Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device. The isolation structure is enclosed to form an isolation opening, when the light-emitting layer and the first electrode layer are subsequently prepared, the light-emitting layer and the first electrode layer are disconnected at the edge of the isolation opening, and a light-emitting unit and a first electrode located in the isolation opening are formed. The preparation cost is reduced. The inner wall, facing the isolation opening, of the isolation structure comprises a plurality of burr areas with protrusions, the average size of the protrusions in one burr area is smaller than the average size of the protrusions in the other burr area, and in other words, the average size of the protrusions in at least one burr area is increased. The contact area of the packaging part and the inner wall, facing the isolation opening, of the isolation structure is increased, attaching is tighter, and the higher tight combining performance of the packaging part and the isolation structure is achieved.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, aiming to improve the performance of the display panel.

[0005] A first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure located on the substrate, the isolation structure enclosing a plurality of isolation openings; the isolation structure having at least two burr regions on an inner wall facing at least one isolation opening, each burr region being provided with a protrusion, and at least two burr regions having an average protrusion size in one burr region being smaller than an average protrusion size in another burr region.

[0006] According to the implementation of the first aspect of the present application, at least two burr regions are distributed along the thickness direction of the display panel, and the average protrusion size of the burr region away from the substrate is greater than the average protrusion size of the burr region close to the substrate.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation opening includes a first isolation opening and a second isolation opening that are spaced apart, and the average size of the protrusion of the isolation structure toward the inner wall of the second isolation opening is larger than the average size of the protrusion of the isolation structure toward the inner wall of the first isolation opening.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the inner wall of the isolation structure facing the second isolation opening has a first burr area and a second burr area, the second burr area is located on the side of the first burr area away from the substrate, the first burr area includes at least one first protrusion, the second burr area includes at least one second protrusion, and the average size of the first protrusion is smaller than the average size of the second protrusion; the inner wall of the isolation structure facing the first isolation opening has a plurality of protrusions of uniform size; the average size of the second protrusion is larger than the average size of the protrusions of the inner wall of the isolation structure facing the first isolation opening.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation opening includes a third isolation opening spaced apart from the first isolation opening and the second isolation opening, the inner wall of the isolation structure facing the third isolation opening has a third burr region and a fourth burr region, the third burr region is located on the side of the fourth burr region away from the substrate, the third burr region includes at least one third protrusion, the fourth burr region includes at least one fourth protrusion, and the average size of the third protrusion is smaller than the average size of the fourth protrusion.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the average size of the fourth protrusions is greater than the average size of the second protrusions.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes: a light-emitting layer, located on the substrate, the light-emitting layer includes a plurality of light-emitting units, and the light-emitting units are located in the isolation opening; a first electrode layer, located on the side of the light-emitting layer away from the substrate, and including a first electrode located in the isolation opening, and the first electrode is electrically connected to the isolation structure.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting unit and the isolation structure are spaced apart.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes: a pixel definition layer located on the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, and the pixel opening and the isolation opening are connected.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a second electrode, the second electrode is located between the substrate and the pixel definition layer, and the second electrode is exposed by the pixel opening.

[0016] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes: a first encapsulation layer located on a side of the second electrode facing away from the substrate, the first encapsulation layer including a plurality of encapsulation portions arranged at intervals.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the packaging portion includes an extension portion, the orthographic projection of the extension portion on the substrate is located within the orthographic projection of the isolation structure on the substrate, and a gap is formed between the extension portion and the isolation structure.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting layer further includes a redundant unit located in the gap.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the first electrode layer further includes a redundant electrode located in the gap.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the width of the extension portion is greater than or equal to 3 μm.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the first encapsulation layer is an inorganic layer.

[0022] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes: a second encapsulation layer located on a side of the first encapsulation layer away from the substrate.

[0023] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes: a third encapsulation layer, located on a side of the second encapsulation layer away from the substrate.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the second encapsulation layer is an organic layer, and / or the third encapsulation layer is an inorganic layer.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first layer and a second layer, the second layer is located on the side of the first layer facing away from the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the burr area is located on the inner wall of the first layer facing the isolation opening.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the first layer includes a conductive material.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the second layer includes a conductive material or an insulating material.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the first layer and the second layer both include metal materials, and the materials of the first layer and the second layer are different.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a third layer located on the side of the first layer facing the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0031] A second aspect of the present application provides a method for preparing a display panel, the method comprising:

[0032] Preparing an isolation material layer on the substrate, and patterning the isolation material layer to form a first isolation opening;

[0033] Sequentially preparing a first light-emitting material layer, a first electrode material layer and a first encapsulation material layer on a side of the isolation material layer facing away from the substrate;

[0034] A first barrier layer is prepared on a side of the first packaging material layer facing away from the substrate, wherein an orthographic projection of the first isolation opening on the substrate is located within an orthographic projection of the first barrier layer on the substrate;

[0035] Performing patterning on the first packaging material layer to form a first packaging portion located at the first isolation opening;

[0036] The first barrier layer is removed by a dry etching process.

[0037] According to an implementation of the second aspect of the present application, before or after the step of removing the first barrier layer by a dry etching process, the method further includes:

[0038] The first light-emitting material layer and the first electrode material layer are patterned to form a first light-emitting unit and a first sub-electrode located in the first isolation opening.

[0039] According to any of the aforementioned embodiments of the second aspect of the present application, the orthographic projection of the first packaging portion on the substrate is located within the orthographic projection of the first barrier layer on the substrate.

[0040] According to any of the aforementioned embodiments of the second aspect of the present application, the first electrode material layer is etched using an acidic etching solution.

[0041] According to any of the aforementioned embodiments of the second aspect of the present application, the first light-emitting material layer is etched using an alkaline etching solution.

[0042] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the first barrier layer includes photoresist.

[0043] According to any of the foregoing embodiments of the second aspect of the present application, the first encapsulation portion includes a first extension portion located on a side of the isolation material layer away from the substrate, the first extension portion is spaced from the isolation material layer to form a first gap, and the first light-emitting material layer and the first electrode material layer are patterned to form a first light-emitting unit and a first sub-electrode located in the first isolation opening, the method further includes:

[0044] The first light emitting material layer and the first electrode material layer are patterned to form a first redundant unit and a first redundant electrode located in the first gap.

[0045] According to any of the aforementioned embodiments of the second aspect of the present application, the width of the first extension portion is greater than or equal to 3 μm.

[0046] According to any of the aforementioned embodiments of the second aspect of the present application, in the step of preparing an isolation material layer on a substrate and patterning the isolation material layer, the method further comprises:

[0047] During the patterning process of the isolation material layer, a second isolation opening spaced apart from the first isolation opening is formed.

[0048] According to any of the aforementioned embodiments of the second aspect of the present application, after the step of patterning the first light-emitting material layer and the first electrode material layer to form a first light-emitting unit and a first sub-electrode located in the first isolation opening, the method further includes:

[0049] The second isolation opening is flushed.

[0050] According to any of the aforementioned embodiments of the second aspect of the present application, the second isolation opening is rinsed with ultrasonic deionized water.

[0051] According to any of the aforementioned implementations of the second aspect of the present application, in the step of removing the first barrier layer by a dry etching process, the method further includes:

[0052] In the dry etching process, the isolation material layer forms a first burr area and a second burr area on the inner wall toward the second isolation opening, the second burr area is located on the side of the first burr area away from the substrate, the first burr area includes at least one first protrusion, the second burr area includes at least one second protrusion, and the average size of the first protrusion is smaller than the average size of the second protrusion.

[0053] According to any of the aforementioned embodiments of the second aspect of the present application, after forming the first light-emitting unit, the method further includes:

[0054] On the side of the isolation material layer facing away from the substrate, a second light-emitting material layer, a second electrode material layer and a second packaging material layer are sequentially prepared;

[0055] A second barrier layer is prepared on a side of the second packaging material layer facing away from the substrate, wherein an orthographic projection of the second isolation opening on the substrate is located within an orthographic projection of the second barrier layer on the substrate;

[0056] Performing patterning on the second packaging material layer to form a second packaging portion located at the second isolation opening;

[0057] The second barrier layer is removed by dry etching process.

[0058] According to any of the aforementioned implementations of the second aspect of the present application, before or after the step of removing the second barrier layer by a dry etching process, the step further includes:

[0059] The second light-emitting material layer and the second electrode material layer are patterned to form a second light-emitting unit and a second sub-electrode located at the second isolation opening.

[0060] According to any of the aforementioned embodiments of the second aspect of the present application, the second electrode material layer is etched using an acidic etching solution.

[0061] According to any of the aforementioned embodiments of the second aspect of the present application, the second light-emitting material layer is etched using an alkaline etching solution.

[0062] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the second blocking layer includes photoresist.

[0063] According to any of the foregoing embodiments of the second aspect of the present application, the second encapsulation portion includes a second extension portion, the orthographic projection of the second extension portion on the substrate is located within the orthographic projection of the isolation material layer on the substrate, the second extension portion is spaced from the isolation material layer to form a second gap, and the second light-emitting material layer and the second electrode material layer are patterned to form a second light-emitting unit and a second sub-electrode located in the second isolation opening, the method further includes:

[0064] The second light emitting material layer and the second electrode material layer are patterned to form a second redundant unit and a second redundant electrode located in the second gap.

[0065] According to any of the aforementioned embodiments of the second aspect of the present application, the width of the second extension portion is greater than or equal to 3 μm.

