Display panel, display device and preparation method of display panel

Abstract

The invention relates to the technical field of display, and particularly provides a display panel, a display device and a preparation method of the display panel, the display panel comprises a display area and a non-display area, and the non-display area is arranged around the peripheral side of the display area; the non-display area comprises an array substrate, an isolation structure, a lifting layer, a first filling layer and a first packaging layer, the isolation structure is located on the array substrate, a plurality of isolation openings are defined in the isolation structure, and the end, away from the array substrate, of the isolation structure is a first end face; the lifting layer is located on the array substrate and comprises a first lifting part located on the side, away from the array substrate, of the isolation structure; the first filling layer is located on the side, away from the array substrate, of the lifting layer, and the orthographic projection of the first filling layer on the array substrate covers the orthographic projection of the first lifting part on the array substrate; the first packaging layer is located on the side, away from the array substrate, of the first filling layer. According to the display panel, the reliability can be improved through the lifting layer, and the use performance of the display panel is improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as OLED have the advantages of high image quality, power saving, thin body and wide application range, and are widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc., becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] The present application provides a display panel, a display device and a method for manufacturing a display panel, so as to improve the performance of the display panel at least to a certain extent.

[0005] To achieve the above-mentioned objectives, the technical solution adopted in the present application is: in the first aspect, a display panel is provided, the display panel having a display area and a non-display area, the non-display area is arranged around the outer peripheral side of the display area; the non-display area includes: an array substrate, an isolation structure, a lifting layer, a first filling layer and a first packaging layer, the isolation structure is located on the array substrate, the isolation structure is defined with a plurality of isolation openings, and the end of the isolation structure away from the array substrate is a first end face; the lifting layer is located on the array substrate, the lifting layer includes a first lifting portion located on the side of the isolation structure away from the array substrate; the first filling layer is located on the side of the lifting layer away from the array substrate, the orthographic projection of the first filling layer on the array substrate covers the orthographic projection of the first lifting portion on the array substrate; the first packaging layer is located on the side of the first filling layer away from the array substrate.

[0006] In the display panel provided in the embodiment of the present application, the height of the corresponding area of ​​the array substrate can be effectively raised by the lifting layer, thereby forming a structure similar to a retaining wall in the non-display area, which helps to prevent water vapor in the external environment from invading the display area and affecting the display effect of the display panel, thereby achieving the purpose of improving the performance of the display panel.

[0007] Optionally, the lifting layer further includes a second lifting portion located in the isolation opening, wherein the second lifting portion is connected to the adjacent first lifting portion.

[0008] Optionally, the non-display area further includes a filling layer, and the filling layer is located between the first encapsulation layer and the array substrate.

[0009] Optionally, the orthographic projection of the first filling layer on the array substrate covers the orthographic projection of the corresponding isolation opening on the array substrate, and the corresponding isolation opening is located on a side of the first filling layer close to the array substrate.

[0010] Optionally, at least two of the correspondingly arranged isolation openings are arranged adjacent to each other.

[0011] Optionally, an orthographic projection of at least one of the isolation openings adjacent to the corresponding isolation opening on the array substrate is spaced apart from an orthographic projection of the first filling layer on the array substrate.

[0012] Optionally, the first filling layer includes a first filling sub-section, a second filling sub-section and a third filling sub-section, the first filling sub-section is arranged corresponding to the lifting layer and is located on the side of the lifting layer away from the array substrate; the second filling sub-section covers the first end surface; and the third filling sub-section connects the first filling sub-section and the second filling sub-section.

[0013] Optionally, a cavity is provided between the first filling layer, the lifting layer and the first end surface.

[0014] Optionally, the display panel further includes a second filling layer, which is disposed in the corresponding isolation opening and located on a side of the lifting layer close to the array substrate.

[0015] Optionally, the display panel further includes a third filling layer, and in a direction parallel to the plane where the array substrate is located, the third filling layer and the second filling layer are respectively arranged in two adjacent isolation openings and are arranged in the same layer.

[0016] Optionally, the display area of ​​the display panel includes a light emitting element, and the second filling layer and the light emitting element are in the same layer and made of the same material.

[0017] Optionally, the third filling layer is made of the same material as the first filling layer.

[0018] Optionally, the second filling layer and the third filling layer are made of different materials.

[0019] Optionally, the second filling layer, the first filling layer and the third filling layer each include a light emitting material layer and a first electrode layer stacked in sequence.

[0020] Optionally, part of the first electrode layer is connected to a side of the isolation structure facing the isolation opening.

[0021] Optionally, the first electrode layer is a cathode layer.

[0022] Optionally, the non-display area further includes a pixel definition layer, the pixel definition layer is located between the array substrate and the isolation structure, the pixel definition layer defines a plurality of pixel openings, and the pixel openings are arranged corresponding to and communicate with the isolation openings.

[0023] Optionally, the non-display area further includes a second electrode layer, the second electrode layer is located between the array substrate and the pixel definition layer, and a portion of the second electrode layer is exposed through the pixel opening.

[0024] Optionally, the second electrode layer is an anode layer.

[0025] Optionally, the isolation structure includes a first isolation portion and a second isolation portion stacked in sequence on the array substrate, the first end surface is located at an end of the second isolation portion that is away from the first isolation portion; and the orthographic projection of the first isolation portion on the array substrate is located within the range of the orthographic projection of the second isolation portion on the array substrate.

[0026] Optionally, the first isolation portion is a conductive structure.

[0027] Optionally, the first isolation portion includes at least two sub-support portions, and an orthographic projection of the sub-support portion farther from the array substrate on the array substrate is located within a range of an orthographic projection of the sub-support portion closer to the array substrate on the array substrate.

[0028] Optionally, an orthographic projection of the sub-support portion closest to the array substrate on the array substrate is located within a range of an orthographic projection of the second isolation portion on the array substrate.

[0029] Optionally, the first encapsulation layer includes a first encapsulation part and a second encapsulation part that are connected, the first encapsulation part is located on the side of the first filling layer away from the array substrate, and the second encapsulation part is connected to the adjacent first encapsulation part; the orthographic projection of the first encapsulation part on the array substrate covers the orthographic projection of the corresponding isolation opening on the array substrate, and the corresponding isolation opening is located on the side of the first encapsulation part close to the array substrate.

[0030] Optionally, at least two of the correspondingly arranged isolation openings are arranged adjacent to each other.

[0031] Optionally, an orthographic projection of the second packaging portion on the array substrate covers an orthographic projection of at least one of the isolation openings adjacent to the corresponding isolation opening on the array substrate.

[0032] Optionally, the second packaging part includes a first packaging sub-part and a second packaging sub-part, the first packaging sub-part is located on the side of the first end surface away from the array substrate and the first packaging sub-part is spaced apart from the first end surface, and the second packaging sub-part connects the first packaging sub-part and the first packaging part.

[0033] Optionally, the non-display area further includes a second encapsulation layer covering the first encapsulation layer.

[0034] Optionally, the non-display area further includes a planarization layer, and the planarization layer is located between the first encapsulation layer and the second encapsulation layer.

[0035] Optionally, the material of the planarization layer includes organic material.

