Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel, a manufacturing method thereof and a display device. The display panel comprises a substrate; the first conductive layer is arranged on one side of the substrate, and the first conductive layer comprises a plurality of first conductive parts; the first insulating layer is arranged on the side, away from the substrate, of the first conductive layer, and the first insulating layer comprises a plurality of via holes; the light-emitting devices are arranged on the side, away from the substrate, of the first insulating layer, each light-emitting device comprises a first electrode, and the first electrodes are connected with the first conductive parts through corresponding via holes; and the plurality of protection parts are arranged on the side, away from the substrate, of the first electrode, each protection part comprises at least one sub-layer made of a non-metal material, and the orthographic projection of the protection part on the substrate covers the orthographic projection of the corresponding via hole on the substrate. The problem of poor display can be solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] OLED (Organic Light Emitting Diode) display panel is one of the hot topics in the current display panel research field. OLED display panel has the advantages of low energy consumption, low cost, self-luminescence, wide viewing angle and fast response speed.

[0003] However, the OLED display panel in the related art has the problem of poor display. Summary of the invention

[0004] Based on this, it is necessary to provide a display panel and a manufacturing method thereof, and a display device in order to improve the problem of poor display of OLED display panels.

[0005] According to a first aspect of the present application, a display panel is provided, comprising:

[0006] substrate;

[0007] A first conductive layer, disposed on one side of the substrate, the first conductive layer comprising a plurality of first conductive parts;

[0008] A first insulating layer, disposed on a side of the first conductive layer away from the substrate, the first insulating layer comprising a plurality of vias;

[0009] A plurality of light-emitting devices are arranged on a side of the first insulating layer away from the substrate, the light-emitting devices comprising a first electrode, and the first electrode is connected to the first conductive part through the corresponding via hole;

[0010] A plurality of protection parts are arranged on a side of the first electrode away from the substrate, the protection parts include at least one sublayer of non-metallic material, and the orthographic projection of the protection parts on the substrate covers the orthographic projection of the corresponding via holes on the substrate.

[0011] In some embodiments, the display panel further comprises an encapsulation layer, wherein the encapsulation layer is disposed on a side of the light emitting device away from the substrate;

[0012] The protection portion includes a first sublayer, and the first sublayer and at least a portion of the encapsulation layer are provided in the same layer and with the same material.

[0013] In some embodiments, the light-emitting device further includes a light-emitting functional layer and a second electrode, and the first electrode, the light-emitting functional layer and the second electrode are sequentially stacked on one side of the substrate;

[0014] The protection portion includes a second sublayer, and the second sublayer and at least a portion of the second electrode of the light-emitting device are provided in the same layer and with the same material.

[0015] In some embodiments, the light-emitting device further includes a light-emitting functional layer and a second electrode, and the first electrode, the light-emitting functional layer and the second electrode are sequentially stacked on one side of the substrate;

[0016] The protection portion includes a third sublayer, and the third sublayer and the light-emitting functional layer of at least part of the light-emitting device are provided in the same layer and with the same material.

[0017] In some embodiments, the display panel further comprises an isolation structure, the isolation structure is disposed on a side of the first insulating layer away from the substrate, the isolation structure encloses a plurality of isolation openings, and the light emitting device is at least partially disposed in the corresponding isolation openings;

[0018] In a direction perpendicular to the plane where the substrate is located, at least a portion of the isolation structure is disposed between the protection portion and the first electrode, and an orthographic projection of the isolation structure on the substrate covers an orthographic projection of the via hole on the substrate;

[0019] Optionally, the isolation structure is located on a side of the first electrode away from the substrate, the isolation opening exposes a portion of the first electrode, and the protection portion is located on a side of the isolation structure away from the substrate;

[0020] Optionally, in a direction perpendicular to the plane of the substrate, the isolation structure includes a first isolation substructure having a first height and a second isolation substructure having a second height, the first isolation substructure is located on a side of the second isolation substructure close to the light-emitting device, and the orthographic projection of the second isolation substructure on the substrate overlaps with the orthographic projection of the via on the substrate.

[0021] In some embodiments, the display panel further includes a pixel definition layer, the pixel definition layer is disposed on a side of the first insulating layer away from the substrate, the pixel definition layer includes a pixel definition structure, and a plurality of pixel openings surrounded by the pixel definition structure, and the pixel openings are disposed corresponding to the first electrode;

[0022] In a direction perpendicular to the plane where the substrate is located, part of the pixel definition structure is arranged between the protection portion and the first electrode, and the orthographic projection of the pixel definition structure on the substrate covers the orthographic projection of the via hole on the substrate.

[0023] In some embodiments, the light emitting device includes a plurality of first color light emitting devices and a plurality of second color light emitting devices, and the first color light emitting devices and the second color light emitting devices emit light of different colors;

[0024] The vias include a plurality of first vias and a plurality of second vias, the first color light emitting devices are connected to the corresponding first conductive parts through the corresponding first vias, and the second color light emitting devices are connected to the corresponding first conductive parts through the corresponding second vias;

[0025] The first via hole is located on a side of the isolation structure surrounding the first color light emitting device close to the substrate, and the second via hole is located on a side of the isolation structure surrounding the second color light emitting device close to the substrate.

[0026] In some embodiments, the display panel further includes an encapsulation layer, the encapsulation layer is disposed on a side of the light-emitting device away from the substrate, the encapsulation layer includes a plurality of first encapsulation layers and a plurality of second encapsulation layers, the first encapsulation layer is disposed on a side of the corresponding first color light-emitting device away from the substrate, and a portion of the first encapsulation layer extends to a side of the isolation structure enclosing the first color light-emitting device away from the substrate;

[0027] The second encapsulation layer is disposed on a side of the corresponding second color light emitting device away from the substrate, and a portion of the second encapsulation layer extends to a side of the isolation structure enclosing the second color light emitting device away from the substrate;

[0028] Optionally, the first encapsulation layer and the second encapsulation layer each include a first encapsulation portion located in the isolation opening and a second encapsulation portion located on a side of the isolation structure away from the substrate;

[0029] Optionally, a first gap is formed between the first encapsulation layer and a surface of the isolation structure facing away from the substrate, and a second gap is formed between the second encapsulation layer and a surface of the isolation structure facing away from the substrate, and the first gap is different from the second gap;

[0030] Optionally, part of the second encapsulation portion of the second encapsulation layer extends to a side of the second encapsulation portion of the first encapsulation layer away from the substrate, and a second gap is provided between part of the second encapsulation portion of the second encapsulation layer and a surface of a side of the second encapsulation portion of the first encapsulation layer away from the substrate.

[0031] In some embodiments, the plurality of protection parts include a plurality of first protection parts and a plurality of second protection parts, the orthographic projection of the first protection part on the substrate covers the orthographic projection of the corresponding first via hole on the substrate, and the orthographic projection of the second protection part on the substrate covers the orthographic projection of the corresponding second via hole on the substrate; optionally, the first protection part and the second protection part both include a first sublayer, and the first sublayer and the first encapsulation layer are provided in the same layer and with the same material;

[0032] Optionally, the thickness of the first sub-layer is the same as the thickness of the first encapsulation layer;

[0033] Optionally, the first protection portion is connected to the first encapsulation layer;

[0034] Optionally, a side of the second protection portion close to the first color light emitting device is connected to the first encapsulation layer;

[0035] Optionally, at least part of the second encapsulation portion of the second encapsulation layer is located on a side of the second protection portion away from the substrate;

[0036] Optionally, an orthographic projection of the second encapsulation portion of the second encapsulation layer on the substrate at least partially overlaps with an orthographic projection of the second protection portion on the substrate.

[0037] In some embodiments, the light-emitting device further includes a light-emitting functional layer and a second electrode, and the first electrode, the light-emitting functional layer and the second electrode are sequentially stacked on one side of the substrate;

[0038] Optionally, the first protection portion and the second protection portion both include a second sublayer, and the second sublayer and the second electrode of the first color light-emitting device are provided in the same layer and with the same material;

[0039] Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode of the first color light emitting device;

[0040] Optionally, the first protection portion and the second protection portion both further include a third sublayer, and the third sublayer and the light-emitting functional layer of the first color light-emitting device are provided in the same layer and with the same material;

[0041] Optionally, the thickness of the third sublayer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device.

[0042] In some embodiments, the light emitting device further comprises a plurality of third color light emitting devices, and the first color light emitting device, the second color light emitting device and the third color light emitting device respectively emit light of different colors;

[0043] The vias further include a plurality of third vias, and the third color light emitting device is connected to the corresponding first conductive part through the corresponding third vias;

[0044] The third via hole is located on a side of the isolation structure surrounding the third color light emitting device close to the substrate;

[0045] The encapsulation layer further includes a plurality of third encapsulation layers, wherein the third encapsulation layers are arranged on a side of the corresponding third color light emitting device away from the substrate, and a portion of the third encapsulation layers extend to a side of the isolation structure enclosing the third color light emitting device away from the substrate;

[0046] Optionally, the first encapsulation layer and the third encapsulation layer each include a first encapsulation portion located in the isolation opening and a second encapsulation portion located on a side of the isolation structure away from the substrate;

[0047] Optionally, a first gap is formed between the first encapsulation layer and a surface of the isolation structure facing away from the substrate, a third gap is formed between the third encapsulation layer and a surface of the isolation structure facing away from the substrate, and the first gap is different from the third gap;

[0048] Optionally, part of the second encapsulation portion of the third encapsulation layer extends to a side of the second encapsulation portion of the first encapsulation layer away from the substrate, and part of the second encapsulation portion of the third encapsulation layer and a side of the second encapsulation portion of the first encapsulation layer away from the substrate have the third gap.

[0049] In some embodiments, the plurality of protection portions further include a plurality of third protection portions, and the orthographic projections of the third protection portions on the substrate cover the orthographic projections of the corresponding third via holes on the substrate;

[0050] Optionally, the third protection portion includes the first sublayer.

[0051] In some embodiments, the light-emitting device further includes a light-emitting functional layer and a second electrode, and the first electrode, the light-emitting functional layer and the second electrode are sequentially stacked on one side of the substrate;

[0052] Optionally, the first protection portion includes a second sublayer, and the second sublayer and the second electrode of the first color light-emitting device are provided in the same layer and with the same material;

[0053] Optionally, the second protection portion includes the second sublayer;

[0054] Optionally, the third protection portion includes the second sublayer;

[0055] Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode of the first color light emitting device;

[0056] Optionally, the first protection portion includes a third sublayer, and the third sublayer and the light-emitting functional layer of the first color light-emitting device are arranged in the same layer and with the same material;

[0057] Optionally, the second protection portion further includes the third sublayer;

[0058] Optionally, the third protection portion further includes the third sublayer;

[0059] Optionally, the thickness of the third sublayer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device.

[0060] In some embodiments, the light-emitting device further includes a light-emitting functional layer and a second electrode, and the first electrode, the light-emitting functional layer and the second electrode are sequentially stacked on one side of the substrate;

[0061] The first protection portion further includes a second sublayer located on a side of the first sublayer away from the substrate and a third sublayer located on a side of the second sublayer away from the substrate, the second sublayer and the second electrode of the first color light-emitting device are provided in the same layer and material, and the third sublayer and the light-emitting functional layer of the first color light-emitting device are provided in the same layer and material;

[0062] Optionally, the second protection portion further includes the second sublayer and the third sublayer;

[0063] Optionally, the third protection portion further includes the second sublayer and the third sublayer;

[0064] Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode of the first color light emitting device;

[0065] Optionally, the thickness of the third sublayer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device;

[0066] Optionally, on a side of the corresponding via hole away from the substrate, the third sub-layer, the second sub-layer and the first sub-layer are stacked in sequence on one side of the substrate.

