Display panel, manufacturing method and display device

Abstract

The invention is suitable for the technical field of display, and provides a display panel, a manufacturing method and a display device.The display panel comprises a display area and a non-display area and comprises a substrate, a dam structure arranged on the substrate and located in the non-display area and a covering layer, the dam structure comprises a first dam, and the first dam is provided with a first surface deviating from the substrate; at least part of the covering layer is located on the side, away from the substrate, of the first surface, the covering layer is provided with a through hole, and at least part of the through hole is formed in the first side face. At least part of the through hole is arranged on the first side surface and can cut off the connection between the first dam and the organic packaging layer, so that the problem that water vapor extends to the display area through the organic packaging layer and the dam structure is avoided.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a manufacturing method and a display device. Background Art

[0002] Compared with liquid crystal display technology, OLED (Organic Light-Emitting Diode) display technology has many advantages, such as high contrast, wide color gamut, low power consumption, thinner structure, and flexible bending. At present, OLED display technology is widely used in mobile phones, computers, televisions and other fields.

[0003] The packaging reliability of OLED display technology still needs to be improved. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a display panel, aiming to provide a solution for improving the packaging reliability of the display panel.

[0005] The embodiment of the present application is implemented as follows: a display panel, the display panel includes a display area and a non-display area, and the display panel includes:

[0006] substrate;

[0007] A dam structure disposed on the substrate and located in the non-display area; the dam structure comprises a first dam, the first dam having a first surface away from the substrate, and a first side surface connected to the first surface and away from the display area;

[0008] The covering layer is at least partially located on a side of the first surface away from the substrate, and the covering layer is provided with through holes, which are at least partially located on the first side surface.

[0009] In one embodiment, the through hole is located on a side of the first surface away from the display area;

[0010] Optionally, the through hole is spaced apart from the first surface;

[0011] Optionally, the through hole is spaced apart from a side of the first side surface close to the substrate;

[0012] Alternatively, a side of the through hole away from the display area is located on a side of the first side away from the display area and away from the display area;

[0013] Optionally, at least part of the non-display area is located at the periphery of the display area, or the display area is located at the periphery of at least part of the non-display area;

[0014] Optionally, the non-display area includes a border area and / or a light-transmitting hole area, the border area is located on the periphery of at least a portion of the display area, at least a portion of the first dam and at least a portion of the through hole are located in the border area, or the display area is located on the periphery of at least a portion of the light-transmitting hole area, at least a portion of the first dam and at least a portion of the through hole are located between the display area and the light-transmitting hole area.

[0015] In one embodiment, the number of through holes is multiple, and the first side surface is provided with multiple through holes arranged at intervals, and the multiple through holes are arranged along the extension direction of the first dam;

[0016] And / or, the through hole includes a plurality of sub-through holes, and the plurality of sub-through holes are arranged in a direction from a side of the first side away from the substrate to a side of the first side close to the substrate.

[0017] In one embodiment, an angle is formed between the first side surface and the thickness direction of the substrate, an orthographic projection of a side of the first side surface close to the substrate on the substrate points in the direction of an orthographic projection of a side of the first side surface away from the substrate on the substrate, and an overlapping length of an orthographic projection of the through hole on the substrate and an orthographic projection of the first side surface on the substrate is greater than 0;

[0018] Optionally, along the direction from the display area to the non-display area, the distance between the first side surface and the substrate along the thickness direction of the substrate gradually decreases.

[0019] In one embodiment, the distance between the orthographic projection of the through hole on the substrate and the orthographic projection of the first surface on the substrate is greater than or equal to 0;

[0020] Alternatively, the orthographic projection of the through hole on the substrate partially overlaps with the orthographic projection of the first surface on the substrate;

[0021] Optionally, a distance between an orthographic projection of the through hole on the substrate and the first surface is greater than or equal to 3 micrometers.

[0022] In one embodiment, the length of the orthographic projection of the through hole on the substrate is greater than or equal to 4 micrometers along the direction of the orthographic projection of the side of the first side close to the substrate on the substrate pointing to the orthographic projection of the side of the first side far from the substrate on the substrate;

[0023] Optionally, along the direction of the orthographic projection of the side of the first side close to the substrate on the substrate pointing to the orthographic projection of the side of the first side far from the substrate on the substrate, the length of the orthographic projection of the through hole on the substrate is greater than or equal to 5 microns.

[0024] In one embodiment, the orthographic projection of the through hole on the substrate is located within the orthographic projection of the first side surface on the substrate;

[0025] Optionally, an orthographic projection of a side of the through hole facing away from the display area on the substrate is spaced from an orthographic projection of a side of the first side facing away from the display area on the substrate;

[0026] Optionally, along the direction of the orthographic projection of the side of the first side close to the substrate on the substrate pointing to the orthographic projection of the side of the first side away from the substrate on the substrate, the length of the orthographic projection of the through hole on the substrate is H, the length of the orthographic projection of the first side on the substrate is L, and the relationship between H and L is: LH ≥ 6 microns.

[0027] In one embodiment, a portion of an orthographic projection of the through hole on the substrate is located outside an orthographic projection of the first dam on the substrate;

[0028] Optionally, in the direction of the orthographic projection of the side of the through hole away from the display area on the substrate pointing to the orthographic projection of the side of the through hole close to the display area on the substrate, the length of the orthographic projection of the through hole on the substrate is H, the overlapping length of the orthographic projection of the through hole on the substrate and the orthographic projection of the first side surface on the substrate is h, and the relationship between H and h satisfies: Hh≥2 micrometers;

[0029] Optionally, the first side surface is perpendicular to the substrate; the through hole exposes at least a portion of the first side surface;

[0030] Optionally, a portion of the orthographic projection of the through hole on the substrate is located on a side of the orthographic projection of a side of the first dam away from the display area on the substrate away from the display area.

[0031] In one embodiment, the dam structure further includes a second dam, the second dam is located on a side of the first dam away from the display area; the covering layer covers the second dam;

[0032] Optionally, the covering layer covers a side of the second dam away from the substrate, a side of the second dam close to the display area, and a side of the second dam away from the near display area;

[0033] Optionally, a cover layer covers a gap between the second bank and the first bank.

[0034] In one embodiment, the cover layer includes a pixel definition layer, and the pixel definition layer is provided with pixel openings;

[0035] Optionally, the display panel further comprises a light emitting device, at least part of which is located in the pixel opening;

[0036] Optionally, the pixel definition layer is an inorganic insulating material.

[0037] In one embodiment, the display panel further comprises an organic encapsulation layer, the organic encapsulation layer is disposed on a side of the first dam facing the display area, and part or all of the organic encapsulation layer is disposed on a side of the cover layer away from the substrate;

[0038] The orthographic projection of the organic encapsulation layer on the substrate overlaps with the orthographic projection of the side surface of the first dam close to the display area on the substrate;

[0039] Optionally, an orthographic projection of the organic encapsulation layer on the substrate overlaps with an orthographic projection of at least part of the first surface on the substrate;

[0040] Optionally, the organic encapsulation layer is spaced apart from the through hole; the organic encapsulation layer is spaced apart from a side of the first surface away from the display area; or the organic encapsulation layer includes at least two separated parts, and the two separated parts are respectively located on a side of the first dam away from the substrate and a side of the first dam away from the display area;

[0041] Optionally, the display panel further comprises a first encapsulation layer, which is disposed on a side of the organic encapsulation layer of the cover layer away from the substrate; a portion of the first encapsulation layer is filled in the through hole;

[0042] Optionally, the first encapsulation layer comprises an inorganic material encapsulation layer.

[0043] In one embodiment, the display panel further includes:

[0044] An isolation structure, wherein the isolation structure encloses an isolation opening;

[0045] A light emitting device, at least a portion of which is located in the isolation opening;

[0046] Optionally, the display panel further includes a plurality of packaging parts, and the packaging parts are located on a side of the corresponding light-emitting device away from the substrate;

[0047] Optionally, light-emitting devices of different light-emitting colors correspond to different packaging parts;

[0048] Optionally, the isolation structure includes a conductive material, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked in a direction away from the substrate, and the second electrode is electrically connected to the isolation structure;

[0049] Optionally, the display panel further includes an organic encapsulation layer located on a side of the encapsulation portion away from the substrate;

[0050] Optionally, the display panel further comprises a first encapsulation layer, and the first encapsulation layer is arranged on a side of the organic encapsulation layer away from the substrate;

[0051] Optionally, the display panel further includes a pixel definition layer, the pixel definition layer includes a pixel definition portion, the pixel definition portion encloses to form a pixel opening; the pixel opening is connected to the corresponding isolation opening;

[0052] Optionally, the isolation structure is located on a side of the pixel definition portion away from the substrate, or the pixel definition layer is provided with a clearance opening, and the isolation structure is located in the clearance opening;

[0053] Optionally, at least part of the film layer in the covering layer is disposed in the same layer as the pixel definition layer, and / or at least part of the film layer in the covering layer is disposed in the same layer as the first electrode or the second electrode.

