Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device, and the display panel comprises a substrate, one side of which is provided with a communication hole; the first electrode is arranged on one side of the substrate, the first electrode comprises a first conductive structure and a second conductive structure located on the side, away from the substrate, of the first conductive structure, and part of the first conductive structure is located in the communicating hole; a first interval is formed between the edge of the orthographic projection of the first conductive structure on the substrate and the edge of the orthographic projection of the second conductive structure on the substrate, and the first interval is smaller than or equal to 1 micrometer.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body, and wide range of applications, becoming the mainstream display device.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the Invention

[0004] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to improve the manufacturing efficiency of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, comprising: a substrate, a connecting hole being provided on one side of the substrate; a first electrode being arranged on one side of the substrate, the first electrode comprising a first conductive structure and a second conductive structure located on a side of the first conductive structure facing away from the substrate, a portion of the first conductive structure being located within the connecting hole, a first spacing being present between an edge of an orthographic projection of the first conductive structure on the substrate and an edge of an orthographic projection of the second conductive structure on the substrate, and the first spacing being less than or equal to 1 micron.

[0006] According to an embodiment of the first aspect of the present application, the first conductive structure has a first side surface, the second conductive structure has a second side surface, and the first side surface is coplanar with at least a portion of the second side surface;

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the first conductive structure further includes a first surface connected to the first side surface and facing away from the substrate, and the first side surface surrounds a peripheral side of the first surface.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the second conductive structure further includes a second surface connected to the second side surface and facing away from the substrate, and the second side surface surrounds a peripheral side of the second surface.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the second conductive structure includes a first conductive layer and a second conductive layer stacked in the thickness direction of the display panel, and the second side surface of at least one of the first conductive layer and the second conductive layer is coplanar with the first side surface.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the second conductive layer is located on the side of the first conductive layer facing away from the substrate, or the number of the second conductive layers is at least two, a portion of the second conductive layer is located on the side of the first conductive layer facing the substrate, and the other portion of the second conductive layer is located on the side of the first conductive layer facing away from the substrate.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first conductive layer includes silver, and / or the material of the second conductive layer includes indium tin oxide, and / or the material of the first conductive structure includes indium tin oxide.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the first conductive structure includes a conductive body and an auxiliary structure, the conductive body extends from the connecting hole to the outside of the connecting hole and is connected to the second conductive structure, the conductive body is recessed at the connecting hole to form a groove, and the auxiliary structure is filled in the groove.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, there is a first distance between an edge of an orthographic projection of the conductive body on the substrate and an edge of an orthographic projection of the second conductive structure on the substrate.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive body has a first side surface, the second conductive structure has a second side surface, and the first side surface is coplanar with at least a portion of the second side surface.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive body and the auxiliary structure are made of different materials.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the conductive body includes a conductive material, and the material of the auxiliary structure includes an organic material.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the conductive body includes indium tin oxide.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the conductive body ranges from 0.01 micrometers to 0.06 micrometers.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive body includes a first main body portion located inside the connecting hole and a second main body portion located outside the connecting hole, the first main body portion is recessed to form a groove, the second main body portion is connected to the second conductive structure, and the surface of the second main body portion facing away from the substrate is coplanar with the surface of the auxiliary structure facing away from the substrate.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a pixel definition layer and a light-emitting layer, the pixel definition layer includes a pixel defining portion arranged on the side of the first electrode facing away from the substrate, a pixel opening is provided on the pixel defining portion, the light-emitting layer is at least partially located within the pixel opening, and at least part of the surface of the first electrode is exposed from the pixel opening and connected to the light-emitting layer.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, a projection of the communication hole in the thickness direction of the display panel at least partially overlaps with a projection of the pixel opening in the thickness direction of the display panel.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, a projection of the communication hole in the thickness direction of the display panel is located within a projection of the pixel opening in the thickness direction of the display panel.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes an isolation structure arranged on one side of the substrate, the isolation structure is provided with an isolation opening connected to the pixel opening, and the projection of the connecting hole in the thickness direction of the display panel at least partially overlaps with the projection of the isolation opening in the thickness direction of the display panel.

[0024] According to any of the aforementioned implementations of the first aspect of the present application, a projection of the communication hole in the thickness direction of the display panel is located within a projection of the isolation opening in the thickness direction of the display panel.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate, and / or the orthographic projection of the second conductive structure on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion facing away from the substrate, and the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the isolation structure includes a conductive material, and the display panel further includes a second electrode arranged on the side of the light-emitting layer away from the substrate, and the second electrode is electrically connected to the isolation structure.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the second electrode is electrically connected to the first isolation portion, and the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the first isolation portion on the substrate.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the first isolation portion on the substrate, and / or the orthographic projection of the second conductive structure on the substrate at least partially overlaps with the orthographic projection of the first isolation portion on the substrate.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a conductive portion arranged on the side of the first isolation portion facing the substrate, the conductive portion protruding from the first isolation portion toward the isolation opening, and the second electrode is electrically connected to the conductive portion.

[0032] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the conductive portion on the substrate.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the conductive portion on the substrate, and / or the orthographic projection of the second conductive structure on the substrate at least partially overlaps with the orthographic projection of the conductive portion on the substrate.

[0034] An embodiment of the first aspect of the present application also provides a display panel, comprising: a substrate, a connecting hole being provided on one side of the substrate; a first electrode being arranged on one side of the substrate, the first electrode comprising a first conductive structure and a second conductive structure located on a side of the first conductive structure facing away from the substrate, the first conductive structure comprising a conductive body and an auxiliary structure, the conductive body extending from the connecting hole to the outside of the connecting hole and connected to the second conductive structure, the conductive body being recessed at the connecting hole to form a groove, the auxiliary structure being filled in the groove, a first spacing being provided between an edge of an orthographic projection of the conductive body on the substrate and an edge of an orthographic projection of the second conductive structure on the substrate, the first spacing being less than or equal to 1 micron.

[0035] According to an embodiment of the first aspect of the present application, the conductive body has a first side surface, the second conductive structure has a second side surface, and the first side surface is coplanar with at least a portion of the second side surface.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive body includes a first main body portion located inside the connecting hole and a second main body portion located outside the connecting hole, the first main body portion is recessed to form a groove, the second main body portion is connected to the second conductive structure, and the surface of the second main body portion facing away from the substrate is coplanar with the surface of the auxiliary structure facing away from the substrate.

[0037] An embodiment of a second aspect of the present application provides a method for manufacturing a display panel, including:

[0038] opening a communication hole on the substrate;

[0039] A first conductive material layer is prepared on the substrate, and a portion of the first conductive material layer falls into the communicating hole;

[0040] preparing a second conductive material layer on the first conductive material layer;

[0041] The first conductive material layer and the second conductive material layer are patterned to form a first electrode, the first electrode including a first conductive structure and a second conductive structure located on a side of the first conductive structure facing away from the substrate, a portion of the first conductive structure is located within the connecting hole, and a first spacing is provided between an edge of an orthographic projection of the first conductive structure on the substrate and an edge of an orthographic projection of the second conductive structure on the substrate, and the first spacing is less than or equal to 1 micron.