[0067] In some embodiments, the display panel further includes a pixel definition layer, the pixel definition layer is disposed on a side of the first insulating layer away from the substrate, the pixel definition layer includes a pixel definition structure, and a plurality of pixel openings surrounded by the pixel definition structure, the pixel openings expose a portion of the first electrode, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the isolation opening on the substrate;

[0068] In a direction perpendicular to the plane where the substrate is located, part of the pixel definition structure is arranged between the protection portion and the first electrode, and the orthographic projection of the pixel definition structure on the substrate covers the orthographic projection of the via hole on the substrate.

[0069] According to a second aspect of the present application, a display panel is provided, comprising:

[0070] substrate;

[0071] A first conductive layer, disposed on one side of the substrate, the first conductive layer comprising a plurality of first conductive parts;

[0072] A first insulating layer, disposed on a side of the first conductive layer away from the substrate, the first insulating layer comprising a plurality of vias;

[0073] A plurality of light-emitting devices are arranged on a side of the first insulating layer away from the substrate, the light-emitting devices comprising a first electrode, and the first electrode is connected to the first conductive part through the corresponding via hole;

[0074] An encapsulation layer, disposed on a side of the light emitting device away from the substrate;

[0075] A plurality of protection parts are arranged on a side of the first electrode away from the substrate, wherein the orthographic projections of the protection parts on the substrate cover the orthographic projections of the corresponding via holes on the substrate;

[0076] The protection portion at least includes a first sub-layer, and the first sub-layer and at least a portion of the encapsulation layer are provided in the same layer and with the same material.

[0077] According to a third aspect of the present application, a display device is provided, comprising any one of the display panels described above.

[0078] According to a fourth aspect of the present application, a method for manufacturing a display panel is provided, comprising:

[0079] providing a substrate;

[0080] forming a first conductive layer on one side of the substrate, wherein the first conductive layer includes a plurality of first conductive parts;

[0081] forming a first insulating layer on a side of the first conductive layer away from the substrate, wherein the first insulating layer comprises a plurality of via holes;

[0082] A plurality of light-emitting devices are formed on a side of the first insulating layer away from the substrate, wherein the light-emitting devices include first electrodes, and the first electrodes are connected to the first conductive parts through corresponding via holes;

[0083] forming a corresponding encapsulation layer on a side of the plurality of light-emitting devices away from the substrate;

[0084] A plurality of protection parts are formed on a side of the first electrode away from the substrate, the protection parts comprising at least one sublayer of a non-metallic material, and the orthographic projections of the protection parts on the substrate cover the orthographic projections of the corresponding via holes on the substrate.

[0085] In some embodiments, forming a plurality of light-emitting devices on a side of the first insulating layer away from the substrate includes: forming a plurality of first-color light-emitting devices, wherein the first-color light-emitting devices include a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on one side of the substrate;

[0086] The forming of a corresponding encapsulation layer on a side of the plurality of light-emitting devices away from the substrate comprises: forming a plurality of first encapsulation layers, wherein the first encapsulation layer is arranged on a side of the corresponding first color light-emitting device away from the substrate;

[0087] The forming of a plurality of protection parts on a side of the first electrode away from the substrate comprises: forming a plurality of first protection parts;

[0088] The plurality of via holes include a plurality of first via holes, the first color light emitting device is connected to the corresponding first conductive part through the corresponding first via holes, and the orthographic projection of the first protection part on the substrate covers the orthographic projection of the corresponding first via hole on the substrate;

[0089] The first protection portion includes a first sublayer, and the first sublayer and the first encapsulation layer are provided in the same layer and with the same material.

[0090] In some embodiments, after forming a plurality of the first color light emitting devices and a plurality of the first encapsulation layers, the method further includes: forming a plurality of second color light emitting devices and a plurality of second encapsulation layers, and a plurality of third color light emitting devices and a plurality of third encapsulation layers;

[0091] The plurality of via holes include a plurality of second via holes and a plurality of third via holes, the second color light emitting device is connected to the corresponding first conductive part through the corresponding second via hole, and the third color light emitting device is connected to the corresponding first conductive part through the corresponding third via hole;

[0092] The second encapsulation layer is disposed on a side of the corresponding second color light emitting device away from the substrate, and the third encapsulation layer is disposed on a side of the corresponding third color light emitting device away from the substrate;

[0093] When forming a plurality of the first protection parts, a plurality of second protection parts and a plurality of third protection parts are also formed at the same time; the orthographic projection of the second protection part on the substrate covers the orthographic projection of the corresponding second via hole on the substrate, and the orthographic projection of the third protection part on the substrate covers the orthographic projection of the corresponding third via hole on the substrate;

[0094] Optionally, the second protecting portion and the third protecting portion include the first sublayer.

[0095] In an embodiment of the present application, the protective portion includes at least one sublayer of non-metallic material, and the orthographic projection of the protective portion on the substrate covers the orthographic projection of the corresponding via on the substrate. During the manufacturing process of the display panel, after the protective portion is formed, the sublayer of non-metallic material can protect the via, and can prevent the electrode or wiring at the via position from being over-etched by the subsequent manufacturing process, for example, it can prevent it from being over-etched by the etching solution in the subsequent manufacturing process (for example, it can prevent the isolation structure at the via position from being over-etched by the etching solution in the subsequent manufacturing process), thereby avoiding defects such as voids in the electrode or wiring at the via position, preventing or improving display defects such as dark spots, and improving the display quality of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0096] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0097] Figure 1 A first partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0098] Figure 2 A first partial cross-sectional schematic diagram of a display panel provided in some embodiments of the present application.

[0099] Figure 3 A second partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0100] Figure 4 A second partial cross-sectional schematic diagram of a display panel provided in some embodiments of the present application.

[0101] Figure 5 A third partial cross-sectional schematic diagram of a display panel provided in some embodiments of the present application.

[0102] Figure 6A third partial top view schematic diagram of a display panel provided in some embodiments of the present application.

[0103] Figure 7 A fourth partial cross-sectional schematic diagram of a display panel provided in some embodiments of the present application.

[0104] Figure 8 A fifth partial cross-sectional schematic diagram of a display panel provided in some embodiments of the present application.

[0105] Fig. 9 Another schematic diagram of a first partial cross-section of a display panel provided in some embodiments of the present application.

[0106] Fig.10 Still another schematic diagram of a second partial cross-section of a display panel provided in some embodiments of the present application.

[0107] Fig.11 A schematic diagram of a display device provided in some embodiments of the present application.

[0108] Fig.12 A schematic diagram of the process steps of a method for manufacturing a display panel provided in some embodiments of the present application.

[0109] Fig.13 A schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application.

[0110] Fig.14 A schematic diagram of a third intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application.

[0111] Reference numerals: display panel 100 ; display device 200 ; substrate 11 ; first conductive layer 12 ; first insulating layer 13 ; first conductive portion 121 ; sub-pixel 10P; first color sub-pixel 10R; second color sub-pixel 10G; third color sub-pixel 10B;

[0112] Protection portion 101; first sub-layer 111D; second sub-layer 112D; third sub-layer 113D; first protection portion 101R; second protection portion 101G; third protection portion 101B;

[0113] Light-emitting device 20; first electrode 14; light-emitting functional layer 21; second electrode 22; first color light-emitting device 20R; second color light-emitting device 20G; third color light-emitting device 20B; first device electrode 14R; first device light-emitting functional layer 21R; fourth device electrode 22R; second device electrode 14G; second device light-emitting functional layer 21G; fifth device electrode 22G; third device electrode 14B; third device light-emitting functional layer 21B; sixth device electrode 22B;

[0114] Encapsulation layer 30; first encapsulation layer 30R; second encapsulation layer 30G; third encapsulation layer 30B; first encapsulation portion 301; second encapsulation portion 302; first gap 30J1; second gap 30J2; third gap 30J3;

[0115] Via hole 131; first via hole 131R; second via hole 131G; third via hole 131B; first dotted line frame XQ1;

[0116] Isolation structure 16; isolation opening 16K; support portion 1601; crown portion 1602; pixel definition layer 15; pixel definition structure 151; pixel opening 152; first isolation substructure 1301; second isolation substructure 1302. DETAILED DESCRIPTION

[0117] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0118] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0119] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0120] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0121] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0122] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0123] In the related art, OLED display panels have the problem of poor display.

[0124] In order to solve the problem of how to improve poor display and enhance the display quality of a display panel, the present application designs a display panel and a manufacturing method thereof, and a display device, aiming to improve the display quality of the display panel.

[0125] See also Figure 1 and Figure 2 , Figure 1 A first partial top view schematic diagram of a display panel provided in some embodiments of the present application. Figure 2 A first partial cross-sectional schematic diagram of a display panel provided in some embodiments of the present application. Figure 1 A schematic top view of a first color light emitting device 20R is shown. Figure 2 for Figure 1 Cross-sectional structure at the dotted line C1-C1.

[0126] See also Figures 3 to 5 , Figure 3 A second partial top view schematic diagram of a display panel provided in some embodiments of the present application. Figure 4 A second partial cross-sectional schematic diagram of a display panel provided in some embodiments of the present application. Figure 5 A third partial cross-sectional schematic diagram of a display panel provided in some embodiments of the present application. Figure 3 A schematic top view of a second color light emitting device 20G is shown. Figure 4 for Figure 3 Cross-sectional structure at the dotted line C2-C2. Figure 5 A schematic cross-sectional structure diagram of the adjacent portion of the first color light emitting device 20R and the second color light emitting device 20G is illustrated.

[0127] See also Figures 6 to 8 , Figure 6 A third partial top view schematic diagram of a display panel provided in some embodiments of the present application. Figure 7 A fourth partial cross-sectional schematic diagram of a display panel provided in some embodiments of the present application. Figure 8 A fifth partial cross-sectional schematic diagram of a display panel provided in some embodiments of the present application. Figure 6 A schematic top view of a third-color light-emitting device 20B is shown. Figure 7 for Figure 6 Cross-sectional structure at the dotted line C3-C3. Figure 8 A schematic cross-sectional structure diagram of the adjacent portion of the first color light emitting device 20R and the third color light emitting device 20B is illustrated.

[0128] Fig. 9 Another schematic diagram of a first partial cross-section of a display panel provided in some embodiments of the present application. Fig.10 Still another schematic diagram of a second partial cross-section of a display panel provided in some embodiments of the present application. Figure 2 , Figure 4 , Figure 5 , Figure 7 and Figure 8 The cross-sectional structure under the combined conditions of dry etching process and wet etching process is shown. Fig. 9 and Fig.10The cross-sectional structure under dry etching process conditions is illustrated. The composition, preparation, etc. of the isolation structure mentioned below are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, Further description is provided in CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0129] First, see Figures 1 to 8 The present application provides a display panel 100, which includes a substrate 11, a first conductive layer 12, a first insulating layer 13, a plurality of light-emitting devices 20 and a plurality of protective parts 101; the first conductive layer 12 is arranged on one side of the substrate 11, and the first conductive layer 12 includes a plurality of first conductive parts 121; the first insulating layer 13 is arranged on a side of the first conductive layer 12 away from the substrate 11, and the first insulating layer 13 includes a plurality of via holes 131; a plurality of light-emitting devices 20 are arranged on a side of the first insulating layer 13 away from the substrate 11, and the light-emitting devices 20 include a first electrode 14, and the first electrode 14 is connected to the first conductive part 121 through the corresponding via holes 131; a plurality of protective parts 101 are arranged on a side of the first electrode 14 away from the substrate 11, and the protective part 101 includes at least one sublayer of non-metallic material, and the orthographic projection of the protective part 101 on the substrate 11 covers the orthographic projection of the corresponding via hole 131 on the substrate 11.

