Preparation method of display panel, display panel and display device

Abstract

The invention relates to a preparation method of a display panel, the display panel and a display device. The preparation method comprises the following steps: forming a pixel defining material layer on a substrate; performing first patterning processing on the pixel defining material layer to form a pixel defining layer provided with a first isolation opening and a plurality of pixel openings; the first isolation opening is provided with a first isolation sub-opening and a second isolation sub-opening which are arranged in the thickness direction of the substrate, the first isolation sub-opening and the second isolation sub-opening are close to one side of the substrate, and the orthographic projection of the second isolation sub-opening on the substrate is located in the orthographic projection of the first isolation sub-opening on the substrate; a plurality of light emitting portions are formed on one side of the substrate. The display panel formed by using the preparation method provided by the invention can prevent transverse flow of current between pixels, and the use performance of a display product comprising the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a display panel, a display panel and a display device. Background Art

[0002] With the development of society and the advancement of science and technology, the technology of smart terminal devices and wearable devices is developing faster and faster, and the requirements for flat panel displays are gradually increasing. OLED (Organic Light Emitting Diode) has the advantages of simple preparation process, bendability and good flexibility, and is widely used in smart terminal products such as mobile phones and tablets.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] Based on this, it is necessary to provide a method for preparing a display panel, a display panel and a display device that can solve the above technical problems and improve the performance of display products.

[0005] In a first aspect, an embodiment of the present application provides a method for preparing a display panel, the method comprising:

[0006] forming a pixel definition material layer on the substrate;

[0007] The pixel defining material layer is subjected to a first patterning process to form a pixel defining layer having a first isolation opening and a plurality of pixel openings; the first isolation opening has a first isolation sub-opening and a second isolation sub-opening arranged along the thickness direction of the substrate, the first isolation sub-opening is located on a side of the second isolation sub-opening close to the substrate, and the orthographic projection of the second isolation sub-opening on the substrate is located within the orthographic projection of the first isolation sub-opening on the substrate;

[0008] A plurality of light emitting parts are formed on one side of the substrate.

[0009] In one embodiment, the pixel defining material layer includes a first pixel defining material layer and a second pixel defining material layer stacked together, and the pixel defining material layer is subjected to a first patterning process to form a pixel defining layer having a first isolation opening and a plurality of pixel openings, including:

[0010] Performing a second patterning process on the first pixel defining material layer and the second pixel defining material layer to form a pixel defining intermediate material layer having a second isolation opening and the plurality of pixel openings; a second isolation opening is provided between at least two adjacent pixel openings;

[0011] The sidewall of the pixel defining intermediate material layer facing the second isolation opening is etched to form a first defining layer including the first isolation opening and a second defining layer.

[0012] In one embodiment, before forming a pixel definition material layer on a substrate, the preparation method includes:

[0013] A plurality of first electrodes are formed on one side of the substrate; the plurality of first electrodes are located on a side of the light emitting portion close to the substrate, and a second isolation opening is provided between at least two adjacent first electrodes.

[0014] In one embodiment, a second patterning process is performed on the first pixel defining material layer and the second pixel defining material layer to form a pixel defining intermediate material layer having a second isolation opening and a plurality of pixel openings, including:

[0015] The first pixel defining material layer and the second pixel defining material layer are etched by a first etching method, so that a pixel defining intermediate material layer having a second isolation opening and a plurality of pixel openings is formed on a side of the plurality of first electrodes away from the substrate; the second isolation opening is provided between at least partially adjacent two pixel openings;

[0016] Optionally, the process gas of the first etching method includes a fluorine-containing gas.

[0017] In one embodiment, etching the sidewall of the pixel-defining intermediate material layer toward the second isolation opening includes:

[0018] Using a second etching method to etch the sidewall of the pixel-defining intermediate material layer toward the second isolation opening;

[0019] Wherein, under the preset etching conditions, the etching rate of the second etching method on the first pixel defining material layer is greater than the etching rate on the second pixel defining material layer;

[0020] Optionally, the process gas of the second etching method includes oxygen.

[0021] In one embodiment, etching the first pixel definition material layer and the second pixel definition material layer using a first etching method includes:

[0022] A first photoresist is formed on a side of the second pixel defining material layer away from the substrate, and a first etching method is used to expose, develop and etch the first pixel defining material layer and the second pixel defining material layer.

[0023] In one embodiment, before etching the sidewall of the pixel-defining intermediate material layer facing the second isolation opening, the preparation method includes:

[0024] A second photoresist is formed on a side of the second pixel defining material layer away from the substrate, and is exposed and developed to reveal a second isolation opening.

[0025] In one embodiment, the light emitting portion further includes a first light emitting portion and a second light emitting portion, and a plurality of light emitting portions are formed on one side of the substrate, including:

[0026] A plurality of first light-emitting portions are formed on one side of the substrate; at least a portion of the first light-emitting portions are disposed in a plurality of first pixel openings in a one-to-one correspondence with each other;

[0027] Forming a first sacrificial material layer and a second sacrificial material layer on the first light-emitting portion;

[0028] A plurality of second light emitting portions are formed on one side of the substrate; at least a portion of the second light emitting portions are disposed in a plurality of second pixel openings in a one-to-one correspondence with each other;

[0029] Optionally, the plurality of light emitting portions further include a plurality of third light emitting portions;

[0030] After forming a plurality of second light-emitting portions on one side of the substrate, the preparation method further includes:

[0031] Forming a stacked third sacrificial material layer and a fourth sacrificial material layer on the second light emitting portion;

[0032] A plurality of third light-emitting portions are formed on one side of the substrate; at least a portion of the third light-emitting portions are disposed in a plurality of third pixel openings in a one-to-one correspondence with each other;

[0033] Forming a fifth sacrificial material layer and a sixth sacrificial material layer in a stack on the third light-emitting portion;

[0034] Optionally, after forming a fifth sacrificial material layer and a sixth sacrificial material layer stacked on the third light-emitting portion, the preparation method further comprises:

[0035] forming an isolation material layer on a side of the plurality of light-emitting portions away from the substrate;

[0036] Performing a third patterning process on the isolation material layer to form an isolation layer; the isolation layer covers the first isolation opening and exposes a plurality of pixel openings;

[0037] Optionally, after performing a third patterning process on the isolation material layer to form an isolation layer, the preparation method further includes:

[0038] Performing a fourth patterning process on the first sacrificial material layer, the second sacrificial material layer, the third sacrificial material layer, the fourth sacrificial material layer, the fifth sacrificial material layer and the sixth sacrificial material layer to form a sacrificial layer corresponding to the first light-emitting portion, a sacrificial layer corresponding to the second light-emitting portion and a sacrificial layer corresponding to the third light-emitting portion;

[0039] The sacrificial layer corresponding to the first light-emitting portion is located on a side of the first part of the first light-emitting portion away from the substrate, and the first part of the first light-emitting portion is located on a side of the pixel defining layer away from the substrate; the sacrificial layer corresponding to the second light-emitting portion is located on a side of the first part of the second light-emitting portion away from the substrate, and the first part of the second light-emitting portion is located on a side of the pixel defining layer away from the substrate; the sacrificial layer corresponding to the third light-emitting portion is located on a side of the first part of the third light-emitting portion away from the substrate, and the first part of the third light-emitting portion is located on a side of the pixel defining layer away from the substrate.

[0040] In one embodiment, after forming a plurality of light-emitting portions on one side of a substrate, the preparation method includes:

[0041] forming a second electrode on a side of the plurality of light-emitting portions away from the substrate;

[0042] forming a packaging structure on a side of the second electrode away from the substrate;

[0043] Optionally, before forming the second electrode on a side of the plurality of light-emitting portions away from the substrate, the preparation method further comprises:

[0044] A common layer is formed on a side of the plurality of light emitting portions away from the substrate.