[0066] According to any of the aforementioned embodiments of the second aspect of the present application, in the step of preparing an isolation material layer on a substrate and patterning the isolation material layer, the method further comprises:

[0067] During the patterning process of the isolation material layer, a third isolation opening spaced apart from the first isolation opening and the second isolation opening is formed.

[0068] According to any of the aforementioned embodiments of the second aspect of the present application, after the step of patterning the second light-emitting material layer and the second electrode material layer to form a second light-emitting unit and a second sub-electrode located in the second isolation opening, the method further includes:

[0069] The third isolation opening is flushed.

[0070] According to any of the aforementioned embodiments of the second aspect of the present application, the third isolation opening is rinsed with ultrasonic deionized water.

[0071] According to any of the aforementioned implementations of the second aspect of the present application, in the step of removing the second barrier layer by a dry etching process, the method further includes:

[0072] In the dry etching process, the isolation material layer forms a third burr area and a fourth burr area on the inner wall toward the third isolation opening, the fourth burr area is located on the side of the third burr area away from the substrate, the third burr area includes at least one third protrusion, the fourth burr area includes at least one fourth protrusion, and the average size of the third protrusion is smaller than the average size of the fourth protrusion.

[0073] According to any of the aforementioned implementations of the second aspect of the present application, the method further includes:

[0074] Sequentially preparing a third light-emitting material layer, a third electrode material layer and a third encapsulation material layer on a side of the isolation material layer facing away from the substrate;

[0075] A third barrier layer is prepared on a side of the third packaging material layer facing away from the substrate, wherein an orthographic projection of the third isolation opening on the substrate is located within an orthographic projection of the third barrier layer on the substrate;

[0076] Performing patterning on the third packaging material layer to form a third packaging portion located in the third isolation opening;

[0077] The third barrier layer is removed by a dry etching process.

[0078] According to any of the aforementioned implementations of the second aspect of the present application, before or after the step of removing the third barrier layer by a dry etching process, the step further includes:

[0079] The third light emitting material layer and the third electrode material layer are patterned to form a third light emitting unit and a third sub-electrode located in the third isolation opening.

[0080] According to any of the aforementioned embodiments of the second aspect of the present application, the third electrode material layer is etched using an acidic etching solution.

[0081] According to any of the aforementioned embodiments of the second aspect of the present application, the third light-emitting material layer is etched using an alkaline etching solution.

[0082] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the third blocking layer includes photoresist.

[0083] According to any of the foregoing embodiments of the second aspect of the present application, the third encapsulation portion includes a third extension portion, the orthographic projection of the third extension portion on the substrate is located within the orthographic projection of the isolation material layer on the substrate, the third extension portion is spaced from the isolation material layer to form a third gap, and the third light-emitting material layer and the third electrode material layer are patterned to form a third light-emitting unit and a third sub-electrode located in the third isolation opening, the method further includes:

[0084] The third light emitting material layer and the third electrode material layer are patterned to form a third redundant unit and a third redundant electrode located in the third gap.

[0085] According to any of the aforementioned embodiments of the second aspect of the present application, the width of the third extension portion is greater than or equal to 3 μm

[0086] According to any of the aforementioned embodiments of the second aspect of the present application, the isolation material layer includes a first layer and a second layer, the second layer is located on the side of the first layer facing away from the substrate, and the orthographic projection of the side of the first layer away from the substrate on the substrate is located within the orthographic projection of the second layer on the substrate.

[0087] According to any of the aforementioned embodiments of the second aspect of the present application, the first layer includes a conductive material.

[0088] According to any of the aforementioned embodiments of the second aspect of the present application, the second layer includes a conductive material or an insulating material.

[0089] According to any of the aforementioned embodiments of the second aspect of the present application, the first layer and the second layer both include metal materials, and the materials of the first layer and the second layer are different.

[0090] According to any of the aforementioned embodiments of the second aspect of the present application, the isolation structure further includes a third layer located on the side of the first layer facing the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0091] An embodiment of a third aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments.

[0092] According to the display panel of the embodiment of the present application, the isolation structure encloses to form an isolation opening. When the light-emitting layer and the first electrode layer are subsequently prepared, the light-emitting layer and the first electrode layer are disconnected at the edge of the isolation opening to form a light-emitting unit and a first electrode located in the isolation opening. The preparation method does not need to use a precision mask plate, which can reduce the development and use of precision masks and reduce preparation costs. The inner wall of the isolation structure facing the isolation opening includes a plurality of burr areas with protrusions, and the average size of the protrusions in one burr area is smaller than the average size of the protrusions in another burr area, that is, the average size of the protrusions in at least one burr area is increased, so that the contact area between the encapsulation part and the inner wall of the isolation structure facing the isolation opening is increased, and the fit is tighter, so as to achieve a stronger tight bonding performance between the encapsulation part and the isolation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0093] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0094] Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0095] Figure 2 is a partial cross-sectional view of a display panel provided by another embodiment;

[0096] Figure 3 is a partial cross-sectional view of a display panel provided by yet another embodiment;

[0097] Figure 4 is a partial cross-sectional view of a display panel provided in yet another embodiment;

[0098] Figure 5 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0099] Figures 6 to 16 This is a diagram of a preparation process of a display panel provided in an embodiment of the present application.

[0100] Description of reference numerals:

[0101] 10. Display panel;

[0102] 100. Substrate;

[0103] 200, isolation structure; 201, isolation material layer; 210, first layer; 220, second layer; 230, third layer; 240, isolation opening; 241, first isolation opening; 242, second isolation opening; 243, third isolation opening; 250, burr area; 251, protrusion; 260, first burr area; 261, first protrusion; 270, second burr area; 271, second protrusion; 280, third burr area; 281, third protrusion; 290, fourth burr area; 291, fourth protrusion;

[0104] 300, light-emitting layer; 310, light-emitting unit; 311, first light-emitting unit; 312, second light-emitting unit; 313, third light-emitting unit; 320, redundant unit; 321, first redundant unit; 322, second redundant unit; 323, third redundant unit;

[0105] 400, first electrode layer; 410, first electrode; 411, first sub-electrode; 412, second sub-electrode; 413, third sub-electrode; 420, redundant electrode; 421, first redundant electrode; 422, second redundant electrode; 423, third redundant electrode;

[0106] 500, pixel definition layer; 510, pixel definition portion; 520, pixel opening; 530, second electrode;

[0107] 600, first encapsulation layer; 601, encapsulation part; 602, extension part; 603, gap; 610, first encapsulation part; 611, first extension part; 612, first gap; 620, second encapsulation part; 621, second extension part; 622, second gap; 630, third encapsulation part; 631, third extension part; 632, third gap; 640, second encapsulation layer; 650, third encapsulation layer;

[0108] 710, first barrier layer; 720, second barrier layer; 730, third barrier layer. DETAILED DESCRIPTION

[0109] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0110] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0111] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0112] Embodiments of the present application provide a display panel, a method for manufacturing the same, and a display device. Embodiments of the display panel, a method for manufacturing the same, and a display device are described below in conjunction with the accompanying drawings.

[0113] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0114] See also Figure 1 , Figure 1 It is a partial cross-sectional view of a display panel provided in an embodiment of the present application.

[0115] like Figure 1As shown, the first aspect of the present application provides a display panel 10, which includes: a substrate 100; an isolation structure 200, which is located on the substrate 100, and the isolation structure 200 encloses a plurality of isolation openings 240; the isolation structure 200 has at least two burr areas 250 on the inner wall facing at least one isolation opening 240, and each burr area 250 is provided with a protrusion 251, and in at least two burr areas 250, the average size of the protrusion 251 in one burr area 250 is smaller than the average size of the protrusion 251 in another burr area 250.

[0116] The average size of the protrusions 251 refers to the average size of the protrusions 251 along a direction perpendicular to the inner wall of the isolation structure 200 toward the isolation opening 240 .

[0117] According to the manufacturing method of the display panel 10 of the embodiment of the present application, the isolation structure 200 encloses the isolation opening 240. When the light-emitting layer 300 and the first electrode layer 400 are subsequently prepared, the light-emitting layer 300 and the first electrode layer 400 are disconnected at the edge of the isolation opening 240 to form the light-emitting unit 310 and the first electrode 410 located in the isolation opening 240. The manufacturing method can be used without the use of a precision mask plate, which can reduce the development and use of precision masks and reduce the manufacturing cost. The inner wall of the isolation structure 200 facing the isolation opening 240 includes a plurality of burr regions 250 with protrusions 251. The average size of the protrusions 251 in one burr region 250 is smaller than the average size of the protrusions 251 in another burr region 250, that is, the average size of the protrusions 251 in at least one burr region 250 is increased, so that the contact area between the encapsulation part 601 and the inner wall of the isolation structure 200 facing the isolation opening 240 is increased, and the fit is tighter, so as to achieve a stronger tight bonding performance between the encapsulation part 601 and the isolation structure 200.

[0118] There are many ways to set the substrate 100. For example, the substrate 100 may include a substrate and an array substrate arranged on the substrate. Alternatively, the substrate 100 is the substrate. Alternatively, the substrate 100 includes a buffer layer and a support plate on a side away from the substrate.

[0119] In some optional embodiments, at least two burr regions 250 are distributed along the thickness direction of the display panel 10 , and the average size of the protrusions 251 of the burr region 250 away from the substrate 100 is greater than the average size of the protrusions 251 of the burr region 250 close to the substrate 100 .

[0120] In these optional embodiments, the average size of the protrusions 251 in the burr area 250 on the side away from the substrate 100 is larger, so that the contact area between the packaging part 601 in this area and the inner wall of the isolation structure 200 is increased, the fit is tighter, and the tight bonding performance between the packaging part 601 and the isolation structure 200 is stronger.

