Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device, and belongs to the technical field of display. The display panel comprises a pixel definition layer; the pixel definition layer defines a plurality of pixel openings surrounded by the pixel definition layer; the plurality of sub-pixels are respectively arranged corresponding to the pixel openings; the sub-pixel comprises a cathode; and the metal wiring layer partially covers the pixel definition layer, and the cathodes of the sub-pixels are in lap joint with the metal wiring layer. According to the embodiment of the invention, the transmittance of the display panel can be improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, people have higher and higher requirements for the display quality of display panels. At present, with the increase of display panel functions, such as the setting of fingerprint recognition and other functions, the demand for the transmittance of display panels is getting higher and higher. However, in the related art, the transmittance of display panels is relatively low. Summary of the invention

[0003] The present invention provides a display panel and a manufacturing method thereof, and a display device, so as to improve the transmittance of the display panel.

[0004] In a first aspect, an embodiment of the present invention provides a display panel, including:

[0005] A pixel definition layer; the pixel definition layer defines a plurality of pixel openings surrounded by the pixel definition layer;

[0006] A plurality of sub-pixels are respectively arranged corresponding to the pixel openings; the sub-pixels include cathodes;

[0007] A metal wiring layer partially covers the pixel definition layer, and the cathode of the sub-pixel is overlapped to the metal wiring layer.

[0008] Optionally, the display panel includes a light-transmitting display area, and at least part of the sub-pixels are arranged in the light-transmitting display area;

[0009] Wherein, the portion of the metal wiring layer located in the light-transmitting display area includes a photosensitive opening, and the photosensitive opening exposes the top surface of the pixel definition layer;

[0010] Preferably, the metal wiring layer comprises a plurality of metal wirings connected in a mesh shape, and the mesh holes of the metal wiring layer expose each of the sub-pixels; at least a portion of the metal wirings located in the light-transmitting display area comprises at least one photosensitive opening;

[0011] Preferably, the display panel further includes: a photosensitive element, which is arranged below the pixel definition layer, and the vertical projection of the photosensitive opening on the pixel definition layer at least partially overlaps with the vertical projection of the photosensitive element on the pixel definition layer, and the photosensitive element senses light through the photosensitive opening.

[0012] Optionally, the photosensitive opening includes a through hole that penetrates the metal routing along the thickness direction of the display panel; for any metal routing provided with the through hole, corresponding to the position of the through hole, along a direction perpendicular to the extension direction of the metal routing, the cathodes of the sub-pixels on both sides of the two side walls of the metal routing are respectively overlapped to the parts of the metal routing located on both sides of the through hole.

[0013] Optionally, the photosensitive opening includes a groove arranged on the side wall of the metal wiring, and the groove penetrates the metal wiring along the thickness direction of the display panel; for any metal wiring provided with the groove, at a position corresponding to the groove, the cathode of the sub-pixel on the side of the side wall of the metal wiring provided with the groove is overlapped to the top surface of the pixel definition layer exposed by the groove;

[0014] Preferably, the groove is provided on one side wall of the metal wiring, and the cathode of the sub-pixel on the side of the side wall of the metal wiring where the groove is not provided is overlapped with the metal wiring.

[0015] Optionally, the photosensitive opening includes a through opening arranged on the side wall of the metal routing, and the metal routing is cut off by the through opening along the extension direction of the metal routing; for any metal routing provided with the through opening, corresponding to the position of the through opening, along the direction perpendicular to the extension direction of the metal routing, the cathodes of the sub-pixels on both sides of the through opening are overlapped to the top surface of the pixel definition layer exposed by the through opening.

[0016] Optionally, the display panel further includes:

[0017] A pixel encapsulation layer is arranged above the cathode of the sub-pixel; the pixel encapsulation layer includes a plurality of pixel encapsulation structures corresponding to each of the sub-pixels; the pixel encapsulation structure completely covers the cathode of the corresponding sub-pixel and is overlapped to the metal wiring layer.

[0018] Optionally, the metal routing layer includes a plurality of metal routings connected in a mesh;

[0019] The photosensitive opening includes a through hole penetrating the metal wiring along the thickness direction of the display panel, and corresponding to the position of the through hole, along a direction perpendicular to the extension direction of the metal wiring, the pixel packaging structure of the sub-pixel on both sides of the two side walls of the metal wiring is respectively overlapped to the parts of the metal wiring located on both sides of the through hole;

[0020] And / or, the photosensitive opening includes a groove arranged on the side wall of the metal wiring, and corresponding to the position of the groove, the pixel encapsulation structure of the sub-pixel on the side of the side wall of the metal wiring provided with the groove is overlapped to the top surface of the pixel definition layer exposed by the groove;

[0021] And / or, the photosensitive opening includes a through opening arranged on the side wall of the metal routing, and corresponding to the position of the through opening, along a direction perpendicular to the extension direction of the metal routing, the pixel packaging structures of the sub-pixels on both sides of the through opening are overlapped to the top surface of the pixel definition layer exposed by the through opening.

[0022] Optionally, the light-transmitting display area includes some of the sub-pixels; the display panel further includes: a normal display area including other sub-pixels; and the sub-pixels are arranged in a uniform array in the display panel.

[0023] In a second aspect, an embodiment of the present invention further provides a display panel, including:

[0024] A display area, the display area comprising a normal display area and a light-transmitting display area;

[0025] A plurality of sub-pixels are uniformly arranged in an array in the display area;

[0026] A metal wiring layer is arranged in the gap between each of the sub-pixels and is electrically connected to all the sub-pixels, and is used to provide a driving signal to each of the sub-pixels; wherein the area proportion of the metal wiring layer in the light-transmitting display area is smaller than the area proportion of the metal wiring layer in the normal display area, so that the transmittance of the light-transmitting display area is greater than the transmittance of the normal display area.

[0027] Optionally, the metal routing layer includes a plurality of metal routings connected in a mesh;

[0028] Among the metal wirings passing through the light-transmitting display area, at least some of the metal wirings have an area in the light-transmitting display area that is smaller than an area of ​​the metal wirings in an area in the normal display area that is equal in size to the light-transmitting display area;

[0029] Preferably, a receiving component in the sub-pixel for receiving the driving signal is connected to the metal wiring;

[0030] Preferably, the receiving component in the sub-pixel for receiving the driving signal is a cathode of the sub-pixel, and the driving signal provided by the metal wiring layer is a cathode voltage.

[0031] Optionally, among the metal traces passing through the light-transmitting display area:

[0032] At least part of the metal wiring is located in the light-transmitting display area and includes a through hole, and the through hole penetrates the metal wiring along the thickness direction of the display panel;

[0033] and / or, the width of at least part of the metal wiring in the light-transmitting display area is smaller than the width in the normal display area;

[0034] And / or, at least part of the metal wiring is discontinuous in the light-transmitting display area.

[0035] In a third aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, comprising:

[0036] Providing a substrate; the substrate includes a pixel driving circuit for each sub-pixel;

[0037] An anode layer is prepared above the substrate; the anode layer includes an anode of each of the sub-pixels;

[0038] A pixel definition layer, a metal wiring layer and an isolation structure layer are sequentially stacked on the substrate; the pixel definition layer defines a plurality of pixel openings surrounded by the pixel definition layer, and each sub-pixel is respectively arranged corresponding to each pixel opening; the metal wiring layer partially covers the pixel definition layer; the isolation structure layer includes an isolation column surrounding each pixel opening;

[0039] Based on the isolation function of the isolation column, the light-emitting layer, cathode and pixel packaging structure of each sub-pixel are respectively prepared in each pixel opening; wherein the cathode of each sub-pixel is overlapped to the metal wiring layer.