[0130] For example, in some embodiments, the display panel 100 includes a substrate 11 and an array composite layer disposed on one side of the substrate 11, and the film layer structure of the array composite layer may include a film layer of multiple transistors and drive lines in multiple drive circuits. In some embodiments, multiple light-emitting devices 20 are disposed on a side of the array composite layer away from the substrate 11.

[0131] It should be noted that Figure 1 , Figure 3 and Figure 6The example in the figure shows that the display panel includes a plurality of sub-pixels 10P, the plurality of sub-pixels 10P include a first color sub-pixel 10R, a second color sub-pixel 10G and a third color sub-pixel 10B, the first color sub-pixel 10R includes a first color light-emitting device 20R, the second color sub-pixel 10G includes a second color light-emitting device 20G, and the third color sub-pixel 10B includes a third color light-emitting device 20B, but the arrangement of the sub-pixels 10P in the display panel 100 and the arrangement of the light-emitting devices 20 in the sub-pixels are not limited to Figure 1 , Figure 3 and Figure 6 Example shown.

[0132] For example, in some embodiments, the first electrode 14 is connected to the corresponding first conductive portion 121 through the corresponding via 131, and the first electrode 14 provides an electrical signal to the first conductive portion 121 exposed through the corresponding via 131. For example, the first conductive portion 121 is a source or drain of a transistor in a driving circuit; for example, the first conductive portion 121 is a connecting electrode, and the first conductive portion 121 is connected to a source or drain of a transistor in a driving circuit.

[0133] By way of example, in some embodiments, a plurality of protection portions 101 are disposed on a side of the first electrode 14 away from the substrate 11 , and an orthographic projection of the protection portion 101 on the substrate 11 covers an orthographic projection of a corresponding via 131 on the substrate 11 , that is, in a thickness direction of the substrate 11 , the protection portion 101 and the corresponding via 131 are stacked, and the protection portion 101 covers the corresponding via 131 .

[0134] By way of example, in some embodiments, a plurality of protection portions 101 are disposed on a side of the first electrode 14 away from the substrate 11, and an orthographic projection of the protection portion 101 on the substrate 11 covers an orthographic projection of a corresponding via 131 on the substrate 11, that is, an orthographic projection of the protection portion 101 on the substrate 11 covers an orthographic projection of a side wall of the corresponding via 131 on the substrate 11, or an orthographic projection of the protection portion 101 on the substrate 11 covers an orthographic projection of a corresponding via 131 area on the substrate 11.

[0135] For example, in some embodiments, the protection portion 101 includes at least one sublayer of non-metallic material. During the manufacturing process of the display panel 100, after the protection portion 101 is formed, the sublayer of non-metallic material can protect the via 131, and can prevent the electrode or wiring at the via 131 from being over-etched by subsequent manufacturing processes. For example, it can prevent the electrode or wiring at the via 131 from being over-etched by the etching solution in the subsequent manufacturing process, thereby avoiding defects such as voids in the electrode or wiring at the via 131, and preventing or improving display defects such as dark spots.

[0136] In an embodiment of the present application, the protection portion 101 includes at least one sublayer of non-metallic material, and the orthographic projection of the protection portion 101 on the substrate 11 covers the orthographic projection of the corresponding via 131 on the substrate 11. During the manufacturing process of the display panel 100, after the protection portion 101 is formed, the sublayer of non-metallic material can protect the via 131, and can prevent the electrode or wiring at the via 131 from being over-etched by subsequent manufacturing processes, for example, it can prevent the electrode or wiring at the via 131 from being over-etched by the etching solution in the subsequent manufacturing process (for example, it can prevent the isolation structure 16 at the via 131 from being over-etched by the etching solution in the subsequent manufacturing process), thereby avoiding defects such as voids in the electrode or wiring at the via 131, preventing or improving display defects such as dark spots, and improving the display quality of the display panel.

[0137] In some embodiments, the display panel 100 further includes an encapsulation layer 30 , which is disposed on a side of the light-emitting device 20 away from the substrate 11 ; the protection portion 101 includes a first sublayer 111D, which is disposed in the same layer and material as at least part of the encapsulation layer 30 .

[0138] For example, in some embodiments, the first sublayer 111D and at least a portion of the encapsulation layer 30 are provided in the same layer and the same material. For example, the first sublayer 111D and at least a portion of the encapsulation layer 30 are manufactured in the same manufacturing process, which can simplify the production process.

[0139] For example, in some embodiments, the first sublayer 111D and at least a portion of the encapsulation layer 30 are arranged in the same layer and the same material, and the encapsulation layer 30 includes at least one film layer of inorganic material, for example, the encapsulation layer 30 includes a silicon nitride film layer and / or a silicon oxide film layer, and the first sublayer 111D can play the role of protecting the film layer between the via 131 and the first sublayer 111D.

[0140] In some embodiments, Fig. 9 and Fig.10 As shown, the light-emitting device 20 also includes a light-emitting functional layer 21 and a second electrode 22, and the first electrode 14, the light-emitting functional layer 21 and the second electrode 22 are stacked in sequence on one side of the substrate 11; the protective part 101 includes a second sublayer 112D, and the second sublayer 112D and the second electrode 22 of at least part of the light-emitting device 20 are arranged in the same layer and with the same material.

[0141] For example, in some embodiments, Fig. 9 and Fig.10 As shown, the second sublayer 112D and the second electrode 22 of at least part of the light-emitting device 20 are provided in the same layer and the same material. For example, the second sublayer 112D and the second electrode 22 of at least part of the light-emitting device 20 are manufactured in the same manufacturing process, which can simplify the production process.

[0142] For example, one of the first electrode 14 and the second electrode 22 may be an anode, and the other may be a cathode.

[0143] By way of example, the light-emitting functional layer 21 may include a light-emitting layer (Emission layer, EML), and the light-emitting functional layer 21 may also include other film layers other than the light-emitting layer (Emission layer, EML), for example, it may also include one or more of a hole injection layer (Hole Injection Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), an electron injection layer (Electron Injection Layer, EIL), an electron transport layer (Electron Transport Layer, ETL), a hole blocking layer (Hole Block Layer, HBL) and an electron blocking layer (Electron Block Layer, EBL).

[0144] For example, in some embodiments, the protection portion 101 includes a second sublayer 112D, and the second sublayer 112D and the second electrode 22 of at least part of the light-emitting device 20 are arranged in the same layer and material, and the second sublayer 112D can play the role of protecting the film layer between the via 131 and the second sublayer 112D.

[0145] In some embodiments, Fig. 9 and Fig.10 As shown, the light-emitting device 20 also includes a light-emitting functional layer 21 and a second electrode 22, and the first electrode 14, the light-emitting functional layer 21 and the second electrode 22 are stacked in sequence on one side of the substrate 11; the protective part 101 includes a third sublayer 113D, and the third sublayer 113D and the light-emitting functional layer 21 of at least part of the light-emitting device 20 are arranged in the same layer and with the same material.

[0146] For example, in some embodiments, Fig. 9 and Fig.10 As shown, the third sublayer 113D and the light-emitting functional layer 21 of at least part of the light-emitting device 20 are set in the same layer and the same material. For example, the third sublayer 113D and the light-emitting functional layer 21 of at least part of the light-emitting device 20 are manufactured in the same manufacturing process, which can simplify the production process.

[0147] For example, in some embodiments, Fig. 9 and Fig.10 As shown, the third sublayer 113D and the light-emitting functional layer 21 of at least part of the light-emitting device 20 are provided in the same layer and with the same material, and the third sublayer 113D can play the role of protecting the film layer between the via hole 131 and the third sublayer 113D.

[0148] In some embodiments, the display panel 100 also includes an isolation structure 16, which is disposed on a side of the first insulating layer 13 away from the substrate 11, and the isolation structure 16 encloses a plurality of isolation openings 16K, and the light-emitting device 20 is at least partially disposed in the corresponding isolation openings 16K; in a direction perpendicular to the plane where the substrate 11 is located, at least a portion of the isolation structure 16 is disposed between the protective portion 101 and the first electrode 14, and the orthographic projection of the isolation structure 16 on the substrate 11 covers the orthographic projection of the via 131 on the substrate 11.

[0149] For example, in some embodiments, the isolation structure 16 includes a support portion 1601 and a crown portion 1602 stacked in sequence on the substrate 11, and the orthographic projection of the support portion 1601 on the substrate 11 is located within the orthographic projection of the crown portion 1602 on the substrate 11. In this way, at least the portion of the isolation structure 16 away from the substrate 11 is set to a shape that is wide at the top and narrow at the bottom, so that the isolation structure 16 can block other film layers such as the light-emitting layer EML or the hole transport layer HTL of the adjacent light-emitting device 20, which can save expensive fine metal mask plates (FMM), thereby reducing the manufacturing cost of the display panel. At the same time, after not using the fine metal mask plate (FMM), the light-emitting area of ​​the sub-pixel is not limited by the opening of the fine metal mask plate, the light-emitting area of ​​the sub-pixel can be made smaller, and a larger number of sub-pixels can be formed in the display panel, thereby improving the resolution of the display panel.

[0150] By way of example, in some embodiments, the isolation structure 16 is a conductive structure, the support portion 1601 is a conductive material, and the second electrode 22 can be overlapped on the side wall of the support portion 1601 facing the corresponding light-emitting device 20. At this time, the isolation structure 16 can provide the second electrode 22 with a corresponding electrical signal. For example, the isolation structure 16 can provide the second electrode 22 with a VSS signal (cathode signal).

[0151] For example, in some embodiments, Fig. 9 and Fig.10As shown, at the corresponding via hole 131, on the side of the isolation structure 16 away from the substrate 11, the third sublayer 113D, the second sublayer 112D and the first sublayer 111D are stacked in sequence, and the isolation structure 16 is a conductive structure. For example, the support portion 1601 is a conductive material. At this time, the protection portion 101 includes the third sublayer 113D, the second sublayer 112D and the first sublayer 111D. During the manufacturing process of the display panel, after the protection portion 101 is formed, the sublayer of non-metallic material can protect the via hole 131, and can prevent the isolation structure 16 at the via hole 131 from being over-etched by the subsequent manufacturing process. For example, it can prevent the isolation structure 16 at the via hole 131 from being over-etched by the etching solution in the subsequent manufacturing process, thereby avoiding defects such as voids in the isolation structure 16 at the via hole 131 (avoiding the damage to the complete film layer of the isolation structure 16), and preventing or improving display defects such as dark spots.

[0152] Optionally, in some embodiments, the isolation structure 16 is located on a side of the first electrode 14 away from the substrate 11 , the isolation opening 16K exposes a portion of the first electrode 14 , and the protection portion 101 is located on a side of the isolation structure 16 away from the substrate 11 .

[0153] For example, the protection portion 101 is located on a side of the isolation structure 16 away from the substrate 11 , and the protection portion 101 can protect the isolation structure 16 between the protection portion 101 and the substrate 11 , thereby preventing the isolation structure 16 between the protection portion 101 and the substrate 11 from being over-etched by subsequent manufacturing processes.

