Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a first conductive layer, a first insulating layer and an isolation structure, the first conductive layer is arranged on the substrate, the first conductive layer comprises a plurality of first conductive parts, and the plurality of first conductive parts are arranged at intervals; at least part of the first insulating layer is arranged on the opposite side walls of the adjacent first conductive parts, and the first insulating layer comprises a first film layer and a second film layer arranged on the side, away from the substrate, of the first film layer; the isolation structures are arranged on the substrate and enclose to form a plurality of isolation openings; wherein between at least two adjacent first conductive parts, the first insulating layer is provided with a first opening, and the second film layer protrudes towards the first opening relative to the first film layer. The reliability and the use performance of the display panel are improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the reliability of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, aiming to improve the reliability of OLED display products.

[0005] A first aspect of the present application provides a display panel, which includes a substrate, a first conductive layer, a first insulating layer and an isolation structure; the first conductive layer is arranged on one side of the substrate, the first conductive layer includes a plurality of first conductive parts, and the plurality of first conductive parts are arranged at intervals; at least part of the first insulating layer is arranged on the side walls opposite to adjacent first conductive parts, the first insulating layer includes a first film layer and a second film layer arranged on the side of the first film layer away from the substrate; the isolation structure is arranged on the substrate and encloses a plurality of isolation openings; wherein, between at least two adjacent first conductive parts, the first insulating layer is provided with a first opening, and the second film layer is provided to protrude toward the first opening relative to the first film layer.

[0006] According to an implementation scheme of the first aspect of the present application, the first opening includes a first sub-opening and a second sub-opening that are connected; the first film layer is provided with the first sub-opening, and the second film layer is provided with the second sub-opening, and the second sub-opening is located on the side of the first sub-opening away from the substrate; the orthographic projection of the second sub-opening on the substrate is located within the orthographic projection of the first sub-opening on the substrate.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, an orthographic projection area of ​​the second sub-opening on the substrate is smaller than an orthographic projection area of ​​the first sub-opening on the substrate.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the first insulating layer further includes a protective layer, and the protective layer is disposed between the first conductive layer and the first film layer.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the first opening further includes a third sub-opening connected to the first sub-opening, and the protective layer is provided with the third sub-opening.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the third sub-opening on the substrate is located within the orthographic projection of the first sub-opening on the substrate.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the protective layer is disposed to protrude toward the first opening relative to the first film layer.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the protective layer is protruded or flush with the second film layer toward the first opening.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the protective layer includes an inorganic material.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the inorganic material includes oxygen silicon compounds and nitrogen silicon compounds.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the protective layer includes silicon oxide.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the protective layer and the first film layer are made of different materials;

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the protective layer and the second film layer are made of the same material.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the materials of the first film layer and the second film layer are different, the material of the first film layer includes an inorganic material, and / or the material of the second film layer includes an inorganic material.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the inorganic material includes oxygen silicon compounds and nitrogen silicon compounds.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first film layer includes silicon oxide, and the material of the second film layer includes silicon nitride.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the first insulating layer includes a pixel definition layer, the pixel definition layer includes a first film layer and a second film layer, the pixel definition layer encloses a plurality of pixel openings, and the pixel openings are connected to corresponding isolation openings.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel opening includes a fourth sub-opening and a fifth sub-opening that are connected; the first film layer is provided with a fourth sub-opening, and the second film layer is provided with a fifth sub-opening, and the fifth sub-opening is located on the side of the fourth sub-opening away from the substrate; the orthographic projection of the fifth sub-opening on the substrate is located within the orthographic projection of the fourth sub-opening on the substrate; the orthographic projection area of ​​the fifth sub-opening on the substrate is smaller than the orthographic projection area of ​​the fourth sub-opening on the substrate.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a light-emitting layer, and a first auxiliary light-emitting layer arranged on a side of the light-emitting layer close to the substrate, a portion of the first auxiliary light-emitting layer is arranged in the pixel opening, the first auxiliary light-emitting layer is separated at the side wall of the pixel opening, and the light-emitting layer is continuously arranged at the side wall of the pixel opening.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the first auxiliary light-emitting layer includes one or more of a hole injection layer, a hole transport layer, an electron blocking layer, an electron injection layer, an electron transport layer, and a hole blocking layer.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure is located on a side of the pixel definition layer facing away from the substrate, or a clearance opening is provided on the pixel definition layer, and the isolation structure is located in the clearance opening.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the first insulating layer includes a first sub-portion and a second sub-portion connected to each other, the first sub-portion is located on the side of the first conductive portion facing away from the substrate, the second sub-portion is arranged on the side wall opposite to the adjacent first conductive portion, and the second sub-portion is provided with a first opening.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the first sub-portion is provided with a second opening, and the second opening exposes at least a portion of the first conductive portion away from the substrate.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, along the thickness direction of the substrate, the thickness of the first insulating layer is greater than or equal to 0.35 microns; the first insulating layer disposed between adjacent first conductive portions and disposed on the same side wall of the first conductive portions has a dimension greater than or equal to 2 microns along the arrangement direction of the first conductive portions;

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, along the thickness direction of the substrate, the thickness of the second sub-portion is greater than or equal to 0.35 microns; the second sub-portion arranged between adjacent first conductive portions and on the same side wall of the first conductive portion has a size greater than or equal to 2 microns along the arrangement direction of the first conductive portion.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, along the thickness direction of the substrate, the thickness of the first insulating layer is greater than or equal to 0.35 micrometers and less than or equal to 0.6 micrometers; the first insulating layer disposed between adjacent first conductive portions and disposed on the same side wall of the first conductive portions has a dimension along the arrangement direction of the first conductive portions that is greater than or equal to 2 micrometers and less than or equal to 2.5 micrometers;

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, along the thickness direction of the substrate, the thickness of the second sub-portion is greater than or equal to 0.35 microns and less than or equal to 0.6 microns; the second sub-portion arranged between adjacent first conductive portions and on the same side wall of the first conductive portion has a size greater than or equal to 2 microns and less than or equal to 2.5 microns along the arrangement direction of the first conductive portion.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a first electrode layer arranged between the first insulating layer and the first conductive layer, the first electrode layer includes a first electrode, and the orthographic projection of the first electrode on the substrate at least partially overlaps with the orthographic projection of the isolation opening on the substrate.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a plurality of light-emitting units located on a side of the first electrode layer facing away from the substrate, and the light-emitting units are arranged corresponding to the isolation openings.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a second electrode layer located on a side of the light-emitting unit away from the substrate, and the second electrode layer includes a second electrode disposed in the isolation opening.

[0035] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a conductive material, and the second electrode is electrically connected to the isolation structure.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first sublayer and a second sublayer located on the side of the first sublayer facing away from the substrate, and the orthographic projection of the side of the first sublayer away from the substrate on the substrate is located within the orthographic projection of the second sublayer on the substrate.

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, an end portion of the second sub-layer facing the isolation opening protrudes beyond an end portion of the first sub-layer facing the isolation opening.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a third sublayer located on the side of the first sublayer facing the substrate, and the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the third sublayer on the substrate.

[0039] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a light-emitting device and a first packaging layer located on the side of the light-emitting device away from the substrate, at least a portion of the light-emitting device is located in the isolation opening, and the first packaging layer includes a packaging portion located on the side of the light-emitting device away from the substrate.

[0040] According to any of the aforementioned embodiments of the first aspect of the present application, there are multiple packaging parts, and light-emitting devices with different luminous colors correspond to different packaging parts.

[0041] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a second encapsulation layer disposed on a side of the first encapsulation layer facing away from the substrate.

[0042] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first encapsulation layer includes an inorganic material, and / or the material of the second encapsulation layer includes an organic material.

[0043] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a third encapsulation layer disposed on a side of the second encapsulation layer facing away from the substrate.

[0044] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the third encapsulation layer includes an inorganic material.

[0045] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a light-emitting device, at least part of which is located in the isolation opening, and the light-emitting device includes a first electrode, a light-emitting unit, and a second electrode which are sequentially stacked in a direction away from the substrate.

[0046] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the second electrode includes silver.

[0047] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel includes a plurality of light-emitting devices with different luminous colors, and the plurality of light-emitting devices with different luminous colors are located in different isolation openings.

[0048] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel has a display area and a non-display area, the first conductive portion is located in the non-display area; and at least part of the isolation opening is located in the display area.

[0049] According to any of the aforementioned embodiments of the first aspect of the present application, the non-display area includes a binding area, and the first conductive part includes a binding pin located in the binding area; and / or, the material of the first conductive part includes a first sub-conductive layer and a second sub-conductive layer stacked in sequence along a thickness direction away from the substrate, and the activity of the material of the second sub-conductive layer is less than the activity of the material of the first sub-conductive layer; and / or, the material of the first conductive part includes aluminum; and / or, the first conductive part includes a titanium layer, an aluminum layer, and a titanium layer stacked along the thickness direction of the substrate; and / or, the interval between adjacent first conductive parts is 8 microns to 10 microns.

[0050] According to any of the aforementioned embodiments of the first aspect of the present application, the first insulating layer is provided with a second opening, and the second opening exposes at least a portion of the first conductive portion away from the substrate.

[0051] An embodiment of the first aspect of the present application also provides a display panel, which includes a substrate, a first conductive layer, a first insulating layer and an isolation structure; the first conductive layer is arranged on the substrate, the first conductive layer includes a plurality of first conductive parts, and the plurality of first conductive parts are arranged at intervals; at least part of the first insulating layer is arranged on the side walls opposite to adjacent first conductive parts; the isolation structure is arranged on the substrate and encloses a plurality of isolation openings; wherein, between at least two adjacent first conductive parts, the first insulating layer is provided with a first opening, and along the thickness direction of the substrate, the thickness of the first insulating layer is greater than or equal to 0.35 microns; the first insulating layer arranged between adjacent first conductive parts and on the same side wall of the first conductive part has a size greater than or equal to 2 microns along the arrangement direction of the first conductive parts.

[0052] An embodiment of the first aspect of the present application also provides a display panel, which includes a substrate, a pixel definition layer and an isolation structure; the pixel definition layer includes a first film layer and a second film layer arranged on the side of the first film layer away from the substrate; the pixel definition layer encloses a plurality of pixel openings, and the pixel openings include a fourth sub-opening and a fifth sub-opening that are connected; the first film layer is provided with a fourth sub-opening, and the second film layer is provided with a fifth sub-opening, and the fifth sub-opening is located on the side of the fourth sub-opening away from the substrate; the orthographic projection of the fifth sub-opening on the substrate is located within the orthographic projection of the fourth sub-opening on the substrate; the orthographic projection area of ​​the fifth sub-opening on the substrate is smaller than the orthographic projection area of ​​the fourth sub-opening on the substrate; the isolation structure is arranged on the substrate and encloses a plurality of isolation openings; the pixel openings are connected to the corresponding isolation openings.

[0053] An embodiment of a second aspect of the present application provides a method for preparing a display panel, including:

[0054] A first conductive layer is prepared on the substrate, wherein the first conductive layer includes a plurality of first conductive portions arranged at intervals;

[0055] Forming a first insulating material layer on a side of the first conductive layer away from the substrate, the first insulating material layer comprising a first film layer and a second film layer disposed on a side of the first film layer away from the substrate;

[0056] forming an isolation material layer;

[0057] Performing patterning on the first insulating material layer to form a first opening, wherein the first opening is located between adjacent first conductive portions, and at least a portion of the first insulating material layer is disposed on opposite side walls of adjacent first conductive portions;

[0058] The second film layer is arranged to protrude relative to the first film layer toward the first opening.

[0059] According to an implementation of the second aspect of the present application, before forming the first opening, the preparation method further includes:

[0060] The isolation material layer is patterned to expose a portion of the first insulation material layer.

