Manufacturing method of display panel, display panel and display device

Abstract

The embodiment of the invention provides a display panel manufacturing method, a display panel and a display device.The manufacturing method comprises the steps that pins are formed in a binding area of a substrate, and the pins are used for being electrically connected with a display area. And forming a barrier layer on one side, deviating from the substrate, of the pin, wherein the orthographic projection of the pin on the substrate is located in the orthographic projection of the barrier layer on the substrate. A first light-emitting structure material layer is formed in the display area of the substrate, and at least part of the material of the first light-emitting structure material layer is located on the side, away from the pins, of the barrier layer. And stripping the barrier layer and the material of the first light-emitting structure material layer on the side, away from the substrate, of the barrier layer to expose the pins. And electrically connecting a driving integrated circuit to the pins to drive the first light-emitting structure material layer to emit light. When the light-emitting structure layer is formed, the material of the light-emitting structure layer can cover the side, away from the pin, of the barrier layer, the barrier layer is stripped from the pin, the electric connection between the driving integrated circuit and the pin can be realized, and the light-emitting structure layer is driven to emit light for detection.

Description

Technical Field

[0001] The present application relates to the technical field of display equipment, and in particular to a method for manufacturing a display panel, a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the manufacturing cost of current OLED display products needs to be reduced. Summary of the invention

[0004] The embodiments of the present application provide a method for manufacturing a display panel, a display panel, and a display device, aiming to reduce the manufacturing cost of the display panel.

[0005] An embodiment of a first aspect of the present application provides a method for manufacturing a display panel, wherein the display panel has a display area and a binding area located on at least one side of the display area; the manufacturing method comprises:

[0006] An isolation structure is formed at least in the display area of ​​the substrate, and the isolation structure includes a first opening and a second opening located in the display area.

[0007] A plurality of pins are formed in a bonding area of ​​the substrate.

[0008] A blocking layer is formed on the side of the plurality of pins facing away from the substrate, and the orthographic projections of the plurality of pins on the substrate are located within the orthographic projections of the blocking layer on the substrate.

[0009] A first light emitting structure material layer is evaporated in the first opening, in the second opening, and on the side of the barrier layer away from the plurality of pins, wherein the first light emitting structure material layer in the first opening and the first light emitting structure material layer in the second opening are electrically connected to the plurality of pins.

[0010] The barrier layer and the first light emitting structure material layer located on a side of the barrier layer away from the plurality of pins are peeled off to expose the plurality of pins.

[0011] The driving integrated circuit is electrically connected to the plurality of pins to drive the first light emitting structure material layer located in the first opening and the first light emitting structure material layer located in the second opening to emit light.

[0012] According to an embodiment of the present application, after the step of electrically connecting the driver integrated circuit to a plurality of pins to drive the first light-emitting structure material layer located in the first opening and the first light-emitting structure material layer located in the second opening to emit light, it also includes: etching and removing the first light-emitting structure material layer located in the second opening to obtain a first light-emitting device located in the first opening.

[0013] According to an embodiment of the present application, after the step of etching and removing the first light emitting structure material layer located in the second opening to obtain the first light emitting device located in the first opening, the method further includes:

[0014] A blocking layer is formed on the side of the plurality of pins facing away from the substrate, and the orthographic projections of the plurality of pins on the substrate are located within the orthographic projections of the blocking layer on the substrate.

[0015] A second light emitting structure material layer is evaporated in the first opening on the side of the first light emitting device away from the substrate, in the second opening, and on the side of the barrier layer away from the multiple pins, wherein the second light emitting structure material layer in the second opening and the first light emitting device are electrically connected to the multiple pins.

[0016] The barrier layer and the second light emitting structure material layer located on a side of the barrier layer away from the plurality of pins are peeled off to expose the plurality of pins.

[0017] The driving integrated circuit is electrically connected to the plurality of pins to drive the second light emitting structure material layer and the first light emitting device located in the second opening to emit light.

[0018] According to an embodiment of the present application, after the step of electrically connecting the driver integrated circuit to a plurality of pins to drive the second light-emitting structure material layer and the first light-emitting device located in the second opening to emit light, it also includes: etching and removing the second light-emitting structure material layer located in the first opening to obtain a second light-emitting device located in the second opening.

[0019] According to an embodiment of the present application, the isolation structure further includes a third opening located in the display area, wherein: a first light-emitting structure material layer is evaporated in the first opening, in the second opening, and on the side of the barrier layer away from the plurality of pins, wherein the step of electrically connecting the first light-emitting structure material layer located in the first opening and the first light-emitting structure material layer located in the second opening to the plurality of pins includes:

[0020] A first light-emitting structure material layer is evaporated in the first opening, in the second opening, in the third opening, and on the side of the barrier layer away from the multiple pins, wherein the first light-emitting structure material layer located in the first opening, the first light-emitting structure material layer located in the second opening, and the first light-emitting structure material layer located in the third opening are electrically connected to the multiple pins.

[0021] The step of electrically connecting the driving integrated circuit to the plurality of pins to drive the first light emitting structure material layer located in the first opening and the first light emitting structure material layer located in the second opening to emit light comprises:

[0022] The driving integrated circuit is electrically connected to the plurality of pins to drive the first light emitting structure material layer in the first opening, the first light emitting structure material layer in the second opening and the first light emitting structure material layer in the third opening to emit light.

[0023] According to an embodiment of the present application, after the step of electrically connecting the driver integrated circuit to a plurality of pins to drive the first light emitting structure material layer located in the first opening, the first light emitting structure material layer located in the second opening, and the first light emitting structure material layer located in the third opening to emit light, the method further includes:

[0024] The first light emitting structure material layer located in the second opening and the third opening is removed by etching to obtain a first light emitting device located in the first opening.

[0025] According to an embodiment of the present application, after the step of etching and removing the first light emitting structure material layer located in the second opening and the third opening to obtain the first light emitting device located in the first opening, the method further includes:

[0026] A blocking layer is formed on the side of the plurality of pins facing away from the substrate, and the orthographic projections of the plurality of pins on the substrate are located within the orthographic projections of the blocking layer on the substrate.

[0027] A second light-emitting structure material layer is evaporated in the first opening, the second opening, the third opening on the side of the first light-emitting device away from the substrate, and the side of the barrier layer away from the multiple pins, wherein the second light-emitting structure material layer located in the second opening, the second light-emitting structure material layer located in the third opening and the first light-emitting device are electrically connected to the multiple pins.

[0028] The barrier layer and the second light emitting structure material layer located on a side of the barrier layer away from the plurality of pins are peeled off to expose the plurality of pins.

[0029] The driving integrated circuit is electrically connected to the plurality of pins to drive the second light emitting structure material layer in the second opening, the second light emitting structure material layer in the third opening and the first light emitting device to emit light.

[0030] According to an embodiment of the present application, after the step of electrically connecting the driver integrated circuit to a plurality of pins to drive the second light emitting structure material layer located in the second opening, the second light emitting structure material layer located in the third opening, and the first light emitting device to emit light, the step further includes:

[0031] The second light emitting structure material layer located in the first opening and the third opening is removed by etching to obtain a second light emitting device located in the second opening.

[0032] According to an embodiment of the present application, after the step of etching away the second light emitting structure material layer located in the first opening and the third opening to obtain the second light emitting device located in the second opening, the method further includes:

[0033] A third light-emitting structure material layer is evaporated in a first opening on a side of the first light-emitting device facing away from the substrate, in a second opening on a side of the second light-emitting device facing away from the substrate, in a third opening, and on a side of the barrier layer facing away from the plurality of pins, wherein the first light-emitting device, the second light-emitting device, and the third light-emitting structure material layer in the third opening are electrically connected to the plurality of pins.

[0034] The barrier layer and the third light emitting structure material layer located on a side of the barrier layer away from the plurality of pins are peeled off to expose the plurality of pins.

[0035] The driving integrated circuit is electrically connected to the plurality of pins to drive the first light emitting device, the second light emitting device and the third light emitting structure material layer in the third opening to emit light;

[0036] According to an embodiment of the present application, after the step of electrically connecting the driver integrated circuit to a plurality of pins to drive the first light emitting device, the second light emitting device and the third light emitting structure material layer in the third opening to emit light, the step further includes:

[0037] The third light emitting structure material layer located in the first opening and the second opening is removed by etching to form a third light emitting device located in the third opening.

[0038] According to an embodiment of the present application, the step of forming a barrier layer on a side of a plurality of pins facing away from the substrate includes:

[0039] The barrier layer completely covers the binding area.

