Display panel and display device

Abstract

The embodiment of the invention provides a display panel and a display device, the display panel is provided with a display area, a light-transmitting area and a packaging area, the display area is arranged around at least part of the light-transmitting area, and the packaging area is located between the display area and the light-transmitting area; the display panel comprises a substrate, an isolation structure, a light-emitting function layer, a first packaging layer and an electrostatic protection structure, the isolation structure is arranged on one side of the substrate, the isolation structure is located in a display area, and a plurality of limiting openings are defined by the isolation structure; the light-emitting functional layer comprises a plurality of light-emitting units located in the display area, and at least parts of the light-emitting units are arranged in the limited openings; the electrostatic protection structure is arranged on one side of the substrate, and the electrostatic protection structure is arranged in the packaging area. According to the display panel, the electrostatic protection structure is arranged in the packaging area, so that the antistatic capacity of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and display panels based on light emitting diode (LED) technologies have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages of high image quality, power saving, thin body and wide application range, becoming the mainstream of display devices. However, some areas of current display panels have poor anti-static ability, which easily leads to poor display. Summary of the invention

[0003] Embodiments of the present application provide a display panel and a display device, which are intended to optimize the anti-static capability of the display panel and improve the quality of the displayed image.

[0004] An embodiment of a first aspect of the present application provides a display panel, the display panel having a display area, a light-transmitting area and a packaging area, the display area is arranged around at least a portion of the light-transmitting area, and the packaging area is located between the display area and the light-transmitting area; the display panel comprises:

[0005] substrate;

[0006] An isolation structure is disposed on one side of the substrate, the isolation structure is located in the display area, and the isolation structure encloses a plurality of defined openings;

[0007] The light-emitting functional layer includes a plurality of light-emitting units located in the display area, and at least a portion of the light-emitting units is disposed in the defined opening;

[0008] The electrostatic protection structure is arranged on one side of the substrate and is arranged in the packaging area.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic protection structure is disposed around at least a portion of the light-transmitting area.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic protection structure includes a plurality of electrostatic conduction parts, and the plurality of electrostatic conduction parts are sequentially spaced from each other along a direction from the light-transmitting area to the display area.

[0011] According to any of the aforementioned implementations of the first aspect of the present application, the electrostatic conduction portion is ring-shaped, and a plurality of electrostatic conduction portions are arranged in sequence from the light-transmitting area to the display area.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic protection structure further includes a connecting portion, which connects adjacent electrostatic conductive portions.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the spacing distance between adjacent electrostatic conductive parts is greater than or equal to 3 microns.

[0014] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a first dielectric layer, and at least a portion of the first dielectric layer is located between adjacent electrostatic conductive portions.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the first dielectric layer is located on a side of the electrostatic protection structure facing away from the substrate, and the orthographic projection of the first dielectric layer on the substrate covers the orthographic projection of the electrostatic protection structure on the substrate.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first dielectric layer on the substrate partially overlaps with the orthographic projection of the electrostatic protection structure on the substrate, and the first dielectric layer includes a plurality of spaced first dielectric sub-parts, and the first dielectric sub-parts are located between adjacent electrostatic conductive parts.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, a surface of the first dielectric sub-portion facing away from the substrate protrudes in a direction away from the substrate relative to a surface of the electrostatic conductive portion facing away from the substrate.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the surface of the first dielectric sub-part facing away from the substrate and the surface of the electrostatic protection structure facing away from the substrate are in the same reference plane.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, at least a portion of the first dielectric layer is located between the isolation structure and the electrostatic conductive portion.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the substrate includes a substrate and a driving circuit layer, the driving circuit layer is arranged between the substrate and the light-emitting functional layer, the driving circuit layer includes a plurality of conductive layers arranged in sequence and spaced apart in a direction away from the substrate, a portion of at least one of the plurality of conductive layers is located in the packaging area and is reused as at least a portion of the electrostatic protection structure.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the multiple conductive layers located in the encapsulation area are insulated from the multiple conductive layers located in the display area.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive layer located in the packaging area is grounded.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic protection structure includes a plurality of electrostatic conduction parts that are spaced apart, and the plurality of electrostatic conduction parts are the same conductive layer.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic protection structure includes a plurality of electrostatic conduction parts that are spaced apart, and at least two of the plurality of electrostatic conduction parts are different conductive layers.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the multiple conductive layers include a first conductive layer, the first conductive layer includes a source, a drain and a first electrostatic conduction part, the source and the drain are located in the display area, and the first electrostatic conduction part is arranged in the packaging area and reused as the electrostatic conduction part.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the multiple conductive layers include a second conductive layer, the second conductive layer includes a gate and a second electrostatic conduction part, the gate is located in the display area, and the second electrostatic conduction part is arranged in the packaging area and reused as the electrostatic conduction part.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the multiple conductive layers include a third conductive layer and a fourth conductive layer, the third conductive layer includes a first electrode plate, the fourth conductive layer includes a second electrode plate and a third electrostatic conduction portion, the orthographic projection of the first electrode plate on the substrate at least partially overlaps with the orthographic projection of the second electrode plate on the substrate, and the third electrostatic conduction portion is arranged in the packaging area and reused as the electrostatic conduction portion.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the driving circuit layer includes at least one dielectric layer, the dielectric layer includes a first dielectric portion located in the packaging area and a second dielectric portion located in the display area, the second dielectric portion covers a side of any conductive layer facing away from the substrate, and at least a portion of the first dielectric portion is located between adjacent electrostatic conductive portions.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the driving circuit layer includes a second dielectric layer, the second dielectric layer is arranged on the side of the first conductive layer facing away from the substrate, at least part of the first dielectric portion of the second dielectric layer is located between adjacent electrostatic conductive portions, and the second dielectric portion of the second dielectric layer covers the side of the gate facing away from the substrate.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, a surface of the first dielectric portion of the second dielectric layer facing away from the substrate is protruding relative to the electrostatic conductive portion.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the surface of the first dielectric portion of the second dielectric layer facing away from the substrate is in the same reference plane as the electrostatic conductive portion.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further comprises a touch layer, which is located on the side of the light-emitting functional layer away from the substrate, and a portion of the touch layer is located in the packaging area to form at least a portion of the electrostatic protection structure.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the touch layer includes a touch electrode layer, the touch electrode layer includes a touch electrode located in the display area and an electrostatic protection structure located in the packaging area, and the touch electrode is insulated from the electrostatic protection structure.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, the touch layer includes a first touch sublayer and a second touch sublayer, and the first touch sublayer includes a first touch electrode located in the display area and the electrostatic protection structure located in the packaging area.

[0035] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes:

[0036] A first touch-control encapsulation layer, located on a side of the touch-control layer close to the substrate;

[0037] The second touch-control encapsulation layer is located on a side of the touch-control layer away from the substrate, and the electrostatic protection structure is located between the first touch-control encapsulation layer and the second touch-control encapsulation layer.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the first touch control encapsulation layer and the second touch control encapsulation layer are in contact and stacked on a side of the electrostatic protection structure away from the display area.

[0039] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a dam structure, which is arranged on one side of the substrate, the dam structure is arranged around the display area, and at least a portion of the dam structure is located between the isolation structure and the electrostatic protection structure.

[0040] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic protection structure is grounded.

[0041] According to any of the aforementioned embodiments of the first aspect of the present application, the surface of the dam structure facing away from the substrate is protruded in a direction away from the substrate relative to the electrostatic protection structure.

[0042] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the dam structure along the direction away from the substrate is greater than the thickness of the electrostatic protection structure along the direction away from the substrate.

[0043] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the dam structure on the substrate at least partially overlaps with the orthographic projection of the electrostatic protection structure on the substrate.

[0044] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic protection structure includes a plurality of electrostatic conducting parts that are spaced apart, and an orthographic projection of at least one electrostatic conducting part on the substrate is located within an orthographic projection of the dam structure on the substrate.

[0045] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a first dielectric layer, and at least a portion of the first dielectric layer is located between adjacent electrostatic conductive portions.

[0046] The surface of the dam structure facing away from the substrate is protruded in a direction facing away from the substrate relative to the surface of the first dielectric layer facing away from the substrate.

[0047] According to any of the aforementioned embodiments of the first aspect of the present application, the substrate includes a substrate and a driving circuit layer, the driving circuit layer is arranged between the substrate and the light-emitting functional layer, the driving circuit layer includes at least one conductive layer and at least one dielectric layer, the dielectric layer includes a first dielectric portion located in the packaging area and a second dielectric portion located in the display area, at least a portion of the first dielectric portion is located between the isolation structure and the electrostatic conduction portion, and the second dielectric portion covers a side of any conductive layer away from the substrate; at least a portion of the first dielectric portion is at least a portion of the dam structure.

[0048] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the dam structure on the substrate is spaced apart from the orthographic projection of the electrostatic protection structure on the substrate, and the orthographic projection of the dam structure on the substrate is located within the orthographic projection of the first dielectric portion on the substrate.

[0049] According to any of the aforementioned embodiments of the first aspect of the present application, the first dielectric portions of at least two dielectric layers are stacked in a direction away from the substrate and form at least a portion of the dam structure.

[0050] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes:

[0051] The pixel definition layer is arranged between the substrate and the isolation structure. The pixel definition layer includes a pixel opening, which is connected to the corresponding limiting opening. The light-emitting unit is at least partially arranged in the pixel opening.

[0052] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the pixel opening on the substrate is located within a range of the orthographic projection of the opening on the substrate.

[0053] According to any of the aforementioned embodiments of the first aspect of the present application, part of the pixel definition layer is located on the side of the electrostatic protection structure facing away from the substrate, and the orthographic projection of the electrostatic protection structure on the substrate is located within the orthographic projection of the pixel definition layer on the substrate.

[0054] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel definition layer includes a first division, a second division, and a third division connected in sequence, the first division is located in the display area and between the isolation structure and the substrate, the second division is located between the isolation structure and the electrostatic protection structure, and the third division is located on the side of the electrostatic protection structure facing away from the substrate.

[0055] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic protection structure includes a plurality of electrostatic conduction parts that are spaced apart from each other, and a portion of the third section is located between adjacent electrostatic conduction parts.

[0056] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic protection structure includes a plurality of electrostatic conductive parts arranged at intervals, the display panel further includes a first dielectric layer, the first dielectric layer includes a plurality of first dielectric sub-parts spaced apart, and the first dielectric sub-parts are located between adjacent electrostatic conductive parts;

[0057] The third portion is located on a side of the first dielectric layer facing away from the substrate and is in contact with the first dielectric layer.

[0058] According to any of the aforementioned embodiments of the first aspect of the present application, a second gap is provided between adjacent first dielectric sub-portions, and a portion of the third sub-portion is located in the second gap and in contact with the electrostatic conductive portion.

[0059] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel definition layer includes a fourth section, the fourth section is connected to an end of the third section away from the second section, and the fourth section is stacked on one side of the substrate and in contact with the substrate.

[0060] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a first encapsulation layer,

[0061] In the display area, a first gap is provided between the first encapsulation layer and the pixel definition layer; the light-emitting functional layer and the isolation structure are arranged in the first gap;

[0062] In the encapsulation area, the first encapsulation layer is stacked on a side of the pixel definition layer away from the substrate, and the stacked first encapsulation layer and the pixel definition layer block the first gap.

[0063] According to any of the aforementioned embodiments of the first aspect of the present application, the first encapsulation layer is arranged around the light-transmitting area.

[0064] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a second encapsulation layer, the second encapsulation layer is disposed in the display area, and the second encapsulation layer is located between the first encapsulation layer and the pixel definition layer.

[0065] According to any of the aforementioned embodiments of the first aspect of the present application, the second encapsulation layer covers a side of the light-emitting functional layer facing away from the substrate and a side of the isolation structure facing away from the substrate.

[0066] According to any of the aforementioned embodiments of the first aspect of the present application, the first encapsulation layer includes a first encapsulation portion and a second encapsulation portion connected to each other, the first encapsulation portion is located in the display area, the first encapsulation portion is located on the side of the second encapsulation layer away from the substrate, the second encapsulation portion is located in the encapsulation area, and the second encapsulation portion is located on the side of the pixel definition layer away from the substrate.

[0067] According to any of the aforementioned embodiments of the first aspect of the present application, the distance from the surface of the second packaging layer facing away from the substrate to the substrate is greater than the distance from the surface of the electrostatic protection structure facing away from the substrate to the substrate.

[0068] According to any of the aforementioned embodiments of the first aspect of the present application, the distance from the first packaging portion to the substrate is greater than the distance from the second packaging portion to the substrate.

[0069] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the first packaging portion along the direction away from the substrate is the same as the thickness of the second packaging portion along the direction away from the substrate.

[0070] According to any of the aforementioned embodiments of the first aspect of the present application, the second encapsulation layer is an organic material layer.