[0045] In a second aspect, an embodiment of the present application provides a display panel, including:

[0046] substrate;

[0047] A pixel defining layer is provided on one side of the substrate; the pixel defining layer is provided with a first isolation opening and a plurality of pixel openings, the first isolation opening has a first isolation sub-opening and a second isolation sub-opening provided along the thickness direction of the substrate, the first isolation sub-opening is located on a side of the second isolation sub-opening close to the substrate, and the orthographic projection of the second isolation sub-opening on the substrate is located within the orthographic projection of the first isolation sub-opening on the substrate;

[0048] The plurality of light emitting parts, at least some of which are respectively arranged in corresponding pixel openings.

[0049] In one embodiment, the pixel defining layer includes a first defining layer and a second defining layer, the first defining layer is provided with a first spacer opening, and the second defining layer is provided with a second spacer opening;

[0050] Optionally, under preset etching conditions, an etching rate of the material of the first defining layer at the first isolation opening is greater than an etching rate of the material of the second defining layer.

[0051] In one embodiment, the display panel further comprises:

[0052] A plurality of first electrodes are arranged on a side of the light emitting portion close to the substrate, and a first isolation opening is arranged between at least two adjacent first electrodes.

[0053] In one embodiment, a first isolation opening is disposed around the periphery of each pixel opening;

[0054] Optionally, the orthographic projection of the first isolation opening on the substrate is annular;

[0055] Optionally, the plurality of first isolation openings are interconnected and their orthographic projections on the substrate form a grid.

[0056] In one embodiment, the material of the first defining layer is an organic material, and the material of the second defining layer is an inorganic material;

[0057] Optionally, the material of the first defining layer includes photosensitive polyimide, and the material of the second defining layer includes silicon oxide, silicon nitride or silicon oxynitride.

[0058] In one of the embodiments, the pixel opening comprises a first sub-pixel opening and a second sub-pixel opening arranged along the thickness direction of the substrate, the first sub-pixel opening being located on a side of the second sub-pixel opening close to the substrate; the orthographic projection of the first sub-pixel opening on the substrate is located within the orthographic projection range of the second sub-pixel opening on the substrate;

[0059] Optionally, a surface of the first defining layer facing the pixel opening and a bottom surface of the first defining layer facing the substrate form a first angle, and the first angle is an acute angle;

[0060] Optionally, a second angle is formed between a surface of the second defining layer facing the pixel opening and a bottom surface of the second defining layer facing the substrate, and the second angle is an acute angle;

[0061] Optionally, a cross section of the pixel opening along the thickness direction of the substrate is in an inverted trapezoidal shape.

[0062] In one embodiment, the display panel also includes a sacrificial layer, the light-emitting portion includes a first portion located on the side of the pixel defining layer away from the substrate and a second portion located in the pixel opening, and along the thickness direction of the substrate, the sacrificial layer is located on the side of the first portion of the light-emitting portion away from the substrate.

[0063] Optionally, the sacrificial layer is provided with a first opening and a second opening, the first opening is provided corresponding to the pixel opening, and the second opening is connected to the first isolation opening;

[0064] Optionally, the sacrificial layer includes a first sub-sacrificial layer and a second sub-sacrificial layer, and the first sub-sacrificial layer is located on a side of the second sub-sacrificial layer close to the substrate.

[0065] In one embodiment, the display panel further comprises:

[0066] An isolation layer filling the first isolation opening and exposing the plurality of pixel openings;

[0067] A second electrode, the second electrode continuously covers the plurality of light-emitting portions and extends along a surface of the light-emitting portion away from the substrate to a surface of the isolation layer away from the substrate;

[0068] Optionally, the display panel further comprises a packaging structure, and the packaging structure is arranged on a side of the second electrode away from the substrate;

[0069] Optionally, the isolation layer includes a filling portion and a top portion, the filling portion is located on a side of the top portion close to the substrate, and an orthographic projection of the filling portion on the substrate is located within a range of an orthographic projection of the top portion on the substrate;

[0070] Optionally, the cross section of the top along the thickness direction of the substrate is a regular trapezoid;

[0071] Optionally, the display panel further comprises a common layer, which is arranged on a side of the plurality of light-emitting portions away from the substrate;

[0072] Optionally, the material of the isolation layer is an organic insulating material.

[0073] In a third aspect, an embodiment of the present application further provides a display device, comprising a display panel prepared by the method for preparing a display panel provided in the first aspect, or a display panel provided in the second aspect.

[0074] The embodiments of the present application provide a method for preparing a display panel, a display panel, and a display device, by forming a pixel defining material layer on a substrate; performing a first patterning process on the pixel defining material layer to form a pixel defining layer having a first isolation opening and a plurality of pixel openings; the first isolation opening has a first isolation sub-opening and a second isolation sub-opening arranged along the thickness direction of the substrate, the first isolation sub-opening is located on a side of the second isolation sub-opening close to the substrate, and the orthographic projection of the second isolation sub-opening on the substrate is located within the orthographic projection of the first isolation sub-opening on the substrate. Such a first isolation opening can better prevent the crosstalk of the lateral current between the two light-emitting parts adjacent to the first isolation opening, thereby improving the display effect of the display panel, and further improving the performance of the display product including the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0076] Figure 1 A schematic flow chart of steps of a method for preparing a display panel provided in an embodiment;

[0077] Figure 2 A schematic flow chart of steps of a method for preparing a display panel provided in another embodiment;

[0078] Figure 3 A schematic flow chart of steps of a method for preparing a display panel provided in another embodiment;

[0079] Figure 4 A schematic flow chart of steps of a method for preparing a display panel provided in another embodiment;

[0080] Figure 5 A schematic flow chart of steps of a method for preparing a display panel provided in another embodiment;

[0081] Figure 6 A schematic flow chart of steps of a method for preparing a display panel provided in another embodiment;

[0082] Figure 7-Figure 14 for Figure 6 A schematic diagram of a cross-sectional structure of a display panel during a method for manufacturing the display panel shown;

[0083] Fig.15 A schematic diagram of a cross-sectional structure of a display panel provided by an embodiment;

[0084] Fig.16 A schematic diagram of the arrangement of pixel openings and second isolation openings in a display panel provided in an embodiment at a macroscopic perspective;

[0085] Fig.17 A schematic diagram of a cross-sectional structure of a display panel provided in another embodiment;

[0086] Fig.18 A schematic cross-sectional structure diagram of a display panel provided in another embodiment.

[0087] Description of reference numerals:

[0088] 1. First pixel defining material layer; 2. Second pixel defining material layer; 3. Second photoresist; 10. Display panel; 11. Substrate; 12. Pixel defining layer; 12a. First defining layer; 12b. Second defining layer; 121. First isolation opening; 121a. First isolation sub-opening; 121b. Second isolation sub-opening; 1210. Second isolation opening; 122. Pixel opening; 122a. First sub-pixel opening; 122b. Second sub-pixel opening; 13. Light-emitting portion; 13a. First portion; 13b. Second portion; 131. First light-emitting portion; 131a, first sacrificial material layer; 131b, second sacrificial material layer; 132, second light-emitting portion; 132a, third sacrificial material layer; 132b, fourth sacrificial material layer; 133, third light-emitting portion; 133a, fifth sacrificial material layer; 133b, sixth sacrificial material layer; 14, first electrode; 15, isolation layer; 151, filling portion; 152, top; 16, common layer and second electrode; 17, encapsulation structure; 18, sacrificial layer; 18a, first opening; 18b, second opening; 181, first sub-sacrificial layer; 182, second sub-sacrificial layer. DETAILED DESCRIPTION

[0089] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0090] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, they do not represent any order, quantity or importance, but are only used to distinguish different components. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the present application, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element. "Including" or "comprising" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0091] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0092] With the development of society and the advancement of science and technology, the technology of smart terminal devices and wearable devices is developing faster and faster, and the requirements for flat panel displays are gradually increasing. OLED (Organic Light Emitting Diode) has the advantages of simple preparation process, bendability and good flexibility, and is widely used in smart terminal products such as mobile phones and tablets.

