Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an isolation structure, a pixel defining layer, a light-transmitting protection layer and a plurality of light-emitting devices, wherein the isolation structure, the pixel defining layer, the light-transmitting protection layer and the light-emitting devices are located on the substrate. The isolation structure defines at least one light-transmitting opening and a plurality of isolation openings, the isolation openings are used for limiting the light-emitting device, the pixel defining layer is located between the isolation structure and the substrate, the orthographic projection of the light-transmitting opening on the substrate is located within the orthographic projection of the pixel defining layer on the substrate, and the light-transmitting protection layer is located on the side, away from the substrate, of the pixel defining layer. And at least part of the pixel defining layer exposed by the light-transmitting opening is covered. In the display panel, the light-transmitting protection layer not only can ensure the light transmission of the area where the light-transmitting opening is located, but also can protect the pixel defining layer in the process of preparing the light-emitting device, so that the protection effect of the pixel defining layer is ensured.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin film electroluminescent device. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] However, current electronic display products are limited by their own structural design, and it is difficult for them to have good display functions when applied to scenarios such as under-screen recognition and transparent display. Summary of the invention

[0004] In a first aspect, the present disclosure provides a display panel, which includes a substrate, an isolation structure, a pixel defining layer, a light-transmitting protective layer, and a plurality of light-emitting devices located on the substrate. The isolation structure defines at least one light-transmitting opening and a plurality of isolation openings, the isolation openings are used to limit the light-emitting devices, the pixel defining layer is located between the isolation structure and the substrate, and the orthographic projection of the light-transmitting opening on the substrate is located within the orthographic projection of the pixel defining layer on the substrate, the light-transmitting protective layer is located on a side of the pixel defining layer away from the substrate, and covers at least a portion of the pixel defining layer exposed by the light-transmitting opening.

[0005] In the process of preparing light-emitting devices in batches through an isolation structure, multiple etching processes are performed. In this way, at the light-transmitting opening, the etching process will etch the pixel definition layer exposed by the light-transmitting opening to destroy the protective effect of the pixel definition layer on the substrate and the structure of the light-emitting device (such as the first electrode described below). In the above process, the light-transmitting protective layer can not only ensure the light transmission of the area where the light-transmitting opening is located, but also protect the pixel definition layer in the process of preparing the light-emitting device, thereby ensuring the protective effect of the pixel definition layer.

[0006] In a specific implementation of the first aspect of the present disclosure, the light-transmitting protection layer covers the entire portion of the pixel defining layer exposed by the light-transmitting opening.

[0007] Optionally, the edge of the light-transmitting protective layer is connected to the isolation structure. In this way, there is no gap between the light-transmitting protective layer and the isolation structure, and the light-transmitting protective layer and the isolation structure can jointly protect the pixel defining layer to improve the protection effect on the pixel defining layer.

[0008] Optionally, a plurality of light-transmitting openings are provided.

[0009] In a specific embodiment of the first aspect of the present disclosure, the light-transmitting protective layer is a transparent conductive layer, the isolation structure includes a conductive structure, and the light-transmitting protective layer is electrically connected to the isolation structure. In this way, the second electrode, the isolation structure and the light-transmitting protective layer can constitute a common electrode to reduce the voltage drop generated on the second electrode when the light-emitting device is driven.

[0010] In a specific embodiment of the first aspect of the present disclosure, the light-transmitting protective layer covers at least a portion of the side surface connection of the isolation structure. In this way, the light-transmitting protective layer can be prepared after the isolation structure is prepared, so that the light-transmitting protective layer will not be damaged by the etching process for preparing the isolation structure, thereby ensuring the protective effect of the light-transmitting protective layer.

[0011] In a specific embodiment of the first aspect of the present disclosure, the isolation structure includes a support portion and a crown portion stacked on a substrate, the support portion is located between the crown portion and the substrate, and the orthographic projection of a surface of the support portion facing away from the substrate on the substrate is located within the orthographic projection of the crown portion on the substrate.

[0012] In a specific embodiment of the first aspect of the present disclosure, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on a substrate, the light-emitting functional layer and the second electrode are located in corresponding isolation openings, the supporting portion is a conductive structure, and the second electrode is connected to the side surface of the supporting portion.

[0013] In a specific embodiment of the first aspect of the present disclosure, the isolation structure further comprises a bottom, the bottom is located on a side of the support portion facing away from the crown portion, the orthographic projection of the bottom on the substrate is located within the orthographic projection of the crown portion on the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the bottom on the substrate. Optionally, the second electrode is connected to an area of ​​the surface of the bottom facing away from the substrate that is not covered by the support portion. Equivalent to the side surface of the support portion, the second electrode is more easily deposited on the bottom, thereby reducing the impedance at the connection between the second electrode and the isolation structure.

[0014] In a specific embodiment of the first aspect of the present disclosure, the edge portion of the light-transmitting protective layer covers at least a portion of the area of ​​the bottom surface facing away from the substrate that is not covered by the support portion. Equivalent to the side surface of the support portion, the light-transmitting protective layer is more easily deposited on the bottom, thereby reducing the impedance at the connection between the light-transmitting protective layer and the isolation structure.

[0015] In a specific embodiment of the first aspect of the present disclosure, the edge portion of the light-transmitting protective layer is located between the support portion and the pixel defining layer. In this way, the light-transmitting protective layer is formed before the isolation structure, so that the light-transmitting protective layer can protect the pixel defining layer during the process of preparing the isolation structure.

[0016] In a specific embodiment of the first aspect of the present disclosure, the material of the light-transmitting protective layer includes at least one of indium tin oxide, indium gallium oxide and indium zinc oxide. These materials have both electrical conductivity and light-transmitting functions.

[0017] In a specific embodiment of the first aspect of the present disclosure, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on a substrate, the light-emitting functional layer and the second electrode are located in corresponding isolation openings, the isolation structure includes a conductive structure, and the second electrode is electrically connected to the isolation structure.

[0018] In a specific embodiment of the first aspect of the present disclosure, the pixel defining layer includes a plurality of pixel openings corresponding to the isolation openings, the pixel openings are connected to the corresponding isolation openings, the pixel openings are used to limit the light emitting device and expose the first electrode, and the pixel openings correspond to the isolation openings one by one.