[0036] Optionally, the planarization layer includes a plurality of planarization units arranged at intervals, and two adjacent planarization units are separated by the first encapsulation layer.

[0037] Optionally, an orthographic projection of the first lifting portion on the array substrate and an orthographic projection of the planarization unit on the array substrate are arranged alternately.

[0038] In a second aspect, the present application provides a method for preparing a display panel, comprising:

[0039] An isolation structure is formed on one side of the array substrate, the isolation structure encloses a plurality of isolation openings, and an end of the isolation structure away from the array substrate is a first end surface;

[0040] forming a lifting layer on a side of a portion of the isolation structure away from the array substrate, the lifting layer comprising a first lifting portion, the first lifting portion covering the first end surface close to the isolation opening;

[0041] forming a filling material layer and a first packaging layer on a side of the isolation opening and the isolation structure away from the array substrate;

[0042] The filling material layer covers a portion of the lifting layer away from the array substrate to form a first filling layer.

[0043] Optionally, the isolation opening includes a first opening and a second opening that are adjacent to each other;

[0044] The step of forming a lifting layer on a side of a portion of the isolation structure away from the array substrate, wherein the lifting layer includes a first lifting portion, and the first lifting portion covers the first end surface close to the isolation opening, comprises:

[0045] A lifting layer is prepared in the first opening and on a surface of the first end surface close to the first opening which is away from the array substrate.

[0046] Optionally, before the step of preparing a lifting layer on a surface of the first end surface in the first opening and close to the first opening and facing away from the array substrate, the method further includes:

[0047] A second filling layer is prepared in the first opening.

[0048] Optionally, a portion of the filling material layer located in the second opening forms a third filling layer.

[0049] In a third aspect, the present application further provides a display device, comprising a display panel, wherein the display panel is any one of the display panels described above, or a display panel prepared by the preparation method described above.

[0050] The display device provided in the embodiment of the present application includes the above-mentioned display panel, so the display device at least includes the beneficial effects of any one or several of the above-mentioned display panels. The specific effects are described above and will not be repeated here.

[0051] The display panel, display device and display panel preparation method provided in the present application have the beneficial effects that: compared with the related art, the display panel provided in the present application can increase the film thickness of some positions in the non-display area through a lifting layer and a first filling layer, so that a structure with a certain blocking function is formed outside the display area, reducing the overflow risk of the planarization layer, and at the same time can improve the display panel's resistance to water vapor intrusion, and improve the packaging effect and performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0053] Figure 1 A schematic diagram of the planar structure of a display panel provided in an embodiment of the present application;

[0054] Figure 2 for Figure 1 The structure of region D in the display panel is shown as an enlarged view;

[0055] Figure 3 for Figure 2 Sectional view at AA in the figure;

[0056] Figure 4 for Figure 2 The cross-sectional view at BB in FIG.

[0057] Figure 5 for Figure 2 A cross-sectional view of another embodiment at AA in FIG.

[0058] Figure 6 A flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0059] Figure 7A-7C A process diagram of a method for preparing a display panel provided in an embodiment of the present application;

[0060] Figure 8 A schematic diagram of the planar structure of a display device provided in an embodiment of the present application.

[0061] Among them, the reference numerals in the figure are:

[0062] 1. array substrate; 2. isolation structure; 201. isolation opening; 202. first end surface; 21. first isolation part; 211. sub-support part; 22. second isolation part; 3. lifting layer; 31. first lifting part; 32. second lifting part; 4. first encapsulation layer; 41. first encapsulation part; 42. second encapsulation part; 421. first encapsulation sub-part; 422. second encapsulation sub-part; 51. second filling layer; 52. first filling layer; 521. first filling sub-part; 522. second filling sub-part; 523. third filling sub-part; 53. third filling layer; 501. light-emitting material layer; 502. first electrode layer; 6. pixel definition layer; 601. pixel opening; 7. second electrode layer; 8. second encapsulation layer; 9. planarization layer; 91. planarization unit;

[0063] 100, display device; 10, display panel; AA, display area; NA, non-display area; S, cavity. DETAILED DESCRIPTION

[0064] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0065] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0066] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0067] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0068] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0069] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0070] In the present application, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0071] The term "layer" used in the text may refer to a material portion including an area with a certain thickness. A layer may extend over the entire underlying structure or overlying structure, or may have a range smaller than the range of the underlying or overlying structure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top surface and the bottom surface of the continuous structure or between any paired lateral planes at the top surface and the bottom surface. A layer may extend laterally, vertically and / or along a tapered surface. An array substrate may be a layer, may include one or more layers therein, and / or may have one or more layers located thereon, above it and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductors and a contact layer (forming contacts, interconnects and / or vias therein) and one or more dielectric layers.

[0072] The display panel 10 may be an organic light emitting diode (OLED) display panel 10. The display panel 10 has a display area AA and a non-display area NA located on the outer side of the display area AA, wherein the display area AA is provided with an organic light emitting material, which emits light under the action of an electric current to realize picture display; and the non-display area NA is generally located on the outer side of the display area AA or used to connect the display area AA and the perforated area located in the display area AA, in addition to providing certain packaging protection and support fixation for the display area AA, it can also be used to realize the electrical connection between the display area AA and the external driving circuit and other electronic components to transmit electrical signals and realize the normal display function of the display area AA. Generally speaking, the above-mentioned non-display area NA is mostly arranged around the display area AA, that is, the edge part of the display panel 10, and a frame-shaped area is formed around the display area AA.

[0073] In the process of implementing the present application, the inventors discovered the following problems in the related technology: some pixel units have display anomalies, which to some extent affect the display effect of the display panel 10 and ultimately affect its performance, reducing the reliability of the display panel 10.

[0074] Based on this, an embodiment of the present application provides a display panel 10 to alleviate or improve the above technical problems at least to a certain extent.

[0075] See also Figure 1-Figure 3 The display panel 10 has a display area AA and a non-display area NA, and the non-display area NA is disposed around the outer periphery of the display area AA.

[0076] Specifically, the non-display area NA includes an array substrate 1, an isolation structure 2, a lifting layer 3, a first filling layer 52 and a first encapsulation layer 4, wherein the isolation structure 2 is located on the array substrate 1, the isolation structure 2 is defined by a plurality of isolation openings 201, and the end of the isolation structure 2 facing away from the array substrate 1 is a first end surface 202; the lifting layer 3 is located on the array substrate 1, the lifting layer 3 includes a first lifting portion 31 located on the side of the isolation structure 2 facing away from the array substrate 1; the first filling layer 52 is located on the side of the lifting layer 3 facing away from the array substrate 1, and the orthographic projection of the first filling layer 52 on the array substrate 1 covers the orthographic projection of the first lifting portion 31 on the array substrate 1; the first encapsulation layer 4 is located on the side of the isolation structure 2 facing away from the array substrate 1, and the first lifting portion 31 is located between the first end surface 202 and the first encapsulation layer 4.