[0071] According to any of the aforementioned embodiments of the first aspect of the present application, the first encapsulation layer is an inorganic material layer.

[0072] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further comprises a dam structure, the dam structure is disposed on one side of the substrate, the dam structure is disposed around the display area, and at least a portion of the second encapsulation layer is located between the isolation structure and the dam structure;

[0073] According to any of the aforementioned embodiments of the first aspect of the present application, part of the second encapsulation layer is located on the side of the dam structure facing away from the substrate, and the orthographic projection of the second encapsulation layer on the substrate partially overlaps with the orthographic projection of the dam structure on the substrate.

[0074] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel definition layer is located on a side of the dam structure away from the substrate, and a portion of the pixel definition layer is located between the second encapsulation layer and the dam structure;

[0075] The orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the dam structure on the substrate.

[0076] According to any of the aforementioned implementations of the first aspect of the present application, the pixel definition layer extends along the dam structure.

[0077] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel definition layer includes a second section, the second section is located between the isolation structure and the electrostatic protection structure, and at least a portion of the second encapsulation layer is located on a side of the second section away from the electrostatic protection structure.

[0078] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel definition layer includes a third section, the third section is connected to one end of the second section close to the light-transmitting area, and the dam structure, the third section and the first encapsulation layer are stacked in sequence in a direction away from the substrate.

[0079] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic protection structure includes a plurality of electrostatic conduction parts arranged at intervals, the display panel also includes a first dielectric layer, at least a portion of the first dielectric layer is located between adjacent electrostatic conduction parts, a third gap is provided between the dam structure and the first dielectric layer, a portion of the third division is located in the third gap and in contact with the electrostatic protection structure.

[0080] According to any of the aforementioned implementations of the first aspect of the present application, the encapsulation area includes a first encapsulation area and a second encapsulation area, and the display area, the first encapsulation area, the second encapsulation area and the light-transmitting area are arranged in sequence; and the display panel further includes:

[0081] A pixel definition layer is disposed between the substrate and the isolation structure, the pixel definition layer includes a pixel opening, the pixel opening is connected to the corresponding limiting opening, and the light emitting unit is at least partially disposed in the pixel opening;

[0082] A first encapsulation layer is located on a side of the light-emitting functional layer away from the substrate;

[0083] In the first packaging area, the substrate, the electrostatic protection structure, the pixel definition layer and the first packaging layer are sequentially arranged in a direction away from the substrate;

[0084] In the second packaging area, the substrate, the pixel definition layer and the first packaging layer are stacked in sequence along a direction away from the substrate.

[0085] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes:

[0086] The first dielectric layer includes a second dielectric sub-portion, the second dielectric sub-portion surrounds the side of the electrostatic protection structure away from the display area, and a portion of the pixel definition layer is arranged around the side of the second dielectric sub-portion away from the display area.

[0087] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes:

[0088] A first encapsulation layer is located in the display area and the encapsulation area, and the first encapsulation layer is located on a side of the light-emitting functional layer, the isolation structure and the electrostatic protection structure away from the substrate;

[0089] The cover plate is located on the side of the first packaging layer facing away from the substrate, and the cover plate is located in the display area, the packaging area and the light-transmitting area.

[0090] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes:

[0091] The polarizing layer, the first encapsulation layer, the polarizing layer and the cover plate are stacked in sequence in a direction away from the substrate, the surface of the first encapsulation layer away from the substrate is non-planar, and the surface of the polarizing layer away from the substrate is planar.

[0092] According to any of the aforementioned embodiments of the first aspect of the present application, the polarizing layer is arranged around the light-transmitting area.

[0093] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first isolation layer and a second isolation layer that are stacked together, the first isolation layer is arranged on a side of the second isolation layer close to the substrate, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate.

[0094] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection area of ​​the surface of the second isolation layer facing away from the substrate on the substrate is smaller than the orthographic projection area of ​​the surface of the second isolation layer close to the substrate on the substrate.

[0095] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection area of ​​the surface of the first isolation layer facing away from the substrate on the substrate is smaller than the orthographic projection area of ​​the surface of the second isolation layer close to the substrate on the substrate.

[0096] An embodiment of the second aspect of the present application further provides a display device, comprising a display panel of any embodiment of the first aspect.

[0097] In the display panel and display device provided in the embodiments of the present application, when preparing the display panel provided in the present application, a substrate, an isolation structure and a light-emitting functional layer can be set first. Since the isolation structure is spaced between adjacent light-emitting units, it is unnecessary to set structures such as isolation columns in the packaging area to isolate the common layer of adjacent light-emitting units, and it is unnecessary to prepare the common layer of the light-emitting units in the packaging area. By setting the electrostatic protection structure in the packaging area, the electrostatic protection structure can guide the static electricity entering the display panel from the light-transmitting area, avoid static electricity interfering with the light-emitting units located in the display area, improve the anti-static ability of the display panel, and improve the quality of the display image of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0098] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0099] Figure 1 is a schematic diagram of a planar structure of a display panel provided in some embodiments of the present application;

[0100] Figure 2 is along Figure 1 A schematic diagram of a partial cross-sectional structure of line AA shown;

[0101] Figure 3 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0102] Figure 4 is a partial planar structural schematic diagram of a display panel provided in some embodiments of the present application;

[0103] Figure 5 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0104] Figure 6 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0105] Figure 7 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0106] Figure 8 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0107] Fig. 9 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0108] Fig.10 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0109] Fig.11 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0110] Fig.12 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0111] Fig.13 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0112] Fig.14 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0113] Fig.15 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0114] Fig.16 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0115] Fig.17 is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application;

[0116] Fig.18 It is a schematic diagram of a partial cross-sectional structure of a display panel provided in some embodiments of the present application.

[0117] Description of reference numerals:

[0118] 100, display panel; AA, display area; TA, light-transmitting area; PA, packaging area; PA1, first packaging area; PA2, second packaging area; 101, light-transmitting hole;

[0119] 1. substrate; 11. underlay; 12. driving circuit layer; 121. conductive layer; 121a. first conductive layer; 121b. second conductive layer; third conductive layer; fourth conductive layer; 13. transistor; 131. source; 132. drain; 133. gate; 134. active layer; 135. first plate; 136. second plate; 122. dielectric layer; 122a. second dielectric layer; 1221. first dielectric portion; 1222. second dielectric portion; 122b. third dielectric layer;

[0120] 2. Isolation structure; 21. First isolation layer; 22. Second isolation layer; 23. Defined opening; 24. Third isolation layer;

[0121] 31. Light-emitting unit; 32. First electrode; 33. Second electrode;

[0122] 4. Electrostatic protection structure; 41. Electrostatic conduction part; 42. Connecting part;

[0123] 5. a first dielectric layer; 51. a first dielectric subunit;

[0124] 6. Touch layer; 61. Touch electrode; 62. First touch encapsulation layer; 63. Second touch encapsulation layer;

[0125] 71, dam structure; 72, pixel definition layer; 721, pixel opening; 722, first subdivision; 723, second subdivision; 724, third subdivision; 725, fourth subdivision;

[0126] 81, first encapsulation layer; 811, first encapsulation part; 812, second encapsulation part; 82, second encapsulation layer; 83, third encapsulation layer; 831, third encapsulation part;

[0127] 91. optical adhesive layer; 92. cover plate; 93. polarizing layer;

[0128] G1, first gap; G2, second gap; G3, third gap;

[0129] X, first direction. DETAILED DESCRIPTION

[0130] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0131] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0132] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0133] A light-transmitting area for light to pass through is provided in the display panel, and the light-emitting functional layer in the display panel is provided around the light-transmitting area, so it is necessary to encapsulate the edge of the light-emitting functional layer provided around the light-transmitting area. When encapsulating in the related art, an isolation column is provided to separate the common layer of the light-emitting functional layer, and all or part of the common layer has the function of preventing static electricity. If the isolation column and the common layer are not provided in the encapsulation area, the anti-static ability of the display panel will be poor, which may easily lead to poor display.

[0134] In order to solve the above problems, embodiments of the present application provide a display panel and a display device. Embodiments of the display panel and the display device will be described below in conjunction with the accompanying drawings.

[0135] In a first aspect, the present application provides a display panel 100, such as Figure 1 , Figure 2 and Figure 3As shown, the display panel 100 has a display area AA, a light-transmitting area TA and a packaging area PA, the display area AA is arranged around at least a portion of the light-transmitting area TA, and the packaging area PA is located between the display area AA and the light-transmitting area TA; the display panel 100 includes: a substrate 1, an isolation structure 2, a light-emitting functional layer and an electrostatic protection structure 4, the isolation structure 2 is arranged on one side of the substrate 1, the isolation structure 2 is located in the display area AA, and the isolation structure 2 surrounds a plurality of defined openings 23; the light-emitting functional layer includes a plurality of light-emitting units 31 located in the display area AA, and at least a portion of the light-emitting units 31 is arranged in the defined openings 23; the electrostatic protection structure 4 is arranged on one side of the substrate 1, and the electrostatic protection structure 4 is arranged in the packaging area PA.

[0136] In the display panel 100 provided in the embodiment of the present application, the display panel 100 may be a display panel 100 based on organic light emitting diode (OLED) technology. The isolation structure 2 is described in the patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, 202310909421.5, 202311117143.6, and 202310692671.8 for reference.

[0137] In the display panel 100 provided in the embodiment of the present application, the substrate 1 can not only provide support force for the isolation structure 2, but also provide electrical signals for the light-emitting functional layer.

[0138] The isolation structure 2 is surrounded by a plurality of defined openings 23, and adjacent defined openings 23 are spaced apart by the isolation structure 2. The number of defined openings 23 may correspond to the number of light emitting units 31. The plurality of light emitting units 31 may be light emitting units 31 capable of emitting light of different colors. For example, there may be a red light emitting unit capable of emitting red light, a green light emitting unit capable of emitting green light, and a blue light emitting unit capable of emitting blue light.

[0139] The light-transmitting area TA, the encapsulation area PA and the display area AA can be arranged in sequence from the inside to the outside. The light transmittance of the light-transmitting area TA is greater than the light transmittance of the display area AA, so that the light entering the display panel 100 from one side of the display panel 100 can pass through the light-transmitting area TA and be emitted from the other side of the display panel 100. A light sensor is suitably arranged on one side of the light-transmitting area TA, and the light sensor located on one side of the display panel 100 receives the light to realize photoelectric conversion. The light sensor can specifically be an infrared sensor, a camera, etc. The shape of the light-transmitting area TA can be adapted to the shape of the light sensor, so that all the light emitted from the light-transmitting area TA can be incident on the light sensor.

[0140] The display panel 100 provided in the present application may also include a cover plate 92 located on the side of the light-emitting functional layer away from the substrate 1, a touch layer 6 located between the cover plate 92 and the light-emitting functional layer, an optical adhesive layer 91 located between the cover plate 92 and the touch layer 6, etc. The cover plate 92 provides protection for the display panel 100 to prevent external forces from scratching or damaging the display panel 100. The touch layer 6 can realize the touch function. The optical adhesive layer 91 bonds the cover plate 92 and the touch layer 6. Part of the cover plate 92 is located in the light-transmitting area TA, so that the cover plate 92 can also protect the light sensor arranged on one side of the light-transmitting area TA.

[0141] When preparing the display panel 100 provided in the present application, a substrate 1, an isolation structure 2 and a light-emitting functional layer can be set first. Since the isolation structure 2 is spaced between adjacent light-emitting units 31, it is unnecessary to set an isolation column or other structure in the packaging area PA to isolate the common layer of adjacent light-emitting units 31, and it is unnecessary to prepare the common layer of the light-emitting units 31 in the packaging area PA. By setting the electrostatic protection structure 4 in the packaging area PA, the electrostatic protection structure 4 can guide the static electricity entering the display panel 100 from the light-transmitting area TA, avoid static electricity interfering with the light-emitting unit 31 located in the display area AA, improve the anti-static ability of the display panel 100, and improve the quality of the display image of the display panel 100.

[0142] See also Figure 4 and Figure 5 In some embodiments, the electrostatic protection structure 4 is disposed around at least a portion of the light-transmitting area TA, so that at least a portion of the circumference of the light-transmitting area TA can be protected by the electrostatic protection structure 4 to prevent static electricity from entering the display area AA from the light-transmitting area TA.

[0143] See also Figure 3 In some embodiments, the electrostatic protection structure 4 is a conductive block continuously laid in the packaging area PA. Figure 4 and Figure 5 In some other embodiments, the electrostatic protection structure 4 includes a plurality of electrostatic conduction parts 41, and the plurality of electrostatic conduction parts 41 are arranged at intervals.

