Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display, the display panel comprises an array substrate, an isolation structure, a light emitting unit and a first packaging layer, the isolation structure is located on one side of the array substrate, and an isolation opening is defined by the isolation structure; at least part of the light-emitting units are located in the isolation openings, each light-emitting unit comprises a light-emitting part and a second electrode which are sequentially stacked in the direction away from the array substrate, and the light-emitting units comprise the first light-emitting unit and the second light-emitting unit; the first packaging layer comprises a plurality of packaging units which are arranged at intervals; the side, away from the array substrate, of the packaging unit comprises a groove, and the depth of the groove located in the first light-emitting unit is smaller than the sum of the thickness of the light-emitting part of the second light-emitting unit and the thickness of the second electrode. According to the display panel, the first light-emitting unit can be better protected, the first light-emitting unit is not prone to being damaged, and then the display effect of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display panels.

[0003] However, there are still some problems with display panels that need to be solved urgently. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a display panel, wherein the display panel includes:

[0005] An array substrate;

[0006] An isolation structure located at one side of the array substrate, the isolation structure enclosing an isolation opening;

[0007] a light-emitting unit located in the isolation opening, the light-emitting unit comprising a light-emitting portion and a second electrode sequentially stacked in a direction away from the array substrate, the light-emitting unit comprising a first light-emitting unit and a second light-emitting unit;

[0008] a first encapsulation layer located on a side of the light-emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of encapsulation units arranged at intervals, the encapsulation units at least covering the light-emitting unit and extending to a side surface of the isolation structure, the side surface of the isolation structure being a surface of the isolation structure facing the isolation opening;

[0009] The packaging unit includes a groove on one side away from the array substrate, and along a direction perpendicular to the array substrate, the depth of the groove located at the first light-emitting unit is less than the sum of the thicknesses of the light-emitting portion of the second light-emitting unit and the second electrode.

[0010] In some possible implementations, the light-emitting unit further includes a third light-emitting unit; along a direction perpendicular to the array substrate, a depth of the groove located in the second light-emitting unit is less than a sum of thicknesses of the light-emitting portion of the third light-emitting unit and the second electrode;

[0011] Preferably, the depth of the groove located in the first light-emitting unit is less than the thickness of the light-emitting portion of the second light-emitting unit;

[0012] Preferably, the depth of the groove located in the second light-emitting unit is less than the thickness of the light-emitting portion of the third light-emitting unit;

[0013] Preferably, along a direction perpendicular to the array substrate, a depth of the groove located in the first light emitting unit is smaller than a depth of the groove located in the third light emitting unit;

[0014] Preferably, along a direction perpendicular to the array substrate, a depth of the groove located at the second light emitting unit is less than a depth of the groove located at the third light emitting unit;

[0015] Preferably, the first light emitting unit, the second light emitting unit and the third light emitting unit all emit different colors of light.

[0016] In some possible implementations, along a direction perpendicular to the array substrate, a depth of the groove located in the first light emitting unit ranges from 0.03 μm to 0.07 μm;

[0017] Preferably, along a direction perpendicular to the array substrate, the depth of the groove located at the second light emitting unit ranges from 0.03 μm to 0.07 μm;

[0018] Preferably, along a direction perpendicular to the array substrate, the depth of the groove located at the third light emitting unit ranges from 0.1 μm to 0.2 μm;

[0019] Preferably, along a direction perpendicular to the array substrate, a depth of the groove located in the second light emitting unit is equal to a depth of the groove located in the first light emitting unit.

[0020] In some possible implementations, the orthographic projection of the groove on the array substrate is located within the orthographic projection of the isolation opening on the array substrate;

[0021] Preferably, at least part of the orthographic projection of the groove on the array substrate is located within the orthographic projection of the isolation structure on the array substrate;

[0022] Preferably, the orthographic projection of the groove on the array substrate is annular, and the orthographic projection of the groove on the array substrate surrounds at least part of the orthographic projection of the light-emitting unit on the array substrate, and the depth of the same groove surrounding the light-emitting unit at different positions is equal.

[0023] In some possible implementations, adjacent packaging units are spaced apart on a side of the isolation structure away from the array substrate;

[0024] Preferably, there is a gap between the packaging unit located at a side of the isolation structure away from the array substrate and a side of the isolation structure away from the array substrate;

[0025] Preferably, the orthographic projection of the packaging unit on the array substrate covers the orthographic projection of the isolation opening on the array substrate and covers a portion of the orthographic projection of the isolation structure on the array substrate.

[0026] In some possible implementations, the display panel further includes a second packaging layer located on a side of the first packaging layer away from the array substrate;

[0027] Preferably, the display panel further comprises a third packaging layer located on a side of the second packaging layer away from the array substrate;

[0028] Preferably, the materials of the first encapsulation layer and the third encapsulation layer both include inorganic materials;

[0029] Preferably, the material of the second encapsulation layer includes organic material.

[0030] In some possible implementations, the light-emitting unit further includes a first electrode located on a side of the light-emitting portion close to the array substrate;

[0031] Preferably, the display panel further comprises a pixel defining layer located on a side of the film layer where the first electrode is located away from the array substrate, and the isolation structure is located on a side of the pixel defining layer away from the array substrate; the pixel defining layer comprises a pixel opening exposing at least a portion of the first electrode, and the orthographic projection of the isolation structure on the array substrate is located between the orthographic projections of two adjacent pixel openings on the array substrate;

[0032] Preferably, the orthographic projection of the pixel opening on the array substrate is located within the orthographic projection of the isolation opening on the array substrate.

[0033] In some possible embodiments, the isolation structure includes a first isolation portion and a second isolation portion which are stacked in sequence in a direction away from the array substrate, and the orthographic projection of the side of the first isolation portion away from the array substrate on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate.

[0034] In some possible implementations, the second electrode of the light-emitting unit is electrically connected to the first isolation portion; and / or the isolation structure further includes a third isolation portion located on a side of the first isolation portion facing the array substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion;

[0035] Preferably, the material of the third isolation portion includes molybdenum metal; and / or the material of the first isolation portion includes aluminum metal; and / or the material of the second isolation portion includes titanium metal.

[0036] In some possible implementations, the present application further provides a method for preparing a display panel, the method comprising:

[0037] Providing an array substrate;

[0038] An isolation structure is formed on one side of the array substrate, wherein the isolation structure encloses an isolation opening;

[0039] At least a portion of a light emitting unit is formed in the isolation opening, and a first encapsulation layer is formed on a side of the light emitting unit away from the array substrate, the light emitting unit includes a light emitting portion and a second electrode sequentially stacked in a direction away from the array substrate, the light emitting unit includes a first light emitting unit and a second light emitting unit, the first encapsulation layer includes a plurality of encapsulation units arranged at intervals, the encapsulation units at least cover the light emitting units and extend to a side surface of the isolation structure, and the side surface of the isolation structure is a surface of the isolation structure facing the isolation opening;

[0040] The packaging unit includes a groove on one side away from the array substrate, and along a direction perpendicular to the array substrate, the depth of the groove located at the first light-emitting unit is less than the sum of the thicknesses of the light-emitting portion of the second light-emitting unit and the second electrode.

[0041] In some possible implementations, the step of forming an isolation structure on one side of the array substrate includes:

[0042] forming a first electrode layer on one side of the array substrate, wherein the first electrode layer includes a plurality of first electrodes arranged at intervals;

[0043] forming a pixel defining material layer on a side of the first electrode layer away from the array substrate;

[0044] forming an isolation structure material layer on a side of the pixel defining material layer away from the array substrate;

[0045] Performing patterning on the isolation structure material layer to form an isolation structure;

[0046] The pixel defining material layer is patterned to form a pixel defining layer, wherein the pixel defining layer includes a pixel opening exposing at least a portion of the first electrode; the orthographic projection of the pixel opening on the array substrate is located within the orthographic projection of the isolation opening on the array substrate.

[0047] In some possible implementations, the step of forming at least a portion of the light emitting unit in the isolation opening and forming a first encapsulation layer on a side of the light emitting unit away from the array substrate includes:

[0048] forming a light-emitting functional layer of a first light-emitting unit on a side of the isolation structure away from the array substrate;

[0049] A second electrode layer formed on a side of the light-emitting functional layer of the first light-emitting unit away from the array substrate;

[0050] forming a first packaging layer on a side of the second electrode layer away from the array substrate;

[0051] forming a first etching protection layer in the isolation opening corresponding to the first light-emitting unit, wherein the first etching protection layer also extends to cover a portion of the isolation structure;

[0052] The first encapsulation layer, the light-emitting functional layer and the second electrode layer that are not covered by the first etching protection layer are removed, and the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate are removed, and the first etching protection layer is removed, so as to form a light-emitting portion, a second electrode and an encapsulation unit in the isolation opening corresponding to the first light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the first light-emitting unit;

[0053] Preferably, the second electrode extends to be electrically connected to an isolation structure corresponding to the first light-emitting unit;

[0054] Preferably, along a direction perpendicular to the array substrate, the depth of the groove located in the first light emitting unit ranges from 0.03 μm to 0.07 μm;

[0055] Preferably, the orthographic projection of the groove on the array substrate is annular, and the orthographic projection of the groove on the array substrate surrounds at least part of the orthographic projection of the first light-emitting unit on the array substrate, and the depth of the same groove surrounding the first light-emitting unit at different positions is equal.