[0040] According to an embodiment of the present application, the barrier layer includes an adhesive tape, and the adhesive tape is attached to a side of the pin facing away from the substrate. The step of peeling off the barrier layer includes:

[0041] Mechanical stripping is used to remove the barrier layer to expose the pins.

[0042] According to an embodiment of the present application, the barrier layer includes a bonding area and a non-bonding area, the barrier layer completely covers the binding area, the orthographic projection of the pin on the substrate is located within the orthographic projection of the non-bonding area on the substrate, and the orthographic projection of the bonding area on the substrate is located outside the pin.

[0043] According to an embodiment of the present application, the barrier layer includes a peeling portion protruding from the binding area in a direction away from the display area, and the step of peeling the barrier layer further includes:

[0044] The clamping and peeling part peels the barrier layer off the lead.

[0045] According to an embodiment of the present application, a temporary substrate is provided on the side of the substrate facing away from the barrier layer, the barrier layer includes a bonding area and a non-bonding area, and the step of forming the barrier layer on the side of the pin facing away from the substrate includes:

[0046] The bonding area is bonded to the temporary substrate, the non-bonding area is arranged on the side of the pin away from the substrate, and the orthographic projection of the pin on the substrate is located within the orthographic projection of the non-bonding area on the substrate.

[0047] According to an embodiment of the present application, the step of removing the barrier layer by mechanical stripping includes:

[0048] The adhesive area and the non-adhesive area are separated from each other to peel off the non-adhesive area.

[0049] According to an embodiment of the present application, the material of the barrier layer includes photoresist; the step of stripping the barrier layer includes:

[0050] The barrier layer is peeled off by mechanical peeling to expose the pins.

[0051] According to an embodiment of the present application, the photoresist includes positive photoresist or negative photoresist.

[0052] According to an embodiment of the present application, the step of evaporating the first light emitting structure material layer in the first opening, in the second opening, and on the side of the barrier layer away from the plurality of pins includes:

[0053] A light emitting material layer is disposed on the entire display area and the binding area of ​​the substrate.

[0054] An electrode material layer is disposed on the entire display area and the binding area of ​​the substrate.

[0055] The encapsulation layer is disposed on the entire display area and the binding area of ​​the substrate.

[0056] The step of stripping the barrier layer and the first light emitting structure material layer located on a side of the barrier layer away from the plurality of pins further includes:

[0057] The barrier layer, the light emitting material layer, the electrode material layer and the packaging layer located on the side of the barrier layer away from the plurality of pins are peeled off to expose the pins.

[0058] According to an embodiment of the present application, the display area includes a driving circuit layer, and the step of forming a plurality of pins in the binding area of ​​the substrate includes: the plurality of pins are electrically connected to the driving circuit layer.

[0059] According to an embodiment of the present application, the step of forming an isolation structure at least in the display area of ​​the substrate includes:

[0060] A first material layer is formed on a substrate.

[0061] A second material layer is formed on a side of the first material layer facing away from the substrate.

[0062] The first material layer and the second material layer are patterned to form a first sublayer and a second sublayer, wherein the first sublayer is located on the side of the second sublayer facing the substrate, the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate, and the first sublayer and the second sublayer constitute an isolation structure.

[0063] A second aspect of the present application provides a method for manufacturing a display panel, wherein the display panel has a display area and a binding area located on at least one side of the display area; the manufacturing method includes:

[0064] An isolation structure is formed at least in the display area of ​​the substrate, and the isolation structure includes a first opening, a second opening and a third opening located in the display area.

[0065] A plurality of pins are formed in a bonding area of ​​the substrate.

[0066] A first light emitting device is formed in the first opening.

[0067] A blocking layer is formed on the side of the plurality of pins facing away from the substrate, and the orthographic projections of the plurality of pins on the substrate are located within the orthographic projections of the blocking layer on the substrate.

[0068] A second light-emitting structure material layer is evaporated in the first opening, the second opening, the third opening on the side of the first light-emitting device away from the substrate, and the side of the barrier layer away from the multiple pins, wherein the second light-emitting structure material layer located in the second opening, the second light-emitting structure material layer located in the third opening and the first light-emitting device are electrically connected to the multiple pins.

[0069] The barrier layer and the second light emitting structure material layer located on a side of the barrier layer away from the plurality of pins are peeled off to expose the plurality of pins.

[0070] The driving integrated circuit is electrically connected to the plurality of pins to drive the second light emitting structure material layer in the second opening, the second light emitting structure material layer in the third opening and the first light emitting device to emit light.

[0071] According to an embodiment of the present application, after the step of electrically connecting the driver integrated circuit to a plurality of pins to drive the second light emitting structure material layer located in the second opening, the second light emitting structure material layer located in the third opening, and the first light emitting device to emit light, the step further includes:

[0072] The second light emitting structure material layer located in the first opening and the second light emitting structure material layer located in the third opening are removed by etching to obtain a second light emitting device located in the second opening.

[0073] According to an embodiment of the present application, after the step of etching away the second light emitting structure material layer in the first opening and the second light emitting structure material layer in the third opening to obtain the second light emitting device in the second opening, the method further includes:

[0074] A third light-emitting structure material layer is evaporated in a first opening on a side of the first light-emitting device facing away from the substrate, in a second opening on a side of the second light-emitting device facing away from the substrate, in a third opening, and on a side of the barrier layer facing away from the plurality of pins, wherein the first light-emitting device, the second light-emitting device, and the third light-emitting structure material layer in the third opening are electrically connected to the plurality of pins.

[0075] The barrier layer and the third light emitting structure material layer located on a side of the barrier layer away from the plurality of pins are peeled off to expose the plurality of pins.

[0076] The driving integrated circuit is electrically connected to the plurality of pins to drive the first light emitting device, the second light emitting device and the third light emitting structure material layer in the third opening to emit light.

[0077] According to an embodiment of the present application, after the step of electrically connecting the driver integrated circuit to a plurality of pins to drive the first light emitting device, the second light emitting device and the third light emitting structure material layer in the third opening to emit light, the step further includes:

[0078] The third light emitting structure material layer located in the first opening and the second opening is removed by etching to form a third light emitting device located in the third opening.

[0079] A third aspect of the present application provides a display panel, which is manufactured by the manufacturing method of the display panel in any one of the embodiments of the first and second aspects.

[0080] In a fourth aspect of the present application, a display panel is proposed, which has a display area and a binding area located on at least one side of the display area; the display panel includes: a substrate; a plurality of pins located on one side of the substrate and in the binding area; a light-emitting structure layer located on one side of the substrate, including at least one light-emitting device located in the display area and a virtual device located in the binding area, wherein at least one light-emitting device is electrically connected to the plurality of pins, and the orthographic projection of the virtual device on the substrate does not overlap with the orthographic projection of the plurality of pins on the substrate.

[0081] According to an embodiment of the present application, the material of the dummy device is partially the same as the material of the light-emitting device.

[0082] In a fifth aspect of the present application, a display panel is proposed, which has a display area and a binding area located on at least one side of the display area; the display panel includes: a substrate; a plurality of pins located on one side of the substrate and in the binding area; a light-emitting structure layer located on one side of the substrate, including at least one light-emitting device located in the display area, wherein the at least one light-emitting device is electrically connected to the plurality of pins, and the orthographic projection of the light-emitting structure layer on the substrate does not overlap with the orthographic projection of the plurality of pins on the substrate.

[0083] According to an embodiment of the present application, at least one light-emitting device includes a first light-emitting device and a second light-emitting device, and the display panel also includes: an isolation structure located on one side of the substrate and at least located in the display area, the isolation structure including a first opening and a second opening located in the display area; wherein at least a portion of the first light-emitting device is located in the first opening, and at least a portion of the second light-emitting device is located in the second opening.

[0084] An embodiment of the sixth aspect of the present application further provides a display device, comprising the display panel of any one of the fourth and fifth aspects above.