[0144] One electrostatic conductive portion 41 can provide a conductive path for static electricity entering the packaging area PA, and multiple electrostatic conductive portions 41 are beneficial to increase the dispersion path of electrostatic charges and reduce local charge accumulation. Multiple electrostatic conductive portions 41 can be electrically connected to the same or different ground structures.

[0145] In some embodiments, the static electricity conducting portion 41 is ring-shaped, and a plurality of static electricity conducting portions 41 are sequentially arranged along a direction from the light-transmitting area TA to the display area AA.

[0146] The static electricity conducting portion 41 is arranged in a ring shape, so that each static electricity conducting portion 41 can surround the peripheral side of the light-transmitting area TA, thereby effectively preventing static electricity from entering the display area AA from the light-transmitting area TA.

[0147] In some embodiments, the electrostatic protection structure 4 further includes a connecting portion 42 , and the connecting portion 42 connects adjacent electrostatic conductive portions 41 .

[0148] The connecting portion 42 connects adjacent electrostatic conduction portions 41, so that the electrostatic conduction portions 41 are connected in series, so that any electrostatic conduction portion 41 can be grounded, and the grounding of each electrostatic conduction portion 41 is achieved. The connecting portion 42 connects adjacent electrostatic conduction portions 41, so that electrostatic charge can be conducted between adjacent electrostatic conduction portions 41, reducing the local accumulation of electrostatic charge in the electrostatic protection structure 4.

[0149] In some embodiments, the spacing distance between adjacent electrostatic conductive portions 41 is greater than or equal to 3 micrometers.

[0150] If the spacing between adjacent electrostatic conductive parts 41 is too small, the possibility of adjacent electrostatic conductive parts 41 touching each other will be increased, and the dispersion path of electrostatic charge per unit area will be reduced, which is not conducive to the dispersion of electrostatic charge. Optionally, the spacing between adjacent electrostatic conductive parts 41 is 3 microns, 4 microns, 5.5 microns, 8 microns, etc.

[0151] See also Figure 6 In some embodiments, the display panel 100 further includes a first dielectric layer 5 , and at least a portion of the first dielectric layer 5 is located between adjacent electrostatic conductive portions 41 .

[0152] At least part of the first dielectric layer 5 is located between adjacent electrostatic conductive parts 41, and at least part of the first dielectric layer 5 can be filled between adjacent electrostatic conductive parts 41, which is conducive to preparing other functional layers of the display panel 100 on the side of the electrostatic protection structure 4 away from the substrate 1, and avoiding the collapse of the functional layer located on the side of the electrostatic protection structure 4 away from the substrate 1. The first dielectric layer 5 can be made of insulating material, so that the first dielectric layer 5 can also avoid or reduce the occurrence of unwanted current conduction between adjacent electrostatic conductive parts 41.

[0153] In some embodiments, the first dielectric layer 5 is located on a side of the electrostatic protection structure 4 facing away from the substrate 1 , and the orthographic projection of the first dielectric layer 5 on the substrate 1 covers the orthographic projection of the electrostatic protection structure 4 on the substrate 1 .

[0154] If not otherwise specified, the orthographic projection on the substrate 1 in the present application is a projection along the first direction X, and the first direction X can be the thickness direction of the display panel 100, and the direction from the substrate 1 to the light-emitting functional layer. The first dielectric layer 5 can be laid on the entire surface, so that the first dielectric layer 5 can not only be located between adjacent electrostatic conductive parts 41, but also cover the side of the electrostatic protection structure 4 away from the substrate 1. The first dielectric layer 5 can flatten the side of the electrostatic protection structure 4 away from the substrate 1, which is conducive to setting other functional layers on the side of the first dielectric layer 5 away from the substrate 1.

[0155] See also Figure 5 In some other embodiments, the orthographic projection of the first dielectric layer 5 on the substrate 1 partially overlaps with the orthographic projection of the electrostatic protection structure 4 on the substrate 1 , and the first dielectric layer 5 includes a plurality of spaced first dielectric sub-portions 51 , and the first dielectric sub-portions 51 are located between adjacent electrostatic conductive portions 41 .

[0156] A plurality of first dielectric sub-portions 51 may be arranged at intervals in the packaging area PA. The first dielectric sub-portions 51 are located between adjacent electrostatic conductive portions 41 , thereby preventing unwanted current conduction between adjacent electrostatic conductive portions 41 through the first dielectric layer 5 .

[0157] In some embodiments, the surface of the first dielectric sub-part 51 facing away from the substrate 1 protrudes in a direction away from the substrate 1 relative to the surface of the electrostatic conduction part 41 facing away from the substrate 1, so that the relatively arranged surfaces between adjacent electrostatic conduction parts 41 can be completely isolated by the first dielectric sub-part 51, which is beneficial to avoid or reduce unnecessary charge migration between the spaced electrostatic conduction parts 41.

[0158] See also Figure 7 In other embodiments, the surface of the first dielectric sub-part 51 facing away from the substrate 1 and the surface of the electrostatic protection structure 4 facing away from the substrate 1 are in the same reference plane, thereby facilitating the formation of other functional layers on the surface of the first dielectric sub-part 51 facing away from the substrate 1 and the surface of the electrostatic protection structure 4 facing away from the substrate 1.

[0159] In some embodiments, at least a portion of the first dielectric layer 5 is located between the isolation structure 2 and the electrostatic conductive portion 41 .

[0160] At least a portion of the first dielectric layer 5 is located between the isolation structure 2 and the electrostatic conduction portion 41, thereby increasing the distance between the isolation structure 2 and the electrostatic conduction portion 41, and avoiding or reducing the electrostatic charge accumulated in the electrostatic conduction portion 41 from affecting the electrical signal conducted in the isolation structure 2 and affecting the light emission of the light-emitting unit 31 on one side of the isolation structure 2.

[0161] See also Figure 8 In some embodiments, the substrate 1 includes a substrate 11 and a driving circuit layer 12, the driving circuit layer 12 is arranged between the substrate 11 and the light-emitting functional layer, the driving circuit layer 12 includes a plurality of conductive layers (not marked) arranged in sequence and spaced apart in a direction away from the substrate 1, a portion of at least one of the plurality of conductive layers is located in the packaging area PA, and is reused as at least a portion of the electrostatic protection structure 4.

[0162] The driving circuit layer 12 may include a pixel driving circuit. Exemplarily, the pixel driving circuit provided in the driving circuit layer 12 includes a transistor 13 and a storage capacitor. The transistor 13 includes an active layer 134, a gate 133, a drain 132 and a source 131. The storage capacitor includes a first plate 135 and a second plate 136. A plurality of patterned conductive layers form the aforementioned transistor 13 and storage capacitor. A plurality of patterned conductive layers are electrically connected through vias to achieve a desired circuit structure.

[0163] Part of at least one of the multiple conductive layers is located in the encapsulation area PA and reused as at least part of the electrostatic protection structure 4, that is, when preparing the conductive layer, the conductive material is set in the display area AA and the encapsulation area PA, and when the conductive material in the display area AA is patterned, the conductive material in the encapsulation area PA is patterned at the same time, and the conductive material in the encapsulation area PA forms at least part of the electrostatic protection structure 4. This saves the step of adding an additional step of independently preparing the electrostatic protection structure 4 in the preparation process of the display panel 100, and improves the preparation efficiency of the display panel 100 with the electrostatic protection structure 4.

[0164] In some embodiments, the plurality of conductive layers located in the encapsulation area PA are insulated from the plurality of conductive layers located in the display area AA.

[0165] The conductive portion of the multiple conductive layers located in the display area AA can be used to transmit electrical signals to start the light-emitting unit 31 to display light. The conductive portion of the multiple conductive layers located in the encapsulation area PA can be used to conduct static electricity. The two are set to be insulated to prevent the static electricity conducted by the conductive portion of the multiple conductive layers located in the encapsulation area PA from affecting the light-emitting unit 31 to display light.

[0166] In some embodiments, the conductive layer located in the package area PA is grounded.

[0167] One or more conductive layers are located in the packaging area PA, and static electricity on the conductive layers in the packaging area PA is eliminated by grounding the conductive layers.

[0168] In some embodiments, the electrostatic protection structure 4 includes a plurality of electrostatic conductive portions 41 disposed at intervals, and the plurality of electrostatic conductive portions 41 are in the same conductive layer.

[0169] The multiple electrostatic conductive parts 41 arranged at intervals are simultaneously realized by patterning the same conductive layer, which simplifies the preparation steps.

[0170] For example, when preparing the source electrode 131 and the drain electrode 132 , a plurality of electrostatic conduction parts 41 are formed in the encapsulation area PA, and the plurality of electrostatic conduction parts 41 are the same conductive layer.

[0171] See also Fig. 9In some other embodiments, the electrostatic protection structure 4 includes a plurality of electrostatic conduction parts 41 disposed at intervals, and at least two of the plurality of electrostatic conduction parts 41 are different conductive layers.

[0172] At least two of the multiple electrostatic conduction parts 41 are patterned different conductive layers, so that different electrostatic conduction parts 41 can be connected to different circuits to achieve a richer circuit structure, and each electrostatic conduction part 41 provides a richer electrostatic charge conduction path. For example: when preparing the gate 133, a first electrostatic conduction part 41a located in the packaging area PA is formed, and when preparing the source 131 and the drain 132, a second electrostatic conduction part 41b located in the packaging area PA is formed, and the first electrostatic conduction part 41a and the second electrostatic conduction part 41b are different conductive layers.

[0173] In some embodiments, the plurality of conductive layers include a first conductive layer 121a, the first conductive layer 121a includes a source 131, a drain 132 and a first electrostatic conductive portion 41a, the source 131 and the drain 132 are located in the display area AA, and the first electrostatic conductive portion 41a is disposed in the encapsulation area PA.

[0174] In the process of forming the first conductive layer 121a, the source 131, the drain 132 and the first electrostatic conductive part 41a are formed together, and the difference is that the source 131 and the drain 132 are located in the display area AA, and the first electrostatic conductive part 41a is located in the packaging area PA. The first electrostatic conductive part 41a located in the packaging area PA conducts static electricity as all or part of the electrostatic protection structure 4.

[0175] In other embodiments, the plurality of conductive layers include a second conductive layer 121b, the gate 133 is located in the display area AA, the second conductive layer 121b includes the gate 133 and a second static electricity conducting portion 41b, and the second static electricity conducting portion 41b is disposed in the encapsulation area PA.

[0176] During the formation of the second conductive layer 121b, the gate 133 and the second electrostatic conductive portion 41b are formed together, the difference being that the gate 133 is located in the display area AA, and the second electrostatic conductive portion 41b is located in the encapsulation area PA. The second electrostatic conductive portion 41b located in the encapsulation area PA conducts static electricity as all or part of the electrostatic protection structure 4.

[0177] In other embodiments, the multiple conductive layers include a third conductive layer and a fourth conductive layer, the third conductive layer includes a first electrode 135, the fourth conductive layer includes a second electrode 136 and a third electrostatic conductive portion, and the orthographic projection of the first electrode 135 on the substrate 11 at least partially overlaps with the orthographic projection of the second electrode 136 on the substrate 11.

[0178] The first electrode plate 135 and the second electrode plate 136 are arranged opposite to each other to form a storage capacitor. In the process of forming the fourth conductive layer, the second electrode plate 136 and the third electrostatic conductive part are formed together, and the difference is that the second electrode plate 136 is located in the display area AA, and the third electrostatic conductive part is located in the packaging area PA. The third electrostatic conductive part located in the packaging area PA conducts static electricity as all or part of the electrostatic protection structure 4.

[0179] The first electrode plate 135 may be located on the side of the second electrode plate 136 away from the substrate 1, or on the side of the second electrode plate 136 close to the substrate 1. Optionally, the first electrode plate 135 is located on the side of the second electrode plate 136 close to the substrate 1, the third conductive layer and the aforementioned second conductive layer 121b are the same conductive layer, that is, the gate 133 and the first electrode plate 135 are located on the same conductive layer, and the second electrostatic conductive portion 41b and the third electrostatic conductive portion are the same electrostatic conductive portion 41.

[0180] In some embodiments, the driving circuit layer 12 includes at least one dielectric layer 122, the dielectric layer 122 includes a first dielectric portion 1221 located in the packaging area PA and a second dielectric portion 1222 located in the display area AA, the second dielectric portion 1222 covers a side of any conductive layer away from the substrate 1, and at least a portion of the first dielectric portion 1221 is located between adjacent electrostatic conductive portions 41.

[0181] In the display area AA, the conductive layer and the second dielectric portion 1222 may be alternately stacked in a direction away from the substrate 1. When forming the second dielectric portion 1222 located in the display area AA, the first dielectric portion 1221 located in the encapsulation area PA may be formed at the same time, thereby simplifying the preparation process. The first dielectric portion 1221 is at least partially located between adjacent electrostatic conductive portions 41, thereby avoiding unwanted current conduction between adjacent electrostatic conductive portions 41 through the first dielectric portion 1221. One or more dielectric layers in the driving circuit layer 12 may be reused as the aforementioned first dielectric layer 5, that is, having all the features of the aforementioned first dielectric layer 5.