[0061] According to any of the aforementioned embodiments of the second aspect of the present application, the substrate includes a first region and a second region, the isolation material layer is patterned to form at least a portion of the isolation opening, and a third opening is formed in the second region, the third opening exposing at least a portion of the first insulating material layer; the isolation opening is located in the first region;

[0062] According to any of the aforementioned embodiments of the second aspect of the present application, the isolation opening includes a first isolation opening, at least one of the second isolation opening, and a third isolation opening, and the step of patterning the isolation material layer to expose a portion of the first insulating material layer includes:

[0063] The isolation material layer is patterned to form at least one of a first isolation opening and a second isolation opening located in the first region, and a third opening located in the second region; wherein the orthographic projections of the first portion of the number of first conductive portions on the substrate are located within the orthographic projections of the third opening on the substrate, and the orthographic projections of the second portion of the number of first conductive portions on the substrate are located outside the orthographic projections of the third opening on the substrate;

[0064] The step of patterning the first insulating material layer to form a first opening includes:

[0065] The first insulating material layer is patterned to form at least one of a first pixel opening and a second pixel opening and a first opening, wherein the first pixel opening is connected to the first isolation opening, the second pixel opening is connected to the second isolation opening, and the first opening is connected to the third opening;

[0066] After the step of patterning the first insulating material layer to form at least one of the first pixel opening and the second pixel opening and the first opening, the preparation method further comprises:

[0067] Forming a first preparation material layer, patterning the first preparation material layer to form a light-emitting unit of a first light-emitting device located at a first isolation opening, a second electrode, and a first packaging portion located at a side of the first light-emitting device away from the substrate; and / or forming a second preparation material layer, patterning the second preparation material layer to form a light-emitting unit of a second light-emitting device located at a second isolation opening, a second electrode, and a second packaging portion located at a side of the second light-emitting device away from the substrate;

[0068] Patterning the isolation material layer having the first isolation opening and / or the second isolation opening to form a third isolation opening located in the first region, patterning the first insulating material layer to form a third pixel opening and a second opening, the third pixel opening being connected to the third isolation opening, and the second opening exposing at least a portion of the first conductive portion away from the substrate;

[0069] A third preparation material layer is formed, and the third preparation material layer is patterned to form a light-emitting unit of a third light-emitting device located in a third isolation opening, a second electrode, and a third packaging portion located on a side of the third light-emitting device away from the substrate.

[0070] According to any of the aforementioned embodiments of the second aspect of the present application, the step of patterning the isolation material layer having the first isolation opening and / or the second isolation opening to form a third isolation opening located in the first region further includes:

[0071] The isolation material layer having the first isolation opening and / or the second isolation opening is patterned to form a third isolation opening located in the first region, and the isolation material layer located in the second region is removed.

[0072] According to any of the foregoing embodiments of the second aspect of the present application, after forming a light-emitting unit, a second electrode, and a first packaging portion located on a side of the first light-emitting device away from the substrate located at the first isolation opening; and / or, after forming a light-emitting unit, a second electrode, and a second packaging portion located on a side of the second light-emitting device away from the substrate located at the second isolation opening, before forming a third isolation opening located in the first area, a lighting test is performed on the first light-emitting device and / or the second light-emitting device.

[0073] According to any of the aforementioned embodiments of the second aspect of the present application, before forming the first opening, the preparation method further includes:

[0074] Performing patterning on the isolation material layer to expose a portion of the first insulation material layer;

[0075] Patterning the isolation material layer to expose a portion of the first insulating material layer while or before forming at least a portion of the isolation opening in the isolation material layer;

[0076] And / or, after forming the first opening, the preparation method further comprises:

[0077] Forming a preparation material layer, and patterning the preparation material layer to form a light-emitting unit of the light-emitting device located in at least part of the isolation openings, a second electrode, and a packaging portion located on a side of the light-emitting device away from the substrate;

[0078] And / or, before the step of forming a first insulating material layer on a side of the first conductive layer facing away from the substrate, the preparation method includes:

[0079] Preparing a first electrode layer on a substrate, the first electrode layer comprising a first electrode;

[0080] The step of patterning the first insulating material layer to form a first opening includes:

[0081] The first insulating material layer is patterned to form at least a portion of a pixel opening and a first opening, wherein the pixel opening exposes at least a portion of the first electrode.

[0082] According to any of the aforementioned embodiments of the second aspect of the present application, the first insulating material layer further includes a protective layer, and the protective layer is disposed between the first conductive layer and the first film layer; and the step of patterning the first insulating material layer to form the first opening includes:

[0083] The first insulating material layer is patterned to form a first sub-opening, a second sub-opening and a third sub-opening that are interconnected, the first sub-opening passes through the first film layer, the second sub-opening passes through the second film layer, the third sub-opening is formed in the protective layer, and the orthographic projection of the second sub-opening on the substrate is located within the orthographic projection of the first sub-opening on the substrate.

[0084] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the first film layer includes an inorganic material, and / or the material of the second film layer includes an inorganic material, and / or the material of the protective layer includes an inorganic material.

[0085] According to any of the aforementioned embodiments of the second aspect of the present application, the inorganic material includes oxygen silicon compounds and nitrogen silicon compounds.

[0086] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the first film layer includes silicon oxide, the material of the second film layer includes silicon nitride, and the material of the protective layer includes silicon oxide.

[0087] An embodiment of the third aspect of the present application provides a display device, which includes a binding element and a display panel provided by any one of the embodiments of the first aspect above, the display panel includes a first conductive part, and the binding element is electrically connected to the first conductive part; the binding element includes a chip and / or a flexible circuit board.

[0088] According to the display panel of the embodiment of the present application, the display panel includes a substrate, a first conductive layer, a first insulating layer and an isolation structure. The second film layer covers the surface of the first film layer away from the substrate, and the second film layer is convexly arranged relative to the first film layer toward the first opening, and at this time, the first film layer is recessed relative to the second film layer in the direction away from the first opening. The undercut structure formed by the first film layer and the second film layer arranged on the side walls opposite to adjacent first conductive parts can isolate the residual isolation material, electrode material, etc. between adjacent first conductive parts from the side walls of the first conductive parts after preparing some light-emitting devices, thereby reducing the risk of short circuit caused by electrical connection between two adjacent first conductive parts through residual isolation material, electrode material, etc., thereby improving the reliability and performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0089] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0090] Figure 1 is a schematic diagram of a top view structure of a display panel provided in an embodiment of the present application;

[0091] Figure 2 is a partial top view of a non-display area of ​​a display panel provided in an embodiment of the present application;

[0092] Figure 3a yes Figure 2 Schematic diagram of the cross-sectional structure at AA in the middle;

[0093] Figure 3b yes Figure 3a A dimensioned structural diagram of the structure shown;

[0094] Figure 4 yes Figure 3a A schematic diagram of the structure when the structure shown is provided with an isolation material layer;

[0095] Figure 5 is a schematic diagram of a cross-sectional structure of a display area of ​​a display panel provided in an embodiment of the present application;

[0096] Figure 6 is a partial cross-sectional view of a display area and a non-display area in a display panel provided by an embodiment of the present application;

[0097] Figure 7 yes Figure 6 The schematic diagram of the cross-sectional structure of the structure shown is when no light-emitting unit is prepared;

[0098] Figure 8is an enlarged partial cross-sectional view of a second sub-portion in a display panel provided in one embodiment of the present application;

[0099] Fig. 9 is a schematic diagram of a cross-sectional structure of a display area of ​​another display panel provided in an embodiment of the present application;

[0100] Fig.10 is a schematic cross-sectional structure diagram of a display area of ​​another display panel provided in an embodiment of the present application;

[0101] Fig.11a is a schematic cross-sectional structure diagram of a display area of ​​another display panel provided in an embodiment of the present application;

[0102] Fig.11b is Fig.11a A schematic diagram of the structure after the light-emitting unit is prepared from the structure shown;

[0103] Fig.12 is a schematic cross-sectional structure diagram of a first conductive portion in a display panel provided in an embodiment of the present application;

[0104] Fig.13 is a flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0105] Fig.14 is a flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0106] Fig.15 It is a structural flow chart of a display panel preparation provided in an embodiment of the present application.

[0107] Description of reference numerals:

[0108] 100, display area; 200, non-display area;

[0109] 1. substrate; 11. first conductive layer; 111. first conductive portion; 112. second conductive portion;

[0110] 2. first insulating layer; 21. pixel definition layer; 211. first film layer; 212. second film layer; 213. protective layer; 20. first opening; 201. third sub-opening; 202. first sub-opening; 203. second sub-opening; 22. pixel opening; 24. first sub-portion; 25. second sub-portion; 251. first portion; 252. second portion; 253. third portion; 210. second opening; 204. fourth sub-opening; 205. fifth sub-opening;

[0111] 3. Isolation structure; 31. First sublayer; 32. Second sublayer; 33. Third sublayer; 30. Isolation opening; 300. Isolation material layer; 310. Residual isolation material; 320. Residual electrode material;

[0112] 4. Light-emitting functional layer; 41. Light-emitting unit; 42. First electrode layer; 421. First electrode; 43. Second electrode layer; 431. Second electrode; 411. Light-emitting layer; 412. First auxiliary light-emitting layer;

[0113] 5. First packaging layer; 50. Packaging part; 6. Second packaging layer; 7. Third packaging layer. DETAILED DESCRIPTION

[0114] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0115] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0116] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0117] Embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device. Embodiments of the display panel and a method for manufacturing the same, and a display device are described below in conjunction with the accompanying drawings.

[0118] Please also read Figures 1 to 7In a first aspect of the present application, an embodiment provides a display panel, which includes a substrate 1, a first conductive layer 11, a first insulating layer 2 and an isolation structure 3; the first conductive layer 11 is disposed on the substrate 1, and the first conductive layer 11 includes a plurality of first conductive portions 111, and the plurality of first conductive portions 111 are disposed at intervals; at least a portion of the first insulating layer 2 is disposed on the opposite sidewalls of adjacent first conductive portions 111, and the first insulating layer 2 includes a first film layer 211 and a second film layer 212 disposed on a side of the first film layer 211 away from the substrate 1; the isolation structure 3 is disposed on the substrate 1 and encloses a plurality of isolation openings 30; wherein, between at least two adjacent first conductive portions 111, the first insulating layer 2 is provided with a first opening 20, and the second film layer 212 is disposed protruding relative to the first film layer 211 toward the first opening 20. At least two adjacent first conductive portions 111 can be used to transmit different signals.

[0119] Optionally, the display panel has a display area 100 and a non-display area 200. Optionally, the display panel has a display area 100 and a non-display area 200 located at least on one side of the display area 100. The isolation opening 30 may be formed in the display area 100; the first opening 20 may be formed in the non-display area 200, such as Figure 4As shown, the undercut structure formed by the second film layer 212 protruding toward the first opening 20 relative to the first film layer 211 can absorb and hold the residual electrode material 320 (for example, silver particles), so that the position of the residual electrode material 320 is fixed and isolated in the first opening 20 by the undercut structure, thereby reducing the risk of the residual electrode material 320 being electrically connected to the adjacent first conductive portion 111 through itself or through other residual conductive film layers, resulting in a short circuit between the two first conductive portions 111. The undercut structure can isolate the residual electrode material 320 and the like from the side wall of the first conductive part 111. During the preparation of the light-emitting device, there may also be residues of the first insulating material in the first opening 20 between adjacent first conductive parts 111 (for example, the portion of the first insulating material is protected by the residual isolation material 310, so that when the first insulating material layer is etched, the portion of the first insulating material under the residual isolation material 310 is retained). The residual first insulating material can further isolate the residual electrode material 320 and the like that are stuck by the undercut structure, thereby reducing the electrical connection between the residual electrode material 320 and the residual isolation material 310 located on the side of the residual first insulating material away from the substrate, thereby reducing the risk of short-circuiting between adjacent first conductive parts 111 through the residual isolation material 310, electrode material, etc. On the other hand, the first insulating layer 2 includes the first film layer 211 and the second film layer 212, which can increase the thickness or area of ​​the first insulating layer 2 on the side wall of the first conductive part 111, and reduce the risk of the first insulating layer 2 on the side wall of the first conductive part 111 being overetched, resulting in the exposure of the side wall of the adjacent first conductive part 111, and the short circuit connection through the residual isolation material 310, electrode material, etc. between the adjacent first conductive parts 111. Figure 3a As shown, the first opening 20 is formed in the non-display area 200, the first conductive portion 111 can be used as a pad pin, and the first insulating layer 2 can be used as a covering protective layer for the pad pin. The embodiment of the present application is described by taking the first opening 20 being located in the non-display area 200 as an example.

[0120] The first conductive layer 11 is a film layer provided on the substrate 1 and including a conductive material. The first conductive layer 11 includes a first conductive portion 111 located in the non-display area 200. The first conductive portion 111 is a conductive structure for achieving electrical connection. It should be noted that the first conductive layer 11 may include only the first conductive portion 111, that is, the first conductive layer 11 is completely located in the non-display area 200 and outside the display area 100. Alternatively, in addition to the first conductive portion 111 located in the non-display area 200, the first conductive layer 11 may also include other conductor structures located in the display area 100. The specific layout of the conductor structure in the first conductive layer 11 is not limited by the embodiment of the present application.

[0121] Optionally, the first conductive layer 11 may include an anode layer, that is, an anode structure may be provided in the first conductive layer 11. Alternatively, the first conductive layer 11 may also be another conductive layer located on the side of the anode layer facing the substrate 1.

[0122] Optionally, the first conductive portion 111 is used to be electrically connected to other signal lines, including power supply voltage signal lines, data voltage signal lines, etc., or the first conductive portion 111 is used as a pin to be electrically connected to an integrated circuit of a flexible circuit board or a chip.