[0040] Optionally, the pixel encapsulation structure of each of the sub-pixels constitutes a pixel encapsulation layer;

[0041] After the light emitting layer, cathode and pixel encapsulation structure of each sub-pixel are prepared in each pixel opening based on the isolation function of the isolation column, the method further includes:

[0042] removing the isolation structure layer;

[0043] preparing an organic encapsulation layer above the pixel encapsulation layer;

[0044] An inorganic encapsulation layer is prepared on the organic encapsulation layer.

[0045] Optionally, the substrate includes a photosensitive element at a portion corresponding to the light-transmitting display area in the display panel;

[0046] In the process of preparing a pixel definition layer, a metal wiring layer and an isolation structure layer stacked in sequence above the substrate, the vertical projection of the pixel definition layer on the substrate is controlled to cover the vertical projection of the photosensitive element on the substrate; and the metal wiring layer is controlled to include a plurality of photosensitive openings in a portion located in the light-transmitting display area, the photosensitive openings expose the top surface of the pixel definition layer, and the vertical projection of the photosensitive openings on the pixel definition layer at least partially overlaps with the vertical projection of the photosensitive element on the pixel definition layer.

[0047] In a fourth aspect, an embodiment of the present invention further provides a display device, comprising: a display panel provided by any embodiment of the present invention.

[0048] In the display panel provided by the embodiment of the present invention, by arranging the metal wiring layer to partially cover the pixel definition layer, the light transmittance of the portion of the pixel definition layer not covered by the metal wiring layer can be improved, thereby increasing the transmittance of the display panel.

[0049] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0051] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0052] Figure 2 is along Figure 1 Schematic diagram of the cross-sectional structure along line A-A';

[0053] Figure 3 This embodiment of the present invention provides a Figure 1 A schematic diagram of the enlarged structure of the middle region F;

[0054] Figure 4 is along Figure 3 Schematic diagram of the cross-sectional structure along line B-B';

[0055] Figure 5 Another embodiment of the present invention provides Figure 1 A schematic diagram of the enlarged structure of the middle region F;

[0056] Figure 6is along Figure 5 Schematic diagram of the cross-sectional structure of C-C';

[0057] Figure 7 Another embodiment of the present invention provides Figure 1 A schematic diagram of the enlarged structure of the middle region F;

[0058] Figure 8 Another embodiment of the present invention provides Figure 1 A schematic diagram of the enlarged structure of the middle region F;

[0059] Fig. 9 is along Figure 8 Schematic diagram of the cross-sectional structure along D-D';

[0060] Fig.10 is along Figure 1 Schematic diagram of the cross-sectional structure along line E-E';

[0061] Fig.11 is a schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0062] Fig.12 is a schematic structural diagram of a display panel in S110-S160 provided by an embodiment of the present invention;

[0063] Fig.13 It is a schematic diagram of the structure of a display panel in S170-S190 provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0064] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0065] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0066] An embodiment of the present invention provides a display panel that can effectively improve the transmittance of the display panel. The display panel includes: a pixel definition layer, a metal wiring layer and a plurality of sub-pixels. The pixel definition layer defines a plurality of pixel openings surrounded by the pixel definition layer; a plurality of sub-pixels are respectively arranged corresponding to each pixel opening; the sub-pixel includes a cathode, and the cathode of the sub-pixel is overlapped to the metal wiring layer. The metal wiring layer partially covers the top of the pixel definition layer, in other words, part of the top surface of the pixel definition layer is covered by the metal wiring layer. Exemplarily, the vertical projection of the metal wiring layer on the pixel definition layer can completely fall on the top surface of the pixel definition layer and partially cover the top surface of the pixel definition layer. Among them, the metal wiring layer is a thinner or transparent metal layer, which itself has a certain light transmittance.

[0067] In the embodiment of the present invention, by arranging the metal wiring layer to partially cover the pixel definition layer, the light transmittance of the portion of the pixel definition layer not covered by the metal wiring layer can be improved, thereby increasing the transmittance of the display panel.

[0068] On the basis of the above embodiments, the display panel may optionally include a light-transmitting display area, at least part of the sub-pixels are arranged in the light-transmitting display area, in which the part above the pixel definition layer is covered by the metal wiring layer, and the uncovered part is used to increase the transmittance of the light-transmitting display area, and the light-transmitting display area can be used to set a photosensitive element to realize functions such as fingerprint recognition. Among them, the light-transmitting display area can occupy a part of the display area in the display panel to increase the local transmittance of the panel according to the functional requirements of the display panel. In this case, some sub-pixels are arranged in the light-transmitting display area; in the parts of the display area other than the light-transmitting display area, a metal wiring layer can be set to completely cover the top surface of the pixel definition layer. Alternatively, the light-transmitting display area can occupy the entire display area, and all sub-pixels are arranged in the light-transmitting display area, so that the overall transmittance of the panel can be increased.

[0069] The structure of the display panel is exemplarily described below in conjunction with some specific implementations.

[0070] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention; Figure 2 is along Figure 1 Schematic diagram of the cross-sectional structure of A-A'. Figure 1 and Figure 2 The display panel includes: a pixel definition layer 20 , a metal wiring layer 30 and a plurality of sub-pixels 100 .

[0071] The pixel definition layer 20 defines a plurality of pixel openings surrounded by the pixel definition layer 20; and a plurality of sub-pixels 100 are respectively arranged corresponding to each pixel opening. The sub-pixel 100 may include a cathode 43. The metal wiring layer 30 is arranged above the pixel definition layer 20, and the cathode 43 of each sub-pixel 100 is overlapped to the metal wiring layer 30. The display panel includes a light-transmitting display area AA1, and at least part of the sub-pixels 100 are arranged in the light-transmitting display area AA1. The portion of the metal wiring layer 30 located in the light-transmitting display area AA1 includes a photosensitive opening 310, and the photosensitive opening 310 exposes the top surface of the pixel definition layer 20 to increase the transmittance of the light-transmitting display area AA1.

[0072] Exemplarily, the light-transmissive display area AA1 is used to place the photosensitive element 200, which is disposed below the pixel definition layer 20. The vertical projection of the photosensitive opening 310 on the pixel definition layer 20 at least partially overlaps with the vertical projection of the photosensitive element 200 on the pixel definition layer 20, and the photosensitive element 200 senses light through the photosensitive opening 310.

[0073] Exemplarily, the light-transmissive display area AA1 may occupy a part or all of the display area in the display panel, which may be specifically set according to actual needs and is not limited here. Figure 1 Exemplarily, the light-transmitting display area AA1 occupies part of the display area, and the light-transmitting display area AA1 can be used for fingerprint recognition, for example. The light-transmitting display area AA1 may include a plurality of sub-pixels 100 to realize the normal display function of the area; and the light-transmitting display area AA1 includes a photosensitive element 200 to realize other functions based on the light sensing of the photosensitive element 200 on the basis of realizing the normal display function. The photosensitive element 200 is arranged in the gap between each sub-pixel 100 and arranged in the non-pixel opening area. In other words, the pixel definition layer 20 covers the part of the display area except the pixel opening, and the photosensitive element 200 is arranged directly below the pixel definition layer 200 to avoid the light emission of the sub-pixel 100 affecting the recognition of the ambient light by the photosensitive element 200. The photosensitive element 200 can be set to one or more as needed. Exemplarily, a plurality of photosensitive elements 200 judge whether the ridge or valley of the fingerprint is in contact with the display panel by sensing the intensity of the ambient light, thereby realizing fingerprint recognition.