[0056] In some possible implementations, after the steps of removing the first encapsulation layer, the light-emitting functional layer, and the second electrode layer that are not covered by the first etching protection layer, removing the light-emitting functional layer and the second electrode layer located on a side of the isolation structure away from the array substrate, and removing the first etching protection layer, the method further includes:

[0057] A light-emitting functional layer of a second light-emitting unit is formed on a side of the isolation structure away from the array substrate, wherein the light-emitting functional layer of the second light-emitting unit covers a side of the packaging unit corresponding to the first light-emitting unit away from the array substrate;

[0058] A second electrode layer is formed on a side of the light-emitting functional layer of the second light-emitting unit away from the array substrate, and at least a portion of the light-emitting functional layer of the second light-emitting unit and / or at least a portion of the second electrode layer fills at least a portion of the groove located in the first light-emitting unit, and the second electrode layer of the second light-emitting unit is continuously arranged at the groove corresponding to the first light-emitting unit;

[0059] forming a first packaging layer on a side of the second electrode layer away from the array substrate;

[0060] forming a second etching protection layer in the isolation opening corresponding to the second light emitting unit;

[0061] The first encapsulation layer, the light-emitting functional layer and the second electrode layer of the second light-emitting unit not covered by the second etching protection layer are removed, and the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate are removed, and the second etching protection layer is removed to form a light-emitting portion, a second electrode and an encapsulation unit in the isolation opening corresponding to the second light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the second light-emitting unit;

[0062] Preferably, the second electrode extends to be electrically connected to an isolation structure corresponding to the second light-emitting unit;

[0063] Preferably, along a direction perpendicular to the array substrate, the depth of the groove located at the second light emitting unit ranges from 0.03 μm to 0.07 μm;

[0064] Preferably, the orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the second light emitting unit on the array substrate, and the depths of the same groove surrounding the second light emitting unit at different positions are equal;

[0065] Preferably, along a direction perpendicular to the array substrate, a depth of the groove located in the second light emitting unit is equal to a depth of the groove located in the first light emitting unit.

[0066] In some possible implementations, after the step of removing the first encapsulation layer, the light-emitting functional layer, and the second electrode layer of the second light-emitting unit that are not covered by the second etching protection layer, removing the light-emitting functional layer and the second electrode layer located on a side of the isolation structure away from the array substrate, and removing the second etching protection layer, the method further includes:

[0067] A light-emitting functional layer of a third light-emitting unit is formed on a side of the isolation structure away from the array substrate, and a light-emitting functional layer of the second light-emitting unit covers a side of the packaging unit corresponding to the first light-emitting unit and the second light-emitting unit away from the array substrate;

[0068] A second electrode layer is formed on a side of the light-emitting function layer of the third light-emitting unit away from the array substrate, at least a portion of the light-emitting function layer of the third light-emitting unit and / or at least a portion of the second electrode layer fills at least a portion of the groove located in the first light-emitting unit and the second light-emitting unit, and the second electrode layer of the third light-emitting unit is continuously arranged at the groove corresponding to the first light-emitting unit and the second light-emitting unit;

[0069] forming a first packaging layer on a side of the second electrode layer away from the array substrate;

[0070] forming a third etching protection layer in the isolation opening corresponding to the third light emitting unit;

[0071] The first encapsulation layer, the light-emitting function layer and the second electrode layer of the third light-emitting unit not covered by the third etching protection layer are removed, and the light-emitting function layer and the second electrode layer located on the side of the isolation structure away from the array substrate are removed, and the third etching protection layer is removed to form a light-emitting portion, a second electrode and an encapsulation unit in the isolation opening corresponding to the third light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the third light-emitting unit;

[0072] Preferably, the second electrode extends to be electrically connected to an isolation structure corresponding to the third light emitting unit;

[0073] Preferably, along a direction perpendicular to the array substrate, a depth of the groove located in the third light emitting unit is greater than a depth of the groove located in the first light emitting unit and / or located in the second light emitting unit;

[0074] Preferably, along a direction perpendicular to the array substrate, the depth of the groove located at the third light emitting unit ranges from 0.1 μm to 0.2 μm;

[0075] Preferably, the orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the third light emitting unit on the array substrate, and the depths of the same groove surrounding the third light emitting unit at different positions are equal.

[0076] In some possible implementations, the present application further provides an electronic device, which includes the display panel described in the present application, or includes a display panel prepared by the method for preparing the display panel described in the present application.

[0077] Compared with the prior art, this application has the following beneficial effects:

[0078] The present application provides a display panel, a method for preparing a display panel, and an electronic device. By setting the depth of a groove located at a first light-emitting unit to be smaller than the sum of the thicknesses of a light-emitting portion and a second electrode of a second light-emitting unit, when preparing the second light-emitting unit, the second electrode of the second light-emitting unit can be continuously formed on a side of the first light-emitting unit away from an array substrate, thereby providing better protection for the first light-emitting unit and preventing the first light-emitting unit from being easily damaged, thereby improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0080] Figure 1 A schematic cross-sectional view of a display panel in the related art provided by an embodiment of the present application;

[0081] Figure 2 One of the cross-sectional schematic diagrams of a display panel provided in an embodiment of the present application;

[0082] Figure 3 A schematic cross-sectional view of a display panel when a second electrode of a second light-emitting unit is formed according to an embodiment of the present application;

[0083] Figure 4 A second cross-sectional schematic diagram of a display panel provided in an embodiment of the present application;

[0084] Figure 5 A partial top view schematic diagram of a display panel provided in an embodiment of the present application;

[0085] Figure 6 A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application including a second encapsulation layer and a third encapsulation layer;

[0086] Figure 7 The isolation structure of the display panel provided in the embodiment of the present application includes a cross-sectional schematic diagram of a three-layer isolation structure;

[0087] Figure 8 A schematic diagram of a process for preparing a display panel provided in an embodiment of the present application;

[0088] Fig. 9 A cross-sectional schematic diagram of forming a first electrode layer on one side of an array substrate provided in an embodiment of the present application;

[0089] Fig.10 A cross-sectional schematic diagram of a pixel defining material layer formed on a side of a first electrode layer away from an array substrate provided in an embodiment of the present application;

[0090] Fig.11 A cross-sectional schematic diagram of an isolation structure material layer formed on a side of a pixel defining material layer away from an array substrate provided in an embodiment of the present application;

[0091] Fig.12 A schematic cross-sectional view of the isolation structure material layer after patterning provided in an embodiment of the present application;

[0092] Fig.13 A schematic cross-sectional view of a pixel defining material layer after patterning according to an embodiment of the present application;

[0093] Fig.14 A cross-sectional schematic diagram of a light-emitting functional layer of a first light-emitting unit formed on a side of an isolation structure away from an array substrate provided in an embodiment of the present application;

[0094] Fig.15 A schematic cross-sectional view of a second electrode layer formed on a side of a light-emitting functional layer of a first light-emitting unit away from an array substrate provided in an embodiment of the present application;

[0095] Fig.16 One of the cross-sectional schematic diagrams of forming a first encapsulation layer on a side of the second electrode layer away from the array substrate provided in an embodiment of the present application;

[0096] Fig.17 A schematic top view of forming a first etching protection layer in an isolation opening corresponding to a first light-emitting unit provided in an embodiment of the present application;

[0097] Fig.18 A schematic cross-sectional view of the embodiment of the present application after removing the first encapsulation layer, the light-emitting functional layer, the second electrode layer, etc. that are not covered by the first etching protection layer;

[0098] Fig.19 A cross-sectional schematic diagram of a light-emitting functional layer of a third light-emitting unit formed on a side of the isolation structure away from the array substrate provided in an embodiment of the present application;

[0099] Fig. 20 A cross-sectional schematic diagram of forming a second electrode layer on a side of the light-emitting functional layer of the third light-emitting unit away from the array substrate provided in an embodiment of the present application;

[0100] Fig.21 A second cross-sectional schematic diagram of forming a first encapsulation layer on a side of the second electrode layer away from the array substrate provided in an embodiment of the present application;

[0101] Fig. 22 A cross-sectional schematic diagram of forming a second etching protection layer in an isolation opening corresponding to a third light-emitting unit provided in an embodiment of the present application;

[0102] Fig.23 A schematic cross-sectional view of the embodiment of the present application after removing the first encapsulation layer, the light-emitting functional layer, the second electrode layer, etc. of the third light-emitting unit not covered by the second etching protection layer;

[0103] Fig.24 A cross-sectional schematic diagram of a light-emitting functional layer of a second light-emitting unit formed on a side of the isolation structure away from the array substrate provided in an embodiment of the present application;

[0104] Fig.25 A cross-sectional schematic diagram of forming a second electrode layer on a side of the light-emitting functional layer of the second light-emitting unit away from the array substrate provided in an embodiment of the present application;

[0105] Fig.26 A third cross-sectional schematic diagram of forming a first encapsulation layer on a side of the second electrode layer away from the array substrate provided in an embodiment of the present application;

[0106] Fig. 27 A cross-sectional schematic diagram of forming a third etching protection layer in the isolation opening corresponding to the second light-emitting unit provided in an embodiment of the present application;

[0107] Fig.28 This is a cross-sectional schematic diagram after removing the first encapsulation layer, the light-emitting functional layer, the second electrode layer, etc. of the second light-emitting unit not covered by the third etching protection layer provided in an embodiment of the present application.

