Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate, an isolation structure, a light-emitting layer, a first packaging layer and a light-transmitting protection layer. The isolation structure is arranged on the substrate and encloses a plurality of isolation openings. The first packaging layer comprises packaging parts which are mutually spaced, and at least parts of the packaging parts are located in the isolation openings so as to package the light-emitting units. The light-transmitting protection layer comprises light-transmitting protection parts which are arranged at intervals, and the orthographic projection of the packaging part on the substrate is located in the orthographic projection of the light-transmitting protection parts on the substrate. When the first packaging layer is prepared, the prepared packaging part is covered by the light-transmitting protection part, and when other packaging parts are subsequently prepared, the light-transmitting protection part made of a metal material can protect the prepared packaging part from being subjected to dry etching, so that the condition that the prepared packaging part is damaged by a dry etching process when the other packaging parts are subsequently prepared is avoided, and the reliability of the first packaging layer is improved; and the use performance of the OLED display panel is improved.

Description

Technical Field

[0001] The present application relates to the display field, and in particular to a display panel, a display device and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, aiming to improve the performance of OLED display products.

[0005] A first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening; a light-emitting layer located on one side of the substrate, the light-emitting layer comprising a light-emitting unit located at the isolation opening; a first encapsulation layer located on a side of the light-emitting layer away from the substrate, the first encapsulation layer comprising a plurality of encapsulation parts spaced apart from each other and used to encapsulate each light-emitting unit, at least part of the encapsulation parts being located at the isolation opening; a light-transmitting protective layer located on a side of the first encapsulation layer away from the substrate, the light-transmitting protective layer comprising a plurality of light-transmitting protective parts spaced apart from each other, at least part of the encapsulation parts having an orthographic projection on the substrate being located within the orthographic projection of the light-transmitting protective parts on the substrate.

[0006] According to an implementation of the first aspect of the present application, the material of the light-transmitting protection portion includes a light-transmitting metal material.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the transmittance of the light-transmitting protection portion is 95% to 100%.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, a dimension of the light-transmitting protection portion in the thickness direction of the display panel is smaller than a dimension of the packaging portion in the thickness direction of the display panel.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, a dimension of the light-transmitting protection portion in a thickness direction of the display panel is 0.01 μm to 0.03 μm.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the light-transmitting protection portion is multiplexed as a signal shielding portion, and the light-transmitting protection portion is connected to a fixed potential.

[0011] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes: a conductive layer located on a side of the light-transmitting protective layer away from the substrate, and the light-transmitting protective layer is electrically connected to the conductive layer.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive layer is electrically connected to the isolation structure.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the conductive layer is the same as the material of the light-transmitting protective part.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the transmittance of the conductive layer is 95% to 100%.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, a size of the conductive layer in the thickness direction of the display panel is 0.01 μm to 0.03 μm.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first encapsulation layer includes an inorganic material.

[0017] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes: a second encapsulation layer located on a side of the first encapsulation layer away from the substrate; and a third encapsulation layer located on a side of the second encapsulation layer away from the substrate.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the second encapsulation layer includes an organic material.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the third encapsulation layer includes an inorganic material.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes: a first electrode layer located between the light-emitting layer and the first encapsulation layer, the first electrode layer including a first electrode located in the isolation opening, and the first electrode is electrically connected to the isolation structure.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of each light-emitting unit on the substrate is located within the orthographic projection of each first electrode on the substrate.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting unit and the isolation structure are spaced apart.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first layer and a second layer, the second layer is located on a side of the first layer facing away from the substrate, and the first electrode is electrically connected to the first layer.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the second layer includes a conductive material or an insulating material.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the second layer includes a metal material, and the materials of the first layer and the second layer are different.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a third layer located on the side of the first layer facing the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes: a pixel definition layer located on the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the orthographic projection of the pixel opening on the substrate and the orthographic projection of the isolation opening on the substrate at least partially overlap.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel defining portion is disposed on a side of the isolation structure facing the substrate.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a second electrode, which is located between the substrate and the pixel definition layer, and the orthographic projection of the second electrode on the substrate at least partially overlaps with the orthographic projection of the pixel opening on the substrate.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the second electrode on the substrate.

[0033] According to a second aspect of the present application, there is provided a display panel, which comprises: a substrate; a pixel definition layer located on the substrate, the pixel definition layer comprising a pixel defining portion and a pixel opening formed by the pixel defining portion; a light-emitting layer located on one side of the substrate, the light-emitting layer comprising a light-emitting unit located at the pixel opening; a first encapsulation layer located on a side of the light-emitting layer away from the substrate, the first encapsulation layer comprising a plurality of encapsulation portions spaced apart from each other and used to encapsulate each light-emitting unit, at least part of the encapsulation portions being located at the pixel opening; a light-transmitting protective layer located on a side of the first encapsulation layer away from the substrate, the light-transmitting protective layer comprising a plurality of light-transmitting protective portions spaced apart from each other, and at least part of the encapsulation portions having an orthographic projection on the substrate being located within the orthographic projection of the light-transmitting protective portion on the substrate.

[0034] According to an implementation of the second aspect of the present application, the material of the light-transmitting protection portion includes a light-transmitting metal material.

[0035] According to any of the aforementioned embodiments of the second aspect of the present application, the transmittance of the light-transmitting protection portion is 95% to 100%.

[0036] According to any of the aforementioned embodiments of the second aspect of the present application, the display panel also includes: an isolation structure located on one side of the substrate, the isolation structure encloses an isolation opening, and the orthographic projection of the pixel opening on the substrate and the orthographic projection of the isolation opening on the substrate at least partially overlap.

[0037] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the light-transmitting protection part includes a light-transmitting metal material.

[0038] According to any of the aforementioned embodiments of the second aspect of the present application, a dimension of the light-transmitting protection portion in the thickness direction of the display panel is smaller than a dimension of the packaging portion in the thickness direction of the display panel.

[0039] According to any of the aforementioned embodiments of the second aspect of the present application, a dimension of the light-transmitting protection portion in the thickness direction of the display panel is 0.01 μm to 0.03 μm.

[0040] According to any of the aforementioned embodiments of the second aspect of the present application, the light-transmitting protection portion is multiplexed as a signal shielding portion, and the light-transmitting protection portion is connected to a fixed potential.

[0041] An embodiment of a third aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments.

[0042] An embodiment of a fourth aspect of the present application provides a method for preparing a display panel, the method comprising:

[0043] An isolation structure is prepared on the substrate, wherein the isolation structure encloses an isolation opening, and the isolation opening includes a first isolation opening;

[0044] Sequentially preparing a first light-emitting material layer, a first packaging material layer and a first light-transmitting metal material layer on a substrate;

[0045] The first light-emitting material layer, the first packaging material layer and the first light-transmitting metal material layer are patterned to obtain a first light-emitting unit, a first packaging part and a first light-transmitting protection part located at the first isolation opening, wherein the first packaging part is used to encapsulate the first light-emitting unit, and the orthographic projection of the first packaging part on the substrate is located within the orthographic projection of the first light-transmitting protection part on the substrate.