[0074] The pixel definition layer 20 may include a light-transmitting insulating material, such as an inorganic or organic material, so that the external ambient light can pass through the pixel definition layer 20 to irradiate the photosensitive element 200. The metal wiring layer 30 is arranged above the pixel definition layer 20, which can be understood as follows: the metal wiring layer 30 is arranged in the non-pixel opening area, located directly above the pixel definition layer 20, and the vertical projection of the metal wiring layer 30 on the pixel definition layer 20 completely falls on the top surface of the pixel definition layer 20. The cathode 40 of each sub-pixel 100 can extend from the bottom of the pixel opening to the top surface of the pixel definition layer 20, thereby achieving overlap with the metal wiring layer 30. The metal wiring layer 30 can be used to provide a cathode voltage to the cathode 43 of the sub-pixel 100.

[0075] The metal wiring layer 30 can be made of metal materials such as titanium, aluminum, silver or molybdenum. By setting the photosensitive opening 310 to remove part of the metal material, the light irradiated to the photosensitive opening 310 can pass through the photosensitive opening 310 and further transmit downward through the pixel definition layer 20. By setting the vertical projection of the photosensitive opening 310 on the pixel definition layer 20 to overlap at least partially with the vertical projection of the photosensitive element 200 on the pixel definition layer 20, the photosensitive element 200 can receive the light transmitted from the photosensitive opening 310, that is, sense light through the photosensitive opening 310. In this way, the transmittance of the display panel can be effectively improved, and conditions for configuring the photosensitive element 200 in the display panel can be provided. Exemplarily, at least one photosensitive opening 310 can be set in the portion of the metal wiring layer 30 located in the light-transmitting display area AA1; wherein, one photosensitive element 200 can sense light through one or more photosensitive openings 310, and one photosensitive opening 310 can be set corresponding to one or more photosensitive elements 200. It is understandable that, in the metal wiring layer 30, except for the part where the photosensitive opening 310 is set, the other parts are still connected as an integral film layer, which can realize the transmission of the cathode voltage across the entire screen; the cathode 43 of each sub-pixel 100 overlaps with the remaining part of the metal wiring layer 30 except the photosensitive opening 310, thereby ensuring that each sub-pixel 100 can normally receive the cathode voltage to complete normal display. According to the different settings of the photosensitive opening 310, the overlap area between the cathode 43 in the sub-pixel 100 set around the photosensitive opening 310 and the metal wiring layer 30 may be less than or equal to the overlap area between the cathode 43 in the sub-pixel 100 not set around the photosensitive opening 310 and the metal wiring layer 30.

[0076] In the display panel provided by the embodiment of the present invention, by opening a photosensitive opening 310 at the portion of the metal wiring layer 30 located in the light-transmitting display area AA1, and setting the vertical projection of the photosensitive opening 310 on the pixel definition layer 20 to at least partially overlap with the vertical projection of the photosensitive element 200 on the pixel definition layer 20, the transmittance of the non-pixel opening area in the light-transmitting display area AA1 can be effectively improved, so that the external ambient light can pass through the photosensitive opening 310 to irradiate the photosensitive element 200, thereby meeting the transmittance requirement of the photosensitive element 200 and ensuring its recognition accuracy. Therefore, the embodiment of the present invention can improve the transmittance of the display panel, so that the photosensitive element 200 can accurately sense the ambient light intensity.

[0077] Figure 3 This embodiment of the present invention provides a Figure 1 Schematic diagram of the enlarged structure of the middle area F, see Figure 3 In one embodiment, optionally, the metal wiring layer 30 includes a plurality of metal wirings 31 connected in a mesh, and the mesh holes in the mesh structure of the metal wiring layer 30 expose each sub-pixel 100 to prevent the metal wiring layer 30 from blocking the light emission of the sub-pixel 100. At least part of the metal wiring 31 located in the light-transmitting display area AA1 includes at least one photosensitive opening 310.

[0078] Specifically, the metal wiring layer 30 may include a plurality of first metal wirings 301 extending along a first direction and a plurality of second metal wirings 302 extending along a second direction, wherein the plurality of first metal wirings 301 and the plurality of second metal wirings 302 overlap to form a mesh-shaped metal wiring layer 30, and the first direction and the second direction intersect. The first direction and the second direction may be specifically determined according to the arrangement of the sub-pixels 100, and the first metal wirings 301 and the second metal wirings 302 are both interspersed between the gaps of the sub-pixels 100. Figure 3 For example, each sub-pixel 100 is arranged in an array to form multiple rows of sub-pixels 100 extending along the column direction Y of the display panel and multiple columns of sub-pixels 100 extending along the row direction X of the display panel; accordingly, the first direction may be the column direction Y, and the second direction may be the row direction X, that is, multiple first metal traces 301 may extend along the column direction Y and be arranged along the row direction X, and multiple second metal traces 302 may extend along the row direction X and be arranged along the column direction Y. For ease of explanation, the following explanations are all based on this arrangement.

[0079] In the light-transmitting display area AA1, a photosensitive opening 310 may be provided at least at a position corresponding to each photosensitive element 200. Preferably, the vertical projection area of ​​the photosensitive opening 310 on the pixel definition layer 200 may be set to be greater than or equal to the vertical projection area of ​​the photosensitive element 200 on the pixel definition layer 200, and the vertical projection of the photosensitive opening 310 on the pixel definition layer 200 may be set to completely cover the vertical projection of the photosensitive element 200 on the pixel definition layer 200, so as to ensure that the photosensitive element 200 is completely unblocked, can be well-photosensitive, avoid misidentification due to blocking, and improve the accuracy of light intensity identification of the photosensitive element 200.

[0080] Based on the above embodiments, optionally, there are multiple ways to set the photosensitive opening 310, and several of them are exemplarily described below, but they are not intended to limit the present invention.

[0081] Figure 4 is along Figure 3 Schematic diagram of the cross-sectional structure of B-B', combined with Figure 3 and Figure 4 In one embodiment, optionally, the photosensitive opening includes a through hole 311 that penetrates the metal wiring 31 along the thickness direction Z of the display panel. Then, for any metal wiring 31 provided with a through hole 311, corresponding to the position of the through hole 311, along the direction perpendicular to the extension direction of the metal wiring 31, the cathode 43 of the sub-pixel 100 on both sides of the two side walls of the metal wiring 31 is respectively overlapped to the parts of the metal wiring 31 located on both sides of the through hole 311. Wherein, at the position where the through hole 311 is provided, the metal wiring 31 partially covers the top of the pixel definition layer 20; at the position where the through hole 311 is not provided, the metal wiring 31 can completely cover the top of the pixel definition layer 20; this structure can be obtained by first laying a metal wiring material layer on the pixel definition layer 20 as a whole layer, and then digging holes in the metal wiring material layer.

[0082] Specifically, Figure 3 and Figure 4 For example, the first metal wiring 301 in FIG. 1 is extended in the column direction Y, and the direction perpendicular to the extension direction is the row direction X. The cross section obtained by cutting along the BB' is the cross section obtained by cutting along the row direction X. Based on this, it can be observed that after the through hole 311 is set, the overlap relationship between the cathode 43 of the sub-pixel 100 on both sides of the through hole 311 along the row direction X and the first metal wiring 301. Figure 3 and Figure 4 It can be seen that along the row direction X, metal materials are retained on both sides of the through hole 311, and the cathodes 43 of the sub-pixels 100 on both sides of the through hole 311 can be respectively overlapped with the metal materials retained on both sides of the through hole 311 to receive the cathode voltage.