[0077] The contents of the isolation structure 23 mentioned below are disclosed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN 117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0078] The first lifting portion 31 arranged on the first end surface 202 of the isolation structure 2 can effectively raise the thickness of the film layer in the area. The isolation structure 2, the lifting layer 3, the first filling layer 52 and the first encapsulation layer 4 cooperate with each other to form a special structure with a larger height difference on the surface of the non-display area NA away from the array substrate 1, thereby increasing the thickness of a part of the area in the non-display area NA, forming a structure similar to a retaining wall in the non-display area NA, so as to enhance the barrier ability of the non-display area NA to external water vapor, which helps to prevent water vapor in the external environment from invading the display area AA and affecting the display effect of the display panel 10, thereby achieving the purpose of improving the performance of the display panel 10.

[0079] In some embodiments, at least part of the isolation openings 201 are arranged at intervals along the first direction and / or the second direction, and the lifting layers 3 are arranged in sequence along the extension direction of the corresponding isolation openings 201 to form the first lifting portions 31 arranged in sequence along the first direction and / or the second direction. The number of the first filling layers 52 is the same as the number of the lifting layers 3 and they are arranged one by one. The first filling layer 52 is located on the side of the first lifting portion 31 away from the array substrate 1, and the orthographic projection of the first filling layer 52 on the array substrate 1 can cover the orthographic projection of the first lifting portion 31 on the array substrate 1.

[0080] The first direction and the second direction are parallel to the surface of the array substrate 1. The first direction and the second direction may be orthogonal to each other or may have a certain angle. The first lifting portion 31 can form a raised structure similar to a dam shape on the first end surface 202 of the isolation structure 2. When the first lifting portions 31 are arranged in sequence along the first direction and / or the second direction, they can be arranged around the outer peripheral side of the display area AA and form a closed or semi-closed area that can surround the display area AA.

[0081] The structure formed by the distribution positions of the above-mentioned multiple first lifting portions 31 along the non-display area NA and capable of surrounding the display area AA is similar to a retaining wall, which can not only cooperate with the isolation structure 2 and the first packaging layer 4 to improve the packaging effect of the display panel 10, but also better isolate the display area AA from the external environment to prevent water and oxygen in the external environment from invading the display area AA, so as to improve the packaging reliability of the display panel 10, but also can be used to limit the flow and diffusion range of other film layers covering the first packaging layer 4 away from the side of the array substrate 1 during the preparation process, and help to limit the corresponding film layer structure within the design range to avoid material overflow to unnecessary areas, thereby improving the processing yield of the display panel 10, and to a certain extent improving the reliability and use effect of the display panel 10.

[0082] For details, please refer to Figure 2 and Figure 3, the direction indicated by X in the figure is the first direction, the direction indicated by Y is the second direction, and the first direction and the second direction are orthogonal to each other. Part of the isolation openings 201 are arranged at intervals along the first direction, and correspondingly, part of the first lifting portions 31 are arranged at intervals along the first direction and are located in the same row; part of the isolation openings 201 are arranged at intervals along the second direction, and correspondingly, part of the first lifting portions 31 are arranged at intervals along the second direction and are located in the same column.

[0083] The first lifting portions 31 in the same row or column cooperate with each other to prevent the corresponding film layer arranged in the display area AA from overflowing during the preparation process. The lifting layer 3 having the first lifting portions 31 is extended along the first direction and the second direction at different positions to form a rectangular or rectangular-like structure surrounding the display area AA, which can further improve the anti-overflow function of the display panel 10.

[0084] The first filling layer 52 disposed on the side of the first lifting portion 31 away from the array substrate 1 can further improve the anti-overflow effect of the display panel 10 .

[0085] Specifically, the orthographic projection of the first filling layer 52 on the array substrate 1 covers the orthographic projection of the corresponding isolation opening 201 on the array substrate 1 , and the corresponding isolation opening 201 is located on a side of the first filling layer 52 close to the array substrate 1 .

[0086] In some embodiments, see Figure 3 The orthographic projection of at least one isolation opening 201 adjacent to the corresponding isolation opening 201 on the array substrate 1 is spaced apart from the orthographic projection of the first filling layer 52 on the array substrate 1 .

[0087] In other embodiments, see Figure 4 At least two corresponding isolation openings 201 are arranged adjacent to each other, and at this time, the two first filling layers 52 are also arranged adjacent to each other.

[0088] Above Figure 3 and Figure 4 The structures shown may appear simultaneously in the same display panel 10 , may be different structures arranged in different regions of the display panel 10 , or may be structures in the same region of the display panel 10 at different viewing angles.

[0089] The orthographic projection of the first encapsulation layer 4 on the array substrate 1 covers the isolation structure 2 and the isolation opening 201 .

[0090] Specifically, the non-display area NA further includes a planarization layer 9, and the planarization layer 9 is located on a side of the first encapsulation layer 4 away from the array substrate 1. Figure 3The barrier-wall structure formed by the plurality of first lifting portions 31 can block the planarization layer 9 , reduce the possibility of overflow of the planarization layer 9 during the preparation process, and further improve the packaging effect of the display panel 10 .

[0091] In some embodiments, the material of the planarization layer 9 includes an organic material. When the planarization layer 9 is made of an organic material, the organic material can be prepared to form the planarization layer 9 by using a technique such as IJP (Ink-Jet Printing).

[0092] The planarized film layer prepared by the IJP technology can accurately control the thickness of the film layer at different positions, so that the surface of the film layer finally prepared on the side away from the array substrate 1 is relatively flat, so as to improve the surface flatness of the first packaging layer 4. By filling the concave part, the surface of the display panel 10 is made smoother, avoiding affecting the display effect of the display panel 10, which helps to improve the performance of the display panel 10.

[0093] See also Figure 3 , the above-mentioned planarization layer 9 can be separated by the first packaging layer 4.

[0094] Specifically, the planarization layer 9 includes a plurality of planarization units 91 disposed at intervals, and two adjacent planarization units 91 are separated by the first encapsulation layer 4 .

[0095] The orthographic projection of the first lifting portion 31 on the array substrate 1 and the orthographic projection of the flattening unit 91 on the array substrate 1 are arranged at intervals. At this time, the first packaging portion 41 can separate the flattening layer 9 under the lifting action of the first lifting portion 31 to reduce the overflow risk of the flattening layer 9 during the processing.

[0096] See also Figure 3 The first lifting portion 31 can cover the first end surface 202 of the isolation structure 2 located at the corresponding position.

[0097] In addition to the first lifting portion 31 , the lifting layer 3 further includes a second lifting portion 32 . The second lifting portion 32 is located in the isolation opening 201 and is connected to the adjacent first lifting portion 31 .

[0098] See also Figure 3 The display panel 10 has a plurality of isolation openings 201 arranged at intervals, wherein the isolation opening 201 in the middle is filled with the second lifting portion 32, and the first end surface 202 of the isolation structure 2 on the peripheral side of the isolation opening 201 in the middle is covered with the first lifting portion 31, and the first lifting portion 31 is connected to the second lifting portion 32.

[0099] Specifically, the lifting layer 3 formed by the cooperation of the first lifting portion 31 and the second lifting portion 32 constitutes the encapsulation of the corresponding isolation opening 201 .

[0100] In some embodiments, in addition to the first filling layer 52, the non-display area NA further includes a second filling layer 51, see Figure 3 .