[0019] Optionally, the pixel defining layer is an inorganic film layer.

[0020] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a first packaging layer, which is located on the side of the light-emitting device away from the substrate and includes a plurality of packaging units corresponding one to one with the isolation openings, and the packaging units cover the corresponding isolation openings.

[0021] Optionally, the edge of the packaging unit extends to the side of the isolation structure (e.g., the crown included therein) facing away from the substrate, and the portion of the packaging unit located on the side of the isolation structure (e.g., the crown included therein) facing away from the substrate is spaced from the isolation structure (e.g., the crown included therein) to form a suspended portion.

[0022] In a specific embodiment of the first aspect of the present disclosure, the display panel may also include a second encapsulation layer and a third encapsulation layer covering the first encapsulation layer, the isolation structure and the light-transmitting protective layer, the second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer, and the light-transmitting protective layer is located between the substrate and the second encapsulation layer.

[0023] Optionally, the first encapsulation layer and the third encapsulation layer are inorganic layers, and the second encapsulation layer is an organic layer;

[0024] Optionally, the second encapsulation layer is a planarization layer.

[0025] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a display area, the display area includes a first area and a second area, the second area is located on at least one side of the first area, the transmittance of the first area is greater than the transmittance of the second area, and the light-transmitting opening is located in the first area.

[0026] A second aspect of the present disclosure provides a method for preparing a display panel, which includes: providing a substrate; forming a pixel defining material film layer on one side of the substrate; forming an isolation structure and a light-transmitting protective layer on a side of the pixel defining material film layer that is away from the substrate, wherein the isolation structure is formed with at least one light-transmitting opening and a plurality of isolation openings, and the light-transmitting protective layer is formed to cover at least a portion of the pixel defining material film layer exposed by the light-transmitting opening; performing a patterning process on the pixel defining material film layer to form a pixel defining layer; and forming a light-emitting device in the isolation opening.

[0027] In the above preparation method, in the process of preparing light-emitting devices in batches through the isolation structure, the light-transmitting protective layer can not only ensure the light transmittance of the area where the light-transmitting opening is located, but also protect the pixel defining layer in the process of preparing the light-emitting device, thereby ensuring the protective effect of the pixel defining layer.

[0028] In a specific embodiment of the second aspect of the present disclosure, before forming a pixel defining material film layer, a plurality of first electrodes are formed on a substrate; a pixel defining material film layer is formed on the substrate, the pixel defining material film layer covers the first electrodes, and an isolation structure and a light-transmitting protective layer are formed on a side of the pixel defining material film layer away from the substrate; a patterning process is performed on the pixel defining material film layer to form pixel openings corresponding to the isolation openings, respectively, the first electrodes are at least partially exposed from the corresponding isolation openings, and the pixel defining material film layer is formed as a pixel defining layer; after forming the isolation structure and the light-transmitting protective layer, a light-emitting functional material layer and a conductive material layer are sequentially deposited to cover the isolation structure, the isolation openings and the light-transmitting openings; on the back of the conductive material layer, a light-emitting functional material layer and a conductive material layer are sequentially deposited to cover the isolation structure, the isolation openings and the light-transmitting openings; A packaging material layer is formed on the side away from the substrate, and then a composition process is performed on the light-emitting functional material layer, the conductive material layer and the packaging material layer to remove the light-emitting functional material layer, the conductive material layer and the packaging material layer corresponding to the light-transmitting opening and part of the isolation opening, wherein the remaining light-emitting functional material layer located at the isolation opening forms a light-emitting functional layer, the remaining conductive material layer is formed as a second electrode, the remaining packaging material layer is formed as a packaging unit, and the first electrode and the light-emitting functional layer and the second electrode in the corresponding isolation opening constitute a light-emitting device; the above-mentioned process of preparing the light-emitting functional layer, the second electrode and the packaging unit is repeated until a light-emitting device and a packaging unit are formed at each isolation opening, wherein all the packaging units constitute the first packaging layer.

[0029] In a specific embodiment of the second aspect of the present disclosure, the step of forming an isolation structure and a light-transmitting protective layer on a side of the pixel-defining material film layer facing away from the substrate may include: forming an isolation structure on the pixel-defining material film layer; depositing a light-transmitting protective material film layer to cover the isolation structure, the isolation opening and the light-transmitting opening, and patterning the protective material film layer to form a light-transmitting protective layer; or,

[0030] A light-transmitting protective material film layer is deposited at the light-transmitting opening to form a light-transmitting protective layer.

[0031] In another specific embodiment of the second aspect of the present disclosure, the step of forming an isolation structure and a light-transmitting protective layer on the side of the pixel defining material film layer facing away from the substrate may include: depositing a light-transmitting protective material film layer to cover the pixel defining material film layer, and patterning the protective material film layer to form a light-transmitting protective layer; and forming an isolation structure on the pixel defining material film layer formed with the light-transmitting protective layer.

[0032] A third aspect of the present disclosure provides a display device, which includes the display panel in the first aspect, or the display panel obtained by the preparation method of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of a planar structure of a display panel provided in one embodiment of the present disclosure.

[0034] Figure 2 for Figure 1 An enlarged view of the S1 region of the display panel is shown.

[0035] Figure 3A for Figure 2 The shown display panel is a cross-sectional view along M1 - N1 in one design.

[0036] Figure 3B for Figure 2 The display panel is shown in a cross-sectional view along M2 - N2 .

[0037] Figure 4 for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0038] Figure 5 for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0039] Figure 6 for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0040] Figure 7 A flow chart of a method for preparing a display panel provided in one embodiment of the present disclosure.

[0041] FIG. 8A to FIG. 8H for Figure 3A A process diagram of a method for preparing a display panel is shown.

[0042] FIG. 9A to FIG. 9B for Figure 4A process diagram of a method for preparing a display panel is shown.