[0093] In traditional technology, when using metal mask-free technology to prepare OLED display panels, the distance between different sub-pixels is relatively close, which easily leads to lateral flow of current between sub-pixels of different colors, resulting in crosstalk.

[0094] In view of this, the embodiments of the present application provide a method for preparing a display panel, a display panel, and a display device, wherein a pixel defining material layer is formed on a substrate; the pixel defining material layer is subjected to a first patterning process to form a pixel defining layer having a first isolation opening and a plurality of pixel openings; the first isolation opening has a first isolation sub-opening and a second isolation sub-opening arranged along the thickness direction of the substrate, the first isolation sub-opening is located on a side of the second isolation sub-opening close to the substrate, and the orthographic projection of the second isolation sub-opening on the substrate is located within the orthographic projection of the first isolation sub-opening on the substrate. Such a first isolation opening can better prevent the crosstalk of the lateral current between the two light-emitting parts adjacent to the first isolation opening, thereby improving the display effect of the display panel, and further improving the performance of the display product including the display panel.

[0095] See also Figure 1 An embodiment of the present application provides a method for preparing a display panel, and the specific steps of the method include:

[0096] Step 100: forming a pixel definition material layer on a substrate.

[0097] The pixel defining material layer may include one layer or multiple layers. When the pixel defining material layer includes multiple layers, the materials of the multiple layers of pixel defining material layers may be the same or different, and this embodiment does not limit this, as long as the function can be achieved.

[0098] Step 110, perform a first patterning process on the pixel defining material layer to form a pixel defining layer having a first isolation opening and a plurality of pixel openings; the first isolation opening has a first isolation sub-opening and a second isolation sub-opening arranged along the thickness direction of the substrate, the first isolation sub-opening is located on a side of the second isolation sub-opening close to the substrate, and the orthographic projection of the second isolation sub-opening on the substrate is located within the orthographic projection of the first isolation sub-opening on the substrate.

[0099] A mask plate is arranged on the pixel defining material layer, and a first patterning process is performed on the pixel defining material layer based on the mask plate to form a pixel defining layer. The formed pixel defining layer includes a first isolation opening and a plurality of pixel openings. The formed first isolation opening includes at least one, and may be provided between every two adjacent pixel openings, or may be provided between two partially adjacent pixel openings, or may be provided with a plurality of first isolation openings between two adjacent pixel openings.

[0100] The formed first isolation opening includes a first isolation sub-opening and a second isolation sub-opening which are arranged in sequence along a direction away from the substrate, and the orthographic projection formed by the second isolation sub-opening on the substrate is located within the orthographic projection range formed by the second isolation sub-opening on the substrate, wherein the orthographic projection edge formed by the first isolation sub-opening on the substrate coincides with the orthographic projection edge of the portion of the pixel defining layer enclosing the first isolation sub-opening on the substrate, and the orthographic projection formed by the second isolation sub-opening on the substrate coincides with the orthographic projection edge of the portion of the pixel defining layer enclosing the second isolation sub-opening on the substrate.

[0101] Step 120 , forming a plurality of light-emitting portions on one side of the substrate.

[0102] After forming a pixel defining layer including a second isolation opening and a plurality of pixel openings on one side of the substrate, a plurality of light emitting portions are formed on one side of the substrate. It is understandable that after forming the pixel defining layer on the substrate, a plurality of light emitting portions are formed on one side of the substrate close to the pixel defining layer.

[0103] The embodiment of the present application provides a method for preparing a display panel, by forming a pixel defining material layer on a substrate; performing a first patterning process on the pixel defining material layer to form a pixel defining layer having a first isolation opening and a plurality of pixel openings; the first isolation opening has a first isolation sub-opening and a second isolation sub-opening arranged along the thickness direction of the substrate, the first isolation sub-opening is located on a side of the second isolation sub-opening close to the substrate, and the orthographic projection of the second isolation sub-opening on the substrate is located within the orthographic projection of the first isolation sub-opening on the substrate. Such a first isolation opening can better prevent the crosstalk of the lateral current between the two light-emitting parts adjacent to the first isolation opening, thereby improving the display effect of the display panel, and further improving the performance of the display product including the display panel.

[0104] In one embodiment, the pixel defining material layer includes two layers, ie, a first pixel defining material layer and a second pixel defining material layer stacked.

[0105] The first pixel defining material layer and the second pixel defining material layer are made of different materials. This embodiment does not limit the method for preparing the first pixel defining material layer and the second pixel defining material layer, as long as the functions thereof can be achieved.

[0106] In an optional embodiment, the first pixel defining material layer is made of an organic material, and the second pixel defining material layer is made of an inorganic material. Optionally, the first pixel defining material layer is made of photosensitive polyimide, and the second pixel defining material layer is made of SiNx, SiO2 or SiNO.

[0107] In an optional embodiment, a first pixel defining material layer and a second pixel defining material layer are stacked by first forming a first pixel defining material layer on a substrate and then forming a second pixel defining material layer on the first pixel defining material layer.

[0108] In the case where the pixel defining material layer includes a first pixel defining material layer and a second pixel defining material layer stacked together, as shown in FIG. Figure 2 As shown, a method for implementing a first patterning process on a pixel defining material layer to form a pixel defining layer having a first isolation opening and a plurality of pixel openings includes the following steps:

[0109] Step 200 , performing a second patterning process on the first pixel defining material layer and the second pixel defining material layer to form a pixel defining intermediate material layer having a second isolation opening and a plurality of pixel openings; a second isolation opening is provided between at least part of two adjacent pixel openings.

[0110] A second patterning process is performed on the first pixel defining material layer and the second pixel defining material layer simultaneously using a mask plate to form a pixel defining intermediate material layer, on which a second isolation opening and a plurality of pixel openings are provided. The second isolation opening on the pixel defining intermediate material layer includes at least one, which may be provided between each two adjacent pixel openings, or provided between two partially adjacent pixel openings, or provided between two adjacent pixel openings. This embodiment does not limit the specific method of performing the second patterning process on the first pixel defining material layer and the second pixel defining material layer, as long as its function can be achieved.

[0111] Step 210 , etching the sidewall of the pixel defining intermediate material layer toward the second isolation opening to form a first defining layer and a second defining layer with the first isolation opening.

[0112] The side wall of the pixel defining intermediate material layer facing the second isolation opening is etched so that the first pixel defining material layer and the second pixel defining material layer form a first defining layer and a second defining layer respectively. The first defining layer and the second defining layer include a first isolation opening and a plurality of pixel openings. The first isolation opening is obtained by etching the first pixel defining material layer and the second pixel defining material layer on the basis of the second isolation opening. The second isolation opening includes a first isolation sub-opening and a second isolation sub-opening, and the first defining layer formed is provided with a first isolation sub-opening, and the second defining layer formed is provided with a second isolation sub-opening.

[0113] In this embodiment, the second patterning process is performed on the first pixel defining material layer and the second pixel defining material layer at the same time, so that only one mask plate is needed to realize it, which can reduce the preparation cost. In addition, the first pixel defining material layer and the second pixel defining material layer are processed simultaneously. Compared with first patterning the first pixel defining material layer to form the first defining layer, forming the second pixel defining material layer on the side of the first defining layer away from the substrate, and then patterning the second pixel defining material, it can avoid damage to other components on the substrate when processing the second pixel defining material layer, thereby improving the service life of the display panel. In addition, this embodiment uses a stacked first pixel defining material layer and a second pixel defining layer, which is convenient for forming a first defining layer and a second defining layer with a first isolation opening and a plurality of pixel openings.