[0101] Specifically, the second filling layer 51 is located between the lifting layer 3 and the array substrate 1. There are multiple second filling layers 51, which are sequentially arranged in the corresponding isolation openings 201. Along the thickness direction of the display panel 10, the second filling layer 51 and the first filling layer 52 are sequentially arranged, and the second filling layer 51 is located on the side of the lifting layer 3 close to the array substrate 1.

[0102] For the structure of the first filling layer 52, please refer to Figure 3 .

[0103] Specifically, the first filling layer 52 includes a first filling sub-portion 521 , wherein the first filling sub-portion 521 is arranged corresponding to the lifting layer 3 and is located at a side of the lifting layer 3 facing away from the array substrate 1 .

[0104] That is, the lifting layer 3 and the first filling sub-portion 521 are provided on the side of the second filling layer 51 facing away from the array substrate 1 , that is, the first filling sub-portion 521 and the lifting layer 3 are sequentially stacked on a portion of the second filling layer 51 .

[0105] See also Figure 3 In addition to the first filling sub-portion 521 , the first filling layer 52 further includes a second filling sub-portion 522 , and the second filling sub-portion 522 covers the first end surface 202 .

[0106] It should be noted that the second filling sub-portion 522 and the corresponding first lifting portion 31 cover the same first end surface 202 of the isolation structure 2 .

[0107] Specifically, in the lifting layer 3 and the first filling layer 52 arranged in sequence corresponding to the same isolation opening 201, the orthographic projection of the second filling sub-portion 522 on the array substrate 1 and the orthographic projection of the first lifting portion 31 on the array substrate 1 are arranged at intervals, or the orthographic projection outer contour of the second filling sub-portion 522 on the array substrate 1 and the orthographic projection outer contour of the first lifting portion 31 on the array substrate 1 coincide with each other.

[0108] In some embodiments, the first filling layer 52 further includes a third filling sub-portion 523 , and the third filling sub-portion 523 connects the first filling sub-portion 521 and the second filling sub-portion 522 , so that the first filling layer 52 forms a continuous film layer structure.

[0109] In the thickness direction of the display panel 10, there is a height difference between the end of the first filling sub-portion 521 close to the second filling sub-portion 522 and the end of the second filling sub-portion 522. The third filling sub-portion 523 extends along the outer edge of the lifting layer 3 to connect the first filling sub-portion 521 and the second filling sub-portion 522.

[0110] It should be noted that the adjacent first lifting portions 31 and the first end surface 202 are spaced apart from each other, and at this time, the first lifting portions 31 are suspended relative to the adjacent isolation structure 2 .

[0111] Since the first filling layer 52 covers a portion of the first end surface 202, the first filling layer 52 and the lifting layer 3 enclose a cavity S on the first end surface 202 of the isolation structure 2, see Figure 3 The cavity S is a closed chamber and is not connected to the external environment.

[0112] During the preparation of the first filling layer 52, the second filling sub-portion 522 in the first filling layer 52 is used to cover the first end surface 202 of the isolation structure 2, and the third filling sub-portion 523 in the first filling layer 52 is used to connect the second filling sub-portion 522 and the first filling sub-portion 521. In this way, during the preparation of the first filling layer 52, the first filling layer 52 contacts the first lifting portion 31 of the lifting layer 3 and covers the first end surface 202 of the isolation structure 2, and closes the space between the first lifting portion 31 and the first end surface 202 to form a closed chamber.

[0113] In some embodiments, see Figure 3 The display panel further includes a third filling layer 53. In a direction parallel to the plane where the array substrate 1 is located, the third filling layer 53 and the second filling layer 51 are respectively arranged in two adjacent isolation openings 201 and are arranged in the same layer.

[0114] The display area AA of the display panel 10 includes a light emitting element, and the second filling layer 51 is made of the same layer and material as the light emitting element. Correspondingly, the third filling layer 53 is also made of the same layer and material as the light emitting element.

[0115] When one or more third filling layers 53 disposed adjacent to the display area AA are powered, the corresponding third filling layers 53 can emit light. When not powered, the corresponding third filling layers 53 do not emit light.

[0116] It should be noted that the first filling layer 52 and the third filling layer 53 are made of the same material. Figure 3 .

[0117] In some embodiments, the materials of the first filling layer 52 and the second filling layer 51 are different; in special cases, the material of the first filling layer 52 and the material of the second filling layer 51 may also be the same.

[0118] Specifically, the second filling layer, the first filling layer and the third filling layer are any one of the first light-emitting unit, the second light-emitting unit and the third light-emitting unit that emit different colors under power-on condition.

[0119] In some embodiments, the emission color of at least one third filling layer 53 adjacent to the first filling layer 52 is the same as the emission color of the corresponding first filling layer 52 and the film material is consistent.

[0120] The second filling layer 51 located between the first filling layer 52 and the array substrate 1 and the third filling layer 53 arranged on the same layer are prepared by different processes respectively, so the emission color of the second filling layer 51 can be different from the emission color of the third filling layer 53; correspondingly, the first filling layer 52 and the third filling layer in the adjacent partial isolation opening 201 are prepared by the same process, so their emission colors are the same.

[0121] During the preparation process, the film layer obtained in the previous step can have the effect of raising the thickness of the film layer at some positions within the non-display area NA. At this time, the film layers prepared in the subsequent processes respectively cover different areas of the display panel 10 and form the first filling layer 52 and the third filling layer 53 respectively.

[0122] In some embodiments, each of the above-mentioned filling layers can be prepared by evaporation.

[0123] Specifically, the second filling layer 51 may be formed in the isolation opening 201 by evaporation, and the first filling layer 52 and the third filling layer may be formed on the isolation structure 2 and the lifting layer 3 on the side away from the array substrate 1 by evaporation.

[0124] Specifically, the second filling layer 51 , the first filling layer 52 and the third filling layer 53 emitting different colors under power-on conditions all include a light-emitting material layer 501 and a first electrode layer 502 stacked in sequence.

[0125] In a direction parallel to the plane where the array substrate 1 is located, the light emitting material layer 501 and the first electrode layer 502 in the adjacent third filling layer 53 and first filling layer 52 are made of the same material.

[0126] In some embodiments, the emission wavelength of the first light emitting unit may be smaller than the emission wavelength of the second light emitting unit, and the emission wavelength of the second light emitting unit may be smaller than the emission wavelength of the third light emitting unit.

[0127] The luminescent material layer 501 may be made of organic small molecule luminescent materials, complex luminescent materials, and high molecular polymers. Different luminescent material layers 501 can emit light of different colors when powered on. In other words, the luminescent material layers 501 in the first luminescent unit, the second luminescent unit, and the third luminescent unit are made of different materials and emit different colors of light.

[0128] Specifically, the light-emitting wavelength of the light-emitting material layer 501 in the first light-emitting unit under the power-on condition can be set to be smaller than the light-emitting wavelength of the light-emitting material layer 501 in the second light-emitting unit under the power-on condition. The light-emitting wavelength of the light-emitting material layer 501 in the second light-emitting unit under the power-on condition is smaller than the light-emitting wavelength of the light-emitting material layer 501 in the third light-emitting unit under the power-on condition.

