Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device, and solves the problem of signal crosstalk of the display panel in the prior art. The display panel comprises a substrate, an isolation structure, a light-emitting device, a packaging layer, a shielding layer and a touch layer, the isolation structure is located on one side of the substrate, at least part of the isolation structure at least encloses a first opening, and at least part of the light-emitting device is located in the first opening; the packaging layer is located on one side of the light-emitting device away from the substrate; the shielding layer is located on one side of the packaging layer away from the substrate. The touch layer is located on one side of the shielding layer away from the substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, there is a problem of signal crosstalk in current display panels. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, which solve the problem of signal crosstalk in the display panel in the prior art.

[0005] In a first aspect, the present application provides a display panel, including a substrate, an isolation structure, a light-emitting device, an encapsulation layer, a shielding layer and a touch layer, wherein the isolation structure is located on one side of the substrate, at least a portion of the isolation structure encloses a first opening, and at least a portion of the light-emitting device is located in the first opening; the encapsulation layer is located on a side of the light-emitting device away from the substrate; the shielding layer is located on a side of the encapsulation layer away from the substrate, and the touch layer is located on a side of the shielding layer away from the substrate.

[0006] In combination with the first aspect, in some possible implementations, the material of the shielding layer includes a transparent conductive material; preferably, the material of the shielding layer includes indium tin oxide; preferably, the transmittance of the shielding layer is greater than or equal to 80%; preferably, the shielding layer includes a continuous film layer; preferably, the display panel includes a display area and a non-display area surrounding the display area, and the shielding layer located in the non-display area includes at least one wiring; preferably, the orthographic projection of the shielding layer on the substrate covers the orthographic projection of the encapsulation layer located in the display area on the substrate; preferably, the orthographic projection of the shielding layer on the substrate covers the orthographic projections of the isolation structure, the light-emitting device and the encapsulation layer located in the display area on the substrate.

[0007] In combination with the first aspect, in some possible implementations, the orthographic projection of the touch layer on the substrate is located within the orthographic projection range of the isolation structure on the substrate; preferably, the substrate includes at least one of a data signal line and a scanning signal line; preferably, the shielding layer is grounded; preferably, the display panel also includes an insulating layer, and the insulating layer is located between the touch layer and the shielding layer.

[0008] In combination with the first aspect, in some possible implementations, the light-emitting device includes a second electrode, the encapsulation layer includes an inorganic encapsulation part, the inorganic encapsulation part is located on the side of the second electrode away from the substrate, the orthographic projection of the inorganic encapsulation part on the substrate covers a partial area of ​​the orthographic projection of the second electrode on the substrate and the orthographic projection of the isolation structure on the substrate, and the partial area surrounds the orthographic projection of the light-emitting device on the substrate; preferably, the multiple inorganic encapsulation parts are arranged at intervals; preferably, the multiple inorganic encapsulation parts correspond one-to-one to the multiple light-emitting devices.

[0009] In combination with the first aspect, in some possible implementations, at least part of the isolation structure encloses a second opening, and the first opening and the second opening are spaced apart; preferably, the orthographic projection of the second opening on the substrate and the orthographic projection of the light-emitting device on the substrate do not overlap; preferably, the orthographic projection of the second opening on the substrate and the orthographic projection of the inorganic packaging portion on the substrate do not overlap.

[0010] In combination with the first aspect, in some possible implementations, the encapsulation layer also includes an organic encapsulation layer, which is located on the side of the inorganic encapsulation part away from the substrate, and the orthographic projection of the organic encapsulation layer on the substrate covers the orthographic projection of the inorganic encapsulation part on the substrate; preferably, the display panel also includes an inorganic encapsulation layer, which is located on the side of the organic encapsulation layer away from the substrate, and the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

[0011] In combination with the first aspect, in some possible implementations, the isolation structure includes a first part and a second part which are stacked, the first part is located on the side of the second part facing away from the substrate, and the orthographic projection of the first part on the substrate covers the orthographic projection of the second part on the substrate; preferably, the isolation structure also includes a third part, which is located on the side of the second part close to the substrate, and the orthographic projection of the second part on the substrate is within the range of the orthographic projection of the third part on the substrate.

[0012] In combination with the first aspect, in some possible implementations, the light-emitting device includes a first electrode and a second electrode stacked together, and the second electrode is located on a side of the first electrode facing away from the substrate; preferably, the second electrode and the second portion are overlapped.

[0013] In combination with the first aspect, in some possible implementations, the first portion includes a first plane sub-portion and at least one second plane sub-portion, and a first connecting sub-portion connecting the first plane sub-portion and the second plane sub-portion; the orthographic projection of the first plane sub-portion on the substrate surrounds the orthographic projection of the light-emitting device on the substrate, and the second plane sub-portion is located on the side of the first plane sub-portion facing the first opening; along the thickness direction of the substrate, the distance between the first plane sub-portion and the substrate is smaller than the distance between the second plane sub-portion and the substrate; preferably, the light-emitting device includes a first electrode, the first electrode is at least partially exposed to the first opening, and the orthographic projection of the second plane sub-portion on the substrate and the orthographic projection of the first electrode on the substrate at least partially overlap.