[0121] like Figure 1 As shown, in some optional embodiments, the isolation opening 240 includes a first isolation opening 241 and a second isolation opening 242 that are spaced apart, and the average size of the protrusions 251 of the inner wall of the isolation structure 200 facing the second isolation opening 242 is greater than the average size of the protrusions 251 of the inner wall of the isolation structure 200 facing the first isolation opening 241. Optionally, the inner wall of the isolation structure 200 facing the second isolation opening 242 has a first burr region 260 and a second burr region 270, the second burr region 270 is located on the side of the first burr region 260 away from the substrate 100, the first burr region 260 includes at least one first protrusion 261, the second burr region 270 includes at least one second protrusion 271, and the average size of the first protrusion 261 is smaller than the average size of the second protrusion 271.

[0122] In these optional embodiments, since oxygen-containing plasma gas is used to peel the first barrier layer 710, the oxygen-containing plasma gas will oxidize the inner wall of the isolation structure 200 exposed toward the second isolation opening 242, so that the average size of the second protrusions 271 of the second burr area 270 is larger. The average size of the first protrusions 261 is smaller than the average size of the second protrusions 271, and the average size of the second protrusions 271 increases. When the packaging part 601 is subsequently used for packaging, the contact area between the packaging part 601 and the inner wall of the isolation structure 200 facing the second isolation opening 242 increases, and the fit is tighter, so that a stronger tight bonding performance between the packaging part 601 and the isolation structure 200 is achieved.

[0123] Optionally, the inner wall of the isolation structure 200 facing the first isolation opening 241 has multiple protrusions 251 of the same average size, and the bonding force between the packaging part 601 and the inner wall of the isolation structure 200 facing the first isolation opening 241 is evenly distributed, thereby improving the tight bonding performance between the packaging part 601 and the isolation structure 200.

[0124] In some optional embodiments, the average size of the second protrusions 271 is greater than the average size of the protrusions 251 on the inner wall of the isolation structure 200 facing the first isolation opening 241 .

[0125] In these optional embodiments, the average size of the second protrusion 271 is larger than the average size of the protrusion 251 on the inner wall of the isolation structure 200 toward the first isolation opening 241. The average size of the second protrusion 271 increases. When the packaging part 601 is subsequently used for packaging, the contact area between the packaging part 601 and the inner wall of the isolation structure 200 toward the second isolation opening 242 increases, and the fit is tighter, thereby achieving stronger tight bonding performance between the packaging part 601 and the isolation structure 200.

[0126] In some optional embodiments, the isolation opening 240 includes a third isolation opening 243 spaced apart from the first isolation opening 241 and the second isolation opening 242, and the inner wall of the isolation structure 200 facing the third isolation opening 243 has a third burr area 280 and a fourth burr area 290, the third burr area 280 is located on the side of the fourth burr area 290 away from the substrate 100, the third burr area 280 includes at least one third protrusion 281, the fourth burr area 290 includes at least one fourth protrusion 291, and the average size of the third protrusion 281 is smaller than the average size of the fourth protrusion 291.

[0127] In these optional embodiments, since oxygen-containing plasma gas is used to peel off the second barrier layer 720, the oxygen-containing plasma gas will oxidize the inner wall of the isolation structure 200 exposed toward the third isolation opening 243, so that the average size of the fourth protrusion 291 in the fourth burr area 290 is larger. The average size of the third protrusion 281 is smaller than the average size of the fourth protrusion 291, and the average size of the fourth protrusion 291 increases. When the packaging part 601 is subsequently used for packaging, the contact area between the packaging part 601 and the inner wall of the isolation structure 200 facing the third isolation opening 243 increases, and the fit is tighter, so that a stronger tight bonding performance between the packaging part 601 and the isolation structure 200 is achieved.

[0128] In some optional embodiments, an average size of the fourth protrusions 291 is greater than an average size of the second protrusions 271 .

[0129] In these optional embodiments, the average size of the fourth protrusion 291 is greater than the average size of the second protrusion 271, and the average size of the fourth protrusion 291 increases. When the packaging part 601 is subsequently used for packaging, the contact area between the packaging part 601 and the inner wall of the isolation structure 200 toward the third isolation opening 243 increases, and the fit is closer, thereby achieving a stronger tight bonding performance between the packaging part 601 and the isolation structure 200.

[0130] Optionally, the display panel 10 also includes: a light-emitting layer 300, located on the substrate 100, the light-emitting layer 300 includes a plurality of light-emitting units 310, the light-emitting units 310 are located in the isolation opening 240, and the light-emitting units 310 are used to realize the light-emitting display of the display panel 10; a first electrode layer 400, located on the side of the light-emitting layer 300 away from the substrate 100, and includes a first electrode 410 located in the isolation opening 240, the first electrode 410 is electrically connected to the isolation structure 200, and the first electrodes 410 are electrically connected to each other through the isolation structure 200 to form a whole-surface electrode.

[0131] Optionally, the orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the second electrode 530 on the substrate 100, that is, the second electrode 530 is arranged to cover the light-emitting unit 310 to serve as an electrode of the light-emitting unit 310, thereby ensuring normal light emission of the light-emitting unit 310 and improving the display effect of the display panel 10.

[0132] Optionally, the light-emitting unit 310 and the isolation structure 200 are spaced apart, which means that the light-emitting unit 310 and the isolation structure 200 are spaced apart and have a certain distance therebetween, and the first electrode 410 is filled between the light-emitting unit 310 and the isolation structure 200 to avoid direct contact between the light-emitting unit 310 and the isolation structure 200, and the light-emitting units 310 are spaced apart from each other to reduce crosstalk of carriers between the light-emitting units 310 and improve the color crosstalk problem of the light-emitting unit 310.

[0133] In some optional embodiments, the display panel 10 also includes: a pixel definition layer 500, located on the substrate 100, the pixel definition layer 500 includes a pixel defining portion 510 and a pixel opening 520 enclosed by the pixel defining portion 510, for defining a light-emitting area of ​​the display panel 10, the pixel opening 520 is connected to the isolation opening 240, thereby reducing the obstruction of the pixel opening 520 by the isolation structure 200, thereby ensuring the light-emitting effect of the display panel 10.

[0134] Optionally, the isolation structure 200 is located on the side of the pixel defining portion 510 away from the substrate 100, so that there is a large step difference between the isolation structure 200 and the pixel opening 520. When preparing the light-emitting unit 310 and the first electrode 410, the light-emitting unit 310 and the first electrode 410 are more easily disconnected at the edge of the isolation structure 200, thereby facilitating the preparation of the light-emitting unit 310 and the first electrode 410.

[0135] In some optional embodiments, the display panel 10 further includes a second electrode 530, the second electrode 530 is located between the substrate 100 and the pixel definition layer 500, the second electrode 530 is exposed by the pixel opening 520, and the second electrode 530 is exposed by the isolation opening 240, so as to serve as a light-emitting electrode of the light-emitting unit 310. One of the first electrode 410 and the second electrode 530 serves as an anode of the light-emitting unit 310, and the other serves as a cathode of the light-emitting unit 310. The embodiment of the present application is described by taking the second electrode 530 as the anode of the light-emitting unit 310 and the first electrode 410 as the cathode of the light-emitting unit 310 as an example.

[0136] Optionally, the display panel 10 also includes: a first encapsulation layer 600, located on the side of the second electrode 530 away from the substrate 100, the first encapsulation layer 600 includes a plurality of spaced-apart encapsulation parts 601, at least part of the encapsulation part 601 is located in the isolation opening 240, to achieve encapsulation of the first electrode 410 and the light-emitting unit 310.

[0137] See also Figure 2 , Figure 2 is a partial cross-sectional view of a display panel provided by another embodiment.

[0138] like Figure 2 As shown, in some optional embodiments, the packaging portion 601 includes an extension portion 602 , the orthographic projection of the extension portion 602 on the substrate 100 is located within the orthographic projection of the isolation structure 200 on the substrate 100 , and the extension portion 602 and the isolation structure 200 are spaced to form a gap 603 .

[0139] Optionally, the light emitting layer 300 further includes a redundant unit 320 located in the gap 603 .

[0140] Optionally, the first electrode layer 400 further includes a redundant electrode 420 located in the gap 603 .

[0141] In these optional embodiments, when the light-emitting layer 300 and the first electrode layer 400 are patterned, the portions of the light-emitting layer 300 and the first electrode layer 400 located in the gap 603 are retained to form redundant units 320 and redundant electrodes 420 located in the gap 603. The redundant units 320 and the redundant electrodes 420 are filled in the gap 603 to support the extension portion 602 and improve the structural stability of the extension portion 602. The inner wall of the extension portion 602 facing the gap 603 can also be covered and protected to prevent damage to the extension portion 602 by subsequent wet processes.

[0142] In some optional embodiments, the width of the extension portion 602 is greater than or equal to 3 μm. The width of the extension portion 602 refers to the distance between the edge of the isolation material layer 201 close to the isolation opening 240 and the edge of the extension portion 602. For example, the width of the extension portion 602 is 3 μm, 4 μm, 5 μm or 6 μm.

[0143] In these optional embodiments, the width of the extension 602 is greater than or equal to 3 μm, which can improve the problem that the water and oxygen intrusion path is too short due to the small width of the extension 602, and the light-emitting unit 310 and the first electrode 410 are easily corroded by water and oxygen. It can also improve the problem that the redundant unit 320 and the redundant electrode 420 located in the gap 603 are too small due to the small width of the extension 602, and are easily etched away in the subsequent process, so that the extension 602 is exposed toward the inner wall of the gap 603, which is easily damaged by etching, and the packaging performance is reduced.