[0043] Description of reference numerals:

[0044] 10-display panel; 11-display area; 12-frame area; 100-substrate; 210-isolation structure; 201-light-transmitting opening; 202-isolation opening; 203-pixel opening; 211-support portion; 212-crown portion; 213-pixel defining layer; 213a-pixel defining material layer; 220-light-emitting device; 221-first electrode; 222-second electrode; 223-light-emitting functional layer; 2231-first functional layer; 2232-light-emitting layer; 2233-second functional layer; 214-bottom; 300-packaging structure; 310-first packaging layer; 310a-packaging material film layer; 320-second packaging layer; 330-third packaging layer; 400-light-transmitting protective layer; 500-photoresist pattern. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0046] In display products, some functional film layers in the light-emitting devices are formed by evaporation, and there are multiple functional film layers in each light-emitting device, and the materials of some functional film layers (such as light-emitting layers) in the light-emitting devices that emit different light are different. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by the alignment accuracy error, sufficient space (and safety margin related to the alignment error) needs to be reserved between different light-emitting devices to ensure that the position of the actual light-emitting area of ​​the light-emitting device can have a certain overlap rate with the designed position (design area), which is equivalent to compressing the design area of ​​the light-emitting area of ​​the light-emitting device, which not only limits the light-emitting area of ​​the light-emitting device, but also prevents the arrangement density of the light-emitting device from being further increased, thereby making it difficult to further improve the PPI (pixel density) of the display panel.

[0047] In the present disclosure, an isolation structure is provided at the gap between the light-emitting devices (hereinafter referred to as the light-emitting unit) to isolate the functional film layers of the adjacent light-emitting devices. Thus, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel without using a mask plate to prepare the functional film layer of each light-emitting device separately. The process does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting devices can be designed to be smaller in size to increase the PPI (the principle of which can be referred to in the following and FIG. 8A to FIG. 8H (See also the relevant description in the relevant embodiments).

[0048] In some application scenarios, the display panel needs to have functions such as transparent display and under-screen recognition (fingerprint recognition, under-screen camera, infrared sensing) based on application requirements. In this way, a light-transmitting area will be divided in the display panel, and light-transmitting holes will be set in the gaps between the sub-pixels in the light-transmitting area to achieve light transmission. However, in the area where the light-transmitting holes are located, due to the transmittance requirements, the light-shielding or low-transmittance structures will be removed. However, this will cause the film layers below these structures to lose protection and be etched and damaged during the preparation process of the light-emitting device.

[0049] At least one embodiment of the present disclosure provides a display panel and a method for preparing the same, and a display device, to at least solve the above-mentioned technical problems. The display panel includes a substrate and an isolation structure, a pixel defining layer, a light-transmitting protective layer, and a plurality of light-emitting devices located on the substrate. The isolation structure defines at least one light-transmitting opening and a plurality of isolation openings, and the isolation opening is used to limit the light-emitting device. The isolation structure includes a support portion and a crown portion stacked in sequence on the substrate. The pixel defining layer is located between the isolation structure and the substrate, and the positive projection of the light-transmitting opening on the substrate is located within the positive projection of the pixel defining layer on the substrate. The light-transmitting protective layer is located on the side of the pixel defining layer away from the substrate, and covers at least the portion of the pixel defining layer exposed by the light-transmitting opening. In the process of preparing light-emitting devices in batches through the isolation structure, multiple etching processes will be performed. In this way, at the light-transmitting opening, the etching process will etch the pixel defining layer exposed by the light-transmitting opening to destroy the protective effect of the pixel defining layer on the substrate and the structure of the light-emitting device (such as the first electrode described below). In the above process, the light-transmitting protective layer can not only ensure the light transmission of the area where the light-transmitting opening is located, but also protect the pixel defining layer in the process of preparing the light-emitting device, thereby ensuring the protective effect of the pixel defining layer.

[0050] The structure of the display panel in at least one embodiment of the present disclosure is described in detail below in conjunction with the accompanying drawings. In addition, in these drawings, a spatial rectangular coordinate system is established with the substrate in the display panel as a reference to intuitively present the positional relationship of each component in the display panel. In this spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the surface where the substrate is located, and the Z-axis is perpendicular to the surface where the substrate is located.

[0051] like Figure 1 , Figure 2 , Figure 3A and Figure 3B As shown, the display panel 10 includes a display area 11 and a non-display area 12 surrounding the display area 11, and the display area 11 includes a first area 13, and sub-pixels emitting light of different colors, such as R, G, and B, are arranged in the display area 11. A light-transmitting opening 201 is provided in the first area 13, and the setting of the light-transmitting opening 201 enables the first area 13 to have a certain light transmittance for under-screen recognition, video recording, infrared sensing or transparent display. It should be noted that in some embodiments of the present disclosure, some wiring in the non-display area 12 can be arranged in the display area 11, so that the non-display area 12 can be designed as a single-sided frame.

[0052] For example, the physical structure of the display panel 10 includes a substrate 100 and an isolation structure 210, a pixel defining layer 213, a light-transmitting protection layer 400 and a plurality of light-emitting devices 220 located on the substrate 100. The light-emitting devices 220 are physical light-emitting structures of sub-pixels such as R, G, and B.

[0053] For example, the isolation structure 210 defines at least one light-transmitting opening 201 and a plurality of isolation openings 202, the isolation openings 202 are used to limit the light-emitting devices 220, and the light-transmitting openings 201 are arranged in the first area 13 and are located between the light-emitting devices 220, that is, the light-transmitting openings 201 for light transmission are set at the gaps between the light-emitting devices 220. The application of the isolation structure 210 can make it unnecessary to use a fine mask plate in the preparation process of the light-emitting device 220, so there is no need to consider the alignment accuracy of the preparation process, which is conducive to reducing the gap size of the light-emitting device 220 to improve the pixel PPI of the display panel 10 (this principle can be seen in FIG. 8A to FIG. 8H In addition, in the first area 13, by providing a light-transmitting opening 201 in the isolation structure 210, the area of ​​the display panel 10 provided with the light-transmitting opening 201 can be made light-transmitting, so that the first area 13 of the display panel 10 can realize a transparent display or an under-screen recognition function such as fingerprint recognition, under-screen camera, infrared sensing, etc.

[0054] For example, the pixel defining layer 213 is located between the isolation structure 210 and the substrate 100, and the orthographic projection of the light-transmitting opening 201 on the substrate 100 is located within the orthographic projection of the pixel defining layer 213 on the substrate 100, and the light-transmitting protective layer 400 is located on the side of the pixel defining layer 213 facing away from the substrate 100, and covers at least the portion of the pixel defining layer 213 exposed by the light-transmitting opening 201.