[0083] Therefore, when the photosensitive opening is a through hole 311, it does not affect the overlap area between the cathode 43 of the sub-pixel 100 and the metal wiring layer 30. Exemplarily, the shape of the through hole 311 in the cross section perpendicular to the thickness direction Z of the display panel can be circular, rectangular, triangular, other polygonal or irregular, and can be set according to actual needs. Along the extension direction of the metal wiring 31, the length of the through hole 311 can be set to be longer to expose as much of the photosensitive element 200 as possible, improve the transmittance, and increase the photosensitive area of ​​the photosensitive element 200. For example, the length of the through hole 311 along the extension direction of the metal wiring 31 can be greater than the length of the photosensitive element 200 along the extension direction of the metal wiring 31, and even a through hole 311 is set to expose multiple photosensitive elements 200 arranged along the extension direction of the metal wiring 31. Along the extension direction of the metal trace 31, the width of the through hole 311 can be set by comprehensively considering the width of the photosensitive element 200 and the reliability of the signal transmission of the metal trace 31, so as to retain a sufficient width of metal material on both sides of the through hole 311 to ensure the reliable transmission of the cathode voltage while ensuring the transmittance.

[0084] Figure 5 Another embodiment of the present invention provides Figure 1 A schematic diagram of the enlarged structure of the middle region F; Figure 6 is along Figure 5 Schematic diagram of the cross-sectional structure of C-C'. Figure 5 and Figure 6 In another embodiment, optionally, the photosensitive opening includes a groove 312 provided on the side wall of the metal trace 31, and the groove 312 penetrates the metal trace along the thickness direction Z of the display panel. The side wall of the metal trace 31 refers to the surface of the metal trace 31 that is parallel to the extension direction of the metal trace 31 and the thickness direction Z of the display panel. Accordingly, for any metal trace 31 provided with a groove 312, at a position corresponding to the groove 312, the cathode 43 of the sub-pixel 100 on the side of the side wall of the metal trace 31 provided with the groove 312 is overlapped to the top surface of the pixel definition layer 20 exposed by the groove 312.

[0085] For example, see Figure 5 and Figure 6 When a groove 312 is provided on one side of the sidewall of the metal wiring 31, metal material is retained between the other sidewall and the groove 312, so the cathode 43 of the sub-pixel 100 on the side of the sidewall of the metal wiring 31 where the groove 312 is not provided can still be overlapped to the remaining part of the metal wiring 31. Alternatively, when grooves 312 are provided on both sides of the sidewall of the metal wiring 31, along a direction perpendicular to the extending direction of the metal wiring 31, corresponding to the position of the groove 312, the cathodes 43 of the sub-pixels 100 on both sides of the metal wiring 31 are respectively overlapped to the top surface of the pixel definition layer 20 exposed by the grooves 312 on both sides.

[0086] Therefore, when the photosensitive opening is a groove 312, the overlap area between the cathode 43 of some sub-pixels 100 and the metal wiring layer 30 will be reduced. For the sub-pixels 100 arranged around the groove 312, it is ensured that the cathode 43 overlaps with the remaining part of the metal wiring layer 30 in at least a part of the area other than the groove 312, so as to ensure that it can receive the cathode voltage normally. Exemplarily, the shape of the groove 312 in the cross section perpendicular to the thickness direction Z of the display panel can be rectangular, semicircular, trapezoidal or irregular, which can be set according to actual needs. Along the direction perpendicular to the extension direction of the metal wiring 31, the depth of the groove 312 can also be set according to actual needs, for example, by comprehensively considering the width of the photosensitive element 200 and the reliability of signal transmission in the remaining part of the metal wiring 31. Along the extension direction of the metal wiring 31, the length of the groove 312 can be set to be longer to expose as much of the photosensitive element 200 as possible, improve the transmittance, and increase the photosensitive area of ​​the photosensitive element 200. For example Figure 5 As shown, the grooves 312 may be arranged to correspond to the photosensitive elements 200 one by one, and the length of each groove 312 along the extension direction of the metal wiring 31 may be greater than the length of the photosensitive element 200 along the extension direction of the metal wiring 31. Figure 7 As shown, taking the first metal wiring 301 as an example, the length of the groove 312 along the column direction can be set to be equal to the distance between two adjacent second metal wirings 302 to increase the transmittance as much as possible.

[0087] Figure 8 Another embodiment of the present invention provides Figure 1 A schematic diagram of the enlarged structure of the middle region F; Fig. 9 is along Figure 8 Schematic diagram of the cross-sectional structure along the line D-D'. Figure 8 and Fig. 9 In another embodiment, optionally, the photosensitive opening includes a through opening 313 provided on the side wall of the metal wiring 31, and the metal wiring 31 is cut off by the through opening 313 along the extension direction of the metal wiring 31. For any metal wiring 31 provided with the through opening 313, corresponding to the position of the through opening 313, along the direction perpendicular to the extension direction of the metal wiring 31, the cathodes 43 of the sub-pixels 100 on both sides of the through opening 313 are overlapped to the top surface of the pixel definition layer 20 exposed by the through opening 313. It can be understood that along the extension direction of the metal wiring 31, the metal wiring 31 is cut off by the through opening 313, so that the metal wiring 31 is divided into at least two parts that are discontinuous along the extension direction; wherein, each part of the metal wiring 31 is connected to other metal wirings 31 in the metal wiring layer 30, so that the metal wiring layer 30 as a whole is still a structure with complete electrical connection, and can normally provide cathode voltage to the sub-pixels 100 of the full screen.

[0088] Since the through opening 313 directly cuts off the metal wiring 31, no metal material is retained on both sides of the through opening 313 in the direction perpendicular to the extension direction of the metal wiring, and the cathodes of the sub-pixels 100 on both sides of the through opening 313 are directly overlapped to the top surface of the pixel definition layer 20. Therefore, when the photosensitive opening is the through opening 313, the overlap area between the cathode 43 of some sub-pixels 100 and the metal wiring layer 30 will be reduced. For the sub-pixels 100 arranged around the through opening 313, it is ensured that the cathode 43 overlaps with the remaining part of the metal wiring layer 30 in at least a part of the area except the through opening 313, so that it can receive the cathode voltage normally.

[0089] It should be noted that, when actually manufacturing the display panel, one or more combinations of the configurations of the photosensitive openings 310 given in the above embodiments may be used to meet the transmittance requirements of each photosensitive element 200. Figure 8 As shown, a through opening 313 may be provided at a portion of the metal wiring layer 30 located in the light-transmitting display area AA1, and a through hole 311 may be provided at a portion of the metal wiring layer 30, so as to effectively improve the transmittance of the light-transmitting display area AA1 while ensuring normal transmission of the cathode voltage.

[0090] On the basis of the above-mentioned embodiments, optionally, the sub-pixel 100 may specifically include a pixel driving circuit (not shown in the figure) and a light-emitting device 40. The light-emitting device 40 may include an anode 41, a light-emitting layer 42 and a cathode 43 stacked from bottom to top. Each light-emitting device 40 is correspondingly arranged in each pixel opening 21. The anode of the light-emitting device 40 is connected to the pixel driving circuit, for example. Exemplarily, the pixel driving circuit provides an anode voltage and a driving current to the anode 41, and the metal wiring layer 30 provides a cathode voltage to the cathode 43; in the light-emitting device 40, the anode 41 injects holes into the light-emitting layer 42, and the cathode 43 injects electrons into the light-emitting layer 42, and the formed electrons and holes form excitons in the light-emitting layer 42, and the excitons return to the ground state through radiation transition, so that the light-emitting device 40 emits light, that is, the sub-pixel emits light.

