Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate; the isolation structure is located on the substrate, a plurality of isolation openings are defined by the isolation structure, and the isolation structure comprises a first isolation part, a second isolation part, a third isolation part and a fourth isolation part which are sequentially arranged in a stacked mode in the direction away from the substrate; the orthographic projection of at least part of the first isolation part on the substrate is located outside the orthographic projection of the second isolation part on the substrate, and the orthographic projection of one side, close to the fourth isolation part, of the third isolation part on the substrate is located inside the orthographic projection of the fourth isolation part on the substrate; and a plurality of light-emitting devices located in the corresponding isolation openings. The light-emitting functional layer is separated through the fourth end part, so that lateral electric leakage can be avoided.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin film electroluminescent device. It has attracted great attention and is widely used in electronic display products due to its advantages such as low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] However, when manufacturing OLED display devices, there is a problem of lateral leakage between pixels, which causes color cast in the low grayscale image quality of the OLED display device. Summary of the invention

[0004] In view of this, the present application provides a display panel, a method for manufacturing the display panel, and a display device to solve the problem of lateral leakage in traditional solutions.

[0005] According to a first aspect of the present application, there is provided a display panel, comprising: a substrate; an isolation structure, the isolation structure being located on the substrate and enclosing a plurality of isolation openings, the isolation structure comprising a first isolation portion, a second isolation portion, a third isolation portion and a fourth isolation portion which are sequentially stacked in a direction away from the substrate, wherein at least a portion of the orthographic projection of the first isolation portion on the substrate is located outside the orthographic projection of the second isolation portion on the substrate, and the orthographic projection of a side of the third isolation portion close to the fourth isolation portion on the substrate is located within the orthographic projection of the fourth isolation portion on the substrate; and a plurality of light-emitting devices, the light-emitting devices being located in the corresponding isolation openings.

[0006] Optionally, the light-emitting device includes a light-emitting functional layer, and at least part of the light-emitting functional layer is spaced from the first isolation portion; preferably, at least part of the layer includes a hole injection layer and / or a hole transport layer; preferably, the orthographic projection of the second isolation portion on the substrate is within the orthographic projection of the first isolation portion on the substrate.

[0007] Optionally, the material of the first isolation portion includes metal oxide; preferably, the metal oxide includes at least one of indium zinc oxide, indium tin oxide, indium gallium zinc oxide, indium gallium tin zinc oxide, indium gallium oxide and indium aluminum zinc oxide; preferably, the material of the second isolation portion includes molybdenum, and / or, the material of the third isolation portion includes aluminum, and / or, the material of the third isolation portion includes titanium; preferably, the orthographic projection of the second isolation portion on the substrate is located within the orthographic projection of the fourth isolation portion on the substrate; preferably, the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate on a side close to the third isolation portion.

[0008] Optionally, the light-emitting device includes a light-emitting functional layer and a first electrode, the first electrode is located on a side of the light-emitting functional layer away from the substrate, and the first electrode continuously extends to the second isolation portion via the first isolation portion; preferably, the first electrode continuously extends to the third isolation portion via the first isolation portion and the second isolation portion; preferably, the first electrode has a first orthographic projection on the substrate, the first orthographic projection and the orthographic projection of the first isolation portion on the substrate have an overlapping part, the first orthographic projection and the orthographic projection of the second isolation portion on the substrate have an overlapping part, and the first orthographic projection is located outside the orthographic projection of the third isolation portion on the substrate; preferably, the first electrode has a first orthographic projection on the substrate, the first orthographic projection and the orthographic projection of the first isolation portion on the substrate have an overlapping part, the first orthographic projection and the orthographic projection of the second isolation portion on the substrate have an overlapping part, and the first orthographic projection and the orthographic projection of the third isolation portion on the substrate have an overlapping part.

[0009] Optionally, the light-emitting device includes a light-emitting functional layer, wherein: in a direction perpendicular to the substrate, the first isolation portion has a first thickness, the light-emitting functional layer has a second thickness, and the first thickness is greater than the second thickness; preferably, the light-emitting device also includes a first electrode, the first electrode is located on a side of the light-emitting functional layer away from the substrate, and in a direction perpendicular to the substrate, the first electrode has a third thickness, and the first thickness is greater than the sum of the second thickness and the third thickness; preferably, the light-emitting functional layer includes a hole injection layer, a hole transport layer, a first light-emitting layer, a first electron transport layer, a charge generation layer, a second light-emitting layer, a hole blocking layer, a second electron transport layer and an electron injection layer, which are sequentially stacked in a direction away from the substrate; preferably, the first thickness is not less than 100 angstroms, and the first thickness is not greater than 300 angstroms.

[0010] Optionally, the display panel further comprises a pixel defining layer located on one side of the substrate, the pixel defining layer enclosing a plurality of pixel openings, the pixel openings being connected to the corresponding isolation openings; preferably, the light-emitting device comprises a second electrode, a portion of the second electrode being located between the substrate and the pixel defining portion, and another portion being exposed from the corresponding pixel opening; preferably, the isolation structure is located on a side of the pixel defining portion away from the substrate; preferably, the orthographic projection of the first isolation portion on the substrate coincides with the orthographic projection of the fourth isolation portion on the substrate.