[0182] Please participate Fig.10 In some embodiments, the driving circuit layer 12 includes a second dielectric layer 122a, which is disposed on a side of the first conductive layer 121a facing away from the substrate 1, at least a portion of the first dielectric portion 1221 of the second dielectric layer 122a is located between adjacent electrostatic conductive portions 41, and the second dielectric portion 1222 of the second dielectric layer 122a covers a side of the source electrode 131 facing away from the substrate 1.

[0183] When the first conductive layer 121a includes the source 131, the drain 132 and the first electrostatic conductive portion 41a, the second dielectric portion 1222 located on the side of the source 131 and the drain 132 away from the substrate 1 is a first planarization layer (PLN), and the first dielectric portion 1221 of the second dielectric layer 122a is formed in the process of forming the first planarization layer.

[0184] In some embodiments, the first dielectric portion 1221 of the second dielectric layer 122 a is disposed protruding relative to the static electricity conductive portion 41 on a surface facing away from the substrate 1 .

[0185] The thickness of the first dielectric portion 1221 of the second dielectric layer 122a in the direction away from the substrate 1 may be less than or equal to the thickness of the static electricity conducting portion 41 in the direction away from the substrate 1. When the first dielectric portion 1221 of the third dielectric layer 122b is provided on one side of the first dielectric portion 1221 of the second dielectric layer 122a, the first dielectric portion 1221 of the third dielectric layer 122b lifts the first dielectric portion 1221 of the second dielectric layer 122a, so that the surface of the first dielectric portion 1221 of the second dielectric layer 122a away from the substrate 1 is protruded relative to the static electricity conducting portion 41, which is conducive to effectively spacing adjacent static electricity conducting portions 41.

[0186] In some embodiments, the surface of the first dielectric portion 1221 of the second dielectric layer 122 a facing away from the substrate 1 and the static electricity conducting portion 41 are in the same reference plane.

[0187] The thickness of the first dielectric portion 1221 of the second dielectric layer 122a in the direction away from the substrate 1 may be less than the thickness of the static electricity conductive portion 41 in the direction away from the substrate 1. The surface of the first dielectric portion 1221 of the second dielectric layer 122a away from the substrate 1 and the static electricity conductive portion 41 are in the same reference plane, which is conducive to providing other functional layers on the side of the first dielectric portion 1221 and the static electricity conductive portion 41 of the second dielectric layer 122a away from the substrate 1.

[0188] In some embodiments, the height of the gate 133 along the direction away from the substrate 1 is H1, and the height of the static electricity conducting portion 41 along the direction away from the substrate 1 is H2, and H1=H2.

[0189] The gate 133 and the electrostatic conduction part 41 are arranged at the same height, so that the gate 133 and the electrostatic conduction part 41 can be formed by evaporation, sputtering, deposition, etc., with the same amount of conductive material, thereby simplifying the preparation process.

[0190] In some embodiments, the height of the first dielectric portion 1221 of the second dielectric layer 122a along the direction away from the substrate 1 is H3, and the height of the second dielectric portion 1222 of the second dielectric layer 122a along the direction away from the substrate 1 is H4, and H3=H4.

[0191] The heights of the first dielectric portion 1221 and the second dielectric portion 1222 of the second dielectric layer 122a are set to be consistent, so that the same amount of dielectric material can be set by evaporation, deposition, coating, etc. to form the first dielectric portion 1221 and the second dielectric portion 1222 of the second dielectric layer 122a, thereby simplifying the preparation process.

[0192] See also Fig.11 In some embodiments, the display panel 100 further includes a touch layer 6 , which is located on a side of the light-emitting functional layer away from the substrate 1 , and a portion of the touch layer 6 is located in the packaging area PA to form at least a portion of the electrostatic protection structure 4 .

[0193] The touch layer 6 enables the display panel 100 to perform touch operation. The touch layer 6 can be arranged on the light-emitting side of the light-emitting functional layer. In order to prevent the touch layer 6 from affecting the display of the light-emitting functional layer, the touch layer 6 can be made of a light-transmitting material. The touch layer 6 is a self-capacitive touch layer or a mutual-capacitive touch layer.

[0194] The mutual capacitive touch layer includes a first touch sublayer and a second touch sublayer. When a finger touches the display panel 100, a first touch electrode in the first touch sublayer and a second touch electrode in the second touch sublayer form coupling capacitances, thereby realizing touch control through capacitance changes.

[0195] The electrostatic protection structure 4 can be reused as any one of the first touch sublayer and the second touch sublayer. Optionally, the first touch sublayer is located on the side of the second touch sublayer close to the substrate 1, and the electrostatic protection structure 4 is reused as the first touch sublayer. The electrostatic protection structure 4 can also be provided with two electrostatic conductive parts 41, which are reused as the first touch sublayer and the second touch sublayer respectively.

[0196] The self-capacitive touch layer includes a touch electrode layer of a grid structure, and the touch electrode layer includes touch lines arranged in an array, and mutual capacitance is formed between the touch lines arranged in an array. When a finger approaches or touches the display panel 100, the value of the mutual capacitance changes, and touch is achieved through the change of each mutual capacitance. The electrostatic protection structure 4 can be reused as part of the touch lines of the mutual capacitance touch layer.

[0197] A portion of the touch layer 6 is located in the packaging area PA to form at least a portion of the electrostatic protection structure 4 , so that when preparing the touch layer 6 , the electrostatic protection structure 4 is prepared at the same time, eliminating the need to set up an independent preparation step for preparing the electrostatic protection structure 4 , thereby improving the preparation efficiency of the display panel 100 .

[0198] In some embodiments, the touch layer 6 includes a touch electrode 61 located in the display area AA and an electrostatic protection structure 4 located in the packaging area PA, and the touch electrode 61 is insulated from the electrostatic protection structure 4 .

[0199] The touch material can be patterned to obtain the touch electrode 61 located in the display area AA and the electrostatic protection structure 4 located in the packaging area PA. The touch electrode 61 and the electrostatic protection structure 4 are insulated to prevent static electricity in the electrostatic protection structure 4 from migrating to the touch electrode 61 and affecting the stability of the touch function of the touch layer 6.

[0200] In some embodiments, the touch layer 6 includes a first touch sublayer and a second touch sublayer, and the first touch sublayer includes a first touch electrode located in the display area and an electrostatic protection structure 4 located in the packaging area.

[0201] The first touch sublayer is located on a side of the second touch sublayer close to the substrate 1 , and the electrostatic protection structure 4 can be prepared together with the first touch electrode in the first touch sublayer.

[0202] In some embodiments, the display panel 100 further includes a first touch packaging layer 62 and a second touch packaging layer 63, wherein the first touch packaging layer 62 is located on the side of the touch layer 6 close to the substrate 1; the second touch packaging layer 63 is located on the side of the touch layer 6 away from the substrate 1, and the electrostatic protection structure 4 is located between the first touch packaging layer 62 and the second touch packaging layer 63.

[0203] The first touch control encapsulation layer 62 and the second touch control encapsulation layer 63 can be made of inorganic encapsulation materials. The first touch control encapsulation layer 62 and the second touch control encapsulation layer 63 can encapsulate the electrostatic protection structure 4 together, thereby avoiding or reducing the impact of external water and oxygen on the electrostatic protection structure 4.

[0204] In some embodiments, the first touch-control encapsulation layer 62 located in the electrostatic protection structure 4 away from the display area AA and the second touch-control encapsulation layer 63 located in the electrostatic protection structure 4 away from the display area AA are in contact and stacked.

[0205] The first touch encapsulation layer 62 and the second touch encapsulation layer 63 are in contact and stacked on the side of the electrostatic protection structure 4 away from the display area AA, thereby encapsulating the electrostatic protection structure 4, thereby preventing or reducing external water and oxygen from entering the encapsulation area PA from the light-transmitting area TA and affecting the electrostatic protection structure 4.

[0206] In some embodiments, the ESD protection structure 4 is grounded to eliminate static electricity carried by the ESD protection structure 4 .

[0207] In some embodiments, the touch layer 6 is disposed around the light-transmitting area TA, that is, the touch layer 6 is not disposed in the light-transmitting area TA, so as to improve the light transmittance of the light-transmitting area TA. The touch layer 6 surrounds the light-transmitting area TA, and electrostatic protection can be provided to the surrounding side of the light-transmitting area TA. Optionally, the minimum spacing distance between the electrostatic protection structure 4 and the light-transmitting area TA is greater than or equal to 30 microns.

[0208] See also Fig.12In some embodiments, the display panel 100 further includes a dam structure 71 , which is disposed on one side of the substrate 1 , and the dam structure 71 is disposed around the display area AA, and at least a portion of the dam structure 71 is located between the isolation structure 2 and the electrostatic protection structure 4 .

[0209] The dam structure 71 is disposed around the display area AA, so that the dam structure 71 can effectively isolate the display area AA from the encapsulation area PA.

[0210] In some embodiments, the surface of the dam structure 71 facing away from the substrate 1 is protruded relative to the electrostatic protection structure 4 in a direction facing away from the substrate 1 .

[0211] The surface of the dam structure 71 facing away from the substrate 1 is protruded relative to the electrostatic conductive portion 41, so that the dam structure 71 can be higher or thicker than the electrostatic conductive portion 41, so that the dam structure 71 can effectively isolate the display area AA and the packaging area PA, and prevent water and oxygen from entering the display area AA from the packaging area PA.

[0212] In some embodiments, the thickness of the dam structure 71 away from the substrate 1 is greater than the thickness of the electrostatic protection structure 4 away from the substrate 1. Therefore, when the dam structure 71 and the substrate 1 are prepared on the same plane, the surface of the dam structure 71 away from the substrate 1 is protruded in the direction away from the substrate 1 relative to the electrostatic protection structure 4.

[0213] In some embodiments, the orthographic projection of the dam structure 71 on the substrate 1 at least partially overlaps with the orthographic projection of the electrostatic protection structure 4 on the substrate 1 .

[0214] Part of the dam structure 71 can extend to the side of the electrostatic protection structure 4 away from the substrate 1, thereby reducing the size of the dam structure 71 and the electrostatic protection structure 4 as a whole, which is beneficial to reducing the length of the encapsulation area PA along the display area AA to the light-transmitting area TA.

[0215] See also Fig.13 In some embodiments, the electrostatic protection structure 4 includes a plurality of electrostatic conductive portions 41 disposed at intervals, and an orthographic projection of at least one electrostatic conductive portion 41 on the substrate 1 is located within an orthographic projection of the dam structure 71 on the substrate 1 .

[0216] When the electrostatic protection structure 4 includes a plurality of electrostatic conduction parts 41 disposed at intervals, the dam structure 71 may extend to the side of one or more electrostatic conduction parts 41 facing away from the substrate 1, that is, the material forming the dam structure 71 may cover the side of one or more electrostatic conduction parts 41 facing away from the substrate 1, thereby increasing the distance between the surface of the dam structure 71 facing away from the substrate 1 and the substrate 1, and increasing the area of ​​the dam structure 71 isolating the display area AA and the packaging area PA.

[0217] In some embodiments, the display panel 100 further includes a first dielectric layer 5 , at least a portion of which is located between adjacent electrostatic conductive portions 41 ; a surface of the dam structure 71 facing away from the substrate 1 is protruded away from the substrate 1 relative to a surface of the first dielectric layer 5 facing away from the substrate 1 .

[0218] The dam structure 71 can not only be protruded relative to the electrostatic conduction part 41, but also be protruded relative to the first dielectric layer 5, so that the dam structure 71 can be spaced between the display area AA and the electrostatic conduction part 41, or the dam structure 71 can be spaced between the display area AA and the first dielectric layer 5 to prevent external water and oxygen from entering the display area AA.

[0219] See also Fig.14 In some embodiments, the substrate 1 includes a substrate 11 and a driving circuit layer 12, the driving circuit layer 12 is arranged between the substrate 11 and the light-emitting functional layer, the driving circuit layer 12 includes at least one conductive layer and at least one dielectric layer 122, the dielectric layer 122 includes a first dielectric portion 1221 located in the packaging area PA and a second dielectric portion 1222 located in the display area AA, at least a portion of the first dielectric portion 1221 is located between the isolation structure 2 and the electrostatic conduction portion 41, and the second dielectric portion 1222 covers a side of any conductive layer away from the substrate 1; wherein, at least a portion of the first dielectric portion 1221 is at least a portion of the dam structure 71.