[0144] In some optional embodiments, the material of the first encapsulation layer 600 includes an inorganic material.

[0145] In these optional embodiments, the first encapsulation layer 600 includes an inorganic material, which has good density and good barrier properties against water vapor and oxygen.

[0146] See also Figure 3 , Figure 3 is a partial cross-sectional view of a display panel provided by yet another embodiment.

[0147] like Figure 3 As shown, the display panel 10 optionally further includes: a second encapsulation layer 640 located on the side of the first encapsulation layer 600 away from the substrate 100; and a third encapsulation layer 650 located on the side of the second encapsulation layer 640 away from the substrate 100. The display panel 10 adopts three-layer encapsulation, has good encapsulation performance, and reduces the possibility of water and oxygen intrusion.

[0148] Optionally, the material of the second encapsulation layer 640 includes an organic material.

[0149] Optionally, the material of the third encapsulation layer 650 includes inorganic material. The first encapsulation layer 600, the second encapsulation layer 640 and the third encapsulation layer 650 are respectively encapsulated with inorganic material, organic material and inorganic material to form a TFE (Thin Film Encapsulation, TFE) thin film encapsulation structure to further improve the encapsulation performance.

[0150] In some optional embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 located on the side of the first layer 210 facing away from the substrate 100 , and the orthographic projection of the side of the first layer 210 away from the substrate 100 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100 .

[0151] In these optional embodiments, the first layer 210 and the second layer 220 are stacked to form the isolation structure 200, the orthographic projection of the side of the first layer 210 disposed close to the substrate 100 away from the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100, the orthographic projection area of ​​the second layer 220 is larger than the orthographic projection area of ​​the side of the first layer 210 away from the substrate 100, and the second layer 220 covers the surface of the first layer 210 close to the second layer 220, and at this time, the first layer 210 is recessed relative to the second layer 220 in a direction away from the isolation opening 240. When preparing the light-emitting layer 300, the light-emitting layer 300 has a large drop at the edge of the isolation structure 200, and the first layer 210 is recessed relative to the second layer 220, and the light-emitting layer 300 is difficult to connect at the edge of the isolation structure 200, so it breaks, and the light-emitting layer 300 breaks to form mutually disconnected light-emitting units 310. All embodiments of the present application do not require the isolation structure 200 to be an inverted trapezoidal structure or a two-layer structure, and any structure that can achieve the isolation effect of the light-emitting layer 300 is sufficient.

[0152] In some optional embodiments, the burr region 250 is located on the inner wall of the first layer 210 facing the isolation opening 240 .

[0153] Optionally, the first layer 210 includes a conductive material, for example, the first layer 210 includes a non-metallic conductive material or a metallic conductive material, so as to achieve electrical connection between the isolation structure 200 and the second electrode 530 .

[0154] In some optional embodiments, the second layer 220 includes a conductive material or an insulating material, wherein the insulating material may be at least one of silicon nitride or silicon oxide.

[0155] In these optional embodiments, the second layer 220 includes a conductive material, for example, the second layer 220 includes a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, the second layer 220 is difficult to be etched during wet etching of the first layer 210 using an etching solution, so that the first layer 210 is more easily concavely arranged relative to the second layer 220.

[0156] In some optional embodiments, the first layer 210 and the second layer 220 include metal materials, and the materials of the first layer 210 and the second layer 220 are different.

[0157] In these optional embodiments, when both the first layer 210 and the second layer 220 are made of metal materials, the first layer 210 may be wet-etched with an etching solution, and the etching rate of the second layer 220 may be set to be lower than the etching rate of the first layer 210 by setting the etching solution. Since the etching rate of the first layer 210 is relatively high, when the etching solution is used for wet etching, even if the second layer 220 is etched to a certain extent, the first layer 210 is etched faster, so that the first layer 210 is set concave relative to the second layer 220.

[0158] See also Figure 4 , Figure 4 is a partial cross-sectional view of a display panel provided in yet another embodiment.

[0159] like Figure 4 As shown, in some optional embodiments, the isolation structure 200 further includes a third layer 230 located on the side of the first layer 210 facing the substrate 100 , and the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the third layer 230 on the substrate 100 .

[0160] In these optional embodiments, after the third layer 230 is provided, the first layer 210 can be well attached to the third layer 230, and the generated etching waste falls on the third layer 230, which is easy to clean.

[0161] Optionally, the material of the second layer 220 is titanium (Ti) or molybdenum (Mo), the material of the first layer 210 is aluminum (Al), silver (Ag) or copper (Cu), and the material of the third layer 230 is titanium (Ti) or molybdenum (Mo). For example, the isolation structure 200 is a three-layer metal composite material of Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum).

[0162] Patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998 900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A record the relevant contents of the isolation structure 200 (or partition structure or isolation column) for reference.

[0163] Optionally, the light emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light emitting material layer, a hole injection layer (HIL) and a hole transport layer (HTL).

[0164] Please also read Figure 5 and Fig.16 , Figure 5 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application; Figures 6 to 16 is a diagram of a manufacturing process of a display panel provided in an embodiment of the present application;

[0165] like Figures 5 to 16 As shown, a second aspect of the present application provides a method for preparing a display panel, the method comprising:

[0166] Step S01: preparing an isolation material layer on a substrate, and patterning the isolation material layer to form a first isolation opening;

[0167] Step S02: sequentially preparing a first light-emitting material layer, a first electrode material layer and a first packaging material layer on a side of the isolation material layer facing away from the substrate;

[0168] Step S03: preparing a first barrier layer on a side of the first packaging material layer facing away from the substrate, wherein the orthographic projection of the first isolation opening on the substrate is located within the orthographic projection of the first barrier layer on the substrate;

[0169] Step S04: performing patterning on the first packaging material layer to form a first packaging portion located in the first isolation opening;

[0170] Step S05: removing the first barrier layer by dry etching process.

[0171] According to the method for preparing the display panel 10 of the embodiment of the present application, the isolation material layer 201 is patterned to form a first isolation opening 241. When the first light-emitting material layer and the first sub-electrode 411 material layer are subsequently prepared, the first light-emitting material layer and the first sub-electrode 411 material layer are disconnected at the edge of the first isolation opening 241 to form a first light-emitting unit 311 and a first sub-electrode 411 located in the first isolation opening 241. The preparation method does not need to use a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost. A first barrier layer 710 is provided on the first encapsulation layer 600. The first barrier layer 710 serves as a mask plate for the first encapsulation material layer to etch and block the first encapsulation material layer at the first isolation opening 241, so that the first encapsulation material layer in other areas can be etched and removed, and the first encapsulation material layer covered by the first barrier layer 710 is retained to form a first encapsulation part 610 located in the first isolation opening 241. The first barrier layer 710 is stripped off by dry etching, which can avoid the problem that when wet etching is used, wet etching has a strong adverse effect on the portion of the first packaging part 610 located on the side of the isolation material layer 201 away from the base, which can easily cause the portion of the first packaging part 610 located on the side of the isolation material layer 201 away from the base to warp or the film layer to fall off, thereby reducing the packaging performance of the first packaging part 610, thereby improving the performance of the display panel 10.

[0172] Optionally, oxygen-containing plasma gas is used to strip the first barrier layer 710 to remove the first barrier layer 710 .

[0173] like Fig.10 As shown, in some optional embodiments, before or after the step of removing the first barrier layer 710 by a dry etching process, the method further includes:

[0174] The first light emitting material layer and the first electrode material layer are patterned to form a first light emitting unit 311 and a first sub-electrode 411 located in the first isolation opening 241 .

[0175] In these optional embodiments, after forming the first packaging part 610, the first light-emitting material layer and the first electrode material layer are patterned, for example, the first electrode material layer is etched with an acidic etching solution, and the first light-emitting material layer is etched with an alkaline etching solution. The step of patterning the first light-emitting material layer and the first electrode material layer can be located before or after the step of removing the first barrier layer 710 by a dry etching process. When the step of patterning the first light-emitting material layer and the first electrode material layer is located after the step of removing the first barrier layer 710 by a dry etching process, when the first light-emitting material layer and the first electrode material layer are wet-etched, the first barrier layer 710 can also protect the first packaging part 610 to reduce the influence of the acidic etching solution and the alkaline etching solution on the first packaging part 610, thereby ensuring the packaging performance of the first packaging part 610.

[0176] like Figure 8 As shown, optionally, the orthographic projection of the first packaging part 610 on the substrate 100 is located within the orthographic projection of the first barrier layer 710 on the substrate 100. After the first packaging part 610 is formed, the first packaging part 610 is covered by the first barrier layer 710. When the step of patterning the first light-emitting material layer and the first electrode material layer is located after the step of removing the first barrier layer 710 by a dry etching process, when the first light-emitting material layer and the first electrode material layer are wet-etched, the first barrier layer 710 can also protect the first packaging part 610 to reduce the influence of the acidic etching solution and the alkaline etching solution on the first packaging part 610, thereby ensuring the packaging performance of the first packaging part 610.

[0177] Optionally, the material of the first barrier layer 710 includes photoresist, which is easy to prepare and has a good etching barrier effect.