[0011] Optionally, the first isolation portion includes a first part and a second part, the orthographic projection of the first part on the substrate coincides with the orthographic projection of the second isolation portion on the substrate, and the orthographic projection of the second part on the substrate is located outside the orthographic projection of the second isolation portion on the substrate, wherein: in a direction perpendicular to the substrate, the first part has a fourth thickness, the second part has a fifth thickness, and the fourth thickness is greater than the fifth thickness; preferably, the difference between the fourth thickness and the fifth thickness is not greater than 100 angstroms.

[0012] The second aspect of the present application provides a method for preparing a display panel, comprising: providing a substrate; sequentially vapor-depositing a first isolation part material layer, a second isolation part material layer, a third isolation part material layer and a fourth isolation part material layer on one side of the substrate, and sequentially patterning the fourth isolation part material layer, the third isolation part material layer, the second isolation part material layer and the first isolation part material layer to sequentially form a fourth isolation part, a third isolation part, a second isolation part and a first isolation part, to obtain an isolation structure enclosing a plurality of isolation openings, wherein the orthographic projection of at least part of the first isolation part on the substrate is located outside the orthographic projection of the second isolation part on the substrate, and the orthographic projection of the side of the third isolation part close to the fourth isolation part on the substrate is located within the orthographic projection of the fourth isolation part on the substrate; and forming a plurality of light-emitting devices located in the plurality of isolation openings.

[0013] Optionally, the step of sequentially vapor-depositing a first isolation part material layer, a second isolation part material layer, a third isolation part material layer and a fourth isolation part material layer on one side of the substrate, and sequentially patterning the fourth isolation part material layer, the third isolation part material layer, the second isolation part material layer and the first isolation part material layer to sequentially form a fourth isolation part, a third isolation part, a second isolation part and a first isolation part to obtain an isolation structure enclosing a plurality of isolation openings includes: vapor-depositing a first isolation part material layer on one side of the substrate, and patterning the first isolation part material layer to obtain a first isolation part; sequentially vapor-depositing a second isolation part material layer, a third isolation part material layer and a fourth isolation part material layer on a side of the first isolation part away from the substrate, and sequentially patterning the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer to sequentially form a fourth isolation part, a third isolation part and a second isolation part to obtain an isolation structure enclosing a plurality of isolation openings.

[0014] Optionally, the step of evaporating a first isolation part material layer on one side of the substrate and patterning the first isolation part material layer to obtain a first isolation part includes: evaporating a first isolation part material layer on one side of the substrate; coating a first photoresist on the first isolation part material layer, exposing and developing the first photoresist to obtain a patterned first photoresist; using the patterned first photoresist as a mask, wet-etching the first isolation part material layer to obtain a first isolation part.

[0015] Optionally, the step of wet-etching the first isolation material portion using the patterned first photoresist as a mask to obtain the first isolation portion includes: wet-etching the first isolation material portion using the patterned first photoresist as a mask to obtain an etched first isolation portion material layer; removing the patterned first photoresist; heating the etched first isolation portion material layer to crystallize the etched first isolation portion material layer to obtain the first isolation portion.

[0016] Optionally, the temperature for heating the etched first isolation portion material layer is greater than 320°C.

[0017] Optionally, the step of sequentially vapor-depositing a second isolation part material layer, a third isolation part material layer and a fourth isolation part material layer on a side of the first isolation part away from the substrate, and sequentially patterning the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer to sequentially form a fourth isolation part, a third isolation part and a second isolation part to obtain an isolation structure enclosing a plurality of isolation openings comprises: sequentially vapor-depositing a second isolation part material layer, a third isolation part material layer and a fourth isolation part material layer on a side of the first isolation part away from the substrate; coating a second photoresist on the fourth isolation part material layer, and exposing and developing the second photoresist to obtain to the patterned second photoresist; using the patterned second photoresist as a mask, sequentially dry-etching the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer to sequentially form a fourth isolation part, a third isolation part and a second isolation part, to obtain an isolation structure enclosing a plurality of isolation openings; preferably, after the step of sequentially dry-etching the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer to sequentially form a fourth isolation part, a third isolation part and a second isolation part using the patterned second photoresist as a mask, it also includes: cleaning the display panel; removing the patterned second photoresist.

[0018] Optionally, in the process of dry etching the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer in sequence using the patterned second photoresist as a mask to sequentially form a fourth isolation part, a third isolation part and a second isolation part, the second part of the material layer of the first isolation part exposed from the second isolation part is overetched to a sixth thickness to form a second part, the first isolation part also includes a first part overlapping with the second isolation part, the first part has a fourth thickness, and the sixth thickness is less than the fourth thickness.

[0019] Optionally, the sixth thickness is not greater than 100 angstroms.

[0020] A third aspect of the present application provides a display device, comprising the display panel as described in the first aspect of the embodiment.