[0054] In one embodiment, the isolation structure includes a first isolation portion and a second isolation portion; the second isolation portion is disposed on a side of the first isolation portion away from the substrate;

[0055] Optionally, an orthographic projection of a side of the first isolation portion away from the substrate on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0056] Optionally, the material of the first isolation portion includes aluminum;

[0057] Optionally, the material of the second isolation portion includes titanium.

[0058] In one embodiment, the isolation structure further includes a third isolation portion, which is disposed between the first isolation portion and the substrate; an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate;

[0059] Optionally, the material of the third isolation portion includes molybdenum.

[0060] In one embodiment, the cover layer comprises an inorganic material and / or a conductive material;

[0061] Optionally, the cover layer comprises an inorganic insulating material or a conductive material;

[0062] Optionally, the first dam comprises an organic material.

[0063] In one embodiment, the cover layer includes a first sublayer and a second sublayer which are stacked, and the through hole penetrates the first sublayer and the second sublayer;

[0064] Optionally, one of the first sublayer and the second sublayer comprises an inorganic insulating material, and the other comprises a conductive material.

[0065] Another object of the embodiment of the present application is to provide a method for manufacturing a display panel, wherein the display panel includes a display area and a non-display area, and the manufacturing method includes:

[0066] providing a substrate;

[0067] A first dam is formed in the non-display area, wherein the first dam has a first surface facing away from the substrate and a first side surface connected to the first surface and facing away from the display area;

[0068] A covering layer is formed on the first dam, wherein at least a portion of the covering layer is located on a side of the first surface away from the substrate, and a through hole is provided on the covering layer, wherein at least a portion of the through hole is provided on the first side surface.

[0069] In one embodiment, after forming a covering layer on the first dam, the method further comprises:

[0070] An organic encapsulation layer is manufactured, wherein the organic encapsulation layer is disposed on a side of the cover layer away from the substrate; the organic encapsulation layer is spaced apart from the through hole; and the orthographic projection of the organic encapsulation layer on the substrate overlaps with the orthographic projection of the side of the first dam close to the display area on the substrate;

[0071] Optionally, after the organic encapsulation layer is formed, the method further includes:

[0072] A first encapsulation layer is formed on a side of the organic encapsulation layer away from the substrate, and the first encapsulation layer is formed on a side of the organic encapsulation layer of the cover layer away from the substrate; a portion of the first encapsulation layer is filled in the through hole;

[0073] Optionally, the first encapsulation layer comprises an inorganic material encapsulation layer.

[0074] In one embodiment, the method for manufacturing a display panel further includes:

[0075] Making an isolation structure, wherein the isolation structure encloses an isolation opening;

[0076] Manufacturing at least a portion of the film layer and the packaging portion of the light-emitting device, wherein at least a portion of the light-emitting device is located at the isolation opening, and the packaging portion is located at a side of the corresponding light-emitting device away from the substrate;

[0077] Manufacturing an organic encapsulation layer located on a side of the encapsulation portion away from the substrate;

[0078] A first encapsulation layer is formed on a side of the organic encapsulation layer away from the substrate.

[0079] Another object of the embodiments of the present application is to provide a display panel, which includes the display panel as described above, or includes a display panel manufactured by the above manufacturing method.

[0080] The display panel, manufacturing method and display device provided by the embodiments of the present application have the following beneficial effects:

[0081] The display panel provided by the embodiment of the present application includes a substrate, a dam structure disposed on the substrate and located in a non-display area, and a covering layer. The dam structure is located in the non-display area and includes a first dam. The first dam has a first surface away from the substrate and a first side surface connected to the first surface and away from the display area. At least part of the covering layer is located on the side of the first surface away from the substrate. The covering layer is provided with a through hole, and the through hole is at least partially disposed on the first side surface. During the manufacturing process of the display panel, the water vapor generated by the first dam is released from the through hole. The through hole is at least partially disposed on the first side surface to cut off the connection between the first dam and the organic encapsulation layer. In the subsequent manufacturing process of the display panel, the first dam and the organic encapsulation layer are not connected, and no water vapor intrusion path is formed, thereby avoiding the problem of water vapor extending to the display area through the organic encapsulation layer and the dam, and ensuring the encapsulation reliability of the pixels in the display area. BRIEF DESCRIPTION OF THE DRAWINGS

[0082] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0083] Figure 1 is a schematic diagram of a cross-sectional structure of a display panel in the related art;

[0084] Figure 2 is a schematic diagram of a top view of the structure of a display panel provided in an embodiment of the present application;

[0085] Figure 3 yes Figure 2 A cross-sectional view along line AA, wherein the through hole is provided on the first side surface;

[0086] Figure 4 yes Figure 3 Enlarged view of point C in the middle;

[0087] Figure 5 yes Figure 3 Overflow schematic diagram of the structure shown;

[0088] Fig. 6A is a partial top view of another display panel provided in an embodiment of the present application;

[0089] Figure 6B is a partial top view of another display panel provided in an embodiment of the present application;

[0090] Figure 7 yes Figure 2 Another cross-sectional view along line AA, wherein the through hole portion is provided on the first side surface;

[0091] Figure 8 yes Figure 7 Enlarged view of point E in the middle;

[0092] Fig. 9 yes Figure 7 Overflow schematic diagram of the structure shown;

[0093] Fig. 10A is a partial top view of another display panel provided in an embodiment of the present application;

[0094] Fig. 10B is a partial top view of another display panel provided in an embodiment of the present application;

[0095] Fig.11 yes Figure 2 Another cross-sectional view along line AA, wherein the first side surface is perpendicular to the substrate;

[0096] Fig.12 yes Figure 2 Another cross-sectional view along line AA, wherein the cover layer is a multi-layer structure;

[0097] Fig.13 yes Figure 2 The cross section along line GG in the middle;

[0098] Fig.14A yes Figure 2 A cross-sectional view along line FF;

[0099] Fig. 14B yes Figure 2 Another cross-sectional view along line FF;

[0100] Fig.15 is a flowchart of the steps of a method for manufacturing a display panel provided in an embodiment of the present application;

[0101] Fig.16 It is a structural schematic diagram corresponding to step S1 and step S2 in the method for manufacturing a display panel provided in an embodiment of the present application;

[0102] Fig.17 is a structural schematic diagram corresponding to step S3 in the method for manufacturing a display panel provided in an embodiment of the present application;

[0103] Fig.18 is a structural schematic diagram corresponding to steps S4 and S5 in the method for manufacturing a display panel provided in an embodiment of the present application;

[0104] Fig.19 It is a structural schematic diagram corresponding to step S6 in the method for manufacturing a display panel provided in an embodiment of the present application.

[0105] The meanings of the marks in the figure are:

[0106] 001, 100-display panel;

[0107] 1-substrate, 10-substrate, 11-driving circuit layer, 002, 13-non-display area, 130-light-transmitting hole area, 005, 14-display area;

[0108] 004, 21-covering layer, 211-through hole, 2110-sub-through hole, 212-first sub-layer, 213-second sub-layer, 25-pixel definition layer, 250-pixel opening, 251-pixel definition portion;

[0109] 003-Dyke;

[0110] 3-dam structure, 31-first dam, 310-first surface, 311-first side, 312-second side, 32-second dam;

[0111] 4-pixel group, 40-light-emitting device, 41-first electrode, 42-light-emitting functional layer, 43-second electrode;

[0112] 5-isolation structure, 50-isolation opening, 51-first isolation part, 52-second isolation part;

[0113] 6-packaging structure, 61-packaging part, 62-organic packaging layer, 63-first packaging layer;

[0114] 006, 7-Organic packaging materials;

[0115] 007-Exhaust hole. DETAILED DESCRIPTION

[0116] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0117] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly or indirectly fixed or disposed on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of this patent. The terms "first" and "second" are only used for the convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0118] In order to illustrate the technical solution described in this application, a detailed description is given below in conjunction with specific drawings and embodiments.