[0046] According to an implementation of the fourth aspect of the present application, the isolation opening further includes a second isolation opening spaced apart from the first isolation opening, and after the first light-emitting material layer, the first encapsulation material layer and the first light-transmitting metal material layer are patterned, the method further includes:

[0047] Sequentially preparing a second light-emitting material layer, a second packaging material layer, and a second light-transmitting metal material layer on the substrate;

[0048] The second light-emitting material layer, the second packaging material layer and the second light-transmitting metal material layer are patterned to obtain a second light-emitting unit, a second packaging part and a second light-transmitting protection part located at the second isolation opening, wherein the second packaging part is used to encapsulate the second light-emitting unit, and the orthographic projection of the second packaging part on the substrate is located within the orthographic projection of the second light-transmitting protection part on the substrate.

[0049] According to any of the aforementioned embodiments of the fourth aspect of the present application, the isolation opening further includes a third isolation opening spaced apart from the first isolation opening and the second isolation opening, and after the second light-emitting material layer, the second encapsulation material layer, and the second light-transmitting metal material layer are patterned, the method further includes:

[0050] sequentially preparing a third light-emitting material layer and a third encapsulation material layer on the substrate;

[0051] The third light-emitting material layer and the third encapsulation material layer are patterned to obtain a third light-emitting unit and a third encapsulation portion located at the third isolation opening, wherein the third encapsulation portion is used to encapsulate the third light-emitting unit.

[0052] According to any of the aforementioned embodiments of the fourth aspect of the present application, after the step of patterning the third light-emitting material layer and the third encapsulation material layer, the method further includes:

[0053] The first light-transmitting protection portion and the second light-transmitting protection portion are etched to remove the first light-transmitting protection portion and the second light-transmitting protection portion.

[0054] An embodiment of a fifth aspect of the present application provides a method for preparing a display panel, the method comprising:

[0055] A pixel definition layer is prepared on a substrate, wherein the pixel definition layer includes a pixel definition portion and a pixel opening formed by the pixel definition portion;

[0056] A light-emitting layer is prepared on a substrate, wherein the light-emitting layer includes a light-emitting unit located at a pixel opening;

[0057] A first encapsulation layer is prepared on a side of the light-emitting layer away from the substrate, wherein the first encapsulation layer includes a plurality of encapsulation parts which are arranged at intervals and used to encapsulate each light-emitting unit, and at least a portion of the encapsulation parts is located at a pixel opening;

[0058] A light-transmitting protective layer is prepared on the side of the first encapsulation layer away from the substrate. The light-transmitting protective layer includes a plurality of light-transmitting protective parts spaced apart from each other. The orthographic projections of at least some of the encapsulation parts on the substrate are located within the orthographic projections of the light-transmitting protective parts on the substrate.

[0059] According to the display panel of the embodiment of the present application, the display panel includes a substrate, an isolation structure, a light-emitting layer, a first encapsulation layer and a light-transmitting protective layer. The isolation structure is arranged on the substrate and encloses a plurality of isolation openings to separate the light-emitting layer to form mutually disconnected light-emitting units, thereby reducing the crosstalk of carriers in the light-emitting layer, improving the display effect of the display panel, and the preparation of the light-emitting unit does not require the use of a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost. The first encapsulation layer includes a plurality of encapsulation parts spaced apart from each other, and at least part of the encapsulation part is located in the isolation opening to encapsulate the light-emitting unit. The light-transmitting protective layer includes a plurality of light-transmitting protective parts spaced apart from each other, and at least part of the encapsulation part is located within the orthographic projection of the light-transmitting protective part on the substrate, that is, the encapsulation part is covered by the light-transmitting protective part, and the light-transmitting protective part is a light-transmitting material, which reduces the influence of the newly added light-transmitting protective layer on the light-emitting unit. When preparing the first encapsulation layer, the first prepared encapsulation part is covered by the light-transmitting protective part. When other encapsulation parts are subsequently prepared, the light-transmitting protective part can protect the first prepared encapsulation part from being dry-etched, thereby preventing the dry-etching process from damaging the first prepared encapsulation part when other encapsulation parts are subsequently prepared, thereby improving the reliability of the first encapsulation layer and enhancing the performance of the OLED display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0061] Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0062] Figure 2 is a partial top view of a display panel provided in an embodiment of the present application;

[0063] Figure 3 is a partial cross-sectional view of a display panel in another embodiment;

[0064] Figure 4 is a partial cross-sectional view of a display panel in yet another embodiment;

[0065] Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment;

[0066] Figure 6 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0067] Figures 7 to 10 is a diagram of a manufacturing process of a display panel provided in an embodiment of the present application;

[0068] Fig.11It is a schematic flow chart of a method for preparing a display panel provided by another embodiment.

[0069] Description of reference numerals:

[0070] 10. Display panel;

[0071] 100. Substrate;

[0072] 200, isolation structure; 210, first layer; 220, second layer; 230, third layer; 240, isolation opening; 241, first isolation opening; 242, second isolation opening; 243, third isolation opening;

[0073] 300, light-emitting layer; 310, light-emitting unit; 311, first light-emitting unit; 312, second light-emitting unit; 313, third light-emitting unit;

[0074] 400, first encapsulation layer; 410, encapsulation part; 411, first encapsulation part; 412, second encapsulation part; 413, third encapsulation part; 420, second encapsulation layer; 430, third encapsulation layer;

[0075] 500, first electrode layer; 510, first electrode;

[0076] 600, pixel definition layer; 610, pixel definition portion; 620, pixel opening; 630, second electrode;

[0077] 700, light-transmitting protective layer; 710, light-transmitting protective portion; 711, first light-transmitting protective portion; 712, second light-transmitting protective portion;

[0078] 800. Conductive layer. DETAILED DESCRIPTION

[0079] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0080] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0081] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0082] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. The embodiments of the display panel, the display device, and the method for manufacturing a display panel are described below in conjunction with the accompanying drawings.

[0083] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0084] Please also read Figure 1 and Figure 2 , Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application; Figure 2 It is a partial top view of a display panel provided in an embodiment of the present application.

[0085] like Figure 1 and Figure 2As shown, the first embodiment of the present application provides a display panel 10, which includes a substrate 100, an isolation structure 200, a light-emitting layer 300, a first encapsulation layer 400 and a light-transmitting protective layer 700; the isolation structure 200 is located on one side of the substrate 100, and the isolation structure 200 encloses an isolation opening 240; the light-emitting layer 300 is located on one side of the substrate 100, and the light-emitting layer 300 includes a light-emitting unit 310 located in the isolation opening 240; the first encapsulation layer 400 is located on the back of the light-emitting layer 300. On the side away from the substrate 100, the first encapsulation layer 400 includes a plurality of encapsulation parts 410 which are spaced apart from each other and are used to encapsulate each light-emitting unit 310, and at least part of the encapsulation parts 410 are located in the isolation opening 240; the light-transmitting protective layer 700 is located on the side of the first encapsulation layer 400 away from the substrate 100, and the light-transmitting protective layer 700 includes a plurality of light-transmitting protective parts 710 spaced apart from each other, and the orthographic projection of at least part of the encapsulation part 410 on the substrate 100 is located within the orthographic projection of the light-transmitting protective part 710 on the substrate 100.

