Display panel, manufacturing method of display panel and display device

Abstract

The invention provides a display panel, a manufacturing method of the display panel and a display device. The display panel further comprises a first area, a display area and a transition area located between the display area and the first area. The display panel further comprises a substrate and at least one isolation structure, the isolation structure is arranged on one side of the substrate and located in the transition area, the side, facing and / or deviating from the display area, of the isolation structure is provided with an isolation opening, the isolation structure comprises a first sub-layer and a second sub-layer which are sequentially arranged in the direction deviating from the substrate, and the first sub-layer comprises a metal material. The orthographic projection of the first sub-layer on the substrate is located in the orthographic projection of the second sub-layer on the substrate, a first interval is formed between the orthographic projections of the edges, facing the same isolation opening, of the first sub-layer and the second sub-layer of each isolation structure on the substrate, the first interval ranges from 260 nanometers to 350 nanometers, and the use performance of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to improve the performance of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, comprising: a first area and a display area, and a transition area located between the display area and the first area; the display panel also comprises: a substrate and at least one isolation structure, the isolation structure is arranged on one side of the substrate and is located in the transition area, the isolation structure has an isolation opening facing and / or away from the display area, the isolation structure comprises a first sublayer and a second sublayer arranged in sequence along a direction away from the substrate, the first sublayer comprises a metal material, the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate, the edges of the first sublayer and the second sublayer of each isolation structure facing the same isolation opening have a first spacing between the orthographic projections of the substrate, and the first spacing is 260 nanometers to 350 nanometers.

[0006] According to an embodiment of the present application, the display panel also includes: a first metal layer, arranged on one side of the substrate, the first metal layer includes a first sub-portion located in the transition zone; an insulating layer, arranged on the side of the first sub-portion facing away from the substrate, the insulating layer is provided with at least one first via located in the transition zone; the isolation structure includes a plurality of first isolation portions arranged on the side of the insulating layer facing away from the substrate, the plurality of first isolation portions enclose a plurality of isolation openings, each first isolation portion is conductively connected to the first sub-portion through the first via hole, so that the first isolation portions located on the side of the insulating layer facing away from the substrate are conductively connected through the first sub-portion.

[0007] According to an embodiment of the present application, the first sublayer includes a first metal material, the first metal layer includes a second metal material, and the metal activity of the first metal material is greater than the metal activity of the second metal material.

[0008] According to an embodiment of the present application, the isolation structure further includes a third sublayer, and the third sublayer is located on a side of the first sublayer facing the substrate.

[0009] According to an embodiment of the present application, an orthographic projection of the first sub-layer on the substrate is located within an orthographic projection of the third sub-layer on the substrate.

[0010] According to an embodiment of the present application, the material of the first sub-layer includes aluminum.

[0011] According to an embodiment of the present application, the material of the first metal layer includes molybdenum.

[0012] According to an embodiment of the present application, the material of the second sub-layer includes titanium.

[0013] According to an embodiment of the present application, the material of the third sub-layer includes titanium.

[0014] According to an embodiment of the present application, the first region includes a hole region, the transition region and the display region are arranged on the periphery of the first region, and each first isolation portion located in the transition region is arranged around the hole region.

[0015] According to an embodiment of the present application, each first isolation portion located in the transition region is arranged around the first region, and the orthographic projection of the first isolation portion on the substrate is ring-shaped.

[0016] According to an embodiment of the present application, each first isolation portion is arranged in sequence away from the hole region.

[0017] According to an embodiment of the present application, the first sub-portion is disposed around the first region, and an orthographic projection of the first sub-portion on the substrate at least partially overlaps with an orthographic projection of the first isolation portion on the substrate.

[0018] According to an embodiment of the present application, there are multiple first sub-sections, which are arranged in sequence along a direction away from the hole area, two adjacent first sub-sections are connected, and each first isolation section is correspondingly connected to each first sub-section.

[0019] According to an embodiment of the present application, the first region includes a border area, the border area is arranged around the display area, the first metal layer includes a second sub-portion located in the border area, the second sub-portion includes a second metal material, and the first isolation portion is electrically connected to the second sub-portion.

[0020] According to an embodiment of the present application, a protection portion is provided on a side of the second sub-portion facing away from the substrate, and an orthographic projection of the protection portion on the substrate at least partially overlaps with an orthographic projection of the second sub-portion on the substrate.

[0021] According to an embodiment of the present application, the display area includes a source-drain electrode, and the source-drain electrode is made of the same material as the protection part.

[0022] According to an embodiment of the present application, the isolation structure further includes a second isolation portion disposed on one side of the substrate, the second isolation portion is located on a side of the first isolation portion facing the first region, and the first isolation portion is electrically connected to the second isolation portion.

[0023] According to an embodiment of the present application, the isolation structure further includes a third isolation portion, at least a portion of the third isolation portion is arranged on a side of each protection portion away from the substrate, and the second isolation portion is electrically connected to the second sub-portion through the protection portion.

[0024] According to an embodiment of the present application, the first metal layer includes a plurality of second sub-portions, and the third isolation portions on a side of each protection portion away from the second sub-portion are electrically connected.