[0021] The present application adds a first isolation portion to one end of the second isolation portion close to the substrate, which can further limit the edge of the isolation opening, inhibit adjacent light-emitting devices from being connected through a third isolation portion with conductive capability, avoid lateral leakage, and further avoid the color cast of low grayscale image quality caused by leakage crosstalk between pixels. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0023] Figure 1 is a schematic diagram of a display panel according to an embodiment of the present application;

[0024] Figure 2 is a partial schematic diagram of a display panel according to an embodiment of the present application;

[0025] Figure 3 is a schematic diagram of a display panel according to another embodiment of the present application;

[0026] Figure 4 is a schematic diagram of a light-emitting functional layer according to an embodiment of the present application;

[0027] Figure 5 is a partial schematic diagram of a display panel according to another embodiment of the present application;

[0028] Figure 6 is a flowchart of the steps of a method for preparing a display panel according to an embodiment of the present application;

[0029] Figure 6a-6e It is a schematic diagram of the structures of the steps of a method for preparing a display panel provided in an embodiment of the present application;

[0030] Figure 7d-Figure 7d It is a schematic structural diagram of each step of a first end forming method provided in an embodiment of the present application;

[0031] Figure 8 It is a step flow chart of a method for forming a third end portion according to an embodiment of the present application.

[0032] In the figure: 1 substrate; 2 isolation structure; 21 first isolation part; 22 second isolation part; 23 third isolation part; 24 fourth isolation part; 3 light-emitting device; 31 light-emitting functional layer; 311-hole injection layer; 312-hole transport layer; 313-first light-emitting layer; 314-first electron transport layer; 315-charge generation layer; 316-second light-emitting layer 316; 317-hole blocking layer; 318-second electron transport layer; 319-electron injection layer; 32 first electrode; 33 second electrode; 4 pixel defining part; 11 driving circuit layer; 12 planarization layer; 20 first photoresist. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0034] The technical solutions in the embodiments of the present application are clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0035] Among them, patent CN118251982A, patent 202410864269.8, patent PCT / CN2024 / 098407, patent PCT / CN2024 / 102783, patent PCT / CN2024 / 098217, patent PCT / CN20241099419 and patent PCT / CN20241099072 record relevant technical solutions of the isolation structure, and their contents are incorporated into this application by reference for reference.

[0036] Figure 1 is a schematic diagram of a display panel according to an embodiment of the present application, Figure 2 FIG. 1 is a partial schematic diagram of a display panel according to an embodiment of the present application. Figure 1-2 As shown, the display panel includes:

[0037] A substrate 1; an isolation structure 2, the isolation structure 2 is located on the substrate 1 and encloses a plurality of isolation openings, the isolation structure 2 comprises a first isolation portion 21, a second isolation portion 22, a third isolation portion 23 and a fourth isolation portion 24 which are sequentially stacked in a direction away from the substrate 1, wherein the orthographic projection of at least part of the first isolation portion 21 on the substrate 1 is located outside the orthographic projection of the second isolation portion 22 on the substrate 1, and the orthographic projection of a side of the third isolation portion 23 close to the fourth isolation portion 24 on the substrate 1 is located within the orthographic projection of the fourth isolation portion 24 on the substrate 1; a plurality of light-emitting devices 3, the light-emitting devices 3 are located in corresponding isolation openings.

[0038] When manufacturing OLED display devices, due to process fluctuations, the uniformity of forming the partition is poor, and the partition of some pixels is short, causing the edge of the light-emitting functional layer to climb up the Mo-Tip and connect with the isolation column when evaporating the B&G&R light-emitting device, causing the hole injection layer (HIL) and hole transport layer (HTL) between pixels to leak laterally. Therefore, the first isolation part 21 is added to the end of the second isolation part 22 close to the substrate 1, so that during evaporation, the fourth isolation part 24, the third isolation part 23 and the second isolation part 22 are raised, and the edge of the isolation opening is further limited to avoid leakage caused by the connection of adjacent light-emitting devices 3 through the third isolation part 23 with conductive ability.

[0039] Specifically, the light-emitting device 3 includes a light-emitting functional layer 31, and at least part of the layers in the light-emitting functional layer 31 are spaced from the first isolation portion 21; preferably, at least part of the layers include a hole injection layer and / or a hole transport layer; preferably, the orthographic projection of the second isolation portion 22 on the substrate 1 is located within the orthographic projection of the first isolation portion 21 on the substrate 1.

[0040] The light-emitting device 3 can emit R (red), G (green) and B (blue) light through the light-emitting functional layer 31 included therein. One light-emitting functional layer 31 emits light of a corresponding color. The first isolation portion 21 in the isolation structure 2 can isolate the light-emitting functional layer 31 of the adjacent light-emitting device 3 to define a plurality of isolation openings. When the light-emitting device 3 is formed, the light-emitting device 3 is limited within the isolation opening to prevent the light-emitting functional layer 31 from being deposited on the side of the third isolation portion 23 near the edge area of ​​the isolation structure 2 and being electrically connected to the isolation structure, resulting in cross-color or poor display.