[0086] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 200, a light-emitting layer 300, a first encapsulation layer 400 and a light-transmitting protective layer 700. The isolation structure 200 is arranged on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers in the light-emitting layer 300, improving the display effect of the display panel 10, and preparing the light-emitting unit 310 does not require the use of a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost. The first encapsulation layer 400 includes a plurality of encapsulation parts 410 spaced apart from each other, and at least part of the encapsulation part 410 is located in the isolation opening 240 to encapsulate the light-emitting unit 310. The light-transmitting protective layer 700 includes a plurality of light-transmitting protective portions 710 spaced apart from each other, and the orthographic projection of at least part of the encapsulation portion 410 on the substrate 100 is located within the orthographic projection of the light-transmitting protective portion 710 on the substrate 100, that is, the encapsulation portion 410 is covered by the light-transmitting protective portion 710, and the light-transmitting protective portion 710 is a light-transmitting material, which reduces the effect of the newly added light-transmitting protective layer 700 on the light emission of the light-emitting unit 310. When preparing the first encapsulation layer 400, the first-prepared encapsulation portion 410 is covered by the light-transmitting protective portion 710, and when preparing other encapsulation portions 410 later, the light-transmitting protective portion 710 can protect the first-prepared encapsulation portion 410 from being dry-etched, thereby preventing the dry-etching process from damaging the first-prepared encapsulation portion 410 when preparing other encapsulation portions 410 later, thereby improving the reliability of the first encapsulation layer 400 and improving the performance of the OLED display panel 10. For the composition, preparation and other contents of the isolation structure, please refer to patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, and 202310692671.8.

[0087] Optionally, the material of the light-transmitting protection portion 710 includes a light-transmitting metal material, for example, the material of the light-transmitting protection portion 710 is a metal oxide or a metal element or a metal alloy, for example, the material of the light-transmitting protection portion 710 includes indium tin oxide (ITO) or indium zinc oxide (IZO), or the material of the light-transmitting protection portion 710 includes magnesium, silver, magnesium-silver alloy, etc. There are many ways to set the substrate 100, and the substrate 100 may include, for example, a substrate and an array substrate disposed on the substrate. Or the substrate 100 is a substrate. Or the substrate 100 includes a buffer layer and a support plate on the side away from the substrate.

[0088] In some optional embodiments, the transmittance of the light-transmitting protection portion 710 is 95% to 100%, for example, the transmittance of the light-transmitting protection portion 710 is 95%, 97%, 98%, 100%, etc.

[0089] In these optional embodiments, the transmittance of the light-transmitting protection part 710 refers to the ratio of the amount of light transmitted through the light-transmitting protection part 710 to the amount of light incident on the light-transmitting protection part 710. The transmittance of the light-transmitting protection part 710 is greater than or equal to 95%, so as to avoid the light transmittance of the light-transmitting protection part 710 being too small, resulting in too little light passing through the light-emitting unit 310, that is, the light emitted by the light-emitting unit 310 is lost more after reaching the light-transmitting protection part 710, and the display effect of the display panel 10 is reduced. The amount of light incident on the light-transmitting protection part 710 should be less than the amount of light transmitted by the light-transmitting protection part 710, so the transmittance of the light-transmitting protection part 710 should be less than or equal to 100%.

[0090] In some optional embodiments, a dimension of the light-transmitting protection portion 710 in the thickness direction of the display panel 10 is smaller than a dimension of the encapsulation portion 410 in the thickness direction of the display panel 10 .

[0091] In these optional practical examples, the dimension of the light-transmitting protection part 710 in the thickness direction is the thickness of the light-transmitting protection part 710, and the dimension of the encapsulation part 410 in the thickness direction of the display panel 10 is the thickness of the encapsulation part 410. The thickness of the light-transmitting protection part 710 is less than the thickness of the encapsulation part 410. On the one hand, the thickness of the light-transmitting protection part 710 can be made thinner, and on the premise of protecting the encapsulation part 410, a better transmittance can be taken into account to ensure the display effect of the display panel 10. On the other hand, the thin thickness of the light-transmitting protection part 710 can improve the problem of increased overall film thickness of the display panel 10.

[0092] Optionally, the thickness of the light-transmitting protection part 710 is 0.01 μm to 0.03 μm, for example, the thickness of the light-transmitting protection part 710 is 0.01 μm, 0.015 μm, 0.02 μm, 0.03 μm, etc.

[0093] In these optional embodiments, the thickness of the light-transmitting protection part 710 is greater than or equal to 0.01 μm, which can improve the problem that the light-transmitting protection part 710 is easily damaged and difficult to protect the packaging part 410 due to the light-transmitting protection part 710 being too thin. The thickness of the light-transmitting protection part 710 is less than or equal to 0.03 μm, which can improve the problem that the transmittance of the light-transmitting protection part 710 is reduced due to the thickness of the light-transmitting protection part 710 being too large, affecting the display effect of the display panel 10, and can also improve the problem that the overall film thickness of the display panel 10 is increased due to the thickness of the light-transmitting protection part 710 being too large.

[0094] In some optional embodiments, the light-transmitting protection portion 710 is multiplexed as a signal shielding portion, and the light-transmitting protection portion 710 is connected to a fixed potential.

[0095] In these optional embodiments, the light-transmitting protection portion 710 is connected to a fixed potential and is located in the isolation opening 240 to isolate the circuit in the isolation opening 240 from the touch layer, that is, the light-transmitting protection layer 700 is reused as a signal shielding portion to shield the influence of the circuit in the isolation opening 240 on the touch layer. After the light-transmitting protection portion 710 is connected to a fixed potential, when the potential in the isolation opening 240 changes, it will not affect the potential of the light-transmitting protection portion 710, thereby improving the influence of the potential change in the isolation opening 240 on the touch signal.

[0096] See also Figure 3 , Figure 3 is a partial cross-sectional view of a display panel in another embodiment.

[0097] like Figure 3 As shown, in some optional embodiments, the display panel 10 further includes a conductive layer 800 , which is located on a side of the light-transmitting protection layer 700 away from the substrate 100 , and the light-transmitting protection portion 710 is electrically connected to the conductive layer 800 .

[0098] Optionally, the packaging parts 410 are spaced apart from each other to form a gap, and a portion of the conductive layer 800 is located in the gap and in contact with the isolation structure 200 .

[0099] In these optional embodiments, the conductive layer 800 is entirely covered with the light-transmitting protective layer 700 , so that the light-transmitting protective portion 710 is in contact and electrically connected with the conductive layer 800 , and the light-transmitting protective portion 710 is electrically connected to a fixed potential through the conductive layer 800 , thereby achieving a signal shielding effect of the light-transmitting protective portion 710 .