[0123] The first insulating layer 2 is used to separate the first conductive layer 11 from the conductive film layer disposed on the first insulating layer 2, and can also protect the first conductive portion 111 by covering the first conductive portion 111. Optionally, the first insulating layer 2 can be a composite film layer having multiple insulating sublayers.

[0124] In a display panel provided in an embodiment of the present application, the display panel includes a substrate 1, a first conductive layer 11, a first insulating layer 2 and an isolation structure 3. The second film layer 212 covers the surface of the first film layer 211 away from the substrate 1, and the second film layer 212 is protruded relative to the first film layer 211 toward the first opening 20, and at this time, the first film layer 211 is recessed relative to the second film layer 212 in the direction away from the first opening 20. The undercut structure formed by the first film layer 211 and the second film layer 212 arranged on the opposite side walls of adjacent first conductive parts 111 can isolate the residual isolation material 310, the residual electrode material 320, etc. between the adjacent first conductive parts 111 from the side walls of the first conductive parts 111 after preparing some light-emitting devices, thereby reducing the risk of short circuit caused by electrical connection between two adjacent first conductive parts 111 through the residual film layer material, thereby improving the reliability and performance of the display panel.

[0125] Taking the first conductive part 111 located in the non-display area 200 as an example, in the related art, due to the existence of the isolation structure, the precision mask plate can be eliminated when preparing the light-emitting unit, and the light-emitting material can be separated into multiple light-emitting units by the isolation structure. When preparing light-emitting units of different colors, it is first necessary to evaporate the first color light-emitting material and the electrode material layer on the entire surface so that the first color light-emitting material falls into multiple isolation openings and is encapsulated, and then etching to remove part of the encapsulation material, part of the electrode material layer and part of the first color light-emitting material, retaining the first color light-emitting material, the electrode material layer and the encapsulation material covering the isolation opening in part of the isolation opening to form a light-emitting device with a first color, and then repeating the above operation to form a light-emitting device with a second color and a light-emitting device with a third color. The isolation material layer used to form the isolation structure can be extended to the non-display area for covering protection during preparation. Insulation settings are required between different circuit structures (such as binding pins). The above-mentioned etching process may damage the insulating material layer between different circuit structures (especially the position not covered by the isolation material layer), so that the adjacent circuit structure (such as the side wall of the binding pin) is exposed, and the residual electrode material 320 after etching is electrically connected with the residual isolation material 310 located between the two, resulting in the risk of short circuit, thereby reducing the reliability of the display panel.

[0126] Illustratively, the residual film layer material of the present application may include at least one of the light-emitting unit material, the electrode material and the isolation structure material in the preparation process.

[0127] The undercut structure formed by the first film layer 211 and the second film layer 212 in the embodiment of the present application can isolate the isolation material remaining at the first opening 20 during preparation and the residual electrode material 320 from the side wall of the first conductive part. For example, after the first opening 20 is formed, when the electrode material in the light-emitting device prepared later is etched, the silver particles in the electrode material remaining and / or adsorbed due to etching can be stuck in the recessed position of the undercut structure formed at the first opening 20, so that the position of the residual electrode material 320 is fixed and isolated in the first opening 20 by the undercut structure. The risk of the residual electrode material 320 being electrically connected to the adjacent first conductive part 111 through itself or through other residual conductive film layers, resulting in a short circuit between the two first conductive parts 111, is reduced. Between adjacent first conductive portions 111, there may also be residues of isolation material and first insulating material under the isolation material at the first opening 20. The residual first insulating material can further isolate the residual electrode material 320 stuck by the bottom cut structure, thereby reducing the electrical connection between the residual electrode material 320 and the residual isolation material 310 located on the side of the residual first insulating material away from the substrate, thereby reducing the risk of short-circuiting between adjacent first conductive portions 111 through the residual film layer material.

[0128] In this case, even if the first insulating layer 2 is etched to expose part of the first conductive parts 111, the side of the first conductive parts 111 facing away from the substrate 1 will not absorb the electrode material, so there is no residual electrode material on the side of the first conductive parts 111 facing away from the substrate 1, thereby reducing the risk of short circuit of the first conductive parts 111 through the residual film layer material, thereby improving the reliability and performance of the display panel.

[0129] Optionally, the residual isolation material 310 may be formed when the isolation material layer 300 is etched by patterning to form a partial isolation opening 30. The isolation material layer 300 has a height difference on the first conductive portion 111 and between two adjacent first conductive portions 111. During local etching, the photoresist on the isolation material layer 300 at a lower position is prone to remain due to insufficient exposure, resulting in incomplete etching of the isolation material layer 300 at this position, thereby causing a thin layer of isolation material to remain in the form of blocks. The undercut structure formed by the first film layer 211 and the second film layer 212 can isolate the residual electrode material 320 stuck in the undercut structure and the residual isolation material 310 located on the side of the residual first insulating material away from the substrate, thereby reducing the risk of short-circuiting the two adjacent first conductive portions 111 through the residual isolation material 310 and the residual electrode material 320, resulting in poor bright line on the display panel, thereby improving the reliability and performance of the display panel.

[0130] Optionally, in the first few etching processes of the light emitting device, a portion of the isolation material layer 300 located in the non-display area 200 needs to be retained, such as Figure 4 As shown, for example, a photoresist can be covered on top for protection during etching, and part of the isolation material layer 300 can be partially hollowed out, thereby reducing the risk of the isolation material layer 300 falling off due to poor adhesion between the large-area isolation material layer 300 and the first insulating layer 2 below, and / or reducing the risk of photoresist exploding when covering the entire surface of the non-display area 200. Figure 2 The cross-section line shows the coverage area of ​​the isolation material layer 300 .

[0131] Optional, see Figure 5 The isolation structure 3 may be in a grid shape, so as to facilitate the division of sub-pixels in the display panel by the isolation structure 3. The hollowed-out area in the grid-shaped isolation structure 3 may be an isolation opening 30.

[0132] Optionally, the display panel includes a light-emitting functional layer 4 , the light-emitting functional layer 4 includes a plurality of light-emitting units 41 , and the light-emitting units 41 are used to realize light-emitting display of the display panel. The light-emitting unit 41 may include a light-emitting layer 411 .

[0133] The isolation structure 3 is arranged on one side of the substrate 1 and encloses an isolation opening 30. The isolation opening 30 can be used to accommodate at least part of the light-emitting unit 41. The isolation structure 3 can be used to divide the sub-pixels of the display panel. The isolation structure 3 is arranged on the substrate 1 and encloses a plurality of isolation openings 30, which can separate the light-emitting functional layer 4 to form mutually disconnected light-emitting units 41, thereby reducing the crosstalk of carriers in the light-emitting functional layer 4, improving the display effect of the display panel, and the light-emitting unit 41 does not need to use a precision mask plate to prepare, which can reduce the development and use of precision masks and reduce the preparation cost.

[0134] The composition, preparation, etc. of the isolation structure 3 (or partition structure or isolation column) are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099 072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, CN117500332A for reference.

[0135] Optionally, the orthographic projection direction of a structure in the present application on the substrate 1 can refer to Figure 3a The Z-axis direction in the figure, and the direction indicated by the Z-axis can also be the thickness direction of the display panel.

[0136] Reference Figure 3a and Figure 4 In some optional embodiments, the first opening 20 includes a first sub-opening 202 and a second sub-opening 203 that are interconnected, the first film layer 211 is provided with the first sub-opening 202, the first sub-opening 202 penetrates the first film layer 211, the second film layer 212 is provided with the second sub-opening 203, the second sub-opening 203 penetrates the second film layer 212, and the second sub-opening 203 is located on a side of the first sub-opening 202 away from the substrate 1; the orthographic projection of the second sub-opening 203 on the substrate 1 is located within the orthographic projection of the first sub-opening 202 on the substrate 1. Optionally, the orthographic projection area of ​​the second sub-opening 203 on the substrate 1 is smaller than the orthographic projection area of ​​the first sub-opening 202 on the substrate 1.

[0137] In these embodiments, the first sub-opening 202 is formed in the first film layer 211 and is disposed through the first film layer 211, and the second sub-opening 203 is formed in the second film layer 212 and is disposed through the second film layer 212. By limiting the orthographic projection of the second sub-opening 203 on the substrate 1 to be located within the orthographic projection of the first sub-opening 202 on the substrate 1, the second film layer 212 can have a portion protruding toward the first opening 20 relative to the first film layer 211, so that the first film layer 211 and the second film layer 212 disposed on the opposite side walls of the adjacent first conductive parts 111 can isolate the insulating material 310, the residual electrode material 320 and other materials at the first opening 20 from the side walls of the first conductive part 111, thereby reducing the risk of short circuit caused by electrical connection between two adjacent first conductive parts 111 through the residual film material etched.

[0138] In some optional embodiments, the first insulating layer 2 further includes a protective layer 213, and the protective layer 213 is disposed between the first conductive layer 11 and the first film layer 211. By providing the protective layer 213, the protective effect of the first insulating layer 2 on the first conductive portion 111 can be further improved, and water vapor, wet etching liquid, etc. can be blocked from invading the first conductive portion 111. Optionally, the first conductive portion 111 includes a first surface facing away from the substrate 1, a second surface facing the substrate 1, and a side wall connecting the first surface and the second surface, and the protective layer 213 can simultaneously cover the side wall of each first conductive portion 111 and at least a portion of the first surface. Optionally, the shape of the first film layer 211 and the second film layer 212 relative to the first conductive portion 111 in the non-display area 200 can be similar to the protective layer 213.

[0139] Optionally, the first opening 20 further includes a third sub-opening 201 communicating with the first sub-opening 202 , and the third sub-opening 201 is formed in the protection layer 213 .

[0140] In these embodiments, the protective layer 213 is also formed with a third sub-opening 201, which further enhances the isolation effect of the bottom cut structure formed by the protective layer 213, the first film layer 211 and the second film layer 212 on the side wall of the first conductive part 111 at the first opening 20 on the residual isolation material 310, the residual electrode material 320 and other film layer materials from the side wall of the first conductive part 111, thereby further reducing the risk of electrical short circuit between adjacent first conductive parts 111 and improving the reliability and performance of the display panel.

[0141] Optionally, the orthographic projection of the third sub-opening 201 on the substrate 1 is located within the orthographic projection of the first sub-opening 202 on the substrate 1. For example, the orthographic projection area of ​​the third sub-opening 201 on the substrate 1 is smaller than the orthographic projection area of ​​the first sub-opening 202 on the substrate 1. Optionally, the protective layer 213 is arranged to protrude relative to the first film layer 211 toward the first opening 20.

[0142] In these embodiments, the projection area of ​​the third sub-opening 201 on the substrate 1 is smaller than the projection area of ​​the first sub-opening 202 on the substrate 1, so that the protective layer 213 can be protruded relative to the first film layer 211 toward the first opening 20, so that the residual electrode material 320 can be better clamped and accommodated, and it can be isolated from other film layer materials, so that the etching residual isolation material 310 and the residual electrode material 320 located at the first opening 20 are less likely to be electrically connected to the first conductive part 111, reducing the risk of short circuit. The width direction in this application refers to the direction from one first conductive part 111 to another adjacent first conductive part 111.

[0143] Optionally, the protective layer 213 is convex or flush with the second film layer 212 toward the first opening 20. When the protective layer 213 is flush with the second film layer 212 toward the first opening 20, the first film layer 211 is concave with the same width relative to the protective layer 213 and the second film layer 212 at the same time, which can simplify the preparation process and form in one step. When the protective layer 213 is convex relative to the second film layer 212 toward the first opening 20, the size of the first insulating layer on the side wall of the first conductive part can be further increased, reducing the risk of the first insulating layer on the side wall of the first conductive part being over-etched, resulting in the exposure of the side wall of the first conductive part.

[0144] Optionally, the material of the first film layer 211 includes an inorganic material, and / or the material of the second film layer 212 includes an inorganic material, and / or the material of the protective layer 213 includes an inorganic material. Inorganic materials have good compactness and water vapor resistance, and have good packaging effects while being thin. By setting the material of the first film layer 211, the second film layer 212 or the protective layer 213 to include an inorganic material, the protective effect of the first insulating layer 2 on the first conductive portion 111 can be increased, thereby improving the reliability of the display panel. Optionally, the inorganic material includes oxygen silicon compounds and nitrogen silicon compounds.

[0145] Optionally, the protective layer 213 and the first film layer 211 are made of different materials. Optionally, the protective layer 213 and the second film layer 212 are made of the same material. Optionally, the first film layer 211 and the second film layer 212 are made of different materials. Optionally, the material of the first film layer 211 includes silicon oxide, the material of the second film layer 212 includes silicon nitride, and the material of the protective layer 213 includes silicon oxide. When etching the three-layer composite structure of silicon oxide, silicon nitride, and silicon oxide stacked in sequence to form the first opening 20, due to differences in material properties, the amount of silicon nitride etched will be greater, so that the silicon oxide concave structure on the upper and lower sides of the silicon nitride can be directly formed through an etching process, thereby simplifying the process.