[0178] like Fig.11 As shown, in some optional embodiments, the first encapsulation portion 610 includes a first extension portion 611 located on a side of the isolation material layer 201 away from the substrate 100, and the first extension portion 611 is spaced from the isolation material layer 201 to form a first gap 612. In the step of patterning the first light-emitting material layer and the first electrode material layer to form the first light-emitting unit 311 and the first sub-electrode 411 located in the first isolation opening 241, the method further includes:

[0179] The first light emitting material layer and the first electrode material layer are patterned to form a first redundant unit 321 and a first redundant electrode 421 located in the first gap 612 .

[0180] In these optional embodiments, the first packaging portion 610 extends to the side of the isolation material layer 201 away from the substrate 100 to form a first extension portion 611, and a first gap 612 is formed between the first extension portion 611 and the isolation material layer 201. When the first light-emitting material layer and the first electrode material layer are patterned, the portions of the first light-emitting material layer and the first electrode material layer located in the first gap 612 are retained to form a first redundant unit 321 and a first redundant electrode 421 located in the first gap 612. The first redundant unit 321 and the first redundant electrode 421 are filled in the first gap 612 to support the first extension portion 611 and improve the structural stability of the first extension portion 611. The inner wall of the first extension portion 611 facing the first gap 612 can also be covered and protected to prevent damage to the first extension portion 611 by subsequent wet processes.

[0181] like Figure 3 and 10 As shown, optionally, after the step of patterning the first light emitting material layer and the first electrode material layer to form the first redundant unit 321 and the first redundant electrode 421 located in the first gap 612, the method further includes:

[0182] The first redundant unit 321 and the first redundant electrode 421 located in the first gap 612 are removed.

[0183] In these optional embodiments, in order to increase the contact area between the subsequent second encapsulation layer 640 and the isolation structure 200 and improve the adhesion between the second encapsulation layer 640 and the isolation structure 200, the first redundant unit 321 and the first redundant electrode 421 in the first gap 612 may be removed so that the second encapsulation layer 640 can be filled in the first gap 612. When the first redundant unit 321 and the first redundant electrode 421 are retained, the above steps can be omitted to simplify the preparation process.

[0184] In some optional embodiments, the width of the first extension portion 611 is greater than or equal to 3 μm. The width of the first extension portion 611 refers to the distance between the edge of the isolation material layer 201 close to the first isolation opening 241 and the edge of the first extension portion 611. For example, the width of the first extension portion 611 is 3 μm, 4 μm, 5 μm or 6 μm.

[0185] In these optional embodiments, the width of the first extension portion 611 is greater than or equal to 3 μm, which can improve the problem that the water and oxygen intrusion path is too short due to the small width of the first extension portion 611, and the first light-emitting unit 311 and the first sub-electrode 411 are easily corroded by water and oxygen. It can also improve the problem that the first redundant unit 321 and the first redundant electrode 421 located in the first gap 612 are too small due to the small width of the first extension portion 611, and are easily etched away in subsequent processes, so that the first extension portion 611 is exposed toward the inner wall of the first gap 612, which is easily damaged by etching and the packaging performance is reduced.

[0186] In some optional embodiments, in the step of preparing the isolation material layer 201 on the substrate 100 and patterning the isolation material layer 201, the method further includes:

[0187] During the patterning process of the isolation material layer 201 , a second isolation opening 242 spaced apart from the first isolation opening 241 is formed.

[0188] In these optional embodiments, the first isolation opening 241 and the second isolation opening 242 are formed simultaneously, and when preparing the first light-emitting material layer and the first electrode material layer, the first light-emitting material layer and the first electrode material layer are deposited to the second isolation opening 242, and when the first light-emitting material layer and the first electrode material layer are patterned, the portion located in the second isolation opening 242 is removed, thereby retaining the first light-emitting unit 311 and the first sub-electrode 411 in the first isolation opening 241. Optionally, the first isolation opening 241 and the second isolation opening 242 are prepared in steps, for example, after the first light-emitting unit 311, the first sub-electrode 411 and the first encapsulation portion 610 are prepared, the isolation material layer 201 is etched to form the second isolation opening 242.

[0189] In some optional embodiments, after the step of patterning the first light emitting material layer and the first electrode material layer to form the first light emitting unit 311 and the first sub-electrode 411 located in the first isolation opening 241, the method further includes:

[0190] The second isolation opening 242 is flushed.

[0191] In these optional embodiments, during the patterning process of the first light-emitting material layer and the first electrode material layer, the first electrode material layer is first etched with an acidic etchant, and then the first light-emitting material layer is etched with an alkaline etchant, and there will be alkaline etchant residue in the second isolation opening 242. The alkaline etchant residue in the second isolation opening 242 can be rinsed and removed by flushing the second isolation opening 242, thereby preventing the residual alkaline etchant from damaging the side wall of the isolation material layer 201 facing the second isolation opening 242, resulting in gaps or holes in the side wall of the isolation material layer 201. It can also prevent the residual alkaline etchant from corroding the second light-emitting unit 312 in the second isolation opening 242 that is subsequently prepared.

[0192] Optionally, the second isolation opening 242 is rinsed with ultrasonic deionized water.

[0193] like Fig. 9 As shown, in some optional embodiments, in the step of removing the first barrier layer 710 by a dry etching process, the method further includes:

[0194] In the dry etching process, the isolation material layer 201 forms a first burr area 260 and a second burr area 270 on the inner wall toward the second isolation opening 242, and the second burr area 270 is located on the side of the first burr area 260 away from the substrate 100. The first burr area 260 includes at least one first protrusion 261, and the second burr area 270 includes at least one second protrusion 271. The average size of the first protrusion 261 is smaller than the average size of the second protrusion 271.

[0195] The average size of the first protrusion 261 refers to the average size of the first protrusion 261 along the direction perpendicular to the isolation material layer 201 toward the inner wall of the second isolation opening 242. The average size of the second protrusion 271 refers to the average size of the second protrusion 271 along the direction perpendicular to the isolation material layer 201 toward the inner wall of the second isolation opening 242.

[0196] In these optional embodiments, since the first barrier layer 710 is stripped by using oxygen-containing plasma gas, the oxygen-containing plasma gas will oxidize the inner wall of the isolation material layer 201 exposed toward the second isolation opening 242, so that the average size of the second protrusion 271 in the second burr area 270 is larger. The other inner wall of the isolation material layer 201 facing the second isolation opening 242 is covered by the first light-emitting material layer and the first electrode material layer, and the inner wall covered by the first light-emitting material layer and the first electrode material layer will not be oxidized by the oxygen-containing plasma gas, so that the average size of the first protrusion 261 is smaller than the average size of the second protrusion 271, and the average size of the second protrusion 271 is increased. When the second packaging part 620 is subsequently used for packaging, the contact area between the second packaging part 620 and the inner wall of the isolation material layer 201 facing the second isolation opening 242 is increased, and the fit is tighter, so that a stronger tight bonding performance between the second packaging part 620 and the isolation material layer 201 is achieved.

[0197] like Figure 12 to Figure 14 As shown, in some optional embodiments, after forming the first light emitting unit 311, the method further includes:

[0198] On the side of the isolation material layer 201 facing away from the substrate 100, a second light emitting material layer, a second electrode 530 material layer and a second encapsulation material layer are sequentially prepared;

[0199] A second barrier layer 720 is prepared on a side of the second packaging material layer facing away from the substrate 100 , and an orthographic projection of the second isolation opening 242 on the substrate 100 is located within the orthographic projection of the second barrier layer 720 on the substrate 100 ;

[0200] Performing patterning on the second packaging material layer to form a second packaging portion 620 located at the second isolation opening 242 ;

[0201] The second barrier layer 720 is removed by dry etching process.

[0202] In these optional embodiments, a second barrier layer 720 is disposed on the second encapsulation layer 640, and the second barrier layer 720 serves as a mask for the second encapsulation material layer to block the etching of the second encapsulation material layer at the second isolation opening 242, so that the second encapsulation material layer in other areas can be etched away, and the second encapsulation material layer covered by the second barrier layer 720 is retained to form a second encapsulation portion 620 located in the second isolation opening 242. The use of dry etching to peel off the second barrier layer 720 can avoid the problem that when wet etching is used, wet etching has a strong adverse effect on the portion of the second encapsulation portion 620 located on the side of the isolation material layer 201 away from the base, which easily causes the portion of the second encapsulation portion 620 located on the side of the isolation material layer 201 away from the base to be lifted or the film layer to fall off, and the encapsulation performance of the second encapsulation portion 620 is reduced, thereby improving the performance of the display panel 10.

[0203] Optionally, oxygen-containing plasma gas is used to strip the second barrier layer 720 to remove the second barrier layer 720 .

[0204] like Fig.13 and Fig.14 As shown, in some optional embodiments, before or after the step of removing the second barrier layer 720 by dry etching process, the step further includes:

[0205] The second light emitting material layer and the second electrode 530 material layer are patterned to form a second light emitting unit 312 and a second sub-electrode 412 located in the second isolation opening 242 .

[0206] In these optional embodiments, after forming the second encapsulation part 620, the second light-emitting material layer and the second electrode 530 material layer are patterned, for example, the second electrode 530 material layer is etched with an acidic etching solution, and the second light-emitting material layer is etched with an alkaline etching solution. The step of patterning the second light-emitting material layer and the second electrode 530 material layer can be located before or after the step of removing the second barrier layer 720 by a dry etching process. When the step of patterning the second light-emitting material layer and the second electrode 530 material layer is located after the step of removing the second barrier layer 720 by a dry etching process, when the second light-emitting material layer and the second electrode 530 material layer are wet-etched, the second barrier layer 720 can also protect the second encapsulation part 620, so as to reduce the influence of the acidic etching solution and the alkaline etching solution on the second encapsulation part 620, and ensure the encapsulation performance of the second encapsulation part 620.