[0085] In the embodiment of the present application, a barrier layer is formed on the side of the pin facing away from the substrate, and the orthographic projection of the pin on the substrate is located within the orthographic projection of the barrier layer on the substrate. When the first light-emitting structure material layer is evaporated, at least part of the material of the first light-emitting structure material layer will cover the side of the barrier layer facing away from the pin. When the barrier layer is peeled off from the pin, the material of the first light-emitting structure material layer located on the side of the barrier layer facing away from the substrate can be taken away while peeling off the barrier layer, thereby exposing the pin, so that the electrical connection between the driver integrated circuit and the pin can be realized to drive the first light-emitting structure material layer to emit light for detection, which is beneficial to reduce the manufacturing cost of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0086] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0087] Figure 1 is a structural schematic diagram of a display panel provided in an embodiment of the present application;

[0088] Figure 2 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0089] Figures 3 to 7 is a schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application;

[0090] Figure 8 is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present application;

[0091] Figures 9 to 13 is a schematic diagram of another method for manufacturing a display panel provided in an embodiment of the present application;

[0092] Fig.14 is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present application;

[0093] Figures 15 to 18 is a schematic diagram of another method for manufacturing a display panel provided in an embodiment of the present application;

[0094] Fig.19 is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present application;

[0095] Figures 20 to 27 is a schematic diagram of a process of manufacturing another display panel provided in an embodiment of the present application;

[0096] Fig.28 is a structural schematic diagram of a display panel provided in an embodiment of the present application;

[0097] Fig.29 It is a schematic diagram of the structure of another display panel provided in an embodiment of the present application.

[0098] Description of reference numerals:

[0099] 10. Display area; 20. Binding area;

[0100] 100, substrate; 110, pin; 200, barrier layer; 210, peeling portion; 220, bonding area; 230, non-bonding area; 301, first light-emitting structure material layer; 302, second light-emitting structure material layer; 303, third light-emitting structure material layer; 310, light-emitting material layer; 320, electrode material layer; 330, encapsulation layer; 340, light-emitting structure layer; 341, first light-emitting device; 342, second light-emitting device; 343, third light-emitting device; 344, light-emitting device; 350, dummy device; 360, electrode; 400, driver integrated circuit; 500, temporary substrate; 700, isolation structure; 710, first sublayer; 720, second sublayer; 731, first opening; 732, second opening; 733, third opening. DETAILED DESCRIPTION

[0101] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0102] In the description of this application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting this application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0103] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0104] A method for manufacturing a display panel provided in an embodiment of the first aspect of the present application is as follows: Figure 1 As shown, the display panel has a display area 10 and a binding area 20 located at at least one side of the display area 10; Figure 2 As shown, the manufacturing method includes:

[0105] Step S01: Figure 3 As shown, an isolation structure 700 is formed at least in the display region 10 of the substrate 100 , and the isolation structure 700 includes a first opening 731 and a second opening 732 located in the display region 10 .

[0106] Step S02: Figure 3 As shown, a plurality of pins 110 are formed in the binding area 20 of the substrate 100 .

[0107] Step S03: Figure 4 As shown, a barrier layer 200 is formed on the side of the plurality of pins 110 facing away from the substrate 100 , and the orthographic projections of the plurality of pins 110 on the substrate 100 are located within the orthographic projection of the barrier layer 200 on the substrate 100 .

[0108] Step S04: Figure 5 As shown, the first light-emitting structure material layer 301 is evaporated in the first opening 731, in the second opening 732, and on the side of the barrier layer 200 away from the multiple pins 110, wherein the first light-emitting structure material layer 301 located in the first opening 731 and the first light-emitting structure material layer 301 located in the second opening 732 are electrically connected to the multiple pins 110.

[0109] Step S05: Figure 6 As shown, the barrier layer 200 and the first light emitting structure material layer 301 located on the side of the barrier layer 200 away from the plurality of pins 110 are peeled off to expose the plurality of pins 110 .

[0110] Step S06: Figure 7 As shown, the driving integrated circuit 400 is electrically connected to the plurality of pins 110 to drive the first light emitting structure material layer 301 in the first opening 731 and the first light emitting structure material layer 301 in the second opening 732 to emit light.

[0111] In this embodiment, the isolation structure 700 encloses the first opening 731 and the second opening 732, and then the first light-emitting structure material layer 301 is arranged on the entire surface to form the first light-emitting structure material layer 301 located in the first opening 731 and the second opening 732. The isolation structure 700 can reduce the problem of crosstalk between the light emitted by the first light-emitting structure material layer 301 in the first opening 731 and the second opening 732, and the isolation structure 700 can also prevent the first light-emitting structure material layer 301 from contacting and short-circuiting between the first opening 731 and the second opening 732.

[0112] The pin 110 of the binding area 20 is used to connect the first light emitting structure material layer 301 in the first opening 731 and the second opening 732. The driver integrated circuit 400 electrically connects the pin 110 to drive the first light emitting structure material layer 301 in the first opening 731 and the second opening 732 to emit light, so that the first light emitting structure material layer 301 in the first opening 731 and the second opening 732 can be detected. The barrier layer 200 is formed on the side of the pin 110 away from the substrate 100, and the orthographic projection of the pin 110 on the substrate 100 is located within the orthographic projection of the barrier layer 200 on the substrate 100. When the first light-emitting structure material layer 301 is evaporated, at least part of the material of the first light-emitting structure material layer 301 will cover the side of the barrier layer 200 away from the pin 110. When the barrier layer 200 is peeled off from the pin 110, the material of the first light-emitting structure material layer 301 located on the side of the barrier layer 200 away from the substrate 100 can be taken away while peeling off the barrier layer 200, thereby exposing the pin 110, thereby realizing the electrical connection between the driver integrated circuit 400 and the pin 110, so as to drive the first light-emitting structure material layer 301 to emit light for detection, which is beneficial to reducing the manufacturing cost of the display panel.

[0113] In some embodiments, the first light-emitting structure material layer 301 is evaporated on the entire surface to cover the pin 110 of the binding area 20. When the first light-emitting structure material layer 301 in the second opening 732 is etched, the first light-emitting structure material layer 301 covering the pin 110 is etched to expose the pin 110, and the first light-emitting structure material layer 301 in the first opening 731 is lit. Since the light-emitting structure material in the second opening 732 is etched, the lighting condition of the second opening 732 cannot be detected, and the damage condition of the second opening 732 cannot be obtained in this process. In the embodiment of the present application, since the barrier layer 200 is provided to cover the pin 110, and the barrier layer 200 is peeled off to expose the pin 110, the first light-emitting structure material layer 301 in the first opening 731 and the second opening 732 can be lit up and tested, so that the lighting condition of the first opening 731 and the second opening 732 can be detected, which is conducive to reducing the manufacturing cost of the display panel.

[0114] In some optional embodiments, after step S06, as Figure 8 As shown, it also includes:

[0115] Step S07: Fig. 9 As shown, the first light emitting structure material layer 301 located in the second opening 732 is removed by etching to obtain the first light emitting device 341 located in the first opening 731 .

[0116] In these optional embodiments, the first light emitting structure material layer 301 located in the first opening 731 is retained to form the first light emitting device 341 in the first opening 731 , and the first light emitting structure material layer 301 in the second opening 732 is removed to make way for forming other light emitting devices.

[0117] In some optional embodiments, after step S07, as Figure 8 As shown, it also includes:

[0118] Step S08: Fig.10 As shown, a barrier layer 200 is formed on the side of the plurality of pins 110 facing away from the substrate 100 , and the orthographic projections of the plurality of pins 110 on the substrate 100 are located within the orthographic projections of the barrier layer 200 on the substrate 100 .

[0119] Step S09: Fig.10 As shown, a second light-emitting structure material layer 302 is evaporated in the first opening 731 on the side of the first light-emitting device 341 away from the substrate 100, in the second opening 732, and on the side of the barrier layer 200 away from the plurality of pins 110, wherein the second light-emitting structure material layer 302 in the second opening 732 and the first light-emitting device 341 are electrically connected to the plurality of pins 110.

[0120] Step S10: Fig.11 As shown, the barrier layer 200 and the second light emitting structure material layer 302 located on the side of the barrier layer 200 away from the plurality of pins 110 are peeled off to expose the plurality of pins 110 .

[0121] Step S11 : electrically connecting the driving integrated circuit 400 to the plurality of pins 110 to drive the second light emitting structure material layer 302 and the first light emitting device 341 in the second opening 732 to emit light.

[0122] In these optional embodiments, the second light emitting structure material layer 302 falls into the first opening 731 and the second opening 732. In the first opening 731, since the first light emitting device 341 is formed first, the second light emitting structure material layer 302 is located on the side of the first light emitting device 341 away from the substrate 100 and thus cannot be connected to the pins 110. The barrier layer 200 and the second light emitting structure material layer 302 located on the side of the barrier layer 200 away from the plurality of pins 110 are peeled off to expose the plurality of pins 110. The driver integrated circuit 400 is electrically connected to the plurality of pins 110 to drive the second light emitting structure material layer 302 and the first light emitting device 341 located in the second opening 732 to emit light. Optionally, the second light emitting structure material layer 302 is a light-transmitting material. When the first light emitting device 341 is lit, the light of the first light emitting device 341 can pass through the second light emitting structure material layer 302, so that the lighting status of the first light emitting device 341 and the second light emitting structure material layer 302 located in the second opening 732 can be detected.