[0041] Specifically, the material of the first isolation portion 21 includes metal oxide; preferably, the metal oxide includes at least one of indium zinc oxide, indium tin oxide, indium gallium zinc oxide, indium gallium tin zinc oxide, indium gallium oxide and indium aluminum zinc oxide; preferably, the material of the second isolation portion 22 includes molybdenum, and / or, the material of the third isolation portion 23 includes aluminum, and / or, the material of the third isolation portion 23 includes titanium; preferably, the orthographic projection of the second isolation portion 22 on the substrate 1 is located within the orthographic projection of the fourth isolation portion 24 on the substrate 1; preferably, the orthographic projection of the third isolation portion 23 on the substrate 1 is located within the orthographic projection of the second isolation portion 22 on the substrate 1 close to the third isolation portion 23.

[0042] The first isolation portion 21 includes a metal oxide coating. Since the metal oxide coating is non-conductive, it can further isolate the connection between the third isolation portion 23 and the light-emitting functional layer 31 to prevent lateral leakage of the light-emitting functional layer 31 .

[0043] In addition, the orthographic projection of the second isolation portion 22 on the substrate 1 is located within the orthographic projection of the first isolation portion 21 on the substrate 1, and the orthographic projection of the third isolation portion 23 on the substrate 1 is located within the orthographic projection of the fourth isolation portion 24 on the substrate 1. Since the display panel is inverted during evaporation, the fourth isolation portion 24 can at least partially block the evaporated light-emitting functional layer 31 for the third isolation portion 23 during evaporation, and the second isolation portion 22 will not block the evaporated light-emitting functional layer 31 for the first isolation portion 21 during evaporation, so as to ensure that the minimum distance between the light-emitting functional layer 31 and the orthographic projection of the first isolation portion 21 included in the isolation structure 2 on the substrate 1 is greater than or equal to 0.

[0044] Specifically, the light-emitting device 3 includes a light-emitting functional layer 31 and a first electrode 32, the first electrode 32 is located on a side of the light-emitting functional layer 31 away from the substrate 1, and the first electrode 32 continuously extends to the second isolation portion 22 via the first isolation portion 21; preferably, the first electrode 32 continuously extends to the third isolation portion 23 via the first isolation portion 21 and the second isolation portion 22; preferably, the first electrode 32 has a first orthographic projection on the substrate 1, the first orthographic projection and the orthographic projection of the first isolation portion 21 on the substrate 1 have an overlapping portion, the first orthographic projection and the orthographic projection of the second isolation portion 22 on the substrate 1 have an overlapping portion, and the first orthographic projection is located outside the orthographic projection of the third isolation portion 23 on the substrate 1; preferably, the first electrode 32 has a first orthographic projection on the substrate 1, the first orthographic projection and the orthographic projection of the first isolation portion 21 on the substrate 1 have an overlapping portion, the first orthographic projection and the orthographic projection of the second isolation portion 22 on the substrate 1 have an overlapping portion, and the first orthographic projection and the orthographic projection of the third isolation portion 23 on the substrate 1 have an overlapping portion.

[0045] In order to realize the OLED series structure, the adjacent light-emitting devices 3 are overlapped with the third isolation part 23 through the first electrode 32 included therein, and are connected in series through the conductive third isolation part 23. In addition, by setting the first electrode 32 to have a first orthographic projection on the substrate 1, the first orthographic projection and the orthographic projection of the first isolation part 21 on the substrate 1 have an overlapping portion, the first orthographic projection and the orthographic projection of the second isolation part 22 on the substrate 1 have an overlapping portion, and the first orthographic projection and the orthographic projection of the third isolation part 23 on the substrate 1 have an overlapping portion, the first electrode 32 can be closely attached to the first isolation part 21 and the second isolation part 22 in the process of overlapping to the third isolation part 23, presenting a stepped structure, and further limiting the light-emitting functional layer 31 in the light-emitting device 3 to avoid leakage.

[0046] It should be noted that the first electrode 32 does not contact the fourth isolating portion 24. Since the fourth isolating portion 24 is made of metal, if the first electrode 32 contacts the fourth isolating portion 24, leakage may occur.

[0047] Figure 3is a schematic diagram of a display panel according to another embodiment of the present application. Figure 3 As shown, the light-emitting device 3 includes a light-emitting functional layer 31, wherein: in a direction perpendicular to the substrate 1, the first isolation portion 21 has a first thickness, the light-emitting functional layer 31 has a second thickness, and the first thickness is greater than the second thickness; preferably, the light-emitting device 3 also includes a first electrode 32, the first electrode 32 is located on a side of the light-emitting functional layer 3 away from the substrate 1, and in a direction perpendicular to the substrate 1, the first electrode 32 has a third thickness, and the first thickness is greater than the sum of the second thickness and the third thickness; preferably, the light-emitting functional layer 31 includes a hole injection layer 311, a hole transport layer 312, a first light-emitting layer 313, a first electron transport layer 314, a charge generation layer 315, a second light-emitting layer 316, a hole blocking layer 317, a second electron transport layer 318 and an electron injection layer 319, which are sequentially stacked in a direction away from the substrate 1; preferably, the first thickness is not less than 100 angstroms, and the first thickness is not greater than 300 angstroms.

