Display panel, preparation method of display panel and display device

Abstract

The invention relates to the technical field of display, and particularly provides a display panel, a preparation method of the display panel and a display device.The display panel is provided with a display area and a non-display area, the display panel comprises a substrate, an isolation structure and a first power line, the isolation structure is located on one side of the substrate and located in the display area, and the isolation structure is located on the other side of the substrate and located in the non-display area. The isolation structure comprises a conductive material; the first power line is located on one side of the substrate and located in the non-display area, and the first power line and the isolation structure are arranged on the same layer and connected. According to the display panel and the preparation method thereof, the processing property of the display panel can be improved to a certain extent.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, to a display panel, a method for preparing the display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as OLED have the advantages of high image quality, power saving, thin body and wide application range, and are widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc., becoming the mainstream in display devices.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the invention

[0004] The present application provides a display panel, a method for manufacturing the display panel, and a display device, so as to improve the process performance of the display panel at least to a certain extent.

[0005] To achieve the above-mentioned objectives, the technical solution adopted in the present application is: in the first aspect, a display panel is provided, having a display area and a non-display area, the display panel comprising a substrate, an isolation structure and a first power line, wherein the isolation structure is located on one side of the substrate and in the display area, and the isolation structure comprises a conductive material; the first power line is located on one side of the substrate and in the non-display area, and the first power line is arranged on the same layer as the isolation structure and is connected to the first power line.

[0006] In the display panel provided in the embodiment of the present application, by adjusting the connected first power lines to be arranged in the same layer and connected to the isolation structure, the corresponding signal transmission can be conveniently and quickly realized, and the related processing steps can be saved, thereby improving and enhancing the process performance of the display panel.

[0007] Optionally, the substrate is a rigid substrate.

[0008] Optionally, the first power line and the isolation structure are made of the same material.

[0009] Optionally, the display panel further includes a plurality of light emitting devices, the isolation structure defines a plurality of isolation openings, at least a portion of the light emitting devices are located within the corresponding isolation openings, and the light emitting devices include a first electrode, which is electrically connected to the first power line through the isolation structure.

[0010] Optionally, the display panel further comprises a pixel definition layer, wherein the pixel definition layer is located on one side of the substrate, and the isolation structure is located on a side of the pixel definition layer facing away from the substrate;

[0011] The pixel definition layer defines a plurality of pixel openings, the pixel openings are arranged correspondingly to and communicate with the isolation openings, and at least a portion of the light emitting device covers the corresponding pixel openings.

[0012] Optionally, at least part of the first power lines are located on a side of the pixel definition layer facing away from the substrate.

[0013] Optionally, an orthographic projection of the first power line on the substrate is located within an orthographic projection of the pixel definition layer on the substrate.

[0014] Optionally, the light emitting device comprises a second electrode, the second electrode is located between the pixel definition layer and the substrate, and the pixel opening exposes the second electrode.

[0015] Optionally, the light emitting device comprises a light emitting functional layer, and the light emitting functional layer covers the pixel opening and is connected to the second electrode.

[0016] Optionally, the substrate includes a second power line and a pixel circuit, and the second power line is electrically connected to the pixel circuit;

[0017] The second power line is located in the non-display area, and the pixel circuit is electrically connected to the second electrode of the light emitting device.

[0018] Optionally, an orthographic projection of the second power line in the thickness direction of the substrate is spaced apart from an orthographic projection of the first power line in the thickness direction of the substrate.

[0019] Optionally, the number of the first power lines is two, and the orthographic projections of the two first power lines in the thickness direction of the substrate are respectively located on both sides of the orthographic projection of the second power line in the thickness direction of the substrate.

[0020] Optionally, the non-display area includes a bonding area and a border area, the border area is arranged around the display area, the border area includes a lower border area, the lower border area connects the display area and the bonding area, and the first power line extends from the lower border area to the bonding area.

[0021] Optionally, the bonding area is provided with a pad, and the first power line is connected to the pad.

[0022] Optionally, the border area further includes an upper border area, a left border area and a right border area, and a first wiring is provided in at least one of the upper border area, the left border area and the right border area, and the first wiring extends along the border area and is electrically connected to the first power line.

[0023] Optionally, the first wiring is a multi-layer conductive structure.

[0024] Optionally, the first wiring is a multi-layer metal layer.

[0025] Optionally, the first trace includes a first conductive layer, a second conductive layer and a third conductive layer stacked in sequence along a thickness direction of the substrate.

[0026] Optionally, the material of the first conductive layer includes titanium, the material of the second conductive layer includes aluminum, and the material of the third conductive layer includes titanium.

[0027] Optionally, the substrate includes a first planarization layer and a substrate, the first planarization layer is located between the substrate and the isolation structure, and the substrate is a rigid substrate.

[0028] Optionally, the material of the substrate includes at least one of glass and silicon wafer.

[0029] Optionally, the non-display area includes a bonding area and a border area arranged around the display area, the border area includes an upper border area, a left border area and a right border area, and a first routing line is provided in at least one of the left border area and the right border area, and the first routing line extends along the border area and is electrically connected to the first power line; at least a portion of the first routing line is located between the substrate and the first planarization layer, and the orthographic projection of the first routing line on the substrate is located within the orthographic projection range of the first planarization layer on the substrate.

[0030] Optionally, the first wiring is a multi-layer conductive structure.

[0031] Optionally, the first wiring is a multi-layer metal layer.

[0032] Optionally, the first trace includes a first conductive layer, a second conductive layer and a third conductive layer stacked in sequence along a thickness direction of the substrate.

[0033] Optionally, the material of the first conductive layer includes titanium, the material of the second conductive layer includes aluminum, and the material of the third conductive layer includes titanium.

[0034] Optionally, the non-display area further includes a bonding area, the frame area further includes a lower frame area, the lower frame area connects the display area and the bonding area, and the first power line extends from the lower frame area to the bonding area.

[0035] Optionally, the display panel further includes a plurality of first packaging parts, wherein the first packaging parts are located on a side of the corresponding light-emitting device facing away from the substrate.

[0036] Optionally, the first packaging part includes a first packaging sub-part and a second packaging sub-part that are connected, the first packaging sub-part is located on the side of the isolation structure facing away from the substrate, the second packaging sub-part is located on the side of the light-emitting device facing away from the substrate and covers the light-emitting device and at least part of the outer wall of the isolation structure close to the isolation opening.

[0037] Optionally, in a direction perpendicular to the substrate, there is a gap between adjacent first package sub-portions and the isolation structure.

[0038] Optionally, the isolation structure comprises a support portion and a crown portion which are stacked, the crown portion is located on a side of the support portion which faces away from the substrate, and the support portion and the crown portion enclose an isolation opening;

[0039] Wherein, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate.