[0114] In one embodiment, before forming a pixel definition material layer on the substrate, the method comprises:

[0115] A plurality of first electrodes are formed on one side of the substrate; the plurality of first electrodes are located on a side of the light emitting portion close to the substrate, and a first isolation opening is provided between at least two adjacent first electrodes.

[0116] An electrode material layer is laid on one side of the substrate, and the electrode material layer is patterned to form a plurality of first electrodes. The formed plurality of first electrodes correspond to the plurality of pixel openings one by one. This embodiment does not limit the specific method of patterning the electrode material layer, as long as its function can be achieved.

[0117] It can be understood that a plurality of first electrodes are first formed on one side of the substrate, a first pixel defining material layer and a second pixel defining material layer are stacked on a side of the substrate close to the first electrodes and a side of the first electrodes away from the substrate, and the first pixel defining material layer and the second pixel defining material layer are subjected to a second patterning process to form a first isolation opening and a plurality of pixel openings, and the plurality of pixel openings correspond to the plurality of first electrodes one by one. In other words, the first pixel defining material layer and the second pixel defining material layer at the position of the first electrode are removed to form a plurality of pixel openings to expose the first electrode.

[0118] In the present embodiment, before forming a pixel defining material layer, a plurality of first electrodes are first formed on one side of the substrate. By processing the first pixel defining material layer and the second pixel defining material layer simultaneously, compared with first patterning the first pixel defining material layer to form a first defining layer, forming a second pixel defining material layer on a side of the first defining layer away from the substrate, and then patterning the second pixel defining material, damage to the first electrodes on the substrate when processing the second pixel defining material layer can be avoided, thereby improving the service life of the display panel.

[0119] In one embodiment, a second patterning process is performed on a first pixel defining material layer and a second pixel defining material layer to form a pixel defining intermediate material layer having a second isolation opening and a plurality of pixel openings, and the implementation method includes:

[0120] The first pixel defining material layer and the second pixel defining material layer are etched using a first etching method to form a pixel defining intermediate material layer having a second isolation opening and a plurality of pixel openings on a side of the plurality of first electrodes away from the substrate; the second isolation opening is provided between at least partially adjacent two pixel openings.

[0121] This embodiment does not limit the first etching method used, as long as it can achieve its function. Optionally, the process gas of the first etching method includes a fluorine-containing gas.

[0122] In an optional embodiment, a photoresist mask may be used to define patterns of the first pixel defining material layer and the second pixel defining material layer, and the first pixel defining material layer and the second pixel defining material layer may be etched using a plasma etching process to form a pixel defining intermediate material layer, wherein the pixel defining intermediate material layer is provided with a second isolation opening and a plurality of pixel openings. The process gas of the plasma etching process includes CF4 or SF6.

[0123] In this embodiment, the first pixel defining material layer and the second pixel defining material layer are etched simultaneously using the same etching method, and only one mask plate is needed, which can reduce the preparation cost.

[0124] In one embodiment, an implementation method is provided for etching a sidewall of a pixel-defining intermediate material layer toward a second isolation opening, the implementation method comprising:

[0125] The sidewall of the pixel-defining intermediate material layer facing the second isolation opening is etched using a second etching method.

[0126] Wherein, under the preset etching conditions, the etching rate of the second etching method on the first pixel defining material layer is greater than the etching rate on the second pixel defining material layer.

[0127] This embodiment does not limit the second etching method used, as long as it can achieve its function. Optionally, the process gas of the second etching method includes oxygen.

[0128] The pixel defining intermediate material layer toward the second isolation opening includes a first pixel defining material layer and a second pixel defining material layer. When the side wall of the pixel defining intermediate material layer toward the second isolation opening is etched using a second etching method, under preset etching conditions, the etching rate of the second etching method on the first pixel defining material layer is greater than the etching rate of the second pixel defining material layer.

[0129] In this embodiment, the first isolation opening formed by etching the side wall of the pixel-defining intermediate material layer toward the second isolation opening using the second etching method can better prevent the crosstalk of lateral current between two light-emitting parts (pixel units) adjacent to the first isolation opening, thereby improving the display effect of the display panel.

[0130] In one embodiment, an implementation method of etching a first pixel defining material layer and a second pixel defining material layer includes:

[0131] A first photoresist is formed on a side of the second pixel defining material layer away from the substrate, and a first etching method is used to expose, develop and etch the first pixel defining material layer and the second pixel defining material layer.

[0132] A first photoresist is formed on a side of the second pixel defining material layer away from the base to define patterns of the first pixel defining material layer and the second pixel defining material layer, and the first pixel defining material layer and the second pixel defining material layer are exposed, developed and etched to form a second isolation opening and a plurality of pixel openings.

[0133] In this embodiment, the first pixel defining material layer and the second pixel defining material layer are simultaneously exposed, developed, and etched. This can be achieved with only one mask plate, thereby reducing the preparation cost.

[0134] In one embodiment, before etching the sidewall of the pixel-defining intermediate material layer facing the second isolation opening, the preparation method further comprises:

[0135] A second photoresist is formed on a side of the second pixel defining material layer away from the substrate, and is exposed and developed to reveal a second isolation opening.

[0136] After performing a second patterning process on the first pixel defining material layer and the second pixel defining material layer to form a second isolation opening and a plurality of pixel openings, a second photoresist is formed on a side of the second pixel defining material layer away from the substrate, as well as at the pixel openings and the second isolation openings to define a pattern of the second isolation openings, and exposure and development are performed to remove the second photoresist at the second isolation openings to expose the second isolation openings.

[0137] In this embodiment, the second photoresist is used to protect the second pixel defining material layer and the component (first electrode) at the pixel opening, which can increase the service life of the prepared display panel.

[0138] In one embodiment, the plurality of light-emitting portions formed on one side of the substrate may include a first light-emitting portion and a second light-emitting portion, and the first light-emitting portion and the second light-emitting portion emit different colors. The plurality of pixel openings include a first pixel opening and a second pixel opening corresponding to the first light-emitting portion and the second light-emitting portion. Figure 3 As shown, the specific steps of forming a plurality of light-emitting portions on one side of the substrate include:

[0139] Step 300: forming a plurality of first light-emitting portions on one side of a substrate; at least a portion of the first light-emitting portions are disposed in a plurality of first pixel openings in a one-to-one correspondence with each other.

[0140] A plurality of first light emitting portions are formed on the plurality of pixel openings on the substrate and a portion of the second defining layer. Specifically, a plurality of first light emitting material layers can be formed on the substrate, and the first light emitting material layers located at the first pixel openings constitute the first light emitting portions.

[0141] Step 310: forming a first sacrificial material layer and a second sacrificial material layer on the first light-emitting portion.

[0142] A first sacrificial material layer is first formed on the first light emitting portion, and a second sacrificial material layer is formed on the first sacrificial material layer.

[0143] It should be noted that the present embodiment describes a two-layer sacrificial material layer, but the sacrificial material layer may have a single-layer structure, a three-layer structure or a multi-layer structure.

[0144] Step 320, forming a plurality of second light-emitting portions on one side of the substrate; at least part of the second light-emitting portions are disposed in a plurality of second pixel openings in a one-to-one correspondence with each other.

[0145] The preparation method of the second light-emitting portion may be the same as the preparation method of the first light-emitting portion.

[0146] In this embodiment, during the preparation of the second light-emitting portion, the first sacrificial material layer and the second sacrificial material layer can protect the first light-emitting portion to prevent the etching solution in the preparation process from corroding the first light-emitting portion.

