocking portion jointly define the containing groove.

18. The display assembly according to claim 17, wherein: The orthographic projection of the isolating body on the substrate is located within the orthographic projection of the blocking portion on the substrate; The light emitting layer at least partially contacts the side wall of the spacer; Preferably, the light emitting layer is at least partially in contact with a surface of the blocking portion facing the substrate.

19. The display assembly according to claim 17, wherein: The isolation layer further comprises a base portion, and the base portion is located on a side of the isolation body close to the substrate; The orthographic projection of the insulator on the substrate is located within the orthographic projection of the base portion on the substrate.

20. A display device, characterized in that: A display panel is included, wherein the display panel Made by a display component prepared by the method for manufacturing a display component according to any one of claims 1 to 6; or Prepared from the display assembly according to any one of claims 7 to 19.

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