[0154] Optionally, in some embodiments, in a direction perpendicular to the plane of the substrate 11, the isolation structure 16 includes a first isolation substructure 1301 having a first height and a second isolation substructure 1302 having a second height, the first isolation substructure 1301 is located on a side of the second isolation substructure close to the light-emitting device, and the orthographic projection of the second isolation substructure 1302 on the substrate 11 overlaps with the orthographic projection of the via 131 on the substrate 11.

[0155] For example, the orthographic projection of the second isolating substructure 1302 on the substrate 11 overlaps with the orthographic projection of the via hole 131 on the substrate 11 , and the first isolating substructure 1301 is surrounded to form an isolating opening 16K.

[0156] For example, in some embodiments, the first height of the first isolation substructure 1301 is the same as the second height of the second isolation substructure 1302 ; in other embodiments, the first height of the first isolation substructure 1301 is different from the second height of the second isolation substructure 1302 .

[0157] For example, in some embodiments, the first isolating substructure 1301 and the second isolating substructure 1302 are connected to form an integral structure; in some embodiments, the first isolating substructure 1301 and the second isolating substructure 1302 are structures that are spaced apart.

[0158] In some embodiments, the display panel 100 also includes a pixel definition layer 15, which is disposed on a side of the first insulating layer 13 away from the substrate 11, and the pixel definition layer 15 includes a pixel definition structure 151, and a plurality of pixel openings 152 surrounded by the pixel definition structure 151, and the pixel openings 152 are disposed corresponding to the first electrode 14; in a direction perpendicular to the plane where the substrate 11 is located, a portion of the pixel definition structure 151 is disposed between the protective portion 101 and the first electrode 14, and the orthographic projection of the pixel definition structure 151 on the substrate 11 covers the orthographic projection of the via 131 on the substrate 11.

[0159] For example, in some embodiments, the pixel definition structure 151 surrounds a plurality of pixel openings 152 , and the pixel openings 152 expose corresponding first electrodes 14 .

[0160] For example, in some embodiments, at the pixel opening 152 , the pixel definition structure 151 covers the edge of the corresponding first electrode 14 .

[0161] For example, in some embodiments, on the side of the corresponding via hole 131 away from the substrate 11, the first electrode 14, the pixel definition structure 151, the isolation structure 16 and the protection part 101 are stacked in sequence, and the protection part 101 can play a role in protecting the via hole 131. For example, the protection part 101 can prevent the isolation structure 16 at the via hole 131 from being over-etched by the etching solution in the subsequent manufacturing process, thereby preventing the isolation structure 16 at the via hole 131 from having defects such as cavities (avoiding the complete film layer of the isolation structure 16 from being damaged), and preventing or improving poor display such as dark spots. At the same time, the pixel definition structure 151 can prevent the isolation structure 16 from short-circuiting with the first electrode 14.

[0162] See also Figures 1 to 5 ,or Fig. 9 and Fig.10 shown.

[0163] In some embodiments, Figures 1 to 5 As shown, the light emitting device 20 includes a plurality of first color light emitting devices 20R and a plurality of second color light emitting devices 20G, and the first color light emitting devices 20R and the second color light emitting devices 20G emit light of different colors;

[0164] The vias 131 include a plurality of first vias 131R and a plurality of second vias 131G, each first color light emitting device 20R is connected to the corresponding first conductive portion 121 through the corresponding first via 131R, and each second color light emitting device 20G is connected to the corresponding first conductive portion 121 through the corresponding second via 131G;

[0165] The first via hole 131R is located on a side of the isolation structure 16 enclosing the first color light emitting device 20R close to the substrate 11 , and the second via hole 131G is located on a side of the isolation structure 16 enclosing the second color light emitting device 20G close to the substrate 11 .

[0166] For example, Figure 2 As shown, the first via hole 131R is located on a side of the isolation structure 16 surrounding the first color light emitting device 20R close to the substrate 11, so that the first color light emitting device 20R is connected to the corresponding first conductive portion 121 through the corresponding first via hole 131R.

[0167] For example, Figure 4 As shown, the second via hole 131G is located on a side of the isolation structure 16 surrounding the second color light emitting device 20G close to the substrate 11, so that the second color light emitting device 20G is connected to the corresponding first conductive portion 121 through the corresponding second via hole 131G.

[0168] In some embodiments, Figures 1 to 5 As shown, the display panel 100 further includes an encapsulation layer 30, which is disposed on a side of the light-emitting device 20 away from the substrate 11, and includes a plurality of first encapsulation layers 30R and a plurality of second encapsulation layers 30G. The first encapsulation layer 30R is disposed on a side of the corresponding first color light-emitting device 20R away from the substrate 11, and a portion of the first encapsulation layer 30R extends to a side of the isolation structure 16 enclosing the first color light-emitting device 20R away from the substrate 11;

[0169] The second encapsulation layer 30G is disposed on a side of the corresponding second color light emitting device 20G away from the substrate 11 , and a portion of the second encapsulation layer 30G extends to a side of the isolation structure 16 enclosing the second color light emitting device 20G away from the substrate 11 .

[0170] Optionally, in some embodiments, the first encapsulation layer 30R and the second encapsulation layer 30G both include a first encapsulation portion 301 located in the isolation opening 16K and a second encapsulation portion 302 located on a side of the isolation structure 16 facing away from the substrate 11 .

[0171] For example, Figure 2As shown, part of the first encapsulation layer 30R extends to the side of the isolation structure 16 enclosing the first color light-emitting device 20R away from the substrate 11, that is, the first encapsulation layer 30R includes a first encapsulation portion 301 located in the isolation opening 16K and a second encapsulation portion 302 located on the side of the isolation structure 16 away from the substrate 11, so that the first encapsulation layer 30R can well encapsulate the first color light-emitting device 20R.

[0172] For example, Figure 4 As shown, part of the second encapsulation layer 30G extends to the side of the isolation structure 16 enclosing the second color light-emitting device 20G away from the substrate 11, that is, the second encapsulation layer 30G includes a first encapsulation portion 301 located in the isolation opening 16K and a second encapsulation portion 302 located on the side of the isolation structure 16 away from the substrate 11, so that the second encapsulation layer 30G can well encapsulate the second color light-emitting device 20G.

[0173] Optionally, in some embodiments, Figure 2 As shown, there is a first gap 30J1 between the first encapsulation layer 30R and the side surface of the isolation structure 16 facing away from the substrate 11; Figure 4 As shown, a second gap 30J2 is provided between the second encapsulation layer 30G and a surface of the isolation structure 16 facing away from the substrate 11 , and the first gap 30J1 is different from the second gap 30J2 .

[0174] For example, the film layer between the first encapsulation layer 30R and the isolation structure 16 (the light-emitting functional layer 21 and the second electrode 22 of the first color light-emitting device 20R) is etched to form the first gap 30J1. The film layer between the second encapsulation layer 30G and the isolation structure 16 (the light-emitting functional layer 21 and the second electrode 22 of the second color light-emitting device 20G) is etched to form the second gap 30J2.

[0175] For example, in a direction perpendicular to the plane where the substrate 11 is located, the first gap 30J1 and the second gap 30J2 have different heights.

[0176] Optionally, in some embodiments, Figure 5 As shown, part of the second encapsulation portion 302 of the second encapsulation layer 30G extends to the side of the second encapsulation portion 302 of the first encapsulation layer 30R away from the substrate 11, and a second gap 30J2 is provided between part of the second encapsulation portion 302 of the second encapsulation layer 30G and the side surface of the second encapsulation portion 302 of the first encapsulation layer 30R away from the substrate 11.

[0177] For example, Figure 5As shown, part of the second encapsulation portion 302 of the second encapsulation layer 30G extends to the side of the second encapsulation portion 302 of the first encapsulation layer 30R away from the substrate 11, which can improve the structural stability of this part and prevent the encapsulation layer 30 (such as the second encapsulation portion 302 of the first encapsulation layer 30R) from film peeling.

[0178] In some embodiments, the plurality of protection portions 101 include a plurality of first protection portions 101R and a plurality of second protection portions 101G, wherein the orthographic projection of the first protection portion 101R on the substrate 11 covers the orthographic projection of the corresponding first via hole 131R on the substrate 11, and the orthographic projection of the second protection portion 101G on the substrate 11 covers the orthographic projection of the corresponding second via hole 131G on the substrate 11.

[0179] For example, in some embodiments, the first color light emitting device 20R and the second color light emitting device 20G may be different ones of a red light emitting device, a green light emitting device, and a blue light emitting device. For example, the first color light emitting device 20R is a red light emitting device, and the second color light emitting device 20G is a green light emitting device; for example, the first color light emitting device 20R is a blue light emitting device, and the second color light emitting device 20G is a red light emitting device.

[0180] For example, Figure 1 and Figure 2 As shown, the first electrode 14 of the first color light emitting device 20R is a first device electrode 14R, the light emitting functional layer 21 of the first color light emitting device 20R is a first device light emitting functional layer 21R, and the second electrode 22 of the first color light emitting device 20R is a fourth device electrode 22R.

[0181] For example, Figure 1 and Figure 2 As shown, the first color light-emitting device 20R is connected to the corresponding first conductive part 121 through the corresponding first via 131R, the first encapsulation layer 30R is arranged on the side of the corresponding first color light-emitting device 20R away from the substrate 11, and the orthographic projection of the first protective part 101R on the substrate 11 covers the orthographic projection of the corresponding first via 131R on the substrate 11.

[0182] For example, Figure 3 and Figure 4 As shown, the first electrode 14 of the second color light emitting device 20G is the second device electrode 14G, the light emitting function layer 21 of the second color light emitting device 20G is the second device light emitting function layer 21G, and the second electrode 22 of the second color light emitting device 20G is the fifth device electrode 22G.

[0183] For example, Figure 3 and Figure 4As shown, the second color light emitting device 20G is connected to the corresponding first conductive portion 121 through the corresponding second via hole 131G, the second encapsulation layer 30G is disposed on the side of the corresponding second color light emitting device 20G away from the substrate 11, and the orthographic projection of the second protection portion 101G on the substrate 11 covers the orthographic projection of the corresponding second via hole 131G on the substrate 11. Optionally, in some embodiments, the first protection portion 101R and the second protection portion 101G both include a first sublayer 111D, and the first sublayer 111D and the first encapsulation layer 30R are disposed in the same layer and the same material.

[0184] For example, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first sublayer 111D in the first protection portion 101R and the second protection portion 101G is formed at the same time, which can simplify the manufacturing process. At the same time, when the film layer of the second color light-emitting device 20G is subsequently formed, the second protection portion 101G can protect the conductive structure between the second protection portion 101G and the substrate 11. Optionally, in some embodiments, the thickness of the first sublayer 111D is the same as the thickness of the first encapsulation layer 30R.

[0185] For example, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first sub-layer 111D is formed at the same time, so that the thickness of the first sub-layer 111D is the same as the thickness of the first encapsulation layer 30R.

[0186] Optionally, in some embodiments, Figure 2 As shown, the first protection portion 101R is connected to the first encapsulation layer 30R.