[0207] Optionally, the orthographic projection of the second packaging part 620 on the substrate 100 is located within the orthographic projection of the second blocking layer 720 on the substrate 100. After the second packaging part 620 is formed, the second packaging part 620 is covered by the second blocking layer 720. When the step of patterning the second light-emitting material layer and the second electrode 530 material layer is located after the step of removing the second blocking layer 720 by a dry etching process, when the second light-emitting material layer and the second electrode 530 material layer are wet-etched, the second blocking layer 720 can also protect the second packaging part 620 to reduce the influence of the acidic etching solution and the alkaline etching solution on the second packaging part 620, thereby ensuring the packaging performance of the second packaging part 620.

[0208] Optionally, the material of the second blocking layer 720 includes photoresist, which is easy to prepare and has a good etching blocking effect.

[0209] like Fig.14 As shown, in some optional embodiments, the second encapsulation portion 620 includes a second extension portion 621, the orthographic projection of the second extension portion 621 on the substrate 100 is located within the orthographic projection of the isolation material layer 201 on the substrate 100, and the second extension portion 621 is spaced from the isolation material layer 201 to form a second gap 622, and the second light-emitting material layer and the second electrode 530 material layer are patterned to form the second light-emitting unit 312 and the second sub-electrode 412 located in the second isolation opening 242, and the method further includes:

[0210] The second light emitting material layer and the second electrode 530 material layer are patterned to form a second redundant unit 322 and a second redundant electrode 422 located in the second gap 622 .

[0211] In these optional embodiments, the second packaging portion 620 extends to the side of the isolation material layer 201 away from the substrate 100 to form a second extension portion 621, and a second gap 622 is formed between the second extension portion 621 and the isolation material layer 201. When the second light-emitting material layer and the second electrode 530 material layer are patterned, the portions of the second light-emitting material layer and the second electrode 530 material layer located in the second gap 622 are retained to form a second redundant unit 322 and a second redundant electrode 422 located in the second gap 622. The second redundant unit 322 and the second redundant electrode 422 are filled in the second gap 622 to support the second extension portion 621 and improve the structural stability of the second extension portion 621. The inner wall of the second extension portion 621 facing the second gap 622 can also be covered and protected to prevent damage to the second extension portion 621 by subsequent wet processes.

[0212] In some optional embodiments, the width of the second extension portion 621 is greater than or equal to 3 μm. The width of the second extension portion 621 refers to the distance between the edge of the isolation material layer 201 close to the second isolation opening 242 and the edge of the second extension portion 621. For example, the width of the second extension portion 621 is 3 μm, 4 μm, 5 μm or 6 μm.

[0213] In these optional embodiments, the width of the second extension portion 621 is greater than or equal to 3 μm, which can improve the problem that the water and oxygen intrusion path is too short due to the width of the second extension portion 621 being too small, and the second light-emitting unit 312 and the second sub-electrode 412 are easily corroded by water and oxygen. It can also improve the problem that the second redundant unit 322 and the second redundant electrode 422 located in the second gap 622 are too small due to the width of the second extension portion 621 being too small, and are easily etched away in subsequent processes, so that the second extension portion 621 is exposed toward the inner wall of the second gap 622, which is easily damaged by etching, and the packaging performance is reduced.

[0214] In some optional embodiments, in the step of preparing the isolation material layer 201 on the substrate 100 and patterning the isolation material layer 201, the method further includes:

[0215] During the patterning process of the isolation material layer 201 , first isolation openings 241 , second isolation openings 242 , and third isolation openings 243 spaced apart from each other are formed.

[0216] In these optional embodiments, the first isolation opening 241, the second isolation opening 242 and the third isolation opening 243 are formed simultaneously, and when preparing the second light-emitting material layer and the second electrode 530 material layer, the second light-emitting material layer and the second electrode 530 material layer are deposited to the third isolation opening 243, and when the second light-emitting material layer and the second electrode 530 material layer are patterned, the portion located in the third isolation opening 243 is removed, thereby retaining the second light-emitting unit 312 and the second sub-electrode 412 in the second isolation opening 242.

[0217] In some optional embodiments, after the step of patterning the second light emitting material layer and the second electrode 530 material layer to form the second light emitting unit 312 and the second sub-electrode 412 located in the second isolation opening 242, the method further includes:

[0218] The third isolation opening 243 is flushed.

[0219] In these optional embodiments, during the patterning process of the second light-emitting material layer and the second electrode 530 material layer, the second electrode 530 material layer is first etched with an acidic etchant, and then the second light-emitting material layer is etched with an alkaline etchant, and there will be alkaline etchant residue in the third isolation opening 243. The third isolation opening 243 is rinsed to remove the alkaline etchant residue in the third isolation opening 243, thereby preventing the residual alkaline etchant from damaging the side wall of the isolation material layer 201 facing the third isolation opening 243, resulting in gaps or holes in the side wall of the isolation material layer 201. It can also prevent the residual alkaline etchant from corroding the third light-emitting unit 313 in the third isolation opening 243 that is subsequently prepared.

[0220] Optionally, the third isolation opening 243 is rinsed with ultrasonic deionized water.

[0221] like Fig.14 As shown, in some optional embodiments, in the step of removing the second barrier layer 720 by a dry etching process, the method further includes:

[0222] In the dry etching process, the isolation material layer 201 forms a third burr region 280 and a fourth burr region 290 on the inner wall of the third isolation opening 243, and the fourth burr region 290 is located on the side of the third burr region 280 away from the substrate 100. The third burr region 280 includes at least one third protrusion 281, and the fourth burr region 290 includes at least one fourth protrusion 291. The average size of the third protrusion 281 is smaller than the average size of the fourth protrusion 291.

[0223] The average size of the third protrusion 281 refers to the average size of the third protrusion 281 along the direction perpendicular to the isolation material layer 201 toward the inner wall of the third isolation opening 243. The average size of the fourth protrusion 291 refers to the average size of the fourth protrusion 291 along the direction perpendicular to the isolation material layer 201 toward the inner wall of the third isolation opening 243.

[0224] In these optional embodiments, since the second barrier layer 720 is stripped by using oxygen-containing plasma gas, the oxygen-containing plasma gas will oxidize the inner wall of the isolation material layer 201 exposed toward the third isolation opening 243, so that the average size of the fourth protrusion 291 in the fourth burr area 290 is larger. The other inner wall of the isolation material layer 201 facing the third isolation opening 243 is covered by the second light-emitting material layer and the second electrode 530 material layer, and the inner wall covered by the second light-emitting material layer and the second electrode 530 material layer will not be oxidized by the oxygen-containing plasma gas, so that the average size of the third protrusion 281 is smaller than the average size of the fourth protrusion 291, and the average size of the fourth protrusion 291 is increased. When the third packaging part 630 is subsequently used for packaging, the contact area between the third packaging part 630 and the inner wall of the isolation material layer 201 facing the third isolation opening 243 is increased, and the fit is tighter, so that a stronger tight bonding performance between the third packaging part 630 and the isolation material layer 201 is achieved.

[0225] like Fig.15 and Fig.16 As shown, in some optional embodiments, the method further includes:

[0226] A third light emitting material layer, a third electrode material layer and a third encapsulation material layer are sequentially prepared on the side of the isolation material layer 201 facing away from the substrate 100;

[0227] A third barrier layer 730 is formed on a side of the third packaging material layer facing away from the substrate 100 , and an orthographic projection of the third isolation opening 243 on the substrate 100 is located within the orthographic projection of the third barrier layer 730 on the substrate 100 ;

[0228] Performing patterning on the third packaging material layer to form a third packaging portion 630 located in the third isolation opening 243 ;

[0229] The third barrier layer 730 is removed by a dry etching process.

[0230] In these optional embodiments, a third barrier layer 730 is disposed on the third encapsulation layer 650, and the third barrier layer 730 serves as a mask for the third encapsulation material layer to perform etching blocking on the third encapsulation material layer at the third isolation opening 243, so that the third encapsulation material layer in other areas can be etched away, and the third encapsulation material layer covered by the third barrier layer 730 is retained, thereby forming a third encapsulation part 630 located in the third isolation opening 243. The third barrier layer 730 is stripped by dry etching, so that when wet etching is used, it is possible to avoid the problem that wet etching has a strong adverse effect on the portion of the third encapsulation part 630 located on the side of the isolation material layer 201 away from the base, which is likely to cause the portion of the third encapsulation part 630 located on the side of the isolation material layer 201 away from the base to be lifted or the film layer to fall off, and the encapsulation performance of the third encapsulation part 630 is reduced, thereby improving the performance of the display panel 10.

[0231] Optionally, the third barrier layer 730 is stripped using oxygen-containing plasma gas to remove the third barrier layer 730 .

[0232] In some optional embodiments, before or after the step of removing the third barrier layer 730 by dry etching, the steps further include:

[0233] The third light emitting material layer and the third electrode material layer are patterned to form a third light emitting unit 313 and a third sub-electrode 413 located in the third isolation opening 243 .