[0123] In some optional embodiments, after step S10, as Figure 8 As shown, it also includes:

[0124] Step S12: Fig.12 As shown, the second light emitting structure material layer 302 located in the first opening 731 is removed by etching to obtain a second light emitting device 342 located in the second opening 732 .

[0125] In these optional embodiments, the second light emitting structure material layer 302 located in the first opening 731 is etched away to expose the first light emitting device 341, thereby reducing the influence of the second light emitting structure material layer 302 in the first opening 731 on the first light emitting device 341. The second light emitting structure material layer 302 located in the second opening 732 is retained to form the second light emitting device 342. The light emitting colors of the first light emitting device 341 and the second light emitting device 342 may be different colors or the same color.

[0126] In some optional embodiments, the isolation structure 700 further includes a third opening 733 located in the display area 10, wherein:

[0127] In step S04, Fig.13 As shown, it includes: evaporating a first light-emitting structure material layer 301 in the first opening 731, in the second opening 732, in the third opening 733, and on the side of the barrier layer 200 away from the multiple pins 110, wherein the first light-emitting structure material layer 301 located in the first opening 731, the first light-emitting structure material layer 301 located in the second opening 732, and the first light-emitting structure material layer 301 located in the third opening 733 are electrically connected to the multiple pins 110.

[0128] In step S06, Fig.14 As shown, including:

[0129] Step S061: Fig.15 As shown, the driver integrated circuit 400 is electrically connected to a plurality of pins 110 to drive the first light emitting structure material layer 301 in the first opening 731 , the first light emitting structure material layer 301 in the second opening 732 , and the first light emitting structure material layer 301 in the third opening 733 to emit light.

[0130] In these optional implementations, the isolation structure 700 forms a first opening 731, a second opening 732 and a third opening 733. When the first light-emitting structure material layer 301 is evaporated, the first light-emitting structure material layer 301 will fall into the first opening 731, the second opening 732 and the third opening 733 and the barrier layer 200 away from the plurality of pins 110. The barrier layer 200 is peeled off to leak out the pins 110. The driver integrated circuit 400 can drive the first light-emitting structure material layer 301 located in the first opening 731, the second opening 732 and the third opening 733 to emit light for detection by connecting the pins 110.

[0131] In some optional embodiments, after step S061, as Fig.14 As shown, it also includes:

[0132] Step S062: Fig.16 As shown, the first light emitting structure material layer 301 located in the second opening 732 and the third opening 733 is removed by etching to obtain the first light emitting device 341 located in the first opening 731 .

[0133] In these optional implementations, the first light emitting structure material layer 301 located in the first opening 731 is retained to form the first light emitting device 341 in the first opening 731, and the first light emitting structure material layer 301 in the second opening 732 and the third opening 733 is removed to make way for forming other light emitting devices.

[0134] Optionally, after step S062, as Fig.14 As shown, it also includes:

[0135] Step S063: Fig.17 As shown, the barrier layer 200 is formed on the side of the plurality of pins 110 away from the substrate 100 , and the orthographic projections of the plurality of pins 110 on the substrate 100 are located within the orthographic projections of the barrier layer 200 on the substrate 100 .

[0136] Step S064: Fig.17As shown, a second light-emitting structure material layer 302 is evaporated in the first opening 731, the second opening 732, the third opening 733 on the side of the first light-emitting device 341 away from the substrate 100, and the side of the barrier layer 200 away from the plurality of pins 110, wherein the second light-emitting structure material layer 302 located in the second opening 732, the second light-emitting structure material layer 302 located in the third opening 733, and the first light-emitting device 341 are electrically connected to the plurality of pins 110.

[0137] Step S065: Fig.18 As shown, the barrier layer 200 and the second light emitting structure material layer 302 located on the side of the barrier layer 200 away from the plurality of pins 110 are peeled off to expose the plurality of pins 110 .

[0138] Step S066 : electrically connecting the driver integrated circuit 400 to the plurality of pins 110 to drive the second light emitting structure material layer 302 in the second opening 732 , the second light emitting structure material layer 302 in the third opening 733 , and the first light emitting device 341 to emit light.

[0139] In these optional implementations, the second light-emitting structure material layer 302 falls into the first opening 731, the second opening 732 and the third opening 733. In the first opening 731, since the first light-emitting device 341 is formed first, the second light-emitting structure material layer 302 is located on the side of the first light-emitting device 341 away from the substrate 100 and cannot be electrically connected to the pin 110. The barrier layer 200 and the second light-emitting structure material layer 302 located on the side of the barrier layer 200 away from the plurality of pins 110 are peeled off to expose the plurality of pins 110. The driver integrated circuit 400 is electrically connected to the plurality of pins 110 to drive the second light-emitting structure material layer 302 and the first light-emitting device 341 located in the second opening 732 and the third opening 733 to emit light, so that the lighting status of the first light-emitting device 341 and the second light-emitting structure material layer 302 located in the second opening 732 and the third opening 733 can be detected.

[0140] In some embodiments, the second light-emitting structure material layer 302 evaporated on the entire surface will cover the pin 110 of the binding area 20. After the second light-emitting structure material layer 302 in the first opening 731 and the third opening 733 is etched while the second light-emitting structure material layer 302 covering the pin 110 is etched, the second light-emitting structure material layer 302 in the second opening 732 can be lit, and the lighting status of the third opening 733 cannot be detected during this process. In the embodiment of the present application, since the barrier layer 200 is provided to cover the pin 110, and the barrier layer 200 is peeled off to expose the pin 110, the light-emitting device in the first opening 731 and the second light-emitting structure material layer 302 in the second opening 732 and the third opening 733 can be lit and detected, which is conducive to reducing the manufacturing cost of the display panel.

[0141] Optionally, after step S066, Fig.19 As shown, it also includes:

[0142] Step S067: Fig. 20 As shown, the second light emitting structure material layer 302 located in the first opening 731 and the third opening 733 is removed by etching to obtain a second light emitting device 342 located in the second opening 732 .

[0143] The second light emitting structure material layer 302 in the first opening 731 is removed by etching to expose the first light emitting device 341, thereby reducing the influence of the second light emitting structure material layer 302 in the first opening 731 on the first light emitting device 341. The second light emitting structure material layer 302 in the second opening 732 is retained to form the second light emitting device 342. The second light emitting structure material layer 302 in the third opening 733 is removed by etching to make way for forming other light emitting devices.

[0144] In some optional embodiments, after step S067, as Fig.19 As shown, it also includes:

[0145] Step S068: Fig.21 As shown, a barrier layer 200 is formed on the side of the plurality of pins 110 facing away from the substrate 100 , and the orthographic projections of the plurality of pins 110 on the substrate 100 are located within the orthographic projections of the barrier layer 200 on the substrate 100 .

[0146] Step S069: Fig.21As shown, a third light-emitting structure material layer 303 is evaporated in the first opening 731 on the side of the first light-emitting device 341 facing away from the substrate 100, in the second opening 732 on the side of the second light-emitting device 342 facing away from the substrate 100, in the third opening 733 and on the side of the barrier layer 200 facing away from the plurality of pins 110, wherein the first light-emitting device 341, the second light-emitting device 342 and the third light-emitting structure material layer 303 in the third opening 733 are electrically connected to the plurality of pins 110.

[0147] Step S070: Fig. 22 As shown, the barrier layer 200 and the third light emitting structure material layer 303 located on the side of the barrier layer 200 away from the plurality of pins 110 are peeled off to expose the plurality of pins 110 .

[0148] Step S071 : electrically connecting the driving integrated circuit 400 to the plurality of pins 110 to drive the first light emitting device 341 , the second light emitting device 342 and the third light emitting structure material layer 303 in the third opening 733 to emit light.

[0149] In these optional embodiments, the third light-emitting structure material layer 303 falls into the first opening 731, the second opening 732 and the third opening 733. In the first opening 731 and the second opening 732, since the first light-emitting device 341 and the second light-emitting device 342 are formed first, the third light-emitting structure material layer 303 is located on the side of the first light-emitting device 341 and the second light-emitting device 342 away from the substrate 100, so that it cannot be conductive with the pins 110. The barrier layer 200 and the third light-emitting structure material layer 303 located on the side of the barrier layer 200 away from the plurality of pins 110 are peeled off to expose the plurality of pins 110. The driver integrated circuit 400 is electrically connected to the plurality of pins 110 to drive the first light-emitting device 341, the second light-emitting device 342 and the third light-emitting structure material layer 303 located in the third opening 733 to emit light. Optionally, the third light-emitting structure material layer 303 is a light-transmitting material. When the first light-emitting device 341 and the second light-emitting device 342 are lit, the light of the first light-emitting device 341 and the second light-emitting device 342 can pass through the third light-emitting structure material layer 303, so that the lighting status of the first light-emitting device 341 and the second light-emitting device 342 and the third light-emitting structure material layer 303 located in the third opening 733 can be detected.