[0129] Generally speaking, the luminescent material layer 501 in the first luminescent unit can be configured to emit blue light when powered on, the luminescent material layer 501 in the second luminescent unit can be configured to emit green light when powered on, and the luminescent material layer 501 in the third luminescent unit can be configured to emit red light when powered on.

[0130] See also Figure 3 In the figure, the third light emitting unit constitutes the first filling layer 52 and the third filling layer 53 , and correspondingly, the first light emitting unit constitutes the second filling layer 51 located between the first filling layer 52 and the array substrate 1 .

[0131] In other embodiments, a second filling layer 51 located between the first filling layer 52 and the array substrate 1 may also be provided and composed of second light emitting units.

[0132] See also Figure 4 In the figure, two adjacent isolation openings 201 are filled with a second filling layer 51 and a third filling layer 53, respectively, wherein the second filling layer 51 and the third filling layer 53 are respectively composed of a first light-emitting unit and a second light-emitting unit. In addition, the second filling layer 51 is provided with a lifting layer 3 and a first filling layer 52 on the side facing away from the array substrate 1.

[0133] The second filling layer 51 is disposed in the isolation opening 201 and connected to a side of the isolation structure 2 facing the isolation opening 201 .

[0134] See also Figure 3 In the figure, the first electrode layer 502 of the second filling layer 51 is connected to the side wall of the isolation structure 2 facing the isolation opening 201.

[0135] Specifically, the first electrode layer 502 is a cathode layer. The first electrode layer 502 overlaps with a side of the isolation structure 2 close to the array substrate 1 .

[0136] In some embodiments, the isolation structure 2 includes a first isolation portion 21 and a second isolation portion 22 stacked in sequence, wherein the second isolation portion 22 is located on a side of the first isolation portion 21 away from the array substrate 1 , and the first end surface 202 is located at an end of the second isolation portion 22 away from the first isolation portion 21 .

[0137] Specifically, the orthographic projection of the first isolation portion 21 on the array substrate 1 is located within the orthographic projection range of the second isolation portion 22 on the array substrate 1 , and at this time, the isolation structure 2 as a whole presents a “wide at the top and narrow at the bottom” shape.

[0138] In some embodiments, the first isolation portion 21 of the isolation structure 2 is a conductive structure, and the first isolation portion 21 may be a single-layer structure or a multi-layer structure.

[0139] When the first isolation portion 21 is a multi-layer structure, the first isolation portion 21 may include at least two sub-support portions 211 stacked in sequence.

[0140] Specifically, the orthographic projection of the sub-support portion 211 far from the array substrate 1 on the array substrate 1 is located within the orthographic projection range of the sub-support portion 211 close to the array substrate 1 on the array substrate 1 .

[0141] In some embodiments, the orthographic projection of the sub-support portion 211 closest to the array substrate 1 on the array substrate 1 is located within the orthographic projection range of the second isolation portion 22 on the array substrate 1 .

[0142] The side wall of the sub-support portion 211 far from the array substrate 1 facing the isolation opening 201 is offset toward a direction away from the isolation opening 201 relative to the side wall of the sub-support portion 211 close to the array substrate 1 facing the isolation opening 201, thereby making the cross-sectional side wall of the isolation structure 2 present a shape similar to an eaves.

[0143] Of course, in other similar embodiments, the size and projection relationship between the first isolation portion 21 and the second isolation portion 22 may also be adaptively adjusted according to actual processing requirements.

[0144] In some embodiments, the first isolation portion 21 and the second isolation portion 22 are shaped like a rectangle or a trapezoid in cross section.

[0145] In some embodiments, the first isolating portion 21 and the second isolating portion 22 may be an integrally formed structure, or may be formed by stacking different materials.

[0146] Specifically, the material of the second isolation part 22 includes metallic titanium, which is a titanium metal layer; the material of the sub-support part 211 far from the array substrate 1 includes metallic aluminum, which is an aluminum metal layer; the material of the sub-support part 211 close to the array substrate 1 includes at least one of molybdenum and molybdenum nitride, which is a molybdenum metal layer.

[0147] The first electrode layer 502 in the second filling layer 51 overlaps with the side wall of the first isolation portion 21 in the isolation structure 2. Specifically, the first electrode layer 502 may overlap only with the sub-support portion 211 close to the array substrate 1, see Figure 3 ; It can also overlap with two sub-support parts 211 at the same time, please refer to Figure 5 .

[0148] The non-display area NA further includes a second electrode layer 7 , which is arranged corresponding to the isolation opening 201 , and the second filling layer 51 may be connected to the second electrode layer 7 through the light emitting material layer 501 .

[0149] When the first electrode layer 502 is a cathode layer, the second electrode layer 7 is an anode layer; of course, the first electrode layer 502 can also be adjusted to be an anode layer as needed, and the second electrode layer 7 is a cathode layer.

[0150] The preparation and processing methods of the first electrode layer 502, the light-emitting material layer 501 and the second electrode layer 7 are prior arts and will not be described in detail herein.

[0151] A pixel definition layer 6 is also disposed in the non-display area NA.

[0152] See also Figure 3-Figure 4 The pixel definition layer 6 is located between the array substrate 1 and the isolation structure 2. The pixel definition layer 6 defines a plurality of pixel openings 601, and the pixel openings 601 are arranged correspondingly to and communicate with the isolation openings 201.

[0153] The pixel definition layer 6 is an inorganic layer that can be used to define the pixel range to ensure that each pixel is independent of each other. It can also block water vapor in the array substrate 1 to prevent external factors such as water and oxygen from corroding the relevant film layer located on the side of the pixel definition part away from the array substrate 1.

[0154] See also Figure 3 The second electrode layer 7 is located between the array substrate 1 and the pixel definition layer 6 and can be exposed relative to the pixel opening 601 and adhere to the light emitting material layer 501 .

[0155] The structure of the first encapsulation layer 4 is introduced below:

[0156] Specifically, the first encapsulation layer 4 includes a first encapsulation portion 41 and a second encapsulation portion 42 connected to each other, wherein the first encapsulation portion 41 is located on a side of the first filling layer 52 away from the array substrate 1, and the second encapsulation portion 42 is used to connect adjacent first encapsulation portions 41, see Figure 3 .

[0157] Specifically, the orthographic projection of the first packaging part 41 on the array substrate 1 covers the orthographic projection of the corresponding isolation opening 201 on the array substrate 1 , and the corresponding isolation opening 201 is located on a side of the first packaging part 41 close to the array substrate 1 .

[0158] See also Figure 3 At this time, the orthographic projection of the second packaging portion 42 on the array substrate 1 covers the orthographic projection of at least one isolation opening 201 adjacent to the corresponding isolation opening 201 on the array substrate 1; in other embodiments, refer to Figure 4 At least two corresponding isolation openings 201 are arranged adjacent to each other, and at this time, two first filling layers 52 are arranged adjacent to each other.

[0159] The above-mentioned second packaging part 42 includes a first packaging sub-part 421 and a second packaging sub-part 422, wherein the first packaging sub-part 421 is spaced apart from the first end face 202 of the adjacent isolation structure 2, that is, suspended relative to the first end face 202; the second packaging sub-part 422 is used to connect the above-mentioned first packaging sub-part 421 and the first packaging part 41.