[0100] Optionally, the conductive layer 800 is electrically connected to the isolation structure 200. After the conductive layer 800 is deposited on the entire surface, part of the conductive layer 800 is deposited on the side of the isolation structure 200 away from the substrate 100, so that the conductive layer 800 is in contact and electrically connected with the isolation structure 200. The conductive layer 800 is electrically connected to the fixed potential through the isolation structure 200, so that the light-transmitting protection part 710 is electrically connected to the fixed potential. The conductive layer 800 can also be electrically connected to the fixed potential at other positions of the display panel 10 through vias. For example, optionally, the conductive layer 800 is electrically connected to the signal line of the substrate 100 in the non-display area of ​​the display panel 10. After the conductive layer 800 is electrically connected to the light-transmitting protection part 710, the resistance of the light-transmitting protection part 710 can be reduced, thereby reducing the voltage drop of the display panel 10.

[0101] Optionally, the material of the conductive layer 800 is the same as that of the light-transmitting protective part 710, that is, the resistivity of the two is the same. Since the conductive layer 800 is in contact and electrically connected with the light-transmitting protective part 710, when the conductive layer 800 is made of the same material as that of the light-transmitting protective part 710, the current uniformity of the conductive layer 800 and the light-transmitting protective part 710 is better and the potential is stable.

[0102] Optionally, the transmittance of the conductive layer 800 is 95% to 100%, for example, the transmittance of the conductive layer 800 is 95%, 97%, 98%, 100%, etc.

[0103] In these optional embodiments, the transmittance of the conductive layer 800 refers to the ratio of the amount of light transmitted through the conductive layer 800 to the amount of light incident on the conductive layer 800. The transmittance of the conductive layer 800 is greater than or equal to 95% to avoid the transmittance of the conductive layer 800 being too small, resulting in too little light passing through the light-emitting unit 310, that is, the light emitted by the light-emitting unit 310 is lost more after reaching the conductive layer 800, and the display effect of the display panel 10 is reduced. The amount of light incident on the conductive layer 800 should be less than the amount of light transmitted by the conductive layer 800, so the transmittance of the conductive layer 800 should be less than or equal to 100%.

[0104] Optionally, the size of the conductive layer 800 in the thickness direction of the display panel 10 is 0.01μm to 0.03μm, and the size of the conductive layer 800 in the thickness direction of the display panel 10 is the thickness of the conductive layer 800. For example, the thickness of the conductive layer 800 is 0.01μm, 0.015μm, 0.02μm, 0.03μm, etc.

[0105] In these optional embodiments, the thickness of the conductive layer 800 is greater than or equal to 0.01 μm, which can improve the problem that the conductive layer 800 is easily damaged and difficult to protect the encapsulation part 410 due to the thin thickness of the conductive layer 800. The thickness of the conductive layer 800 is less than or equal to 0.03 μm, which can improve the problem that the transmittance of the conductive layer 800 is reduced due to the thickness of the conductive layer 800 is too large, affecting the display effect of the display panel 10, and can also improve the problem that the overall film thickness of the display panel 10 is increased due to the thickness of the conductive layer 800 being too large.

[0106] In some optional embodiments, the material of the first encapsulation layer 400 includes an inorganic material.

[0107] In these optional embodiments, the first encapsulation layer 400 includes an inorganic material, which has good density and good barrier properties against water vapor and oxygen.

[0108] See also Figure 4 , Figure 4 is a partial cross-sectional view of a display panel in yet another embodiment.

[0109] like Figure 4 As shown, in some optional embodiments, the display panel 10 further includes a second encapsulation layer 420 and a third encapsulation layer 430 , the second encapsulation layer 420 being located on the side of the first encapsulation layer 400 away from the substrate 100 ; the third encapsulation layer 430 being located on the side of the second encapsulation layer 420 away from the substrate 100 .

[0110] In these optional embodiments, the display panel 10 adopts three-layer packaging, which has better packaging performance and reduces the possibility of water and oxygen intrusion.

[0111] Optionally, the material of the second encapsulation layer 420 includes an organic material.

[0112] Optionally, the material of the third encapsulation layer 430 includes inorganic material. The first encapsulation layer 400, the second encapsulation layer 420 and the third encapsulation layer 430 are respectively encapsulated with inorganic material, organic material and inorganic material to form a TFE (Thin Film Encapsulation, TFE) thin film encapsulation structure to further improve the encapsulation performance.

[0113] In some optional embodiments, the display panel 10 further includes a first electrode layer 500 , which is located between the light-emitting layer 300 and the first encapsulation layer 400 . The first electrode layer 500 includes a first electrode 510 located in the isolation opening 240 , and the first electrode 510 is electrically connected to the isolation structure 200 .

[0114] In these optional embodiments, the isolation structure 200 separates the first electrode layer 500 to form mutually spaced first electrodes 510 , and the mutually spaced first electrodes 510 are electrically connected through the isolation structure 200 to form a full-surface electrode, thereby ensuring normal light emission of the light-emitting unit 310 .

[0115] In some optional embodiments, the orthographic projection of each light emitting unit 310 on the substrate 100 is located within the orthographic projection of each first electrode 510 on the substrate 100 .

[0116] In these optional embodiments, the orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 510 on the substrate 100, that is, the first electrode 510 is arranged to cover the light-emitting unit 310 to serve as an electrode of the light-emitting unit 310, thereby ensuring normal light emission of the light-emitting unit 310 and improving the display effect of the display panel 10.

[0117] Optionally, the light emitting unit 310 is spaced apart from the isolation structure 200. The light emitting layer 300 and the isolation structure 200 are spaced apart, that is, the light emitting units 310 are spaced apart from each other, which reduces the crosstalk of carriers between the light emitting units 310 and improves the cross-color problem of the light emitting units 310.

[0118] In some optional embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 , the second layer 220 is located on a side of the first layer 210 facing away from the substrate 100 , and the first electrode 510 is electrically connected to the first layer 210 .

[0119] Optionally, the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100 .

[0120] In these optional embodiments, the first layer 210 and the second layer 220 are arranged to form an isolation structure 200, the orthographic projection of the first layer 210 arranged close to the substrate 100 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100, the area of ​​the second layer 220 is larger than the area of ​​the first layer 210, and the second layer 220 covers the surface of the first layer 210 close to the second layer 220, and at this time, the first layer 210 is recessed relative to the second layer 220 in a direction away from the isolation opening 240. When preparing the light-emitting layer 300, the light-emitting layer 300 has a large drop at the edge of the isolation structure 200, and the first layer 210 is recessed relative to the second layer 220, and the light-emitting layer 300 is difficult to connect at the edge of the isolation structure 200, so it breaks, and the light-emitting layer 300 breaks to form mutually disconnected light-emitting units 310.

[0121] In some optional embodiments, the second layer 220 includes a conductive material or an insulating material.