[0040] Optionally, the supporting portion includes a first supporting portion and a second supporting portion, and the second supporting portion is located on a side of the first supporting portion facing away from the substrate.

[0041] Optionally, an orthographic projection of the second supporting portion on the substrate is located within an orthographic projection of the first supporting portion on the substrate.

[0042] Optionally, the orthographic projection of the first support portion on the substrate is located within the orthographic projection of the crown portion on the substrate.

[0043] Optionally, the material of the first supporting part includes molybdenum or titanium.

[0044] Optionally, the material of the second supporting part includes aluminum, copper or silver.

[0045] Optionally, the material of the crown includes titanium or molybdenum.

[0046] In a second aspect, the present application further provides a method for preparing a display panel, wherein the display panel has a display area and a non-display area, and the method comprises:

[0047] preparing an isolation forming layer on one side of the substrate;

[0048] Performing patterning on the isolation forming layer to obtain an isolation structure and a first power line, wherein the isolation structure is located in the display area and an isolation opening is defined on the isolation structure, and the first power line is located in the non-display area;

[0049] Wherein, the isolation structure is connected to the first power line.

[0050] In the display panel preparation method provided in the embodiment of the present application, by adjusting the processing technology so that the first power line and the isolation structure are arranged in the same layer and connected, the corresponding signal can be transmitted conveniently and quickly, and the related processing steps can be saved, which can improve and enhance the process performance of the display panel.

[0051] Optionally, the substrate is a rigid substrate.

[0052] In a third aspect, the present application further provides a display device, comprising the display panel described in any one of the above items, or comprising a display panel prepared by the above preparation method.

[0053] The display device provided in the embodiment of the present application includes the above-mentioned display panel, so the display device at least includes the beneficial effects of any one or several of the above-mentioned display panels. The specific effects are described above and will not be repeated here.

[0054] The beneficial effects of the display panel, the method for preparing the display panel, and the display device provided in the present application are: compared with the related art, the display panel provided in the present application can be directly connected to the isolation structure by adjusting the first power line and prepared from the same material, ensuring that the two are integrally formed, which can save related processing steps and realize effective transmission of signals between the isolation structure and the first power line, helping to improve the process performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0056] Figure 1 A schematic top view of a display panel provided in an embodiment of the present application;

[0057] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of the display panel along the cross-sectional line AA is shown;

[0058] Figure 3 for Figure 1 A schematic diagram of a cross-sectional structure of the display panel along the section line BB is shown;

[0059] Figure 4 for Figure 1 A schematic diagram of the cross-sectional structure of a display area in the display panel shown;

[0060] Figure 5 A top view of a display panel provided in another embodiment of the present application;

[0061] Figure 6 A flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0062] Figure 7 A schematic diagram of the planar structure of a display device provided in an embodiment of the present application.

[0063] Among them, the reference numerals in the figure are:

[0064] 100. Display device;

[0065] 10. Display panel; AA, display area; NA, non-display area; NA1, bonding area; NA2, border area; NA21, lower border area; NA22, upper border area; NA23, left border area; NA24, right border area;

[0066] 1. Substrate; 11. First planarization layer; 12. Underlying layer; 2. Isolation structure; 201. Isolation opening; 21. Supporting portion; 211. First supporting portion; 212. Second supporting portion; 22. Crown; 3. First power line; 4. Light-emitting device; 41. First electrode; 42. Second electrode; 43. Light-emitting functional layer; 5. Pixel definition layer; 501. Pixel opening; 6. Second power line; 7. First routing; 71. First conductive layer; 72. Second conductive layer; 73. Third conductive layer; 8. First packaging portion; 81. First packaging sub-portion; 82. Second packaging sub-portion; 9. Second packaging layer. DETAILED DESCRIPTION

[0067] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0068] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0069] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0070] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0071] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0072] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0073] In the present application, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0074] The term "substrate" as used herein refers to a material to which subsequent material layers are added, which is used to provide a supporting base for the layers above it. The substrate can be a single-layer structure or a multi-layer structure. The substrate can be transparent, translucent or opaque. In other embodiments, the substrate can be hard and made of a hard insulating material, such as metal, ultra-thin glass, plastic or sapphire wafer. The substrate itself can be patterned, and the material added on top of the substrate can be patterned, or it can remain unpatterned.

[0075] The term "layer" used in the text may refer to a material portion including an area with a certain thickness. A layer may extend over the entire underlying structure or overlying structure, or may have a range smaller than the range of the underlying or overlying structure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top surface and the bottom surface of the continuous structure or between any paired lateral planes at the top surface and the bottom surface. A layer may extend laterally, vertically and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers located thereon, above it and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductors and a contact layer (forming contacts, interconnects and / or vias therein) and one or more dielectric layers.

[0076] With the development of display technology, the types of display panels in the market have gradually increased, and the performance has been continuously improved. From the perspective of panel categories, they mainly include flexible screens made of flexible materials as substrates, and hard screens made of hard materials as substrates. Taking hard screens as an example, since hard screens do not have the characteristics of being bendable and foldable, it is generally necessary to arrange the integrated circuit on one side of the display area to achieve the connection between the integrated circuit and the circuits in the display area.

[0077] In the process of preparing the hard screen, the inventors found that the relevant technology has the following problems: in order to realize the electrical connection between the integrated circuit and the circuit in the display area, the display panel requires more processes, especially the hole engraving process for some film layers, which makes the processing technology of the display panel more complicated.

[0078] Based on this, the embodiment of the present application provides a display panel 10 to improve or alleviate the above technical problems at least to a certain extent, simplify the preparation process of the display panel 10, and improve the process performance of the display panel 10.

[0079] See also Figure 1 An embodiment of the present application provides a display panel 10 , which has a display area AA and a non-display area NA, wherein the display area AA and the non-display area NA are arranged adjacent to each other.

[0080] The display panel 10 also includes a substrate 1, an isolation structure 2 and a first power line 3. The isolation structure 2 is located on one side of the substrate 1 and in the display area AA. The isolation structure 2 includes a conductive material. The first power line 3 is located on one side of the substrate 1 and in the non-display area NA. The first power line 3 is arranged on the same layer as the isolation structure 2 and is connected to the first power line 3.

[0081] The isolation structure 2 and the first power line 3 are located on the same side of the substrate 1. Since the isolation structure 2 includes a conductive material and the first power line 3 is disposed on the same layer as the isolation structure 2 and connected, the first power line 3 also includes a conductive material. The connected isolation structure 2 and the first power line 3 can realize the transmission of related control signals or electrical signals under power-on conditions.

[0082] In some embodiments, the first power line 3 and the isolation structure 2 may be made of the same material. In addition, since the isolation structure 2 and the first power line 3 are arranged in the same layer and connected, the two may be an integrally formed structure and may be manufactured by the same process, which means that the process of the display panel 10 having the structure may be simplified to a certain extent, and the process optimization such as the punching of some film layers may be realized, which helps to improve and enhance the process performance of the display panel 10.