[0220] When preparing the dielectric layer 122 in the driving circuit layer 12 , the first dielectric part 1221 and the second dielectric part 1222 may be prepared together, and part of the second dielectric part 1222 may be spaced between multiple electrostatic protection parts, and part of the second dielectric part 1222 may serve as all or part of the dam structure 71 .

[0221] See also Fig.15 In other embodiments, the orthographic projection of the dam structure 71 on the substrate 1 is spaced apart from the orthographic projection of the electrostatic protection structure 4 on the substrate 1, or the orthographic projection of the dam structure 71 on the substrate 1 is located within the orthographic projection of the first dielectric portion 1221 on the substrate 1, or the orthographic projection of the dam structure 71 on the substrate 1 covers the orthographic projection of the first dielectric portion 1221 on the substrate 1. The above implementation modes can be combined and implemented in consideration of actual conditions.

[0222] The first dielectric portion 1221 located in the encapsulation area PA may be entirely or partially equivalent to the aforementioned first dielectric layer 5. The dam structure 71 and the first dielectric portion 1221 may be prepared independently, and the dam structure 71 may be provided on the side of the first dielectric portion 1221 away from the substrate 1, thereby increasing the distance from the surface of the dam structure 71 away from the substrate 1 to the surface of the substrate 1 away from the dam structure 71, and improving the blocking effect of the dam structure 71 on some functional layers.

[0223] See also Fig.14 In some embodiments, the first dielectric portions 1221 of at least two dielectric layers 122 are stacked in a direction away from the substrate 1 and form at least a portion of the dam structure 71 .

[0224] The two or more dielectric layers in the driving circuit layer 12 respectively have a first dielectric portion 1221 located in the packaging area PA, and the first dielectric portions 1221 formed successively are stacked in a direction away from the substrate 1, thereby increasing the thickness of the stacked first dielectric portions 1221 as a whole and increasing the thickness of the dam structure 71 formed by the stacked first dielectric portions 1221.

[0225] Exemplarily, the first conductive layer includes a source electrode 131 and a drain electrode 132, and the second dielectric portion 1222 located on the side of the source electrode 131 and the drain electrode 132 away from the substrate 1 is a first flat layer, and the first dielectric portion 1221 of the second dielectric layer 122a is formed in the process of forming the first flat layer. The second dielectric portion 1222 located on the side of the second dielectric layer 122a away from the substrate 1 is a second flat layer, and the first dielectric portion 1221 of the third dielectric layer 122b is formed in the process of forming the second flat layer. The first dielectric portion 1221 of the third dielectric layer 122b and the first dielectric portion 1221 of the second dielectric layer 122a formed successively can be stacked and serve as all or part of the dam structure 71, thereby increasing the total thickness of the dam structure 71 to effectively isolate the encapsulation area PA from the display area AA.

[0226] See also Fig.12 and Fig.16 In some embodiments, the display panel 100 further includes:

[0227] The pixel definition layer 72 is disposed between the substrate 1 and the isolation structure 2 . The pixel definition layer 72 includes a pixel opening 721 . The pixel opening 721 is connected to the corresponding limiting opening 23 . The light emitting unit 31 is at least partially disposed in the pixel opening 721 .

[0228] The pixel definition layer 72 encloses a pixel opening 721. At least a portion of the light-emitting unit 31 can be disposed in the pixel opening 721 to achieve light-emitting display of the display panel 100, and the pixel opening 721 can be disposed corresponding to the limiting opening 23. The isolation structure 2 can be directly disposed on the side of the pixel definition layer 72 away from the substrate 1, and the isolation structure 2 is supported by the pixel definition layer 72.

[0229] In some embodiments, the orthographic projection of the pixel opening 721 on the substrate 1 is located within the orthographic projection range of the limiting opening 23 on the substrate 1 .

[0230] The area of ​​the limiting opening 23 is larger than the area of ​​the pixel opening 721 , which can reduce the influence of the isolation structure 2 on the light emitting viewing angle of the light emitting functional layer.

[0231] Optionally, there are multiple pixel openings 721, and the multiple pixel openings 721 are distributed at intervals, and the isolation structure 2 can be disposed on at least part of the pixel defining portion between two adjacent pixel openings 721. Optionally, the isolation structure 2 can be disposed around at least part of the pixel openings 721.

[0232] In some embodiments, part of the pixel definition layer 72 is located on the side of the electrostatic protection structure 4 facing away from the substrate 1 , and the orthographic projection of the electrostatic protection structure 4 on the substrate 1 is located within the orthographic projection of the pixel definition layer 72 on the substrate 1 .

[0233] When the electrostatic protection structure 4 is formed together with part of the driving circuit layer 12, the pixel definition layer 72 can extend from the display area AA to the packaging area PA and be located on the side of the electrostatic protection structure 4 facing away from the substrate 1, thereby insulating the side of the electrostatic protection structure 4 facing away from the substrate 1 through the pixel definition layer 72.

[0234] In some embodiments, the pixel definition layer 72 includes a first division 722, a second division 723 and a third division 724 connected in sequence, the first division 722 is located in the display area AA and between the isolation structure 2 and the substrate 1, the second division 723 is located between the isolation structure 2 and the electrostatic protection structure 4, and the third division 724 is located on the side of the electrostatic protection structure 4 facing away from the substrate 1.

[0235] The pixel opening 721 can be arranged in the first subsection 722, at least part of the light-emitting unit 31 is located in the first subsection 722, and the first subsection 722 supports the isolation structure 2. The third subsection 724 is located on the side of the electrostatic protection structure 4 away from the substrate 1 to insulate the side of the electrostatic protection structure 4 away from the substrate 1. Part or all of the isolation structure 2 and the electrostatic protection structure 4 can be located in the same reference plane parallel to the substrate 1, so that in the pixel definition layer 72 prepared on the whole surface, the second subsection 723 is located between the isolation structure 2 and the electrostatic protection structure 4. The second subsection 723 has the function of isolating the display area AA and the encapsulation area PA, thereby improving the effect of isolating static electricity and water oxygen in the display area AA and the encapsulation area PA.

[0236] See also Fig.18 In some embodiments, the electrostatic protection structure 4 includes a plurality of electrostatic conductive portions 41 disposed at intervals, and a portion of the third portion 724 is located between adjacent electrostatic conductive portions 41. Adjacent electrostatic conductive portions 41 are isolated by the pixel definition layer 72 to reduce or avoid unwanted charge movement between adjacent electrostatic conductive portions 41.

[0237] See also Fig.12In some embodiments, the electrostatic protection structure 4 includes a plurality of electrostatic conduction portions 41 that are spaced apart, and the display panel 100 further includes a first dielectric layer 5, the first dielectric layer 5 includes a plurality of spaced-apart first dielectric sub-portions 51, and the first dielectric sub-portions 51 are located between adjacent electrostatic conduction portions 41; the third portion 724 is located on a side of the first dielectric layer 5 that is away from the substrate 1, and is in contact with the first dielectric layer 5.

[0238] The third sub-portion 724 can not only encapsulate the electrostatic conductive portion 41, but also encapsulate the first dielectric layer 5. The third sub-portion 724 is in contact with the first dielectric layer 5, so that the two can be spaced between adjacent electrostatic conductive portions 41, thereby avoiding or reducing the occurrence of unwanted charge movement between adjacent electrostatic conductive portions 41.

[0239] In some embodiments, a second gap G2 is defined between adjacent first dielectric sub-portions 51 , and a portion of the third portion 724 is located in the second gap G2 and contacts the static electricity conducting portion 41 .

[0240] The surface of the first dielectric sub-portion 51 facing away from the substrate 1 may protrude relative to the electrostatic conductive portion 41, so that a second gap G2 exposing the electrostatic conductive portion 41 is provided between adjacent first dielectric sub-portions 51, and a portion of the third sub-portion 724 is located on the side of the first dielectric sub-portion 51 facing away from the substrate 1, and extends into the second gap G2 to contact the electrostatic conductive portion 41, and then extends to the side of another first dielectric sub-portion 51 facing away from the substrate 1. The third sub-portion 724 is arranged in a non-planar manner, so as to avoid the cracks in the third sub-portion 724 from continuing to spread along the direction from the light-transmitting area TA to the display area AA when cracks are generated.

[0241] In some embodiments, the pixel definition layer 72 includes a fourth portion 725 , which is connected to an end of the third portion 724 away from the second portion 723 , and is stacked on one side of the substrate 1 and in contact with the substrate 1 .

[0242] The third division 724 extends in a direction away from the display area AA to form a fourth division 725. The fourth division 725 is stacked on one side of the substrate 1 and contacts the substrate 1, so that the stacked fourth division 725 and the substrate 1 can encapsulate the electrostatic protection structure 4 to prevent water and oxygen from entering the packaging area PA from the light-transmitting area TA and affecting the electrostatic protection structure 4.

[0243] In some embodiments, the display panel 100 further includes a first encapsulation layer 81.

[0244] In the display area AA, a first gap G1 is provided between the first encapsulation layer 81 and the pixel definition layer 72; the light emitting functional layer and the isolation structure 2 are disposed in the first gap G1;

[0245] In the encapsulation area PA, the first encapsulation layer 81 is stacked on the side of the pixel definition layer 72 facing away from the substrate 1 , and the stacked first encapsulation layer 81 and the pixel definition layer 72 block the first gap G1 .

[0246] The first encapsulation layer 81 extends from the display area AA to the encapsulation area PA, and is located on the side of the electrostatic protection structure 4 away from the substrate 1, thereby achieving full-surface encapsulation of the display area AA and the encapsulation area PA. The first encapsulation layer 81 located in the display area AA can encapsulate the side of the light-emitting functional layer and the isolation structure 2 away from the substrate 1, preventing external water and oxygen from entering the first gap G1 from the side of the light-emitting functional layer and the isolation structure 2 away from the substrate 1, thereby affecting the display and luminescence of the light-emitting functional layer. The first encapsulation layer 81 located in the encapsulation area PA is stacked on the side of the pixel definition layer 72 away from the substrate 1. The stacked first encapsulation layer 81 and the pixel definition layer 72 can block the first gap G1, thereby preventing external water and oxygen from entering the first gap G1 from the encapsulation area, thereby affecting the display and luminescence of the light-emitting functional layer.

[0247] In some embodiments, the first encapsulation layer 81 is disposed around the light-transmitting area TA.

[0248] The first encapsulation layer 81 may extend in the display area AA and the encapsulation area PA, and the first encapsulation layer 81 may not be disposed in the light-transmitting area TA, thereby improving the light transmittance of the light-transmitting area TA. The first encapsulation layer 81 is disposed around the light-transmitting area TA, thereby preventing water and oxygen from entering the display area AA from the light-transmitting area TA.

[0249] In some embodiments, the display panel 100 also includes a second encapsulation layer 82, which is disposed in the display area AA. The second encapsulation layer 82 is located between the first encapsulation layer 81 and the pixel definition layer 72, and the second encapsulation layer 82 covers the side of the light-emitting functional layer facing away from the substrate 1 and the side of the isolation structure 2 facing away from the substrate 1.

[0250] The second encapsulation layer 82 can be made of organic or inorganic materials. The first encapsulation layer 81 and the second encapsulation layer 82 can be made of the same or different materials. The second encapsulation layer 82 is conducive to improving the water and oxygen isolation capability of the display panel 100 for the light-emitting functional layer. The first encapsulation layer 81 and the second encapsulation layer 82 are made of different materials, so that the first encapsulation layer 81 and the second encapsulation layer 82 can have different properties to improve the water and oxygen resistance capability of the display panel 100.

[0251] In some embodiments, the second encapsulation layer 82 covers a side of the isolation structure 2 facing away from the substrate 1 .

[0252] The second encapsulation layer 82 covers the side of the isolation structure 2 facing away from the substrate 1 , so that the second encapsulation layer 82 has the function of flattening the isolation structure 2 , which is conducive to forming a flat first encapsulation layer 81 on the side of the second encapsulation layer 82 facing away from the substrate 1 .

[0253] In some embodiments, the first encapsulation layer 81 includes a first encapsulation portion 811 and a second encapsulation portion 812 connected to each other, the first encapsulation portion 811 is located in the display area AA, the first encapsulation portion 811 is located on the side of the second encapsulation layer 82 away from the substrate 1, the second encapsulation portion 812 is located in the encapsulation area PA, and the second encapsulation portion 812 is located on the side of the pixel definition layer 72 away from the substrate 1.

[0254] The first encapsulation part 811 and the second encapsulation part 812 can be manufactured simultaneously, thereby improving the uniformity of the first encapsulation part 811 and the second encapsulation part 812. The first encapsulation part 811 can effectively prevent water and oxygen from entering the light-emitting functional layer from the side of the light-emitting functional layer away from the substrate 1, and the second encapsulation part 812 can effectively prevent water and oxygen from entering the electrostatic protection structure 4, and can also prevent water and oxygen from entering the light-emitting functional layer from the side of the light-emitting functional layer.