[0122] In these optional embodiments, the second layer 220 includes a conductive material, for example, the second layer 220 includes a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, the second layer 220 is difficult to be etched during wet etching of the first layer 210 using an etching solution, so that the first layer 210 is more easily concavely arranged relative to the second layer 220.

[0123] In some optional embodiments, the second layer 220 includes a metal material, and the first layer 210 and the second layer 220 are made of different materials.

[0124] In these optional embodiments, when both the first layer 210 and the second layer 220 are made of metal materials, the first layer 210 may be wet-etched with an etching solution, and the etching rate of the second layer 220 may be set to be lower than the etching rate of the first layer 210 by setting the etching solution. Since the etching rate of the first layer 210 is relatively high, when the etching solution is used for wet etching, even if the second layer 220 is etched to a certain extent, the first layer 210 is etched faster, so that the first layer 210 is set concave relative to the second layer 220.

[0125] See also Figure 5 , Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment.

[0126] like Figure 5 As shown, in some optional embodiments, the isolation structure 200 further includes a third layer 230 located on the side of the first layer 210 facing the substrate 100 , and the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the third layer 230 on the substrate 100 .

[0127] In these optional embodiments, in order to obtain the first layer 210 with a concave setting, the first layer 210 has a faster etching rate than the second layer 220 and the third layer 230 during the etching process, thereby forming the concave first layer 210. Since the etching rate of the first layer 210 is faster, the waste generated by etching is more likely to enter other positions of the display panel 10, thereby causing adverse effects. After the third layer 230 is set, the first layer 210 can be well attached to the third layer 230, and the generated etching waste falls on the third layer 230, which is easy to clean.

[0128] In some optional embodiments, the display panel 10 also includes: a pixel definition layer 600, located on the substrate 100, the pixel definition layer 600 includes a pixel defining portion 610 and a pixel opening 620 formed by the pixel defining portion 610, and the orthographic projection of the pixel opening 620 on the substrate 100 and the orthographic projection of the isolation opening 240 on the substrate 100 at least partially overlap.

[0129] In these optional embodiments, the pixel defining portion 610 of the pixel defining layer 600 encloses a pixel opening 620 to set the light emitting unit 310 and realize normal light emission of the light emitting unit 310. In addition, the pixel defining portion 610 defines the setting area of ​​each light emitting unit 310 to reduce the cross-color defect between each light emitting unit 310.

[0130] Optionally, the orthographic projection of the pixel opening 620 on the substrate 100 is located within the orthographic projection of the isolation opening 240 on the substrate 100, that is, the pixel opening 620 and the isolation opening 240 are connected to each other so that when the light-emitting unit 310 is prepared, the light-emitting unit 310 can be deposited into the pixel opening 620 through the isolation opening 240.

[0131] Optionally, the pixel defining portion 610 is arranged on the side of the isolation structure 200 facing the substrate 100, so that the isolation structure 200 and the pixel opening 620 have a larger step difference. When preparing the light-emitting layer 300, the light-emitting layer 300 is more easily disconnected at the edge of the isolation structure 200 to form a light-emitting unit 310 located in the pixel opening 620.

[0132] Optionally, the display panel 10 further includes a second electrode 630, the second electrode 630 is located between the substrate 100 and the pixel definition layer 600, and the orthographic projection of the second electrode 630 on the substrate 100 at least partially overlaps with the orthographic projection of the pixel opening 620 on the substrate 100. The second electrode 630 is exposed by the pixel opening 620. One of the second electrode 630 and the first electrode 510 serves as the anode of the light-emitting unit 310, and the other serves as the cathode of the light-emitting unit 310. The embodiment of the present application is described by taking the second electrode 630 as the anode of the light-emitting unit 310 and the first electrode 510 as the cathode of the light-emitting unit 310 as an example.

[0133] Optionally, the orthographic projection of the pixel opening 620 on the substrate 100 is located within the orthographic projection of the second electrode 630 on the substrate 100 , that is, the second electrode 630 is exposed by the pixel opening 620 and contacts the light emitting unit 310 to achieve normal light emission of the light emitting unit 310 .

[0134] Optionally, the light emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light emitting material layer, a hole transport layer (HTL) and a hole injection layer (HIL).

[0135] like Figure 1 As shown, the second aspect of the present application provides a display panel 10 , which includes a substrate 100 , a pixel definition layer 600 , a light emitting layer 300 , a first encapsulation layer 400 and a light-transmitting protective layer 700 . The pixel definition layer 600 is located on one side of the substrate 100 and includes a pixel defining portion 610 and a pixel opening 620 enclosed by the pixel defining portion 610, wherein the orthographic projection of the pixel opening 620 on the substrate 100 and the orthographic projection of the isolation opening 240 on the substrate 100 at least partially overlap; the light-emitting layer 300 is located on one side of the substrate 100, and the light-emitting layer 300 includes a light-emitting unit 310 located at the pixel opening 620; the first encapsulation layer 400 is located on the side of the light-emitting layer 300 away from the substrate 100, and the first encapsulation layer 400 includes encapsulation portions 410 that are arranged at intervals and used to encapsulate each light-emitting unit 310, and at least a portion of the encapsulation portion 410 is located at the pixel opening 620; the light-transmitting protective layer 700 is located on the side of the first encapsulation layer 400 away from the substrate 100, and the light-transmitting protective layer 700 includes a plurality of light-transmitting protective portions 710 that are spaced apart from each other, and the orthographic projection of the encapsulation portion 410 on the substrate 100 is located within the orthographic projection of the light-transmitting protective portion 710 on the substrate 100.

[0136] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 200, a light-emitting layer 300, a first encapsulation layer 400 and a light-transmitting protective layer 700. The pixel defining portion 610 of the pixel defining layer 600 encloses a pixel opening 620 to set the light-emitting unit 310 and realize the normal light emission of the light-emitting unit 310. In addition, the pixel defining portion 610 defines the setting area of ​​each light-emitting unit 310 to reduce the cross-color defects between each light-emitting unit 310. The first encapsulation layer 400 includes encapsulation portions 410 spaced apart from each other, and at least a portion of the encapsulation portion 410 is located in the isolation opening 240 to encapsulate the light-emitting unit 310. The light-transmitting protective layer 700 includes light-transmitting protective parts 710 spaced apart from each other. The orthographic projection of the encapsulation part 410 on the substrate 100 is located within the orthographic projection of the light-transmitting protective part 710 on the substrate 100, that is, the encapsulation part 410 is covered by the light-transmitting protective part 710. The light-transmitting protective part 710 is a light-transmitting material, which reduces the effect of the newly added light-transmitting protective layer 700 on the light emission of the light-emitting unit 310. When preparing the first encapsulation layer 400, the first-prepared encapsulation part 410 is covered by the light-transmitting protective part 710. When preparing other encapsulation parts 410 later, the light-transmitting protective part 710 can protect the first-prepared encapsulation part 410 from being dry-etched, thereby preventing the dry-etching process from damaging the first-prepared encapsulation part 410 when preparing other encapsulation parts 410 later, thereby improving the reliability of the first encapsulation layer 400 and improving the performance of the OLED display panel 10.