[0234] In these optional embodiments, after forming the third packaging part 630, the third light-emitting material layer and the third electrode material layer are patterned, for example, the third electrode material layer is etched with an acidic etching solution, and the third light-emitting material layer is etched with an alkaline etching solution. The step of patterning the third light-emitting material layer and the third electrode material layer can be located before or after the step of removing the third barrier layer 730 by a dry etching process. When the step of patterning the third light-emitting material layer and the third electrode material layer is located after the step of removing the third barrier layer 730 by a dry etching process, when the third light-emitting material layer and the third electrode material layer are wet-etched, the third barrier layer 730 can also protect the third packaging part 630 to reduce the influence of the acidic etching solution and the alkaline etching solution on the third packaging part 630, thereby ensuring the packaging performance of the third packaging part 630.

[0235] Optionally, the orthographic projection of the third packaging part 630 on the substrate 100 is located within the orthographic projection of the third barrier layer 730 on the substrate 100. After the third packaging part 630 is formed, the third packaging part 630 is covered by the third barrier layer 730. When the step of patterning the third light-emitting material layer and the third electrode material layer is located after the step of removing the third barrier layer 730 by a dry etching process, when the third light-emitting material layer and the third electrode material layer are wet-etched, the third barrier layer 730 can also protect the third packaging part 630 to reduce the influence of the acidic etching solution and the alkaline etching solution on the third packaging part 630, thereby ensuring the packaging performance of the third packaging part 630.

[0236] Optionally, the material of the third blocking layer 730 includes photoresist, which is easy to prepare and has a good etching blocking effect.

[0237] In some optional embodiments, the third encapsulation portion 630 includes a third extension portion 631, the orthographic projection of the third extension portion 631 on the substrate 100 is located within the orthographic projection of the isolation material layer 201 on the substrate 100, and the third extension portion 631 is spaced from the isolation material layer 201 to form a third gap 632, and in the step of patterning the third light-emitting material layer and the third electrode material layer to form a third light-emitting unit 313 and a third sub-electrode 413 located in the third isolation opening 243, the method further includes:

[0238] The third light emitting material layer and the third electrode material layer are patterned to form a third redundant unit 323 and a third redundant electrode 423 located in the third gap 632 .

[0239] In these optional embodiments, the third packaging portion 630 extends to the side of the isolation material layer 201 away from the substrate 100 to form a third extension portion 631, and a third gap 632 is formed between the third extension portion 631 and the isolation material layer 201. When the third light-emitting material layer and the third electrode material layer are patterned, the portions of the third light-emitting material layer and the third electrode material layer located in the third gap 632 are retained to form a third redundant unit 323 and a third redundant electrode 423 located in the third gap 632. The third redundant unit 323 and the third redundant electrode 423 are filled in the third gap 632 to support the third extension portion 631 and improve the structural stability of the third extension portion 631. The inner wall of the third extension portion 631 facing the third gap 632 can also be covered and protected to prevent damage to the third extension portion 631 by subsequent wet processes.

[0240] In some optional embodiments, the width of the third extension portion 631 is greater than or equal to 3 μm. The width of the third extension portion 631 refers to the distance between the edge of the isolation material layer 201 close to the third isolation opening 243 and the edge of the third extension portion 631. For example, the width of the third extension portion 631 is 3 μm, 4 μm, 5 μm or 6 μm.

[0241] In these optional embodiments, the width of the third extension portion 631 is greater than or equal to 3 μm, which can improve the problem that the water and oxygen intrusion path is too short due to the width of the third extension portion 631 being too small, and the third light-emitting unit 313 and the third sub-electrode 413 are easily corroded by water and oxygen. It can also improve the problem that the third redundant unit 323 and the third redundant electrode 423 located in the third gap 632 are too small due to the width of the third extension portion 631 being too small, and are easily etched away in subsequent processes, so that the inner wall of the third extension portion 631 is exposed toward the third gap 632, and is easily damaged by etching, resulting in reduced packaging performance.

[0242] In some optional embodiments, the isolation material layer 201 includes a first layer 210 and a second layer 220 located on the side of the first layer 210 facing away from the substrate 100 , and the orthographic projection of the side of the first layer 210 away from the substrate 100 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100 .

[0243] In these optional embodiments, the first layer 210 and the second layer 220 are stacked to form the isolation material layer 201, the orthographic projection of the side of the first layer 210 disposed close to the substrate 100 away from the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100, the orthographic projection area of ​​the second layer 220 is larger than the orthographic projection area of ​​the side of the first layer 210 away from the substrate 100, and the second layer 220 covers the surface of the first layer 210 close to the second layer 220, and at this time, the first layer 210 is recessed relative to the second layer 220 in a direction away from the isolation opening 240. When preparing the light-emitting layer 300, the light-emitting layer 300 has a large drop at the edge of the isolation material layer 201, and the first layer 210 is recessed relative to the second layer 220, and the light-emitting layer 300 is difficult to connect at the edge of the isolation material layer 201, so it breaks, and the light-emitting layer 300 breaks to form mutually disconnected light-emitting units 310. All embodiments of the present application do not require the isolation material layer 201 to be an inverted trapezoidal structure or a two-layer structure, and any structure that can achieve the isolation effect of the light-emitting layer 300 is sufficient.

[0244] Optionally, the first layer 210 includes a conductive material, for example, the first layer 210 includes a non-metallic conductive material or a metallic conductive material, so as to achieve electrical connection between the isolation material layer 201 and the second electrode 530 .

[0245] In some optional embodiments, the second layer 220 includes a conductive material or an insulating material, wherein the insulating material may be at least one of silicon nitride or silicon oxide.

[0246] In these optional embodiments, the second layer 220 includes a conductive material, for example, the second layer 220 includes a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, the second layer 220 is difficult to be etched during wet etching of the first layer 210 using an etching solution, so that the first layer 210 is more easily concavely arranged relative to the second layer 220.

[0247] In some optional embodiments, the first layer 210 and the second layer 220 include metal materials, and the materials of the first layer 210 and the second layer 220 are different.

[0248] In these optional embodiments, when both the first layer 210 and the second layer 220 are made of metal materials, the first layer 210 may be wet-etched with an etching solution, and the etching rate of the second layer 220 may be set to be lower than the etching rate of the first layer 210 by setting the etching solution. Since the etching rate of the first layer 210 is relatively high, when the etching solution is used for wet etching, even if the second layer 220 is etched to a certain extent, the first layer 210 is etched faster, so that the first layer 210 is set concave relative to the second layer 220.

[0249] In some optional embodiments, the isolation material layer 201 further includes a third layer 230 located on the side of the first layer 210 facing the substrate 100 , and the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the third layer 230 on the substrate 100 .

[0250] In these optional embodiments, after the third layer 230 is provided, the first layer 210 can be well attached to the third layer 230, and the generated etching waste falls on the third layer 230, which is easy to clean.

[0251] Optionally, the material of the second layer 220 is titanium (Ti) or molybdenum (Mo), the material of the first layer 210 is aluminum (Al), silver (Ag) or copper (Cu), and the material of the third layer 230 is titanium (Ti) or molybdenum (Mo). For example, the isolation material layer 201 is a three-layer metal composite material of Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum).

[0252] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made according to actual conditions, and this application does not impose any specific restrictions on it.

[0253] The embodiment of the third aspect of the present application further provides a display device, comprising the display panel 10 of any of the above embodiments. Since the display device provided by the embodiment of the third aspect of the present application comprises the display panel 10 of any of the above embodiments, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel 10 of any of the above embodiments, which will not be described in detail here.

[0254] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0255] According to the embodiments described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; An isolation structure, located on the substrate, the isolation structure encloses a plurality of isolation openings; The inner wall of the isolation structure facing at least one of the isolation openings has at least two burr areas, each of the burr areas is provided with a protrusion, and in at least two of the burr areas, the average protrusion size in one of the burr areas is smaller than the average protrusion size in the other burr area.

2. The display panel according to claim 1, characterized in that: At least two of the burr regions are distributed along the thickness direction of the display panel, and an average protrusion size of the burr region on a side away from the substrate is greater than an average protrusion size of the burr region on a side close to the substrate.

3. The display panel according to claim 2, characterized in that: The isolation opening comprises a first isolation opening and a second isolation opening which are spaced apart from each other, and an average size of the protrusion of the isolation structure facing the inner wall of the second isolation opening is larger than an average size of the protrusion of the isolation structure facing the inner wall of the first isolation opening; Preferably, the inner wall of the isolation structure facing the second isolation opening has a first burr area and a second burr area, the second burr area is located on a side of the first burr area away from the substrate, the first burr area includes at least one first protrusion, the second burr area includes at least one second protrusion, and the average size of the first protrusion is smaller than the average size of the second protrusion; The inner wall of the isolation structure facing the first isolation opening has a plurality of protrusions of uniform size; The average size of the second protrusions is greater than the average size of the protrusions on the inner wall of the isolation structure facing the first isolation opening; Preferably, the isolation opening includes a third isolation opening spaced apart from the first isolation opening and the second isolation opening, the inner wall of the isolation structure facing the third isolation opening has a third burr region and a fourth burr region, the third burr region is located on a side of the fourth burr region away from the substrate, the third burr region includes at least one third protrusion, the fourth burr region includes at least one fourth protrusion, and the average size of the third protrusion is smaller than the average size of the fourth protrusion; Preferably, the average size of the fourth protrusions is larger than the average size of the second protrusions.