[0014] In combination with the first aspect, in some possible implementations, it also includes a pixel definition layer located on the side of the isolation structure facing the substrate, the pixel definition layer encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the first opening on the substrate.

[0015] In combination with the first aspect, in some possible implementations, the shielding layer is configured to receive a first signal in a first state and to receive a second signal in a second state; in the second state, the temperature of the shielding layer increases; preferably, the first signal is a ground signal.

[0016] A second aspect of the present application provides a display device, comprising the above-mentioned display panel.

[0017] In combination with the second aspect, in some possible implementations, it also includes an integrated circuit chip, and the integrated circuit chip and the display panel are bound and connected.

[0018] In combination with the second aspect, in some possible implementations, a temperature sensor is further included. The temperature sensor is electrically connected to the integrated circuit chip, and the temperature sensor is used to detect the external temperature.

[0019] In combination with the second aspect, in some possible implementations, the integrated circuit chip is electrically connected to the shielding layer, and the integrated circuit chip is used to output a preset voltage to the shielding layer when the external temperature is lower than a temperature threshold; preferably, the preset voltage is greater than or equal to 4 volts and less than or equal to 6 volts; preferably, the temperature threshold is less than or equal to -10 degrees Celsius and greater than or equal to -30 degrees Celsius.

[0020] The third aspect of the present application provides a method for preparing a display panel, including: preparing an isolation structure on one side of a substrate, the substrate including a first electrode, at least part of the isolation structure enclosing a first opening, the first opening exposing at least part of the first electrode; sequentially preparing a light-emitting layer and a second electrode in the first opening; preparing an encapsulation layer and a shielding layer on a side of the second electrode facing away from the substrate; and preparing a touch layer on a side of the shielding layer facing away from the substrate.

[0021] In combination with the third aspect, in some possible implementations, it also includes: the display panel includes a display area and a non-display area surrounding the display area; preparing an encapsulation layer and a shielding layer on the side of the second electrode facing away from the substrate includes: preparing an encapsulation layer on the side of the second electrode facing away from the substrate; preparing a shielding material layer on the side of the encapsulation layer facing away from the substrate, and patterning the shielding material layer to obtain a shielding layer, wherein the shielding layer located in the non-display area includes at least one routing line.

[0022] In conjunction with the third aspect, in some possible implementations, preparing a touch layer on the side of the shielding layer facing away from the substrate includes: preparing an insulating layer on the side of the shielding layer facing away from the substrate; and preparing a touch layer on the side of the insulating layer facing away from the substrate.

[0023] According to the display panel, preparation method thereof and display device provided by the embodiments of the present application, a shielding layer is arranged on the side of the touch layer close to the substrate to shield the signal, thereby achieving full shielding between the signal line of the substrate and the touch layer, thereby avoiding signal crosstalk between the signal line of the substrate and the touch layer due to the fact that some areas of the display panel (such as the second opening) are not covered by the cathode. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the cross-sectional structure of a display panel provided in the first embodiment of the present application.

[0025] Figure 2 for Figure 1 A schematic diagram of a partial cross-sectional structure of a display panel is shown.

[0026] Figure 3 for Figure 2 A schematic diagram of a partial cross-sectional structure of a display panel is shown.

[0027] Figure 4 A flow chart of a method for manufacturing a display panel provided in the first embodiment of the present application.

[0028] Figure 5a-5f A schematic structural diagram of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application.

[0029] Figure 6 A schematic diagram of the structure of a display device provided in the first embodiment of the present application.

[0030] Figure 7 A schematic diagram of the structure of a display device provided in the second embodiment of the present application. DETAILED DESCRIPTION

[0031] As mentioned in the background technology, organic light emitting diodes (OLED) and flat panel display devices based on light emitting diodes (LED) and other technologies have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0032] The current display panel size is no longer limited by the fine metal mask. As one of the alternative technical means, an isolation structure is usually set in the display panel to isolate the film layer evaporated on the isolation structure, such as the organic light-emitting functional layer and cathode layer of the adjacent light-emitting device. However, in this case, the cathode layer except the light-emitting opening area is completely etched away, so there is a problem of signal crosstalk between the touch signal line at the ambient light hole position and the signal line of the substrate.

[0033] In view of this, the display panel, its preparation method and display device provided in the embodiments of the present application, by setting a shielding layer on the side of the touch layer close to the substrate, play a role in shielding the signal, thereby achieving full shielding between the signal line of the substrate and the touch layer, and avoiding signal crosstalk between the signal line of the substrate and the touch layer due to the fact that some areas of the display panel (such as the second opening) are not covered by the cathode.

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is understood that when a structure is referred to as being "on or under" another structure, the structure may be directly on or under the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. The structures mentioned herein include any of a film layer, an element, a device, a component, and an assembly.

[0036] When a structure is referred to as being “connected” to another structure, the structure may be directly connected to the other structure or indirectly connected to the other structure with one or more intervening structures interposed therebetween.

[0037] The isolation structure mentioned in this application is recorded in application documents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 for reference.