[0137] Optionally, the material of the light-transmitting protection part 710 includes a light-transmitting metal material, and the light-transmitting protection part 710 is a light-transmitting material, which reduces the effect of the newly added light-transmitting protection layer 700 on the light emission of the light-emitting unit 310. When preparing the first encapsulation layer 400, the first-prepared encapsulation part 410 is covered by the light-transmitting protection part 710. When preparing other encapsulation parts 410 later, the light-transmitting protection part 710 of the metal material can protect the first-prepared encapsulation part 410 from being dry-etched, thereby preventing the dry-etching process from damaging the first-prepared encapsulation part 410 when preparing other encapsulation parts 410 later, thereby improving the reliability of the first encapsulation layer 400 and improving the performance of the OLED display panel 10.

[0138] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made according to actual conditions, and this application does not impose any specific restrictions on it.

[0139] The embodiment of the third aspect of the present application further provides a display device, comprising the display panel 10 of any of the above embodiments. Since the display device provided by the embodiment of the third aspect of the present application comprises the display panel 10 of any of the above embodiments, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel 10 of any of the above embodiments, which will not be described in detail here.

[0140] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0141] The fourth aspect of the present application also provides a method for preparing a display panel 10. The display panel 10 may be the display panel 10 provided by any of the above embodiments. Figures 1 to 5 , and see Figures 6 to 10 , Figure 6 is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application, Figures 7 to 10 : is a diagram of a manufacturing process of a display panel provided in an embodiment of the present application. The manufacturing method includes:

[0142] Step S01: preparing an isolation structure on a substrate, wherein the isolation structure encloses an isolation opening, and the isolation opening includes a first isolation opening.

[0143] Step S02: sequentially preparing a first light-emitting material layer, a first packaging material layer and a first light-transmitting metal material layer on a substrate.

[0144] Step S03: Patterning the first light-emitting material layer, the first packaging material layer and the first light-transmitting metal material layer to obtain a first light-emitting unit, a first packaging part and a first light-transmitting protection part located at the first isolation opening, wherein the first packaging part is used to encapsulate the first light-emitting unit, and the orthographic projection of the first packaging part on the substrate is located within the orthographic projection of the first light-transmitting protection part on the substrate.

[0145] According to the preparation method of the third aspect of the present application, Figure 7 As shown, the isolation structure 200 is prepared through step S01, and the isolation structure 200 encloses and forms an isolation opening 240, and the isolation opening 240 includes a first isolation opening 241. Figure 8As shown, the first light-emitting material layer, the first packaging material layer and the first light-transmitting metal material layer are prepared by step S02. The isolation structure 200 is arranged on the substrate 100 and encloses a plurality of first isolation openings 241 to separate the first light-emitting material layer to form mutually disconnected first light-emitting units 311. There is no need to use a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost. The first light-emitting material layer, the first packaging material layer and the first light-transmitting metal material layer are patterned by step S03, for example, the first light-transmitting metal material layer is wet-etched, and the first light-emitting material layer and the first packaging material layer are dry-etched to obtain the first light-emitting unit 311, the first packaging portion 411 and the first light-transmitting protection portion 711 located in the first isolation opening 241. The orthographic projection of the first encapsulation part 411 on the substrate 100 is located within the orthographic projection of the first light-transmitting protection part 711 on the substrate 100, that is, the first encapsulation part 411 is covered by the first light-transmitting protection part 711, and the first light-transmitting protection part 711 is a light-transmitting material, which reduces the effect of the newly added first light-transmitting protection layer 700 on the light emission of the light-emitting unit 310. The first encapsulation part 411 prepared first is covered by the first light-transmitting protection part 711, such as Fig. 9 As shown, when the second packaging part 412 and the third packaging part 413 are subsequently prepared, the first light-transmitting protection part 711 of the metal material can protect the first packaging part 411 prepared earlier from being dry-etched, thereby preventing the dry-etching process from damaging the first packaging part 411 prepared earlier when the second packaging part 412 and the third packaging part 413 are subsequently prepared, thereby improving the reliability of the first packaging layer 400 and enhancing the performance of the OLED display panel 10.

[0146] like Fig. 9 As shown, in some optional embodiments, the isolation opening 240 further includes a second isolation opening 242 spaced apart from the first isolation opening 241. After step S03, the method further includes:

[0147] A second light-emitting material layer, a second packaging material layer, and a second light-transmitting metal material layer are sequentially prepared on the substrate 100;

[0148] The second light-emitting material layer, the second packaging material layer and the second light-transmitting metal material layer are patterned to obtain a second light-emitting unit 312, a second packaging part 412 and a second light-transmitting protection part 712 located at the second isolation opening 242. The second packaging part 412 is used to encapsulate the second light-emitting unit 312. The orthographic projection of the second packaging part 412 on the substrate 100 is located within the orthographic projection of the second light-transmitting protection part 712 on the substrate 100.

[0149] In these optional embodiments, the second light-emitting material layer, the second packaging material layer, and the second light-transmitting metal material layer are patterned, for example, the second light-transmitting metal material layer is wet-etched, and the second light-emitting material layer and the second packaging material layer are dry-etched, to obtain the second light-emitting unit 312, the second packaging portion 412, and the second light-transmitting protection portion 712 located at the second isolation opening 242. The orthographic projection of the second packaging portion 412 on the substrate 100 is located within the orthographic projection of the second light-transmitting protection portion 712 on the substrate 100, that is, the second packaging portion 412 is covered by the second light-transmitting protection portion 712, and the second light-transmitting protection portion 712 is a light-transmitting material, thereby reducing the influence of the newly added second light-transmitting protection layer 700 on the light emission of the light-emitting unit 310. The first prepared second packaging part 412 is covered by the second light-transmitting protection part 712. When the third packaging part 413 is subsequently prepared, the second light-transmitting protection part 712 of the metal material can protect the first prepared second packaging part 412 from being dry-etched, thereby preventing the first prepared second packaging part 412 from being damaged by the dry-etching process when the third packaging part 413 is subsequently prepared, thereby improving the reliability of the first packaging layer 400 and enhancing the performance of the OLED display panel 10.

[0150] like Fig.10 As shown, in some optional embodiments, the isolation opening 240 further includes a third isolation opening 243 spaced apart from the first isolation opening 241 and the second isolation opening 242. After the second light-emitting material layer, the second packaging material layer, and the second light-transmitting metal material layer are patterned, the method further includes:

[0151] Sequentially preparing a third light emitting material layer and a third encapsulation material layer on the substrate 100;

[0152] The third light emitting material layer and the third encapsulation material layer are patterned to obtain a third light emitting unit 313 and a third encapsulation portion 413 located at the third isolation opening 243 . The third encapsulation portion 413 is used to encapsulate the third light emitting unit 313 .