[0150] In some optional embodiments, after step S071, as Fig.19 As shown, it also includes:

[0151] Step S072: Fig.23 As shown, the third light emitting structure material layer 303 located in the first opening 731 and the second opening 732 is removed by etching to form a third light emitting device 343 located in the third opening 733 .

[0152] In these optional embodiments, the third light emitting structure material layer 303 located in the first opening 731 and the second opening 732 is removed by etching, thereby reducing the influence of the third light emitting structure material layer 303 on the light emission of the first light emitting device 341 and the second light emitting device 342. The light emission colors of the first light emitting device 341, the second light emitting device 342 and the third light emitting device 343 can be the same or different.

[0153] In some optional embodiments, in step S03, it includes: Fig.24 The barrier layer 200 is shown to completely cover the binding area 20 .

[0154] In these optional embodiments, the barrier layer 200 is formed on the entire surface of the binding area 20 , which can reduce the manufacturing accuracy of the barrier layer 200 and improve the situation where some pins 110 are not covered due to process errors.

[0155] In some optional embodiments, the barrier layer 200 includes a tape, which is adhered to the side of the pin 110 facing away from the substrate 100 , and the step of peeling off the barrier layer 200 includes: removing the barrier layer 200 by mechanical peeling to expose the pin 110 .

[0156] In these optional embodiments, the barrier layer 200 includes a tape, and the tape is used to cover the pins 110. When peeling off the barrier layer 200, a mechanical peeling method is used to remove the tape and the light-emitting structure material layer on the tape, so that the pins 110 can be exposed, which is beneficial to improving the production efficiency of the display panel.

[0157] like Fig.25 As shown, in some optional embodiments, the barrier layer 200 includes a bonding area 220 and a non-bonding area 230, the barrier layer 200 completely covers the binding area 20, the orthographic projection of the pin 110 on the substrate 100 is located within the orthographic projection of the non-bonding area 230 on the substrate 100, and the orthographic projection of the bonding area 220 on the substrate 100 is located in the area outside the pin 110.

[0158] In these optional embodiments, the orthographic projection of the bonding area 220 on the substrate 100 is located outside the pin 110, which reduces the risk of the bonding area 220 adhering to and damaging the pin 110 when the barrier layer 200 is peeled off. That is, the non-bonding area 230 covers the area where the pin 110 is located.

[0159] like Fig.25 As shown, in some optional embodiments, the barrier layer 200 includes a peeling portion 210 protruding from the binding area 20 in a direction away from the display area 10, and the step of peeling the barrier layer 200 further includes:

[0160] The clamping and peeling unit 210 peels the barrier layer 200 off the lead 110 .

[0161] In these optional embodiments, the stripping portion 210 protrudes from the binding area 20, that is, the stripping portion 210 is exposed from the binding area 20, which is conducive to clamping the stripping portion 210, so that the barrier layer 200 can be stripped from the pin 110 by clamping the stripping portion 210, thereby improving the stripping efficiency of the barrier portion.

[0162] like Fig.26 As shown, in some optional embodiments, a temporary substrate 500 is provided on the side of the substrate 100 away from the barrier layer 200, the barrier layer 200 includes a bonding area 220 and a non-bonding area 230, and the step of forming the barrier layer 200 on the side of the pin 110 away from the substrate 100 includes:

[0163] The bonding area 220 is bonded to the temporary substrate 500 , and the non-bonding area 230 is disposed on the side of the pin 110 away from the substrate 100 . The orthographic projection of the pin 110 on the substrate 100 is located within the orthographic projection of the non-bonding area 230 on the substrate 100 .

[0164] In these optional embodiments, a temporary substrate 500 is disposed on the side of the substrate 100 away from the barrier layer 200, the adhesive area 220 is adhered to the temporary substrate 500, and the non-adhesive area 230 is disposed on the side of the pin 110, so as to reduce the risk of the adhesive area 220 adhering to and damaging the pin 110 and the binding area 20 when the barrier layer 200 is peeled off. That is, the non-adhesive area 230 covers the area where the pin 110 is located.

[0165] Optionally, the step of removing the barrier layer 200 by mechanical stripping includes:

[0166] The adhesive region 220 and the non-adhesive region 230 are separated from each other so that the non-adhesive region 230 can be peeled off.

[0167] The adhesive area 220 and the non-adhesive area 230 are separated from each other, so that the adhesive area 220 is retained on the temporary substrate 500, while the non-adhesive area 230 has no stickiness, so that the non-adhesive area 230 is separated from the pin 110, thereby realizing the peeling of the barrier layer 200, that is, the pin 110 can be exposed for lighting detection.

[0168] In some optional embodiments, the material of the barrier layer 200 includes photoresist; and the step of stripping the barrier layer 200 includes:

[0169] The barrier layer 200 is peeled off by mechanical peeling to expose the pins 110 .

[0170] In these optional embodiments, a photoresist is provided as the barrier layer 200. When the barrier layer 200 is stripped, the photoresist and the light emitting structure material layer on the photoresist are removed by mechanical stripping, so that the pins 110 can be exposed, which is beneficial to improving the production efficiency of the display panel. Optionally, the photoresist includes a positive photoresist or a negative photoresist.

[0171] In some optional embodiments, in step S04, as Fig. 27 As shown, including:

[0172] The light emitting material layer 310 is disposed on the entire surface of the display region 10 and the binding region 20 of the substrate 100 .

[0173] The electrode material layer 320 is provided on the entire surface of the display region 10 and the binding region 20 of the substrate 100 .

[0174] The encapsulation layer 330 is provided on the entire surface of the display region 10 and the binding region 20 of the substrate 100 .

[0175] Step S05 also includes:

[0176] The barrier layer 200 , and the light emitting material layer 310 , the electrode material layer 320 , and the packaging layer 330 located on a side of the barrier layer 200 away from the plurality of pins 110 are peeled off to expose the pins 110 .

[0177] In these optional embodiments, the material of the first light-emitting structure material layer 301 includes a light-emitting material layer 310, an electrode material layer 320 and an encapsulation layer 330 arranged in sequence in a direction away from the substrate 100. When the light-emitting material layer 310, the electrode material layer 320 and the encapsulation layer 330 are evaporated on the entire surface, the light-emitting material layer 310, the electrode material layer 320 and the encapsulation layer 330 will be evaporated to the side of the barrier layer 200 away from the pins 110. When the barrier layer 200 is peeled off, the light-emitting material layer 310, the electrode material layer 320 and the encapsulation layer 330 located on the side of the barrier layer 200 away from the plurality of pins 110 will be peeled off simultaneously, so that the pins 110 can be exposed to perform lighting detection on the first light-emitting structure material layer 301. Optionally, the materials of the second light-emitting structure material layer 302 and the third light-emitting structure material layer 303 both include a light-emitting material layer 310, an electrode material layer 320 and an encapsulation layer 330 arranged in sequence in a direction away from the substrate 100. Optionally, an electrode 360 ​​is further provided on the side of the light emitting material layer 310 facing the substrate.

[0178] In some optional embodiments, the display area 10 includes a driving circuit layer, and the step of forming a plurality of pins 110 in the binding area 20 of the substrate 100 includes: the plurality of pins 110 are electrically connected to the driving circuit layer.

[0179] In these optional embodiments, the driving circuit layer is arranged on the side of the isolation structure 700 facing the substrate 100, and the driving circuit layer can be electrically connected to the light-emitting structure material layer in the first opening 731, the second opening 732 and the third opening 733. The pin 110 is electrically connected to the driving circuit layer through a connecting wire, and the driving integrated circuit is electrically connected to the pin 110 so as to be conductive with the light-emitting structure material layer, which can drive the light-emitting structure material layer to emit light for detection.

[0180] In some optional embodiments, in step S01, as Figure 3 As shown, including:

[0181] A first material layer is formed on the substrate 100 .

[0182] A second material layer is formed on a side of the first material layer facing away from the substrate 100 .