[0119] See also Figure 1 As shown, in the display panel 001, the non-display area 002 is provided with one or more protruding dams 003, and a covering layer 004 is provided on the dam 003. The dam 003 is annular, and is arranged to surround the display area 005, and is used to prevent the overflow of the organic encapsulation material 006 in the display area 005. The dam 003 is made of organic material, and the covering layer 004 needs to be provided with a vent hole 007 to allow the gas generated by the organic material to be discharged in time, so as to avoid the occurrence of bulging, peeling and other problems between the surface of the covering layer 004 and the dam 003.

[0120] In the related art, after forming the cover layer 004, when the organic encapsulation material 006 is filled in the display area 005, due to process control deviation, the organic encapsulation material 006 may overflow and reach the surface of the cover layer 004. The overflowed part of the organic encapsulation material 006 may extend into the exhaust hole 007, and then the water vapor released by the dam 003 may extend along the organic encapsulation material 006 to the display area 005, causing the encapsulation of the pixels in the display area 005 to fail and form a dark spot on the display.

[0121] See also Figure 2 , Figure 3 and Fig. 6A As shown, the first embodiment of the present application first provides a display panel 100, which includes a display area 14 and a non-display area 13. At least part of the non-display area 13 may be located outside the display area 14, or the display area 14 may be located outside at least part of the non-display area 13.

[0122] For example, the non-display area 13 includes at least one of a frame area and a light-transmitting hole area 130. Fig.13 As shown, the light-transmitting hole area 130 can be used to set, for example, light-sensing elements such as cameras, fingerprint recognition modules, infrared sensors and other optical elements. The frame area can be located outside the display area 14. The display area 14 can be located outside the light-transmitting hole area 130. Optical elements can be set in the light-transmitting hole area 130.

[0123] like Figure 3 and Figure 4 As shown, the display panel 100 includes a substrate 1, a dam structure 3 and a cover layer 21, the dam structure 3 includes a first dam 31, the first dam 31 has a first surface 310 away from the substrate 1, and a first side surface 311 connected to the first surface 310 and away from the display area 14; at least part of the cover layer 21 is located on a side of the first surface 310 away from the substrate 1, and a through hole 211 is provided on the cover layer 21, and the through hole 211 is at least partially provided on the first side surface 311. The through hole can expose at least part of the first side surface.

[0124] The frame area may surround at least a portion of the display area 14. At least a portion of the first dam 31 and at least a portion of the through hole 211 are located in the frame area. The frame area may be located at the periphery of at least a portion of the display area.

[0125] The display area 14 may surround at least a portion of the light-transmitting hole area 130. The display area may be located at the periphery of at least a portion of the light-transmitting hole area. At least a portion of the first dam 31 and at least a portion of the through hole 211 are located between the light-transmitting hole area 130 and the display area 14, for example, located in a transition area between the light-transmitting hole area 130 and the display area 14. The arrangement of the first dam 31 and the through hole 211 between the light-transmitting hole area 130 and the display area 14 is the same or similar to the arrangement of the first dam 31 and the through hole 211 in the frame area, see Figures 3 to 12 .

[0126] The dam structure 3 is disposed on the substrate 1 and located in the non-display area 13. For example, the dam structure 3 may be disposed in a closed ring shape to surround the display area 14.

[0127] The through hole 211 can be used as an exhaust hole to release water vapor during the manufacturing process of the dam structure 3 and the subsequent use of the display panel 100. The cover layer 21 can be an inorganic layer to improve the packaging effect. The first dam 31 can include organic materials.

[0128] The first dam 31 has a certain thickness. During the photomask manufacturing process, based on the etching process, the first side surface 311 may be an inclined side surface, specifically, in the direction away from the substrate 1, the first side surface 311 gradually tilts toward the display area 14. Alternatively, based on the etching process, the first side surface 311 may be a side surface perpendicular to the substrate 1, that is, the first side surface 311 is parallel to the thickness direction Z of the substrate 1 and perpendicular to the substrate 1. It is explained here that for the convenience of description, the two directions "X" and "Z" are defined in this article, see Figure 2 and Figure 3 As shown, the Z direction is the thickness direction of the substrate 1 , and the X direction is the thickness direction perpendicular to the substrate 1 .

[0129] like Figure 3 As shown in , the display panel 100 further includes an encapsulation structure 6, which includes an organic encapsulation layer 62, for example, disposed in the display area 14. The organic encapsulation layer 62 is formed after the cover layer 21, and the organic encapsulation layer 62 is blocked by the first bank 31 and the cover layer 21.

[0130] In one embodiment, if Fig.11 As shown, the first side surface 311 is perpendicular to the substrate 1. Therefore, in this embodiment, since the through hole 211 has a certain length, the through hole 211 exposes the first side surface 311. Here, the length direction refers to the direction from the side of the first side surface 311 close to the substrate 1 to the side of the first side surface 311 away from the substrate 1.

[0131] Alternatively, if Fig.11 As shown, the through hole 211 also exposes a portion of the substrate 1 located at the first side 311 away from the display area 14 .

[0132] Further optionally, the distance between the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first surface 310 on the substrate 1 is 0, or partially overlaps. That is, in the orthographic projection direction of the substrate 1, the through hole 211 may overlap with the first surface 310, or may just touch the first surface 310. In this embodiment, in order to fully expose the first side surface 311 during the process, the orthographic projection of the through hole 211 on the substrate 1 partially overlaps with the orthographic projection of the first surface 310 on the substrate 1. At this time, the process control can be used to ensure that the length of the overlapping portion of the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first surface 310 on the substrate 1 is reduced as much as possible on the basis of being able to expose the first side surface 311.

[0133] See also Figure 4 and Figure 8 As shown, in this embodiment, the first side surface 311 is inclined relative to the thickness direction Z of the substrate 1, and has an angle with the thickness direction Z. For example, along the direction from the display area 14 to the non-display area 13, the distance between the first side surface 311 and the substrate 1 along the thickness direction of the substrate 1 gradually decreases. The overlapping length H of the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first side surface 311 on the substrate 1 is greater than 0.

[0134] In one embodiment of the present application, the through hole 211 is located on a side of the first surface 310 away from the display area 14. In an alternative embodiment, see Figure 4 and Figure 8 As shown, the through hole 211 is spaced apart from the first surface 310, or in other words, the distance D between the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first surface 310 on the substrate 1 is greater than or equal to 0. Here, the length direction refers to the direction in which the orthographic projection of the side of the first side 311 close to the substrate 1 on the substrate 1 points to the orthographic projection of the side of the first side 311 away from the substrate 1 on the substrate 1. The "length direction" mentioned below has the same meaning and will not be repeated.

[0135] Please refer to Figure 4 and Figure 8 As shown, the distance D between the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first surface 310 on the substrate 1 is greater than or equal to 0, which means that any position of the first surface 310 of the first dam 31 will not be exposed from the through hole 211; the overlapping length H between the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first side surface 311 on the substrate 1 is greater than 0, which means that at least a portion of the first side surface 311 is exposed from the through hole 211.

[0136] For example, the organic encapsulation layer 62 includes at least two phase-separated portions, and the two phase-separated portions are respectively located on the side of the first dam 31 away from the substrate 1 and the side of the first dam 31 away from the display area 14. One of the two phase-separated portions is located on the side of the first dam 31 away from the substrate 1, and the other is located on the side of the first dam 31 away from the display area 14. For example, one of the two phase-separated portions is located on the side of the first dam 31 away from the substrate 1, and the other is located in the through hole 211 on the side of the first dam 31 away from the display area 14.

[0137] During the manufacturing process of the display panel 100 (for example, when manufacturing a light-emitting device, before manufacturing an organic encapsulation layer), water vapor generated by the first dam 31 is released from the through hole 211. In the subsequent manufacturing process of the display panel, the organic encapsulation layer 62 is solidified by a liquid organic encapsulation material 7. During its formation, the liquid organic encapsulation material 7 is filled on one side of the first dam 31 close to the display area 14. In the embodiment of the present application, the through hole 211 on the covering layer 21 is arranged corresponding to the first side surface 311 of the dam, rather than corresponding to the first surface 310 of the first dam 31. Even if the liquid organic encapsulation material 7 overflows and reaches the top of the covering layer 21, it will not enter the through hole 211. Figure 5 and Fig. 9 As shown, when the liquid organic encapsulation material 7 overflows and further reaches the side of the first dam 31 away from the display area 14, a part of the liquid organic encapsulation material 7 will flow downward and accumulate at the lower part of the first dam 31, and the other part will stay on the cover layer 21. In this way, the organic encapsulation material 7 includes two separated parts, which are respectively located on the side of the first dam 31 away from the substrate 1 and the side of the first dam 31 away from the display area 14. After curing, the two parts will not be connected together. The effect of this is that the connection between the through hole 211 and the organic encapsulation layer 62 is cut off, and it is not easy to contact the organic encapsulation layer 62. Therefore, the problem of water vapor extending to the display area 14 through the organic encapsulation layer 62 and the dam is avoided, and the encapsulation reliability of the pixel group 4 in the display area 14 is ensured. During the manufacturing process of the display panel 100, the water vapor generated by the first dam 31 is released from the through hole 211. In the display panel 100 provided in the embodiment of the present application, the orthographic projection of the through hole 211 arranged on the covering layer 21 of the non-display area 13 at least partially falls within the orthographic projection of the first side surface 311 of the first dam 31 on the substrate 1, but does not fall within the orthographic projection of the first surface 310 of the first dam 31 on the substrate 1, so that the connection between the through hole 211 and the organic encapsulation layer 62 can be cut off. In the subsequent display panel manufacturing process, the first dam 31 and the organic encapsulation layer 62 are not connected, and no water vapor intrusion path is formed, thereby avoiding the problem of water vapor extending to the display area 14 through the organic encapsulation layer 62 and the dam, thereby ensuring the packaging reliability of the pixel group 4.