[0025] According to an embodiment of the present application, at least one third isolation portion extends to one side of the substrate and is connected to the second isolation portion.

[0026] In a second aspect, the present application provides a method for manufacturing a display panel, wherein the display panel includes a first area and a display area, and a transition area between the display area and the first area; the manufacturing method includes:

[0027] forming an isolation structure material layer on one side of the substrate;

[0028] Patterning the isolation structure material layer to form at least one isolation structure located in the transition area, wherein the isolation structure has an isolation opening on a side facing and / or away from the display area;

[0029] An isolation structure is side-etched by a developer, wherein the isolation structure includes a first sublayer and a second sublayer which are sequentially arranged in a direction away from the substrate, wherein an orthographic projection of the first sublayer on the substrate is located within an orthographic projection of the second sublayer on the substrate, and edges of the first sublayer and the second sublayer of the isolation structure facing one side of the same isolation opening have a first spacing between the orthographic projections of the substrate, and the first spacing is 260 nanometers to 350 nanometers.

[0030] According to an embodiment of the present application, before the step of forming an isolation structure material layer on one side of the substrate, the method includes: forming a first metal layer on one side of the substrate, the first metal layer including a first sub-portion located in the transition region;

[0031] forming an insulating layer on a side of the first metal layer facing away from the substrate;

[0032] The patterned insulating layer forms a plurality of first via holes located in the transition region;

[0033] The step of forming an isolation structure material layer on one side of the substrate includes:

[0034] forming an isolation structure material layer on the side of the insulating layer facing away from the substrate and in the first via hole;

[0035] The step of patterning the isolation structure material layer includes: patterning the isolation structure material layer to form a plurality of first isolation parts located in the transition zone, two adjacent first isolation parts are spaced apart and enclosed to form an isolation opening, and each first isolation part is conductively connected to the first sub-part through a first via hole so that each first isolation part is conductively connected through the first sub-part.

[0036] According to an embodiment of the present application, the step of forming a first metal layer on one side of the substrate includes: forming the first metal layer on one side of the substrate, the metal activity of the material of the first sublayer being greater than the metal activity of the material of the first metal layer, and patterning the first metal layer to form a first sub-portion located in the transition region and a second sub-portion located in the first region;

[0037] The step of patterning the insulating layer to form a first via hole located in the transition region further includes: removing at least a portion of the insulating layer located in the first region to expose the second sub-portion;

[0038] Before the step of forming an isolation structure material layer on the side of the insulating layer away from the substrate and in the first via hole, the step further includes: forming a protection portion on the side of the second sub-portion away from the substrate.

[0039] According to an embodiment of the present application, the step of forming an isolation structure material layer on the side of the insulating layer away from the substrate and in the first via hole also includes: forming an isolation structure material layer in the first region, the isolation structure material layer covers the side of the protection portion away from the substrate, and the isolation structure material layer fills between two adjacent second sub-portions, between two adjacent protection portions, and around the first region, and the isolation structure material layer in the transition region is connected to the isolation structure material layer on the side of the first region;

[0040] The step of patterning the isolation structure material layer also includes: forming a plurality of second isolation portions located on the peripheral side of the first region and a third isolation portion located on the side of the protection portion away from the second sub-portion, exposing at least a portion of the side wall of the second sub-portion along a direction perpendicular to the thickness of the display panel, the plurality of third isolation portions are interconnected, and at least one third isolation portion is connected to the first isolation portion through the second isolation portion.

[0041] According to an embodiment of the present application, the step of forming a protection portion on a side of the second sub-portion facing away from the substrate includes:

[0042] forming a protective material layer on the display area, the side of the insulating layer facing away from the substrate, the side of each second sub-section facing away from the substrate, and between two adjacent second sub-sections;

[0043] The patterned protection material layer forms source and drain electrodes located in the display area and protection portions located at a side of each second sub-portion away from the substrate.

[0044] An embodiment of the third aspect of the present application further provides a display device, comprising the display panel in any of the above embodiments or a display panel prepared by the manufacturing method of the display panel in any of the above embodiments of the second aspect.

[0045] In the embodiment of the present application, the isolation structure blocks water, oxygen, etc. in the first area, reduces the water, oxygen, etc. entering from the first area to reach the display area of ​​the display panel through the transition area, thereby improving the display quality of the display panel. The orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate. When the light-emitting layer and the electrode layer are prepared, the material of the light-emitting layer and the material of the electrode layer have a large drop at the edge of the isolation structure, and the first sublayer is concave relative to the second sublayer. The material of the light-emitting layer and the material of the electrode layer are difficult to connect at the edge of the isolation structure, thereby causing a break. When the encapsulation layer is prepared on the material of the electrode layer, the encapsulation layer can overlap with at least part of the isolation structure to improve the encapsulation effect, and reduce water, oxygen, etc. from entering the display area through any side of the material of the light-emitting layer or the material of the electrode layer. The first sublayer includes a metal material, and the first sublayer is side-engraved by a primary battery reaction in a developer. In the primary battery reaction, a positive electrode of the primary battery reaction is formed in the first area, which accelerates the etching rate of the developer on the first sublayer, increases the first spacing a, and facilitates the material of the light-emitting layer and the material of the electrode layer to break at the edge of the isolation structure, thereby improving the performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0047] Figure 1 is a structural schematic diagram of a display panel provided in an embodiment of the present application;

[0048] Figure 2 is a schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0049] Figure 3 is a structural schematic diagram of another display panel provided in an embodiment of the present application;

[0050] Figure 4 yes Figure 3 Cross-section at AA;

[0051] Figure 5 is a structural schematic diagram of another display panel provided in an embodiment of the present application;

[0052] Figure 6 yes Figure 3 Cross-section at the middle BB;

[0053] Figure 7 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0054] Figure 8 is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present application;

[0055] Figures 9 to 15 It is a schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application.