[0042] According to an embodiment of the second aspect of the present application, in the step of preparing the first conductive material layer on the substrate:

[0043] The first conductive material layer is recessed at the communicating hole to form a groove;

[0044] After the step of preparing the first conductive material layer on the substrate:

[0045] preparing a filling material layer on the first conductive material layer, with a portion of the filling material layer falling into the groove;

[0046] The filling material layer is patterned to form an auxiliary structure, and the auxiliary structure is filled in the groove.

[0047] An embodiment of the third aspect of the present application provides a display device, comprising a display panel according to any of the above embodiments, or a display panel prepared by a preparation method according to any of the above embodiments.

[0048] In a display panel provided in an embodiment of the present application, the display panel includes a substrate and a first electrode. A communication hole is formed on one side of the substrate, and the first electrode can be electrically connected to a device in the substrate through the communication hole, so that the first electrode can function as a pixel electrode of the display panel and participate in driving the display panel's light-emitting display.

[0049] The first electrode includes a first conductive structure and a second conductive structure located on the side of the first conductive structure facing away from the substrate. Part of the structure of the first conductive structure is located in the connecting hole. The first conductive structure located in the connecting hole can play a flattening role, so that the second conductive structure is not easy to collapse at the connecting hole, so that the surface of the side of the second conductive structure facing away from the substrate can have a good degree of flatness, so that the film layer structure subsequently prepared on the second conductive structure can also have a good degree of flatness, which can better improve the structural stability of the display panel.

[0050] There is a first spacing between the edge of the orthographic projection of the first conductive structure on the substrate and the edge of the orthographic projection of the second conductive structure on the substrate. By setting the first spacing to be less than or equal to 1 micron, the edge of the first conductive structure and the edge of the second conductive structure can be closer, so that during the preparation process of the display panel, the material of the stacked first conductive structure and the material of the second conductive structure can be patterned in the same step to complete the preparation of the first conductive structure and the second conductive structure at the same time, thereby greatly improving the preparation efficiency of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0052] Figure 1 This is a schematic diagram of a partial structure of a pixel definition layer according to an embodiment of the present application;

[0053] Figure 2 is a partial cross-sectional schematic diagram of a display panel according to an embodiment of the present application;

[0054] Figure 3 is a partial cross-sectional schematic diagram of a display panel according to another embodiment of the present application;

[0055] Figure 4 This is a partial structural diagram of a pixel definition layer and an isolation structure according to an embodiment of the present application;

[0056] Figure 5 is a partial cross-sectional schematic diagram of a display panel according to yet another embodiment of the present application;

[0057] Figure 6 is a partially enlarged schematic diagram of a first electrode and a substrate in an embodiment of the present application;

[0058] Figure 7 This is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0059] Figures 8 to 13 This is a schematic diagram of the preparation process of a method for preparing a display panel provided in an embodiment of the present application.

[0060] Description of reference numerals:

[0061] 10. Display panel; 11. First conductive material layer; 12. Second conductive material layer; 13. Filling material layer;

[0062] 100, substrate; 100a, communication hole; 110, substrate; 120, first insulating layer; 130, second insulating layer; 140, third insulating layer; 150, driving circuit; 151, transistor; 151a, gate; 151b, source and drain; 152, storage capacitor; 152a, first plate; 152b, second plate;

[0063] 200, first electrode; 210, first conductive structure; 210a, first side surface; 210b, first surface; 211, conductive body; 211a, groove; 2111, first body portion; 2112, second body portion; 212, auxiliary structure; 220, second conductive structure; 220a, second side surface; 220b, second surface; 221, first conductive layer; 222, second conductive layer;

[0064] 300, pixel definition layer; 310, pixel definition portion; 310a, pixel opening;

[0065] 400, isolation structure; 400a, isolation opening; 410, first isolation portion; 420, second isolation portion; 430, conductive portion;

[0066] 500, luminescent layer;

[0067] 600, second electrode;

[0068] X, thickness direction. DETAILED DESCRIPTION

[0069] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0070] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0071] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0072] Embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. Hereinafter, various embodiments of the display panel, the method for manufacturing a display panel, and the display device will be described with reference to the accompanying drawings.

[0073] Figure 1 is a partial structural diagram of a pixel definition layer 300 according to an embodiment of the present application. Figure 2 FIG. 1 is a partial cross-sectional view of a display panel 10 according to an embodiment of the present application. In the figure, the X direction is the thickness direction X of the display panel 10 .

[0074] like Figure 1 and Figure 2 As shown, an embodiment of the first aspect of the present application provides a display panel 10, including: a substrate 100, a connecting hole 100a is opened on one side of the substrate 100; a first electrode 200, arranged on one side of the substrate 100, the first electrode 200 includes a first conductive structure 210 and a second conductive structure 220 located on the side of the first conductive structure 210 away from the substrate 100, part of the first conductive structure 210 is located in the connecting hole 100a, and there is a first spacing between the edge of the orthographic projection of the first conductive structure 210 on the substrate 100 and the edge of the orthographic projection of the second conductive structure 220 on the substrate 100, and the first spacing is less than or equal to 1 micron.

[0075] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100 and a first electrode 200. A communication hole 100a is defined on one side of the substrate 100. The first electrode 200 can be electrically connected to a device in the substrate 100 through the communication hole 100a, so that the first electrode 200 can function as a pixel electrode of the display panel 10 to drive the display panel 10 to emit light.

[0076] The first electrode 200 includes a first conductive structure 210 and a second conductive structure 220 located on a side of the first conductive structure 210 facing away from the substrate 100 . Part of the first conductive structure 210 is located in the connecting hole 100 a .

[0077] Optionally, a portion of the first conductive structure 210 may be located within the communicating hole 100 a , and another portion of the first conductive structure 210 may be located outside the communicating hole 100 a and connected to the second conductive structure 220 .

[0078] The first conductive structure 210 located in the connecting hole 100a can play a flattening role, making it difficult for the second conductive structure 220 to collapse at the connecting hole 100a, so that the surface of the second conductive structure 220 facing away from the substrate 100 can have a better flatness, so that the film layer structure subsequently prepared on the second conductive structure 220 can also have a better flatness, which can better improve the structural stability of the display panel 10.

[0079] A first distance is provided between the edge of the orthographic projection of the first conductive structure 210 on the substrate 100 and the edge of the orthographic projection of the second conductive structure 220 on the substrate 100. By setting the first distance to be less than or equal to 1 micron, the edge of the first conductive structure 210 and the edge of the second conductive structure 220 can be relatively close. Therefore, during the preparation process of the display panel 10, the material of the stacked first conductive structure 210 and the material of the second conductive structure 220 can be patterned in the same step to simultaneously complete the preparation of the first conductive structure 210 and the second conductive structure 220, thereby significantly improving the preparation efficiency of the display panel 10.

[0080] In some embodiments of the present application, during the manufacturing process of the display panel 10, when the materials of the stacked first conductive structure 210 and the second conductive structure 220 are simultaneously patterned, the edge surfaces of the first conductive structure 210 and the edge surfaces of the second conductive structure 220 should theoretically be coplanar. However, because the distance between the edges of the first conductive structure 210 and the second conductive structure 220 is susceptible to manufacturing process fluctuations and process errors, the value of the first spacing may have a certain range, that is, the first spacing may be less than or equal to 1 micron.

