Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device, and the display panel comprises a substrate, one side of which is provided with a communication hole; the light-emitting device is arranged on one side of the substrate, the light-emitting device comprises a first electrode, the first electrode comprises a first conductive structure and a second conductive structure located on the side, away from the substrate, of the first conductive structure, and part of the first conductive structure is located in the communicating hole; the pixel defining layer comprises a pixel limiting part arranged on the side, away from the substrate, of the first conductive structure, a pixel opening is defined by the pixel limiting part, at least part of the second conductive structure is located in the pixel opening, and at least part of the surface of the first conductive structure is exposed out of the pixel opening and connected with the second conductive structure. The display panel provided by the embodiment of the invention has relatively good structural stability.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to improve the structural stability of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, including: a substrate, a connecting hole is opened on one side of the substrate; a light-emitting device is arranged on one side of the substrate, the light-emitting device includes a first electrode, the first electrode includes a first conductive structure and a second conductive structure located on the side of the first conductive structure away from the substrate, and a part of the structure of the first conductive structure is located in the connecting hole; a pixel definition layer includes a pixel defining portion arranged on the side of the first conductive structure away from the substrate, the pixel defining portion encloses a pixel opening, the second conductive structure is at least partially located in the pixel opening, and at least a part of the surface of the first conductive structure is exposed from the pixel opening and connected to the second conductive structure.

[0006] According to an implementation of the first aspect of the present application, the pixel defining portion has a first inner wall on one side facing the pixel opening, and a portion of the second conductive structure covers at least a portion of the first inner wall.

[0007] According to any of the aforementioned implementations of the first aspect of the present application, in a direction away from the substrate, the first inner wall is inclined toward a direction away from the pixel opening.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel defining portion has a first top wall on the side facing away from the substrate, the second conductive structure covers the first inner wall and extends to the side of the first top wall away from the substrate, and part of the second conductive structure covers at least part of the first top wall.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting device further comprises a light-emitting layer located on the side of the first electrode facing away from the substrate, and the orthographic projection of the second conductive structure on the substrate is located within the orthographic projection of the light-emitting layer on the substrate.

[0010] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the first inner wall on the substrate.

[0011] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the first inner wall on the substrate is located within the orthographic projection of the first conductive structure on the substrate.

[0012] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the first conductive structure on the substrate.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, a partition groove is opened on the first inner wall, the second conductive structure is disconnected at the partition groove and forms a first conductive section and a second conductive section, the first conductive section is connected to the first conductive structure, and the second conductive section is located on a side of the first conductive section away from the substrate.

[0014] According to any of the aforementioned implementations of the first aspect of the present application, the second conductive section covers at least a portion of the first inner wall.

[0015] According to any of the aforementioned implementations of the first aspect of the present application, the partition groove is located on a side of the pixel defining portion facing the substrate, and at least a portion of the surface of the first conductive structure is exposed from the partition groove, and the first conductive sub-portion is spaced apart from the first inner wall, or a portion of the pixel defining portion is located between the partition groove and the first conductive structure, and the first conductive sub-portion covers a portion of the first inner wall;

[0016] According to any of the aforementioned implementations of the first aspect of the present application, the partition groove extends in a direction away from the pixel opening;

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting device also includes a light-emitting layer located on the side of the first electrode facing away from the substrate, the light-emitting layer is at least partially located in the pixel opening and connected to the second conductive structure, and the light-emitting layer covers at least a portion of the side of the partition groove facing the pixel opening.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the first conductive section has a first thickness, the light-emitting layer has a second thickness, the size of the partition groove in the thickness direction of the display panel is less than or equal to the sum of the first thickness and the second thickness, and / or the size of the partition groove in the thickness direction of the display panel is greater than the first thickness.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the first electrode further includes an auxiliary structure located between the first conductive structure and the second conductive structure, the first conductive structure is recessed at the connecting hole to form a groove, and the auxiliary structure is filled in the groove.

[0020] According to any of the aforementioned implementations of the first aspect of the present application, the first conductive structure and the auxiliary structure are made of different materials.

[0021] According to any of the aforementioned implementations of the first aspect of the present application, the material of the first conductive structure includes a conductive material.

[0022] According to any of the aforementioned implementations of the first aspect of the present application, the material of the first conductive structure includes indium tin oxide.

[0023] According to any of the aforementioned implementations of the first aspect of the present application, the material of the pixel defining portion includes an inorganic material.

[0024] According to any of the aforementioned implementations of the first aspect of the present application, the auxiliary structure and the pixel defining portion are provided with the same material.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the first conductive structure includes a first section located inside the connecting hole and a second section located outside the connecting hole, the first section is recessed to form a groove, the second section is connected to the second conductive structure, and a surface of the second section facing away from the substrate is coplanar with a surface of the auxiliary structure facing away from the substrate.

[0026] According to any of the aforementioned implementations of the first aspect of the present application, a projection of the communication hole in the thickness direction of the display panel at least partially overlaps with a projection of the pixel opening in the thickness direction of the display panel.

[0027] According to any of the aforementioned implementations of the first aspect of the present application, a projection of the communication hole in the thickness direction of the display panel is located within a projection of the pixel opening in the thickness direction of the display panel.

[0028] According to any of the aforementioned implementations of the first aspect of the present application, the material of the second conductive structure includes silver.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes an isolation structure arranged on one side of the substrate, the isolation structure is provided with an isolation opening connected to the pixel opening, the isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, and the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening.

[0030] According to any of the aforementioned implementations of the first aspect of the present application, a plurality of isolation openings are provided, a plurality of pixel openings are provided, and the isolation openings are provided corresponding to the pixel openings.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first isolation opening, a second isolation opening and a third isolation opening, the light-emitting device includes a first light-emitting device arranged corresponding to the first isolation opening, a second light-emitting device arranged corresponding to the second isolation opening and a third light-emitting device arranged corresponding to the third isolation opening, and the light-emitting colors of the first light-emitting device, the second light-emitting device and the third light-emitting device are different from each other.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a first packaging layer arranged on the side of the isolation structure and the light-emitting device away from the substrate, the first packaging layer includes a first packaging unit arranged on the side of the first light-emitting device away from the substrate, a second packaging unit arranged on the side of the second light-emitting device away from the substrate, and a third packaging unit arranged on the side of the third light-emitting device away from the substrate.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the isolation structure includes a conductive material, the light-emitting device also includes a light-emitting layer located on the side of the first electrode facing away from the substrate and a second electrode located on the side of the light-emitting layer facing away from the substrate, and the second electrode is electrically connected to the isolation structure.

[0034] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

[0035] According to any of the aforementioned implementations of the first aspect of the present application, the second conductive structure is spaced apart from the isolation structure.

[0036] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, the second electrode is electrically connected to the first isolation portion, and the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the first isolation portion on the substrate.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a conductive portion disposed on a side of the first isolation portion facing the substrate, the conductive portion protruding from the first isolation portion toward the isolation opening, and the second electrode is connected to the conductive portion.

[0039] According to any of the aforementioned implementations of the first aspect of the present application, an orthographic projection of the first electrode on the substrate at least partially overlaps with an orthographic projection of the conductive portion on the substrate.

[0040] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the conductive portion on the substrate.

[0041] An embodiment of the first aspect of the present application also provides a display panel, comprising: a substrate, a connecting hole is opened on one side of the substrate; a light-emitting device is arranged on one side of the substrate, the light-emitting device comprises a first electrode, the first electrode comprises a first conductive structure and an auxiliary structure, a part of the structure of the first conductive structure is located in the connecting hole, and the first conductive structure is recessed at the connecting hole to form a groove, and the auxiliary structure is filled in the groove; a pixel definition layer, comprising a pixel defining portion arranged on the side of the first conductive structure away from the substrate, the pixel defining portion encloses to form a pixel opening, a projection of the connecting hole in the thickness direction of the display panel at least partially overlaps with a projection of the pixel opening in the thickness direction of the display panel, at least a part of the surface of the first conductive structure is exposed from the pixel opening, and the auxiliary structure and the pixel defining portion are arranged with the same material.

[0042] According to an implementation of the first aspect of the present application, the first conductive structure and the auxiliary structure are made of different materials.

[0043] According to any of the aforementioned implementations of the first aspect of the present application, the material of the first conductive structure includes a conductive material.

[0044] According to any of the aforementioned implementations of the first aspect of the present application, the material of the first conductive structure includes indium tin oxide.

[0045] According to any of the aforementioned implementations of the first aspect of the present application, the material of the pixel defining portion includes an inorganic material.

[0046] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting device also includes a second conductive structure located on the side of the first conductive structure away from the substrate, the second conductive structure is at least partially located within the pixel opening, and at least a portion of the surface of the first conductive structure is exposed from the pixel opening and connected to the second conductive structure.

[0047] According to any of the aforementioned implementations of the first aspect of the present application, the pixel defining portion has a first inner wall on a side facing the pixel opening, and a portion of the second conductive structure covers at least a portion of the first inner wall.

[0048] According to any of the aforementioned implementations of the first aspect of the present application, in a direction away from the substrate, the first inner wall is inclined toward a direction away from the pixel opening.

[0049] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel defining portion has a first top wall on the side facing away from the substrate, the second conductive structure covers the first inner wall and extends to the side of the first top wall away from the substrate, and part of the second conductive structure covers at least part of the first top wall.

[0050] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting device further comprises a light-emitting layer located on the side of the first electrode facing away from the substrate, and the orthographic projection of the second conductive structure on the substrate is located within the orthographic projection of the light-emitting layer on the substrate.

[0051] According to any of the aforementioned embodiments of the first aspect of the present application, a partition groove is opened on the first inner wall, the second conductive structure is disconnected at the partition groove and forms a first conductive section and a second conductive section, the first conductive section is connected to the first conductive structure, and the second conductive section is located on a side of the first conductive section away from the substrate.

[0052] According to any of the aforementioned implementations of the first aspect of the present application, the second conductive section covers at least a portion of the first inner wall.

[0053] According to any of the aforementioned embodiments of the first aspect of the present application, the partition groove is located on the side of the pixel defining portion facing the substrate, and at least a portion of the surface of the first conductive structure is exposed from the partition groove, the first conductive section is spaced apart from the first inner wall, or a portion of the pixel defining portion is located between the partition groove and the first conductive structure, and the first conductive section covers a portion of the first inner wall.

[0054] According to any of the aforementioned implementations of the first aspect of the present application, the partition groove extends in a direction away from the pixel opening.

[0055] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting device also includes a light-emitting layer located on the side of the first electrode facing away from the substrate, the light-emitting layer is at least partially located in the pixel opening and connected to the second conductive structure, and the light-emitting layer covers at least a portion of the side of the partition groove facing the pixel opening.

[0056] According to any of the aforementioned embodiments of the first aspect of the present application, the first conductive section has a first thickness, the light-emitting layer has a second thickness, the size of the partition groove in the thickness direction of the display panel is smaller than the sum of the first thickness and the second thickness, and / or the size of the partition groove in the thickness direction of the display panel is greater than the first thickness.

[0057] According to any of the aforementioned embodiments of the first aspect of the present application, the first conductive structure includes a first section located inside the connecting hole and a second section located outside the connecting hole, the first section is recessed to form a groove, the second section is connected to the second conductive structure, and a surface of the second section facing away from the substrate is coplanar with a surface of the auxiliary structure facing away from the substrate.

[0058] According to any of the aforementioned implementations of the first aspect of the present application, the material of the second conductive structure includes silver.

[0059] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes an isolation structure arranged on one side of the substrate, the isolation structure is provided with an isolation opening connected to the pixel opening, the isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, and the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening.

[0060] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the isolation structure includes a conductive material, the light-emitting device also includes a light-emitting layer located on the side of the first electrode facing away from the substrate and a second electrode located on the side of the light-emitting layer facing away from the substrate, and the second electrode is electrically connected to the isolation structure.

[0061] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

[0062] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

[0063] According to any of the aforementioned embodiments of the first aspect of the present application, the second electrode is electrically connected to the first isolation portion, and the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the first isolation portion on the substrate.

[0064] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a conductive portion disposed on a side of the first isolation portion facing the substrate, the conductive portion protruding from the first isolation portion toward the isolation opening, and the second electrode is connected to the conductive portion.

[0065] According to any of the aforementioned implementations of the first aspect of the present application, an orthographic projection of the first electrode on the substrate at least partially overlaps with an orthographic projection of the conductive portion on the substrate.

[0066] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the conductive portion on the substrate.

[0067] An embodiment of a second aspect of the present application provides a method for preparing a display panel, including:

[0068] A communication hole is formed on the substrate;

[0069] Forming a plurality of first conductive structures spaced apart from each other on the substrate, wherein a portion of the first conductive structures is located in the connecting hole;

[0070] forming a pixel definition material layer on the first conductive structure;

[0071] Performing patterning on the pixel definition material layer to form a first pixel opening, wherein at least a portion of the first conductive structure is exposed from the first pixel opening;

[0072] A second conductive structure at least partially located in the first pixel opening is prepared, and at least a portion of the surface of the first conductive structure is exposed from the first pixel opening and connected to the second conductive structure.

[0073] According to an implementation of the second aspect of the present application, the first conductive structure is recessed at the connecting hole to form a groove, and the orthographic projection of at least one connecting hole on the substrate is located within the orthographic projection of the first pixel opening on the substrate. In the step of forming a pixel definition material layer on the first conductive structure:

[0074] A portion of the pixel definition material layer is filled in the groove;

[0075] In the step of patterning the pixel definition material layer to form a first pixel opening:

[0076] The pixel definition material layer is patterned to form a first pixel opening and an auxiliary structure filled in a groove communicating with the first pixel opening.