[0083] The first power line 3 can be used to transmit an ELVSS signal to the display area AA of the display panel 10. The ELVSS signal is used to communicate between different modules or components of the display panel 10 to transfer information such as display data and control instructions to achieve normal operation of the display panel 10.

[0084] In some embodiments, the substrate 1 is a rigid substrate.

[0085] The isolation structures 2 are evenly distributed in the display area AA, wherein part of the isolation structures 2 are located on the side of the display area AA close to the non-display area NA. The first power line 3 located in the non-display area NA can be connected to the isolation structure 2 adjacent to the non-display area NA, thereby realizing electrical connection between the first power line 3 and the isolation structure 2, which is helpful for signal transmission between the isolation structure 2 and the first power line 3.

[0086] The isolation structure 2 and the first power line 3 are connected at the boundary between the display area AA and the non-display area NA.

[0087] In some embodiments, the isolation structure 2 and the first power line 3 are located in the same layer.

[0088] Specifically, the isolation structure 2 and the first power line 3 may be a single-layer structure or a multi-layer structure. When the isolation structure 2 and the first power line 3 are both multi-layer structures, at least part of the film layers in the isolation structure 2 and the first power line 3 correspond to each other and are integrally formed, so as to realize normal transmission of signals between the isolation structure 2 and the first power line 3.

[0089] See also Figure 2 and Figure 4 The display panel 10 further includes a pixel definition layer 5, which is located on one side of the substrate 1, and the isolation structure 2 is located on the side of the pixel definition layer 5 facing away from the substrate 1. At least part of the first power line 3 is located on the side of the pixel definition layer 5 facing away from the substrate 1.

[0090] The first power line 3 and the isolation structure 2 are located in the same film layer.

[0091] In some embodiments, at least part of the film layer of the first power line 3 is located on the side of the pixel definition layer 5 facing away from the substrate 1. Further, the first power line 3 is located on the side of the pixel definition layer 5 facing away from the substrate 1, and the orthographic projection of the first power line 3 on the substrate 1 is located within the orthographic projection of the pixel definition layer 5 on the substrate 1.

[0092] The pixel definition layer 5 may be made of an inorganic material, such as silicon oxide, silicon nitride, etc.

[0093] See also Figure 4 The display panel 10 further includes a plurality of light emitting devices 4 , and the light emitting devices 4 are located in the display area AA of the display panel 10 .

[0094] Specifically, a plurality of isolation openings 201 are defined on the isolation structure 2 located in the display area AA, and at least a portion of the light-emitting device 4 is located in the corresponding isolation opening 201. The light-emitting device 4 includes a first electrode 41, and the first electrode 41 is connected to a portion of the side wall of the isolation structure 2 facing the isolation opening 201 to achieve electrical connection between the first electrode 41 and the isolation structure 2. Under power-on conditions, the first electrode 41 is electrically connected to the first power line 3 through the isolation structure 2.

[0095] The first electrode 41 is electrically connected to the isolation structure 2. Therefore, the signal transmitted to the corresponding isolation structure 2 through the first power line 3 can be transmitted to the first electrode 41 and directly act on the corresponding light-emitting device 4 to achieve light-emitting control of the light-emitting device 4 located in the relevant area, so as to achieve control and adjustment of the display content of the display panel 10.

[0096] Specifically, the isolation structure 2 having the isolation openings 201 may be distributed in a grid shape, and a plurality of isolation openings 201 are formed on the isolation structure 2 at intervals.

[0097] It should be noted that the isolation structure 2 with the isolation opening 201 can be evenly distributed in the display area AA, and it is also possible that some isolation structures 2 with the isolation opening 201 are distributed in the non-display area NA. This structure does not affect the normal connection between the isolation structure 2 and the first power line 3.

[0098] The contents of the isolation structure 2 mentioned below are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0099] The isolation structure 2 defines a plurality of isolation openings 201. The isolation structure 2 can realize the corresponding arrangement of the light-emitting devices 4 with different colors arranged at intervals without the need for a fine mask plate, thereby reducing the manufacturing cost of the display panel 10. The first electrode 41 in the manufactured light-emitting device 4 can be electrically connected to the first power line 3 through the isolation structure 2.

[0100] In some embodiments, the pixel definition layer 5 defines a plurality of pixel openings 501 . The pixel openings 501 are correspondingly arranged and communicated with the corresponding isolation openings 201 , and at least a portion of the light emitting device 4 covers the corresponding pixel openings 501 .

[0101] See also Figure 4 , at least part of the light emitting device 4 is located in the isolation opening 201, each isolation opening 201 can correspond to a light emitting device 4, and at least part of the isolation structure 2 is located between two adjacent light emitting devices 4 to achieve isolation of the two adjacent light emitting devices 4. At this time, different light emitting devices 4 can remain independent of each other to improve the crosstalk between adjacent light emitting devices 4 and enhance the display effect. In addition, this structural design also helps to independently package different light emitting devices 4 to enhance the packaging effect of the display panel 10.

[0102] In a direction perpendicular to the substrate 1 , the isolation structure 2 formed between two adjacent light emitting devices 4 is a columnar structure.

[0103] The isolation structure 2 can not only realize independent packaging of different light-emitting devices 4, but also realize whole-surface preparation and patterning processing of different light-emitting devices 4, thereby eliminating the use of fine mask plates, effectively reducing the preparation cost of the display panel 10, and optimizing the processing technology performance of the display panel 10.

[0104] See also Figure 4 The isolation structure 2 includes a support portion 21 and a crown portion 22 which are stacked, wherein the crown portion 22 is located at an end of the support portion 21 facing away from the substrate 1 , and the support portion 21 and the crown portion 22 enclose the isolation opening 201 .

[0105] The orthographic projection of the support portion 21 on the base plate 1 is located within the orthographic projection of the crown portion 22 on the base plate 1 .

[0106] In some embodiments, the support portion 21 of the isolation structure 2 may be a single-layer structure or a multi-layer structure.

[0107] When the support portion 21 is a multi-layer structure, the support portion 21 includes a first support portion 211 and a second support portion 212 stacked in sequence, and the second support portion 212 is located on a side of the first support portion 211 facing away from the substrate 1 .

[0108] The orthographic projection of the second support portion 212 on the substrate 1 is located within the orthographic projection of the first support portion 211 on the substrate 1 ; the orthographic projection of the first support portion 211 on the substrate 1 is located within the orthographic projection of the crown portion 22 on the substrate 1 .

[0109] In some embodiments, the side wall of the second support portion 212 facing the isolation opening 201 is offset toward the side away from the isolation opening 201 relative to the side wall of the first support portion 211 facing the pixel opening 501, so that the cross-sectional side wall of the isolation structure 2 presents a shape similar to an eaves.