[0081] For example, the first spacing may be 0, 0.2 micrometers, 0.4 micrometers, 0.6 micrometers, 0.8 micrometers, or 1 micrometer.

[0082] In some embodiments of the present application, one surface is coplanar with another surface, which may mean that one surface may be located in an extension plane of the other surface.

[0083] In some optional embodiments, the first conductive structure 210 has a first side surface 210 a , the second conductive structure 220 has a second side surface 220 a , and the first side surface 210 a is coplanar with at least a portion of the second side surface 220 a .

[0084] Optionally, the first conductive structure 210 further includes a first surface 210b connected to the first side surface 210a and facing away from the substrate 100. The first side surface 210a surrounds the first surface 210b. The first surface 210b can have a relatively high flatness, which helps improve the flatness of other film structures above the first conductive structure 210. For example, the second conductive structure 220 can be located above the first surface 210b, making it less likely for the second conductive structure 220 to collapse at the connecting hole 100a.

[0085] Optionally, the second conductive structure 220 also includes a second surface 220b connected to the second side 220a and facing away from the substrate 100. The second side 220a surrounds the peripheral side of the second surface 220b. The second surface 220b may have a better flatness, which is beneficial to improving the flatness of other film layer structures above the second conductive structure 220.

[0086] In these optional embodiments, during the preparation process of the display panel 10 , when the materials of the stacked first conductive structure 210 and the second conductive structure 220 are patterned simultaneously to improve the preparation efficiency of the display panel 10 , the first side surface 210 a and the second side surface 220 a may be coplanar.

[0087] In some optional embodiments, the display panel 10 further includes a pixel definition layer 300 and a light-emitting layer 500. The pixel definition layer 300 includes a pixel defining portion 310 disposed on the side of the first electrode 200 facing away from the substrate 100. A pixel opening 310a is provided on the pixel defining portion 310. The light-emitting layer 500 is at least partially located within the pixel opening 310a. At least a portion of the surface of the first electrode 200 is exposed from the pixel opening 310a and is connected to the light-emitting layer 500.

[0088] Optionally, there may be a plurality of first electrodes 200 , and the pixel defining portion 310 may be located between adjacent first electrodes 200 to better cover and protect the sidewalls of each first electrode 200 .

[0089] Optionally, the light-emitting layer 500 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting structure, an electron injection layer (EIL), and an electron transport layer (ETL).

[0090] Optionally, the display panel 10 further includes a second electrode 600 disposed on a side of the light emitting layer 500 facing away from the substrate 100 .

[0091] In these optional embodiments, the pixel definition layer 300 can be used to participate in dividing the sub-pixels of the display panel 10. The first electrode 200 and the second electrode 600 can serve as pixel electrodes of the display panel 10. One of the first electrode 200 and the second electrode 600 can serve as an anode, and the other can serve as a cathode to drive the light-emitting layer 500 to emit light. In the embodiment of the present application, the first electrode 200 is used as the anode of the display panel 10, and the second electrode 600 is used as the cathode of the display panel 10.

[0092] Optionally, the pixel definition layer 300 may be in a mesh shape, and the hollow areas in the mesh-shaped pixel definition layer 300 may form pixel openings 310 a , and the light-emitting layer 500 may be driven to emit light in the pixel openings 310 a .

[0093] In some embodiments of the present application, the first conductive structure 210 located in the connecting hole 100a can play a flattening role, so that the second conductive structure 220 is not likely to collapse at the connecting hole 100a, so that the light-emitting layer 500 formed on the second conductive structure 220 can have a better flatness, which can better improve the structural stability of the display panel 10, and make the display panel 10 less likely to have a large color deviation, which can better improve the display effect of the display panel 10.

[0094] In some embodiments of the present application, the substrate 100 can be arranged in various ways. For example, the substrate 100 may include a substrate 110 and a driving circuit 150 arranged on the side of the substrate 110 facing the first electrode 200. For example, the driving circuit 150 may include a transistor 151, a storage capacitor 152, and a driving signal line for connecting various devices. The transistor 151 may include a semiconductor, a gate 151a, and a source and drain 151b. The storage capacitor 152 may include a first plate 152a and a second plate 152b.

[0095] Optionally, the substrate 100 may also include a first insulating layer 120, a second insulating layer 130 and a third insulating layer 140 arranged on one side of the substrate 110 and stacked in sequence in a direction away from the substrate 110, wherein the third insulating layer 140 can be used as a planarization layer of the display panel 10, so that the substrate 100 can have a relatively flat surface, which can facilitate the subsequent preparation of other film layer structures on the substrate 100.

[0096] As an example, the gate 151a and the first electrode 152a can be located on the side of the first insulating layer 120 facing the substrate 110, the second electrode 152b can be located between the first insulating layer 120 and the second insulating layer 130, and the source and drain 151b can be located between the second insulating layer 130 and the third insulating layer 140.

[0097] In some embodiments of the present application, there are various ways to open the communication hole 100 a on the substrate 100 . For example, the communication hole 100 a can be set through the third insulating layer 140 .

[0098] Optionally, the first electrode 200 can be connected to the transistor 151 in the substrate 100 through the connecting hole 100a. For example, the first conductive structure 210 of the first electrode 200 can be electrically connected to the source and drain 151b of the transistor 151 through the connecting hole 100a, so that the transistor 151 can be used to provide a driving current to the first electrode 200, so that the first electrode 200 can participate in driving the light-emitting display of the light-emitting layer 500.

[0099] In some optional embodiments, a projection of the communication hole 100 a in the thickness direction X of the display panel 10 at least partially overlaps with a projection of the pixel opening 310 a in the thickness direction X of the display panel 10 .

[0100] Optionally, the projection of the connecting hole 100a in the thickness direction X of the display panel 10 may refer to the projection area formed by the orthographic projection of the inner wall of the connecting hole 100a in the thickness direction X of the display panel 10 and the orthographic projection of the inner wall of the connecting hole 100a in the thickness direction X of the display panel 10.

[0101] Optionally, the projection of the pixel opening 310a in the thickness direction X of the display panel 10 may refer to the projection area formed by the orthographic projection of the inner wall of the pixel opening 310a in the thickness direction X of the display panel 10 and the orthographic projection of the inner wall of the pixel opening 310a in the thickness direction X of the display panel 10.

[0102] Optionally, the projection of the communication hole 100 a in the thickness direction X of the display panel 10 is located within the projection of the pixel opening 310 a in the thickness direction X of the display panel 10 .

[0103] In these optional embodiments, the projection of the connecting hole 100a in the thickness direction X of the display panel 10 can at least partially overlap with the projection of the pixel opening 310a in the thickness direction X of the display panel 10, so that some transistors 151 in the driving circuit 150 can be located below or relatively close to the pixel opening 310a, which can facilitate the arrangement of the driving circuit 150 in the substrate 100, so that the driving circuit 150 in the substrate 100 can be arranged more densely, which is also beneficial to improving the pixel density (Pixels Per Inch, PPI) of the display panel 10.