[0038] Figure 1 FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel provided in the first embodiment of the present application. Figure 1 As shown, the display panel includes a substrate 11, an isolation structure 12, a light-emitting device 13, an encapsulation layer 14 and a shielding layer 15. The isolation structure 12 is located on one side of the substrate 11, and at least a portion of the isolation structure 12 encloses a first opening 1201. The light-emitting device 13 is located in the first opening 1201, the encapsulation layer 14 is located on the side of the light-emitting device 13 away from the substrate 11, the shielding layer 15 is located on the side of the encapsulation layer 14 away from the substrate 11, and the touch layer 17 is located on the side of the shielding layer 15 away from the substrate 11.

[0039] Among them, the substrate 11 can be a substrate substrate. In some embodiments, the substrate substrate can be a glass-based substrate. In some embodiments, the substrate substrate can include an organic resin material such as epoxy resin, triazine, silicone resin or polyimide. For example, the substrate substrate can be an FR4 type printed circuit board (Printed circuit board, PCB), or it can be a flexible PCB that is easy to deform. In some embodiments, the substrate substrate can include a ceramic material such as silicon nitride, aluminum nitride or aluminum oxide, or include a metal or a metal compound. For example, the substrate substrate can be a metal core printed circuit board (Metal Core PCB, MCPCB) or a metal copper clad laminate (Metal Copper Clad Laminate, MCCL).

[0040] The substrate 11 further includes a plurality of signal lines. Exemplarily, the substrate 11 includes at least one of a data signal line and a scan signal line.

[0041] The light-emitting device 13 may be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), etc. The light-emitting device 13 may be a light-emitting device of various colors, such as a red light-emitting device R, a green light-emitting device G, a blue light-emitting device B, etc.

[0042] Figure 2 for Figure 1 The partial cross-sectional structure diagram of the display panel is shown in FIG. Figure 2As shown, the light emitting device 13 includes a first electrode 131 and a second electrode 132, and at least one organic light emitting functional layer 133 located between the first electrode 131 and the second electrode 132. The first electrode 131 is located on the side of the second electrode 132 close to the substrate 11, and the first electrode 131 is at least partially exposed to the first opening 1201. The first electrode 131 may be an anode, and the second electrode 132 may be a cathode. The at least one organic light emitting functional layer 133 includes an emitting layer (EML), and may also include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron blocking layer (EBL) located between the anode and the emitting layer (EML), and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole blocking layer (HBL) located between the cathode and the emitting layer (EML).

[0043] In one embodiment, at least part of the isolation structure 12 encloses a second opening 1202, and the first opening 1201 and the second opening 1202 are spaced apart. Exemplarily, the first opening 1201 may be a light outlet, and the second opening 1202 may be a light transmission opening, that is, an ambient light hole.

[0044] In one embodiment, the orthographic projection of the second opening 1202 on the substrate 11 and the orthographic projection of the light emitting device 13 on the substrate 11 do not overlap.

[0045] The isolation structure 12 is used to electrically isolate adjacent light-emitting devices 13, and specifically can isolate at least part of the organic light-emitting functional layer 133 of the adjacent light-emitting devices 13. In one embodiment, the isolation structure 12 includes a first portion 121 and a second portion 122 stacked, the first portion 121 is located on the side of the second portion 122 away from the substrate 11, and the orthographic projection of the first portion 121 on the substrate 11 covers the orthographic projection of the second portion 122 on the substrate 11. Exemplarily, the second portion 122 can be designed as an independent film layer, that is, there is no physical interface inside the second portion 122, and each part is composed of the same material, for example, the material of the second portion 122 is aluminum. Alternatively, the second portion 122 can be designed to be composed of at least two film layers stacked. For example, the second portion 122 is formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer composed of molybdenum is located between the substrate 11 and the conductive film layer composed of aluminum. Exemplarily, the second portion 122 includes a conductive sub-portion, or the second portion 122 itself is a conductive structure. The second portion 122 overlaps the first electrode 131 of the light emitting device 13, so that the first electrodes 131 of adjacent light emitting devices 13 are electrically connected to each other, thereby realizing a full-surface cathode. The material of the first portion 121 can be an organic material, an inorganic material, or a metal material. In the case where the first portion 121 is a metal material, the material of the first portion 121 can be titanium.

[0046] Figure 3 for Figure 2 The partial cross-sectional structure diagram of the display panel is shown in FIG. Figure 3 As shown, in one embodiment, since the orthographic projection of the isolation structure 12 on the substrate 11 and the orthographic projection of the first electrode 131 on the substrate 11 partially overlap, the isolation structure 12 will be uneven, forming a step structure. Specifically, the first portion 121 includes a first plane sub-portion 1211 and at least one second plane sub-portion 1212, and a first connecting sub-portion 1213 connected to the first plane sub-portion 1211 and the second plane sub-portion 1212. The orthographic projection of the first plane sub-portion 1211 on the substrate 11 surrounds the orthographic projection of the light-emitting device 13 on the substrate 11, and the second plane sub-portion 1212 is located on the side of the first plane sub-portion 1211 facing the first opening 1201.

[0047] Further, along the thickness direction Z of the substrate 11 , a distance L1 between the first plane sub-portion 1211 and the substrate 11 is smaller than a distance L2 between the second plane sub-portion 1212 and the substrate 11 .

[0048] In one embodiment, an orthographic projection of the second planar sub-portion 1212 on the substrate 11 and an orthographic projection of the first electrode 131 on the substrate 11 at least partially overlap.