[0056] Explanation of the figure marks: 10, first region; 20, display area; 30, transition zone; 100, substrate; 200, first metal layer; 210, first sub-section; 220, second sub-section; 300, insulating layer; 301, first via; 400, isolation structure; 401, first sub-layer; 402, second sub-layer; 403, third sub-layer; 410, isolation opening; 420, isolation structure material layer; 430, first isolation section; 450, third isolation section; 460, second isolation section; 500, protective material layer; 510, protective section. DETAILED DESCRIPTION

[0057] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0058] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0059] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0060] like Figure 1 and Figure 2 As shown, a display panel provided by an embodiment of the first aspect of the present application includes: a first area 10 and a display area 20, and a transition area 30 located between the display area 20 and the first area 10; the display panel also includes: a substrate 100 and at least one isolation structure 400, the isolation structure 400 is arranged on one side of the substrate 100 and is located in the transition area 30, the isolation structure 400 has an isolation opening 410 facing and / or away from the display area 20, the isolation structure 400 includes a first sublayer 401 and a second sublayer 402 arranged in sequence along a direction away from the substrate 100, the orthographic projection of the first sublayer 401 on the substrate 100 is located within the orthographic projection of the second sublayer 402 on the substrate 100, and the edges of the first sublayer 401 and the second sublayer 402 of each isolation structure 400 facing the same isolation opening 410 have a first spacing a between the orthographic projections of the substrate 100, and the first spacing a ranges from 260 nanometers to 350 nanometers.

[0061] In this embodiment, the isolation structure 400 blocks water, oxygen, etc. in the first area 10, and reduces the water, oxygen, etc. entering from the first area 10 to reach the display area 20 of the display panel through the transition area 30, thereby improving the display quality of the display panel. The orthographic projection of the first sublayer 401 on the substrate 100 is located within the orthographic projection of the second sublayer 402 on the substrate 100, the area of ​​the second sublayer 402 is larger than the area of ​​the first sublayer 401, and the second sublayer 402 covers the surface of the first sublayer 401 close to the second sublayer 402. At this time, the first sublayer 401 is concave relative to the second sublayer 402 in the direction away from the isolation opening 410. When the light-emitting layer and the electrode layer are prepared, the material of the light-emitting layer and the material of the electrode layer have a large drop at the edge of the isolation structure 400, and the first sublayer 401 is concave relative to the second sublayer 402. The material of the light-emitting layer and the material of the electrode layer are difficult to connect at the edge of the isolation structure 400, so that they are broken, and there is no need to use a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost. Therefore, when preparing the encapsulation layer on the material of the electrode layer, the encapsulation layer can overlap with at least part of the isolation structure 400 to improve the encapsulation effect and reduce water, oxygen, etc. from entering the display area 20 through any side of the material of the light-emitting layer or the material of the electrode layer. The first sublayer 401 includes a metal material, and the first sublayer 401 is side-etched by a galvanic cell reaction in a developer, so that the positive projection of the first sublayer 401 on the substrate 100 is located within the positive projection of the second sublayer 402 on the substrate 100. In the galvanic cell reaction, the positive electrode of the galvanic cell reaction is formed in the first region 10, the etching rate of the developer on the first sublayer 401 is accelerated, the first spacing a is increased, and the material of the light-emitting layer and the material of the electrode layer are facilitated to break at the edge of the isolation structure 400. The first spacing a can be 260 nanometers, 280 nanometers, 300 nanometers, 320 nanometers, 340 nanometers, 350 nanometers, etc., to improve the water and oxygen blocking effect of the display panel and improve the performance of the display panel.

[0062] like Figure 2 As shown, in some optional embodiments, the display panel also includes: a first metal layer 200 and an insulating layer 300, the first metal layer 200 is arranged on one side of the substrate 100, and the first metal layer 200 includes a first sub-portion 210 located in the transition zone 30; the insulating layer 300 is arranged on the side of the first metal layer 200 away from the substrate 100, and the insulating layer 300 is provided with a plurality of first vias 301 located in the transition zone 30; the isolation structure 400 includes a plurality of first isolation portions 430 arranged on the side of the insulating layer 300 away from the substrate 100, the plurality of first isolation portions 430 enclose a plurality of isolation openings 410, and each first isolation portion 430 is conductively connected to the first sub-portion 210 through the first via 301, so that each first isolation portion 430 located on the side of the insulating layer 300 away from the substrate 100 is conductively connected through the first sub-portion 210.