[0187] For example, Figure 2 As shown, the first sublayer 111D and the first encapsulation layer 30R are provided in the same layer and the same material. At this time, the first protection portion 101R is connected to the first encapsulation layer 30R. For example, the first sublayer 111D is a part of the first encapsulation layer 30R, which increases the encapsulation area and reduces the area of ​​the non-encapsulation area, thereby improving the encapsulation performance and sealing performance of the first protection portion 101R and the first encapsulation layer 30R. Optionally, in some embodiments, please combine Figure 3 and Figure 4 As shown, the second protection portion 101G is connected to the first encapsulation layer 30R at a side close to the first color light emitting device 20R.

[0188] For example, please combine Figure 3 and Figure 4 As shown, the second protection portion 101G is connected to the first encapsulation layer 30R at a side close to the first color light emitting device 20R.

[0189] For example, Figure 4In the embodiment, the side of the second protection portion 101G away from the second color light emitting device 20G is the side of the second protection portion 101G close to the first color light emitting device 20R. At this time, the side of the second protection portion 101G away from the second color light emitting device 20G and the first encapsulation layer 30R, for example, the first sub-layer 111D is a part of the first encapsulation layer 30R ( Figure 3 The first dotted box XQ1 in the figure indicates that the first encapsulation layer 30R covers the first via hole 131R, the first color light-emitting device 20R and the second via hole 131G on the substrate 11, thereby increasing the encapsulation area and reducing the area of ​​the non-encapsulation area, thereby improving the encapsulation performance and sealing performance at the second protection portion 101G.

[0190] In some embodiments, on the side of the isolation structure 16 facing away from the substrate 11, the second encapsulation layer 30G and the second protection portion 101G are spaced apart to ensure that the film layer of the first color light-emitting device 20R prepared earlier is completely removed in the isolation opening 16K area corresponding to the second color light-emitting device 20G.

[0191] In other embodiments, Fig. 9 and Fig.10 As shown, the second protection portion 101G may further include a third sublayer 113D prepared at the same layer as the light-emitting functional layer 21 of the first color light-emitting device 20R, and a second sublayer 112D prepared at the same layer as the second electrode 22 of the first color light-emitting device 20R.

[0192] The light-emitting functional layer 21 and the second electrode 22 of the second color light-emitting device 20G can also extend to the side of the isolation structure 16 away from the substrate 11, and the light-emitting functional layer 21 and the second electrode 22 of the second color light-emitting device 20G are spaced apart from the third sublayer 113D and the second sublayer 112D of the second protective portion 101G.

[0193] In this embodiment, the first color light emitting device 20R, the first encapsulation layer 30R, the first protection portion 101R and the second protection portion 101G are all formed in the same dry etching process, and the second color light emitting device 20G is formed in another dry etching process.

[0194] Optionally, in some embodiments, Figure 4 As shown, at least a portion of the second encapsulation portion 302 of the second encapsulation layer 30G is located on a side of the second protection portion 101G facing away from the substrate 11 .

[0195] Optionally, in some embodiments, Figure 4 As shown, the orthographic projection of the second encapsulation portion 302 of the second encapsulation layer 30G on the substrate 11 at least partially overlaps with the orthographic projection of the second protection portion 101G on the substrate 11 .

[0196] For example, Figure 4As shown, the first encapsulation layer 30R is formed by a dry etching process after covering the entire surface, and the film layer between the first encapsulation layer 30R and the isolation structure 16 (the light-emitting functional layer 21 and the second electrode 22 of the first color light-emitting device 20R) is formed by a wet etching process to form a first gap 30J1. The film layer between the second encapsulation layer 30G and the isolation structure 16 (the light-emitting functional layer 21 and the second electrode 22 of the second color light-emitting device 20G) is etched to form a second gap 30J2. The orthographic projection of at least part of the second encapsulation portion 302 of the second encapsulation layer 30G on the substrate 11 is at least partially overlapped with the orthographic projection of the second protection portion 101G on the substrate 11, so as to improve the structural stability of the second protection portion 101G and prevent the film layer from peeling off in the encapsulation layer 30 (for example, the first sublayer 111D in the second protection portion 101G). After the second protection portion 101G and the first encapsulation layer 30R are prepared simultaneously, the problem that the second protection portion 101G is more easily broken by the impact of gas or liquid in the preparation process of the second color light emitting device 20G due to its distance from the first encapsulation layer 30R is further avoided.

[0197] In some embodiments of the present application, compared with the second color light emitting device 20G and the second encapsulation layer 30G, the first color light emitting device 20R and the first encapsulation layer 30R are manufactured first, and the first protection portion 101R and the second protection portion 101G are manufactured when the first color light emitting device 20R and the first encapsulation layer 30R are manufactured. In the subsequent manufacturing process of the second color light emitting device 20G and the second encapsulation layer 30G, on the one hand, the first protection portion 101R can protect the first via hole 131R, and can prevent the electrode or the wiring at the first via hole 131R from being damaged by the subsequent On the other hand, the second protection portion 101G can protect the second via 131G, and can prevent the electrode or the wiring at the second via 131G from being over-etched by the subsequent manufacturing process. For example, it can prevent the electrode or the wiring at the second via 131G from being over-etched by the subsequent manufacturing process. For example, it can prevent the electrode or the wiring at the second via 131G from being over-etched by the subsequent manufacturing process. Thus, defects such as holes in the electrode or the wiring at the second via 131G can be avoided, and display defects such as dark spots can be prevented or improved.

[0198] See also Figures 1 to 8 ,or Fig. 9 and Fig.10 .

[0199] In some embodiments, Figures 1 to 8 As shown, the light emitting device 20 further includes a plurality of third color light emitting devices 20B, and the first color light emitting device 20R, the second color light emitting device 20G and the third color light emitting device 20B respectively emit light of different colors;

[0200] The via hole 131 further includes a plurality of third via holes 131B, and the third color light emitting device 20B is connected to the corresponding first conductive portion 121 through the corresponding third via holes 131B;

[0201] The third via hole 131B is located on a side of the isolation structure 16 surrounding the third color light emitting device 20B close to the substrate 11;

[0202] The encapsulation layer 30 further includes a plurality of third encapsulation layers 30B, which are disposed on a side of the corresponding third color light emitting device 20B away from the substrate 11 , and a portion of the third encapsulation layer 30B extends to a side of the isolation structure 16 enclosing the third color light emitting device 20B away from the substrate 11 .

[0203] For example, Figure 7 As shown, the third via hole 131B is located on a side of the isolation structure 16 surrounding the third color light emitting device 20B close to the substrate 11, so that the third color light emitting device 20B is connected to the corresponding first conductive portion 121 through the corresponding third via hole 131B.

[0204] Optionally, in some embodiments, the first encapsulation layer 30R and the third encapsulation layer 30B each include a first encapsulation portion 301 located in the isolation opening 16K and a second encapsulation portion 302 located on a side of the isolation structure 16 facing away from the substrate 11 .

[0205] For example, Figure 7 As shown, part of the third encapsulation layer 30B extends to the side of the isolation structure 16 enclosing the third color light-emitting device 20B away from the substrate 11, that is, the third encapsulation layer 30B includes a first encapsulation portion 301 located in the isolation opening 16K and a second encapsulation portion 302 located on the side of the isolation structure 16 away from the substrate 11, so that the third encapsulation layer 30B can well encapsulate the third color light-emitting device 20B.

[0206] Optionally, in some embodiments, Figure 8 As shown, a first gap 30J1 is formed between the first encapsulation layer 30R and a surface of the isolation structure 16 facing away from the substrate 11 , and a third gap 30J3 is formed between the third encapsulation layer 30B and a surface of the isolation structure 16 facing away from the substrate 11 . The first gap 30J1 is different from the third gap 30J3 .

[0207] For example, the film layer between the first encapsulation layer 30R and the side surface of the isolation structure 16 away from the substrate 11 (the light-emitting functional layer 21 and the second electrode 22 of the first color light-emitting device 20R) can be etched away to form a first gap 30J1, and the film layer between the third encapsulation layer 30B and the side surface of the isolation structure 16 away from the substrate 11 (the light-emitting functional layer 21 and the second electrode 22 of the third color light-emitting device 20B) can be etched away to form a third gap 30J3.

[0208] For example, in a direction perpendicular to the plane where the substrate 11 is located, the first gap 30J1 and the third gap 30J3 have different heights.

[0209] Optionally, in some embodiments, Figure 8 As shown, part of the second encapsulation portion 302 of the third encapsulation layer 30B extends to the side of the second encapsulation portion 302 of the first encapsulation layer 30R away from the substrate 11, and part of the second encapsulation portion 302 of the third encapsulation layer 30B and the side of the second encapsulation portion 302 of the first encapsulation layer 30R away from the substrate 11 have a third gap 30J3.

[0210] For example, Figure 8 As shown, the film layer between part of the second packaging part 302 of the third packaging layer 30B and the surface of the side of the second packaging part 302 of the first packaging layer 30R away from the substrate 11 (the light-emitting functional layer 21 and the second electrode 22 of the third color light-emitting device 20B) is etched away to form a third gap 30J3, thereby ensuring that the materials of the first color light-emitting device 20R and the second color light-emitting device 20G formed by the previous process in the isolation opening 16K where the third color light-emitting device 20B is located can be completely removed by wet etching materials, thereby improving the light-emitting effect of the display panel.

[0211] In some embodiments, Figure 7 As shown, the plurality of protection portions 101 further include a plurality of third protection portions 101B, and the orthographic projections of the third protection portions 101B on the substrate 11 cover the orthographic projections of the corresponding third via holes 131B on the substrate 11 .

[0212] Optionally, in some embodiments, Figure 7 As shown, the third protection portion 101B includes only the first sub-layer 111D.

[0213] For example, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first sublayer 111D in the third protective part 101B is also formed at the same time, which can simplify the manufacturing process. When the film layer of the third color light-emitting device 20B is subsequently formed, the third protective part 101B can protect the conductive structure between the third protective part 101B and the substrate 11.

[0214] For example, in some embodiments, the first color light emitting device 20R, the second color light emitting device 20G, and the third color light emitting device 20B may be different ones of a red light emitting device, a green light emitting device, and a blue light emitting device. For example, the first color light emitting device 20R is a red light emitting device, the second color light emitting device 20G is a green light emitting device, and the third color light emitting device 20B is a blue light emitting device; for example, the first color light emitting device 20R is a blue light emitting device, the second color light emitting device 20G is a red light emitting device, and the third color light emitting device 20B is a green light emitting device.

[0215] For example, Figure 6 and Figure 7 As shown, the first electrode 14 of the third color light emitting device 20B is the third device electrode 14B, the light emitting functional layer 21 of the third color light emitting device 20B is the third device light emitting functional layer 21B, and the second electrode 22 of the third color light emitting device 20B is the sixth device electrode 22B.

[0216] For example, Figure 6 and Figure 7 As shown, the third color light emitting device 20B is connected to the corresponding first conductive part 121 through the corresponding third via 131B, the third encapsulation layer 30B is arranged on the side of the corresponding third color light emitting device 20B away from the substrate 11, and the orthographic projection of the third protection part 101B on the substrate 11 covers the orthographic projection of the corresponding third via 131B on the substrate 11.

[0217] In some embodiments, the light emitting device 20 further includes a light emitting functional layer 21 and a second electrode 22 , and the first electrode 14 , the light emitting functional layer 21 and the second electrode 22 are sequentially stacked on one side of the substrate 11 .

[0218] Optionally, in some embodiments, Fig. 9 and Fig.10 As shown, the first protection portion 101R includes a second sublayer 112D, and the second sublayer 112D and the second electrode 22 of the first color light emitting device 20R are provided in the same layer and with the same material.