[0055] In the process of preparing the light-emitting device 220 in batches through the isolation structure 210, multiple etching processes are performed. In this way, at the light-transmitting opening 201, the etching process will etch the pixel definition layer 213 exposed by the light-transmitting opening 201 to destroy the protective effect of the pixel definition layer 213 on the substrate 100 and the structure of the light-emitting device 220 (such as the first electrode 221 described below). In the above process, the light-transmitting protective layer 400 can not only ensure the light transmission of the area where the light-transmitting opening 201 is located, but also protect the pixel definition layer 213 in the process of preparing the light-emitting device 220, thereby ensuring the protective effect of the pixel definition layer 213.

[0056] It should be noted that the composition, preparation and other contents of the isolation structure 210 (which may be referred to as a partition structure or an isolation column) may also be referred to patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN20 The relevant instructions in 24 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A are not repeated here.

[0057] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the light emitting device 220 includes a first electrode 221, a second electrode 222 and a light emitting functional layer 223 sequentially stacked on the substrate 100, and the light emitting functional layer 223 and the second electrode 222 are located in the corresponding isolation opening 202. For example, the first electrode 221 can be set as an anode, and the second electrode 222 can be set as a cathode.

[0058] For example, the light-emitting functional layer 223 may include a first common layer 2231, a light-emitting layer 2232, and a second common layer 2233 stacked in sequence, and the first common layer 2231, the light-emitting layer 2232, and the second common layer 2233 are stacked in sequence on the first electrode 221. The first common layer 2231 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second common layer 2233 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. The isolation structure 210 is arranged so that the first common layer 2231 (the main film layer causing current crosstalk) of each light-emitting device 220 is electrically disconnected from each other.

[0059] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the isolation structure 210 includes a support portion 211 and a crown portion 212 stacked on the substrate 100, the support portion 211 is located between the crown portion 212 and the substrate 100, and the surface of the support portion 211 facing away from the substrate 100 is located within the orthographic projection of the crown portion 212 on the substrate 100, that is, the edge of the crown portion 212 will exceed the edge of the support portion 211. In this way, when evaporating the film layers (such as the light-emitting functional layer 223 and the second electrode 222) in the light-emitting device, the evaporation range of these film layers can be limited by the crown portion 212, so that part of the film layers (such as the light-emitting functional layer described below) are separated by the isolation structure 210, while ensuring that other parts of the film layers (such as the second electrode 222) are connected to the isolation structure 210.

[0060] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the light-transmitting protection layer 400 covers the entire portion of the pixel defining layer 213 exposed by the light-transmitting opening 201 , thereby improving the protection effect of the light-transmitting protection layer 400 on the underlying film layer of the light-transmitting opening 201 .

[0061] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the edge of the light-transmitting protection layer 400 is connected to the isolation structure 210. Thus, there is no gap between the light-transmitting protection layer 400 and the isolation structure 210, and the light-transmitting protection layer 400 and the isolation structure 210 can jointly protect the pixel defining layer 213 to improve the protection effect on the pixel defining layer 213.

[0062] In at least one embodiment of the present disclosure, there is no limit on the number of light-transmitting openings 201, and the number can be designed according to actual needs. For example, one light-transmitting opening 201 can be provided; or, a plurality of light-transmitting openings 201 can be provided. Figure 2 and Figure 3A shown.

[0063] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the support portion 211 is a conductive structure, and the second electrode 222 is connected to the side surface of the support portion 211. In this way, the second electrodes 222 of each light emitting device 220 are connected together through the support portion 211 to form a common electrode, and the support portion 211 is not limited by thickness, so that the impedance of the common electrode can be reduced.

[0064] It should be noted that the material of the second electrode 222 can be a metal material. The smaller the thickness of the second electrode 222, the higher its transmittance, but the higher its resistivity. If the thickness of the second electrode 222 is too small, when the isolation structure 210 is not set, the voltage drop of the second electrode 222 (the common electrode at this time) will be too large. In the embodiment of the present disclosure, the second electrode 222 is connected to the conductive support portion 211, which can remove the thickness restriction of the second electrode 222, so that the second electrode 222 has a smaller thickness to have a higher transmittance.

[0065] In at least one embodiment of the present disclosure, the support portion 211 may be a metal conductive structure. The metal material has a high conductivity and can reduce the voltage drop when driving the cathode. Accordingly, the metal material can only be light-transmissive when the thickness is extremely thin (e.g., tens of nanometers), and the isolation structure 210 requires a certain thickness to isolate the light-emitting functional layer 223 (the first common layer 2231 included therein). Accordingly, the support portion 211 in the isolation structure 210 is almost opaque. Therefore, the isolation structure 210 can only be made light-transmissive by providing the light-transmitting opening 201.

[0066] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the light-transmitting protective layer 400 is a transparent conductive layer, the isolation structure 210 includes a conductive structure (such as the above-mentioned support portion 211), and the light-transmitting protective layer 400 is electrically connected to the isolation structure 210. In this way, the second electrodes 222 of each light-emitting device 220 are connected together through the support portion 211 to form a common electrode, and the support portion 211 is not limited by thickness, so that the impedance of the common electrode can be reduced. The second electrodes 222 of each light-emitting device 220 are connected together through the isolation structure 210 and the light-transmitting protective layer 400 to form a common electrode, and the support portion 211 is not limited by thickness, so that the impedance of the common electrode can be reduced, so as to reduce the voltage drop generated on the second electrode 222 when the light-emitting device 220 is driven.

[0067] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the light-transmitting protective layer 400 covers at least a portion of the side surface of the isolation structure 210, for example, the edge portion of the light-transmitting protective layer 400 is connected to the side surface of the support portion 211. The isolation structure 210 may be formed by an etching process. In this embodiment, the light-transmitting protective layer 400 may be prepared after the isolation structure 210 is prepared, so that the light-transmitting protective layer 400 will not be damaged by the etching process for preparing the isolation structure 210, thereby ensuring the protection effect of the light-transmitting protective layer 400.

[0068] In at least one embodiment of the present disclosure, Figure 4As shown, the edge of the light-transmitting protection layer 400 is located between the support portion 211 and the pixel defining layer 213. Thus, the light-transmitting protection layer 400 is formed before the isolation structure 210, so that the light-transmitting protection layer 400 can protect the pixel defining layer 213 during the process of preparing the isolation structure 210.