[0108] Figure numerals: 1. array substrate; 2. pixel defining layer; 21. pixel opening; 3. isolation structure; 31. first isolation portion; 32. second isolation portion; 33. third isolation portion; 4. first electrode; 5. light-emitting portion; 6. second electrode; 7. light-emitting unit; 71. first light-emitting unit; 72. second light-emitting unit; 73. third light-emitting unit; 8. first encapsulation layer; 81. encapsulation unit; 811. groove; 9. isolation opening; 10. second encapsulation layer; 11. third encapsulation layer; 12. pixel defining material layer; 13. isolation structure material layer; 14. first etching protection layer; 15. second etching protection layer; 16. third etching protection layer. DETAILED DESCRIPTION

[0109] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0110] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0111] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0112] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0113] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0114] See also Figure 1The display panel in the related art includes an array substrate 1, an isolation structure 3 located on one side of the array substrate 1, a light-emitting unit 7 at least partially located in an isolation opening 9 formed by the isolation structure 3, and a first packaging layer 8 located on a side of the light-emitting unit 7 away from the array substrate 1, the first packaging layer 8 includes a packaging unit 81, and the side of the packaging unit 81 away from the array substrate 1 includes a groove 811.

[0115] The light-emitting unit 7 includes a first light-emitting unit 71 and a second light-emitting unit 72. According to the preparation sequence of the first light-emitting unit 71 and the second light-emitting unit 72, when preparing the second light-emitting unit 72, the second electrode of the second light-emitting unit 72 cannot be continuously formed at the groove 811 of the first light-emitting unit 71, so the second electrode of the second light-emitting unit 72 cannot completely protect the first light-emitting unit 71. When patterning the second light-emitting unit 72, the first light-emitting unit 71 may be damaged, making the first light-emitting unit 71 ineffective, and ultimately affecting the display effect of the display panel.

[0116] In view of this, the present embodiment provides a solution that can improve the display effect of the display panel. The solution provided by the present embodiment is described in detail below.

[0117] See also Figure 2 This embodiment provides a display panel, which includes an array substrate 1, an isolation structure 3, a light-emitting unit 7 and a first encapsulation layer 8.

[0118] The array substrate 1 may include a substrate and a plurality of driving units located on one side of the substrate, and each driving unit may include one or more semiconductor switching devices. The semiconductor switching device may be formed by the cooperation of a plurality of film layers in the array substrate 1, for example, the semiconductor switching device may be a thin film transistor formed by the cooperation of a plurality of film layers.

[0119] The isolation structure 3 is located on one side of the array substrate 1 , and the isolation structure 3 encloses an isolation opening 9 .

[0120] The composition, preparation and other contents of the isolation structure 3 are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, 202311499823.9, 202310731471.9, and 202311091555.7 for reference.

[0121] At least part of the light-emitting unit 7 is located in the isolation opening 9. The light-emitting unit 7 includes a light-emitting portion 5 and a second electrode 6 sequentially stacked in a direction away from the array substrate 1. The light-emitting unit 7 includes a first light-emitting unit 71 and a second light-emitting unit 72. The first light-emitting unit 71 and the second light-emitting unit 72 emit different colors of light. For example, the first light-emitting unit 71 may emit blue light, and the second light-emitting unit 72 may emit green light. The second light-emitting unit 72 is the last light-emitting unit 7 prepared for the display panel.

[0122] The first packaging layer 8 is located on a side of the light-emitting unit 7 away from the array substrate 1. The first packaging layer 8 includes a plurality of packaging units 81 arranged at intervals. The packaging units 81 at least cover the light-emitting unit 7 and extend to the side of the isolation structure 3. The side of the isolation structure 3 is the surface of the isolation structure 3 facing the isolation opening 9.

[0123] Among them, the side of the packaging unit 81 away from the array substrate 1 includes a groove 811, and along the direction perpendicular to the array substrate 1, the depth D1 of the groove 811 located in the first light-emitting unit 71 is less than the sum H1 of the thickness of the light-emitting portion 5 and the second electrode 6 of the second light-emitting unit 72.

[0124] According to the manufacturing sequence of the first light emitting unit 71 and the second light emitting unit 72 , after the first light emitting unit 71 and the second light emitting unit 72 are manufactured, grooves 811 are formed on the packaging units 81 corresponding to the first light emitting unit 71 and the second light emitting unit 72 .

[0125] Since the depth D1 of the groove 811 located in the first light-emitting unit 71 is less than the sum H1 of the thickness of the light-emitting portion 5 and the second electrode 6 of the second light-emitting unit 72, see Figure 3 In the process of forming the second light-emitting unit 72, the second electrode 6 of the second light-emitting unit 72 can be continuously formed at the groove 811 located in the first light-emitting unit 71. Therefore, when the second light-emitting unit 72 is subsequently patterned, the second electrode of the second light-emitting unit 72 can more completely protect the first light-emitting unit 71, so that it is not easy to damage the first light-emitting unit 71 or make it fail.

[0126] Based on the above design, in this embodiment, by setting the depth D1 of the groove 811 located in the first light-emitting unit 71 to be smaller than the sum H1 of the thickness of the light-emitting portion 5 and the second electrode 6 of the second light-emitting unit 72, when preparing the second light-emitting unit 72, the second electrode 6 of the second light-emitting unit 72 can be continuously formed on the side of the first light-emitting unit 71 away from the array substrate 1, thereby providing better protection for the first light-emitting unit 71, making it less likely to damage the first light-emitting unit 71, and thus improving the display effect of the display panel.

[0127] For some possible implementations, see again Figure 2 The light-emitting unit 7 also includes a first electrode 4 located on a side of the light-emitting portion 5 close to the array substrate 1, the display panel also includes a pixel defining layer 2 located on a side of the film layer where the first electrode 4 is located away from the array substrate 1, and the isolation structure 3 is located on a side of the pixel defining layer 2 away from the array substrate 1; the pixel defining layer 2 includes a pixel opening 21 exposing at least a portion of the first electrode 4, the orthographic projection of the isolation structure 3 on the array substrate 1 is located between the orthographic projections of two adjacent pixel openings 21 on the array substrate 1, and the orthographic projection of the pixel opening 21 on the array substrate 1 is located within the orthographic projection of the isolation opening 9 on the array substrate 1.

[0128] When forming the light-emitting functional layer, the light-emitting functional layer will be separated by the isolation structure 3 to form a plurality of light-emitting portions 5 arranged at intervals. When forming the second electrode layer, the second electrode layer will be separated by the isolation structure 3 to form a plurality of second electrodes 6 arranged at intervals. The isolation structure 3 includes a conductive material. The second electrode 6 is electrically connected to the isolation structure 3. A first electrode 4, a light-emitting portion 5 and a second electrode 6 form a light-emitting unit 7. Among them, the first electrode 4 is an anode and the second electrode 6 is a cathode.

[0129] For some possible implementations, see Figure 4 , the light-emitting unit 7 also includes a third light-emitting unit 73; along the direction perpendicular to the array substrate 1, the depth D3 of the groove 811 located in the second light-emitting unit 72 is less than the sum H2 of the thickness of the light-emitting portion 5 of the third light-emitting unit 73 and the second electrode 6.

[0130] The first light emitting unit 71 , the second light emitting unit 72 and the third light emitting unit 73 all emit different colors of light. For example, the first light emitting unit 71 includes a blue light emitting unit, the second light emitting unit 72 includes a green light emitting unit, and the third light emitting unit 73 includes a red light emitting unit.