[0138] like Figure 2 and Fig.14A As shown, each pixel group 4 in the display area 14 includes a plurality of light emitting devices 40, for example, at least one red light emitting device, at least one green light emitting device and at least one blue light emitting device. In each pixel group 4, the arrangement of the plurality of light emitting devices 40 is not limited, and they can be arranged in one direction or in two directions.

[0139] like Fig.14A As shown, the light emitting device 40 may include a first electrode 41, a light emitting functional layer 42, and a second electrode 43 which are sequentially stacked on the substrate 1 and away from the substrate 1. The light emitting device 40 may emit light of different colors depending on the material of the light emitting functional layer 42. The first electrode 41 may be an anode, and the second electrode 43 may be a cathode.

[0140] Please continue reading Fig.14A As shown, in the display area 14, an isolation structure 5 is further provided, and the isolation structure encloses an isolation opening 50. At least part of the light emitting device 40 is located in the isolation opening 50. The isolation structure 5 is disposed on the substrate 1 and is used to isolate adjacent light emitting devices 40. Specifically, isolation openings 50 are defined between the isolation structures 5, and a light emitting device 40 is disposed in each isolation opening 50.

[0141] For an example, see Figure 3 , Figure 7 and Fig.14A As shown, the substrate 1 includes a substrate 10. The display panel 100 also includes a driving circuit layer 11 disposed on the substrate 10. Alternatively, the substrate 1 includes a substrate 10 and a driving circuit layer 11 disposed on the substrate 10.

[0142] For example, the display panel 100 further includes a pixel definition layer 25, the pixel definition layer 25 includes a pixel definition portion 251, and the pixel definition portion 251 encloses and forms a pixel opening 250; the pixel opening 250 is connected to the corresponding isolation opening 50. Fig.14A As shown, the pixel definition layer 25 is disposed on the driving circuit layer 11 and includes a pixel definition portion 251, and the isolation structure 5 is disposed on a side of the pixel definition portion 251 away from the substrate 1. The pixel opening 250 is formed between the pixel definition portions 251. In addition, the isolation opening 50 is connected to the pixel opening 250 in the Z direction. The material of the pixel definition layer 25 may include an organic insulating material, or include an inorganic insulating material.

[0143] In other optional embodiments, the pixel definition layer 25 may be provided with a clearance opening (not shown), and the isolation structure 5 is disposed in the clearance opening to isolate adjacent light-emitting devices 40 .

[0144] In an optional embodiment, the cover layer 21 includes a pixel definition layer 25 , and the pixel definition layer 25 is provided with a pixel opening 250 .

[0145] At least a portion of the light emitting device 40 is disposed within the pixel opening 250. Specifically, Figure 3 , Figure 7 As shown, the first electrode 41 is disposed on the driving circuit layer 11 and connected to the driving circuit layer 11, the pixel definition layer 25 is disposed on the first electrode 41 and the driving circuit layer 11, and exposes at least a portion of the first electrode 41. The light-emitting functional layer 42 is disposed on a side surface of the pixel definition portion 251 and the first electrode 41 away from the substrate 1, and the second electrode 43 is disposed on a side surface of the light-emitting functional layer 42 away from the substrate 1.

[0146] For an example, see Fig.14A As shown, the isolation structure 5 includes a first isolation portion 51 and a second isolation portion 52; the second isolation portion 52 is arranged on the side of the first isolation portion 51 away from the substrate 1. Optionally, the first isolation portion 51 is arranged on the substrate 1 and is located in the display area 14. The orthographic projection of the side of the first isolation portion 51 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 52 on the substrate 1.

[0147] In an optional embodiment, the orthographic projection of the first isolating portion 51 on the substrate 1 is completely within the orthographic projection of the second isolating portion 52 on the substrate 1. That is, the two edges of the second isolating portion 52 along the X direction are more prominent than the first isolating portion 51. By configuring the isolating structure 5 in this way, the adjacent light-emitting functional layers 42 and the adjacent second electrodes 43 can be isolated during the evaporation process of the light-emitting functional layers 42 and the second electrodes 43.

[0148] In one embodiment, the isolation structure 5 includes a conductive material. The second electrode 43 of the light emitting device 40 is electrically connected to the isolation structure 5 to achieve mutual electrical connection of the second electrodes 43 of the plurality of light emitting devices 40 .

[0149] Optionally, the first isolation portion 51 includes a conductive material. Specifically, the first isolation portion 51 may include aluminum.

[0150] Optionally, the second isolation portion 52 includes a conductive material. Specifically, the second isolation portion 52 may include titanium.

[0151] In an optional embodiment, if Fig. 14B, the isolation structure 5 further includes a third isolation portion 53, which is arranged between the substrate 1 and the first isolation portion 51, and the orthographic projection of the first isolation portion 51 on the substrate 1 is located within the orthographic projection of the third isolation portion 53 on the substrate 1. The third isolation portion 53 is used to connect the substrate 1 with the first isolation portion 51. Further optionally, the third isolation portion may include a conductive material. Specifically, the third isolation portion may include molybdenum.

[0152] Here, the composition, preparation and other contents of the isolation structure 5 are disclosed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN11797 The present invention is further described in CN11755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A, the contents of which are incorporated herein by reference for reference.

[0153] In other optional examples, the isolation structure 5 is allowed to have other forms and corresponding preparation methods.

[0154] See also Fig. 6A and Fig. 10A As shown, there are multiple through holes, and the first side is provided with multiple through holes arranged at intervals, and the multiple through holes are arranged along the extension direction of the first dam. For example, at least three through holes can be arranged at equal intervals or unequal intervals along the extension direction of the first dam.

[0155] See also Figure 6B and Fig. 10B As shown, the through hole includes a plurality of sub-through holes, and the plurality of sub-through holes are arranged in a direction from a side of the first side away from the substrate to a side of the first side close to the substrate. For example, at least three sub-through holes can be arranged at equal or unequal intervals along a direction from a side of the first side away from the substrate to a side of the first side close to the substrate.

[0156] See also Fig. 6A and Fig. 10A As shown, a plurality of through holes 211 are provided on the cover layer 21, and the through holes 211 can be distributed at intervals around the display area 14, that is, arranged along the extension direction of the first dam 31. The distance between two adjacent through holes 211 is not particularly limited.

[0157] The shape of the through hole 211 is not limited, and can be circular, quasi-circular, rectangular, or other polygonal shapes.

[0158] like Figure 6B and Fig. 10B As shown, in an optional embodiment, there may be a plurality of sub-through holes 2110 arranged at intervals along a direction from the side of the first side 311 away from the substrate 1 to the side of the first side 311 close to the substrate 1, that is, in a direction from the side of the first side 311 away from the substrate 1 to the side of the first side 311 close to the substrate 1, the number of through holes 211 may be one, or each through hole 211 may include a plurality of sub-through holes 2110, in which case the length of the through hole 211, etc. should refer to the total length of the arrangement of the plurality of sub-through holes 2110.

[0159] See also Figure 3 and Figure 7 As shown, in one embodiment, the dam structure 3 further includes a second dam 32, which is arranged on the side of the first dam 31 away from the display area 14 and is spaced apart from the first dam 31. The covering layer 21 covers the second dam 32. The second dam 32 is used to further block the organic encapsulation material 7 that may overflow. At the same time, the spacing between the first dam 31 and the second dam 32 prolongs the path for external water and oxygen to enter the display area 14, further improving the water and oxygen barrier capability of the encapsulation structure 6. Optionally, the covering layer 21 covers the side of the second dam 32 away from the substrate 1, the side of the second dam 32 close to the display area 14, and the side of the second dam 32 away from the display area 14. Optionally, the covering layer 21 covers the gap between the second dam 32 and the first dam 31. The second dam 32 may include an organic material.