[0077] According to any of the aforementioned implementations of the second aspect of the present application, after the step of forming a pixel definition material layer on the first conductive structure, the step further includes:

[0078] forming an isolation material layer on the pixel definition material layer;

[0079] In the step of patterning the pixel definition material layer to form a first pixel opening:

[0080] The isolation material layer and the pixel definition material layer are patterned in sequence to form a first isolation opening and a first pixel opening in sequence, and the first isolation opening and the first pixel opening are connected to each other.

[0081] According to any of the foregoing implementations of the second aspect of the present application, the step of preparing a second conductive structure at least partially located in the first pixel opening includes:

[0082] Preparing a first conductive material on the entire surface;

[0083] A portion of the first conductive material outside the first isolation opening and the first pixel opening is removed to form a second conductive structure at least partially located within the first pixel opening.

[0084] According to any of the aforementioned implementations of the second aspect of the present application, in the step of preparing the first conductive material on the entire surface:

[0085] The first conductive material is prepared on the entire surface by evaporation.

[0086] According to any of the aforementioned implementations of the second aspect of the present application, in the step of preparing the first conductive material on the entire surface:

[0087] sequentially preparing a first conductive material, a first device material and a first packaging material on the entire surface;

[0088] In the step of removing a portion of the first conductive material outside the first isolation opening and the first pixel opening:

[0089] Portions of the first packaging material, the first device material and the first conductive material outside the first isolation opening and the first pixel opening are removed in sequence to sequentially form a first packaging unit, a first type of device located on a side of the first packaging unit facing the substrate, and a second conductive structure located on a side of the first type of device facing the substrate.

[0090] According to any of the aforementioned embodiments of the second aspect of the present application, the preparation method further comprises:

[0091] performing patterning on the isolation material layer and the pixel definition material layer in sequence to form a second isolation opening and a second pixel opening in sequence, wherein the second isolation opening and the second pixel opening are interconnected, and at least a portion of the first conductive structure is exposed from the second pixel opening;

[0092] Preparing a second conductive material on the entire surface;

[0093] Part of the second conductive material outside the second isolation opening and the second pixel opening is removed to form a second conductive structure at least partially located in the second pixel opening, and at least part of the surface of the first conductive structure is exposed from the second pixel opening and connected to the second conductive structure.

[0094] According to any of the aforementioned embodiments of the second aspect of the present application, the step of patterning the isolation material layer and the pixel definition material layer in sequence to sequentially form the second isolation opening and the second pixel opening may be located during the step of patterning the isolation material layer and the pixel definition material layer in sequence to sequentially form the first isolation opening and the first pixel opening, or the step of patterning the isolation material layer and the pixel definition material layer in sequence to sequentially form the second isolation opening and the second pixel opening may be located after the step of patterning the isolation material layer and the pixel definition material layer in sequence to sequentially form the first isolation opening and the first pixel opening.

[0095] According to any of the foregoing implementations of the second aspect of the present application, in the step of preparing the second conductive material on the entire surface:

[0096] The second conductive material is prepared on the entire surface by evaporation.

[0097] According to any of the foregoing implementations of the second aspect of the present application, in the step of preparing the second conductive material on the entire surface:

[0098] sequentially preparing a second conductive material, a second device material, and a second packaging material on the entire surface;

[0099] In the step of removing a portion of the second conductive material outside the second isolation opening and the second pixel opening:

[0100] Part of the second packaging material, the second device material and the second conductive material outside the second isolation opening and the second pixel opening are removed in sequence to sequentially form a second packaging unit, a second type of device located on the side of the second packaging unit facing the substrate, and a second conductive structure located on the side of the second type of device facing the substrate.

[0101] According to any of the foregoing embodiments of the second aspect of the present application, the first conductive structure is recessed at the connecting hole to form a groove, and the orthographic projection of at least one connecting hole on the substrate is located within the orthographic projection of the second pixel opening on the substrate. In the step of forming a pixel definition material layer on the first conductive structure:

[0102] A portion of the pixel definition material layer is filled in the groove;

[0103] In the step of patterning the pixel definition material layer to form a second pixel opening:

[0104] The pixel definition material layer is patterned to form a second pixel opening and an auxiliary structure filled in the groove communicating with the second pixel opening.

[0105] According to any of the aforementioned embodiments of the second aspect of the present application, the preparation method further comprises:

[0106] Patterning the isolation material layer and the pixel definition material layer in sequence to form a third isolation opening and a third pixel opening in sequence, wherein the third isolation opening and the third pixel opening are interconnected, and at least a portion of the first conductive structure is exposed from the third pixel opening;

[0107] preparing a third conductive material on the entire surface;

[0108] A portion of the third conductive material outside the third isolation opening and the third pixel opening is removed to form a second conductive structure at least partially located in the third pixel opening, and at least a portion of the surface of the first conductive structure is exposed from the third pixel opening and connected to the second conductive structure.

[0109] According to any of the aforementioned embodiments of the second aspect of the present application, the step of patterning the isolation material layer and the pixel definition material layer in sequence to form a third isolation opening and a third pixel opening in sequence may be located in the step of patterning the isolation material layer and the pixel definition material layer in sequence to form a first isolation opening and a first pixel opening in sequence, or the step of patterning the isolation material layer and the pixel definition material layer in sequence to form a third isolation opening and a third pixel opening in sequence may be located after the step of patterning the isolation material layer and the pixel definition material layer in sequence to form a first isolation opening and a first pixel opening in sequence.

[0110] According to any of the aforementioned implementations of the second aspect of the present application, in the step of preparing the third conductive material on the entire surface:

[0111] The third conductive material is prepared on the entire surface by evaporation.

[0112] According to any of the aforementioned implementations of the second aspect of the present application, in the step of preparing the third conductive material on the entire surface:

[0113] sequentially preparing a third conductive material, a third device material and a third packaging material on the entire surface;

[0114] In the step of removing a portion of the third conductive material outside the third isolation opening and the third pixel opening:

[0115] Portions of the third packaging material, the third device material and the third conductive material outside the third isolation opening and the third pixel opening are removed in sequence to sequentially form a third packaging unit, a third type of device located on the side of the third packaging unit facing the substrate, and a second conductive structure located on the side of the third type of device facing the substrate.

[0116] According to any of the foregoing embodiments of the second aspect of the present application, the first conductive structure is recessed at the connecting hole to form a groove, and the orthographic projection of at least one connecting hole on the substrate is located within the orthographic projection of the third pixel opening on the substrate. In the step of forming a pixel definition material layer on the first conductive structure:

[0117] A portion of the pixel definition material layer is filled in the groove;

[0118] In the step of patterning the pixel definition material layer to form a third pixel opening:

[0119] The pixel definition material layer is patterned to form a third pixel opening and an auxiliary structure filled in the groove communicating with the third pixel opening.

[0120] An embodiment of the third aspect of the present application provides a display device, including a display panel according to any of the above embodiments, or a display panel prepared by a preparation method according to any of the above embodiments.

[0121] In a display panel provided in an embodiment of the present application, the display panel includes a substrate, a light-emitting device, and a pixel definition layer. The light-emitting device is disposed on one side of the substrate, the light-emitting device includes a first electrode, the pixel definition layer includes a pixel definition portion disposed on a side of the first conductive structure away from the substrate, the pixel definition portion encloses a pixel opening, and the pixel definition layer can be used to participate in dividing sub-pixels of the display panel.

[0122] The first electrode includes a first conductive structure and a second conductive structure located on a side of the first conductive structure away from the substrate. A connecting hole is provided on one side of the substrate, and part of the first conductive structure is located in the connecting hole. The first electrode can be electrically connected to the device in the substrate through the connecting hole, so that the first electrode can be used as a pixel electrode of the display panel to participate in driving the light-emitting display of the display panel. In addition, the first conductive structure located in the connecting hole can play a flattening role, so that the second conductive structure is not easy to collapse at the connecting hole, so that the surface of the second conductive structure on the side away from the substrate can have a good flatness, so that the film layer structure subsequently prepared on the second conductive structure can also have a good flatness, which can improve the structural stability of the display panel.

[0123] By arranging the second conductive structure to be at least partially located in the pixel opening, the pixel defining portion is not easily shielded from the second conductive structure, so that the second conductive structure can have a larger size to improve the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0124] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0125] Figure 1 is a schematic diagram of a local structure of a pixel definition layer in an embodiment of the present application;

[0126] Figure 2 is a partial cross-sectional schematic diagram of a display panel according to an embodiment of the present application;

[0127] Figure 3 is a partial cross-sectional schematic diagram of a display panel according to another embodiment of the present application;

[0128] Figure 4 is a partial cross-sectional schematic diagram of a display panel according to yet another embodiment of the present application;

[0129] Figure 5 is a partial cross-sectional schematic diagram of a display panel according to another embodiment of the present application;

[0130] Figure 6 It is a partial structural diagram of a pixel definition layer and an isolation structure in an embodiment of the present application;

[0131] Figure 7 is a partial cross-sectional schematic diagram of a display panel according to another embodiment of the present application;

[0132] Figure 8is a partial cross-sectional schematic diagram of a display panel according to another embodiment of the present application;

[0133] Fig. 9 is a partial cross-sectional schematic diagram of a display panel according to another embodiment of the present application;

[0134] Fig.10 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0135] Figures 11 to 21 It is a schematic diagram of the preparation process of a method for preparing a display panel provided in an embodiment of the present application.

[0136] Description of reference numerals:

[0137] 10. Display panel; 10a. Pixel definition material layer; 10b. Isolation material layer; 10ba. First isolation layer; 10bb. Second isolation layer; 10bc. Third isolation layer; 11. First conductive material; 12. First device material; 12a. First light emitting material; 12b. First conductive electrode material; 13. First packaging material; 14. Second conductive material; 15. Second device material; 15a. Second light emitting material; 15b. Second conductive electrode material; 16. Second packaging material; 17. Third conductive material; 18. Third device material; 18a. Third light emitting material; 18b. Third conductive electrode material; 19. Third packaging material;

[0138] 100, substrate; 100a, connecting hole; 110, substrate; 120, first insulating layer; 130, second insulating layer; 140, third insulating layer; 150, driving circuit; 151, transistor; 151a, gate; 151b, source and drain; 152, storage capacitor; 152a, first plate; 152b, second plate;

[0139] 200, light emitting device; 201, first light emitting device; 202, second light emitting device; 203, third light emitting device; 210, first electrode; 211, first conductive structure; 211a, first subdivision; 211aa, groove; 211b, second subdivision; 212, second conductive structure; 212a, first conductive subdivision; 212b, second conductive subdivision; 213, auxiliary structure; 220, light emitting layer; 230, second electrode;

[0140] 300, pixel definition layer; 310, pixel defining portion; 310a, pixel opening; 310aa, first pixel opening; 310ab, second pixel opening; 310ac, third pixel opening; 311, first inner wall; 311a, partition groove; 312, first top wall;

[0141] 400, isolation structure; 400a, isolation opening; 400aa, first isolation opening; 400ab, second isolation opening; 400ac, third isolation opening; 410, first isolation portion; 420, second isolation portion; 430, conductive portion;

[0142] 500, a first packaging layer; 510, a first packaging unit; 520, a second packaging unit; 530, a third packaging unit;

[0143] 600, second encapsulation layer;

[0144] 700, third encapsulation layer;

[0145] X, thickness direction. DETAILED DESCRIPTION

[0146] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0147] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0148] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0149] Embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. Embodiments of the display panel, the method for manufacturing a display panel, and the display device will be described below in conjunction with the accompanying drawings.

[0150] Figure 1 is a schematic diagram of a partial structure of a pixel definition layer 300 according to an embodiment of the present application. Figure 2 FIG. 1 is a partial cross-sectional schematic diagram of a display panel 10 according to an embodiment of the present application. The X direction in the figure is the thickness direction X of the display panel 10 .

[0151] like Figure 1 and Figure 2 As shown, an embodiment of the first aspect of the present application provides a display panel 10, including: a substrate 100, a connecting hole 100a is opened on one side of the substrate 100; a light-emitting device 200, arranged on one side of the substrate 100, the light-emitting device 200 includes a first electrode 210, the first electrode 210 includes a first conductive structure 211 and a second conductive structure 212 located on the side of the first conductive structure 211 away from the substrate 100, and a part of the structure of the first conductive structure 211 is located in the connecting hole 100a; a pixel definition layer 300, including a pixel defining portion 310 arranged on the side of the first conductive structure 211 away from the substrate 100, the pixel defining portion 310 encloses a pixel opening 310a, the second conductive structure 212 is at least partially located in the pixel opening 310a, and at least a part of the surface of the first conductive structure 211 is exposed from the pixel opening 310a and connected to the second conductive structure 212.

[0152] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, a light-emitting device 200, and a pixel definition layer 300. The light-emitting device 200 is disposed on one side of the substrate 100, the light-emitting device 200 includes a first electrode 210, the pixel definition layer 300 includes a pixel defining portion 310 disposed on a side of the first conductive structure 211 away from the substrate 100, the pixel defining portion 310 encloses a pixel opening 310a, and the pixel definition layer 300 can be used to participate in dividing the sub-pixels of the display panel 10.