[0160] Specifically, the first packaging sub-portion 421 is located on the side of the first end surface 202 away from the array substrate 1 and is suspended relative to the first end surface 202, the second packaging sub-portion 422 covers the third filling layer 53 located in the corresponding isolation opening 201, and one end of the second packaging sub-portion 422 extends through the side wall of the isolation structure 2 to be connected to the first packaging sub-portion 421, and the other end of the second packaging sub-portion 422 extends through the side wall of the isolation structure 2 to be connected to the first packaging sub-portion 41.

[0161] It should be noted that the first encapsulation layer 4 may be a thin film layer prepared by chemical vapor deposition (CVD) technology.

[0162] The first encapsulation layer 4 may be made of at least one of an organic material and an inorganic material by using a CVD technique.

[0163] Under the action of the second encapsulation sub-part 422, the second encapsulation part 42 is connected to the first encapsulation part 41 to form a continuous film layer structure, namely the first encapsulation layer 4. The first encapsulation layer 4 can be used to achieve preliminary encapsulation of the non-display area NA film layer.

[0164] The first encapsulation layer 4 can be used to enhance the sealing of the non-display area NA, reduce the possibility of water and oxygen in the external environment invading the display area AA through the non-display area NA, and at the same time help to improve the structural stability and mechanical strength of the display panel 10, so that the display panel 10 can better withstand external pressure and stress without deformation and damage, thereby improving the reliability and use effect of the display panel 10.

[0165] In some embodiments, the lifting layer 3 and the first encapsulation layer 4 can be prepared by the same process.

[0166] It should be noted that in this embodiment and other similar embodiments, a frame area is provided outside the non-display area NA, and a retaining wall is provided inside the frame area. The structure of the retaining wall has been disclosed in the relevant technology and will not be described in detail here.

[0167] After the first encapsulation layer 4 is applied to encapsulate the surface of the non-display area NA, the planarization layer 9 and other film layer structures may be disposed on the surface of the first encapsulation layer 4 facing away from the array substrate 1 to further encapsulate the display panel 10 .

[0168] Specifically, the non-display area NA further includes a second encapsulation layer 8 covering the first encapsulation layer 4 .

[0169] See also Figure 3-Figure 4 The second encapsulation layer 8 covers the planarization layer 9 , and the planarization layer 9 is located between the first encapsulation layer 4 and the second encapsulation layer 8 .

[0170] In other embodiments, the second encapsulation layer 8 may be a single-layer structure or a multi-layer structure. The second encapsulation layer 8 may be an organic encapsulation film layer or an inorganic encapsulation film layer. Of course, when the second encapsulation layer 8 is a multi-layer structure, the second encapsulation layer 8 may also include an organic encapsulation film layer and an inorganic encapsulation film layer, respectively.

[0171] In this embodiment or other similar embodiments, at least one film layer structure selected from the group consisting of a touch layer, an organic adhesive layer, and a cover plate may be further disposed on the side of the second packaging layer 8 facing away from the array substrate 1 .

[0172] It can be understood that the display panel 10 provided in the embodiment of the present application can increase the thickness of the corresponding position of the display panel 10 by setting a first lifting portion 31 outside the first end surface 202 of the partial isolation structure 2 in the non-display area NA, thereby forming a structure similar to a retaining wall in the non-display area NA, so as to improve the possibility of the non-display area NA blocking water and oxygen in the external environment from invading the display area AA, so as to improve the reliability of the display panel 10 and make the display panel 10 have a better display effect; in addition, the regular arrangement of the above-mentioned first lifting portion 31 can play the role of blocking the planarization layer 9, so as to improve the overflow failure of the planarization layer 9, help improve the packaging effect of the display panel 10, and further improve the performance of the display panel 10.

[0173] In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel 10, wherein the display panel 10 includes a display area AA and a non-display area NA, wherein the non-display area NA has an array substrate 1, and the method includes:

[0174] Step S1: forming an isolation structure 2 on one side of the array substrate 1, the isolation structure 2 encloses a plurality of isolation openings 201, and an end of the isolation structure 2 facing away from the array substrate 1 is a first end surface 202;

[0175] Step S2: forming a lifting layer 3 on a side of the partial isolation structure 2 away from the array substrate 1 , wherein the lifting layer 3 includes a first lifting portion 31 , and the first lifting portion 31 covers a first end surface 202 close to the isolation opening 201 ;

[0176] Step S3 : forming a filling material layer and a first packaging layer 4 on the side of the isolation opening 201 and the isolation structure 2 facing away from the array substrate 1 .

[0177] The filling material layer covers the portion of the lifting layer 3 away from the array substrate 1 to form a first filling layer 52 , and the first packaging layer 4 covers the filling material layer.

[0178] Please refer to the above preparation method Figure 6 .

[0179] In the method for preparing the display panel 10 provided in the embodiment of the present application, a structure similar to a retaining wall can be formed on the non-display area NA by covering the first lifting portion 31 and the first filling layer 52 of the first end surface 202 of the array substrate 1. The retaining wall structure can help to increase the step difference of the first encapsulation layer 4 that subsequently covers the first lifting portion 31, the first filling layer 52 and the isolation structure 2 at different positions, thereby increasing the difficulty of water vapor in the external environment invading the display area AA of the display panel 10 through the non-display area NA, improving the reliability of the display panel 10, and making the display panel 10 have better performance.

[0180] In some embodiments, a side of the first encapsulation layer 4 facing away from the array substrate 1 is covered with a planarization layer 9 .

[0181] At this time, the above-mentioned retaining wall-like structure formed by the first lifting portion 31, the first filling layer 52 and the first encapsulation layer 4 helps to improve the overflow problem of the planarization layer 9, helps to improve the display effect of the display panel 10, and further prevents water, oxygen and the like from corroding the display area AA, thereby achieving the purpose of improving the performance of the display panel 10.

[0182] The isolation opening 201 includes a first opening and a second opening, wherein the first opening is covered by the lifting layer 3. The orthographic projection of the lifting layer 3 on the array substrate 1 covers the orthographic projection of the first opening on the array substrate 1, and at the same time, the orthographic projection of the lifting layer 3 on the array substrate 1 is spaced from the orthographic projection of the second opening on the array substrate 1.

[0183] In some embodiments, a lifting layer 3 is formed on a side of a portion of the isolation structure 2 away from the array substrate 1 , wherein the lifting layer 3 includes a first lifting portion 31 , and the first lifting portion 31 covers a first end surface 202 close to the isolation opening 201 , including:

[0184] A lifting layer 3 is prepared in the first opening and on a surface of the first end surface 202 close to the first opening which is away from the array substrate 1 .

[0185] Before performing the above steps, the method further includes: preparing a second filling layer 51 in the first opening.

[0186] Specifically, the preparation process of the second filling layer 51 and the lifting layer 3 is as follows:

[0187] In order, a light emitting material layer 501 , a first electrode layer 502 and a CVD layer are prepared on the side of the isolation structure 2 and the isolation opening 201 facing away from the array substrate 1 ;

[0188] The light-emitting material layer 501 , the first electrode layer 502 and the CVD layer are patterned to form a second filling layer 51 and a lifting layer 3 located in the corresponding isolation opening 201 , wherein the first lifting portion 31 of the lifting layer 3 is located on the side of the isolation structure 2 away from the array substrate 1 .