[0146] Reference Figure 5In some optional embodiments, the isolation structure 3 includes a first sublayer 31 and a second sublayer 32 located on the side of the first sublayer 31 facing away from the substrate 1, and the orthographic projection of the side of the first sublayer 31 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second sublayer 32 on the substrate 1.

[0147] In these optional embodiments, the first sublayer 31 and the second sublayer 32 are stacked in sequence to form an isolation structure 3. The orthographic projection of the side of the first sublayer 31 disposed close to the substrate 1 away from the substrate 1 is located within the orthographic projection of the second sublayer 32 on the substrate 1, that is, the orthographic projection area of ​​the second sublayer 32 is larger than the orthographic projection area of ​​the side of the first sublayer 31 away from the substrate 1. The second sublayer 32 covers the surface of the first sublayer 31 close to the second sublayer 32. At this time, the first sublayer 31 is recessed relative to the second sublayer 32 in the direction away from the isolation opening 30, that is, the second sublayer 32 is protruded from the first sublayer 31 toward the isolation opening 30. When preparing the light-emitting functional layer 4, the light-emitting functional layer 4 has a large drop at the edge of the isolation opening 30, and the first sublayer 31 is recessed relative to the second sublayer 32. The light-emitting functional layer 4 is difficult to connect at the edge of the isolation opening 30, and thus breaks. The light-emitting functional layer 4 breaks to form mutually disconnected light-emitting units 41.

[0148] In some optional embodiments, the display panel further includes a first electrode layer 42 , the first electrode layer 42 includes a first electrode 421 , and the first electrode 421 is disposed between the substrate 1 and the light emitting unit 41 .

[0149] Optionally, the display panel further includes a second electrode layer 43, and the second electrode layer 43 includes a second electrode 431 located on the side of the light-emitting unit 41 away from the substrate 1. One of the first electrode 421 and the second electrode 431 can be used as an anode, and the other can be used as a cathode to drive the light-emitting unit 41 to emit light. In the embodiment of the present application, the first electrode 421 is used as the anode of the display panel, and the second electrode 431 is used as the cathode of the display panel.

[0150] Optionally, the orthographic projection of the first electrode 421 on the substrate 1 at least partially overlaps the orthographic projection of the isolation opening 30 on the substrate 1. By preparing the light-emitting unit 41 and the second electrode 431 in the isolation opening 30, the light-emitting unit 41 can be driven to emit light by the first electrode 421 and the second electrode 431.

[0151] In some optional embodiments, the material of the isolation structure 3 includes a conductive material, and the second electrode 431 is electrically connected to the isolation structure 3. The isolation structure 3 separates the second electrode layer 43 to form mutually spaced second electrodes 431, and the mutually spaced second electrodes 431 are electrically connected through the isolation structure 3 to form a whole-surface electrode, thereby ensuring normal light emission of the light-emitting unit 41.

[0152] Optionally, the material of the first sublayer 31 may include a conductive material, and the second electrode 431 may be connected to the first sublayer 31 , so that the second electrodes 431 of adjacent sub-pixels may be electrically connected through the first sublayer 31 .

[0153] Optionally, when vapor-depositing the light-emitting functional layer 4 and the second electrode layer 43 of the display panel, the second sublayer 32 is capable of shielding at least part of the material used to prepare the light-emitting functional layer 4 and the second electrode layer 43, so as to separate the light-emitting functional layer 4 and the second electrode layer 43 between adjacent sub-pixels, and facilitate the formation of a plurality of light-emitting units 41 that are spaced apart and located within the isolation opening 30, and facilitate the formation of a plurality of second electrodes 431 that are spaced apart and located within the isolation opening 30, so that when vapor-depositing the light-emitting functional layer 4 and the second electrode layer 43 of the display panel, there is no need to set a mask with high precision, for example, when vapor-depositing the light-emitting functional layer 4 and the second electrode layer 43, there is no need to set a high-precision metal mask (Fine Metal Mask, FMM), thereby effectively reducing the production and preparation cost of the display panel.

[0154] Reference Fig. 9 In some optional embodiments, the isolation structure 3 further includes a third sublayer 33 located on the side of the first sublayer 31 facing the substrate 1, and the orthographic projection of the first sublayer 31 on the substrate 1 is located within the orthographic projection of the third sublayer 33 on the substrate 1. For example, the third sublayer 33 is arranged to protrude from the first sublayer 31 toward the isolation opening 30. Optionally, the material of the third sublayer 33 may include a conductive material, and the second electrode 431 may be connected to the third sublayer 33, so that the second electrodes 431 of adjacent sub-pixels can be electrically connected through the third sublayer 33. By arranging the third sublayer 33 to protrude from the first sublayer 31 toward the isolation opening 30, the third sublayer 33 may have a larger size to facilitate connection with the second electrode 431. The film thickness of the third sublayer 33 may be less than the film thickness of the first sublayer 31.

[0155] Optionally, the second sublayer 32 is made of titanium (Ti) or molybdenum (Mo), the first sublayer 31 is made of aluminum (Al), silver (Ag) or copper (Cu), and the third sublayer 33 is made of titanium (Ti) or molybdenum (Mo). For example, the isolation structure 3 is a three-layer metal composite material of Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum). For example, the cross section of the isolation structure 3 perpendicular to the substrate 1 is in an I-shape.

[0156] In some optional embodiments, the first conductive layer 11 includes a second conductive portion 112 located in the display area 100 , and the second conductive portion 112 located in the display area 100 may be disposed in the same layer as the first conductive portion 111 located in the non-display area 200 .

[0157] Optionally, an array layer may be included between the substrate 1 and the light-emitting functional layer 4, and the array layer may include a pixel circuit. The second conductive portion 112 may be a conductive structure in the pixel circuit that is directly or indirectly electrically connected to the first electrode 421. The array layer may also include multiple conductive layers. An insulating layer is provided between adjacent conductive layers. Exemplarily, the pixel circuit provided in the array layer includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source and a drain. The storage capacitor includes a first plate and a second plate.

[0158] In some optional embodiments, the first insulating layer 2 or the display panel includes a pixel definition layer 21, the pixel definition layer 21 includes a first film layer 211 and a second film layer 212, the pixel definition layer 21 encloses a plurality of pixel openings 22 located in the display area 100, and the pixel openings 22 are connected to the isolation openings 30. The pixel definition layer 21 and the first insulating layer 2 may be the same film layer or different film layers.

[0159] In these embodiments, the pixel definition layer 21 is located between the isolation structure 3 and the first electrode layer 42, the first film layer 211 and the second film layer 212 can jointly enclose the upper and lower parts of the pixel opening 22, and the light-emitting unit 41 is at least partially located in the pixel opening 22, for example, the light-emitting unit 41 can also extend into the isolation opening 30 connected to the pixel opening 22. The pixel opening 22 is used to expose at least part of the first electrode 421, so that the light-emitting unit 41 formed in the pixel opening 22 is electrically connected to the first electrode 421.

[0160] Optionally, the second film layer 212 may be disposed to protrude toward the pixel opening 22 relative to the first film layer 211 .

[0161] In some optional embodiments, referring to Fig.11a and Fig.11b The structure of the pixel opening 22 may be similar to that of the first opening 20, and the pixel opening 22 includes a fourth sub-opening 204 and a fifth sub-opening 205 that are connected to each other; the first film layer 211 is provided with a fourth sub-opening 204, and the second film layer 212 is provided with a fifth sub-opening 205, and the fifth sub-opening 205 is located on a side of the fourth sub-opening 204 away from the substrate 1; the orthographic projection of the fifth sub-opening 205 on the substrate 1 is located within the orthographic projection of the fourth sub-opening 204 on the substrate 1; the orthographic projection area of ​​the fifth sub-opening 205 on the substrate 1 is smaller than the orthographic projection area of ​​the fourth sub-opening 204 on the substrate 1.

[0162] Optionally, the display panel also includes a light-emitting layer 411, and a first auxiliary light-emitting layer 412 arranged on the side of the light-emitting functional layer 4 close to the substrate, part of the first auxiliary light-emitting layer 412 is arranged in the pixel opening, the first auxiliary light-emitting layer 412 is separated at the side wall of the pixel opening 22, and the light-emitting layer 411 is continuously arranged at the side wall of the pixel opening 22.

[0163] The light-emitting unit 41 may include a light-emitting layer 411 and a first auxiliary light-emitting layer 412 disposed on a side of the light-emitting layer 411 close to the substrate 1. Optionally, the first auxiliary light-emitting layer 412 may include one or more of a hole injection layer (Hole Inject Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), an electron blocking layer, a hole blocking layer, an electron injection layer (Electron Inject Layer, EIL) and an electron transport layer (Electron Transport Layer, ETL). For example, the first electrode 421 may be an anode, and the first auxiliary light-emitting layer 412 may include one or more of a hole injection layer (Hole Inject Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), and an electron blocking layer. For example, the first electrode 421 may be a cathode, and the first auxiliary light-emitting layer 412 may include one or more of a hole blocking layer, an electron injection layer (Electron Inject Layer, EIL) and an electron transport layer (Electron Transport Layer, ETL). Optionally, the first auxiliary light-emitting layer 412 may include a hole injection layer and / or a hole transport layer.

[0164] In these optional embodiments, at least part of the film layer of the first insulating layer 2 can be used as the pixel definition layer 21, and the fourth sub-opening 204 and the fifth sub-opening 205 formed by the pixel opening 22 can isolate part of the structure of the light-emitting unit 41, and the second film layer 212 is convexly arranged toward the pixel opening 22 relative to the first film layer 211, and at this time, the first film layer 211 is concave relative to the second film layer 212 in the direction away from the pixel opening 22. The first auxiliary light-emitting layer 412 that falls into the pixel opening 22 has a large drop at the edge of the pixel opening 22 due to its thin thickness, and the first film layer 211 is concavely arranged relative to the second film layer 212, and the first auxiliary light-emitting layer 412 is difficult to connect at the edge of the pixel opening 22, so it breaks, so that the first auxiliary light-emitting layer 412 can be broken into multiple parts that are disconnected from each other. For example, the pixel opening 22 can be used to isolate the hole injection layer and / or hole transport layer of the light-emitting unit 41 in the OLED light-emitting device to prevent the hole injection layer and / or hole transport layer in the adjacent isolation opening 30 from being electrically connected through the isolation structure 3, thereby reducing crosstalk between adjacent light-emitting units 41 and improving the reliability of the display panel.

[0165] Optionally, there are multiple ways to set the relative position relationship between the isolation structure 3 and the pixel definition layer 21. For example, the isolation structure 3 can be set on the side of the pixel definition layer 21 facing away from the substrate 1, or a clearance opening is opened on the pixel definition layer 21, and the isolation structure 3 can be located in the clearance opening.

[0166] Combined with reference Figure 3a and Figure 8 In some optional embodiments, the first insulating layer 2 includes a first sub-portion 24 and a second sub-portion 25 connected to each other, the first sub-portion 24 is located on the side of the first conductive portion 111 facing away from the substrate 1, and the second sub-portion 25 is arranged on the side wall opposite to the adjacent first conductive portion 111, and the second sub-portion 25 is provided with a first opening 20.

[0167] Optionally, the first conductive portion 111 includes a first surface facing away from the substrate 1 , a second surface facing the substrate 1 , and a side wall connecting the first surface and the second surface. Optionally, the second sub-portion 25 is disposed on the side wall of the first conductive portion 111 .

[0168] In these embodiments, the first sub-portion 24 covers at least a portion of the first surface of the first conductive portion 111, and the second sub-portion 25 covers the side walls of two adjacent first conductive portions 111. By forming a first opening 20 on the second sub-portion 25, the bottom cut structure in the second sub-portion 25 can be used to isolate residual electrode materials and other film materials from the side walls of the first conductive portion 111, thereby reducing the risk of electrical short circuit between the two adjacent first conductive portions 111 due to etching of residual isolation material 310 and electrode materials, thereby improving the reliability and performance of the display panel.

[0169] Optional, combined with reference Figure 3a and Figure 3b , along the thickness direction Z of the substrate 1, the thickness h of the first insulating layer 2 is greater than or equal to 0.35 microns. Optionally, the first insulating layer 2 arranged between adjacent first conductive portions 111 and on the same side wall of the first conductive portions 111 has a dimension L1 along the arrangement direction of the first conductive portions 111 that is greater than or equal to 2 microns.