[0153] The first electrode 210 includes a first conductive structure 211 and a second conductive structure 212 located on a side of the first conductive structure 211 away from the substrate 100. A connecting hole 100a is provided on one side of the substrate 100. Part of the structure of the first conductive structure 211 is located in the connecting hole 100a. The first electrode 210 can be electrically connected to the device in the substrate 100 through the connecting hole 100a, so that the first electrode 210 can be used as a pixel electrode of the display panel 10 to participate in driving the light-emitting display of the display panel 10. In addition, the first conductive structure 211 located in the connecting hole 100a can play a flattening role, so that the second conductive structure 212 is not easy to collapse at the connecting hole 100a, so that the surface of the second conductive structure 212 on the side away from the substrate 100 can have a good flatness, so that the film layer structure subsequently prepared on the second conductive structure 212 can also have a good flatness, which can well improve the structural stability of the display panel 10.

[0154] Optionally, a portion of the first conductive structure 211 may be located inside the connecting hole 100 a , and another portion of the first conductive structure 211 may be located outside the connecting hole 100 a and connected to the second conductive structure 212 .

[0155] By arranging the second conductive structure 212 to be at least partially located in the pixel opening 310 a , the pixel defining portion 310 is not easily shielded from the second conductive structure 212 , so that the second conductive structure 212 can have a larger size to improve the display effect of the display panel 10 .

[0156] In some embodiments of the present application, there are many ways to set the substrate 100. For example, the substrate 100 may include a substrate 110 and a driving circuit 150 arranged on the side of the substrate 110 facing the light-emitting device 200. Exemplarily, the driving circuit 150 may include a transistor 151, a storage capacitor 152, and a driving signal line for connecting various devices. Among them, the transistor 151 may include a semiconductor, a gate 151a, and a source and drain 151b. The storage capacitor 152 may include a first plate 152a and a second plate 152b.

[0157] Optionally, the substrate 100 may also include a first insulating layer 120, a second insulating layer 130 and a third insulating layer 140 which are arranged on one side of the substrate 110 and stacked in sequence in a direction away from the substrate 110, wherein the third insulating layer 140 can be used as a planarization layer of the display panel 10, so that the substrate 100 can have a relatively flat surface, which can facilitate the subsequent preparation of other film layer structures on the substrate 100.

[0158] As an example, the gate 151a and the first electrode 152a can be located on the side of the first insulating layer 120 facing the substrate 110, the second electrode 152b can be located between the first insulating layer 120 and the second insulating layer 130, and the source and drain 151b can be located between the second insulating layer 130 and the third insulating layer 140.

[0159] In some embodiments of the present application, there are multiple ways to open the communication hole 100 a on the substrate 100 . For example, the communication hole 100 a may be set through the third insulating layer 140 .

[0160] Optionally, the first electrode 210 can be electrically connected to the transistor 151 in the substrate 100 through the connecting hole 100a. For example, the first conductive structure 211 of the first electrode 210 can be connected to the source and drain 151b of the transistor 151 through the connecting hole 100a, so that the transistor 151 can be used to provide a driving current to the first electrode 210 to drive the light-emitting device 200 to display light.

[0161] In some optional embodiments, a projection of the communication hole 100 a in the thickness direction X of the display panel 10 at least partially overlaps with a projection of the pixel opening 310 a in the thickness direction X of the display panel 10 .

[0162] Optionally, the projection of the connecting hole 100a in the thickness direction X of the display panel 10 may refer to a projection area formed by the orthographic projection of the inner wall of the connecting hole 100a in the thickness direction X of the display panel 10 and the orthographic projection of the inner wall of the connecting hole 100a in the thickness direction X of the display panel 10.

[0163] Optionally, the projection of the pixel opening 310a in the thickness direction X of the display panel 10 may refer to a projection area formed by the orthographic projection of the inner wall of the pixel opening 310a in the thickness direction X of the display panel 10 and the orthographic projection of the inner wall of the pixel opening 310a in the thickness direction X of the display panel 10.

[0164] Optionally, the projection of the communication hole 100 a in the thickness direction X of the display panel 10 is located within the projection of the pixel opening 310 a in the thickness direction X of the display panel 10 .

[0165] In these optional embodiments, the projection of the connecting hole 100a in the thickness direction X of the display panel 10 can at least partially overlap with the projection of the pixel opening 310a in the thickness direction X of the display panel 10, so that some transistors 151 in the driving circuit 150 can be located below or relatively close to the pixel opening 310a, which can facilitate the arrangement of the driving circuit 150 in the substrate 100, so that the driving circuit 150 in the substrate 100 can be arranged more closely, which is also beneficial to improving the pixel density (Pixels Per Inch, PPI) of the display panel 10.

[0166] In some optional embodiments, the light emitting device 200 further includes a light emitting layer 220 located on a side of the first electrode 210 facing away from the substrate 100 .

[0167] Optionally, the light emitting layer 220 is at least partially located in the pixel opening 310 a and connected to the second conductive structure 212 , so that the second conductive structure 212 can drive the light emitting layer 220 to emit light.

[0168] Optionally, the light emitting layer 220 may include a hole injection layer (HIL), a hole transport layer (HTL), a light emitting structure, an electron injection layer (EIL) and an electron transport layer (ETL).

[0169] Optionally, the light emitting device 200 further includes a second electrode 230 located on a side of the light emitting layer 220 facing away from the substrate 100 .

[0170] In these optional embodiments, the first electrode 210 and the second electrode 230 can be used as pixel electrodes of the display panel 10, one of the first electrode 210 and the second electrode 230 can be used as an anode, and the other can be used as a cathode to drive the light-emitting layer 220 to emit light. The embodiment of the present application is described by taking the first electrode 210 as the anode of the display panel 10 and the second electrode 230 as the cathode of the display panel 10 as an example.

[0171] Optionally, there may be a plurality of light emitting devices 200. Optionally, the second electrodes 230 of adjacent light emitting devices 200 may be electrically connected to each other to facilitate control of the second electrodes 230.

[0172] Exemplarily, the light emitting device 200 may include a first light emitting device 201, a second light emitting device 202, and a third light emitting device 203, wherein the light emitting colors of the first light emitting device 201, the second light emitting device 202, and the third light emitting device 203 may be different from each other, so as to realize color display of the display panel 10. For example, the light emitting color of the first light emitting device 201 may be red, the light emitting color of the second light emitting device 202 may be green, and the light emitting color of the third light emitting device 203 may be blue.

[0173] In some optional embodiments, the number of pixel openings 310a may be multiple, and the pixel definition layer 300 may be in a mesh shape. For example, the hollowed-out portion in the mesh-shaped pixel defining portion 310 may form a pixel opening 310a, and at least one light-emitting layer 220 may be correspondingly disposed in each pixel opening 310a, and the light-emitting layer 220 may be driven to emit light in the pixel opening 310a.

[0174] Optionally, the material of the first conductive structure 211 includes a conductive material. For example, the material of the first conductive structure 211 may include indium tin oxide, so that the first conductive structure 211 has good conductivity and good light transmittance.

[0175] Optionally, the material of the second conductive structure 212 includes a conductive material, so that the current transmitted from the first conductive structure 211 can be transmitted to the upper light-emitting layer 220 through the second conductive structure 212. Exemplarily, the material of the second conductive structure 212 may include silver, so that the second conductive structure 212 can be used to reflect light, so that the light emitted by the light-emitting layer 220 toward the side of the substrate 100 can be reflected by the second conductive structure 212 and emitted outward in a direction away from the substrate 100, so as to better improve the display effect of the display panel 10.

[0176] Optionally, the pixel opening 310a may include a first pixel opening 310aa, a second pixel opening 310ab and a third pixel opening 310ac, the first light-emitting device 201 may be arranged corresponding to the first pixel opening 310aa, the second light-emitting device 202 may be arranged corresponding to the second pixel opening 310ab, and the third light-emitting device 203 may be arranged corresponding to the third pixel opening 310ac.

[0177] Optionally, the first light-emitting device 201 is disposed corresponding to the first pixel opening 310aa, which may mean that at least part of the structure of the first light-emitting device 201 may be located in the first pixel opening 310aa, for example, at least part of the second electrode 230, the light-emitting layer 220, and at least part of the second conductive structure 212 in the first light-emitting device 201 may be located in the first pixel opening 310aa. Similarly, the second light-emitting device 202 is disposed corresponding to the second pixel opening 310ab, which may mean that at least part of the structure of the second light-emitting device 202 may be located in the second pixel opening 310ab, for example, at least part of the second electrode 230, at least part of the light-emitting layer 220, and at least part of the second conductive structure 212 in the second light-emitting device 202 may be located in the second pixel opening 310ab. The third light-emitting device 203 is arranged corresponding to the third pixel opening 310ac, which may mean that at least part of the structure of the third light-emitting device 203 may be located within the third pixel opening 310ac, for example, at least part of the second electrode 230, at least part of the light-emitting layer 220 and at least part of the second conductive structure 212 in the third light-emitting device 203 may be located within the third pixel opening 310ac.

[0178] In some embodiments of the present application, the first conductive structure 211 located in the connecting hole 100a can play a flattening role, so that the second conductive structure 212 is not easy to collapse at the connecting hole 100a, so that the light-emitting device formed on the second conductive structure 212 can have a better flatness, which can better improve the structural stability of the display panel 10, and make the display panel 10 less likely to have a large color deviation, which can better improve the display effect of the display panel 10.

[0179] By arranging the second conductive structure 212 to be at least partially located in the pixel opening 310a, the arrangement of the pixel defining portion 310 is not easy to block the second conductive structure 212, so that the second conductive structure 212 can have a larger size to contact the light-emitting layer 220, so that the second conductive structure 212 can drive a larger area of ​​the light-emitting layer 220 to emit light, thereby improving the display effect of the display panel 10. Also, when the material of the second conductive structure 212 includes silver, the second conductive structure 212 can have a larger size to reflect the light emitted by the light-emitting layer 220, which can better reduce the light loss of the light-emitting device 200 and improve the display effect of the display panel 10. In addition, the second conductive structure 212 arranged in the pixel opening 310a can also be used to protect the pixel defining portion 310, so that the pixel defining portion 310 is not easily damaged during the preparation process of the display panel 10, which is conducive to improving the structural stability of the display panel 10.

[0180] In some optional embodiments, a side of the pixel defining portion 310 facing the pixel opening 310 a has a first inner wall 311 , and a portion of the second conductive structure 212 covers at least a portion of the first inner wall 311 .

[0181] Optionally, the projection of the pixel opening 310a in the thickness direction X of the display panel 10 may refer to a projection area formed by the orthographic projection of the first inner wall 311 in the thickness direction X of the display panel 10 and the orthographic projection of the first inner wall 311 in the thickness direction X of the display panel 10 .

[0182] Optionally, the pixel defining portion 310 has a first top wall 312 on the side facing away from the substrate 100 , the second conductive structure 212 may cover the first inner wall 311 and extend to the side of the first top wall 312 away from the substrate 100 , and part of the second conductive structure 212 covers at least part of the first top wall 312 .

[0183] Optionally, a projection of the first top wall 312 in the thickness direction X of the display panel 10 may surround a projection of the communication hole 100 a in the thickness direction X of the display panel 10 .

[0184] In these optional embodiments, by setting the second conductive structure 212 to cover at least a portion of the first inner wall 311 and at least a portion of the first top wall 312, the second conductive structure 212 can have a larger size, so that the second conductive structure 212 can have the beneficial effects of the aforementioned embodiments, which can facilitate improving the display effect of the display panel 10 and the structural stability of the display panel 10.

[0185] Optionally, in the direction away from the substrate 100 , the first inner wall 311 is inclined in the direction away from the pixel opening 310 a , which can facilitate the light emission of the light emitting layer 220 and reduce the shielding effect of the first inner wall 311 of the pixel defining portion 310 on the light emission of the light emitting layer 220 .

[0186] Optionally, the orthographic projection of the second conductive structure 212 on the substrate 100 may be located within the orthographic projection of the light-emitting layer 220 on the substrate 100, so that the light-emitting layer 220 can be better covered by the second conductive structure 212, thereby allowing the light-emitting layer 220 and the second conductive structure 212 to have a larger contact area, which is beneficial to increasing the light-emitting area of ​​the light-emitting layer 220, thereby helping to improve the display effect of the display panel 10.

[0187] In some optional embodiments, an orthographic projection of the first conductive structure 211 on the substrate 100 at least partially overlaps with an orthographic projection of the first inner wall 311 on the substrate 100 .

[0188] Optionally, the orthographic projection of the first inner wall 311 on the substrate 100 is located within the orthographic projection of the first conductive structure 211 on the substrate 100 .

[0189] In these optional embodiments, by setting the orthographic projection of the first conductive structure 211 on the substrate 100 to at least partially overlap with the orthographic projection of the first inner wall 311 on the substrate 100, the first conductive structure 211 can have a better size and be arranged below the first inner wall 311, so that the first conductive structure 211 can have a better flattening effect on the first inner wall 311, so that the first inner wall 311 can be relatively smooth, which is beneficial to improving the continuity and thickness uniformity of the subsequently prepared film layer structure falling on the first inner wall 311, for example, it is beneficial to improve the continuity and thickness uniformity of the second conductive structure 212 and the light-emitting layer 220 located on the first inner wall 311, which can better improve the structural stability and display effect of the display panel 10.

[0190] Optionally, the orthographic projection of the pixel opening 310a on the substrate 100 is located within the orthographic projection of the first conductive structure 211 on the substrate 100, so that the first conductive structure 211 can better flatten the film layer structure within the pixel opening 310a, so that the second conductive structure 212 and the light-emitting layer 220 falling into the pixel opening 310a can have good continuity and thickness uniformity, which can better improve the structural stability and display effect of the display panel 10.