[0069] In at least one embodiment of the present disclosure, Figure 5 As shown, the isolation structure 210 further includes a bottom 214, the bottom 214 is located on the side of the support portion 211 away from the crown portion 212, the orthographic projection of the bottom 214 on the substrate 100 is located within the orthographic projection of the crown portion 212 on the substrate 100, and the orthographic projection of the support portion 211 on the substrate 100 is located within the orthographic projection of the bottom 214 on the substrate 100. For example, the second electrode 222 is connected to the area of ​​the surface of the bottom 214 away from the substrate 100 that is not covered by the support portion 211. For example, the bottom 214 is a conductive structure, so that the second electrode 222 is easier to deposit on the bottom 214 than on the side surface of the support portion 211, thereby reducing the impedance at the connection between the second electrode 222 and the isolation structure 210.

[0070] For example, the crown 212, the support portion 211 and the bottom 214 can be made of titanium, aluminum and molybdenum in sequence, and the corrosion resistance of titanium, molybdenum and aluminum decreases in sequence, so that the following can be formed: Figure 5 An isolation structure 210 is shown.

[0071] In some embodiments of the present disclosure, Figure 5 As shown, when the isolation structure 210 is prepared first and then the light-transmitting protective layer 400 is prepared, the edge portion of the light-transmitting protective layer 400 covers at least a portion of the area of ​​the bottom 214 that is away from the substrate 100 and is not covered by the support portion 211. The light-transmitting protective layer 400 is more easily deposited on the bottom 214, which is equivalent to the side surface of the support portion 211, so that the impedance at the connection between the light-transmitting protective layer 400 and the isolation structure 210 can be reduced.

[0072] In some other embodiments of the present disclosure, when the light-transmitting protection layer 400 is formed before the isolation structure 210 , the edge portion of the light-transmitting protection layer 400 is located between the bottom 214 and the pixel defining layer 213 to be connected to the bottom 214 .

[0073] In some embodiments of the present disclosure, the material of the light-transmitting protective layer 400 includes at least one of indium tin oxide, indium gallium oxide and indium zinc oxide. These materials have both electrical conductivity and light-transmitting functions.

[0074] In at least one embodiment of the present disclosure, Figure 5As shown, the pixel defining layer 213 includes a plurality of pixel openings 203 corresponding to the isolation openings 202, and the pixel openings 203 are connected to the corresponding isolation openings 202. The pixel openings 203 are used to limit the light emitting device 220 and expose the first electrode 221, and the pixel openings 203 correspond to the isolation openings 202.

[0075] In at least one embodiment of the present disclosure, the pixel defining layer 213 is an inorganic film layer. In the process of preparing the light-emitting device 220 based on the isolation structure 210, the pixel defining layer 213 does not need a high thickness to accommodate the light-emitting device 220, which is conducive to the thin and light design of the display panel; in addition, the pixel defining layer 213 as an inorganic film layer can have a high bonding strength with the isolation structure 210 and the first electrode 221 to reduce the risk of the isolation structure 210 and the first electrode 221 falling off; in addition, the inorganic film layer has a high density and can more effectively block the intrusion of water, oxygen, etc., thereby improving the packaging effect of the display panel. Furthermore, when the pixel defining layer 213 is an inorganic layer, it can have a smaller thickness, thereby reducing the break at the edge of the pixel opening 203, so as to improve the film continuity of the second electrode 222 at this location, so as to reduce the impedance of the second electrode 222, thereby ensuring the display effect of the display panel.

[0076] In at least one embodiment of the present disclosure, Figure 6 As shown, the display panel may further include a packaging structure 300, and the packaging structure 300 may include a first packaging layer 310, which is located on a side of the light-emitting device 220 away from the substrate 100 and includes a plurality of packaging units corresponding to the isolation openings 202, and the packaging units cover the corresponding isolation openings 202. The light-emitting device 220 is prepared in batches based on different luminous colors, and the packaging unit is used to protect the light-emitting device 220 during the preparation process, so the packaging unit is also prepared in batches.

[0077] For example, Figure 6 As shown, the edge of the packaging unit extends to the side of the isolation structure 210 (e.g., the crown 212 included therein) away from the substrate 100, and the portion of the packaging unit located on the side of the isolation structure 210 (e.g., the crown 212 included therein) away from the substrate 100 is spaced from the isolation structure 210 (e.g., the crown 212 included therein) to form a suspended portion. The reason for the formation of the suspended portion is related to the process of preparing the light-emitting device 200 based on the isolation structure 210, and the details can be referred to the following about FIG. 8A to FIG. 8H The relevant descriptions in the illustrated embodiments are not repeated here.

[0078] In at least one embodiment of the present disclosure, Figure 6As shown, the encapsulation structure 300 may further include a second encapsulation layer 320 and a third encapsulation layer 330 covering the first encapsulation layer 310, the isolation structure 210 and the light-transmitting protective layer 400, the second encapsulation layer 320 is located between the first encapsulation layer 310 and the third encapsulation layer 330, and the light-transmitting protective layer 400 is located between the substrate 100 and the second encapsulation layer 320. For example, the first encapsulation layer 310 and the third encapsulation layer 330 are inorganic layers, and the inorganic layers have high density to isolate water and oxygen, and the second encapsulation layer 320 is an organic layer as a planarization layer, so as to have a large thickness to planarize the surface of the display panel, so as to facilitate the preparation of functional structures such as a touch structure, an optical film, and a cover plate on the encapsulation layer 300.

[0079] It should be noted that in the embodiments of the present disclosure, there is no restriction on the design area of ​​the first region, and the design can be performed according to the actual process requirements and the application scenario of the display panel.

[0080] For example, in some embodiments of the present disclosure, the entire display area can be designed as the first area 13. Under this design, the display panel can be used in scenes such as transparent display.

[0081] For example, in some other embodiments of the present disclosure, refer to Figure 1 , the display area also includes a second area (an area within the display area 11 and outside the first area 13), the second area is located on at least one side of the first area 13, the light-transmitting opening 201 is located in the first area, and the light transmittance of the first area is greater than the light transmittance of the second area. For example, the first area 13 is a light-transmitting area, and the second area is a non-light-transmitting area. Under this design, the display panel can be used in scenarios such as fingerprint recognition or under-screen camera.