[0131] Since the depth D2 of the groove 811 located in the second light-emitting unit 72 is smaller than the sum H2 of the thickness of the light-emitting portion 5 and the second electrode 6 of the third light-emitting unit 73, in the process of forming the third light-emitting unit 73, the second electrode 6 of the third light-emitting unit 73 can be continuously formed in the groove 811 located in the second light-emitting unit 72. Therefore, when the third light-emitting unit 73 is subsequently patterned, the second electrode of the third light-emitting unit 73 can more completely protect the second light-emitting unit 72, so that the second light-emitting unit 72 is not easily damaged or rendered ineffective.

[0132] Preferably, the depth of the groove 811 located in the first light-emitting unit 71 is less than the thickness of the light-emitting portion 5 of the second light-emitting unit 72. In this way, in the process of forming the second light-emitting unit 72, the second electrode 6 of the second light-emitting unit 72 can be more easily and continuously formed at the groove 811 located in the first light-emitting unit 71, thereby providing more complete protection for the first light-emitting unit 71.

[0133] Preferably, the depth of the groove 811 located in the second light-emitting unit 72 is less than the thickness of the light-emitting portion 5 of the third light-emitting unit 73. In this way, in the process of forming the third light-emitting unit 73, the second electrode 6 of the third light-emitting unit 73 can be more easily and continuously formed at the groove 811 located in the second light-emitting unit 72, thereby providing more complete protection for the second light-emitting unit 72.

[0134] Preferably, see again Figure 4 , along the direction perpendicular to the array substrate 1, the depth D1 of the groove 811 located in the first light emitting unit 71 is less than the depth D3 of the groove 811 located in the third light emitting unit 73, that is, D1 <D3。

[0135] Preferably, along the direction perpendicular to the array substrate 1, the depth D2 of the groove 811 of the second light emitting unit 72 is less than the depth D3 of the groove 811 of the third light emitting unit 73, that is, D2 <D3。

[0136] The depth D1 of the groove 811 located in the first light emitting unit 71 and the depth D2 of the groove 811 located in the second light emitting unit 72 may be equal or unequal.

[0137] According to the preparation order of the first light-emitting unit 71, the second light-emitting unit 72 and the third light-emitting unit 73, the depth D1 of the groove 811 located in the first light-emitting unit 71 and the depth D2 of the groove 811 located in the second light-emitting unit 72 can be made smaller than the depth D3 of the groove 811 located in the third light-emitting unit 73 by setting the thickness of the encapsulation unit 81 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72 to be thicker than the thickness of the encapsulation unit 81 corresponding to the third light-emitting unit 73.

[0138] Since the depth D1 of the groove 811 of the first light-emitting unit 71 and the depth D2 of the groove 811 of the second light-emitting unit 72 are both smaller than the depth D3 of the groove 811 of the third light-emitting unit 73, in the process of forming the second light-emitting unit 72, the second electrode of the second light-emitting unit 72 can be continuously formed at the groove 811 of the first light-emitting unit 71, so when the second light-emitting unit 72 is subsequently patterned, the second electrode of the second light-emitting unit 72 can provide more complete protection for the first light-emitting unit 71. In the process of forming the third light-emitting unit 73, the second electrode of the third light-emitting unit 73 can be continuously formed at the groove 811 of the second light-emitting unit 72, so when the third light-emitting unit 73 is subsequently patterned, the second electrode of the third light-emitting unit 73 can provide more complete protection for the second light-emitting unit 72, so that the first light-emitting unit 71 and the second light-emitting unit 72 are not easily damaged, and the first light-emitting unit 71 and the second light-emitting unit 72 are not easily invalidated.

[0139] Since the third light-emitting unit 73 is the last light-emitting unit 7 prepared for the display panel, there is no need to consider whether the preparation of other light-emitting units 7 may cause damage to the third light-emitting unit 73. In this way, the thickness of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 can be set to be smaller than the thickness of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72. Since the thickness of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 is smaller than the thickness of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72, the patterning of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 can be completed in less time, thereby improving the efficiency of preparing the display panel.

[0140] For some possible implementations, see again Figure 4 , along the direction perpendicular to the array substrate 1, the depth D1 of the groove 811 located in the first light-emitting unit 71 ranges from 0.03 μm to 0.07 μm, for example, the depth D1 may be 0.03 μm, 0.04 μm, 0.05 μm, 0.06 μm or 0.07 μm, etc. By properly setting the depth D1, the first light-emitting unit 71 may be less likely to fail without increasing too many packaging units 81 corresponding to the first light-emitting unit 71.

[0141] Preferably, see again Figure 4 , along the direction perpendicular to the array substrate 1, the depth D2 of the groove 811 located in the second light emitting unit 72 ranges from 0.03 μm to 0.07 μm, for example, the depth D2 may be 0.03 μm, 0.04 μm, 0.05 μm, 0.06 μm or 0.07 μm, etc. By properly setting the depth D2, the second light emitting unit 72 may be less likely to fail without increasing too many packaging units 81 corresponding to the second light emitting unit 72.

[0142] Preferably, see again Figure 4 , along the direction perpendicular to the array substrate 1, the depth D3 of the groove 811 located in the third light emitting unit 73 ranges from 0.1 μm to 0.2 μm, for example, the depth D3 can be 0.1 μm, 0.12 μm, 0.15 μm, 0.18 μm or 0.2 μm, etc. Reasonable setting of the depth D3 can improve the patterning efficiency of the first encapsulation layer 8 corresponding to the third light emitting unit 73.

[0143] Preferably, see again Figure 4 , along a direction perpendicular to the array substrate 1 , a depth D2 of the groove 811 located in the second light emitting unit 72 is equal to a depth D1 of the groove 811 located in the first light emitting unit 71 .

[0144] Here, the depth D2 and the depth D1 may not be absolutely equal. As long as the difference between the depth D2 and the depth D1 is within a preset error range, the depth D2 and the depth D1 can be considered equal. For example, if the difference between the depth D2 and the depth D1 is within 15%, the depth D2 and the depth D1 can be considered equal.

[0145] Since the first light-emitting unit 71 and the second light-emitting unit 72 are not the last light-emitting unit 7 prepared for the display panel, it is necessary to set the depth of the groove 811 located in the first light-emitting unit 71 and the second light-emitting unit 72 to be less than the depth of the groove 811 located in the third light-emitting unit 73. In this embodiment, the depth D2 of the groove 811 located in the second light-emitting unit 72 is set to be equal to the depth D1 of the groove 811 located in the first light-emitting unit 71, so that the preparation process of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72 can be the same, thereby improving the efficiency of preparing the display panel.

[0146] For some possible implementations, see Figure 4 and Figure 5 , the orthographic projection of the groove 811 on the array substrate 1 is located within the orthographic projection of the isolation opening 9 on the array substrate 1 .

[0147] The isolation opening 9 of this embodiment can be understood as the largest opening formed by the side walls of the isolation structure 3, for example, Figure 5 The dotted line of the outermost circle of the same light-emitting unit 7 in FIG. 8 represents the maximum opening formed by the side wall of the isolation structure 3. Since the orthographic projection of the side of the isolation structure 3 close to the array substrate 1 on the array substrate 1 is located within the orthographic projection of the side of the isolation structure 3 away from the array substrate 1 on the array substrate 1, the orthographic projection of at least part of the groove 811 on the array substrate 1 is also located within the orthographic projection of the isolation structure 3 on the array substrate 1. In this way, the groove 811 is located at the position of the first packaging unit 81 close to the side wall of the isolation structure 3.

[0148] Preferably, see again Figure 5 The orthographic projection shape of the groove 811 on the array substrate 1 is similar to the orthographic projection shape of the isolation opening 9 on the array substrate 1 .

[0149] Preferably, see again Figure 4 , the orthographic projection of the groove 811 on the array substrate 1 is annular, the orthographic projection of the groove 811 on the array substrate 1 surrounds at least part of the orthographic projection of the light-emitting unit 7 on the array substrate 1, and the depths of the same groove 811 surrounding the light-emitting unit 7 at different positions are equal, that is, along the direction perpendicular to the array substrate 1, the depths of the same groove 811 located at the same light-emitting unit 7 at different positions are equal. In this way, when forming the second light-emitting unit 72, the second electrode of the second light-emitting unit 72 can more completely protect the first light-emitting unit 71, and when forming the third light-emitting unit 73, the second electrode of the third light-emitting unit 73 can more completely protect the first light-emitting unit 71 and the second light-emitting unit 72, thereby improving the display effect of the display panel.