[0219] Optionally, in some embodiments, the second protection portion 101G includes a second sub-layer 112D.

[0220] Optionally, in some embodiments, the third protection portion 101B includes a second sub-layer 112D.

[0221] For example, during the manufacturing process of the display panel, when the second electrode 22 of the first color light emitting device 20R is formed, the first sublayer 111D in the third protection portion 101B is formed at the same time, which can simplify the manufacturing process.

[0222] For example, in some embodiments, during the manufacturing process of the display panel, when the second electrode 22 of the first color light emitting device 20R is formed, the second sublayer 112D in the first protection portion 101R, the second protection portion 101G and the third protection portion 101B are formed at the same time, which can simplify the manufacturing process.

[0223] Optionally, in some embodiments, the thickness of the second sublayer 112D is the same as the thickness of the second electrode 22 of the first color light emitting device 20R.

[0224] Optionally, in some embodiments, Fig. 9 and Fig.10 As shown, the first protection portion 101R includes a third sublayer 113D, and the third sublayer 113D and the light-emitting functional layer 21R of the first color light-emitting device 20R are provided in the same layer and with the same material.

[0225] Optionally, in some embodiments, the second protection portion 101G further includes a third sublayer 113D.

[0226] Optionally, in some embodiments, the third protection portion 101B further includes a third sub-layer 113D.

[0227] For example, during the manufacturing process of the display panel, when the light-emitting functional layer 21 of the first color light-emitting device 20R is formed, the third sublayer 113D in the third protection portion 101B is formed at the same time, which can simplify the manufacturing process.

[0228] For example, in some embodiments, during the manufacturing process of the display panel, when the light-emitting functional layer 21 of the first color light-emitting device 20R is formed, the first protection part 101R, the second protection part 101G and the third sublayer 113D in the third protection part 101B are formed at the same time, which can simplify the manufacturing process.

[0229] Optionally, in some embodiments, the thickness of the third sublayer 113D is the same as the thickness of the light-emitting functional layer 21 of the first color light-emitting device 20R.

[0230] It should be noted that, in some embodiments, on the side surface of the isolation structure 16 facing away from the substrate 11, the third encapsulation layer 30B and the third protection portion 101B are spaced apart to ensure that the film layer of the first color light-emitting device 20R prepared earlier is completely removed in the isolation opening 16K area corresponding to the third color light-emitting device 20B.

[0231] In some embodiments, please refer to Fig. 9 and Fig.10As shown, the third protection portion 101B may further include a third sublayer 113D prepared on the same layer as the light-emitting functional layer 21 of the first color light-emitting device 20R, and a second sublayer 112D prepared on the same layer as the second electrode 22 of the first color light-emitting device 20R.

[0232] The light-emitting functional layer 21 and the second electrode 22 of the third color light-emitting device 20B can also extend to the side of the isolation structure 16 away from the substrate 11, and the light-emitting functional layer 21 and the second electrode 22 of the third color light-emitting device 20B are spaced apart from the third sublayer 113D and the second sublayer 112D of the third protective portion 101B.

[0233] In this embodiment, the first color light emitting device 20R, the first encapsulation layer 30R, the first protection portion 101R and the third protection portion 101B are all formed in the same dry etching process, and the third color light emitting device 20B is formed in another dry etching process.

[0234] In some embodiments of the present application, compared with the second color light emitting device 20G and the second packaging layer 30G, the third color light emitting device 20B and the third packaging layer 30B, the first color light emitting device 20R and the first packaging layer 30R are manufactured first, and the first protection part 101R, the second protection part 101G and the third protection part 101B are manufactured when the first color light emitting device 20R and the first packaging layer 30R are manufactured. In the subsequent manufacturing process of the second color light emitting device 20G and the second packaging layer 30G, and in the subsequent manufacturing process of the third color light emitting device 20B and the third packaging layer 30B, on the one hand, the first protection part 101R can protect the first via 131R, and can prevent the electrode or the wiring at the position of the first via 131R from being over-etched by the subsequent manufacturing process, for example, it can prevent it from being over-etched by the etching solution in the subsequent manufacturing process, thereby On the one hand, the second protection portion 101G can protect the second via 131G, and can prevent the electrode or the wiring at the second via 131G from being over-etched by the subsequent manufacturing process, for example, it can prevent it from being over-etched by the etching solution in the subsequent manufacturing process, thereby avoiding defects such as holes in the electrode or the wiring at the second via 131G, and preventing or improving display defects such as dark spots; on the third hand, the third protection portion 101B can protect the third via 131B, and can prevent the electrode or the wiring at the third via 131B from being over-etched by the subsequent manufacturing process, for example, it can prevent it from being over-etched by the etching solution in the subsequent manufacturing process, thereby avoiding defects such as holes in the electrode or the wiring at the third via 131B, and preventing or improving display defects such as dark spots.

[0235] In some embodiments, Fig. 9 and Fig.10As shown, the light-emitting device 20 also includes a light-emitting functional layer 21 and a second electrode 22, and the first electrode 14, the light-emitting functional layer 21 and the second electrode 22 are stacked in sequence on one side of the substrate 11; the first protective portion 101R also includes a second sublayer 112D located on the side of the first sublayer 111D away from the substrate 11, and a third sublayer 113D located on the side of the second sublayer 112D away from the substrate 11, the second sublayer 112D and the second electrode 22 of the first color light-emitting device 20R are arranged in the same layer and the same material, and the third sublayer 113D and the light-emitting functional layer 21 of the first color light-emitting device 20R are arranged in the same layer and the same material.

[0236] Optionally, in some embodiments, the second protection portion 101G further includes a second sublayer 112D and a third sublayer 113D.

[0237] Optionally, in some embodiments, the third protection portion 101B further includes a second sublayer 112D and a third sublayer 113D.

[0238] Optionally, in some embodiments, the thickness of the second sublayer 112D is the same as the thickness of the second electrode 22 of the first color light emitting device 20R.

[0239] Optionally, in some embodiments, the thickness of the third sublayer 113D is the same as the thickness of the light-emitting functional layer 21 of the first color light-emitting device 20R.

[0240] Optionally, in some embodiments, on a side of the corresponding via hole 131 away from the substrate 11 , the third sublayer 113D, the second sublayer 112D and the first sublayer 111D are sequentially stacked on one side of the substrate 11 .

[0241] For example, in some embodiments, please refer to Fig. 9 and Fig.10 As shown, the first protection part 101R includes a first sublayer 111D, a second sublayer 112D and a third sublayer 113D, the second protection part 101G includes a first sublayer 111D, a second sublayer 112D and a third sublayer 113D, and the third protection part 101B includes a first sublayer 111D, a second sublayer 112D and a third sublayer 113D. The first sublayer 111D and the first encapsulation layer 30R are provided in the same layer and the same material, the second sublayer 112D and the second electrode 22 of the first color light emitting device 20R are provided in the same layer and the same material, and the third sublayer 113D and the light emitting functional layer 21 of the first color light emitting device 20R are provided in the same layer and the same material. On the side of the corresponding via 131 away from the substrate 11, the third sublayer 113D, the second sublayer 112D and the first sublayer 111D are stacked in sequence on one side of the substrate 11.

[0242] It should be noted that, in some embodiments, the first protection portion 101R includes a first sublayer 111D, a second sublayer 112D, and a third sublayer 113D, the second protection portion 101G includes a first sublayer 111D, a second sublayer 112D, and a third sublayer 113D, and the third protection portion 101B includes a first sublayer 111D, a second sublayer 112D, and a third sublayer 113D. The first sublayer 111D and the first encapsulation layer 30R are provided in the same layer and the same material, the second sublayer 112D and the second electrode 22 of the first color light emitting device 20R are provided in the same layer and the same material, and the third sublayer 113D and the light emitting functional layer 21 of the first color light emitting device 20R are provided in the same layer and the same material. On the side of the corresponding via 131 away from the substrate 11, the isolation structure 16, the third sublayer 113D, the second sublayer 112D, and the first sublayer 111D are stacked in sequence on one side of the substrate 11.

[0243] It should be noted that, in some implementations, please refer to Fig. 9 and Fig.10 As shown, at the corresponding via hole 131, on the side of the isolation structure 16 away from the substrate 11, the third sublayer 113D, the second sublayer 112D and the first sublayer 111D are stacked in sequence, and the isolation structure 16 is a conductive structure. For example, the support portion 1601 is a conductive material. At this time, the protection portion 101 includes the third sublayer 113D, the second sublayer 112D and the first sublayer 111D. During the manufacturing process of the display panel, after the protection portion 101 is formed, the sublayer of non-metallic material can protect the via hole 131, and can prevent the isolation structure 16 at the via hole 131 from being over-etched by the subsequent manufacturing process. For example, it can prevent the isolation structure 16 at the via hole 131 from being over-etched by the etching solution in the subsequent manufacturing process, thereby avoiding defects such as voids in the isolation structure 16 at the via hole 131 (avoiding the damage to the complete film layer of the isolation structure 16), and preventing or improving display defects such as dark spots.

[0244] In some embodiments, the display panel 100 further includes a pixel definition layer 15, which is disposed on a side of the first insulating layer 13 away from the substrate 11, and the pixel definition layer 15 includes a pixel definition structure 151, and a plurality of pixel openings 152 surrounded by the pixel definition structure 151, the pixel opening 152 exposes a portion of the first electrode 14, and an orthographic projection of the pixel opening 152 on the substrate 11 is located within the orthographic projection range of the isolation opening 16K on the substrate 11; in a direction perpendicular to the plane where the substrate 11 is located, a portion of the pixel definition structure 151 is disposed between the protective portion 101 and the first electrode 14, and the orthographic projection of the pixel definition structure 151 on the substrate 11 covers the orthographic projection of the via 131 on the substrate 11.

[0245] For example, on the side of the corresponding via hole 131 away from the substrate 11 , the pixel definition structure 151 , the isolation structure 16 , the third sublayer 113D, the second sublayer 112D and the first sublayer 111D are sequentially stacked on one side of the substrate 11 .

[0246] For example, in some embodiments, on the side of the corresponding via hole 131 away from the substrate 11 , the pixel definition structure 151 , the isolation structure 16 , the third sublayer 113D, the second sublayer 112D and the first sublayer 111D are sequentially stacked on one side of the substrate 11 .

[0247] For example, in some embodiments, on the side of the corresponding via hole 131 away from the substrate 11, the first electrode 14, the pixel definition structure 151, the isolation structure 16 and the protection part 101 are stacked in sequence, and the protection part 101 can play a role in protecting the via hole 131. For example, the protection part 101 can prevent the isolation structure 16 at the via hole 131 from being over-etched by the etching solution in the subsequent manufacturing process, thereby preventing the isolation structure 16 at the via hole 131 from having defects such as cavities (avoiding the complete film layer of the isolation structure 16 from being damaged), and preventing or improving poor display such as dark spots. At the same time, the pixel definition structure 151 can prevent the isolation structure 16 from short-circuiting with the first electrode 14.