[0110] Specifically, the side wall of the first support portion 211 close to the isolation opening 201 is the first side wall, and the side wall of the second support portion 212 close to the isolation opening 201 is the second side wall; wherein the second side wall is located on the side of the first side wall away from the isolation opening 201 .

[0111] Of course, in other similar embodiments, the sizes and projection relationships among the first support portion 211 , the second support portion 212 and the crown portion 22 may also be adaptively adjusted according to actual processing requirements.

[0112] In some embodiments, the first support portion 211 and the crown portion 22 are shaped like a rectangle or a trapezoid in cross section, and the second support portion 212 is shaped like a trapezoid in cross section.

[0113] In some embodiments, the first support portion 211, the second support portion 212 and the crown portion 22 may be an integrally formed structure, or may be formed by stacking different materials.

[0114] Specifically, the material of the crown portion 22 includes metal titanium or metal molybdenum; the material of the second support portion 212 includes at least one of metal aluminum, metal copper and metal silver; and the material of the first support portion 211 includes metal molybdenum or metal titanium.

[0115] Correspondingly, since the first power line 3 and the isolation structure 2 are made of the same material and are directly connected, the first power line 3 can also be a multi-layer structure.

[0116] Specifically, the first power line 3 in this embodiment includes a titanium metal layer, an aluminum metal layer and a molybdenum metal layer stacked in sequence along the thickness direction of the substrate 1, see Figure 2 .

[0117] Of course, when the materials of each film layer in the isolation structure 2 are changed, the corresponding film layer materials of the first power line 3 are also adjusted synchronously.

[0118] See also Figure 4 In addition to the first electrode 41, the light emitting device 4 further includes a second electrode 42 and a light emitting functional layer 43. The second electrode 42 is located between the pixel definition layer 5 and the substrate 1, and the pixel opening 501 exposes a portion of the surface of the second electrode 42 facing away from the substrate 1; the light emitting functional layer 43 covers the pixel opening 501 and is connected to the second electrode 42.

[0119] In some embodiments, the number of the first power line 3 is at least one. When the number of the first power lines 3 is at least two, different light emitting devices 4 can be connected to different first power lines 3 respectively.

[0120] In some embodiments, the first electrodes 41 in the plurality of light emitting devices 4 may be electrically connected to the same first power line 3 through the isolation structure 2. For example, the first electrodes 41 of some or all of the light emitting devices 4 may be electrically connected to the same first power line 3 through the isolation structure 2.

[0121] In some embodiments, the display panel 10 may be provided with at least two isolation structures 2 , and different isolation structures 2 may be insulated from each other, so that different light-emitting devices 4 can be connected to different first power lines 3 , respectively.

[0122] In other similar embodiments, the first electrodes 41 of the plurality of light-emitting devices 4 may be insulated from each other, and the first electrodes 41 of the plurality of light-emitting devices 4 may be respectively connected to different first power lines 3 through different insulated isolation structures 2. For example, the first electrodes 41 of the light-emitting devices 4 with the same luminous color may be connected to the same first power line 3 through the isolation structure 2; the first electrodes 41 of the light-emitting devices 4 with different luminous colors may be insulated and respectively connected to different first power lines 3 through the insulated isolation structures 2.

[0123] In this embodiment, an isolation structure 2 is provided to be connected to the first power line 3 located in the non-display area NA, so that the first electrode 41 in each light-emitting device 4 can obtain the electrical signal at the first power line 3 through the isolation structure 2. The isolation structure 2 having a conductive material has good conductive properties, and can realize signal transmission between the first electrode 41 and the first power line 3.

[0124] See also Figure 1 The substrate 1 includes a second power line 6 and a pixel circuit, and the second power line 6 is electrically connected to the pixel circuit.

[0125] The second power line 6 is located in the non-display area NA. The pixel circuit is disposed in the substrate 1 and is electrically connected to the second electrode 42 of the light emitting device 4 .

[0126] Specifically, the substrate 1 mainly includes a rigid substrate, a pixel circuit, a power line, several insulating layers for achieving electrical insulation between adjacent layers, a planarization layer, etc. Please refer to the following for its specific structure.

[0127] The pixel circuit is formed in the substrate 1 and is electrically connected to the second electrode 42 of the light emitting device 4, and is used to provide an electrical signal such as a driving signal to the light emitting device 4, so as to achieve precise control of the light emitting brightness of the light emitting device 4, and complete high-quality image display. The pixel circuit includes a thin film transistor (TFT) and a storage capacitor, etc.

[0128] The second power line 6 can be used to provide an ELVDD signal to the display panel 10. The first power line 3 and the second power line 6 cooperate with each other to realize the display function of the display panel 10.

[0129] In the thickness direction of the display panel 10 , the orthographic projection of the second power line 6 in the substrate 1 on the substrate 1 may overlap with the orthographic projection of the first power line 3 on the substrate 1 , or may not overlap or have a certain interval.

[0130] See also Figure 1 In the figure, the first power line 3 and the second power line 7 are arranged at intervals in the non-display area NA, and the number of the first power lines 3 is two, and the two first power lines 3 are distributed on both sides of the second power line 7.

[0131] In some embodiments, the second power line 6 may include but is not limited to a single metal layer structure.

[0132] Specifically, the second power line 6 is a multi-layer metal layer structure. For example, the second power line 6 is a three-layer structure of Ti / Al / Ti. That is, the second power line 6 in this embodiment includes a titanium metal layer, an aluminum metal layer and a titanium metal layer stacked in sequence along the thickness direction of the substrate 1.

[0133] The specific arrangement positions of the first power line 3 and the second power line 6 are described below.

[0134] See also Figure 1 The non-display area NA includes a bonding area NA1 and a border area NA2, wherein the border area NA2 is arranged around the display area AA, the border area NA2 includes a lower border area NA21, the lower border area NA21 connects the display area AA and the bonding area NA1, and the first power line 3 extends from the lower border area NA21 to the bonding area NA1.

[0135] See also Figure 1 There are two first power lines 3 arranged at intervals in the lower frame area NA21, and the orthographic projection of the second power line 6 in the thickness direction of the substrate 1 is located between the orthographic projections of the two first power lines 3 arranged at intervals in the thickness direction of the substrate 1.

[0136] The bonding area NA1 is located on the side of the lower frame area NA21 away from the display area AA, and a pad may be provided thereon. The first power line 3 extends from the lower frame area NA21 to the bonding area NA1 and is connected to the pad located in the bonding area NA1.

[0137] The pad is used to realize the electrical connection between the electronic components and the circuit. In the display panel 10, the pad can be used to connect the display driver chip (IC, i.e. the integrated circuit mentioned above) and the electrical connection of the circuit located in the display panel 10. In this embodiment, the first power line 3 is connected to the pad, and the electrical connection between the first power line 3 and the integrated circuit can be realized. Thus, the integrated circuit can accurately transmit the image data signal to be displayed to the corresponding electrode of the light-emitting device 4 located in the display area AA through the pad, thereby controlling the light-emitting state of the light-emitting device 4, and realizing the normal display of the image in the display area AA of the display panel 10.