[0150] For some possible implementations, see again Figure 4 Adjacent packaging units 81 are spaced apart on a side of the isolation structure 3 away from the array substrate 1, and there is a gap between the packaging unit 81 located on the side of the isolation structure 3 away from the array substrate 1 and the side of the isolation structure 3 away from the array substrate 1, and the orthographic projection of the packaging unit 81 on the array substrate 1 covers the orthographic projection of the isolation opening 9 on the array substrate 1 and covers part of the orthographic projection of the isolation structure 3 on the array substrate 1.

[0151] During the patterning process of the light-emitting unit 7 , the first encapsulation layer 8 is disconnected at the isolation structure 3 to form an encapsulation unit 81 . The encapsulation unit 81 can completely and independently encapsulate the corresponding light-emitting unit 7 , thereby improving the display characteristics of the display panel.

[0152] For some possible implementations, see Figure 6 The display panel further includes a second encapsulation layer 10 located on a side of the first encapsulation layer 8 away from the array substrate 1, and the display panel further includes a third encapsulation layer 11 located on a side of the second encapsulation layer 10 away from the array substrate 1. The materials of the first encapsulation layer 8 and the third encapsulation layer 11 both include inorganic materials, and the material of the second encapsulation layer 10 includes organic materials.

[0153] The second encapsulation layer 10 and the third encapsulation layer 11 can achieve a better encapsulation effect on the light-emitting unit 7, thereby further improving the encapsulation quality of the display panel.

[0154] For some possible implementations, see again Figure 6The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 which are stacked in sequence in a direction away from the array substrate 1, and the orthographic projection of the side of the first isolation portion 31 away from the array substrate 1 on the array substrate 1 is located within the orthographic projection of the second isolation portion 32 on the array substrate 1.

[0155] Since the second isolation portion 32 is located on the side of the first isolation portion 31 away from the array substrate 1, and the lateral width of the second isolation portion 32 is greater than the lateral width of the first isolation portion 31, the second isolation portion 32 disconnects the light-emitting functional layer and the second electrode layer at the isolation structure 3. In this way, the isolation structure 3 formed by the first isolation portion 31 and the second isolation portion 32 can make it easier to package each light-emitting unit 7 independently.

[0156] For some possible implementations, see again Figure 6 , the second electrode 6 of the light-emitting unit 7 is electrically connected to the first isolation portion 31; the first isolation portion 31 includes a conductive material, and the second electrode 6 corresponding to the light-emitting unit 7 extends to contact the side wall of the first isolation portion 31 to achieve electrical connection between the second electrode 6 corresponding to the light-emitting unit 7 and the first isolation portion 31.

[0157] See also Figure 7 The isolation structure 3 further includes a third isolation portion 33 located on a side of the first isolation portion 31 facing the array substrate 1 , and the second electrode 6 of the light emitting unit 7 is electrically connected to the third isolation portion 33 .

[0158] The third isolation portion 33 includes a conductive material, and the second electrode 6 corresponding to the light emitting unit 7 extends to contact the side wall of the third isolation portion 33 to achieve electrical connection between the second electrode 6 corresponding to the light emitting unit 7 and the third isolation portion 33 .

[0159] Specifically, the material of the third isolation portion 33 includes molybdenum metal; and / or, the material of the first isolation portion 31 includes aluminum metal; and / or, the material of the second isolation portion 32 includes titanium metal. In this way, when the isolation structure 3 separates the second electrode layer into the second electrode 6, the second electrode 6 is more easily electrically connected to the first isolation portion 31 and / or the third isolation portion 33.

[0160] In summary, the present application sets the depth of the groove 811 located in the first light-emitting unit 71 to be smaller than the sum of the thicknesses of the light-emitting portion 5 and the second electrode 6 of the second light-emitting unit 72. When preparing the second light-emitting unit 72, the second electrode 6 of the second light-emitting unit 72 can be continuously formed on the side of the first light-emitting unit 71 away from the array substrate 1, thereby providing better protection for the first light-emitting unit 71, making it less likely to damage the first light-emitting unit 71, and further improving the display effect of the display panel.

[0161] For some possible implementations, see Figure 8The present application also provides a method for preparing a display panel, the method comprising:

[0162] S10: providing an array substrate 1.

[0163] The array substrate 1 may include a substrate and a plurality of driving units located on one side of the substrate, and each driving unit may include one or more semiconductor switching devices. The semiconductor switching device may be formed by the cooperation of a plurality of film layers in the array substrate 1, for example, the semiconductor switching device may be a thin film transistor formed by the cooperation of a plurality of film layers.

[0164] S11 : forming an isolation structure 3 on one side of the array substrate 1 , wherein the isolation structure 3 encloses an isolation opening 9 .

[0165] See also Fig. 9 A first electrode layer is formed on one side of the array substrate 1 , the first electrode layer includes a plurality of first electrodes 4 arranged at intervals, and the first electrode 4 includes an anode.

[0166] See also Fig.10 A pixel defining material layer 12 is formed on a side of the first electrode layer away from the array substrate 1 .

[0167] See also Fig.11 , an isolation structure material layer 13 is formed on a side of the pixel defining material layer 12 away from the array substrate 1 .

[0168] See also Fig.12 , the isolation structure material layer 13 is patterned to form an isolation structure 3.

[0169] See also Fig.13 The pixel defining material layer 12 is patterned to form a pixel defining layer 2, wherein the pixel defining layer 2 includes a pixel opening 21 exposing at least a portion of the first electrode 4; the orthographic projection of the pixel opening 21 on the array substrate 1 is located within the orthographic projection of the isolation opening 9 on the array substrate 1.

[0170] S12: At least a portion of the light-emitting unit 7 is formed in the isolation opening 9, and a first packaging layer 8 is formed on a side of the light-emitting unit 7 away from the array substrate 1, the light-emitting unit 7 includes a light-emitting portion 5 and a second electrode 6 stacked in sequence along a direction away from the array substrate 1, the light-emitting unit 7 includes a first light-emitting unit 71 and a second light-emitting unit 72, the first packaging layer 8 includes a plurality of packaging units 81 arranged at intervals, the packaging units 81 at least cover the light-emitting unit 7 and extend to the side of the isolation structure 3, and the side of the isolation structure 3 is the surface of the isolation structure 3 facing the isolation opening 9.

[0171] Among them, the side of the packaging unit 81 away from the array substrate 1 includes a groove 811, and along the direction perpendicular to the array substrate 1, the depth of the groove 811 located in the first light-emitting unit 71 is less than the sum of the thicknesses of the light-emitting portion 5 and the second electrode 6 of the second light-emitting unit 72.

[0172] See also Fig.14 , a light-emitting functional layer of the first light-emitting unit 71 is formed on a side of the isolation structure 3 away from the array substrate 1 .

[0173] The light-emitting functional layer is disconnected at the isolation structure 3 , so that at least part of the light-emitting functional layer is located in the isolation opening 9 to form a light-emitting portion 5 . By controlling the evaporation angle, the light-emitting portion 5 is prevented from contacting the isolation structure 3 .

[0174] See also Fig.15 A second electrode layer is formed on a side of the light-emitting functional layer of the first light-emitting unit 71 away from the array substrate 1 .

[0175] The second electrode layer is disconnected at the isolation structure 3, so that at least part of the second electrode layer is located in the isolation opening 9 to form the second electrode 6. By controlling the evaporation angle, the second electrode 6 can be extended from the isolation opening 9 to electrically contact the isolation structure 3 to connect adjacent second electrodes 6 or connect the second electrode 6 to other circuits. In this way, the manufacturing difficulty of the display panel can be reduced.

[0176] See also Fig.16 A first packaging layer 8 is formed on a side of the second electrode layer away from the array substrate 1 , and the first packaging layer 8 forms a groove 811 in the isolation opening 9 corresponding to the first light-emitting unit 71 .

[0177] See also Fig.17 A first etching protection layer 14 is formed in the isolation opening 9 corresponding to the first light-emitting unit 71 , and the first etching protection layer 14 also extends to cover a portion of the isolation structure 3 .

[0178] The first etching protection layer 14 can protect the corresponding light-emitting functional layer, the second electrode layer and the first encapsulation layer 8 of the first light-emitting unit 71 .

[0179] See also Fig.18 , remove the first packaging layer 8, the light-emitting functional layer and the second electrode layer that are not covered by the first etching protection layer 14, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure 3 away from the array substrate 1, and remove the first etching protection layer 14 to form a light-emitting portion 5, a second electrode 6 and a packaging unit 81 in the isolation opening 9 corresponding to the first light-emitting unit 71, and the packaging unit 81 located on the side of the second electrode 6 away from the array substrate 1 forms a groove 811 corresponding to the first light-emitting unit 71, and the second electrode 6 extends to be electrically connected to the isolation structure 3 corresponding to the first light-emitting unit 71.