[0248] Second, see Figures 1 to 8 The present application provides a display panel 100, which includes a substrate 11, a first conductive layer 12, a first insulating layer 13, a plurality of light-emitting devices 20, an encapsulation layer 30, and a plurality of protective portions 101; the first conductive layer 12 is disposed on one side of the substrate 11, and the first conductive layer 12 includes a plurality of first conductive portions 121; the first insulating layer 13 is disposed on a side of the first conductive layer 12 away from the substrate 11, and the first insulating layer 13 includes a plurality of vias 131; the plurality of light-emitting devices 20 are disposed on a side of the first insulating layer 13 away from the substrate 11 The light-emitting device 20 includes a first electrode 14, which is connected to the first conductive part 121 through a corresponding via 131; the encapsulation layer 30 is arranged on a side of the light-emitting device 20 away from the substrate 11; a plurality of protection parts 101 are arranged on a side of the first electrode 14 away from the substrate 11, and the orthographic projection of the protection part 101 on the substrate 11 covers the orthographic projection of the corresponding via 131 on the substrate 11; wherein the protection part 101 includes at least a first sublayer 111D, and the first sublayer 111D and at least part of the encapsulation layer 30 are arranged in the same layer and with the same material.

[0249] In an embodiment of the present application, the first sublayer 111D and at least a portion of the encapsulation layer 30 are arranged in the same layer and the same material. The encapsulation layer 30 includes at least one film layer of inorganic material, for example, the encapsulation layer 30 includes a silicon nitride film layer and / or a silicon oxide film layer. The first sublayer 111D can protect the film layer between the via 131 and the first sublayer 111D, and can prevent the electrode or the wiring at the via 131 from being over-etched by subsequent manufacturing processes. For example, it can prevent the electrode or the wiring at the via 131 from being over-etched by the etching solution in the subsequent manufacturing process, thereby avoiding defects such as voids in the electrode or the wiring at the via 131, and preventing or improving display defects such as dark spots.

[0250] See also Fig.11 , Fig.11 A schematic diagram of a display device 200 provided in some embodiments of the present application.

[0251] Third, see Fig.11 The present application provides a display device 200, which includes the display panel 100 of any one of the above items, or the display device 200 includes the display panel 100 having any combination of the above features.

[0252] For example, the display device 200 may be a mobile phone, a laptop computer, a television, etc., but is not limited thereto.

[0253] See also Figure 2 , Figure 12 to Figure 14 , Fig.12 A schematic diagram of the process steps of a method for manufacturing a display panel provided in some embodiments of the present application. Figure 2 It is also a schematic diagram of a first intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application. Fig.13 A schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application. Fig.14 A schematic diagram of a third intermediate process of a method for manufacturing a display panel provided in some embodiments of the present application.

[0254] Fourth, please refer to Fig.12 The present application provides a method for manufacturing a display panel. Any of the above display panels can be manufactured using this method for manufacturing a display panel. The method for manufacturing a display panel includes steps S100, S200, S300, S400, S500, and S600.

[0255] In step S100 , a substrate 11 is provided.

[0256] In step S200 , a first conductive layer 12 is formed on one side of the substrate 11 , wherein the first conductive layer 12 includes a plurality of first conductive portions 121 .

[0257] In step S300 , a first insulating layer 13 is formed on a side of the first conductive layer 12 away from the substrate 11 . The first insulating layer 13 includes a plurality of vias 131 .

[0258] In step S400 , a plurality of light emitting devices 20 are formed on a side of the first insulating layer 13 away from the substrate 11 . The light emitting devices 20 include first electrodes 14 . The first electrodes 14 are connected to the first conductive parts 121 through corresponding via holes 131 .

[0259] Step S500 : forming a corresponding encapsulation layer 30 on a side of the plurality of light-emitting devices 20 away from the substrate 11 .

[0260] Step S600 , forming a plurality of protection parts 101 on a side of the first electrode 14 away from the substrate 11 , wherein the protection parts 101 include at least one sublayer of non-metallic material, and the orthographic projection of the protection parts 101 on the substrate 11 covers the orthographic projection of the corresponding via holes 131 on the substrate 11 .

[0261] In some embodiments, a plurality of light-emitting devices 20 are formed on a side of the first insulating layer 13 away from the substrate 11 (step 400), including: forming a plurality of first color light-emitting devices 20R, the first color light-emitting devices 20R including a first electrode 14, a light-emitting functional layer 21, and a second electrode 22 sequentially stacked on one side of the substrate 11;

[0262] Forming a corresponding encapsulation layer 30 on a side of the plurality of light-emitting devices 20 away from the substrate 11 (step 500), including: forming a plurality of first encapsulation layers 30R, wherein the first encapsulation layer 30R is disposed on a side of the corresponding first color light-emitting device 20R away from the substrate 11;

[0263] Forming a plurality of protection portions 101 on a side of the first electrode 14 away from the substrate 11 (step 600 ), including: forming a plurality of first protection portions 101R;

[0264] The plurality of vias 131 include a plurality of first vias 131R, the first color light emitting device 20R is connected to the corresponding first conductive portion 121 through the corresponding first vias 131R, and the orthographic projection of the first protection portion 101R on the substrate 11 covers the orthographic projection of the corresponding first via 131R on the substrate 11;

[0265] The first protection portion 101R includes a first sub-layer 111D. The first sub-layer 111D and the first encapsulation layer 30R are formed in the same layer and with the same material.

[0266] For example, Figure 2 , Fig.13 and Fig.14As shown, when the first color light emitting device 20R is formed, at least part of the sub-film layer of the first protection portion 101R, at least part of the sub-film layer of the second protection portion 101G, and at least part of the sub-film layer of the third protection portion 101B are formed simultaneously.

[0267] For example, in some other embodiments, please refer to Fig. 9 and Fig.10 , in the dry engraving process ( Fig. 9 and Fig.10 The third protection part 101B is not shown in the figure). Under the dry etching process conditions, the first protection part 101R, the second protection part 101G and the third protection part 101B include a first sublayer 111D, a second sublayer 112D and a third sublayer 113D. The first sublayer 111D and the first encapsulation layer 30R are arranged in the same layer and with the same material. The second sublayer 112D and the second electrode 22 of the first color light-emitting device 20R are arranged in the same layer and with the same material. The third sublayer 113D and the light-emitting functional layer 21 of the first color light-emitting device 20R are arranged in the same layer and with the same material.

[0268] For example, in some other embodiments, Figure 2 , Figure 4 , Figure 5 , Figure 7 and Figure 8 As shown, under the combined conditions of the dry etching process and the wet etching process, the first protecting portion 101R, the second protecting portion 101G and the third protecting portion 101B only include the first sub-layer 111D.

[0269] In some embodiments, after forming a plurality of first color light emitting devices 20R and a plurality of first encapsulation layers 30R, the method further includes: forming a plurality of second color light emitting devices 20G and a plurality of second encapsulation layers 30G, and a plurality of third color light emitting devices 20B and a plurality of third encapsulation layers 30B;

[0270] The plurality of vias 131 include a plurality of second vias 131G and a plurality of third vias 131B, the second color light emitting device 20G is connected to the corresponding first conductive portion 121 through the corresponding second vias 131G, and the third color light emitting device 20B is connected to the corresponding first conductive portion 121 through the corresponding third vias 131B;

[0271] The second encapsulation layer 30G is disposed on a side of the corresponding second color light emitting device 20G away from the substrate 11, and the third encapsulation layer 30B is disposed on a side of the corresponding third color light emitting device 20B away from the substrate 11;

[0272] When forming multiple first protection parts 101R, multiple second protection parts 101G and multiple third protection parts 101B are also formed at the same time; the orthographic projection of the second protection part 101G on the substrate 11 covers the orthographic projection of the corresponding second via 131G on the substrate 11, and the orthographic projection of the third protection part 101B on the substrate 11 covers the orthographic projection of the corresponding third via 131B on the substrate 11.

[0273] Optionally, in some embodiments, the second protecting portion 101G and the third protecting portion 101B both include a first sub-layer 111D.

[0274] For example, Figure 4 and Figure 7 As shown, after forming the first color light emitting device 20R, the first protection portion 101R, the second protection portion 101G and the third protection portion 101B, the second color light emitting device 20G and / or the third color light emitting device 20B are formed. When forming the second color light emitting device 20G and / or the third color light emitting device 20B, or performing other manufacturing processes, the first protection portion 101R can protect the first via hole 131R, the second protection portion 101G can protect the second via hole 131G, and the third protection portion 101B can protect the third via hole 131B, so as to prevent the electrode or the wiring at the via hole 131 from being over-etched by the subsequent manufacturing process, for example, it can prevent the electrode or the wiring from being over-etched by the etching solution in the subsequent manufacturing process, thereby avoiding defects such as voids in the electrode or the wiring at the via hole 131, and preventing or improving poor display such as dark spots. The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0275] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: include: substrate; A first conductive layer, disposed on one side of the substrate, the first conductive layer comprising a plurality of first conductive parts; a first insulating layer, arranged on a side of the first conductive layer away from the substrate, the first insulating layer comprising a plurality of via holes; a plurality of light emitting devices, arranged on a side of the first insulating layer away from the substrate, the light emitting devices comprising a first electrode, the first electrode being connected to the first conductive portion through the corresponding via holes; A plurality of protection parts are arranged on a side of the first electrode away from the substrate, the protection parts include at least one sublayer of non-metallic material, and the orthographic projection of the protection parts on the substrate covers the orthographic projection of the corresponding via holes on the substrate.

2. The display panel according to claim 1, characterized in that: The display panel further comprises an encapsulation layer, wherein the encapsulation layer is arranged on a side of the light emitting device away from the substrate; The protection portion includes a first sublayer, and the first sublayer and at least a portion of the encapsulation layer are provided in the same layer and with the same material.

3. The display panel according to claim 1, characterized in that: The light emitting device further comprises a light emitting functional layer and a second electrode, wherein the first electrode, the light emitting functional layer and the second electrode are sequentially stacked on one side of the substrate; The protection portion includes a second sublayer, and the second sublayer and at least a portion of the second electrode of the light-emitting device are provided in the same layer and with the same material.

4. The display panel according to claim 1, characterized in that: The light emitting device further comprises a light emitting functional layer and a second electrode, wherein the first electrode, the light emitting functional layer and the second electrode are sequentially stacked on one side of the substrate; The protection portion includes a third sublayer, and the third sublayer and the light-emitting functional layer of at least part of the light-emitting device are provided in the same layer and with the same material.

5. The display panel according to claim 1, characterized in that: The display panel further comprises an isolation structure, wherein the isolation structure is arranged on a side of the first insulating layer away from the substrate, the isolation structure encloses a plurality of isolation openings, and the light emitting device is at least partially arranged in the corresponding isolation openings; In a direction perpendicular to the plane where the substrate is located, at least a portion of the isolation structure is disposed between the protection portion and the first electrode, and an orthographic projection of the isolation structure on the substrate covers an orthographic projection of the via hole on the substrate; Optionally, the isolation structure is located on a side of the first electrode away from the substrate, the isolation opening exposes a portion of the first electrode, and the protection portion is located on a side of the isolation structure away from the substrate; Optionally, in a direction perpendicular to the plane of the substrate, the isolation structure includes a first isolation substructure having a first height and a second isolation substructure having a second height, the first isolation substructure is located on a side of the second isolation substructure close to the light-emitting device, and the orthographic projection of the second isolation substructure on the substrate overlaps with the orthographic projection of the via on the substrate.

6. The display panel according to claim 1, characterized in that: The display panel further includes a pixel definition layer, which is disposed on a side of the first insulating layer away from the substrate, the pixel definition layer includes a pixel definition structure, and a plurality of pixel openings surrounded by the pixel definition structure, and the pixel openings are disposed corresponding to the first electrode; In a direction perpendicular to the plane where the substrate is located, part of the pixel definition structure is arranged between the protection portion and the first electrode, and the orthographic projection of the pixel definition structure on the substrate covers the orthographic projection of the via hole on the substrate.