[0082] In at least one embodiment of the present disclosure, Figure 6 As shown, the substrate 100 may include a substrate and a driving circuit layer located on the substrate, the driving circuit layer includes a plurality of pixel driving circuits located in the display area, and the display function layer is located on the side of the driving circuit layer away from the substrate. For example, the pixel driving circuit may include a plurality of transistors TFT, capacitors, etc., for example, formed in various forms such as 2T1C (i.e., 2 transistors (TFT) and 1 capacitor (C)), 3T1C or 7T1C. The pixel driving circuit is connected to the light emitting device 220 in the display function layer to control the switching state and light emitting brightness of the light emitting device 200.

[0083] At least one embodiment of the present disclosure provides a method for preparing a display panel, such as Figure 7 As shown, the specific process of the preparation method can refer to the following steps S110 to S140.

[0084] S110, providing a substrate.

[0085] For example, based on step S110 , a plurality of first electrodes may be further formed on the substrate.

[0086] S120, forming a pixel definition material film layer on one side of the substrate.

[0087] For example, a pixel defining material film layer is formed on one side of the substrate, and the pixel defining material film layer may cover the first electrode.

[0088] S130, forming an isolation structure and a light-transmitting protective layer on a side of the pixel defining material film layer facing away from the substrate, wherein the isolation structure is formed with at least one light-transmitting opening and a plurality of isolation openings, and the light-transmitting protective layer is formed to cover at least a portion of the pixel defining material film layer exposed by the light-transmitting opening.

[0089] For example, the isolation openings correspond to the first electrodes respectively.

[0090] For example, the isolation structure includes a support portion and a crown portion sequentially stacked on a base plate.

[0091] S140 , performing a patterning process on the pixel defining material film layer to form a pixel defining layer.

[0092] S150, forming a light emitting device in the isolation opening.

[0093] In the preparation method of the above steps S110 to S150, in the process of preparing the light-emitting device in batches through the isolation structure, the light-transmitting protective layer can not only ensure the light transmission of the area where the light-transmitting opening is located, but also protect the pixel defining layer in the process of preparing the light-emitting device, thereby ensuring the protection effect of the pixel defining layer. The structure of the display panel obtained by the preparation method can be as follows Figure 3A or Figure 3B As shown, the specific process steps can be found in the following FIG. 8A to FIG. 8H The relevant descriptions in the illustrated embodiments are not repeated here.

[0094] In the above process steps S110 to S150, the preparation method for forming the light-emitting device, the isolation structure, the light-transmitting protection layer and the pixel defining layer may further include the following process steps S210 to S260.

[0095] S210, before forming a pixel defining layer, forming a plurality of first electrodes spaced apart from each other on a substrate.

[0096] S220, forming a pixel defining material film layer on the substrate, the pixel defining material film layer covers the first electrode, and forming an isolation structure and a light-transmitting protection layer on a side of the pixel defining material film layer away from the substrate.

[0097] S230 , performing a patterning process on the pixel defining material film layer to form pixel openings corresponding to the isolation openings respectively, and at least a portion of the first electrode is exposed from the corresponding isolation openings, that is, the pixel defining material film layer is formed into a pixel defining layer.

[0098] S240, after forming the isolation structure and the light-transmitting protection layer, sequentially depositing a light-emitting functional material layer and a conductive material layer to cover the isolation structure, the isolation opening and the light-transmitting opening.

[0099] S250, forming a packaging material layer on the side of the conductive material layer away from the substrate, and then performing a composition process on the light-emitting functional material layer, the conductive material layer and the packaging material layer to remove the light-emitting functional material layer, the conductive material layer and the packaging material layer corresponding to the light-transmitting opening and part of the isolation opening, wherein the remaining light-emitting functional material layer located in the isolation opening forms a light-emitting functional layer, the remaining conductive material layer forms a second electrode, the remaining packaging material layer forms a packaging unit, and the first electrode and the light-emitting functional layer and the second electrode in the corresponding isolation opening constitute a light-emitting device.

[0100] S260, repeating the above process of preparing the light-emitting functional layer, the second electrode and the encapsulation unit until a light-emitting device and an encapsulation unit are formed at each isolation opening, wherein all the encapsulation units constitute a first encapsulation layer.

[0101] For example, in one example, step S130 may include: forming an isolation structure on the pixel defining material film layer; depositing a light-transmitting protective material film layer to cover the isolation structure, the isolation opening and the light-transmitting opening, and patterning the protective material film layer to form a light-transmitting protective layer. The structure of the display panel obtained by the preparation method may be as follows: Figure 3A or Figure 3B Alternatively, in other embodiments, a light-transmitting protective material film layer is directly deposited on the light-transmitting opening to form a light-transmitting protective layer.

[0102] For example, in another example, step S130 may include: depositing a light-transmitting protective material film layer to cover the pixel-defining material film layer, and patterning the protective material film layer to form a light-transmitting protective layer; and forming an isolation structure on the pixel-defining material film layer having the light-transmitting protective layer formed thereon. The structure of the display panel obtained by the preparation method may be as follows: Figure 4 As shown, no further details are given here.

[0103] Next, combine FIG. 8A to FIG. 8H right Figure 3A The preparation process of the display panel shown is described to intuitively demonstrate the principle that the isolation structure can increase the pixel arrangement density PPI and the distance that the light-transmitting protection layer 400 can protect the pixel defining layer 213.

[0104] like Fig. 8A As shown, a substrate 100 is provided and first electrodes 221 arranged in an array are formed on the substrate 100 ; a pixel defining material film layer 213 a (eg, an inorganic material film layer) is deposited on the substrate 100 on which the first electrodes are formed.

[0105] like Figure 8B As shown, an isolation structure 210 is formed on the pixel defining material film layer 213 a . The isolation structure 210 includes a support portion 211 and a crown portion 212 . The support portion 211 and the crown portion 212 surround a light-transmitting opening 201 and an isolation opening 202 .

[0106] like Figure 8C As shown, a protective film layer covering the isolation structure 210 , the light-transmitting opening 201 and the isolation opening 202 is deposited and patterned to form a light-transmitting protective layer 400 , which covers the light-transmitting opening 201 and has its edge extending to the side surface of the support portion 211 .