[0049] In one embodiment, the second portion 122 includes a third planar sub-portion 1221 and at least one fourth planar sub-portion 1222, and a second connecting sub-portion 1223 connecting the third planar sub-portion 1221 and the fourth planar sub-portion 1222, the orthographic projection of the third planar sub-portion 1221 on the substrate 11 surrounds the orthographic projection of the light-emitting device 13 on the substrate 11, and the fourth planar sub-portion is located on the side of the third planar sub-portion 1221 facing the first opening 1201.

[0050] Further, along the thickness direction Z of the substrate 11 , a distance L3 between the third plane sub-portion 1221 and the substrate 11 is smaller than a distance L4 between the fourth plane sub-portion 1222 and the substrate 11 .

[0051] In one embodiment, an orthographic projection of the fourth plane sub-portion 1222 on the substrate 11 and an orthographic projection of the first electrode 131 on the substrate 11 at least partially overlap.

[0052] In one embodiment, the third planar sub-portion 1221 overlaps with the first planar sub-portion 1211 , and the fourth planar sub-portion 1222 overlaps with the second planar sub-portion 1212 .

[0053] In one embodiment, the second connecting sub-portion 1223 is parallel to the first connecting sub-portion 1213 .

[0054] In one embodiment, the isolation structure 12 further includes a third portion 123, which is located on the side of the second portion 122 close to the substrate 11, and the orthographic projection of the second portion 122 on the substrate 11 is located within the orthographic projection range of the third portion 123 on the substrate 11. Exemplarily, the second portion 122 is a conductive film layer composed of aluminum, and the third portion 123 is a conductive film layer composed of molybdenum. In this case, the cross-section of the isolation structure 12 is I-shaped.

[0055] In one embodiment, the third portion 123 includes a fifth planar sub-portion 1231 and at least one sixth planar sub-portion 1232, and a third connecting sub-portion 1233 connecting the fifth planar sub-portion 1231 and the sixth planar sub-portion 1232, the orthographic projection of the fifth planar sub-portion 1231 on the substrate 11 surrounds the orthographic projection of the light-emitting device 13 on the substrate 11, and the sixth planar sub-portion 1232 is located on the side of the fifth planar sub-portion 1231 facing the first opening 1201.

[0056] Further, along the thickness direction Z of the substrate 11 , a distance L5 between the fifth plane sub-portion 1231 and the substrate 11 is smaller than a distance L6 between the sixth plane sub-portion 1232 and the substrate 11 .

[0057] In one embodiment, an orthographic projection of the sixth plane sub-portion 1232 on the substrate 11 and an orthographic projection of the first electrode 131 on the substrate 11 at least partially overlap.

[0058] In one embodiment, the fifth planar sub-portion 1231 overlaps with the third planar sub-portion 1221 , and the sixth planar sub-portion 1232 overlaps with the fourth planar sub-portion 1222 .

[0059] like Figure 3 and Figure 4 As shown, in one embodiment, the display panel also includes a pixel definition layer 16, which is located on the side of the isolation structure 12 facing the substrate 11, and the pixel definition layer 16 encloses a pixel opening 1601, and the orthographic projection of the pixel opening 1601 on the substrate 11 is located within the orthographic projection range of the first opening 1201 on the substrate 11.

[0060] Optionally, the pixel definition layer 16 may be made of a light-transmitting material so that the light of the light-emitting device 13 can better pass through the pixel definition layer. Optionally, the pixel definition layer 16 may be made of an opaque material so as to improve the light absorption of the pixel definition layer 16, reduce the reflectivity of the display panel, further reduce the optical crosstalk between adjacent light-emitting devices 13, and improve the display effect of the display panel.

[0061] In one embodiment, since the orthographic projection of the pixel definition layer 16 on the substrate 11 and the orthographic projection of the second electrode 132 on the substrate 11 partially overlap, the pixel definition layer 16 is uneven, forming a stepped structure. Specifically, the pixel definition layer 16 includes a seventh plane sub-portion 161 and at least one eighth plane sub-portion 162, and a fourth connecting sub-portion 163 connecting the seventh plane sub-portion 161 and the eighth plane sub-portion 162, the orthographic projection of the seventh plane sub-portion 161 on the substrate 11 surrounds the orthographic projection of the light-emitting device 13 on the substrate 11, and the eighth plane sub-portion 162 is located on the side of the seventh plane sub-portion 161 facing the pixel opening 1601.

[0062] Furthermore, the seventh plane sub-portion 161 is stacked on the substrate 11 , and the eighth plane sub-portion 162 is stacked on the first electrode 131 .

[0063] In one embodiment, an orthographic projection of the eighth plane sub-portion 162 on the substrate 11 and an orthographic projection of the first electrode 131 on the substrate 11 at least partially overlap.

[0064] In one embodiment, the seventh planar sub-portion 161 and the first planar sub-portion 1211 overlap, and the eighth planar sub-portion 162 and the second planar sub-portion 1212 overlap.

[0065] In one embodiment, the fourth connecting sub-portion 163 is parallel to the first connecting sub-portion 1213 .