[0104] Figure 3 FIG. 1 is a partial cross-sectional schematic diagram of a display panel 10 according to another embodiment of the present application.

[0105] like Figure 3 As shown, in some optional embodiments, the first conductive structure 210 includes a conductive body 211 and an auxiliary structure 212. The conductive body 211 extends from the connecting hole 100a to the outside of the connecting hole 100a and is connected to the second conductive structure 220. The conductive body 211 is recessed at the connecting hole 100a to form a groove 211a, and the auxiliary structure 212 is filled in the groove 211a.

[0106] Optionally, the conductive body 211 extends from the connecting hole 100a to the outside of the connecting hole 100a and is connected to the second conductive structure 220, which may mean that a part of the structure of the conductive body 211 may be located inside the connecting hole 100a, and another part of the structure of the conductive body 211 may be located outside the connecting hole 100a and connected to the second conductive structure 220.

[0107] Optionally, the conductive body 211 is recessed at the communicating hole 100a to form a groove 211a. This may mean that due to the height difference of the surface of the substrate 100 at the communicating hole 100a, the conductive body 211 is easily recessed at the communicating hole 100a, so that the groove 211a is easily formed on the side of the conductive body 211 facing away from the substrate 100. It is worth noting that in the aforementioned embodiment, the first conductive structure 210 located within the communicating hole 100a plays a planarizing role, but the film layer constituting the first conductive structure 210 needs to be processed, that is, additional processing is required, such as thinning, which increases production costs.

[0108] Optionally, the conductive body 211 and the auxiliary structure 212 may be made of different materials.

[0109] Optionally, there is a first distance between the edge of the orthographic projection of the conductive body 211 on the substrate 100 and the edge of the orthographic projection of the second conductive structure 220 on the substrate 100, that is, the first distance in the aforementioned embodiment may be the distance between the edge of the orthographic projection of the conductive body 211 on the substrate 100 and the edge of the orthographic projection of the second conductive structure 220 on the substrate 100.

[0110] Optionally, the conductive body 211 has a first side surface 210 a , the second conductive structure 220 has a second side surface 220 a , and the first side surface 210 a and at least a portion of the second side surface 220 a are coplanar.

[0111] In these optional embodiments, the conductive body 211 and the auxiliary structure 212, made of different materials, can be used to achieve different functions. For example, the conductive body 211 can be primarily used to transmit current to drive the light-emitting layer 500 to emit light, and the auxiliary structure 212 can be primarily used to ensure that the surface of the first conductive structure 210 facing away from the substrate 100 has a relatively high degree of flatness. For example, when the conductive body 211 is unable to properly fill the connecting hole 100a, that is, when the conductive body 211 is recessed at the connecting hole 100a to form a groove 211a, the auxiliary structure 212 can effectively fill the groove 211a, thereby effectively reducing the impact of the connecting hole 100a and the groove 211a on the flatness of the film structure above. Specifically, the second conductive structure 220 located on the side of the first conductive structure 210 facing away from the substrate 100 is less likely to collapse at the connecting hole 100a and the groove 211a, thereby ensuring that the surface of the second conductive structure 220 facing away from the substrate 100 has a relatively high degree of flatness.

[0112] Furthermore, by setting a first spacing between the edge of the orthographic projection of the conductive body 211 on the substrate 100 and the edge of the orthographic projection of the second conductive structure 220 on the substrate 100, during the preparation process of the display panel 10, the material of the stacked conductive body 211 and the material of the second conductive structure 220 can be patterned in the same step to simultaneously complete the preparation of the conductive body 211 and the second conductive structure 220, thereby greatly improving the preparation efficiency of the display panel 10.

[0113] Optionally, the conductive body 211 may be made of a conductive material, and the auxiliary structure 212 may be made of an organic material.

[0114] By setting the material of the auxiliary structure 212 to include organic material, the material of the auxiliary structure 212 can have better fluidity during the preparation process of the display panel 10, and the material of the auxiliary structure 212 can be better filled into the groove 211a, so that the auxiliary structure 212 can play a better planarization role.

[0115] Optionally, the material of the first conductive structure 210 may include indium tin oxide. Exemplarily, the material of the conductive body 211 may include indium tin oxide, so that the conductive body 211 can have good conductivity and good light transmittance.

[0116] Optionally, the thickness of the conductive body 211 ranges from 0.01 micrometers to 0.06 micrometers. For example, the thickness of the conductive body 211 may be 0.01 micrometers, 0.02 micrometers, 0.03 micrometers, 0.04 micrometers, 0.05 micrometers, or 0.06 micrometers.

[0117] By reasonably setting the thickness of the conductive body 211, the conductive body 211 is not likely to have an excessively small thickness, so that the conductive body 211 can have a more appropriate resistance. In addition, by reasonably setting the thickness of the conductive body 211, the conductive body 211 is not likely to have an excessively large thickness, so that the setting of the conductive body 211 is not likely to affect the light transmittance performance of the display panel 10.

[0118] In some optional embodiments, the conductive body 211 includes a first main body portion 2111 located inside the connecting hole 100a and a second main body portion 2112 located outside the connecting hole 100a, the first main body portion 2111 is recessed to form a groove 211a, the second main body portion 2112 is connected to the second conductive structure 220, and the surface of the second main body portion 2112 facing away from the substrate 100 is coplanar with the surface of the auxiliary structure 212 facing away from the substrate 100.

[0119] Optionally, the auxiliary structure 212 may be located only in the groove 211 a , that is, the auxiliary structure 212 may not extend to the surface of the second main body portion 2112 facing away from the substrate 100 .

[0120] In this optional embodiment, by arranging the surface of the second main portion 2112 facing away from the substrate 100 to be coplanar with the surface of the auxiliary structure 212 facing away from the substrate 100, the surface of the first conductive structure 210 facing away from the substrate 100 can be relatively flat, for example, the first surface 210b can be relatively flat, which helps to improve the flatness of other film structures above the first conductive structure 210. Specifically, by arranging the surface of the second main portion 2112 facing away from the substrate 100 to be coplanar with the surface of the auxiliary structure 212 facing away from the substrate 100, the second conductive structure 220 is less likely to collapse at the connecting hole 100a and the groove 211a.

[0121] Furthermore, by disposing the auxiliary structure 212 only in the groove 211 a , a sufficient connection area is provided between the second main body portion 2112 and the second conductive structure 220 , thereby effectively reducing the resistance of the display panel 10 .

[0122] Figure 4 : is a partial structural diagram of a pixel definition layer 300 and an isolation structure 400 according to an embodiment of the present application. Figure 5 FIG. 1 is a partial cross-sectional schematic diagram of a display panel 10 according to another embodiment of the present application.

[0123] like Figure 4 and Figure 5 As shown, in some optional embodiments, the display panel 10 further includes an isolation structure 400 disposed on one side of the substrate 100. The isolation structure 400 defines an isolation opening 400a that communicates with the pixel opening 310a. The isolation structure 400 can also be used to divide the sub-pixels of the display panel 10.