[0063] In these optional embodiments, the isolation structure 400 is disposed on the insulating layer 300, and two adjacent first isolation portions 430 are spaced apart to form an isolation opening 410. The insulating layer 300 is provided with a first via hole 301 located in the transition zone 30. Each isolation structure 400 is electrically connected to the first sub-portion 210 through the first via hole 301, so that each first isolation portion 430 is conductively connected through the first sub-portion 210 to form a negative electrode of the primary battery reaction, so as to facilitate side engraving of multiple first isolation portions 430 in a developer.

[0064] In some optional embodiments, the first sub-layer 401 includes a first metal material, the first metal layer 200 includes a second metal material, and the metal activity of the first metal material is greater than the metal activity of the second metal material.

[0065] In these optional embodiments, Figure 3 and Figure 4 As shown, the first metal layer 200 forms a second sub-section 220 located in the first region 10, and the first sub-section 210 and the second sub-section 220 both include a second metal material, so that the first sub-section 210 and the second sub-section 220 can be formed in the same process, thereby simplifying the preparation process. The metal activity of the first metal material is greater than the metal activity of the second metal material of the second sub-section 220. The second sub-section 220, as the positive electrode of the primary battery reaction, is conducive to accelerating the side etching rate of the first sub-layer 401, increasing the first spacing, and facilitating the material of the light-emitting layer and the material of the electrode layer to break at the edge of the isolation structure 400, thereby improving the water and oxygen barrier effect of the display panel.

[0066] like Figure 2 As shown, in some optional embodiments, the isolation structure 400 further includes a third sublayer 403 , and the third sublayer 403 is located on a side of the first sublayer 401 facing the substrate 100 .

[0067] In these optional embodiments, the third sub-layer 403 includes a metal material, and the metal activity of the material of the third sub-layer 403 is weaker than the metal activity of the first metal material, thereby facilitating the acceleration of the side etching rate of the first sub-layer 401 .

[0068] Optional, such as Figure 2 As shown, since the metal activity of the material of the third sub-layer 403 is weaker than the metal activity of the first metal material, the side etching rate of the first sub-layer 401 is greater than that of the third sub-layer 403, so that the orthographic projection of the first sub-layer 401 on the substrate 100 is located within the orthographic projection of the third sub-layer 403 on the substrate 100.

[0069] Optionally, the material of the first sub-layer 401 includes aluminum.

[0070] Optionally, the material of the first metal layer 200 includes molybdenum.

[0071] Optionally, the material of the second sub-layer 402 includes titanium.

[0072] Optionally, the material of the third sublayer 403 includes titanium.

[0073] like Figures 1 to 3 As shown, in some optional embodiments, the first region 10 includes a hole region, the transition region 30 and the display region 20 are arranged around the first region 10, and the first isolation portion 430 located in the transition region 30 is arranged around the hole region.

[0074] In these optional embodiments, the hole area of ​​the first region 10 will be removed during the preparation of the display panel, and the second sub-portion 220 is arranged in the hole area to form a galvanic cell reaction with the first sub-layer 401 to increase the side engraving rate of the first sub-layer 401, and at the same time, it can reduce the occupation of the second sub-portion 220 in the display area 20, which is beneficial to improve the resolution of the display panel. Optionally, the hole area can be used to accommodate a camera.

[0075] Optional, such as Figure 3 As shown, each first isolation portion 430 located in the transition area 30 is arranged around the first area 10 , and the orthographic projection of the first isolation portion 430 on the substrate 100 is annular, thereby reducing the water, oxygen, etc. in the first area 10 from entering the display area 20 through the transition area 30 .

[0076] Optional, such as Figure 2 and Figure 3 As shown, each first isolation portion 430 is arranged in sequence along a direction away from the hole area, thereby further improving the barrier effect of the first isolation portion 430 against water and oxygen.

[0077] Optional, such as Figure 2 and Figure 3 As shown, the first sub-portion 210 is arranged around the first region 10 , and the orthographic projection of the first sub-portion 210 on the substrate 100 at least partially overlaps with the orthographic projection of the first isolation portion 430 on the substrate 100 , so that the first isolation portion 430 is connected to the first sub-portion 210 through the first via 301 .

[0078] Optional, such as Figure 2 and Figure 3 As shown, there are multiple first sub-sections 210, and the multiple first sub-sections 210 are arranged in sequence along the direction away from the hole area, and two adjacent first sub-sections 210 are connected. Each first isolation section 430 is correspondingly connected to each first sub-section 210, and two adjacent first sub-sections 210 are connected so that each first isolation section 430 is conductively connected.

[0079] like Figure 5 and Figure 6As shown, in some optional embodiments, the first region 10 includes a border area, the border area is arranged around the display area 20, the first metal layer 200 includes a second sub-portion 220 located in the border area, the second sub-portion 220 includes a second metal material, and the first isolation portion 430 is electrically connected to the second sub-portion 220.

[0080] In these optional embodiments, the first isolating portion 430 is electrically connected to the second sub-portion 220 , and the first isolating portion 430 and the second sub-portion 220 respectively constitute the negative electrode and the positive electrode in the galvanic cell reaction, thereby improving the side wall rate of the first isolating portion 430 .