[0138] Similarly, the second power line 6 can also be electrically connected to the above-mentioned pad.

[0139] See also Figure 1 In the embodiment of the present application, the frame area NA2 of the display panel 10 provided by the present invention includes, in addition to the lower frame area NA21, an upper frame area NA22, a left frame area NA23 and a right frame area NA24.

[0140] Specifically, the border area NA2 is arranged around the display area AA, wherein the upper border area NA22 and the lower border area NA21 are arranged above and below the display area AA respectively, and the left border area NA23 and the right border area NA24 are arranged on the left and right sides of the display area AA respectively, and each area is connected in sequence to form a hollow area set around the display area AA.

[0141] The display panel 10 further includes a first wiring line 7 , which is arranged in the frame area NA2 and electrically connected to the first power line 3 .

[0142] In some embodiments, a first wiring 7 is disposed in at least one of the upper frame area NA22 , the left frame area NA23 , and the right frame area NA24 . The first wiring 7 extends along the frame area NA2 and is electrically connected to the first power line 3 .

[0143] For details, please refer to Figure 1 One end of the first routing line 7 is connected to the first power line 3 located in the lower border area NA21 and adjacent to the left border area NA23, and the other end extends along the left border area NA23, the upper border area NA22 and the right border area NA24 and is connected to another first power line 3 adjacent to the right border area NA24.

[0144] Electrostatic discharge (ESD) generates instantaneous high voltage and high current, and damages the circuit inside the display panel 10. In the display panel 10, such high-energy pulses may break down sensitive electronic components such as semiconductor devices (such as thin film transistors TFT), integrated circuits (ICs), etc. For example, TFT is a key component for controlling pixels in the organic light-emitting diode display panel 10. The high voltage generated by ESD may cause the gate oxide layer of the TFT to be broken down, thereby causing the TFT to lose its function of controlling the pixel, resulting in the pixel not being able to display normally or display abnormalities (such as bright spots, dark spots, lines, etc.).

[0145] The first wiring 7 can help protect the display panel 10, prevent the peripheral circuit from being damaged by ESD, and help protect the internal circuit of the display panel 10. The first wiring 7 has a good grounding effect, can provide a stable reference potential for the circuit in the display panel 10, and can guide and discharge interference signals such as static electricity and noise in the circuit, thereby reducing the impact on the normal operation of the circuit. The first wiring 7 can also be used as a grounding line to connect the various components in the display panel 10 to the ground plane to ensure a good grounding effect. Of course, in other similar embodiments, the display panel 10 may not have the above-mentioned first wiring 7, please refer to Figure 5 .

[0146] In some embodiments, the first trace 7 may include but is not limited to a single metal layer structure.

[0147] Specifically, the first wiring 7 is a multi-layer conductive structure, and may also be a multi-layer metal layer structure.

[0148] In some embodiments, the first trace 7 includes a first conductive layer 71, a second conductive layer 72, and a third conductive layer 73 sequentially stacked along the thickness direction of the substrate 1, see Figure 3 .

[0149] Specifically, the material of the first conductive layer 71 includes titanium, which is a titanium metal layer, the material of the second conductive layer 72 includes aluminum, which is an aluminum metal layer, and the material of the third conductive layer 73 includes titanium, which is a titanium metal layer. At this time, the first trace 7 is a Ti / Al / Ti three-layer structure. Among them, the second conductive layer 72 covers the first conductive layer 71, and the third conductive layer 73 covers the second conductive layer 72.

[0150] See also Figure 3 The substrate 1 of the display panel 10 includes a first planarization layer 11 and a substrate 12 . The first planarization layer 11 is located between the substrate 12 and the isolation structure 2 . The substrate 12 is a rigid substrate.

[0151] In this embodiment, the first planarization layer 11 is located between the pixel definition layer 5 and the substrate 12 .

[0152] Specifically, the material of the rigid substrate 12 includes at least one of glass and silicon wafer. In other embodiments, the material of the substrate 12 may also include metal.

[0153] At least a portion of the first trace 7 is located between the substrate 12 and the first planarization layer 11 .

[0154] For details, please refer to Figure 1 and Figure 3 , the orthographic projection of the first wiring 7 on the substrate 12 is located within the orthographic projection range of the first planarization layer 11 on the substrate 12. That is, the first planarization layer 11 covers the first wiring 7.

[0155] The substrate 12 may be made of a single film layer or multiple film layers. The substrate 12 may be used to provide a certain support force for the first wiring 7, the first planarization layer 11 and the pixel definition layer 5.

[0156] In addition to the first wiring 7, other film structures and metal wirings between adjacent film layers are arranged between the substrate 12 and the first planarization layer 11. The pixel circuit described above can be composed of the above metal wirings, and its structure is a known prior art and will not be described here.

[0157] Specifically, between the substrate 12 and the first planarization layer 11, the substrate 1 also includes a second planarization layer and a second routing line, wherein the second planarization layer is located on the side of the first routing line 7 facing away from the first planarization layer 11, and at this time, the first routing line 7 is located between the first planarization layer 11 and the second planarization layer; the second routing line is located on the side of the second planarization layer facing away from the first routing line 7.

[0158] Specifically, the second wiring is a metal wiring, and its structure may be the same as or different from that of the first wiring 7 .

[0159] In order to achieve insulation isolation between two adjacent conductive metal traces at non-connected positions, an organic film layer with insulation effect, namely a second planarization layer, is provided at each metal trace. The second planarization layer is provided with vias for achieving connection at the connection position between the first trace 7 and the second trace.

[0160] In some embodiments, the orthographic projection of the second routing line on the substrate 12 may overlap with the orthographic projection of the first routing line 7 on the substrate 12. In this case, the first routing line 7 and the second routing line may contact at the overlapped position to achieve normal transmission of the corresponding circuit signal.

[0161] Of course, in addition to the above-mentioned structures, the film layer located between the substrate 12 and the first planarization layer 11 also includes an interlayer dielectric layer (Inter Layer Dielectric Layer, ILD layer), an insulating layer (Gate Insulator Layer, GI layer) and other structures, wherein the ILD layer is used to isolate different circuit layers, and the GI layer is used to provide a certain insulation effect.

[0162] Specifically, a third wiring may be provided between the interlayer dielectric layer and the insulating layer. The third wiring is a metal wiring, and its structure may be the same as or different from that of the first wiring 7 .