[0048] In order to prevent the light-emitting functional layer 31 from climbing up the first isolation portion 21, the thickness of the first isolation portion 21 is set to be greater than the thickness of the light-emitting functional layer 31. Due to the thickness difference, the first electrode 32 can be connected to the side of part of the third isolation portion 23, while the light-emitting functional layer 31 cannot cross the first isolation portion 21. The light-emitting functional layer 31 can be specifically as follows: Figure 4 shown.

[0049] Specifically, the display panel also includes a pixel defining layer 4 located on one side of the substrate 1, the pixel defining layer 4 encloses a plurality of pixel openings, and the pixel openings are connected to the corresponding isolation openings; preferably, the light-emitting device 3 includes a second electrode 33, a portion of the second electrode 33 is located between the substrate 1 and the pixel defining portion 4, and another portion is exposed from the corresponding pixel opening; preferably, the isolation structure 2 is located on the side of the pixel defining portion 4 away from the substrate 1.

[0050] A pixel defining portion 4 may be further added between the isolation structure 2 and the substrate 1 to improve the light extraction efficiency of the display panel and reduce light scattering.

[0051] Specifically, the first isolation portion 21 includes a first portion 211 and a second portion 212, the orthographic projection of the first portion 211 on the substrate 1 coincides with the orthographic projection of the second isolation portion 22 on the substrate 1, and the orthographic projection of the second portion 212 on the substrate 1 is located outside the orthographic projection of the second isolation portion 22 on the substrate 1, wherein: in a direction perpendicular to the substrate 1, the first portion 211 has a fourth thickness, the second portion 212 has a fifth thickness, and the fourth thickness is greater than the fifth thickness; preferably, the difference between the fourth thickness and the fifth thickness is not greater than 100 angstroms.

[0052] like Figure 5As shown, the first isolation portion 21 can be regarded as two parts. The second portion 212 is the portion that blocks the light-emitting functional layer 31. By setting the fifth thickness of the second portion 212 to be greater than the fourth thickness of the first portion 211, the light-emitting functional layer 31 can be further prevented from climbing onto the first isolation portion 21.

[0053] Specifically, in order to avoid lateral leakage problems between light-emitting devices while further increasing the aperture ratio of the light-emitting devices and ensuring the light-emitting efficiency, in some embodiments, the orthographic projection of the first isolation portion 21 on the substrate 1 coincides with the orthographic projection of the fourth isolation portion 24 on the substrate 1.

[0054] Figure 6 is a flowchart of a method for preparing a display panel according to an embodiment of the present application. Figure 6 As shown, the method for preparing the display panel includes the following steps:

[0055] Step 601: Provide a substrate.

[0056] The substrate 1 generally includes a driving circuit layer 11 and a planarization layer 12. The driving circuit layer 11 and the planarization layer 12 stacked in the substrate 1 can be as follows: Figure 6a The driving circuit layer 11 is used to supply power to the devices in the display panel, and the planarization layer 12 is used to smooth the uneven driving circuit layer 11 into a flat surface for subsequent production processes.

[0057] Step 602: vapor-deposit a first isolation part material layer, a second isolation part material layer, a third isolation part material layer and a fourth isolation part material layer on one side of the substrate in sequence, and pattern the fourth isolation part material layer, the third isolation part material layer, the second isolation part material layer and the first isolation part material layer in sequence to form a fourth isolation part, a third isolation part, a second isolation part and a first isolation part in sequence, to obtain an isolation structure enclosing a plurality of isolation openings.

[0058] During the evaporation process, at least part of the orthographic projection of the first isolation portion on the substrate is located outside the orthographic projection of the second isolation portion on the substrate, and the orthographic projection of the third isolation portion on the substrate close to the fourth isolation portion is located within the orthographic projection of the fourth isolation portion on the substrate.

[0059] Specifically, during the preparation of the display panel, Figure 6b As shown, first, a second electrode 33 is formed on the planarization layer 12, and the second electrode 33 is connected to the driving circuit layer 11, as shown in FIG. Figure 6c As shown, a pixel defining portion 4 is then formed on the second electrode 33, as shown in FIG. Figure 6d As shown, the fourth isolation portion 24 , the third isolation portion 23 , the second isolation portion 22 and the first isolation portion 21 are then formed in sequence on the pixel defining portion 4 .

[0060] Step 603: forming a plurality of light-emitting devices located in the plurality of isolation openings.

[0061] The light emitting device 3 located in the isolation opening can be Figure 6e shown.

[0062] Specifically, step 602 may also include: evaporating a first isolation part material layer on one side of the substrate, and patterning the first isolation part material layer to obtain a first isolation part. Evaporating a second isolation part material layer, a third isolation part material layer, and a fourth isolation part material layer on the side of the first isolation part away from the substrate in sequence, and patterning the fourth isolation part material layer, the third isolation part material layer, and the second isolation part material layer in sequence to form a fourth isolation part, a third isolation part, and a second isolation part in sequence, to obtain an isolation structure enclosing a plurality of isolation openings.

[0063] Specifically, the process of evaporating a first isolation part material layer on one side of the substrate and patterning the first isolation part material layer to obtain a first isolation part may also include: evaporating a first isolation part material layer on one side of the substrate, then coating a first photoresist on the first isolation part material layer, exposing and developing the first photoresist to obtain a patterned first photoresist, and finally using the patterned first photoresist as a mask to wet-etch the first isolation part material layer to obtain a first isolation part.