[0091] On the basis of the above embodiments, the display panel may further include a substrate 10, which is arranged below the pixel definition layer 20. Each pixel driving circuit and the photosensitive element 200 may be arranged in the substrate 10. Exemplarily, the substrate may include a substrate 11, an array layer 12 and a planarization layer 13 stacked from bottom to top; each pixel driving circuit may be arranged in the array layer 12, and each pixel driving circuit may be arranged, for example, corresponding to the position of each light-emitting device 40, and the light-emitting device 40 may be connected to the pixel driving circuit through a via. The array layer 12 may also be provided with a photosensitive driving circuit of each photosensitive element 200, and each photosensitive element 200 may be connected respectively. The photosensitive element 200 may be arranged in the planarization layer 13, or may be arranged below the array layer 12 or below the substrate 11, and may be arranged specifically according to actual conditions.

[0092] On the basis of the above embodiments, optionally, the display panel further includes: a pixel encapsulation layer, which is arranged above the cathode 43 of the sub-pixel 100. The pixel encapsulation layer includes a plurality of pixel encapsulation structures 51 corresponding to each sub-pixel 100; the pixel encapsulation structure 51 completely covers the cathode of the corresponding sub-pixel and is overlapped to the metal wiring layer 30 to achieve encapsulation protection for the sub-pixel 100. Exemplarily, the pixel encapsulation layer is made of inorganic materials, such as silicon nitride or silicon oxide.

[0093] Furthermore, when the photosensitive opening 310 is arranged in a different manner, the specific overlapping manner of the pixel encapsulation structure 51 above the top surface of the pixel definition layer 20 is slightly different, which are described below respectively:

[0094] See also Figure 4 , when the photosensitive opening is a through hole 311 penetrating the metal wiring 31 along the thickness direction Z of the display panel, corresponding to the position of the through hole 311, along the direction perpendicular to the extension direction of the metal wiring 31, the pixel encapsulation structures 51 of the sub-pixels 100 on both sides of the two side walls of the metal wiring 31 are respectively overlapped to the parts of the metal wiring 31 located on both sides of the through hole 311. In other words, when the photosensitive opening is a through hole 311, the pixel encapsulation structures 51 of the sub-pixels 100 disposed around the through hole 311 are all overlapped to the remaining parts of the metal wiring 31.

[0095] See also Figure 6 , when the photosensitive opening is a groove 312 set on the side wall of the metal wiring 31, corresponding to the position of the groove 312, the pixel encapsulation structure 51 of the sub-pixel 100 on the side of the side wall of the metal wiring 31 where the groove is set is overlapped to the top surface of the pixel definition layer 20 exposed by the groove 312. In other words, when the photosensitive opening is a groove 312, a part of the pixel encapsulation structure 51 of the sub-pixel 100 on the side where the groove 312 is set will be overlapped to the pixel definition layer 20; compared with metal materials, the encapsulation effect obtained by overlapping the pixel encapsulation structure 51 and the pixel definition layer 20 is better. Therefore, such a setting can improve the encapsulation effect of the pixel encapsulation layer to a certain extent.

[0096] See also Fig. 9 When the photosensitive opening is a through opening 313 disposed on the side wall of the metal wiring 31, corresponding to the position of the through opening 313, along the direction perpendicular to the extension direction of the metal wiring 31, the pixel encapsulation structure 51 of the sub-pixel 100 on both sides of the through opening 313 is overlapped to the top surface of the pixel definition layer 20 exposed by the through opening 313. In this way, firstly, the metal material at the through opening 313 can be directly removed to effectively improve the transmittance, and secondly, the overlap area of ​​the pixel encapsulation structure 51 and the pixel definition layer 20 can be larger, further improving the encapsulation effect of the pixel encapsulation layer.

[0097] Based on the above embodiments, optionally, see Figure 1 , the light-transmitting display area AA1 includes some sub-pixels 100; the display panel also includes: a normal display area AA2, including other sub-pixels 100. Each sub-pixel 100 is arranged in a uniform array in the display panel. In other words, the arrangement mode and pixel density of the sub-pixels 100 in the light-transmitting display area AA1 and the normal display area AA2 are the same. The light-transmitting display area AA1 and the normal display area AA2 together constitute the display area of ​​the display panel. Each sub-pixel 100 is arranged in a uniform array in the display area, which can effectively improve the consistency of the display image of the display panel and avoid different display effects in different display areas. Combined with Figure 4 and Fig.10 , along the same direction (e.g., row direction X), the spacing d3 between two adjacent pixel openings 21 in the light-transmitting display area AA1 is the same as the spacing d4 between two adjacent pixel openings 21 in the normal display area AA2. The embodiment of the present invention is equivalent to arranging the photosensitive element 200 by utilizing the gaps between the sub-pixels 100 in the light-transmitting display area AA1.

[0098] The cross-sectional structure between two adjacent sub-pixels 100 in the normal display area AA2 can be seen in FIG. Fig.10 , wherein, along the direction perpendicular to the extension direction of the metal wiring, the two sides of the metal wiring 31 are respectively overlapped with the cathodes 43 of the sub-pixels 100 on both sides, and the portion of the metal wiring 31 disposed in the normal display area AA2 does not include the photosensitive opening 310. Corresponding to the metal wiring 31 disposed with the photosensitive opening 310, along the direction perpendicular to the extension direction of the metal wiring 31, its width in the normal display area AA2 is greater than its remaining width at the position where the photosensitive opening 310 is disposed, which is equivalent to removing the metal material at the position of the photosensitive opening 310, thereby improving the transmittance of the light-transmitting display area AA2.

[0099] The embodiment of the present invention further provides a display panel, which can effectively improve the transmittance of the light-transmitting display area of ​​the display panel. Figure 1 In terms of area division, the display panel includes: a display area, the display area includes a normal display area AA2 and a light-transmitting display area AA1.

[0100] Structurally, the display panel includes: a metal wiring layer (not shown in the figure) and a plurality of sub-pixels 100. Among them, the plurality of sub-pixels 100 are arranged in a uniform array in the display area. The metal wiring layer is arranged in the gaps between the sub-pixels 100 and is electrically connected to all the sub-pixels 100 to provide a driving signal to each sub-pixel 100; wherein, the area ratio of the metal wiring layer in the light-transmitting display area AA1 is smaller than the area ratio of the metal wiring layer in the normal display area AA2, so that the transmittance of the light-transmitting display area AA1 is greater than the transmittance of the normal display area AA2. In this way, favorable conditions can be provided for arranging photosensitive elements in the light-transmitting display area AA1, so that the photosensitive elements can accurately sense the ambient light intensity.

[0101] In the display panel provided by the embodiment of the present invention, the metal wiring layer is arranged in the gap between each sub-pixel 100, so the metal wiring layer will not block the light emitted by the sub-pixel 100; by setting each sub-pixel 100 to be arranged in a uniform array in the display area, the display effects of the normal display area AA2 and the light-transmitting display area AA1 can be made consistent, avoiding uneven display between different areas. In addition, since the metal material blocks light, by setting the area proportion of the metal wiring layer in the light-transmitting display area AA1 to be smaller than the area proportion in the normal display area AA2, the area of ​​the gap between each sub-pixel 100 in the light-transmitting display area AA1 that is blocked by the metal wiring layer can be reduced, so that the area proportion of the light-transmitting area in the part of the light-transmitting display area AA1 other than the sub-pixel 100 is larger, thereby improving the transmittance of the light-transmitting display area AA1.