[0081] Optional, such as Figure 5 and Figure 6 As shown, a protection portion 510 is provided on the side of the second sub-portion 220 facing away from the substrate 100, and the orthographic projection of the protection portion 510 on the substrate 100 at least partially overlaps with the orthographic projection of the second sub-portion 220 on the substrate 100. The protection portion 510 can reduce the etching damage to the second sub-portion 220 caused by other etching processes, so as to improve the side wall rate of the first isolation portion 430.

[0082] Optionally, the display area 20 includes source-drain electrodes, and the source-drain electrodes are made of the same material as the protection portion 510 , so that the source-drain electrodes and the protection portion 510 can be prepared and formed in the same process step.

[0083] like Figure 6 As shown, in some optional embodiments, the isolation structure 400 also includes a second isolation portion 460 disposed on one side of the substrate 100 , the second isolation portion 460 is located on the side of the first isolation portion 430 facing the first region 10 , and the first isolation portion 430 is electrically connected to the second isolation portion 460 .

[0084] In these optional embodiments, the first isolation portion 430 is connected to the second isolation portion 460 , and the second isolation portion 460 is located on the side of the first isolation portion 430 facing the first region 10 , so that the first isolation portion 430 is electrically connected to the second sub-portion 220 .

[0085] Optional, such as Figure 6 As shown, the isolation structure 400 also includes a third isolation portion 450, at least a portion of the third isolation portion 450 is arranged on the side of each protection portion 510 away from the substrate 100, and the second isolation portion 460 is electrically connected to the second sub-portion 220 through the protection portion 510, so that the first isolation portion 430 is electrically connected to the second sub-portion 220 through the second isolation portion 460, the third isolation portion 450 and the protection portion 510, forming a primary battery reaction.

[0086] Optional, such as Figure 6As shown, the first metal layer 200 includes a plurality of second sub-portions 220, and each protection portion 510 is electrically connected to the third isolation portion 450 on the side facing away from the second sub-portion 220. The second sub-portions 220 are electrically connected through the third isolation portion 450 to form the positive electrode in the primary battery reaction. Arranging a plurality of second sub-portions 220 is beneficial to accelerating the side etching rate of the first isolation portion 430.

[0087] Optional, such as Figure 6 As shown, at least one third isolation portion 450 extends to one side of the substrate 100 and is connected to the second isolation portion 460 to achieve electrical connection with the first isolation portion 430 .

[0088] The second aspect of the present application also provides a method for manufacturing a display panel, wherein the display panel includes a first region 10 and a display region 20, and a transition region 30 between the display region 20 and the first region 10. Figure 7 As shown, the manufacturing method comprises the following steps:

[0089] Step S01: Fig.12 As shown, an isolation structure material layer 420 is formed on one side of the substrate 100 .

[0090] Step S02: Fig.13 As shown, the isolation structure material layer 420 is patterned to form at least one isolation structure 400 located in the transition area 30 , and the isolation structure 400 has an isolation opening 410 on a side facing and / or away from the display area 20 .

[0091] Step S03: Figure 4 As shown, an isolation structure 400 is side-etched by a developer, and the isolation structure 400 includes a first sublayer 401 and a second sublayer 402 arranged in sequence along a direction away from the substrate 100, and the orthographic projection of the first sublayer 401 on the substrate 100 is located within the orthographic projection of the second sublayer 402 on the substrate 100, and the edges of the first sublayer 401 and the second sublayer 402 of each isolation structure 400 facing the same isolation opening 410 have a first spacing a between the orthographic projections of the substrate 100, and the first spacing a is 260 nanometers to 350 nanometers.

[0092] In this embodiment, the isolation structure 400 blocks water, oxygen, etc. in the first area 10, and reduces the water, oxygen, etc. entering from the first area 10 to reach the display area 20 of the display panel through the transition area 30, thereby improving the display quality of the display panel. The orthographic projection of the first sublayer 401 on the substrate 100 is located within the orthographic projection of the second sublayer 402 on the substrate 100, the area of ​​the second sublayer 402 is larger than the area of ​​the first sublayer 401, and the second sublayer 402 covers the surface of the first sublayer 401 close to the second sublayer 402. At this time, the first sublayer 401 is concave relative to the second sublayer 402 in the direction away from the isolation opening 410. When the light-emitting layer and the electrode layer are prepared, the material of the light-emitting layer and the material of the electrode layer have a large drop at the edge of the isolation structure 400, and the first sublayer 401 is concave relative to the second sublayer 402. The material of the light-emitting layer and the material of the electrode layer are difficult to connect at the edge of the isolation structure 400, so that they are broken, and there is no need to use a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost. Therefore, when preparing the encapsulation layer on the material of the electrode layer, the encapsulation layer can overlap with at least part of the isolation structure 400 to improve the encapsulation effect and reduce water, oxygen, etc. from entering the display area 20 through any side of the material of the light-emitting layer or the material of the electrode layer. The first sublayer 401 includes a metal material, and the first sublayer 401 is side-etched by a galvanic cell reaction in a developer, so that the positive projection of the first sublayer 401 on the substrate 100 is located within the positive projection of the second sublayer 402 on the substrate 100. In the galvanic cell reaction, the positive electrode of the galvanic cell reaction is formed in the first region 10, the etching rate of the developer on the first sublayer 401 is accelerated, the first spacing a is increased, and the material of the light-emitting layer and the material of the electrode layer are facilitated to break at the edge of the isolation structure 400. The first spacing a can be 260 nanometers, 280 nanometers, 300 nanometers, 320 nanometers, 340 nanometers, 350 nanometers, etc., to improve the water and oxygen blocking effect of the display panel and improve the performance of the display panel.