[0255] In the case where the second encapsulation layer 82 is an organic material layer, if the second encapsulation layer 82 extends to the encapsulation area PA, water vapor may enter the display area AA along the second encapsulation layer 82, so the second encapsulation layer 82 is disposed in the display area AA to prevent water vapor from entering the display area AA through the second encapsulation layer 82 extending to the encapsulation area PA. The edge of the second encapsulation layer 82 is surrounded by the first encapsulation portion 811 and the pixel definition layer 72, so that the first encapsulation portion 811 and the pixel definition layer 72 can isolate the second encapsulation layer 82 and the encapsulation area PA at the edge of the second encapsulation layer 82.

[0256] In some embodiments, the distance between the surface of the second encapsulation layer 82 facing away from the substrate 1 and the substrate 1 is greater than the distance between the surface of the electrostatic protection structure 4 facing away from the substrate 1 and the substrate 1, so that the second encapsulation layer 82 can isolate water and oxygen from the encapsulation area PA entering the display area AA. The second encapsulation layer 82 has a sufficient thickness along the direction away from the substrate 1, which is conducive to the second encapsulation layer 82 flattening the isolation structure 2.

[0257] In some embodiments, the distance between the first packaging portion 811 and the substrate 1 is greater than the distance between the second packaging portion 812 and the substrate 1 .

[0258] Since the distance from the surface of the second packaging layer 82 facing away from the substrate 1 to the substrate 1 is greater than the distance from the surface of the electrostatic protection structure 4 facing away from the substrate 1 to the substrate 1, the distance from the first packaging part 811 formed on the second packaging layer 82 to the substrate 1 is greater than the distance from the second packaging part 812 formed on the electrostatic protection structure 4 to the substrate 1.

[0259] In some embodiments, the thickness of the first encapsulation portion 811 along the direction away from the substrate 1 is the same as the thickness of the second encapsulation portion 812 along the direction away from the substrate 1, so that the same amount of encapsulation material can be set in the display area AA and the encapsulation area PA based on a deposition process, etc. to prepare the first encapsulation portion 811 and the second encapsulation portion 812, thereby simplifying the preparation process.

[0260] In some embodiments, the second encapsulation layer 82 is an organic material layer;

[0261] In some embodiments, the first encapsulation layer 81 is an inorganic material layer.

[0262] Compared with the organic material layer, the inorganic material layer has a better ability to block water and oxygen. Compared with the inorganic material layer, the organic material layer has better flexibility and good film-forming properties. The second encapsulation layer 82 has a flattening effect. The light-emitting functional layer is encapsulated by the organic material layer and the inorganic material layer together to improve the comprehensive ability of the display panel 100 to resist water and oxygen.

[0263] In some embodiments, the display panel 100 further includes a third encapsulation layer 83 , which is disposed between the second encapsulation layer 82 and the light-emitting functional layer, and the orthographic projection of the third encapsulation layer 83 on the substrate 1 covers the orthographic projection of the light-emitting unit 31 on the substrate 1 .

[0264] The light-emitting functional layer may further include a first electrode 32 and a second electrode 33 disposed on opposite sides of the light-emitting unit 31, and the first electrode 32, the light-emitting unit 31 and the second electrode 33 are stacked in a direction away from the substrate 1. One of the first electrode 32 and the second electrode 33 may be a cathode, and the other may be an anode. The first electrode 32 and the second electrode 33 are respectively connected to the light-emitting unit 31 and are used to drive the light-emitting unit 31 to emit light. The third encapsulation layer 83 may cover the side of the second electrode 33 away from the substrate 1, and the third encapsulation layer 83 may reduce or prevent water and oxygen from entering the light-emitting unit 31, thereby increasing the service life of the light-emitting unit 31. Optionally, the first electrode 32 is an anode, and the second electrode 33 is a cathode.

[0265] The third encapsulation layer 83 can be made of organic or inorganic materials. The first encapsulation layer 81, the second encapsulation layer 82 and the third encapsulation layer 83 can be made of the same or different materials. The third encapsulation layer 83 is conducive to improving the water and oxygen isolation ability of the display panel 100 to the light-emitting functional layer. The third encapsulation layer 83 and the second encapsulation layer 82 are made of different materials, so that the third encapsulation layer 83 and the second encapsulation layer 82 can have different properties to improve the ability of the display panel 100 to resist water and oxygen.

[0266] Please refer to Fig.16In some embodiments, the third encapsulation layer 83 includes a plurality of third encapsulation parts 831, at least a portion of the third encapsulation part 831 is located within the defined opening 23, the orthographic projection of the third encapsulation part 831 on the substrate 1 covers the orthographic projection of the light-emitting unit 31 on the substrate 1, and the edge of the third encapsulation part 831 overlaps the isolation structure 2.

[0267] The third encapsulation part 831 and the light emitting unit 31 can be arranged in a one-to-one correspondence, that is, one third encapsulation part 831 is used to encapsulate one light emitting unit 31. The third encapsulation part 831 can be arranged entirely within the defined opening 23, or partially extend to the outside of the defined opening 23. The edge of the third encapsulation part 831 overlaps the isolation structure 2 to avoid or reduce the formation of a gap between the third encapsulation part 831 and the isolation structure 2 through which water and oxygen can pass.

[0268] Since the light-emitting unit 31 is not provided in the encapsulation area PA and the light-transmitting area TA, the second encapsulation layer 82 and the third encapsulation layer 83 may not be provided in the encapsulation area PA and the light-transmitting area TA, so as to reduce or avoid unnecessary refraction of light incident on the light-transmitting area TA in the light-transmitting area TA, thereby improving the light transmittance of the light-transmitting area TA.

[0269] In some embodiments, the third encapsulation layer 83 is an inorganic material layer.

[0270] The material of the third encapsulation layer 83 may be the same as that of the first encapsulation layer 81 to simplify the manufacturing process.

[0271] See also Fig.12 In some embodiments, the display panel 100 further includes a dam structure 71 , which is disposed on one side of the substrate 1 , the dam structure 71 is disposed around the display area AA, and at least a portion of the second encapsulation layer 82 is located between the isolation structure 2 and the dam structure 71 .

[0272] The second encapsulation layer 82 may be spaced apart from the second encapsulation layer 82 , thereby improving the ability of the display panel 100 to isolate the display panel 100 from external water and oxygen in the direction from the encapsulation layer to the display layer.

[0273] In some embodiments, part of the second encapsulation layer 82 is located on the side of the dam structure 71 facing away from the substrate 1 , and the orthographic projection of the second encapsulation layer 82 on the substrate 1 partially overlaps with the orthographic projection of the dam structure 71 on the substrate 1 .

[0274] In the direction away from the substrate 1, the second encapsulation layer 82 can be thicker than the dam structure 71, so that part of the second encapsulation layer 82 can extend to the side of the dam structure 71 away from the substrate 1, avoiding spacing between the second encapsulation layer 82 and the dam structure 71; the first encapsulation layer 81 can smoothly extend from the side of the second encapsulation layer 82 away from the substrate 1 to the side of the dam structure 71 away from the substrate 1, which is beneficial to avoid or reduce the appearance of cracks in the first encapsulation layer 81.

[0275] In some embodiments, the pixel definition layer 72 is located on a side of the dam structure 71 facing away from the substrate 1 , and a portion of the pixel definition layer 72 is located between the second encapsulation layer 82 and the dam structure 71 .

[0276] A portion of the pixel definition layer 72 is located on a side of the second packaging portion 812 close to the substrate 1, and another portion of the pixel definition layer 72 is located on a side of the dam away from the substrate 1, so that a portion of the pixel definition layer 72 is located between the second packaging layer 82 and the dam structure 71, thereby avoiding or reducing the transfer of electrostatic charge accumulated in the packaging area PA to the second packaging layer 82 through the display definition layer.

[0277] In some embodiments, the orthographic projection of the pixel definition layer 72 on the substrate 1 covers the orthographic projection of the dam structure 71 on the substrate 1 .

[0278] The side of the dam structure 71 facing away from the substrate 1 may be covered by the pixel definition layer 72 , thereby improving the water vapor isolation capability of the display panel 100 on the side of the dam structure 71 facing away from the substrate 1 .

[0279] In some embodiments, the pixel definition layer 72 extends along the bank structure 71 .

[0280] The dam structure 71 can be prepared first, and the material used to prepare the pixel definition layer 72 can be covered on the dam structure 71 to form a pixel definition layer 72 extending along the dam structure 71, thereby increasing the contact area between the pixel definition layer 72 and the dam structure 71, which is beneficial to improving the packaging ability of the pixel definition layer 72 and the dam structure 71 for the display area AA.

[0281] The pixel definition layer 72 extends along the dam structure 71 , thereby improving the bonding capability between the pixel definition layer 72 and the dam structure 71 .

[0282] In some embodiments, the pixel definition layer 72 includes a second sub-portion 723 located between the isolation structure 2 and the electrostatic protection structure 4 , and at least a portion of the second encapsulation layer 82 is located on a side of the second sub-portion 723 away from the electrostatic protection structure 4 .

[0283] Along the direction from the display area AA to the encapsulation layer, the isolation structure 2, the second encapsulation layer 82, the second division 723, and the dam structure 71 are connected in sequence, thereby avoiding or reducing the external water vapor and the electrostatic charge accumulated in the electrostatic protection structure 4 from entering the display area AA from the encapsulation area PA, thereby improving the life of the light-emitting unit 31.

[0284] In some embodiments, the pixel definition layer 72 includes a third section 724 , which is connected to an end of the second section 723 near the light-transmitting area TA, and the dam structure 71 , the third section 724 and the first encapsulation layer 81 are stacked in sequence in a direction away from the substrate 1 .

[0285] The dam structure 71 , the third portion 724 and the first encapsulation layer 81 are sequentially stacked in a direction away from the substrate 1 to form a structure enclosing the second encapsulation layer 82 , thereby minimizing or preventing external water vapor from entering the second encapsulation layer 82 .

[0286] In some embodiments, the display panel 100 also includes a first dielectric layer 5, at least a portion of the first dielectric layer 5 is located between adjacent electrostatic conductive portions 41, a third gap G3 is provided between the dam structure 71 and the first dielectric layer 5, and a portion of the third division 724 is located within the third gap G3 and in contact with the electrostatic protection structure 4.

[0287] The dam structure 71 and the first dielectric layer 5 can be arranged protruding relative to the electrostatic protection structure 4, so that a third gap G3 is provided between the dam structure 71 and the first dielectric layer 5, and the third section 724 can extend from the side of the dam structure 71 away from the substrate 1 to the third gap G3, and then extend along the electrostatic protection structure 4 to the side of the first dielectric layer 5 away from the substrate 1. The third section 724 is arranged non-planar, so as to avoid the cracks in the third section 724 from continuing to spread along the direction from the light-transmitting area TA to the display area AA.

[0288] In some embodiments, the encapsulation area PA includes a first encapsulation area PA1 and a second encapsulation area PA2, and the display area AA, the first encapsulation area PA1, the second encapsulation area PA2 and the light-transmitting area TA are sequentially arranged; the display panel 100 further includes a pixel definition layer 72 and a first encapsulation layer 81, the pixel definition layer 72 is arranged between the substrate 1 and the isolation structure 2, the pixel definition layer 72 includes a pixel opening 721, the pixel opening 721 is connected to the corresponding limiting opening 23, and the light-emitting unit 31 is at least partially arranged in the pixel opening 721; the first encapsulation layer 81 is located on the side of the light-emitting functional layer away from the substrate 1;

[0289] In the first encapsulation area PA1, the substrate 1, the electrostatic protection structure 4, the pixel definition layer 72 and the first encapsulation layer 81 are sequentially arranged in a direction away from the substrate 1;

[0290] In the second encapsulation area PA2 , the substrate 1 , the pixel definition layer 72 and the first encapsulation layer 81 are stacked in sequence along a direction away from the substrate 1 .

[0291] In the first encapsulation area PA1, the electrostatic protection structure 4 can guide the static electricity entering the encapsulation area PA from the light-transmitting area TA, and avoid or reduce the static electricity entering the display area AA from the encapsulation area PA. In the second encapsulation area PA2, the stacked substrate 1, the pixel definition layer 72 and the first encapsulation layer 81 can encapsulate the side of the electrostatic protection structure 4 close to the light-transmitting area TA, thereby preventing external water vapor from entering the electrostatic protection structure 4 from the light-transmitting area TA.

[0292] In some embodiments, the display panel 100 also includes a first dielectric layer 5, the first dielectric layer 5 includes a second dielectric sub-portion 52, the second dielectric sub-portion 52 surrounds the side of the electrostatic protection structure 4 away from the display area AA, and a portion of the pixel definition layer 72 is arranged around the side of the second dielectric sub-portion away from the display area AA.