[0180] Preferably, along the direction perpendicular to the array substrate 1, the depth D1 of the groove 811 located in the first light-emitting unit 71 ranges from 0.03 μm to 0.07 μm, for example, the depth D1 may be 0.03 μm, 0.04 μm, 0.05 μm, 0.06 μm or 0.07 μm, etc. By properly setting the depth D1, the first light-emitting unit 71 may be less likely to fail without increasing too many packaging units 81 corresponding to the first light-emitting unit 71.

[0181] Preferably, the orthographic projection of the groove 811 on the array substrate 1 is annular, and the orthographic projection of the groove 811 on the array substrate 1 surrounds at least part of the orthographic projection of the first light-emitting unit 71 on the array substrate 1, and the depths of the same groove 811 surrounding the first light-emitting unit 71 at different positions are equal, that is, along the direction perpendicular to the array substrate 1, the depths of the same groove 811 located at different positions of the first light-emitting unit 71 are equal. When forming the second light-emitting unit 72, the second electrode of the second light-emitting unit 72 can provide more complete protection for the first light-emitting unit 71, so that the first light-emitting unit 71 is not easily invalidated.

[0182] After removing the first encapsulation layer 8, the light-emitting functional layer and the second electrode layer that are not covered by the first etching protection layer 14, the first electrode 4, the light-emitting portion 5 of the first light-emitting unit 71 and the second electrode 6 form the first light-emitting unit 71, and the first light-emitting unit 71 is completely covered by the encapsulation unit 81, thereby reducing the risk of the evaporation material entering the evaporation equipment after being exposed to the air, causing equipment contamination and film layer disconnection.

[0183] In this way, the light-emitting portion 5, the second electrode 6 and the packaging unit 81 can be formed only in the pixel opening 21 corresponding to the first light-emitting unit 71 without the need for a precise mask, and the second electrode 6 can be electrically connected to the isolation structure 3, so that the first light-emitting unit 71 can be formed in the pixel opening 21 corresponding to the first light-emitting unit 71 at a lower cost.

[0184] See also Fig.19 A light-emitting functional layer of the second light-emitting unit 72 is formed on the side of the isolation structure 3 away from the array substrate 1 , and the light-emitting functional layer of the second light-emitting unit 72 covers the side of the packaging unit 81 corresponding to the first light-emitting unit 71 away from the array substrate 1 .

[0185] On the basis of forming the first light-emitting unit 71 , the light-emitting functional layer of the second light-emitting unit 72 is further formed. The light-emitting functional layer of the second light-emitting unit 72 will cover the packaging unit 81 corresponding to the first light-emitting unit 71 . At the same time, the light-emitting part 5 of the second light-emitting unit 72 will be formed in the pixel opening 21 corresponding to the second light-emitting unit 72 .

[0186] See also Fig. 20A second electrode layer is formed on a side of the light-emitting functional layer of the second light-emitting unit 72 away from the array substrate 1 .

[0187] When the second electrode layer is formed, the second electrode layer will be disconnected at the isolation structure 3, and the second electrode 6 of the second light-emitting unit 72 will be formed in the pixel opening 21 corresponding to the second light-emitting unit 72, the second electrode 6 of the second light-emitting unit 72 is connected to the corresponding electrode of the isolation structure 3, at least part of the light-emitting functional layer and / or at least part of the second electrode layer of the second light-emitting unit 72 fills at least part of the groove 811 located in the first light-emitting unit 71, and the second electrode layer of the second light-emitting unit 72 is continuously arranged at the groove 811 corresponding to the first light-emitting unit 71.

[0188] Since the depth D1 of the groove 811 located in the first light-emitting unit 71 is greatly reduced, when the second electrode layer of the second light-emitting unit 72 is formed, the second electrode layer of the second light-emitting unit 72 can be continuously formed in the groove 811 located in the first light-emitting unit 71. Therefore, when the second light-emitting unit 72 is subsequently patterned, the second electrode of the second light-emitting unit 72 can more completely protect the first light-emitting unit 71, thereby preventing the first light-emitting unit 71 from being damaged or failing.

[0189] See also Fig.21 A first packaging layer 8 is formed on a side of the second electrode layer away from the array substrate 1 , and a groove 811 is formed in the first packaging layer 8 in the isolation opening 9 corresponding to the second light-emitting unit 72 .

[0190] See also Fig. 22 A second etching protection layer 15 is formed in the isolation opening 9 corresponding to the second light-emitting unit 72 , and the second etching protection layer 15 also extends to cover a portion of the isolation structure 3 .

[0191] The second etching protection layer 15 can protect the corresponding light-emitting layer of the second light-emitting unit 72 , the second electrode layer and the first encapsulation layer 8 .

[0192] See also Fig.23 , removing the first encapsulation layer 8, the light-emitting functional layer and the second electrode layer of the second light-emitting unit 72 not covered by the second etching protection layer 15, and removing the light-emitting functional layer and the second electrode layer located on the side of the isolation structure 3 away from the array substrate 1, and removing the second etching protection layer 15, so as to form a light-emitting portion 5, a second electrode 6 and an encapsulation unit 81 in the isolation opening 9 corresponding to the second light-emitting unit 72, the encapsulation unit 81 located on the side of the second electrode 6 away from the array substrate 1 forms a groove 811 corresponding to the second light-emitting unit 72, and the second electrode 6 extends to be electrically connected to the isolation structure 3 corresponding to the second light-emitting unit 72;

[0193] Preferably, along the direction perpendicular to the array substrate 1, the depth D2 of the groove 811 located in the second light emitting unit 72 ranges from 0.03 μm to 0.07 μm, for example, the depth D2 may be 0.03 μm, 0.04 μm, 0.05 μm, 0.06 μm or 0.07 μm, etc. By properly setting the depth D2, the second light emitting unit 72 may be less likely to fail without increasing too many packaging units 81 corresponding to the second light emitting unit 72.

[0194] Preferably, the orthographic projection of the groove 811 on the array substrate 1 surrounds at least part of the orthographic projection of the second light-emitting unit 72 on the array substrate 1, and the depths of the same groove 811 surrounding the second light-emitting unit 72 at different positions are equal, that is, along the direction perpendicular to the array substrate 1, the depths of the same groove 811 located in the second light-emitting unit 72 at different positions are equal; when the third light-emitting unit 73 is formed, the second electrode of the third light-emitting unit 73 can provide more complete protection for the second light-emitting unit 72, thereby improving the yield of the second light-emitting unit 72.

[0195] Preferably, along the direction perpendicular to the array substrate 1, the depth D2 of the groove 811 located in the second light emitting unit 72 is equal to the depth D1 of the groove 811 located in the first light emitting unit 71. Here, the depth D2 and the depth D1 may not be absolutely equal, as long as the difference between the depth D2 and the depth D1 is within a preset error range, the depth D2 and the depth D1 can be considered equal, for example, the depth D2 and the depth D1 can be considered equal if the difference between the depth D2 and the depth D1 is within 15%.

[0196] Since the first light-emitting unit 71 and the second light-emitting unit 72 are not the last light-emitting unit 7 prepared for the display panel, it is necessary to set the depth of the groove 811 located in the first light-emitting unit 71 and the second light-emitting unit 72 to be less than the depth of the groove 811 located in the third light-emitting unit 73. In this embodiment, the depth D2 of the groove 811 located in the second light-emitting unit 72 is set to be equal to the depth D1 of the groove 811 located in the first light-emitting unit 71, so that the preparation process of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72 can be the same, thereby improving the efficiency of preparing the display panel.

[0197] After removing the first encapsulation layer 8, the light-emitting functional layer and the second electrode layer that are not covered by the second etching protection layer 15, the first electrode 4, the light-emitting portion 5 of the second light-emitting unit 72 and the second electrode 6 form a second light-emitting unit 72, and the second light-emitting unit 72 is completely covered by the encapsulation unit 81, thereby reducing the risk of the evaporation material entering the evaporation equipment after being exposed to the air, causing equipment contamination and film layer disconnection.

[0198] In this way, the light-emitting portion 5, the second electrode 6 and the packaging unit 81 can be formed only in the pixel opening 21 corresponding to the second light-emitting unit 72 without the need for a precise mask, and the second electrode 6 can be electrically connected to the isolation structure 3, so that the second light-emitting unit 72 can be formed in the pixel opening 21 corresponding to the second light-emitting unit 72 at a lower cost.

[0199] See also Fig.24 A light-emitting functional layer of the third light-emitting unit 73 is formed on the side of the isolation structure 3 away from the array substrate 1 , and the light-emitting functional layer of the third light-emitting unit 73 covers the side of the packaging unit 81 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72 away from the array substrate 1 .

[0200] On the basis of forming the first light-emitting unit 71 and the second light-emitting unit 72, the light-emitting functional layer of the third light-emitting unit 73 is further formed. The light-emitting functional layer of the third light-emitting unit 73 will cover the encapsulation units 81 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72. At the same time, the light-emitting portion 5 of the third light-emitting unit 73 will be formed in the pixel opening 21 corresponding to the third light-emitting unit 73.