[0183] The first material layer and the second material layer are patterned to form a first sublayer 710 and a second sublayer 720. The first sublayer 710 is located on the side of the second sublayer 720 facing the substrate 100. The orthographic projection of the first sublayer 710 on the substrate 100 is located within the orthographic projection of the second sublayer 720 on the substrate 100. The first sublayer 710 and the second sublayer 720 constitute an isolation structure 700.

[0184] In these optional embodiments, a first material layer and a second material layer are sequentially formed on the substrate 100, the first material layer and the second material layer are stacked in a direction away from the substrate 100, and the first material layer and the second material layer are patterned to form a first sublayer 710 and a second sublayer 720, the first sublayer 710 and the second sublayer 720 are sequentially arranged in a direction away from the substrate 100, and the orthographic projection of the first sublayer 710 on the substrate 100 is located within the orthographic projection of the second sublayer 720 on the substrate 100. The orthographic projection size of the first sublayer 710 on the substrate 100 is smaller than the orthographic projection size of the second sublayer 720 on the substrate 100, so as to form a concave under the second sublayer 720. In the preparation process of the first light-emitting device 341, the second light-emitting device 342 and the third light-emitting device 343, the materials of the first light-emitting structure material layer 301, the second light-emitting structure material layer 302 and the third light-emitting structure material layer 303 can be separated into independent light-emitting structure material layers by the isolation structure 700, and the precision mask plate evaporation process can be omitted, thereby reducing the preparation cost.

[0185] Optionally, a pixel defining portion 800 is further provided on the side of the isolation structure 700 facing the substrate, and the pixel defining portion 800 encloses and forms a plurality of pixel openings, and the pixel openings are staggered with respect to the orthographic projection of the isolation structure 700 on the substrate 100 .

[0186] The specific design of the isolation structure 700 can refer to existing patents, such as application numbers 202310771124.9, 202310740412.8, 202310855866.X, 202311017132.0, 202311124847.6, and 202311091555.7, which record relevant contents of the isolation structure 700.

[0187] A second embodiment of the present application provides a method for manufacturing a display panel, wherein the display panel has a display area 10 and a binding area 20 located on at least one side of the display area 10; the manufacturing method comprises:

[0188] like Fig.16 As shown, an isolation structure 700 is formed at least in the display region 10 of the substrate 100 , and the isolation structure 700 includes a first opening 731 , a second opening 732 and a third opening 733 located in the display region 10 .

[0189] A plurality of pins 110 are formed in the binding region 20 of the substrate 100 .

[0190] A first light emitting device 341 is formed in the first opening 731 .

[0191] like Fig.17 As shown, a barrier layer 200 is formed on the side of the plurality of pins 110 facing away from the substrate 100 , and the orthographic projections of the plurality of pins 110 on the substrate 100 are located within the orthographic projection of the barrier layer 200 on the substrate 100 .

[0192] like Fig.17 As shown, a second light-emitting structure material layer 302 is evaporated in the first opening 731, the second opening 732, the third opening 733 on the side of the first light-emitting device 341 away from the substrate 100, and the side of the barrier layer 200 away from the plurality of pins 110, wherein the second light-emitting structure material layer 302 located in the second opening 732, the second light-emitting structure material layer 302 located in the third opening 733, and the first light-emitting device 341 are electrically connected to the plurality of pins 110.

[0193] like Fig.18 As shown, the barrier layer 200 and the second light emitting structure material layer 302 located on the side of the barrier layer 200 away from the plurality of pins 110 are peeled off to expose the plurality of pins 110 .

[0194] The driving integrated circuit 400 is electrically connected to the plurality of pins 110 to drive the second light emitting structure material layer 302 in the second opening 732 , the second light emitting structure material layer 302 in the third opening 733 , and the first light emitting device 341 to emit light.

[0195] In this embodiment, a first light-emitting device 341 is formed in the first opening 731, and a second light-emitting structure material layer 302 is evaporated in the first opening 731, in the second opening 732, in the third opening 733, and on the side of the barrier layer 200 away from the plurality of pins 110 on the side of the first light-emitting device 341 away from the substrate 100, the barrier layer 200 is peeled off to expose the plurality of pins 110, and the driver integrated circuit 400 is electrically connected to the plurality of pins 110 to make the second light-emitting structure material layer 302 in the second opening 732, the second light-emitting structure material layer 302 in the third opening 733, and the first light-emitting device 341 emit light. The manufacturing method of the display panel and the effects produced are as described in the first aspect above and will not be repeated here.

[0196] In some optional embodiments, after the step of electrically connecting the driver integrated circuit 400 to the plurality of pins 110 to drive the second light emitting structure material layer 302 in the second opening 732, the second light emitting structure material layer 302 in the third opening 733 and the first light emitting device 341 to emit light, the step further includes:

[0197] like Fig. 20 As shown, the second light emitting structure material layer 302 located in the first opening 731 and the second light emitting structure material layer 302 located in the third opening 733 are removed by etching to obtain a second light emitting device 342 located in the second opening 732 .

[0198] Optionally, after the step of removing the second light emitting structure material layer 302 in the first opening 731 and the second light emitting structure material layer 302 in the third opening 733 by etching to obtain the second light emitting device 342 in the second opening 732, the method further includes:

[0199] like Fig.21 As shown, a third light-emitting structure material layer 303 is evaporated in the first opening 731 on the side of the first light-emitting device 341 facing away from the substrate 100, in the second opening 732 on the side of the second light-emitting device 342 facing away from the substrate 100, in the third opening 733 and on the side of the barrier layer 200 facing away from the plurality of pins 110, wherein the first light-emitting device 341, the second light-emitting device 342 and the third light-emitting structure material layer 303 in the third opening 733 are electrically connected to the plurality of pins 110.

[0200] like Fig. 22 As shown, the barrier layer 200 and the third light emitting structure material layer 303 located on the side of the barrier layer 200 away from the plurality of pins 110 are peeled off to expose the plurality of pins 110 .

[0201] The driving integrated circuit 400 is electrically connected to the plurality of pins 110 to drive the first light emitting device 341 , the second light emitting device 342 and the third light emitting structure material layer 303 in the third opening 733 to emit light.

[0202] Optionally, after the step of electrically connecting the driver integrated circuit 400 to the plurality of pins 110 to drive the first light emitting device 341, the second light emitting device 342 and the third light emitting structure material layer 303 in the third opening 733 to emit light, the method further includes:

[0203] like Fig.23 As shown, the third light emitting structure material layer 303 located in the first opening 731 and the second opening 732 is removed by etching to form a third light emitting device 343 located in the third opening 733 .

[0204] In these optional embodiments, the manufacturing method of the display panel and the effects produced are as described above and will not be described in detail here.

[0205] The embodiment of the third aspect of the present application also provides a display panel, which is prepared by the manufacturing method of the display panel of any one of the embodiments of the first and second aspects. Since the display panel provided by the embodiment of the third aspect of the present application is prepared by the manufacturing method of any one of the embodiments of the first and second aspects, the display panel provided by the embodiment of the third aspect of the present application has the beneficial effects of the manufacturing method of any one of the embodiments of the first and second aspects, which will not be repeated here.

[0206] A fourth aspect of the present application provides a display panel, such as Fig.28 As shown, the display panel has a display area 10 and a binding area 20 located on at least one side of the display area 10; the display panel includes: a substrate 100, a plurality of pins 110 and a light-emitting structure layer 340; the plurality of pins 110 are located on one side of the substrate 100 and in the binding area 20; the light-emitting structure layer 340 is located on one side of the substrate 100, and includes at least one light-emitting device 344 located in the display area 10 and a virtual device 350 located in the binding area 20, wherein at least one light-emitting device 344 is electrically connected to the plurality of pins 110, and the orthographic projection of the virtual device 350 on the substrate 100 does not overlap with the orthographic projection of the plurality of pins 110 on the substrate 100.

[0207] In these optional embodiments, the light emitting structure layer 340 is formed on the light emitting device 344 in the display area 10 and the dummy device 350 located in the binding area 20. The dummy device 350 includes a material of a portion of the light emitting device 344, and the orthographic projection of the dummy device 350 on the substrate 100 does not overlap with the orthographic projection of the plurality of pins 110 on the substrate 100, so as to leak out the pins 110, so that the driver integrated circuit 400 can be electrically connected to the pins 110.

[0208] Optionally, the material of the dummy device 350 is partially the same as that of the light emitting device 344. When the light emitting device 344 is formed by evaporation, the material of the light emitting device 344 is evaporated to the binding region 20 to form the dummy device 350, so that the material of the dummy device 350 is partially the same as that of the light emitting device.