[0160] See also Figure 3 and Figure 7 As shown, the first dam 31 has a second side surface 312 on one side close to the display area 14. Similarly, the second side surface 312 is an inclined side surface, and in the direction away from the substrate 1, the first side surface 311 gradually tilts away from the display area 14, or the second side surface 312 is perpendicular to the substrate 1.

[0161] In addition, optionally, the dam structure 3 may further include more dams, such as a third dam (not shown) as required. The first dam 31 is the dam closest to the display area 14. The first dam 31, the second dam 32, the third dam, etc. are formed by the same photomask process.

[0162] The first bank 31 and the second bank 32 are made of organic insulating material. In one embodiment, the first bank 31 and the second bank 32 are made of polyimide material or polymethyl methacrylate material.

[0163] like Figure 4As shown, the height H' of the first dam 31 and the second dam 32 needs to be determined according to the height of the light-emitting device 40 in the display area 14 and the height of the organic encapsulation layer 62. The height H' of the first dam 31 and the second dam 32 is preferably to ensure that the organic encapsulation layer 62 has a suitable thickness. Wherein, the height and thickness both refer to the size in the X direction.

[0164] In one embodiment, the height H′ of the first bank 31 and the second bank 32 is greater than or equal to 50 μm.

[0165] Optionally, the height H′ of the first bank 31 and the second bank 32 is greater than or equal to 80 μm.

[0166] Optionally, the height H′ of the first bank 31 and the second bank 32 is greater than or equal to 100 μm.

[0167] In addition, the height H' of the first dam 31 and the second dam 32 also determines the frame thickness of the display panel 100 and the overall thickness of the display panel 100. In one embodiment, the height H' of the first dam 31 and the second dam 32 is less than or equal to 300 micrometers.

[0168] Optionally, the height H′ of the first bank 31 and the second bank 32 is less than or equal to 250 μm.

[0169] Optionally, the height H′ of the first bank 31 and the second bank 32 is less than or equal to 200 μm.

[0170] In the display panel 100 , part of the film layer can be formed in the non-display area 13 and the display area 14 at the same time.

[0171] For example, the driving circuit layer 11 includes multiple insulating layers and multiple conductive layers, the conductive layers may include metal layers, the insulating layers are used to separate adjacent conductive layers, and the conductive layers are used to form a pixel driving circuit. In addition, in the non-display area 13, the wiring used to connect the pixel driving circuit and the driving chip (not shown) can be formed by one or more layers of the multiple conductive layers.

[0172] In one embodiment, see Fig.15 As shown, the covering layer 21 includes at least one material. For example, the covering layer 21 can be a single-layer structure of one material, or a stacked-layer structure of multiple materials.

[0173] Optionally, the cover layer 21 may include at least one of an inorganic material and a conductive material. For example, the cover layer 21 includes an inorganic material, or for another example, the cover layer 21 includes a conductive material.

[0174] In an optional embodiment, if Fig.12As shown, the cover layer 21 includes a first sub-layer 212 and a second sub-layer 213 stacked together, and the first sub-layer 212 and the second sub-layer 213 are made of different materials. The through hole 211 is configured to penetrate the first sub-layer 212 and the second sub-layer 213 .

[0175] Optionally, one of the first sublayer 212 and the second sublayer 213 includes an inorganic insulating material, and the other includes a conductive material. In addition, either of the first sublayer 212 and the second sublayer 213 can be configured to be disposed closer to the substrate 1 relative to the other. The conductive material can be the same material as the first electrode 41 and formed at the same time, or the same material as the second electrode 43 and formed at the same time. In other embodiments, the conductive material can be the same material as the driving circuit layer 11 of any layer.

[0176] In an optional embodiment, one of the first sublayer 212 and the second sublayer 213 is disposed in the same layer as the pixel definition layer 25, and the other is disposed in the same layer as the first electrode 41 or the second electrode 43 or the isolation structure. The first sublayer 212 may cover the first surface of the first dam. The second sublayer 213 may cover the first surface of the first dam.

[0177] For example, at least part of the film layer in the cover layer 21 is disposed in the same layer as the pixel definition layer 25, and / or at least part of the film layer in the cover layer 21 is disposed in the same layer as the first electrode 41 or the second electrode 43 or the isolation structure. Multiple structures disposed in the same layer can be obtained by patterning the same film layer to simplify the process.

[0178] See also Figure 3 , Figure 7 and Fig.14A As shown, the cover layer 21 in the non-display area 13 includes a pixel definition layer 25, and the pixel definition layer 25 includes an inorganic insulating material. That is, the pixel definition layer 25 is formed in both the non-display area 13 and the display area 14. In the display area 14, the pixel definition layer 25 is used to define and space adjacent light-emitting devices 40; in the non-display area 13, the pixel definition layer 25 covers the first dam 31 and is used to separate the first dam 31 and the organic encapsulation layer 62. Figure 2 , Figure 3 and Fig.14A As shown, the organic encapsulation layer 62 is simultaneously formed in the display area 14 and disposed on each light emitting device 40 and the isolation structure 5 , so as to encapsulate each light emitting device 40 .

[0179] like Figure 3 and Figure 7 As shown, for example, part or all of the organic encapsulation layer is disposed on a side of the cover layer away from the substrate.

[0180] like Figure 3 and Figure 7As shown, the orthographic projection of the organic encapsulation layer 62 on the substrate 1 overlaps with the orthographic projection of the side of the first dam 31 close to the display area 14 on the substrate 1. In addition, in the non-display area 13, the organic encapsulation layer 62 is arranged on the side of the first dam 31 facing the display area 14, and on the side of the cover layer 21 away from the substrate 1. Optionally, the organic encapsulation layer 62 can be spaced apart from the through hole 211 to prevent the organic encapsulation material 7 from entering the through hole 211.

[0181] like Figure 7 As shown, for example, an orthographic projection of the organic encapsulation layer on the substrate overlaps with an orthographic projection of at least a portion of the first surface on the substrate.

[0182] For example, the organic encapsulation layer is spaced apart from the through hole. The organic encapsulation layer is spaced apart from a side of the first surface away from the display area;

[0183] Also, please read Fig.14A As shown, in one embodiment, the display panel 100 or the encapsulation structure 6 further includes a plurality of encapsulation parts 61, and the encapsulation parts 61 are located on a side of the corresponding light-emitting device 40 away from the substrate 1. The encapsulation parts 61 are arranged between each light-emitting device 40 and the organic encapsulation layer 62. The encapsulation parts 61 include inorganic materials, and are used to isolate each light-emitting device 40 from the organic encapsulation layer 62, so as to prevent water and oxygen in the organic encapsulation layer 62 from entering each light-emitting device 40.

[0184] The light emitting devices 40 of different light emitting colors correspond to different packaging parts 61. In an optional embodiment, the light emitting devices 40 of different light emitting colors and their corresponding packaging parts 61 are formed together or in steps.

[0185] See also Figure 3 , Figure 7 and Fig.14A As shown, in one embodiment, the display panel 100 or the encapsulation structure 6 further includes a first encapsulation layer 63, and the first encapsulation layer 63 is disposed on a side of the organic encapsulation layer 62 away from the substrate 1. The first encapsulation layer 63 is located in both the non-display area 13 and the display area 14, and covers the cover layer 21 and the organic encapsulation layer 62. The first encapsulation layer 63 may include an inorganic material encapsulation layer. The first encapsulation layer 63 may be partially filled in the through hole 211 to cover the cover layer 21 and at least the first dam 31. Optionally, the first encapsulation layer 63 may cover the second dam 32. For example, the first encapsulation layer 63 is disposed on a side of the cover layer 21 and the organic encapsulation layer 62 away from the substrate 1. The first encapsulation layer 63 is partially filled in the through hole 211.

[0186] See also Figure 4 and Figure 8As shown, in one embodiment, the through hole 211 is spaced apart from the first surface 310, that is, the distance D between the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first surface 310 on the substrate 1 is greater than 0. For example, D can be 1 micron, 2 microns, 3 microns, 4 microns, 5 microns, 6 microns, etc.

[0187] The purpose of such design is that in the process of forming the through hole 211, mask alignment and etching are involved, and there is inevitably an alignment deviation in the mask alignment. Therefore, in order to ensure that the orthographic projection of the through hole 211 on the substrate 1 does not overlap with the orthographic projection of the first surface 310 on the substrate 1, the through hole 211 can be designed to be as far away from the first surface 310 as possible.