[0107] In the embodiments of the present disclosure, the patterning process may be a photolithography process, which may include, for example, coating a photoresist on a structure layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structure layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that, in the case where the material of the structure layer (such as the photoresist pattern 500 described below) includes photoresist, the structure layer may be directly exposed through a mask to form a desired pattern.

[0108] like Fig.8D As shown, the pixel defining material film layer 213a is patterned to form a pixel defining layer 213 (the plane shape is a grid shape), the pixel defining layer 213 includes a pixel opening 203 and the pixel defining layer 213 covers the gap between adjacent first electrodes, so that the plane shape of the pixel defining layer 213 is a grid shape.

[0109] In such Fig.8D In the patterning process shown, the light-transmitting protection layer 400 can protect the portion of the pixel defining layer 213 located at the light-transmitting opening 201 to prevent the pixel defining layer 213 at that portion from being etched.

[0110] like Fig. 8EAs shown, a light-emitting functional material layer and a conductive material layer covering the isolation structure 210, the light-transmitting opening 201 and the isolation opening 202 are evaporated on the substrate 100, and the portion of the light-emitting functional material layer located in the isolation opening 202 and the light-transmitting opening 201 forms a light-emitting functional layer, and the portion of the conductive material layer located in the isolation opening 202 and the light-transmitting opening 201 forms a second electrode, so that a light-emitting device 220 is formed in each isolation opening 202 of the isolation structure 210. The evaporation in this process does not use a fine mask plate, so the evaporated material will also be deposited on the crown 212. For example, the evaporated light-emitting functional layer can emit red light (R), that is, at this stage, a light-emitting device 220 emitting red light is formed in each light-transmitting opening 201 and the isolation opening 202 of the isolation structure 210. It should be noted that the light-emitting device 220 at the light-transmitting opening 201 lacks a first electrode.

[0111] like Fig. 8E As shown, a packaging material layer 310 a is deposited to cover the light emitting device 220 . The packaging material layer 310 a covers the entire display area at this stage.

[0112] like Figure 8F As shown, a photoresist is formed (e.g., coated) on the packaging material layer 310a, and then patterned to form a photoresist pattern 500, which only covers a portion of the isolation opening 202 of the isolation structure 210 (the isolation opening 202 where the light-emitting device R of the finished display panel is located).

[0113] like Figure 8G As shown, the surface of the display panel is etched using the photoresist pattern 500 as a mask to remove the encapsulation material layer 310a, the second electrode and the light-emitting functional layer not covered by the photoresist pattern 700; and then the remaining photoresist pattern 500 is removed.

[0114] In such Figure 8G In the etching process shown, the structure at the light-transmitting opening 201 is etched, and the light-transmitting protection layer 400 can block the etching to protect the pixel definition layer 213 therebelow.

[0115] like Figure 8H As shown, the above steps are repeated to form light emitting devices 220 emitting green light (G) and blue light (not shown) in other isolation openings 202 respectively.

[0116] It should be noted that the preparation order of the light-emitting device 220 emitting red light, green light and blue light can be designed according to actual needs, and the embodiments of this announcement do not limit this.

[0117] It should be noted that in some embodiments of the present disclosure, some film layers in the light-emitting functional layer, such as the light-emitting layer, can be prepared by non-evaporation methods such as inkjet printing. The specific method can be selected according to the materials of these film layers. For example, when these film layers are made of polymer materials and are not suitable for evaporation, inkjet printing can be used to prepare them.

[0118] In other embodiments of the present disclosure, the above-mentioned Figure 8B and Figure 8C The order of the preparation process is as follows: Figure 4 For details, please refer to the display panel shown in Fig.9A and Fig. 9B The process steps are shown.

[0119] like Fig.9A As shown, in obtaining Fig. 8A After the structure shown in FIG. 1 , a protection film layer covering the pixel defining material film layer 213 a is deposited and patterned to form a light-transmitting protection layer 400 .

[0120] like Fig.9A As shown, an isolation structure 210 is formed on the pixel defining material film layer 213a and the light-transmitting protective layer 400. The isolation structure 210 includes a supporting portion 211 and a crown portion 212. The supporting portion 211 and the crown portion 212 surround a light-transmitting opening 201 and an isolation opening 202. The edge portion of the light-transmitting protective layer 400 is located between the supporting portion 211 and the pixel defining material film layer 213a.

[0121] At least one embodiment of the present disclosure provides a display device, which may include the display panel in the above embodiment. In addition, when the first area is an identification area, the display device may include an identification device, and the orthographic projection of the identification device on the substrate at least partially overlaps with the first area.

[0122] For example, in some embodiments of the present disclosure, the identification device includes at least one fingerprint identification sensor. For example, the fingerprint identification sensor can be arranged on a side of the substrate away from the display function layer, or the fingerprint identification sensor can also be arranged inside the substrate.

[0123] For example, in some other embodiments of the present disclosure, the identification device may be a camera, and the camera is located on a side of the substrate away from the display function layer.

[0124] For example, in the embodiments of the present disclosure, the display device may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, or the like.

[0125] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0126] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

[0127] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, etc. made within the spirit and principles of this specification should be included in the protection scope of this specification.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure, located on the substrate and defining at least one light-transmitting opening and a plurality of isolation openings, wherein the isolation openings are used to limit the light-emitting device; a pixel defining layer, located between the isolation structure and the substrate, wherein the orthographic projection of the light-transmitting opening on the substrate is located within the orthographic projection of the pixel defining layer on the substrate; and The light-transmitting protection layer is located on a side of the pixel defining layer away from the substrate and covers at least a portion of the pixel defining layer exposed by the light-transmitting opening.

2. The display panel according to claim 1, characterized in that: The light-transmitting protection layer covers the entire pixel defining layer exposed by the light-transmitting opening; Preferably, the edge portion of the light-transmitting protective layer is connected to the isolation structure; Preferably, a plurality of light-transmitting openings are provided.

3. The display panel according to claim 1, characterized in that: The light-transmitting protective layer is a transparent conductive layer, the isolation structure includes a conductive structure, and the light-transmitting protective layer is electrically connected to the isolation structure.