[0102] On the basis of the above embodiments, optionally, the metal wiring layer includes a plurality of metal wirings connected in a mesh; each grid of the metal wiring layer of the mesh structure exposes each sub-pixel 100. Exemplarily, the receiving component for receiving the driving signal in the sub-pixel 100 is overlapped with the metal wiring, thereby achieving electrical connection with the metal wiring layer. For example, the receiving component for receiving the driving signal in the sub-pixel 100 is the cathode of the sub-pixel 100, and the driving signal provided by the metal wiring layer is the cathode voltage.

[0103] Among them, among the metal traces passing through the light-transmitting display area AA1, the area of ​​at least some of the metal traces in the light-transmitting display area AA1 is smaller than the area of ​​the metal traces in the normal display area AA2 that is equal to the light-transmitting display area AA2. In other words, for the area passed by the same metal trace, a portion of the normal display area AA2 that has the same area as the light-transmitting display area AA1 (recorded as area 1) is intercepted, and compared with the light-transmitting display area AA1, the area of ​​the same metal trace in area 1 is larger than that in the light-transmitting display area AA1, so that more areas in the light-transmitting display area AA1 are not blocked by the metal traces, thereby improving the transmittance of the light-transmitting display area AA1.

[0104] On the basis of the above-mentioned embodiments, there are various ways to reduce the area ratio of the metal wiring in the light-transmitting display area AA1, and several of them are described below by way of example, but they are not intended to limit the present invention.

[0105] In one embodiment, optionally, among the metal traces passing through the light-transmitting display area AA1, at least some of the metal traces located in the light-transmitting display area AA1 may include through holes, and the through holes penetrate the metal traces along the thickness direction of the display panel. The through holes are light-transmitting structures, which are used to reduce the area ratio of the metal traces and improve the transmittance of the light-transmitting display area AA1.

[0106] In another embodiment, optionally, see Figure 7 Among the metal traces 31 passing through the light-transmitting display area AA1, the width d1 of at least some of the metal traces 31 in the light-transmitting display area AA1 can be set to be smaller than the width d2 in the normal display area AA2, so that the area proportion of the metal traces 31 in the normal display area AA2 that is equal to the light-transmitting display area AA1 is larger than the area proportion of the metal traces 31 in the light-transmitting display area AA1, so that the transmittance of the light-transmitting display area AA1 is greater than the transmittance of the normal display area AA2.

[0107] In another embodiment, at least some of the metal traces passing through the light-transmitting display area AA1 may be configured to be discontinuous in the light-transmitting display area AA1. The discontinuous parts of the metal traces are light-transmitting structures, which are used to reduce the area of ​​the metal traces and improve the transmittance of the light-transmitting display area AA1.

[0108] It is understandable that the methods of reducing the area proportion of the metal wiring in the light-transmitting display area AA1 provided in the above-mentioned embodiments can be used alone or in combination as needed. Also, no matter how the structure of the metal wiring is set, in the entire display area, the metal wiring layer is a metal film layer connected as a whole, which can realize the transmission of the driving signal across the entire screen, so that all sub-pixels 100 can normally receive the driving signal and realize normal display.

[0109] On the basis of the above-mentioned embodiments, optionally, the display panel may include a pixel definition layer, the pixel definition layer defines a plurality of pixel openings surrounded by the pixel definition layer, and each sub-pixel 100 is respectively arranged corresponding to each pixel opening. The metal wiring layer may be arranged above the pixel definition layer, and the photosensitive element may be arranged below the pixel definition layer. The photosensitive element may be arranged corresponding to a position not covered by the metal wiring layer so as to identify ambient light. Furthermore, the display panel may also include a pixel encapsulation layer, including a plurality of pixel encapsulation structures, which respectively correspond to the cathodes covering each sub-pixel 100. Wherein, corresponding to the portion where the through hole is set for the metal wiring, the cathode and the pixel encapsulation structure of the sub-pixel 100 can be overlapped to the remaining metal wiring outside the through hole; corresponding to the portion where the metal wiring layer is removed by other means, the cathode and the pixel encapsulation structure of the sub-pixel 100 can be overlapped to the top of the pixel definition layer.

[0110] The embodiment of the present invention further provides a method for preparing a display panel, which can be used to prepare the display panel provided by any embodiment of the present invention, and has corresponding beneficial effects. The method for preparing the display panel may include the following steps:

[0111] 1) Providing a substrate, wherein the substrate includes a pixel driving circuit for each sub-pixel.

[0112] 2) Preparing an anode layer on the substrate, wherein the anode layer includes an anode of each sub-pixel.

[0113] 3) A pixel definition layer, a metal wiring layer and an isolation structure layer are prepared and stacked in sequence on top of the substrate.

[0114] The pixel definition layer defines a plurality of pixel openings surrounded by the pixel definition layer, and each sub-pixel is respectively arranged corresponding to each pixel opening; the metal wiring layer partially covers the pixel definition layer; and the isolation structure layer includes isolation columns surrounding each pixel opening.

[0115] 4) Based on the isolation function of the isolation column, the light-emitting layer, cathode and pixel packaging structure of each sub-pixel are prepared in each pixel opening, wherein the cathode of each sub-pixel is overlapped to the metal wiring layer.

[0116] Exemplarily, the step of preparing a pixel definition layer, a metal wiring layer and an isolation structure layer stacked in sequence above the substrate may specifically be: stacking a pixel definition material layer, a metal wiring material layer and an isolation structure material layer in sequence above the substrate; and patterning the isolation structure material layer, the metal wiring material layer and the pixel definition material layer in sequence to form an isolation structure layer, a metal wiring layer and a pixel definition layer. Alternatively, the step may also be to first prepare a pixel definition material layer above the substrate and pattern it to form a pixel definition layer, then prepare a metal wiring material layer above the pixel definition layer and pattern it to form a metal wiring layer, and finally prepare an isolation structure material layer above the metal wiring layer and pattern it to form an isolation structure layer. The specific preparation process can be selected as needed and is not limited here.

[0117] On the basis of the above embodiments, optionally, the portion of the substrate corresponding to the light-transmitting display area in the display panel includes a photosensitive element. In the process of preparing the pixel definition layer, the metal wiring layer and the isolation structure layer stacked in sequence above the substrate, the vertical projection of the pixel definition layer on the substrate can be controlled to cover the vertical projection of the photosensitive element on the substrate; and the portion of the metal wiring layer located in the light-transmitting display area can be controlled to include a plurality of photosensitive openings, the photosensitive openings expose the top surface of the pixel definition layer, and the vertical projection of the photosensitive openings on the pixel definition layer at least partially overlaps with the vertical projection of the photosensitive element on the pixel definition layer.

[0118] Fig.11 is a schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention; Fig.12 is a schematic diagram of the structure of a display panel in S110-S160 provided by an embodiment of the present invention. Fig.11 and Fig.12 , illustratively, the method for preparing the display panel includes:

[0119] S110, providing a substrate.

[0120] The substrate 10 includes a photosensitive element 200 at a portion corresponding to the light-transmitting display area of ​​the display panel, and the substrate 10 includes a pixel driving circuit for each sub-pixel.