[0124] Related solutions of the isolation structure 400 (also called partition structure, etc.) are disclosed in patents (applications) CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN117979 755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, CN117500332A, etc., the contents of which are incorporated into this application by reference for reference.

[0125] Optionally, the isolation structure 400 may also be in a mesh shape, and the hollow areas in the mesh-shaped isolation structure 400 may form isolation openings 400 a , and the light emitted by the light-emitting layer 500 may be transmitted outwards through the isolation openings 400 a .

[0126] Optionally, there are many ways to set the relative position between the pixel defining portion 310 and the isolation structure 400, for example, Figure 5 As shown, the isolation structure 400 can be disposed on the side of the pixel defining portion 310 facing away from the substrate 100, that is, the isolation structure 400 can be disposed directly on the pixel defining portion 310. Alternatively, for example, the pixel defining portion 310 can be provided with a receiving groove (not shown), and at least a portion of the isolation structure 400 can be located within the receiving groove. This prevents the isolation structure 400 from being excessively tall relative to the substrate 100, thereby effectively reducing the thickness of the display panel 10. For ease of description, the following embodiments will be described using the example of the isolation structure 400 being disposed on the side of the pixel defining portion 310 facing away from the substrate 100.

[0127] In some optional embodiments, a projection of the communication hole 100 a in the thickness direction X of the display panel 10 at least partially overlaps with a projection of the isolation opening 400 a in the thickness direction X of the display panel 10 .

[0128] Optionally, the projection of the isolation opening 400a in the thickness direction X of the display panel 10 may refer to the projection area formed by the orthographic projection of the inner wall of the isolation opening 400a in the thickness direction X of the display panel 10 and the orthographic projection of the inner wall of the isolation opening 400a in the thickness direction X of the display panel 10.

[0129] Optionally, the projection of the communication hole 100 a in the thickness direction X of the display panel 10 is located within the projection of the isolation opening 400 a in the thickness direction X of the display panel 10 .

[0130] In these optional embodiments, by setting the projection of the connecting hole 100a in the thickness direction X of the display panel 10 and the projection of the isolation opening 400a in the thickness direction X of the display panel 10 to at least partially overlap, some transistors 151 in the driving circuit 150 can be located below or relatively close to the isolation opening 400a, which can facilitate the arrangement of the driving circuit 150 in the substrate 100, so that the driving circuit 150 in the substrate 100 can be arranged more densely, which is also beneficial to improving the pixel density of the display panel 10.

[0131] In some optional embodiments, the isolation structure 400 includes a first isolation portion 410 and a second isolation portion 420 located on the side of the first isolation portion 410 facing away from the substrate 100, and the second isolation portion 420 is arranged to protrude from the first isolation portion 410 toward the isolation opening 400a, that is, the projection of the first isolation portion 410 in the thickness direction X of the display panel 10 is located within the projection of the second isolation portion 420 in the thickness direction X of the display panel 10.

[0132] By arranging the second isolation portion 420 to protrude from the first isolation portion 410 toward the isolation opening 400a, when the light-emitting layer 500 and the second electrode 600 of the display panel 10 are evaporated, the second isolation portion 420 can block at least a portion of the material used to prepare the light-emitting layer 500 and the second electrode 600, so as to separate the light-emitting layer 500 and the second electrode 600 between adjacent sub-pixels, and can facilitate the formation of multiple spaced light-emitting layers 500 and second electrodes 600, so that there is no need to set a mask with high precision when evaporating the light-emitting layer 500 and the second electrode 600 of the display panel 10. For example, there is no need to set a high-precision metal mask (Fine Metal Mask, FMM) when evaporating the light-emitting layer 500 and the second electrode 600, thereby effectively reducing the production cost of the display panel 10.

[0133] In some optional embodiments, the material of the isolation structure 400 includes a conductive material, and the second electrode 600 is electrically connected to the isolation structure 400, so that the second electrodes 600 in adjacent isolation openings 400a can be electrically connected through the isolation structure 400 to facilitate control of the second electrodes 600.

[0134] Optionally, the second electrode 600 may be directly connected to the isolation structure 400 to achieve electrical connection between the second electrode 600 and the isolation structure 400 .

[0135] For example, the material of the first isolation portion 410 may include a conductive material. Optionally, the second electrode 600 is electrically connected to the first isolation portion 410 , so that the second electrodes 600 in adjacent isolation openings 400 a can be electrically connected through the first isolation portion 410 .

[0136] Optionally, the second electrode 600 may be directly connected to the first isolation portion 410 to achieve electrical connection between the second electrode 600 and the first isolation portion 410 .

[0137] In some optional embodiments, the isolation structure 400 further includes a conductive portion 430 disposed on the side of the first isolation portion 410 facing the substrate 100, and the conductive portion 430 is disposed so as to protrude from the first isolation portion 410 toward the isolation opening 400a, that is, the projection of the first isolation portion 410 in the thickness direction X of the display panel 10 is located within the projection of the conductive portion 430 in the thickness direction X of the display panel 10; the second electrode 600 is electrically connected to the conductive portion 430.

[0138] Optionally, the second electrode 600 may be in direct contact with the conductive portion 430 to achieve electrical connection between the second electrode 600 and the conductive portion 430 .

[0139] By arranging the conductive portion 430 to protrude from the first isolation portion 410 toward the isolation opening 400 a , the overlap between the second electrode 600 and the conductive portion 430 can be facilitated, and the overlap area between the second electrode 600 and the conductive portion 430 can be improved, thereby reducing the resistance of the display panel 10 .

[0140] In some optional embodiments, the orthographic projection of the first electrode 200 on the substrate 100 at least partially overlaps with the orthographic projection of the isolation structure 400 on the substrate 100, so that the edge of the first electrode 200 can extend to below the isolation structure 400, so that the step difference between the edge of the first electrode 200 and the substrate 100 is not likely to affect the continuity and thickness uniformity of the second electrode 600 above the pixel defining portion 310, so that the second electrode 600 can be better connected to the isolation structure 400.

[0141] Optionally, the orthographic projection of the first conductive structure 210 on the substrate 100 at least partially overlaps with the orthographic projection of the isolation structure 400 on the substrate 100, so that the edge of the first conductive structure 210 can extend below the isolation structure 400, so that the step difference between the edge of the first conductive structure 210 and the substrate 100 is not likely to affect the continuity and thickness uniformity of the second electrode 600 above the pixel defining portion 310, so that the second electrode 600 can be better connected to the isolation structure 400.

[0142] For example, an orthographic projection of the conductive body 211 on the substrate 100 may at least partially overlap with an orthographic projection of the isolation structure 400 on the substrate 100 .

[0143] Optionally, the orthographic projection of the second conductive structure 220 on the substrate 100 at least partially overlaps with the orthographic projection of the isolation structure 400 on the substrate 100, so that the edge of the second conductive structure 220 can extend to below the isolation structure 400, so that the step difference between the edge of the second conductive structure 220 and the substrate 100 is not likely to affect the continuity and thickness uniformity of the second electrode 600 above the pixel defining portion 310, so that the second electrode 600 can be better connected to the isolation structure 400.