4. The display panel according to claim 3, characterized in that: The light-transmitting protective layer covers at least a portion of the side surface of the isolation structure.

5. The display panel according to claim 4, characterized in that: The isolation structure includes a support portion and a crown portion stacked on the substrate, the support portion being located between the crown portion and the substrate, and The orthographic projection of the surface of the support portion facing away from the substrate on the substrate is located within the orthographic projection of the crown portion on the substrate; Preferably, the light-transmitting protective layer covers at least a portion of the side surface of the supporting portion.

6. The display panel according to claim 5, characterized in that: The isolation structure further includes a bottom portion, the bottom portion being located on a side of the support portion facing away from the crown portion, and The orthographic projection of the bottom portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the bottom portion on the substrate; Preferably, the edge portion of the light-transmitting protective layer covers at least a portion of the area of ​​the surface of the bottom facing away from the substrate that is not covered by the supporting portion.

7. The display panel according to claim 5, characterized in that: An edge portion of the light-transmitting protection layer is located between the supporting portion and the pixel defining layer.

8. The display panel according to claim 1, characterized in that: The material of the light-transmitting protective layer includes at least one of indium tin oxide, indium gallium oxide and indium zinc oxide.

9. The display panel according to claim 1, characterized in that: The light emitting device comprises a first electrode, a light emitting functional layer and a second electrode which are sequentially stacked on the substrate, the light emitting functional layer and the second electrode are located in the corresponding isolation openings, and The isolation structure includes a conductive structure, and the second electrode is electrically connected to the isolation structure.

10. The display panel according to claim 9, characterized in that: The pixel definition layer includes a plurality of pixel openings corresponding to the isolation openings, and the pixel openings are connected to the corresponding isolation openings; Wherein, the pixel opening limits the light-emitting device and exposes the first electrode; Preferably, the pixel openings correspond one-to-one to the isolation openings; Preferably, the pixel defining layer is an inorganic film layer.

11. The display panel according to claim 1, characterized in that: It also includes a first packaging layer, wherein the first packaging layer is located on a side of the light-emitting device away from the substrate and includes a plurality of packaging units corresponding to the isolation openings one by one, and the packaging units cover the corresponding isolation openings; Preferably, an edge of the packaging unit extends to a side of the isolation structure away from the substrate, and a portion of the packaging unit located on a side of the isolation structure away from the substrate is spaced from the isolation structure to form a suspended portion.

12. The display panel according to claim 11, characterized in that: It also includes a second encapsulation layer and a third encapsulation layer covering the first encapsulation layer, the isolation structure and the light-transmitting protective layer, wherein the second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer, and the light-transmitting protective layer is located between the substrate and the second encapsulation layer; Preferably, the first encapsulation layer and the third encapsulation layer are inorganic layers, and the second encapsulation layer is an organic layer.

13. The display panel according to any one of claims 1 to 12, characterized in that: It also includes a display area, wherein the display area includes a first area and a second area, the second area is located on at least one side of the first area, the transmittance of the first area is greater than the transmittance of the second area, and the light-transmitting opening is located in the first area.

14. A method for preparing a display panel, characterized in that: include: providing a substrate; forming a pixel defining material film layer on one side of the substrate; An isolation structure and a light-transmitting protective layer are formed on a side of the pixel-defining material film layer away from the substrate, wherein the isolation structure is formed with at least one light-transmitting opening and a plurality of isolation openings, and the light-transmitting protective layer is formed to cover at least a portion of the pixel-defining material film layer exposed by the light-transmitting opening; Performing a patterning process on the pixel definition material film layer to form a pixel definition layer; and A light emitting device is formed in the isolation opening.

15. The preparation method according to claim 14, characterized in that: Also includes: Before forming the pixel defining material film layer, forming a plurality of first electrodes on the substrate; forming a pixel defining material film layer on the substrate, the pixel defining material film layer covering the first electrode, and forming the isolation structure and the light-transmitting protective layer on a side of the pixel defining material film layer away from the substrate; The step of patterning the pixel defining material film layer to form a pixel defining layer comprises: Performing a patterning process on the pixel definition material film layer to form pixel openings respectively corresponding to the isolation openings, wherein at least a portion of the first electrode is exposed through the corresponding isolation openings; The step of forming a light emitting device in the isolation opening comprises: Depositing a light-emitting functional material layer and a conductive material layer in sequence to cover the isolation structure, the isolation opening and the light-transmitting opening; A packaging material layer is formed on a side of the conductive material layer away from the substrate, and then the light-emitting functional material layer, the conductive material layer and the packaging material layer are patterned to remove the light-transmitting opening and the light-emitting functional material layer, the conductive material layer and the packaging material layer corresponding to a part of the isolation opening, wherein the remaining light-emitting functional material layer located in the isolation opening forms a light-emitting functional layer, the remaining conductive material layer forms a second electrode, the remaining packaging material layer forms a packaging unit, and the first electrode and the light-emitting functional layer and the second electrode in the corresponding isolation opening constitute the light-emitting device; and The above process of preparing the light-emitting functional layer, the second electrode and the packaging unit is repeated until the light-emitting device and the packaging unit are formed at each isolation opening, wherein all the packaging units constitute a first packaging layer.

16. The preparation method according to claim 14, characterized in that: The step of forming an isolation structure and a light-transmitting protective layer on a side of the pixel defining material film layer away from the substrate comprises: forming the isolation structure on the pixel defining material film layer; and Depositing a light-transmitting protective material film layer to cover the isolation structure, the isolation opening and the light-transmitting opening, and performing a patterning process on the protective material film layer to form the light-transmitting protective layer; or, A light-transmitting protective material film layer is deposited at the light-transmitting opening to form the light-transmitting protective layer.

17. The preparation method according to claim 14, characterized in that: The step of forming an isolation structure and a light-transmitting protective layer on a side of the pixel defining material film layer away from the substrate comprises: Depositing a light-transmitting protective material film layer to cover the pixel-defining material film layer, and performing a patterning process on the protective material film layer to form the light-transmitting protective layer; and The isolation structure is formed on the pixel defining material film layer having the light-transmitting protection layer formed thereon.

18. A display device, characterized in that: A display panel comprising any one of claims 1 to 13, or a display panel obtained by the preparation method according to any one of claims 14 to 17.

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