[0189] The intermediate structure of the display panel 10 prepared as above is shown in FIG. Fig. 7A .

[0190] In some embodiments, the above-mentioned steps S2 and S3 also include preparing a filling material layer in the non-display area NA, namely the light-emitting material layer 501 and the first electrode layer 502 mentioned above, and the filling material layer located in the above-mentioned second opening forms a third filling layer 53, and the filling material layer located on the side of the lifting layer 3 away from the array substrate 1 forms a first filling layer 52.

[0191] After the first filling layer 52 and the third filling layer 53 are prepared, the first encapsulation layer 4 is formed on the side of the isolation structure 2 away from the array substrate 1 , and the first encapsulation layer 4 covers the first filling layer 52 , the third filling layer 53 and the isolation structure 2 .

[0192] In some embodiments, after step S3 , the process further includes sequentially stacking a planarization layer 9 and a second packaging layer 8 on a side of the first packaging layer 4 facing away from the array substrate 1 , so as to planarize the surface of the display panel 10 and further improve the packaging effect of the display panel 10 .

[0193] In the manufacturing method, the specific structure of the display panel 10 may refer to the structure in any embodiment of the display panel 10 described above, and will not be described in detail here.

[0194] Below, taking the example that the luminous colors of the first filling layer 52 and the third filling layer 53 are red (that is, the third light-emitting unit is prepared to form the first filling layer 52 and the third filling layer 53), and the luminous color of the second filling layer 51 is blue (that is, the first light-emitting unit is prepared to form the second filling layer 51) as an example, the preparation process of the non-display area NA of the above-mentioned display panel 10 is specifically described to intuitively demonstrate the influence of the lifting layer 3, the second filling layer 51 and the first filling layer 52 in cooperation with the first encapsulation layer 4 on the film thickness of the non-display area NA, as well as the principle that can achieve the improvement of the encapsulation performance and anti-overflow effect of the display panel 10.

[0195] When preparing the lifting layer 3, each isolation opening 201 and the first end face 202 of the isolation structure 2 are provided with the above-mentioned first light-emitting unit for forming the second filling layer 51, and the side of the above-mentioned first light-emitting unit facing away from the array substrate 1 is covered with a CVD layer. Subsequently, the first light-emitting unit and the CVD layer located in the first end face 202 and part of the isolation opening 201 (referring to the isolation opening 201 used to accommodate light-emitting units of other colors) are removed. In this process, the first light-emitting unit and the CVD layer formed in the correct position can be left in the corresponding isolation opening 201 under the protection of the photoresist and form the second filling layer 51. At this time, the CVD layer can be used to protect the first light-emitting unit located in the isolation opening 201 to prevent the first light-emitting unit from being etched and removed. The CVD layer forms the lifting layer 3.

[0196] Based on this method, we can get Fig. 7A The structure of the display panel 10 is shown.

[0197] The isolation structure 2 is prepared again to obtain a third light emitting unit covering all the isolation openings 201 and the first end surface 202 of the isolation structure 2. Subsequently, the CVD layer is covered on the side of the third light emitting unit away from the array substrate 1 to obtain the following Figure 7B The structure of the display panel 10 is shown. In this process, the third light-emitting unit is separated by the isolation structure 2, wherein: the third light-emitting unit located on the side of the lifting layer 3 away from the array substrate 1 is used to form the first filling layer 52, and the third light-emitting unit located in the isolation opening 201 and in contact with the second electrode layer 7 is used to form the third filling layer 53. At this time, the CVD layer covers the first filling layer 52 and the third filling layer 53 and forms the first encapsulation layer 4.

[0198] Finally, the planarization layer 9 and the second encapsulation layer 8 can be sequentially covered on the side of the first encapsulation layer 4 away from the array substrate 1, and a display panel 10 that meets the design requirements can be obtained. The structure of the display panel 10 is as follows: Figure 7C shown.

[0199] Please note that Figure 7A-7CIt is only used to explain the processing technology. The arrangement positions and arrangement order of the various light-emitting units and light-transmitting openings in the figure are only for illustration and are not intended to limit the arrangement mode and layout of the above-mentioned structures.

[0200] The manufacturing method of the display panel 10 provided in this embodiment can increase the thickness of a part of the non-display area NA by only patterning the front pixels, thereby forming a barrier-like effect in the non-display area NA, so that a structure with a certain barrier function is formed outside the display area AA. This structure can reduce the overflow risk of the planarization layer 9, improve the ability of the display panel 10 to resist water vapor intrusion, and improve the packaging effect and performance of the display panel 10.

[0201] In a fourth aspect, the present application further provides a display device 100, comprising the display panel 10 described in any one of the above items, see Figure 8 The display device 100 includes any one of the display panels 10 described above. The display panel 10 may be the display panel 10 described above, or may be a display panel 10 prepared by the preparation method described above.

[0202] The display device 100 provided in this embodiment can be a product or component with a display function such as a mobile phone, a notebook, a tablet computer, a smart watch, a smart bracelet, a navigator, a display, a personal digital assistant (PDA), etc. Since the display device 100 provided in the embodiment of the present application includes the above-mentioned display panel 10, the display device 100 at least includes the beneficial effects of any one or more of the above-mentioned display panels 10. The specific effects refer to the specific description in the above-mentioned embodiments, which will not be repeated here.

[0203] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel (10) comprises a display area (AA) and a non-display area (NA), wherein the non-display area (NA) is arranged around the outer periphery of the display area (AA); The non-display area (NA) includes: An array substrate (1); An isolation structure (2) located on the array substrate (1), the isolation structure (2) enclosing a plurality of isolation openings (201), and an end of the isolation structure (2) facing away from the array substrate (1) being a first end surface (202); A lifting layer (3) located on the array substrate (1), the lifting layer (3) comprising a first lifting portion (31) located on a side of the isolation structure (2) away from the array substrate (1); a first filling layer (52), the first filling layer (52) being located on a side of the lifting layer (3) facing away from the array substrate (1), the orthographic projection of the first filling layer (52) on the array substrate (1) covering the orthographic projection of the first lifting portion (31) on the array substrate (1); The first packaging layer (4) is located on a side of the first filling layer (52) away from the array substrate (1).

2. The display panel according to claim 1, characterized in that: The lifting layer (3) further comprises a second lifting portion (32) located in the isolation opening (201), wherein the second lifting portion (32) is connected to the adjacent first lifting portion (31).

3. The display panel according to claim 1, characterized in that: The orthographic projection of the first filling layer (52) on the array substrate (1) covers the orthographic projection of the corresponding isolation opening (201) on the array substrate (1), and the corresponding isolation opening (201) is located on a side of the first filling layer (52) close to the array substrate (1); Preferably, at least two of the correspondingly arranged isolation openings (201) are arranged adjacent to each other; Preferably, the orthographic projection of at least one of the isolation openings (201) adjacent to the correspondingly arranged isolation opening (201) on the array substrate (1) is spaced apart from the orthographic projection of the first filling layer (52) on the array substrate (1).