[0191] In some embodiments, Figure 2 As shown, the second conductive structure 212 in the pixel opening 310a can be an integral structure. For example, the second conductive structure 212 can be continuous in the pixel opening 310a and on the first top wall 312, so that each position of the second conductive structure 212 can be used to transmit current to drive the light-emitting layer 220 to emit light. Therefore, by setting the second conductive structure 212 as an integral structure, the light-emitting layer 220 can have a larger light-emitting area, which can better improve the display effect of the display panel 10.

[0192] Figure 3 is a partial cross-sectional schematic diagram of a display panel 10 according to another embodiment of the present application. Figure 4 FIG. 1 is a partial cross-sectional schematic diagram of a display panel 10 according to another embodiment of the present application.

[0193] In other embodiments, Figure 3 and Figure 4 As shown, the second conductive structure 212 may be a split structure. For example, a portion of the second conductive structure 212 may be used to transmit current to drive the light-emitting layer 220 to emit light, and another portion of the second conductive structure 212 may only be used to reflect light emitted by the light-emitting layer 220 and protect the pixel defining portion 310.

[0194] In this embodiment, the specific light emitting area of ​​the light emitting layer 220 can be adjusted by controlling the size of the partial structure of the second conductive structure 212 that is used to drive the light emitting layer 220 to emit light, thereby better adjusting the color deviation of the display panel 10.

[0195] Exemplarily, there are many ways to realize that the second conductive structure 212 is a split structure. For example, by changing the morphology of the pixel defining portion 310, the surface morphology of the pixel defining portion 310 can be used to isolate the material of the second conductive structure 212 during the preparation process of the display panel 10, so that the formed second conductive structure 212 can be a split structure.

[0196] In some optional embodiments, a partition groove 311a is opened on the first inner wall 311, and the second conductive structure 212 is disconnected at the partition groove 311a to form a first conductive division 212a and a second conductive division 212b, the first conductive division 212a is connected to the first conductive structure 211, and the second conductive division 212b is located on the side of the first conductive division 212a away from the substrate 100.

[0197] Optionally, the second conductive structure 212 is disconnected at the partition groove 311a to form a first conductive section 212a and a second conductive section 212b, which may mean that the second conductive structure 212 may include a first conductive section 212a and a second conductive section 212b, and the first conductive section 212a and the second conductive section 212b may be spaced apart at the partition groove 311a.

[0198] Optionally, the partition groove 311 a may extend in a direction away from the pixel opening 310 a .

[0199] Optionally, the first conductive segment 212 a may be partially located in the partition groove 311 a .

[0200] Optionally, the second conductive segment 212 b may cover at least a portion of the first top wall 312 .

[0201] Optionally, the second conductive segment 212 b may cover at least a portion of the first inner wall 311 .

[0202] In this optional embodiment, by providing a partition groove 311a on the first inner wall 311, when preparing the second conductive structure 212, for example, when evaporating the material of the second conductive structure 212, the material of the second conductive structure 212 is disconnected at the partition groove 311a, so that the material of the second conductive structure 212 may no longer be continuous on the first inner wall 311, so that the second conductive structure 212 may be a split structure. Among them, the first conductive sub-portion 212a connected to the first conductive structure 211 can be used to reflect the light at the light emitting portion of the light emitting layer 220 and to transmit the driving current to drive the light emitting layer 220 to emit light, and the second conductive sub-portion 212b separated from the first conductive sub-portion 212a can be mainly used to reflect light and protect the pixel defining portion 310.

[0203] Optionally, the size of the first conductive portion 212 a may be adjusted by adjusting the location of the partition groove 311 a , thereby adjusting the light emitting area of ​​the light emitting layer 220 , and thus better adjusting the color deviation of the display panel 10 .

[0204] As an example, Figure 3 As shown, the partition groove 311a may be located on the side of the pixel defining portion 310 facing the substrate 100, and at least part of the surface of the first conductive structure 211 is exposed from the partition groove 311a, and the first conductive sub-portion 212a may be spaced apart from the first inner wall 311. In this example, the partition groove 311a may be opened at the edge of the first inner wall 311 facing the substrate 100, so that the second conductive structure 212 may be disconnected at the edge of the pixel defining portion 310 close to the substrate 100 and form the first conductive sub-portion 212a and the second conductive sub-portion 212b, and the first conductive sub-portion 212a may not extend above the first inner wall 311.

[0205] As another example, Figure 4 As shown, part of the pixel defining portion 310 is located between the partition groove 311a and the first conductive structure 211, and the first conductive sub-portion 212a covers part of the first inner wall 311. In this example, the partition groove 311a can be opened at a relatively middle position of the first inner wall 311 in the thickness direction X of the display panel 10, so that the first conductive sub-portion 212a can extend to the upper part of the first inner wall 311 located on the side of the partition groove 311a facing the substrate 100, so that the first conductive sub-portion 212a can have a larger size to contact the light-emitting layer 220, which is beneficial to increase the light-emitting area of ​​the light-emitting layer 220, thereby facilitating the display effect of the display panel 10.

[0206] Optionally, the partition groove 311a may be used only to isolate the material of the second conductive structure 212 during the preparation of the display panel 10. During the preparation of the display panel 10, the light-emitting layer 220 may not be affected by the partition groove 311a, that is, the light-emitting layer 220 may be continuous at the partition groove 311a.

[0207] Exemplarily, the light-emitting layer 220 may cover at least a portion of the side of the partition groove 311a facing the pixel opening 310a, so that the light-emitting layer 220 can flatten the second electrode 230 located above the light-emitting layer 220, making it difficult for the second electrode 230 to be disconnected at the partition groove 311a, and making the second electrode 230 located above the light-emitting layer 220 have better continuity and thickness uniformity.

[0208] In some optional embodiments, the first conductive portion 212a may have a first thickness, the light-emitting layer 220 may have a second thickness, the size of the partition groove 311a in the thickness direction X of the display panel 10 is less than or equal to the sum of the first thickness and the second thickness, and / or the size of the partition groove 311a in the thickness direction X of the display panel 10 is greater than the first thickness.

[0209] Optionally, the first thickness may be an average thickness or a maximum thickness of the first conductive portion 212 a , and the second thickness may be an average thickness or a maximum thickness of the light emitting layer 220 .

[0210] In these optional embodiments, the size of the partition groove 311a in the thickness direction X of the display panel 10 is reasonably set according to the thickness of the first conductive section 212a and the thickness of the light-emitting layer 220, so that the partition groove 311a can better isolate the material of the second conductive structure 212, while the light-emitting layer 220 is not affected by the isolation of the partition groove 311a and is continuous at the partition groove 311a.

[0211] Figure 5 FIG. 1 is a partial cross-sectional schematic diagram of a display panel 10 according to another embodiment of the present application.

[0212] like Figure 5 As shown, in some optional embodiments, the first electrode 210 further includes an auxiliary structure 213 located between the first conductive structure 211 and the second conductive structure 212, the first conductive structure 211 is recessed at the connecting hole 100a to form a groove 211aa, and the auxiliary structure 213 is filled in the groove 211aa.

[0213] Optionally, the first conductive structure 211 is recessed at the connecting hole 100a to form a groove 211aa, which may mean that due to the height difference of the surface of the substrate 100 at the connecting hole 100a, the first conductive structure 211 is easily recessed at the connecting hole 100a, so that the groove 211aa is easily formed on the side of the first conductive structure 211 away from the substrate 100.

[0214] Optionally, the first conductive structure 211 and the auxiliary structure 213 are made of different materials.

[0215] In these optional embodiments, the first conductive structure 211 and the auxiliary structure 213 of different materials can be used to achieve different functions. Exemplarily, the first conductive structure 211 can be mainly used to transfer current to drive the light-emitting layer 220 to emit light, and the auxiliary structure 213 can be mainly used to flatten the surface of the first conductive structure 211 on the side away from the substrate 100. For example, when the first conductive structure 211 cannot fill the connecting hole 100a well, that is, when the first conductive structure 211 is recessed at the connecting hole 100a to form a groove 211aa, the auxiliary structure 213 can fill the groove 211aa well to better reduce the influence of the connecting hole 100a and the groove 211aa on the flatness of the upper film structure. Specifically, the second conductive structure 212 located on the side of the first conductive structure 211 away from the substrate 100 is not easy to collapse at the connecting hole 100a and the groove 211aa, so that the surface of the second conductive structure 212 on the side away from the substrate 100 can have a better flatness.

[0216] In some optional embodiments, the material of the auxiliary structure 213 includes an organic material. For example, the auxiliary structure 213 and the third insulating layer 140 may be made of the same material.

[0217] By setting the material of the auxiliary structure 213 to include organic material, the material of the auxiliary structure 213 can have better fluidity during the preparation of the display panel 10, and the material of the auxiliary structure 213 can be better filled into the groove 211aa, so that the auxiliary structure 213 can play a better planarization role.

[0218] In some optional embodiments, the auxiliary structure 213 may be made of the same material as the pixel defining portion 310, so that the auxiliary structure 213 and the pixel defining portion 310 may be prepared together using the same preparation equipment, thereby effectively improving the preparation efficiency of the display panel 10. For example, when preparing the pixel defining portion 310, part of the material of the pixel defining portion 310 may fall into the groove 211aa to form the auxiliary structure 213, thereby effectively improving the preparation efficiency of the display panel 10.

[0219] In some optional embodiments, the first conductive structure 211 includes a first division 211a located inside the connecting hole 100a and a second division 211b located outside the connecting hole 100a, the first division 211a is recessed to form a groove 211aa, the second division 211b is connected to the second conductive structure 212, and the surface of the second division 211b facing away from the substrate 100 is coplanar with the surface of the auxiliary structure 213 facing away from the substrate 100.

[0220] Optionally, the auxiliary structure 213 may be located only in the groove 211 aa , that is, the auxiliary structure 213 may not extend to the surface of the second portion 211 b facing away from the substrate 100 .

[0221] In this optional embodiment, by setting the surface of the second section 211b facing away from the substrate 100 to be coplanar with the surface of the auxiliary structure 213 facing away from the substrate 100, the surfaces of the first conductive structure 211 and the auxiliary structure 213 facing away from the substrate 100 can be relatively flat, which is beneficial to improving the flatness of the second conductive structure 212 above the first conductive structure 211, so that the second conductive structure 212 is not easy to collapse at the connecting hole 100a and the groove 211aa.

[0222] Furthermore, by disposing the auxiliary structure 213 only in the groove 211 aa , a sufficient connection area is provided between the second portion 211 b and the second conductive structure 212 , thereby reducing the resistance of the display panel 10 .

[0223] Figure 6 is a partial structural diagram of a pixel definition layer 300 and an isolation structure 400 according to an embodiment of the present application. Figure 7 FIG. 1 is a partial cross-sectional schematic diagram of a display panel 10 according to another embodiment of the present application.

[0224] like Figure 6 and Figure 7 As shown, in some optional embodiments, the display panel 10 also includes an isolation structure 400 arranged on one side of the substrate 100, the isolation structure 400 is provided with an isolation opening 400a connected to the pixel opening 310a, the isolation structure 400 includes a first isolation portion 410 and a second isolation portion 420 located on the side of the first isolation portion 410 away from the substrate 100, the second isolation portion 420 is arranged to protrude from the first isolation portion 410 toward the isolation opening 400a, for example, the orthographic projection of the first isolation portion 410 on the substrate 100 is located within the orthographic projection of the second isolation portion 420 on the substrate 100.

[0225] Related solutions of the isolation structure 400 (also called partition structure, etc.) are disclosed in patents (applications) CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979 755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, CN117500332A, etc., the contents of which are incorporated into this application by reference for reference.

[0226] Optionally, the isolation structure 400 may also be in a mesh shape, and the hollowed-out areas in the mesh-shaped isolation structure 400 may form isolation openings 400 a , and the light emitted by the light-emitting layer 220 may be transmitted to the outside through the isolation openings 400 a .

[0227] Optionally, a plurality of isolation openings 400 a may be provided, a plurality of pixel openings 310 a may be provided, and the isolation openings 400 a may be provided corresponding to the pixel openings 310 a .

[0228] Optionally, the isolation opening 400a is arranged corresponding to the pixel opening 310a, which may refer to a single isolation opening 400a being connected to a single pixel opening 310a. Exemplarily, the isolation structure 400 includes a first isolation opening 400aa, a second isolation opening 400ab, and a third isolation opening 400ac, and the first isolation opening 400aa, the second isolation opening 400ab, and the third isolation opening 400ac may be connected to the first pixel opening 310aa, the second pixel opening 310ab, and the third pixel opening 310ac, respectively. Among them, the first light-emitting device 201 may be arranged corresponding to the first isolation opening 400aa, the second light-emitting device 202 may be arranged corresponding to the second isolation opening 400ab, and the third light-emitting device 203 may be arranged corresponding to the third isolation opening 400ac.