[0170] Optional, combined with reference Figure 3a and Figure 3b Along the thickness direction Z of the substrate 1, the thickness h of the first insulating layer 2 is greater than or equal to 0.35 microns and less than or equal to 0.6 microns. Optionally, the first insulating layer 2 arranged between adjacent first conductive portions 111 and on the same side wall of the first conductive portions 111 has a dimension L1 along the arrangement direction of the first conductive portions 111 greater than or equal to 2 microns and less than or equal to 2.5 microns.

[0171] Optional, combined with reference Figure 3a and Figure 3b, along the thickness direction Z of the substrate 1, the thickness h of the second sub-portion 25 is greater than or equal to 0.35 microns, optionally, the thickness of the first sub-portion 24 may be greater than or equal to the thickness h of the second sub-portion 25; the second sub-portion 25 arranged between adjacent first conductive portions 111 and on the same side wall of the first conductive portion 111 has a dimension L1 along the arrangement direction of the first conductive portion 111 that is greater than or equal to 2 microns.

[0172] In these embodiments, by limiting the minimum size of the second sub-portion 25, the second sub-portion 25 can have a relatively sufficient thickness and width to isolate the residual film material and isolate the residual film material from the side wall of the first conductive portion 111; in addition, this embodiment can also reduce the risk of the first insulating layer 2 on the side wall of the first conductive portion 111 being over-etched, resulting in the exposure of the side walls of adjacent first conductive portions 111, and short-circuiting through the residual isolation material 310 and the residual electrode material 320 between adjacent first conductive portions 111. Exemplarily, the thickness h of the second sub-portion 25 can be between 0.35 microns and 0.6 microns, for example, h can be 0.35 microns, 0.4 microns, 0.45 microns, 0.5 microns, 0.55 microns or 0.6 microns; the width L1 of the second sub-portion 25 can be between 2 microns and 2.5 microns, for example, L1 can be 2 microns, 2.1 microns, 2.2 microns, 2.3 microns, 2.4 microns or 2.5 microns.

[0173] Optionally, the first sub-portion 24 is provided with a second opening 210, and the second opening 210 exposes at least a portion of the first conductive portion 111 away from the substrate 1. At least a portion of the first conductive portion 111 away from the substrate 1 is exposed through the second opening 210 to be electrically connected to the flexible circuit board or chip. Optionally, the structure of the second opening 210 can also be arranged similarly to the structure of the first opening 20. For example, the second opening includes a sixth sub-opening and a seventh sub-opening that are connected; the first film layer is provided with a sixth sub-opening, and the second film layer is provided with a seventh sub-opening, and the seventh sub-opening is located on the side of the sixth sub-opening away from the substrate; the orthographic projection of the seventh sub-opening on the substrate is located within the orthographic projection of the sixth sub-opening on the substrate; the orthographic projection area of ​​the seventh sub-opening on the substrate is smaller than the orthographic projection area of ​​the sixth sub-opening on the substrate.

[0174] Optionally, the second sub-portion 25 is located on the side of the first sub-portion 24 facing the substrate 1. In order to facilitate the binding of the first conductive portion 111 located in the non-display area 200, the softer organic material layer between adjacent first conductive portions 111 is removed. When preparing the first insulating layer 2, the first sub-portion 24 is deposited on the first surface of the first conductive portion 111 away from the substrate, and the second sub-portion 25 is recessed downward toward the substrate 1 between the adjacent first conductive portions 111, so that the second sub-portion 25 is located on the side of the first sub-portion 24 facing the substrate 1.

[0175] In some optional embodiments, the display panel further includes a light-emitting device, at least part of which is located in the isolation opening 30, and the light-emitting device includes a first electrode 421, a light-emitting unit 41, and a second electrode 431 which are sequentially stacked along a direction Z away from the substrate 1. For example, the light-emitting device and the isolation opening 30 may be arranged in a one-to-one correspondence. For example, the second electrodes 431 of a plurality of light-emitting devices are electrically connected to the isolation structure 3. For example, the second electrodes 431 of a plurality of light-emitting devices with different luminous colors are electrically connected to the isolation structure 3.

[0176] Optionally, the material of the second electrode 431 may include conductive metals such as silver, gold, and copper. Exemplarily, the second electrode material includes silver. In the process of preparing the display panel, when the first insulating layer on the side wall of the first conductive part is a single-layer film layer with a relatively small thickness, the first insulating layer on the side wall of the first conductive part is easily over-etched by the etching process in the process of forming the light-emitting device, resulting in the exposure of the side wall of the first conductive part. The aluminum in the first conductive part has an adsorption effect on the silver particles of the electrode material forming the second electrode, which can easily cause a short circuit between adjacent first conductive parts through residual electrode material 320 and residual isolation material 310. The undercut structure formed by insulating materials such as the first film layer 211 and the second film layer 212 arranged on the side walls opposite to the adjacent first conductive parts 111 can adsorb and hold the residual electrode material 320 (for example, silver particles), and can isolate the residual electrode material 320 from the side walls of the first conductive parts 111. During the preparation process, the residual first insulating material between the adjacent first conductive parts 111 can isolate the residual electrode material 320 that is stuck by the undercut structure from the residual isolation material 310 located on the side of the residual first insulating material away from the substrate, thereby reducing the risk of short-circuiting between the adjacent first conductive parts 111 through the residual isolation material 310, the residual electrode material 310, etc.

[0177] Optionally, the display panel includes a plurality of light emitting devices with different light emitting colors, and the plurality of light emitting devices with different light emitting colors are located in different isolation openings 30. Fig.10 As shown, the isolation opening 30 includes a first isolation opening 30a, a second isolation opening 30b and a third isolation opening 30c. Exemplarily, the light emitting device may have three colors, namely red, green and blue. The types of the isolation openings 30 correspond to the colors of the light emitting device, and may also be three categories.

[0178] Optionally, the non-display area 200 includes a binding area, and the first conductive portion 111 includes a binding pin located in the binding area. The first conductive portion 111 can be used as a binding pin to be electrically connected to a flexible circuit board or a chip.

[0179] Optionally, the material of the first conductive portion 111 includes a first sub-conductive layer and a second sub-conductive layer stacked in sequence along a thickness direction Z away from the substrate 1, and the activity of the material of the second sub-conductive layer is less than that of the material of the first sub-conductive layer. Exemplarily, the material of the first sub-conductive layer may be aluminum, and the material of the second sub-conductive layer may be titanium. For example, the first sub-conductive layer may be an aluminum layer, and the second sub-conductive layer may be a titanium layer.

[0180] Optionally, the material of the first conductive part 111 includes aluminum.

[0181] Optional, see Fig.12 , the first conductive part 111 includes a titanium layer (Ti), an aluminum layer (Al), and a titanium layer (Ti) stacked along the thickness direction of the substrate 1. The multilayer composite structure of the titanium layer, the aluminum layer, and the titanium layer can improve the self-protection ability of the first conductive part 111 and enhance its conductive effect. In addition, the first conductive part 111 can also be a composite structure of Ti / Al / Ti, Ti / Al / Mo (molybdenum), Mo / Al / Ti, Mo / Al / Mo, MoNb (molybdenum-niobium alloy) / Ti / MoNb, Ti / Al / MoNb, etc. The titanium layer (Ti) has no adsorption effect on silver.

[0182] Optional, combined with reference Figure 2 , Figure 3a and Figure 3b , the interval L2 between adjacent first conductive parts 111 (for example, the distance along the arrangement direction of the first conductive parts 111) can be 8 microns to 10 microns. Since the metal spacing is small, the risk of short circuit is prone to occur. Through the embodiments of the present application, the risk of short circuit can be effectively reduced. Exemplarily, the distance L2 between adjacent first conductive parts 111 can be 8 microns, 8.5 microns, 9 microns, 9.5 microns or 10 microns.

[0183] Optional, see Figure 6 The first insulating layer 2 is formed with a second opening 210, and the second opening 210 exposes at least a portion of the first conductive portion 111 away from the substrate 1. The first conductive portion 111 is exposed through the second opening 210 to be electrically connected to the flexible circuit board or chip.

[0184] Reference Fig. 9In some optional embodiments, the display panel further includes a first encapsulation layer 5, which is located on the side of the light-emitting device away from the substrate. The first encapsulation layer 5 includes a plurality of encapsulation parts 50, which are located on the side of the light-emitting device away from the substrate. The first encapsulation layer 5 includes a plurality of encapsulation parts 50 arranged at intervals. The encapsulation part 50 is located on the side of the second electrode 431 away from the substrate 1. There are multiple light-emitting units 41, and the multiple encapsulation parts 50 can be arranged in a one-to-one correspondence with the multiple light-emitting units 41. The encapsulation parts 50 corresponding to light-emitting devices of different luminous colors are different. Optionally, the material of the first encapsulation layer 5 may include an inorganic material, which has good compactness and water vapor resistance, a thin thickness, and also has a good encapsulation effect. The first encapsulation layer 5 can be prepared by a chemical vapor deposition process (Chemical Vapor Deposition, CVD). For example, the encapsulation part 50 extends through the isolation structure 3 toward the side wall of the isolation opening 30 to the side of the isolation structure 3 away from the substrate 1.

[0185] Reference Fig.10 Optionally, the display panel further includes a second encapsulation layer 6 disposed on the side of the first encapsulation layer 5 away from the substrate 1. Optionally, the display panel further includes a third encapsulation layer 7 disposed on the side of the second encapsulation layer 6 away from the substrate 1. The material of the second encapsulation layer 6 may include an organic material, so that the second encapsulation layer 6 may have good fluidity, so that the surface of the second encapsulation layer 6 on the side away from the substrate 1 is relatively flat. The material of the third encapsulation layer 7 may include an inorganic material to further enhance the encapsulation effect of the display panel. Optionally, the second encapsulation layer 6 may be prepared by inkjet printing (IJP); the third encapsulation layer 7 may be prepared by chemical vapor deposition process.

[0186] Optionally, the display panel further includes a touch layer, a polarizing layer and a cover plate disposed on the third encapsulation layer 7. The touch layer can be used to realize the touch operation of the display panel, the polarizing layer can be used to filter light to improve the display effect of the display panel, and the cover plate can be used to protect the underlying film layer to improve the strength of the display panel.

[0187] Please refer to Figures 1 to 10The first aspect of the present application also provides a display panel, which includes a substrate 1, a first conductive layer 11, a first insulating layer 2 and an isolation structure 3; the first conductive layer 11 is arranged on the substrate 1, and the first conductive layer 11 includes a plurality of first conductive parts 111, and the plurality of first conductive parts 111 are arranged at intervals; at least part of the first insulating layer 2 is arranged on the side walls opposite to the adjacent first conductive parts 111, and the first insulating layer 2 includes a first film layer 211 and a second film layer 212 arranged on the side of the first film layer 211 away from the substrate 1; the isolation structure 3 is arranged on the substrate 1 and encloses a plurality of isolation openings 30; wherein, between at least two adjacent first conductive parts 111, the first insulating layer is provided with a first opening 20, and along the thickness direction Z of the substrate 1, the thickness of the first insulating layer 2 is greater than or equal to 0.35 microns; the first insulating layer 2 arranged between the adjacent first conductive parts 111 and on the same side wall of the first conductive part 111 has a size greater than or equal to 2 microns along the arrangement direction of the first conductive part 111. The first insulating layer 2 may be a relatively thick single-layer film, or the first insulating layer 2 may include multiple film layers.

[0188] In a display panel provided in an embodiment of the present application, the display panel includes a substrate 1, a first conductive layer 11, a first insulating layer 2 and an isolation structure 3, such as Figure 3b As shown, along the thickness direction Z of the substrate 1, the thickness H of the first insulating layer 2 is greater than or equal to 0.35 microns; the dimension L1 of the first insulating layer 2 disposed between adjacent first conductive parts 111 and disposed on the same side wall of the first conductive part 111 along the arrangement direction of the first conductive part 111 is greater than or equal to 2 microns. By limiting the minimum thickness and width of the first insulating layer 2, the first insulating layer 2 can have a relatively sufficient thickness and width to protect the side wall of the first conductive part 111, and can accommodate or even isolate part of the residual film material in the first opening 20, thereby improving the reliability and performance of the display panel. In addition, this embodiment can also reduce the risk of the first insulating layer 2 on the side wall of the first conductive part 111 being over-etched, resulting in the exposure of the side wall of the adjacent first conductive part 111, and the risk of short-circuiting through the residual isolation material 310, the residual electrode material 320, etc. between the adjacent first conductive parts 111.

[0189] Exemplarily, the thickness H of the first insulating layer 2 can be between 0.35 microns and 0.6 microns, for example, h can be 0.35 microns, 0.4 microns, 0.45 microns, 0.5 microns, 0.55 microns or 0.6 microns; the width L1 of the second sub-portion 25 can be between 2 microns and 2.5 microns, for example, L1 can be 2 microns, 2.1 microns, 2.2 microns, 2.3 microns, 2.4 microns or 2.5 microns.