[0188] In an optional embodiment, a distance D between an orthographic projection of the through hole 211 on the substrate 1 and an orthographic projection of the first surface 310 on the substrate 1 is greater than or equal to 3 micrometers.

[0189] Further optionally, a distance D between an orthographic projection of the through hole 211 on the substrate 1 and an orthographic projection of the first surface 310 on the substrate 1 is greater than or equal to 4 micrometers.

[0190] See also Figure 4 As shown, in one embodiment, the angle between the first side surface 311 and the surface of the substrate 1 is α, and the length of the orthographic projection of the first side surface 311 on the substrate 1 is L. The length refers to the dimension in the X direction. Then H'=L·tanα.

[0191] According to the aforementioned height H′ of the first dam 31 , the length L of the orthographic projection of the first side surface 311 on the substrate 1 can be calculated.

[0192] In one embodiment, 80°≤α≤89°, for example, α may be 82°, 85°, 88°, etc.

[0193] In an optional embodiment, the length L of the orthographic projection of the first side surface 311 on the substrate 1 is greater than or equal to 8 micrometers and less than or equal to 50 micrometers. For example, L can be 8 micrometers, 10 micrometers, 20 micrometers, 30 micrometers, 40 micrometers, 50 micrometers, etc.

[0194] In an optional embodiment, the length L of the orthographic projection of the first side surface 311 on the substrate 1 is greater than or equal to 10 micrometers and less than or equal to 40 micrometers.

[0195] In an optional embodiment, the length L of the orthographic projection of the first side surface 311 on the substrate 1 is greater than or equal to 15 micrometers and less than or equal to 30 micrometers.

[0196] In more embodiments, according to different specific values ​​of the height H' of the first dam 31 and the specific values ​​of the angle α between the first side surface 311 and the surface of the substrate 1, the length L of the orthographic projection of the first side surface 311 on the substrate 1 may have other ranges and specific values.

[0197] See also Figure 4 , Figure 5 As shown in FIG6 , in one embodiment, the orthographic projection of the through hole 211 on the substrate 1 is completely within the orthographic projection of the first side surface 311 on the substrate 1. This includes that the side of the orthographic projection of the through hole 211 on the substrate 1 away from the display area 14 may just coincide with the side of the orthographic projection of the first side surface 311 on the substrate 1 away from the display area 14, or the side of the orthographic projection of the through hole 211 on the substrate 1 away from the display area 14 may be spaced a certain distance from the side of the orthographic projection of the first side surface 311 on the substrate 1 away from the display area 14.

[0198] The purpose of such arrangement is that, since the through hole 211 is intended to allow the release of water vapor from the first dam 31, based on the limited area of ​​the through hole 211, the orthographic projection of the through hole 211 on the substrate 1 is completely within the orthographic projection of the first side surface 311 on the substrate 1, which can ensure that the first side surface 311 of the through hole 211 is exposed the most, and is conducive to maximizing the water vapor release rate of the first dam 31.

[0199] In this embodiment, the overlapping length H of the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first side surface 311 on the substrate 1 is the length of the orthographic projection of the through hole 211 on the substrate 1 .

[0200] In an optional embodiment, the through hole 211 is spaced apart from a side of the first side surface 311 close to the substrate 1. For example, the side of the through hole 211 close to the substrate 1 is spaced apart from a side of the first side surface 311 close to the substrate 1.

[0201] In an optional embodiment, the side of the through hole 211 away from the display area 14 is located on the side of the first side 311 away from the display area 14 away from the display area 14, that is, compared with the side of the first side 311 away from the display area 14, the side of the through hole 211 away from the display area 14 is configured to be further away from the display area 14, so that the orthographic projection of the side of the through hole 211 away from the display area 14 on the substrate 1 is spaced from the orthographic projection of the side of the first side 311 away from the display area 14 on the substrate 1.

[0202] In one embodiment, the length of the orthographic projection of the through hole 211 on the substrate 1 is greater than or equal to 4 micrometers.

[0203] Optionally, the length of the orthographic projection of the through hole 211 on the substrate 1 is greater than or equal to 5 micrometers.

[0204] Optionally, the length of the orthographic projection of the through hole 211 on the substrate 1 is greater than or equal to 6 micrometers.

[0205] Optionally, the length of the orthographic projection of the through hole 211 on the substrate 1 is greater than or equal to 8 micrometers.

[0206] In addition, considering the alignment deviation between the through hole 211 and the first side surface 311 , in order to ensure that the through hole 211 completely falls within the orthographic projection of the first side surface 311 on the substrate 1 , in an optional embodiment, L and H satisfy the relationship: LH≥6 microns.

[0207] Further optionally, L and H satisfy the relationship: LH ≥ 8 microns.

[0208] See also Figure 7 , Figure 8 As shown in FIG. 10 , in one embodiment, a portion of the orthographic projection of the through hole 211 on the substrate 1 falls within the orthographic projection of the first side surface 311 on the substrate 1, and another portion of the orthographic projection of the through hole 211 on the substrate 1 is located outside the orthographic projection of the first dam 31 on the substrate 1. In other words, another portion of the through hole 211 is formed between the first dam 31 and the second dam 32.

[0209] The purpose of this setting is to combine Fig. 9 As shown, on the substrate 1, on the side of the first dam 31 away from the display area 14, part of the through hole 211 forms a low space that can accommodate the liquid organic encapsulation material 7. Compared with the previous embodiment, the low space can accommodate more organic encapsulation material 7, so that the overflowed organic encapsulation material 7 is farther from the upper end of the through hole 211, further ensuring that the connection path between the through hole 211 and the organic encapsulation layer 62 is completely cut off. Therefore, this embodiment allows a larger process deviation in the manufacturing process of the organic encapsulation layer 62, in other words, it is more conducive to improving the encapsulation reliability of the encapsulation structure 6.

[0210] Furthermore, the side of the through hole 211 farthest from the display area 14 is located on the substrate 1 rather than on the first dam 31 , which is also beneficial to the implementation of the etching process of the cover layer 21 .

[0211] In one embodiment, if Figure 8 As shown, the length of the orthographic projection of the through hole 211 on the substrate 1 is H, the overlapping length of the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first side surface 311 on the substrate 1 is h, and H>h. For example, H can be 5 microns, 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, 11 microns, 12 microns, etc. For example, h can be 1 micron, 2 microns, 3 microns, 4 microns, 5 microns, 6 microns, 7 microns, etc.

[0212] In this embodiment, the length H of the orthographic projection of the through hole 211 on the substrate 1 is greater than or equal to 4 micrometers.

[0213] Optionally, a length H of an orthographic projection of the through hole 211 on the substrate 1 is greater than or equal to 5 micrometers.

[0214] Optionally, a length H of an orthographic projection of the through hole 211 on the substrate 1 is greater than or equal to 6 micrometers.

[0215] Optionally, a length H of an orthographic projection of the through hole 211 on the substrate 1 is greater than or equal to 8 micrometers.

[0216] In one embodiment, H and h satisfy the relationship: Hh≥2 microns.

[0217] Optionally, H and h satisfy the relationship: Hh≥3 microns.

[0218] Next, see Fig.15 As shown, a method for manufacturing a display panel provided in a second embodiment of the present application is used to manufacture the display panel 100 mentioned in the above embodiments.

[0219] Specifically, Fig.15 As shown, the display panel 100 includes a display area 14 and a non-display area 13. The manufacturing method of the display panel includes:

[0220] Step S1, such as Fig.15 As shown, a substrate 1 is provided;

[0221] Step S2, such as Fig.16 As shown, a first dam 31 is formed in the non-display area 13 , and the first dam 31 has a first surface 310 facing away from the substrate 1 , and a first side surface 311 connected to the first surface 310 and facing away from the display area 14 ;

[0222] Step S3, such as Fig.17 As shown, a covering layer 21 is formed on the first dam 31 , and at least a portion of the covering layer 21 is located on a side of the first surface 310 away from the substrate 1 . The covering layer 21 has a through hole 211 , and the through hole 211 is at least partially disposed on the first side surface 311 .

[0223] In an optional embodiment, the first side surface 311 is inclined relative to the orthographic projection direction of the substrate 1 , and the overlapping length of the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first side surface 311 on the substrate 1 is greater than 0.

[0224] Further optionally, the distance between the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first surface 310 on the substrate 1 is greater than or equal to 0.