[0201] See also Fig.25 A second electrode layer is formed on the side of the light-emitting functional layer of the third light-emitting unit 73 away from the array substrate 1, and at least part of the light-emitting functional layer and / or at least part of the second electrode layer of the third light-emitting unit 73 fills at least part of the groove 811 located in the first light-emitting unit 71 and the second light-emitting unit 72, and the second electrode layer of the third light-emitting unit 73 is continuously arranged at the groove 811 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72.

[0202] When forming the second electrode layer, the second electrode layer will be disconnected at the isolation structure 3, and the second electrode 6 of the third light-emitting unit 73 will be formed in the pixel opening 21 corresponding to the third light-emitting unit 73, and the second electrode 6 of the third light-emitting unit 73 is connected to the corresponding isolation structure 3 electrode.

[0203] Since the depth D2 of the groove 811 located in the second light-emitting unit 72 is greatly reduced, and the depth D1 of the groove 811 located in the first light-emitting unit 71 is greatly reduced, when the second electrode layer of the third light-emitting unit 73 is formed, the second electrode layer of the third light-emitting unit 73 can be continuously formed in the groove 811 located in the first light-emitting unit 71 and the second light-emitting unit 72. Therefore, when the third light-emitting unit 73 is subsequently patterned, the second electrode of the third light-emitting unit 73 can more completely protect the first light-emitting unit 71 and the second light-emitting unit 72, so that it is not easy to damage the first light-emitting unit 71 and the second light-emitting unit 72, and it is not easy to make the first light-emitting unit 71 and the second light-emitting unit 72 fail.

[0204] See also Fig.26 A first packaging layer 8 is formed on a side of the second electrode layer away from the array substrate 1 , and a groove 811 is formed in the first packaging layer 8 in the isolation opening 9 corresponding to the third light emitting unit 73 .

[0205] See also Fig. 27 A third etching protection layer 16 is formed in the isolation opening 9 corresponding to the third light-emitting unit 73 , and the third etching protection layer 16 also extends to cover a portion of the isolation structure 3 .

[0206] The third etching protection layer 16 can protect the corresponding light-emitting layer of the third light-emitting unit 73 , the second electrode layer and the first encapsulation layer 8 .

[0207] See also Fig.28 , remove the first packaging layer 8, the light-emitting functional layer and the second electrode layer of the third light-emitting unit 73 that are not covered by the third etching protection layer 16, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure 3 away from the array substrate 1, and remove the third etching protection layer 16 to form a light-emitting portion 5, a second electrode 6 and a packaging unit 81 in the isolation opening 9 corresponding to the third light-emitting unit 73, and the packaging unit 81 located on the side of the second electrode 6 away from the array substrate 1 forms a groove 811 corresponding to the third light-emitting unit 73, and the second electrode 6 extends to be electrically connected to the isolation structure 3 corresponding to the third light-emitting unit 73.

[0208] Preferably, along the direction perpendicular to the array substrate 1, the depth D3 of the groove 811 located in the third light-emitting unit 73 is greater than the depth of the groove 811 located in the first light-emitting unit 71 and the second light-emitting unit 72. Since the third light-emitting unit 73 is the last light-emitting unit 7 prepared for the display panel, there is no need to consider the damage to the third light-emitting unit 73 caused by the preparation of other light-emitting units 7. In this way, the thickness of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 can be set to be less than the thickness of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72. Since the thickness of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 is less than the thickness of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72, the patterning of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 can be completed in less time, thereby improving the efficiency of preparing the display panel.

[0209] Preferably, along the direction perpendicular to the array substrate 1, the depth D3 of the groove 811 located in the third light emitting unit 73 ranges from 0.1 μm to 0.2 μm, for example, the depth D3 may be 0.1 μm, 0.12 μm, 0.15 μm, 0.18 μm or 0.2 μm, etc. Reasonable setting of the depth D3 may improve the patterning efficiency of the first encapsulation layer 8 corresponding to the third light emitting unit 73.

[0210] Preferably, the orthographic projection of the groove 811 on the array substrate 1 surrounds at least part of the orthographic projection of the third light emitting unit 73 on the array substrate 1, and the depths of the same groove 811 surrounding the third light emitting unit 73 at different positions are equal, that is, the depths of the same groove 811 located at different positions of the third light emitting unit 73 are equal along the direction perpendicular to the array substrate 1. In this way, the light uniformity of the third light emitting unit 73 is better.

[0211] In this way, the display panel formed by the above method is not likely to damage the front first light-emitting unit 71 and the second light-emitting unit 72, thereby improving the light-emitting effect of the display panel formed by the above method.

[0212] In some possible implementations, the present application further provides an electronic device, which includes the display panel of the present application, or includes a display panel prepared by the method for preparing a display panel of the present application. The electronic device may include a device with image processing capabilities, such as a server, a personal computer, a laptop computer, etc. Since the electronic device includes the display panel of the present application, the display quality of the electronic device is higher.

[0213] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0214] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: include: An array substrate; An isolation structure located at one side of the array substrate, the isolation structure enclosing an isolation opening; a light-emitting unit located in the isolation opening, the light-emitting unit comprising a light-emitting portion and a second electrode sequentially stacked in a direction away from the array substrate, the light-emitting unit comprising a first light-emitting unit and a second light-emitting unit; a first encapsulation layer located on a side of the light-emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of encapsulation units arranged at intervals, the encapsulation units at least covering the light-emitting unit and extending to a side surface of the isolation structure, the side surface of the isolation structure being a surface of the isolation structure facing the isolation opening; The packaging unit includes a groove on one side away from the array substrate, and along a direction perpendicular to the array substrate, the depth of the groove located at the first light-emitting unit is less than the sum of the thicknesses of the light-emitting portion of the second light-emitting unit and the second electrode.

2. The display panel according to claim 1, characterized in that: The light-emitting unit further includes a third light-emitting unit; along a direction perpendicular to the array substrate, the depth of the groove located in the second light-emitting unit is less than the sum of the thicknesses of the light-emitting portion of the third light-emitting unit and the second electrode; Preferably, the depth of the groove located in the first light-emitting unit is less than the thickness of the light-emitting portion of the second light-emitting unit; Preferably, the depth of the groove located in the second light-emitting unit is less than the thickness of the light-emitting portion of the third light-emitting unit; Preferably, along a direction perpendicular to the array substrate, a depth of the groove located in the first light emitting unit is smaller than a depth of the groove located in the third light emitting unit; Preferably, along a direction perpendicular to the array substrate, a depth of the groove located at the second light emitting unit is less than a depth of the groove located at the third light emitting unit; Preferably, the first light emitting unit, the second light emitting unit and the third light emitting unit all emit different colors of light.

3. The display panel according to claim 2, characterized in that: Along a direction perpendicular to the array substrate, the depth of the groove located at the first light emitting unit ranges from 0.03 μm to 0.07 μm; Preferably, along a direction perpendicular to the array substrate, the depth of the groove located at the second light emitting unit ranges from 0.03 μm to 0.07 μm; Preferably, along a direction perpendicular to the array substrate, the depth of the groove located at the third light emitting unit ranges from 0.1 μm to 0.2 μm; Preferably, along a direction perpendicular to the array substrate, a depth of the groove located in the second light emitting unit is equal to a depth of the groove located in the first light emitting unit.

4. The display panel according to any one of claims 1 to 3, characterized in that: The orthographic projection of the groove on the array substrate is located within the orthographic projection of the isolation opening on the array substrate; Preferably, at least part of the orthographic projection of the groove on the array substrate is located within the orthographic projection of the isolation structure on the array substrate; Preferably, the orthographic projection of the groove on the array substrate is annular, and the orthographic projection of the groove on the array substrate surrounds at least part of the orthographic projection of the light-emitting unit on the array substrate, and the depth of the same groove surrounding the light-emitting unit at different positions is equal.

5. The display panel according to any one of claims 1 to 3, characterized in that: Adjacent packaging units are arranged at intervals on a side of the isolation structure away from the array substrate; Preferably, there is a gap between the packaging unit located at a side of the isolation structure away from the array substrate and a side of the isolation structure away from the array substrate; Preferably, the orthographic projection of the packaging unit on the array substrate covers the orthographic projection of the isolation opening on the array substrate and covers a portion of the orthographic projection of the isolation structure on the array substrate.

6. The display panel according to claim 5, characterized in that: The display panel further comprises a second packaging layer located on a side of the first packaging layer away from the array substrate; Preferably, the display panel further comprises a third packaging layer located on a side of the second packaging layer away from the array substrate; Preferably, the materials of the first encapsulation layer and the third encapsulation layer both include inorganic materials; Preferably, the material of the second encapsulation layer includes organic material.