[0190] This embodiment can be combined with some or all of the features of the above embodiments, which will not be described in detail here.

[0191] Please also read Figures 1 to 10 ,as well as Fig.11a and Fig.11b The first aspect of the present application also provides a display panel, which includes a substrate 1, a pixel definition layer 21 and an isolation structure 3; the pixel definition layer 21 includes a first film layer 211 and a second film layer 212 arranged on the side of the first film layer 211 away from the substrate 1; the pixel definition layer 21 encloses a plurality of pixel openings 22, and the pixel openings 22 include a fourth sub-opening 204 and a fifth sub-opening 205 that are connected; the first film layer 211 is provided with a fourth sub-opening 204, and the second film layer 212 is provided with a fifth sub-opening 205, and the fifth sub-opening 205 is located on the side of the fourth sub-opening 204 away from the substrate 1; the orthographic projection of the fifth sub-opening 205 on the substrate 1 is located within the orthographic projection of the fourth sub-opening 204 on the substrate 1; the orthographic projection area of ​​the fifth sub-opening 205 on the substrate 1 is smaller than the orthographic projection area of ​​the fourth sub-opening 204 on the substrate 1; the isolation structure 3 is arranged on the substrate 1 and encloses a plurality of isolation openings 30; the pixel openings 22 are connected to the corresponding isolation openings 30.

[0192] In a display panel provided in an embodiment of the present application, the display panel includes a substrate 1, a first conductive layer 11, a first insulating layer 2 and an isolation structure 3. The fourth sub-opening 204 and the fifth sub-opening 205 formed by the pixel opening 22 can isolate part of the structure of the light-emitting unit 41, such as the hole injection layer and / or the hole transport layer. The second film layer 212 is convexly arranged toward the pixel opening 22 relative to the first film layer 211, and the first film layer 211 is concave relative to the second film layer 212 in a direction away from the pixel opening 22. The hole injection layer and / or the hole transport layer falling into the pixel opening 22 have a relatively thin thickness, and a large drop will be generated at the edge of the pixel opening 22. The first film layer 211 is concavely arranged relative to the second film layer 212, and the hole injection layer and / or the hole transport layer are difficult to connect at the edge of the pixel opening 22, so that they are broken, so that the hole injection layer and / or the hole transport layer can be broken to form multiple parts disconnected from each other. The pixel opening 22 can be used to isolate the hole injection layer and / or hole transport layer of the light-emitting unit 41 in the OLED light-emitting device to prevent the hole injection layer and / or hole transport layer in the adjacent isolation opening 30 from being electrically connected through the isolation structure 3, thereby reducing crosstalk between adjacent light-emitting units 41 and improving the reliability of the display panel.

[0193] This embodiment can be combined with some or all of the features of the above embodiments, which will not be described in detail here.

[0194] Optionally, a display panel provided in an embodiment of the first aspect of the present application may be the display panel in any of the aforementioned embodiments. Therefore, a display panel provided in an embodiment of the present application may have the beneficial effects of the display panel in any of the aforementioned embodiments, and the present application will not elaborate on it.

[0195] Please also read Figures 1 to 13 , Fig.13 It is a flow chart of a method for preparing a display panel provided in an embodiment of the present application.

[0196] like Fig.13 As shown, an embodiment of the second aspect of the present application provides a method for preparing a display panel, comprising:

[0197] S10, preparing a first conductive layer on a substrate, wherein the first conductive layer includes a plurality of first conductive portions arranged at intervals.

[0198] S20, forming a first insulating material layer on a side of the first conductive layer away from the substrate, wherein the first insulating material layer includes a first film layer and a second film layer disposed on a side of the first film layer away from the substrate.

[0199] S30, forming an isolation material layer.

[0200] S40, patterning the first insulating material layer to form a first opening, wherein the first opening is located between adjacent first conductive portions, and at least a portion of the first insulating material layer is disposed on opposite side walls of adjacent first conductive portions.

[0201] The second film layer is arranged to protrude relative to the first film layer toward the first opening.

[0202] Optionally, the display panel has a display area and a non-display area. The display panel has a display area and a non-display area located at least on one side of the display area. The first opening may be formed in the non-display area, and the undercut structure formed by the second film layer protruding toward the first opening relative to the first film layer may isolate the side wall of the first conductive portion from a portion of the film layer material formed at the first opening. For example, Fig.11a and Fig.11b As shown, in the display area, at least a portion of the film layer of the first insulating material layer can be formed as a pixel definition layer, and the structure of the pixel opening is similar to the structure of the first opening or can be prepared and formed together. The pixel opening can be used to isolate the first auxiliary light-emitting layer such as the hole injection layer and / or the hole transport layer of the light-emitting unit in the OLED light-emitting device to prevent the first auxiliary light-emitting layer such as the hole injection layer and / or the hole transport layer in adjacent isolation openings from being electrically connected through the isolation structure, thereby reducing crosstalk between adjacent light-emitting units and improving the reliability of the display panel.

[0203] like Figure 3aAs shown, when the first opening is formed in the non-display area, the first conductive portion can be used as a pad pin (or binding pin), and the first insulating layer can be used as a covering protection layer for the pad pin.

[0204] In the embodiment of the present application, the second film layer is convexly arranged relative to the first film layer toward the first opening, and at this time, the first film layer is concave relative to the second film layer in the direction away from the first opening. After the first opening is formed, the electrode material in the light-emitting device prepared later can be stuck in the recessed position of the undercut structure formed at the first opening due to the residual electrode material (such as silver particles) left over and / or adsorbed due to etching during etching, so that the position of the residual electrode material is fixed and isolated in the first opening by the undercut structure. Reduce the risk of the residual electrode material being electrically connected to the adjacent first conductive part through itself or through other residual conductive film layers, resulting in a short circuit between the two first conductive parts. Between the adjacent first conductive parts, there may also be residual isolation material and the first insulating material under the isolation material at the first opening. The residual first insulating material can further isolate the residual electrode material stuck by the undercut structure, etc., and reduce the situation where the residual electrode material is electrically connected to the residual isolation material located on the side of the residual first insulating material away from the substrate, thereby reducing the risk of short circuit connection between adjacent first conductive parts through residual isolation material, electrode material, etc., and improving the reliability and performance of the display panel.

[0205] Fig.14 is a flow chart of another method for preparing a display panel provided in an embodiment of the present application, Fig.15 It is a structural flow chart of a display panel preparation provided in an embodiment of the present application.

[0206] In some embodiments, before forming the first opening, the preparation method further includes:

[0207] The isolation material layer is patterned to expose a portion of the first insulating material layer. The patterning process includes an etching process such as dry etching and / or wet etching.

[0208] During preparation, the isolation material layer entirely covers the first insulating layer. The isolation material layer is first etched to expose the first insulating material layer, so as to facilitate subsequent patterning of the first insulating material layer.

[0209] Optionally, the substrate includes a first region and a second region, and the isolation material layer is patterned to form at least a portion of the isolation opening, and at the same time, a third opening is formed in the second region, and the third opening exposes at least a portion of the first insulating material layer; the isolation opening is located in the first region. The simultaneous preparation does not increase the process steps, and the process is simplified.

[0210] Preparation is performed on the first area of ​​the substrate to form a display area of ​​the display panel, and preparation is performed on the second area to form a non-display area of ​​the display panel. The first conductive portion is used to electrically connect with other signal lines, for example, the signal lines include power supply voltage signal lines, data voltage signal lines, etc., or the first conductive portion is used as a pin to electrically connect with the integrated circuit of the flexible circuit board or chip.

[0211] Optional, such as Fig.15 As shown, the isolation openings include a first isolation opening 30a, at least one of a second isolation opening 30b, and a third isolation opening 30c. Fig.14 and Fig.15 , step S30 comprises:

[0212] The isolation material layer is patterned to form at least one of a first isolation opening and a second isolation opening located in the first region and a third opening located in the second region.

[0213] The orthographic projections of the first number of first conductive parts on the substrate are located within the orthographic projection of the third opening on the substrate, and the orthographic projections of the second number of first conductive parts on the substrate are located outside the orthographic projection of the third opening on the substrate.

[0214] The isolation opening can be prepared in two processes. In the first isolation opening preparation process, the first isolation opening and the second isolation opening located in the first area are prepared simultaneously. Fig.15 For the sake of simplicity in description, only one of the first isolation opening and the second isolation opening is drawn as a schematic diagram. At the same time, in this process, the isolation material layer can be partially hollowed out in the second area to form a third opening, which can simplify the process and does not increase the process steps. The third opening can expose the first insulating material layer on multiple first conductive parts, and the multiple first openings formed by etching the first insulating material layer can be connected to the third opening. The first isolation opening and the second isolation opening can also be prepared in batches. The preparation of the first isolation opening is before or after the preparation of the second isolation opening.

[0215] Partially hollowing out part of the isolation material layer in the non-display area can reduce the risk of the isolation material layer falling off due to poor adhesion between the large-area isolation material layer and the first insulating layer below, or can also reduce the risk of photoresist exploding when the entire non-display area is covered. Figure 2 The cross-hatching shows the coverage area of ​​the isolation material layer.

[0216] Step S40 includes:

[0217] The first insulating material layer is patterned to form a first pixel opening, at least one of a second pixel opening and a first opening, the first pixel opening is connected to the first isolation opening, the second pixel opening is connected to the second isolation opening, and the first opening is connected to the third opening.

[0218] After preparing the partial isolation opening, a first pixel opening corresponding to the first isolation opening is opened, and a second pixel opening corresponding to the second isolation opening is opened, so as to prepare the light-emitting unit later. At the same time, in this process, the exposed portion of the first insulating material layer can be etched in the second area to form the first opening, which can simplify the process and does not increase the process steps. The display panel structure formed after step S40 can refer to Figure 7 .

[0219] After step S40, the preparation method further includes:

[0220] S50, forming a first preparation material layer, and patterning the first preparation material layer to form a light-emitting unit of the first light-emitting device located in the first isolation opening, a second electrode, and a first packaging portion located on a side of the first light-emitting device away from the substrate.

[0221] The formed first preparation material layer may cover the first opening, and when the first preparation material layer is patterned, the first preparation material layer at the first opening will be etched. The patterning of the first preparation material layer may include dry etching and wet etching.

[0222] And / or, S60, forming a second preparation material layer, patterning the second preparation material layer to form a light-emitting unit of a second light-emitting device located in the second isolation opening, a second electrode, and a second packaging portion located on a side of the second light-emitting device away from the substrate.

[0223] The formed second preparation material layer may cover the first opening, and when the second preparation material layer is patterned, the second preparation material layer at the first opening will be etched. The patterning of the second preparation material layer may include dry etching and wet etching.

[0224] Step S50 may be performed before or after step S60. Optionally, step S50 may be performed after forming the first isolation opening. Optionally, step S60 may be performed after forming the second isolation opening. Forming the first isolation opening may be performed before or after forming the second isolation opening, or the first isolation opening and the second isolation opening may be formed simultaneously.

[0225] S70, patterning the isolation material layer having the first isolation opening and / or the second isolation opening to form a third isolation opening located in the first area, and patterning the first insulating material layer to form a third pixel opening and a second opening, the third pixel opening is connected to the third isolation opening, and the second opening exposes at least a portion of the first conductive portion away from the side of the substrate.

[0226] Step S70 may be after step S50 and / or step S60.

[0227] The structure of the second opening can be referred to Figure 6 shown.

[0228] The third pixel opening and the third isolation opening are used to accommodate part of the third light-emitting device. At the same time, in the process of patterning the first insulating material layer to form the third pixel opening, at least part of the first insulating material layer above the first conductive part can be etched in the second region to form a second opening, so as to expose the first conductive part 111 through the second opening 210 for electrical connection with the flexible circuit board or chip. The orthographic projections of a part of the second openings 210 on the substrate can be located within the orthographic projections of the third openings on the substrate, so as to expose at least part of the first conductive part 111 in the third openings away from the substrate; the orthographic projections of a part of the second openings 210 on the substrate can be located outside the orthographic projections of the third openings on the substrate, so as to expose at least part of the first conductive part 111 outside the third openings away from the substrate.

[0229] S80, forming a third preparation material layer, and patterning the third preparation material layer to form a light-emitting unit of a third light-emitting device located in a third isolation opening, a second electrode, and a third packaging portion located on a side of the third light-emitting device away from the substrate.

[0230] The formed third preparation material layer may cover the first opening, and when the third preparation material layer is patterned, the third preparation material layer at the first opening will be etched. The patterning of the third preparation material layer may include dry etching and wet etching.