[0163] Similarly, the orthographic projection of the third line on the substrate 12 can partially overlap with the orthographic projection of the second line on the substrate 12, and the third line and the second line can contact at the overlapped position to achieve normal transmission of the corresponding circuit signal. The relevant film layer used to separate the third line and the second line forms a via hole for achieving connection at the connection between the two.

[0164] The above-mentioned film layer structure for constituting the substrate 1 is prior art and will not be described in detail here.

[0165] See also Figure 4 , the number of light emitting devices 4 formed in the display area AA is multiple and independently arranged in the isolation opening 201 .

[0166] The light-emitting device 4 includes a second electrode 42, a light-emitting functional layer 43 and a first electrode 41 which are stacked in sequence, wherein the second electrode 42 is located between the pixel definition layer 5 and the substrate 1, and the pixel opening 501 exposes a portion of the surface of the second electrode 42 facing away from the substrate 1; the light-emitting functional layer 43 covers the pixel opening 501 and is connected to the second electrode 42 through the pixel opening 501, and the first electrode 41 covers the light-emitting functional layer 43 and is connected to the side wall of the isolation structure 2 close to the corresponding isolation opening 201.

[0167] It should be noted that the light emitting devices 4 of different colors have light emitting functional layers 43 that can emit light of different colors.

[0168] The light-emitting functional layer 43 can be made of organic small molecule light-emitting materials, complex light-emitting materials, high molecular polymers, etc. Different light-emitting functional layers 43 can be used to emit light of different colors.

[0169] Specifically, the light-emitting functional layer 43 can have three film layers with different light-emitting colors, namely the first light-emitting layer, the second light-emitting layer and the third light-emitting layer, wherein the wavelength of the emitted light of the first light-emitting layer is smaller than the wavelength of the emitted light of the second light-emitting layer, and the wavelength of the emitted light of the second light-emitting layer is smaller than the wavelength of the emitted light of the third light-emitting layer.

[0170] Specifically, the number of the light-emitting functional layers 43 is three and they are used to emit blue, green and red light respectively.

[0171] At least one of the first light-emitting layer, the second light-emitting layer and the third light-emitting layer is disposed in any isolation opening 201 .

[0172] In some embodiments, one of the first electrode 41 and the second electrode 42 is an anode, and the other is a cathode.

[0173] For details, please refer to Figure 4 In the figure, the first electrode 41 is a cathode, the second electrode 42 is an anode, and the first electrode 41 is electrically connected to the isolation structure 2.

[0174] See also Figure 4 The display panel 10 further includes a plurality of first encapsulation parts 8, which are located on the side of the light emitting device 4 facing away from the substrate 1. The first encapsulation parts 8 are used to encapsulate the light emitting device 4 located in the corresponding isolation opening 201. Two adjacent first encapsulation parts 8 for encapsulating different light emitting devices 4 are disconnected on the side of the isolation structure 2 away from the substrate 1.

[0175] In some embodiments, the display panel 10 further includes an organic encapsulation layer and a second encapsulation layer 9, wherein the side of the organic encapsulation layer away from the substrate 1 has a relatively flat surface. The second encapsulation layer 9 is located on the side of the organic encapsulation layer away from the substrate 1 and covers the organic encapsulation layer.

[0176] Specifically, the first encapsulation part 8 and the second encapsulation layer 9 are both inorganic encapsulation layers. The first encapsulation part 8 and the second encapsulation layer 9 can be prepared by chemical vapor deposition (CVD), and the organic encapsulation layer can be prepared by inkjet printing (IJP). Inkjet printing technology is a method of depositing organic functional materials on a substrate 1 in the form of tiny droplets to form a film layer. Compared with other processing methods, IJP technology has the advantages of simple process and convenient patterning.

[0177] See also Figure 4 At least a portion of the first packaging portion 8 is located in the isolation opening 201 and covers the first electrode 41 and at least a portion of the sidewall of the isolation structure 2 close to the isolation opening 201 .

[0178] Specifically, the first encapsulation part 8 includes a first encapsulation sub-part 81 and a second encapsulation sub-part 82 connected to each other. The first encapsulation sub-part 81 is located on the side of the isolation structure 2 facing away from the substrate 1, and the second encapsulation sub-part 82 is located on the side of the light-emitting device 4 facing away from the substrate 1 and covers the light-emitting device 4 and at least part of the outer wall of the isolation structure 2 close to the isolation opening 201. The first encapsulation sub-part 81 and the second encapsulation sub-part 82 are connected to form a continuous encapsulation film layer.

[0179] It should be noted that, in the direction perpendicular to the array substrate 1 , the adjacent first packaging sub-portions 81 are spaced apart from the end surface of the isolation structure 2 facing away from the array substrate 1 (i.e., there is a gap between the two), and at this time, the first packaging sub-portion 81 is suspended relative to the isolation structure 2.

[0180] See also Figure 4 The organic encapsulation layer can fill the gap formed between the first encapsulation sub-portion 81 and the end surface of the isolation structure 2 facing away from the substrate 1 .

[0181] On the side wall of the isolation structure 2 facing the isolation opening 201, the first electrode 41 in the light emitting device 4 overlaps a portion of the side wall, and the second encapsulation sub-part 82 contacts another portion of the side wall. Figure 4 The first electrode 41 overlaps with a portion of the side wall of the isolation structure 2 close to the substrate 1 , and the second packaging sub-portion 82 overlaps with a portion of the side wall away from the substrate 1 .

[0182] Since part of the first encapsulation sub-part 81 of the first encapsulation part 8 is located on the side of the isolation structure 2 facing away from the substrate 1, the orthographic projection of the isolation opening 201 on the substrate 1 is located within the orthographic projection of the corresponding first encapsulation part 8 on the substrate 1. In this way, it can be ensured that the first encapsulation part 8 can provide better encapsulation protection for the isolation opening 201 and the light-emitting device 4 arranged corresponding to the isolation opening 201.

[0183] It is understandable that the display panel 10 provided in the embodiment of the present application can realize the transmission of signals between the first power line 3 and the isolation structure 2 through the directly connected isolation structure 2 and the first power line 3, and realize the control of the light-emitting device 4 through the first electrode 41 located in the isolation structure 2. This structure can help save the processing steps of the display panel 10, optimize the processing process of the display panel 10, and improve and enhance the process performance of the display panel 10.

[0184] In a second aspect, the present application also provides a method for preparing the display panel 10, see Figure 6 .

[0185] The manufacturing method provided in this embodiment is used to manufacture the display panel 10 mentioned above. The display panel 10 has a display area AA and a non-display area NA.

[0186] Specifically, the preparation method comprises:

[0187] Step S1, preparing an isolation forming layer on one side of the substrate 1;

[0188] Step S2, patterning the isolation forming layer to obtain an isolation structure 2 and a first power line 3, wherein the isolation structure 2 is located in the display area AA and an isolation opening 201 is defined on the isolation structure 2, and the first power line 3 is located in the non-display area NA; wherein the isolation structure 2 and the first power line 3 are connected.