[0209] A fifth aspect of the present application provides a display panel, such as Fig.29 As shown, the display panel has a display area 10 and a binding area 20 located on at least one side of the display area 10; the display panel includes: a substrate 100, pins 110 and a light-emitting structure layer 340; a plurality of pins 110 are located on one side of the substrate 100 and on the binding area 20; the light-emitting structure layer 340 is located on one side of the substrate 100, and includes at least one light-emitting device 344 located in the display area 10, wherein the at least one light-emitting device 344 is electrically connected to the plurality of pins 110, and the orthographic projection of the light-emitting structure layer 340 on the substrate 100 does not overlap with the orthographic projection of the plurality of pins 110 on the substrate 100.

[0210] In these optional embodiments, when the material of the light-emitting structure layer 340 is evaporated, a light-emitting device 344 is formed in the display area 10 and a dummy device 350 is located in the binding area 20. A blocking layer 200 is arranged between the dummy device 350 and the binding area 20. The blocking layer 200 covers the entire surface of the binding area 20. When the binding area 20 is removed, the dummy device 350 is peeled off simultaneously, so that the binding area 20 does not have the dummy device 350.

[0211] In some optional embodiments, such as Fig.29 As shown, at least one light emitting device 344 includes a first light emitting device 341 and a second light emitting device 342, and the display panel further includes:

[0212] The isolation structure 700 is located at one side of the substrate 100 and at least at the display area 10 . The isolation structure 700 includes a first opening 731 and a second opening 732 located at the display area 10 .

[0213] At least a portion of the first light emitting device 341 is located in the first opening 731 , and at least a portion of the second light emitting device 342 is located in the second opening 732 .

[0214] In these optional embodiments, the isolation structure 700 encloses a first opening 731 and a second opening 732, at least a portion of the first light-emitting device 341 is located in the first opening 731, and at least a portion of the second light-emitting device 342 is located in the second opening 732. The isolation structure 700 can reduce the light crosstalk problem between the adjacent first light-emitting devices 341 and the second light-emitting devices 342, and the isolation structure 700 can also prevent the first light-emitting device 341 and the second light-emitting device 342 from contacting and short-circuiting in the first opening 731 and the second opening 732. Optionally, the isolation structure encloses a third opening 733, and at least one light-emitting device 344 further includes a third light-emitting device 343, and the third light-emitting device 343 is at least partially located in the third opening 733.

[0215] The embodiment of the sixth aspect of the present application further provides a display device, comprising a display panel of any of the embodiments of the third, fourth and fifth aspects. Since the display device provided by the embodiment of the sixth aspect of the present application comprises the display panel of any of the embodiments of the third, fourth and fifth aspects, the display device provided by the embodiment of the sixth aspect of the present application has the beneficial effects of the display panel of any of the embodiments of the third, fourth and fifth aspects, which will not be described in detail here.

[0216] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0217] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for manufacturing a display panel, characterized in that: The display panel comprises a display area and a binding area located at least on one side of the display area; The manufacturing method comprises: forming an isolation structure at least in the display area of ​​the substrate, the isolation structure comprising a first opening and a second opening located in the display area; forming a plurality of pins in the binding area of ​​the substrate; Forming a blocking layer on a side of the plurality of pins away from the substrate, wherein the orthographic projections of the plurality of pins on the substrate are located within the orthographic projection of the blocking layer on the substrate; Vapor depositing a first light-emitting structure material layer in the first opening, in the second opening, and on the side of the barrier layer away from the plurality of pins, wherein the first light-emitting structure material layer in the first opening and the first light-emitting structure material layer in the second opening are electrically connected to the plurality of pins; Peeling off the barrier layer and the first light emitting structure material layer located on a side of the barrier layer away from the plurality of pins to expose the plurality of pins; A driving integrated circuit is electrically connected to the plurality of pins to drive the first light emitting structure material layer located in the first opening and the first light emitting structure material layer located in the second opening to emit light.

2. The method for manufacturing a display panel according to claim 1, wherein: After the step of electrically connecting the driving integrated circuit to the plurality of pins to drive the first light emitting structure material layer located in the first opening and the first light emitting structure material layer located in the second opening to emit light, the method further includes: The first light emitting structure material layer located in the second opening is removed by etching to obtain a first light emitting device located in the first opening.

3. The method for manufacturing a display panel according to claim 2, wherein: After the step of removing the first light emitting structure material layer located in the second opening by etching to obtain the first light emitting device located in the first opening, the method further includes: The blocking layer is formed on a side of the plurality of pins facing away from the substrate, and the orthographic projections of the plurality of pins on the substrate are located within the orthographic projections of the blocking layer on the substrate; A second light-emitting structure material layer is evaporated in the first opening on the side of the first light-emitting device away from the substrate, in the second opening, and on the side of the barrier layer away from the plurality of pins, wherein the second light-emitting structure material layer in the second opening and the first light-emitting device are electrically connected to the plurality of pins; Peeling off the barrier layer and the second light emitting structure material layer located on a side of the barrier layer away from the plurality of pins to expose the plurality of pins; The driving integrated circuit is electrically connected to the plurality of pins to drive the second light emitting structure material layer and the first light emitting device located in the second opening to emit light.

4. The method for manufacturing a display panel according to claim 3, characterized in that: After the step of electrically connecting the driver integrated circuit to the plurality of pins to drive the second light emitting structure material layer and the first light emitting device in the second opening to emit light, the method further includes: The second light emitting structure material layer located in the first opening is removed by etching to obtain a second light emitting device located in the second opening.

5. The method for manufacturing a display panel according to claim 1, wherein: The isolation structure further includes a third opening located in the display area, wherein: The step of evaporating a first light-emitting structure material layer in the first opening, in the second opening, and on a side of the barrier layer away from the plurality of pins, wherein the first light-emitting structure material layer in the first opening and the first light-emitting structure material layer in the second opening are electrically connected to the plurality of pins, comprises: Depositing a first light-emitting structure material layer in the first opening, in the second opening, in the third opening, and on the side of the barrier layer away from the plurality of pins, wherein the first light-emitting structure material layer in the first opening, the first light-emitting structure material layer in the second opening, and the first light-emitting structure material layer in the third opening are electrically connected to the plurality of pins; The step of electrically connecting the driving integrated circuit to the plurality of pins to drive the first light emitting structure material layer located in the first opening and the first light emitting structure material layer located in the second opening to emit light includes: The driving integrated circuit is electrically connected to the plurality of pins to drive the first light emitting structure material layer located in the first opening, the first light emitting structure material layer located in the second opening, and the first light emitting structure material layer located in the third opening to emit light; Preferably, after the step of electrically connecting the driving integrated circuit to the plurality of pins to drive the first light emitting structure material layer located in the first opening, the first light emitting structure material layer located in the second opening, and the first light emitting structure material layer located in the third opening to emit light, the method further includes: Etching and removing the first light emitting structure material layer located in the second opening and the third opening to obtain a first light emitting device located in the first opening; Preferably, after the step of removing the first light emitting structure material layer located in the second opening and the third opening by etching to obtain the first light emitting device located in the first opening, the method further includes: The blocking layer is formed on a side of the plurality of pins facing away from the substrate, and the orthographic projections of the plurality of pins on the substrate are located within the orthographic projections of the blocking layer on the substrate; A second light-emitting structure material layer is evaporated in the first opening, the second opening, the third opening, and the side of the barrier layer away from the plurality of pins on the first light-emitting device away from the substrate, wherein the second light-emitting structure material layer in the second opening, the second light-emitting structure material layer in the third opening, and the first light-emitting device are electrically connected to the plurality of pins; Peeling off the barrier layer and the second light emitting structure material layer located on a side of the barrier layer away from the plurality of pins to expose the plurality of pins; The driving integrated circuit is electrically connected to the plurality of pins to drive the second light emitting structure material layer located in the second opening, the second light emitting structure material layer located in the third opening, and the first light emitting device to emit light; Preferably, after the step of electrically connecting the driver integrated circuit to the plurality of pins to drive the second light emitting structure material layer located in the second opening, the second light emitting structure material layer located in the third opening, and the first light emitting device to emit light, the method further includes: Etching and removing the second light emitting structure material layer located in the first opening and the third opening to obtain a second light emitting device located in the second opening; Preferably, after the step of removing the second light emitting structure material layer located in the first opening and the third opening by etching to obtain the second light emitting device located in the second opening, the method further includes: A third light-emitting structure material layer is evaporated in the first opening on the side of the first light-emitting device away from the substrate, in the second opening on the side of the second light-emitting device away from the substrate, in the third opening, and on the side of the barrier layer away from the plurality of pins, wherein the first light-emitting device, the second light-emitting device, and the third light-emitting structure material layer in the third opening are electrically connected to the plurality of pins; Peeling off the barrier layer and the third light emitting structure material layer located on a side of the barrier layer away from the plurality of pins to expose the plurality of pins; The driving integrated circuit is electrically connected to the plurality of pins to drive the first light emitting device, the second light emitting device and the third light emitting structure material layer in the third opening to emit light; Preferably, after the step of electrically connecting the driver integrated circuit to the plurality of pins to drive the first light emitting device, the second light emitting device and the third light emitting structure material layer in the third opening to emit light, the method further includes: Etching and removing the third light emitting structure material layer located in the first opening and the second opening to form a third light emitting device located in the third opening; Preferably, the step of forming a barrier layer on a side of the plurality of pins facing away from the substrate comprises: The barrier layer completely covers the binding area.