[0231] Optionally, in step S30, since the isolation material layer has a height difference above the first conductive portion and between two adjacent first conductive portions, during local etching, the photoresist on the isolation material layer at a lower position is likely to remain due to insufficient exposure, resulting in incomplete etching of the isolation material layer at that position, thereby resulting in a thin layer of isolation material layer remaining. That is, the residual isolation material is formed when the isolation material layer is etched by patterning to form the third opening.

[0232] In these embodiments, the isolation material layer extends to the second region to cover and protect the first insulating material layer above at least part of the first conductive part. At the same time, there are also positions where the isolation material layer is not covered, especially at the boundary position of the isolation material layer, where the isolation material layer is prone to residue. In the preparation process of the three-channel light-emitting device, the etching residue of the conductive material of the second electrode in the preparation material layer may be adsorbed into the first opening. The bottom cut structure formed by the first film layer and the second film layer arranged on the side walls opposite to the adjacent first conductive parts can isolate the residual isolation material, electrode material, etc. between the adjacent first conductive parts from the side walls of the first conductive parts after preparing some light-emitting devices, thereby reducing the risk of short circuit caused by electrical connection between two adjacent first conductive parts through residual isolation material, electrode material, etc., thereby improving the reliability and performance of the display panel.

[0233] Optionally, the material of the second electrode 431 may include conductive metals such as silver, gold, copper, etc. Exemplarily, the conductive material in the second electrode includes silver (Ag).

[0234] Optionally, in step S70, the step of patterning the isolation material layer having the first isolation opening and / or the second isolation opening to form a third isolation opening located in the first region further includes:

[0235] The isolation material layer having the first isolation opening and / or the second isolation opening is patterned to form a third isolation opening located in the first region, and the isolation material layer located in the second region is removed. The display panel structure formed after step S70 can refer to Figure 6 .

[0236] In this embodiment, when the first preparation material layer or the second preparation material layer is patterned, the isolation material layer located in the non-display area and covering the first conductive part can be retained to improve the protection effect of the first conductive part in the non-display area. In the process of preparing the third isolation opening, the isolation material layer located in the second area can be removed simultaneously (and the isolation material remaining in the first opening can also be removed simultaneously, and then when the first insulating material layer is patterned to form the third pixel opening and the second opening, the first insulating material remaining in the first opening can also be removed simultaneously). Figure 6 As shown, this part of the isolation material layer can be used as a sacrificial layer to protect the first insulating layer and the first conductive part below during the first two etching steps of the preparation material layer. In this process, it is removed simultaneously, so that the isolation material layer can play a certain protective role without adding an additional etching removal process, simplifying the process and improving efficiency.

[0237] Optionally, after forming a light-emitting unit, a second electrode, and a first packaging portion located on a side of the first light-emitting device away from the substrate located at the first isolation opening; and / or after forming a light-emitting unit, a second electrode, and a second packaging portion located on a side of the second light-emitting device away from the substrate located at the second isolation opening, and before forming a third isolation opening located in the first area, a lighting test is performed on the first light-emitting device and / or the second light-emitting device.

[0238] In these optional embodiments, during the lighting test, the steps of etching the third isolation opening and the third pixel opening have not yet been performed, and residual isolation material and first insulating material may still remain at the first opening. Since the embodiment of the present application forms an undercut structure at the first opening, the residual electrode material can be adsorbed and clamped, so that the position of this part of the residual electrode material is fixed and isolated in the first opening by the undercut structure. Therefore, the residual isolation material, residual electrode material, etc. between adjacent first conductive parts can be isolated from the side walls of the first conductive parts, thereby reducing the risk of short circuit caused by electrical connection between two adjacent first conductive parts through residual isolation material, electrode material, etc., thereby improving the reliability and performance of the display panel.

[0239] In some embodiments, before forming the first opening, the preparation method includes: patterning the isolation material layer to expose a portion of the first insulating material layer.

[0240] Optionally, the isolation material layer is patterned to expose a portion of the first insulating material layer, and at least a portion of the isolation opening is formed in the isolation material layer before or at the same time.

[0241] Optionally, after forming the first opening, the preparation method further includes:

[0242] A preparation material layer is formed, and the preparation material layer is patterned to form a light-emitting unit of the light-emitting device located in at least a portion of the isolation openings, a second electrode, and a packaging portion located on a side of the light-emitting device away from the substrate.

[0243] Optionally, after step 10 and before step S20, the preparation method includes:

[0244] A first electrode layer is prepared on the substrate, wherein the first electrode layer includes a first electrode.

[0245] Step S40 includes:

[0246] The first insulating material layer is patterned to form at least a portion of a pixel opening and a first opening, wherein the pixel opening exposes at least a portion of the first electrode.

[0247] In these embodiments, the first insulating material layer can separate the first electrode from the isolation material layer, and the first electrode can serve as the anode of the light-emitting unit. After each isolation opening is opened, the pixel definition material layer is patterned to form a corresponding pixel opening to expose at least a portion of the first electrode, so as to facilitate the subsequent preparation of the light-emitting material and the overlap with the first electrode.

[0248] In some embodiments, the first insulating material layer further includes a protective layer, and the protective layer is disposed between the first conductive layer and the first film layer; step S40 includes:

[0249] The first insulating material layer is patterned to form a first sub-opening, a second sub-opening and a third sub-opening that are interconnected, the first sub-opening passes through the first film layer, the second sub-opening passes through the second film layer, the third sub-opening is formed in the protective layer, and the orthographic projection of the second sub-opening on the substrate is located within the orthographic projection of the first sub-opening on the substrate.

[0250] In these embodiments, by providing a protective layer, the protective effect of the first insulating layer on the first conductive part can be further improved, and water vapor, wet etching liquid, etc. can be blocked from invading the first conductive part. The first sub-opening is formed in the first film layer and is arranged through the first film layer, and the second sub-opening is formed in the second film layer and is arranged through the second film layer. On the one hand, by limiting the orthographic projection of the second sub-opening on the substrate to be located within the orthographic projection of the first sub-opening on the substrate, the second film layer can have a portion protruding toward the first opening relative to the first film layer, thereby isolating the insulating material, electrode material and other film layer materials remaining after etching at the first opening from the side wall of the first conductive part, which can reduce the risk of short circuit caused by electrical connection between two adjacent first conductive parts through the insulating material, electrode material and other film layer materials remaining after etching. On the other hand, the protective layer is also formed with a third sub-opening, so that the relative position of the isolation material layer remaining at the first opening is lower, further enhancing the isolation effect of the bottom cut structure formed by the protective layer, the first film layer and the second film layer arranged on the side walls opposite to the adjacent first conductive parts at the first opening on the isolation material, electrode material and other film layer materials remaining after etching from the side walls of the first conductive part, thereby further reducing the risk of electrical short circuit of adjacent first conductive parts and improving the reliability and performance of the display panel.

[0251] Optionally, the material of the first film layer includes an inorganic material, and / or the material of the second film layer includes an inorganic material, and / or the material of the protective layer includes an inorganic material. Inorganic materials have good compactness and water vapor resistance, and have good packaging effects while being thin. Optionally, the inorganic material includes oxygen silicon compounds and nitrogen silicon compounds.

[0252] Optionally, the material of the first film layer includes silicon oxide, the material of the second film layer includes silicon nitride, and the material of the protective layer includes silicon oxide.

[0253] Optionally, the material of the first film layer includes silicon oxide, the material of the second film layer includes silicon nitride, and the material of the protective layer includes silicon oxide. When etching the three-layer composite structure of silicon oxide, silicon nitride, and silicon oxide stacked in sequence to form the first opening, due to differences in material properties, the etching amount of silicon nitride will be greater, so that the silicon oxide concave structure on the upper and lower sides of the silicon nitride can be directly formed through one etching process, simplifying the process.

[0254] Optionally, the protective layer is arranged to protrude relative to the first film layer toward the first opening. This embodiment can increase the size of the first insulating layer on the side wall of the first conductive part, reduce the risk of the first insulating layer on the side wall of the first conductive part being over-etched, and cause the side wall of the first conductive part to be exposed, and can make it more difficult for the residual isolation material, electrode material, etc. to be electrically connected to the first conductive part, reducing the risk of short circuit.

[0255] Optionally, the protective layer is convex or flush with the second film layer toward the first opening. When the protective layer is flush with the second film layer toward the first opening, the first film layer is concave with the same width relative to the protective layer and the second film layer, which can simplify the preparation process and form in one step. When the protective layer is convex relative to the second film layer toward the first opening, the size of the first insulating layer on the side wall of the first conductive part can be further increased, reducing the risk of the first insulating layer on the side wall of the first conductive part being over-etched, resulting in the exposure of the side wall of the first conductive part.

[0256] The embodiment of the third aspect of the present application provides a display device, which includes a binding element and a display panel of any embodiment of the first aspect, wherein the binding element is electrically connected to the first conductive portion; the binding element includes a chip and / or a flexible circuit board. Since the display device provided by the embodiment of the third aspect of the present application includes the display panel provided by any embodiment of the first aspect, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel of any embodiment of the first aspect, which will not be described in detail here.

[0257] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0258] According to the embodiments described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; A first conductive layer is disposed on the substrate, wherein the first conductive layer comprises a plurality of first conductive portions, and the plurality of first conductive portions are disposed at intervals; a first insulating layer, at least a portion of which is disposed on a side wall opposite to the adjacent first conductive portion, the first insulating layer comprising a first film layer and a second film layer disposed on a side of the first film layer away from the substrate; An isolation structure is disposed on the substrate and encloses a plurality of isolation openings; Wherein, between at least two adjacent first conductive parts, the first insulating layer is provided with a first opening, and the second film layer is provided to protrude relative to the first film layer toward the first opening.

2. The display panel according to claim 1, characterized in that: The first opening includes a first sub-opening and a second sub-opening that are connected; the first film layer is provided with the first sub-opening, the second film layer is provided with the second sub-opening, and the second sub-opening is located on a side of the first sub-opening away from the substrate; the orthographic projection of the second sub-opening on the substrate is located within the orthographic projection of the first sub-opening on the substrate; Preferably, an orthographic projection area of ​​the second sub-opening on the substrate is smaller than an orthographic projection area of ​​the first sub-opening on the substrate.

3. The display panel according to claim 2, characterized in that: The first insulating layer further comprises a protective layer, and the protective layer is arranged between the first conductive layer and the first film layer; Preferably, the first opening further includes a third sub-opening connected to the first sub-opening, and the protective layer is provided with the third sub-opening; Preferably, the orthographic projection of the third sub-opening on the substrate is located within the orthographic projection of the first sub-opening on the substrate; Preferably, the protective layer is arranged to protrude relative to the first film layer toward the first opening; Preferably, the protective layer is protruding or flush with the second film layer toward the first opening; Preferably, the material of the protective layer includes an inorganic material; Preferably, the inorganic material includes silicon oxide compounds and silicon nitrogen compounds; Preferably, the material of the protective layer includes silicon oxide; Preferably, the protective layer and the first film layer are made of different materials; Preferably, the protective layer and the second film layer are made of the same material.

4. The display panel according to claim 2, characterized in that: The first film layer and the second film layer are made of different materials, the first film layer comprises an inorganic material, and / or the second film layer comprises an inorganic material; Preferably, the inorganic material includes silicon oxide compounds and silicon nitrogen compounds; Preferably, the material of the first film layer includes silicon oxide, and the material of the second film layer includes silicon nitride.

5. The display panel according to claim 1, characterized in that: The first insulating layer includes a pixel definition layer, the pixel definition layer includes the first film layer and the second film layer, the pixel definition layer encloses a plurality of pixel openings, and the pixel openings are connected to the corresponding isolation openings; Preferably, the pixel opening includes a fourth sub-opening and a fifth sub-opening that are connected; the first film layer is provided with the fourth sub-opening, the second film layer is provided with the fifth sub-opening, and the fifth sub-opening is located on a side of the fourth sub-opening away from the substrate; the orthographic projection of the fifth sub-opening on the substrate is located within the orthographic projection of the fourth sub-opening on the substrate; The orthographic projection area of ​​the fifth sub-opening on the substrate is smaller than the orthographic projection area of ​​the fourth sub-opening on the substrate; Preferably, the display panel further comprises a light-emitting layer, and a first auxiliary light-emitting layer arranged on a side of the light-emitting layer close to the substrate, a portion of the first auxiliary light-emitting layer is arranged in the pixel opening, the first auxiliary light-emitting layer is cut off at a side wall of the pixel opening, and the light-emitting layer is continuously arranged at the side wall of the pixel opening; Preferably, the first auxiliary light-emitting layer includes one or more of a hole injection layer, a hole transport layer, an electron blocking layer, an electron injection layer, an electron transport layer, and a hole blocking layer; Preferably, the isolation structure is located on a side of the pixel definition layer facing away from the substrate, or a clearance opening is provided on the pixel definition layer, and the isolation structure is located in the clearance opening.