7. The display panel according to any one of claims 1 to 3, characterized in that: The light emitting unit further comprises a first electrode located on a side of the light emitting portion close to the array substrate; Preferably, the display panel further comprises a pixel defining layer located on a side of the film layer where the first electrode is located away from the array substrate, and the isolation structure is located on a side of the pixel defining layer away from the array substrate; the pixel defining layer comprises a pixel opening exposing at least a portion of the first electrode, and the orthographic projection of the isolation structure on the array substrate is located between the orthographic projections of two adjacent pixel openings on the array substrate; Preferably, the orthographic projection of the pixel opening on the array substrate is located within the orthographic projection of the isolation opening on the array substrate.

8. The display panel according to any one of claims 1 to 3, characterized in that: The isolation structure includes a first isolation portion and a second isolation portion which are stacked in sequence in a direction away from the array substrate, wherein the orthographic projection of the first isolation portion on the array substrate at a side away from the array substrate is located within the orthographic projection of the second isolation portion on the array substrate.

9. The display panel according to claim 8, characterized in that: The second electrode of the light-emitting unit is electrically connected to the first isolation portion; and / or the isolation structure further includes a third isolation portion located on a side of the first isolation portion facing the array substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion; Preferably, the material of the third isolation portion includes molybdenum metal; and / or the material of the first isolation portion includes aluminum metal; and / or the material of the second isolation portion includes titanium metal.

10. A method for preparing a display panel, characterized in that: The method comprises: Providing an array substrate; An isolation structure is formed on one side of the array substrate, wherein the isolation structure encloses an isolation opening; At least a portion of a light emitting unit is formed in the isolation opening, and a first encapsulation layer is formed on a side of the light emitting unit away from the array substrate, the light emitting unit includes a light emitting portion and a second electrode sequentially stacked in a direction away from the array substrate, the light emitting unit includes a first light emitting unit and a second light emitting unit, the first encapsulation layer includes a plurality of encapsulation units arranged at intervals, the encapsulation units at least cover the light emitting units and extend to a side surface of the isolation structure, and the side surface of the isolation structure is a surface of the isolation structure facing the isolation opening; The packaging unit includes a groove on one side away from the array substrate, and along a direction perpendicular to the array substrate, the depth of the groove located at the first light-emitting unit is less than the sum of the thicknesses of the light-emitting portion of the second light-emitting unit and the second electrode.

11. The method for preparing a display panel according to claim 10, characterized in that: The step of forming an isolation structure on one side of the array substrate includes: forming a first electrode layer on one side of the array substrate, wherein the first electrode layer includes a plurality of first electrodes arranged at intervals; forming a pixel defining material layer on a side of the first electrode layer away from the array substrate; forming an isolation structure material layer on a side of the pixel defining material layer away from the array substrate; Performing patterning on the isolation structure material layer to form an isolation structure; The pixel defining material layer is patterned to form a pixel defining layer, wherein the pixel defining layer includes a pixel opening exposing at least a portion of the first electrode; the orthographic projection of the pixel opening on the array substrate is located within the orthographic projection of the isolation opening on the array substrate.

12. The method for preparing a display panel according to claim 10, characterized in that: The step of forming at least part of the light emitting unit in the isolation opening and forming a first encapsulation layer on a side of the light emitting unit away from the array substrate comprises: forming a light-emitting functional layer of a first light-emitting unit on a side of the isolation structure away from the array substrate; A second electrode layer formed on a side of the light-emitting functional layer of the first light-emitting unit away from the array substrate; forming a first packaging layer on a side of the second electrode layer away from the array substrate; forming a first etching protection layer in the isolation opening corresponding to the first light-emitting unit, wherein the first etching protection layer also extends to cover a portion of the isolation structure; The first encapsulation layer, the light-emitting functional layer and the second electrode layer that are not covered by the first etching protection layer are removed, and the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate are removed, and the first etching protection layer is removed, so as to form a light-emitting portion, a second electrode and an encapsulation unit in the isolation opening corresponding to the first light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the first light-emitting unit; Preferably, the second electrode extends to be electrically connected to an isolation structure corresponding to the first light-emitting unit; Preferably, along a direction perpendicular to the array substrate, the depth of the groove located in the first light emitting unit ranges from 0.03 μm to 0.07 μm; Preferably, the orthographic projection of the groove on the array substrate is annular, and the orthographic projection of the groove on the array substrate surrounds at least part of the orthographic projection of the first light-emitting unit on the array substrate, and the depth of the same groove surrounding the first light-emitting unit at different positions is equal.

13. The method for preparing a display panel according to claim 12, characterized in that: After the steps of removing the first encapsulation layer, the light-emitting functional layer, and the second electrode layer that are not covered by the first etching protection layer, removing the light-emitting functional layer and the second electrode layer located on a side of the isolation structure away from the array substrate, and removing the first etching protection layer, the method further includes: A light-emitting functional layer of a second light-emitting unit is formed on a side of the isolation structure away from the array substrate, wherein the light-emitting functional layer of the second light-emitting unit covers a side of the packaging unit corresponding to the first light-emitting unit away from the array substrate; A second electrode layer is formed on a side of the light-emitting functional layer of the second light-emitting unit away from the array substrate, and at least a portion of the light-emitting functional layer of the second light-emitting unit and / or at least a portion of the second electrode layer fills at least a portion of the groove located in the first light-emitting unit, and the second electrode layer of the second light-emitting unit is continuously arranged at the groove corresponding to the first light-emitting unit; forming a first packaging layer on a side of the second electrode layer away from the array substrate; forming a second etching protection layer in the isolation opening corresponding to the second light emitting unit; The first encapsulation layer, the light-emitting functional layer and the second electrode layer of the second light-emitting unit not covered by the second etching protection layer are removed, and the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate are removed, and the second etching protection layer is removed to form a light-emitting portion, a second electrode and an encapsulation unit in the isolation opening corresponding to the second light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the second light-emitting unit; Preferably, the second electrode extends to be electrically connected to an isolation structure corresponding to the second light-emitting unit; Preferably, along a direction perpendicular to the array substrate, the depth of the groove located at the second light emitting unit ranges from 0.03 μm to 0.07 μm; Preferably, the orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the second light emitting unit on the array substrate, and the depths of the same groove surrounding the second light emitting unit at different positions are equal; Preferably, along a direction perpendicular to the array substrate, a depth of the groove located in the second light emitting unit is equal to a depth of the groove located in the first light emitting unit.

14. The method for preparing a display panel according to claim 13, characterized in that: After the steps of removing the first encapsulation layer, the light-emitting functional layer, and the second electrode layer of the second light-emitting unit not covered by the second etching protection layer, removing the light-emitting functional layer and the second electrode layer located on a side of the isolation structure away from the array substrate, and removing the second etching protection layer, the method further includes: A light-emitting functional layer of a third light-emitting unit is formed on a side of the isolation structure away from the array substrate, and a light-emitting functional layer of the second light-emitting unit covers a side of the packaging unit corresponding to the first light-emitting unit and the second light-emitting unit away from the array substrate; A second electrode layer is formed on a side of the light-emitting function layer of the third light-emitting unit away from the array substrate, at least a portion of the light-emitting function layer of the third light-emitting unit and / or at least a portion of the second electrode layer fills at least a portion of the groove located in the first light-emitting unit and the second light-emitting unit, and the second electrode layer of the third light-emitting unit is continuously arranged at the groove corresponding to the first light-emitting unit and the second light-emitting unit; forming a first packaging layer on a side of the second electrode layer away from the array substrate; forming a third etching protection layer in the isolation opening corresponding to the third light emitting unit; The first encapsulation layer, the light-emitting function layer and the second electrode layer of the third light-emitting unit not covered by the third etching protection layer are removed, and the light-emitting function layer and the second electrode layer located on the side of the isolation structure away from the array substrate are removed, and the third etching protection layer is removed to form a light-emitting portion, a second electrode and an encapsulation unit in the isolation opening corresponding to the third light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the third light-emitting unit; Preferably, the second electrode extends to be electrically connected to an isolation structure corresponding to the third light emitting unit; Preferably, along a direction perpendicular to the array substrate, a depth of the groove located in the third light emitting unit is greater than a depth of the groove located in the first light emitting unit and / or located in the second light emitting unit; Preferably, along a direction perpendicular to the array substrate, the depth of the groove located at the third light emitting unit ranges from 0.1 μm to 0.2 μm; Preferably, the orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the third light emitting unit on the array substrate, and the depths of the same groove surrounding the third light emitting unit at different positions are equal.

15. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 9, or comprises a display panel prepared by the method for preparing a display panel according to any one of claims 10 to 14.

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