[0093] Before step S01, Figure 8 As shown, the manufacturing method further includes: step S11: Fig. 9 As shown, a first metal layer 200 is formed on one side of the substrate 100 , and the first metal layer 200 includes a first sub-portion 210 located in the transition region 30 .

[0094] Step S12: Fig.10 As shown, an insulating layer 300 is formed on a side of the first metal layer 200 facing away from the substrate 100 .

[0095] Step S13: Fig.11 As shown, the patterned insulating layer 300 forms a plurality of first via holes 301 located in the transition region 30 .

[0096] In step S01, it includes: step S14: Fig.12As shown, an isolation structure material layer 420 is formed on the side of the insulation layer 300 facing away from the substrate 100 and in the first via hole 301 .

[0097] In step S02, it includes: step S15: Fig.13 As shown, the patterned isolation structure material layer 420 forms a plurality of first isolation portions 430 located in the transition zone 30, and two adjacent first isolation portions 430 are spaced apart and enclosed to form an isolation opening 410, and each first isolation portion 430 is conductively connected to the first sub-portion 210 through the first via 301 so that each first isolation portion 430 is conductively connected to the first sub-portion 210 through the first via 301.

[0098] In this embodiment, the first isolation portion 430 is arranged on the insulating layer 300, and two adjacent first isolation portions 430 are spaced apart to form an isolation opening 410. The first isolation portion 430 blocks water, oxygen, etc. in the first area 10, thereby reducing the amount of water, oxygen, etc. entering from the first area 10 through the transition area 30 to reach the display area 20 of the display panel, thereby improving the display quality of the display panel.

[0099] When forming the first sublayer 401 and the second sublayer 402, the insulating layer 300 is provided with a first via hole 301 located in the transition zone 30, and each first isolation portion 430 is electrically connected to the first sub-portion 210 through the first via hole 301, so that each first isolation portion 430 is conductively connected through the first sub-portion 210 to form a negative electrode of the primary battery reaction, thereby accelerating the side etching rate of the developer on the first sublayer 401 to increase the first spacing a.

[0100] In some optional embodiments, in step S11, it includes: Fig. 9 As shown, a first metal layer 200 is formed on one side of the substrate 100 , the metal activity of the material of the first sublayer 401 is greater than the metal activity of the material of the first metal layer 200 , and the first metal layer 200 is patterned to form a first sub-portion 210 located in the transition zone 30 and a second sub-portion 220 located in the first region 10 .

[0101] In step S13, it also includes: Fig.11 As shown, at least a portion of the insulating layer 300 located in the first region 10 is removed to expose the second sub-portion 220 .

[0102] Before step S14, the method further includes: Fig.15 As shown, a protection portion 510 is formed on a side of the second sub-portion 220 facing away from the substrate 100 .

[0103] In these optional embodiments, the first sub-section 210 and the second sub-section 220 are formed in the same process step, which is conducive to simplifying the preparation process. The metal activity of the material of the first sub-layer 401 is greater than the metal activity of the material of the second sub-section 220. When the isolation structure 400 is etched by the developer, each first isolation section 430 is electrically connected to the first sub-section 210 through the first via 301, so that each first isolation section 430 is conductively connected through the first sub-section 210 to form the negative electrode of the galvanic cell reaction, and the second sub-section 220 forms the positive electrode of the galvanic cell reaction, accelerating the side etching rate of the developer on the first sub-layer 401 to increase the first spacing, so that the material of the light-emitting layer and the material of the electrode layer are broken at the edge of the isolation structure 400, and the barrier ability of the first isolation section 430 to water and oxygen is improved. A protective portion 510 is formed on the side of the second sub-section 220 away from the substrate 100, and the protective portion 510 can reduce the etching damage to the second sub-section 220 caused by other etching processes.

[0104] In some optional embodiments, step S14 further includes: forming an isolation structural material layer 420 in the first region 10, the isolation structural material layer 420 covers the side of the protection portion 510 facing away from the substrate 100, and the isolation structural material layer 420 fills between two adjacent second sub-portions 220, between two adjacent protection portions 510 and around the first region 10, and the isolation structural material layer 420 in the transition zone 30 is connected to the isolation structural material layer 420 on the side around the first region 10.

[0105] In step S15, it also includes: Fig.13 As shown, a plurality of second isolation portions 460 located on the peripheral side of the first region 10 and a third isolation portion 450 located on the side of the protection portion 510 away from the second sub-portion 220 are formed, exposing at least a portion of the side wall of the second sub-portion 220 along a direction perpendicular to the thickness of the display panel, and the plurality of third isolation portions 450 are interconnected, and at least one third isolation portion 450 is connected to the first isolation portion 430 through the second isolation portion 460.