[0147] Please continue to see Figure 3 In an optional embodiment, the plurality of light-emitting portions further include a plurality of third light-emitting portions, the third light-emitting portions, the first light-emitting portions, and the second light-emitting portions emit light of different colors, and the plurality of pixel openings further include a plurality of third pixel openings. In this case, after forming a plurality of second light-emitting portions on one side of the substrate, the preparation method further includes:

[0148] Step 330: Form a stacked third sacrificial material layer and a fourth sacrificial material layer on the second light-emitting portion.

[0149] It should be noted that the present embodiment describes a two-layer sacrificial material layer, but the sacrificial material layer may have a single-layer structure, a three-layer structure or a multi-layer structure.

[0150] Step 340: forming a plurality of third light-emitting portions on one side of the substrate; at least a portion of the third light-emitting portions are disposed in a plurality of third pixel openings in a one-to-one correspondence with each other.

[0151] Step 350 , forming a fifth sacrificial material layer and a sixth sacrificial material layer in a stack on the third light-emitting portion.

[0152] The preparation method of the third light-emitting portion is the same as the preparation method of the first light-emitting portion.

[0153] In this embodiment, during the preparation of the third light-emitting portion, the third sacrificial material layer and the fourth sacrificial material layer can protect the second light-emitting portion to prevent the etching solution in the preparation process from corroding the second light-emitting portion. In addition, during the subsequent preparation process, the fifth sacrificial material layer and the sixth sacrificial material layer can protect the third light-emitting portion to prevent the etching solution in the preparation process from corroding the third light-emitting portion.

[0154] In an optional embodiment, if Figure 4 As shown, after forming a fifth sacrificial material layer and a sixth sacrificial material layer on the third light-emitting portion, the preparation method further includes:

[0155] Step 400: forming an isolation material layer on a side of the plurality of light-emitting portions away from the substrate.

[0156] Step 410 , performing a third patterning process on the isolation material layer to form an isolation layer; the isolation layer covers the first isolation opening and exposes a plurality of pixel openings.

[0157] Optionally, the isolation material layer may be a planarization material layer or an organic insulating layer.

[0158] An isolation material layer is formed on the light-emitting portion formed on the substrate. It is understood that an isolation material layer is also formed at the first isolation opening. A second mask is used to define a pattern of the isolation material layer, and the isolation material layer is etched to form an isolation layer. The formed isolation layer covers the first isolation opening and exposes a plurality of pixel openings.

[0159] In one embodiment, after performing a third patterning process on the isolation material layer to form an isolation layer, the preparation method further includes:

[0160] The first sacrificial material layer, the second sacrificial material layer, the third sacrificial material layer, the fourth sacrificial material layer, the fifth sacrificial material layer and the sixth sacrificial material layer are subjected to a fourth patterning process to form a sacrificial layer corresponding to the first light-emitting portion, a sacrificial layer corresponding to the second light-emitting portion and a sacrificial layer corresponding to the third light-emitting portion.

[0161] Among them, the sacrificial layer corresponding to the first light-emitting portion is located on a side of the first part of the first light-emitting portion away from the substrate, and the first part of the first light-emitting portion is located on a side of the pixel defining layer away from the substrate; the sacrificial layer corresponding to the second light-emitting portion is located on a side of the first part of the second light-emitting portion away from the substrate, and the first part of the second light-emitting portion is located on a side of the pixel defining layer away from the substrate; the sacrificial layer corresponding to the third light-emitting portion is located on a side of the first part of the third light-emitting portion away from the substrate, and the first part of the third light-emitting portion is located on a side of the pixel defining layer away from the substrate.

[0162] It can be understood that each light-emitting portion includes a first portion located on a side of the pixel defining layer away from the substrate. By patterning the sacrificial material layer corresponding to each light-emitting portion, a sacrificial layer can be formed on a side of the first portion of each light-emitting portion away from the substrate.

[0163] Exemplarily, the material of the first sacrificial material layer, the second sacrificial material layer, the third sacrificial material layer, the fourth sacrificial material layer, the fifth sacrificial material layer and the sixth sacrificial material layer can be water-soluble photoresist. In this way, the first sacrificial material layer, the second sacrificial material layer, the third sacrificial material layer, the fourth sacrificial material layer, the fifth sacrificial material layer and the sixth sacrificial material layer can be patterned using water based on the mask plate corresponding to the sacrificial layer.

[0164] In one embodiment, Figure 5 As shown, after forming a plurality of light-emitting portions on one side of the substrate, the preparation method further comprises:

[0165] Step 500: forming a second electrode on a side of the plurality of light-emitting portions away from the substrate.

[0166] Step 510: forming a packaging structure on a side of the second electrode away from the substrate.

[0167] The second electrode formed on the side of the plurality of light emitting parts away from the substrate is a cathode. The packaging structure formed on the side of the second electrode away from the substrate can be a glass cover plate or a film.

[0168] Please continue to see Figure 5 In an optional embodiment, before forming the second electrode on a side of the plurality of light-emitting portions away from the substrate, the preparation method further comprises:

[0169] Step 520 , forming a common layer on a side of the plurality of light-emitting portions away from the substrate.

[0170] The common layer refers to the common layer corresponding to the light-emitting part. The common layer may include one or more of a hole injection layer, a hole transport layer, a hole blocking layer, an electron transport layer and an electron injection layer arranged in a stacked manner.

[0171] Specifically, a common layer is first formed in sequence on the plurality of light-emitting portions away from the substrate, and then a second electrode is formed on a side of the common layer away from the substrate.

[0172] It should be noted that in the method for preparing the display panel provided in the embodiment of the present application, each film layer can be prepared by sputtering, chemical vapor deposition (CVD), vacuum deposition, pulsed laser deposition (PLD), atomic layer deposition (ALD), etc. The CVD method includes plasma enhanced chemical vapor deposition (PECVD), laser chemical vapor deposition (LCVD), low pressure chemical vapor deposition (LPCVD), etc.

[0173] In one embodiment, see Figure 6 Flowchart, combined with Figure 7-Figure 14 The present application provides a method for preparing a display panel, and the steps of the preparation method include:

[0174] Step 600: forming a plurality of first electrodes 14 on one side of the substrate 11, and forming a first pixel defining material layer 1 and a second pixel defining material layer 2 as a stack. Figure 7 shown.

[0175] Step 610: forming a first photoresist on the side of the second pixel defining material layer 2 away from the substrate 11, and performing exposure, development and etching on the first pixel defining material layer 1 and the second pixel defining material layer 2 to form a pixel defining intermediate material layer having a second isolation opening 1210 and a plurality of pixel openings 122. Figure 8 shown.

[0176] Step 620: forming a second photoresist 3 on the side of the second pixel defining material layer 2 away from the substrate 11, and exposing and developing the second photoresist 3 to expose the second isolation opening 1210. Fig. 9 shown.

[0177] Step 630: Etch the sidewall of the pixel defining intermediate material layer toward the second isolation opening 1210 to form a second defining layer 12b having a first isolation opening 121 and a first defining layer 12a. Fig.10 shown.

[0178] Step 640: Form a first light-emitting portion 131, a second light-emitting portion 132, and a third light-emitting portion 133 on one side of the substrate 11, a first sacrificial material layer 131a and a second sacrificial material layer 131b corresponding to the first light-emitting portion 131, a third sacrificial material layer 132a and a fourth sacrificial material layer 132b corresponding to the second light-emitting portion 132, and a fifth sacrificial material layer 133a and a sixth sacrificial material layer 133b corresponding to the third light-emitting portion 133, as shown in FIG. Fig.11 shown.

[0179] Step 650: forming a planarization material layer on one side of the substrate 11, and performing a third patterning process on the planarization material layer to form a planarization layer; Fig.12 As shown, the planarization layer covers the first isolation opening 121 and exposes a plurality of pixel openings 122 .