[0066] Please refer again Figure 1 ,like Figure 1As shown, in one embodiment, the orthographic projection of the encapsulation layer 14 on the substrate 11 covers the orthographic projection of the light-emitting device 13 on the substrate 11. The encapsulation layer 14 includes an inorganic encapsulation portion 141, which is located on the side of the light-emitting device 13 away from the substrate 11, and the orthographic projection of the inorganic encapsulation portion 141 on the substrate 11 covers the orthographic projection of the second electrode 132 on the substrate 11 and the partial area of ​​the orthographic projection of the isolation structure on the substrate 11, and the partial area surrounds the orthographic projection of the light-emitting device 13 on the substrate 11. Exemplarily, the material of the inorganic encapsulation portion 141 is silicon oxide, silicon oxynitride or silicon nitride, etc. The inorganic encapsulation portion 141 can be a single layer, a multi-layer, a composite layer, etc.

[0067] In one embodiment, there are multiple inorganic packaging parts 141 , and the multiple inorganic packaging parts 141 are arranged at intervals.

[0068] In one embodiment, the plurality of inorganic encapsulation parts 141 correspond one-to-one to the plurality of light emitting devices 13 .

[0069] In one embodiment, an orthographic projection of the inorganic encapsulation portion 141 on the substrate 11 and an orthographic projection of the second opening 1202 on the substrate 11 do not overlap.

[0070] In one embodiment, the display panel further includes an organic encapsulation layer 142, which is located on the side of the inorganic encapsulation part 141 away from the substrate 11, and the orthographic projection of the organic encapsulation layer 142 on the substrate 11 covers the orthographic projection of the inorganic encapsulation part 141 on the substrate 11. Exemplarily, the material of the organic encapsulation layer 142 is a fiber material, a resin material, or a material for a laminated multilayer board, etc. The organic encapsulation layer 142 can be a single layer, a multilayer, a composite layer, etc.

[0071] In one embodiment, the inorganic encapsulation part 141 has a recess 1411 on one side away from the substrate 11, and the organic encapsulation layer 142 fills the recess 1411, which improves the flatness of the film layer and the encapsulation effect of the display panel. Exemplarily, the orthographic projection of the recess 1411 on the substrate 11 and the orthographic projection of the isolation structure 12 on the substrate 11 at least partially overlap.

[0072] In one embodiment, the display panel further includes an inorganic encapsulation layer 143, which is located on the side of the organic encapsulation layer 142 away from the substrate 11, and the orthographic projection of the inorganic encapsulation layer 143 on the substrate 11 covers the orthographic projection of the organic encapsulation layer 142 on the substrate 11. Exemplarily, the material of the inorganic encapsulation layer 143 is silicon oxide, silicon oxynitride or silicon nitride, etc. The inorganic encapsulation layer 143 can be a single layer, a multi-layer, a composite layer, etc.

[0073] In one embodiment, the display panel further includes a touch layer 17, which is located on the side of the shielding layer 15 away from the substrate 11. The orthographic projection of the touch layer 17 on the substrate 11 is within the orthographic projection range of the isolation structure 12 on the substrate 11.

[0074] In one embodiment, the touch layer 17 and the shielding layer 15 are insulated from each other. Specifically, the display panel further includes an insulating layer 18 , and the insulating layer 18 is located between the touch layer 17 and the shielding layer 15 .

[0075] In one embodiment, the shielding layer 15 is grounded to shield the signal, thereby achieving full shielding between the signal line of the substrate 11 and the touch layer 17 , and avoiding signal crosstalk between the signal line of the substrate 11 and the touch layer 17 due to the second opening 1202 not being covered by the second electrode 132 .

[0076] Specifically in one embodiment, the shielding layer 15 is configured to receive a first signal in a first state and a second signal in a second state. The first signal is a ground signal. In the first state, the shielding layer 15 plays a role of shielding the signal. In the second state, the temperature of the shielding layer 15 rises, and the thermal effect is used to ensure that the temperature of the display panel is in a constant temperature state, so as to avoid the low temperature environment affecting the normal use of the display device.

[0077] In one embodiment, the shielding layer 15 can be in the first state and the second state at the same time.

[0078] The material of the shielding layer 15 includes a transparent conductive material, and the transmittance of the shielding layer 15 is greater than or equal to 80%. Exemplarily, the material of the shielding layer 15 includes indium tin oxide. Exemplarily, the transmittance of the shielding layer 15 is 80%, 80.4%, 85%, 90%, 91% or 95%, etc. Compared with the non-light-transmitting metal layer, the shielding layer 15 can achieve signal shielding while also avoiding excessive light transmission loss of the second opening 1202.

[0079] In one embodiment, the shielding layer 15 includes a continuous film layer. Specifically, the shielding layer 15 is a whole-layer structure.

[0080] In one embodiment, the display panel includes a display area and a non-display area surrounding the display area, and the shielding layer located in the non-display area includes at least one wiring, and the wiring is used to connect the control circuit of the display device.

[0081] Further in one embodiment, the orthographic projection of the shielding layer 15 on the substrate 11 covers the orthographic projection of the encapsulation layer 14 on the substrate 11 located in the display area.