[0225] In an optional embodiment, the first side surface 311 is perpendicular to the substrate 1. At least a portion of the through hole 211 exposes the first side surface 311. At this time, the orthographic projection length of the first side surface 311 on the substrate 1 is 0, so the overlapping length of the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first side surface 311 on the substrate 1 is equal to 0.

[0226] like Figure 7 As shown, for example, a portion of the orthographic projection of the through hole on the substrate is located on the side of the first dam away from the display area. Optionally, the through hole 211 also exposes a portion of the substrate 1 located on the first side 311 away from the display area 14.

[0227] Optionally, the distance between the orthographic projection of the through hole 211 on the substrate 1 and the orthographic projection of the first surface 310 on the substrate 1 is 0, or they partially overlap. That is, in the orthographic projection direction of the substrate 1, the through hole 211 may overlap with the first surface 310, or may just touch the first surface 310.

[0228] In one embodiment, step S3 of making the covering layer 21 specifically includes:

[0229] A covering material is formed on the first dam 31, and a photoresist layer is formed on the covering material, and a photomask is provided, on which a shading pattern is provided; the photoresist layer is exposed through the photomask, and the exposed photoresist layer is developed to obtain a photoresist pattern, wherein the photoresist pattern has a hollow area, and the hollow area corresponds to the position of the through hole 211 to be obtained; the covering material is etched through the photoresist pattern to remove part of the covering material, and a covering layer 21 having a through hole 211 is obtained.

[0230] In one embodiment, please continue to refer to Fig.15 As shown, the method for manufacturing the display panel further includes:

[0231] Step S4, such as Fig.18 As shown, an isolation structure 5 is manufactured, and the isolation structure 5 encloses and forms an isolation opening 50;

[0232] Step S5, such as Fig.18 As shown, at least a portion of the film layer and the packaging portion 61 of the light-emitting device 40 are manufactured; at least a portion of the light-emitting device 40 is located in the isolation opening 50, and the packaging portion 61 is located on a side of the corresponding light-emitting device 40 away from the substrate 1;

[0233] Step S6, as Fig.19 As shown, an organic encapsulation layer 62 is formed on a side of the encapsulation portion 61 away from the substrate 1; and

[0234] Step S7 , forming a first encapsulation layer 63 located on a side of the organic encapsulation layer 62 away from the substrate 1 .

[0235] It should be noted that the above steps S1 to S7 are not limited to occur in a unique order. Without affecting the inventive principle of the present application, the above steps S1 to S7 are allowed to occur in a crossover or exchanged order. For example, at least part of the film layer of the light-emitting device 40 includes a light-emitting functional layer 42 and a second electrode 43. The first electrode 41 of the light-emitting device 40 can be manufactured before the isolation structure 5 is manufactured.

[0236] Optionally, after forming a cover layer having a through hole on the first dam, the method further includes:

[0237] An organic encapsulation layer is fabricated, and the organic encapsulation layer is disposed on a side of the cover layer away from the substrate. The through hole is at least partially disposed on the first side surface, so as to avoid the formation of a water vapor intrusion path between the organic encapsulation layer and the first dam being directly connected. For example, the organic encapsulation layer is disposed on a side of the first dam facing the display area.

[0238] The organic encapsulation layer is spaced apart from the through hole; the orthographic projection of the organic encapsulation layer on the substrate overlaps with the orthographic projection of the side surface of the first dam close to the display area on the substrate.

[0239] Optionally, after the organic encapsulation layer is formed, the method further includes:

[0240] A first encapsulation layer is formed on the side of the organic encapsulation layer away from the substrate, and the first encapsulation layer is disposed on the side of the organic encapsulation layer of the cover layer away from the substrate; a portion of the first encapsulation layer is filled in the through hole to improve the encapsulation effect. The first dam may include an organic material, such as an organic insulating material.

[0241] Optionally, the first encapsulation layer comprises an inorganic material encapsulation layer.

[0242] In one embodiment, in step S3, Fig.17 As shown, the cover layer 21 is simultaneously formed in the display area 14 as a pixel definition layer 25, and the pixel definition layer 25 includes a pixel definition portion 251. In other words, the cover layer 21 and the pixel definition layer 25 are made of the same layer and the same material.

[0243] In a specific embodiment, both the cover layer 21 and the pixel definition layer 25 include inorganic insulating materials.

[0244] In an alternative embodiment, the cover layer 21 may be made of a different material from the pixel definition layer 25 .

[0245] In one embodiment, the light emitting device 40 manufactured in step S4 includes a first electrode 41, a light emitting functional layer 42 and a second electrode 43 stacked on the substrate 1. Fig.14AAs shown; wherein, the first electrode 41 is manufactured in step S3: a plurality of spaced first electrodes 41 are manufactured on the substrate 1, and a pixel definition layer 25 is formed on the first electrode 41, and a cover layer 21 is formed on the first dam 31. The light-emitting functional layer 42 and the second electrode 43 are manufactured in step S5, and the light-emitting functional layer 42 and the second electrode 43 are manufactured between the isolation structures 5 and on the first electrode 41. In this way, at least a partial film layer of the light-emitting device 40 in the isolation opening 50 of the isolation structure 5 is obtained.

[0246] In one embodiment, step S4 includes:

[0247] The light-emitting functional material layer, the second electrode 43 material layer and the first packaging material layer are sequentially deposited between the isolation structures 5 and on each first electrode 41. Due to the arrangement of the second isolation portion 52 and the first isolation portion 51 of the isolation structure 5, the light-emitting functional material layer and the second electrode material layer are separated between different isolation openings 50 by the isolation structure 5. The first packaging material layer is patterned, and the first packaging material layer of the unnecessary isolation opening 50 and the light-emitting functional material layer and the second electrode material layer thereunder are removed, so that the light-emitting functional layer 42, the second electrode 43 and the packaging portion 61 stacked sequentially are obtained in the partial isolation openings 50.

[0248] See also Fig.16 and Fig.17 As shown, in one embodiment, in step S2 , a second dam 32 is formed in the non-display area 13 on the side of the first dam 31 away from the display area 14 , and in step S3 , the covering layer 21 covers the second dam 32 .

[0249] Finally, the third embodiment of the present application provides a display device (not shown), which includes the display panel 100 as described in the above embodiments, or a display panel manufactured by the above display panel manufacturing method.

[0250] Display devices may include mobile phones, tablet computers, wearable devices, laptop computers, vehicle-mounted display devices, etc.

[0251] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalences, combinations, substitutions and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area, and the display panel includes: substrate; a dam structure disposed on the substrate and located in the non-display area; the dam structure comprises a first dam, the first dam having a first surface away from the substrate, and a first side surface connected to the first surface and away from the display area; A covering layer, wherein at least a portion of the covering layer is located on a side of the first surface away from the substrate, and the covering layer is provided with a through hole, and the through hole is at least partially provided on the first side surface.

2. The display panel according to claim 1, wherein: The through hole is located on a side of the first surface away from the display area; Preferably, the through hole is spaced apart from the first surface; Preferably, the through hole is spaced apart from a side of the first side surface close to the substrate; Alternatively, a side of the through hole away from the display area is located on a side of the first side away from the display area and away from the display area; Preferably, at least part of the non-display area is located at the periphery of the display area, or the display area is located at the periphery of at least part of the non-display area; Preferably, the non-display area includes a border area and / or a light-transmitting hole area, the border area is located on the periphery of at least part of the display area, at least part of the first dam and at least part of the through hole are located in the border area; or, the display area is located on the periphery of at least part of the light-transmitting hole area, at least part of the first dam and at least part of the through hole are located between the display area and the light-transmitting hole area.

3. The display panel according to claim 1, wherein: The number of the through holes is multiple, the first side surface is provided with multiple through holes arranged at intervals, and the multiple through holes are arranged along the extension direction of the first dam; And / or, the through hole includes a plurality of sub-through holes, and the plurality of sub-through holes are arranged in a direction from a side of the first side away from the substrate to a side of the first side close to the substrate.

4. The display panel according to claim 1, wherein: There is an angle between the first side surface and the thickness direction of the substrate, the orthographic projection of the side of the first side surface close to the substrate on the substrate points in the direction of the orthographic projection of the side of the first side surface away from the substrate on the substrate, and the overlapping length of the orthographic projection of the through hole on the substrate and the orthographic projection of the first side surface on the substrate is greater than 0; Preferably, along the direction from the display area to the non-display area, the distance between the first side surface and the substrate along the thickness direction of the substrate gradually decreases.