[0180] Step 660: Perform a fourth patterning process on the first sacrificial material layer 131a, the second sacrificial material layer 131b, the third sacrificial material layer 132a, the fourth sacrificial material layer 132b, the fifth sacrificial material layer 133a and the sixth sacrificial material layer 133b to form a sacrificial layer 18 corresponding to the first light-emitting portion 13, a sacrificial layer 18 corresponding to the second light-emitting portion 13 and a sacrificial layer 18 corresponding to the third light-emitting portion 13, as shown in FIG. Fig.13 shown.

[0181] Step 670: deposit a common layer and a second electrode 16, and cover the packaging structure 17, such as Fig.14 shown.

[0182] See also Fig.15 According to an embodiment of the present application, a display panel 10 is provided, including:

[0183] substrate 11;

[0184] The pixel defining layer 12 is disposed on one side of the substrate 11; the pixel defining layer 12 includes a first isolation opening 121 and a plurality of pixel openings 122, the first isolation opening 121 includes a first isolation sub-opening 121a and a second isolation sub-opening 121b disposed along the thickness direction of the substrate 11, the first isolation sub-opening 121a is located on a side of the second isolation sub-opening 121b close to the substrate 11, and the orthographic projection of the second isolation sub-opening 121b on the substrate 11 is located within the orthographic projection of the first isolation sub-opening 121a on the substrate 11;

[0185] The plurality of light emitting portions 13 , at least part of the light emitting portions 13 are respectively disposed in corresponding pixel openings 122 .

[0186] The substrate 11 may be a substrate of an inorganic material, a substrate of an organic material, or a composite substrate formed by stacking a substrate of an inorganic material and a substrate of an organic material. The description of the first isolation opening 121, the plurality of pixel openings 122, and the light emitting portion 13 may refer to the specific description of the above embodiment, and will not be repeated here.

[0187] The display panel 10 provided in this embodiment includes a substrate 11, a pixel defining layer 12 and a plurality of light-emitting portions 13. The pixel defining layer 12 is disposed on one side of the substrate 11, and the pixel defining layer 12 includes a first isolation opening 121 and a plurality of pixel openings 122; the first isolation opening 121 includes a first isolation sub-opening 121a and a second isolation sub-opening 121b disposed along the thickness direction of the substrate 11, the first isolation sub-opening 121a is located on the side of the second isolation sub-opening 121b close to the substrate 11, and the orthographic projection of the second isolation sub-opening 121b on the substrate 11 is located within the orthographic projection range of the first isolation sub-opening 121a on the substrate 11; and the plurality of light-emitting portions 13 are disposed in a one-to-one correspondence within the plurality of pixel openings 122. The first isolation opening 121 in the pixel defining layer 12 can better prevent the crosstalk of the lateral current between the two light-emitting portions 13 (pixel units) adjacent to the first isolation opening 121, thereby improving the display effect of the display panel 10.

[0188] Please continue to see Fig.15 In one embodiment, the pixel defining layer 12 includes a first defining layer 12a and a second defining layer 12b. The first defining layer 12a is provided with a first spacer opening 121a, and the second defining layer 12b is provided with a second spacer opening 121b.

[0189] For the description of the first defining layer 12a and the second defining layer 12b, reference may be made to the specific description in the above embodiments, which will not be repeated here.

[0190] In an optional embodiment, under a preset etching condition, the etching rate of the material of the first defining layer 12 a at the first isolation opening 121 is greater than the etching rate of the material of the second defining layer 12 b .

[0191] It can be understood that when forming the first isolation opening 121 included in the pixel defining layer 12, the etching rate of the first pixel defining material layer (the material of the first defining layer 12a) forming the pixel defining layer 12 is greater than the etching rate of the second pixel defining material layer (the material of the second defining layer 12b).

[0192] In this embodiment, the first spacer opening 121a and the second spacer opening 121b are formed by the first defining layer 12a and the second defining layer 12b. The first spacer opening 121a and the second spacer opening 121b formed in this way have a simple structure and are easy to implement.

[0193] Please continue to see Fig.15 In one embodiment, the display panel 10 further includes:

[0194] A plurality of first electrodes 14 are disposed on a side of the light emitting portion 13 close to the substrate 11 , and a first isolation opening 121 is disposed between at least two adjacent first electrodes 14 .

[0195] For the description of the plurality of first electrodes 14 , reference may be made to the specific description in the above embodiment, which will not be repeated here.

[0196] In one embodiment, each pixel opening 122 is surrounded by a first isolation opening 121. Thus, the first isolation opening 121 can block the lateral current between the light emitting parts (pixel units) at two adjacent pixel openings 122, thereby improving the display effect of the display panel 10.

[0197] In an optional embodiment, if Fig.16 As shown, the orthographic projection of the first isolation opening 121 on the substrate 11 is annular. That is, when viewed from a top view of the display panel 10, the orthographic projection of the first isolation opening 121 on the substrate 11 is annular.

[0198] Please continue to see Fig.16 In an optional embodiment, the orthographic projections of the plurality of first isolation openings 121 on the substrate 11 form a grid shape. That is, the display panel 10 includes a plurality of first isolation openings 121, and when viewed from a top view of the display panel 10, the orthographic projections of the plurality of first isolation openings 121 on the substrate 11 form a grid shape, and each grid unit represents a first isolation opening 121.

[0199] In one embodiment, the material of the first defining layer 12 a is an organic layer material, and the material of the second defining layer 12 b is an inorganic material.

[0200] In this embodiment, the first defining layer 12 a and the second defining layer 12 b are made of different materials, which facilitates the subsequent formation of the first isolation opening 121 by using different etching methods.

[0201] Optionally, the material of the first defining layer 12a includes photosensitive polyimide, and the material of the second defining layer 12b includes silicon oxide (such as SiO2), silicon nitride SiN x Or silicon oxynitride SiNO.

[0202] See also Fig.17 In one embodiment, the pixel opening 122 has a first sub-pixel opening 122a and a second sub-pixel opening 122b arranged along the thickness direction of the substrate 11, and the first sub-pixel opening 122a is located on a side of the second sub-pixel opening 122b close to the substrate 11; the orthographic projection of the first sub-pixel opening 122a on the substrate 11 is located within the orthographic projection range of the second sub-pixel opening 122b on the substrate 11.

[0203] The pixel opening 122 is formed by the pixel defining layer 12, and the pixel defining layer 12 includes a first defining layer 12a and a second defining layer 12b, and the corresponding first defining layer 12a is provided with a first sub-pixel opening 122a, and the second defining layer 12b is provided with a second sub-pixel opening 122b. The orthographic projection of the first sub-pixel opening 122a on the substrate 11 is located within the orthographic projection range of the second sub-pixel opening 122b on the substrate 11.

[0204] In an optional embodiment, if Fig.17 As shown, a surface of the first defining layer 12a facing the pixel opening 122 and a bottom surface of the first defining layer 12a facing the substrate 11 form a first angle θ1, and the first angle θ1 is an acute angle.

[0205] In an optional embodiment, if Fig.17 As shown, the surface of the second defining layer 12 b facing the pixel opening 122 and the bottom surface of the second defining layer 12 b facing the substrate 11 form a second angle θ2, and the second angle θ2 is an acute angle.

[0206] In an optional embodiment, if Fig.17 As shown, the cross section of the pixel opening 122 along the thickness direction of the substrate 11 is in an inverted trapezoidal shape.

[0207] It can be understood that, along the direction from the substrate 11 to the second defining layer 12 b , the side wall of the pixel opening 122 is inclined toward the side away from the pixel opening 122 .

[0208] In this embodiment, the orthographic projection of the first sub-pixel opening 122a included in the pixel opening 122 on the substrate 11 is located within the orthographic projection range of the second sub-pixel opening 122b on the substrate 11, which can ensure the continuity and climbing of subsequent film layers (light-emitting part and common layer) prepared in the pixel opening 122 area.