[0153] In these optional embodiments, the third light-emitting material layer and the third encapsulation material layer are patterned, for example, the third light-emitting material layer and the third encapsulation material layer are dry-etched to obtain the third light-emitting unit 313 and the third encapsulation part 413 located at the third isolation opening 243. When the third light-emitting material layer and the third encapsulation material layer are dry-etched, since the first encapsulation part 411 is covered by the first light-transmitting protection part 711 and the second encapsulation part 412 is covered by the second light-transmitting protection part 712, the first encapsulation part 411 and the second encapsulation part 412 are difficult to be etched, thereby improving the reliability of the first encapsulation layer 400 and improving the performance of the OLED display panel 10.

[0154] In some optional embodiments, after the step of patterning the third light emitting material layer and the third encapsulation material layer, the method further comprises:

[0155] The first light-transmitting protection portion 711 and the second light-transmitting protection portion 712 are etched to remove the first light-transmitting protection portion 711 and the second light-transmitting protection portion 712 .

[0156] In these optional embodiments, after the entire first encapsulation layer 400 is prepared, the first light-transmitting protection portion 711 and the second light-transmitting protection portion 712 are etched. Since the first light-transmitting protection portion 711 and the second light-transmitting protection portion 712 are etched by wet etching, the first encapsulation portion 411 and the second encapsulation portion 412 are difficult to be etched. After the first light-transmitting protection portion 711 and the second light-transmitting protection portion 712 are etched, the light emitted by the light-emitting unit 310 is not blocked by the first light-transmitting protection portion 711 and the second light-transmitting protection portion 712, and more light can reach the light-emitting surface of the display panel 10, thereby improving the display effect of the display panel 10. After the first light-transmitting protection portion 711 and the second light-transmitting protection portion 712 are removed, the overall film thickness of the display panel 10 can be reduced, thereby achieving a thinner and lighter module.

[0157] See also Fig.11 , Fig.11 It is a schematic flow chart of a method for preparing a display panel provided by another embodiment.

[0158] like Fig.11 As shown, an embodiment of the fifth aspect of the present application provides a method for preparing a display panel 10, the method comprising:

[0159] Step S1: preparing a pixel definition layer on a substrate, wherein the pixel definition layer comprises a pixel definition portion and a pixel opening formed by the pixel definition portion.

[0160] Step S2: preparing a light-emitting layer on a substrate, wherein the light-emitting layer includes light-emitting units located at pixel openings.

[0161] Step S3: preparing a first encapsulation layer on the side of the light-emitting layer facing away from the substrate, the first encapsulation layer comprising a plurality of encapsulation parts spaced apart from each other and used to encapsulate each light-emitting unit, at least part of the encapsulation parts being located at the pixel opening.

[0162] Step S4: preparing a light-transmitting protective layer on the side of the first encapsulation layer facing away from the substrate, the light-transmitting protective layer comprising a plurality of light-transmitting protective portions spaced apart from each other, and at least part of the orthographic projections of the encapsulation portions on the substrate being located within the orthographic projections of the light-transmitting protective portions on the substrate.

[0163] According to the preparation method of the third aspect of the present application, a pixel definition layer 600 is prepared by step S1, and the pixel definition part 610 of the pixel definition layer 600 encloses a pixel opening 620 to set the light-emitting unit 310 to achieve normal light emission of the light-emitting unit 310. And the pixel definition part 610 defines the setting area of ​​each light-emitting unit 310 to reduce the cross-color badness between each light-emitting unit 310. The light-emitting layer 300 is prepared by step S2. The first encapsulation layer 400 is prepared by step S3, and the first encapsulation layer 400 includes mutually spaced encapsulation parts 410, and at least part of the encapsulation part 410 is located in the isolation opening 240 to encapsulate the light-emitting unit 310. The light-transmitting protective layer 700 is prepared by step S4. The light-transmitting protective layer 700 includes light-transmitting protective parts 710 spaced apart from each other. The orthographic projection of the encapsulation part 410 on the substrate 100 is located within the orthographic projection of the light-transmitting protective part 710 on the substrate 100, that is, the encapsulation part 410 is covered by the light-transmitting protective part 710. The light-transmitting protective part 710 is a light-transmitting material, which reduces the effect of the newly added light-transmitting protective layer 700 on the light emission of the light-emitting unit 310. When preparing the first encapsulation layer 400, the first-prepared encapsulation part 410 is covered by the light-transmitting protective part 710. When preparing other encapsulation parts 410 later, the light-transmitting protective part 710 can protect the first-prepared encapsulation part 410 from being dry-etched, so as to avoid the damage of the first-prepared encapsulation part 410 by the dry-etching process when preparing other encapsulation parts 410 later, thereby improving the reliability of the first encapsulation layer 400 and improving the performance of the OLED display panel 10. The thickness of the light-transmitting protection part 710 is greater than or equal to 0.01 μm, which can improve the problem that the light-transmitting protection part 710 is easily damaged and difficult to protect the packaging part 410 due to the light-transmitting protection part 710 being too thin.

[0164] According to the embodiments described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure, located on one side of the substrate, and the isolation structure encloses an isolation opening; A light-emitting layer, located on one side of the substrate, wherein the light-emitting layer includes a light-emitting unit located in the isolation opening; A first encapsulation layer is located on a side of the light-emitting layer away from the substrate, the first encapsulation layer comprising a plurality of encapsulation parts which are arranged at intervals and used to encapsulate the light-emitting units, at least part of the encapsulation parts being located in the isolation opening; The light-transmitting protective layer is located on the side of the first encapsulation layer away from the substrate, and the light-transmitting protective layer includes a plurality of light-transmitting protective parts spaced apart from each other, and at least part of the orthographic projection of the encapsulation parts on the substrate is located within the orthographic projection of the light-transmitting protective parts on the substrate.

2. The display panel according to claim 1, characterized in that: The material of the light-transmitting protection part includes a light-transmitting metal material.

3. The display panel according to claim 1, characterized in that: The light-transmitting protective portion has a transmittance of 95% to 100%.

4. The display panel according to claim 1, characterized in that: The dimension of the light-transmitting protection portion in the thickness direction of the display panel is smaller than the dimension of the packaging portion in the thickness direction of the display panel; Preferably, a dimension of the light-transmitting protection portion in a thickness direction of the display panel is 0.01 μm to 0.03 μm.

5. The display panel according to claim 1, characterized in that: The light-transmitting protection part is multiplexed into a signal shielding part, and the light-transmitting protection part is connected to a fixed potential.

6. The display panel according to claim 5, characterized in that: The display panel further includes: A conductive layer, located on a side of the light-transmitting protective layer away from the substrate, the light-transmitting protective portion being electrically connected to the conductive layer; Preferably, the conductive layer is electrically connected to the isolation structure; Preferably, the material of the conductive layer is the same as that of the light-transmitting protective portion; Preferably, the transmittance of the conductive layer is 95% to 100%; Preferably, the size of the conductive layer in the thickness direction of the display panel is 0.01 μm to 0.03 μm.