[0229] Optionally, the first light-emitting device 201 is disposed corresponding to the first isolation opening 400aa, which may mean that part of the structure of the first light-emitting device 201 may be located in the first isolation opening 400aa, for example, part of the second electrode 230, part of the light-emitting layer 220 and part of the second conductive structure 212 in the first light-emitting device 201 may be located in the first isolation opening 400aa. Similarly, the second light-emitting device 202 is disposed corresponding to the second isolation opening 400ab, which may mean that part of the structure of the second light-emitting device 202 may be located in the second isolation opening 400ab, for example, part of the second electrode 230, part of the light-emitting layer 220 and part of the second conductive structure 212 in the second light-emitting device 202 may be located in the second isolation opening 400ab. The third light-emitting device 203 is disposed corresponding to the third isolation opening 400ac, which may mean that part of the structure of the third light-emitting device 203 may be located in the third isolation opening 400ac, for example, part of the second electrode 230, part of the light-emitting layer 220 and part of the second conductive structure 212 in the third light-emitting device 203 may be located in the third isolation opening 400ac.

[0230] In these optional embodiments, the isolation structure 400 can also be used to participate in dividing the sub-pixels of the display panel 10. By arranging the second isolation portion 420 protruding from the first isolation portion 410 toward the isolation opening 400a, when the light-emitting layer 220 and the second electrode 230 of the light-emitting device 200 are evaporated, the second isolation portion 420 can shield at least part of the material used to prepare the light-emitting layer 220 and the second electrode 230, so as to separate the second conductive structure 212, the light-emitting layer 220 and the second electrode 230 of the adjacent light-emitting device 200, and can facilitate the formation of a plurality of light-emitting layers 220 and the second electrode 230 arranged at intervals, so that when the light-emitting layer 220 and the second electrode 230 of the display panel 10 are formed by evaporation, it is not necessary to set a mask with high precision, for example, when the light-emitting layer 220 and the second electrode 230 are formed by evaporation, it is not necessary to set a high-precision metal mask (Fine Metal Mask, FMM), so that the production cost of the display panel 10 can be reduced.

[0231] Optionally, the isolation structure 400 can also be used to isolate the material of the second conductive structure 212. Exemplarily, when vapor-depositing the second conductive structure 212 of the first electrode 210, the second isolation portion 420 can block at least a portion of the material used to prepare the second conductive structure 212 to isolate the second conductive structure 212 of the adjacent light-emitting device 200, and can facilitate the formation of a plurality of spaced second conductive structures 212, thereby eliminating the need to set a mask with high precision when vapor-depositing the second conductive structure 212 formed by the display panel 10. For example, there is no need to set a high-precision metal mask when vapor-depositing the second conductive structure 212, thereby significantly reducing the production cost of the display panel 10.

[0232] Optionally, there are many ways to set the relative position between the pixel defining portion 310 and the isolation structure 400, for example, Figure 7 As shown, the isolation structure 400 may be disposed on the side of the pixel defining portion 310 away from the substrate 100, that is, the isolation structure 400 may be directly disposed on the first top wall 312 of the pixel defining portion 310. Or, for example, the pixel defining portion 310 may be provided with a receiving groove (not shown in the figure), and at least part of the isolation structure 400 may be located in the receiving groove, so that the isolation structure 400 is not likely to have an excessive height compared to the substrate 100, thereby being able to better reduce the thickness of the display panel 10. For ease of description, the following embodiments are described by taking the isolation structure 400 disposed on the side of the pixel defining portion 310 away from the substrate 100 as an example.

[0233] Optionally, the material of the pixel defining portion 310 may include an inorganic material, so that the pixel defining portion 310 may have good structural stability when preparing the isolation structure 400. Exemplarily, when the material of the isolation structure 400 is etched to form a morphology in which the second isolation portion 420 protrudes from the first isolation portion 410 toward the isolation opening 400a, the etching liquid is not likely to have a significant impact on the pixel defining portion 310. For example, the pixel defining portion 310 including the inorganic material is not likely to be affected by the etching liquid and absorb water and swell, thereby being able to better improve the structural stability of the pixel defining portion 310.

[0234] In some optional embodiments, a projection of the communication hole 100 a in the thickness direction X of the display panel 10 at least partially overlaps with a projection of the isolation opening 400 a in the thickness direction X of the display panel 10 .

[0235] Optionally, the projection of the isolation opening 400a in the thickness direction X of the display panel 10 may refer to a projection area formed by the orthographic projection of the inner wall of the isolation opening 400a in the thickness direction X of the display panel 10 and the orthographic projection of the inner wall of the isolation opening 400a in the thickness direction X of the display panel 10.

[0236] Optionally, the projection of the communication hole 100 a in the thickness direction X of the display panel 10 may be located within the projection of the communication hole 100 a in the thickness direction X of the display panel 10 .

[0237] In these optional embodiments, by setting the projection of the connecting hole 100a in the thickness direction X of the display panel 10 to at least partially overlap with the projection of the isolation opening 400a in the thickness direction X of the display panel 10, some transistors 151 in the driving circuit 150 can be located below or relatively close to the isolation opening 400a, which can facilitate the arrangement of the driving circuit 150 in the substrate 100, so that the driving circuit 150 in the substrate 100 can be arranged more closely, which is also beneficial to improving the pixel density of the display panel 10.

[0238] In some optional embodiments, the material of the isolation structure 400 includes a conductive material, and the second electrode 230 is electrically connected to the isolation structure 400 , so that the second electrodes 230 of adjacent light-emitting devices 200 can be electrically connected through the isolation structure 400 to facilitate control of the second electrodes 230 .

[0239] For example, the material of the first isolation portion 410 may include a conductive material. The optional second electrode 230 is electrically connected to the first isolation portion 410 , so that the second electrodes 230 of adjacent light-emitting devices 200 can be electrically connected through the first isolation portion 410 .

[0240] In some optional embodiments, the isolation structure 400 also includes a conductive portion 430 disposed on the side of the first isolation portion 410 facing the substrate 100, and the conductive portion 430 is disposed protruding from the first isolation portion 410 toward the isolation opening 400a. For example, the orthographic projection of the first isolation portion 410 on the substrate 100 is located within the orthographic projection of the conductive portion 430 on the substrate 100; the second electrode 230 is connected to the conductive portion 430.

[0241] By arranging the conductive portion to protrude from the first isolation portion 410 toward the isolation opening 400 a , the overlap between the second electrode 230 and the conductive portion 430 can be facilitated, and the overlap area between the second electrode 230 and the conductive portion 430 can be improved to better reduce the resistance of the display panel 10 .

[0242] Optionally, the second conductive structure 212 may be spaced apart from the isolation structure 400 , so that the first electrode 210 and the second electrode 230 are unlikely to be short-circuited through the isolation structure 400 , thereby improving the working stability of the display panel 10 .

[0243] In some optional embodiments, the orthographic projection of the first electrode 210 on the substrate 100 at least partially overlaps with the orthographic projection of the isolation structure 400 on the substrate 100, so that the edge of the first electrode 210 can extend below the isolation structure 400, so that the step difference between the edge of the first electrode 210 and the substrate 100 is not likely to affect the continuity and thickness uniformity of the second electrode 230 above the pixel defining portion 310, so that the second electrode 230 can be better connected to the isolation structure 400.

[0244] Optionally, the orthographic projection of the first conductive structure 211 on the substrate 100 at least partially overlaps with the orthographic projection of the isolation structure 400 on the substrate 100, so that the edge of the first conductive structure 211 can extend to below the isolation structure 400, so that the step difference between the edge of the first conductive structure 211 and the substrate 100 is not likely to affect the continuity and thickness uniformity of the second electrode 230 above the pixel defining portion 310, so that the second electrode 230 can be better connected to the isolation structure 400.

[0245] In some optional embodiments, an orthographic projection of the first electrode 210 on the substrate 100 at least partially overlaps with an orthographic projection of the conductive portion 430 on the substrate 100 .

[0246] Optionally, an orthographic projection of the first conductive structure 211 on the substrate 100 at least partially overlaps with an orthographic projection of the conductive portion 430 on the substrate 100 .

[0247] In these optional embodiments, by reasonably setting the relative position relationship between the film layer structure in the first electrode 210 and the conductive part 430, the edge of the first electrode 210 can be extended to below the conductive part 430. For example, the step difference between the edge of the first conductive structure 211 and the substrate 100 is not likely to affect the continuity and thickness uniformity of the second electrode 230 above the pixel defining part 310, so that the second electrode 230 can be better connected to the conductive part 430.

[0248] In some optional embodiments, an orthographic projection of the first electrode 210 on the substrate 100 at least partially overlaps with an orthographic projection of the first isolation portion 410 on the substrate 100 .

[0249] Optionally, an orthographic projection of the first conductive structure 211 on the substrate 100 at least partially overlaps with an orthographic projection of the first isolation portion 410 on the substrate 100 .

[0250] In these optional embodiments, by reasonably setting the relative position relationship between the film layer structure in the first electrode 210 and the first isolation portion 410, the edge of the first electrode 210 can be extended to below the first isolation portion 410. For example, the step difference between the edge of the first conductive structure 211 and the substrate 100 is not likely to affect the continuity and thickness uniformity of the second electrode 230 above the pixel defining portion 310, so that the second electrode 230 can be better connected to the conductive portion 430.

[0251] In some optional embodiments, the display panel 10 further includes a first encapsulation layer 500 disposed on a side of the isolation structure 400 and the light-emitting device 200 away from the substrate 100 . The first encapsulation layer 500 can be used to encapsulate the light-emitting device 200 in the display panel 10 .

[0252] Optionally, the material of the first encapsulation layer 500 may include an inorganic material, so that the first encapsulation layer 500 is not easily affected by water vapor, so as to better improve the encapsulation effect of the first encapsulation layer 500. Optionally, the first encapsulation layer 500 may be prepared by a chemical vapor deposition process (CVD).

[0253] In some optional embodiments, the first packaging layer 500 includes a first packaging unit 510 arranged on the side of the first light-emitting device 201 away from the substrate 100, a second packaging unit 520 arranged on the side of the second light-emitting device 202 away from the substrate 100, and a third packaging unit 530 arranged on the side of the third light-emitting device 203 away from the substrate 100.

[0254] Optionally, the first encapsulation unit 510 , the second encapsulation unit 520 and the third encapsulation unit 530 may be spaced apart from each other.

[0255] In these optional embodiments, the first packaging unit 510 , the second packaging unit 520 , and the third packaging unit 530 may respectively perform relatively independent packaging on the first light-emitting device 201 , the second light-emitting device 202 , and the third light-emitting device 203 .

[0256] In some optional embodiments, the light emitting devices 200 of different colors and their corresponding parts of the first encapsulation layer 500 can be prepared relatively independently with the help of the isolation structure 400. For example, during the preparation of the display panel 10, under the shielding and partitioning effect of the isolation structure 400, the second conductive structure 212, the light emitting layer 220 and the second electrode 230 in the light emitting devices 200 with different light emitting colors in the display panel 10 can be prepared relatively independently, and the first encapsulation unit 510, the second encapsulation unit 520 and the third encapsulation unit 530 can also be prepared relatively independently.

[0257] As an example, the isolation structure 400 may be used to sequentially prepare the first encapsulation unit 510 , the first light-emitting device 201 , the second encapsulation unit 520 , the second light-emitting device 202 , the third encapsulation unit 530 and the third light-emitting device 203 .

[0258] Exemplarily, the first conductive structure 211 and the auxiliary structure 213 of the first electrode 210 in each light-emitting device 200 may be prepared first. Then, the materials of the second conductive structure 212, the light-emitting layer 220 and the second electrode 230 in the first light-emitting device 201 may be evaporated on the entire surface, and the isolation structure 400 may isolate the materials of the second conductive structure 212, the light-emitting layer 220 and the second electrode 230 in part of the first light-emitting device 201, and then the materials of the first encapsulation layer 500 may be evaporated on the entire surface. Then, the materials of the first encapsulation layer 500 outside the first isolation opening 400aa and the first pixel opening 310aa are removed to form the first encapsulation unit 510, and then the materials of the second electrode 230 of the first light-emitting device 201 outside the first isolation opening 400aa, the materials of the light-emitting layer 220 of the first light-emitting device 201 and the materials of the second conductive structure 212 of the first electrode 210 in the first light-emitting device 201 are removed in sequence to form the first light-emitting device 201 arranged corresponding to the first isolation opening 400aa and the first pixel opening 310aa.

[0259] Then, the whole surface of the material of the second conductive structure 212, the light-emitting layer 220 and the second electrode 230 in the second light-emitting device 202 is evaporated, and the isolation structure 400 can isolate the material of the second conductive structure 212, the light-emitting layer 220 and the second electrode 230 in part of the second light-emitting device 202, and then the whole surface of the material of the first encapsulation layer 500 is evaporated. Then, the material of the first encapsulation layer 500 outside the second isolation opening 400ab and the second pixel opening 310ab is removed to form a second encapsulation unit 520, and then the material of the second electrode 230 of the second light-emitting device 202 outside the second isolation opening 400ab, the material of the light-emitting layer 220 of the second light-emitting device 202, and the material of the second conductive structure 212 of the first electrode 210 in the second light-emitting device 202 are removed in sequence to form a second light-emitting device 202 corresponding to the second isolation opening 400ab and the second pixel opening 310ab.

[0260] Then, the material of the second conductive structure 212, the light-emitting layer 220 and the second electrode 230 in the third light-emitting device 203 is evaporated on the whole surface. The isolation structure 400 can isolate the material of the second conductive structure 212, the light-emitting layer 220 and the second electrode 230 in part of the third light-emitting device 203, and then the material of the first encapsulation layer 500 is evaporated on the whole surface. Then, the material of the first encapsulation layer 500 outside the third isolation opening 400ac is removed to form a third encapsulation unit 530, and then the material of the second electrode 230 of the third light-emitting device 203 outside the third isolation opening 400ac and the third pixel opening 310ac, the material of the light-emitting layer 220 of the third light-emitting device 203, and the material of the second conductive structure 212 of the first electrode 210 in the third light-emitting device 203 are removed in sequence to form a third light-emitting device 203 corresponding to the third isolation opening 400ac and the third pixel opening 310ac.