[0144] In some optional embodiments, the orthographic projection of the first electrode 200 on the substrate 100 at least partially overlaps with the orthographic projection of the conductive portion 430 on the substrate 100 .

[0145] Optionally, the orthographic projection of the first conductive structure 210 on the substrate 100 at least partially overlaps with the orthographic projection of the conductive portion 430 on the substrate 100. Exemplarily, the orthographic projection of the conductive body 211 on the substrate 100 may at least partially overlap with the orthographic projection of the conductive portion 430 on the substrate 100.

[0146] Optionally, the orthographic projection of the second conductive structure 220 on the substrate 100 at least partially overlaps with the orthographic projection of the conductive portion 430 on the substrate 100 .

[0147] In these optional embodiments, by reasonably setting the relative position relationship between each film layer structure in the first electrode 200 and the conductive part 430, the edge of each film layer structure in the first electrode 200 can be extended to below the conductive part 430, so that the step difference between the edge of each film layer structure in the first electrode 200 and the substrate 100 is not likely to affect the continuity and thickness uniformity of the second electrode 600 above the pixel defining part 310, so that the second electrode 600 can be better connected to the conductive part 430.

[0148] In some optional embodiments, an orthographic projection of the first electrode 200 on the substrate 100 at least partially overlaps with an orthographic projection of the first isolation portion 410 on the substrate 100 .

[0149] Optionally, the orthographic projection of the first conductive structure 210 on the substrate 100 at least partially overlaps with the orthographic projection of the first isolation portion 410 on the substrate 100. Exemplarily, the orthographic projection of the conductive body 211 on the substrate 100 may at least partially overlap with the orthographic projection of the first isolation portion 410 on the substrate 100.

[0150] Optionally, the orthographic projection of the second conductive structure 220 on the substrate 100 at least partially overlaps with the orthographic projection of the first isolation portion 410 on the substrate 100 .

[0151] In these optional embodiments, by reasonably setting the relative position relationship between each film layer structure in the first electrode 200 and the first isolation portion 410, the edge of each film layer structure in the first electrode 200 can be extended to the bottom of the first isolation portion 410, so that the step difference between the edge of each film layer structure in the first electrode 200 and the substrate 100 is not easy to affect the continuity and thickness uniformity of the second electrode 600 above the pixel defining portion 310, so that the second electrode 600 can be better connected to the first isolation portion 410.

[0152] Figure 6 It is a partially enlarged schematic diagram of a first electrode 200 and a substrate 100 according to an embodiment of the present application.

[0153] In some optional embodiments, the second conductive structure 220 includes a first conductive layer 221 and a second conductive layer 222 stacked in the thickness direction X of the display panel 10, and the second side surface 220a of at least one of the first conductive layer 221 and the second conductive layer 222 is coplanar with the first side surface 210a.

[0154] Optional, such as Figure 6 As shown, the second conductive layer 222 is located on the side of the first conductive layer 221 facing away from the substrate 100, or the number of the second conductive layers 222 is at least two (not shown in the figure), a portion of the second conductive layer 222 is located on the side of the first conductive layer 221 facing the substrate 100, and the other portion of the second conductive layer 222 is located on the side of the first conductive layer 221 facing away from the substrate 100.

[0155] In these optional embodiments, by arranging the second side surface 220a of at least one of the first conductive layer 221 and the second conductive layer 222 to be coplanar with the first side surface 210a, at least one of the first conductive layer 221 and the second conductive layer 222 can be simultaneously manufactured with the film layer structure in the first conductive structure 210. Exemplarily, by arranging the second side surface 220a of at least one of the first conductive layer 221 and the second conductive layer 222 to be coplanar with the first side surface 210a, during the manufacturing process of the display panel 10, the material of the stacked conductive body 211 and the material of the first conductive layer 221 can be patterned in the same step, and / or the material of the stacked conductive body 211 and the material of the second conductive layer 222 can be patterned in the same step, so as to simultaneously complete the manufacturing of the first conductive structure 210 and the second conductive structure 220, thereby effectively improving the manufacturing efficiency of the display panel 10.

[0156] Optionally, the material of the first conductive layer 221 includes silver, so that the first conductive layer 221 can be used to reflect light, so that the light emitted by the light-emitting layer 500 toward the side of the substrate 100 can be emitted outward in a direction away from the substrate 100 under the reflection of the first conductive layer 221, so as to better improve the display effect of the display panel 10.

[0157] Optionally, the material of the second conductive layer 222 includes indium tin oxide, so that the second conductive layer 222 can have good electrical conductivity and good light transmittance.

[0158] See also Figures 1 to 6 , an embodiment of the first aspect of the present application further provides a display panel 10, comprising: a substrate 100, a connecting hole 100a being opened on one side of the substrate 100; a first electrode 200, arranged on one side of the substrate 100, the first electrode 200 comprising a first conductive structure 210 and a second conductive structure 220 located on the side of the first conductive structure 210 facing away from the substrate 100, the first conductive structure 210 comprising a conductive body 211 and an auxiliary structure 212, the conductive body 211 extending from the connecting hole 100a to the outside of the connecting hole 100a and connected to the second conductive structure 220, the conductive body 211 being recessed at the connecting hole 100a to form a groove 211a, the auxiliary structure 212 filling the groove 211a, a first spacing being provided between an edge of an orthographic projection of the conductive body 211 on the substrate 100 and an edge of an orthographic projection of the second conductive structure 220 on the substrate 100, and the first spacing being less than or equal to 1 micron.

[0159] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100 and a first electrode 200. A communication hole 100a is defined on one side of the substrate 100. The first electrode 200 can be electrically connected to a device in the substrate 100 through the communication hole 100a, so that the first electrode 200 can function as a pixel electrode of the display panel 10 to drive the display panel 10 to emit light.

[0160] The first conductive structure 210 includes a conductive body 211 and an auxiliary structure 212. The conductive body 211 extends from the connecting hole 100a to the outside of the connecting hole 100a and is connected to the second conductive structure 220, so that the current of the device in the substrate 100 can be transmitted toward the second conductive structure 220 through the conductive body 211.

[0161] The conductive body 211 is recessed at the connecting hole 100a to form a groove 211a, and the auxiliary structure 212 is filled in the groove 211a. The auxiliary structure 212 filled in the groove 211a can play a good flattening role, so that the second conductive structure 220 on the side of the auxiliary structure 212 away from the substrate 100 is not easy to collapse at the connecting hole 100a and the groove 211a, so that the surface of the side of the second conductive structure 220 away from the substrate 100 can have a good flatness, so that the film layer structure subsequently prepared on the second conductive structure 220 can also have a good flatness, which can better improve the structural stability of the display panel 10.

[0162] Optionally, a portion of the first conductive structure 210 may be located within the communicating hole 100 a , and another portion of the first conductive structure 210 may be located outside the communicating hole 100 a and connected to the second conductive structure 220 .

[0163] There is a first distance between the edge of the orthographic projection of the conductive body 211 on the substrate 100 and the edge of the orthographic projection of the second conductive structure 220 on the substrate 100. By setting the first distance to be less than or equal to 1 micron, the edge of the conductive body 211 and the edge of the second conductive structure 220 can be relatively close, so that in the preparation process of the display panel 10, the material of the stacked conductive body 211 and the material of the second conductive structure 220 can be patterned in the same step to complete the preparation of the conductive body 211 and the second conductive structure 220 at the same time, thereby greatly improving the preparation efficiency of the display panel 10.