[0189] In the preparation method of the display panel 10 provided in the embodiment of the present application, by adjusting the first power line 3 and the isolation structure 2 to be arranged in the same layer and connected, the transmission of the corresponding signal can be conveniently and quickly realized, and the related processing steps can be saved, thereby improving and enhancing the process performance of the display panel 10.

[0190] Specifically, the substrate 1 may be set as a rigid substrate.

[0191] In step S1 , before preparing the isolation forming layer on one side of the substrate 1 , the method further includes: preparing a pixel definition forming layer on one side of the substrate 1 .

[0192] The pixel definition forming layer covers the display area AA and extends from the display area AA to the non-display area NA.

[0193] After the pixel definition forming layer is prepared, the above-mentioned isolation forming layer is prepared on the side of the pixel definition forming layer facing away from the substrate 1 .

[0194] In some embodiments, the orthographic projection of the isolation structure 2 on the substrate 1 is located within the orthographic projection of the pixel definition layer 5 on the substrate 1 , and the orthographic projection of the first power line 3 on the substrate 1 is located within the orthographic projection of the pixel definition layer 5 on the substrate 1 .

[0195] After step S2 , the method further includes step S3 , patterning the pixel definition forming layer to obtain a pixel definition layer 5 having a pixel opening 501 , wherein the pixel opening 501 is correspondingly arranged and connected to the isolation opening 201 .

[0196] Before forming the pixel definition layer on one side of the substrate 1 , the method further includes: forming a second electrode 42 on one side of the substrate 1 .

[0197] There are a plurality of second electrodes 42 , which are disposed at intervals on one surface of the substrate 1 .

[0198] Specifically, the second electrode 42 can be prepared by depositing a metal material.

[0199] After the second electrode 42 is prepared, a pixel definition forming layer is prepared on one side of the substrate 1. The pixel definition forming layer covers the second electrode 42.

[0200] After the pixel opening 501 is prepared in step S3 , a portion of the surface of the second electrode 42 facing away from the substrate 1 can be exposed relative to the pixel opening 501 .

[0201] The preparation method also includes:

[0202] Step S4, preparing a light-emitting functional layer 43 and a first electrode 41 in the isolation opening 201 to obtain a light-emitting device 4;

[0203] Step S5, preparing a first packaging portion 8 on the side of the light emitting device 4 facing away from the substrate 1;

[0204] Step S6 , sequentially preparing an organic encapsulation layer and a second encapsulation layer 9 on the side of the first encapsulation portion 8 facing away from the substrate 1 .

[0205] It should be noted that the above steps S4 and S5 need to be repeated several times, and the number of repetitions is consistent with the number of luminous colors of the light-emitting device 4.

[0206] After all the light-emitting devices 4 and the first packaging parts 8 are prepared, step S6 is performed.

[0207] The preparation process of the above step S4 and step S5 is briefly described below:

[0208] Taking the light-emitting device 4 having three different light-emitting colors as an example, when it is necessary to prepare the first light-emitting device 4 in the partial isolation opening 201, the first light-emitting forming layer and the first electrode forming layer having corresponding materials can be sequentially evaporated to the display area AA, and then the first encapsulation forming layer is prepared. Then, according to the design requirements, the photoresist is used as a mask to retain the first light-emitting forming layer, the first electrode forming layer and the first encapsulation forming layer whose formation positions meet the requirements, and the remaining areas are etched to remove unnecessary film layer structures. By patterning the display area AA, the first light-emitting device 4 and part of the first encapsulation part 8 are prepared. Subsequently, the above process is repeated to realize the preparation of the second light-emitting device 4 and the third light-emitting device 4, and the preparation of the first encapsulation part 8 is realized in this process.

[0209] It can be understood that the display panel 10 preparation method provided in the embodiment of the present application can be prepared by adjusting the first power line 3 to be directly connected to the isolation structure 2 and made of the same material, ensuring that the two are formed as one piece, avoiding the processing method of punching holes in the relevant film layer to achieve the connection between the two, which not only helps to simplify the preparation precautions of the display panel 10, but also saves related processing steps, and realizes the effective transmission of signals between the isolation structure 2 and the first power line 3, helping to improve the process performance of the display panel 10.

[0210] In a third aspect, the present application further provides a display device 100, see Figure 7 The display device 100 includes any one of the display panels 10 described above; or, the display device 100 includes the display panel 10 manufactured by any one of the manufacturing methods described above.

[0211] The display device 100 provided in this embodiment can be a mobile phone, a foldable mobile phone, a television, a laptop computer, a tablet computer, a navigator, a display, a personal digital assistant (PDA), and other products or components with display functions.

[0212] In some embodiments, the size of the display panel 10 on the display device 100 is not less than 10 inches.

[0213] Since the display device 100 provided in the embodiment of the present application includes the above-mentioned display panel 10, the display device 100 at least includes the beneficial effects of any one or several of the above-mentioned display panels 10. The specific effects refer to the specific description in the above-mentioned embodiment and will not be repeated here.

[0214] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel (10) has a display area (AA) and a non-display area (NA), and comprises: base(1); An isolation structure (2), located on one side of the substrate (1) and in the display area (AA), the isolation structure (2) comprising a conductive material; A first power line (3) is located on one side of the substrate (1) and in the non-display area (NA); the first power line (3) is arranged in the same layer as the isolation structure (2) and is connected to the first power line (3).

2. The display panel according to claim 1, characterized in that: The substrate (1) is a rigid substrate; Preferably, the first power line (3) and the isolation structure (2) are made of the same material.

3. The display panel according to claim 1, characterized in that: The display panel (10) further comprises a plurality of light-emitting devices (4), the isolation structure (2) defines a plurality of isolation openings (201), at least a portion of the light-emitting devices (4) are located in the corresponding isolation openings (201), and the light-emitting devices (4) comprise a first electrode (41), and the first electrode (41) is electrically connected to the first power line (3) through the isolation structure (2).

4. The display panel according to claim 3, characterized in that: The display panel (10) further comprises a pixel definition layer (5), wherein the pixel definition layer (5) is located on one side of the substrate (1), and the isolation structure (2) is located on a side of the pixel definition layer (5) facing away from the substrate (1); The pixel definition layer (5) defines a plurality of pixel openings (501), the pixel openings (501) are arranged correspondingly to and communicate with the isolation openings (201), and at least a portion of the light-emitting device (4) covers the corresponding pixel openings (501); Preferably, at least part of the first power line (3) is located on a side of the pixel definition layer (5) facing away from the substrate (1); Preferably, the orthographic projection of the first power line (3) on the substrate (1) is located within the orthographic projection of the pixel definition layer (5) on the substrate (1).