[0261] Optionally, the specific method for preparing each light-emitting device 200 and the first encapsulation layer 500 by using the isolation structure 400 may refer to the method for preparing the display panel 10 in the embodiment described later.

[0262] Figure 8 FIG. 1 is a partial cross-sectional schematic diagram of a display panel 10 according to another embodiment of the present application.

[0263] like Figure 8 As shown, in some optional embodiments, the display panel 10 further includes a second encapsulation layer 600 , which is located on a side of the first encapsulation layer 500 away from the substrate 100 , and the second encapsulation layer 600 at least covers the first encapsulation layer 500 to further encapsulate the display panel 10 .

[0264] Optionally, the material of the second encapsulation layer 600 may include organic material, so that the second encapsulation layer 600 can have better fluidity, so as to form a relatively flat surface on the side of the second encapsulation layer 600 away from the substrate 100, so as to facilitate the subsequent formation of a film layer or device above the second encapsulation layer 600.

[0265] Optionally, the second encapsulation layer 600 may be prepared by inkjet printing (IJP).

[0266] In some optional embodiments, the display panel 10 may further include a third encapsulation layer 700, which is located on a side of the second encapsulation layer 600 away from the substrate 100. By providing the third encapsulation layer 700 on a side of the second encapsulation layer 600 away from the substrate 100, the encapsulation effect of the display panel 10 can be further improved.

[0267] Optionally, the third encapsulation layer 700 may include an inorganic encapsulation layer. Optionally, the third encapsulation layer 700 may be prepared by a chemical vapor deposition process.

[0268] Fig. 9 FIG. 1 is a partial cross-sectional schematic diagram of a display panel 10 according to another embodiment of the present application.

[0269] Please combine Figures 1 to 8 Also see Fig. 9 The embodiment of the first aspect of the present application further provides a display panel 10, comprising: a substrate 100, a connecting hole 100a is opened on one side of the substrate 100; a light emitting device 200 is arranged on one side of the substrate 100, the light emitting device 200 comprises a first electrode 210, the first electrode 210 comprises a first conductive structure 211 and an auxiliary structure 213, a part of the structure of the first conductive structure 211 is located in the connecting hole 100a, and the first conductive structure 211 is recessed at the connecting hole 100a to form a groove 211aa, and the auxiliary structure 213 fills In the groove 211aa; the pixel definition layer 300 includes a pixel defining portion 310 arranged on the side of the first conductive structure 211 away from the substrate 100, the pixel defining portion 310 encloses a pixel opening 310a, the projection of the connecting hole 100a in the thickness direction X of the display panel 10 and the projection of the pixel opening 310a in the thickness direction X of the display panel 10 at least partially overlap, at least part of the surface of the first conductive structure 211 is exposed from the pixel opening 310a, and the auxiliary structure 213 is set with the same material as the pixel defining portion 310.

[0270] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, a light-emitting device 200, and a pixel definition layer 300. The light-emitting device 200 is disposed on one side of the substrate 100, the light-emitting device 200 includes a first electrode 210, the pixel definition layer 300 includes a pixel definition portion 310 disposed on a side of the first electrode 210 away from the substrate 100, the pixel definition portion 310 encloses a pixel opening 310a, and the pixel definition layer 300 can be used to participate in dividing the sub-pixels of the display panel 10.

[0271] The first electrode 210 includes a first conductive structure 211 and an auxiliary structure 213. A connecting hole 100a is opened on one side of the substrate 100. Part of the structure of the first conductive structure 211 is located in the connecting hole 100a. The first electrode 210 can be electrically connected to the device in the substrate 100 through the connecting hole 100a, so that the first electrode 210 can be used as a pixel electrode of the display panel 10 to participate in driving the luminous display of the display panel 10.

[0272] By setting the projection of the connecting hole 100a in the thickness direction X of the display panel 10 to at least partially overlap with the projection of the pixel opening 310a in the thickness direction X of the display panel 10, the device in the substrate 100 can be located below or relatively close to the pixel opening 310a, which can facilitate the arrangement of the devices in the substrate 100, so that the devices in the substrate 100 can be arranged more closely, which is also beneficial to improving the pixel density of the display panel.

[0273] The first conductive structure 211 is recessed at the connecting hole 100a to form a groove 211aa, and the auxiliary structure 213 is filled in the groove 211aa. The auxiliary structure 213 can be mainly used to flatten the surface of the first conductive structure 211 facing away from the substrate 100. For example, when the first conductive structure 211 cannot fill the connecting hole 100a well, that is, when the first conductive structure 211 is recessed at the connecting hole 100a to form the groove 211aa, the auxiliary structure 213 can fill the groove 211aa well, so as to better reduce the influence of the connecting hole 100a and the groove 211aa on the flatness of the upper film structure, and can further improve the structural stability of the display panel 10.

[0274] By setting the auxiliary structure 213 to be made of the same material as the pixel defining portion 310, the auxiliary structure 213 and the pixel defining portion 310 can be prepared together using the same preparation equipment, thereby improving the preparation efficiency of the display panel 10. For example, when preparing the pixel defining portion 310, part of the material of the pixel defining portion 310 can fall into the groove 211aa to form the auxiliary structure 213, thereby improving the preparation efficiency of the display panel 10.

[0275] Optionally, a display panel 10 provided in an embodiment of the first aspect of the present application may be the display panel 10 in any of the aforementioned embodiments. Therefore, a display panel 10 provided in an embodiment of the present application may have the beneficial effects of the display panel 10 in any of the aforementioned embodiments, and the present application will not elaborate on it.

[0276] For example, the substrate 100 may be the substrate 100 in any of the foregoing embodiments. For example, the light emitting device 200 may be the light emitting device 200 in any of the foregoing embodiments, and the light emitting device 200 may include the first electrode 210, the light emitting layer 220 and the second electrode 230 in any of the foregoing embodiments, and the first electrode 210 may include the first conductive structure 211, the second conductive structure 212 and the auxiliary structure 213 in any of the foregoing embodiments. Exemplarily, the light emitting device 200 may include the first light emitting device 201, the second light emitting device 202 and the third light emitting device 203 in any of the foregoing embodiments. For example, the pixel definition layer 300 may be the pixel definition layer 300 in any of the foregoing embodiments, and the relative positional relationship between the first conductive structure 211, the second conductive structure 212 and the pixel defining portion 310 may be set with reference to any of the foregoing embodiments.

[0277] Optionally, the display panel 10 may further include the isolation structure 400 in any of the aforementioned embodiments, the isolation structure 400 may be provided with the isolation opening 400a in any of the aforementioned embodiments, and the isolation structure 400 may include the first isolation portion 410, the second isolation portion 420, and the conductive portion 430 in any of the aforementioned embodiments. The relative positional relationship between the first electrode 210 and the isolation structure 400 may be set with reference to the aforementioned embodiments, for example, the relative positional relationship between the first conductive structure 211, the second conductive structure 212, and each film layer structure in the isolation structure 400 may be set with reference to any of the aforementioned embodiments.

[0278] Fig.10 is a schematic flow chart of a method for preparing a display panel 10 provided in an embodiment of the present application. Figures 11 to 21 It is a schematic diagram of a preparation process of a method for preparing a display panel 10 provided in an embodiment of the present application.

[0279] The second aspect of the present application provides a method for preparing a display panel 10. The display panel 10 prepared by the preparation method may be the display panel 10 provided by any of the first aspect embodiments described above. Figures 1 to 9 Combined with Figures 10 to 21 , the preparation method comprises:

[0280] Step S1: Fig.11 As shown, a connecting hole 100 a is opened on the substrate 100 .

[0281] Step S2: Fig.12As shown, a plurality of first conductive structures 211 are formed on the substrate 100 and are arranged at intervals, and a portion of the first conductive structure 211 is located in the connecting hole 100 a.

[0282] Step S3: Fig.13 As shown, a pixel definition material layer 10 a is formed on the first conductive structure 211 .

[0283] Optionally, the pixel definition material layer 10 a may be used to participate in forming the pixel definition layer 300 in any of the aforementioned embodiments.

[0284] Optionally, after step S3, the following steps may be further included: Fig.14 As shown, an isolation material layer 10b is formed on the pixel definition material layer 10a.

[0285] Optionally, the isolation material layer 10 b may be used to participate in forming the isolation structure 400 in any of the aforementioned embodiments.

[0286] Optionally, in the direction away from the substrate 100, the isolation material layer 10b may include a first isolation layer 10ba, a second isolation layer 10bb and a third isolation layer 10bc stacked in sequence, wherein the first isolation layer 10ba, the second isolation layer 10bb and the third isolation layer 10bc may be used to form the conductive part 430, the first isolation part 410 and the second isolation part 420 in any of the aforementioned embodiments, respectively.

[0287] Step S4: Fig.15 As shown, the pixel definition material layer 10 a is patterned to sequentially form a first pixel opening 310 aa , and at least a portion of the first conductive structure 211 is exposed from the first pixel opening 310 aa .

[0288] Optionally, in step S4: Fig.15 As shown, the isolation material layer 10b and the pixel definition material layer 10a may be patterned in sequence to form a first isolation opening 400aa and a first pixel opening 310aa in sequence, and the first isolation opening 400aa is connected to the first pixel opening 310aa.

[0289] Step S5: Fig.16 and Fig.17 As shown, a second conductive structure 212 at least partially located in the first pixel opening 310 aa is prepared, and at least a portion of the surface of the first conductive structure 211 is exposed from the first pixel opening 310 aa and connected to the second conductive structure 212 .

[0290] Optionally, step S5 may include:

[0291] S5a: preparing the first conductive material 11 on the entire surface.

[0292] S5b: removing a portion of the first conductive material 11 outside the first isolation opening 400aa and the first pixel opening 310aa to form a second conductive structure 212 at least partially located within the first pixel opening 310aa.

[0293] Optionally, step S5a may include: sequentially preparing a first conductive material 11, a first device material 12 and a first packaging material 13 on the entire surface.

[0294] Optionally, the first conductive material 11 may be used to participate in forming the second conductive structure 212 of the first light-emitting device 201 in any of the aforementioned embodiments.

[0295] Optionally, the first device material 12 may include a first light-emitting material 12a and a first conductive electrode material 12b located on the side of the first light-emitting material 12a away from the substrate 100. The first light-emitting material 12a and the first conductive electrode material 12b may be used to form the light-emitting layer 220 and the second electrode 230 of the first light-emitting device 201 in any of the aforementioned embodiments, respectively.

[0296] Optionally, the first packaging material 13 may be used to participate in forming the first packaging unit 510 in any of the aforementioned embodiments.

[0297] Optionally, in step S5a: the first conductive material 11 may be prepared on the entire surface by evaporation.

[0298] Optionally, step S5b may include: sequentially removing portions of the first packaging material 13, the first device material 12 and the first conductive material 11 outside the first isolation opening 400aa and the first pixel opening 310aa to sequentially form a first packaging unit 510, a first type of device located on the side of the first packaging unit 510 facing the substrate 100, and a second conductive structure 212 located on the side of the first type of device facing the substrate 100.

[0299] Optionally, the first type of device may include the light-emitting layer 220 and the second electrode 230 of the first light-emitting device 201 in any of the aforementioned embodiments.

[0300] In the preparation method provided in the embodiment of the present application, the second conductive structure 212 of the first light-emitting device 201 is prepared after the first pixel opening 310aa is prepared, so that the second conductive structure 212 of the first light-emitting device 201 is at least partially located in the first pixel opening 310aa, and the pixel definition material layer 10a is not easy to block the second conductive structure 212 of the first light-emitting device 201, so that the second conductive structure 212 of the first light-emitting device 201 can have a larger size to improve the display effect of the display panel 10.

[0301] In some optional embodiments, the preparation method further comprises:

[0302] The isolation material layer 10b and the pixel definition material layer 10a are patterned in sequence to form a second isolation opening 400ab and a second pixel opening 310ab in sequence. The second isolation opening 400ab is connected to the second pixel opening 310ab, and at least part of the first conductive structure 211 is exposed from the second pixel opening 310ab.

[0303] Optionally, the step of patterning the isolation material layer 10b and the pixel definition material layer 10a in sequence to form the second isolation opening 400ab and the second pixel opening 310ab in sequence may be located in step S4 to better improve the manufacturing efficiency of the display panel 10 .

[0304] Alternatively, the step of patterning the isolation material layer 10b and the pixel definition material layer 10a in sequence to form the second isolation opening 400ab and the second pixel opening 310ab in sequence may be located after step S4. For example, the step of patterning the isolation material layer 10b and the pixel definition material layer 10a in sequence to form the second isolation opening 400ab and the second pixel opening 310ab in sequence may be located after step S5, so that in step S5, the pixel definition material layer 10a can protect part of the first conductive structure 211, and the etching material is not likely to cause etching damage to the first conductive structure 211 formed subsequently and located below the first pixel opening 310aa.

[0305] For ease of description, the following embodiments are described by taking “patterning the isolation material layer 10b and the pixel definition material layer 10a in sequence to form the second isolation opening 400ab and the second pixel opening 310ab in sequence in step S4” as an example.

[0306] In some optional embodiments, the preparation method further comprises:

[0307] Step S6: Fig.18 As shown, the second conductive material 14 is prepared on the entire surface.