[0082] Further in one embodiment, the orthographic projection of the shielding layer 15 on the substrate 11 covers the orthographic projections of the isolation structure 12 , the light emitting device 13 and the encapsulation layer 14 located in the display area on the substrate 11 .

[0083] According to the display panel provided in the embodiment of the present application, a shielding layer is arranged on the side of the touch layer close to the substrate to shield the signal, thereby achieving full shielding between the signal line of the substrate and the touch layer, and avoiding signal crosstalk between the signal line of the substrate and the touch layer due to the fact that some areas of the display panel (such as the second opening) are not covered by the cathode.

[0084] The embodiment of the present application also provides a method for preparing a display panel. Figure 4 This is a flow chart of a method for preparing a display panel provided in the first embodiment of the present application. The preparation method is used to prepare a display panel provided in any of the above embodiments. Figure 4 As shown, the preparation method comprises:

[0085] Step S410: preparing an isolation structure on one side of a substrate, the substrate including a first electrode, at least a portion of the isolation structure encloses a first opening, and the first opening exposes at least a portion of the first electrode.

[0086] Step S420, preparing a light-emitting layer and a second electrode in sequence in the first opening.

[0087] Step S430: preparing a packaging layer and a shielding layer on a side of the second electrode facing away from the substrate.

[0088] Step S440 , preparing a touch layer on the side of the shielding layer facing away from the substrate.

[0089] Figure 5a-5f This is a schematic diagram of the structure of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application. The preparation method specifically includes:

[0090] According to step S410, refer to Figure 5a , an isolation structure 12 is prepared on one side of the substrate 11 , and at least a portion of the isolation structure 12 encloses a first opening 1201 , and the first opening 1201 exposes at least a portion of the first electrode 131 .

[0091] In one embodiment, at least a portion of the isolation structure 12 encloses a second opening 1202 , and the second opening 1202 and the first opening 1201 are spaced apart.

[0092] The isolation material layer is prepared by film forming process, and then the isolation material layer is patterned to obtain the isolation structure 12. For example, a groove can be formed on the isolation material layer by dry etching process, and then the sidewall of the groove can be further etched by wet etching process to form an undercut structure.

[0093] In one embodiment, preparing an isolation structure 12 on one side of a substrate 11 includes: preparing a pixel definition material layer on one side of the substrate 11, preparing an isolation material layer on a side of the pixel definition material layer facing away from the substrate 11, patterning the isolation material layer to obtain an isolation structure 12, and then patterning the pixel definition material layer to obtain a pixel definition layer 16.

[0094] According to step S420, refer to Figure 5b , a light-emitting layer and a second electrode layer are sequentially prepared in the first opening 1201 , and the light-emitting layer and the second electrode layer are disconnected at the isolation structure 12 to obtain a light-emitting unit 1301 and a second electrode 132 , respectively, wherein the light-emitting unit 1301 and the second electrode 132 are located in the first opening 1201 .

[0095] The light-emitting layer and the second electrode layer can be formed by an evaporation process.

[0096] According to step S430 , an encapsulation layer 14 and a shielding layer 15 are prepared on the side of the second electrode 132 facing away from the substrate 11 .

[0097] First, see Figure 5c , a packaging layer 14 is prepared on the side of the second electrode 132 away from the substrate 11 . Specifically, an inorganic packaging material layer is prepared on the side of the second electrode 132 away from the substrate 11 , and then the inorganic packaging material layer is pattern-etched to obtain an inorganic packaging portion 141 .

[0098] Then, see Figure 5d An organic encapsulation layer 142 and an inorganic encapsulation layer 143 are sequentially prepared on the side of the inorganic encapsulation portion 141 away from the substrate, and the inorganic encapsulation portion 141, the organic encapsulation layer 142 and the inorganic encapsulation layer 143 constitute the encapsulation layer 14.

[0099] Second, see Figure 5e , a shielding material layer is prepared on the side of the packaging layer 14 facing away from the substrate 11 , and the shielding material layer is patterned to obtain a shielding layer 15 .

[0100] In one implementation, the display panel includes a display area and a non-display area surrounding the display area, and the shielding layer located in the non-display area includes at least one wiring.

[0101] In one embodiment, see Figure 5f , a touch layer 17 is prepared on the side of the shielding layer 15 away from the substrate 11. Specifically, a touch material layer is prepared on the side of the shielding layer 15 away from the substrate 11, and the touch material layer is patterned and etched to obtain the touch layer 15, and the orthographic projection of the touch layer 15 on the substrate 11 is located within the orthographic projection range of the isolation structure 12 on the substrate 11.

[0102] In one embodiment, preparing the touch layer 17 on the side of the shielding layer 15 facing away from the substrate 11 includes: preparing the insulating layer 18 on the side of the shielding layer 15 facing away from the substrate 11 , and preparing the touch layer 17 on the side of the insulating layer 18 facing away from the substrate 11 .

[0103] Figure 6 This is a schematic diagram of the structure of a display device provided in the first embodiment of the present application. Figure 6 As shown, the display device is a product with an image display function. For example, the display device can be used to display static images, such as pictures or photos. The display device can also be used to display dynamic images, such as videos.

[0104] The display device can be a laptop computer, a mobile phone, a handheld or portable computer, a camera, a camcorder, a vehicle-mounted intelligent central control screen, a calculator, a smart watch, a GPS navigator, an electronic photo, an electronic billboard or sign, a projector, etc.