[0164] Optionally, the embodiment of the first aspect of the present application also provides a display panel 10 which may be the display panel 10 in any of the aforementioned embodiments. Therefore, the embodiment of the present application also provides a display panel 10 which may have the beneficial effects of the display panel 10 in any of the aforementioned embodiments, and the present application will not elaborate on it.

[0165] For example, the substrate 100 may be the substrate 100 in any of the aforementioned embodiments. For example, the first electrode 200 may include the first conductive structure 210 and the second conductive structure 220 in any of the aforementioned embodiments. The first conductive structure 210 may include the conductive body 211 and the auxiliary structure 212 in any of the aforementioned embodiments. The second conductive structure 220 may include the first conductive layer 221 and the second conductive layer 222 in any of the aforementioned embodiments.

[0166] Optionally, the display panel 10 may further include the pixel definition layer 300, the light emitting layer 500, and the second electrode 600 in any of the aforementioned embodiments. The relative positional relationship between the first conductive structure 210, the second conductive structure 220, and the pixel defining portion 310 may be set with reference to any of the aforementioned embodiments.

[0167] Optionally, the display panel 10 may further include the isolation structure 400 of any of the aforementioned embodiments. The isolation structure 400 may be provided with the isolation opening 400a of any of the aforementioned embodiments. The isolation structure 400 may include the first isolation portion 410, the second isolation portion 420, and the conductive portion 430 of any of the aforementioned embodiments. The relative positional relationship between the first electrode 200 and the isolation structure 400 may be set with reference to the aforementioned embodiments. For example, the relative positional relationship between the first conductive structure 210, the second conductive structure 220, and the various film layer structures in the isolation structure 400 may be set with reference to any of the aforementioned embodiments.

[0168] Figure 7 1 is a flow chart of a method for preparing a display panel 10 provided in an embodiment of the present application. Figures 8 to 13 1 is a schematic diagram of a manufacturing process of a method for manufacturing a display panel 10 provided in an embodiment of the present application.

[0169] The embodiment of the second aspect of the present application provides a method for preparing a display panel 10. The display panel 10 prepared by the preparation method can be the display panel 10 provided by any of the embodiments of the first aspect above. Figures 1 to 6 Combined with Figures 7 to 13 , the preparation method comprises:

[0170] Step S100: Figure 8 As shown, a communication hole 100 a is opened on the substrate 100 .

[0171] Step S200: Figure 9 As shown, a first conductive material layer 11 is prepared on a substrate 100 , and a portion of the first conductive material layer 11 falls into the connecting hole 100 a .

[0172] Optionally, the first conductive material layer 11 can be used to participate in forming the first conductive structure 210 in any of the aforementioned embodiments. For example, the first conductive material layer 11 can be used to participate in forming the conductive body 211 in any of the aforementioned embodiments.

[0173] Step S300: Figure 12 As shown, a second conductive material layer 12 is prepared on the first conductive material layer 11 .

[0174] Optionally, the second conductive material layer 12 can be used to participate in forming the second conductive structure 220 in any of the aforementioned embodiments. For example, the second conductive material layer 12 may include a multi-layer film structure (not shown in the figure), and each film layer structure in the second conductive material layer 12 can be used to participate in forming the first conductive layer 221 and the second conductive layer 222 in any of the aforementioned embodiments.

[0175] Step S400: Figure 13 As shown, the first conductive material layer 11 and the second conductive material layer 12 are patterned to form a first electrode 200. The first electrode 200 includes a first conductive structure 210 and a second conductive structure 220 located on the side of the first conductive structure 210 facing away from the substrate 100. Part of the structure of the first conductive structure 210 is located in the connecting hole 100a. There is a first spacing between the edge of the orthographic projection of the first conductive structure 210 on the substrate 100 and the edge of the orthographic projection of the second conductive structure 220 on the substrate 100. The first spacing is less than or equal to 1 micron.

[0176] In the preparation method provided in the embodiment of the present application, by patterning the stacked first conductive material layer 11 and the second conductive material layer 12 in the same step, the preparation of the first conductive structure 210 and the second conductive structure 220 can be completed at the same time, thereby greatly improving the preparation efficiency of the display panel 10.

[0177] In some optional embodiments, in step S200: Figure 9 As shown, the first conductive material layer 11 is recessed at the communicating hole 100 a to form a groove 211 a .

[0178] After step S200:

[0179] like Figure 10 As shown, a filling material layer 13 is prepared on the first conductive material layer 11, and part of the filling material layer 13 falls into the groove 211a;

[0180] like Figure 11 As shown, the filling material layer 13 is patterned to form an auxiliary structure 212 , and the auxiliary structure 212 is filled in the groove 211 a .

[0181] In this optional embodiment, the first conductive material layer 11 can be used to participate in forming the conductive body 211 in any of the aforementioned embodiments, and the filling material layer 13 can be used to participate in forming the auxiliary structure in any of the aforementioned embodiments. When the conductive body 211 cannot properly fill the connecting hole 100a, that is, when the conductive body 211 is recessed at the connecting hole 100a to form a groove 211a, the auxiliary structure 212 can effectively fill the groove 211a, thereby effectively reducing the impact of the connecting hole 100a and the groove 211a on the flatness of the upper film structure. Specifically, it can prevent the second conductive structure 220 located on the side of the first conductive structure 210 facing away from the substrate 100 from collapsing at the connecting hole 100a and the groove 211a, so that the surface of the second conductive structure 220 facing away from the substrate 100 can have a better flatness.

[0182] The embodiment of the third aspect of the present application provides a display device, which includes the display panel 10 of any of the above-mentioned embodiments, or includes the display panel 10 prepared by the preparation method of any of the above-mentioned embodiments. Since the display device provided by the embodiment of the third aspect of the present application includes the display panel 10 of any of the above-mentioned embodiments of the first aspect, or includes the display panel 10 prepared by the preparation method of any of the above-mentioned embodiments of the second aspect, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned embodiments of the first aspect or the display panel 10 prepared by the preparation method of any of the above-mentioned embodiments of the second aspect, and no further details are given here.

[0183] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0184] While the embodiments described above are not exhaustive, they do not limit the invention to specific embodiments. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: include: A base plate, wherein a communication hole is formed on one side of the base plate; A first electrode is arranged on one side of the substrate, the first electrode includes a first conductive structure and a second conductive structure located on a side of the first conductive structure away from the substrate, a portion of the first conductive structure is located in the connecting hole, and a first spacing is provided between an edge of an orthographic projection of the first conductive structure on the substrate and an edge of an orthographic projection of the second conductive structure on the substrate, and the first spacing is less than or equal to 1 micron.

2. The display panel according to claim 1, characterized in that: The first conductive structure has a first side surface, the second conductive structure has a second side surface, and the first side surface is coplanar with at least a portion of the second side surface; Preferably, the first conductive structure further comprises a first surface connected to the first side surface and facing away from the substrate, and the first side surface surrounds the periphery of the first surface; Preferably, the second conductive structure further includes a second surface connected to the second side surface and facing away from the substrate, and the second side surface surrounds a peripheral side of the second surface.