[0308] Optionally, in step S6: the second conductive material 14 may be prepared on the entire surface by evaporation.

[0309] Optionally, in step S6: the second conductive material 14, the second device material 15 and the second packaging material 16 may be prepared in sequence on the entire surface.

[0310] Optionally, the second conductive material 14 may be used to participate in forming the second conductive structure 212 of the second light-emitting device 202 in any of the aforementioned embodiments.

[0311] Optionally, the second device material 15 may include a second light-emitting material 15a and a second conductive electrode material 15b located on the side of the second light-emitting material 15a away from the substrate 100. The second light-emitting material 15a and the second conductive electrode material 15b may be used to form the light-emitting layer 220 and the second electrode 230 of the second light-emitting device 202 in any of the aforementioned embodiments, respectively.

[0312] Optionally, the second packaging material 16 may be used to participate in forming the second packaging unit 520 in any of the aforementioned embodiments.

[0313] Step S7: Fig.19 As shown, part of the second conductive material 14 outside the second isolation opening 400ab and the second pixel opening 310ab is removed to form a second conductive structure 212 at least partially located within the second pixel opening 310ab, and at least part of the surface of the first conductive structure 211 is exposed from the second pixel opening 310ab and connected to the second conductive structure 212.

[0314] Optionally, in step S7: portions of the second packaging material 16, the second device material 15 and the second conductive material 14 outside the second isolation opening 400ab and the second pixel opening 310ab are removed in sequence to sequentially form a second packaging unit 520, a second type of device located on the side of the second packaging unit 520 facing the substrate 100, and a second conductive structure 212 located on the side of the second type of device facing the substrate 100.

[0315] Optionally, the second type of device may include the light-emitting layer 220 and the second electrode 230 of the second light-emitting device 202 in any of the aforementioned embodiments.

[0316] In these optional embodiments, by preparing the second conductive structure 212 of the second light-emitting device 202 after preparing the second pixel opening 310ab, the second conductive structure 212 of the second light-emitting device 202 is at least partially located within the second pixel opening 310ab, and the pixel definition material layer 10a is not easy to block the second conductive structure 212 of the second light-emitting device 202, so that the second conductive structure 212 of the second light-emitting device 202 can have a larger size to improve the display effect of the display panel 10.

[0317] In some optional embodiments, the preparation method further comprises:

[0318] The isolation material layer 10b and the pixel definition material layer 10a are patterned in sequence to form a third isolation opening 400ac and a third pixel opening 310ac in sequence. The third isolation opening 400ac and the third pixel opening 310ac are interconnected, and at least part of the first conductive structure 211 is exposed from the third pixel opening 310ac.

[0319] Optionally, the step of patterning the isolation material layer 10b and the pixel definition material layer 10a in sequence to form the third isolation opening 400ac and the third pixel opening 310ac in sequence may be located in step S4 to better improve the manufacturing efficiency of the display panel 10 .

[0320] Or optionally, the step of patterning the isolation material layer 10b and the pixel definition material layer 10a in sequence to form the third isolation opening 400ac and the third pixel opening 310ac in sequence may be located after step S4. For example, the step of patterning the isolation material layer 10b and the pixel definition material layer 10a in sequence to form the second isolation opening 400ab and the second pixel opening 310ab in sequence may be located after step S5 and step S7, so that in step S5 and step S7, the pixel definition material layer 10a can protect part of the first conductive structure 211, and the etching material is not likely to cause etching damage to the first conductive structure 211 formed subsequently and located below the third pixel opening 310ac.

[0321] For ease of description, the following embodiments are described by taking “patterning the isolation material layer 10b and the pixel definition material layer 10a in sequence to form the third isolation opening 400ac and the third pixel opening 310ac in sequence in step S4 ” as an example.

[0322] In some optional embodiments, the preparation method further comprises:

[0323] Step S8: Fig. 20 As shown, the third conductive material 17 is prepared on the entire surface.

[0324] Optionally, in step S8: the third conductive material 17 may be prepared on the entire surface by evaporation.

[0325] Optionally, in step S8: a third conductive material 17, a third device material 18 and a third packaging material 19 may be prepared in sequence on the entire surface.

[0326] Optionally, the third conductive material 17 may be used to participate in forming the second conductive structure 212 of the third light-emitting device 203 in any of the aforementioned embodiments.

[0327] Optionally, the third device material 18 may include a third light-emitting material 18a and a third conductive electrode material 18b located on the side of the third light-emitting material 18a away from the substrate 100. The third light-emitting material 18a and the third conductive electrode material 18b may be used to participate in forming the light-emitting layer 220 and the second electrode 230 of the third light-emitting device 203 in any of the aforementioned embodiments, respectively.

[0328] Optionally, the third packaging material 19 may be used to participate in forming the third packaging unit 530 in any of the aforementioned embodiments.

[0329] Step S9: Fig.21 As shown, part of the third conductive material 17 outside the third isolation opening 400ac and the third pixel opening 310ac is removed to form a second conductive structure 212 at least partially located within the third pixel opening 310ac, and at least part of the surface of the first conductive structure 211 is exposed from the third pixel opening 310ac and connected to the second conductive structure 212.

[0330] Optionally, in step S9: portions of the third packaging material 19, the third device material 18 and the third conductive material 17 outside the third isolation opening 400ac and the third pixel opening 310ac may be removed in sequence to sequentially form a third packaging unit 530, a third type of device located on the side of the third packaging unit 530 facing the substrate 100, and a second conductive structure 212 located on the side of the third type of device facing the substrate 100.

[0331] Optionally, the third type of device may include the light-emitting layer 220 and the second electrode 230 of the third light-emitting device 203 in any of the aforementioned embodiments.

[0332] In these optional embodiments, by preparing the second conductive structure 212 of the third light-emitting device 203 after preparing the third pixel opening, the second conductive structure 212 of the third light-emitting device 203 is at least partially located in the third pixel opening 310ac, and the pixel definition material layer 10a is not easy to block the second conductive structure 212 of the third light-emitting device 203, so that the second conductive structure 212 of the third light-emitting device 203 can have a larger size to improve the display effect of the display panel 10.

[0333] In some optional embodiments, the first conductive structure 211 may be recessed at the communicating hole 100 a to form a groove 211 aa . For example, in step S2 , the first conductive structure 211 may be recessed at the communicating hole 100 a to form a groove 211 aa .

[0334] Optionally, in step S3 : a portion of the pixel definition material layer 10 a may be filled in the groove 211 aa .

[0335] Optionally, the orthographic projection of at least one connecting hole 100a on the substrate 100 may be located within the orthographic projection of the first pixel opening 310aa on the substrate 100. In step S4, the pixel definition material layer 10a may be patterned to form the first pixel opening 310aa and an auxiliary structure 213 filled in the groove 211aa connected to the first pixel opening 310aa.

[0336] Optionally, the orthographic projection of at least one connecting hole 100a on the substrate 100 is located within the orthographic projection of the second pixel opening 310ab on the substrate 100, and in the step of patterning the pixel definition material layer 10a to form the second pixel opening 310ab: the pixel definition material layer 10a can be patterned to form the second pixel opening 310ab and an auxiliary structure 213 filled in the groove 211aa connected to the second pixel opening 310ab.

[0337] Optionally, the orthographic projection of at least one connecting hole 100a on the substrate is located within the orthographic projection of the third pixel opening on the substrate 100, and in the step of patterning the pixel definition material layer 10a to form the third pixel opening 310ac: the pixel definition material layer 10a can be patterned to form the third pixel opening 310ac and an auxiliary structure 213 filled in the groove 211aa connected to the third pixel opening 310ac.

[0338] Optionally, in the step of patterning the pixel definition material layer 10a in the aforementioned embodiment, the pixel definition material layer 10a located in the groove 211aa may not be patterned, so that the pixel definition material layer 10a retained in the groove 211aa can form an auxiliary structure 213, for example, the pixel definition material layer 10a retained in the groove 211aa can form an auxiliary structure 213 of the first light-emitting device 201, an auxiliary structure 213 of the second light-emitting device 202, and an auxiliary structure 213 of the third light-emitting device 203.

[0339] In these optional embodiments, by utilizing the pixel definition material layer 10a filled in the groove 211aa as the auxiliary structure 213, there is no need to add a new step to prepare the auxiliary structure 213 during the preparation process of the display panel 10, thereby greatly improving the preparation efficiency of the display panel 10.

[0340] The embodiment of the third aspect of the present application provides a display device, which includes the display panel 10 of any of the above-mentioned embodiments, or includes the display panel 10 prepared by the preparation method of any of the above-mentioned embodiments. Since the display device provided by the embodiment of the third aspect of the present application includes the display panel 10 of any of the above-mentioned first aspect, or includes the display panel 10 prepared by the preparation method of any of the above-mentioned second aspect. Therefore, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned first aspect or the display panel 10 prepared by the preparation method of any of the above-mentioned second aspect, which will not be repeated here.

[0341] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0342] According to the embodiments of the present application as above, these embodiments do not describe all the details in detail, nor do they limit the invention to specific embodiments. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: include: A base plate, wherein a communication hole is formed on one side of the base plate; a light emitting device disposed on one side of the substrate, the light emitting device comprising a first electrode, the first electrode comprising a first conductive structure and a second conductive structure located on a side of the first conductive structure away from the substrate, a portion of the first conductive structure being located in the connecting hole; The pixel definition layer includes a pixel defining portion arranged on the side of the first conductive structure facing away from the substrate, the pixel defining portion encloses a pixel opening, the second conductive structure is at least partially located within the pixel opening, and at least a portion of the surface of the first conductive structure is exposed from the pixel opening and connected to the second conductive structure.

2. The display panel according to claim 1, characterized in that: The pixel defining portion has a first inner wall on one side facing the pixel opening, and part of the second conductive structure covers at least part of the first inner wall; Preferably, in a direction away from the substrate, the first inner wall is inclined toward a direction away from the pixel opening; Preferably, the pixel defining portion has a first top wall on a side facing away from the substrate, the second conductive structure covers the first inner wall and extends to a side of the first top wall away from the substrate, and a portion of the second conductive structure covers at least a portion of the first top wall; Preferably, the light emitting device further comprises a light emitting layer located on a side of the first electrode facing away from the substrate, and an orthographic projection of the second conductive structure on the substrate is located within an orthographic projection of the light emitting layer on the substrate.

3. The display panel according to claim 2, characterized in that: The orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the first inner wall on the substrate; Preferably, the orthographic projection of the first inner wall on the substrate is located within the orthographic projection of the first conductive structure on the substrate; Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the first conductive structure on the substrate.

4. The display panel according to claim 2, characterized in that: A partition groove is formed on the first inner wall, the second conductive structure is disconnected at the partition groove to form a first conductive segment and a second conductive segment, the first conductive segment is connected to the first conductive structure, and the second conductive segment is located on a side of the first conductive segment away from the substrate; Preferably, the second conductive section covers at least a portion of the first inner wall; Preferably, the partition groove is located on a side of the pixel defining portion facing the substrate, and at least a portion of the surface of the first conductive structure is exposed from the partition groove, and the first conductive sub-portion is spaced apart from the first inner wall, or a portion of the pixel defining portion is located between the partition groove and the first conductive structure, and the first conductive sub-portion covers a portion of the first inner wall; Preferably, the partition groove extends in a direction away from the pixel opening; Preferably, the light-emitting device further comprises a light-emitting layer located on a side of the first electrode away from the substrate, the light-emitting layer is at least partially located in the pixel opening and connected to the second conductive structure, and the light-emitting layer covers at least a part of a side of the partition groove facing the pixel opening; Preferably, the first conductive section has a first thickness, the light-emitting layer has a second thickness, the size of the partition groove in the thickness direction of the display panel is less than or equal to the sum of the first thickness and the second thickness, and / or the size of the partition groove in the thickness direction of the display panel is greater than the first thickness.

5. The display panel according to claim 1, characterized in that: The first electrode further includes an auxiliary structure located between the first conductive structure and the second conductive structure, the first conductive structure is recessed at the communicating hole to form a groove, and the auxiliary structure is filled in the groove; Preferably, the first conductive structure and the auxiliary structure are made of different materials; Preferably, the material of the first conductive structure includes a conductive material; Preferably, the material of the first conductive structure includes indium tin oxide; Preferably, the material of the pixel defining portion includes an inorganic material; Preferably, the auxiliary structure and the pixel defining portion are made of the same material.

6. The display panel according to claim 5, characterized in that: The first conductive structure includes a first section located inside the connecting hole and a second section located outside the connecting hole, the first section is recessed to form a groove, the second section is connected to the second conductive structure, and a surface of the second section facing away from the substrate is coplanar with a surface of the auxiliary structure facing away from the substrate.

7. The display panel according to claim 1, characterized in that: The projection of the communication hole in the thickness direction of the display panel at least partially overlaps with the projection of the pixel opening in the thickness direction of the display panel; Preferably, a projection of the connecting hole in the thickness direction of the display panel is located within a projection of the pixel opening in the thickness direction of the display panel.

8. The display panel according to claim 1, characterized in that: The material of the second conductive structure includes silver.