[0106] In these optional embodiments, the isolation structure material layer 420 is continuously arranged as a whole layer, and the isolation structure material layer 420 covers the side of the protection part 510 facing away from the substrate 100, and the isolation structure material layer 420 fills between two adjacent second sub-parts 220, between two adjacent protection parts 510, and around the first area 10, and the isolation structure material layer 420 of the transition area 30 is connected to the isolation structure material layer 420 around the first area 10. The isolation structure material layer 420 located in the first area 10 is patterned to form a plurality of third isolation parts 450 and second isolation parts 460, exposing at least part of the side wall of the second sub-part 220 along the direction perpendicular to the thickness of the display panel so that the second sub-part 220 can contact the developer to react with the galvanic battery, and the plurality of third isolation parts 450 are respectively located on the side of each protection part 510 facing away from the substrate 100, and the plurality of third isolation parts 450 are connected to each other, so that the plurality of second sub-parts 220 are electrically connected to each other to form electrodes in the galvanic battery reaction, thereby increasing the reaction rate. The second isolation part 460 is located on the peripheral side of the first region 10, at least one third isolation part 450 is connected to the second isolation part 460, and the second isolation part 460 is connected to the first isolation part 430, so that the first isolation part 430 is electrically connected to the second sub-part 220 through the second isolation part 460 and the third isolation part 450, forming a primary battery reaction and improving the side etching rate of the isolation structure 400.

[0107] In some optional embodiments, the step of forming the protection portion 510 on the side of the second sub-portion 220 facing away from the substrate 100 includes:

[0108] like Fig.14 As shown, a protective material layer 500 is formed in the display area 20 , on the side of the insulating layer 300 facing away from the substrate 100 , on the side of each second sub-portion 220 facing away from the substrate 100 , and between two adjacent second sub-portions 220 .

[0109] like Fig.15 As shown, the patterned protection material layer 500 forms source and drain electrodes located in the display area 20 and a protection portion 510 located on a side of each second sub-portion 220 facing away from the substrate 100 .

[0110] In these optional embodiments, the protective material layer 500 constitutes the source-drain electrode and the protective part 510 located in the display area 20, which is conducive to simplifying the manufacturing process. In addition, the source-drain electrode and the protective part 510 include a conductive material, so that the second sub-part 220 can be electrically connected to the third isolation part 450 through the protective part 510 to form a primary battery.

[0111] The embodiment of the third aspect of the present application also provides a display device, including the display panel of any of the first or second aspects. Since the display device provided by the embodiment of the third aspect of the present application includes the display panel of any of the first or second aspects, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel of any of the first or second aspects, which will not be described in detail here.

[0112] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0113] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that: include: A first area and a display area, and a transition area between the display area and the first area; The display panel further includes: substrate; At least one isolation structure is arranged on one side of the substrate and located in the transition area, the isolation structure has an isolation opening facing and / or away from the display area, the isolation structure includes a first sublayer and a second sublayer arranged in sequence along a direction away from the substrate, the first sublayer includes a metal material, the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate, and the edges of the first sublayer and the second sublayer of each isolation structure facing the same isolation opening have a first spacing between the orthographic projections of the substrate, and the first spacing is 260 nanometers to 350 nanometers.

2. The display panel according to claim 1, characterized in that: The display panel further includes: A first metal layer, disposed on one side of the substrate, the first metal layer comprising a first sub-portion located in the transition region; an insulating layer, disposed on a side of the first sub-portion away from the substrate, the insulating layer being provided with at least one first via hole located in the transition region; The isolation structure includes a plurality of first isolation portions arranged on the side of the insulating layer away from the substrate, the plurality of first isolation portions enclose a plurality of isolation openings, and each of the first isolation portions is conductively connected to the first sub-portions through the first via holes, so that each of the first isolation portions located on the side of the insulating layer away from the substrate is conductively connected through the first sub-portions.

3. The display panel according to claim 2, characterized in that: The first sublayer includes a first metal material, the first metal layer includes a second metal material, and the metal activity of the first metal material is greater than the metal activity of the second metal material; Preferably, the isolation structure further comprises a third sublayer, and the third sublayer is located on a side of the first sublayer facing the substrate; Preferably, the orthographic projection of the first sub-layer on the substrate is located within the orthographic projection of the third sub-layer on the substrate; Preferably, the material of the first sublayer includes aluminum; Preferably, the material of the first metal layer includes molybdenum; Preferably, the material of the second sublayer includes titanium; Preferably, the material of the third sublayer includes titanium.

4. The display panel according to claim 3, characterized in that: The first region includes a hole region, the transition region and the display region are arranged at the periphery of the first region, and each of the first isolation portions located in the transition region is arranged around the hole region; Preferably, each of the first isolation parts located in the transition region is arranged around the first region, and the orthographic projection of the first isolation part on the substrate is annular; Preferably, each of the first isolation parts is arranged in sequence away from the hole area.