6. The display panel according to claim 1, characterized in that: The first insulating layer comprises a first sub-portion and a second sub-portion connected to each other, the first sub-portion is located at a side of the first conductive portion away from the substrate, the second sub-portion is arranged on a side wall opposite to the adjacent first conductive portion, and the second sub-portion is provided with the first opening; Preferably, the first sub-portion is provided with a second opening, and the second opening exposes at least a portion of the first conductive portion on a side away from the substrate; Preferably, along the thickness direction of the substrate, the thickness of the first insulating layer is greater than or equal to 0.35 microns; the dimension of the first insulating layer disposed between adjacent first conductive portions and disposed on the same side wall of the first conductive portions along the arrangement direction of the first conductive portions is greater than or equal to 2 microns; Preferably, along the thickness direction of the substrate, the thickness of the second sub-portion is greater than or equal to 0.35 microns; the size of the second sub-portion disposed between adjacent first conductive portions and disposed on the same side wall of the first conductive portion along the arrangement direction of the first conductive portions is greater than or equal to 2 microns; Preferably, along the thickness direction of the substrate, the thickness of the first insulating layer is greater than or equal to 0.35 micrometers and less than or equal to 0.6 micrometers; the size of the first insulating layer disposed between adjacent first conductive portions and disposed on the same side wall of the first conductive portions along the arrangement direction of the first conductive portions is greater than or equal to 2 micrometers and less than or equal to 2.5 micrometers; Preferably, along the thickness direction of the substrate, the thickness of the second sub-portion is greater than or equal to 0.35 microns and less than or equal to 0.6 microns; the second sub-portion arranged between adjacent first conductive portions and on the same side wall of the first conductive portion has a size greater than or equal to 2 microns and less than or equal to 2.5 microns along the arrangement direction of the first conductive portion.

7. The display panel according to claim 1, characterized in that: Also included is a first electrode layer disposed between the first insulating layer and the first conductive layer, the first electrode layer includes a first electrode, and an orthographic projection of the first electrode on the substrate at least partially overlaps with an orthographic projection of the isolation opening on the substrate; Preferably, the display panel further comprises a plurality of light emitting units located on a side of the first electrode layer away from the substrate, and the light emitting units are arranged corresponding to the isolation openings; Preferably, the display panel further comprises a second electrode layer located on a side of the light-emitting unit away from the substrate, and the second electrode layer comprises a second electrode disposed in the isolation opening; Preferably, the isolation structure comprises a conductive material, and the second electrode is electrically connected to the isolation structure.

8. The display panel according to claim 1, characterized in that: The isolation structure includes a first sublayer and a second sublayer located on a side of the first sublayer away from the substrate, wherein an orthographic projection of the side of the first sublayer away from the substrate on the substrate is located within an orthographic projection of the second sublayer on the substrate; Preferably, the end of the second sub-layer facing the isolation opening protrudes beyond the end of the first sub-layer facing the isolation opening; Preferably, the isolation structure further comprises a third sublayer located on a side of the first sublayer facing the substrate, and an orthographic projection of the first sublayer on the substrate is located within an orthographic projection of the third sublayer on the substrate.

9. The display panel according to claim 1, characterized in that: It also includes a light emitting device and a first encapsulation layer located on a side of the light emitting device away from the substrate, wherein at least a portion of the light emitting device is located in the isolation opening, and the first encapsulation layer includes an encapsulation portion located on a side of the light emitting device away from the substrate; Preferably, there are multiple packaging parts, and the light-emitting devices with different luminous colors correspond to different packaging parts; Preferably, the display panel further comprises a second encapsulation layer arranged on a side of the first encapsulation layer away from the substrate; Preferably, the material of the first encapsulation layer includes an inorganic material, and / or the material of the second encapsulation layer includes an organic material; Preferably, the display panel further comprises a third encapsulation layer disposed on a side of the second encapsulation layer away from the substrate; Preferably, the material of the third encapsulation layer includes inorganic material.

10. The display panel according to claim 1, characterized in that: Also included is a light emitting device, at least a portion of which is located in the isolation opening, and the light emitting device includes a first electrode, a light emitting unit, and a second electrode which are sequentially stacked in a direction away from the substrate; Preferably, the material of the second electrode includes silver; Preferably, the display panel includes a plurality of light-emitting devices with different light-emitting colors, and the plurality of light-emitting devices with different light-emitting colors are located in different isolation openings; preferably, the display panel has a display area and a non-display area, and the first conductive portion is located in the non-display area; at least part of the isolation openings is located in the display area; Preferably, the non-display area includes a binding area, and the first conductive portion includes a binding pin located in the binding area; And / or, the material of the first conductive part includes a first sub-conductive layer and a second sub-conductive layer stacked in sequence along a thickness direction away from the substrate, and the activity of the material of the second sub-conductive layer is lower than that of the material of the first sub-conductive layer; And / or, the material of the first conductive part includes aluminum; And / or, the first conductive portion includes a titanium layer, an aluminum layer, and a titanium layer stacked along the thickness direction of the substrate; and / or, the interval between adjacent first conductive parts is 8 micrometers to 10 micrometers; Preferably, the first insulating layer is provided with a second opening, and the second opening exposes at least a portion of the first conductive portion on a side away from the substrate.

11. A display panel, characterized in that: The display panel comprises: substrate; A first conductive layer is disposed on the substrate, wherein the first conductive layer comprises a plurality of first conductive portions, and the plurality of first conductive portions are disposed at intervals; a first insulating layer, wherein at least a portion of the first insulating layer is disposed on side walls opposite to adjacent first conductive portions; An isolation structure is disposed on the substrate and encloses a plurality of isolation openings; Among them, the first insulating layer is provided with a first opening between at least two adjacent first conductive parts, and the thickness of the first insulating layer is greater than or equal to 0.35 microns along the thickness direction of the substrate; the first insulating layer arranged between adjacent first conductive parts and on the same side wall of the first conductive parts has a size greater than or equal to 2 microns along the arrangement direction of the first conductive parts.

12. A display panel, characterized in that: The display panel comprises: substrate; A pixel definition layer, comprising a first film layer and a second film layer arranged on a side of the first film layer away from the substrate; the pixel definition layer encloses a plurality of pixel openings, the pixel openings comprising a fourth sub-opening and a fifth sub-opening that are connected; the first film layer is provided with the fourth sub-opening, the second film layer is provided with the fifth sub-opening, the fifth sub-opening is located on a side of the fourth sub-opening away from the substrate; the orthographic projection of the fifth sub-opening on the substrate is located within the orthographic projection of the fourth sub-opening on the substrate; the orthographic projection area of ​​the fifth sub-opening on the substrate is smaller than the orthographic projection area of ​​the fourth sub-opening on the substrate; The isolation structure is arranged on the substrate and encloses a plurality of isolation openings; the pixel openings are connected to the corresponding isolation openings.

13. A method for preparing a display panel, characterized in that: include: Preparing a first conductive layer on a substrate, wherein the first conductive layer includes a plurality of first conductive portions arranged at intervals; forming a first insulating material layer on a side of the first conductive layer away from the substrate, wherein the first insulating material layer comprises a first film layer and a second film layer disposed on a side of the first film layer away from the substrate; forming an isolation material layer; Performing patterning on the first insulating material layer to form a first opening, wherein the first opening is located between adjacent first conductive portions, and at least a portion of the first insulating material layer is disposed on opposite side walls of adjacent first conductive portions; Wherein, the second film layer is disposed protruding relative to the first film layer toward the first opening.

14. The preparation method according to claim 13, characterized in that: Before forming the first opening, the preparation method further comprises: Performing patterning on the isolation material layer to expose a portion of the first insulation material layer; Preferably, the substrate comprises a first region and a second region, the isolation material layer is patterned to form at least a portion of an isolation opening, and at the same time, a third opening is formed in the second region, the third opening exposing at least a portion of the first insulating material layer; the isolation opening is located in the first region; Preferably, the isolation opening includes at least one of a first isolation opening and a second isolation opening and a third isolation opening, and the step of patterning the isolation material layer to expose a portion of the first insulating material layer includes: The isolation material layer is patterned to form at least one of a first isolation opening and a second isolation opening located in the first region, and a third opening located in the second region; wherein a first portion of the orthographic projections of the first conductive portions on the substrate are located within an orthographic projection of the third opening on the substrate, and a second portion of the orthographic projections of the first conductive portions on the substrate are located outside an orthographic projection of the third opening on the substrate; The step of patterning the first insulating material layer to form a first opening comprises: Patterning the first insulating material layer to form at least one of a first pixel opening and a second pixel opening and a first opening, wherein the first pixel opening is connected to the first isolation opening, the second pixel opening is connected to the second isolation opening, and the first opening is connected to the third opening; After the step of patterning the first insulating material layer to form at least one of the first pixel opening and the second pixel opening and the first opening, the preparation method further comprises: Forming a first preparation material layer, patterning the first preparation material layer to form a light-emitting unit of a first light-emitting device located at the first isolation opening, a second electrode, and a first packaging portion located at a side of the first light-emitting device away from the substrate; and / or forming a second preparation material layer, patterning the second preparation material layer to form a light-emitting unit of a second light-emitting device located at the second isolation opening, a second electrode, and a second packaging portion located at a side of the second light-emitting device away from the substrate; Patterning the isolation material layer having the first isolation opening and / or the second isolation opening to form a third isolation opening located in the first region, patterning the first insulating material layer to form a third pixel opening and a second opening, wherein the third pixel opening is connected to the third isolation opening, and the second opening exposes at least a portion of the first conductive portion away from the substrate; Forming a third preparation material layer, and patterning the third preparation material layer to form a light-emitting unit of a third light-emitting device located in the third isolation opening, a second electrode, and a third packaging portion located on a side of the third light-emitting device away from the substrate; Preferably, the step of patterning the isolation material layer having the first isolation opening and / or the second isolation opening to form a third isolation opening located in the first region further comprises: Performing patterning on the isolation material layer having the first isolation opening and / or the second isolation opening to form a third isolation opening located in the first region, and removing the isolation material layer located in the second region; Preferably, after forming a light-emitting unit, a second electrode and a first packaging portion of a first light-emitting device located at the first isolation opening and a first packaging portion located at a side of the first light-emitting device away from the substrate; and / or after forming a light-emitting unit, a second electrode and a second packaging portion of a second light-emitting device located at the second isolation opening and a second packaging portion located at a side of the second light-emitting device away from the substrate, before forming a third isolation opening located in the first area, a lighting test is performed on the first light-emitting device and / or the second light-emitting device.

15. The preparation method according to claim 13, characterized in that: Before forming the first opening, the preparation method further comprises: Performing patterning on the isolation material layer to expose a portion of the first insulation material layer; Performing patterning on the isolation material layer to expose a portion of the first insulating material layer, or before, at least partially forming an isolation opening in the isolation material layer; And / or, after forming the first opening, the preparation method further comprises: Forming a preparation material layer, and patterning the preparation material layer to form a light-emitting unit of the light-emitting device located in at least a portion of the isolation openings, a second electrode, and a packaging portion located on a side of the light-emitting device away from the substrate; And / or, before the step of forming a first insulating material layer on a side of the first conductive layer facing away from the substrate, the preparation method further comprises: Preparing a first electrode layer on the substrate, wherein the first electrode layer includes a first electrode; The step of patterning the first insulating material layer to form a first opening comprises: Performing patterning on the first insulating material layer to form at least a portion of a pixel opening and a first opening, wherein the pixel opening exposes at least a portion of the first electrode; Preferably, the first insulating material layer further includes a protective layer, and the protective layer is disposed between the first conductive layer and the first film layer; the step of patterning the first insulating material layer to form the first opening includes: The first insulating material layer is patterned to form a first sub-opening, a second sub-opening and a third sub-opening which are interconnected, wherein the first sub-opening penetrates the first film layer, the second sub-opening penetrates the second film layer, the third sub-opening is formed in the protective layer, and the orthographic projection of the second sub-opening on the substrate is located within the orthographic projection of the first sub-opening on the substrate; Preferably, the material of the first film layer includes an inorganic material, and / or the material of the second film layer includes an inorganic material, and / or the material of the protective layer includes an inorganic material; Preferably, the inorganic material includes silicon oxide compounds and silicon nitrogen compounds; Preferably, the material of the first film layer includes silicon oxide, the material of the second film layer includes silicon nitride, and the material of the protective layer includes silicon oxide.

16. A display device, characterized in that: A device comprising a binding element and a display panel according to any one of claims 1 to 12, wherein the display panel comprises a first conductive portion, and the binding element is electrically connected to the first conductive portion; The binding element includes a chip and / or a flexible circuit board.

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