9. The display panel according to any one of claims 1 to 8, characterized in that: The display panel further comprises an isolation structure disposed on one side of the substrate, the isolation structure is provided with an isolation opening connected to the pixel opening, the isolation structure comprises a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, the second isolation portion is disposed protruding from the first isolation portion toward the isolation opening; Preferably, the isolation openings are provided in plurality, the pixel openings are provided in plurality, and the isolation openings are provided correspondingly to the pixel openings; Preferably, the isolation opening includes a first isolation opening, a second isolation opening and a third isolation opening, the light emitting device includes a first light emitting device arranged corresponding to the first isolation opening, a second light emitting device arranged corresponding to the second isolation opening and a third light emitting device arranged corresponding to the third isolation opening, and the light emitting colors of the first light emitting device, the second light emitting device and the third light emitting device are different from each other; Preferably, the display panel also includes a first packaging layer arranged on the side of the isolation structure and the light-emitting device away from the substrate, the first packaging layer includes a first packaging unit arranged on the side of the first light-emitting device away from the substrate, a second packaging unit arranged on the side of the second light-emitting device away from the substrate, and a third packaging unit arranged on the side of the third light-emitting device away from the substrate.

10. The display panel according to claim 9, characterized in that: The material of the isolation structure includes a conductive material, the light-emitting device further includes a light-emitting layer located on a side of the first electrode away from the substrate and a second electrode located on a side of the light-emitting layer away from the substrate, and the second electrode is electrically connected to the isolation structure; Preferably, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate; Preferably, the second conductive structure is spaced apart from the isolation structure; Preferably, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate; Preferably, the second electrode is electrically connected to the first isolation portion, and an orthographic projection of the first conductive structure on the substrate at least partially overlaps with an orthographic projection of the first isolation portion on the substrate.

11. The display panel according to claim 10, characterized in that: The isolation structure further includes a conductive portion disposed on a side of the first isolation portion facing the substrate, the conductive portion protruding from the first isolation portion toward the isolation opening, and the second electrode is connected to the conductive portion; Preferably, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the conductive portion on the substrate; Preferably, an orthographic projection of the first conductive structure on the substrate at least partially overlaps with an orthographic projection of the conductive portion on the substrate.

12. A display panel, characterized in that: include: A base plate, wherein a communication hole is formed on one side of the base plate; A light emitting device is disposed on one side of the substrate, the light emitting device comprises a first electrode, the first electrode comprises a first conductive structure and an auxiliary structure, a part of the first conductive structure is located in the connecting hole, and the first conductive structure is recessed at the connecting hole to form a groove, and the auxiliary structure is filled in the groove; A pixel definition layer includes a pixel defining portion arranged on the side of the first conductive structure away from the substrate, the pixel defining portion encloses a pixel opening, the projection of the connecting hole in the thickness direction of the display panel and the projection of the pixel opening in the thickness direction of the display panel at least partially overlap, at least a portion of the surface of the first conductive structure is exposed from the pixel opening, and the auxiliary structure is arranged with the same material as the pixel defining portion.

13. The display panel according to claim 12, characterized in that: The first conductive structure and the auxiliary structure are made of different materials; Preferably, the material of the first conductive structure includes a conductive material; Preferably, the material of the first conductive structure includes indium tin oxide; Preferably, the material of the pixel defining portion includes an inorganic material.

14. The display panel according to claim 12, characterized in that: The light emitting device further comprises a second conductive structure located on a side of the first conductive structure away from the substrate, the second conductive structure is at least partially located in the pixel opening, and at least a portion of the surface of the first conductive structure is exposed from the pixel opening and connected to the second conductive structure; Preferably, the pixel defining portion has a first inner wall on a side facing the pixel opening, and part of the second conductive structure covers at least part of the first inner wall; Preferably, in a direction away from the substrate, the first inner wall is inclined toward a direction away from the pixel opening; Preferably, the pixel defining portion has a first top wall on a side facing away from the substrate, the second conductive structure covers the first inner wall and extends to a side of the first top wall away from the substrate, and a portion of the second conductive structure covers at least a portion of the first top wall; Preferably, the light emitting device further comprises a light emitting layer located on a side of the first electrode away from the substrate, and an orthographic projection of the second conductive structure on the substrate is located within an orthographic projection of the light emitting layer on the substrate; Preferably, a partition groove is formed on the first inner wall, the second conductive structure is disconnected at the partition groove to form a first conductive section and a second conductive section, the first conductive section is connected to the first conductive structure, and the second conductive section is located on a side of the first conductive section away from the substrate; Preferably, the second conductive section covers at least a portion of the first inner wall; Preferably, the partition groove is located on a side of the pixel defining portion facing the substrate, and at least a portion of the surface of the first conductive structure is exposed from the partition groove, and the first conductive sub-portion is spaced apart from the first inner wall, or a portion of the pixel defining portion is located between the partition groove and the first conductive structure, and the first conductive sub-portion covers a portion of the first inner wall; Preferably, the partition groove extends in a direction away from the pixel opening; Preferably, the light-emitting device further comprises a light-emitting layer located on a side of the first electrode away from the substrate, the light-emitting layer is at least partially located in the pixel opening and connected to the second conductive structure, and the light-emitting layer covers at least a part of a side of the partition groove facing the pixel opening; Preferably, the first conductive portion has a first thickness, the light-emitting layer has a second thickness, the size of the partition groove in the thickness direction of the display panel is smaller than the sum of the first thickness and the second thickness, and / or the size of the partition groove in the thickness direction of the display panel is larger than the first thickness; Preferably, the first conductive structure includes a first sub-portion located in the communicating hole and a second sub-portion located outside the communicating hole, the first sub-portion is recessed to form a groove, the second sub-portion is connected to the second conductive structure, and a surface of the second sub-portion facing away from the substrate is coplanar with a surface of the auxiliary structure facing away from the substrate; Preferably, the material of the second conductive structure includes silver.

15. The display panel according to any one of claims 12 to 14, characterized in that: The display panel further comprises an isolation structure disposed on one side of the substrate, the isolation structure is provided with an isolation opening connected to the pixel opening, the isolation structure comprises a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, the second isolation portion is disposed protruding from the first isolation portion toward the isolation opening; Preferably, the material of the isolation structure includes a conductive material, the light-emitting device further includes a light-emitting layer located on a side of the first electrode away from the substrate and a second electrode located on a side of the light-emitting layer away from the substrate, and the second electrode is electrically connected to the isolation structure; Preferably, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate; Preferably, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate; Preferably, the second electrode is electrically connected to the first isolation portion, and an orthographic projection of the first conductive structure on the substrate at least partially overlaps with an orthographic projection of the first isolation portion on the substrate; Preferably, the isolation structure further comprises a conductive portion disposed on a side of the first isolation portion facing the substrate, the conductive portion protruding from the first isolation portion toward the isolation opening, and the second electrode is connected to the conductive portion; Preferably, the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the conductive portion on the substrate; Preferably, an orthographic projection of the first conductive structure on the substrate at least partially overlaps with an orthographic projection of the conductive portion on the substrate.

16. A method for preparing a display panel, characterized in that: include: A communication hole is formed on the substrate; forming a plurality of first conductive structures spaced apart from each other on the substrate, wherein a portion of the first conductive structures is located in the connecting hole; forming a pixel definition material layer on the first conductive structure; Performing patterning on the pixel definition material layer to form a first pixel opening, wherein at least a portion of the first conductive structure is exposed from the first pixel opening; A second conductive structure at least partially located in the first pixel opening is prepared, and at least a portion of the surface of the first conductive structure is exposed from the first pixel opening and connected to the second conductive structure.

17. The preparation method according to claim 16, characterized in that: The first conductive structure is recessed at the connecting hole to form a groove, and the orthographic projection of at least one connecting hole on the substrate is located within the orthographic projection of the first pixel opening on the substrate. In the step of forming a pixel definition material layer on the first conductive structure: A portion of the pixel definition material layer is filled in the groove; In the step of patterning the pixel definition material layer to form a first pixel opening: The pixel definition material layer is patterned to form a first pixel opening and an auxiliary structure filled in the groove communicating with the first pixel opening.

18. The preparation method according to claim 16, characterized in that: After the step of forming a pixel definition material layer on the first conductive structure, the method further includes: forming an isolation material layer on the pixel definition material layer; In the step of patterning the pixel definition material layer to form a first pixel opening: performing patterning on the isolation material layer and the pixel definition material layer in sequence to form a first isolation opening and a first pixel opening in sequence, wherein the first isolation opening is connected to the first pixel opening; Preferably, the step of preparing a second conductive structure at least partially located in the first pixel opening includes: Preparing a first conductive material on the entire surface; removing a portion of the first conductive material outside the first isolation opening and the first pixel opening to form a second conductive structure at least partially located within the first pixel opening; Preferably, in the step of preparing the first conductive material on the entire surface: The first conductive material is prepared on the entire surface by evaporation; Preferably, in the step of preparing the first conductive material on the entire surface: sequentially preparing a first conductive material, a first device material and a first packaging material on the entire surface; In the step of removing a portion of the first conductive material outside the first isolation opening and the first pixel opening: Portions of the first packaging material, the first device material, and the first conductive material outside the first isolation opening and the first pixel opening are removed in sequence to sequentially form a first packaging unit, a first type of device located on a side of the first packaging unit facing the substrate, and a second conductive structure located on a side of the first type of device facing the substrate.

19. The preparation method according to claim 18, characterized in that: The preparation method further comprises: performing patterning on the isolation material layer and the pixel definition material layer in sequence to form a second isolation opening and a second pixel opening in sequence, wherein the second isolation opening and the second pixel opening are interconnected, and at least a portion of the first conductive structure is exposed from the second pixel opening; Preparing a second conductive material on the entire surface; removing a portion of the second conductive material outside the second isolation opening and the second pixel opening to form a second conductive structure at least partially located within the second pixel opening, wherein at least a portion of the surface of the first conductive structure is exposed from the second pixel opening and connected to the second conductive structure; Preferably, the step of patterning the isolation material layer and the pixel definition material layer in sequence to form the second isolation opening and the second pixel opening in sequence may be located during the step of patterning the isolation material layer and the pixel definition material layer in sequence to form the first isolation opening and the first pixel opening in sequence, or the step of patterning the isolation material layer and the pixel definition material layer in sequence to form the second isolation opening and the second pixel opening in sequence may be located after the step of patterning the isolation material layer and the pixel definition material layer in sequence to form the first isolation opening and the first pixel opening in sequence; Preferably, in the step of preparing the second conductive material on the entire surface: The second conductive material is prepared on the entire surface by evaporation; Preferably, in the step of preparing the second conductive material on the entire surface: sequentially preparing a second conductive material, a second device material, and a second packaging material on the entire surface; In the step of removing a portion of the second conductive material outside the second isolation opening and the second pixel opening: Sequentially removing a portion of the second packaging material, the second device material, and the second conductive material outside the second isolation opening and the second pixel opening to sequentially form a second packaging unit, a second type of device located on a side of the second packaging unit facing the substrate, and a second conductive structure located on a side of the second type of device facing the substrate; Preferably, the first conductive structure is recessed at the connecting hole to form a groove, and the orthographic projection of at least one connecting hole on the substrate is located within the orthographic projection of the second pixel opening on the substrate. In the step of forming a pixel definition material layer on the first conductive structure: A portion of the pixel definition material layer is filled in the groove; In the step of patterning the pixel definition material layer to form a second pixel opening: The pixel definition material layer is patterned to form a second pixel opening and an auxiliary structure filled in the groove communicating with the second pixel opening.

20. The preparation method according to claim 18, characterized in that: The preparation method further comprises: performing patterning on the isolation material layer and the pixel definition material layer in sequence to form a third isolation opening and a third pixel opening in sequence, wherein the third isolation opening is connected to the third pixel opening, and at least a portion of the first conductive structure is exposed from the third pixel opening; preparing a third conductive material on the entire surface; removing a portion of the third conductive material outside the third isolation opening and the third pixel opening to form a second conductive structure at least partially located within the third pixel opening, wherein at least a portion of the surface of the first conductive structure is exposed from the third pixel opening and connected to the second conductive structure; Preferably, the step of patterning the isolation material layer and the pixel definition material layer in sequence to form a third isolation opening and a third pixel opening in sequence may be located during the step of patterning the isolation material layer and the pixel definition material layer in sequence to form a first isolation opening and a first pixel opening in sequence, or the step of patterning the isolation material layer and the pixel definition material layer in sequence to form a third isolation opening and a third pixel opening in sequence may be located after the step of patterning the isolation material layer and the pixel definition material layer in sequence to form a first isolation opening and a first pixel opening in sequence; Preferably, in the step of preparing the third conductive material on the entire surface: The third conductive material is prepared on the entire surface by evaporation; Preferably, in the step of preparing the third conductive material on the entire surface: sequentially preparing a third conductive material, a third device material and a third packaging material on the entire surface; In the step of removing a portion of the third conductive material outside the third isolation opening and the third pixel opening: Sequentially removing the third packaging material, the third device material, and the third conductive material outside the third isolation opening and the third pixel opening to sequentially form a third packaging unit, a third type of device located on a side of the third packaging unit facing the substrate, and a second conductive structure located on a side of the third type of device facing the substrate; Preferably, the first conductive structure is recessed at the connecting hole to form a groove, and the orthographic projection of at least one connecting hole on the substrate is located within the orthographic projection of the third pixel opening on the substrate. In the step of forming a pixel definition material layer on the first conductive structure: A portion of the pixel definition material layer is filled in the groove; In the step of patterning the pixel definition material layer to form a third pixel opening: The pixel definition material layer is patterned to form a third pixel opening and an auxiliary structure filled in the groove communicating with the third pixel opening.

21. A display device, characterized in that: A display panel comprising the display panel as claimed in any one of claims 1 to 15, or a display panel prepared by the preparation method as claimed in any one of claims 16 to 20.

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