[0064] Since directly processing the first isolation part material layer is difficult and has a low fault tolerance, covering the first isolation part material layer with a first photoresist and patterning the first photoresist can reduce process difficulty and improve process accuracy.

[0065] Specifically, using the patterned first photoresist as a mask, wet etching the first isolation part material layer to obtain the first isolation part may also include: using the patterned first photoresist as a mask, wet etching the first isolation part material layer to obtain the etched first isolation part material layer, then removing the patterned first photoresist, and finally heating the etched first isolation part material layer to crystallize the etched first isolation part material layer to obtain the first isolation part.

[0066] After forming the pixel defining portion 4, a process for forming the first isolation portion 21 may be performed. The first isolation portion material layer formed on the side of the pixel defining portion 4 away from the substrate 1 may be as follows: Figure 7a As shown. Figure 7b As shown in FIG. 1 , after forming the first isolation part material layer, since the first isolation part material layer does not form an ideal shape by inkjet, it needs to be processed and covered with the first photoresist 20. After covering the first photoresist 20, the first photoresist 20 is exposed and developed to obtain a patterned first photoresist 20. Figure 7cAs shown, the first isolation portion material layer is wet-etched using the patterned first photoresist as a mask. Figure 7d As shown, the patterned first photoresist is removed.

[0067] Specifically, the temperature at which the etched first isolation portion material layer is heated is greater than 320°C.

[0068] The patterned first photoresist is removed, and finally the etched first isolation part material layer is heated to crystallize the etched first isolation part material layer. By controlling the high temperature heating temperature to be greater than 320° C., the crystallization of the first isolation part material layer can be ensured.

[0069] Figure 8 is a flowchart of the steps of a method for preparing an isolation structure according to an embodiment of the present application. Figure 8 As shown, the method for preparing the isolation structure comprises the following steps:

[0070] Step 801 : sequentially vapor-depositing a second isolation portion material layer, a third isolation portion material layer, and a fourth isolation portion material layer on a side of the first isolation portion facing away from the substrate.

[0071] Step 802 : coating a second photoresist on the fourth isolation portion material layer, and exposing and developing the second photoresist to obtain a patterned second photoresist.

[0072] After evaporation of each material layer, etching is required to obtain the desired shape. Since it is difficult to directly etch each material layer, a second photoresist can be coated on the fourth isolation portion material layer to perform a patterning process on the second photoresist.

[0073] Step 803, using the patterned second photoresist as a mask, dry-etching the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer in sequence to form a fourth isolation part, a third isolation part and a second isolation part in sequence, and obtaining an isolation structure enclosing a plurality of isolation openings.

[0074] After obtaining the patterned second photoresist, dry etching is performed, and the patterned second photoresist is used as a mask to protect the portion that needs to be retained during the dry etching process, so as to obtain the fourth isolation portion, the third isolation portion and the second isolation portion after the dry etching.

[0075] Preferably, in step 803, before obtaining the isolation structure enclosing a plurality of isolation openings, the display panel may be cleaned and the patterned second photoresist may be removed.

[0076] Specifically, in a process where the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer are dry-etched in sequence using the patterned second photoresist as a mask to sequentially form the fourth isolation part, the third isolation part and the second isolation part, the second part of the material layer of the first isolation part exposed from the second isolation part is overetched to a sixth thickness to form a second part, the first isolation part also includes a first part overlapping with the second isolation part, the first part has a fourth thickness, and the sixth thickness is less than the fourth thickness.

[0077] Due to the limitation of etching process, when dry etching the second isolation part material layer, there may be a certain amount of over-etching. The second part of the material layer exposed from the second isolation part of the first isolation part is over-etched to the sixth thickness to form the second part. In order to avoid the second part of the material layer being etched through to expose the pixel defining part, the sixth thickness is controlled to be less than the fourth thickness.

[0078] Specifically, the sixth thickness is no greater than 100 angstroms.

[0079] When the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer are dry-etched in sequence, there may be a certain amount of over-etching due to the limitation of the etching process. Therefore, the over-etching can only be controlled within a certain amount of over-etching. Since the second part of the first isolation part exposed from the second isolation part cannot be completely over-etched, the over-etching amount needs to be controlled to be less than the thickness of the second part of the first isolation part exposed from the second isolation part. Since the thickness of the second part of the first isolation part exposed from the second isolation part can be greater than 100 angstroms and less than 300 angstroms, the over-etching amount of dry etching is controlled to be less than 100 angstroms, which can ensure that the second part of the first isolation part exposed from the second isolation part will not be etched through.

[0080] The light-emitting device 3 can emit R (red), G (green) and B (blue) light through the light-emitting functional layer 31 included therein. One light-emitting functional layer 31 emits light of a corresponding color. The first isolation portion 21 in the isolation structure 2 can isolate the light-emitting functional layer 31 of the adjacent light-emitting device 3 to define a plurality of isolation openings. When the light-emitting device 3 is formed, the light-emitting device 3 is limited within the isolation opening to prevent the light-emitting functional layer 31 from being deposited on the side of the third isolation portion 23 near the edge area of ​​the isolation structure 2 and being electrically connected to the isolation structure, resulting in cross-color or poor display.