[0121] Exemplarily, the substrate may include a substrate 11, an array layer 12, and a planarization layer 13 stacked from bottom to top; each pixel driving circuit may be arranged in the array layer 12, and each pixel driving circuit may be arranged, for example, at the position of the light-emitting device corresponding to each sub-pixel, and the light-emitting device may be connected to the corresponding pixel driving circuit through a via. Photosensitive driving circuits of each photosensitive element 200 may also be arranged in the array layer 12, and each photosensitive element 200 may be connected to the corresponding photosensitive element 200. The photosensitive element 200 may be arranged in the planarization layer 13, or may be arranged below the array layer 12 or below the substrate 11. The arrangement may be specific according to actual conditions, and is shown here by taking the arrangement in the planarization layer 13 as an example.

[0122] S120, preparing an anode layer above the substrate.

[0123] Among them, the anode layer includes an anode 41 of each sub-pixel. Exemplarily, the material of the anode layer is a metal material such as aluminum, silver, titanium or molybdenum or its alloy material, or a metal oxide such as indium tin oxide, or other non-metallic materials with good conductivity. The anode layer can be laid on the substrate 10 in a whole layer by evaporation, sputtering or deposition, and then the anode 41 of each sub-pixel is obtained by patterning. The patterning process, for example, uses a mask plate + photolithography + dry etching / wet etching process to remove the part of the anode material layer except the anode 41.

[0124] S130, preparing a pixel definition layer above the substrate.

[0125] The pixel definition layer 20 defines a plurality of pixel openings surrounded by the pixel definition layer 20, and each sub-pixel is arranged corresponding to each pixel opening. The vertical projection of the pixel definition layer 20 on the substrate 10 covers the vertical projection of the photosensitive element 200 on the substrate 10; that is, the vertical projection of the photosensitive element 200 on the substrate 10 does not overlap with the vertical projection of the pixel opening on the substrate 10, and the photosensitive element 200 is arranged in the gap between each sub-pixel to avoid mutual influence between the sub-pixel and the photosensitive element 200.

[0126] For example, the pixel definition layer 20 may be made of a light-transmitting insulating material, such as a transparent organic material or an inorganic material. The pixel definition layer 20 may be made by a whole-layer laying+patterning process.

[0127] S140, preparing a metal wiring layer above the pixel definition layer.

[0128] Among them, the metal wiring layer 30 includes a plurality of photosensitive openings 310 in the portion located in the light-transmitting display area, and the photosensitive openings 310 expose the top surface of the pixel definition layer 20. The vertical projection of the photosensitive openings 310 on the pixel definition layer 20 at least partially overlaps with the vertical projection of the photosensitive element 200 on the pixel definition layer 20, and the photosensitive element 200 senses light through the photosensitive openings 310.

[0129] S150, preparing an isolation structure layer above the metal routing layer.

[0130] Among them, the isolation structure layer 60 includes isolation columns surrounding each pixel opening. On a cross section parallel to the thickness direction of the display panel, between two adjacent pixel openings, the cross section of the isolation column presents a shape that is larger at the top and smaller at the bottom, such as an inverted trapezoid or an eaves shape, so that when preparing sub-pixels, the cathodes 43 of adjacent sub-pixels can be isolated, and the light-emitting layers 42 of adjacent sub-pixels can be isolated, so that the evaporation of the light-emitting layer 42 and the cathode 43 of each sub-pixel can be completed without using a fine mask, thereby reducing the preparation cost. Exemplarily, the isolation structure layer 60 may include at least two isolation layers stacked above the pixel definition layer 20, so as to prepare an isolation column structure that is larger at the top and smaller at the bottom. Exemplarily, the first isolation layer 61 can be prepared by a whole-layer paving + patterning process, and then the second isolation layer 62 can be prepared by a whole-layer paving + patterning process, and then the exposed sidewalls of the first isolation layer 61 are etched so that both sides of the second isolation layer 62 protrude from the first isolation layer 61, presenting an eaves-like structure.

[0131] S160 , based on the isolation function of the isolation column, respectively prepare the light-emitting layer, cathode and pixel packaging structure of each sub-pixel in each pixel opening.

[0132] The cathode 43 of each sub-pixel is connected to the metal wiring layer 30 to achieve electrical connection with the metal wiring layer 30 , thereby receiving the cathode voltage. The pixel packaging structure of each sub-pixel constitutes a pixel packaging layer 50 .

[0133] In the method for preparing a display panel provided by an embodiment of the present invention, by opening a photosensitive opening 310 at a portion of the metal wiring layer 30 located in the light-transmitting display area, and setting the vertical projection of the photosensitive opening 310 on the pixel definition layer 20 to at least partially overlap with the vertical projection of the photosensitive element 200 on the pixel definition layer 20, the transmittance of the non-pixel opening area in the light-transmitting display area can be effectively improved, so that the external ambient light can pass through the photosensitive opening 310 to irradiate the photosensitive element 200, thereby meeting the transmittance requirement of the photosensitive element 200 and ensuring its recognition accuracy. Therefore, the embodiment of the present invention can improve the transmittance of the display panel, so that the photosensitive element 200 can accurately sense the ambient light intensity.

[0134] Based on the above implementations, optionally, S140 specifically includes:

[0135] A metal material is deposited on the pixel definition layer 20 to form a metal material layer.

[0136] The metal material layer is patterned to form a metal wiring layer 30 .

[0137] In the patterning process, it can be set that: the vertical projection of the pixel definition layer 20 on the substrate 10 covers the vertical projection of the metal wiring layer 30 on the substrate 10; the vertical projection of the metal wiring layer 30 on the substrate 10, for example, completely falls into the vertical projection of the top surface of the pixel definition layer 20 on the substrate 10. The patterned metal wiring layer 30 may include a plurality of metal wirings connected in a mesh shape, and at least a portion of the metal wirings located in the light-transmitting display area includes at least one photosensitive opening 310.

[0138] Fig.13 Schematic diagram of the structure of a display panel in S170-S190 provided by an embodiment of the present invention. Fig.13 Based on the above embodiments, optionally, after S160, the method for preparing a display panel further includes:

[0139] S170, removing the isolation structure layer.

[0140] S180, preparing an organic encapsulation layer above the pixel encapsulation layer.

[0141] Among them, after the sub-pixel evaporation is completed, the isolation structure layer 60 is removed, so that the top of the pixel definition layer 20 can be flat, and the structure without isolation columns can make the organic encapsulation layer 70 easier to level, and without the obstruction of the isolation columns, the light emitting range of the sub-pixel can be diffused and the viewing angle can be widened. Exemplarily, the organic encapsulation layer can be an inkjet printing (IJP) layer, which can be laid on the display panel in one layer.

[0142] S190, preparing an inorganic encapsulation layer on the organic encapsulation layer.

[0143] The inorganic encapsulation layer 80 is made of an inorganic material, such as silicon nitride or silicon oxide. The material of the inorganic encapsulation layer 80 is, for example, the same as the material of the pixel encapsulation layer 50. In this way, the pixel encapsulation layer 50, the organic encapsulation layer 70 and the inorganic encapsulation layer 80 form an inorganic-organic-inorganic encapsulation structure, which has a good water and oxygen barrier effect and enables the display panel to have a certain bending resistance.

[0144] An embodiment of the present invention further provides a display device, including the display panel provided by any embodiment of the present invention, and having corresponding beneficial effects.

[0145] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0146] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel, characterized in that: include: Pixel definition layer; The pixel definition layer defines a plurality of pixel openings surrounded by the pixel definition layer; A plurality of sub-pixels are respectively arranged corresponding to the pixel openings; The sub-pixel includes a cathode; The metal wiring layer partially covers the pixel definition layer, and the cathode of the sub-pixel is overlapped to the metal wiring layer.