5. The display panel according to claim 4, characterized in that: The first sub-portion is arranged around the first region, and an orthographic projection of the first sub-portion on the substrate at least partially overlaps with an orthographic projection of the first isolation portion on the substrate; Preferably, there are a plurality of the first sub-sections, and the plurality of the first sub-sections are arranged in sequence along a direction away from the hole area, two adjacent first sub-sections are connected, and each of the first isolation sections is correspondingly connected to each of the first sub-sections.

6. The display panel according to claim 3, characterized in that: The first region includes a frame area, the frame area is arranged around the display area, the first metal layer includes a second sub-portion located in the frame area, the second sub-portion includes the second metal material, and the first isolation portion is electrically connected to the second sub-portion; Preferably, a protection portion is provided on a side of the second sub-portion facing away from the substrate, and an orthographic projection of the protection portion on the substrate at least partially overlaps with an orthographic projection of the second sub-portion on the substrate; Preferably, the display area includes source-drain electrodes, and the source-drain electrodes are made of the same material as the protective portion.

7. The display panel according to claim 6, characterized in that: The isolation structure further includes a second isolation portion disposed on one side of the substrate, the second isolation portion is located on a side of the first isolation portion facing the first region, and the first isolation portion is electrically connected to the second isolation portion; Preferably, the isolation structure further comprises a third isolation portion, at least part of which is arranged on a side of each protection portion away from the substrate, and the second isolation portion is electrically connected to the second sub-portion through the protection portion; Preferably, the first metal layer includes a plurality of the second sub-portions, and the third isolation portions on a side of each of the protection portions away from the second sub-portion are electrically connected; Preferably, at least one of the third isolation portions extends to one side of the substrate and is connected to the second isolation portion.

8. A method for manufacturing a display panel, characterized in that: The display panel comprises a first area and a display area, and a transition area between the display area and the first area; The manufacturing method comprises: forming an isolation structure material layer on one side of the substrate; Patterning the isolation structure material layer to form at least one isolation structure located in the transition area, wherein the isolation structure has an isolation opening facing and / or away from the display area; The isolation structure is engraved by a developer, and the isolation structure includes a first sublayer and a second sublayer arranged in sequence along a direction away from the substrate, the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate, and edges of the first sublayer and the second sublayer of the isolation structure facing the same isolation opening side have a first spacing between the orthographic projections of the substrate, and the first spacing is 260 nanometers to 350 nanometers.

9. The manufacturing method according to claim 8, characterized in that: Before the step of forming an isolation structure material layer on one side of the substrate, the method includes: forming a first metal layer on one side of the substrate, the first metal layer including a first sub-portion located in the transition region; forming an insulating layer on a side of the first metal layer facing away from the substrate; patterning the insulating layer to form a plurality of first via holes located in the transition region; The step of forming an isolation structure material layer on one side of the substrate includes: forming the isolation structure material layer on a side of the insulating layer away from the substrate and in the first via hole; The step of patterning the isolation structure material layer includes: patterning the isolation structure material layer to form a plurality of first isolation parts located in the transition zone, two adjacent first isolation parts are spaced apart and enclosed to form an isolation opening, and each first isolation part is conductively connected to the first sub-part through the first via hole so that each first isolation part is conductively connected to the first sub-part through the first sub-part.

10. The manufacturing method according to claim 9, characterized in that: The step of forming a first metal layer on one side of the substrate includes: forming a first metal layer on one side of the substrate, wherein the metal activity of the material of the first sub-layer is greater than the metal activity of the material of the first metal layer, and patterning the first metal layer to form a first sub-portion located in the transition region and a second sub-portion located in the first region; The step of patterning the insulating layer to form a first via hole located in the transition region further includes: removing at least a portion of the insulating layer located in the first region to expose the second sub-portion; Before the step of forming an isolation structure material layer on the side of the insulating layer away from the substrate and in the first via hole, the step further includes: forming a protection portion on the side of the second sub-portion away from the substrate.

11. The manufacturing method according to claim 10, characterized in that: The step of forming an isolation structure material layer on the side of the insulating layer away from the substrate and in the first via hole also includes: forming the isolation structure material layer in the first region, the isolation structure material layer covers the side of the protection portion away from the substrate, and the isolation structure material layer fills between two adjacent second sub-portions, between two adjacent protection portions and around the first region, and the isolation structure material layer in the transition region is connected to the isolation structure material layer around the first region; The step of patterning the isolation structure material layer also includes: forming a plurality of second isolation portions located on the peripheral side of the first region and a third isolation portion located on the side of the protection portion away from the second sub-portion, exposing at least a portion of the side wall of the second sub-portion along a direction perpendicular to the thickness of the display panel, the plurality of third isolation portions are interconnected, and at least one of the third isolation portions is connected to the first isolation portion through the second isolation portion.

12. The manufacturing method according to claim 10, characterized in that: The step of forming a protection portion on a side of the second sub-portion facing away from the substrate includes: forming a protective material layer on the display area, on the side of the insulating layer facing away from the substrate, on the side of each second sub-section facing away from the substrate, and between two adjacent second sub-sections; The protective material layer is patterned to form source and drain electrodes located in the display area and protective portions located on a side of each second sub-portion away from the substrate.

13. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 7, or a display panel manufactured by the method for manufacturing a display panel according to any one of claims 8 to 12.

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