4. The display panel according to claim 2, characterized in that: The display panel further includes: A light-emitting layer, located on the substrate, comprising a plurality of light-emitting units, and the light-emitting units are located in the isolation openings; A first electrode layer, located on a side of the light-emitting layer away from the substrate, and comprising a first electrode located in the isolation opening, wherein the first electrode is electrically connected to the isolation structure; Preferably, the orthographic projection of the light emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate; Preferably, the light emitting unit and the isolation structure are spaced apart; Preferably, the display panel further includes: A pixel definition layer, located on the substrate, the pixel definition layer comprises a pixel definition portion and a pixel opening formed by the pixel definition portion, the pixel opening is connected to the isolation opening; Preferably, the display panel further comprises a second electrode, the second electrode is located between the substrate and the pixel definition layer, and the second electrode is exposed by the pixel opening; Preferably, the display panel further comprises: a first encapsulation layer, located on a side of the second electrode away from the substrate, the first encapsulation layer comprising a plurality of encapsulation parts arranged at intervals; Preferably, the packaging portion comprises an extension portion, the orthographic projection of the extension portion on the substrate is located within the orthographic projection of the isolation structure on the substrate, and the extension portion and the isolation structure are spaced to form a gap; Preferably, the light-emitting layer further comprises a redundant unit located in the gap; Preferably, the first electrode layer further comprises a redundant electrode located in the gap; Preferably, the width of the extension portion is greater than or equal to 3 μm; Preferably, the first encapsulation layer is an inorganic layer; Preferably, the display panel further comprises: a second encapsulation layer, located on a side of the first encapsulation layer away from the substrate; Preferably, the display panel further comprises: a third encapsulation layer, located on a side of the second encapsulation layer away from the substrate; Preferably, the second encapsulation layer is an organic layer, and / or the third encapsulation layer is an inorganic layer.

5. The display panel according to claim 2, characterized in that: The isolation structure comprises a first layer and a second layer, wherein the second layer is located on a side of the first layer away from the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the second layer on the substrate; Preferably, the burr area is located on the inner wall of the first layer facing the isolation opening; Preferably, the first layer comprises a conductive material; Preferably, the second layer comprises a conductive material or an insulating material; Preferably, the first layer and the second layer both comprise metal materials, and the materials of the first layer and the second layer are different; Preferably, the isolation structure further comprises a third layer located on a side of the first layer facing the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the third layer on the substrate.

6. A method for preparing a display panel, characterized in that: The method comprises: Preparing an isolation material layer on a substrate, and patterning the isolation material layer to form a first isolation opening; Sequentially preparing a first light-emitting material layer, a first electrode material layer and a first packaging material layer on a side of the isolation material layer facing away from the substrate; A first barrier layer is prepared on a side of the first packaging material layer facing away from the substrate, wherein the orthographic projection of the first isolation opening on the substrate is located within the orthographic projection of the first barrier layer on the substrate; Performing patterning on the first packaging material layer to form a first packaging portion located at the first isolation opening; The first barrier layer is removed by a dry etching process.

7. The preparation method according to claim 6, characterized in that: Before or after the step of removing the first barrier layer by dry etching, the method further includes: Performing patterning on the first light-emitting material layer and the first electrode material layer to form a first light-emitting unit and a first sub-electrode located in the first isolation opening; Preferably, the orthographic projection of the first encapsulation portion on the substrate is located within the orthographic projection of the first barrier layer on the substrate; Preferably, the first electrode material layer is etched using an acidic etching solution; Preferably, the first light-emitting material layer is etched using an alkaline etching solution; Preferably, the material of the first barrier layer includes photoresist.

8. The preparation method according to claim 7, characterized in that: The first encapsulation portion includes a first extension portion located on a side of the isolation material layer away from the substrate, the first extension portion is spaced from the isolation material layer to form a first gap, and the first light-emitting material layer and the first electrode material layer are patterned to form a first light-emitting unit and a first sub-electrode located in the first isolation opening, the method further includes: Performing patterning on the first light-emitting material layer and the first electrode material layer to form a first redundant unit and a first redundant electrode located in the first gap; Preferably, the width of the first extension portion is greater than or equal to 3 μm.

9. The preparation method according to claim 7, characterized in that: In the step of preparing an isolation material layer on the substrate and patterning the isolation material layer, the method further comprises: During the patterning process of the isolation material layer, a second isolation opening spaced apart from the first isolation opening is formed.

10. The preparation method according to claim 9, characterized in that: After the step of patterning the first light-emitting material layer and the first electrode material layer to form a first light-emitting unit and a first sub-electrode located in the first isolation opening, the method further includes: flushing the second isolation opening; Preferably, the second isolation opening is rinsed with ultrasonic deionized water.

11. The preparation method according to claim 9, characterized in that: In the step of removing the first barrier layer by dry etching, the method further comprises: In the dry etching process, the isolation material layer forms a first burr area and a second burr area toward the inner wall of the second isolation opening, the second burr area is located on the side of the first burr area away from the substrate, the first burr area includes at least one first protrusion, the second burr area includes at least one second protrusion, and the average size of the first protrusion is smaller than the average size of the second protrusion.

12. The preparation method according to claim 9, characterized in that: After forming the first light emitting unit, the method further includes: Sequentially preparing a second light-emitting material layer, a second electrode material layer, and a second packaging material layer on a side of the isolation material layer facing away from the substrate; A second barrier layer is prepared on a side of the second packaging material layer facing away from the substrate, wherein the orthographic projection of the second isolation opening on the substrate is located within the orthographic projection of the second barrier layer on the substrate; performing patterning on the second packaging material layer to form a second packaging portion located at the second isolation opening; removing the second barrier layer by dry etching process; Preferably, before or after the step of removing the second barrier layer by dry etching, the step further includes: Performing patterning on the second light-emitting material layer and the second electrode material layer to form a second light-emitting unit and a second sub-electrode located in the second isolation opening; Preferably, the second electrode material layer is etched using an acidic etching solution; Preferably, the second light-emitting material layer is etched using an alkaline etching solution; Preferably, the material of the second barrier layer includes photoresist.

13. The preparation method according to claim 12, characterized in that: The second encapsulation portion includes a second extension portion, the orthographic projection of the second extension portion on the substrate is located within the orthographic projection of the isolation material layer on the substrate, the second extension portion and the isolation material layer are spaced to form a second gap, and the second light-emitting material layer and the second electrode material layer are patterned to form a second light-emitting unit and a second sub-electrode located in the second isolation opening, the method further includes: performing patterning on the second light emitting material layer and the second electrode material layer to form a second redundant unit and a second redundant electrode located in the second gap; Preferably, the width of the second extension portion is greater than or equal to 3 μm.

14. The preparation method according to claim 12, characterized in that: In the step of preparing an isolation material layer on the substrate and patterning the isolation material layer, the method further comprises: During the patterning process of the isolation material layer, a third isolation opening spaced apart from the first isolation opening and the second isolation opening is formed.

15. The preparation method according to claim 14, characterized in that: After the step of patterning the second light-emitting material layer and the second electrode material layer to form a second light-emitting unit and a second sub-electrode located in the second isolation opening, the method further includes: flushing the third isolation opening; Preferably, the third isolation opening is rinsed with ultrasonic deionized water.

16. The preparation method according to claim 14, characterized in that: In the step of removing the second barrier layer by dry etching, the method further comprises: In the dry etching process, the isolation material layer forms a third burr region and a fourth burr region toward the inner wall of the third isolation opening, the fourth burr region is located on the side of the third burr region away from the substrate, the third burr region includes at least one third protrusion, the fourth burr region includes at least one fourth protrusion, and the average size of the third protrusion is smaller than the average size of the fourth protrusion.

17. The preparation method according to claim 14, characterized in that: The method further comprises: sequentially preparing a third light-emitting material layer, a third electrode material layer and a third encapsulation material layer on a side of the isolation material layer away from the substrate; A third barrier layer is prepared on a side of the third packaging material layer facing away from the substrate, wherein the orthographic projection of the third isolation opening on the substrate is located within the orthographic projection of the third barrier layer on the substrate; Performing patterning on the third packaging material layer to form a third packaging portion located in the third isolation opening; Removing the third barrier layer by dry etching process; Preferably, before or after the step of removing the third barrier layer by dry etching, the step further includes: Performing patterning on the third light-emitting material layer and the third electrode material layer to form a third light-emitting unit and a third sub-electrode located in the third isolation opening; Preferably, the third electrode material layer is etched using an acidic etching solution; Preferably, the third light-emitting material layer is etched using an alkaline etching solution; Preferably, the material of the third barrier layer includes photoresist.

18. The preparation method according to claim 17, characterized in that: The third encapsulation portion includes a third extension portion, the orthographic projection of the third extension portion on the substrate is located within the orthographic projection of the isolation material layer on the substrate, the third extension portion and the isolation material layer are spaced to form a third gap, and the third light-emitting material layer and the third electrode material layer are patterned to form a third light-emitting unit and a third sub-electrode located in the third isolation opening, the method further includes: Performing patterning on the third light emitting material layer and the third electrode material layer to form a third redundant unit and a third redundant electrode located in the third gap; Preferably, the width of the third extension portion is greater than or equal to 3 μm.

19. The preparation method according to claim 6, characterized in that: The isolation material layer comprises a first layer and a second layer, wherein the second layer is located on a side of the first layer away from the substrate, and an orthographic projection of a side of the first layer away from the substrate on the substrate is located within an orthographic projection of the second layer on the substrate; Preferably, the first layer comprises a conductive material; Preferably, the second layer comprises a conductive material or an insulating material; Preferably, the first layer and the second layer both comprise metal materials, and the materials of the first layer and the second layer are different; Preferably, the isolation structure further comprises a third layer located on a side of the first layer facing the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the third layer on the substrate.

20. A display device, characterized in that: A display panel comprising any one of claims 1 to 5.

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