[0209] See also Fig.18 In one embodiment, the display panel 10 further includes a sacrificial layer 18, the light-emitting portion 13 includes a first portion 13a located on a side of the pixel defining layer 12 away from the substrate 11 and a second portion 13b located within the pixel opening 122, and along the thickness direction of the substrate 11, the sacrificial layer 18 is located on a side of the first portion 13a of the light-emitting portion 13 away from the substrate 11.

[0210] In an optional embodiment, if Fig.18 As shown, the sacrificial layer 18 is provided with a first opening 18 a and a second opening 18 b , the first opening 18 a exposes the light emitting portion 13 , the first opening 18 a is provided corresponding to the pixel opening 122 , and the second opening 18 b is connected to the first isolation opening 121 .

[0211] In an optional embodiment, if Fig.18 As shown, the sacrificial layer 18 includes a first sub-sacrificial layer 181 and a second sub-sacrificial layer 182 , and the first sub-sacrificial layer 181 is located on a side of the second sub-sacrificial layer 182 close to the substrate 11 .

[0212] The sacrificial layer 18 is laminated with the isolation layer 15 , which can avoid damage to the light-emitting portion 13 and the side wall of the isolation layer 15 during the subsequent preparation process, thereby improving the practicality and reliability of the display panel 10 .

[0213] See also Figure 11-Figure 14 In one embodiment, the display panel 10 further includes:

[0214] An isolation layer 15 fills the first isolation opening 121 and exposes a plurality of pixel openings 122;

[0215] The second electrode continuously covers the plurality of light emitting portions 13 and extends along a surface of the light emitting portion 13 away from the substrate 11 to a surface of the isolation layer 15 away from the substrate 11 .

[0216] That is, the second electrode is covered on the surface of the light emitting portion 13 away from the substrate 11, the surface of the sacrificial layer 18 facing the first isolation opening 121 and the surface away from the substrate 11, and the surface of the isolation layer 15 away from the substrate 11. The description of the isolation layer 15 can refer to the specific description in the above embodiment, which will not be repeated here.

[0217] In an optional embodiment, the display panel 10 further includes a common layer disposed on a side of the plurality of light emitting portions 13 away from the substrate 11 .

[0218] It can be understood that a common layer and a first electrode 16 are provided on a side of the plurality of light emitting portions 13 away from the substrate 11 .

[0219] like Fig.14 As shown, the common layer and the first electrode 16 are continuously arranged on a side of each light emitting portion 13 away from the substrate 11 , and on a side of the isolation layer 15 away from the substrate 11 .

[0220] In an optional embodiment, the display panel 10 further includes a packaging structure 17 , and the packaging structure 17 is disposed on a side of the common layer and the second electrode 16 away from the substrate 11 .

[0221] For the description of the packaging structure 17 , reference may be made to the specific description in the above embodiment, which will not be repeated here.

[0222] By providing the encapsulation structure 17 , each film layer encapsulated by the encapsulation structure 17 can be protected, thereby increasing the service life of the display panel 10 .

[0223] In one embodiment, Fig.13 As shown, the isolation layer 15 includes a filling portion 151 and a top portion 152 . The filling portion 151 is located on a side of the top portion 152 close to the substrate 11 , and the orthographic projection of the filling portion 151 on the substrate 11 is located within the orthographic projection of the top portion 152 on the substrate 11 .

[0224] The filling portion 151 refers to a portion of the isolation layer filled in the first isolation opening 121, and the top portion 152 refers to a portion of the isolation layer that is higher than the first isolation opening 121. The orthographic projection of the filling portion 151 on the substrate 11 is within the orthographic projection range of the top portion 152 on the substrate 11.

[0225] In an optional embodiment, if Fig.13 As shown, the cross section of the top portion 152 along the thickness direction of the substrate 11 is in the shape of a right trapezoid.

[0226] In this way, the isolation layer 15 with a top 152 having a regular trapezoidal cross section along the thickness direction of the substrate 11 can better isolate the two light-emitting parts 13 adjacent to the isolation layer 15 , thereby improving the display effect of the display panel 10 .

[0227] In an optional embodiment, the material of the isolation layer 15 is an organic insulating layer. The isolation layer 15 may be a planarization layer.

[0228] An embodiment of the present application provides a display device, including a display panel 10 prepared by the method for preparing a display panel provided by the above embodiment, or a display panel 10 provided by the above embodiment.

[0229] The display device includes the display panel 10 provided in the above embodiment, or a display panel prepared by the method for preparing the display panel provided in the above embodiment, and has all the beneficial effects of the display panel 10, or all the beneficial effects of the method for preparing the display panel, which will not be repeated here.

[0230] The display device can be a laptop computer, a mobile phone, a wireless device, a personal digital assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a camcorder, a game console, a watch, a clock, a calculator, a television monitor, a flat-panel display, a computer monitor, a car display (e.g., an odometer display, etc.), a navigator, a cockpit controller and / or display, a display of a camera view (e.g., a display of a rearview camera in a vehicle), an electronic photo, an electronic billboard or sign, a projector, etc.

[0231] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0232] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0233] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for preparing a display panel, characterized in that: The preparation method comprises: forming a pixel definition material layer on the substrate; The pixel defining material layer is subjected to a first patterning process to form a pixel defining layer having a first isolation opening and a plurality of pixel openings; the first isolation opening has a first isolation sub-opening and a second isolation sub-opening arranged along the thickness direction of the substrate, the first isolation sub-opening is located on a side of the second isolation sub-opening close to the substrate, and the orthographic projection of the second isolation sub-opening on the substrate is located within the orthographic projection of the first isolation sub-opening on the substrate; A plurality of light emitting parts are formed on one side of the substrate.

2. The preparation method according to claim 1, characterized in that: The pixel defining material layer includes a first pixel defining material layer and a second pixel defining material layer stacked together, and the pixel defining material layer is subjected to a first patterning process to form a pixel defining layer having a first isolation opening and a plurality of pixel openings, including: Performing a second patterning process on the first pixel defining material layer and the second pixel defining material layer to form a pixel defining intermediate material layer having a second isolation opening and the plurality of pixel openings; the second isolation opening is provided between at least part of two adjacent pixel openings; The sidewall of the pixel defining intermediate material layer facing the second isolation opening is etched to form a first defining layer and a second defining layer provided with the first isolation opening.

3. The preparation method according to claim 2, characterized in that: Before forming a pixel definition material layer on the substrate, the preparation method includes: A plurality of first electrodes are formed on one side of the substrate; the plurality of first electrodes are located on a side of the light emitting portion close to the substrate, and the first isolation opening is provided between at least two adjacent first electrodes.

4. The preparation method according to claim 3, characterized in that: The second patterning process is performed on the first pixel defining material layer and the second pixel defining material layer to form a pixel defining intermediate material layer having a second isolation opening and a plurality of pixel openings, comprising: The first pixel defining material layer and the second pixel defining material layer are etched by a first etching method, so that the pixel defining intermediate material layer provided with the second isolation opening and the plurality of pixel openings is formed on the side of the plurality of first electrodes away from the substrate; the second isolation opening is provided between at least partially adjacent two of the pixel openings; Optionally, the process gas of the first etching method includes a fluorine-containing gas.

5. The preparation method according to claim 4, characterized in that: The etching of the sidewall of the pixel-defining intermediate material layer toward the second isolation opening includes: Etching the sidewall of the pixel-defining intermediate material layer toward the second isolation opening by using a second etching method; Wherein, under the preset etching conditions, the etching rate of the second etching method on the first pixel defining material layer is greater than the etching rate on the second pixel defining material layer; Optionally, the process gas of the second etching method includes oxygen.

6. The preparation method according to claim 4, characterized in that: The etching of the first pixel defining material layer and the second pixel defining material layer by using a first etching method includes: A first photoresist is formed on a side of the second pixel defining material layer away from the substrate, and the first pixel defining material layer and the second pixel defining material layer are exposed, developed and etched using the first etching method.