[0293] The second dielectric sub-portion 52 is spaced between the electrostatic protection structure 4 and the pixel definition layer 72, and the second dielectric sub-portion 52 can prevent the cracks formed by cutting the pixel definition layer 72 and the first encapsulation layer 81 from continuing to spread toward the display area AA. Optionally, the second dielectric sub-portion 52 is an organic dielectric material.

[0294] See also Figure 2 and Figure 3 In some embodiments, the display panel 100 further includes a first encapsulation layer 81 and a cover plate 92, the first encapsulation layer 81 is located in the display area AA and the encapsulation area PA, and the first encapsulation layer 81 is located on the side of the light-emitting functional layer, the isolation structure 2 and the electrostatic protection structure 4 away from the substrate 1; the cover plate 92 is located on the side of the first encapsulation layer 81 away from the substrate 1, and the cover plate 92 is located in the display area AA, the encapsulation area PA and the light-transmitting area TA.

[0295] The cover plate 92 extends in the display area AA, the encapsulation area PA and the light transmission area TA, so that the cover plate 92 can effectively protect the layer structures in the display area AA, the encapsulation area PA and the light transmission area TA from being damaged by external forces.

[0296] In some embodiments, the display panel 100 also includes a polarizing layer 93, and the first encapsulation layer 81, the polarizing layer 93 and the cover plate 92 are stacked in sequence along a direction away from the substrate 1, the surface of the first encapsulation layer 81 away from the substrate 1 is non-planar, and the surface of the polarizing layer 93 away from the substrate 1 is planar.

[0297] The polarizing layer 93 can adjust the light emitted by the light emitting unit 31 to improve the display effect of the display panel 100. The first encapsulation layer 81, the polarizing layer 93 and the cover plate 92 are stacked in sequence in a direction away from the substrate 1. The surface of the first encapsulation layer 81 away from the substrate 1 is non-planar, and the surface of the polarizing layer 93 away from the substrate 1 is planar, so that the polarizing layer 93 also has the function of flattening the first encapsulation layer 81.

[0298] In some embodiments, the polarizing layer 93 is disposed around the light-transmitting area TA, thereby improving light transmittance of the light-transmitting area TA.

[0299] Please refer to Fig.12 and Fig.16In some embodiments, the isolation structure 2 includes a first isolation layer 21 and a second isolation layer 22 which are stacked together, the first isolation layer 21 is arranged on a side of the second isolation layer 22 close to the substrate 1, and the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the second isolation layer 22 on the substrate 1.

[0300] The isolation structure 2 encloses and forms a limited opening 23 to limit the setting range of the light-emitting functional layer. The isolation structure 2 includes a first isolation layer 21 and a second isolation layer 22 that are stacked, and the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the second isolation layer 22 on the substrate 1, so that the cross-sectional area of ​​the end of the isolation structure 2 away from the substrate 1 is larger, and the cross-sectional area of ​​the end of the isolation structure 2 close to the substrate 1 is smaller. Along the direction from the isolation structure 2 to the substrate 1, the second isolation layer 22 completely blocks the first isolation layer 21.

[0301] When preparing the light-emitting unit 31, the light-emitting material A used to prepare the light-emitting unit 31 can be covered on the isolation structure 2 based on the evaporation technology. Since the second isolation layer 22 blocks the first isolation layer 21, the light-emitting material A used to prepare the light-emitting unit 31 has a large drop at the edge of the second isolation layer 22, and the light-emitting material A falling in the defined opening 23 and the light-emitting material A falling on the second isolation layer 22 are difficult to connect, so they are broken, forming light-emitting materials A arranged in adjacent defined openings 23. Compared with the preparation of the light-emitting functional layer by mask evaporation in the related art, the present application sets the first isolation layer 21 and the second isolation layer 22, so that the light-emitting unit 31 located in the defined opening 23 can be prepared without a metal mask, thereby saving the cost of preparing the metal mask. Compared with preparing the light-emitting functional layer by preparing a high-precision metal mask for evaporation, it is easier to directly prepare the isolation structure 2 with high precision, so that the structure of the display panel 100 provided by the present application has low requirements on the preparation process, and the consistency of the prepared display panel 100 is good. The light-emitting material A can be a complex containing indium element. Because the light emitting units 31 are spaced apart by the isolation structure 2 disposed in the display area AA, no film layer of the light emitting unit 31 may be disposed in the encapsulation area PA.

[0302] In some embodiments, the orthographic projection area of ​​the surface of the second isolation layer 22 facing away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the surface of the second isolation layer 22 close to the substrate 1 on the substrate 1 .

[0303] The second isolation layer 22 extends outward a predetermined distance relative to the first isolation layer 21, that is, the orthographic projection area of ​​the surface of the second isolation layer 22 facing away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the surface of the second isolation layer 22 close to the substrate 1 on the substrate 1, so that the second isolation layer 22 has an inclined slope structure, so that the pattern of the light-emitting unit 31 is limited by the second isolation layer 22.

[0304] In some embodiments, the cross-sectional area of ​​the second isolation layer 22 gradually decreases in a direction away from the substrate 1 .

[0305] Optionally, the cross-section of the second isolation layer 22 is a trapezoid with the bottom edge facing the substrate 1, so that the second isolation layer 22 has a sloped surface, which is conducive to the preparation material being disconnected at the partition edge, forming a state in which part of the preparation material is located on the second isolation layer 22 and part of the preparation material is located in the isolation opening.

[0306] In some embodiments, the orthographic projection area of ​​the surface of the first isolation layer 21 facing away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the surface of the second isolation layer 22 close to the substrate 1 on the substrate 1 .

[0307] That is, the second isolation layer 22 extends outward relative to the first isolation layer 21, so as to limit the pattern of the first electrode 32 and the light-emitting unit 31 through the second isolation layer 22. The area of ​​the second isolation layer 22 is larger than that of the first isolation layer 21, and it is completely covered by the first isolation layer 21. At this time, the first isolation layer 21 is recessed relative to the second isolation layer 22 in a direction away from the isolation opening. When preparing the light-emitting unit 31, at least part of the material used to prepare the light-emitting unit 31 has a large drop at the edge of the isolation structure 2, and the first isolation layer 21 is concavely arranged, and the material used to prepare the light-emitting unit 31 is difficult to connect on the outside of the isolation structure 2, so that a break is found, forming mutually isolated light-emitting units 31.

[0308] See also Fig.17 In some embodiments, the isolation structure 2 includes a third isolation layer 24, which is located on a side of the first isolation layer 21 close to the substrate 1, and the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the third isolation layer 24 on the substrate 1. The cross section of the isolation structure 2 may be I-shaped.

[0309] Optionally, the orthographic projection area of ​​the first isolation layer 21 on the substrate 1 is smaller than the orthographic projection area of ​​the third isolation layer 24 on the substrate 1 .

[0310] The cross section of the first isolation layer 21 can be a trapezoid, which increases the size of the isolation opening. The cross section of the first isolation layer 21 can be a regular trapezoid, which can stably support the second isolation layer 22 on the one hand, and on the other hand, make the contact surface area between the first isolation layer 21 and the second isolation layer 22 smaller.

[0311] Optionally, the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the third isolation layer 24 on the substrate 1, so that the third isolation layer 24 can stably support the first isolation layer 21, thereby realizing that the first isolation layer 21 is concavely set relative to the second isolation layer 22 in a direction away from the central axis of the isolation opening, which facilitates the disconnection of the light-emitting device layer at the isolation structure 2, and the etching waste generated by etching the first isolation layer 21 falls on the third isolation layer 24, which is easy to clean.

[0312] In some embodiments, the first isolation layer 21 includes a conductive material, and an edge of the second electrode 33 overlaps the first isolation layer 21 .

[0313] The edge of the first electrode 32 overlaps the first isolation layer 21 , so that the first isolation layer 21 can supply power to the first electrode 32 and also enable the adjacent first electrodes 32 to conduct electricity, thereby forming a surface electrode with a whole surface being conductive.

[0314] In some other embodiments, the first electrode 32 is electrically connected to the third isolation layer 24. The third isolation layer 24 is made of molybdenum metal; and / or the first isolation layer 21 is made of aluminum metal; and / or the second isolation layer 22 is made of titanium metal.

[0315] Optionally, the isolation structure 2 is in a grid shape, and the isolation openings are arranged in an array, so as to improve the light emission uniformity of the light emitting units 31 .

[0316] The second aspect of the present application also provides a display device. Figure 1 and Figure 2 , the display device includes the display panel 100 of any of the first embodiment. Since the display device provided by the third embodiment of the present application includes the display panel 100 of any of the first embodiment, the display device provided by the fourth embodiment of the present application has the beneficial effects of the display panel 100 of any of the first embodiment, which will not be described in detail here.

[0317] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0318] In some embodiments, the display device includes: a light sensing element, which is disposed opposite to the display panel 100100, and an orthographic projection of the light sensing element on the display panel 100 at least partially overlaps with the light-transmitting area TA.

[0319] The display panel 100 has a light-transmitting hole 101 penetrating the substrate 1, the pixel definition layer 72, the first encapsulation layer 81, the touch layer 6 and the polarizing layer 93. The light-transmitting hole 101 is located in the light-transmitting area TA. The light-sensing element can be arranged on one side of the light-transmitting hole 101, or can be fully or partially extended into the light-transmitting hole 101. The light-sensing element can be a photoelectric conversion element such as an infrared sensor and a camera.

[0320] According to the embodiments of the present application as above, these embodiments do not describe all the details in detail, nor do they limit the invention to specific embodiments. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel comprises a display area, a light-transmitting area and a packaging area, wherein the display area is arranged around at least a portion of the light-transmitting area, and the packaging area is located between the display area and the light-transmitting area; the display panel comprises: substrate; An isolation structure, disposed on one side of the substrate, the isolation structure is located in the display area, and the isolation structure encloses a plurality of defined openings; a light-emitting functional layer, comprising a plurality of light-emitting units located in the display area, wherein at least a portion of the light-emitting units is disposed in the defined opening; The electrostatic protection structure is arranged on one side of the substrate, and the electrostatic protection structure is arranged in the packaging area.

2. The display panel according to claim 1, characterized in that: The electrostatic protection structure is disposed around at least a portion of the light-transmitting area; Preferably, the electrostatic protection structure comprises a plurality of electrostatic conduction parts, and the plurality of electrostatic conduction parts are arranged at intervals; Preferably, the electrostatic conduction portion is annular, and a plurality of the electrostatic conduction portions are sequentially arranged along a direction from the light-transmitting area to the display area; Preferably, the electrostatic protection structure further comprises a connecting portion, wherein the connecting portion connects adjacent electrostatic conductive portions; Preferably, the spacing distance between adjacent electrostatic conductive parts is greater than or equal to 3 microns; Preferably, the display panel further comprises a first dielectric layer, at least a portion of the first dielectric layer is located between adjacent electrostatic conductive portions; Preferably, the first dielectric layer is located on a side of the electrostatic protection structure facing away from the substrate, and an orthographic projection of the first dielectric layer on the substrate covers an orthographic projection of the electrostatic protection structure on the substrate; Preferably, the orthographic projection of the first dielectric layer on the substrate partially overlaps with the orthographic projection of the electrostatic protection structure on the substrate, and the first dielectric layer comprises a plurality of spaced first dielectric sub-parts, wherein the first dielectric sub-parts are located between adjacent electrostatic conductive parts; Preferably, a surface of the first dielectric sub-part facing away from the substrate protrudes in a direction away from the substrate relative to a surface of the electrostatic conductive part facing away from the substrate; or a surface of the first dielectric sub-part facing away from the substrate and a surface of the electrostatic protection structure facing away from the substrate are in the same reference plane; Preferably, at least a portion of the first dielectric layer is located between the isolation structure and the electrostatic conductive portion.