[0105] The display device includes the display panel 60 provided by any of the above embodiments or the display panel obtained by the preparation method provided by any of the above embodiments. The display panel 60 may be an organic light emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0106] In addition, the display device may also have functions such as taking photos, recording videos, fingerprint recognition, and face recognition. Accordingly, the display device also includes at least one functional module for realizing the above functions, such as an under-screen camera, an under-screen fingerprint recognition sensor, and the like.

[0107] Figure 7 This is a schematic diagram of the structure of a display device provided in the second embodiment of the present application. Figure 7 As shown, the display device further includes an integrated circuit chip 110 , and the integrated circuit chip 110 and the display panel 60 are bound and connected.

[0108] In one embodiment, the properties of the various film layer materials of the display panel 60 change due to the low temperature environment, and the changes in parameters such as impedance and dielectric constant have a greater impact on the touch performance of the display panel 60, which can easily lead to the deterioration of the touch performance or the inability to touch, thereby causing the display device to be unable to be used normally. Therefore, when the external temperature is too low, heat needs to be generated to maintain the temperature of the display panel. Specifically, the integrated circuit chip 110 is connected to the shielding layer 15, and the integrated circuit chip 110 is used to output a preset voltage to the shielding layer 15 when the external temperature is lower than the temperature threshold, and the shielding layer is heated to use the thermal effect to ensure that the temperature of the display panel 60 is in a constant temperature state, thereby preventing the low temperature environment from affecting the normal use of the display device. Furthermore, by reusing the shielding layer as a heating layer, the structure and preparation process of the display panel are simplified, and the cost is reduced.

[0109] In one embodiment, the preset voltage is greater than or equal to 4 volts and less than or equal to 6 volts. For example, the preset voltage may be 4 volts, 5 volts, 6 volts, or the like.

[0110] In one embodiment, the temperature threshold is less than or equal to -10 degrees Celsius and greater than or equal to -30 degrees Celsius. For example, the temperature threshold may be -10 degrees Celsius, -15 degrees Celsius, -20 degrees Celsius, -25 degrees Celsius, -30 degrees Celsius, etc.

[0111] Preferably, the temperature threshold is -20 degrees Celsius.

[0112] In one embodiment, the display device further includes a temperature sensor 120 . The temperature sensor 120 is electrically connected to the integrated circuit chip 110 . The temperature sensor 120 is used to detect the external temperature.

[0113] In one embodiment, the temperature sensor 120 may be disposed on a flexible circuit board of the display device.

[0114] In one embodiment, the temperature sensor 120 may be disposed on a host panel of the display device.

[0115] According to the display panel provided by the embodiment of the present application, a shielding layer is provided on the side of the touch layer close to the substrate to play a role in shielding signals, thereby achieving full shielding between the signal line of the substrate and the touch layer, thereby avoiding signal crosstalk between the signal line of the substrate and the touch layer due to the fact that some areas of the display panel (such as the second opening) are not covered by the cathode. Furthermore, when the external temperature is lower than the temperature threshold, the shielding layer is heated by the integrated circuit chip to output a preset voltage to the shielding layer, thereby utilizing the thermal effect to ensure that the temperature of the display panel is in a constant temperature state, thereby avoiding the low temperature environment from affecting the normal use of the display device. Furthermore, by reusing the shielding layer as a heating layer, the structure and preparation process of the display panel are simplified, thereby reducing costs.

[0116] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0117] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure, located at one side of the substrate, at least a portion of the isolation structure encloses a first opening; a light emitting device, at least a portion of which is located in the first opening; An encapsulation layer, located on a side of the light-emitting device away from the substrate; A shielding layer, located on a side of the packaging layer away from the substrate; as well as The touch layer is located on a side of the shielding layer away from the substrate.

2. The display panel according to claim 1, characterized in that: The material of the shielding layer includes a transparent conductive material; Preferably, the material of the shielding layer includes indium tin oxide; Preferably, the transmittance of the shielding layer is greater than or equal to 80%; Preferably, the shielding layer comprises a continuous film layer; Preferably, the display panel includes a display area and a non-display area surrounding the display area, and the shielding layer located in the non-display area includes at least one wiring; Preferably, the orthographic projection of the shielding layer on the substrate covers the orthographic projection of the encapsulation layer located in the display area on the substrate; Preferably, the orthographic projection of the shielding layer on the substrate covers the orthographic projections of the isolation structure, the light-emitting device and the encapsulation layer located in the display area on the substrate.

3. The display panel according to claim 1, characterized in that Preferably, the orthographic projection of the touch layer on the substrate is located within the orthographic projection range of the isolation structure on the substrate; Preferably, the substrate includes at least one of a data signal line and a scan signal line; Preferably, the shielding layer is grounded; Preferably, the display panel further includes an insulating layer, and the insulating layer is located between the touch layer and the shielding layer.