2. The display panel according to claim 1, characterized in that: The display panel comprises a light-transmitting display area, and at least part of the sub-pixels are arranged in the light-transmitting display area; Wherein, the portion of the metal wiring layer located in the light-transmitting display area includes a photosensitive opening, and the photosensitive opening exposes the top surface of the pixel definition layer; Preferably, the metal wiring layer comprises a plurality of metal wirings connected in a mesh shape, and the mesh holes of the metal wiring layer expose each of the sub-pixels; at least a portion of the metal wirings located in the light-transmitting display area comprises at least one photosensitive opening; Preferably, the display panel further includes: a photosensitive element, which is arranged below the pixel definition layer, and the vertical projection of the photosensitive opening on the pixel definition layer at least partially overlaps with the vertical projection of the photosensitive element on the pixel definition layer, and the photosensitive element senses light through the photosensitive opening.

3. The display panel according to claim 2, characterized in that: The photosensitive opening includes a through hole that penetrates the metal routing along the thickness direction of the display panel; for any metal routing provided with the through hole, corresponding to the position of the through hole, along a direction perpendicular to the extension direction of the metal routing, the cathodes of the sub-pixels on both sides of the two side walls of the metal routing are respectively overlapped to the parts of the metal routing located on both sides of the through hole.

4. The display panel according to claim 2, characterized in that: The photosensitive opening includes a groove arranged on the side wall of the metal wiring, and the groove penetrates the metal wiring along the thickness direction of the display panel; for any metal wiring provided with the groove, at a position corresponding to the groove, the cathode of the sub-pixel on the side of the side wall of the metal wiring provided with the groove is overlapped to the top surface of the pixel definition layer exposed by the groove; Preferably, the groove is provided on one side wall of the metal wiring, and the cathode of the sub-pixel on the side of the side wall of the metal wiring where the groove is not provided is overlapped with the metal wiring.

5. The display panel according to claim 2, characterized in that: The photosensitive opening includes a through opening arranged on the side wall of the metal routing, and the metal routing is cut off by the through opening along the extension direction of the metal routing; for any metal routing provided with the through opening, corresponding to the position of the through opening, along the direction perpendicular to the extension direction of the metal routing, the cathodes of the sub-pixels on both sides of the through opening are overlapped to the top surface of the pixel definition layer exposed by the through opening.

6. The display panel according to any one of claims 1 to 5, characterized in that: Also includes: A pixel encapsulation layer is disposed above the cathode of the sub-pixel; the pixel encapsulation layer comprises a plurality of pixel encapsulation structures corresponding to each of the sub-pixels; The pixel encapsulation structure completely covers the cathode of the corresponding sub-pixel and is overlapped to the metal wiring layer.

7. The display panel according to claim 6, characterized in that: The metal routing layer includes a plurality of metal routings connected in a mesh shape; The photosensitive opening includes a through hole penetrating the metal wiring along the thickness direction of the display panel, and corresponding to the position of the through hole, along a direction perpendicular to the extension direction of the metal wiring, the pixel packaging structure of the sub-pixel on both sides of the two side walls of the metal wiring is respectively overlapped to the parts of the metal wiring located on both sides of the through hole; And / or, the photosensitive opening includes a groove arranged on the side wall of the metal wiring, and corresponding to the position of the groove, the pixel encapsulation structure of the sub-pixel on the side of the side wall of the metal wiring provided with the groove is overlapped to the top surface of the pixel definition layer exposed by the groove; And / or, the photosensitive opening includes a through opening arranged on the side wall of the metal routing, and corresponding to the position of the through opening, along a direction perpendicular to the extension direction of the metal routing, the pixel packaging structures of the sub-pixels on both sides of the through opening are overlapped to the top surface of the pixel definition layer exposed by the through opening.

8. The display panel according to any one of claims 1 to 5, characterized in that: The light-transmitting display area includes some of the sub-pixels; the display panel also includes: a normal display area including other sub-pixels; and each of the sub-pixels is uniformly arranged in an array in the display panel.

9. A display panel, characterized in that: include: A display area, the display area comprising a normal display area and a light-transmitting display area; A plurality of sub-pixels are uniformly arranged in an array in the display area; A metal wiring layer is arranged in the gap between each of the sub-pixels and is electrically connected to all the sub-pixels, and is used to provide a driving signal to each of the sub-pixels; wherein the area proportion of the metal wiring layer in the light-transmitting display area is smaller than the area proportion of the metal wiring layer in the normal display area, so that the transmittance of the light-transmitting display area is greater than the transmittance of the normal display area.

10. The display panel according to claim 9, characterized in that: The metal routing layer includes a plurality of metal routings connected in a mesh shape; Among the metal wirings passing through the light-transmitting display area, at least some of the metal wirings have an area in the light-transmitting display area that is smaller than an area of ​​the metal wirings in an area in the normal display area that is equal in size to the light-transmitting display area; Preferably, a receiving component in the sub-pixel for receiving the driving signal is connected to the metal wiring; Preferably, the receiving component in the sub-pixel for receiving the driving signal is a cathode of the sub-pixel, and the driving signal provided by the metal wiring layer is a cathode voltage.

11. The display panel according to claim 10, characterized in that: In each of the metal traces passing through the light-transmitting display area: At least part of the metal wiring is located in the light-transmitting display area and includes a through hole, and the through hole penetrates the metal wiring along the thickness direction of the display panel; and / or, the width of at least part of the metal wiring in the light-transmitting display area is smaller than the width in the normal display area; And / or, at least part of the metal wiring is discontinuous in the light-transmitting display area.

12. A method for preparing a display panel, characterized in that: include: providing a substrate; The substrate includes a pixel driving circuit for each sub-pixel; An anode layer is prepared above the substrate; the anode layer includes an anode of each of the sub-pixels; Preparing a pixel definition layer, a metal wiring layer and an isolation structure layer stacked in sequence above the substrate; The pixel definition layer defines a plurality of pixel openings surrounded by the pixel definition layer, and each of the sub-pixels is arranged corresponding to each of the pixel openings; The metal wiring layer partially covers the pixel definition layer; The isolation structure layer includes isolation columns surrounding each of the pixel openings; Based on the isolation function of the isolation column, the light-emitting layer, cathode and pixel packaging structure of each sub-pixel are respectively prepared in each pixel opening; wherein the cathode of each sub-pixel is overlapped to the metal wiring layer.

13. The method for preparing a display panel according to claim 12, characterized in that: The pixel encapsulation structure of each sub-pixel constitutes a pixel encapsulation layer; After the light emitting layer, cathode and pixel encapsulation structure of each sub-pixel are prepared in each pixel opening based on the isolation function of the isolation column, the method further includes: removing the isolation structure layer; preparing an organic encapsulation layer above the pixel encapsulation layer; An inorganic encapsulation layer is prepared on the organic encapsulation layer.

14. The method for preparing a display panel according to claim 12, characterized in that: The substrate includes a photosensitive element at a portion corresponding to the light-transmitting display area in the display panel; In the process of preparing a pixel definition layer, a metal wiring layer and an isolation structure layer stacked in sequence above the substrate, the vertical projection of the pixel definition layer on the substrate is controlled to cover the vertical projection of the photosensitive element on the substrate; and the metal wiring layer is controlled to include a plurality of photosensitive openings in a portion located in the light-transmitting display area, the photosensitive openings expose the top surface of the pixel definition layer, and the vertical projection of the photosensitive openings on the pixel definition layer at least partially overlaps with the vertical projection of the photosensitive element on the pixel definition layer.

15. A display device, characterized in that: include: The display panel according to any one of claims 1 to 11.

Images