3. The display panel according to any one of claims 1 or 2, characterized in that: The substrate comprises a substrate and a driving circuit layer, wherein the driving circuit layer is arranged between the substrate and the light-emitting functional layer, and the driving circuit layer comprises a plurality of conductive layers arranged in sequence and spaced apart in a direction away from the substrate, and a portion of at least one of the plurality of conductive layers is located in the packaging area and reused as at least a portion of the electrostatic protection structure; Preferably, the plurality of conductive layers located in the encapsulation area are insulated from the plurality of conductive layers located in the display area; Preferably, the conductive layer located in the packaging area is grounded; Preferably, the electrostatic protection structure comprises a plurality of electrostatic conduction parts arranged at intervals, and the plurality of electrostatic conduction parts are the same conductive layer; Preferably, the electrostatic protection structure comprises a plurality of electrostatic conductive parts arranged at intervals, and at least two of the plurality of electrostatic conductive parts are different conductive layers; Preferably, the plurality of conductive layers include a first conductive layer, the first conductive layer includes a source electrode, a drain electrode and a first electrostatic conductive portion, the source electrode and the drain electrode are located in the display area, and the first electrostatic conductive portion is arranged in the packaging area and reused as the electrostatic conductive portion; Preferably, the plurality of conductive layers include a second conductive layer, the second conductive layer includes a gate and a second electrostatic conductive portion, the gate is located in the display area, and the second electrostatic conductive portion is disposed in the packaging area and multiplexed as the electrostatic conductive portion; Preferably, the plurality of conductive layers include a third conductive layer and a fourth conductive layer, the third conductive layer includes a first electrode plate, the fourth conductive layer includes a second electrode plate and a third electrostatic conductive portion, the orthographic projection of the first electrode plate on the substrate at least partially overlaps the orthographic projection of the second electrode plate on the substrate, and the third electrostatic conductive portion is disposed in the packaging area and reused as the electrostatic conductive portion; Preferably, the driving circuit layer includes at least one dielectric layer, the dielectric layer includes a first dielectric portion located in the packaging area and a second dielectric portion located in the display area, the second dielectric portion covers a side of any one of the conductive layers away from the substrate, and at least a portion of the first dielectric portion is located between adjacent electrostatic conductive portions.

4. The display panel according to claim 3, characterized in that: The driving circuit layer comprises a second dielectric layer, the second dielectric layer is arranged on a side of the first conductive layer away from the substrate, at least part of the first dielectric portion of the second dielectric layer is located between adjacent electrostatic conductive portions, and the second dielectric portion of the second dielectric layer covers a side of the gate away from the substrate; Preferably, the surface of the first dielectric portion of the second dielectric layer facing away from the substrate is protruded relative to the electrostatic conductive portion; Or a surface of the first dielectric portion of the second dielectric layer facing away from the substrate is in the same reference plane as the electrostatic conductive portion.

5. The display panel according to any one of claims 1 or 2, characterized in that: The display panel further includes a touch layer, the touch layer is located on a side of the light-emitting functional layer away from the substrate, and a portion of the touch layer is located in the packaging area to form at least a portion of the electrostatic protection structure; Preferably, the touch layer comprises a touch electrode located in the display area and the electrostatic protection structure located in the packaging area, and the touch electrode is insulated from the electrostatic protection structure; Preferably, the touch layer includes a first touch sublayer and a second touch sublayer, the first touch sublayer includes a first touch electrode located in the display area and the electrostatic protection structure located in the packaging area; Preferably, the display panel further includes: A first touch-control encapsulation layer, located on a side of the touch-control layer close to the substrate; A second touch control packaging layer is located on a side of the touch control layer away from the substrate, and the electrostatic protection structure is located between the first touch control packaging layer and the second touch control packaging layer; Preferably, the electrostatic protection structure is grounded; Preferably, the first touch control encapsulation layer and the second touch control encapsulation layer are in contact and stacked on a side of the electrostatic protection structure away from the display area.

6. The display panel according to claim 1, characterized in that: The display panel further comprises a dam structure, wherein the dam structure is disposed on one side of the substrate, the dam structure is disposed around the display area, and at least a portion of the dam structure is located between the isolation structure and the electrostatic protection structure; Preferably, the surface of the dam structure facing away from the substrate is protruded relative to the electrostatic protection structure in a direction facing away from the substrate; Preferably, the thickness of the dam structure away from the substrate is greater than the thickness of the electrostatic protection structure away from the substrate.

7. The display panel according to claim 6, characterized in that: The orthographic projection of the dam structure on the substrate at least partially overlaps with the orthographic projection of the electrostatic protection structure on the substrate; Preferably, the electrostatic protection structure comprises a plurality of electrostatic conductive parts arranged at intervals, and an orthographic projection of at least one of the electrostatic conductive parts on the substrate is located within an orthographic projection of the dam structure on the substrate; Preferably, the display panel further comprises a first dielectric layer, at least a portion of the first dielectric layer is located between adjacent electrostatic conductive portions; The surface of the dam structure facing away from the substrate is protruded in a direction facing away from the substrate relative to the surface of the first dielectric layer facing away from the substrate.

8. The display panel according to claim 6, characterized in that: The substrate comprises a substrate and a driving circuit layer, wherein the driving circuit layer is arranged between the substrate and the light-emitting functional layer, the driving circuit layer comprises at least one conductive layer and at least one dielectric layer, the dielectric layer comprises a first dielectric portion located in the packaging area and a second dielectric portion located in the display area, and the second dielectric portion covers a side of any conductive layer away from the substrate; At least a portion of the first dielectric portion is at least a portion of the dam structure; Or, the orthographic projection of the dam structure on the substrate and the orthographic projection of the electrostatic protection structure on the substrate are arranged at intervals, Or, the orthographic projection of the dam structure on the substrate covers the orthographic projection of the first dielectric portion on the substrate, Or, the orthographic projection of the dam structure on the substrate is located within the orthographic projection of the first dielectric portion on the substrate; Preferably, the first dielectric portions of at least two of the dielectric layers are stacked in a direction away from the substrate and form at least a portion of the dam structure.

9. The display panel according to claim 1, characterized in that: The display panel further includes: A pixel definition layer, disposed between the substrate and the isolation structure, the pixel definition layer comprising a pixel opening, the pixel opening being in communication with the corresponding defined opening, the light emitting unit being at least partially disposed in the pixel opening; Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the limiting opening on the substrate; Preferably, part of the pixel definition layer is located on a side of the electrostatic protection structure away from the substrate, and an orthographic projection of the electrostatic protection structure on the substrate is located within an orthographic projection of the pixel definition layer on the substrate; Preferably, the pixel definition layer comprises a first sub-section, a second sub-section and a third sub-section connected in sequence, the first sub-section is located in the display area and between the isolation structure and the substrate, the second sub-section is located between the isolation structure and the electrostatic protection structure, and the third sub-section is located on a side of the electrostatic protection structure away from the substrate; Preferably, the electrostatic protection structure comprises a plurality of electrostatic conduction parts arranged at intervals, and a portion of the third section is located between adjacent electrostatic conduction parts; Preferably, the electrostatic protection structure comprises a plurality of electrostatic conductive parts arranged at intervals, the display panel further comprises a first dielectric layer, the first dielectric layer comprises a plurality of first dielectric sub-parts arranged at intervals, and the first dielectric sub-parts are located between adjacent electrostatic conductive parts; The third sub-portion is located on a side of the first dielectric layer facing away from the substrate and is in contact with the first dielectric layer; Preferably, there is a second gap between adjacent first dielectric sub-parts, and a portion of the third sub-part is located in the second gap and contacts the electrostatic conductive part; Preferably, the pixel definition layer includes a fourth section, the fourth section is connected to an end of the third section away from the second section, and the fourth section is stacked on one side of the substrate and in contact with the substrate.

10. The display panel according to claim 9, characterized in that: The display panel further includes a first encapsulation layer, In the display area, there is a first gap between the first encapsulation layer and the pixel definition layer; the light-emitting functional layer and the isolation structure are arranged in the first gap; In the encapsulation area, the first encapsulation layer is stacked on a side of the pixel definition layer away from the substrate, and the stacked first encapsulation layer and the pixel definition layer block the first gap; Preferably, the first encapsulation layer is arranged around the light-transmitting area; Preferably, the display panel further comprises a second encapsulation layer, the second encapsulation layer is arranged in the display area, and the second encapsulation layer is located between the first encapsulation layer and the pixel definition layer; Preferably, the second encapsulation layer covers a side of the light-emitting functional layer away from the substrate and a side of the isolation structure away from the substrate; Preferably, the first encapsulation layer comprises a first encapsulation portion and a second encapsulation portion connected to each other, the first encapsulation portion is located in the display area, the first encapsulation portion is located on a side of the second encapsulation layer away from the substrate, the second encapsulation portion is located in the encapsulation area, and the second encapsulation portion is located on a side of the pixel definition layer away from the substrate; Preferably, the distance between the surface of the second encapsulation layer facing away from the substrate and the substrate is greater than the distance between the surface of the electrostatic protection structure facing away from the substrate and the substrate; Preferably, the distance from the first packaging part to the substrate is greater than the distance from the second packaging part to the substrate; Preferably, a thickness of the first encapsulation portion along a direction away from the substrate is the same as a thickness of the second encapsulation portion along a direction away from the substrate; Preferably, the second encapsulation layer is an organic material layer; Preferably, the first encapsulation layer is an inorganic material layer.

11. The display panel according to claim 10, characterized in that: The display panel further comprises a dam structure, wherein the dam structure is disposed on one side of the substrate, the dam structure is disposed around the display area, and at least a portion of the second encapsulation layer is located between the isolation structure and the dam structure; Preferably, a portion of the second encapsulation layer is located on a side of the dam structure away from the substrate, and an orthographic projection of the second encapsulation layer on the substrate partially overlaps with an orthographic projection of the dam structure on the substrate; Preferably, the pixel definition layer is located on a side of the dam structure away from the substrate, and a portion of the pixel definition layer is located between the second encapsulation layer and the dam structure; The orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the dam structure on the substrate; Preferably, the pixel definition layer extends along the dam structure; Preferably, the pixel definition layer includes a second sub-portion, the second sub-portion is located between the isolation structure and the electrostatic protection structure, and at least a portion of the second encapsulation layer is located on a side of the second sub-portion away from the electrostatic protection structure; Preferably, the pixel definition layer includes a third sub-section, the third sub-section is connected to an end of the second sub-section close to the light-transmitting area, and the dam structure, the third sub-section and the first encapsulation layer are stacked in sequence in a direction away from the substrate; Preferably, the electrostatic protection structure includes a plurality of electrostatic conduction parts arranged at intervals, the display panel also includes a first dielectric layer, at least a portion of the first dielectric layer is located between adjacent electrostatic conduction parts, a third gap is provided between the dam structure and the first dielectric layer, a portion of the third division is located within the third gap and in contact with the electrostatic protection structure.

12. The display panel according to claim 1, characterized in that: The encapsulation area includes a first encapsulation area and a second encapsulation area, and the display area, the first encapsulation area, the second encapsulation area and the light-transmitting area are arranged in sequence; the display panel also includes: A pixel definition layer, disposed between the substrate and the isolation structure, the pixel definition layer comprising a pixel opening, the pixel opening being in communication with the corresponding defined opening, the light emitting unit being at least partially disposed in the pixel opening; A first encapsulation layer is located on a side of the light-emitting functional layer away from the substrate; In the first packaging area, the substrate, the electrostatic protection structure, the pixel definition layer and the first packaging layer are sequentially arranged in a direction away from the substrate; In the second encapsulation area, the substrate, the pixel definition layer and the first encapsulation layer are sequentially stacked in a direction away from the substrate; Preferably, the display panel further includes: A first dielectric layer includes a second dielectric sub-portion, the second dielectric sub-portion surrounds a side of the electrostatic protection structure away from the display area, and a portion of the pixel definition layer is arranged around a side of the second dielectric sub-portion away from the display area.

13. The display panel according to claim 1, characterized in that: The display panel further includes: A first encapsulation layer, located in the display area and the encapsulation area, the first encapsulation layer being located on a side of the light-emitting functional layer, the isolation structure and the electrostatic protection structure away from the substrate; a cover plate, the cover plate being located on a side of the first encapsulation layer away from the substrate, the cover plate being located in the display area, the encapsulation area and the light-transmitting area; Preferably, the display panel further includes: A polarizing layer, wherein the first encapsulation layer, the polarizing layer and the cover plate are stacked in sequence in a direction away from the substrate, a surface of the first encapsulation layer away from the substrate is non-planar, and a surface of the polarizing layer away from the substrate is planar; Preferably, the polarizing layer is arranged around the light-transmitting area.

14. The display panel according to claim 1, characterized in that: The isolation structure comprises a first isolation layer and a second isolation layer which are stacked, wherein the first isolation layer is arranged on a side of the second isolation layer close to the substrate, and an orthographic projection of the first isolation layer on the substrate is located within an orthographic projection of the second isolation layer on the substrate; Preferably, the orthographic projection area of ​​the surface of the second isolation layer facing away from the substrate on the substrate is smaller than the orthographic projection area of ​​the surface of the second isolation layer close to the substrate on the substrate; Preferably, an orthographic projection area of ​​a surface of the first isolation layer facing away from the substrate on the substrate is smaller than an orthographic projection area of ​​a surface of the second isolation layer close to the substrate on the substrate.

15. A display device, characterized in that: The invention comprises the display panel as claimed in any one of claims 1 to 14.

16. The display device according to claim 15, characterized in that: include: The light sensing element is arranged opposite to the display panel, and the orthographic projection of the light sensing element on the display panel at least partially overlaps with the light-transmitting area.

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