4. The display panel according to claim 1, characterized in that: The light-emitting device includes a second electrode, the encapsulation layer includes an inorganic encapsulation portion, the inorganic encapsulation portion is located on a side of the second electrode away from the substrate, the orthographic projection of the inorganic encapsulation portion on the substrate covers a partial area of ​​the orthographic projection of the second electrode on the substrate and the orthographic projection of the isolation structure on the substrate, and the partial area surrounds the orthographic projection of the light-emitting device on the substrate; Preferably, a plurality of the inorganic packaging parts are arranged at intervals; Preferably, the plurality of inorganic encapsulation parts correspond one-to-one to the plurality of light-emitting devices.

5. The display panel according to claim 4, characterized in that: At least a portion of the isolation structure encloses a second opening, and the first opening and the second opening are spaced apart; Preferably, the orthographic projection of the second opening on the substrate and the orthographic projection of the light emitting device on the substrate do not overlap; Preferably, an orthographic projection of the second opening on the substrate and an orthographic projection of the inorganic packaging portion on the substrate do not overlap.

6. The display panel according to claim 4, characterized in that: The encapsulation layer further comprises an organic encapsulation layer, which is located on a side of the inorganic encapsulation portion away from the substrate, and the orthographic projection of the organic encapsulation layer on the substrate covers the orthographic projection of the inorganic encapsulation portion on the substrate; Preferably, the display panel further comprises an inorganic encapsulation layer located on a side of the organic encapsulation layer away from the substrate, and an orthographic projection of the inorganic encapsulation layer on the substrate covers an orthographic projection of the organic encapsulation layer on the substrate.

7. The display panel according to claim 1, characterized in that: The isolation structure comprises a first portion and a second portion which are stacked, the first portion being located on a side of the second portion away from the substrate, and an orthographic projection of the first portion on the substrate covering an orthographic projection of the second portion on the substrate; Preferably, the isolation structure further includes a third portion located on a side of the second portion close to the substrate, and an orthographic projection of the second portion on the substrate is located within a range of an orthographic projection of the third portion on the substrate.

8. The display panel according to claim 7, characterized in that: The light emitting device comprises a first electrode and a second electrode stacked together, wherein the second electrode is located on a side of the first electrode away from the substrate; Preferably, the second electrode and the second portion are overlapped.

9. The display panel according to claim 7, characterized in that: The first portion includes a first plane sub-portion and at least one second plane sub-portion, and a first connecting sub-portion connecting the first plane sub-portion and the second plane sub-portion; the orthographic projection of the first plane sub-portion on the substrate surrounds the orthographic projection of the light-emitting device on the substrate, and the second plane sub-portion is located on the side of the first plane sub-portion facing the first opening; along the thickness direction of the substrate, the distance between the first plane sub-portion and the substrate is smaller than the distance between the second plane sub-portion and the substrate; Preferably, the light emitting device comprises a first electrode, the first electrode is at least partially exposed to the first opening, and an orthographic projection of the second plane sub-portion on the substrate and an orthographic projection of the first electrode on the substrate at least partially overlap.

10. The display panel according to claim 2, characterized in that: It also includes a pixel definition layer located on the side of the isolation structure facing the substrate, the pixel definition layer encloses the pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the first opening on the substrate.

11. The display panel according to claim 1, characterized in that: The shielding layer is configured to receive a first signal in a first state, and / or receive a second signal in a second state; in the second state, the temperature of the shielding layer increases; Preferably, the first signal is a ground signal.

12. A display device, characterized in that: A display panel comprising any one of claims 1-11.

13. The display device according to claim 12, characterized in that: It also includes an integrated circuit chip, and the integrated circuit chip is bound and connected to the display panel.

14. The display device according to claim 13, characterized in that: It also includes a temperature sensor, which is electrically connected to the integrated circuit chip and is used to detect the external temperature.

15. The display device according to claim 13, characterized in that: The integrated circuit chip is electrically connected to the shielding layer, and the integrated circuit chip is used to output a preset voltage to the shielding layer when the external temperature is lower than a temperature threshold; Preferably, the preset voltage is greater than or equal to 4 volts and less than or equal to 6 volts; Preferably, the temperature threshold is less than or equal to -10 degrees Celsius and greater than or equal to -30 degrees Celsius.

16. A method for preparing a display panel, characterized in that: include: An isolation structure is prepared on one side of a substrate, the substrate includes a first electrode, at least a portion of the isolation structure encloses a first opening, and the first opening exposes at least a portion of the first electrode; sequentially preparing a light-emitting layer and a second electrode in the first opening; Preparing a packaging layer and a shielding layer on a side of the second electrode facing away from the substrate; A touch layer is prepared on the side of the shielding layer facing away from the substrate.

17. The preparation method according to claim 16, characterized in that: The display panel includes a display area and a non-display area surrounding the display area; the step of preparing the encapsulation layer and the shielding layer on the side of the second electrode away from the substrate includes: preparing an encapsulation layer on a side of the second electrode facing away from the substrate; A shielding material layer is prepared on the side of the packaging layer away from the substrate, and the shielding material layer is patterned to obtain a shielding layer, wherein the shielding layer located in the non-display area includes at least one wiring and.

18. The preparation method according to claim 16, characterized in that: The step of preparing a touch layer on a side of the shielding layer away from the substrate comprises: preparing an insulating layer on a side of the shielding layer away from the substrate; A touch layer is prepared on the side of the insulating layer facing away from the substrate.

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