7. The preparation method according to claim 2, characterized in that: Before etching the sidewall of the pixel-defining intermediate material layer toward the second isolation opening, the preparation method includes: A second photoresist is formed on a side of the second pixel defining material layer away from the substrate, and is exposed and developed to reveal the second isolation opening.

8. The preparation method according to any one of claims 1 to 7, characterized in that: The light-emitting portion further includes a first light-emitting portion and a second light-emitting portion, and the plurality of light-emitting portions are formed on one side of the substrate, including: A plurality of the first light-emitting portions are formed on one side of the substrate; at least a portion of the first light-emitting portions are disposed in a plurality of first pixel openings in a one-to-one correspondence with each other; Forming a first sacrificial material layer and a second sacrificial material layer on the first light-emitting portion; A plurality of the second light emitting portions are formed on one side of the substrate; at least a portion of the second light emitting portions are disposed in a plurality of second pixel openings in a one-to-one correspondence with each other; Optionally, the light emitting unit further includes a third light emitting unit; After forming a plurality of the second light-emitting portions on one side of the substrate, the preparation method further includes: Forming a stacked third sacrificial material layer and a fourth sacrificial material layer on the second light-emitting portion; A plurality of the third light emitting portions are formed on one side of the substrate; at least a portion of the third light emitting portions are disposed in a plurality of third pixel openings in a one-to-one correspondence with each other; Forming a fifth sacrificial material layer and a sixth sacrificial material layer on the third light-emitting portion; Optionally, after forming a fifth sacrificial material layer and a sixth sacrificial material layer stacked on the third light-emitting portion, the preparation method further includes: forming an isolation material layer on a side of the plurality of light emitting portions away from the substrate; Performing a third patterning process on the isolation material layer to form an isolation layer; the isolation layer covers the first isolation opening and exposes the plurality of pixel openings; Optionally, after performing a third patterning process on the isolation material layer to form an isolation layer, the preparation method further includes: Performing a fourth patterning process on the first sacrificial material layer, the second sacrificial material layer, the third sacrificial material layer, the fourth sacrificial material layer, the fifth sacrificial material layer and the sixth sacrificial material layer to form a sacrificial layer corresponding to the first light-emitting portion, a sacrificial layer corresponding to the second light-emitting portion and a sacrificial layer corresponding to the third light-emitting portion; The sacrificial layer corresponding to the first light-emitting portion is located on a side of the first portion of the first light-emitting portion away from the substrate, and the first portion of the first light-emitting portion is located on a side of the pixel defining layer away from the substrate; the sacrificial layer corresponding to the second light-emitting portion is located on a side of the first portion of the second light-emitting portion away from the substrate, and the first portion of the second light-emitting portion is located on a side of the pixel defining layer away from the substrate; the sacrificial layer corresponding to the third light-emitting portion is located on a side of the first portion of the third light-emitting portion away from the substrate, and the first portion of the third light-emitting portion is located on a side of the pixel defining layer away from the substrate.

9. The preparation method according to any one of claims 1 to 7, characterized in that: After forming a plurality of light-emitting portions on one side of the substrate, the preparation method includes: forming a second electrode on a side of the plurality of light-emitting portions away from the substrate; forming a packaging structure on a side of the second electrode away from the substrate; Optionally, before forming the second electrode on a side of the plurality of light-emitting portions away from the substrate, the preparation method further comprises: A common layer is formed on a side of the plurality of light emitting portions away from the substrate.

10. A display panel, characterized in that: include: substrate; A pixel defining layer is disposed on one side of the substrate; The pixel defining layer is provided with a first isolation opening and a plurality of pixel openings, the first isolation opening having a first isolation sub-opening and a second isolation sub-opening arranged along the thickness direction of the substrate, the first isolation sub-opening being located on a side of the second isolation sub-opening close to the substrate, and the orthographic projection of the second isolation sub-opening on the substrate being located within the orthographic projection of the first isolation sub-opening on the substrate; A plurality of light emitting parts, at least some of which are respectively arranged in the corresponding pixel openings.

11. The display panel according to claim 10, characterized in that: The pixel defining layer comprises a first defining layer and a second defining layer, the first defining layer is provided with the first spacer opening, and the second defining layer is provided with the second spacer opening; Optionally, under preset etching conditions, an etching rate of the material of the first defining layer at the first isolation opening is greater than an etching rate of the material of the second defining layer.

12. The display panel according to claim 10, characterized in that: The display panel further includes: A plurality of first electrodes are arranged on a side of the light emitting portion close to the substrate, and the first isolation opening is arranged between at least two adjacent first electrodes.

13. The display panel according to claim 10, characterized in that: The first isolation opening is arranged around the periphery of each pixel opening; Optionally, the orthographic projection of the first isolation opening on the substrate is annular; Optionally, a plurality of the first isolation openings are interconnected and their orthographic projections on the substrate form a grid.

14. The display panel according to claim 11, characterized in that: The material of the first defining layer is an organic material, and the material of the second defining layer is an inorganic material; Optionally, the material of the first defining layer includes photosensitive polyimide, and the material of the second defining layer includes silicon oxide, silicon nitride or silicon oxynitride.

15. The display panel according to claim 11, characterized in that: The pixel opening comprises a first sub-pixel opening and a second sub-pixel opening arranged along the thickness direction of the substrate, wherein the first sub-pixel opening is located at a side of the second sub-pixel opening close to the substrate; The orthographic projection of the first sub-pixel opening on the substrate is within the orthographic projection range of the second sub-pixel opening on the substrate; Optionally, a surface of the first defining layer facing the pixel opening and a bottom surface of the first defining layer facing the substrate form a first angle, and the first angle is an acute angle; Optionally, a surface of the second defining layer facing the pixel opening and a bottom surface of the second defining layer facing the substrate form a second angle, and the second angle is an acute angle; Optionally, a cross section of the pixel opening along the thickness direction of the substrate is in an inverted trapezoidal shape.

16. The display panel according to claim 11, characterized in that: The display panel further includes a sacrificial layer, the light-emitting portion includes a first portion located on a side of the pixel defining layer away from the substrate and a second portion located in the pixel opening, and along the thickness direction of the substrate, the sacrificial layer is located on a side of the first portion of the light-emitting portion away from the substrate; Optionally, the sacrificial layer is provided with a first opening and a second opening, the first opening is provided corresponding to the pixel opening, and the second opening is connected to the first isolation opening; Optionally, the sacrificial layer includes a first sub-sacrificial layer and a second sub-sacrificial layer, and the first sub-sacrificial layer is located on a side of the second sub-sacrificial layer close to the substrate.

17. The display panel according to claim 11, characterized in that: The display panel further includes: an isolation layer filling the first isolation opening and exposing the plurality of pixel openings; a second electrode, the second electrode continuously covering the plurality of light-emitting portions and extending along a surface of the light-emitting portion away from the substrate to a surface of the isolation layer away from the substrate; Optionally, the display panel further comprises a packaging structure, and the packaging structure is arranged on a side of the second electrode away from the substrate; Optionally, the isolation layer includes a filling portion and a top portion, the filling portion is located on a side of the top portion close to the substrate, and an orthographic projection of the filling portion on the substrate is located within an orthographic projection of the top portion on the substrate; Optionally, the cross section of the top along the thickness direction of the substrate is a regular trapezoid; Optionally, the display panel further comprises a common layer, which is arranged on a side of the plurality of light-emitting portions away from the substrate; Optionally, the isolation layer is made of an organic insulating material.

18. A display device, characterized in that: It comprises a display panel prepared by the method for preparing a display panel according to any one of claims 1 to 9, or a display panel according to any one of claims 10 to 17.

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