3. The display panel according to claim 2, characterized in that: The second conductive structure includes a first conductive layer and a second conductive layer stacked in a thickness direction of the display panel, and the second side surface of at least one of the first conductive layer and the second conductive layer is coplanar with the first side surface; Preferably, the second conductive layer is located on a side of the first conductive layer facing away from the substrate, or the number of the second conductive layers is at least two, a part of the second conductive layer is located on a side of the first conductive layer facing the substrate, and another part of the second conductive layer is located on a side of the first conductive layer facing away from the substrate; Preferably, the material of the first conductive layer includes silver, and / or the material of the second conductive layer includes indium tin oxide, and / or the material of the first conductive structure includes indium tin oxide.

4. The display panel according to claim 1, characterized in that: The first conductive structure includes a conductive body and an auxiliary structure, wherein the conductive body extends from the connecting hole to the outside of the connecting hole and is connected to the second conductive structure, the conductive body is recessed at the connecting hole to form a groove, and the auxiliary structure is filled in the groove; Preferably, the first distance exists between the edge of the orthographic projection of the conductive body on the substrate and the edge of the orthographic projection of the second conductive structure on the substrate; Preferably, the conductive body has a first side surface, the second conductive structure has a second side surface, and the first side surface is coplanar with at least a portion of the second side surface; Preferably, the conductive body and the auxiliary structure are made of different materials; Preferably, the material of the conductive body includes a conductive material, and the material of the auxiliary structure includes an organic material; Preferably, the material of the conductive body includes indium tin oxide; Preferably, the thickness of the conductive body ranges from 0.01 micrometer to 0.06 micrometer.

5. The display panel according to claim 4, characterized in that: The conductive body includes a first main body portion located inside the connecting hole and a second main body portion located outside the connecting hole, the first main body portion is recessed to form a groove, the second main body portion is connected to the second conductive structure, and a surface of the second main body portion facing away from the substrate is coplanar with a surface of the auxiliary structure facing away from the substrate.

6. The display panel according to any one of claims 1 to 5, characterized in that: The display panel further comprises a pixel definition layer and a light-emitting layer, wherein the pixel definition layer comprises a pixel definition portion disposed on a side of the first electrode away from the substrate, a pixel opening is formed on the pixel definition portion, the light-emitting layer is at least partially located in the pixel opening, and at least a portion of the surface of the first electrode is exposed from the pixel opening and connected to the light-emitting layer; Preferably, a projection of the communication hole in the thickness direction of the display panel at least partially overlaps with a projection of the pixel opening in the thickness direction of the display panel; Preferably, a projection of the connecting hole in the thickness direction of the display panel is located within a projection of the pixel opening in the thickness direction of the display panel.

7. The display panel according to claim 6, characterized in that: The display panel further comprises an isolation structure disposed on one side of the substrate, the isolation structure is provided with an isolation opening connected with the pixel opening, and a projection of the connecting hole in a thickness direction of the display panel at least partially overlaps with a projection of the isolation opening in the thickness direction of the display panel; Preferably, the projection of the communication hole in the thickness direction of the display panel is located within the projection of the isolation opening in the thickness direction of the display panel; Preferably, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate; Preferably, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate, and / or the orthographic projection of the second conductive structure on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

8. The display panel according to claim 7, characterized in that: The isolation structure comprises a first isolation portion and a second isolation portion located at a side of the first isolation portion away from the substrate, wherein the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening; Preferably, the material of the isolation structure includes a conductive material, and the display panel further includes a second electrode disposed on a side of the light-emitting layer away from the substrate, and the second electrode is electrically connected to the isolation structure.

9. The display panel according to claim 8, characterized in that: The second electrode is electrically connected to the first isolation portion, and an orthographic projection of the first electrode on the substrate at least partially overlaps with an orthographic projection of the first isolation portion on the substrate; Preferably, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the first isolation portion on the substrate, and / or the orthographic projection of the second conductive structure on the substrate at least partially overlaps with the orthographic projection of the first isolation portion on the substrate.

10. The display panel according to claim 8, characterized in that: The isolation structure further includes a conductive portion disposed on a side of the first isolation portion facing the substrate, the conductive portion protruding from the first isolation portion toward the isolation opening, and the second electrode is electrically connected to the conductive portion; Preferably, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the conductive portion on the substrate; Preferably, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the conductive portion on the substrate, and / or the orthographic projection of the second conductive structure on the substrate at least partially overlaps with the orthographic projection of the conductive portion on the substrate.

11. A display panel, characterized in that: include: A base plate, wherein a communication hole is formed on one side of the base plate; A first electrode is arranged on one side of the substrate, the first electrode includes a first conductive structure and a second conductive structure located on a side of the first conductive structure away from the substrate, the first conductive structure includes a conductive body and an auxiliary structure, the conductive body extends from the connecting hole to the outside of the connecting hole and is connected to the second conductive structure, the conductive body is recessed at the connecting hole to form a groove, the auxiliary structure is filled in the groove, and a first spacing is provided between an edge of the orthographic projection of the conductive body on the substrate and an edge of the orthographic projection of the second conductive structure on the substrate, and the first spacing is less than or equal to 1 micron.

12. The display panel according to claim 11, characterized in that: The conductive body has a first side surface, the second conductive structure has a second side surface, and the first side surface is coplanar with at least a portion of the second side surface.

13. The display panel according to any one of claims 11 or 12, characterized in that: The conductive body includes a first main body portion located inside the connecting hole and a second main body portion located outside the connecting hole, the first main body portion is recessed to form a groove, the second main body portion is connected to the second conductive structure, and a surface of the second main body portion facing away from the substrate is coplanar with a surface of the auxiliary structure facing away from the substrate.

14. A method for preparing a display panel, characterized in that: include: A communication hole is formed on the substrate; Preparing a first conductive material layer on the substrate, wherein a portion of the first conductive material layer falls into the connecting hole; preparing a second conductive material layer on the first conductive material layer; The first conductive material layer and the second conductive material layer are patterned to form a first electrode, the first electrode comprising a first conductive structure and a second conductive structure located on a side of the first conductive structure facing away from the substrate, a portion of the first conductive structure is located within the connecting hole, and a first spacing is provided between an edge of an orthographic projection of the first conductive structure on the substrate and an edge of an orthographic projection of the second conductive structure on the substrate, and the first spacing is less than or equal to 1 micron.

15. The preparation method according to claim 14, characterized in that: In the step of preparing a first conductive material layer on the substrate: The first conductive material layer is recessed at the communicating hole to form a groove; After the step of preparing a first conductive material layer on the substrate: Preparing a filling material layer on the first conductive material layer, wherein a portion of the filling material layer falls into the groove; The filling material layer is patterned to form an auxiliary structure, and the auxiliary structure is filled in the groove.

16. A display device, characterized in that: A display panel comprising any one of claims 1 to 13, or a display panel prepared by the preparation method according to any one of claims 14 or 15.

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