4. The display panel according to claim 1, characterized in that: The first filling layer (52) comprises a first filling sub-portion (521), a second filling sub-portion (522) and a third filling sub-portion (523); the first filling sub-portion (521) is arranged corresponding to the lifting layer (3) and is located on the side of the lifting layer (3) away from the array substrate (1); the second filling sub-portion (522) covers the first end surface (202); and the third filling sub-portion (523) connects the first filling sub-portion (521) and the second filling sub-portion (522).

5. The display panel according to claim 4, characterized in that: A cavity (S) is provided between the first filling layer (52), the lifting layer (3) and the first end surface (202).

6. The display panel according to claim 1, characterized in that: The display panel (10) further comprises a second filling layer (51), wherein the second filling layer (51) is arranged in the corresponding isolation opening (201) and is located on a side of the lifting layer (3) close to the array substrate (1); Preferably, the display panel (10) further comprises a third filling layer (53); in a direction parallel to the plane where the array substrate (1) is located, the third filling layer (53) and the second filling layer (51) are respectively arranged in two adjacent isolation openings (201) and are arranged in the same layer; Preferably, the display area (AA) of the display panel (10) comprises a light-emitting element, and the second filling layer (51) is formed from the same layer and material as the light-emitting element.

7. The display panel according to claim 6, characterized in that: The third filling layer (53) is made of the same material as the first filling layer (52); Preferably, the second filling layer (51) and the third filling layer (53) are made of different materials.

8. The display panel according to claim 7, characterized in that: The second filling layer (51), the first filling layer (52) and the third filling layer (53) all include a light-emitting material layer (501) and a first electrode layer (502) stacked in sequence; Preferably, part of the first electrode layer (502) is connected to a side of the isolation structure (2) facing the isolation opening (201); Preferably, the first electrode layer (502) is a cathode layer.

9. The display panel according to claim 1, characterized in that: The non-display area (NA) further comprises a pixel definition layer (6), the pixel definition layer (6) being located between the array substrate (1) and the isolation structure (2), the pixel definition layer (6) defining a plurality of pixel openings (601), the pixel openings (601) being arranged correspondingly to and communicating with the isolation openings (201); Preferably, the non-display area (NA) further comprises a second electrode layer (7), the second electrode layer (7) being located between the array substrate (1) and the pixel definition layer (6), and a portion of the second electrode layer (7) being exposed through the pixel opening (601); Preferably, the second electrode layer (7) is an anode layer.

10. The display panel according to claim 1, characterized in that: The isolation structure (2) comprises a first isolation portion (21) and a second isolation portion (22) sequentially stacked on the array substrate (1), and the first end surface (202) is located at an end of the second isolation portion (22) away from the first isolation portion (21); The orthographic projection of the first isolation portion (21) on the array substrate (1) is located within the orthographic projection range of the second isolation portion (22) on the array substrate (1); Preferably, the first isolation portion (21) is a conductive structure; Preferably, the first isolation portion (21) comprises at least two sub-support portions (211), and an orthographic projection of the sub-support portion (211) farther from the array substrate (1) on the array substrate (1) is located within the range of an orthographic projection of the sub-support portion (211) closer to the array substrate (1) on the array substrate (1); Preferably, the orthographic projection of the sub-support portion (211) closest to the array substrate (1) on the array substrate (1) is located within the range of the orthographic projection of the second isolation portion (22) on the array substrate (1).

11. The display panel according to claim 1, characterized in that: The first encapsulation layer (4) comprises a first encapsulation portion (41) and a second encapsulation portion (42) which are connected to each other, the first encapsulation portion (41) being located on a side of the first filling layer (52) away from the array substrate (1), and the second encapsulation portion (42) being connected to adjacent first encapsulation portions (41); The orthographic projection of the first packaging portion (41) on the array substrate (1) covers the orthographic projection of the corresponding isolation opening (201) on the array substrate (1), and the corresponding isolation opening (201) is located on a side of the first packaging portion (41) close to the array substrate (1); Preferably, at least two of the correspondingly arranged isolation openings (201) are arranged adjacent to each other; Preferably, the orthographic projection of the second packaging portion (42) on the array substrate (1) covers the orthographic projection of at least one of the isolation openings (201) adjacent to the correspondingly arranged isolation opening (201) on the array substrate (1).

12. The display panel according to claim 11, characterized in that: The second packaging part (42) comprises a first packaging sub-part (421) and a second packaging sub-part (422), wherein the first packaging sub-part (421) is located on a side of the first end surface (202) away from the array substrate (1) and the first packaging sub-part (421) is spaced apart from the first end surface (202), and the second packaging sub-part (422) connects the first packaging sub-part (421) and the first packaging part (41).

13. The display panel according to claim 1, characterized in that: The non-display area (NA) further comprises a second encapsulation layer (8) covering the first encapsulation layer (4); Preferably, the non-display area (NA) further comprises a planarization layer (9), and the planarization layer (9) is located between the first encapsulation layer (4) and the second encapsulation layer (8); Preferably, the material of the planarization layer (9) includes an organic material; Preferably, the planarization layer (9) comprises a plurality of planarization units (91) arranged at intervals, and two adjacent planarization units (91) are separated by the first encapsulation layer (4); Preferably, the orthographic projection of the first lifting portion (31) on the array substrate (1) and the orthographic projection of the flattening unit (91) on the array substrate (1) are arranged alternately.

14. A method for preparing a display panel, characterized in that: include: An isolation structure (2) is formed on one side of the array substrate (1), the isolation structure (2) encloses a plurality of isolation openings (201), and an end of the isolation structure (2) facing away from the array substrate (1) is a first end surface (202); A lifting layer (3) is formed on a side of a portion of the isolation structure (2) facing away from the array substrate (1), the lifting layer (3) comprising a first lifting portion (31), the first lifting portion (31) covering the first end surface (202) close to the isolation opening (201); forming a filling material layer and a first packaging layer (4) on a side of the isolation opening (201) and the isolation structure (2) facing away from the array substrate (1); The filling material layer covers the portion of the lifting layer (3) away from the array substrate (1) to form a first filling layer (52).

15. The method for preparing a display panel according to claim 14, characterized in that: The isolation opening (201) comprises a first opening and a second opening that are adjacent to each other; The step of forming a lifting layer (3) on a side of a portion of the isolation structure (2) away from the array substrate (1), wherein the lifting layer (3) comprises a first lifting portion (31), and the first lifting portion (31) covers the first end surface (202) close to the isolation opening (201), comprises: A lifting layer (3) is prepared on a surface of the first end surface (202) in the first opening and close to the first opening, which is away from the array substrate (1); Preferably, before the step of preparing the lifting layer (3) on the surface of the first end surface (202) in the first opening and close to the first opening and facing away from the array substrate (1), the step further comprises: Preparing a second filling layer (51) in the first opening; Preferably, the portion of the filling material layer located at the second opening forms a third filling layer (53).

16. A display device, characterized in that: Comprising a display panel (10), wherein the display panel (10) is the display panel (10) according to any one of claims 1 to 13, or a display panel (10) prepared by the preparation method according to claim 14 or 15.

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