6. The method for manufacturing a display panel according to claim 5, characterized in that: The barrier layer includes an adhesive tape, and the adhesive tape is attached to a side of the pin facing away from the substrate. The step of peeling off the barrier layer includes: Removing the barrier layer by mechanical stripping to expose the pins; Preferably, the barrier layer comprises an adhesive area and a non-adhesive area, the barrier layer completely covers the binding area, the orthographic projection of the pin on the substrate is located within the orthographic projection of the non-adhesive area on the substrate, and the orthographic projection of the adhesive area on the substrate is located in the area outside the pin; Preferably, the barrier layer comprises a peeling portion protruding from the binding area in a direction away from the display area, and the step of peeling off the barrier layer further comprises: Clamping the stripping portion to strip the barrier layer from the pin; Preferably, a temporary substrate is provided on the side of the substrate away from the barrier layer, the barrier layer includes a bonding area and a non-bonding area, and the step of forming the barrier layer on the side of the pin away from the substrate includes: The bonding area is bonded to the temporary substrate, the non-bonding area is arranged on the side of the pin away from the substrate, and the orthographic projection of the pin on the substrate is located within the orthographic projection of the non-bonding area on the substrate; Preferably, the step of removing the barrier layer by mechanical stripping comprises: The adhesive area and the non-adhesive area are separated from each other to peel off the non-adhesive area.

7. The method for manufacturing a display panel according to claim 1, wherein: The material of the barrier layer includes photoresist; the step of stripping the barrier layer includes: The barrier layer is peeled off by mechanical peeling to expose the pins; Preferably, the photoresist includes positive photoresist or negative photoresist.

8. The method for manufacturing a display panel according to claim 1, wherein: The step of evaporating the first light emitting structure material layer in the first opening, in the second opening, and on the side of the barrier layer away from the plurality of pins includes: Disposing a light-emitting material layer on the entire surface of the display area and the binding area of ​​the substrate; Disposing an electrode material layer on the entire surface of the display area and the binding area of ​​the substrate; Disposing a packaging layer on the entire surface of the display area and the binding area of ​​the substrate; The step of peeling off the barrier layer and the first light emitting structure material layer located on a side of the barrier layer away from the plurality of pins further includes: The barrier layer, the light emitting material layer, the electrode material layer and the packaging layer located on a side of the barrier layer away from the plurality of pins are peeled off to expose the pins.

9. The method for manufacturing a display panel according to claim 1, wherein: The display area includes a driving circuit layer, and the step of forming a plurality of pins in the binding area of ​​the substrate includes: the plurality of pins are electrically connected to the driving circuit layer.

10. The method for manufacturing a display panel according to claim 1, wherein: The step of forming an isolation structure at least in the display area of ​​the substrate includes: forming a first material layer on the substrate; forming a second material layer on a side of the first material layer facing away from the substrate; The first material layer and the second material layer are patterned to form a first sublayer and a second sublayer, the first sublayer is located on the side of the second sublayer facing the substrate, the orthographic projection of the first sublayer on the substrate is within the orthographic projection of the second sublayer on the substrate, and the first sublayer and the second sublayer constitute the isolation structure.

11. A method for manufacturing a display panel, characterized in that: The display panel comprises a display area and a binding area located at least on one side of the display area; The manufacturing method comprises: forming an isolation structure at least in the display area of ​​the substrate, the isolation structure comprising a first opening, a second opening and a third opening located in the display area; forming a plurality of pins in the binding area of ​​the substrate; forming a first light emitting device in the first opening; Forming a blocking layer on a side of the plurality of pins away from the substrate, wherein the orthographic projections of the plurality of pins on the substrate are located within the orthographic projection of the blocking layer on the substrate; A second light-emitting structure material layer is evaporated in the first opening, the second opening, the third opening, and the side of the barrier layer away from the plurality of pins on the first light-emitting device away from the substrate, wherein the second light-emitting structure material layer in the second opening, the second light-emitting structure material layer in the third opening, and the first light-emitting device are electrically connected to the plurality of pins; Peeling off the barrier layer and the second light emitting structure material layer located on a side of the barrier layer away from the plurality of pins to expose the plurality of pins; A driving integrated circuit is electrically connected to the plurality of pins to drive the second light emitting structure material layer located in the second opening, the second light emitting structure material layer located in the third opening, and the first light emitting device to emit light.

12. The method for manufacturing a display panel according to claim 11, characterized in that: After the step of electrically connecting the driver integrated circuit to the plurality of pins to drive the second light emitting structure material layer located in the second opening, the second light emitting structure material layer located in the third opening, and the first light emitting device to emit light, the method further includes: The second light emitting structure material layer located in the first opening and the second light emitting structure material layer located in the third opening are removed by etching to obtain a second light emitting device located in the second opening.

13. The method for manufacturing a display panel according to claim 12, characterized in that: After the step of removing the second light emitting structure material layer in the first opening and the second light emitting structure material layer in the third opening by etching to obtain the second light emitting device in the second opening, the method further includes: A third light-emitting structure material layer is evaporated in the first opening on the side of the first light-emitting device away from the substrate, in the second opening on the side of the second light-emitting device away from the substrate, in the third opening, and on the side of the barrier layer away from the plurality of pins, wherein the first light-emitting device, the second light-emitting device, and the third light-emitting structure material layer in the third opening are electrically connected to the plurality of pins; Peeling off the barrier layer and the third light emitting structure material layer located on a side of the barrier layer away from the plurality of pins to expose the plurality of pins; The driving integrated circuit is electrically connected to the plurality of pins to drive the first light emitting device, the second light emitting device and the third light emitting structure material layer in the third opening to emit light.

14. The method for manufacturing a display panel according to claim 13, wherein: After the step of electrically connecting the driver integrated circuit to the plurality of pins to drive the first light emitting device, the second light emitting device and the third light emitting structure material layer in the third opening to emit light, the method further includes: The third light emitting structure material layer located in the first opening and the second opening is removed by etching to form a third light emitting device located in the third opening.

15. A display panel, characterized in that: The display panel is prepared by the manufacturing method of any one of claims 1 to 14.

16. A display panel, characterized in that: The display panel has a display area and a binding area located at at least one side of the display area; the display panel includes: substrate; A plurality of pins are located on one side of the substrate and in the binding area; A light-emitting structure layer is located on one side of the substrate, and includes at least one light-emitting device located in the display area and a virtual device located in the binding area, wherein the at least one light-emitting device is electrically connected to the multiple pins, and the orthographic projection of the virtual device on the substrate does not overlap with the orthographic projection of the multiple pins on the substrate.

17. The display panel according to claim 16, characterized in that: The material of the dummy device is partially the same as that of the light-emitting device.

18. A display panel, characterized in that: The display panel has a display area and a binding area located at at least one side of the display area; the display panel includes: substrate; A plurality of pins are located on one side of the substrate and in the binding area; A light-emitting structure layer is located on one side of the substrate, and includes at least one light-emitting device located in the display area, wherein the at least one light-emitting device is electrically connected to the multiple pins, and the orthographic projection of the light-emitting structure layer on the substrate does not overlap with the orthographic projection of the multiple pins on the substrate.

19. The display panel according to claim 18, characterized in that: The at least one light emitting device includes a first light emitting device and a second light emitting device, and the display panel further includes: An isolation structure, located at one side of the substrate and at least located in the display area, the isolation structure comprising a first opening and a second opening located in the display area; At least a portion of the first light emitting device is located in the first opening, and at least a portion of the second light emitting device is located in the second opening.

20. A display device, characterized in that: A display panel comprising any one of claims 15 to 19.

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