7. The display panel according to claim 1, characterized in that: The material of the first encapsulation layer includes an inorganic material; Preferably, the display panel further includes: a second encapsulation layer, located on a side of the first encapsulation layer away from the substrate; a third encapsulation layer, located on a side of the second encapsulation layer away from the substrate; Preferably, the material of the second encapsulation layer includes organic material; Preferably, the material of the third encapsulation layer includes inorganic material.

8. The display panel according to claim 1, characterized in that: The display panel further includes: A first electrode layer, located between the light-emitting layer and the first encapsulation layer, the first electrode layer comprising a first electrode located in the isolation opening, the first electrode being electrically connected to the isolation structure; Preferably, the orthographic projection of each of the light-emitting units on the substrate is located within the orthographic projection of each of the first electrodes on the substrate; Preferably, the light emitting unit and the isolation structure are spaced apart; Preferably, the isolation structure comprises a first layer and a second layer, the second layer is located on a side of the first layer away from the substrate, and the first electrode is electrically connected to the first layer; Preferably, the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate; Preferably, the second layer comprises a conductive material or an insulating material; Preferably, the second layer comprises a metal material, and the first layer and the second layer are made of different materials; Preferably, the isolation structure further comprises a third layer located on a side of the first layer facing the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the third layer on the substrate.

9. The display panel according to claim 1, characterized in that: The display panel further includes: A pixel definition layer is located on the substrate, the pixel definition layer comprises a pixel definition portion and a pixel opening formed by the pixel definition portion, and the orthographic projection of the pixel opening on the substrate and the orthographic projection of the isolation opening on the substrate at least partially overlap; Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate; Preferably, the pixel defining portion is arranged on a side of the isolation structure facing the substrate; Preferably, the display panel further comprises a second electrode, the second electrode is located between the substrate and the pixel definition layer, and an orthographic projection of the second electrode on the substrate at least partially overlaps with an orthographic projection of the pixel opening on the substrate; Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the second electrode on the substrate.

10. A display panel, characterized in that: include: substrate; A pixel definition layer, located on the substrate, the pixel definition layer comprising a pixel definition portion and a pixel opening formed by the pixel definition portion; A light-emitting layer, located on one side of the substrate, wherein the light-emitting layer includes a light-emitting unit located at the pixel opening; A first encapsulation layer is located on a side of the light-emitting layer away from the substrate, the first encapsulation layer comprising a plurality of encapsulation parts which are arranged at intervals and used to encapsulate each of the light-emitting units, at least part of the encapsulation parts being located at the pixel opening; The light-transmitting protective layer is located on the side of the first encapsulation layer away from the substrate, and the light-transmitting protective layer includes a plurality of light-transmitting protective parts spaced apart from each other, and at least part of the orthographic projection of the encapsulation parts on the substrate is located within the orthographic projection of the light-transmitting protective parts on the substrate.

11. The display panel according to claim 10, characterized in that: The material of the light-transmitting protection part includes a light-transmitting metal material; Preferably, the transmittance of the light-transmitting protective portion is 95% to 100%.

12. The display panel according to claim 10, characterized in that: The display panel further includes: The isolation structure is located at one side of the substrate, the isolation structure encloses an isolation opening, and the orthographic projection of the pixel opening on the substrate and the orthographic projection of the isolation opening on the substrate at least partially overlap.

13. The display panel according to claim 10, characterized in that: The material of the light-transmitting protection part includes a light-transmitting metal material.

14. The display panel according to claim 10, characterized in that: The dimension of the light-transmitting protection portion in the thickness direction of the display panel is smaller than the dimension of the packaging portion in the thickness direction of the display panel; Preferably, a dimension of the light-transmitting protection portion in a thickness direction of the display panel is 0.01 μm to 0.03 μm.

15. The display panel according to claim 10, characterized in that: The light-transmitting protection part is multiplexed into a signal shielding part, and the light-transmitting protection part is connected to a fixed potential.

16. A display device, characterized in that: A display panel comprising any one of claims 1-15.

17. A method for preparing a display panel, characterized in that: The method comprises: Preparing an isolation structure on a substrate, wherein the isolation structure encloses an isolation opening, and the isolation opening includes a first isolation opening; Sequentially preparing a first light-emitting material layer, a first packaging material layer and a first light-transmitting metal material layer on the substrate; The first light-emitting material layer, the first packaging material layer and the first light-transmitting metal material layer are patterned to obtain a first light-emitting unit, a first packaging part and a first light-transmitting protection part located at the first isolation opening, wherein the first packaging part is used to encapsulate the first light-emitting unit, and the orthographic projection of the first packaging part on the substrate is located within the orthographic projection of the first light-transmitting protection part on the substrate.

18. The preparation method according to claim 17, characterized in that: The isolation opening further includes a second isolation opening spaced apart from the first isolation opening. After the step of patterning the first light-emitting material layer, the first packaging material layer and the first light-transmitting metal material layer, the method further includes: Sequentially preparing a second light-emitting material layer, a second packaging material layer, and a second light-transmitting metal material layer on the substrate; The second light-emitting material layer, the second packaging material layer and the second light-transmitting metal material layer are patterned to obtain a second light-emitting unit, a second packaging part and a second light-transmitting protection part located at the second isolation opening, wherein the second packaging part is used to encapsulate the second light-emitting unit, and the orthographic projection of the second packaging part on the substrate is located within the orthographic projection of the second light-transmitting protection part on the substrate.

19. The preparation method according to claim 18, characterized in that: The isolation opening further includes a third isolation opening spaced apart from the first isolation opening and the second isolation opening. After the step of patterning the second light-emitting material layer, the second packaging material layer and the second light-transmitting metal material layer, the method further includes: sequentially preparing a third light-emitting material layer and a third encapsulation material layer on the substrate; Performing patterning on the third light-emitting material layer and the third encapsulation material layer to obtain a third light-emitting unit and a third encapsulation portion located at the third isolation opening, wherein the third encapsulation portion is used to encapsulate the third light-emitting unit; Preferably, after the step of patterning the third light emitting material layer and the third encapsulation material layer, the method further comprises: The first light-transmitting protection portion and the second light-transmitting protection portion are etched to remove the first light-transmitting protection portion and the second light-transmitting protection portion.

20. A method for preparing a display panel, characterized in that: The method comprises: Preparing a pixel definition layer on a substrate, wherein the pixel definition layer includes a pixel definition portion and a pixel opening formed by the pixel definition portion; Preparing a light-emitting layer on the substrate, wherein the light-emitting layer includes a light-emitting unit located at the pixel opening; A first encapsulation layer is prepared on a side of the light-emitting layer away from the substrate, wherein the first encapsulation layer comprises a plurality of encapsulation parts which are arranged at intervals and used to encapsulate each of the light-emitting units, and at least a portion of the encapsulation parts is located at the pixel opening; A light-transmitting protective layer is prepared on the side of the first encapsulation layer away from the substrate, the light-transmitting protective layer includes a plurality of light-transmitting protective parts spaced apart from each other, and at least part of the orthographic projections of the encapsulation parts on the substrate are located within the orthographic projections of the light-transmitting protective parts on the substrate.

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