[0081] The present application also provides a display device, including the display panel 100 provided in the above embodiment. The display device has the advantages of the display panel 100 in the above embodiment, so they are not described in detail here.

[0082] It should be noted that the display device can be any device that displays whether it is moving (e.g., video) or fixed (e.g., still image) and whether it is text or image. More specifically, it is contemplated that the embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0083] The above embodiments of the present application may complement each other if no conflict occurs.

[0084] It should be understood that the specific examples in the embodiments of the present application are only to help those skilled in the art better understand the embodiments of the present application, rather than to limit the scope of the embodiments of the present application. Those skilled in the art can make various improvements and modifications based on the above embodiments, and these improvements or modifications all fall within the scope of protection of the present application. The above is only a specific implementation method of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be based on the scope of protection of the claims.

Claims

1. A display panel, characterized in that: include: substrate; an isolation structure, the isolation structure being located on the substrate and enclosing a plurality of isolation openings, the isolation structure comprising a first isolation portion, a second isolation portion, a third isolation portion and a fourth isolation portion which are sequentially stacked in a direction away from the substrate, wherein at least a portion of the orthographic projection of the first isolation portion on the substrate is located outside the orthographic projection of the second isolation portion on the substrate, and the orthographic projection of a side of the third isolation portion close to the fourth isolation portion on the substrate is located within the orthographic projection of the fourth isolation portion on the substrate; A plurality of light emitting devices are disposed in corresponding isolation openings.

2. The display panel according to claim 1, characterized in that: The light emitting device comprises a light emitting functional layer, and a gap exists between at least a part of the light emitting functional layer and the first isolation part; Preferably, the at least part of the layer comprises a hole injection layer and / or a hole transport layer; Preferably, the orthographic projection of the second isolation portion on the substrate is located within the orthographic projection of the first isolation portion on the substrate.

3. The display panel according to claim 1, characterized in that: The material of the first isolation portion includes metal oxide; Preferably, the metal oxide includes at least one of indium zinc oxide, indium tin oxide, indium gallium zinc oxide, indium gallium tin zinc oxide, indium gallium oxide and indium aluminum zinc oxide; Preferably, the material of the second isolation portion includes molybdenum, and / or the material of the third isolation portion includes aluminum, and / or the material of the third isolation portion includes titanium; Preferably, the orthographic projection of the second isolation portion on the substrate is located within the orthographic projection of the fourth isolation portion on the substrate; Preferably, the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of a side of the second isolation portion close to the third isolation portion on the substrate.

4. The display panel according to claim 1, characterized in that: The light emitting device comprises a light emitting functional layer and a first electrode, wherein the first electrode is located at a side of the light emitting functional layer away from the substrate, and the first electrode continuously extends to the second isolation portion via the first isolation portion; Preferably, the first electrode continuously extends to the third isolation portion via the first isolation portion and the second isolation portion; Preferably, the first electrode has a first orthographic projection on the substrate, the first orthographic projection and the orthographic projection of the first isolating portion on the substrate have an overlapping portion, the first orthographic projection and the orthographic projection of the second isolating portion on the substrate have an overlapping portion, and the first orthographic projection is located outside the orthographic projection of the third isolating portion on the substrate; Preferably, the first electrode has a first orthographic projection on the substrate, the first orthographic projection and the orthographic projection of the first isolation portion on the substrate have an overlapping portion, the first orthographic projection and the orthographic projection of the second isolation portion on the substrate have an overlapping portion, and the first orthographic projection and the orthographic projection of the third isolation portion on the substrate have an overlapping portion.

5. The display panel according to claim 1, characterized in that: The light emitting device comprises a light emitting functional layer, wherein: In a direction perpendicular to the substrate, the first isolation portion has a first thickness, the light-emitting functional layer has a second thickness, and the first thickness is greater than the second thickness; Preferably, the light emitting device further comprises a first electrode, the first electrode is located on a side of the light emitting functional layer away from the substrate, and the first electrode has a third thickness in a direction perpendicular to the substrate, and the first thickness is greater than the sum of the second thickness and the third thickness; Preferably, the light-emitting functional layer comprises a hole injection layer, a hole transport layer, a first light-emitting layer, a first electron transport layer, a charge generation layer, a second light-emitting layer, a hole blocking layer, a second electron transport layer and an electron injection layer which are sequentially stacked in a direction away from the substrate; Preferably, the first thickness is not less than 100 angstroms, and the first thickness is not more than 300 angstroms.

6. The display panel according to claim 1, characterized in that: The display panel further comprises a pixel defining layer located on one side of the substrate, wherein the pixel defining layer encloses a plurality of pixel openings, and the pixel openings are connected to the corresponding isolation openings; Preferably, the light emitting device comprises a second electrode, a portion of the second electrode is located between the substrate and the pixel defining portion, and another portion of the second electrode is exposed from the corresponding pixel opening; Preferably, the isolation structure is located on a side of the pixel defining portion away from the substrate; Preferably, an orthographic projection of the first isolation portion on the substrate coincides with an orthographic projection of the fourth isolation portion on the substrate.