5. The display panel according to claim 4, characterized in that: The light emitting device (4) comprises a second electrode (42), the second electrode (42) is located between the pixel definition layer (5) and the substrate (1), and the pixel opening (501) exposes the second electrode (42); Preferably, the light-emitting device (4) comprises a light-emitting functional layer (43), wherein the light-emitting functional layer (43) covers the pixel opening (501) and is connected to the second electrode (42).

6. The display panel according to claim 5, characterized in that: The substrate (1) comprises a second power line (6) and a pixel circuit, and the second power line (6) is electrically connected to the pixel circuit; The second power line (6) is located in the non-display area (NA), and the pixel circuit is electrically connected to the second electrode (42) of the light-emitting device (4); Preferably, the orthographic projection of the second power line (6) in the thickness direction of the substrate (1) and the orthographic projection of the first power line (3) in the thickness direction of the substrate (1) are arranged at an interval; Preferably, the number of the first power lines (3) is two, and the orthographic projections of the two first power lines (3) in the thickness direction of the substrate (1) are respectively located on both sides of the orthographic projection of the second power line (6) in the thickness direction of the substrate (1).

7. The display panel according to any one of claims 1 to 6, characterized in that: The non-display area (NA) includes: Bonding District (NA1); A frame area (NA2) is arranged around the display area (AA), the frame area (NA2) includes a lower frame area (NA21), the lower frame area (NA21) connects the display area (AA) and the bonding area (NA1), and the first power line (3) extends from the lower frame area (NA21) to the bonding area (NA1); Preferably, the bonding area (NA1) is provided with a pad, and the first power line (3) is connected to the pad.

8. The display panel according to claim 7, characterized in that: The border area (NA2) further includes an upper border area (NA22), a left border area (NA23) and a right border area (NA24); A first wiring (7) is provided in at least one of the upper frame area (NA22), the left frame area (NA23) and the right frame area (NA24); the first wiring (7) extends along the frame area (NA2) and is electrically connected to the first power line (3); Preferably, the first wiring (7) is a multi-layer conductive structure; Preferably, the first wiring (7) is a multi-layer metal layer; Preferably, the first wiring (7) comprises a first conductive layer (71), a second conductive layer (72) and a third conductive layer (73) which are sequentially stacked along the thickness direction of the substrate (1); Preferably, the material of the first conductive layer (71) includes titanium, the material of the second conductive layer (72) includes aluminum, and the material of the third conductive layer (73) includes titanium.

9. The display panel according to claim 1, characterized in that: The substrate (1) comprises a first planarization layer (11) and a substrate (12), wherein the first planarization layer (11) is located between the substrate (12) and the isolation structure (2), and the substrate (12) is a rigid substrate; Preferably, the material of the substrate (12) includes at least one of glass and silicon wafer.

10. The display panel according to claim 9, characterized in that: The non-display area (NA) includes a bonding area (NA1) and a frame area (NA2) arranged around the display area (AA); the frame area (NA2) includes an upper frame area (NA22), a left frame area (NA23) and a right frame area (NA24); a first wiring (7) is arranged in at least one of the left frame area (NA23) and the right frame area (NA24); the first wiring (7) extends along the frame area (NA2) and is electrically connected to the first power line (3); At least part of the first wiring (7) is located between the substrate (12) and the first planarization layer (11); The orthographic projection of the first wiring (7) on the substrate (12) is located within the orthographic projection range of the first planarization layer (11) on the substrate (12); Preferably, the first wiring (7) is a multi-layer conductive structure; Preferably, the first wiring (7) is a multi-layer metal layer; Preferably, the first wiring (7) comprises a first conductive layer (71), a second conductive layer (72) and a third conductive layer (73) which are sequentially stacked along the thickness direction of the substrate (1); Preferably, the material of the first conductive layer (71) includes titanium, the material of the second conductive layer (72) includes aluminum, and the material of the third conductive layer (73) includes titanium; Preferably, the non-display area (NA) further includes a bonding area (NA1), the border area (NA2) further includes a lower border area (NA21), the lower border area (NA21) connects the display area (AA) and the bonding area (NA1), and the first power line (3) extends from the lower border area (NA21) to the bonding area (NA1).

11. The display panel according to any one of claims 3 to 6, characterized in that: The display panel (10) further comprises a plurality of first packaging parts (8), wherein the first packaging parts (8) are located on a side of the corresponding light-emitting device (4) facing away from the substrate (1); Preferably, the first encapsulation portion (8) comprises a first encapsulation sub-portion (81) and a second encapsulation sub-portion (82) which are connected, the first encapsulation sub-portion (81) being located on a side of the isolation structure (2) facing away from the substrate (1), and the second encapsulation sub-portion (82) being located on a side of the light-emitting device (4) facing away from the substrate (1) and covering the light-emitting device (4) and at least a portion of an outer wall of the isolation structure (2) close to the isolation opening (201); Preferably, in a direction perpendicular to the substrate (1), there is a gap between adjacent first packaging sub-portions (81) and the isolation structure (2).

12. The display panel according to any one of claims 1 to 6, characterized in that: The isolation structure (2) comprises a support portion (21) and a crown portion (22) arranged in a stacked manner, wherein the crown portion (22) is located on a side of the support portion (21) facing away from the substrate (1), and the support portion (21) and the crown portion (22) enclose an isolation opening (201); Wherein, the orthographic projection of the support portion (21) on the substrate (1) is located within the orthographic projection of the crown portion (22) on the substrate (1); Preferably, the support portion (21) comprises a first support portion (211) and a second support portion (212), and the second support portion (212) is located on a side of the first support portion (211) facing away from the substrate (1); Preferably, the orthographic projection of the second supporting portion (212) on the substrate (1) is located within the orthographic projection of the first supporting portion (211) on the substrate (1); Preferably, the orthographic projection of the first supporting portion (211) on the substrate (1) is located within the orthographic projection of the crown portion (22) on the substrate (1).

13. The display panel according to claim 12, characterized in that: The material of the first supporting part (211) includes molybdenum or titanium; Preferably, the material of the second supporting portion (212) includes aluminum, copper or silver; Preferably, the material of the crown (22) includes titanium or molybdenum.

14. A method for preparing a display panel, characterized in that: The display panel (10) has a display area (AA) and a non-display area (NA), and the method comprises: Preparing an isolation forming layer on one side of the substrate (1); The isolation forming layer is patterned to obtain an isolation structure (2) and a first power line (3), wherein the isolation structure (2) is located in the display area (AA) and an isolation opening (201) is defined on the isolation structure (2), and the first power line (3) is located in the non-display area (NA); Wherein, the isolation structure (2) and the first power line (3) are connected.

15. The method for preparing a display panel according to claim 14, characterized in that: The substrate (1) is a rigid substrate.

16. A display device, characterized in that: A display panel (10) comprising any one of claims 1 to 13, or a display panel (10) prepared by the preparation method according to claim 14 or 15.

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