7. The display panel according to claim 5, characterized in that: The light emitting device comprises a plurality of first color light emitting devices and a plurality of second color light emitting devices, wherein the first color light emitting devices and the second color light emitting devices emit light of different colors; The vias include a plurality of first vias and a plurality of second vias, the first color light emitting devices are connected to the corresponding first conductive parts through the corresponding first vias, and the second color light emitting devices are connected to the corresponding first conductive parts through the corresponding second vias; The first via hole is located on a side of the isolation structure surrounding the first color light emitting device close to the substrate, and the second via hole is located on a side of the isolation structure surrounding the second color light emitting device close to the substrate.

8. The display panel according to claim 7, characterized in that: The display panel further includes an encapsulation layer, which is disposed on a side of the light-emitting device away from the substrate, and includes a plurality of first encapsulation layers and a plurality of second encapsulation layers, wherein the first encapsulation layer is disposed on a side of the corresponding first-color light-emitting device away from the substrate, and a portion of the first encapsulation layer extends to a side of the isolation structure enclosing the first-color light-emitting device away from the substrate; The second encapsulation layer is disposed on a side of the corresponding second color light emitting device away from the substrate, and a portion of the second encapsulation layer extends to a side of the isolation structure enclosing the second color light emitting device away from the substrate; Optionally, the first encapsulation layer and the second encapsulation layer each include a first encapsulation portion located in the isolation opening and a second encapsulation portion located on a side of the isolation structure away from the substrate; Optionally, a first gap is formed between the first encapsulation layer and a surface of the isolation structure facing away from the substrate, and a second gap is formed between the second encapsulation layer and a surface of the isolation structure facing away from the substrate, and the first gap is different from the second gap; Optionally, part of the second encapsulation portion of the second encapsulation layer extends to a side of the second encapsulation portion of the first encapsulation layer away from the substrate, and a second gap is provided between part of the second encapsulation portion of the second encapsulation layer and a surface of a side of the second encapsulation portion of the first encapsulation layer away from the substrate.

9. The display panel according to claim 8, characterized in that: The plurality of protection parts include a plurality of first protection parts and a plurality of second protection parts, the orthographic projection of the first protection part on the substrate covers the orthographic projection of the corresponding first via hole on the substrate, and the orthographic projection of the second protection part on the substrate covers the orthographic projection of the corresponding second via hole on the substrate; Optionally, the first protection portion and the second protection portion both include a first sublayer, and the first sublayer and the first encapsulation layer are provided in the same layer and with the same material; Optionally, the thickness of the first sub-layer is the same as the thickness of the first encapsulation layer; Optionally, the first protection portion is connected to the first encapsulation layer; Optionally, a side of the second protection portion close to the first color light emitting device is connected to the first encapsulation layer; Optionally, at least part of the second encapsulation portion of the second encapsulation layer is located on a side of the second protection portion away from the substrate; Optionally, an orthographic projection of the second encapsulation portion of the second encapsulation layer on the substrate at least partially overlaps with an orthographic projection of the second protection portion on the substrate.

10. The display panel according to claim 9, characterized in that: The light emitting device further comprises a light emitting functional layer and a second electrode, wherein the first electrode, the light emitting functional layer and the second electrode are sequentially stacked on one side of the substrate; Optionally, the first protection portion and the second protection portion both include a second sublayer, and the second sublayer and the second electrode of the first color light-emitting device are provided in the same layer and with the same material; Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode of the first color light emitting device; Optionally, the first protection portion and the second protection portion both further include a third sublayer, and the third sublayer and the light-emitting functional layer of the first color light-emitting device are provided in the same layer and with the same material; Optionally, the thickness of the third sublayer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device.

11. The display panel according to claim 9, characterized in that: The light emitting device further comprises a plurality of third color light emitting devices, wherein the first color light emitting device, the second color light emitting device and the third color light emitting device respectively emit light of different colors; The vias further include a plurality of third vias, and the third color light emitting device is connected to the corresponding first conductive part through the corresponding third vias; The third via hole is located on a side of the isolation structure surrounding the third color light emitting device close to the substrate; The encapsulation layer further includes a plurality of third encapsulation layers, wherein the third encapsulation layers are arranged on a side of the corresponding third color light emitting device away from the substrate, and a portion of the third encapsulation layers extend to a side of the isolation structure enclosing the third color light emitting device away from the substrate; Optionally, the first encapsulation layer and the third encapsulation layer each include a first encapsulation portion located in the isolation opening and a second encapsulation portion located on a side of the isolation structure away from the substrate; Optionally, a first gap is formed between the first encapsulation layer and a surface of the isolation structure facing away from the substrate, a third gap is formed between the third encapsulation layer and a surface of the isolation structure facing away from the substrate, and the first gap is different from the third gap; Optionally, part of the second encapsulation portion of the third encapsulation layer extends to a side of the second encapsulation portion of the first encapsulation layer away from the substrate, and part of the second encapsulation portion of the third encapsulation layer and a side of the second encapsulation portion of the first encapsulation layer away from the substrate have the third gap.

12. The display panel according to claim 11, characterized in that: The plurality of protection parts further include a plurality of third protection parts, and the orthographic projections of the third protection parts on the substrate cover the orthographic projections of the corresponding third via holes on the substrate; Optionally, the third protection portion includes the first sublayer.

13. The display panel according to claim 12, characterized in that: The light emitting device further comprises a light emitting functional layer and a second electrode, wherein the first electrode, the light emitting functional layer and the second electrode are sequentially stacked on one side of the substrate; Optionally, the first protection portion includes a second sublayer, and the second sublayer and the second electrode of the first color light-emitting device are provided in the same layer and with the same material; Optionally, the second protection portion includes the second sublayer; Optionally, the third protection portion includes the second sublayer; Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode of the first color light emitting device; Optionally, the first protection portion includes a third sublayer, and the third sublayer and the light-emitting functional layer of the first color light-emitting device are arranged in the same layer and with the same material; Optionally, the second protection portion further includes the third sublayer; Optionally, the third protection portion further includes the third sublayer; Optionally, the thickness of the third sublayer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device.

14. The display panel according to claim 12, characterized in that: The light emitting device further comprises a light emitting functional layer and a second electrode, wherein the first electrode, the light emitting functional layer and the second electrode are sequentially stacked on one side of the substrate; The first protection portion further includes a second sublayer located on a side of the first sublayer away from the substrate and a third sublayer located on a side of the second sublayer away from the substrate, the second sublayer and the second electrode of the first color light-emitting device are arranged in the same layer and the same material, and the third sublayer and the light-emitting functional layer of the first color light-emitting device are arranged in the same layer and the same material; Optionally, the second protection portion further includes the second sublayer and the third sublayer; Optionally, the third protection portion further includes the second sublayer and the third sublayer; Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode of the first color light emitting device; Optionally, the thickness of the third sublayer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device; Optionally, on a side of the corresponding via hole away from the substrate, the third sub-layer, the second sub-layer and the first sub-layer are stacked in sequence on one side of the substrate.

15. The display panel according to claim 5, characterized in that: The display panel further comprises a pixel definition layer, the pixel definition layer is arranged on a side of the first insulating layer away from the substrate, the pixel definition layer comprises a pixel definition structure, and a plurality of pixel openings surrounded by the pixel definition structure, the pixel openings expose a portion of the first electrode, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the isolation opening on the substrate; In a direction perpendicular to the plane where the substrate is located, part of the pixel definition structure is arranged between the protection portion and the first electrode, and the orthographic projection of the pixel definition structure on the substrate covers the orthographic projection of the via hole on the substrate.

16. A display panel, characterized in that: include: substrate; A first conductive layer, disposed on one side of the substrate, the first conductive layer comprising a plurality of first conductive parts; A first insulating layer, disposed on a side of the first conductive layer away from the substrate, the first insulating layer comprising a plurality of vias; A plurality of light-emitting devices are arranged on a side of the first insulating layer away from the substrate, the light-emitting devices comprising a first electrode, and the first electrode is connected to the first conductive part through the corresponding via hole; An encapsulation layer, disposed on a side of the light emitting device away from the substrate; A plurality of protection parts are arranged on a side of the first electrode away from the substrate, wherein the orthographic projections of the protection parts on the substrate cover the orthographic projections of the corresponding via holes on the substrate; The protection portion at least includes a first sub-layer, and the first sub-layer and at least a portion of the encapsulation layer are provided in the same layer and with the same material.

17. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 16.

18. A method for manufacturing a display panel, characterized in that: include: providing a substrate; forming a first conductive layer on one side of the substrate, wherein the first conductive layer includes a plurality of first conductive parts; forming a first insulating layer on a side of the first conductive layer away from the substrate, wherein the first insulating layer comprises a plurality of via holes; A plurality of light-emitting devices are formed on a side of the first insulating layer away from the substrate, wherein the light-emitting devices include first electrodes, and the first electrodes are connected to the first conductive parts through corresponding via holes; forming a corresponding encapsulation layer on a side of the plurality of light-emitting devices away from the substrate; A plurality of protection parts are formed on a side of the first electrode away from the substrate, the protection parts comprising at least one sublayer of a non-metallic material, and the orthographic projections of the protection parts on the substrate cover the orthographic projections of the corresponding via holes on the substrate.

19. The method for manufacturing a display panel according to claim 18, characterized in that: The forming of a plurality of light-emitting devices on a side of the first insulating layer away from the substrate comprises: forming a plurality of first-color light-emitting devices, wherein the first-color light-emitting devices comprise a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on one side of the substrate; The forming of a corresponding encapsulation layer on a side of the plurality of light-emitting devices away from the substrate comprises: forming a plurality of first encapsulation layers, wherein the first encapsulation layer is arranged on a side of the corresponding first color light-emitting device away from the substrate; The forming of a plurality of protection parts on a side of the first electrode away from the substrate comprises: forming a plurality of first protection parts; The plurality of via holes include a plurality of first via holes, the first color light emitting device is connected to the corresponding first conductive part through the corresponding first via holes, and the orthographic projection of the first protection part on the substrate covers the orthographic projection of the corresponding first via hole on the substrate; The first protection portion includes a first sublayer, and the first sublayer and the first encapsulation layer are provided in the same layer and with the same material.

20. The method for manufacturing a display panel according to claim 19, wherein: After forming a plurality of the first color light emitting devices and a plurality of the first encapsulation layers, the method further includes: forming a plurality of second color light emitting devices and a plurality of second encapsulation layers, and a plurality of third color light emitting devices and a plurality of third encapsulation layers; The plurality of via holes include a plurality of second via holes and a plurality of third via holes, the second color light emitting device is connected to the corresponding first conductive part through the corresponding second via hole, and the third color light emitting device is connected to the corresponding first conductive part through the corresponding third via hole; The second encapsulation layer is disposed on a side of the corresponding second color light emitting device away from the substrate, and the third encapsulation layer is disposed on a side of the corresponding third color light emitting device away from the substrate; When forming a plurality of the first protection parts, a plurality of second protection parts and a plurality of third protection parts are also formed at the same time; the orthographic projection of the second protection part on the substrate covers the orthographic projection of the corresponding second via hole on the substrate, and the orthographic projection of the third protection part on the substrate covers the orthographic projection of the corresponding third via hole on the substrate; Optionally, both the second protecting portion and the third protecting portion include the first sublayer.

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