7. The display panel according to claim 1, characterized in that: The first isolation portion includes a first part and a second part, the orthographic projection of the first part on the substrate coincides with the orthographic projection of the second isolation portion on the substrate, and the orthographic projection of the second part on the substrate is located outside the orthographic projection of the second isolation portion on the substrate, wherein: In a direction perpendicular to the substrate, the first portion has a fourth thickness, the second portion has a fifth thickness, and the fourth thickness is greater than the fifth thickness; Preferably, the difference between the fourth thickness and the fifth thickness is no more than 100 angstroms.

8. A method for preparing a display panel, characterized in that: include: providing a substrate; A first isolation part material layer, a second isolation part material layer, a third isolation part material layer and a fourth isolation part material layer are sequentially evaporated on one side of the substrate, and the fourth isolation part material layer, the third isolation part material layer, the second isolation part material layer and the first isolation part material layer are sequentially patterned to sequentially form a fourth isolation part, a third isolation part, a second isolation part and a first isolation part, to obtain an isolation structure enclosing a plurality of isolation openings, wherein the orthographic projection of at least part of the first isolation part on the substrate is located outside the orthographic projection of the second isolation part on the substrate, and the orthographic projection of a side of the third isolation part close to the fourth isolation part on the substrate is located within the orthographic projection of the fourth isolation part on the substrate; A plurality of light emitting devices are formed within the plurality of isolation openings.

9. The preparation method according to claim 8, characterized in that: The step of sequentially evaporating a first isolation part material layer, a second isolation part material layer, a third isolation part material layer and a fourth isolation part material layer on one side of the substrate, and sequentially patterning the fourth isolation part material layer, the third isolation part material layer, the second isolation part material layer and the first isolation part material layer to sequentially form a fourth isolation part, a third isolation part, a second isolation part and a first isolation part to obtain an isolation structure enclosing a plurality of isolation openings comprises: Vapor-depositing a first isolation portion material layer on one side of the substrate and patterning the first isolation portion material layer to obtain a first isolation portion; A second isolation part material layer, a third isolation part material layer and a fourth isolation part material layer are sequentially evaporated on the side of the first isolation part away from the substrate, and the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer are sequentially patterned to sequentially form a fourth isolation part, a third isolation part and a second isolation part to obtain an isolation structure enclosed to form a plurality of isolation openings.

10. The preparation method according to claim 9, characterized in that: The step of evaporating a first isolation part material layer on one side of the substrate and patterning the first isolation part material layer to obtain a first isolation part includes: Vapor depositing a first isolation material layer on one side of the substrate; Coating a first photoresist on the first isolation portion material layer, and exposing and developing the first photoresist to obtain a patterned first photoresist; The first isolation part material layer is wet-etched using the patterned first photoresist as a mask to obtain a first isolation part.

11. The preparation method according to claim 10, characterized in that: The step of wet-etching the first isolation material portion using the patterned first photoresist as a mask to obtain the first isolation portion comprises: Using the patterned first photoresist as a mask, wet-etching the first isolation material portion to obtain an etched first isolation portion material layer; removing the patterned first photoresist; The etched first isolation part material layer is heated to crystallize the etched first isolation part material layer to obtain a first isolation part.

12. The preparation method according to claim 11, characterized in that: The temperature for heating the etched first isolation material layer is greater than 320° C.

13. The preparation method according to claim 10, characterized in that: The step of sequentially evaporating a second isolation part material layer, a third isolation part material layer and a fourth isolation part material layer on a side of the first isolation part away from the substrate, and sequentially patterning the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer to sequentially form a fourth isolation part, a third isolation part and a second isolation part to obtain an isolation structure enclosing a plurality of isolation openings comprises: sequentially evaporating a second isolating portion material layer, a third isolating portion material layer and a fourth isolating portion material layer on a side of the first isolating portion away from the substrate; coating a second photoresist on the fourth isolation portion material layer, and exposing and developing the second photoresist to obtain a patterned second photoresist; Using the patterned second photoresist as a mask, sequentially dry-etching the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer to sequentially form a fourth isolation part, a third isolation part and a second isolation part to obtain an isolation structure enclosing a plurality of isolation openings; Preferably, after the step of sequentially dry-etching the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer using the patterned second photoresist as a mask to sequentially form the fourth isolation part, the third isolation part and the second isolation part, the method further comprises: cleaning the display panel; The patterned second photoresist is removed.

14. The preparation method according to claim 13, characterized in that: In the process of dry etching the fourth isolation part material layer, the third isolation part material layer and the second isolation part material layer in sequence using the patterned second photoresist as a mask to sequentially form a fourth isolation part, a third isolation part and a second isolation part, a second part of the material layer of the first isolation part exposed from the second isolation part is overetched to a sixth thickness to form a second part, the first isolation part also includes a first part overlapping with the second isolation part, the first part has a fourth thickness, and the sixth thickness is less than the fourth thickness.

15. The preparation method according to claim 14, characterized in that: The sixth thickness is no greater than 100 angstroms.

16. A display device, comprising the display panel according to any one of claims 1 to 9.

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