5. The display panel according to claim 1, wherein: The distance between the orthographic projection of the through hole on the substrate and the orthographic projection of the first surface on the substrate is greater than or equal to 0; Alternatively, the orthographic projection of the through hole on the substrate partially overlaps with the orthographic projection of the first surface on the substrate; Preferably, the distance between the orthographic projection of the through hole on the substrate and the first surface is greater than or equal to 3 micrometers.

6. The display panel according to claim 1, wherein: The length of the orthographic projection of the through hole on the substrate is greater than or equal to 4 micrometers in the direction of the orthographic projection of the side of the first side close to the substrate on the substrate pointing to the orthographic projection of the side of the first side far from the substrate on the substrate; Preferably, along the direction of the orthographic projection of the first side surface close to the substrate on the substrate pointing to the orthographic projection of the first side surface away from the substrate on the substrate, the length of the orthographic projection of the through hole on the substrate is greater than or equal to 5 microns.

7. The display panel according to claim 1, wherein: The orthographic projection of the through hole on the substrate is located within the orthographic projection of the first side surface on the substrate; Preferably, an orthographic projection of a side of the through hole facing away from the display area on the substrate is spaced from an orthographic projection of a side of the first side facing away from the display area on the substrate; Preferably, along the direction in which the orthographic projection of the side of the first side close to the substrate on the substrate points to the orthographic projection of the side of the first side far from the substrate on the substrate, the length of the orthographic projection of the through hole on the substrate is H, the length of the orthographic projection of the first side on the substrate is L, and the relationship between H and L is: LH ≥ 6 microns.

8. The display panel according to claim 1, wherein: A portion of the orthographic projection of the through hole on the substrate is located outside the orthographic projection of the first dam on the substrate; Preferably, in the direction of the orthographic projection of the side of the through hole away from the display area on the substrate pointing to the orthographic projection of the side of the through hole close to the display area on the substrate, the length of the orthographic projection of the through hole on the substrate is H, the overlapping length of the orthographic projection of the through hole on the substrate and the orthographic projection of the first side surface on the substrate is h, and the relationship between H and h satisfies: Hh≥2 microns; Preferably, the first side surface is perpendicular to the substrate; the through hole exposes at least a portion of the first side surface; Preferably, a portion of an orthographic projection of the through hole on the substrate is located on a side of the first dam away from the display area and a side of the orthographic projection of the first dam on the substrate away from the display area.

9. The display panel according to any one of claims 1 to 8, characterized in that: The dam structure further includes a second dam, the second dam being located on a side of the first dam away from the display area; the covering layer covers the second dam; Preferably, the covering layer covers a side of the second dam away from the substrate, a side of the second dam close to the display area, and a side of the second dam away from the display area; Preferably, the cover layer covers a gap between the second dam and the first dam.

10. The display panel according to any one of claims 1 to 8, characterized in that: The cover layer includes a pixel definition layer, and the pixel definition layer is provided with a pixel opening; Preferably, the display panel further comprises a light emitting device, at least a portion of which is located in the pixel opening; Preferably, the pixel definition layer is an inorganic insulating material.

11. The display panel according to any one of claims 1 to 8, characterized in that: The display panel further comprises an organic encapsulation layer, part or all of which is disposed on a side of the first dam facing the display area, and the organic encapsulation layer is disposed on a side of the cover layer away from the substrate; The orthographic projection of the organic encapsulation layer on the substrate overlaps with the orthographic projection of the side of the first dam close to the display area on the substrate; Preferably, an orthographic projection of the organic encapsulation layer on the substrate overlaps with an orthographic projection of at least part of the first surface on the substrate; Preferably, the organic encapsulation layer is spaced apart from the through hole; the organic encapsulation layer is spaced apart from a side of the first surface away from the display area; or the organic encapsulation layer comprises at least two phase-separated portions, the two phase-separated portions are respectively located on a side of the first dam away from the substrate and a side of the first dam away from the display area; Preferably, the display panel further comprises a first encapsulation layer, which is arranged on a side of the organic encapsulation layer of the cover layer away from the substrate; a portion of the first encapsulation layer is filled in the through hole; Preferably, the first encapsulation layer comprises an inorganic material encapsulation layer.

12. The display panel according to any one of claims 1 to 8, characterized in that: The display panel further includes: An isolation structure, wherein the isolation structure encloses and forms an isolation opening; a light emitting device, at least a portion of which is located in the isolation opening; Preferably, the display panel further comprises a plurality of packaging parts, wherein the packaging parts are located on a side of the corresponding light-emitting device away from the substrate; Preferably, the light-emitting devices with different light-emitting colors correspond to different packaging parts; Preferably, the isolation structure comprises a conductive material, the light-emitting device comprises a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked in a direction away from the substrate, and the second electrode is electrically connected to the isolation structure; Preferably, the display panel further comprises an organic encapsulation layer, which is located on a side of the encapsulation portion away from the substrate; Preferably, the display panel further comprises a first encapsulation layer, and the first encapsulation layer is arranged on a side of the organic encapsulation layer away from the substrate; Preferably, the display panel further comprises a pixel definition layer, the pixel definition layer comprises a pixel definition portion, the pixel definition portion encloses to form a pixel opening; the pixel opening is connected to the corresponding isolation opening; Preferably, the isolation structure is located at a side of the pixel definition portion away from the substrate, or the pixel definition layer is provided with a clearance opening, and the isolation structure is located in the clearance opening; Preferably, at least part of the film layer in the covering layer is disposed in the same layer as the pixel definition layer, and / or at least part of the film layer in the covering layer is disposed in the same layer as the first electrode or the second electrode.

13. The display panel according to claim 12, wherein: The isolation structure comprises a first isolation portion and a second isolation portion; the second isolation portion is arranged on a side of the first isolation portion away from the substrate; Preferably, the orthographic projection of the side of the first isolation portion away from the substrate on the substrate is located within the orthographic projection of the second isolation portion on the substrate; Preferably, the material of the first isolation portion includes aluminum; Preferably, the material of the second isolation portion includes titanium.

14. The display panel according to claim 13, wherein: The isolation structure further includes a third isolation portion, the third isolation portion is disposed between the first isolation portion and the substrate; the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate; Preferably, the material of the third isolation portion includes molybdenum.

15. The display panel according to any one of claims 1 to 8, characterized in that: The covering layer comprises an inorganic material and / or a conductive material; Preferably, the cover layer comprises an inorganic insulating material or a conductive material; Preferably, the first bank comprises an organic material.

16. The display panel according to any one of claims 1 to 8, characterized in that: The cover layer includes a first sub-layer and a second sub-layer which are stacked, and the through hole penetrates the first sub-layer and the second sub-layer; Preferably, one of the first sublayer and the second sublayer comprises an inorganic insulating material, and the other comprises a conductive material.

17. A method for manufacturing a display panel, the display panel comprising a display area and a non-display area, characterized in that: The production method comprises: providing a substrate; A first dam is formed in the non-display area, wherein the first dam has a first surface facing away from the substrate and a first side surface connected to the first surface and facing away from the display area; A covering layer is formed on the first dam, wherein at least a portion of the covering layer is located on a side of the first surface away from the substrate, and a through hole is provided on the covering layer, wherein at least a portion of the through hole is provided on the first side surface.

18. The method for manufacturing a display panel according to claim 17, wherein: After forming a covering layer with through holes on the first dam, the method further comprises: An organic encapsulation layer is manufactured, wherein the organic encapsulation layer is disposed on a side of the cover layer away from the substrate; the organic encapsulation layer is spaced apart from the through hole; and an orthographic projection of the organic encapsulation layer on the substrate overlaps with an orthographic projection of a side of the first dam close to the display area on the substrate; Preferably, after the organic encapsulation layer is manufactured, the method further comprises: A first encapsulation layer is formed on a side of the organic encapsulation layer away from the substrate, wherein the first encapsulation layer is disposed on a side of the cover layer away from the substrate; a portion of the first encapsulation layer is filled in the through hole; Preferably, the first encapsulation layer comprises an inorganic material encapsulation layer.

19. The method for manufacturing a display panel according to claim 17, wherein: The method for manufacturing the display panel further includes: Making an isolation structure, wherein the isolation structure encloses and forms an isolation opening; Manufacturing at least a portion of the film layer and the packaging portion of the light-emitting device, wherein at least a portion of the light-emitting device is located in the isolation opening, and the packaging portion is located on a side of the corresponding light-emitting device away from the substrate; Manufacturing an organic encapsulation layer located on a side of the encapsulation portion away from the substrate; A first encapsulation layer is formed on a side of the organic encapsulation layer away from the substrate.

20. A display device, characterized in that: A display panel comprising any one of claims 1 to 16, or a display panel manufactured by the manufacturing method according to any one of claims 17 to 19.

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